Semiconductor chip solder paste brushing equipment

Abstract

The invention discloses semiconductor chip solder paste brushing equipment, which relates to the field of semiconductor chip production and comprises a support frame, a paste brushing assembly and a material conveying assembly, the paste brushing assembly comprises a shaving assembly arranged at one end of the supporting frame, and a coating assembly is arranged on the side face of the shaving assembly; the material conveying assembly comprises a lifting assembly arranged at the bottom end of the supporting frame, and the top end of the lifting assembly is fixedly connected with a moving assembly. The shaving assembly comprises a driving part, an adjusting part and a shaver part, the driving part is arranged at one end of the supporting frame, the output end of the driving part is fixedly connected with the adjusting part, and the side face of the adjusting part is fixedly connected with the shaver part; the coating assembly comprises a sliding part, a brushing part and a material spraying part, the sliding part is arranged on the side face of the razor part, the middle of the sliding part is fixedly connected with the brushing part, and the material spraying part is arranged on the side face of the brushing part. According to the solder paste coating device, the solder paste can be uniformly coated on the semiconductor chip and redundant solder paste can be scraped off, so that the production efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor chip production, and particularly relates to a semiconductor chip tin paste brushing equipment. BACKGROUND

[0002] Semiconductor chips are tiny electronic components made of semiconductor materials, usually silicon, and are widely used in various electronic devices such as computers, mobile phones, televisions, and cars. They play an important role in microelectronics as the core part of integrated circuits (ICs), controlling various electronic functions. In the production process of semiconductor chips, tin paste coating is a crucial step that directly affects the welding and assembly quality of the chips.

[0003] The existing tin paste coating equipment uses a brush to evenly coat the tin paste, which causes the excess tin paste to be unable to be effectively scraped off, resulting in the accumulation of excess tin paste, which cannot be further evenly coated, making the tin paste coating equipment inefficient in removing excess tin paste, causing waste and unnecessary residue. The residual tin paste not only affects the welding quality of the chips, but also leads to an increase in the failure rate in subsequent production, reducing production efficiency. SUMMARY

[0004] The purpose of the present application is to provide a semiconductor chip tin paste brushing equipment that solves the problem of uneven tin paste coating on the semiconductor chip and the inability to scrape off excess tin paste, reducing production efficiency.

[0005] To achieve this purpose, the present application adopts the following technical solutions: A semiconductor chip tin paste brushing equipment, comprising: a support frame, a paste brushing assembly, and a material conveying assembly; The paste brushing assembly comprises a material shaving assembly arranged at one end of the support frame, and a coating assembly arranged on the side of the material shaving assembly; The material conveying assembly comprises a lifting assembly arranged at the bottom end of the support frame, and a moving assembly fixedly connected to the top end of the lifting assembly; The material shaving assembly comprises a driving part, an adjusting part, and a shaving part, the driving part is arranged at one end of the support frame, the output end of the driving part is fixedly connected with the adjusting part, and the side of the adjusting part is fixedly connected with the shaving part; The coating assembly comprises a sliding part, a brushing part, and a material spraying part, the sliding part is arranged on the side of the shaving part, the middle part of the sliding part is fixedly connected with the brushing part, and the material spraying part is arranged on the side of the brushing part.

[0006] Preferably, the adjusting part comprises a moving frame, a second rack and a rotating gear, the moving frame is slidably connected to one end of the supporting frame, the first rack is fixedly connected to the top end of the moving frame, the first rack is engaged with the rotating gear, the rotating gear is engaged with the second rack, the first rack is provided with a first telescopic rod on the side, and the second rack is provided with a second telescopic rod on the side.

[0007] Preferably, the razor part comprises a first razor and a second razor, the first telescopic rod and the second telescopic rod are respectively fixedly connected with the first razor and the second razor at the bottom end.

[0008] Preferably, the driving part comprises a first telescopic cylinder, a connecting rod and a rotating rod, the first telescopic cylinder is fixedly connected to the top end of the supporting frame, the telescopic end of the first telescopic cylinder is fixedly connected with the connecting rod, the first driving motor is arranged above the first telescopic cylinder, the output end of the first driving motor is fixedly connected with the rotating rod, and the bottom end of the rotating rod is fixedly connected with the rotating gear.

