Ball mounting method, ball mounting equipment and ball mounting substrate

Abstract

The invention discloses a ball mounting method, ball mounting equipment and a ball mounting substrate, and relates to the technical field of ball mounting, the ball mounting method comprises the following steps: providing a solution with metal particles; forming liquid drops with the metal particles from the solution with the metal particles, and spraying the liquid drops with the metal particles to a target position on a substrate to be subjected to ball implantation; and laser irradiation is carried out on the liquid drops with the metal particles on the substrate to be subjected to ball implantation, so that liquid in the liquid drops with the metal particles is removed, and the metal particles at the target position are melted. Through the steps, the utilization rate of materials can be increased.

Description

Technical Field

[0001] The present application relates to the field of ball planting technology, and in particular to a ball planting method, a ball planting device, and a ball planting substrate. Background Art

[0002] As microelectronic devices rapidly advance toward miniaturization, high density, and integration, metal microparticle arrays, serving as crucial electrical interconnects and mechanical support units, face significant challenges in device performance and reliability. However, existing metal microparticle deposition techniques, such as ball implantation and jetting, are limited in their ability to fabricate high-precision, high-density microsphere arrays, failing to meet the packaging requirements of next-generation high-performance devices. Furthermore, existing jetting methods offer low material utilization.

[0003] Invention content

[0004] The purpose of this application is to provide a ball planting method, a ball planting device and a ball planting substrate, which can improve the utilization rate of materials.

[0005] The present application discloses a bulb planting method, which comprises the following steps:

[0006] providing a solution with metal particles;

[0007] Forming droplets containing metal particles from a solution containing metal particles and spraying the droplets onto a target position on a substrate to be ball-planted;

[0008] Laser irradiation is performed on the liquid droplets with metal particles on the substrate to be ball-planted, so as to remove liquid from the liquid droplets with metal particles and melt the metal particles at target positions.

[0009] Optionally, the step of forming droplets containing metal particles from a solution containing metal particles and spraying the droplets onto a target position on the substrate to be ball-planted includes:

[0010] A piezoelectric injection device is used to extrude a solution containing metal particles to form droplets containing metal particles, and the droplets containing metal particles are then injected onto target locations on a substrate to be ball-planted.

[0011] Optionally, the step of using a piezoelectric injection device to extrude the solution containing metal particles to form droplets containing metal particles, and injecting the formed droplets containing metal particles onto target locations on the substrate to be ball-planted includes:

[0012] Continuously maintain the flow of the solution containing metal particles;

[0013] A piezoelectric injection device is used to extrude a solution containing metal particles to form droplets containing metal particles, and the droplets containing metal particles are then injected onto target locations on a substrate to be ball-planted.

[0014] Optionally, the step of continuously maintaining the flow of the solution containing the metal particles includes:

[0015] continuously maintaining the flow of the solution containing the metal particles and continuously heating the solution containing the metal particles;

[0016] The heating temperature is 35°C-45°C.

[0017] Optionally, the piezoelectric frequency of the piezoelectric injection device is 35khz-45khz.

[0018] The present application also discloses a ball planting device, which can adopt the ball planting method described above, and the ball planting device includes:

[0019] A machine platform, the machine platform is used to carry the substrate to be ball-planted;

[0020] A droplet emission module, the droplet emission module is used to eject droplets containing metal particles;

[0021] A liquid storage module, the liquid storage module is used to store a solution containing metal particles, and the liquid storage module is connected to the droplet emission module;

[0022] The laser irradiation module is used to heat and volatilize the liquid in the liquid droplets with metal particles on the substrate to be ball-planted, and melt the metal particles in the liquid droplets with metal particles.

[0023] Optionally, the droplet emission module includes a nozzle, a heating structure and a piezoelectric ceramic. The interior of the nozzle is hollow to form a accommodating cavity, and the accommodating cavity is used to accommodate a solution containing metal particles. The accommodating cavity is connected to the liquid storage module; a through hole and a droplet outlet are provided on the nozzle, the piezoelectric ceramic covers the through hole, and the heating structure is located in the accommodating cavity.

[0024] Optionally, the laser irradiation module includes a laser emitting unit and a laser homogenizing unit. The laser homogenizing unit is located between the laser emitting unit and the machine platform, and is used to homogenize the laser emitted by the laser emitting unit.

