A chip testing device and method based on aging test

Abstract

This invention relates to the field of testing equipment technology, and more particularly to a chip testing device and method based on aging testing. The chip testing device based on aging testing of this invention includes: a body, a test board, and a test socket; the chip is encapsulated within the test socket; a temperature control module is provided within the body; the temperature control module is capable of heating and maintaining the temperature within the body; an interface is provided on the test board; the test socket is connected to the test board through the interface; this invention achieves the replacement of defective chips during testing by using vertical, horizontal, and longitudinal moving blocks within the body to move an mounting block and an electric clamp, then using the electric clamp to hold the test socket and remove it from the test board, subsequently placing the old test socket on a pick-and-place platform, clamping the new test socket, and then installing the new test socket onto the interface on the test board.

Description

Technical Field

[0001] This invention relates to the field of testing equipment technology, and in particular to a chip testing device and method based on aging testing. Background Technology

[0002] As the core component of electronic devices, the performance and stability of chips directly affect the reliability of the entire system. To ensure the long-term performance and stable operation of chips, chip aging testing has become an essential process. Chip aging testing, also known as life testing, accelerates the chip aging process by simulating the extreme conditions encountered by chips in real-world usage environments, thereby discovering potential problems in chip design or materials and ensuring chip reliability.

[0003] Existing chip aging test equipment includes a main body, an aging test board, and a test socket. The chip is packaged in the test socket, and then the test socket is connected to the aging test board to make the circuit between the test socket and the aging test board connected. The test board is then placed in the main body for aging test. Dozens of chips can be packaged on a single aging test board, and hundreds of chips can be aged and tested simultaneously in the entire main body.

[0004] Chip aging tests can take up to 1,000 hours, and military-grade chips can take up to 2,000 hours. During the entire testing process, if a chip fails to meet the requirements, it can only be removed after the entire testing phase is completed, resulting in low testing efficiency and limitations.

[0005] To address this, we propose a chip testing device and method based on aging tests. Summary of the Invention

[0006] In view of the shortcomings of the prior art, the present invention provides a chip testing device and method based on aging test, which overcomes the shortcomings of the prior art and aims to solve the problems in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a chip testing device based on aging test, comprising:

[0008] The device comprises a body, a test board, and a test socket; the chip is encapsulated within the test socket; a temperature control module is installed within the body; the temperature control module is capable of heating and maintaining the temperature within the body; an interface is provided on the test board; the test socket is connected to the test board through the interface; a buckle is installed on the test socket to engage with the interface on the test board.

[0009] The machine body is provided with a pick-and-place channel; a closed door is provided on the outside of the machine body at the pick-and-place channel; a pick-and-place platform is rotatably connected inside the pick-and-place channel;

[0010] The machine body is provided with a replacement mechanism; the replacement mechanism can remove the test seat on the test plate and replace it with the test seat in the pick-and-place channel.

[0011] Preferably, the replacement mechanism includes a vertical moving block, a horizontal moving block, a longitudinal moving block, and a mounting block; the vertical moving block is vertically slidably connected to the body; the horizontal moving block is horizontally slidably connected to the vertical moving block; the longitudinal moving block is slidably connected to the horizontal moving block; a drive assembly is provided between the body and the vertical moving block; drive assemblies are also provided between the horizontal moving block and the vertical moving block, and between the longitudinal moving block and the horizontal moving block; the drive assembly includes a lead screw and a motor.

[0012] The mounting block is slidably connected to the longitudinal moving block, and a lifting electric push rod is connected between the mounting block and the longitudinal moving block; an electric clamp is provided on the mounting block.

[0013] Preferably, the front end of the electric clamp is inclined, and when the front end of the electric clamp moves downward, it can press the buckle inward, thereby allowing the test seat to be pulled out.

[0014] By setting vertical, horizontal, and longitudinal moving blocks within the machine body to move the mounting block and electric clamp, and then using the electric clamp to hold the test socket, the test socket is pulled out of the test board. Subsequently, the old test socket is placed on the pick-and-place stage, the new test socket is held, and then the new test socket is installed onto the interface on the test board, thus completing the replacement of the defective chip during the testing process.

[0015] Preferably, an upper clamping cover is slidably connected to the longitudinal moving block; an electric push rod is connected between the upper clamping cover and the longitudinal moving block; the upper clamping cover can move downward and cover the outside of the test seat.

[0016] By setting an upper clamping cover on the vertical moving block, and moving the upper clamping cover downward to abut against the test board, the test board can be prevented from bending upward during the removal of the test socket, thus preventing it from affecting the testing of other chips.

