Heat dissipation system, electronic equipment, heat dissipation method, product and medium

Abstract

The invention discloses a heat dissipation system, electronic equipment, a heat dissipation method, a product and a medium, and relates to the technical field of heat dissipation control, a booster liquid pump is arranged between a cooling distribution unit and a refrigerant transmission channel, and flow parameters of a refrigerant in the refrigerant transmission channel can be adjusted. The control unit dynamically adjusts the output power of the booster liquid pump and the operation power of the cooling distribution unit according to the monitoring temperature, collected by the temperature monitoring unit, of the electronic equipment, and therefore precise control over the cooling effect and the flowing speed of a refrigerant is achieved. Due to the fact that the operation power of the cooling distribution unit is adjustable, the problem that energy consumption is too high due to continuous high-power operation of the cooling distribution unit in the related technology is solved, and the beneficial effects of improving the refrigerant transmission efficiency and remarkably reducing the overall power consumption of the liquid cooling heat dissipation system are achieved.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation control technology, and in particular to a heat dissipation system, electronic equipment, heat dissipation method, product and medium. Background Art

[0002] With the rapid development of electronic technology, the power density and heat generation of electronic equipment continue to rise. Air cooling has gradually become unable to meet the heat dissipation requirements under high heat load conditions. For this reason, liquid cooling technology with higher heat dissipation efficiency has been widely used in various electronic devices. In existing liquid cooling systems, coolant is usually distributed to the cold plate through pipes and manifolds through a cooling distribution unit (CDU). After heat exchange, it returns to the CDU to form a closed loop. Although the heat dissipation capacity of liquid cooling systems is significantly improved compared to air cooling, because servers need to maintain uninterrupted operation, the accompanying CDU must also continue to operate at high power, resulting in high overall energy consumption and affecting server performance.

[0003] Therefore, how to provide a solution to the above technical problems is a problem that those skilled in the art need to solve at present. Summary of the Invention

[0004] The present application provides a heat dissipation system, electronic equipment, heat dissipation method, product and medium to at least solve the problem of excessive energy consumption caused by continuous high-power operation of a cooling distribution unit in the related art.

[0005] The present application provides a heat dissipation system, including: a cooling distribution unit, configured to cool a refrigerant; a booster liquid pump, arranged between the cooling distribution unit and a refrigerant transmission channel, configured to adjust the flow parameters of the refrigerant in the refrigerant transmission channel; a temperature monitoring unit, configured to collect the monitoring temperature of the electronic device; a control unit, connected to the cooling distribution unit, the booster liquid pump and the temperature monitoring unit, configured to control the booster liquid pump to operate according to the output power corresponding to the monitoring temperature, and control the cooling distribution unit to operate according to the target power corresponding to the monitoring temperature.

[0006] The present application also provides an electronic device, comprising a housing, and a heat dissipation system as described above and arranged in the housing.

[0007] The application further provides a heat dissipation method applied to a heat dissipation system, the heat dissipation system comprising a cooling distribution unit, a refrigerant transmission channel, and a booster liquid pump arranged between the refrigerant transmission channel and the cooling distribution unit, the heat dissipation method comprising the following steps: when a monitoring temperature of an electronic device is in any early warning temperature range, obtaining a heat dissipation control model corresponding to the early warning temperature range in which the monitoring temperature of the electronic device is located and a target power of the cooling distribution unit; the heat dissipation control model representing a corresponding relationship between an output power of the booster liquid pump and the monitoring temperature of the electronic device; controlling the cooling distribution unit to operate at the target power and increasing the output power of the booster liquid pump based on the monitoring temperature of the electronic device and the heat dissipation control model; when the monitoring temperature of the electronic device decreases to an initial threshold temperature, controlling the cooling distribution unit and the booster liquid pump to enter a low-power operation state; the initial threshold temperature being less than a lower limit value of the early warning temperature range.

[0008] The application further provides a computer readable storage medium, and the computer readable storage medium stores a computer program, wherein the computer program is executed by a processor to implement the steps of any of the heat dissipation methods.

[0009] The application further provides a computer program product, comprising a computer program, wherein the computer program is executed by a processor to implement the steps of any of the heat dissipation methods.

[0010] According to the application, the booster liquid pump is arranged between the cooling distribution unit and the refrigerant transmission channel, so that the flow parameters of the refrigerant in the refrigerant transmission channel can be adjusted. The control unit dynamically adjusts the output power of the booster liquid pump and the operating power of the cooling distribution unit according to the monitoring temperature of the electronic device collected by the temperature monitoring unit, so as to accurately control the cooling effect and flow speed of the refrigerant. Since the operating power of the cooling distribution unit is adjustable, the problem of high energy consumption caused by the continuous high-power operation of the cooling distribution unit in the related art is solved, and the beneficial effects of improving the refrigerant transmission efficiency and significantly reducing the overall power consumption of the liquid cooling heat dissipation system are achieved. BRIEF DESCRIPTION OF DRAWINGS

[0011] In order to more clearly illustrate the embodiments of the application, the drawings required in the embodiments will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0012] Figure 1 A structural schematic diagram of a heat dissipation system provided by an embodiment of the application.

[0013] Figure 2A schematic structural diagram of another heat dissipation system provided in an embodiment of the present application.

[0014] Figure 3 A flow chart of the steps of a heat dissipation method provided in an embodiment of the present application.

[0015] Figure 4 A schematic diagram of a heat dissipation control model provided in an embodiment of the present application.

[0016] Figure 5 A control flow chart of a heat dissipation method provided in an embodiment of the present application. DETAILED DESCRIPTION

[0017] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0018] It should be noted that, in the description of this application, the terms "comprises," "includes," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. The terms "first," "second," etc., in this application are used to distinguish similar objects, and are not used to describe a particular order or sequence.

[0019] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0020] Please refer to Figure 1 The present application provides a heat dissipation system, including: a cooling distribution unit 1, configured to cool the refrigerant; a booster liquid pump 2, arranged between the cooling distribution unit 1 and the refrigerant transmission channel, configured to adjust the flow parameters of the refrigerant in the refrigerant transmission channel; a temperature monitoring unit 3, configured to collect the monitoring temperature of the electronic device; a control unit 4, connected to the cooling distribution unit 1, the booster liquid pump 2 and the temperature monitoring unit 3, configured to control the booster liquid pump 2 to operate according to the output power corresponding to the monitoring temperature, and control the cooling distribution unit 1 to operate according to the target power corresponding to the monitoring temperature.

[0021] In this embodiment, the heat dissipation system is a liquid-cooled heat dissipation system, comprising a cooling distribution unit 1, a cold plate mounted on the device to be cooled, and a refrigerant transmission channel connecting the cooling distribution unit 1 and the cold plate. The refrigerant transmission channel is used to circulate a refrigerant, specifically a coolant liquid. The refrigerant is distributed to the cold plate via the refrigerant transmission channel by the cooling distribution unit 1. After heat exchange, the refrigerant returns to the cooling distribution unit 1, forming a closed-loop circulation system.

[0022] It can be understood that the cooling distribution unit 1 is used to cool the refrigerant. The higher the operating power of the cooling distribution unit 1, the better the cooling effect and the faster the heat dissipation. However, the higher the operating power of the cooling distribution unit 1, the higher the power consumption. In order to reduce power consumption, this embodiment provides at least one boosting liquid pump 2 between the cooling distribution unit 1 and the refrigerant transmission channel. The boosting liquid pump 2 is used to adjust the flow parameters of the refrigerant in the corresponding refrigerant transmission channel. The flow parameters include but are not limited to the flow velocity. It can be understood that the power increase of the boosting liquid pump 2 can accelerate the flow velocity of the refrigerant in the refrigerant transmission channel, thereby achieving greater heat absorption and heat extraction.

[0023] In this embodiment, the electronic device is an electronic device having a housing, including but not limited to a server. The electronic device has at least one temperature monitoring location, and at least one temperature monitoring unit 3 can be set at each temperature monitoring location. The temperature monitoring unit 3 includes but is not limited to a temperature sensor. As an optional embodiment, this embodiment can use the temperature collected by the temperature monitoring unit 3 at a certain temperature monitoring location as the monitoring temperature of the electronic device. When selecting the temperature monitoring location, the maximum heat point in the application scenario where the electronic device is located can be considered. The temperature collected by the temperature monitoring unit 3 at the temperature monitoring location corresponding to the maximum heat point is used as the monitoring temperature of the electronic device, and the temperature monitoring unit 3 corresponding to the maximum heat point is determined as the target temperature monitoring unit. Each temperature monitoring unit 3 collects the temperature of its location according to its corresponding collection cycle. A communication connection is established between the target temperature monitoring unit and the control unit 4 so that the control unit 4 can obtain the monitoring temperature collected by the target temperature monitoring unit.

