A pin processing and forming device for electronic components

Abstract

The application relates to a pin processing and forming device for electronic components, which comprises an operation table, a driving belt rotatably arranged on the operation table, a plurality of bearing plates arranged on the driving belt and used for bearing electronic components, a detection mechanism arranged on the operation table and close to one side of the driving belt and used for detecting the electronic components on the bearing plates, and a forming mechanism used for pin forming of the electronic components. The application realizes automatic processing and forming of the pins of the electronic components, can effectively reduce manual intervention, improves processing precision and speed, and guarantees the processing quality of the pins of the electronic components.

Description

Technical Field

[0001] This application relates to the technical field of electronic component processing, and in particular to a pin forming apparatus for electronic components. Background Technology

[0002] Currently, the processing of electronic components is a crucial step. The quality of the processing and shaping of electronic component leads directly affects the soldering effect and electrical connection stability on the circuit board, playing a decisive role in the performance and reliability of the entire electronic product.

[0003] Traditionally, the molding and shaping of electronic component leads is primarily carried out using fully automated equipment. However, several problems can arise during the actual processing. During molding, leads may deform due to uneven stress, resulting in shapes that do not meet design requirements. During cutting, uneven cutting may occur, affecting the consistency of lead length. Furthermore, during the transportation and movement of electronic components, leads may be subjected to collisions or friction, leading to damage or misalignment, causing bending and affecting their electrical performance. Deformed leads may not be able to be accurately inserted into circuit board sockets, uneven cutting can lead to inconsistent lead lengths, affecting soldering quality and electrical connection stability, and surface damage may reduce lead conductivity, thus impacting the overall performance and reliability of the electronic product.

[0004] In view of the above-mentioned technologies, it is necessary to propose a pin forming apparatus for electronic components to solve one of the above-mentioned technical problems. Summary of the Invention

[0005] To address one of the aforementioned technical problems, this application provides a pin forming apparatus for electronic components.

[0006] This application provides a pin forming apparatus for electronic components, which adopts the following technical solution:

[0007] An apparatus for forming leads for electronic components, comprising:

[0008] An operating table, on which a drive belt is rotatably mounted, and a plurality of support plates are mounted on the drive belt for supporting electronic components;

[0009] A testing mechanism, located on the side near the drive belt, is positioned on the operating table for testing electronic components on the carrier plate; and

[0010] A molding mechanism for molding leads of electronic components includes a fixed frame near the drive belt, a molding stage on the fixed frame, a sliding block slidably disposed on the molding stage, and a pressure block disposed above the molding stage. A molding groove is provided on the top of the molding stage near the drive belt, and a sliding groove is provided through the bottom of the molding stage. The sliding block is slidably disposed within the sliding groove. A molded part is disposed on the top side of the sliding block corresponding to the molding groove. A positioning frame is provided on the top of the molding stage, and a lifting cylinder assembly is provided on the positioning frame. A combination plate is provided at the output end of the lifting cylinder assembly, and the output end of the lifting cylinder assembly is connected to the pressure block through the combination plate. The pressure block descends and moves to the molded part within the molding groove, thereby realizing the lead molding operation.

[0011] By adopting the above technical solution, electronic components are placed on a carrier plate and pass through the detection mechanism and forming mechanism in sequence as the drive belt rotates. The detection mechanism can accurately detect the electronic components on the carrier plate to ensure that the position of the components to be processed is accurate. Subsequently, the electronic components are sent to the forming mechanism, where a sliding block slides in the groove to move the formed part into the forming slot. The lifting cylinder group drives the pressure block to descend, and the pressure block cooperates with the formed part to perform a precise pressing operation on the pins of the electronic components. This solution not only improves the accuracy and efficiency of pin processing, but also effectively avoids the error and damage risks that may be caused by traditional manual operation, ensuring that the pin forming quality of electronic components is stable and reliable.

[0012] Optionally, a protective block is slidably disposed at the rear end of the molding stage corresponding to the molding groove. A V-shaped groove is disposed on the front end face of the protective block. A first driving cylinder and a second driving cylinder are disposed on the top side of the fixing frame away from the molding stage. A connecting member is disposed at the output end of the first driving cylinder and the second driving cylinder. The output end of the first driving cylinder is connected to the tail end of the protective block through the connecting member, so that the inner side of the V-shaped groove at the protective block abuts against the head of the electronic component and provides protection. The output end of the second driving cylinder is connected to the tail end of the sliding block through the connecting member. When the molding part on the sliding block is pressed and molded in the molding groove, the protective block forms a limit on the pins and head of the electronic component.