[0025] The present application also discloses a ball planting substrate, which is prepared by the ball planting method as described above.

[0026] Compared with the existing laser-assisted spraying method, the present application forms droplets containing metal particles from a solution containing metal particles and sprays them onto the target position on the substrate to be ball-planted; then the droplets containing metal particles on the substrate to be ball-planted are subjected to laser irradiation to remove the liquid in the droplets containing metal particles and melt the metal particles at the target position. Since the solution containing metal particles can be reused, the utilization rate of the material can be improved; moreover, there is no need to melt the metal and then spray it onto the target position on the substrate to be ball-planted. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without inventive work. In the drawings:

[0028] Figure 1 is a schematic diagram of a bulb planting device according to an embodiment of the present application;

[0029] Figure 2 is a schematic diagram of a droplet emission module according to an embodiment of the present application;

[0030] Figure 3 is a schematic diagram of a first laser irradiation module according to an embodiment of the present application;

[0031] Figure 4 is a schematic diagram of a bulb planting method according to an embodiment of the present application;

[0032] Figure 5 is a schematic diagram of a second laser irradiation module according to an embodiment of the present application;

[0033] Figure 6 FIG. 1 is a schematic diagram of a bulb planting substrate according to an embodiment of the present application.

[0034] Among them, 10, ball planting device; 100, machine; 200, liquid storage module; 300, droplet emission module; 310, nozzle; 320, through hole; 330, droplet outlet; 340, accommodating cavity; 350, heating structure; 360, piezoelectric ceramic; 400, laser irradiation module; 410, laser emission unit; 420, laser homogenization unit; 430, laser scanning galvanometer; 500, droplets with metal particles; 510, metal particles; 600, substrate to be ball-planted; 700, ball-planting substrate. DETAILED DESCRIPTION

[0035] It should be understood that the terms used herein, the specific structures and functional details disclosed are only for describing specific embodiments and are representative. However, the present application can be implemented in many alternative forms and should not be construed as being limited to the embodiments described herein.

[0036] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate relative importance or implicitly specify the quantity of the technical features indicated. Therefore, unless otherwise specified, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features; "plurality" means two or more. The term "comprising" and any variations thereof are intended to be non-exclusive inclusion, and one or more other features, integers, steps, operations, units, components, and / or combinations thereof may be present or added.

[0037] In addition, terms indicating orientation or positional relationships such as “center,” “lateral,” “up,” “down,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inside,” and “outside” are described based on the orientation or relative positional relationships shown in the accompanying drawings. They are merely simplified descriptions for the convenience of describing the present application, and do not indicate that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the present application.

[0038] Furthermore, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; or internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on specific circumstances.

[0039] The present application is described in detail below with reference to the accompanying drawings and optional embodiments.

[0040] Figure 1 Schematic diagram of a bulb planting device according to an embodiment of the present application. Figure 1As shown, the present application discloses a ball planting device 10, which includes: a machine 100, which is used to carry a substrate 600 to be ball-planted; a droplet emission module 300, which is used to eject droplets 500 with metal particles; a liquid storage module 200, which is used to store a solution with metal particles, and the liquid storage module 200 is connected to the droplet emission module 300; a laser irradiation module 400, which is used to heat and volatilize the liquid in the droplets 500 with metal particles on the substrate 600 to be ball-planted, and melt the metal particles 510 in the droplets 500 with metal particles.

[0041] The ball planting device 10 of the present application cooperates with each other by setting up a liquid storage module 200, a droplet emission module 300 and a laser irradiation module 400, wherein the liquid storage module 200 is used to store a solution containing metal particles, and the liquid storage module 200 is connected to the droplet emission module 300, and the droplet emission module 300 is used to spray out droplets 500 containing metal particles; and the laser irradiation module 400 is used to heat and volatilize the liquid in the droplets 500 containing metal particles on the substrate 600 to be ball planted, and melt the metal particles 510 in the droplets 500 containing metal particles.

[0042] When it is necessary to plant balls on the substrate to be planted 600, a solution containing metal particles is transported to the droplet emission module 300 through the liquid storage module 200, and then the droplet emission module 300 sprays the solution containing metal particles into droplets 500 containing metal particles, and the droplets 500 containing metal particles are sprayed onto the substrate with balls on the machine 100. Specifically, there is a pad area on the substrate to be planted 600, and the droplets 500 containing metal particles will be sprayed onto the pad area; then the laser irradiation module 400 irradiates the droplets 500 containing metal particles on the substrate to be planted 600.

