Manipulator, semiconductor device, and method for adjusting manipulator

Abstract

The invention provides a manipulator, semiconductor equipment and an adjusting method of the manipulator, relates to the technical field of semiconductors, and solves the technical problem that the extension length of an adsorption part cannot be flexibly adjusted by the manipulator. The manipulator comprises a movable part and a fixed part which are in sealed connection; an adsorption end capable of adsorbing a substrate is arranged at the tail end of the moving part, an adsorption hole is formed in the adsorption end, a through first air channel is formed in the moving part, and the first air channel is communicated with the adsorption hole; a second air passage is formed in the fixing part, is communicated with the first air passage and is communicated with the adsorption hole through the first air passage; the moving part can move relative to the fixed part to change the extension length of the moving part, so that the position of the adsorption end is flexibly adjusted, the moving part can place the substrate into the clamp or take the substrate out of the clamp after being correspondingly matched with the clamp (through the adsorption end), adjustment is convenient, and time and labor are saved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a manipulator, a semiconductor device, and a method for adjusting the manipulator. Background Art

[0002] In the semiconductor field, electroplating refers to the process of depositing a thin metal film on a substrate. In advanced packaging technology, electroplating is often used to form different structures such as copper pillars and solder joints on the substrate to interconnect chips on the substrate.

[0003] Electroplating equipment is a semiconductor device that performs the electroplating process. It consists of a plating chamber and fixtures, as well as a robot capable of placing and removing substrates from the fixtures. After removing a substrate from the Equipment Front End Module (EFEM) or cleaning structure, the robot places it in the fixture. Once the fixture secures the substrate, the surface to be plated is immersed in the plating solution in the plating chamber to perform the electroplating process. Once plating is complete, the robot removes the substrate from the fixture.

[0004] like Figure 1 、 Figure 2 and Figure 3 As shown, the fixture 200 in the electroplating equipment is generally an open and close structure. The upper structure 201 of the fixture 200 can move upward to form an opening 203 with the lower structure 202. The robot can place the substrate on the bottom of the lower structure 202 through the opening 203. After that, the upper structure 201 of the fixture 200 moves downward to contact the substrate and apply downward pressure, so that the edge of the surface of the substrate facing downward to be electroplated is fixed on the annular sealing ring 204 at the bottom.

[0005] The lower structure 202 of the fixture 200 includes an annular wall, with an annular sealing ring 204 disposed below the wall. An annular convex wall 2021 is disposed above the wall. Convex wall 2021 has a certain width and a certain height from the surface of convex wall 2021 to the surface of the annular sealing ring 204. When a robot places a substrate into or removes a substrate from the opening 203 of the fixture 200, two conditions must be met: first, the robot must not interfere with convex wall 2021, and second, the robot must be able to reach the bottom of the lower structure 202 to place or remove the substrate.

[0006] In the existing related technology, the adsorption part of the manipulator is connected to the vacuum tube through a joint, and the vacuum tube is connected to the fixed part through another joint. The adsorption part includes an adsorption end, which is capable of adsorbing the substrate. However, with this structure, if the position of the adsorption end is to be adjusted, it is necessary to re-determine the required length of the new vacuum tube and replace the current vacuum tube with the new one. Therefore, the adjustment process is more troublesome, time-consuming and labor-intensive. In addition, by providing joints at both ends of the vacuum tube, the sealing performance is also poor, which is prone to air leakage, which may cause the adsorption end to be unable to adsorb the substrate, or cause the substrate adsorbed on the adsorption end to fall. Summary of the Invention

[0007] In order to solve the above technical problems, the present application is proposed. The embodiments of the present application provide a manipulator, a semiconductor device, and a method for adjusting the manipulator.

[0008] In the first aspect, an embodiment of the present application provides a robot, which is arranged in a semiconductor device and is used to place a substrate in a fixture of the semiconductor device or to remove a substrate from the fixture. The robot includes a moving part and a fixed part, and the moving part is sealed with the fixed part. The end of the moving part is provided with an adsorption end capable of adsorbing the substrate, and the adsorption end is provided with an adsorption hole. The moving part is formed with a through first air channel, and the first air channel is connected to the adsorption hole; a second air channel is formed inside the fixed part, and the second air channel is connected to the first air channel, and is connected to the adsorption hole through the first air channel, so that the second air channel, the first air channel and the adsorption hole form a substrate adsorption channel for adsorbing the substrate; the moving part can move relative to the fixed part to change the extension length of the moving part, so that the moving part can place the substrate in the fixture or remove the substrate from the fixture after corresponding matching; wherein, before and after the moving part moves relative to the fixed part, the substrate adsorption channel formed by the moving part and the fixed part is in a sealed state.

[0009] In some embodiments, the fixed part has a first opening connected to the second air channel, and the first air channel includes a first sub-air channel and a second sub-air channel; wherein, the movable part includes: a vacuum connector, at least partially extending into the second air channel from the first opening, the vacuum connector has a first sub-air channel and a second opening and a third opening connected to the first sub-air channel, the second opening is located in the second air channel, and the first sub-air channel is connected to the second air channel through the second opening; an adsorption component, the adsorption component has an adsorption hole, a second sub-air channel and a connecting hole, the second sub-air channel is connected to the adsorption hole and the connecting hole, one end of the adsorption component with the connecting hole is connected to one end of the vacuum connector with the third opening, and the second sub-air channel is connected to the first sub-air channel through the connecting hole and the third opening; wherein, the manipulator also includes: a first seal, which is arranged between the end face of the adsorption component with the connecting hole and the end face of the vacuum connector with the third opening, and is arranged around the third opening, and is configured to seal the gap between the third opening and the connecting hole.

