Display panel and its manufacturing method, display device

Abstract

Embodiments of the present application provide a display panel, a preparation method thereof and a display device. The display panel comprises a substrate, a first electrode layer, a pixel definition layer arranged on one side of the substrate and comprising a pixel definition part and a pixel opening, a plurality of pixel openings are arranged in an array, a projection of the pixel opening on the substrate and a projection of the first electrode on the substrate at least partially overlap, an isolation structure, the isolation structure is in communication with the pixel opening and the pixel opening, the isolation structure comprises a lap joint layer and a first sub-layer arranged in a stacking manner away from the substrate, the lap joint layer is arranged protruding towards the pixel opening relative to the first sub-layer, a first insulating part covering the lap joint layer, wherein the first electrode comprises a plurality of sub-layers arranged in a stacking manner along the thickness direction of the display panel, the plurality of sub-layers comprise a first conductive sub-layer, the first conductive sub-layer comprises an edge segment, and the edge segment is located on the side of the first insulating part away from the substrate. The present application can improve the process performance of the display panel.

Description

Technical Field

[0001] This application relates to the field of display device technology, and in particular to a display panel and its manufacturing method, and a display device. Background Technology

[0002] Organic light-emitting diode (OLED) display technology is considered the most promising next-generation display technology. Compared with liquid crystal display technology, OLED display technology has advantages such as low energy consumption, low cost, self-emissiveness, wide viewing angle, and fast response speed.

[0003] In the traditional OLED display panel manufacturing process, a fine metal mask (FMM) is typically used to pattern the light-emitting pixels. FMM technology is mature and has extensive mass production experience. However, FMM technology also suffers from limitations in precision and high cost. Fine metal mask-less technology eliminates the limitations of traditional OLED processes on display size, resolution, and other screen performance characteristics, offering advantages such as high performance, full-size display, and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, and CN118781966A describe relevant content regarding fine metal mask-less technology and are provided for reference.

[0004] However, the process performance of current OLED display products needs to be improved. Summary of the Invention

[0005] This application provides a display panel, a method for manufacturing the same, and a display device, aiming to improve the process performance of the display panel.

[0006] An embodiment of the first aspect of this application provides a display panel, comprising: a substrate; a pixel defining layer disposed on one side of the substrate and including a pixel defining portion and a pixel opening, wherein a plurality of pixel openings are arrayed; an isolation structure disposed on the side of the pixel defining layer away from the substrate and enclosing an isolation opening, the isolation opening communicating with a corresponding pixel opening, the isolation structure including an overlap layer and a first sub-layer stacked in a direction away from the substrate, the overlap layer protruding toward the isolation opening relative to the first sub-layer; a first insulating portion covering the surface of the overlap layer away from the substrate and the side of the overlap layer toward the isolation opening; a first electrode layer disposed on one side of the substrate and including a plurality of first electrodes spaced apart, the first electrodes including at least a first conductive sub-layer located within a corresponding pixel opening, the first conductive sub-layer extending along the sidewall of the pixel opening and having an edge segment located on the side of the first insulating portion away from the substrate; a plurality of light-emitting units, the light-emitting units being located on the side of the corresponding first electrode away from the substrate; wherein the distance between the edge segment and the first sub-layer is greater than the distance between the first edge portion and the first sub-layer.

[0007] According to an embodiment of the first aspect of this application, the display panel further includes a second electrode layer, the second electrode layer including a plurality of second electrodes, the second electrodes being located on the side of the corresponding light-emitting unit facing away from the substrate, wherein: the light-emitting unit has a second edge portion, the second edge portion covering the edge segment and contacting the first edge portion; the second electrode has a third edge portion, the third edge portion covering the second edge portion and contacting the first sub-layer; the second edge portion is spaced apart from the first edge portion by the overlapping layer, and the second edge portion is spaced apart from the first sub-layer by the third edge portion.

[0008] According to an embodiment of the first aspect of this application, it further includes: a second insulating portion, the second insulating portion covering at least a portion of the edge segment on one side surface away from the substrate, and the second insulating portion covering the edge segment on one side surface facing the isolation opening.

[0009] According to any of the foregoing embodiments of the first aspect of this application, the second insulating portion surrounds the pixel opening in a closed ring shape; and / or, the first insulating portion surrounds the pixel opening in a closed ring shape.

[0010] According to any of the foregoing embodiments of the first aspect of this application, a second electrode layer is further included, the second electrode layer comprising a second electrode located on the side of the light-emitting unit opposite to the substrate.

[0011] Wherein, the first insulating part and the second insulating part are provided with a clearance gap between themselves and the first sub-layer, the second electrode covers the overlapping layer exposed by the clearance gap, and / or, at least one of the first insulating part and the second insulating part is in contact with the first sub-layer, and the second electrode covers at least a portion of the surface of the first sub-layer facing the isolation opening.

[0012] According to any of the foregoing embodiments of the first aspect of this application, the density of the first insulating portion is greater than the density of the pixel defining portion, and / or the density of the second insulating portion is greater than the density of the pixel defining portion.

[0013] According to any of the foregoing embodiments of the first aspect of this application, the film thickness of the first insulating portion is less than the film thickness of the overlapping layer, and / or, the film thickness of the second insulating portion is less than the film thickness of the overlapping layer.

[0014] According to any of the foregoing embodiments of the first aspect of this application, the light-emitting unit is located within the orthogonal projection of the second insulating portion onto the substrate at the edge of its projection onto the substrate, or the light-emitting unit is located on the side of the second insulating portion facing the pixel opening.

[0015] According to any of the foregoing embodiments of the first aspect of this application, the surface of the second insulating portion facing away from the substrate includes a first sub-surface, a second sub-surface, and a third sub-surface connecting the first sub-surface and the second sub-surface and extending along the thickness direction of the display panel.

[0016] The light-emitting unit is located on the side of the third sub-surface facing the pixel opening, or the second sub-surface is located on the side of the third sub-surface away from the pixel opening, and the edge of the light-emitting unit in the orthographic projection of the substrate is located within the orthographic projection of the second sub-surface on the substrate.

[0017] According to any of the foregoing embodiments of the first aspect of this application, the first conductive sublayer includes a central segment and a transition segment surrounding the central segment, the edge segment is connected to the side of the transition segment opposite to the central segment, the transition segment covers the side surface of the pixel defining portion facing the pixel opening, and at least a portion of the edge segment is located between the first insulating portion and the second insulating portion.

[0018] According to any of the foregoing embodiments of the first aspect of this application, the first insulating portion extends to the edge of the pixel opening, and the transition segment also covers the surface of the first insulating portion facing the pixel opening.

[0019] According to any of the foregoing embodiments of the first aspect of this application, the first insulating portion extends to the edge of the pixel opening and covers a portion of the pixel defining portion.

[0020] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure further includes a second sublayer located on the side of the first sublayer facing away from the substrate, the second sublayer being disposed protruding toward the isolation opening relative to the first sublayer, and the first insulating portion overlapping the orthographic projection of the first sublayer onto the substrate and the second sublayer overlapping the orthographic projection of the second sublayer onto the substrate.

[0021] According to any of the foregoing embodiments of the first aspect of this application, the plurality of light-emitting units include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit with different light-emitting colors, wherein at least two of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit correspond to different thicknesses of the first conductive electronic layer.

[0022] According to any of the foregoing embodiments of the first aspect of this application, the first electrode further includes a second conductive layer located on the side of the first conductive layer facing the substrate and a third conductive layer located on the side of the second conductive layer facing the substrate. A portion of the second conductive layer is in contact with the first conductive layer, and another portion of the second conductive layer is located between the pixel defining portion and the substrate. The orthographic projection of the third conductive layer on the substrate overlaps with the orthographic projection of the second conductive layer on the substrate. The materials of the first conductive layer and the third conductive layer include metal oxides, and the material of the second conductive layer includes metal.

[0023] According to any of the foregoing embodiments of the first aspect of this application, a protective portion is provided between the second conductive layer and the pixel defining portion, the material of the protective portion including an insulating material, and the protective portion is disposed around the pixel opening.

[0024] An embodiment of the first aspect of this application also provides a display panel, comprising: a substrate; a pixel definition layer disposed on one side of the substrate and including a pixel defining portion and a pixel opening, wherein a plurality of the pixel openings are arranged in an array, and the pixel openings are used to accommodate light-emitting units; a first electrode layer disposed on one side of the substrate and including a plurality of first electrodes spaced apart, wherein the first electrodes include at least a first conductive sublayer located within a corresponding pixel opening; a plurality of light-emitting units, wherein the light-emitting units are located on the side of the corresponding first electrode facing away from the substrate; wherein the first conductive sublayer includes an edge segment covering the pixel defining portion facing away from the top surface of the substrate, and the side of the edge segment facing away from the substrate is covered with a second insulating portion.

[0025] According to an embodiment of the first aspect of this application, the isolation structure includes an overlap layer and a first sub-layer stacked in a direction away from the substrate, the overlap layer protruding toward the isolation opening relative to the first sub-layer.