[0043] The laser irradiation module 400 irradiates the droplet 500 with metal particles on the substrate 600 to be implanted with balls to achieve the effect of heating the droplet 500 with metal particles, so that the liquid in the droplet 500 with metal particles evaporates, leaving metal particles 510 on the pad area. Since a droplet 500 with metal particles includes multiple metal particles 510, the laser irradiation module 400 also melts the multiple metal particles 510. After the multiple metal particles 510 are melted, metal droplets are formed. Due to the surface tension of the droplets, the multiple metal particles 510 will form metal droplets after melting, and will gather into one metal droplet. After the metal droplet cools, a metal implant will be formed on the pad area.

[0044] Figure 2This is a schematic diagram of a droplet emission module according to an embodiment of the present application, combined with Figure 2 As shown, the droplet emission module 300 includes a nozzle 310, a heating structure 350 and a piezoelectric ceramic 360. The interior of the nozzle 310 is hollow to form a accommodating cavity 340. The accommodating cavity 340 is used to accommodate a solution containing metal particles. The accommodating cavity 340 is connected to the liquid storage module 200. A through hole 320 and a droplet outlet 330 are provided on the nozzle 310. The piezoelectric ceramic 360 covers the through hole 320, and the heating structure 350 is located in the accommodating cavity 340.

[0045] The solution containing metal particles is transported to the containing cavity 340 through the liquid storage module 200, and the solution containing metal particles is kept circulating between the containing cavity 340 and the liquid storage module 200. The heating structure 350 is used to heat and keep the solution containing metal particles warm, thereby avoiding temperature loss of the solution containing metal particles during the circulation process. The piezoelectric ceramic 360 is energized to cause the piezoelectric ceramic 360 to produce rapid deformation and extrude the solution containing metal particles, so that the solution containing metal particles is squeezed and ejected into droplets 500 containing metal particles at the droplet outlet 330, thereby realizing the conversion of the solution containing metal particles into droplets 500 containing metal particles, and ejecting them onto the substrate to be implanted.

[0046] Figure 3 is a schematic diagram of a first laser irradiation module according to an embodiment of the present application. Figure 3 As shown, the laser irradiation module 400 includes a laser emitting unit 410 and a laser homogenizing unit 420 . The laser homogenizing unit 420 is located between the laser emitting unit 410 and the machine 100 . The laser homogenizing unit 420 is used to homogenize the laser emitted by the laser emitting unit 410 .

[0047] Since the energy of the laser reflected by the laser emitting unit 410 is concentrated at one point, and the energy concentrated at one point is relatively high, the laser energy can be homogenized into a surface through the laser homogenization unit 420 to form a planar laser, so that the energy of the laser on this surface is equal, thereby achieving rapid heating of the droplets 500 with metal particles on the entire substrate 600 to be implanted, thereby improving the implantation efficiency.

[0048] Figure 4 Schematic diagram of a bulb planting method according to an embodiment of the present application. Figure 4 As shown, the present application also discloses a ball planting method, which can be used in the above-mentioned ball planting device 10, and the ball planting method includes the following steps:

[0049] S1: providing a solution with metal particles;

[0050] Exemplarily, the solution with metal particles can be stored in the solution storage module 200, and the solution with metal particles in the solution storage module 200 can be transported into the accommodating cavity 340 of the droplet emission module 300 due to the connection between the solution storage module 200 and the droplet emission module 300.

[0051] S2: Forming a droplet with metal particles from the solution with metal particles, and spraying the droplet with metal particles to a target position on the ball mounting substrate;

[0052] Exemplarily, the solution with metal particles can be formed by the droplet emission module 300, the droplet with metal particles 500 can be formed, and the droplet with metal particles 500 can be sprayed to the target position on the ball mounting substrate 600.

[0053] S3: Laser irradiating the droplet with metal particles on the ball mounting substrate to remove the liquid in the droplet with metal particles, and melting the metal particles on the target position.

[0054] Exemplarily, the droplet with metal particles 500 on the ball mounting substrate 600 can be laser irradiated by the laser irradiation module 400, the droplet with metal particles 500 can be heated to remove the liquid in the droplet with metal particles 500, and the metal particles 510 on the target position can be melted, and the metal particles 510 can form metal balls after the temperature decreases.