[0017] Preferably, a first support block is rotatably connected to the outer side of the longitudinal moving block; a C-shaped rod is slidably connected to the first support block; a second support block is installed at the other end of the C-shaped rod; a lower clamping cover is slidably connected to the second support block; a first electric push rod is also connected between the lower clamping cover and the C-shaped rod; a gear ring is installed on the outer side of the longitudinal moving block; a drive gear is rotatably connected to the first support block; the drive gear is driven by a motor inside the first support block.

[0018] Preferably, the C-shaped rod is slidably connected to the support block; a telescopic electric push rod is connected between the second support block and the C-shaped rod; a telescopic electric push rod is also connected between the C-shaped rod and the first support block.

[0019] A method for using a chip testing device based on aging test, applicable to the aforementioned chip testing device based on aging test, comprising the following steps:

[0020] S1. Package the chip into the test socket, then snap the test socket into the interface on the test board, and finally place the test board into the bracket inside the machine body, and connect the test board to the machine body through the ribbon cable circuit.

[0021] S2. Close the door of the machine body, heat the test board and test socket, and pass current into the test board and test socket, control the voltage and temperature, and perform aging test on the chip in the test socket.

[0022] S3. When the chip in the test socket is found to be unqualified, the longitudinal moving block moves the mounting block and electric clamp to the top of the test socket and clamps the test socket. Then the upper and lower clamping covers on the longitudinal moving block clamp the test board. The mounting block moves upward to remove the test socket. The removed test socket is placed on the pick-and-place stage. After clamping the new test socket, it is installed on the interface on the test board.

[0023] The beneficial effects of this invention are:

[0024] 1. This invention uses vertical, horizontal, and longitudinal moving blocks within the machine body to move the mounting block and electric clamp. The electric clamp holds the test socket, pulls the test socket off the test board, places the old test socket on the pick-and-place stage, holds the new test socket, and then installs the new test socket onto the interface on the test board, thereby completing the replacement of defective chips during the testing process.

[0025] 2. The present invention provides an upper clamping cover on the longitudinal moving block. The upper clamping cover moves downward to abut against the test board, thereby preventing the test board from bending upward during the removal of the test socket and affecting the testing of other chips. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of a chip testing device based on aging test according to the present invention;

[0027] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0028] Figure 3 for Figure 1 Enlarged view of point B in the middle;

[0029] Figure 4 This is a schematic diagram of the structure of a chip testing device based on aging test according to the present invention from another perspective;

[0030] Figure 5 for Figure 4 Enlarged view of point C in the middle;

[0031] Figure 6 This is a cross-sectional view of the longitudinal moving block, the first support block, the second support block, and the C-shaped rod in this invention;

[0032] Figure 7 This is a schematic diagram of the structure of the test board and test socket in this invention;

[0033] Figure 8 for Figure 7 Enlarged view of point D in the middle.

[0034] In the diagram: 1. Machine body; 11. Pick-up and drop-off channel; 13. Pick-up and drop-off platform; 2. Test board; 3. Test seat; 21. Interface; 31. Buckle; 41. Vertical moving block; 42. Horizontal moving block; 43. Longitudinal moving block; 44. Mounting block; 45. Drive assembly; 46. Lifting electric push rod; 47. Electric clamp; 5. Upper clamping cover; 51. Electric push rod No. 1; 6. Support block No. 1; 61. C-shaped rod; 62. Support block No. 2; 63. Lower clamping cover; 64. Gear ring; 65. Drive gear; 66. Telescopic electric push rod. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] Example 1: Refer to the appendix of the instruction manual. Figures 1 to 8 A chip testing device based on aging test, comprising:

[0037] The device consists of a body 1, a test board 2, and a test socket 3; the chip is packaged inside the test socket 3; a temperature control module is installed inside the body 1; the temperature control module can heat and keep the body 1 warm; an interface 21 is provided on the test board 2; the test socket 3 is connected to the test board 2 through the interface 21; a buckle 31 is installed on the test socket 3, which engages with the interface 21 on the test board 2.

[0038] The machine body 1 is provided with a pick-up and put-down channel 11; a closed door is provided on the outside of the machine body 1 at the pick-up and put-down channel 11; a pick-up and put-down table 13 is rotatably connected inside the pick-up and put-down channel 11;

[0039] The machine body 1 is equipped with a replacement mechanism; the replacement mechanism can remove the test seat 3 on the test plate 2 and replace it with the test seat 3 in the pick-and-place channel 11.