[0009] Preferably, the material spraying part comprises a tin paste cylinder, a material conveying pipe and a pressure spray head, the tin paste cylinder is fixedly connected to the top end of the sliding frame, the tin paste cylinder is fixedly connected with the material conveying pipe on the side, and one end of the material conveying pipe is fixedly connected with the pressure spray head.

[0010] Preferably, the brushing part comprises a brush, a second telescopic cylinder and a pushing rod, the top end of the sliding frame is fixedly connected with the second telescopic rod, the telescopic end of the second telescopic cylinder is fixedly connected with the pushing rod, and the bottom end of the pushing rod is fixedly connected with the brush.

[0011] Preferably, the sliding part comprises a sliding frame and a receiving plate, the bottom end of the sliding frame is slidably connected with the supporting frame, the top end of the sliding frame is fixedly connected with the receiving plate, and the connecting rod is fixedly connected through the moving frame and the sliding frame.

[0012] Preferably, the lifting assembly comprises a third driving motor, a first screw rod and a first sliding rail frame, the third driving motor is arranged at the bottom end of the supporting frame, the output end of the third driving motor is fixedly connected with the first screw rod, and the bottom end of the first screw rod is threadedly connected with the first sliding rail frame.

[0013] Preferably, the moving assembly includes: a third drive motor, a second screw and a third screw, the third drive motor is arranged at the top of the first slide rail frame, the output end of the third drive motor is fixedly connected to the second screw, the surface of the second screw is threadedly connected to the second slide rail frame, the side of the second slide rail frame is provided with a fourth drive motor, the output end of the fourth drive motor is fixedly connected to the third screw, the surface of the third screw is threadedly connected to the material transport plate, the bottom end of the second slide rail frame is fixedly connected to the first sliding block, the bottom end of the first sliding block is slidably connected to the first slide rail frame, the bottom end of the material transport plate is fixedly connected to the second sliding block, and the bottom end of the second sliding block is slidably connected to the second slide rail frame.

[0014] Preferably, a perforated rack is provided above the material transport plate.

[0015] Compared with the prior art, the present invention has the following beneficial effects: When brushing solder paste, the semiconductor chip is manually placed into the moving component of the material transport component, and then the lifting component is started, so that the lifting component drives the moving component to move upward to the hole rack for fitting, and then the shaving component of the paste brushing component is started, so that the driving part of the shaving component starts to drive the razor part and the sliding part of the coating component, so that the sliding part drives the brushing part and the spraying part to slide synchronously on the support frame, and then the spraying part is started, so that the spraying part sprays solder paste onto the brushing part, and then the brushing part is started, so that the brushing part starts to apply coating to the conductor chip and scrapes off the excess residual solder paste on the hole rack to ensure that the cleanliness of the hole rack is high enough, and at the same time the driving part drives the adjusting part to move, so that the adjusting part drives the razor part to perform staggered scraping, which solves the problem of not being able to evenly apply solder paste on the semiconductor chip and scraping off excess solder paste, thereby reducing production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] The structures, proportions, sizes, etc. depicted in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not intended to limit the conditions under which the present invention can be implemented and therefore have no substantive technical significance. Any structural modifications, changes in proportional relationships, or adjustments in size should still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and objectives that can be achieved by the present invention.

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 The structure schematic diagram of the sliding frame, tin paste cylinder and pressure spray head of the present application; Figure 3 The structure schematic diagram of the sliding frame, tin paste cylinder and pressure spray head of the present application; Figure 2 The local structure schematic diagram of the present application; Figure 4 The structure schematic diagram of the third driving motor, second driving motor and first screw rod of the present application; Figure 5 The structure schematic diagram of the first sliding block, first sliding rail frame and second sliding rail frame of the present application.

[0019] Illustration: 1, support frame; 2, paste brushing assembly; 3, material conveying assembly; 4, hole frame; 210, material shaving assembly; 2110, driving part; 2111, first telescopic cylinder; 2112, first driving motor; 2113, connecting rod; 2114, rotating rod; 2120, adjusting part; 2121, moving frame; 2122, first telescopic rod; 2123, second telescopic rod; 2124, first rack; 2125, second rack; 2126, rotating gear; 2130, shaving part; 2131, first shaving cutter; 2132, second shaving cutter; 220, coating assembly; 2210, sliding part; 2211, sliding frame; 2212, receiving plate; 2220, brushing part; 2221, brush; 2222, second telescopic cylinder; 2223, pushing rod; 2230, material spraying part; 2231, tin paste cylinder; 2232, material conveying pipe; 2233, pressure spray head; 310, lifting assembly; 311, second driving motor; 312, first screw rod; 313, first sliding rail frame; 320, moving assembly; 321, third driving motor; 322, second screw rod; 323, first sliding block; 324, second sliding rail frame; 325, second sliding block; 326, fourth driving motor; 327, third screw rod; 328, material conveying plate. DETAILED DESCRIPTION

