Chemical vapor deposition apparatus with facilitated cooling

Abstract

The application discloses a chemical vapor deposition equipment convenient to cool, and relates to the technical field of chemical vapor deposition equipment. When the temperature of the material is high, the material cannot be rapidly cooled, the temperature of the material is high, the deposition effect of the dense film layer on the surface is reduced, the arc-shaped stirring blade and the through hole of the water guide ring are matched with the guide hole ring, the liquid is guided out of the through hole and impacts the arc-shaped stirring blade in the process of guiding the cooling liquid, the flow rate of the guided liquid is reduced, the speed of the liquid after entering the flow cavity is slowed down, the heat absorption time of the liquid is increased, the gap between the top of the arc-shaped stirring blade and the bottom of the support disc gradually increases from inside to outside, the driving strength on the outside liquid is reduced, the smooth guiding of the outside liquid is ensured, the smooth guiding of the subsequent low-temperature liquid is ensured, the heat absorption time of the liquid is increased, the cooling effect on the support disc is improved, and the cooling effect on the material is ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chemical vapor deposition equipment, in particular to a chemical vapor deposition equipment convenient to cool. BACKGROUND

[0002] The chemical vapor deposition equipment is a complete set of devices specially used for realizing the chemical vapor deposition technology, and its core function is to realize the chemical reaction and deposition of gaseous reactants on the substrate surface by accurately controlling the delivery of gaseous precursors, the reaction environment and the product discharge, so as to form a solid thin film or coating. In the field of medical device manufacturing, the preparation of functional coating of intravascular implant is very important, and the chemical vapor deposition equipment is a key means to realize this process. Its principle is to decompose and deposit gaseous coating materials on the surface of the implant under high temperature and vacuum environment, so as to form a coating with specific functions, improve the biocompatibility and service life of the implant, and has great significance for the treatment of cardiovascular diseases.

[0003] In the chemical vapor deposition process, because the processing time is usually long, the material cannot be cooled quickly when the temperature is high during the long processing process, which leads to high temperature of the material, reduces the deposition effect of the dense film layer on the surface, and affects the chemical vapor deposition effect on the surface of the material. At the same time, during the long processing process, gas leakage is prone to occur. SUMMARY

[0004] In order to achieve the above purpose, the present application realizes the technical scheme as follows:

[0005] A chemical vapor deposition equipment convenient to cool, comprising:

[0006] A frame body, a gas pump and a liquid pump are fixedly installed on the top of the frame body, a gas tank and a liquid tank are fixedly installed on the top of the frame body, a side groove plate is fixedly installed on the top of the frame body, a sliding groove is formed on the outer side of the side groove plate, and the side groove plate is symmetrically installed on the top of the frame body, and a gas cylinder is fixedly installed on the outer side of the side groove plate.

[0007] A reaction mechanism, the reaction mechanism is installed on the top of the frame body, and the reaction mechanism provides a reaction place for the chemical vapor deposition reaction, and a cavity column is fixedly installed in the reaction mechanism.

[0008] A gas guiding mechanism, the gas guiding mechanism is installed in the reaction mechanism.

