Carrier plate air floatation device of silicon carbide epitaxial furnace

Abstract

The invention discloses a silicon carbide epitaxial furnace carrier plate air floatation device, and relates to the technical field of semiconductor processing. Comprising a base, a furnace chamber is arranged in the center of the top of the base, a round base is arranged in the center of the top of the furnace chamber, a round carrying disc is installed on the top of the round base, temperature sensors are installed on the inner walls of the two sides of the furnace chamber, a cooling mechanism is arranged on the inner wall of the furnace chamber and comprises a cooling box, and the cooling box is connected with the furnace chamber; one side of the top of the cooling box is fixedly connected with a cold water pipe. Through the arrangement of the temperature sensor, the cooling mechanism and the heat preservation mechanism, in the using process, the cooling box and the furnace cavity are tightly attached, then cooling liquid is added into a hot water tank through a water inlet pipe, meanwhile, a water pump is started to input the cooling liquid into the cooling box through a cold water pipe, and when the temperature of the cooling liquid in the cooling box rises, the cooling liquid is cooled; the device can adjust the temperature in the furnace chamber in real time, so that the material quality problem caused by temperature fluctuation is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, in particular to a silicon carbide epitaxial furnace carrier plate flotation device. Background Art

[0002] For example, patent publication number CN116876079A discloses a carrier flotation device for a silicon carbide epitaxial growth furnace, comprising a furnace chamber, a circular base disposed within the furnace chamber, a circular carrier rotatably mounted on the upper surface of the circular base, a hydrogen inlet disposed on the outer surface of the circular base, a plurality of vents evenly disposed on the upper surface of the circular base, the vents being symmetrically distributed and equidistant from the center of the circular base, and a process air inlet disposed on one side of the furnace chamber. The present invention utilizes a silicon carbide epitaxial growth furnace made of graphite components, but hydrogen injected at high temperatures can etch the graphite, easily causing numerous defects in the silicon carbide epitaxial growth. Therefore, it is necessary to coat the outer surfaces of each component with a tantalum carbide coating to prevent hydrogen from etching the graphite at high temperatures, thereby affecting the silicon carbide epitaxial growth and the service life of the furnace body and its components. This coating can also reduce the problem of chamber particle contamination caused by the precipitation of graphite powder.

[0003] However, during the use of the above-mentioned equipment, due to the setting of its internal furnace chamber, the temperature of the furnace chamber continues to rise and cannot be adjusted in real time, resulting in material quality problems due to temperature fluctuations. At the same time, the equipment is prone to vibration during operation, thereby reducing the stability of the furnace chamber, resulting in uneven material deposition and reduced work efficiency. Therefore, in response to this situation, we propose a more convenient and practical flotation device that meets the usage needs. Summary of the Invention

[0004] The object of the present invention is to provide a silicon carbide epitaxial furnace carrier flotation device to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a silicon carbide epitaxial furnace carrier flotation device, comprising a base, a furnace cavity is arranged in the center of the top of the base, a circular base is arranged in the center of the top of the furnace cavity, a circular carrier is installed on the top of the circular base, temperature sensors are installed on the inner walls of both sides of the furnace cavity, a cooling mechanism is provided on the inner wall of the furnace cavity, the cooling mechanism includes a cooling box, the cooling box is connected to the furnace cavity, a cold water pipe is fixedly connected to one side of the top of the cooling box, a water pump is installed at one end of the cold water pipe, and a cold water tank is fixedly connected to one end of the water pump. A hot water pipe is fixedly connected to the side, a solenoid valve is installed at one end of the hot water pipe, a hot water tank is fixedly connected to one side of the solenoid valve, a through hole is provided on one side of the hot water tank, a water inlet pipe is fixedly connected to the through hole, a slot is provided on one side of the hot water tank, a heat exchange pipe is fixedly connected to the slot, one end of the heat exchange pipe is connected to the cold water tank, a fixing plate is fixedly connected to the top of the cold water tank, a through hole is provided in the center of the top of the fixing plate, a fan is installed in the through hole, shock absorbing mechanisms are provided on both sides of the bottom of the furnace cavity, a cleaning mechanism is provided on one side of the top, and a heat preservation mechanism is provided on one side of the bottom of the furnace cavity.

[0006] Furthermore, the shock absorbing mechanism includes two fixed blocks, which are connected to the base. A damper is installed in the center of the top of the fixed block. A threaded ring is screwed on the outer wall of the damper. A damping spring is installed on one side of the threaded ring. One end of the damper is fixedly connected to the top plate. A semicircular fixed ring is fixedly connected to the center of the top of the top plate, and the fixed ring is connected to the furnace cavity.