[0010] In some embodiments, the robot further comprises: at least one second seal arranged between the inner wall of the second air channel and the outer side of the end of the vacuum connector having the second opening, configured to seal the gap between the inner wall of the second air channel and the vacuum connector.

[0011] In some embodiments, there are multiple second seals, and the multiple second seals are arranged in sequence along the extension direction of the vacuum connector.

[0012] In some embodiments, the maximum distance by which the moving part moves away from the fixed part is a target distance between the second seal closest to the first opening and the end surface of the fixed part having the first opening, wherein the target distance ranges from 0 mm to 30 mm.

[0013] In some embodiments, the vacuum connector comprises: an extending part at least partially extending into the second air channel through the first opening; and an abutting part located on the side of the extending part away from the fixed part, between the adsorption assembly and the fixed part, and connected with the extending part; wherein when the extending part is entirely located in the second air channel and the abutting part abuts against the fixed part, the target distance is 30 mm; and when the second seal closest to the first opening and the end surface of the fixed part having the first opening are located at the same position in the extension direction of the vacuum connector, the target distance is 0 mm.

[0014] In some embodiments, the adsorption assembly comprises: two clamping parts arranged on both sides of the end of the vacuum connector and the fixed part having the first opening in a first direction, one clamping part having at least one first through hole extending in the first direction, and the other clamping part having at least one first threaded part extending in the first direction, the first direction being parallel to the end surface of the fixed part having the first opening; at least one first screwing part, the first screwing part passing through the first through hole and screwing with the first threaded part; and an adsorption part arranged on the side of the vacuum connector away from the fixed part and connected with the two clamping parts, the adsorption part having an adsorption hole, a second air channel, and a communication hole.

[0015] In some embodiments, the end of the adsorption part having the communication hole has at least one second threaded part arranged adjacent to the communication hole, the second threaded part extending in a second direction, the first seal being arranged between the second threaded part and the communication hole, the second direction intersecting the first direction, and the vacuum connector having at least one second through hole extending in the second direction; wherein the adsorption assembly further comprises: at least one second screwing part, the second screwing part passing through the second through hole and screwing with the second threaded part.

[0016] In some embodiments, the end face of the vacuum connector having the third opening has a first annular groove arranged around the third opening, the shape of the first seal includes a ring shape, and is partially arranged in the first annular groove; and / or, the outer wall of the vacuum connector has a second annular groove arranged along the circumference of the vacuum connector, the shape of the second seal includes a ring shape, and is partially arranged in the second annular groove.

[0017] In a second aspect, an embodiment of the present application provides a semiconductor device comprising at least one electroplating chamber assembly, the electroplating chamber assembly comprising an electroplating chamber and a clamp arranged above the electroplating chamber, the clamp being capable of fixing a substrate and carrying the substrate to the electroplating liquid in the electroplating chamber to perform an electroplating process, and also comprising a robot such as any one of the first aspects that is capable of placing a substrate into the clamp or removing a substrate from the clamp.

[0018] In a third aspect, an embodiment of the present application provides a method for adjusting a manipulator, which is applied to the manipulator of any one of the first aspects above. The method for adjusting the manipulator includes: moving a moving part of the manipulator relative to a fixed part of the manipulator to change the extension length of the moving part, so that the moving part can place a substrate in the fixture or remove a substrate from the fixture after correspondingly matching with the fixture; wherein, before and after the moving part moves relative to the fixed part, the substrate adsorption channel formed by the moving part and the fixed part is in a sealed state.

[0019] In some embodiments, the fixed part has a first opening in communication with a second air channel, the first air channel includes a first sub-air channel and a second sub-air channel, the moving part includes a vacuum connector and an adsorption assembly, the vacuum connector at least partially extends into the second air channel from the first opening, the vacuum connector has the first sub-air channel and a second opening and a third opening in communication with the first sub-air channel, the second opening is located in the second air channel, the first sub-air channel is in communication with the second air channel through the second opening, the adsorption assembly has an adsorption hole, a second sub-air channel and a communication hole, the second sub-air channel is in communication with the adsorption hole and the communication hole, one end of the communication hole of the adsorption assembly is connected with one end of the third opening of the vacuum connector, the second sub-air channel is in communication with the first sub-air channel through the communication hole and the third opening, the robot further includes a first sealing member, the first sealing member is arranged between the end surface of the adsorption assembly having the communication hole and the end surface of the vacuum connector having the third opening, and is arranged around the third opening, and is configured to seal the gap between the third opening and the communication hole; wherein the adsorption assembly includes two clamping parts, at least one first screw member and an adsorption part, the two clamping parts are arranged on both sides of the fixed part having the first opening in a first direction away from the vacuum connector, one clamping part has at least one first through hole extending in the first direction, the other clamping part has at least one first threaded part extending in the first direction, the first direction is parallel to the end surface of the fixed part having the first opening, the first screw member passes through the first through hole and is screwed with the first threaded part, and the adsorption part is arranged on the side of the vacuum connector away from the fixed part and connected with the two clamping parts, and the adsorption part has the adsorption hole, the second sub-air channel and the communication hole; wherein moving the moving part of the robot relative to the fixed part of the robot includes: disassembling the first screw member from the first through hole and the first threaded part; moving the vacuum connector, the clamping parts and the adsorption part relative to the fixed part in a direction perpendicular to the first opening; and making the first screw member pass through the first through hole and be screwed with the first threaded part.