[0020] In order to make the invention purpose, features and advantages of the present application more obvious and easy to understand, the technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the embodiments described below are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0021] In the description of the present application, it should be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there can be a component disposed therebetween.

[0022] The technical solutions of the present application will be further illustrated below in conjunction with the drawings and through specific embodiments.

[0023] The semiconductor chip tin paste brushing equipment is suitable for the production process of semiconductor chips, especially in the assembly and welding stages of the chips. Brushing tin paste is a crucial link that directly affects the welding quality and final performance of the chips. The main function of the equipment is to accurately and uniformly apply tin paste to the welding area of the chip, ensuring the stability and reliability of the welding. It is especially suitable for automated production lines, which can greatly improve production efficiency and production precision, and reduce errors and inconsistencies caused by manual operation; semiconductor chips are an important basic component in microelectronic technology, usually made of semiconductor materials such as silicon. It integrates a large number of electronic components on a tiny chip through integrated circuits (IC), and these electronic components perform various functions through complex circuit connections. Semiconductor chips are widely used in computers, mobile phones, cars, home appliances and various electronic devices, and are the core of modern electronic industry and technological development.

[0024] Reference Figures 1-5 As shown in the drawings, the semiconductor chip tin paste brushing equipment provided by the embodiment of the present application comprises a support frame 1, a paste brushing assembly 2 and a material conveying assembly 3. The paste brushing assembly 2 comprises a material shaving assembly 210 arranged at one end of the support frame 1, and a coating assembly 220 arranged on the side surface of the material shaving assembly 210. The material conveying assembly 3 comprises a lifting assembly 310 arranged at the bottom end of the support frame 1, and a moving assembly 320 fixedly connected to the top end of the lifting assembly 310. The material shaving assembly 210 comprises a driving part 2110, an adjusting part 2120 and a razor part 2130. The driving part 2110 is arranged at one end of the support frame 1, the output end of the driving part 2110 is fixedly connected with the adjusting part 2120, and the side surface of the adjusting part 2120 is fixedly connected with the razor part 2130. The coating assembly 220 comprises a sliding part 2210, a brushing part 2220 and a spraying part 2230, the sliding part 2210 is arranged at the side of the razor part 2130, the middle part of the sliding part 2210 is fixedly connected with the brushing part 2220, and the spraying part 2230 is arranged at the side of the brushing part 2220.

[0025] The brushing assembly 2 is mainly used for brushing the solder paste on the semiconductor chip, the conveying assembly 3 is mainly used for conveying the semiconductor chip, the shaving assembly 210 is used for scraping the excess residual solder paste, the lifting assembly 310 is used for lifting the height of the semiconductor chip, and the moving assembly 320 is used for conveying the semiconductor chip. The semiconductor chip is manually placed into the moving assembly, then the lifting assembly 310 is started to drive the moving assembly 320 to move upward to the hole frame 4 to be attached, the driving part 2110 of the shaving assembly 210 is started to drive the razor part 2130 and the sliding part 2210 of the coating assembly 220, the sliding part 2210 drives the brushing part 2220 and the spraying part 2230 to synchronously slide on the support frame 1, then the spraying part 2230 sprays the solder paste to the brushing part 2220, the brushing part 2220 is started to start coating the conductor chip and scraping the excess residual solder paste on the hole frame 4, the driving part 2110 drives the adjusting part 2120 to move, the adjusting part 2120 drives the razor part 2130 to staggeringly scrape, and the adjusting part is used for driving the coating assembly 220 and the razor part 2130 to slide on the support frame 1 under the driving of the driving part 2110. When brushing the solder paste, the semiconductor chip is manually placed into the moving assembly 320 of the conveying assembly 3, then the lifting assembly 310 is started to drive the moving assembly 320 to move upward to the hole frame 4 to be attached, the shaving assembly 210 of the brushing assembly 2 is started, the driving part 2110 of the shaving assembly 210 drives the razor part 2130 and the sliding part 2210 of the coating assembly 220, the sliding part 2210 drives the brushing part 2220 and the spraying part 2230 to synchronously slide on the support frame 1, then the spraying part 2230 sprays the solder paste to the brushing part 2220, then the brushing part 2220 is started, so that the brushing part 2220 starts to coat the conductor chip and scrapes the excess residual solder paste on the hole frame 4, ensures the cleanliness of the hole frame 4, the driving part 2110 drives the adjusting part 2120 to move, the adjusting part 2120 drives the razor part 2130 to staggeringly scrape, and the problem that the solder paste cannot be uniformly coated on the semiconductor chip and the excess solder paste is scraped is solved, and the production efficiency is reduced.