[0007] Furthermore, a connecting block is fixedly connected to the inner wall of the bottom of the top plate, connecting rods are rotatably connected on both sides of the connecting block, one end of the connecting rod is rotatably connected to a sliding block, a through hole is opened on one side of the sliding block, a fixed rod is slidably connected in the through hole, the fixed rod is connected to the fixed block, and a return spring is installed on one side of the sliding block, and one end of the return spring is in contact with the fixed block.

[0008] Furthermore, the cleaning mechanism includes a support frame connected to the base, a booster pump is installed on one side of the support frame, and a hose is fixedly connected to one end of the booster pump.

[0009] Furthermore, one end of the hose is fixedly connected to a spray pipe, a through hole is opened on one side of the spray pipe, a nozzle is installed in the through hole, one side of the spray pipe is rotatably connected to a support plate, the support plate is connected to the furnace cavity, and a rotating component is provided on one side of the support plate, which is connected to the spray pipe.

[0010] Furthermore, a drain pipe is fixedly connected to one side of the support frame, one end of the drain pipe is connected to the through hole opened in the furnace cavity, and the other end is fixedly connected to a filter box, which is connected to the booster pump. A plurality of equidistant slots are opened on one side of the filter box, and filter plates are inserted into the slots.

[0011] Furthermore, the insulation mechanism includes an insulation plate, which is connected to the furnace cavity. A through hole is provided on one side of the bottom of the insulation plate, a connecting pipe is fixedly connected in the through hole, one end of the connecting pipe is fixedly connected to a heating box, a symmetrically arranged mounting plate is fixedly connected to the inner wall of one side of the heating box, a heater is installed on one side of the mounting plate, through holes are provided on both sides of the heating box, and an air blowing fan is installed in the through hole.

[0012] Furthermore, a semicircular tray is fixedly connected to one side of the top of the furnace cavity, an air inlet is opened in the center of the top of the tray, and a vent hole is opened on one side of the tray.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] The silicon carbide epitaxial furnace carrier flotation device is provided with a temperature sensor, a cooling mechanism and a heat preservation mechanism. During use, the cooling box and the furnace cavity are first tightly fitted, and then the coolant is added into the hot water tank through the water inlet pipe. At the same time, the water pump is started to input the coolant into the cooling box through the cold water pipe. When the temperature of the coolant in the cooling box rises, the solenoid valve is started and cooperates with the water pump to allow the coolant to enter the hot water tank through the hot water pipe and then into the cold water tank through the heat exchange pipe. During this process, the fan on the fixed plate is started to dissipate heat from the heat exchange pipe, thereby reducing the temperature of the coolant. The device can adjust the temperature in the furnace cavity in real time, thereby avoiding material quality problems caused by temperature fluctuations. It is highly practical and suitable for promotion.

[0015] At the same time, the shock-absorbing mechanism can effectively absorb and reduce the impact of external vibrations on the equipment, ensure the stability of the furnace cavity, and avoid uneven material deposition. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0017] Figure 2 It is a schematic structural diagram of the cooling mechanism of the present invention;

[0018] Figure 3 It is a schematic structural diagram of the shock absorbing mechanism of the present invention;

[0019] Figure 4 It is a schematic structural diagram of the cleaning mechanism of the present invention;

[0020] Figure 5 It is a schematic cross-sectional structural diagram of the heat preservation mechanism of the present invention.

[0021] In the figure: 1. base; 2. furnace cavity; 3. circular base; 4. circular carrier; 5. temperature sensor; 6. cooling mechanism; 601. cooling box; 602. cold water pipe; 603. water pump; 604. cold water tank; 605. hot water pipe; 606. solenoid valve; 607. hot water tank; 608. water inlet pipe; 609. heat exchange pipe; 610. fixing plate; 611. fan; 7. shock absorption mechanism; 701. fixing block; 702. damper; 703. threaded ring; 704. damping spring; 705. top plate; 706. fixing ring; 707. connecting block; 7 08. Connecting rod; 709. Sliding block; 710. Fixed rod; 711. Return spring; 8. Cleaning mechanism; 801. Support frame; 802. Booster pump; 803. Hose; 804. Spray pipe; 805. Spray head; 806. Support plate; 807. Rotating assembly; 808. Drain pipe; 809. Filter box; 810. Filter plate; 9. Insulation mechanism; 901. Insulation plate; 902. Connecting pipe; 903. Heating box; 904. Mounting plate; 905. Heater; 906. Air fan; 10. Tray; 11. Air inlet; 12. Vent. DETAILED DESCRIPTION