[0020] The robot and the adjusting method of the robot provided in the embodiments of the present application can freely and flexibly adjust the extension length of the moving part, so as to flexibly adjust the position of the adsorption end, so that the moving part can place or take out the substrate into or from the clamp (through the adsorption end) after corresponding matching with the clamp, without replacing the vacuum tube, and the adjustment is convenient, time-saving and labor-saving. Moreover, the substrate adsorption channel formed by the moving part and the fixed part can be in a sealed state at all times before and after the moving part moves relative to the fixed part, so as to ensure the sealing of the adjustment of the extension length of the moving part. BRIEF DESCRIPTION OF DRAWINGS

[0021] The above and other objects, features and advantages of the present application will become more apparent from the following detailed description thereof taken in conjunction with the accompanying drawings, in which: The accompanying drawings provide a further understanding of the present application and constitute a part of this specification, illustrate embodiments of the present application and together with the description serve to explain the present application. In the drawings:

[0022] Figure 1 Fig. 1 shows a structural schematic diagram of a clamp provided by an exemplary embodiment of the present application.

[0023] Figure 2 Fig. 2 shows a structural schematic diagram of a clamp after being cut open provided by an exemplary embodiment of the present application.

[0024] Figure 3 Fig. 3 shows a structural schematic diagram of a clamp provided by an exemplary embodiment of the present application. Figure 2 Fig. 4 shows a partial enlarged view of the clamp in region D.

[0025] Figure 4 Fig. 5 shows a structural schematic diagram of a robot provided by an exemplary embodiment of the present application.

[0026] Figure 5 Fig. 6 shows a top view of a robot provided by an exemplary embodiment of the present application.

[0027] Figure 6 Fig. 7 shows a structural schematic diagram of a robot provided by an exemplary embodiment of the present application. Figure 5 Fig. 8 shows a sectional view of the robot along AA direction.

[0028] Figure 7 Fig. 9 shows a structural schematic diagram of a robot provided by an exemplary embodiment of the present application. Figure 6 Fig. 10 shows a partial enlarged view of the robot in region B.

[0029] Figure 8 Fig. 11 shows a structural schematic diagram of a robot provided by an exemplary embodiment of the present application. Figure 6 Fig. 12 shows a partial enlarged view of the robot in region C.

[0030] Figure 9 Fig. 13 shows a structural schematic diagram of a robot provided by an exemplary embodiment of the present application. Figure 7 Fig. 14 shows a sectional view of the robot along EE direction.

[0031] Figure 10 Fig. 15 shows a flowchart of a method for adjusting a robot provided by an exemplary embodiment of the present application.

[0032] Figure 11 Fig. 16 shows a flowchart of a method for moving a moving part of a robot relative to a fixed part of the robot provided by an exemplary embodiment of the present application.

[0033] Figure 12 Shown is a schematic structural diagram of a semiconductor device provided by an exemplary embodiment of the present application.

[0034] Reference numerals: 100, manipulator; 101, moving part; 1011, adsorption end; 10111, adsorption hole; 1012, first air channel; 10121, first sub-air channel; 10122, second sub-air channel; 1013, vacuum connector; 10131, second opening; 10132, third opening; 10133, second through hole; 10134, first annular groove; 10135, second annular groove; 10136, insertion portion; 10137, abutment portion; 1014, adsorption assembly; 10141, connecting hole; 10142, clamp Tightening part; 101421, first threaded hole; 101422, first through hole; 10143, adsorption part; 10144, second threaded part; 102, fixing part; 1021, second air duct; 1022, first opening; 103, first sealing part; 104, second sealing part; 200, fixture; 201, upper structure; 202, lower structure; 203, opening of fixture; 2021, outer convex wall; 204, annular sealing ring; 300, semiconductor equipment; 301, electroplating chamber assembly; 3011, electroplating chamber. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0036] Figure 1 FIG. 1 is a schematic structural diagram of a clamp provided by an exemplary embodiment of the present application. Figure 2 The figure shows a schematic diagram of the structure of a clamp provided by an exemplary embodiment of the present application after being cut open. Figure 3 An exemplary embodiment of the present application is shown. Figure 2 The clamp shown is a partial enlarged view of area D. Figure 4 FIG. 1 is a schematic diagram of the structure of a manipulator provided by an exemplary embodiment of the present application. Figure 5 FIG. 1 is a top view of a manipulator provided by an exemplary embodiment of the present application. Figure 6 An exemplary embodiment of the present application is shown. Figure 5 The cross-sectional view of the manipulator along the AA direction is shown. Figure 7 An exemplary embodiment of the present application is shown. Figure 6 A partial enlarged view of the robot arm in area B is shown.

[0037] like Figures 1 to 7 As shown, an embodiment of the present application provides a manipulator 100, which is disposed in a semiconductor device 300 and is used to place a substrate into or remove a substrate from a fixture 200 of the semiconductor device 300. The manipulator 100 includes a movable portion 101 and a fixed portion 102, wherein the movable portion 101 and the fixed portion 102 are sealedly connected. The end of the movable portion 101 is provided with a suction end 1011 capable of sucking a substrate, and the suction end 1011 is provided with a suction hole 10111. The movable portion 101 is formed with a through first air channel 1012, which is connected to the suction hole 10111. A second air channel 1021 is formed inside the fixed portion 102, which is connected to the first air channel 1012 and is connected to the suction hole 10111 through the first air channel 1012, so that the second air channel 1021, the first air channel 1012, and the suction hole 10111 form a substrate suction channel for sucking the substrate. The movable portion 101 can move relative to the fixed portion 102 to change the extension length of the movable portion 101, so that the movable portion 101 can be matched with the clamp 200 to place a substrate in the clamp 200 or remove a substrate from the clamp 200. Before and after the movable portion 101 moves relative to the fixed portion 102, the substrate suction channel formed by the movable portion 101 and the fixed portion 102 is in a sealed state.