[0040] In this invention, the replacement mechanism includes a vertical moving block 41, a horizontal moving block 42, a longitudinal moving block 43, and a mounting block 44; the vertical moving block 41 is vertically slidably connected inside the machine body 1; the horizontal moving block 42 is horizontally slidably connected to the vertical moving block 41; the longitudinal moving block 43 is slidably connected to the horizontal moving block 42; a drive assembly 45 is provided between the machine body 1 and the vertical moving block 41; a drive assembly 45 is also provided between the horizontal moving block 42 and the vertical moving block 41, and between the longitudinal moving block 43 and the horizontal moving block 42; the drive assembly 45 includes a lead screw and a motor;

[0041] Mounting block 44 is slidably connected to longitudinal moving block 43, and a lifting electric push rod 46 is connected between mounting block 44 and longitudinal moving block 43; an electric clamp 47 is provided on mounting block 44.

[0042] In this invention, the front end of the electric clamp 47 is inclined. When the front end of the electric clamp 47 moves downward, it can press the buckle 31 inward, thereby allowing the test seat 3 to be pulled out.

[0043] The staff encapsulates the chip in the test socket 3, and then snaps the test socket 3 onto the interface 21 on the test board 2, so that the test socket 3 is connected to the test board 2 through the interface 21; then the test board 2 is placed into the body 1 and placed on the bracket inside the body 1. The test boards 2 are arranged vertically and vertically inside the body 1, and the test boards 2 are connected to the body 1 through a ribbon cable.

[0044] In this invention, the motor in the drive assembly 45 drives the corresponding lead screw to rotate, thereby the lead screw drives the corresponding vertical moving block 41, horizontal moving block 42 and longitudinal moving block 43 to move through the screw engagement;

[0045] After the test preparation is completed, the door of the main body 1 is closed. Then, the temperature control module inside the main body 1 heats the inside of the main body 1, so that the test board 2, test socket 3 and chip are in a high temperature environment. Then, the main body 1 is connected to the test board 2 through the ribbon cable, and voltage and current are conducted into the chip on the test board 2, so that the chip is in a high temperature and high voltage environment. The high temperature accelerates the electromigration, gate oxide degradation, ion migration and physical degradation processes inside the chip, while the high voltage accelerates the gate oxide breakdown, hot carrier injection effect and other electric field-related failure mechanisms inside the chip.

[0046] In this invention, the body 1 is connected to intelligent devices such as computers. When the chip aging test is detected as unqualified through the connection between the body 1 and the test board 2 and the test board 2 and the chip, the unqualified chip is replaced in time.

[0047] First, the vertical moving block 41 moves vertically along with the horizontal moving block 42 and the longitudinal moving block 43. The horizontal moving block 42 moves horizontally along with the longitudinal moving block 43 within the machine body 1. The longitudinal moving block 43 moves longitudinally along with the mounting block 44 within the machine body 1. This causes the longitudinal moving block 43 and the mounting block 44 to move above the test plate 2 and above the test seat 3 that needs to be replaced. The lifting electric push rod 46 pushes the mounting block 44 downward, causing the front end of the electric clamp 47 to contact the buckle 31 on the test seat 3, pressing the buckle 31 inward, so that the buckle 31 engages with the test seat 3. After the port 21 is disengaged, the electric clamp 47 clamps the test seat 3, lifts the test seat 3 upward, removes the test seat 3 from the test plate 2, places the removed test seat 3 on the pick-up and place platform 13, rotates the pick-up and place platform 13, transfers the removed test seat 3 to the other side of the pick-up and place channel 11, and places the new test seat 3 on the other side of the pick-up and place platform 13. After the pick-up and place platform 13 is rotated, the new test seat 3 enters the machine body 1. After the electric clamp 47 on the mounting block 44 clamps the test seat 3, moves it above the test plate 2, and inserts the new test seat 3 into the port 21.

[0048] This invention replaces defective chips during testing by setting a vertical moving block 41, a horizontal moving block 42, and a longitudinal moving block 43 within the body 1, which move the mounting block 44 and the electric clamp 47. The electric clamp 47 then holds the test socket 3 and pulls it off the test board 2. The old test socket 3 is then placed on the pick-and-place platform 13, which holds the new test socket 3. Finally, the new test socket 3 is installed onto the interface 21 on the test board 2.

[0049] In this invention, an upper clamping cover 5 is slidably connected to the longitudinal moving block 43; an electric push rod 51 is connected between the upper clamping cover 5 and the longitudinal moving block 43; the upper clamping cover 5 can move downward and cover the outside of the test seat 3.

