Surface mounting auxiliary device for semiconductor chip production and processing

Abstract

The invention relates to the technical field of semiconductor chips, and particularly discloses a mounting auxiliary device for semiconductor chip production and processing, which comprises a base, a workbench, a transmission table, a chip and a substrate located on the transmission table, a supporting rod is rotatably mounted at the top of the base, and a mounting block is fixedly connected to the top of the supporting rod; a first connecting rod and a second connecting rod are installed on the two sides of the installation block respectively, the first frame body, the second frame body, the sliding rod, the sliding block and the suction cylinders are arranged, and the multiple suction cylinders can be installed on the sliding rod, so that the first frame body and the second frame body can pick up multiple chips at the same time, the multiple chips are placed on a substrate at the same time, and mounting of the multiple chips is completed at a time; and the suction tube can be fixed at any position below the first frame body or the second frame body, so that the position of the suction tube can be adjusted at will according to the shapes of different substrates and different chip fixing positions, and the suction tube can adapt to different substrates in the production process.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor chip, and particularly relates to a mounting auxiliary device for semiconductor chip production and processing. BACKGROUND

[0002] The semiconductor chip is a kind of semiconductor device with certain function made by etching, wiring on semiconductor sheet material. The semiconductor chip includes silicon chip and gallium arsenide chip, etc. The electrical property of semiconductor must be predictable and stable. In the manufacturing process of semiconductor chip, the mounting process is a key step of accurately carrying and mounting the chip from the initial position to the target substrate, which involves accurately fixing the chip on the printed circuit board (PCB) or other types of packaging substrate.

[0003] The common mounting device uses a mechanical arm to take the chip from the chip tape and place the chip on the glued substrate, so as to fix the chip on the substrate. Since the lines on different substrates are different, the positions of the chip mounting are also different. Therefore, the common mechanical arm usually takes one chip and places it on the substrate, and then takes another chip, or the mechanical arm takes multiple chips at a time and places the chips on different positions one by one. There is a problem of low work efficiency, and the common mechanical arm cannot detect the chip when taking the chip. SUMMARY

[0004] The purpose of the present application is to solve the problems in the prior art and provide a mounting auxiliary device for semiconductor chip production and processing.

[0005] In order to achieve the above purpose, the present application adopts the following technical scheme: A mounting auxiliary device for semiconductor chip production and processing, comprising a base, a workbench, a transmission table, a chip and a substrate on the transmission table, a supporting rod is rotatably installed on the top of the base, an installation block is fixedly connected to the top of the supporting rod, a first connecting rod and a second connecting rod are installed on the two sides of the installation block respectively, a first frame body is fixedly installed on the end of the first connecting rod away from the installation block, a second frame body is fixedly installed on the end of the second connecting rod away from the installation block, a plurality of sliding rods are installed on the first frame body and the second frame body, a suction cylinder is installed below the sliding rods, an installation ring is fixedly connected to the outside of the suction cylinder, a plurality of probes are arranged on the bottom of the installation ring, and the chip to be installed is arranged on the workbench.

[0006] Preferably, four protrusions are arranged on the sliding rod, the four protrusions are arranged on the top and the bottom of the two ends of the sliding rod respectively, a first bolt is threadedly connected to the protrusion, and the end of the first bolt can contact the first frame body or the second frame body.

[0007] Preferably, the sliding rod is provided with a sliding block, the sliding block is sleeved on the outer side of the sliding rod, the top of the sliding block is provided with a second bolt through thread connection, the end of the second bolt can contact with the sliding rod, the bottom of the sliding block is fixedly connected with a vertical rod, the bottom of the vertical rod is fixedly connected with the top of the suction cylinder, the suction cylinder is hollow, the bottom of the suction cylinder is fixedly connected with a convex head, the convex head is also hollow, and the bottom of the convex head is fixedly connected with a rubber ring.

[0008] Preferably, the bottom of the mounting ring is detachably provided with a mounting plate, and the bottom of the mounting plate is fixedly connected with a plurality of probes.

[0009] Preferably, the bottom of the mounting ring is fixedly connected with a screw rod, the outer side of the screw rod is provided with a nut through thread connection, and the mounting plate is provided with a through hole for the screw rod to pass through.