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0023] In the semiconductor processing process, flotation equipment is required. The flotation equipment provided by the present invention is specifically used for silicon carbide flotation operations in the semiconductor processing process. During the use of this equipment, it is necessary to regularly check the temperature sensor 5 and the control system to ensure their accuracy and reliability to avoid material damage or equipment failure due to abnormal temperature. Regular cleaning is required to prevent the furnace chamber 2 and the carrier plate from dirt affecting product quality, and to ensure that the air inlet 11 and the air vent 12 on the tray 10 are not blocked to promote smooth gas flow and ensure the stability of the reaction process.

[0024] like Figure 1-Figure 5As shown, the present invention provides a technical solution: a silicon carbide epitaxial furnace carrier flotation device, comprising a base 1, a furnace cavity 2 is provided in the center of the top of the base 1, a circular base 3 is provided in the center of the top of the furnace cavity 2, a circular carrier 4 is installed on the top of the circular base 3, temperature sensors 5 are installed on the inner walls of both sides of the furnace cavity 2, a cooling mechanism 6 is provided on the inner wall of the furnace cavity 2, the cooling mechanism 6 comprises a cooling box 601, the cooling box 601 is connected to the furnace cavity 2, a cold water pipe 602 is fixedly connected to one side of the top of the cooling box 601, a water pump 603 is installed at one end of the cold water pipe 602, a cold water tank 604 is fixedly connected to one end of the water pump 603, a hot water pipe 605 is fixedly connected to one side of the cooling box 601, a solenoid valve 606 is installed at one end of the hot water pipe 605, and the solenoid valve 606 is installed at one end of the hot water pipe 605. A hot water tank 607 is fixedly connected to one side of the valve 606, and a through hole is provided on one side of the hot water tank 607, in which a water inlet pipe 608 is fixedly connected, a slot is provided on one side of the hot water tank 607, a heat exchange tube 609 is fixedly connected to the slot, and one end of the heat exchange tube 609 is connected to the cold water tank 604, and a fixing plate 610 is fixedly connected to the top of the cold water tank 604, and a through hole is provided in the center of the top of the fixing plate 610, in which a fan 611 is installed, shock absorbing mechanisms 7 are provided on both sides of the bottom of the furnace cavity 2, a cleaning mechanism 8 is provided on one side of the top, and a heat preservation mechanism 9 is provided on one side of the bottom of the furnace cavity 2, a semicircular tray 10 is fixedly connected to one side of the top of the furnace cavity 2, an air inlet 11 is provided in the center of the top of the tray 10, and a vent 12 is provided on one side of the tray 10.

[0025] It should be noted that the circular base 3 and the circular carrier 4 are both provided with an air inlet 11 adapted to the process. During use, the material to be processed is first placed on the circular carrier 4, and then the gas enters the furnace cavity 2 through the air inlet 11 and the air vent 12 provided on the tray 10 in the furnace cavity 2 to work, and the temperature is recorded by the temperature sensor 5. During use, the cooling box 601 and the furnace cavity 2 are tightly fitted, and then the coolant is added into the hot water tank 607 through the water inlet pipe 608, and the water pump 603 is started to cool the material. The water pipe 602 inputs the coolant into the cooling box 601. When the temperature of the coolant in the cooling box 601 rises, the solenoid valve 606 starts and cooperates with the water pump 603 to allow the coolant to enter the hot water tank 607 through the hot water pipe 605, and enter the cold water tank 604 through the heat exchange tube 609. In this process, the fan 611 on the fixed plate 610 starts to dissipate heat from the heat exchange tube 609, thereby reducing the temperature of the coolant. The cooling mechanism 6 can adjust the temperature in the furnace chamber 2 in real time, thereby avoiding material quality problems caused by temperature fluctuations.

[0026] like Figure 3As shown, the shock absorbing mechanism 7 includes two fixed blocks 701, which are connected to the base 1, a damper 702 is installed in the top center of the fixed block 701, a threaded ring 703 is screwed on the outer wall of the damper 702, and a damping spring 704 is installed on one side of the threaded ring 703, one end of the damper 702 is fixedly connected to a top plate 705, a semicircular fixed ring 706 is fixedly connected to the top center of the top plate 705, the fixed ring 706 is connected to the furnace chamber 2, and a connecting block 707 is fixedly connected to the inner wall of the bottom of the top plate 705, connecting rods 708 are rotatably connected on both sides of the connecting block 707, and one end of the connecting rod 708 is rotatably connected to a sliding block 709, a through hole is opened on one side of the sliding block 709, and a fixed rod 710 is slidably connected in the through hole, the fixed rod 710 is connected to the fixed block 701, and a return spring 711 is installed on one side of the sliding block 709, and one end of the return spring 711 is in contact with the fixed block 701.