[0009] The top of the cavity column is fixedly provided with an empty groove disc, a circular groove is formed in the center of the bottom of the empty groove disc, a flow guide cavity is formed in the center of the cavity column, the flow guide cavity of the cavity column corresponds to the circular groove of the empty groove disc, a plurality of empty grooves are uniformly formed in the outer side of the empty groove disc, the empty grooves of the empty groove disc are matched with the reaction mechanism, when the gas is guided to the surface of the material, the gas is blocked to a certain extent, meanwhile, the empty grooves on the two sides make the gas contact the material and then smoothly flow out of the empty grooves, so that the subsequent gas cannot smoothly contact the material, the chemical vapor deposition effect on the surface of the material is affected, a guide hole ring is fixedly arranged at the circular groove of the top of the empty groove disc, a plurality of through holes are uniformly formed in the bottom of the outer side of the guide hole ring, a supporting disc is fixedly arranged at the top of the empty groove disc, a cooling cavity is formed between the bottom of the supporting disc and the top of the empty groove disc, the bottom of the supporting disc is tightly combined with the top of the guide hole ring, a stirring wheel is rotatably arranged at the top of the outer side of the guide hole ring, a plurality of arc-shaped stirring blades are uniformly arranged on the outer side of the stirring wheel, the arc-shaped stirring blades and the through holes of the guide hole ring are matched with the guide hole ring, so that the liquid is guided out of the through holes and then impacts the arc-shaped stirring blades, the stirring ring rotates under the limitation of the guide hole ring, the flow rate of the guided liquid is reduced by the impact of the liquid on the arc-shaped stirring blades, the speed of the liquid after entering the flow cavity is slowed down, the heat absorption time of the liquid is increased, meanwhile, the gap between the top of the arc-shaped stirring blade and the bottom of the supporting disc gradually increases from inside to outside, the driving force on the liquid on the outer side is reduced, the liquid on the outer side is smoothly guided out, the guide-in space of the cooling liquid in the cooling cavity is ensured, the subsequent low-temperature liquid is smoothly guided out, the liquid heat absorption time is increased, the cooling effect on the supporting disc is improved, the cooling effect on the material during processing is ensured, the problem of the quality of the dense film layer generated on the surface of the material due to the high temperature of the material is avoided, the bottom of the arc-shaped stirring blade is tightly combined with the bottom of the inner wall of the empty groove disc, and the gap between the top of the arc-shaped stirring blade and the bottom of the supporting disc gradually increases from inside to outside.

[0010] Preferably, a plurality of backflow holes are uniformly formed in the bottom of the empty groove disc, the backflow holes are communicated with the cooling cavity formed between the empty groove disc and the supporting disc, an inner ring cover is fixedly arranged at the backflow hole of the bottom of the empty groove disc, a backflow pipe is fixedly arranged at the bottom of the inner ring cover, one end of the backflow pipe away from the inner ring cover penetrates through the reaction mechanism and is fixedly connected with the liquid tank, a connector is fixedly arranged at the bottom of the cavity column, the bottom end of the connector penetrates through the reaction mechanism and extends to the bottom of the reaction mechanism, a flow guide pipe is fixedly arranged at the bottom of the connector, one end of the flow guide pipe away from the connector is connected with the liquid outlet end of the liquid pump, the liquid inlet end of the liquid pump is communicated with the inside of the liquid tank through a pipeline, and the gas inlet end of the gas pump is communicated with the inside of the gas tank through a pipeline.

[0011] Preferably, the reaction mechanism comprises a reaction tank, the bottom of the reaction tank is fixedly installed with a tank seat, the bottom of the tank seat is fixedly connected with the top of the frame body, the top of the reaction tank is clamped with a tank cover, the both sides of the tank cover are provided with a lug plate, and the tank cover is slidably matched with the sliding groove of the side groove plate through the lug plate, the output end of the air cylinder is fixedly connected with the lug plate of the tank cover, the bottom of the reaction tank is uniformly provided with a gas guide groove, and the bottom of the tank cover is fixedly installed with a bottom cover disc, the outer side of the bottom cover disc is fixedly installed with a waste gas pipe, the center position of the top of the tank cover is fixedly installed with a heater, the heating end of the heater penetrates through the tank cover and extends to the bottom thereof, the bottom of the tank cover is provided with a ring clamping groove, and the sealing gasket ring is matched with the inclined ring cover, in the process of closing the tank body, the tank cover bottom ring clamping groove and the top of the reaction tank are clamped, and after closing, the sealing gasket ring is tightly matched with the inclined ring cover, the gap degree of the connection position is increased, the path tortuosity of the gas outflow is increased, the sealing effect during reaction is improved, the high temperature and high pressure state during reaction is ensured, gas leakage is avoided, the working environment is affected, and the tank cover is clamped with the top of the reaction tank through the ring clamping groove, the inner wall of the tank cover is fixedly installed with a sealing gasket ring, the top of the inner wall of the reaction tank is fixedly installed with an inclined ring cover, the top end of the inclined ring cover is inclined upward, and the outer side of the sealing gasket ring is tightly matched with the inner wall of the inclined ring cover.