[0026] The edge segments and the overlapping layers are spaced apart, and the second insulating portion covers the surface of the edge segments away from the substrate and the side surface of the edge segments facing the isolation structure.

[0027] Alternatively, it may include a first insulating portion that covers at least a portion of the overlapping layer, and at least a portion of the edge segments located on the side of the first insulating portion away from the substrate.

[0028] According to any of the foregoing embodiments of the first aspect of this application, it further includes:

[0029] The second electrode layer includes a second electrode located on the side of the light-emitting unit opposite to the substrate.

[0030] Both the first insulating portion and the second insulating portion are provided with clearance gaps between themselves and the first sub-layer, and the second electrode covers the overlapping layer exposed by the clearance gaps.

[0031] The second aspect of this application also provides a method for manufacturing a display panel, comprising: patterning a material layer to form a plurality of spaced second conductive sublayers and a pre-protection portion located on the side of the second conductive sublayers away from the substrate;

[0032] A pixel definition material layer and an isolation structure material layer are disposed on the side of the second conductive sublayer away from the substrate, and the isolation structure material layer is patterned to form an isolation structure. The isolation structure encloses and forms an isolation opening. The isolation structure includes an overlap layer and a first sublayer stacked in a direction away from the substrate. The overlap layer protrudes toward the isolation opening relative to the first sublayer.

[0033] A first insulating material layer is provided on the side of the pixel definition material layer and the isolation structure away from the substrate, and the pixel definition material layer and the first insulating material layer are patterned to form a pixel definition layer and a first pre-insulating portion. The pixel definition layer includes a pixel defining portion and a pixel opening. The first pre-insulating portion surrounds and forms a first pre-opening that communicates with the pixel opening, and the first pre-insulating portion covers at least a portion of the isolation structure.

[0034] A first conductive material layer is disposed on the side of the first pre-insulating portion, the pixel definition layer, and the isolation structure away from the substrate, and the first conductive material layer is patterned to form a first conductive sub-layer. The first conductive sub-layer includes a central segment located at the pixel opening, an edge segment located at the pixel defining portion away from the top surface of the substrate, and a transition segment connecting the central segment and the edge segment. The edge segment is located on the side of the first pre-insulating portion away from the substrate.

[0035] According to an embodiment of the second aspect of this application, in the step of providing a first insulating material layer on the side of the pixel definition material layer and the isolation structure away from the substrate, and patterning the pixel definition material layer and the first insulating material layer to form a pixel definition layer and a first pre-insulating portion:

[0036] The pixel definition material layer and the pre-protection portion are patterned to form the pixel definition layer and the protection portion, wherein the protection portion is located between the second conductive sublayer and the pixel defining portion and is disposed around the pixel opening;

[0037] A first insulating material layer is provided on the side of the pixel definition layer and the isolation structure away from the substrate, and the first insulating material layer is patterned to form the first pre-insulating portion;

[0038] Alternatively, in the step of forming the pixel definition layer and the first pre-insulating portion by patterning the pixel definition layer and the first insulating layer on the side of the isolation structure opposite to the substrate:

[0039] A first insulating material layer is provided on the side of the pixel definition material layer and the isolation structure facing away from the substrate;

[0040] The pre-protection portion, the pixel definition material layer, and the first insulating material layer are patterned to form the protection portion, the pixel definition layer, and the first pre-insulating portion. The protection portion is located between the second conductive layer and the pixel defining portion and is disposed around the pixel opening.

[0041] According to any of the foregoing embodiments of the second aspect of this application, it further includes:

[0042] A second insulating material layer is provided on the side of the first conductive layer away from the substrate. The second insulating material layer and the first pre-insulating portion are patterned to form a second insulating portion and a first insulating portion. The first insulating portion covers a portion of the pixel defining portion and a portion of the first insulating portion of the overlapping layer. The second insulating portion covers at least a portion of the edge segment on the side surface away from the substrate.

[0043] Alternatively, the first pre-insulating portion may be patterned to form a first insulating portion, the first insulating portion covering at least a portion of the overlapping layer.

[0044] The third aspect of this application also provides a display device, including a display panel prepared according to any of the first aspect embodiments or a display panel provided according to any of the second aspect embodiments.

[0045] In the display panel provided in this application embodiment, the display panel includes a substrate, a pixel definition layer, an isolation structure, a first insulating portion, a first electrode layer, and light-emitting units. The first electrode of the first electrode layer and the pixel opening of the pixel definition layer are correspondingly disposed, allowing the first electrode to contact and connect with the light-emitting unit within the pixel opening, and the first electrode to drive the light-emitting unit to emit light for display. The isolation structure encloses and forms an isolation opening, which can be used to separate the light-emitting material into independent light-emitting units located in each isolation opening. The first insulating portion covers the overlap layer, and the distance between the edge segment and the first sub-layer is greater than the distance between the first edge portion and the first sub-layer. During the subsequent fabrication of the first conductive sub-layer of the first electrode, the edge segment of the first conductive sub-layer is located on the side of the first insulating portion away from the substrate, i.e., the first insulating portion is located between the first conductive sub-layer and the overlap layer. This can improve the short-circuit connection problem between the first conductive sub-layer and the isolation structure, thereby reducing the process difficulty and improving the process performance of the display panel. Attached Figure Description

[0046] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, wherein the same or similar reference numerals denote the same or similar features.

[0047] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of this application;

[0048] Figure 2 yes Figure 1 A partially enlarged structural diagram;

[0049] Figure 3 yes Figure 2 A partial cross-sectional view in one embodiment;

[0050] Figure 4 This is a schematic diagram of a pixel driving circuit structure for a display panel provided in an embodiment of this application;

[0051] Figure 5 yes Figure 2 A partial cross-sectional view in another embodiment;

[0052] Figure 6 yes Figure 2 A partial cross-sectional view in another embodiment;

[0053] Figure 7 yes Figure 2 A partial cross-sectional view in another embodiment;

[0054] Figure 8 yes Figure 2 A partial cross-sectional view in yet another embodiment;

[0055] Figure 9 yes Figure 2 A partial cross-sectional view in yet another embodiment;

[0056] Figure 10 yes Figure 2 A partial cross-sectional view in yet another embodiment;

[0057] Figure 11 This is a schematic flowchart of a method for manufacturing a display panel provided in an embodiment of this application;

[0058] Figures 11a to 11d This is a schematic diagram of the process structure of a method for manufacturing a display panel according to an embodiment of this application;

[0059] Figure 12 This is a schematic flowchart of a method for manufacturing a display panel according to another embodiment of this application;

[0060] Figure 12a This is a schematic diagram of the process structure of a method for manufacturing a display panel according to an embodiment of this application;

[0061] Figure 13 This is a schematic flowchart of a method for manufacturing a display panel according to another embodiment of this application;

[0062] Figure 13a This is a schematic diagram of the process structure of a method for manufacturing a display panel according to an embodiment of this application;

[0063] Figure 14 This is a schematic flowchart of a method for manufacturing a display panel according to another embodiment of this application;

[0064] Figure 14a This is a schematic diagram of the process structure of a method for manufacturing a display panel provided in an embodiment of this application.

[0065] Explanation of reference numerals in the attached figures:

[0066] 100. Substrate;

[0067] 200, Pixel definition layer; 201, First definition layer; 202, Second definition layer; 210, Pixel limiting part; 220, Pixel opening; 230, Light-emitting unit;

[0068] 300. Isolation structure; 301. First sub-layer; 302. Second sub-layer; 303. Overlap layer; 310. Isolation opening;

[0069] 400, First electrode layer; 410, First electrode; 411, First conductive sublayer; 411a, Edge segment; 411b, Transition segment; 411c, Center segment; 412, Second conductive sublayer; 413, Third conductive sublayer; 420, Protective part;

[0070] 500, Second electrode layer; 510, Second electrode; 511, Main body; 512, Overlapping part;

[0071] 600, Encapsulation layer; 610, First encapsulation layer; 610a, Encapsulation part; 611, First encapsulation part; 612, Second encapsulation part; 613, Third encapsulation part; 620, Second encapsulation layer; 630, Third encapsulation layer;

[0072] 710. First insulating part; 720. Second insulating part; 721. First sub-surface; 722. Second sub-surface; 723. Third sub-surface; 730. Clearance gap;

[0073] X, first direction; Y, second direction; Z, thickness direction; AA, display area; NA, non-display area. Detailed Implementation

[0074] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0075] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0076] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. It should be noted that, unless otherwise specified, different features in the embodiments of this application can be combined with each other.

[0077] For ease of understanding, the accompanying diagram shows the mutually orthogonal X-axis, Y-axis, and Z-axis. The direction along the X-axis is called the X-direction, the direction along the Y-axis is called the Y-direction, and the direction along the Z-axis is called the Z-direction. The Z-direction is the normal direction relative to the plane containing the X and Y directions. Furthermore, a view where various elements are observed parallel to the plane containing the X and Y directions is called a top view. Alternatively, the planes in the X and Y directions can be planes parallel to the display surface of the display panel, and the Z-direction can be a direction parallel to the thickness direction Z of the display panel.