[0026] Reference Figure 1 , Figure 2 With Figure 3As shown, the adjusting part 2120 comprises a moving frame 2121, a second rack 2125 and a rotating gear 2126, the moving frame 2121 is slidingly connected to one end of the support frame 1, the top end of the moving frame 2121 is fixedly connected with a first rack 2124, the first rack 2124 is engaged with the rotating gear 2126, the rotating gear 2126 is engaged with the second rack 2125, the side of the first rack 2124 is provided with a first telescopic rod 2122, and the side of the second rack 2125 is provided with a second telescopic rod 2123; the adjusting part 2120 is matched with the moving frame 2121, the rack and the rotating gear 2126, so that the razor part 2130 can realize accurate staggered scraping during the scraping process. The technical design can ensure that the movement trajectory of the razor matches the actual demand in the shaving process, avoiding the common problems of uneven scraping or tin paste residue in traditional technology. More importantly, the cooperative working mechanism of the first telescopic rod 2122 and the second telescopic rod 2123 enables the razor to realize efficient and stable up-down movement, thereby ensuring accurate and effective scraping operation each time, making the scraping process more accurate and controllable, and thus improving the coating effect; the greatest advantage of this technical effect is that it can effectively remove excess tin paste, ensure the cleanliness of the chip surface, and improve the quality of the subsequent welding process. Through accurate scraping, the scraping assembly 210 not only avoids waste of tin paste, but also prevents tin paste residue, which has a significant effect on improving the pass rate and production efficiency of semiconductor chips.

[0027] When brushing tin paste, the driving part 2110 drives the moving frame 2121 to slide on the support frame 1, and at the same time, the driving part 2110 drives the first rack 2124 to move downward by engagement, and the driving part 2110 drives the second rack 2125 to move upward by engagement, so that the first rack 2124 and the second rack 2125 respectively drive the razor part 2130 to stagger and scrape, while the razor part 2130 is scraped, the razor part 2130 is stressed and compressed by the spring, so that the spring drives the first telescopic rod 2122 and the second telescopic rod 2123 to extend and retract, and the first telescopic rod 2122 and the second telescopic rod 2123 drive the razor part 2130 to move up and down.

[0028] Reference Figure 1 With Figure 2 As shown, the razor part 2130 comprises a first razor 2131 and a second razor 2132, and the bottom end of the first telescopic rod 2122 and the second telescopic rod 2123 is respectively fixedly connected with the first razor 2131 and the second razor 2132.

[0029] When the first and second razors 2131 and 2132 are scraping, the first rack 2124 drives the first razor 2131 to move downward to scrape the tin paste, and at the same time, the first razor 2131 extrudes the spring and drives the first telescopic rod 2122 to extend and retract, when the second rack 2125 moves downward, the first rack 2124 drives the first razor 2131 to move upward, so that the first telescopic rod 2122 and the spring are reset by the rebound force, and at the same time, the second rack 2125 drives the second razor 2132 to move downward to scrape the tin paste, and the first razor 2131 extrudes the spring and drives the first telescopic rod 2122 to extend and retract.

[0030] With reference to Figure 1 、 Figure 2 and Figure 3 As shown, the driving part 2110 comprises a first telescopic cylinder 2111, a connecting rod 2113 and a rotating rod 2114, the first telescopic cylinder 2111 is fixedly connected at the top end of the support frame 1, the telescopic end of the first telescopic cylinder 2111 is fixedly connected with the connecting rod 2113, the upper side of the first telescopic cylinder 2111 is provided with a first driving motor 2112, the output end of the first driving motor 2112 is fixedly connected with the rotating rod 2114, and the bottom end of the rotating rod 2114 is fixedly connected with the rotating gear 2126.