[0012] Preferably, the gas guide mechanism comprises a cavity cover, the cavity cover is fixedly installed on the top of the inner wall of the reaction tank, and the cavity cover is located between the inclined ring cover and the air groove disc, the inner wall of the cavity cover is fixedly installed with a spray head, the spray head is uniformly installed on the inner wall of the cavity cover, the inner diameter of the spray head gradually decreases in the process of gradually moving away from the cavity cover, the bottom of the inner wall of the cavity cover is fixedly installed with an inner guide disc, one end of the inner guide disc away from the cavity cover is inclined downward, and the inner guide disc is matched with the spray head, in the process that the spray head sprays gas, the gas sprayed by the spray head is guided through the inclination of the inner guide disc, so that the gas is smoothly guided to the material position under limitation, a large amount of gas is prevented from scattering after being introduced, the gas cannot flow to the material in a concentrated manner, the utilization efficiency of the gas material is low, the outer side of the cavity cover is fixedly installed with a fixed pipe, and one end of the fixed pipe away from the cavity cover penetrates through the reaction tank and extends to the outer side thereof.

[0013] Preferably, one end of the fixed tube away from the cavity cover is fixedly provided with a connecting pipe, one end of the connecting pipe close to the fixed tube is located inside the fixed tube, and the outer side of the connecting pipe is fixedly provided with a rubber pad cylinder, the outer side of the rubber pad cylinder is in contact with the inner wall of the fixed tube, one end of the connecting pipe away from the fixed tube is fixedly connected with the gas outlet end of the air pump through a pipeline, and the inner slide cover cooperates with the rubber pad cylinder, so that the outer diameter of the inner slide cover away from the connecting pipe changes during installation, the installation direction is guided, installation misalignment is avoided, the inner slide cover extrudes the rubber pad cylinder after installation, the rubber pad cylinder deforms under pressure, the connecting gap is fully filled, the sealing effect is improved, gas leakage during long-term work is avoided, and one end of the connecting pipe close to the fixed tube is slidably provided with an inner slide cover, and the outer diameter of one end of the inner slide cover away from the connecting pipe gradually decreases.

[0014] The application provides a chemical vapor deposition device convenient for cooling.

[0015] I. The chemical vapor deposition device convenient for cooling is provided with an arc-shaped stirring blade and a water guide ring, and the arc-shaped stirring blade and the through hole of the water guide ring are matched with the guide hole ring, so that the liquid is guided out of the through hole and impacts the arc-shaped stirring blade during the guiding of the cooling liquid, the stirring ring rotates under the limitation of the guide hole ring, the flow rate of the guided liquid is reduced by the impact of the liquid on the arc-shaped stirring blade, the speed of the liquid after entering the flow cavity is slowed down, the heat absorption time of the liquid is increased, the gap between the top of the arc-shaped stirring blade and the bottom of the support disc is gradually increased from inside to outside, the driving force on the outside liquid is reduced, the outside liquid is smoothly guided out, the guiding space of the cooling liquid in the cooling cavity is ensured, the subsequent low-temperature liquid is smoothly guided out, the cooling effect on the support disc is improved by the cooperation of the increase of the heat absorption time of the liquid, the cooling effect on the material during processing is ensured, and the problem of the quality of the dense film layer generated on the surface due to the high temperature of the material is avoided.

[0016] II. The chemical vapor deposition device convenient for cooling is provided with a hollow groove of the hollow groove disc and a reaction mechanism, and the hollow groove is matched with the reaction mechanism, so that the gas is blocked to a certain extent when the gas is guided to the surface of the material, the gas is smoothly guided out of the four surrounding hollow grooves after contacting the material, the subsequent gas cannot smoothly contact the material, and the chemical vapor deposition effect on the surface of the material is affected.