[0078] For certain elements, terms like "above" or "overhead" are sometimes used when describing the position of an element in the Z direction, and "below" or "under" are used when describing the position of an element in the opposite direction. Furthermore, when using terms like "above," "overhead," "below," "under," or "relative" to define the positional relationship between two elements, this includes not only the state where the two elements are directly adjacent, but also the state where the two elements are separated by gaps or other elements. Additionally, terms like "first," "second," and "third" are used only for distinguishing descriptions and should not be interpreted as indicating or implying relative importance.

[0079] Figure 1 This is a schematic diagram of a display panel according to one embodiment of this application. The display panel can be an organic light-emitting diode (OLED) display panel or a quantum dot light-emitting diode (QLED) display panel. The display panel includes a display area AA with display function and a non-display area NA.

[0080] The display area AA of the display panel can be rectangular, square, circular, oval, or other shapes.

[0081] The display area AA includes a plurality of pixels PX arranged in the X and Y directions. Each pixel PX includes a plurality of sub-pixels SPX displaying different colors. In some embodiments, a pixel PX includes a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. For example, the first sub-pixel SPX1 is a blue sub-pixel, the second sub-pixel SPX2 is a green sub-pixel, and the third sub-pixel SPX3 is a red sub-pixel. In some embodiments, in addition to sub-pixels SPX1, SPX2, and SPX3, a pixel PX also includes sub-pixels SPX that emit white or other colors of light.

[0082] A sub-pixel SPX includes a pixel circuit and a light-emitting device driven by the pixel circuit to emit light of the corresponding color. The first sub-pixel SPX1 includes a first light-emitting device, the second sub-pixel SPX2 includes a second light-emitting device, and the third sub-pixel SPX3 includes a third light-emitting device. One pixel circuit drives at least one light-emitting device to emit light. For example, a display area AA includes a normal display area AA and a light-transmitting display area AA. The light-transmitting display area AA is a display area AA that corresponds to a sensor and has light-transmitting properties, while the normal display area AA is a display area AA that does not correspond to a sensor. In the normal display area AA, one pixel circuit drives one light-emitting device to emit light, and in the light-transmitting display area AA, one pixel circuit drives one or more light-emitting devices to emit light.

[0083] like Figures 2 to 3 As shown, a first aspect of this application provides a display panel, which includes: a substrate 100; a pixel defining layer 200 disposed on one side of the substrate 100 and including a pixel defining portion 210 and a pixel opening 220, wherein a plurality of pixel openings 220 are arrayed and the pixel openings 220 are used to accommodate light-emitting units 230; an isolation structure 300 disposed on one side of the substrate 100 and forming an isolation opening 310, the isolation opening 310 communicating with the pixel openings 220, the isolation structure 300 including an overlapping layer 303 and a first sub-layer 301 stacked in a direction away from the substrate 100, the overlapping layer 303 protruding toward the isolation opening 310 relative to the first sub-layer 301; and a first insulating portion 710 covering the surface of the overlapping layer 303 away from the substrate 100 and the overlapping layer. The first electrode layer 303 faces the side of the isolation opening 310 and has a first edge portion located on the side of the overlapping layer 303 away from the substrate 100; the first electrode layer 400 is disposed on one side of the substrate 100 and includes a plurality of first electrodes 410 spaced apart, each first electrode 410 including at least a first conductive sublayer 411 located within the corresponding pixel opening 220, the first conductive sublayer 411 extending along the sidewall of the pixel opening 220 and having an edge segment 411a located on the side of the first insulating portion 710 away from the substrate 100; a plurality of light-emitting units 230, the light-emitting units 230 being located on the side of the corresponding first electrode 410 away from the substrate 100; wherein the distance between the edge segment 411a and the first sublayer 301 is greater than the distance between the first edge portion and the first sublayer 301.

[0084] In the display panel provided in this embodiment, the display panel includes a substrate 100, a pixel definition layer 200, an isolation structure 300, a first insulating portion 710, a first electrode layer 400, and a plurality of light-emitting units 230. The first electrode 410 of the first electrode layer 400 and the pixel opening 220 of the pixel definition layer 200 are correspondingly disposed, such that the first electrode 410 can contact and connect with the light-emitting unit 230 within the pixel opening 220, and the first electrode 410 can drive the light-emitting unit 230 to emit light for display. The isolation structure 300 encloses and forms an isolation opening 310, which can be used to separate the light-emitting material into mutually independent light-emitting units 230 located in each isolation opening 310. The first insulating portion 710 covers the overlapping layer 303. The distance between the edge segment 411a and the first sub-layer 301 is greater than the distance between the first edge portion and the first sub-layer 301. When the first conductive sub-layer 411 of the first electrode 410 is subsequently fabricated, the edge segment 411a of the first conductive sub-layer 411 is located on the side of the first insulating portion 710 away from the substrate 100. That is, the first insulating portion 710 is located between the first conductive sub-layer 411 and the overlapping layer 303. This can improve the short-circuit connection problem between the first conductive sub-layer 411 and the isolation structure 300, thereby reducing the process difficulty and improving the process performance of the display panel.

[0085] Optionally, the orthographic projection of the pixel opening 220 onto the substrate 100 and the orthographic projection of the first electrode 410 onto the substrate 100 at least partially overlap. At least a portion of the light-emitting unit 230 is located in the pixel opening 220 and is in contact with the first electrode 410.

[0086] The first electrode 410 can be a single-layer structure including a first conductive sublayer 411, or the first electrode 410 can include multiple sublayers.

[0087] The first electrode 410 can have multiple sub-layers arranged in various ways. For example, the multiple sub-layers may include a metal layer and a pair of conductive oxide layers covering the upper and lower surfaces of the metal layer, respectively. For example, the first conductive sub-layer 411 may be a conductive oxide layer, and the material of the first conductive sub-layer 411 may include a metal oxide. The multiple sub-layers may also include a second conductive sub-layer 412, which is located on the side of the first conductive sub-layer 411 facing the substrate 100. A portion of the second conductive sub-layer 412 is in contact with the first conductive sub-layer 411, and another portion of the second conductive sub-layer 412 is located between the pixel defining portion 210 and the substrate 100. Optionally, the material of the second conductive sub-layer 412 may include a metal, such as silver. Each conductive oxide layer may be formed, for example, a transparent conductive oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or IGZO (Indium Gallium Zinc Oxide).

[0088] Optionally, the first electrode 410 further includes a third conductive layer 413, which is located on the side of the second conductive layer 412 facing the substrate 100. The orthographic projection of the third conductive layer 413 onto the substrate 100 and the orthographic projection of the second conductive layer 412 onto the substrate 100 can overlap, and the third conductive layer 413 and the second conductive layer 412 are in contact, so that the third conductive layer 413 and the second conductive layer 412 can be fabricated in the same patterning process. Optionally, the third conductive layer 413 may be, for example, a conductive oxide layer, and the material of the third conductive layer 413 may include metal oxides, which can improve the problem of the second conductive layer 412 being easily oxidized.

[0089] Optionally, a protective portion 420 is provided between the second conductive sublayer 412 and the pixel defining portion 210, the protective portion 420 surrounding the pixel opening 220. By providing the protective portion 420, during the fabrication of the second conductive sublayer 412 and the third conductive sublayer 413, an insulating material can be deposited on the material layer of the second conductive sublayer 412. The insulating material provides protection to the second conductive sublayer 412. Before fabricating the first conductive sublayer 411, the insulating material is patterned to form the protective portion 420 surrounding the pixel opening 220. The subsequent first conductive sublayer 411 can be electrically connected to the second conductive sublayer 412 via the pixel opening 220. Before the first conductive sublayer 411 covers the second conductive sublayer 412, the insulating material provides insulating protection to the second conductive sublayer 412. The material of the protective portion 420 includes, for example, photoresist, giving the protective portion 420 good insulating properties and making it easy to pattern, thus reducing the complexity of the fabrication process.

[0090] There are multiple, selectable ways to set up the substrate 100, such as... Figure 3 As shown, the substrate 100 further includes a substrate and a pixel driving circuit. For example, the substrate 100 includes a substrate and a driving circuit layer and a planarization layer disposed on the substrate. The pixel driving circuit includes a transistor and a capacitor. The capacitor includes a first electrode and a second electrode. The transistor includes a source, a drain, a gate, and a semiconductor layer. The driving circuit layer also includes multiple signal lines, such as data signal lines, scan signal lines, driving power supply voltage signal lines, etc. The driving circuit layer includes multiple conductive layers, including a first conductive layer, a second conductive layer, and a third conductive layer. The gate and the first electrode may be located on the first conductive layer, the second electrode may be located on the second conductive layer, and the source and drain may be located on the third conductive layer.

