Equal-ratio line scanning integrated imaging display device

Abstract

According to the technical scheme, the equal-ratio line scanning integrated imaging display equipment comprises a wafer production line, a control host and a line scanning host, supporting frames are installed on the portions, close to the front surface and the rear surface, of the top of the wafer production line, and dovetail grooves are formed in the adjacent sides of the supporting frames on the two sides; and line scanning hosts are installed in the dovetail grooves in the two sides through connecting bases, equal-ratio line scanning cameras are installed in the middles of the interiors of the line scanning hosts, line array lenses are installed at the bottoms of the equal-ratio line scanning cameras, and light supplementing lamps are installed at the positions, located on the two sides of the equal-ratio line scanning cameras, in the line scanning hosts. The equal-ratio line scanning integrated imaging display equipment solves the problems that existing wafer defect detection mostly depends on a manual detection means for naked eye observation, the wafer detection efficiency is low, small flaws cannot be found in time, and follow-up use of wafers is affected, the quality detection efficiency of the wafers is improved, and the production cost is reduced. And meanwhile, the quality detection precision of the wafer is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to wafer detection technology field, specifically to a kind of equal ratio line scanning integrated imaging display device. BACKGROUND

[0002] With the rapid development of electronic science and technology and the continuous improvement of the integration and performance of electronic products, wafer production technology is continuously improved, and the detection requirement of wafer surface defect is gradually improved. Wafer defect detection as an important application of target detection has been widely concerned. For the semiconductor industry, wafer defect detection has become a major defect detection problem. The manufacturing process of semiconductor involves dozens of complex steps, and defects may occur on the surface due to many reasons. Visualizing and identifying defect patterns are crucial to preventing defects.

[0003] The existing wafer defect detection relies on manual detection means for naked eye observation, and the wafer detection efficiency is low, and the small defects cannot be found in time, which affects the use of subsequent wafers. Therefore, we propose a kind of equal ratio line scanning integrated imaging display device. SUMMARY

[0004] The present application aims to provide an equal ratio line scanning integrated imaging display device, which can quickly detect wafers, to solve the problem of low wafer detection efficiency caused by relying on manual detection means for naked eye observation in the existing wafer defect detection, and the small defects cannot be found in time, which affects the use of subsequent wafers.

[0005] To achieve the above purpose, the present application provides the following technical scheme: an equal ratio line scanning integrated imaging display device, comprising a wafer production line, a control host and a line scanning host, wherein the top of the wafer production line is provided with a support frame near the front and rear surfaces, and the adjacent side of the support frame on both sides is provided with a dovetail groove, and the line scanning host is installed in the inside of the dovetail groove on both sides through a connecting seat, the equal ratio line scanning camera is installed in the inside of the line scanning host, the line array lens is installed at the bottom of the equal ratio line scanning camera, and the light supplementing lamp is installed on both sides of the equal ratio line scanning camera in the inside of the line scanning host.

[0006] Preferably, the line scanning host is provided with a high-transparency glass at the bottom, an inner shell is installed in the inside of the line scanning host, and heat exchange fins are installed on both sides of the inner shell.

[0007] Preferably, the line scanning host is provided with a heat dissipation seat at the top, a fan is installed in the inside of the heat dissipation seat, and a dust screen is installed at the top of the heat dissipation seat.

[0008] Preferably, the line scanning host is provided with heat dissipation holes on both sides.

[0009] Preferably, the top of the support frame on both sides is provided with a motor frame, the top of the motor frame is provided with a motor, and the output shaft of the motor is provided with a rotating shaft.

[0010] Preferably, the rotating shaft is sleeved in the connecting seat, and the rotating shaft and the connecting seat are connected through thread rotation.

[0011] Preferably, the front surface of the support frame on the front side of the wafer production line is provided with a control host, and the top of the control host is provided with an alarm.

[0012] Preferably, the bottom of the connecting seat is provided with an infrared sensor, and the infrared sensor is electrically connected with the control host.