[0017] III. The chemical vapor deposition device convenient for cooling is provided with a sealing gasket ring and an inclined ring cover, and the sealing gasket ring is matched with the inclined ring cover during the closing of the tank body, the ring clamping groove at the bottom of the tank cover is matched with the clamping of the top of the reaction tank, the sealing gasket ring and the inclined ring cover are closely fitted after being closed, the gap tortuosity of the connecting position is increased, the path tortuosity when the gas flows out is increased, the sealing effect during the reaction is improved, the high temperature and high pressure state during the reaction is ensured, gas leakage is avoided, and the working environment is affected.

[0018] Four, the chemical vapor deposition equipment convenient to cool, through the cooperation of the inner guide disc and the shower head, in the process that the shower head sprays the gas, the gas sprayed by the shower head is guided by the inclination of the inner guide disc, so that the gas is smoothly guided to the material position under the limitation, after the gas is introduced, a large amount of gas is scattered, cannot flow to the material in a concentrated manner, and the utilization efficiency of the gas material is low.

[0019] Five, the chemical vapor deposition equipment convenient to cool, through the cooperation of the inner slide cover and the rubber pad cylinder, when installing, the outer diameter of the inner slide cover away from the connecting pipe is changed, the installation direction is guided, the installation misalignment is avoided, and after installation, the inner slide cover extrudes the rubber pad cylinder, so that the rubber pad cylinder is deformed under pressure, the connecting gap is fully filled, the sealing effect is improved, and gas leakage is avoided in the long working process. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is a structure schematic view of the chemical vapor deposition equipment convenient to cool.

[0021] Figure 2 It is a partial structure schematic view of the chemical vapor deposition equipment convenient to cool.

[0022] Figure 3 It is a partial structure sectional view of the chemical vapor deposition equipment convenient to cool.

[0023] Figure 4 It is a partial structure side view of the chemical vapor deposition equipment convenient to cool.

[0024] Figure 5 It is a partial structure sectional side view of the chemical vapor deposition equipment convenient to cool.

[0025] Figure 6 It is a partial structure sectional top view of the chemical vapor deposition equipment convenient to cool.

[0026] Figure 7 It is a structure sectional view of the reaction mechanism.

[0027] Figure 8 It is a structure sectional view of the reaction mechanism.

[0028] Figure 9 It is a structure schematic view of the gas guiding mechanism.

[0029] Figure 10 It is a structure sectional view of the gas guiding mechanism.

[0030] Figure 11 It is a partial structure sectional view of the gas guiding mechanism.

[0031] In the figure: 1, frame body; 2, reaction mechanism; 3, gas guide mechanism; 4, gas pump; 5, liquid pump; 6, gas tank; 7, liquid tank; 8, gas cylinder; 9, side groove plate; 10, return pipe; 11, flow guide pipe; 12, cavity column; 13, empty groove disc; 14, support disc; 15, stirring wheel; 16, guide hole ring; 17, inner ring cover; 18, joint; 21, reaction tank; 22, tank seat; 23, bottom cover disc; 24, heater; 25, tank cover; 26, gasket ring; 27, inclined ring cover; 28, waste gas pipe; 31, cavity cover; 32, inner guide disc; 33, spray head; 34, connecting pipe; 35, fixed pipe; 36, rubber pad cylinder; 37, inner sliding cover. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0033] The first embodiment, as shown in the figure, the present application provides a technical solution: Figures 1 to 6

[0034] A chemical vapor deposition equipment convenient to cool, comprising:

[0035] Frame body 1, the top of the frame body 1 is fixedly installed with a gas pump 4 and a liquid pump 5, and the top of the frame body 1 is fixedly installed with a gas tank 6 and a liquid tank 7, the top of the frame body 1 is fixedly installed with a side groove plate 9, the outer side of the side groove plate 9 is provided with a sliding groove, and the side groove plate 9 is symmetrically installed on the top of the frame body 1, and the outer side of the side groove plate 9 is fixedly installed with a gas cylinder 8;