[0038] Exemplarily, the substrate is a wafer.

[0039] Exemplarily, the movable portion 101 and the fixed portion 102 are sealed by a sealing ring.

[0040] Exemplarily, the second air channel 1021 can be connected to an air pump. By extracting the gas in the second air channel 1021, the air pump can extract the gas in the first air channel 1012 and the adsorption hole 10111, so that suction is generated at the adsorption hole 10111 to adsorb the substrate.

[0041] In the above embodiment, since the movable portion 101 can move relative to the fixed portion 102 to change the extension length of the movable portion 101, and before and after the movable portion 101 moves relative to the fixed portion 102, the substrate adsorption channel formed by the movable portion 101 and the fixed portion 102 is in a sealed state, the manipulator 100 provided in the embodiment of the present application can freely and flexibly adjust the extension length of the movable portion 101, thereby flexibly adjusting the position of the adsorption end 1011, so that the movable portion 101 can be matched with the fixture 200 and can (through the adsorption end 1011) place the substrate into the fixture 200 or remove the substrate from the fixture 200 without replacing the vacuum tube, which is convenient for adjustment, saving time and effort. In addition, since the substrate adsorption channel formed by the movable portion 101 and the fixed portion 102 can always be in a sealed state before and after the movable portion 101 moves relative to the fixed portion 102, the sealing performance of adjusting the extension length of the movable portion 101 is ensured.

[0042] In some embodiments, as Figure 6 and Figure 7As shown, the fixed portion 102 has a first opening 1022 (located at the dotted line indicated by 1022) that communicates with the second air channel 1021. The first air channel 1012 includes a first sub-air channel 10121 and a second sub-air channel 10122. The movable portion 101 includes a vacuum connector 1013 and an adsorption assembly 1014. At least a portion of the vacuum connector 1013 extends from the first opening 1022 into the second air channel 1021. The vacuum connector 1013 has a first sub-air channel 10121, a second opening 10131 communicating with the first sub-air channel 10121, and a third opening 10132. The second opening 10131 is located within the second air channel 1021, and the first sub-air channel 10121 communicates with the second air channel 1021 through the second opening 10131. The adsorption assembly 1014 has an adsorption hole 10111, a second sub-air channel 10122, and a connecting hole 10141. The second sub-air channel 10122 is connected to the adsorption hole 10111 and the connecting hole 10141. One end of the adsorption assembly 1014 with the connecting hole 10141 is connected to the end of the vacuum connector 1013 with the third opening 10132. The second sub-air channel 10122 is connected to the first sub-air channel 10121 through the connecting hole 10141 and the third opening 10132. That is, from left to right, the adsorption hole 10111, the second sub-air channel 10122, the connecting hole 10141, the third opening 10132, the first sub-air channel 10121, the second opening 10131, and the second air channel 1021 are connected in sequence to form a substrate adsorption channel. The robot 100 also includes a first sealing member 103. The first seal 103 is arranged between the end surface of the adsorption component 1014 having the connecting hole 10141 and the end surface of the vacuum connector 1013 having the third opening 10132, and is arranged around the third opening 10132, and is configured to seal the gap between the third opening 10132 and the connecting hole 10141.

[0043] Exemplarily, the first sealing member 103 is an annular sealing ring.

[0044] In the above embodiment, by providing the first sealing member 103 between the end face of the adsorption component 1014 having the connecting hole 10141 and the end face of the vacuum connector 1013 having the third opening 10132 , the gap between the third opening 10132 and the connecting hole 10141 can be better sealed to prevent air leakage.

[0045] In some embodiments, as Figure 7 As shown, the manipulator 100 further includes: at least one second sealing member 104. The at least one second sealing member 104 is disposed between the inner wall of the second air channel 1021 and the outer side surface of one end of the vacuum connector 1013 having the second opening 10131, and is configured to seal the gap between the inner wall of the second air channel 1021 and the vacuum connector 1013.

[0046] Exemplarily, the second sealing member 104 is an annular sealing ring.

[0047] Exemplarily, the number of the second sealing members 104 is 2, 3 or 4.

[0048] In the above embodiment, by arranging the second sealing member 104 between the inner wall of the second air channel 1021 and the outer side surface of one end of the vacuum connector 1013 having the second opening 10131, the gap between the inner wall of the second air channel 1021 and the vacuum connector 1013 can be better sealed to prevent air leakage.

[0049] In some embodiments, as Figure 7 As shown, there are multiple second sealing members 104 , and the multiple second sealing members 104 are sequentially arranged along the extending direction of the vacuum connecting member 1013 .

[0050] Exemplarily, there are two second sealing members 104 , which are sequentially arranged along the extending direction of the vacuum connector 1013 .

[0051] In the above embodiment, by providing multiple second seals 104 , the sealing between the inner wall of the second air duct 1021 and the vacuum connector 1013 can be improved. The more second seals 104 are provided, the better the sealing between the inner wall of the second air duct 1021 and the vacuum connector 1013 .