[0031] When brushing the tin paste, the first telescopic cylinder 2111 and the first driving motor 2112 are started, so that the telescopic end of the first telescopic cylinder 2111 starts to drive the connecting rod 2113, and at the same time, the output end of the first driving motor 2112 drives the rotating rod 2114 to rotate, and the rotating rod 2114 drives the rotating gear 2126 to rotate.

[0032] With reference to Figure 1 、 Figure 2 and Figure 4As shown, the material spraying part 2230 includes a tin paste cylinder 2231, a material conveying pipe 2232, and a pressure spray head 2233. The tin paste cylinder 2231 is fixedly connected to the top end of the sliding frame 2211, the side surface of the tin paste cylinder 2231 is fixedly connected with the material conveying pipe 2232, and one end of the material conveying pipe 2232 is fixedly connected with the pressure spray head 2233. Through the cooperation of the tin paste cylinder 2231, the material conveying pipe 2232, and the pressure spray head 2233, the accurate conveying and spraying of the tin paste are realized. In the device, the tin paste is guided to the material conveying pipe 2232 through the tin paste cylinder 2231, and then sprayed to the brushing part 2220 through the pressure spray head 2233, so as to ensure that the tin paste can be uniformly and accurately distributed to the surface of the chip. This structural design effectively avoids the problems of tin paste waste and uneven coating in traditional manual coating; through the efficient spraying of the pressure spray head 2233, the tin paste can uniformly cover the surface of the chip in a short time, improving the production efficiency. At the same time, the accurate spraying control reduces the residual tin paste that may be generated in the coating process, reduces the quality defects caused by uneven coating, and ensures the welding quality of each chip.

[0033] When brushing the tin paste, the tin paste is manually put into the tin paste cylinder 2231, then the vacuum air pump is started to suck the tin paste in the tin paste cylinder 2231 into the material conveying pipe 2232, and then sprayed from the pressure spray head 2233 to the brushing part 2220.

[0034] Reference Figure 1 , Figure 2 With Figure 4As shown, the brushing part 2220 includes a brush 2221, a second telescopic cylinder 2222, and a pushing rod 2223. The top end of the sliding frame 2211 is fixedly connected with the second telescopic rod 2123. The telescopic end of the second telescopic cylinder 2222 is fixedly connected with the pushing rod 2223. The bottom end of the pushing rod 2223 is fixedly connected with the brush 2221. The telescopic action of the second telescopic cylinder 2222 drives the pushing rod 2223, so that the brush 2221 moves accurately to the surface of the chip, thereby uniformly coating the solder paste on the chip. This design effectively solves the uneven problem in the traditional coating process, ensures that the surface of each chip can be uniformly and carefully coated, greatly improves the stability of production and the consistency of products; in addition, this structure of the brushing part 2220 also has high adjustability. By controlling the action of the telescopic cylinder, the brushing force can be adjusted according to the needs of different chips, to ensure that the effect of each coating can reach the predetermined quality standard. Compared with the traditional manual coating method, this technology can provide more accurate and efficient coating service in mass production, reduce the errors caused by manual operation, and also improve the production efficiency and product qualification rate. By optimizing the uniformity of coating and controlling the coating amount, this technology significantly improves the quality of solder paste coating, reduces the defective rate caused by improper solder paste coating, and ensures the soldering performance and long-term stability of the semiconductor chip.

[0035] When the solder paste is sprayed onto the brush 2221, the second telescopic cylinder 2222 is started, so that the extending end of the second telescopic cylinder 2222 drives the pushing rod 2223 to move, and the pushing rod 2223 pushes the brush 2221 downward to coat the semiconductor chip; Reference Figure 1 With Figure 4 As shown, the sliding part 2210 includes a sliding frame 2211 and a receiving plate 2212. The bottom end of the sliding frame 2211 is slidingly connected with the support frame 1. The top end of the sliding frame 2211 is fixedly connected with the receiving plate 2212. The connecting rod 2113 penetrates through the moving frame 2121 and is fixedly connected with the sliding frame 2211.