[0036] Reaction mechanism 2, the reaction mechanism 2 is installed on the top of the frame body 1, and the reaction mechanism 2 provides a reaction place for chemical vapor deposition reaction, and the inside of the reaction mechanism 2 is fixedly installed with a cavity column 12;

[0037] Gas guide mechanism 3, the gas guide mechanism 3 is installed in the inside of the reaction mechanism 2;

[0038] ​The top of the cavity column 12 is fixedly installed with the hollow groove disc 13, and a circular groove is formed in the center of the bottom of the hollow groove disc 13; the center of the cavity column 12 is provided with a flow guide cavity, and the flow guide cavity of the cavity column 12 corresponds to the circular groove of the hollow groove disc 13; when cooling, the cooling liquid in the liquid tank 7 is guided into the cavity column 12 by the joint 18 and the flow guide pipe 11, and then the cooling liquid is guided into the inside of the guide hole ring 16 through the flow guide cavity of the cavity column 12, and then the cooling liquid is guided out from the flow guide holes on the bottom of the outside of the guide hole ring 16, and then the cooling liquid enters the cooling cavity between the support disc 14 and the hollow groove disc 13, and then the outside of the hollow groove disc 13 is uniformly provided with hollow grooves, and the circular groove on the top of the hollow groove disc 13 is fixedly installed with the guide hole ring 16, and the bottom of the outside of the guide hole ring 16 is uniformly provided with through holes, and the top of the hollow groove disc 13 is fixedly installed with the support disc 14, and the bottom of the support disc 14 and the top of the hollow groove disc 13 form a cooling cavity, and the bottom of the support disc 14 is tightly combined with the top of the guide hole ring 16, and the top of the outside of the guide hole ring 16 is rotatably installed with the stirring wheel 15, and the outside of the stirring wheel 15 is uniformly installed with arc-shaped stirring blades, and then the arc-shaped stirring blades of the stirring wheel 15 are impacted by the cooling liquid guided out from the flow guide holes, so that the stirring wheel 15 rotates under the limitation of the guide hole ring 16, and in the process of rotation, the cooling liquid uniformly contacts the support disc 14, and at the same time, the arc-shaped stirring blades are gradually increased from inside to outside in the gap between the stirring blades and the bottom of the support disc 14, so that the arc-shaped stirring blades have smaller driving force on the outside cooling liquid in the process of rotation, and then the outside cooling liquid is guided into the inner ring cover 17 from the backflow holes of the hollow groove disc 13 under the driving of the liquid pump 5, and then the cooling liquid is guided into the liquid tank 7 again through the backflow pipe 10, and the bottom of the arc-shaped stirring blades is tightly combined with the bottom of the inner wall of the hollow groove disc 13, and the gap between the top of the arc-shaped stirring blades and the bottom of the support disc 14 is gradually increased from inside to outside.

[0039] The bottom of the hollow groove disc 13 is uniformly provided with backflow holes, and the backflow holes are communicated with the cooling cavity between the hollow groove disc 13 and the support disc 14, and the even backflow holes of the hollow groove disc 13 are fixedly installed with the inner ring cover 17, and the bottom of the inner ring cover 17 is fixedly installed with the backflow pipe 10, and the end of the backflow pipe 10 away from the inner ring cover 17 penetrates through the reaction mechanism 2 and is fixedly connected with the liquid tank 7, and the bottom of the joint 18 penetrates through the reaction mechanism 2 and extends to the bottom of the reaction mechanism 2, and the bottom of the joint 18 is fixedly installed with the flow guide pipe 11, and the end of the flow guide pipe 11 away from the joint 18 is connected with the liquid outlet end of the liquid pump 5, and the liquid inlet end of the liquid pump 5 is communicated with the inside of the liquid tank 7 through a pipeline, and the gas inlet end of the gas pump 4 is communicated with the inside of the gas tank 6 through a pipeline.