[0055] The metal particles 510 in the solution with metal particles can be one of pure copper, pure indium, and gold-tin alloy.

[0056] The existing ball mounting method is to store a large number of solder balls in a solder ball box first, and then fix a single solder ball on a target position on the ball mounting substrate 600 by a wedge, which cannot be controlled if the volume of the solder ball is small, so the ball mounting method cannot meet the micron-level ball mounting requirement.

[0057] The existing spraying method is to melt metal in a quartz crucible, and then form micro-droplets of the metal melted in the quartz crucible by argon impact and spray the micro-droplets to a target position on the ball mounting substrate 600, which needs to continuously heat the metal in the quartz crucible during ball mounting, and the energy consumption is large. The spraying method also includes a method of preparing a metal film, and then focusing laser to melt the metal film on the target position on the ball mounting substrate 600 to form micro-droplets and drop the micro-droplets on the target position on the ball mounting substrate 600, but this method can cause the micro-droplets to splash after dropping on the ball mounting substrate 600, the micro-droplets after splashing can be cooled and solidified directly, which is difficult to remove, resulting in the ball mounting substrate 600 being not clean, and causing a short circuit problem. Moreover, the metal film cannot be reused, resulting in a low utilization rate of materials.

[0058] Compared with the prior laser-assisted jetting method, the present application forms the metal particle-containing droplet 500 from the metal particle-containing solution and sprays it onto the target position on the substrate 600 to be ball-mounted; then the metal particle-containing droplet 500 on the substrate 600 to be ball-mounted is irradiated with laser light to remove the liquid in the metal particle-containing droplet 500 and melt the metal particles 510 on the target position. Since the metal particle-containing solution can be reused, the material utilization rate can be improved. Moreover, the metal particles 510 do not need to be melted and then sprayed onto the target position on the substrate 600 to be ball-mounted, so the energy consumption can be saved.

[0059] Compared with the prior ball mounting method, the present application forms the metal particle-containing droplet 500 from the metal particle-containing solution and sprays it onto the target position on the substrate 600 to be ball-mounted; then the metal particle-containing droplet 500 on the substrate 600 to be ball-mounted is irradiated with laser light to remove the liquid in the metal particle-containing droplet 500 and melt the metal particles 510 on the target position. The single metal particle 510 does not need to be controlled, so the diameter of the metal particle 510 can be set smaller, thereby meeting the micron-level ball mounting requirement.

[0060] In the step S3 of irradiating the metal particle-containing droplet on the substrate to be ball-mounted with laser light to remove the liquid in the metal particle-containing droplet and melt the metal particles on the target position.

[0061] In combination Figure 3 The laser homogenization unit 420 can be arranged in the laser irradiation module 400 to homogenize the laser light emitted by the laser emitting unit 410 to form planar laser light, which is then used to irradiate the entire target area.

[0062] Figure 5 is a schematic view of a second laser irradiation module of an embodiment of the present application, as Figure 5 of course, the laser scanning galvanometer 430 can be arranged in the laser irradiation module 400 instead of the laser homogenization unit 420, i.e., the laser irradiation module 400 includes the laser emitting unit 410 and the laser scanning galvanometer 430, which is located between the laser emitting unit 410 and the machine table 100. The laser scanning galvanometer 430 is used to divide the laser light emitted by the laser emitting unit 410. The laser light emitted by the laser emitting unit 410 is divided into a plurality of tiny light spots by the laser scanning galvanometer 430, thereby forming dot matrix laser light, and each dot of the dot matrix laser light corresponds to one pad on the target position on the substrate 600 to be ball-mounted. Then the dot matrix laser light is used to irradiate the entire target area of the pad position.

[0063] After the irradiation is completed, the substrate 600 to be ball-planted can also be purged; in this way, even after the droplets 500 containing metal particles are sprayed onto a pad at the target position of the substrate 600 to be ball-planted, sputtering is emitted, so that there are droplets 500 containing metal particles between two adjacent pads. However, since each pad is irradiated separately by using a dot matrix laser, the droplets 500 containing metal particles sputtered between two adjacent pads will not volatilize and the metal particles 510 will not melt, thereby further reducing the possibility of substrate short circuit after ball planting and improving the accuracy of ball planting.