[0050] In this invention, after the mounting block 44, with the electric clamp 47, clamps the test seat 3 on the test board 2, the first electric push rod 51 on the longitudinal moving block 43 pushes the upper clamping cover 5 downward, causing the upper clamping cover 5 to move downward. After the upper clamping cover 5 contacts the test board 2, during the process of the mounting block 44 and the electric clamp 47 pulling the test seat 3 up and down, the upper clamping cover 5 abuts against the test board 2, thereby preventing the test board 2 from bending upward due to the large force between the interface 21 of the test board 2 and the test seat 3, and thus preventing the impact on other chips.

[0051] The present invention provides an upper clamping cover 5 on the longitudinal moving block 43. The upper clamping cover 5 moves downward to abut against the test board 2, thereby preventing the test board 2 from bending upward during the removal of the test socket 3 and affecting the testing of other chips.

[0052] Example 2: Based on Example 1, refer to the appendix of the instruction manual. Figures 1 to 8 In this invention, a first support block 6 is rotatably connected to the outer side of the longitudinal moving block 43; a C-shaped rod 61 is slidably connected to the first support block 6; a second support block 62 is installed at the other end of the C-shaped rod 61; a lower clamping cover 63 is slidably connected to the second support block 62; a first electric push rod 51 is also connected between the lower clamping cover 63 and the C-shaped rod 61; a toothed ring 64 is fixedly connected to the outer side of the longitudinal moving block 43; a drive gear 65 is rotatably connected to the first support block 6; the drive gear 65 is driven by a motor inside the first support block 6.

[0053] In this invention, the C-shaped rod 61 is slidably connected to the support block; a telescopic electric push rod 66 is connected between the second support block 62 and the C-shaped rod 61; a telescopic electric push rod 66 is also connected between the C-shaped rod 61 and the first support block 6.

[0054] In this invention, a second support block 62 is connected to the longitudinal moving block 43, and a lower clamping cover 63 is provided on the second support block 62. Therefore, when the mounting block 44 pulls out the test seat 3, the upper clamping cover 5 and the lower clamping cover 63 can clamp on the upper and lower sides of the test board 2 respectively. In this way, when the test seat 3 is pulled out from the test board 2, the vibration generated by the test board 2 can be reduced. On the one hand, the impact of vibration on the testing of other chips is reduced, and on the other hand, the impact of vibration on the electrical components on the test board 2 is reduced.

[0055] In this invention, the telescopic electric push rod 66 pushes the C-shaped rod 61, enabling the C-shaped rod 61 to move telescopically. When the test seat 3 at the middle position on the test plate 2 is removed, the C-shaped rod 61 can be slid outward to ensure the connection between the longitudinal moving block 43 and the second support block 62. When the test seat 3 at the upper edge of the test plate 2 is removed, the motor inside the first support block 6 drives the drive gear 65 to rotate, thereby driving the gear 65 to rotate circumferentially around the outer side of the longitudinal moving block 43, so that the first support block 6 also rotates circumferentially around the longitudinal moving block 43. As the outer side of the moving block 43 rotates, the first support block 6 rotates, causing the crisscross rod 61 and the second support block 62 to rotate together. The crisscross rod 61 is rotated to the side closer to the test seat 3 that needs to be removed. By extending and retracting the crisscross rod 61 and rotating the first support block 6 and the second support block 62, the overall length of the first support block 6, the second support block 62 and the crisscross rod 61 can be shortened, preventing the overall length of the first support block 6, the second support block 62 and the crisscross rod 61 from being too long and interfering with other components inside the machine body 1 during the movement.

[0056] Example 3: A method for using a chip testing device based on aging test, applicable to the aforementioned chip testing device based on aging test, comprising the following steps:

[0057] S1. Package the chip into the test socket 3, then snap the test socket 3 into the interface 21 on the test board 2, and finally place the test board 2 into the bracket inside the body 1, and connect the test board 2 and the body 1 through the ribbon cable circuit.

[0058] S2. Close the door of the machine body 1. The machine body 1 heats the test board 2 and the test socket 3 and flows current into the test board 2 and the test socket 3, controlling the voltage and temperature to perform aging tests on the chip in the test socket 3.

[0059] S3. When the chip in the test socket 3 is found to be unqualified, the longitudinal moving block 43 moves the mounting block 44 and the electric clamp 47 to the top of the test socket 3 and clamps the test socket 3. Then the upper clamping cover 5 and the lower clamping cover 63 on the longitudinal moving block 43 clamp the test board 2. The mounting block 44 moves upward to remove the test socket 3. The removed test socket 3 is placed on the pick-and-place stage 13. After clamping the new test socket 3, it is installed on the interface 21 on the test board 2.