[0036] When the first telescopic cylinder 2111 pushes the connecting rod 2113 to move, the connecting rod 2113 drives the sliding frame 2211 and the moving frame 2121 to slide synchronously on the support frame 1, so that the sliding frame 2211 drives the receiving plate 2212 to move synchronously, and then the receiving plate 2212 drives the material spraying part 2230 to slide synchronously.

[0037] Reference Figure 1 , Figure 4 With Figure 5As shown, the lifting assembly 310 comprises a second driving motor 311, a first screw rod 312 and a first sliding rail frame 313, the third driving motor 321 is arranged at the bottom end of the support frame 1, the output end of the second driving motor 311 is fixedly connected with the first screw rod 312, and the bottom end of the first screw rod 312 is threadedly connected with the first sliding rail frame 313.

[0038] The second driving motor 311 drives the first screw rod 312 to rotate, so that the first screw rod 312 drives the first sliding rail frame 313 to move upwards, and the first sliding rail frame 313 drives the moving assembly to move upwards synchronously.

[0039] Reference Figure 1 , Figure 4 and Figure 5 As shown, the moving assembly comprises a third driving motor 321, a second screw rod 322 and a third screw rod 327, the third driving motor 321 is arranged at the top end of the first sliding rail frame 313, the output end of the third driving motor 321 is fixedly connected with the second screw rod 322, the surface of the second screw rod 322 is threadedly connected with a second sliding rail frame 324, the side surface of the second sliding rail frame 324 is provided with a fourth driving motor 326, the output end of the fourth driving motor 326 is fixedly connected with the third screw rod 327, the surface of the third screw rod 327 is threadedly connected with a material conveying plate 328, the bottom end of the second sliding rail frame 324 is fixedly connected with a first sliding block 323, the bottom end of the first sliding block 323 is slidably connected with the first sliding rail frame 313, the bottom end of the material conveying plate 328 is fixedly connected with a second sliding block, and the bottom end of the second sliding block is slidably connected with the second sliding rail frame 324.

[0040] The semiconductor chip is placed into the material conveying plate 328, and then the moving assembly is driven by the lifting assembly 310 to move upwards, when the lifting assembly 310 is lifted upwards, the third driving motor 321 is manually started, the third driving motor 321 drives the second screw rod 322 to rotate, the second screw rod 322 drives the second sliding rail frame 324 to move in the Y-axis direction on the first sliding rail frame 313 through the first sliding block 323, and the fourth driving motor 326 is started, the fourth driving motor 326 drives the third screw rod 327 to rotate, the third screw rod 327 drives the second sliding rail frame 324 to move in the X-axis direction on the second sliding rail frame 324 through the second sliding block.

[0041] Working principle: Before brushing tin paste, the support frame 1, the first drive motor 2112, the second drive motor 311, the third drive motor 321, the fourth drive motor 326, the first telescopic rod 2122, the second telescopic rod 2123, the connecting rod 2113, the rotating rod 2114, the receiving plate 2212 and the material spraying part 2230 are in the initial state; the first rack 2124 is engaged with the rotating gear 2126, and the rotating gear 2126 is engaged with the second rack 2125; the first sliding block 323 is slidingly connected with the first sliding frame 2211, and the second sliding block is slidingly connected with the second sliding frame 2211; the first screw rod 312 is slidingly connected with the first sliding rail frame 313, the second screw rod 322 is slidingly connected with the second sliding rail frame 324, and the third screw rod 327 is threadedly connected with the material conveying plate 328; During the brushing tin paste process, first, the semiconductor chip is placed on the material conveying plate 328, then the third drive motor 321 is started, the output end of the third drive motor 321 drives the first screw rod 312 to rotate, then the first screw rod 312 drives the first sliding rail frame 313 to move upward through the threaded connection, so that the first sliding rail frame 313 drives the moving assembly to move upward, when the moving assembly moves upward to a certain position, the third drive motor 321 is manually started, the output end of the third drive motor 321 drives the second screw rod 322 to rotate, then the second screw rod 322 drives the second sliding rail frame 324 to move in the Y-axis direction on the first sliding rail frame 313 through the first sliding block 323, at the same time, the fourth drive motor 326 is started, the fourth drive motor 326 drives the third screw rod 327 to rotate, the third screw rod 327 drives the second sliding rail frame 324 to move in the X-axis direction on the second sliding rail frame 324 through the second sliding block, so that the semiconductor chip on the material conveying plate 328 is moved in the X-axis and Y-axis directions.