[0024] As another optional embodiment, the electronic device includes a temperature monitoring system, which establishes communication connections with each temperature monitoring unit 3 and the control unit 4. The temperature monitoring system obtains the monitored temperature from the target temperature monitoring unit at a preset monitoring frequency (e.g., once every second) and then transmits it to the control unit 4.

[0025] The control unit 4 is connected to the boosting liquid pump 2 and the cooling distribution unit 1 respectively. The control unit 4 determines whether it is necessary to adjust the output frequency of the boosting liquid pump 2 and / or the operating power of the cooling distribution unit 1 based on the received monitoring temperature. If necessary, the output power that the boosting liquid pump 2 needs to reach at the monitored temperature and the target power required by the cooling distribution unit 1 at the monitored temperature are determined (the target power can be dynamically adjusted or remain unchanged according to the actual heat dissipation requirements). Then, corresponding control signals are generated and sent to the power control unit 4 of the boosting liquid pump 2 and the cooling distribution unit 1 respectively, so that the power control unit 4 adjusts the output power of the boosting liquid pump 2 under the action of the received control signal, thereby adjusting the flow rate of the refrigerant in the refrigerant transmission channel, and causing the cooling distribution unit 1 to operate at the target power under the action of the received control signal.

[0026] Through the present application, by setting a booster liquid pump 2 between the cooling distribution unit 1 and the refrigerant transmission channel, the flow parameters of the refrigerant in the refrigerant transmission channel can be adjusted. The control unit 4 dynamically adjusts the output power of the booster liquid pump 2 and the operating power of the cooling distribution unit 1 based on the monitoring temperature of the electronic equipment collected by the temperature monitoring unit 3, thereby achieving precise control of the cooling effect and flow speed of the refrigerant. Since the operating power of the cooling distribution unit 1 is adjustable, the problem of excessive energy consumption caused by the continuous high-power operation of the cooling distribution unit 1 in the related art is solved, achieving the beneficial effect of improving the refrigerant transmission efficiency and significantly reducing the overall power consumption of the liquid cooling heat dissipation system.

[0027] Please refer to Figure 2 In an exemplary embodiment, the refrigerant transmission channel includes: an inner layer pipeline 5, the interior of the inner layer pipeline 5 is used for circulating the refrigerant; an outer layer pipeline 6, the outer layer pipeline 6 is arranged on the outside of the inner layer pipeline 5, and there is a cavity for accommodating the refrigerant between the inner layer pipeline 5 and the outer layer pipeline 6.

[0028] In this embodiment, the refrigerant transmission channel is composed of two nested layers of inner and outer pipes, each connected to other pipes (such as the liquid supply pipe of the cooling distribution unit 1 or the circulation pipe on the cold plate) via quick connectors at both ends. The length of the refrigerant transmission channel can be determined according to actual design requirements.

[0029] It can be understood that since the outer pipeline 6 is arranged on the outside of the inner pipeline 5, and a sealed cavity for accommodating the refrigerant is formed between the two, when a refrigerant leak occurs in the inner pipeline 5, the leaked refrigerant will be confined to the cavity and will not leak into the inside of the electronic equipment box, thereby effectively preventing components such as boards in the box from being contaminated, thereby improving the reliability and safety of the system.

[0030] Furthermore, quick connectors at both ends of the refrigerant transmission channel connect to other pipelines, facilitating installation and removal while also enabling rapid replacement of faulty pipelines in the event of a failure or maintenance. This design also allows for the recycling of refrigerant from the refrigerant transmission channel after replacement, avoiding coolant waste and reducing operational costs.

[0031] In an exemplary embodiment, please refer to Figure 2 The refrigerant transmission channel also includes: a flow sensor 52, which is arranged inside the inner pipeline 5 and is configured to collect refrigerant flow data at its location; a leakage detection device 61, which is arranged in the outer pipeline 6 and is configured to detect whether there is refrigerant in the cavity between the inner pipeline 5 and the outer pipeline 6, and generate a leakage signal when the refrigerant is detected; a control unit 4, which is connected to the flow sensor 52 and the leakage detection device 61, and is also configured to generate information including the refrigerant leakage location based on the refrigerant flow data and the leakage signal.

[0032] In this embodiment, multiple flow sensors 52 are also installed within the inner pipeline 5 of the refrigerant transmission channel. Preferably, these flow sensors 52 are located at the pipeline's inlet and outlet, as well as near key branches or leak-prone points. The specific number and location of these sensors can be determined based on the overall length and complexity of the pipeline to ensure segmented flow monitoring. The flow sensors 52 establish a communication connection with the control unit 4, continuously or periodically uploading the collected refrigerant flow data at their respective locations to the control unit 4.

[0033] Leakage detection devices 61 can be installed on the outer pipe 6 of the refrigerant transmission channel, corresponding to the sections of the inner pipe 5. These devices are preferably located at pipe connections, near valves or structural weaknesses, and at the bottom of the cavity (where refrigerant tends to accumulate under gravity). Leakage detection devices 61 can be based on conductive, optical, or capacitive sensing principles. When they detect the presence of liquid (i.e., refrigerant) in the cavity, they trigger and generate a leakage signal, which is sent to the control unit 4.

[0034] By comprehensively analyzing the flow sensor 52 data (e.g., an abnormal flow drop) in a specific section and the leakage signal triggered by the leakage detection device 61 in that section, the control unit 4 can accurately locate the leak segment and generate information containing the leak location identifier. For example, if the flow data for a certain section falls below a preset threshold and the leakage detection device 61 in the same outer pipe 6 simultaneously reports a leakage signal, the control unit 4 determines that this location is a leak point.

[0035] The cooling system also includes a display unit. The control unit 4 can transmit information including the location of the refrigerant leakage to the display unit for visual display, so that operation and maintenance personnel can quickly locate and perform corresponding inspection and operation and maintenance operations, significantly improving fault response speed and maintenance efficiency.

[0036] Through the dual sensing and intelligent judgment mechanism of this embodiment, the system realizes early detection and precise positioning of refrigerant leakage, effectively avoiding problems such as reduced cooling efficiency, equipment contamination or damage caused by leakage, improving the reliability and safety of system operation, and reducing potential maintenance costs and refrigerant waste.

[0037] In an exemplary embodiment, the refrigerant transmission channel also includes at least one of the following: a shut-off valve 51, arranged at the inlet of the inner pipeline 5, configured to control the circulation and cut-off of the refrigerant in the inner pipeline 5; a non-return device 53, arranged at the outlet of the inner pipeline 5, and the non-return device 53 is used to control the unidirectional flow of the refrigerant in the inner pipeline 5.

[0038] In this embodiment, a shutoff valve 51 is provided at the inlet of the internal pipe. It automatically controls the flow or shutoff of refrigerant in the internal pipe under the control of the control unit 4 or according to changes in pipe pressure. A check valve 53 is provided at the outlet of the inner pipe 5 to ensure that the refrigerant in the inner pipe 5 flows only in a predetermined direction, preventing backflow.

[0039] By providing a shutoff valve 51, the refrigerant supply can be quickly shut off when the control unit 4 detects a leak or requires maintenance, effectively controlling the scope of the leak and ensuring the safety of the electronic equipment. The check valve 53 prevents refrigerant backflow or interference between refrigerants in different branches, ensuring the stability of the circulation direction and heat dissipation efficiency. It also reduces temperature fluctuations or efficiency losses caused by backflow, improving the reliability and overall energy efficiency of the cooling system.

[0040] In an exemplary embodiment, the heat dissipation system also includes: a liquid supply pipeline, one end of the liquid supply pipeline is sealed and connected to the inner pipeline 5, and the other end of the liquid supply pipeline is used to communicate with the liquid inlet or liquid outlet of the cooling distribution unit 1; the boost liquid pump 2 includes: a first boost liquid pump and a second boost liquid pump, the first boost liquid pump and the second boost liquid pump are arranged in parallel in the liquid supply pipeline, and the first boost liquid pump and the second boost liquid pump are both connected to the control unit 4; the control unit 4 is also configured to control the start-up of the second boost liquid pump in the event of a failure of the first boost liquid pump, and to control the shutdown of the second boost liquid pump in the event of a failure of the first boost liquid pump.