[0013] By adopting the above technical solution, the protective block set at the rear end of the forming stage can effectively protect the head of the electronic component during the pin forming process, avoiding damage to the head of the electronic component due to external force. The V-groove design on the front end of the protective block further enhances the protection effect on the head of the electronic component, ensuring its stability during processing. In addition, the setting of the first driving cylinder and the second driving cylinder enables precise control of the protective block and the sliding block, allowing the protective block to move flexibly as needed. It can also effectively limit the pin of the electronic component when the V-groove at the protective block, together with the forming part at the sliding block, is pressed and formed at the forming groove. This better adapts to electronic components of different sizes and shapes, improving the applicability and reliability of the device.

[0014] Optionally, an adjustment frame is provided below the fixed frame, and an adjustment cylinder assembly is provided on the adjustment frame. An adjustment plate is provided at the output end of the adjustment cylinder assembly, and the adjustment plate is connected to the bottom of the fixed frame.

[0015] By adopting the above technical solution, the connection between the adjusting frame and the fixed frame can be dynamically adjusted by adjusting the cylinder assembly, thereby adapting to the processing requirements of different heights.

[0016] Optionally, the detection mechanism includes a detection frame on the operating table and a light beam sensor for detection. The detection frame has a through groove corresponding to the top of the support plate. The light beam sensor is adjusted and locked in the through groove by a nut, so that the position of the light beam sensor in the through groove is adjusted and locked.

[0017] By adopting the above technical solution, the position of the light bar sensor can be flexibly adjusted in the through groove of the detection frame by means of a nut, and locked after being adjusted to the appropriate position. This design not only enables the detection mechanism to be accurately adapted according to the size and position differences of electronic components, but also effectively improves the accuracy and reliability of detection. At the same time, the adjustability of the position of the light bar sensor enhances the versatility of the device, making it suitable for the detection of electronic components of various specifications, thereby reducing production costs and improving work efficiency.

[0018] Optionally, it also includes a deflection adjustment mechanism for adjusting the position of electronic components on the carrier plate to realize pin processing of electronic components. The deflection adjustment mechanism includes a deflection correction frame disposed on one side of the operating table and a push block disposed on the deflection correction frame. A deflection correction cylinder assembly is disposed on the top of the deflection correction frame. A connecting plate is disposed on the output end of the deflection correction cylinder assembly. The connecting plate is connected to the push block to realize the push block to perform horizontal position adjustment of electronic components on the carrier plate.

[0019] By adopting the above technical solution, the alignment mechanism can accurately adjust the position of electronic components on the carrier plate, ensuring the accuracy of the electronic components' position during pin processing. The specific effects are as follows: the alignment frame and push block provide stable structural support for the position adjustment of electronic components. The alignment cylinder group drives the connecting plate and push block to move, achieving precise horizontal adjustment of electronic components, thereby avoiding pin processing defects caused by position deviation and improving the processing yield.

[0020] Optionally, a cutting mechanism is also included for cutting the pins of the formed electronic components. The cutting mechanism includes a cutting frame away from the forming mechanism, a cutter disposed above the cutting frame, and a receiving block disposed below the cutter on the cutting frame. A cutting cylinder is disposed on one side of the top of the cutting frame. The output end of the cutting cylinder is connected to the top of the cutter, driving the cutter to cooperate with the receiving block to cut the excess pins of the electronic components.

[0021] By adopting the above technical solution, the cutting mechanism can accurately cut the pins of the formed electronic components. Specifically, the cutting frame is set away from the forming mechanism to ensure that the cutting operation and the forming operation do not interfere with each other, thus improving work efficiency. The cutter is set above the cutting frame and cooperates with the receiving block below to form a stable cutting structure. When cutting is required, the output end of the cutting cylinder drives the cutter to move downward. The relative movement between the cutter and the receiving block can accurately cut off the excess pin portion, thereby ensuring the consistency of the length of the electronic component pins.

[0022] Optionally, a cutting clamping mechanism is provided at the rear end of the cutting frame and between the cutter and the receiving block for clamping and limiting the component head of the electronic component. The cutting clamping mechanism includes a cutting clamping cylinder provided at the rear end of the cutting frame, a drive hinge provided at the output end of the cutting clamping cylinder, and grippers for clamping the component head of the electronic component. The grippers are symmetrically arranged at the ends of the drive hinge. A limit frame is provided outside the cutting clamping cylinder for adjusting and limiting the drive hinge. The gripping and separating of the grippers is achieved by adjusting the opening and closing angle of the drive hinge through the output end of the cutting clamping cylinder.

[0023] By adopting the above technical solution, the cutting and clamping mechanism can clamp and limit the electronic component head during the cutting process, effectively preventing the electronic component from shaking or shifting during cutting, thereby improving cutting accuracy and stability. Specific effects include: the cutting and clamping cylinder drives the clamping jaws to open and close via the drive hinge, which can flexibly adapt to electronic component heads of different sizes; the setting of the limit frame ensures that the drive hinge remains stable during adjustment, preventing excessive opening and closing that could lead to clamping failure.