[0052] Figure 8 An exemplary embodiment of the present application is shown. Figure 6 A partial enlarged view of the robot arm in area C is shown.

[0053] In some embodiments, as Figure 8 As shown, the maximum distance that the movable portion 101 can move away from the fixed portion 102 is the target distance between the second sealing member 104 closest to the first opening 1022 and the end surface of the fixed portion 102 having the first opening 1022. The target distance ranges from 0 mm to 30 mm. Accordingly, the maximum distance that the movable portion 101 can move toward the fixed portion 102 is from 0 mm to 30 mm.

[0054] Exemplarily, the target distance is 10 mm, 20 mm or 30 mm.

[0055] In the above embodiment, by setting the target distance range to 0 mm to 30 mm, the moving portion 101 can flexibly adjust the extension length so that the adsorption end 1011 can extend to a suitable position in the fixture 200 to place or remove the substrate.

[0056] It should be understood that the numerical value of the above distance is set in combination with the actual application field of the semiconductor device 300 in the present embodiment. In different application fields, the position of the second sealing member 104 can be set according to actual conditions to change the target distance. For example, the target distance can be adjusted to 0 mm to 50 mm or other different data according to actual application.

[0057] In some embodiments, as shown in Figure 7 and Figure 8 The vacuum connecting piece 1013 includes a protruding part 10136 and an abutting part 10137. The protruding part 10136 is at least partially protruded into the second air duct 1021 by the first opening 1022. The abutting part 10137 is located on the side of the protruding part 10136 away from the fixed part 102, between the adsorption assembly 1014 and the fixed part 102, and is connected with the protruding part 10136. When the protruding part 10136 is entirely located in the second air duct 1021 and the abutting part 10137 abuts against the fixed part 102, the target distance is 30 mm. When the second sealing member 104 closest to the first opening 1022 and the end face of the fixed part 102 having the first opening 1022 are located at the same position in the extension direction of the vacuum connecting piece 1013, the target distance is 0 mm.

[0058] Specifically, in order to make the second sealing member 104 play a sealing role, the second sealing member 104 cannot be separated from the second air duct 1021 and must always be located between the inner wall of the second air duct 1021 and the vacuum connecting piece 1013. In addition, when the abutting part 10137 abuts against the fixed part 102, the moving part 101 cannot move towards the fixed part 102. Therefore, when the protruding part 10136 is entirely located in the second air duct 1021 and the abutting part 10137 abuts against the fixed part 102, the target distance is the maximum (i.e., 30 mm). When the second sealing member 104 closest to the first opening 1022 and the end face of the fixed part 102 having the first opening 1022 are located at the same position in the extension direction of the vacuum connecting piece 1013, that is, when the second sealing member 104 is about to be separated from the second air duct 1021, the target distance is the minimum (i.e., 0 mm). Correspondingly, the maximum distance of the moving part 101 moving towards the fixed part 102 is the maximum (i.e., 30 mm).

[0059] In some embodiments, as shown in Figures 5 to 7As shown, the suction assembly 1014 includes two clamping portions 10142, at least one first screw connection, and a suction portion 10143. The two clamping portions 10142 are located on either side of the vacuum connector 1013 and the end of the fixed portion 102 having the first opening 1022, in a first direction (i.e., the X direction in the figure). One clamping portion 10142 has at least one first through-hole 101422 extending in the first direction, and the other clamping portion 10142 has at least one first threaded portion extending in the first direction, parallel to the end face of the fixed portion 102 having the first opening 1022. The first screw connection passes through the first through-hole 101422 and is threadedly engaged with the first threaded portion. The suction portion 10143 is located on the side of the vacuum connector 1013 away from the fixed portion 102 and is connected to the two clamping portions 10142. The suction portion 10143 has a suction hole 10111, a second sub-air channel 10122, and a connecting hole 10141.

[0060] Exemplarily, the first direction and the extending direction of the vacuum connector 1013 are horizontal directions perpendicular to each other.

[0061] Exemplarily, the other clamping portion 10142 has at least one first threaded hole 101421 extending along the first direction, and the first threaded portion is a thread in the first threaded hole 101421 .

[0062] Exemplarily, the first threaded member is a screw or a bolt.

[0063] Exemplarily, there are multiple first through holes 101422, and the multiple first through holes 101422 are arranged in sequence along the second direction (i.e., the Y direction in the figure), and / or, the multiple first through holes 101422 are arranged in sequence along the third direction (i.e., the Z direction in the figure), and the first direction, the second direction and the third direction intersect in pairs, such as the first direction, the second direction and the third direction (such as the vertical direction) are perpendicular to each other; accordingly, there are multiple first threaded portions, and the multiple first threaded portions are arranged in sequence along the second direction, and / or, the multiple first threaded portions are arranged in sequence along the third direction.

[0064] Exemplarily, one clamping portion 10142 has two first through holes at one end in the third direction, and the other end of the clamping portion 10142 has two first through holes in the third direction, and the two first through holes located at the same end of the clamping portion 10142 in the third direction are spaced apart along the second direction. Accordingly, another clamping portion 10142 has two first threaded portions at one end in the third direction, and the other end of the other clamping portion 10142 has two first threaded portions in the third direction, and the two first threaded portions located at the same end of the other clamping portion 10142 in the third direction are spaced apart along the second direction.

[0065] In the above embodiment, the movable portion 101 and the fixed portion 102 can be securely connected by means of the two clamping portions 10142 and the at least one first screw connection member.