[0091] Optional, see reference Figure 4 The pixel driving circuit includes a driving transistor T1 and a switching transistor T2. The source of the switching transistor T2 is connected to the data line that provides the data signal Data, the gate of the switching transistor T2 is connected to the scan line that provides the scan signal Scan, the drain of the switching transistor T2 is connected to the gate of the driving transistor T1, the two ends of the storage capacitor C1 are connected to the gate and the source of the driving transistor T1 respectively, and the drain of the driving transistor T1 is connected to the light-emitting device. Figure 4 This is one implementation of the pixel driving circuit, but the pixel driving circuit of this application is not limited to... Figure 4 The pixel driving circuit shown in the 2T1C diagram can also be other pixel driving circuits, such as 7T1C, 8T1C, etc.

[0092] In some alternative embodiments, the isolation structure 300 includes a first sublayer 301 and a second sublayer 302 stacked in a direction away from the substrate 100, the second sublayer 302 protruding relative to the first sublayer 301 toward the isolation opening 310.

[0093] In these alternative embodiments, the isolation structure 300 includes a first sub-layer 301 and a second sub-layer 302, the second sub-layer 302 protruding relative to the first sub-layer 301 toward the isolation opening 310, such that a recess can be formed beneath the second sub-layer 302. During the fabrication of the light-emitting unit 230, the light-emitting material can be broken into independent light-emitting units 230 at the edge of the second sub-layer 302.

[0094] Optionally, the isolation structure 300 further includes the aforementioned overlapping layer 303, which is located on the side of the first sub-layer 301 facing the substrate 100, and protrudes from the first sub-layer 301 toward the isolation opening 310. During the fabrication of the isolation structure 300, when the first sub-layer 301 is side-etched, the overlapping layer 303 can provide protection to the film layer on the substrate 100 side.

[0095] Optionally, the materials of the first sublayer 301 and the second sublayer 302 are different, and the etching rate of the first sublayer 301 is lower than that of the second sublayer 302. The material of the first sublayer 301 includes a conductive material, specifically including at least one of aluminum (Al) and aluminum alloys, and the aluminum alloys may include at least one of aluminum-neodymium alloy (AlNd), aluminum-yttrium alloy (AlY), or aluminum-silicon alloy (AlSi). The second sublayer 302 can be a single-layer structure or a multi-layer structure. If the second sublayer 302 is a single-layer structure, the material of the second sublayer 302 may include at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy, or molybdenum-niobium alloy. If the second sublayer 302 is a multi-layer structure, one layer of the second sublayer 302 may be made of at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy, or molybdenum-niobium alloy, and the other layer of the second sublayer 302 may be made of a conductive oxide or an inorganic insulating material, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0096] Optionally, the material of the overlap layer 303 may include a conductive material. For example, the material of the overlap layer 303 may include at least one of molybdenum (Mo), titanium (Ti), titanium nitride (TiN), molybdenum-tungsten alloy (MoW), or molybdenum-niobium alloy (MoNb).

[0097] Optionally, the display panel further includes a second electrode layer 500, which includes a second electrode 510 located on the side of each light-emitting unit 230 facing away from the substrate 100. Optionally, the light-emitting device is composed of the first electrode 410, the light-emitting unit 230, and the second electrode 510 described above. Optionally, the second electrode 510 is located in each isolation opening 310. Optionally, the second electrode 510 is electrically connected to the isolation structure 300. For example, the material of the first sub-layer 301 includes a conductive material, and the second electrode 510 is electrically connected to the first sub-layer 301. Alternatively, the materials of both the first sub-layer 301 and the overlapping layer 303 include conductive materials, and the second electrode 510 is electrically connected to the overlapping layer 303 and the first sub-layer 301.

[0098] Optionally, at least one light-emitting unit 230 includes a hole injection layer HIL, a hole transport layer HTL, an electron blocking layer EBL, a light-emitting material layer EML, a hole blocking layer HBL, an electron transport layer ETL, and an electron injection layer EIL stacked along a direction away from the substrate 100 (thickness direction Z). The light-emitting unit 230 may include a single light-emitting material layer EML, or a stacked light-emitting structure including multiple light-emitting material layers EML.

[0099] During the light emission process of the light-emitting unit 230, the first electrode 410 is used to generate holes, and the second electrode 510 is used to generate electrons. Holes and electrons combine within the light-emitting unit 230, causing the light-emitting unit 230 to emit light. The first electrode 410 is in contact with the light-emitting unit 230, and a portion of the light-emitting unit 230 may overlap with the isolation structure 300. This can cause holes to crosstalk between adjacent light-emitting units 230 through the light-emitting unit 230 and the isolation structure 300. In this embodiment, the pixel limiting portion 210 is provided with a recess, which allows at least a portion of the light-emitting unit 230 to break at the recess, thereby reducing the hole transmission area and improving the problem of lateral crosstalk.

[0100] In order for the light-emitting unit 230 to emit light, a pixel voltage is provided to the first electrode 410 and a common voltage is provided to the second electrode 510, respectively, forming a potential difference between the first electrode 410 and the second electrode 510, so that the light-emitting structure disposed between the first electrode 410 and the second electrode 510 emits light. In one embodiment, if a potential difference is formed between the first electrode 410 and the second electrode 510 of the light-emitting unit 230, the light-emitting material layer EML of the light-emitting unit 230 emits light.

[0101] In this circuit, the pixel voltage of the first electrode 410 is provided by the pixel driving circuit, and the common voltage of the second electrode 510 is provided by the isolation structure 300. Specifically, the second electrode 510 is electrically connected to the isolation structure 300, and the common voltage is supplied to the second electrode 510 by providing the isolation structure 300. That is, the isolation structure 300 has the function of supplying a common voltage to the second electrode 510.

[0102] In some alternative embodiments, such as Figure 3 As shown, the display panel further includes a second electrode layer 500, which includes a plurality of second electrodes 510. The second electrodes 510 are located on the side of the corresponding light-emitting unit 230 away from the substrate 100. The light-emitting unit 230 has a second edge portion that covers the edge segment 411a and contacts the first edge portion. The second electrode 510 has a third edge portion that covers the second edge portion and contacts the first sub-layer 301. The second edge portion is spaced from the first edge portion by the overlapping layer 303, and the second edge portion is spaced from the third edge portion by the first sub-layer 301.

[0103] In these alternative embodiments, a first insulating portion 710 is provided between the overlapping layer 303 and the first conductive sublayer 411, and a light-emitting unit 230 is provided between the first conductive sublayer 411 and the second electrode 510. The light-emitting unit 230 covers the edge segment 411a, which can improve the short-circuit connection problem between the second electrode 510 and the first conductive sublayer 411.

[0104] In some other alternative embodiments, such as Figure 5 As shown, the display panel also includes a second insulating portion 720, which covers at least a portion of the edge segment 411a on the side surface facing away from the substrate 100.

[0105] In these alternative embodiments, a second insulating portion 720 is provided on the side of the edge segment 411a facing away from the substrate 100. The second insulating portion 720 can cover at least a portion of the surface of the edge segment 411a facing away from the substrate 100. When the second electrode 510 is subsequently fabricated, the second electrode 510 can fall on the second insulating portion 720, thereby improving the problem of short-circuit connection between the first electrode 410 and the second electrode 510.

[0106] There are various ways to arrange the shape of the first insulating part 710 and the second insulating part 720. For example, the edge segment 411a surrounds the pixel opening 220 in a closed ring shape, and the first insulating part 710 surrounds the pixel opening 220 in a closed ring shape, so that the first insulating part 710 is provided under the edge segment 411a at different positions around the pixel opening 220, which can improve the problem of short circuit connection between the edge segment 411a at different positions and the overlapping layer 303.

[0107] Optionally, the second insulating portion 720 surrounds the pixel opening 220 in a closed ring shape. This ensures that the second insulating portion 720 covers the edge segments 411a at different positions around the pixel opening 220, which can improve the problem of short-circuit connection between the edge segments 411a at different positions and the second electrode 510.

[0108] There are various ways to set the material of the pixel definition layer 200. For example, the pixel definition layer 200 can be made of an inorganic material, such as using at least one of silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON) as an inorganic insulating material. Figure 3 and Figure 5 As shown, the pixel definition layer 200 can be a single-layer structure.

[0109] In one implementation, such as Figure 6 As shown, the pixel definition layer 200 includes multiple sub-layers. The pixel definition layer 200 includes a first definition layer 201 and a second definition layer 202 that are stacked sequentially along the direction away from the substrate 100. That is, the pixel definition layer 200 can adopt a double-layer design.

[0110] For example, the first defining layer 201 has better film-forming properties than the second defining layer 202. That is, under the same thickness conditions, the first defining layer 201 can better cover the stepped structure formed by the first electrode 410 than the second defining layer 202, without causing cracks. Conversely, to obtain the same stepped coverage effect, the thickness of the first defining layer 201 needs to be thinner than that of the second defining layer 202. That is, the thickness requirement for the first defining layer 201 is relatively low, which is beneficial for product thinning. In addition, better film-forming properties are reflected in the better coverage of the formed film, which is denser and more conducive to the isolation of moisture. That is, the material density of the first defining layer 201 is greater than that of the second defining layer 202.