[0024] Optionally, the carrier plate is provided with symmetrical carrier grooves, and a number of magnetic pieces are provided in the carrier grooves. The magnetic pieces magnetically attract the pins of electronic components to prevent displacement during transportation.

[0025] By adopting the above technical solution, the magnetic sheet can effectively attract the pins of electronic components, preventing them from shifting during transportation, thereby improving the stability of the processing and reducing processing errors or damage caused by positional deviations.

[0026] Optionally, an anti-bending mechanism is also included to prevent the protruding portion of the electronic component's pin on the carrier plate from bending. The anti-bending mechanism includes an extension cylinder disposed on both sides of the carrier plate, a combination block installed at the output end of the extension cylinder, and a semi-arc block for partially enclosing the pin to prevent bending. The arc surface of the semi-arc block is on the same horizontal plane as the carrier groove. The semi-arc block is disposed above the combination block. The output end of the extension cylinder drives the combination block to extend, so that the semi-arc block adapts to the protruding length of the pin.

[0027] By adopting the above technical solution, the problem of the protruding part of the pin of electronic components being easily bent due to external factors during the processing is effectively solved. Specifically, the anti-bending mechanism, through the extension cylinders set on both sides of the support plate, can precisely adjust the position of the semi-arc block according to the length of the pin protrusion, ensuring that the semi-arc block always fits the pin protrusion. At the same time, the arc surface of the semi-arc block is at the same level as the support groove. This design can not only avoid interference between the pin and the edge of the support groove, but also achieve semi-enclosed support for the pin protrusion, thereby effectively preventing bending.

[0028] Optionally, a rotary motor is provided on the top of the assembly block, and a rotating disk is provided at the output end of the rotary motor. The bottom of the semi-arc block is connected to the end face of the rotating disk, so as to realize the pin support of electronic components with different horizontal angles to adapt the semi-arc block.

[0029] By adopting the above technical solution, the semi-circular block can adapt to support electronic component pins at different horizontal angles, effectively avoiding damage or bending of the pins due to angle deviation during processing; the rotary motor drives the rotary disk to rotate, thereby adjusting the semi-circular block to a suitable angle, ensuring stable support for the pins, and improving processing accuracy and yield.

[0030] In summary, this application includes at least one of the following beneficial technical effects:

[0031] 1. The drive belt is equipped with multiple carrier plates, each with symmetrical carrier grooves. Several magnetic pieces are distributed within the carrier grooves. These magnetic pieces can magnetically attract the pins of electronic components, effectively preventing the pins of electronic components from shifting during transportation. This ensures that the electronic components are in the correct position, providing a precise positioning basis for subsequent processing steps, thereby guaranteeing the accuracy of subsequent processing.

[0032] 2. The molding mechanism includes a fixed frame located near the drive belt, a molding stage mounted on the fixed frame, a sliding block that slides on the molding stage, and a pressure block located above the molding stage. A molding groove is provided on the top of the molding stage near the drive belt, and a molding part is provided on the top side of the sliding block corresponding to the molding groove. When the pressure block descends and engages with the molding part that has moved into the molding groove, it can perform precise molding operations on the pins of electronic components. This engagement method can make the pins more evenly stressed, reduce the deformation of the pins due to uneven stress, and significantly improve the molding quality of the pins.

[0033] 3. The cutting mechanism consists of a cutting frame located away from the forming mechanism, a cutter positioned above the cutting frame, and a receiving block positioned below the cutter on the cutting frame. A cutting cylinder on one side of the top of the cutting frame drives the cutter to move, so that the cutter, in conjunction with the receiving block, cuts off the excess electronic component pins after forming. This cutting method can ensure the neatness of the cut and ensure that the length of each pin is consistent. Attached Figure Description

[0034] Figure 1 This is a three-dimensional view of a pin forming apparatus for electronic components according to this application.

[0035] Figure 2 This is a top view of a pin forming apparatus for electronic components according to this application.

[0036] Figure 3 yes Figure 1 A magnified schematic diagram of the structure at point A in the middle.

[0037] Figure 4 This is a top view of a carrier plate for a pin forming apparatus for electronic components according to this application.

[0038] Figure 5 This is a first-view structural schematic diagram of the forming mechanism of a pin forming apparatus for electronic components in this application.

[0039] Figure 6 This is a second-view structural schematic diagram of the forming mechanism of a pin forming apparatus for electronic components in this application.

[0040] Figure 7 yes Figure 5 Enlarged schematic diagram of the structure at point B.

[0041] Figure 8 This is a schematic diagram of the mounting bracket of the alignment mechanism of a pin forming apparatus for electronic components in this application.