[0010] Preferably, the two ends of the workbench are respectively provided with a group of mounting rods, each group includes two mounting rods, a plurality of rotating shafts are arranged between the two mounting rods, the rotating shafts are rotationally connected with the corresponding mounting rods, one of the mounting rods in each group is provided with a plurality of second stepping motors, the second stepping motors are in one-to-one correspondence with the rotating shafts, and the output ends of the second stepping motors are fixedly connected with the rotating shafts.

[0011] Preferably, the outer side of the rotating shaft is provided with a flat key and a key groove, the outer side of the rotating shaft is provided with a coiled chip strip, the chip to be mounted is located in the groove of the chip strip, and the two sides of the chip strip are provided with fixing rings, the third bolts are connected with the fixing rings through thread connection, and the ends of the third bolts can contact with the rotating shafts.

[0012] Preferably, the inside of the base is provided with a first stepping motor, and the output end of the first stepping motor is fixedly connected with the bottom of the supporting rod.

[0013] Preferably, the two sides of the mounting block are respectively provided with a first mounting groove and a second mounting groove, one end of the first connecting rod is connected with the inner wall of the first mounting groove in the vertical direction, and one end of the second connecting rod is connected with the inner wall of the second mounting groove in the vertical direction.

[0014] Preferably, the inside of the first mounting groove is provided with a first push rod, the inside of the second mounting groove is provided with a second push rod, the bottom of the first push rod is connected with the bottom of the first mounting groove, the top of the first push rod is connected with the first connecting rod, the bottom of the second push rod is connected with the bottom of the second mounting groove, and the top of the second push rod is connected with the second connecting rod.

[0015] Compared with the prior art, the present application has the following advantages: 1. By setting up a first frame, a second frame, a sliding rod, a slider, and a suction cup, multiple suction cups can be installed on the sliding rod, so that the first frame and the second frame can pick up multiple chips at the same time and place multiple chips on the substrate at the same time, completing the placement of multiple chips at one time, and increasing the placement efficiency. The sliding rod can move along the first frame or the second frame and be fixed at any position, and the slider can move along the length of the sliding rod and be fixed at any position, so that the suction cup can be fixed at any position below the first frame or the second frame. Therefore, according to the shape of different substrates and the different chip fixing positions, the position of the suction cup can be adjusted at will, so that the present application can adapt to different substrates during the production process.

[0016] 2. By setting the chip belt, rotating shaft and fixing ring, the chip belt can be fixed at any position on the rotating shaft. With the drive of the second stepper motor, the chip to be mounted can be transported to any position on the workbench, so that the suction cup under the first frame or the second frame can pick up the chip to be mounted at any position, so that the first frame and the second frame can pick up multiple chips at the same time and mount multiple chips at the same time, thereby increasing the efficiency of mounting.

[0017] 3. The output end of the second stepper motor drives the shaft to rotate, and the chip on the chip belt is sent to the predetermined position on the workbench. After the rubber ring at the bottom of the convex head contacts the chip, the suction cup picks up the chip. At this time, the probe on the mounting plate contacts the contact on the chip to detect the chip, so as to determine whether each chip has a fault before installation, and avoid installing faulty chips, which will reduce the yield rate of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a structural schematic diagram of the workbench shown in the present invention; Figure 3 As shown in the present invention Figure 2 A magnified schematic diagram of part A; Figure 4 As shown in the present invention Figure 2 An enlarged schematic diagram of part B; Figure 5 It is a structural schematic diagram of the first frame shown in the present invention; Figure 6 This is a schematic structural diagram of the first connecting rod and the second connecting rod shown in the present invention; Figure 7 As shown in the present invention Figure 6 An enlarged schematic diagram of part C; Figure 8 This is a schematic structural diagram of the base and mounting block shown in the present invention; Figure 9 It is a structural schematic diagram of the mounting ring shown in the present invention.

[0019] Figure: 1, base; 2, support rod; 3, mounting block; 4, workbench; 5, transmission table; 6, base plate; 7, chip; 8, first connecting rod; 9, first frame; 10, second connecting rod; 11, second frame; 12, mounting rod; 13, rotating shaft; 14, chip strip; 15, fixing ring; 16, third bolt; 17, flat key; 18, second stepper motor; 19, sliding rod; 20, protruding block; 21, first bolt; 22, vertical rod; 23, suction cylinder; 24, mounting ring; 25, mounting plate; 26, protruding head; 27, probe; 28, screw; 29, rubber ring; 30, first mounting groove; 31, first push rod; 32, second mounting groove; 33, second push rod; 34, first stepper motor; 35, nut; 36, sliding block; 37, second bolt. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all.