[0111] For example, the second defining layer 202 has better etching resistance than the first defining layer 201. Since the side of the pixel defining layer 200 facing away from the substrate 100 will be etched during the manufacturing process of the display panel, by selecting a material with stronger etching resistance as the second defining layer 202, the etching resistance of the pixel defining layer 200 can be improved, thereby further improving the reliability of the display panel.

[0112] For example, the first defining layer 201 and the second defining layer 202 are made of different materials. For instance, the first defining layer 201 is made of silicon nitride, and the second defining layer 202 is made of silicon oxide.

[0113] For example, the thickness of the first defining layer 201 is greater than or equal to 1000 micrometers and less than or equal to 5000 micrometers. For instance, the thickness of the first defining layer 201 is 1000 micrometers, 2000 micrometers, 3000 micrometers, 4000 micrometers, 5000 micrometers, etc.

[0114] For example, the thickness of the second defining layer 202 is greater than or equal to 500 micrometers and less than or equal to 3000 micrometers. For instance, the thickness of the second defining layer 202 is 500 micrometers, 1000 micrometers, 2000 micrometers, 3000 micrometers, etc.

[0115] In some optional embodiments, when the display panel includes the aforementioned second electrode layer 500, and the second electrode layer 500 includes a second electrode 510 located on the side of the light-emitting unit 230 facing away from the substrate 100, the second electrode 510 and the isolation structure 300 can be electrically connected in various ways. For example, such as Figure 3 and Figure 5As shown, a clearance gap 730 is provided between the first insulating portion 710, the second insulating portion 720, and the first sub-layer 301. The second electrode 510 covers the overlapping layer 303 exposed through the clearance gap 730. This allows the second electrode 510 to be electrically connected to the isolation structure 300 through the overlapping layer 303. In this case, the second electrode 510 may only cover at least a portion of the overlapping layer 303 exposed through the clearance gap 730, or the second electrode 510 may extend from the clearance gap 730 to the first sub-layer 301. The second electrode 510 may also cover at least a portion of the surface of the first sub-layer 301 facing the isolation opening 310.

[0116] In some other alternative embodiments, such as Figure 7 As shown, the second insulating portion 720 and / or the first insulating portion 710 can completely cover the overlapping layer 303 that is not covered by the first sublayer 301. For example, at least one of the first insulating portion 710 and the second insulating portion 720 is in contact with the first sublayer 301. In this case, the second electrode 510 can extend directly from the side of the second insulating portion 720 and / or the first insulating portion 710 away from the substrate 100 to the first sublayer 301 and be electrically connected to the first sublayer 301.

[0117] In some alternative embodiments, the density of the first insulating portion 710 is greater than the density of the pixel defining portion 210, and / or the density of the second insulating portion 720 is greater than the density of the pixel defining portion 210.

[0118] In these alternative embodiments, the first insulating portion 710 and / or the second insulating portion 720 have a high density. The first insulating portion 710 and / or the second insulating portion 720 can be prepared by atomic layer deposition (ALD) technology, so that the first insulating portion 710 and / or the second insulating portion 720 have good density and improve their insulation performance.

[0119] In some optional embodiments, since the first insulating portion 710 and / or the second insulating portion 720 are prepared using atomic layer deposition technology, the film thickness of the first insulating portion 710 and / or the second insulating portion 720 can be precisely controlled. In some preferred embodiments, the film thickness of the first insulating portion 710 is less than the film thickness of the overlapping layer 303, and / or, the film thickness of the second insulating portion 720 is less than the film thickness of the overlapping layer 303.

[0120] In these optional embodiments, the film thickness of the first insulating portion 710 and / or the second insulating portion 720 is less than the film thickness of the overlapping layer 303, so that the first insulating portion 710 and / or the second insulating portion 720 can better cover the overlapping layer 303, and the first insulating portion 710 and / or the second insulating portion 720 can more densely wrap around the overlapping layer 303. In addition, since the film thickness of the first insulating portion 710 and / or the second insulating portion 720 is less than the film thickness of the overlapping layer 303, the added first insulating portion 710 and / or the second insulating portion 720, being too thick, can also avoid affecting the continuity of the cathode overlap. That is to say, the film thickness of the first insulating portion 710 and / or the second insulating portion 720 is less than the film thickness of the overlapping layer 303, so that the cathode can overlap the overlapping layer 303 more continuously.

[0121] There are various ways to configure the second insulating portion 720. For example, the second insulating portion 720 may only cover the surface of the first conductive layer 411 that is away from the substrate 100.

[0122] Alternatively, in some other alternative embodiments, the second insulating portion 720 covers the surface of the edge segment 411a facing away from the substrate 100 and the side surface of the edge segment 411a facing the first sublayer 301.

[0123] Optionally, the first conductive electronic layer 411 includes a first top surface facing away from the substrate 100, a first bottom surface facing the substrate 100, and a first side surface connecting the first top surface and the first bottom surface.

[0124] In these alternative embodiments, the second insulating portion 720 not only covers the first top surface corresponding to the edge segment 411a, but also covers the first side surface of the edge segment 411a facing the first sub-layer 301, which can better ensure that the second electrode 510 and the first electrode 410 will not be short-circuited to each other.

[0125] Optionally, the second insulating portion 720 extends to the surface of the first insulating portion 710 away from the substrate 100, and the edge of the first insulating portion 710 away from the pixel opening 220 is located on the side of the second insulating portion 720 away from the pixel opening 220.

[0126] In these alternative embodiments, the end of the second insulating portion 720 extends onto the first insulating portion 710. The second insulating portion 720 and the first insulating portion 710 can better wrap the first conductive layer 411, thereby better improving the short-circuit connection problem between the first conductive layer 411 and the overlap layer 303 of the isolation structure 300 and the second electrode 510.

[0127] Optionally, the edge of the first insulating portion 710 extends to the side of the end of the second insulating portion 720 facing the first sublayer 301 of the isolation structure 300, so as to ensure that the end of the second insulating portion 720 can overlap the surface of the first insulating portion 710 away from the substrate 100.

[0128] When the display panel includes the first insulating portion 710 and the second insulating portion 720 as described above, there are various ways to arrange the relative positions of the light-emitting unit 230 with the first insulating portion 710 and the second insulating portion 720, for example, Figure 8 As shown, the first insulating portion 710 and / or the second insulating portion 720 may surround the light-emitting unit 230 and be spaced apart from the edge of the light-emitting unit 230.

[0129] In some other alternative embodiments, such as Figure 7 As shown, the edge of the light-emitting unit 230 in the orthographic projection of the substrate 100 is located within the orthographic projection of the second insulating portion 720 in the substrate 100, or, as... Figure 8 As shown, the light-emitting unit 230 is located on the side of the second insulating portion 720 facing the pixel opening 220.

[0130] In these alternative embodiments, the edge of the light-emitting unit 230 in the orthographic projection of the substrate 100 is located within the orthographic projection of the second insulating portion 720 on the substrate 100, that is, the edge of the light-emitting unit 230 itself is located above the second insulating portion 720. This can improve the problem of lateral crosstalk of charge carriers caused by the contact between the light-emitting unit 230 and the isolation structure 300. Alternatively, the light-emitting unit 230 is located on the side of the second insulating portion 720 facing the pixel opening 220, that is, the second insulating portion 720 is disposed around the light-emitting unit 230. This can also improve the problem of lateral crosstalk of charge carriers caused by the contact between the light-emitting unit 230 and the isolation structure 300.

[0131] There are various ways to distribute the first insulating portion 710. The first insulating portion 710 may only cover the overlapping layer 303. For example, the first insulating portion 710 may cover at least a portion of the overlapping layer 303 on the top surface away from the substrate 100 and the side of the overlapping layer 303 facing the isolation opening 310. Alternatively, the first insulating portion 710 may cover at least a portion of the overlapping layer 303 and at least a portion of the pixel defining portion 210 away from the top surface of the substrate 100. The first insulating portion 710 has a larger distribution area, which can better improve the problem of short-circuit connection between the first conductive electronic layer 411 and the isolation structure 300.

[0132] This application embodiment uses the example of the first insulating portion 710 covering at least a portion of the overlapping layer 303 and at least a portion of the pixel defining portion 210 away from the top surface of the substrate 100 for illustration. When the first insulating portion 710 covers at least a portion of the overlapping layer 303 and at least a portion of the pixel defining portion 210 away from the top surface of the substrate 100, since a stepped surface is provided between the overlapping layer 303 and the pixel defining portion 210, a stepped surface is formed on the surface of the first insulating portion 710 away from the substrate 100, which in turn causes a stepped surface to be formed on the surface of the edge segment 411a covering the first insulating portion 710 and a stepped surface to be formed on the surface of the second insulating portion 720 covering the edge segment 411a.