[0041] In this embodiment, two booster liquid pumps 2 are provided between the cooling distribution unit 1 and each refrigerant transmission channel. The first booster liquid pump and the second booster liquid pump are redundant with each other, and only one booster liquid pump 2 needs to be started at a time. In addition to controlling the output power of the started booster liquid pump 2, the control unit 4 also regularly obtains the operating status of the first booster liquid pump; when it is determined that the first booster liquid pump fails (such as pump body overheating, abnormal speed, current exceeding limit or complete no response), the second booster liquid pump is controlled to start to take over the boosting work; and when the first booster liquid pump is operating normally, the second booster liquid pump is controlled to be in a standby shutdown state.

[0042] This embodiment utilizes a redundant, parallel design with two booster pumps 2, with automatic failover implemented by the control unit 4. This significantly improves the reliability and continuity of the cooling system's fluid supply and pressurization process. If the primary booster pump (the first booster pump) fails, the backup pump (the second booster pump) can be seamlessly activated, effectively preventing degradation or interruption of system cooling efficiency due to single-point failures and ensuring the continued stable operation of electronic equipment (such as servers). This design also facilitates online maintenance or replacement of failed pumps, improving system maintainability and availability.

[0043] In an exemplary embodiment, the control unit 4 is specifically configured to obtain the heat dissipation control model corresponding to the warning temperature range in which the monitored temperature of the electronic device is located and the target power of the cooling distribution unit 1 when the monitored temperature of the electronic device is within any warning temperature range, control the cooling distribution unit 1 to operate at the target power, and increase the output power of the boosting liquid pump 2 based on the monitored temperature of the electronic device and the heat dissipation control model; when the monitored temperature of the electronic device drops to the initial threshold temperature, control the cooling distribution unit 1 and the boosting liquid pump 2 to enter a low-power operation state; the initial threshold temperature is less than the lower limit temperature value of the warning temperature range, and the heat dissipation control model characterizes the correspondence between the output power of the boosting liquid pump 2 and the monitored temperature of the electronic device.

[0044] In this embodiment, the control unit 4 is specifically configured to: when the monitored temperature of the electronic device enters any pre-set warning temperature range, determine that range as the target warning temperature range; obtain a heat dissipation control model corresponding to the target warning temperature range and a target power set for the cooling distribution unit 1; control the cooling distribution unit 1 to operate at the target power, and dynamically increase the output power of the booster pump 2 based on the monitored temperature of the electronic device and the control relationship defined in the selected heat dissipation control model, so that the monitored temperature of the electronic device can be reduced and stabilized near the lower limit of the target warning temperature range; when the monitored temperature of the electronic device further drops to an initial threshold temperature (which is lower than the lower limit of the current target warning temperature range), control the cooling distribution unit 1 and the booster pump 2 to switch to a low-power operation mode. The heat dissipation control model defines a functional relationship between the output power of the booster pump 2 and the monitored temperature of the electronic device.

[0045] In this embodiment, multiple warning temperature ranges are pre-set, each associated with a different task or load state performed by the electronic device. For example, an electronic device may have three warning temperature ranges: high, medium, and low, corresponding to different application scenarios such as computationally intensive tasks, routine tasks, and idle state.

[0046] Different warning temperature ranges correspond to different heat dissipation control models and target powers for cooling distribution unit 1. Control unit 4 determines the target warning temperature range by assessing the monitored temperature range and invokes the corresponding target power and heat dissipation control model for cooling distribution unit 1. Control unit 4 controls cooling distribution unit 1 to operate at the acquired target power. It also dynamically adjusts the output power of booster pump 2 based on the real-time monitored temperature and a heat dissipation control model (such as a PID (Proportional-Integral-Derivative) control algorithm or a preset power-temperature mapping table). This allows for precise control of device temperature, aiming to reduce and maintain the temperature at the lower limit of the target warning temperature range.

[0047] When the monitored temperature of the electronic device successfully decreases and crosses the lower limit of the target warning temperature range, reaching a lower initial threshold temperature, indicating that the cooling demand has significantly decreased, the control unit 4 controls the cooling distribution unit 1 and the booster pump 2 to enter a low-power operating state, thereby minimizing the cooling system's operating power consumption while still meeting basic cooling requirements.

[0048] This embodiment achieves refined and adaptive management of the cooling system's operating status by establishing multi-level warning temperature thresholds and a linked differentiated control strategy. The cooling system automatically selects the optimal cooling intensity based on the device's real-time thermal load, ensuring both cooling efficiency and device safety under high-load conditions. It also automatically switches to low-power mode when the load is low or cooling demand decreases, significantly improving the system's overall energy efficiency. This intelligent control mechanism based on temperature feedback effectively avoids energy waste, reduces operating costs, and helps extend the life of cooling components.

[0049] An embodiment of the present invention further provides an electronic device, including a housing and a heat dissipation system as described in any one of the above embodiments and disposed in the housing.

[0050] The electronic device has the same beneficial effects as the heat dissipation system. For the description of the electronic device in this embodiment, please refer to the above embodiment, and this embodiment will not be described in detail here.

[0051] Please refer to Figure 3 The present invention also provides a heat dissipation method, which is applied to a heat dissipation system. The heat dissipation system includes a cooling distribution unit and a refrigerant transmission channel, and a booster liquid pump arranged between the refrigerant transmission channel and the cooling distribution unit. The heat dissipation method includes: S101: when the monitored temperature of the electronic device is within any warning temperature range, obtaining a heat dissipation control model and a target power of the cooling distribution unit corresponding to the warning temperature range in which the monitored temperature of the electronic device is located; the heat dissipation control model represents the corresponding relationship between the output power of the booster liquid pump and the monitored temperature of the electronic device.

[0052] In this embodiment, multiple warning temperature ranges are pre-set, and each warning temperature range is associated with a different task or load state performed by the electronic device. For example, the electronic device may include three warning temperature ranges: high, medium, and low, corresponding to different application scenarios such as the electronic device being in computationally intensive tasks, routine tasks, and idle state. Different warning temperature ranges correspond to different heat dissipation control models and different cooling distribution unit target powers. The control unit determines the target warning temperature range by determining the range of the monitored temperature and calls the corresponding cooling distribution unit target power and heat dissipation control model.

[0053] In this embodiment, the monitoring temperature in the electronic device can be collected by a temperature sensor (such as a thermistor or a digital temperature sensor) and compared with the warning temperature range (such as 60-70 The first warning temperature range is 70-80 If the monitored temperature falls within any of the warning temperature ranges, first obtain the heat dissipation control model corresponding to the warning temperature range. The heat dissipation control model includes but is not limited to a mathematical function curve or a lookup table, which defines the functional relationship between the monitored temperature of the electronic device and the output power of the booster pump. For example, a linear model (such as ,in, is the output power, k and b are preset adjustment parameters, and T is the monitoring temperature of the electronic equipment) or a nonlinear model (such as a formula based on PID control), the purpose of which is to optimize the cooling efficiency by adjusting the output power of the booster liquid pump.

[0054] The target power of the cooling distribution unit (CDU) is also obtained. As you can see, the CDU is the core component in the liquid cooling system, responsible for the distribution and circulation of the refrigerant. Its target power is typically a preset value (such as fixed power mode) or a value dynamically calculated based on monitored temperature to ensure cooling stability.

[0055] For example, it is assumed that the server presets two warning temperature ranges: Level 1 warning ( ) and Level 2 Warning ( When the temperature sensor detects that the CPU (Central Processing Unit) temperature is When the temperature is within the first-level warning temperature range, the control unit first obtains the corresponding first-level warning heat dissipation control model from the storage module, such as a linear model: the output power of the booster pump , which means that for every 1°C increase in temperature, the output power of the booster pump increases by 0.5W. At the same time, the target power of the cooling distribution unit (CDU) is read from the configuration file (for example, the rated power is set to Based on these data, the output power of the booster pump currently required is calculated as , and generates a control signal to adjust the booster pump operation, while controlling the CDU to operate at the target power. Another example is that if the temperature rises to (Second level warning), switch to another cooling control mode (such as ), and dynamically increase the target power of the CDU (for example, to the rated power ) to enhance the cooling response.

[0056] This step achieves precise management and dynamic optimization of the thermal state of electronic equipment by establishing a multi-level warning temperature control range and differentiated heat dissipation strategies. The system can automatically select the optimal heat dissipation intensity based on the real-time temperature, which not only ensures the heat dissipation efficiency and equipment safety under high-load conditions, but also effectively prevents performance reduction or hardware damage due to overheating; it can also adopt a more energy-efficient control model at a low warning level, significantly reducing system energy consumption. This intelligent hierarchical control strategy based on temperature feedback improves the response speed and stability of the heat dissipation system, optimizes the balance between cooling efficiency and power consumption, and extends the service life of the equipment. It is especially suitable for high-performance computing scenarios such as servers and data centers with large load fluctuations, and provides an effective technical means to reduce overall operating costs.