[0042] Figure 9 This is a schematic diagram of the alignment mechanism and the alignment frame of a pin forming apparatus for electronic components in this application.

[0043] Figure 10 This is a schematic diagram of the cutting mechanism of a pin forming apparatus for electronic components according to this application.

[0044] Figure 11 This is a schematic diagram of the cutting and clamping mechanism of a pin forming apparatus for electronic components according to this application.

[0045] Figure 12 This is a schematic diagram of the anti-bending mechanism of a pin forming apparatus for electronic components in this application.

[0046] In the diagram: 1. Operating table; 11. Drive belt; 12. Support plate; 121. Support groove; 122. Magnet piece; 13. Drive wheel; 14. Drive motor; 15. Drive component; 2. Detection mechanism; 21. Detection frame; 211. Through groove; 22. Light column sensor; 3. Forming mechanism; 31. Fixing frame; 311. First drive cylinder; 312. Second drive cylinder; 313. Connecting component; 32. Forming table; 321. Forming groove; 322. Slide groove; 323. Positioning frame; 324. Lifting cylinder assembly; 325. Combination plate; 33. Sliding block; 331. Formed part; 34. Pressing block; 35. Protective block; 351. V-groove; 36. Adjusting frame; 361. Adjusting cylinder assembly; 362. Adjustment 4. Plate; 41. Adjustment mechanism; 42. Correction frame; 43. Push block; 44. Correction cylinder assembly; 45. Connecting plate; 46. Mounting frame; 47. Vertical cylinder; 48. Positioning plate; 49. Horizontal cylinder; 50. Horizontal bar; 51. Splitting fork rod; 52. Cutting mechanism; 53. Cutting frame; 54. Cutting blade; 55. Receiving block; 56. Cutting cylinder; 57. Cutting clamping mechanism; 58. Cutting clamping cylinder; 59. Cutting clamping mechanism; 50. Cutting clamping mechanism; 51. Cutting clamping cylinder; 52. Drive hinge; 53. Gripper; 54. Limiting frame; 6. Anti-bending mechanism; 61. Extension cylinder; 62. Combination block; 63. Semi-arc block; 64. Rotary motor; 65. Rotary disk; 7. Waste collection bin; 71. Telescopic cylinder; 72. Matching plate; 73. Waste clamping mechanism. Detailed Implementation

[0047] The following is in conjunction with the accompanying drawings. Figures 1-12 This application will be described in further detail.

[0048] Example 1, Reference Figures 1-7This application discloses a pin forming apparatus for electronic components, including: an operating table 1, a detection mechanism 2 and a forming mechanism 3.

[0049] A drive belt 11 is rotatably mounted on the operating table 1, and several support plates 12 are mounted on the drive belt 11 for supporting electronic components. Drive wheels 13 are located at both ends of the operating table 1, and a drive motor 14 is located on the outer side of the operating table 1. A drive component 15 is mounted at the output end of the drive motor 14, and the output end of the drive motor 14 is connected to one of the drive wheels 13 via the drive component 15, thereby rotating the drive belt 11. A detection mechanism 2 is mounted on the operating table 1 near the drive belt 11 and is used to detect the electronic components on the support plates 12. A forming mechanism 3 is used for forming the leads of the electronic components. The forming mechanism 3 includes a fixed frame 31 near the drive belt 11, a forming platform 32 mounted on the fixed frame 31, and a sliding component at the forming platform 32. The molding platform 32 has a sliding block 33 and a pressure block 34 positioned above it. A molding groove 321 is provided on the top side of the molding platform 32 near the drive belt 11, and a sliding groove 322 is provided through the bottom of the molding platform 32. The sliding block 33 is slidably positioned in the sliding groove 322. A molded part 331 is provided on the top side of the sliding block 33 corresponding to the molding groove 321. A positioning frame 323 is provided on the top of the molding platform 32, and a lifting cylinder assembly 324 is provided on the positioning frame 323. A combination plate 325 is provided at the output end of the lifting cylinder assembly 324. The output end of the lifting cylinder assembly 324 is connected to the pressure block 34 through the combination plate 325. The pressure block 34 descends and moves to the molded part 331 in the molding groove 321 to realize the pin pressing operation.

[0050] Electronic components are placed on a carrier plate 12 and pass through a detection mechanism 2 and a forming mechanism 3 in sequence as the drive belt 11 rotates. The detection mechanism 2 can accurately detect the electronic components on the carrier plate 12 to ensure that the position of the components to be processed is accurate. Subsequently, the electronic components are sent to the forming mechanism 3. The sliding block 33 slides in the slide groove 322 to move the forming part 331 into the forming groove 321. The lifting cylinder group 324 drives the pressure block 34 to descend. The pressure block 34 cooperates with the forming part 331 to perform a precise pressing operation on the pins of the electronic components. This solution not only improves the accuracy and efficiency of pin processing, but also effectively avoids the error and damage risks that may be caused by traditional manual operation, ensuring that the pin forming quality of electronic components is stable and reliable.