[0133] In some alternative embodiments, such as Figure 5 As shown, the surface of the second insulating portion 720 facing away from the substrate 100 includes a first sub-surface 721, a second sub-surface 722, and a third sub-surface 723 connecting the first sub-surface and the second sub-surface 722 and extending along the thickness direction Z of the display panel. In these optional embodiments, the surface of the second insulating portion 720 facing away from the substrate 100 is stepped and includes the first sub-surface 721, the second sub-surface 722, and the third sub-surface 723.

[0134] When the second insulating portion 720 includes a first sub-surface 721, a second sub-surface 722, and a third sub-surface 723, the light-emitting unit 230 is located on the side of the third sub-surface 723 facing the pixel opening 220, or the second sub-surface 722 is located on the side of the third sub-surface 723 away from the pixel opening 220. The edge of the light-emitting unit 230 in the orthographic projection of the substrate 100 is located within the orthographic projection of the second sub-surface 722 on the substrate 100. That is, the edge of the light-emitting unit 230 is located on the second insulating portion 720, which can improve the problem of lateral crosstalk of charge carriers caused by the contact between the light-emitting unit 230 and the isolation structure 300.

[0135] In some alternative embodiments, the first conductive sublayer 411 includes a central segment 411c and a transition segment 411b surrounding the central segment 411c, the edge segment 411a being connected to the side of the transition segment 411b opposite to the central segment 411c, the transition segment 411b covering the side surface of the pixel defining portion 210 facing the pixel opening 220, and at least a portion of the edge segment 411a being located between the first insulating portion 710 and the second insulating portion 720.

[0136] In these optional embodiments, the first conductive sublayer 411 can be electrically connected to the second conductive sublayer 412 via the central segment 411c. The transition segment 411b is located within the pixel opening 220 and covers the side surface of the pixel limiting portion 210 facing the pixel opening 220. The transition segment 411b can also be in contact with the light-emitting unit 230, thereby increasing the effective light-emitting area of ​​the light-emitting unit 230. The edge segment 411a is connected to the side of the transition segment 411b away from the central segment 411c. The edge segment 411a can further increase the distribution area of ​​the first conductive sublayer 411.

[0137] Optionally, the first insulating portion 710 extends to the edge of the pixel opening 220, and the transition segment 411b also covers the surface of the first insulating portion 710 facing the pixel opening 220, which can further increase the distribution area of ​​the transition segment 411b and increase the distribution area of ​​the first insulating portion 710. The first insulating portion 710 can extend to the edge of the pixel opening 220.

[0138] In some alternative embodiments, referring to the above, the first insulating portion 710 may only cover the overlapping layer 303. Alternatively, the first insulating portion 710 may also cover a portion of the pixel defining portion 210 to increase the distribution area of ​​the first insulating portion 710, for example, the first insulating portion 710 may extend to the edge of the pixel opening 220 to further increase the distribution area of ​​the first insulating portion 710.

[0139] In some optional embodiments, when the isolation structure 300 includes the first sub-layer 301 and the second sub-layer 302 described above, the first insulating portion 710 in the orthographic projection on the substrate 100 and the second sub-layer 302 in the orthographic projection on the substrate 100 overlap to increase the distribution area of ​​the first insulating portion 710, so that the first insulating portion 710 can cover a larger area of ​​the overlapping layer 303, thereby better improving the short-circuit connection problem between the first conductive sub-layer 411 and the overlapping layer 303.

[0140] In some optional embodiments, the plurality of light-emitting units 230 include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit with different emitting colors, and the thickness of the first conductive layer 411 corresponding to at least two of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit is different. This allows the light-emitting units 230 of different colors to be provided with different microcavity effects, thereby improving luminous efficiency.

[0141] In some optional embodiments, the first electrode 410 may include the first conductive sublayer 411, the second conductive sublayer 412, and the protective portion 420 described above. Optionally, the protective portion 420 is flush with the edge of the pixel opening 220 and the edge of the second conductive sublayer 412. This flush alignment is not strictly geometric; for example, if the distance between the edge of the protective portion 420 and the edge of the second conductive sublayer 412 is less than or equal to 2 micrometers, it can be considered that the edge of the protective portion 420 and the edge of the second conductive sublayer 412 are flush, allowing the edge of the protective portion 420 and the edge of the second conductive sublayer 412 to be formed in the same process step.

[0142] The display panel also includes a first encapsulation layer 610, such as Figure 3 As shown, the first encapsulation layer 610 includes a plurality of encapsulation portions 610a, which are located on the side of the second electrode 510 away from the substrate 100 and extend through the sidewall of the isolation structure 300 to the side of the isolation structure 300 away from the substrate 100.

[0143] For example, such as Figure 9 and Figure 10 The encapsulation portion 610a shown includes a first segment and a second segment that are connected to each other. The first segment is located inside the isolation opening 310 and is disposed on the side of the light-emitting unit 230 away from the substrate 100. The second segment is located on the side of the isolation structure 300 facing the isolation opening 310. The surface of the first segment away from the substrate 100 and the surface of the second segment away from the isolation structure 300 are at least partially connected to each other to enclose and form a gap space.

[0144] For example, such as Figure 3 As shown, the surface of the first segment facing away from the substrate 100 and the surface of the second segment facing away from the isolation structure 300 may not be connected.

[0145] like Figure 3 As shown, the display panel further includes a second encapsulation layer 620 and a third encapsulation layer 630. The second encapsulation layer 620 covers the isolation structure 300 and the encapsulation portion 610a, and the third encapsulation layer 630 covers the second encapsulation layer 620. Both the first encapsulation layer 610 and the third encapsulation layer 630 are inorganic materials, and the materials of the first encapsulation layer 610 and the third encapsulation layer 630 include at least one of silicon nitride (SiN), silicon oxide (SiO), and silicon oxynitride (SiON). The second encapsulation layer 620 is an organic insulating material, such as epoxy resin, acrylic resin, or other resin materials. The second encapsulation layer 620 and the third encapsulation layer 630 are continuously disposed at least over the entire display area AA, with a portion also disposed in the non-display area NA.

[0146] The display panel 10 may also include at least one film layer such as a touch layer, a polarizer, a color filter substrate 100, and a protective cover. This film layer may also be bonded to the display panel via an adhesive layer such as OCA (Optical Clear Adhesive).

[0147] like Figures 1 to 10 As shown, an embodiment of the first aspect of this application also provides a display panel, the display panel including: a substrate 100; a pixel definition layer 200 disposed on one side of the substrate 100 and including a pixel defining portion 210 and a pixel opening 220, wherein a plurality of pixel openings 220 are arrayed; a first electrode layer 400 disposed on one side of the substrate 100 and including a plurality of first electrodes 410 spaced apart, wherein each first electrode 410 includes at least a first conductive sublayer 411 located within a corresponding pixel opening 220; a plurality of light-emitting units 230, wherein the light-emitting units 230 are located on the side of the corresponding first electrode 410 facing away from the substrate 100; wherein the first conductive sublayer 411 includes an edge segment 411a covering the pixel defining portion 210 facing away from the top surface of the substrate 100, and the side of the edge segment 411a facing away from the substrate 100 is covered with a second insulating portion 720.

[0148] In the display panel provided in this application embodiment, the display panel includes a substrate 100, a first electrode layer 400, and a pixel definition layer 200. The first electrode 410 of the first electrode layer 400 and the pixel opening 220 of the pixel definition layer 200 are correspondingly disposed, so that the first electrode 410 can contact and connect with the light-emitting unit 230 in the pixel opening 220, and the first electrode 410 can drive the light-emitting unit 230 in the pixel opening 220 to emit light and display. The first electrode 410 includes a first conductive layer 411, and a second insulating portion 720 is covered on the edge segment 411a of the first conductive layer 411. When the second electrode 510 is subsequently fabricated, the short-circuit connection problem between the second electrode 510 and the first conductive layer 411 can be improved, thereby improving the process performance and performance of the display panel.

[0149] The display panel provided in this application embodiment and the display panel of any of the above embodiments can be cross-referenced, and the repetitions will not be repeated here.

[0150] When the edge segment 411a is provided with a second insulating portion 720 and the display panel includes the above-mentioned isolation structure 300, there are various ways to insulate the edge segment 411a and the overlapping layer 303 from each other. For example, the edge segment 411a and the overlapping layer 303 are spaced apart so that the first conductive layer 411 and the isolation structure 300 are insulated from each other, thereby improving the short-circuit connection problem between the first electrode 410 and the isolation structure 300.

[0151] Optionally, when the edge segment 411a and the overlapping layer 303 of the isolation structure 300 are spaced apart, the second insulating portion 720 can cover the top surface of the edge segment 411a away from the substrate 100 and the side surface of the edge segment 411a facing the isolation structure 300, so that the pixel limiting portion 210 and the second insulating portion 720 can better wrap the edge segment 411a, and better improve the short-circuit connection between the edge segment 411a and the second electrode 510 and the isolation structure 300.