[0066] Figure 9 An exemplary embodiment of the present application is shown. Figure 7 The cross-sectional view of the robot arm along the EE direction is shown.

[0067] In some embodiments, as Figure 9 As shown, the end of the adsorption portion 10143 having the connecting hole 10141 has at least one second threaded portion disposed adjacent to the connecting hole 10141. The second threaded portion extends in the second direction. The first sealing member 103 is disposed between the second threaded portion and the connecting hole 10141. The second direction intersects the first direction. The vacuum connector 1013 has at least one second through hole 10133 extending in the second direction. The adsorption assembly 1014 further includes at least one second threaded connector 10144. The second threaded connector 10144 passes through the second through hole 10133 and is threadedly engaged with the second threaded portion.

[0068] Exemplarily, one end of the adsorption portion 10143 having the communicating hole 10141 has at least one second threaded hole arranged adjacent to the communicating hole 10141 , and the second threaded portion is a thread in the second threaded hole.

[0069] Exemplarily, the second threaded connector 10144 is a screw or a bolt.

[0070] Exemplarily, there are multiple second threaded portions, and the multiple second threaded portions are arranged around the first sealing member 103 .

[0071] Exemplarily, the number of the second threaded portions is 2, 3 or 4.

[0072] In the above embodiment, the adsorption portion 10143 and the vacuum connector 1013 can be fixed to each other through the second threaded portion and the second screw connection 10144. By arranging the first sealing member 103 between the second threaded portion and the connecting hole 10141 instead of arranging the second threaded portion between the first sealing member 103 and the connecting hole 10141, air leakage at the position of the second threaded portion can be avoided.

[0073] In some embodiments, the end surface of the vacuum connector 1013 having the third opening 10132 has a first annular groove 10134 disposed around the third opening 10132 . The first sealing member 103 is annular in shape and is partially disposed in the first annular groove 10134 .

[0074] In the above embodiment, the first annular groove 10134 is provided to accommodate at least a portion of the first sealing member 103 , thereby stably fixing the first sealing member 103 .

[0075] In some embodiments, the outer wall of the vacuum connector 1013 has a second annular groove 10135 arranged along the circumference of the vacuum connector 1013, and the second seal 104 has a shape including an annular ring and is partially arranged in the second annular groove 10135.

[0076] For example, if there are multiple second seals 104, the multiple second seals 104 are arranged in sequence along the extension direction of the vacuum connector 1013, and correspondingly, there are multiple second annular grooves 10135 arranged in sequence along the extension direction of the vacuum connector 1013, so that each second annular groove 10135 can accommodate at least part of a corresponding second seal 104.

[0077] In the above embodiments, by arranging the second annular groove 10135 to accommodate at least part of the second seal 104, the second seal 104 can be stably fixed.

[0078] Figure 12 Fig. 1 shows a structural schematic diagram of a semiconductor device provided by an example embodiment of the present application, and the semiconductor device 300 includes a plating device.

[0079] Based on the same concept, as Figure 12 As shown, the semiconductor device 300 provided by the embodiments of the present application further includes at least one plating cavity assembly 301, the plating cavity assembly 301 includes a plating cavity 3011 and a clamp 200 arranged above the plating cavity 3011, the clamp 200 can fix a substrate and carry the substrate to the plating liquid in the plating cavity 3011 to perform a plating process, and the semiconductor device 300 further includes a robot 100 as in the above embodiments, which can place or take out the substrate in / from the clamp 200.

[0080] Figure 10 Fig. 2 shows a flowchart of an adjusting method of a robot provided by an example embodiment of the present application.

[0081] Based on the same concept, as Figure 10 As shown, the adjusting method of the robot provided by the embodiments of the present application is applied to the robot of any one of the above embodiments, and the adjusting method of the robot provided by the embodiments of the present application includes the following step 1001.

[0082] Step 1001, moving the moving part of the robot relative to the fixed part of the robot to change the extension length of the moving part, so that the moving part can correspondingly match the clamp to place or take out the substrate in / from the clamp.

[0083] Wherein, before and after the moving part moves relative to the fixed part, the substrate suction passage formed by the moving part and the fixed part is in a sealed state.

[0084] Figure 11 1 is a flow chart of a method for moving a mobile part of a manipulator relative to a fixed part of the manipulator provided by an exemplary embodiment of the present application.

[0085] In some embodiments, the fixed portion 102 has a first opening 1022 connected to the second air channel 1021, the first air channel 1012 includes a first sub-air channel 10121 and a second sub-air channel 10122, the movable portion 101 includes a vacuum connector 1013 and an adsorption assembly 1014, the vacuum connector 1013 at least partially extends from the first opening 1022 into the second air channel 1021, the vacuum connector 1013 has a first sub-air channel 10121 and a second opening 10131 and a third opening 10132 connected to the first sub-air channel 10121, the second opening 10131 is located in the second air channel 1021, the first sub-air channel 10121 is connected to the second air channel 1021 through the second opening 10131, and the adsorption assembly 1014 has adsorption holes 10111, a second The sub-air channel 10122 and the connecting hole 10141, the second sub-air channel 10122 is connected with the adsorption hole 10111 and the connecting hole 10141, the adsorption component 1014 has one end with the connecting hole 10141 connected to the end of the vacuum connector 1013 with the third opening 10132, the second sub-air channel 10122 is connected with the first sub-air channel 10121 through the connecting hole 10141 and the third opening 10132, the manipulator also includes a first seal 103, the first seal 103 is arranged between the end face of the adsorption component 1014 with the connecting hole 10141 and the end face of the vacuum connector 1013 with the third opening 10132, and is arranged around the third opening 10132, and is configured to seal the gap between the third opening 10132 and the connecting hole 10141. Among them, the adsorption component 1014 includes two clamping parts 10142, at least one first screw connection and an adsorption part 10143. The two clamping parts 10142 are respectively arranged on both sides of the vacuum connector 1013 and the fixed part 102 with the first opening 1022 in the first direction. One clamping part 10142 has at least one first through hole 101422 extending along the first direction, and the other clamping part 10142 has at least one first threaded part extending along the first direction. The first direction is parallel to the end face of the fixed part 102 with the first opening 1022. The first screw connection passes through the first through hole 101422 and is screwed with the first threaded part. The adsorption part 10143 is arranged on the side of the vacuum connector 1013 away from the fixed part 102 and is connected to the two clamping parts 10142. The adsorption part 10143 has an adsorption hole 10111, a second sub-air channel 10122 and a connecting hole 10141. The specific structure here is detailed in the above embodiments and will not be described again here.