[0057] S102: Control the cooling distribution unit to operate at a target power, and increase the output power of the boosting liquid pump based on the monitored temperature of the electronic device and a heat dissipation control model.

[0058] In this embodiment, the cooling distribution unit (CDU) is controlled to operate according to the obtained target power, and the output power of the booster pump is dynamically adjusted based on the real-time temperature monitoring and heat dissipation control model, thereby achieving precise control of the device temperature. The goal is to reduce the monitored temperature of the electronic equipment to and maintain it at the lower limit of its target warning temperature range.

[0059] In this step, the cooling distribution unit (CDU) is first controlled to operate at the target power. This is achieved by sending a control instruction (such as a PWM (Pulse Width Modulation) signal or digital command) to the CDU controller, containing the desired target power value. Upon receiving the instruction, the CDU adjusts the operating state of its internal components (such as the cooling pump, fans, or valves) to achieve the target power consumption, ensuring that the coolant is distributed and circulated at the preset flow rate and pressure.

[0060] Secondly, the booster pump's output power is dynamically increased based on monitored temperature and the heat dissipation control model. The system substitutes the real-time monitored temperature values ​​into the acquired heat dissipation control model to calculate the required booster pump power output value at the current temperature. A control unit (such as the BMC (Baseboard Management Controller)) generates control instructions based on this information and sends them to the booster pump's power control unit (such as the motor driver). This calculates the output power and increases the booster pump's speed and output flow by adjusting the voltage, current, or operating frequency supplied to the booster pump, thereby enhancing the coolant's circulation intensity and heat dissipation capacity.

[0061] For example, it is assumed that the monitored temperature of the server is in the first-level warning temperature range ( ), and the CDU target power has been obtained as 100W, and the heat dissipation control model is First, the BMC sends a command to the CDU via the I2C (Inter-Integrated Circuit) or PWM interface to set its operating power to 100W. After receiving the command, the CDU adjusts the pump speed and fan speed of the internal cooling pump to stabilize the power consumption at 100W to maintain the basic circulation efficiency of the coolant. At the same time, the real-time temperature Substitute the model to calculate the required booster pump power: The BMC then sends a control signal corresponding to 42.5W to the boost pump driver via a DAC (digital-to-analog converter) or digital communication interface. The driver increases the output current or voltage accordingly, raising the pump motor speed from 3000RPM to approximately 4000RPM, thereby increasing the coolant flow rate and system pressure, accelerating the removal of heat from heat-generating components such as the CPU.

[0062] This step achieves accurate and dynamic allocation of cooling system resources by collaboratively controlling the operating power of the CDU and the output power of the booster pump. It ensures the matching and linkage of coolant distribution and drive links, and avoids efficiency bottlenecks caused by excessive work or insufficient capacity of a single component. This embodiment can respond quickly based on real-time temperature and predefined models, significantly improve the cooling efficiency under high heat loads, effectively suppress the temperature rise trend, and ensure the performance stability and hardware security of electronic equipment (such as servers) under high temperature conditions. At the same time, this model-based power regulation avoids the blind use of maximum cooling power, significantly reduces system energy consumption while ensuring the heat dissipation effect, and achieves an optimized balance between performance and energy efficiency.

[0063] S103: When the monitored temperature of the electronic device drops to an initial threshold temperature, the cooling distribution unit and the boosting liquid pump are controlled to enter a low-power operation state; the initial threshold temperature is lower than the lower limit of the warning temperature range.

[0064] When the monitored temperature of an electronic device successfully drops below the lower limit of the target warning temperature range and reaches the preset initial threshold temperature, indicating that the device's immediate cooling needs have been fully met and the thermal load has been significantly reduced, the control unit will then switch the cooling distribution unit (CDU) and booster pump to a low-power operating state, thereby minimizing overall system power consumption while ensuring basic cooling capacity.

[0065] In this step, the system continuously monitors the device's temperature and determines whether it has reached an initial threshold temperature. This threshold is a preset safety value (e.g., 50°C) that is strictly below the lower limit of all warning temperature ranges. This creates a safety buffer with hysteresis. Its core purpose is to prevent the system from frequently switching power modes due to minor fluctuations near the warning temperature boundary. When the conditions are met, the control unit (such as the BMC or a dedicated controller) sends new control instructions to the CDU and booster pump, instructing them to enter a low-power operating mode. For the CDU, this low-power state can be achieved by shutting down the auxiliary fan, reducing the pump speed, or adjusting the valve opening. For the booster pump, energy consumption is reduced by reducing the motor speed or switching to the lowest power level required to maintain the basic cycle.

[0066] For example, assuming that the lower limit of the system warning temperature range is , the initial threshold temperature can be set to When the CPU temperature drops from high temperature to When the power level reaches 100W, the operation of S103 is triggered: the BMC sends a command to the CDU to reduce its operating power from the high-performance state of 100W to the low-power mode of 20W. The CDU then turns off some fans and reduces the opening of the flow control valve. At the same time, the BMC instructs the booster pump to adjust its power output from 42.5W to the maintenance gear of 10W. The pump speed is correspondingly reduced from 4000RPM to 1000RPM, ensuring only the most basic flow of coolant in the circuit.

[0067] This step achieves smooth and efficient switching between cooling system operating states by introducing low-temperature threshold control and hysteresis design. Automatically exiting high-performance mode upon completion of high-temperature cooling tasks significantly reduces unnecessary energy consumption and improves overall energy efficiency. This mechanism also effectively avoids frequent power adjustments caused by minor temperature fluctuations, enhancing control stability and reducing the number of mechanical and electronic component movements. This reduces equipment wear and extends the service life of critical cooling components such as the CDU and liquid pumps.

[0068] In an exemplary embodiment, the process of increasing the output power of the liquid pump based on the monitored temperature of the electronic device and the heat dissipation control model comprises: querying the heat dissipation control model based on the monitored temperature of the electronic device to obtain a target output power of the liquid pump; determining a difference between the output power of the liquid pump and the target output power; and increasing the output power of the liquid pump by the difference to increase the output power of the liquid pump to the target output power.

[0069] In the embodiment, first, the heat dissipation control model is queried based on the monitored temperature to obtain the target output power of the liquid pump. Then, a difference between the target output power and the actual output power of the liquid pump is determined. The control unit (such as the BMC) needs to obtain the current actual output power fed back by the liquid pump driver in real time (Pact) ), which can be read by a power sensor or an internal state register of the driver. The difference between the target value and the actual value is calculated: .

[0070] Finally, the output power of the liquid pump is gradually increased by the difference. The adjustment process is not to increase the power at one time , as an optional embodiment, a closed-loop controller (such as a proportional (P) controller or a proportional integral (PI) controller) can be used. The input of the closed-loop controller is the power difference , and the output is a control signal (such as an adjustment voltage or a PWM duty cycle), which can be proportional to the power difference , so as to adjust the actual output power to the target value in a gradual and smooth manner.

[0071] Exemplarily, assuming that the monitored temperature is T , the heat dissipation control model is a function P(T) , and the target output power calculated is 42.5W. If the BMC reads the current actual output power from the state register of the liquid pump driver as 30W, the power difference is 42.5-30=12.5W . Then, the BMC uses a P controller with a proportional coefficient Kp to process: (the value can correspond to an increase of PWM duty cycle by 0.1 ). The controller sends the instruction to the driver, and the output power of the liquid pump is increased accordingly. In the next control period (such as a few milliseconds later), the BMC reads the actual power again (for example, 35W), calculates a new difference 42.5-35=7.5W , and outputs a new control amount equal to 3 (the duty cycle is increased by 0.1 again ). The iteration is repeated in this way until the actual power converges to the target value of 42.5W.

[0072] This embodiment effectively avoids the mechanical and electrical shock to the liquid cooling system caused by sudden step changes in output power by adopting a differential-based progressive power regulation strategy. This closed-loop control method ensures smooth changes in coolant flow and system pressure, reduces stress on pipe joints and the mechanical structure of the liquid pump, and improves system reliability. Furthermore, smooth power regulation suppresses current spikes, reduces noise interference with the server power system, and reduces heat loss and electrical stress on the liquid pump motor, helping to extend its service life. The entire regulation process is smooth and controllable, achieving an effective balance between high-performance heat dissipation and system protection.