[0013] Compared with the prior art, the present application has the following advantages: 1、The control host, the line scanning host, the equal ratio line scanning camera and the line array lens are arranged, so that the wafer can be automatically and efficiently detected, the problem that the wafer defect detection is mainly relied on manual detection means for naked eye observation, the wafer detection efficiency is low, the small defects cannot be found in time, and the use of the wafer is affected is solved, the quality detection efficiency of the wafer is improved, and the quality detection precision of the wafer is improved.

[0014] 2、The inner shell, the heat exchange fin, the heat dissipation seat and the fan are arranged, so that the equal ratio line scanning camera can be cooled, the problem that the equal ratio line scanning camera cannot be cooled when being used due to high temperature, and the service life of the equal ratio line scanning camera is low is solved, the use temperature of the equal ratio line scanning camera is reduced, and the service life of the equal ratio line scanning camera is improved.

[0015] 3、The infrared sensor, the motor and the rotating shaft are arranged, so that the height of the line scanning host can be automatically adjusted, the problem that the thickness of the wafer to be detected is different, the height of the line scanning host needs to be manually adjusted, and the wafer detection efficiency is affected is solved, the debugging efficiency of the line scanning host is improved, and the wafer detection efficiency is ensured. DETAILED DESCRIPTION

[0016] Figure 1 is a front view structural schematic diagram of the present application; Figure 2 is a sectional view structural schematic diagram of the line scanning host of the present application; Figure 3 is a side view structural schematic diagram of the present application; Figure 4 is Figure 3 is an enlarged structural schematic diagram of A in the middle.

[0017] Figure numerals: 1. Wafer production line; 2. Control host; 3. Dovetail groove; 4. Heat dissipation hole; 5. Heat sink; 6. Line scan host; 7. Alarm; 8. Support frame; 9. Dust net; 10. Fan; 11. Proportional line scan camera; 12. Heat exchanger; 13. High-transmittance glass; 14. Line array lens; 15. Fill light; 16. Inner shell; 17. Connecting seat; 18. Motor; 19. Motor frame; 20. Rotating shaft; 21. Infrared sensor. DETAILED DESCRIPTION

[0018] The technical solution of the present invention is further described below with reference to the accompanying drawings and specific embodiments. Example 1

[0019] like Figure 1-3 As shown, in order to achieve the above-mentioned purpose, the present invention provides the following technical solutions: a geometric line scanning integrated imaging display device, comprising a wafer production line 1, a control host 2 and a line scanning host 6, a support frame 8 is installed on the top of the wafer production line 1 near the front and rear surfaces, and a dovetail groove 3 is provided on the adjacent side of the support frame 8 on both sides, and the line scanning host 6 is installed inside the dovetail groove 3 on both sides through a connecting seat 17, a geometric line scanning camera 11 is installed in the middle of the line scanning host 6, and a linear array lens 14 is installed at the bottom of the geometric line scanning camera 11, which can realize the principle of the same length as the reading width, and the linear array lens 14 is used to replace the transmission line. The optical reduction system of the system is modified, and a CCD photosensitive chip is added to improve the detection accuracy. Fill lights 15 are installed on both sides of the proportional line scan camera 11 inside the line scan host 6. The proportional line scan camera 11 is filled with light by the fill lights 15 arranged on both sides. High-transmittance glass 13 is installed at the bottom of the line scan host 6. The front surface of the support frame 8 on the front side of the wafer production line 1 is installed with a control host 2. The control host 2 is equipped with software inside. The wafer defects are tested in different environments based on the ResNet residual network and the FPN multi-scale feature pyramid network. An alarm 7 is installed on the top of the control host 2.

[0020] like Figure 1-2 As shown, an inner shell 16 is installed in the middle of the line sweeping host 6, and the line sweeping host 6 is protected by the inner shell 16. Heat exchange plates 12 are installed on both sides of the inner shell 16. A heat sink 5 is installed on the top of the line sweeping host 6. A fan 10 is installed in the middle of the heat sink 5. The inside of the line sweeping host 6 is cooled by the fan 10 inside the heat sink 5. A dustproof net 9 is installed on the top of the heat sink 5, and heat dissipation holes 4 are provided on both sides of the line sweeping host 6.