[0051] refer to Figures 5-7In this embodiment, more specifically, a protective block 35 is slidably disposed at the rear end of the molding stage 32 corresponding to the molding groove 321. A V-groove 351 is provided on the front end face of the protective block 35 for protecting the head of the electronic component. A first driving cylinder 311 and a second driving cylinder 312 are disposed on the top side of the fixing frame 31 away from the molding stage 32. Connectors 313 are provided at the output ends of the first and second driving cylinders 311 and 312. The output end of the first driving cylinder 311 is connected to the tail end of the protective block 35 via the connector 313, so that the inner side of the V-groove 351 at the protective block 35 abuts against the head of the electronic component and provides protection. The output end of the second driving cylinder 312 is connected to the tail end of the sliding block 33 via the connector 313. When the protective block 35, in conjunction with the molding component 331 on the sliding block 33, presses and molds the pins of the electronic component within the molding groove 321, it limits the pins and head of the electronic component. The protective block 35 at the rear end of the molding stage 32 can protect the pins during the molding process. The head of the electronic component is effectively protected to prevent damage caused by external forces. The V-groove 351 design on the front end of the protective block 35 further enhances the protection of the electronic component head, ensuring its stability during processing. In addition, the first drive cylinder 311 and the second drive cylinder 312 enable precise control of the protective block 35 and the sliding block 33, allowing the protective block 35 to move flexibly as needed. The V-groove 351 on the protective block 35, in conjunction with the molding part 331 on the sliding block 33, effectively limits the pressure on the pins of the electronic component at the molding groove 321, better adapting to electronic components of different sizes and shapes, thus improving the applicability and reliability of the device. Specifically, the first drive cylinder 311 moves the protective block 35 through the connecting part 313, ensuring that the protective block 35 is always in the correct position; the second drive cylinder 312 controls the movement of the sliding block 33 through the connecting part 313, achieving precise matching for pin molding.

[0052] refer to Figures 5-7 In this embodiment, more specifically, an adjusting frame 36 is provided below the fixed frame 31, and an adjusting cylinder assembly 361 is provided on the adjusting frame 36. An adjusting plate 362 is provided at the output end of the adjusting cylinder assembly 361. The adjusting plate 362 is connected to the bottom of the fixed frame 31. The connection relationship between the adjusting frame 36 and the fixed frame 31 can be dynamically adjusted by the adjusting cylinder assembly 361, thereby adapting to the processing requirements of different heights. This design not only improves the flexibility of the device, but also ensures the stable operation of the forming mechanism 3 under different working conditions, effectively reducing the processing error caused by height mismatch of the equipment.

[0053] refer to Figures 1-3In this embodiment, more specifically, the detection mechanism 2 includes a detection frame 21 mounted on the operating table 1 and a light column sensor 22 for detection. The detection frame 21 has a through groove 211 extending through the top of the support plate 12. The light column sensor 22 is locked and adjusted within the through groove 211 by a nut, allowing the light column sensor 22 to be locked after its position is adjusted within the through groove 211. The light column sensor 22 can be flexibly adjusted in position within the through groove 211 of the detection frame 21 by the nut, and locked after being adjusted to a suitable position. This design not only enables the detection mechanism 2 to be precisely adapted to the size and position differences of electronic components, but also effectively improves the accuracy and reliability of detection. At the same time, the adjustability of the position of the light column sensor 22 enhances the versatility of the device, making it suitable for the detection of electronic components of various specifications, thereby reducing production costs and improving work efficiency. In addition, by accurately detecting the presence and position of electronic components on the support plate 12, abnormalities can be detected in advance, avoiding the generation of defective products in subsequent processing, further improving the product yield and overall processing quality.

[0054] refer to Figure 1 and Figure 9 In this embodiment, more specifically, it also includes a deflection adjustment mechanism 4, used for adjusting the position of electronic components on the carrier plate 12 to realize the pin processing of electronic components. The deflection adjustment mechanism 4 includes a deflection correction frame 41 disposed on one side of the operating table 1 and a push block 42 disposed on the deflection correction frame 41. A deflection correction cylinder assembly 43 is disposed on the top of the deflection correction frame 41. A connecting plate 44 is disposed at the output end of the deflection correction cylinder assembly 43. The connecting plate 44 is connected to the push block 42, so that the push block 42 can make horizontal adjustments to the position of electronic components on the carrier plate 12. The deflection adjustment mechanism 4 can make precise adjustments to the position of electronic components on the carrier plate 12, ensuring the position accuracy of electronic components during pin processing. The specific effects are as follows: the deflection correction frame 41 and the push block 42 provide stable structural support for the position adjustment of electronic components. The deflection correction cylinder assembly 43 drives the connecting plate 44 and the push block 42 to move, realizing precise horizontal adjustment of electronic components, thereby avoiding pin processing defects caused by position deviation and improving the processing yield.