[0073] In an exemplary embodiment, the heat dissipation method also includes: obtaining a first temperature change value between the monitoring temperature of the electronic device in a first temperature acquisition cycle and the monitoring temperature of the electronic device in a second temperature acquisition cycle; the second temperature acquisition cycle is a temperature acquisition cycle before the first temperature acquisition cycle; obtaining a second temperature change value between the monitoring temperature of the electronic device in the first temperature acquisition cycle and an initial monitoring temperature; the initial monitoring temperature is the monitoring temperature of the electronic device in the last temperature acquisition cycle before adjusting the output power of the boosting liquid pump; updating the heat dissipation control model based on the first temperature change value and the second temperature change value, so that when the monitoring temperature of the electronic device is within the warning temperature range for the last time, the output power of the boosting liquid pump is adjusted using the updated heat dissipation control model.

[0074] In this embodiment, the heat dissipation control model is dynamically optimized by analyzing the trend of temperature change. First, a first temperature change value ( ) between the monitored temperature of the first temperature acquisition cycle and the monitored temperature of the second temperature acquisition cycle is obtained. Specifically, the system reads the temperature value of the first temperature acquisition period in each fixed acquisition period ( ), and subtract the temperature value stored in the second temperature acquisition cycle ( ),Right now This value reflects the instantaneous rate of change and recent trend of temperature.

[0075] At the same time, a second temperature change value between the monitored temperature of the first temperature acquisition cycle and the initial monitored temperature is obtained ( The initial monitoring temperature here is a key reference point, which is defined as the temperature value recorded at the last moment before the control unit starts to intervene and adjust the output power of the booster pump ( ). ,This value reflects the cumulative change in temperature relative to the initial baseline since the start of the cooling intervention, reflecting the overall effect of the control strategy.

[0076] Finally, based on the first temperature change value ( ) and the second temperature change value ( ) To update the heat dissipation control model, refer to Figure 4 As shown, Figure 4 The figure shows the heat dissipation control model before the update (dashed line) and the heat dissipation control model after the update (solid line). The update strategy may include: using a weighted algorithm to integrate short-term sensitivity ( ) and long-term effects ( ) to adjust model parameters (such as the slope k or intercept b in a linear model); or and As input, a new model that is more adapted to the current thermal load characteristics is generated through a predefined rule base or a lightweight optimization algorithm.

[0077] For example, assume that the system collects temperature once per second. In the second temperature collection cycle, the system increases the output power of the booster pump for the first time because the temperature reaches the warning value. At this time, the initial monitoring temperature is recorded. In the first temperature collection cycle, the temperature , the temperature of the second temperature acquisition cycle Then: the first temperature change value , indicating that the temperature is decreasing; the second temperature change value , indicating that the temperature has decreased cumulatively since the intervention .

[0078] If the original heat dissipation control model is (For example ), can be based on and Adjust the model parameters. As an optional implementation, if and are all negative (temperature decreases and the downward trend continues), indicating that the current control strategy is effective, and may even be excessive heat dissipation. In this case, the model parameters can be slightly reduced, for example, the slope k can be updated to (i.e., from 0.5 to 0.475), so that the next time the power demand is calculated at the same temperature, it will be slightly lower, thus achieving energy saving. The updated model will be stored and used for power adjustment the next time the temperature enters the warning range.

[0079] This embodiment introduces a dynamic model update mechanism based on temperature change trends to enable the heat dissipation system to have adaptive optimization capabilities. This embodiment can automatically evaluate and adjust the control strategy based on short-term changes and long-term cumulative effects, thereby more accurately responding to changes in the actual thermal load of the electronic equipment and the external environment. This mechanism avoids the lack of response or energy waste that may be caused by fixed models, and achieves a precise match between the heat dissipation intensity and the actual needs of the equipment. It not only improves the heat dissipation efficiency and stability of the system under dynamic conditions, but also effectively reduces unnecessary energy consumption and extends the service life of the heat dissipation components. It is particularly suitable for scenarios with large load fluctuations or variable ambient temperatures.

[0080] In an exemplary embodiment, the process of querying a heat dissipation control model based on the monitored temperature of the electronic device to obtain the target output power of the boost liquid pump includes: determining the maximum output power corresponding to the warning temperature range of the monitored temperature of the electronic device; querying the heat dissipation control model based on the monitored temperature to obtain the intermediate output power of the boost liquid pump; and determining the smaller value between the intermediate output power and the maximum output power as the target output power of the boost liquid pump.

[0081] In this embodiment, the output power of the booster pump can be increased by increasing it in fixed steps, increasing it proportionally, or calculating a higher target value based on a preset algorithm model. It should be noted that the output power of the booster pump should never exceed the maximum output power corresponding to the current warning temperature range ( ). That is, before or after each power increase command is issued, the BMC will compare the new target power or current actual power to the power If the new power value exceeds , the system will force the output power to be limited to .

[0082] For example, suppose an electronic device is in the second warning temperature range ( ), the level preset The BMC decided to increase the output power of the booster pump because the equipment temperature did not drop to a safe range.

[0083] Scenario 1 (step increase): The booster pump output power is 70W. The BMC control strategy is to increase the output power by 10W each time. The BMC first calculates the new target power: .because , the BMC command is valid, and the booster pump output power increases to 80W. Next time, the BMC tries to increase it by 10W again ( ),but At this time, the BMC does not execute this instruction, but forcibly sets and maintains the output power of the boost pump at 80W.

[0084] Scenario 2 (Model Calculation): The BMC uses a heat dissipation control model to calculate the new required power as 85W. Before issuing the command, the BMC compares 85W with ,because , discard this value and directly determine the target output power as 80W before execution.

[0085] Through the above-mentioned mechanism, this embodiment can effectively avoid excessive responses caused by control logic errors, algorithm defects or continuous high temperature alarms, prevent the liquid pump motor from overheating and damage due to long-term overload, and at the same time ensure that the internal pressure of the cooling circuit does not exceed the design limit, thereby eliminating the potential risks of pipeline leakage or joint bursting.

[0086] In an exemplary embodiment, the heat dissipation method also includes: when the monitored temperature of the electronic device is within any warning temperature range, determining the lower limit value of the warning temperature range in which the monitored temperature of the electronic device is located and the corresponding maximum output power; when the output power of the boosting liquid pump increases to the target output power, judging whether the monitored temperature of the electronic device is less than or equal to the lower limit value; if not, increasing the output power of the boosting liquid pump under preset adjustment conditions, the preset adjustment conditions including that the output power of the boosting liquid pump is not greater than the maximum output power.

[0087] In this embodiment, when the output power of the booster pump reaches the target output power, it is determined whether the monitored temperature is still within the warning temperature range. If so, that is, the temperature has not safely dropped below the lower limit of the warning temperature range, indicating that the target power calculated by the initial heat dissipation control model is insufficient to cope with the current heat load, the output power of the booster pump is further increased. When increasing, a fixed step value can be added on the basis of the current power (such as each increase). ), or switch to another backup heat dissipation control model (such as a linear model with a larger slope or a maximum power model) to recalculate a new, higher target output power until the monitored temperature of the electronic equipment drops below the lower limit of the warning temperature range. It can be understood that this process of increasing power will continue to form a closed loop of "power increase-temperature monitoring" until the monitored temperature is confirmed to have dropped to the preset safety threshold (such as ) or below, the power upgrade cycle will be terminated at this time.

[0088] For example, suppose that the BMC has previously reached (Level 1 warning) The target power is calculated as 42.5W according to the model, and the booster pump has been controlled to reach this power. After running for a period of time (such as 30 seconds), it is detected that the output power of the booster pump has stabilized at 42.5W. Then a judgment is made: the current monitoring temperature is read and it is found that the temperature is still , still in the first level warning temperature range ( ). Since the initial control strategy failed to get the temperature out of the warning state, the cooling upgrade was triggered. If a fixed step strategy is used, the output power of the booster pump will be increased from the current 42.5W. , that is, the new target power becomes The BMC controls the booster pump to reach this new power and continues to monitor the temperature. If the temperature is still higher than the warning lower limit ( ), which will increase the output power again to This cycle continues until the temperature is found to have dropped to When the temperature is below the initial threshold, the BMC stops increasing the power and subsequently executes S103 to enter a low power state.