[0042] When the tin paste is brushed, the first telescopic cylinder 2111 and the first driving motor 2112 are started, the telescopic end of the first telescopic cylinder 2111 starts to drive the connecting rod 2113, the tin paste is manually put into the tin paste cylinder 2231, the first driving motor 2112 is started, the output end of the first driving motor 2112 drives the rotating rod 2114 to rotate, the rotating rod 2114 drives the rotating gear 2126 to rotate, the connecting rod 2113 drives the moving frame 2121 to slide on the support frame 1, at the same time, the rotating rod 2114 drives the rotating gear 2126 to move downward through meshing, the driving part 2110 drives the second rack 2125 to move upward through meshing, the first rack 2124 and the second rack 2125 drive the first razor 2131 and the second razor 2132 to move upward and downward respectively, at the same time, the razor part 2130 is pressed to compress the spring, so that the spring drives the first telescopic rod 2122 and the second telescopic rod 2123 to extend and retract, the first telescopic rod 2122 and the second telescopic rod 2123 drive the first razor 2131 and the second razor 2132 to move upward and downward, at the same time, the connecting rod 2113 drives the sliding frame 2211 to slide on the support frame 1, so that the sliding frame 2211 drives the supporting plate 2212 to move synchronously, then the vacuum air pump is started to suck the tin paste in the tin paste cylinder 2231 into the conveying pipe 2232, then the tin paste is sprayed from the pressure nozzle 2233 to the brush 2221, and the second telescopic cylinder 2222 is started, the extending end of the second telescopic cylinder 2222 drives the pushing rod 2223 to move, so that the pushing rod 2223 pushes the brush 2221 downward to brush the semiconductor chip; After the tin paste is brushed, the first driving motor 2112 is turned off, the first driving motor 2112 stops driving the rotating rod 2114 to drive the rotating gear 2126 to rotate, the rotating gear 2126 stops driving the first rack 2124 and the second rack 2125 to move upward and downward through meshing, so that the first razor 2131 and the second razor 2132 stop moving upward and downward, the first telescopic cylinder 2111 is turned off, the first telescopic cylinder 2111 stops driving the moving frame 2121 and the sliding frame 2211 to slide synchronously on the support frame 1 through the connecting rod 2113, the second telescopic cylinder 2222 is turned off, the second telescopic cylinder 2222 stops driving the brush 2221 to move upward and downward through the pushing rod 2223, the second driving motor 311 is turned off, the second driving motor 311 stops driving the first sliding rail frame 313 to move upward and downward through the first screw rod 312, the third driving motor 321 is turned off, the third driving motor 321 stops driving the second sliding rail frame 324 to move in the Y-axis direction on the first sliding rail frame 313 to transport the semiconductor chip, and the fourth driving motor 326 is turned off, the fourth driving motor 326 stops driving the conveying plate 328 to move in the X-axis direction on the second sliding rail frame 324 to transport the semiconductor chip.

[0043] The above-described embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit the present application; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features can be replaced by equivalent replacements; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A semiconductor chip solder paste brushing device, characterized in that: include: Support frame (1), paste brushing assembly (2) and material transport assembly (3); The paste brushing assembly (2) comprises a shaving assembly (210) arranged at one end of the support frame (1), and a coating assembly (220) is arranged on the side of the shaving assembly (210); The material transport component (3) comprises a lifting component (310) arranged at the bottom end of the support frame (1), and a moving component (320) is fixedly connected to the top end of the lifting component (310); The shaving assembly (210) comprises: a driving portion (2110), an adjusting portion (2120) and a razor portion (2130); the driving portion (2110) is arranged at one end of the support frame (1); the output end of the driving portion (2110) is fixedly connected to the adjusting portion (2120); and the side surface of the adjusting portion (2120) is fixedly connected to the razor portion (2130); The coating assembly (220) comprises: a sliding portion (2210), a brushing portion (2220) and a spraying portion (2230); the sliding portion (2210) is arranged on the side of the razor portion (2130); the middle portion of the sliding portion (2210) is fixedly connected to the brushing portion (2220); and the spraying portion (2230) is arranged on the side of the brushing portion (2220).