[0152] Alternatively, in some other alternative embodiments, the display panel further includes the first insulating portion 710 described above, which covers at least a portion of the overlap layer 303, and at least a portion of the edge segment 411a is located on the side of the first insulating portion 710 away from the substrate 100, in order to improve the problem of short-circuit connection between the first conductive layer 411 and the isolation structure 300.

[0153] The second aspect of this application also provides a method for manufacturing a display panel, which can be any of the display panels provided in the first aspect of the above-described embodiments. Please refer to the following: Figures 1 to 11 The methods for measuring the display panel include:

[0154] Step S01: As Figure 11a As shown, a second conductive material layer and a protective material layer are provided on one side of the substrate 100, and the second conductive material layer and the protective material layer are patterned to form a plurality of spaced second conductive sub-layers 412 and a pre-protection portion located on the side of the second conductive sub-layers 412 away from the substrate 100.

[0155] Step S02: As Figure 11b As shown, a pixel definition material layer and an isolation structure 300 material layer are disposed on the side of the second conductive sublayer 412 away from the substrate 100, and the isolation structure 300 material layer is patterned to form the isolation structure 300. The isolation structure 300 encloses and forms an isolation opening 310. The isolation structure 300 includes an overlap layer 303 and a first sublayer 301 stacked in a direction away from the substrate 100. The overlap layer 303 protrudes toward the isolation opening 310 relative to the first sublayer 301.

[0156] Step S03: As Figure 11cAs shown, a first insulating material layer is provided on the side of the pixel definition material layer and the isolation structure 300 away from the substrate 100, and the pixel definition material layer and the first insulating material layer are patterned to form a pixel definition layer 200 and a first pre-insulating portion. The pixel definition layer 200 includes a pixel defining portion 210 and a pixel opening 220. The first pre-insulating portion surrounds and forms a first pre-opening that communicates with the pixel opening 220, and the first pre-insulating portion covers at least a portion of the isolation structure 300.

[0157] Step S04: As Figure 11d As shown, a first conductive material layer is provided on the side of the first pre-insulating portion, the pixel definition layer 200, and the isolation structure 300 away from the substrate 100, and the first conductive material layer is patterned to form a first conductive sublayer 411. The first conductive sublayer 411 includes a central segment 411c located in the pixel opening 220, an edge segment 411a located in the pixel defining portion 210 away from the top surface of the substrate 100, and a transition segment 411b connecting the central segment 411c and the edge segment 411a. The edge segment 411a is located on the side of the first pre-insulating portion away from the substrate 100.

[0158] In the method for manufacturing a display panel provided in this application embodiment, firstly, in step S01, a second conductive material layer and a protective material layer are set to form a second conductive sublayer 412 and a pre-protective portion. The pre-protective portion can completely cover the second conductive sublayer 412 to provide protection to the second conductive sublayer 412. Then, in step S02, an isolation structure 300 is prepared. The isolation structure 300 can be used to prepare light-emitting units 230, so that the light-emitting material is broken into independent light-emitting units 230. Next, in step S03, a pixel definition layer 200 and a first pre-insulating portion are prepared. When the first conductive sublayer 411 is prepared in step S04, the first pre-insulating portion covers the isolation structure 300, which can improve the short-circuit connection problem between the first conductive sublayer 411 and the isolation structure 300.

[0159] There are various ways to pattern the pixel definition material layer, the first insulating material layer, and the pre-protection portion in step S03. In some optional embodiments, such as... Figure 12 As shown, step S03 includes:

[0160] Step S031: As Figure 12a As shown, the pixel definition material layer and the pre-protection portion are patterned to form the pixel definition layer 200 and the protection portion 420. The protection portion 420 is located between the second conductive layer 412 and the pixel defining portion 210 and is disposed around the pixel opening 220.

[0161] Step S032: As Figure 11c As shown, a first insulating material layer is provided on the side of the pixel definition layer 200 and the isolation structure 300 away from the substrate 100, and the first insulating material layer is patterned to form the first pre-insulating portion.

[0162] In these alternative embodiments, before setting the first insulating material layer, the pixel definition material layer and the pre-protection portion can be patterned to form the pixel definition layer 200 and the protection portion 420, and then the first insulating material layer is set and patterned to form the first pre-insulating portion.

[0163] In some other alternative embodiments, such as Figure 13 As shown, step S03 includes:

[0164] Step S031': As Figure 13a As shown, a first insulating material layer is provided on the side of the pixel definition material layer and the isolation structure 300 facing away from the substrate 100.

[0165] Step S032': As Figure 11c As shown, the pre-protection portion, the pixel definition material layer, and the first insulating material layer are patterned to form a protection portion 420, the pixel definition layer 200, and the first pre-insulating portion. The protection portion 420 is located between the second conductive layer 412 and the pixel defining portion 210 and is disposed around the pixel opening 220.

[0166] In these optional embodiments, before the pixel definition material layer and the pre-protection portion are patterned, a first insulating material layer is first set in step S031', and then the pre-protection portion, the pixel definition material layer and the first insulating material layer are simultaneously patterned in step S032', so that the pre-protection portion forms a protection portion 420, the pixel definition material layer forms a pixel definition layer 200, and the first insulating material layer forms a first pre-insulating portion, which can simplify the manufacturing process of the display panel and improve the manufacturing efficiency of the display panel.

[0167] In some alternative embodiments, such as Figure 14 As shown, step S04 may be followed by:

[0168] Step S05: As Figure 14aAs shown, a second insulating material layer is provided on the side of the first conductive layer 411 away from the substrate 100. The second insulating material layer and the first pre-insulating portion are patterned to form a second insulating portion 720 and a first insulating portion 710. The first insulating portion 710 covers a portion of the pixel limiting portion 210 and a portion of the first insulating portion 710 of the overlapping layer 303. The second insulating portion 720 covers at least a portion of the edge segment 411a on the side surface away from the substrate 100.

[0169] In these optional embodiments, after step S04, a second insulating portion 720 is formed in step S05. When forming the second insulating portion 720, the first pre-insulating portion covering the isolation structure 300 is also removed to form the first insulating portion 710. For example, the first pre-insulating portion covering the first sub-layer 301 and the second sub-layer 302 of the isolation structure 300 is removed to form the first insulating portion 710 covering at least part of the overlapping layer 303. On the one hand, by adding the second insulating portion 720, the short-circuit connection problem of the first electrode 410 and the second electrode 510 can be improved. On the other hand, when the second insulating material layer is patterned, the first pre-insulating portion covering the isolation structure 300 is also removed, which can simplify the manufacturing process of the display panel.

[0170] In some alternative embodiments, the display panel may not include the second insulating portion 720. In this case, after step S04, the first pre-insulating portion may be patterned to form a first insulating portion 710. The first insulating portion 710 covers part of the overlap layer 303 to improve the short-circuit connection problem between the first conductive layer 411 and the overlap layer 303.

[0171] The third aspect of this application also provides a display device, including a display panel prepared according to any of the first aspect embodiments or any of the second aspect embodiments. Since the display device of this application includes a display panel prepared according to any of the first aspect embodiments or any of the second aspect embodiments, the display device of this application has the beneficial effects of the display panel prepared according to any of the first aspect embodiments or any of the second aspect embodiments, which will not be elaborated further here.

[0172] The display devices in the application embodiments include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0173] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0174] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

[0175] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no structural conflict. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, characterized by, The display panel comprises: a substrate; a pixel definition layer disposed on one side of the substrate and comprising a pixel definition portion and a plurality of pixel openings, the plurality of pixel openings being arrayed; an isolation structure disposed on a side of the pixel definition layer away from the substrate and enclosing a separation opening, the separation opening being in communication with a corresponding pixel opening, the isolation structure comprising a first sub-layer and a lap joint layer disposed in a direction away from the substrate, the lap joint layer being protrudingly disposed toward the separation opening relative to the first sub-layer; a first insulating portion covering at least part of a surface of the lap joint layer away from the substrate and a side of the lap joint layer toward the separation opening, and having a first edge portion on a side of the lap joint layer away from the substrate; a first electrode layer disposed on one side of the substrate and comprising a plurality of first electrodes spaced apart, the first electrodes at least comprising a first conductive sub-layer located within a corresponding pixel opening, the first conductive sub-layer extending along a sidewall of the pixel opening and having an edge segment on a side of the first insulating portion away from the substrate; a plurality of light emitting units located on a side of a corresponding first electrode away from the substrate; wherein a distance between the edge segment and the first sub-layer is greater than a distance between the first edge portion and the first sub-layer.

2. The display panel of claim 1, wherein, The display panel further comprises a second electrode layer, the second electrode layer comprising a plurality of second electrodes located on a side of a corresponding light emitting unit away from the substrate, wherein: the light emitting unit has a second edge portion covering the edge segment and in contact with the first edge portion; the second electrode has a third edge portion covering the second edge portion and in contact with the first sub-layer; the second edge portion is spaced apart from the lap joint layer by the first edge portion, and the second edge portion is spaced apart from the first sub-layer by the third edge portion.