[0089] This embodiment enhances the robustness and reliability of the cooling system in dealing with abnormally high heat loads, preventing the system from experiencing insufficient cooling due to initial calculation model deviations or unexpected sudden computing tasks. Through this gradually escalating forced cooling approach, the system can proactively and systematically increase cooling efforts to ensure that the temperature is ultimately brought back within the safe range, significantly reducing the risk of server CPU throttling, performance degradation, or even unexpected shutdowns due to cooling failure.

[0090] In an exemplary embodiment, the heat dissipation method further includes: determining an area to be monitored of the electronic device in a target operating scenario; the area to be monitored is the area with the highest heat generation in a heat source simulation result of the electronic device in the target operating scenario; and determining the collected temperature of the area to be monitored as the monitoring temperature.

[0091] In this exemplary embodiment, the heat dissipation method further includes: determining a to-be-monitored area of ​​the electronic device in a target operation scenario, and determining a collected temperature of the to-be-monitored area as a monitoring temperature.

[0092] Specifically, the BMC first identifies the target operating scenario of the electronic device, which is the operating scenario in which the electronic device is currently executing business, such as CPU-intensive computing, GPU (Graphics Processing Unit) rendering, or memory database operations. The main heat sources in different target operating scenarios may be different. Then, the BMC queries the preset "scenario-heat source simulation results" database, which contains thermal distribution maps obtained by simulating various typical workloads of the server in advance through thermodynamic simulation software. Based on the current target operating scenario, the BMC extracts the area with the highest heat generation from the corresponding thermal distribution map and determines it as the area to be monitored.

[0093] After determining the area to be monitored, the BMC selects the reading of the physical temperature sensor in the area (such as the sensor located under the hottest CPU core or on the GPU chip) as the monitoring temperature for use by the entire thermal control logic.

[0094] For example, suppose a server is equipped with dual CPUs and four GPUs, and its preset simulation database contains two typical target operation scenarios: Scenario A (CPU-intensive task): The heat source simulation results show that a core area of ​​CPU1 is the area with the highest heat generation; Scenario B (AI training task): The heat source simulation results show that the chip of the second GPU (GPU1) is the area with the highest heat generation.

[0095] When the BMC detects that the server is executing AI (artificial intelligence) model training (target scenario B), it loads the heat source simulation results for scenario B from the database and identifies the GPU1 chip as the area to be monitored. The BMC then uses the temperature measured by the corresponding sensor on GPU1 as the monitoring temperature, rather than the CPU's temperature sensor. All subsequent cooling control operations (such as adjusting the boost pump's output power) are based on this monitored temperature.

[0096] This embodiment dynamically identifies and monitors the areas with the highest heat generation in the current target operating scenario, enabling the heat dissipation BMC to respond quickly and specifically to the most critical heat sources. This effectively avoids the shortcomings of traditional fixed monitoring methods: for example, when the GPU is overheated and the CPU temperature is normal, the BMC with the CPU as the fixed monitoring object cannot promptly perceive the risk of GPU overheating. This method ensures that heat dissipation resources are concentrated in the areas that need cooling the most, while preventing local overheating and ensuring hardware safety, it improves the computing stability of the server. In addition, due to precise temperature control of the hottest spots, unnecessary cooling of non-critical areas is also avoided, which helps to reduce the overall cooling energy consumption of the BMC.

[0097] In an exemplary embodiment, the heat dissipation method also includes: determining the initial threshold temperature and the maximum warning temperature corresponding to the heat-generating components in the monitored area; the initial threshold temperature is the temperature reached when the heat-generating components start to operate, and the maximum warning temperature is the maximum safe operating temperature of the heat-generating components; obtaining a monitoring temperature range based on the initial threshold temperature and the maximum warning temperature, the lower temperature limit of the monitoring temperature range is the initial threshold temperature, and the lower temperature limit of the monitoring temperature range is the maximum warning temperature; dividing the monitoring temperature range into multiple continuous warning temperature ranges.

[0098] In this embodiment, two key parameters are required for the selected monitored area (e.g., a CPU chip): the initial threshold temperature and the maximum warning temperature. The initial threshold temperature refers to the typical steady-state operating temperature reached by the heat-generating component upon initial operation, typically determined based on the manufacturer's recommendations or system testing. The maximum warning temperature refers to the maximum safe operating temperature allowed for the heat-generating component, strictly specified by the manufacturer. The initial threshold temperature serves as the lower limit of the monitored temperature range, while the maximum warning temperature serves as the upper limit, forming the overall temperature interval [initial threshold temperature, maximum warning temperature].

[0099] The monitored temperature range is divided into multiple continuous warning temperature ranges based on preset strategies (such as equal division, exponential division, or based on thermal sensitivity). These sub-ranges connect end to end, seamlessly covering the entire monitored temperature range, and each sub-range corresponds to a different level of overheating risk and cooling response.

[0100] Let’s take the CPU as an example. The CPU manufacturer specifies the maximum warning temperature of its product, for example , which is set as the highest warning temperature and written into the BMC firmware. At the same time, according to the thermal design of the CPU under the common operating conditions of electronic equipment, its initial threshold temperature is determined as Therefore, the monitoring temperature range is The system divides this range into four consecutive warning temperature ranges, corresponding to different cooling strategies: Level 1 warning temperature range: , Level 2 warning temperature range: , three-level warning temperature range: , Level 4 warning temperature range: .

[0101] The cooling system includes multiple temperature monitoring units, which are used to continuously monitor the monitoring temperature within different warning temperature ranges, thereby triggering corresponding cooling actions. Figure 5 As shown, when the electronic device is running, the monitoring temperature of the electronic device is first determined. Is it less than If yes, trigger the control unit action, temperature control system, power control unit and cooling distribution unit action to make the cold pump in the cooling distribution unit run at low power. If no, determine the monitoring temperature. Is greater than or equal to and less than If yes, trigger the control unit action, temperature control system, power control unit and cooling distribution unit action to make the cold pump in the cooling distribution unit run at medium power. If no, determine the monitoring temperature. Is greater than or equal to and less than If yes, trigger the control unit action, temperature control system, power control unit and cooling distribution unit action to make the cold pump in the cooling distribution unit run at high power. If no, determine the monitoring temperature. Is greater than or equal to and less than If so, the control unit, temperature control system, power control unit and cooling distribution unit are triggered to make the cold pump in the cooling distribution unit run at full power.

[0102] In an exemplary embodiment, the process of obtaining the target power of the cooling distribution unit corresponding to the warning temperature range in which the monitored temperature of the electronic device is located includes: determining whether the warning temperature range in which the monitored temperature of the electronic device is located is the last warning temperature range; if not, determining that the target power of the cooling distribution unit is the lowest power; if so, determining the target power of the cooling distribution unit based on the monitored temperature of the electronic device, and the target power is greater than the lowest power.

[0103] Specifically, warning temperature ranges are typically arranged sequentially from low to high based on temperature and risk level (for example, Range 1, Range 2, Range 3). The last warning temperature range is the highest temperature range, closest to the component's maximum safe operating temperature, representing the highest level of overheating risk.

[0104] If the current warning temperature range is not the last warning temperature range, the system determines that the cooling distribution unit does not need to run at high intensity, so its target power is set to the minimum power ( This power is usually only used to maintain the basic standby operation of the cooling distribution unit, such as driving the control circuit and maintaining minimum liquid flow circulation, and the power consumption is extremely low.

[0105] If the current temperature is in the last warning temperature range, the system determines that the cooling distribution unit needs to provide significant cooling capacity to assist in emergency heat dissipation, so its target power is set to an intermediate power higher than the minimum power ( This power can activate the active cooling functions of the cooling distribution unit (such as turning on the internal fan and adjusting the valve to the high-efficiency position) to enhance the cooling effect while avoiding a surge in energy consumption.

[0106] For example, assume that the warning temperature range of a CPU is divided into three levels: Level 1 warning temperature range: ; Second level warning temperature range: ;Level 3 warning temperature range: (Highest warning temperature, last warning temperature range); The cooling distribution unit has two preset power modes: minimum power (P_min): 20W (only maintains basic standby); intermediate power (P_mid): 100W (starts the cooling fan and optimizes the liquid distribution); Scenario 1: The monitored temperature is , enters the third pre-warning temperature range (the last pre-warning temperature range). The BMC determines that the current is in the last pre-warning temperature range, and thus determines that the target power of the cooling distribution unit is the intermediate power 100W. The system sends an instruction to the cooling distribution unit, which starts the internal fan and adjusts the valve, the power consumption rises to 100W, and the effective heat dissipation assistance is started.