[0021] Reference Figures 1-9 A mounting auxiliary device for semiconductor chip production and processing includes a base 1, a workbench 4, a transmission table 5, a chip 7, and a base plate 6 located on the transmission table 5. The base 1 is rotatably installed on the top of the support rod 2. The support rod 2 is fixedly connected to the top of the mounting block 3. The first connecting rod 8 and the second connecting rod 10 are respectively installed on both sides of the mounting block 3. The first frame 9 is fixedly installed on the end of the first connecting rod 8 away from the mounting block 3. The second frame 11 is fixedly installed on the end of the second connecting rod 10 away from the mounting block 3. A plurality of sliding rods 19 are installed on the first frame 9 and the second frame 11. The suction cylinder 23 is installed below the sliding rod 19. The mounting ring 24 is fixedly connected to the outside of the suction cylinder 23. The mounting ring 24 is provided with a plurality of probes 27 at the bottom. The chip 7 to be installed is located on the workbench 4. The sliding rod 19 is provided with four protruding blocks 20. The four protruding blocks 20 are respectively located at the top and bottom of both ends of the sliding rod 19. The first bolt 21 is threadedly connected to the protruding block 20. The end of the first bolt 21 can contact the first frame 9 or the second frame 11. The sliding block 36 is provided on the outside of the sliding rod 19. The sliding block 36 is sleeved on the outside of the sliding rod 19. The second bolt 37 is threadedly connected to the top of the sliding block 36. The end of the second bolt 37 can contact the sliding rod 19. The sliding rod 19 can be fixed by the first bolt 21 and can slide to any position in the first frame 9 or the second frame 11. The sliding block 36 can slide to any position on the sliding rod 19 by being installed on the outside of the sliding rod 19. Thus, the position of the suction cylinder 23 can be adjusted according to the size of the base plate 6 and the installation position of the chip 7.

[0022] As a technical optimization scheme of the present application, the slider 36 is fixedly connected with a vertical rod 22 at the bottom, the vertical rod 22 is fixedly connected with the top of the suction cylinder 23 at the bottom, the suction cylinder 23 is hollow, the suction cylinder 23 is fixedly connected with a convex head 26 at the bottom, the convex head 26 is also hollow, the convex head 26 is fixedly connected with a rubber ring 29 at the bottom, a plurality of sliding rods 19 are installed on the first frame 9 and the second frame 11, a plurality of suction cylinders 23 can be installed on the sliding rod 19, so that the first frame 9 and the second frame 11 can pick up a plurality of chips 7 at the same time, and place a plurality of chips 7 on the substrate 6 at the same time, thereby increasing the mounting efficiency. The sliding rod 19 can move along the first frame 9 or the second frame 11 and be fixed at any position, the slider 36 can move along the length direction of the sliding rod 19 and be fixed at any position, so that the suction cylinder 23 can be fixed at any position below the first frame 9 or the second frame 11, thereby adjusting the position of the suction cylinder 23 according to the shape of different substrates 6 and the fixed position of the chip 7, so that the present application can adapt to different substrates 6 in the production process, thereby increasing the use range and working efficiency of the present application.

[0023] As a technical optimization scheme of the present application, the mounting ring 24 is detachably mounted with a mounting plate 25 at the bottom, the mounting plate 25 is fixedly connected with a plurality of probes 27 at the bottom, the end of the probe 27 can contact the port of the chip 7 on the workbench 4, the corresponding second stepping motor 18 drives the rotating shaft 13 and the chip belt 14 to rotate, so that the chip 7 on the chip belt 14 is sent to the predetermined position on the workbench 4, the suction cylinder 23 picks up the chip 7, the probe 27 on the mounting plate 25 contacts the contact on the chip 7, and the chip 7 is detected by the detector connected to the mounting plate 25, so that whether each chip 7 has a fault is judged before installation, thereby avoiding installing a faulty chip 7 and reducing the yield of the substrate 6.