[0055] refer to Figure 1 and Figure 8 In this embodiment, more specifically, a mounting frame 45 is provided directly opposite the correction frame 41 and on the other side of the operating table 1. A vertical cylinder 46 is provided on the mounting frame 45. A positioning plate 461 is provided at the output end of the vertical cylinder 46. A horizontal cylinder 47 is provided on the positioning plate 461. A horizontal rod 48 is provided at the output end of the horizontal cylinder 47. A forked rod 49 is provided on one side of the bottom of the horizontal rod 48 to cooperate in forking the pins of electronic components.

[0056] refer to Figure 1 and Figure 10In this embodiment, more specifically, a cutting mechanism 5 is also included for cutting the pins of the formed electronic components. The cutting mechanism 5 includes a cutting frame 51 located away from the forming mechanism 3, a cutter 52 disposed above the cutting frame 51, and a receiving block 53 disposed below the cutter 52 on the cutting frame 51. A cutting cylinder 54 is disposed on one side of the top of the cutting frame 51. The output end of the cutting cylinder 54 is connected to the top of the cutter 52, driving the cutter 52 to cooperate with the receiving block 53 to cut the excess pins of the electronic components. The cutting mechanism 5 can achieve precise cutting of the pins of the formed electronic components. Specifically, the cutting frame 51 located away from the forming mechanism 3 includes a cutting frame 51 located away from the forming mechanism 3, a cutter 52 disposed above the cutting frame 51, and a receiving block 53 disposed below the cutter 52 on the cutting frame 51. The separation of the forming mechanism 3 from the cutting mechanism ensures that the cutting and forming operations do not interfere with each other, thus improving work efficiency. The cutter 52 is positioned above the cutting frame 51 and works in conjunction with the receiving block 53 below to form a stable cutting structure. When cutting is required, the output end of the cutting cylinder 54 drives the cutter 52 to move downward. The relative movement between the cutter 52 and the receiving block 53 can accurately remove excess pins, thereby ensuring the consistency of the pin length of electronic components. This design not only improves cutting accuracy but also effectively avoids the errors and damage that may be caused by traditional manual cutting, significantly improving the overall processing quality of electronic components.

[0057] refer to Figure 1 and Figure 11 In this embodiment, more specifically, a cutting clamping mechanism 55 is provided at the rear end of the cutting frame 51 and between the cutter 52 and the receiving block 53 for clamping and limiting the component head of the electronic component. The cutting clamping mechanism 55 includes a cutting clamping cylinder 551 disposed at the rear end of the cutting frame 51, a drive hinge 552 disposed at the output end of the cutting clamping cylinder 551, and grippers 553 for clamping the component head of the electronic component. The grippers 553 are symmetrically disposed at the ends of the drive hinge 552. A limit frame 554 is provided outside the cutting clamping cylinder 551 for adjusting and limiting the drive hinge 552. The output end of the cutting and clamping cylinder 551 drives the opening and closing angle of the drive hinge 552 to achieve the clamping and separation of the gripper 553. The cutting and clamping mechanism 55 can clamp and limit the component head of the electronic component during the cutting process, effectively preventing the electronic component from shaking or shifting during cutting, thereby improving cutting accuracy and stability. Specific effects include: the cutting and clamping cylinder 551 drives the gripper 553 to open and close through the drive hinge 552, which can flexibly adapt to the heads of electronic components of different sizes; the setting of the limiting frame 554 ensures that the drive hinge 552 remains stable during adjustment, preventing excessive opening and closing that could lead to clamping failure.

[0058] refer to Figure 4In this embodiment, more specifically, the carrier plate 12 is provided with symmetrical carrier grooves 121, and a plurality of magnetic pieces 122 are provided in the carrier grooves 121. The magnetic pieces 122 magnetically attract the pins of electronic components to prevent them from shifting during transportation. The magnetic pieces 122 can effectively attract the pins of electronic components to prevent them from shifting during transportation, thereby improving the stability of the processing process and reducing processing errors or damage caused by position deviation.

[0059] refer to Figure 1 and Figure 2 In this embodiment, more specifically, a waste collection bin 7 is provided on one side of the operating table 1. A telescopic cylinder 71 is provided on the side of the bearing plate 12 above the waste collection bin 7. A mating plate 72 is provided at the output end of the telescopic cylinder 71. A waste clamping mechanism 73 is provided on the mating plate 72. The waste clamping mechanism 73 adopts the same structure and clamping principle as the cutting clamping mechanism 55, and is adjusted in conjunction with the output end of the telescopic cylinder 71 to realize the telescopic clamping of waste material into the waste collection bin 7.