[0107] The embodiment saves power by maintaining the cooling distribution unit at the lowest power in the non-last pre-warning temperature range with low risk, and only starts the intermediate power mode when the temperature reaches the highest risk level to provide sufficient heat dissipation assistance. The hierarchical power control strategy not only ensures the heat dissipation capacity in high-temperature emergency, but also maximizes the idle energy consumption of the system, which helps to improve the energy efficiency of the data center and achieve the balance between energy saving and safety.

[0108] In an example embodiment, the refrigerant transmission channel is provided with a flow sensor configured to collect refrigerant flow data at its location. The heat dissipation method further comprises: obtaining the refrigerant flow data at the location of the flow sensor; determining whether refrigerant leakage occurs in the refrigerant transmission channel based on the refrigerant flow data; if so, determining the refrigerant leakage position and generating and outputting information corresponding to the refrigerant leakage position.

[0109] In the embodiment, the inner layer pipeline of the refrigerant transmission channel is further provided with a plurality of flow sensors. Preferably, the flow sensors can be arranged near the inlet, outlet and key branches or easy leakage points of the pipeline. The specific number and position can be determined according to the total length and complexity of the pipeline to ensure segmented monitoring of the flow. The flow sensor continuously or periodically uploads the collected refrigerant flow data at its location to the control unit.

[0110] In an example embodiment, the refrigerant transmission channel is provided with a liquid leakage detection device configured to detect whether refrigerant exists between the inner layer pipeline and the outer layer pipeline of the refrigerant transmission channel, and generate a liquid leakage signal when refrigerant is detected. The process of determining the refrigerant leakage position comprises: determining the refrigerant leakage position based on the liquid leakage signal and the refrigerant flow data.

[0111] On the outer layer pipeline of the refrigerant transmission channel, the liquid leakage detection device can be arranged correspondingly between each segment of the inner layer pipeline, preferably near the pipeline connection, valve or structural weak point, and the bottom of the cavity (because the liquid is easy to accumulate under the action of gravity). The liquid leakage detection device can be based on conductive, optical or capacitive sensing principles. When liquid (i.e. refrigerant) is detected in the cavity, the liquid leakage signal is triggered and generated. ​

[0112] In this embodiment, by comprehensively analyzing flow sensor data from a specific section (e.g., an abnormal flow drop) and the leakage signal triggered by the leakage detection device in that section, the leak location can be precisely located and information containing the leak location identifier can be generated. For example, if the flow data for a certain section falls below a preset threshold and the leakage detection device in the same outer pipe simultaneously reports a leakage signal, this information can be used to identify the leak.

[0113] This embodiment achieves rapid and accurate positioning of refrigerant leaks, thereby greatly improving maintenance efficiency and system reliability. When a single pipeline in the related art leaks, maintenance personnel may need to spend a lot of time to check the entire cooling circuit one by one to find the leak point. During this period, the server must be shut down, causing business interruption. However, this solution designs a double-layer pipeline in the physical structure and arranges sensors with address labels on the outer pipeline. Once a leak occurs in the inner pipe, the liquid will be confined in the outer pipeline and immediately captured by the nearest sensor. The system can automatically and accurately report the specific section where the leak occurs, rather than just alerting the leak. This enables operation and maintenance personnel to directly inspect the fault point, significantly shortening the average repair time and minimizing server downtime. At the same time, the design of the outer pipeline also plays a secondary containment role, preventing the coolant from leaking directly onto the server motherboard or other electronic components, causing short-circuit damage, and providing additional safety protection.

[0114] In an exemplary embodiment, the heat dissipation method further includes: determining treatment measures based on the refrigerant leakage location; generating and outputting information corresponding to the treatment measures, the treatment measures including shutting off a shut-off valve in the refrigerant transmission channel or replacing a pipeline.

[0115] In this embodiment, the leak location information can be converted into specific, executable operation and maintenance instructions. The process of determining the treatment measures based on the refrigerant leak location includes: a knowledge base or rule engine is pre-installed in the BMC, which defines the recommended treatment solutions corresponding to different leak locations. Once the precise leak location (such as the "CPU heat sink inlet section") is determined, the BMC will query the knowledge base to determine the treatment measures. For example, the best solution for a leak at a certain location is to close the upstream valve, while another location may recommend directly replacing a certain section of components. The control prompt unit prompts the information corresponding to the treatment measures. Specifically, the BMC will then display clear treatment instructions to the operation and maintenance personnel through the human-computer interaction interface (i.e., the prompt unit). The prompt unit can be the front panel indicator light of the server (prompted by a specific flashing pattern), the BMC's web management interface, an SNMP alarm trap (Trap) sent to the network management platform, or an email containing specific text instructions. Actions include shutting off the shutoff valve (operating a specific solenoid valve to cut off the coolant flow to the leak) or replacing the line (indicating which specific line component needs to be replaced). They may also include other instructions such as "BMC has been safely shut down" or "Please check connector X."

[0116] For example, following the previous embodiment, the BMC determines that the leak location is "the north area of ​​the chassis, the CPU heat sink inlet section." The system queries the internal rule base. One rule in the rule base is: IF the leak location == "CPU heat sink inlet section" THEN the treatment measures = ["turn off the upstream shut-off valve", "prompt to replace the CPU heat sink inlet pipe"]. Based on this, the BMC determines two treatment measures. Prompt treatment measures: The BMC performs the following operations: First, it sends a closing command to the solenoid valve through the control bus to automatically shut off the shut-off valve, isolate the fault point at the source, and prevent the leakage from expanding. At the same time, a high-priority alarm is generated in the alarm event of the Web management interface, with the content: "Serious: Coolant leak detected. Location: CPU heat sink inlet section. The system has automatically shut off the shut-off valve. Treatment measures: Please replace the CPU heat sink inlet pipe assembly (part number: XXXX-XXX) immediately."

[0117] In addition, the BMC may also light up the red fault indicator on the server's front panel, which flashes at a specific frequency, prompting personnel to check on site. Operations and maintenance personnel can intuitively obtain clear fault location and specific repair plans from the management interface.

[0118] This embodiment improves the efficiency and accuracy of operations and maintenance. By matching the leak location with pre-configured processing rules, it automatically performs preliminary physical isolation (e.g., closing a valve), effectively preventing further coolant leakage and secondary damage (e.g., short circuits and component corrosion). This prevents maintenance personnel from making incorrect operations due to inexperience or panic, saves time and effort in tedious troubleshooting, ensures rapid service recovery, and improves the availability and service efficiency of the entire server system.

[0119] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus the necessary general hardware platform, and of course it can also be implemented by hardware, but in many cases the former is a better implementation method.

[0120] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored. The computer program is configured to execute the steps of any of the above-mentioned heat dissipation method embodiments when running.

[0121] In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to, various media that can store computer programs, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk, or an optical disk.

[0122] An embodiment of the present application further provides a computer program product, which includes a computer program. When the computer program is executed by a processor, the steps in any of the above-mentioned heat dissipation method embodiments are implemented.

[0123] An embodiment of the present application further provides another computer program product, including a non-volatile computer-readable storage medium, wherein the non-volatile computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in any of the above-mentioned heat dissipation method embodiments are implemented.

[0124] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the above description has generally described the components and steps of each example according to their functions. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0125] The above is a detailed introduction to a heat dissipation system, electronic device, heat dissipation method, product and medium provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A heat dissipation system, characterized in that: include: a cooling distribution unit configured to perform cooling operations on the refrigerant; a booster liquid pump, disposed between the cooling distribution unit and the refrigerant transmission channel, configured to adjust flow parameters of the refrigerant in the refrigerant transmission channel; a temperature monitoring unit configured to collect a monitoring temperature of the electronic device; A control unit is connected to the cooling distribution unit, the boost liquid pump and the temperature monitoring unit, and is configured to control the boost liquid pump to operate according to the output power corresponding to the monitored temperature, and to control the cooling distribution unit to operate according to the target power corresponding to the monitored temperature.

2. The heat dissipation system according to claim 1, characterized in that: The refrigerant transmission channel includes: An inner layer pipeline, wherein the interior of the inner layer pipeline is used for circulating refrigerant; The outer layer pipeline is sleeved on the outside of the inner layer pipeline, and a cavity for accommodating refrigerant is provided between the inner layer pipeline and the outer layer pipeline.

3. The heat dissipation system according to claim 2, characterized in that: The refrigerant transmission channel further includes: a flow sensor, the flow sensor being disposed inside the inner layer pipeline and configured to collect refrigerant flow data at the location thereof; a liquid leakage detection device, the liquid leakage detection device being disposed in the outer layer pipeline and configured to detect whether the refrigerant is present in the cavity between the inner layer pipeline and the outer layer pipeline, and generating a liquid leakage signal when the refrigerant is detected; The control unit is connected to the flow sensor and the leakage detection device, and is further configured to generate information including a refrigerant leakage location based on the refrigerant flow data and the leakage signal.