[0027] It should be noted that during use, the fixing ring 706 and the top plate 705 are first fixed to the furnace cavity 2. When the furnace cavity 2 vibrates, the vibration is absorbed by the cooperation of the damper 702, the damping spring 704 and the threaded ring 703. At the same time, the top plate 705 is pressed down to rotate the connecting rod 708 on the connecting block 707, and moves on the fixing rod 710 through the sliding block 709, and absorbs the impact force through the reset spring 711. The shock absorbing mechanism 7 can effectively absorb and reduce the impact of external vibration on the equipment, ensure the stability in the furnace cavity 2, and avoid uneven material deposition.

[0028] like Figure 4 As shown, the cleaning mechanism 8 includes a support frame 801, which is connected to the base 1, and a booster pump 802 is installed on one side of the support frame 801, and a hose 803 is fixedly connected to one end of the booster pump 802, and a spray pipe 804 is fixedly connected to one end of the hose 803. A through hole is provided on one side of the spray pipe 804, and a nozzle 805 is installed in the through hole. A support plate 806 is rotatably connected to one side of the spray pipe 804, and the support plate 806 is connected to the furnace cavity 2. A rotating component 807 is provided on one side of the support plate 806, and the rotating component 807 is connected to the spray pipe 804. A drain pipe 808 is fixedly connected to one side of the support frame 801, and one end of the drain pipe 808 is connected to the through hole provided in the furnace cavity 2, and the other end is fixedly connected to a filter box 809, which is connected to the booster pump 802. A plurality of equidistant slots are provided on one side of the filter box 809, and a filter plate 810 is inserted into the slot.

[0029] It should be noted that the support frame 801, the cold water tank 604 and the hot water tank 607 are connected. During use, when cleaning is required, clean water is added to the filter box 809, and then the booster pump 802 is started to flush the furnace cavity 2 through the hose 803, the spray pipe 804 and the nozzle 805. In this process, the rotating component 807 is started to drive the spray pipe 804 to rotate and adjust the flushing direction. At the same time, the sewage enters the filter box 809 through the drain pipe 808 and is filtered through the filter plate 810. The cleaning mechanism 8 can effectively remove impurities, dust and reaction residues inside the furnace cavity 2 and on the surface of the carrier plate.

[0030] like Figure 5 As shown, the insulation mechanism 9 includes an insulation plate 901, which is connected to the furnace chamber 2. A through hole is provided on one side of the bottom of the insulation plate 901, in which a connecting pipe 902 is fixedly connected. One end of the connecting pipe 902 is fixedly connected to a heating box 903. A symmetrically arranged mounting plate 904 is fixedly connected to the inner wall of one side of the heating box 903. A heater 905 is installed on one side of the mounting plate 904. Through holes are provided on both sides of the heating box 903, in which an air blowing fan 906 is installed.

[0031] It should be noted that during use, when the temperature sensor 5 senses that the temperature in the furnace cavity 2 is too low, the heater 905 installed on the mounting plate 904 of the heating box 903 starts to generate hot air, and the air blowing fan 906 blows the hot air into the insulation plate 901 through the connecting pipe 902 to maintain the temperature of the furnace cavity 2. The insulation mechanism 9 can effectively reduce heat loss, maintain a high temperature state in the furnace cavity 2, improve energy utilization efficiency, and reduce production costs.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is limited by the accompanying embodiments and their equivalents.