[0024] As a technical optimization scheme of the present application, the mounting ring 24 is fixedly connected with a screw rod 28 at the bottom, the screw rod 28 is threadedly connected with a nut 35 outside, a through hole is formed in the mounting plate 25 for the screw rod 28 to pass through, and the mounting ring 24 is fixedly connected with the mounting plate 25 through the nut 35 and the screw rod 28. When the size and type of the chip 7 to be mounted change, the nut 35 can be unscrewed, and a new mounting plate 25 can be removed and replaced, so that the mounting plate 25 and the probe 27 can match the new chip 7, thereby enabling the present application to adapt to the mounting of different types of chips 7.

[0025] As a technical optimization scheme of the present application, the workbench 4 is provided with a group of mounting rods 12 at both ends, each group including two mounting rods 12, a plurality of rotating shafts 13 being provided between the two mounting rods 12, the rotating shaft 13 being rotatably connected with the corresponding mounting rod 12, one of the mounting rods 12 in each group being provided with a plurality of second stepping motors 18, the second stepping motor 18 corresponding to the rotating shaft 13 one by one, and the output end of the second stepping motor 18 being fixedly connected with the rotating shaft 13, the rotating shaft 13 being provided with a flat key 17 and a key groove on the outside, the rotating shaft 13 being provided with a coiled chip strip 14 on the outside, the chip 7 to be mounted being located in the groove of the chip strip 14, the chip strip 14 being provided with a fixing ring 15 on both sides, the third bolt 16 being threadedly connected with the fixing ring 15, the end of the third bolt 16 being capable of contacting the rotating shaft 13, the chip strip 14 being capable of moving along the axis direction of the rotating shaft 13, and being fixed by the two fixing rings 15, so that the chip strip 14 can be fixed at any position on the rotating shaft 13, and cooperating with the driving of the second stepping motor 18, the chip 7 to be mounted can be transported to any position on the workbench 4, so that the suction cylinder 23 below the first frame body 9 or the second frame body 11 can pick up the chip 7 to be mounted at any position, thereby enabling the first frame body 9 and the second frame body 11 to simultaneously pick up a plurality of chips 7, simultaneously mount a plurality of chips 7, and increase the mounting efficiency.

[0026] As a technical optimization scheme of the present application, the base 1 is internally provided with a first stepping motor 34, and the output end of the first stepping motor 34 is fixedly connected with the bottom of the supporting rod 2.

[0027] As a technical optimization scheme of the present application, the mounting block 3 is provided with a first mounting slot 30 and a second mounting slot 32 on both sides, respectively, one end of the first connecting rod 8 being slidably connected with the inner wall of the first mounting slot 30 in the vertical direction, one end of the second connecting rod 10 being slidably connected with the inner wall of the second mounting slot 32 in the vertical direction, the first mounting slot 30 being internally provided with a first push rod 31, and the second mounting slot 32 being internally provided with a second push rod 33, the bottom of the first push rod 31 being connected with the bottom of the first mounting slot 30, the top being connected with the first connecting rod 8, the bottom of the second push rod 33 being connected with the bottom of the second mounting slot 32, and the top being connected with the second connecting rod 10, the first push rod 31 being used to control the lifting of the first connecting rod 8, and the second push rod 33 being used to control the lifting of the second connecting rod 10, so that the first frame body 9 and the second frame body 11 can work separately, and one side picking up and detecting the chip 7 does not affect the mounting on the other side.

[0028] The first push rod 31 and the second push rod 33 are both electric push rods, and the suction cylinder 23 is externally connected with an air pump and an air pipe (not shown in the figure).

[0029] In use, first, the chip strip 14 is installed on the corresponding rotating shaft 13, the chip strip 14 can move along the axial direction of the rotating shaft 13, then the chip strip 14 is fixed by the two fixing rings 15, when moving, the corresponding third bolt 16 is loosened, the fixing ring 15 and the chip strip 14 can move along the axial direction of the rotating shaft 13, so as to complete the adjustment of the position of the chip strip 14.