[0064] For example, the present application can extrude the solution containing metal particles by introducing an inert gas and extruding the solution to form the droplets 500 containing metal particles.

[0065] For example, the present application may extrude the solution containing metal particles by a piezoelectric injection device to form droplets 500 containing metal particles, as follows:

[0066] The step S2: forming droplets containing metal particles from the solution containing metal particles and spraying the droplets to the target position on the substrate to be ball-planted comprises:

[0067] S21: A piezoelectric injection device is used to extrude the solution containing metal particles to form liquid droplets containing metal particles, and the formed liquid droplets containing metal particles are injected onto target positions on the substrate to be ball-planted.

[0068] By using a piezoelectric injection device to extrude the solution containing metal particles to form droplets 500 containing metal particles, since the piezoelectric ceramic 360 of the piezoelectric injection device deforms quickly, the droplets 500 containing metal particles formed at the droplet outlet 330 can be quickly separated from the solution containing metal particles by rapid extrusion, thereby avoiding the droplets 500 containing metal particles hanging at the droplet outlet 330.

[0069] The piezoelectric frequency of the piezoelectric spray device is 35 kHz to 45 kHz, preferably 40 kHz, so that the piezoelectric spray device can generate sufficient shear force to quickly separate the droplets 500 containing metal particles formed by the droplet outlet 330 from the solution containing metal particles. Furthermore, the droplets 500 containing metal particles are moved along the spray direction with a certain initial velocity to the target area of ​​the substrate 600 to be ball-planted.

[0070] The metal particles 510 are nano-sized microspheres. By making the metal particles 510 nano-sized microspheres, it is ensured that the droplets 500 with metal particles are all provided with metal particles 510 .

[0071] The step S21 of squeezing the solution containing metal particles using a piezoelectric injection device to form droplets containing metal particles, and injecting the formed droplets containing metal particles onto target positions on the substrate to be ball-planted comprises:

[0072] S211: continuously maintaining the flow of the solution containing the metal particles;

[0073] S212: using a piezoelectric spray device to squeeze the solution containing metal particles to form droplets containing metal particles, and spraying the formed droplets containing metal particles to a target position on the substrate to be ball-planted.

[0074] By keeping the solution containing metal particles flowing between the droplet emission module 300 and the liquid storage module 200, uneven distribution of the metal particles 510 in the solution containing metal particles can be avoided, thereby ensuring the consistency of the number of metal particles 510 present in the droplets 500 containing metal particles.

[0075] Furthermore, the step of S211: continuously maintaining the flow of the solution containing the metal particles includes:

[0076] S2111: continuously maintaining the flow of the solution containing the metal particles, and continuously heating the solution containing the metal particles;

[0077] The heating temperature is 35°C-45°C.

[0078] By heating the solution containing metal particles to 35°C-45°C through the heating structure 350, heat loss caused by the flow of the solution containing metal particles can be avoided, and the droplets 500 containing metal particles sprayed onto the substrate 600 to be implanted can have an initial temperature, thereby further reducing the energy required for laser irradiation and further reducing the probability of damage to the substrate 600 to be implanted.

[0079] The irradiation time of the laser irradiation module 400 is 0.1S-1S, the output power of the laser irradiation module 400 is 100W-150W, and the central wavelength of the laser emitted by the laser irradiation module 400 is 1064nm, so that the droplets 500 with metal particles can be quickly heated to 290 degrees Celsius-310 degrees Celsius, which can ensure that the liquid in the droplets 500 with metal particles evaporates and the metal particles 510 melts without causing damage to the substrate 600 to be implanted.

[0080] Wherein, before the step of S1: providing a solution with metal particles, the step further includes

[0081] S01: preparing metal particles and mixing the metal particles in a volatile solvent to obtain a solution of the metal particles;

[0082] S02: ultrasonic vibration is performed on the solution with metal particles;

[0083] The ultrasonic vibration performed on the solution with metal particles makes the metal particles 510 uniformly diffuse, improving the consistency of the ball mounting.

[0084] For example, the preparation method of the metal particles 510 includes a physical method. The physical method is to break the molten metal into droplets by high-pressure gas or centrifugal force, and form microspheres after rapid cooling.