Claims

1. A silicon carbide epitaxial furnace carrier flotation device, comprising a base (1), characterized in that: A furnace cavity (2) is provided at the center of the top of the base (1), a circular base (3) is provided at the center of the top of the furnace cavity (2), a circular carrier (4) is installed on the top of the circular base (3), temperature sensors (5) are installed on the inner walls of both sides of the furnace cavity (2), a cooling mechanism (6) is provided on the inner wall of the furnace cavity (2), the cooling mechanism (6) comprises a cooling box (601), the cooling box (601) is connected to the furnace cavity (2), a cold water pipe (602) is fixedly connected to one side of the top of the cooling box (601), a water pump (603) is installed at one end of the cold water pipe (602), and a cold water tank (604) is fixedly connected to one end of the water pump (603), and a hot water pipe (605) is fixedly connected to one side of the cooling box (601), and one end of the hot water pipe (605) is fixedly connected to the other end. A solenoid valve (606) is installed, and a hot water tank (607) is fixedly connected to one side of the solenoid valve (606). A through hole is provided on one side of the hot water tank (607), and a water inlet pipe (608) is fixedly connected in the through hole. A notch is provided on one side of the hot water tank (607), and a heat exchange pipe (609) is fixedly connected to the notch. One end of the heat exchange pipe (609) is connected to the cold water tank (604). A fixing plate (610) is fixedly connected to the top of the cold water tank (604), and a through hole is provided in the center of the top of the fixing plate (610). A fan (611) is installed in the through hole. Shock-absorbing mechanisms (7) are provided on both sides of the bottom of the furnace cavity (2), a cleaning mechanism (8) is provided on one side of the top, and a heat-insulating mechanism (9) is provided on one side of the bottom of the furnace cavity (2).

2. The silicon carbide epitaxial furnace carrier plate flotation device according to claim 1, characterized in that: The shock absorbing mechanism (7) comprises two fixed blocks (701), the fixed blocks (701) being connected to the base (1), a damper (702) being installed at the center of the top of the fixed block (701), a threaded ring (703) being screwed onto the outer wall of the damper (702), a damping spring (704) being installed on one side of the threaded ring (703), one end of the damper (702) being fixedly connected to a top plate (705), a semicircular fixed ring (706) being fixedly connected to the center of the top of the top plate (705), and the fixed ring (706) being connected to the furnace chamber (2).

3. The silicon carbide epitaxial furnace carrier plate flotation device according to claim 2, characterized in that: The bottom inner wall of the top plate (705) is fixedly connected to a connecting block (707), and connecting rods (708) are rotatably connected to both sides of the connecting block (707). One end of the connecting rod (708) is rotatably connected to a sliding block (709). A through hole is provided on one side of the sliding block (709), and a fixed rod (710) is slidably connected in the through hole. The fixed rod (710) is connected to the fixed block (701). A return spring (711) is installed on one side of the sliding block (709), and one end of the return spring (711) is in contact with the fixed block (701).

4. The silicon carbide epitaxial furnace carrier plate flotation device according to claim 1, characterized in that: The cleaning mechanism (8) comprises a support frame (801), the support frame (801) is connected to the base (1), a booster pump (802) is installed on one side of the support frame (801), and a hose (803) is fixedly connected to one end of the booster pump (802).

5. The silicon carbide epitaxial furnace carrier plate flotation device according to claim 4, characterized in that: One end of the hose (803) is fixedly connected to a spray pipe (804), a through hole is provided on one side of the spray pipe (804), a nozzle (805) is installed in the through hole, one side of the spray pipe (804) is rotatably connected to a support plate (806), the support plate (806) is connected to the furnace chamber (2), and a rotating assembly (807) is provided on one side of the support plate (806), the rotating assembly (807) is connected to the spray pipe (804).

6. The silicon carbide epitaxial furnace carrier plate flotation device according to claim 4, characterized in that: A drainage pipe (808) is fixedly connected to one side of the support frame (801), one end of the drainage pipe (808) is connected to a through hole provided in the furnace chamber (2), and the other end is fixedly connected to a filter box (809), which is connected to the booster pump (802). A plurality of equidistant notches are provided on one side of the filter box (809), and filter plates (810) are inserted into the notches.

7. The silicon carbide epitaxial furnace carrier plate flotation device according to claim 1, characterized in that: The heat preservation mechanism (9) comprises a heat preservation plate (901), which is connected to the furnace chamber (2). A through hole is provided on one side of the bottom of the heat preservation plate (901), a connecting pipe (902) is fixedly connected in the through hole, one end of the connecting pipe (902) is fixedly connected to a heating box (903), a symmetrically arranged mounting plate (904) is fixedly connected to the inner wall of one side of the heating box (903), a heater (905) is installed on one side of the mounting plate (904), and through holes are provided on both sides of the heating box (903), and an air blowing fan (906) is installed in the through hole.

8. The silicon carbide epitaxial furnace carrier plate flotation device according to claim 1, characterized in that: A semicircular tray (10) is fixedly connected to one side of the top of the furnace cavity (2), an air inlet (11) is provided at the center of the top of the tray (10), and a vent hole (12) is provided on one side of the tray (10).

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