[0030] The rotating shaft 13 is driven to rotate by the output end of the corresponding second stepping motor 18, the chip strip 14 is driven to rotate, so as to send the chip 7 on the chip strip 14 to the predetermined position on the workbench 4, then the first push rod 31 is retracted, the first connecting rod 8, the first frame body 9 and the corresponding slide rod 19 are driven to move downward, the slide rod 19 drives the sliding block 36, the vertical rod 22, the suction cylinder 23 and the lug 26 to move downward, after the rubber ring 29 at the bottom of the lug 26 contacts the chip 7, the suction cylinder 23 is connected with the air pump to suck air, so as to make the chip 7 adsorbed on the rubber ring 29, at this time, the probe 27 on the mounting plate 25 contacts the contact point on the chip 7, the chip 7 is detected by the detector connected to the mounting plate 25, so as to judge whether each chip 7 has a fault before installation, avoid installing the faulty chip 7, and reduce the yield of the substrate 6, and the subsequent troubleshooting is more complicated.

[0031] After the suction cylinder 23 below the first frame body 9 adsorbs the chip 7, the first stepping motor 34 drives the support rod 2 to rotate 180°, the support rod 2 drives the mounting block 3 to rotate, the mounting block 3 drives the first connecting rod 8, the first frame body 9, the second connecting rod 10 and the second frame body 11 to rotate, so as to make the first frame body 9 and the second frame body 11 exchange positions, the second push rod 33 is retracted, the slide rod 19, the sliding block 36, the vertical rod 22, the suction cylinder 23 and the lug 26 on the second frame body 11 repeat the above-mentioned action, pick up the chip 7 and detect the chip 7, at this time, the first push rod 31 is retracted, the first frame body 9, the sliding block 36, the vertical rod 22, the suction cylinder 23 and the lug 26 above the substrate 6 drive the chip 7 to move downward, and the chip 7 is placed on the substrate 6 after being coated with glue, the mounting of the chip 7 is completed, the above-mentioned action is repeatedly performed, so that the mounting of the chip 7 is efficiently completed, and the mounted chip 7 is detected at the same time.

[0032] The first frame 9 and the second frame 11 are both provided with a plurality of slide rods 19, and a plurality of suction cylinders 23 can be installed on the slide rods 19, so that the first frame 9 and the second frame 11 can simultaneously pick up a plurality of chips 7 and place the plurality of chips 7 on the substrate 6, thereby increasing the mounting efficiency. The slide rods 19 can move along the first frame 9 or the second frame 11 and be fixed at any position, the sliding blocks 36 can move along the length direction of the slide rods 19 and be fixed at any position, the suction cylinders 23 can be fixed at any position below the first frame 9 or the second frame 11, so that the position of the suction cylinders 23 can be adjusted at will according to the shape of different substrates 6 and the fixed positions of the chips 7, and the application can adapt to different substrates 6 during production, thereby increasing the use range and working efficiency of the application.

[0033] The chip strip 14 can move along the axis direction of the rotating shaft 13 and be fixed by the two fixing rings 15, so that the chip strip 14 can be fixed at any position on the rotating shaft 13, and the chip strip 14 can be driven by the second stepping motor 18 to be transported to any position on the workbench 4, so that the suction cylinders 23 below the first frame 9 or the second frame 11 can pick up the chips 7 to be mounted at any position, thereby enabling the first frame 9 and the second frame 11 to simultaneously pick up a plurality of chips 7 and mount a plurality of chips 7 at the same time, thereby increasing the mounting efficiency.

[0034] The mounting ring 24 is provided below with two screw rods 28, the screw rods 28 are provided with nuts 35 through threaded connection, and the mounting ring 24 is fixedly installed on the mounting plate 25 through the nuts 35 and the screw rods 28. When the size and type of the chip 7 to be mounted change, the nuts 35 can be unscrewed, the mounting plate 25 can be removed and replaced, the mounting plate 25 and the probe 27 can match the new chip 7, and the application can adapt to mounting of different types of chips 7.

[0035] The above is only the preferred specific embodiment of the application, but the protection scope of the application is not limited to this. Any person skilled in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the application within the technical range disclosed by the application, which should be covered in the protection scope of the application.

Claims

1. A placement auxiliary device for semiconductor chip production and processing, comprising a base (1), a workbench (4), a transfer table (5), a chip (7) and a substrate (6) located on the transfer table (5), characterized in that: A support rod (2) is rotatably mounted on the top of the base (1), a mounting block (3) is fixedly connected to the top of the support rod (2), a first connecting rod (8) and a second connecting rod (10) are respectively mounted on both sides of the mounting block (3), a first frame (9) is fixedly mounted on the end of the first connecting rod (8) away from the mounting block (3), a second frame (11) is fixedly mounted on the end of the second connecting rod (10) away from the mounting block (3), a plurality of slide rods (19) are mounted on both the first frame (9) and the second frame (11), a suction cylinder (23) is mounted below the slide rod (19), a mounting ring (24) is fixedly connected to the outside of the suction cylinder (23), a plurality of probes (27) are provided at the bottom of the mounting ring (24), and a chip (7) to be mounted is located on the workbench (4).