[0060] The implementation principle of the pin processing and forming device for electronic components in this application embodiment is as follows: Through the coordinated work of various mechanisms, the problems of easy deformation, uneven cutting, and surface damage in the processing of electronic component pins in the prior art are effectively solved; the drive belt 11 drives the electronic components on the carrier plate 12 to pass through the detection mechanism 2, the alignment mechanism 4, the forming mechanism 3, and the cutting mechanism 5 in sequence, realizing the pin detection, position adjustment, forming, and cutting processing steps; at the same time, the magnet 122 and the anti-bending mechanism 6 on the carrier plate 12 further ensure the stability of the electronic components during transportation and processing, improve the pin processing accuracy and quality, reduce the product defect rate, meet the market demand for high-quality electronic components, and have made significant improvements and enhancements compared with the prior art.

[0061] Example 2, reference Figure 12The difference between this embodiment and Embodiment 1 is that it also includes an anti-bending mechanism 6 to prevent the protruding portion of the electronic component's pins on the carrier plate 12 from bending. The anti-bending mechanism 6 includes an extension cylinder 61 disposed on both sides of the carrier plate 12, a combination block 62 installed at the output end of the extension cylinder 61, and a semi-arc block 63 for partially enclosing the pins to prevent bending. The arc surface of the semi-arc block 63 is on the same horizontal plane as the carrier groove 121. The semi-arc block 63 is disposed above the combination block 62. The combination block 62 is extended by the output end of the extension cylinder 61, so that the semi-arc block 63 adapts to the protruding length of the pins. During the processing of electronic components, the protruding portion of the pins is easily bent due to external factors. The problem is effectively solved. Specifically, the anti-bending mechanism 6, through the extension cylinders 61 set on both sides of the support plate 12, can precisely adjust the position of the semi-arc block 63 according to the length of the pin protrusion, ensuring that the semi-arc block 63 always fits the pin protrusion. At the same time, the arc surface of the semi-arc block 63 is on the same horizontal plane as the support groove 121. This design can not only avoid interference between the pin and the edge of the support groove 121, but also achieve semi-enclosed support for the pin protrusion, thereby effectively preventing bending. In addition, the mechanism has a simple structure and is easy to operate, which can significantly improve the yield of electronic component pin processing and provide reliable guarantee for subsequent molding and cutting processes.

[0062] refer to Figure 12 In this embodiment, more specifically, a rotary motor 64 is provided on the top of the assembly block 62, and a rotary disk 65 is provided at the output end of the rotary motor 64. The bottom of the semi-arc block 63 is connected to the end face of the rotary disk 65, so as to realize the pin support of electronic components with different horizontal angles. The semi-arc block 63 can adapt to the pin support of electronic components with different horizontal angles, effectively avoiding damage or bending of the pins due to angle deviation during processing. The rotary motor 64 drives the rotary disk 65 to rotate, thereby adjusting the semi-arc block 63 to a suitable angle, ensuring stable support for the pins, and improving processing accuracy and yield.

[0063] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A pin forming apparatus for electronic components, characterized in that, include: An operating table (1) is rotatably provided with a drive belt (11), and a plurality of carrier plates (12) are provided on the drive belt (11) for carrying electronic components; a symmetrical carrier groove (121) is provided on the carrier plate (12), and a plurality of magnet pieces (122) are provided in the carrier groove (121). The pins of the electronic components are magnetically attracted by the plurality of magnet pieces (122) to prevent displacement during transportation; The testing mechanism (2), located on the operating table (1) near the drive belt (11), is used to test electronic components on the carrier plate (12); and A molding mechanism (3) is used for molding the pins of electronic components. The molding mechanism (3) includes a fixed frame (31) disposed near the drive belt (11), a molding stage (32) disposed on the fixed frame (31), a sliding block (33) slidably disposed on the molding stage (32), and a pressure block (34) disposed above the molding stage (32). A molding groove (321) is disposed on the top side of the molding stage (32) near the drive belt (11), and a sliding groove (322) is disposed through the bottom of the molding stage (32). The sliding block (33) is slidably disposed in the sliding groove (322). Inside, a molding part (331) is provided on the top side of the sliding block (33) and corresponding to the molding groove (321). A positioning frame (323) is provided on the top of the molding table (32). A lifting cylinder assembly (324) is provided on the positioning frame (323). A combination plate (325) is provided at the output end of the lifting cylinder assembly (324). The output end of the lifting cylinder assembly (324) is connected to the pressure block (34) through the combination plate (325). The pressure block (34) descends and moves to the molding part (331) in the molding groove (321) to realize the pin molding operation. It also includes an anti-bending mechanism (6) for preventing the protruding parts of the electronic component pins on the support plate (12) from bending. The anti-bending mechanism (6) includes an extension cylinder (61) disposed on both sides of the support plate (12), a combination block (62) installed at the output end of the extension cylinder (61), and a semi-arc block (63) for partially wrapping the pins to prevent bending. The arc surface of the semi-arc block (63) is on the same horizontal plane as the support groove (121). The semi-arc block (63) is disposed on the combination plate (121). Above the block (62), the output end of the extension cylinder (61) drives the combined block (62) to extend, so that the semi-arc block (63) can adapt to the pin protrusion length; a rotary motor (64) is provided on the top of the combined block (62), and a rotating disk (65) is provided on the output end of the rotary motor (64). The bottom of the semi-arc block (63) is connected to the end face of the rotating disk (65), so as to realize the pin support of electronic components with different horizontal angles adapted to the semi-arc block (63).