[0085] In the present application, the metal ions are slowly precipitated in the solution by a chemical reduction method to generate particle precursors; then the particle precursors and the solution are mixed together and heated at high temperature to obtain a mixed solution containing metal particles 510; and then the desired metal particles 510 are obtained by centrifugal filtration.

[0086] Figure 6 is a schematic diagram of a ball mounting substrate according to an embodiment of the present application, as Figure 6 The present application also discloses a ball mounting substrate 700, which is prepared by the ball mounting method described above.

[0087] It should be noted that the steps involved in the present application are not limited in the order of execution as long as the specific scheme can be implemented, and should be considered within the protection scope of the present application.

[0088] It should be noted that the inventive concept of the present application can form a very large number of embodiments, but the length of the application file is limited and cannot be listed one by one, therefore, on the premise of not conflicting, the above-described embodiments or technical features can be combined to form new embodiments, and the combination of each embodiment or technical feature will enhance the original technical effect.

[0089] The above is a further detailed description of the present application in combination with specific optional embodiments, and the specific implementation of the present application cannot be limited to these descriptions. For ordinary skilled persons in the technical field to which the present application belongs, some simple deductions or substitutions can be made without departing from the concept of the present application, and all should be considered within the protection scope of the present application.

Claims

1. A bulb planting method, characterized in that: The ball planting method comprises the steps of: S1: providing a solution with metal particles; S2: forming droplets containing metal particles from the solution containing metal particles and spraying the droplets to a target position on the substrate to be ball-planted; S3: performing laser irradiation on the liquid droplets with metal particles on the substrate to be ball-planted, so as to remove liquid from the liquid droplets with metal particles and melt the metal particles at the target position.

2. The ball planting method according to claim 1, characterized in that: The step S2: forming droplets containing metal particles from the solution containing metal particles and spraying the droplets to the target position on the substrate to be ball-planted comprises: S21: A piezoelectric injection device is used to extrude the solution containing metal particles to form liquid droplets containing metal particles, and the formed liquid droplets containing metal particles are injected onto target positions on the substrate to be ball-planted.

3. The ball planting method according to claim 2, characterized in that: The step S21 of squeezing the solution containing metal particles using a piezoelectric injection device to form droplets containing metal particles, and injecting the formed droplets containing metal particles onto target positions on the substrate to be ball-planted comprises: S211: continuously maintaining the flow of the solution containing the metal particles; S212: using a piezoelectric spray device to squeeze the solution containing metal particles to form droplets containing metal particles, and spraying the formed droplets containing metal particles to a target position on the substrate to be ball-planted.

4. The ball planting method according to claim 3, characterized in that: The step of continuously maintaining the flow of the solution containing the metal particles in step S211 includes: S2111: continuously maintaining the flow of the solution containing the metal particles, and continuously heating the solution containing the metal particles; The heating temperature is 35°C-45°C.

5. The ball planting method according to claim 2, characterized in that: The piezoelectric frequency of the piezoelectric injection device is 35khz-45khz.

6. A bulb planting device, characterized in that: The ball planting device may adopt the ball planting method according to any one of claims 1 to 5, and the ball planting device includes: A machine platform, the machine platform is used to carry the substrate to be ball-planted; A droplet emission module, the droplet emission module is used to eject droplets containing metal particles; A liquid storage module, the liquid storage module is used to store a solution containing metal particles, and the liquid storage module is connected to the droplet emission module; The laser irradiation module is used to heat and volatilize the liquid in the liquid droplets with metal particles on the substrate to be ball-planted, and melt the metal particles in the liquid droplets with metal particles.

7. The ball planting device according to claim 6, characterized in that: The droplet emission module includes a nozzle, a heating structure and a piezoelectric ceramic. The interior of the nozzle is hollow to form a accommodating cavity, which is used to accommodate a solution containing metal particles. The accommodating cavity is connected to the liquid storage module; a through hole and a droplet outlet are provided on the nozzle, the piezoelectric ceramic covers the through hole, and the heating structure is located in the accommodating cavity.

8. The ball planting device according to claim 6, characterized in that: The laser irradiation module includes a laser emitting unit and a laser homogenizing unit. The laser homogenizing unit is located between the laser emitting unit and the machine platform. The laser homogenizing unit is used to homogenize the laser emitted by the laser emitting unit.

9. A bulb planting substrate, characterized in that: The ball planting substrate is prepared by the ball planting method according to any one of claims 1 to 5.

Images