2. A placement auxiliary device for semiconductor chip production and processing according to claim 1, characterized in that: The slide bar (19) is provided with four protrusions (20), which are respectively located at the top and bottom of both ends of the slide bar (19). A first bolt (21) is connected to the protrusion (20) through a thread, and the end of the first bolt (21) can contact the first frame (9) or the second frame (11).

3. A placement auxiliary device for semiconductor chip production and processing according to claim 2, characterized in that: The outside of the slide bar (19) is provided with a slider (36), which is sleeved on the outside of the slide bar (19), and the top of the slider (36) is connected to a second bolt (37) through a thread, and the end of the second bolt (37) can contact the slide bar (19), and the bottom of the slider (36) is fixedly connected to a vertical rod (22), and the bottom of the vertical rod (22) is fixedly connected to the top of the suction cylinder (23), and the suction cylinder (23) is hollow. The bottom of the suction cylinder (23) is fixedly connected to a convex head (26), which is also hollow. The bottom of the convex head (26) is fixedly connected to a rubber ring (29).

4. A placement auxiliary device for semiconductor chip production and processing according to claim 3, characterized in that: A mounting plate (25) is detachably mounted on the bottom of the mounting ring (24), and a plurality of probes (27) are fixedly connected to the bottom of the mounting plate (25), and the ends of the probes (27) are capable of contacting the ports of the chip (7) on the workbench (4).

5. A placement auxiliary device for semiconductor chip production and processing according to claim 4, characterized in that: The bottom of the mounting ring (24) is fixedly connected to a screw rod (28), the outer side of the screw rod (28) is connected to a nut (35) via a thread, and a through hole for the screw rod (28) to pass through is provided on the mounting plate (25).

6. A placement auxiliary device for semiconductor chip production and processing according to claim 1, characterized in that: A group of mounting rods (12) is respectively provided at both ends of the workbench (4), each group includes two mounting rods (12), a plurality of rotating shafts (13) are provided between the two mounting rods (12), and the rotating shafts (13) are rotatably connected to the corresponding mounting rods (12), and a plurality of second stepper motors (18) are provided on one of the mounting rods (12) in each group, the second stepper motors (18) correspond to the rotating shafts (13) one by one, and the output end of the second stepper motor (18) is fixedly connected to the rotating shaft (13).

7. A placement auxiliary device for semiconductor chip production and processing according to claim 6, characterized in that: A flat key (17) and a keyway are provided on the outside of the rotating shaft (13); a rolled chip strip (14) is provided on the outside of the rotating shaft (13); a chip (7) to be mounted is located in a groove of the chip strip (14); fixing rings (15) are provided on both sides of the chip strip (14); a third bolt (16) is connected to the fixing ring (15) through a thread; and an end of the third bolt (16) can contact the rotating shaft (13).

8. The placement auxiliary device for semiconductor chip production and processing according to claim 1, characterized in that: A first stepper motor (34) is provided inside the base (1), and an output end of the first stepper motor (34) is fixedly connected to the bottom of the support rod (2).

9. A placement auxiliary device for semiconductor chip production and processing according to claim 8, characterized in that: A first mounting groove (30) and a second mounting groove (32) are respectively provided on both sides of the mounting block (3); one end of the first connecting rod (8) is slidably connected to the inner wall of the first mounting groove (30) along the vertical direction; and one end of the second connecting rod (10) is slidably connected to the inner wall of the second mounting groove (32) along the vertical direction.

10. A placement auxiliary device for semiconductor chip production and processing according to claim 9, characterized in that: A first push rod (31) is provided inside the first mounting groove (30), and a second push rod (33) is provided inside the second mounting groove (32). The bottom of the first push rod (31) is connected to the bottom of the first mounting groove (30), and the top is connected to the first connecting rod (8). The bottom of the second push rod (33) is connected to the bottom of the second mounting groove (32), and the top is connected to the second connecting rod (10).

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