4. The heat dissipation system according to claim 2, characterized in that: The refrigerant transmission channel further includes at least one of the following: a shutoff valve, disposed at the inlet of the inner pipeline, configured to control the flow and shutoff of the refrigerant in the inner pipeline; A non-return device is provided at the outlet of the inner layer pipeline, and the non-return device is used to control the one-way flow of the refrigerant in the inner layer pipeline.

5. The heat dissipation system according to claim 2, characterized in that: The heat dissipation system further comprises: a liquid supply pipeline, one end of which is sealedly connected to the inner layer pipeline, and the other end of which is used to communicate with the liquid inlet or the liquid outlet of the cooling distribution unit; The booster liquid pump includes a first booster liquid pump and a second booster liquid pump, the first booster liquid pump and the second booster liquid pump are arranged in parallel on the liquid supply pipeline, and the first booster liquid pump and the second booster liquid pump are both connected to the control unit; The control unit is further configured to control the second boosting liquid pump to start if the first boosting liquid pump fails, and control the second boosting liquid pump to stop if the first boosting liquid pump does not fail.

6. The heat dissipation system according to any one of claims 1 to 5, characterized in that: The control unit is specifically configured to, when the monitored temperature of the electronic device is within any warning temperature range, obtain a heat dissipation control model corresponding to the warning temperature range in which the monitored temperature of the electronic device is located and a target power of the cooling distribution unit, control the cooling distribution unit to operate at the target power, and increase the output power of the boosting liquid pump based on the monitored temperature of the electronic device and the heat dissipation control model; when the monitored temperature of the electronic device drops to an initial threshold temperature, control the cooling distribution unit and the boosting liquid pump to enter a low-power operating state; the initial threshold temperature is less than the lower limit temperature value of the warning temperature range, and the heat dissipation control model characterizes the correspondence between the output power of the boosting liquid pump and the monitored temperature of the electronic device.

7. An electronic device, characterized in that: The invention comprises a box body, and a heat dissipation system according to any one of claims 1 to 6, which is arranged in the box body.

8. A heat dissipation method, characterized in that: Applied to a heat dissipation system, the heat dissipation system includes a cooling distribution unit and a refrigerant transmission channel, and a booster liquid pump provided between the refrigerant transmission channel and the cooling distribution unit. The heat dissipation method includes: When the monitored temperature of the electronic device is within any warning temperature range, obtaining a heat dissipation control model corresponding to the warning temperature range in which the monitored temperature of the electronic device is located and a target power of the cooling distribution unit; the heat dissipation control model represents a corresponding relationship between the output power of the boosting liquid pump and the monitored temperature of the electronic device; controlling the cooling distribution unit to operate at the target power, and increasing the output power of the boosting liquid pump based on the monitored temperature of the electronic device and the heat dissipation control model; When the monitored temperature of the electronic device drops to an initial threshold temperature, the cooling distribution unit and the boost liquid pump are controlled to enter a low-power operation state; the initial threshold temperature is lower than the lower limit of the warning temperature range.

9. The heat dissipation method according to claim 8, characterized in that: The process of increasing the output power of the booster pump based on the monitored temperature of the electronic device and the heat dissipation control model includes: querying the heat dissipation control model based on the monitored temperature of the electronic device to obtain a target output power of the booster pump; Determining the difference between the output power of the booster liquid pump and the target output power; The output power of the boosting liquid pump is increased according to the difference, so that the output power of the boosting liquid pump is increased to the target output power.

10. The heat dissipation method according to claim 9, wherein: The heat dissipation method further includes: Acquire a first temperature change value between a monitored temperature of the electronic device in a first temperature acquisition cycle and a monitored temperature of the electronic device in a second temperature acquisition cycle, wherein the second temperature acquisition cycle is a temperature acquisition cycle preceding the first temperature acquisition cycle; Acquiring a second temperature change value of the electronic device between a monitored temperature in a first temperature acquisition cycle and an initial monitored temperature; the initial monitored temperature is the monitored temperature of the electronic device in a last temperature acquisition cycle before adjusting the output power of the boosting liquid pump; The heat dissipation control model is updated based on the first temperature change value and the second temperature change value, so that when the monitored temperature of the electronic device is within the warning temperature range for the last time, the output power of the boosting liquid pump is adjusted using the updated heat dissipation control model.

11. The heat dissipation method according to claim 9, wherein: The process of querying the heat dissipation control model based on the monitored temperature of the electronic device to obtain the target output power of the booster pump includes: Determining a maximum output power corresponding to a warning temperature range within which the monitored temperature of the electronic device lies; querying the heat dissipation control model based on the monitored temperature to obtain an intermediate output power of the boosting liquid pump; A smaller value between the intermediate output power and the maximum output power is determined as the target output power of the boosting liquid pump.

12. The heat dissipation method according to claim 9, wherein: The heat dissipation method further includes: When the monitored temperature of the electronic device is within any warning temperature range, determining a lower limit value of the warning temperature range in which the monitored temperature of the electronic device is located and a corresponding maximum output power; After the output power of the boosting liquid pump increases to the target output power, determining whether the monitored temperature of the electronic device is less than or equal to the lower limit; If not, the output power of the boosting liquid pump is increased under a preset adjustment condition, wherein the preset adjustment condition includes that the output power of the boosting liquid pump is not greater than the maximum output power.

13. The heat dissipation method according to claim 8, wherein: The heat dissipation method further includes: Determining a to-be-monitored area of ​​the electronic device in a target operating scenario; the to-be-monitored area is an area of ​​the electronic device with the highest heat generation in a heat source simulation result in the target operating scenario; The collected temperature of the area to be monitored is determined as the monitoring temperature.

14. The heat dissipation method according to claim 13, wherein: The heat dissipation method further includes: Determine an initial threshold temperature and a maximum warning temperature corresponding to the heat-generating component in the monitored area; the initial threshold temperature is the temperature reached when the heat-generating component starts operating, and the maximum warning temperature is the maximum safe operating temperature of the heat-generating component; A monitoring temperature range is obtained based on the initial threshold temperature and the maximum warning temperature, wherein a lower limit value of the monitoring temperature range is equal to or greater than the initial threshold temperature, and a lower limit value of the monitoring temperature range is equal to or greater than the maximum warning temperature; The monitored temperature range is divided into a plurality of continuous warning temperature ranges.

15. The heat dissipation method according to claim 14, wherein: The process of obtaining the target power of the cooling distribution unit corresponding to the warning temperature range in which the monitored temperature of the electronic device is located includes: Determining whether the warning temperature range within which the monitored temperature of the electronic device is located is the last warning temperature range; If not, determining that the target power of the cooling distribution unit is the minimum power; If so, a target power of the cooling distribution unit is determined based on the monitored temperature of the electronic device, and the target power is greater than the minimum power.

16. The heat dissipation method according to any one of claims 8 to 15, characterized in that: The refrigerant transmission channel is provided with a flow sensor configured to collect refrigerant flow data at the location thereof, and the heat dissipation method further comprises: Obtaining refrigerant flow data collected by the flow sensor at the location where the flow sensor is located; determining whether refrigerant leakage occurs in the refrigerant transmission channel based on the refrigerant flow data; If so, the refrigerant leakage location is determined, and information corresponding to the refrigerant leakage location is generated and output.

17. The heat dissipation method according to claim 16, wherein: The refrigerant transmission channel is provided with a liquid leakage detection device, which is configured to detect whether the refrigerant is present in the cavity between the inner layer pipe and the outer layer pipe of the refrigerant transmission channel, and generate a liquid leakage signal when the refrigerant is detected; The process for locating a refrigerant leak includes: A refrigerant leakage location is determined based on the leakage signal and the refrigerant flow data.

18. The heat dissipation method according to claim 17, wherein: The heat dissipation method further includes: determining treatment measures based on the refrigerant leakage location; Generate and output information corresponding to the treatment measures, where the treatment measures include shutting off a shut-off valve in the refrigerant transmission channel or replacing a pipeline.

19. A computer program product comprising a computer program / instructions, characterized in that When the computer program / instruction is executed by a processor, the steps of the heat dissipation method according to any one of claims 8 to 18 are implemented.

20. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the heat dissipation method according to any one of claims 8 to 18 are implemented.

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