[0086] Among them, such as Figure 11As shown, when the moving part 101 of the manipulator is moved relative to the fixed part 102 of the manipulator, the following steps 1101 to 1103 may be performed.

[0087] Step 1101: Remove the first screw connection component from the first through hole and the first threaded portion.

[0088] Through step 1101 , the entirety of the vacuum connector 1013 , the clamping portion 10142 , and the adsorption portion 10143 can be released from the fixing portion 102 .

[0089] Step 1102 : Move the vacuum connector, the clamping portion, and the adsorption portion relative to the fixing portion in a direction perpendicular to the first opening.

[0090] For example, the direction perpendicular to the first opening 1022 may be the same as the aforementioned second direction and the extending direction of the vacuum connector 1013 .

[0091] Step 1103: Pass the first screw-connecting member through the first through hole and screw-connect it to the first threaded portion.

[0092] Through step 1103 , the vacuum connector 1013 , the clamping portion 10142 , and the adsorption portion 10143 can be fixed to the fixing portion 102 .

[0093] The basic principles of the present application have been described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, and effects mentioned in this application are merely illustrative and not restrictive, and it should not be assumed that these advantages, strengths, and effects are required of each embodiment of this application. In addition, the specific details disclosed above are merely illustrative and facilitating understanding, and are not restrictive. The above details do not limit this application to necessarily being implemented using the above specific details.

[0094] The block diagrams of the devices, devices, equipment, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As will be appreciated by those skilled in the art, these devices, devices, equipment, and systems can be connected, arranged, or configured in any manner. Words such as "include," "comprise," "have," and the like are open-ended words, meaning "including but not limited to," and can be used interchangeably therewith. The words "or" and "and" used herein refer to the words "and / or" and can be used interchangeably therewith, unless the context clearly indicates otherwise. The word "such as" used herein refers to the phrase "such as but not limited to," and can be used interchangeably therewith.

[0095] It should also be noted that in the apparatus, device, and method of the present application, each component or each step can be decomposed and / or recombined, and such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0096] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0097] The above description has been provided for the purpose of illustration and description. Furthermore, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although a number of example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A robot arm, provided in a semiconductor device, for placing a substrate into a fixture of the semiconductor device or removing the substrate from the fixture, characterized in that: The manipulator comprises a moving part and a fixed part, wherein the moving part is sealedly connected to the fixed part; The end of the movable portion is provided with an adsorption end capable of adsorbing the substrate, the adsorption end is provided with an adsorption hole, and the movable portion is formed with a through first air channel, the first air channel is connected to the adsorption hole; A second air channel is formed inside the fixing portion, the second air channel is connected to the first air channel, and is connected to the adsorption hole through the first air channel, so that the second air channel, the first air channel and the adsorption hole form a substrate adsorption channel for adsorbing the substrate; The movable portion is movable relative to the fixed portion to change the extension length of the movable portion, so that the movable portion can be matched with the clamp to place the substrate in the clamp or remove the substrate from the clamp; Before and after the moving portion moves relative to the fixed portion, the substrate adsorption channel formed by the moving portion and the fixed portion is in a sealed state.

2. The manipulator according to claim 1, characterized in that: The fixing portion has a first opening communicating with the second air channel, and the first air channel includes a first sub-air channel and a second sub-air channel; Wherein, the moving part includes: a vacuum connecting piece, at least partially extending from the first opening into the second air channel, the vacuum connecting piece having the first sub-air channel and a second opening and a third opening communicating with the first sub-air channel, the second opening being located within the second air channel, and the first sub-air channel communicating with the second air channel through the second opening; an adsorption assembly, the adsorption assembly comprising the adsorption hole, the second sub-air channel, and a communicating hole, the second sub-air channel being in communication with the adsorption hole and the communicating hole, an end of the adsorption assembly having the communicating hole being connected to an end of the vacuum connector having the third opening, the second sub-air channel being in communication with the first sub-air channel via the communicating hole and the third opening; Wherein, the manipulator further comprises: The first sealing member is arranged between the end surface of the adsorption component having the communicating hole and the end surface of the vacuum connecting member having the third opening, and is arranged around the third opening, and is configured to seal the gap between the third opening and the communicating hole.

3. The manipulator according to claim 2, characterized in that: Also includes: At least one second sealing member is disposed between the inner wall of the second air channel and the outer side surface of one end of the vacuum connecting member having the second opening, and is configured to seal the gap between the inner wall of the second air channel and the vacuum connecting member.