[0040] The second embodiment is based on the first embodiment, please refer to Figures 7 to 8As shown, the reaction mechanism 2 includes a reaction tank 21, the bottom of the reaction tank 21 is fixedly installed with a tank seat 22, the bottom of the tank seat 22 is fixedly connected with the top of the frame body 1, the top of the reaction tank 21 is clamped with a tank cover 25, both sides of the tank cover 25 are provided with a lug plate, and the tank cover 25 is slidably matched with the sliding groove of the side groove plate 9 through the lug plate, the output end of the air cylinder 8 is fixedly connected with the lug plate of the tank cover 25, through the connection of the tank cover 25 and the air cylinder 8, the air cylinder 8 drives the tank cover 25 to move up and down under the limitation of the sliding groove of the side groove plate 9, realizes the opening and closing of the tank cover 25 and the reaction tank 21, and at the same time, after the material is put into the inside, the tank cover 25 is lowered to close the reaction tank 21, in the process of lowering the tank cover 25, the ring clamping groove at the bottom of the tank cover 25 is clamped with the top end of the reaction tank 21, at the same time, in the process of lowering the tank cover 25, the sealing gasket ring 26 gradually contacts the inclined ring cover 27, and under the pressure of the air cylinder 8, the sealing gasket ring 26 is tightly attached with the inclined ring cover 27, the bottom of the reaction tank 21 is uniformly provided with a gas guide groove, and the bottom of the reaction tank 21 is fixedly installed with a bottom cover disc 23 at the gas guide groove, the outer side of the bottom cover disc 23 is fixedly installed with a waste gas pipe 28, the center position of the top of the tank cover 25 is fixedly installed with a heater 24, the heating end of the heater 24 penetrates through the tank cover 25 and extends to the bottom thereof, in the process of reaction, first, the heater 24 is used to preheat the reaction environment and the material, so that the material and the reaction environment reach the preheating temperature, then the gas is guided into the inside of the reaction tank 21 by the gas guiding mechanism 3, reacts under the high temperature environment to form a dense coating film on the surface of the material, at the same time, the participating gas is guided into the bottom cover disc 23 from the gas guide groove at the bottom of the reaction tank 21, and finally is guided out by the waste gas pipe 28 and is treated in the exhaust gas treatment equipment, the bottom of the tank cover 25 is provided with a ring clamping groove, and the tank cover 25 is clamped with the top of the reaction tank 21 through the ring clamping groove, the inner wall of the tank cover 25 is fixedly installed with a sealing gasket ring 26, the top of the inner wall of the reaction tank 21 is fixedly installed with an inclined ring cover 27, the top end of the inclined ring cover 27 is inclined upward, and the outer side of the sealing gasket ring 26 is tightly attached with the inner wall of the inclined ring cover 27.

[0041] The third embodiment is based on the first and second embodiments, please refer to Figures 9 to 11As shown, the gas guide mechanism 3 comprises a cavity cover 31 fixedly installed on the top of the inner wall of the reaction tank 21, and the cavity cover 31 is located between the inclined ring cover 27 and the hollow groove disc 13. The inner wall of the cavity cover 31 is fixedly installed with a spray head 33 which is uniformly installed on the inner wall of the cavity cover 31, and the inner diameter of the spray head 33 gradually decreases in the process of gradually moving away from the cavity cover 31. The gas material in the gas tank 6 is guided into the connecting pipe 34 by the gas pump 4, and the gas is guided into the cavity cover 31 through the connection of the connecting pipe 34 and the fixed pipe 35, and is sprayed obliquely downward through the spray head 33. Through the cooperation of the spray head 33 and the inner guide disc 32, the sprayed gas is guided to move towards the material, and the film coating work is carried out. The bottom of the inner wall of the cavity cover 31 is fixedly installed with the inner guide disc 32, and the end of the inner guide disc 32 away from the cavity cover 31 is inclined downward. The outer side of the cavity cover 31 is fixedly installed with the fixed pipe 35, and the end of the fixed pipe 35 away from the cavity cover 31 penetrates the reaction tank 21 and extends to the outside thereof.