[0060] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip testing device based on aging test, characterized in that: include: The device comprises a body (1), a test board (2), and a test socket (3); the chip is encapsulated in the test socket (3); a temperature control module is provided inside the body (1); the temperature control module can heat and keep the body (1) warm; an interface (21) is provided on the test board (2); the test socket (3) is connected to the test board (2) through the interface (21); a buckle (31) is installed on the test socket (3) and engages with the interface (21) on the test board (2); The machine body (1) is provided with a pick-up and put-down channel (11); a closed door is provided on the outside of the machine body (1) at the pick-up and put-down channel (11); a pick-up and put-down platform (13) is rotatably connected inside the pick-up and put-down channel (11). The body (1) is provided with a replacement mechanism; the replacement mechanism can remove the test seat (3) on the test plate (2) and replace it with the test seat (3) in the pick-and-place channel (11).

2. The chip testing equipment based on aging test according to claim 1, characterized in that: The replacement mechanism includes a vertical moving block (41), a horizontal moving block (42), a longitudinal moving block (43), and a mounting block (44); the vertical moving block (41) is vertically slidably connected inside the machine body (1); the horizontal moving block (42) is horizontally slidably connected to the vertical moving block (41); the longitudinal moving block (43) is slidably connected to the horizontal moving block (42); a drive assembly (45) is provided between the machine body (1) and the vertical moving block (41); a drive assembly (45) is also provided between the horizontal moving block (42) and the vertical moving block (41), and between the longitudinal moving block (43) and the horizontal moving block (42); the drive assembly (45) includes a lead screw and a motor; The mounting block (44) is slidably connected to the longitudinal moving block (43), and a lifting electric push rod (46) is connected between the mounting block (44) and the longitudinal moving block (43); an electric clamp (47) is provided on the mounting block (44).

3. The chip testing equipment based on aging test according to claim 2, characterized in that: The front end of the electric clamp (47) is inclined. When the front end of the electric clamp (47) moves downward, it can press the buckle (31) inward, so that the test seat (3) can be pulled out.

4. The chip testing equipment based on aging test according to claim 3, characterized in that: An upper clamping cover (5) is slidably connected to the longitudinal moving block (43); an electric push rod (51) is connected between the upper clamping cover (5) and the longitudinal moving block (43); the upper clamping cover (5) can move downward and cover the outside of the test seat (3).

5. A chip testing device based on aging test according to claim 4, characterized in that: A first support block (6) is rotatably connected to the outer side of the longitudinal moving block (43); a C-shaped rod (61) is slidably connected to the first support block (6); a second support block (62) is installed at the other end of the C-shaped rod (61); a lower clamping cover (63) is slidably connected to the second support block (62); a first electric push rod (51) is also connected between the lower clamping cover (63) and the C-shaped rod (61); a gear ring (64) is installed on the outer side of the longitudinal moving block (43); a drive gear (65) is rotatably connected to the first support block (6); the drive gear (65) is driven by a motor inside the first support block (6).

6. A chip testing device based on aging test according to claim 5, characterized in that: The C-shaped rod (61) is slidably connected to the support block; a telescopic electric push rod (66) is connected between the second support block (62) and the C-shaped rod (61); a telescopic electric push rod (66) is also connected between the C-shaped rod (61) and the first support block (6).

7. A method for using a chip testing device based on aging test, the method being applicable to the chip testing device based on aging test as described in claim 6, characterized in that: The steps of this method are as follows: S1. Pack the chip into the test socket (3), then snap the test socket (3) into the interface (21) on the test board (2), and finally put the test board (2) into the bracket inside the body (1) and connect the test board (2) and the body (1) through the ribbon cable circuit. S2. Close the door of the machine body (1), heat the test board (2) and test socket (3) and pass current into the test board (2) and test socket (3) to control the voltage and temperature and perform aging test on the chip in the test socket (3); S3. When the chip in the test socket (3) is found to be unqualified, the longitudinal moving block (43) moves the mounting block (44) and the electric clamp (47) to the top of the test socket (3) and clamps the test socket (3). Then the upper clamping cover (5) and the lower clamping cover (63) on the longitudinal moving block (43) clamp the test board (2). The mounting block (44) moves upward and removes the test socket (3). The removed test socket (3) is placed on the pick-and-place stage (13). After clamping the new test socket (3), it is installed on the interface (21) on the test board (2).

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