2. The lead forming apparatus for electronic components according to claim 1, characterized in that: A protective block (35) is slidably disposed at the rear end of the forming table (32) corresponding to the forming groove (321). A V-groove (351) is provided on the front end face of the protective block (35). A first driving cylinder (311) and a second driving cylinder (312) are disposed on the top side of the fixing frame (31) away from the forming table (32). A connector (313) is provided at the output end of the first driving cylinder (311) and the second driving cylinder (312). The output end of the first driving cylinder (311) is connected to the connector (313). The component (313) is connected to the tail end of the protective block (35), so that the inner side of the V-groove (351) at the protective block (35) abuts against the head of the electronic component and provides protection. The output end of the second drive cylinder (312) is connected to the tail end of the sliding block (33) through the connector (313). When the protective block (35) cooperates with the molding component (331) on the sliding block (33) to press and mold the pins of the electronic component in the molding groove (321), it forms a limit on the pins and head of the electronic component.

3. The pin forming apparatus for electronic components according to claim 1, characterized in that: An adjustment frame (36) is provided below the fixed frame (31), and an adjustment cylinder group (361) is provided on the adjustment frame (36). An adjustment plate (362) is provided at the output end of the adjustment cylinder group (361), and the adjustment plate (362) is connected to the bottom of the fixed frame (31).

4. The pin forming apparatus for electronic components according to claim 1, characterized in that: The detection mechanism (2) includes a detection frame (21) set on the operating table (1) and a light column sensor (22) for detection. The detection frame (21) has a through groove (211) above the support plate (12). The light column sensor (22) is locked and adjusted in the through groove (211) by a nut, so that the position of the light column sensor (22) in the through groove (211) is adjusted and locked.

5. The pin forming apparatus for electronic components according to claim 4, characterized in that: It also includes a deflection adjustment mechanism (4) for adjusting the position of electronic components on the carrier plate (12) to realize the pin processing of electronic components. The deflection adjustment mechanism (4) includes a deflection correction frame (41) set on one side of the operating table (1) and a push block (42) set on the deflection correction frame (41). A deflection correction cylinder group (43) is set on the top of the deflection correction frame (41). A connecting plate (44) is set on the output end of the deflection correction cylinder group (43). The connecting plate (44) is connected to the push block (42) to realize the push block (42) to perform horizontal position adjustment of electronic components on the carrier plate (12).

6. The pin forming apparatus for electronic components according to claim 1, characterized in that: It also includes a cutting mechanism (5) for cutting the pins of the formed electronic components. The cutting mechanism (5) includes a cutting frame (51) away from the forming mechanism (3), a cutter (52) disposed above the cutting frame (51), and a receiving block (53) disposed below the cutter (52) on the cutting frame (51). A cutting cylinder (54) is disposed on one side of the top of the cutting frame (51). The output end of the cutting cylinder (54) is connected to the top of the cutter (52) to drive the cutter (52) to cooperate with the receiving block (53) to cut the excess pins of the electronic components.

7. The pin forming apparatus for electronic components according to claim 6, characterized in that: A cutting clamping mechanism (55) is provided at the rear end of the cutting frame (51) and between the cutter (52) and the receiving block (53) for clamping and limiting the component head of the electronic component. The cutting clamping mechanism (55) includes a cutting clamping cylinder (551) provided at the rear end of the cutting frame (51), a drive hinge (552) provided at the output end of the cutting clamping cylinder (551), and a gripper (553) for clamping the component head of the electronic component. The grippers (553) are symmetrically arranged at the ends of the drive hinge (552). A limit frame (554) is provided outside the cutting clamping cylinder (551) for adjusting and limiting the drive hinge (552). The gripper (553) can be separated by adjusting the opening and closing angle of the drive hinge (552) driven by the output end of the cutting clamping cylinder (551).

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