3. The display panel of claim 1, wherein, Further comprising: a second insulating portion covering at least part of a surface of the edge segment away from the substrate and covering a surface of the edge segment toward the separation opening.

4. The display panel of claim 3, wherein, The second insulating portion surrounds the pixel opening in a closed ring shape; and / or, the first insulating portion surrounds the pixel opening in a closed ring shape.

5. The display panel of claim 3, wherein, Further comprising a second electrode layer, the second electrode layer comprising a second electrode located on a side of the light emitting unit away from the substrate, wherein: the first insulating portion and the second insulating portion each have a clearance gap between the first sub-layer, and the second electrode covers the lap joint layer exposed by the clearance gap; and / or, at least one of the first insulating portion and the second insulating portion is in contact with the first sub-layer, and the second electrode covers at least part of a surface of the first sub-layer toward the separation opening.

6. The display panel of claim 3, wherein, The first insulating portion has a density greater than a density of the pixel definition portion, and / or the second insulating portion has a density greater than a density of the pixel definition portion.

7. The display panel of claim 3, wherein, The first insulating portion has a film thickness less than a film thickness of the lap joint layer, and / or the second insulating portion has a film thickness less than a film thickness of the lap joint layer.

8. The display panel of claim 3, wherein, The light emitting unit is located at a side of the third sub-surface facing the pixel opening, or the second sub-surface is located at a side of the third sub-surface facing away from the pixel opening, and the light emitting unit is located within the second sub-surface in the orthographic projection of the substrate.

9. The display panel of claim 8, wherein, The surface of the second insulating part facing away from the substrate includes a first sub-surface, a second sub-surface, and a third sub-surface connected between the first sub-surface and the second sub-surface and extending in the thickness direction of the display panel, The light emitting unit is located at a side of the third sub-surface facing the pixel opening, or the second sub-surface is located at a side of the third sub-surface facing away from the pixel opening, and the light emitting unit is located within the second sub-surface in the orthographic projection of the substrate.

10. The display panel of claim 3, wherein, The first conductive sub-layer includes a center segment and a transition segment surrounding the center segment, the edge segment is connected to a side of the transition segment facing away from the center segment, the transition segment covers a side surface of the pixel defining part facing the pixel opening, and at least part of the edge segment is located between the first insulating part and the second insulating part.

11. The display panel of claim 10, wherein, The first insulating part extends to the edge of the pixel opening, and the transition segment further covers the surface of the first insulating part facing the pixel opening.

12. The display panel of claim 1, wherein, The first insulating part extends to the edge of the pixel opening and covers part of the pixel defining part.

13. The display panel of claim 1, wherein, The isolation structure further includes a second sub-layer located at a side of the first sub-layer facing away from the substrate, the second sub-layer is protrudingly arranged relative to the first sub-layer towards the isolation opening, and the orthographic projection of the first insulating part and the orthographic projection of the second sub-layer on the substrate partially overlap.

14. The display panel of claim 1, wherein, The plurality of light emitting units include first light emitting units, second light emitting units, and third light emitting units having different light emitting colors, and the film thickness of the first conductive sub-layer corresponding to at least two of the first light emitting units, the second light emitting units, and the third light emitting units is different.

15. The display panel of claim 1, wherein, The first electrode further includes a second conductive sub-layer located at a side of the first conductive sub-layer facing the substrate, and a third conductive sub-layer located at a side of the second conductive sub-layer facing the substrate, a part of the second conductive sub-layer is in contact with the first conductive sub-layer, another part of the second conductive sub-layer is located between the pixel defining part and the substrate, and the orthographic projection of the third conductive sub-layer and the orthographic projection of the second conductive sub-layer on the substrate overlap, The material of the first conductive sub-layer and the third conductive sub-layer includes metal oxide, and the material of the second conductive sub-layer includes metal.

16. The display panel of claim 15, wherein, A protection part is arranged between the second conductive sub-layer and the pixel defining part, the material of the protection part includes insulating material, and the protection part is arranged around the pixel opening.

17. A display panel, characterized by It includes: a substrate; a pixel definition layer arranged on one side of the substrate and including a pixel defining part and a pixel opening, a plurality of pixel openings are arranged in an array, and the pixel opening is used to accommodate a light emitting unit; An isolation structure is arranged on one side of the substrate and encloses an isolation opening, and the isolation structure comprises a lap layer and a first sub-layer arranged in a stacked manner away from the substrate, and the lap layer is arranged protruding towards the isolation opening relative to the first sub-layer; A first electrode layer is arranged on one side of the substrate and comprises a plurality of first electrodes arranged at intervals, and the first electrode at least comprises a first conductive sub-layer located in the corresponding pixel opening; A plurality of light emitting units are located on the side of the corresponding first electrode away from the substrate; The first conductive sub-layer comprises an edge segment covering the edge of the pixel defining portion away from the top surface of the substrate, and the side of the edge segment away from the substrate is covered with a second insulating portion; The edge segment and the lap layer are arranged at intervals, the second insulating portion covers the surface of the edge segment away from the substrate and the side surface of the edge segment towards the isolation structure, or further comprises a first insulating portion covering at least part of the lap layer, and at least part of the edge segment is located on the side of the first insulating portion away from the substrate.

18. The display panel of claim 17, wherein, Further comprising: A second electrode layer comprising a second electrode located on the side of the light emitting unit away from the substrate, The display panel comprises the first insulating portion and the second insulating portion, and the first insulating portion, the second insulating portion and the first sub-layer are arranged with a clearance gap, and the second electrode covers the lap layer exposed by the clearance gap.

19. A method for manufacturing a display panel, characterized by, Comprising: A second conductive material layer and a protective material layer are arranged on one side of the substrate, and the second conductive material layer and the protective material layer are subjected to patterning treatment to form a plurality of second conductive sub-layers arranged at intervals and a preliminary protective portion located on the side of the second conductive sub-layer away from the substrate; A pixel definition material layer and an isolation structure material layer are arranged on the side of the second conductive sub-layer away from the substrate, and the isolation structure material layer is subjected to patterning treatment to form an isolation structure, and the isolation structure encloses an isolation opening, and the isolation structure comprises a lap layer and a first sub-layer arranged in a stacked manner away from the substrate, and the lap layer is arranged protruding towards the isolation opening relative to the first sub-layer; A first insulating material layer is arranged on the side of the pixel definition material layer and the isolation structure away from the substrate, and the pixel definition material layer and the first insulating material layer are subjected to patterning treatment to form a pixel definition layer and a first preliminary insulating portion, the pixel definition layer comprises a pixel defining portion and a pixel opening, the first preliminary insulating portion encloses a first preliminary opening in communication with the pixel opening, and the first preliminary insulating portion covers at least part of the isolation structure; A first conductive material layer is disposed on a side of the first preliminary insulating portion, the pixel definition layer and the isolation structure away from the substrate, and the first conductive material layer is patterned to form a first conductive sub-layer, the first conductive sub-layer includes a center segment located in the pixel opening, an edge segment located in the edge of the pixel definition portion away from the top surface of the substrate, and a transition segment connecting the center segment and the edge segment, and the edge segment is located on a side of the first preliminary insulating portion away from the substrate.

20. The method of claim 19, wherein, In the step of disposing a first insulating material layer on a side of the pixel definition material layer and the isolation structure away from the substrate, and patterning the pixel definition material layer and the first insulating material layer to form the pixel definition layer and the first preliminary insulating portion: The pixel definition material layer and the preliminary protection portion are patterned to form the pixel definition layer and the protection portion, the protection portion is located between the second conductive sub-layer and the pixel definition portion and surrounds the pixel opening; A first insulating material layer is disposed on a side of the pixel definition layer and the isolation structure away from the substrate, and the first insulating material layer is patterned to form the first preliminary insulating portion; Or, in the step of disposing a first insulating material layer on a side of the pixel definition material layer and the isolation structure away from the substrate, and patterning the pixel definition material layer and the first insulating material layer to form the pixel definition layer and the first preliminary insulating portion: A first insulating material layer is disposed on a side of the pixel definition material layer and the isolation structure away from the substrate; The preliminary protection portion, the pixel definition material layer and the first insulating material layer are patterned to form the protection portion, the pixel definition layer and the first preliminary insulating portion, and the protection portion is located between the second conductive sub-layer and the pixel definition portion and surrounds the pixel opening.

21. The method of claim 19, wherein, Further comprising: A second insulating material layer is disposed on a side of the first conductive sub-layer away from the substrate, and the second insulating material layer and the first preliminary insulating portion are patterned to form a second insulating portion and a first insulating portion, the first insulating portion covers part of the pixel definition portion and part of the first insulating portion of the overlap layer, and the second insulating portion covers at least part of the surface of the edge segment away from the substrate; Or, the first preliminary insulating portion is patterned to form a first insulating portion, and the first insulating portion covers at least part of the overlap layer.

22. A display device comprising: The display panel of any one of claims 1-18, or the display panel prepared by the preparation method of any one of claims 19-21.

Images