4. The manipulator according to claim 3, characterized in that: There are multiple second sealing members, and the multiple second sealing members are arranged in sequence along the extending direction of the vacuum connecting member.

5. The manipulator according to claim 3 or 4, characterized in that: The maximum distance that the movable portion moves away from the fixed portion is a target distance between the second sealing member closest to the first opening and the end surface of the fixed portion having the first opening, wherein the target distance ranges from 0 mm to 30 mm.

6. The robot according to claim 5, characterized in that: The vacuum connection comprises: an extending portion, at least partially extending from the first opening into the second airway; an abutting portion, located on a side of the extending portion away from the fixing portion, located between the adsorption assembly and the fixing portion, and connected to the extending portion; Wherein, when the extending portion is entirely located in the second air passage and the abutting portion abuts against the fixing portion, the target distance is 30 mm; When the second sealing member closest to the first opening and the end surface of the fixing portion having the first opening are located at the same position in the extending direction of the vacuum connector, the target distance is 0 mm.

7. The manipulator according to any one of claims 2 to 4, characterized in that: The adsorption component includes: Two clamping parts are provided on both sides of the vacuum connector and the end of the fixing part having the first opening in the first direction, one of the clamping parts has at least one first through hole extending along the first direction, and the other clamping part has at least one first threaded part extending along the first direction, and the first direction is parallel to the end surface of the fixing part having the first opening; at least one first screw connection member, the first screw connection member passing through the first through hole and being screwed to the first threaded portion; The adsorption part is arranged on a side of the vacuum connector away from the fixing part and connected to the two clamping parts. The adsorption part has the adsorption hole, the second sub-air channel and the communication hole.

8. The robot according to claim 7, characterized in that: The end of the adsorption portion having the communicating hole has at least one second threaded portion disposed adjacent to the communicating hole, the second threaded portion extending along a second direction, the first sealing member being disposed between the second threaded portion and the communicating hole, the second direction intersecting the first direction, and the vacuum connector having at least one second through hole extending along the second direction; Wherein, the adsorption component further includes: At least one second screw connection member passes through the second through hole and is screwed to the second threaded portion.

9. The robot according to claim 3 or 4, characterized in that: The end surface of the vacuum connecting piece having the third opening has a first annular groove arranged around the third opening, and the first sealing piece has a ring shape and is partially arranged in the first annular groove; And / or, the outer wall of the vacuum connecting piece has a second annular groove arranged along the circumference of the vacuum connecting piece, and the second sealing piece has a ring shape and is partially arranged in the second annular groove.

10. A semiconductor device comprising at least one electroplating chamber assembly, wherein the electroplating chamber assembly comprises an electroplating chamber and a fixture disposed above the electroplating chamber, wherein the fixture is capable of fixing a substrate and carrying the substrate to a plating solution in the electroplating chamber to perform an electroplating process, wherein: The invention further comprises a robot arm according to any one of claims 1 to 9, which is capable of placing a substrate into the clamp or removing the substrate from the clamp.

11. A method for adjusting a manipulator, characterized in that: The robot arm according to any one of claims 1 to 9 comprises: Moving the movable portion of the manipulator relative to the fixed portion of the manipulator to change the extension length of the movable portion so that the movable portion can be matched with the fixture to place a substrate in the fixture or remove the substrate from the fixture; Before and after the moving part moves relative to the fixed part, the substrate adsorption channel formed by the moving part and the fixed part is in a sealed state.

12. The method for adjusting a manipulator according to claim 11, characterized in that: The fixing portion has a first opening communicating with the second air channel, the first air channel including a first sub-air channel and a second sub-air channel, the movable portion including a vacuum connector and an adsorption assembly, the vacuum connector at least partially extending from the first opening into the second air channel, the vacuum connector having the first sub-air channel and a second opening and a third opening communicating with the first sub-air channel, the second opening being located in the second air channel, the first sub-air channel communicating with the second air channel through the second opening, the adsorption assembly having an adsorption hole, the second sub-air channel and a communicating hole, the second sub-air channel communicating with the adsorption hole and the communicating hole, one end of the adsorption assembly having the communicating hole is connected to one end of the vacuum connector having the third opening, the second sub-air channel communicating with the first sub-air channel through the communicating hole and the third opening, the manipulator further including a first sealing member, the first sealing member being arranged between an end surface of the adsorption assembly having the communicating hole and an end surface of the vacuum connector having the third opening, and being arranged around the third opening, and being configured to seal a gap between the third opening and the communicating hole; wherein the adsorption assembly comprises two clamping parts, at least one first screw connection and an adsorption part, the two clamping parts are arranged on both sides of the vacuum connector and the fixing part having the first opening in the first direction, one of the clamping parts has at least one first through hole extending along the first direction, the other clamping part has at least one first threaded part extending along the first direction, the first direction is parallel to the end face of the fixing part having the first opening, the first screw connection passes through the first through hole and is screwed with the first threaded part, the adsorption part is arranged on a side of the vacuum connector away from the fixing part and is connected to the two clamping parts, the adsorption part has the adsorption hole, the second sub-air channel and the communicating hole; Wherein, moving the movable part of the manipulator relative to the fixed part of the manipulator comprises: removing the first threaded member from the first through hole and the first threaded portion; moving the vacuum connector, the clamping portion, and the adsorption portion relative to the fixing portion in a direction perpendicular to the first opening; The first screw member is passed through the first through hole and is screwed to the first threaded portion.

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