2. A semiconductor chip solder paste brushing device according to claim 1, characterized in that: The adjusting portion (2120) comprises: a moving frame (2121), a second rack (2125) and a rotating gear (2126); the moving frame (2121) is arranged on one end of the supporting frame (1) for sliding connection; a first rack (2124) is fixedly connected to the top of the moving frame (2121); the first rack (2124) is meshed with the rotating gear (2126); the rotating gear (2126) is meshed with the second rack (2125); a first telescopic rod (2122) is arranged on the side of the first rack (2124); and a second telescopic rod (2123) is arranged on the side of the second rack (2125).

3. A semiconductor chip solder paste brushing device according to claim 2, characterized in that: The razor unit (2130) comprises a first razor (2131) and a second razor (2132), and the first razor (2131) and the second razor (2132) are fixedly connected to the bottom ends of the first telescopic rod (2122) and the second telescopic rod (2123), respectively.

4. A semiconductor chip solder paste brushing device according to claim 3, characterized in that: The driving part (2110) comprises: a first telescopic cylinder (2111), a connecting rod (2113) and a rotating rod (2114); the first telescopic cylinder (2111) is fixedly connected to the top of the support frame (1); the telescopic end of the first telescopic cylinder (2111) is fixedly connected to the connecting rod (2113); a first driving motor (2112) is provided above the first telescopic cylinder (2111); the output end of the first driving motor (2112) is fixedly connected to the rotating rod (2114); and the bottom end of the rotating rod (2114) is fixedly connected to the rotating gear (2126).

5. The semiconductor chip solder paste brushing device according to claim 4, characterized in that: The spraying part (2230) comprises: a solder paste cylinder (2231), a feeding pipe (2232) and a pressure nozzle (2233); the solder paste cylinder (2231) is fixedly connected to the top of the sliding frame (2211); the side of the solder paste cylinder (2231) is fixedly connected to the feeding pipe (2232); and one end of the feeding pipe (2232) is fixedly connected to the pressure nozzle (2233).

6. The semiconductor chip solder paste brushing device according to claim 4, characterized in that: The brushing portion (2220) comprises: a brush (2221), a second telescopic cylinder (2222) and a push rod (2223); the top end of the second razor (2132) is fixedly connected to the second telescopic rod (2123); the telescopic end of the second telescopic cylinder (2222) is fixedly connected to the push rod (2223); and the bottom end of the push rod (2223) is fixedly connected to the brush (2221).

7. The semiconductor chip solder paste brushing device according to claim 4, characterized in that: The sliding portion (2210) comprises a sliding frame (2211) and a receiving plate (2212), wherein the bottom end of the sliding frame (2211) is slidably connected to the support frame (1), the top end of the sliding frame (2211) is fixedly connected to the receiving plate (2212), and the connecting rod (2113) passes through the moving frame (2121) and is fixedly connected to the sliding frame (2211).

8. The semiconductor chip solder paste brushing device according to claim 1, characterized in that: The lifting assembly (310) comprises: a second drive motor (311), a first screw rod (312) and a first slide rail frame (313); the second drive motor (311) is arranged at the bottom end of the support frame (1); the output end of the second drive motor (311) is fixedly connected to the first screw rod (312); and the bottom end of the first screw rod (312) is threadedly connected to the first slide rail frame (313).

9. The semiconductor chip solder paste brushing device according to claim 8, characterized in that: The moving assembly (320) includes: a third driving motor (321), a second screw (322) and a third screw (327), wherein the third driving motor (321) is arranged at the top of the first slide rail frame (313), the output end of the third driving motor (321) is fixedly connected to the second screw (322), the surface of the second screw (322) is threadedly connected to the second slide rail frame (324), and the side of the second slide rail frame (324) is provided with a fourth driving motor (326), the output end of the fourth driving motor (326) is fixedly connected to the third screw (327), the surface of the third screw (327) is threadedly connected to the material transport plate (328), the bottom end of the second slide rail frame (324) is fixedly connected to the first sliding block (323), the bottom end of the first sliding block (323) is slidably connected to the first slide rail frame (313), the bottom end of the material transport plate (328) is fixedly connected to the second sliding block, and the bottom end of the second sliding block is slidably connected to the second slide rail frame (324).

10. The semiconductor chip solder paste brushing device according to claim 9, characterized in that: A perforated frame (4) is provided above the material transport plate (328).

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