[0021] The working principle of the embodiment 1 is that: after the device is installed, the wafer is moved to the bottom of the line scanning host 6 by the wafer production line 1, the line array lens 14 at the bottom of the equal-ratio line scanning camera 11 is opened to record the wafer, the recording data is transmitted to the control host 2, the recording data is analyzed by the control host 2, the fan 10 in the heat dissipation seat 5 is started, the external air is taken in through the heat dissipation hole 4 and discharged through the dust screen 9, the airflow is generated in the line scanning host 6, the heat exchange sheet 12 is cooled by the airflow, the equal-ratio line scanning camera 11 is cooled, and the service life of the device is prolonged. Thus, the working process of the device is completed. Embodiment two

[0022] As shown in Figure 3 and Figure 4 , the embodiment further comprises: the top of the two side support frames 8 is provided with a motor frame 19, the top of the motor frame 19 is provided with a motor 18, the output shaft of the motor 18 is provided with a rotating shaft 20, the rotating shaft 20 is sleeved in the connecting seat 17, the rotating shaft 20 and the connecting seat 17 are connected by screwing, the rotating shaft 20 drives the connecting seat 17 to move, so as to drive the height of the line scanning host 6, the bottom of the connecting seat 17 is provided with an infrared sensor 21, the infrared sensor 21 senses the position height of the wafer production line 1, so as to adjust the height of the line scanning host 6, and the infrared sensor 21 is electrically connected with the control host 2.

[0023] In the embodiment, the infrared sensor 21 senses the height to be detected, and then the motor 18 is started to drive the rotating shaft 20 to rotate, the connecting seat 17 is moved by the rotating shaft 20, so that the height of the line scanning host 6 is adjusted, and the wafer is scanned by the line scanning host 6.

[0024] The above specific embodiments are only several preferred embodiments of the present application. Based on the technical solutions of the present application and the related inspirations of the above embodiments, those skilled in the art can make various alternative improvements and combinations on the above specific embodiments.

Claims

1. A linear scanning integrated imaging display device, comprising a wafer production line (1), a control host (2) and a linear scanning host (6), characterized in that: Support frames (8) are installed on the top of the wafer production line (1) near the front and rear surfaces, and dovetail grooves (3) are provided on adjacent sides of the support frames (8) on both sides. Line scanning hosts (6) are installed inside the dovetail grooves (3) on both sides through connecting seats (17), and a proportional line scanning camera (11) is installed in the middle of the line scanning host (6). A linear array lens (14) is installed at the bottom of the proportional line scanning camera (11), and fill lights (15) are installed on both sides of the proportional line scanning camera (11) inside the line scanning host (6).

2. The isometric line scanning integrated imaging display device according to claim 1, characterized in that: A high-transmittance glass (13) is installed at the bottom of the line-scanning main unit (6), an inner shell (16) is installed in the middle of the line-scanning main unit (6), and heat exchange fins (12) are installed on both sides of the inner shell (16).

3. The isometric line scanning integrated imaging display device according to claim 1, characterized in that: A heat sink (5) is installed on the top of the line sweeping main unit (6), a fan (10) is installed in the middle of the heat sink (5), and a dustproof net (9) is installed on the top of the heat sink (5).

4. The isometric line scanning integrated imaging display device according to claim 1, characterized in that: Both sides of the line scanning main unit (6) are provided with heat dissipation holes (4).

5. The isometric line scanning integrated imaging display device according to claim 1, characterized in that: A motor frame (19) is installed on the top of the support frames (8) on both sides, a motor (18) is installed on the top of the motor frame (19), and a rotating shaft (20) is installed on the output shaft of the motor (18).

6. The isometric line scanning integrated imaging display device according to claim 5, characterized in that: The rotating shaft (20) is sleeved inside the connecting seat (17), and the rotating shaft (20) and the connecting seat (17) are screwed together via a thread.

7. The isometric line scanning integrated imaging display device according to claim 1, characterized in that: A control host (2) is installed on the front surface of the support frame (8) on the front side of the wafer production line (1), and an alarm (7) is installed on the top of the control host (2).

8. The isometric line scanning integrated imaging display device according to claim 1, characterized in that: An infrared sensor (21) is installed at the bottom of the connecting seat (17), and the infrared sensor (21) is electrically connected to the control host (2).

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