[0042] The end of the fixed pipe 35 away from the cavity cover 31 is fixedly installed with the connecting pipe 34, and the end of the connecting pipe 34 close to the fixed pipe 35 is located in the inside of the fixed pipe 35. The outer side of the connecting pipe 34 is fixedly installed with a rubber pad cylinder 36, and the outer side of the rubber pad cylinder 36 is in contact with the inner wall of the fixed pipe 35. In the process of reaction, the rubber pad cylinder 36 is pressed by the inner sliding cover 37, and cooperates with the connection of the fixed pipe 35 and the connecting pipe 34, so that the rubber pad cylinder 36 blocks the connection gap, improves the sealing performance, avoids the gas leakage phenomenon in the long-time chemical vapor deposition work, and the end of the connecting pipe 34 away from the fixed pipe 35 is fixedly connected with the gas outlet end of the gas pump 4 through a pipeline. The end of the connecting pipe 34 close to the fixed pipe 35 is slidingly installed with the inner sliding cover 37, and the outer diameter of the end of the inner sliding cover 37 away from the connecting pipe 34 gradually decreases.

[0043] In use, the opening and closing of the reaction mechanism 2 is controlled by the gas cylinder 8. After the reaction mechanism 2 is opened, the material required for chemical vapor deposition film coating is placed in the hollow groove disc 13 in the reaction mechanism 2, so that the film coating surface is placed upward and the bottom is supported by the support disc 14. Then the reaction mechanism 2 is closed to form a sealed cavity required for reaction. Then the material is preheated by the reaction mechanism 2. After preheating, the gas required for chemical vapor deposition reaction in the gas tank 6 is driven by the gas pump 4 into the gas guide mechanism 3, so that the gas is guided into the reaction mechanism 2 by the gas guide mechanism 3. The chemical reaction of the gas under high temperature conditions deposits uniform and dense solid products on the surface of the material. At the same time, the cooling liquid in the liquid tank 7 is guided into the cavity column 12 by the flow guide pipe 11, and then into the cooling cavity between the support disc 14 and the hollow groove disc 13 to control the temperature of the material placed on the top of the support disc 14.

[0044] When cooling, the cooling liquid in the liquid tank 7 is guided by the joint 18 and the flow guide pipe 11 into the cavity column 12, and is guided into the inside of the guide hole ring 16 through the flow guide cavity of the cavity column 12, and is guided out from the flow guide hole at the bottom of the outside of the guide hole ring 16 into the cooling cavity between the support disc 14 and the air groove disc 13 under the limitation of being blocked by the support disc 14 at the top of the guide hole ring 16, and after the cooling liquid is guided out from the flow guide hole, the arc-shaped stirring blade of the stirring wheel 15 is impacted, so that the stirring wheel 15 rotates under the limitation of the guide hole ring 16, and in the process of rotation, the cooling liquid is uniformly contacted with the support disc 14, and the feature that the gap between the stirring blade and the bottom of the support disc 14 gradually increases from inside to outside is utilized, so that the arc-shaped stirring blade has a small driving force on the outside cooling liquid when rotating, and the outside cooling liquid is quickly guided into the inner ring cover 17 from the backflow hole of the air groove disc 13 under the driving of the liquid pump 5, and is backflowed into the liquid tank 7 through the backflow pipe 10 again.

[0045] In the reaction mechanism 2, the cylinder 8 drives the tank cover 25 to move up and down under the limitation of the sliding groove of the side groove plate 9 through the connection of the tank cover 25 and the cylinder 8, so that the tank cover 25 and the reaction tank 21 are opened and closed, and when the material is put into the inside, the tank cover 25 is moved downward to close the reaction tank 21, and in the process of moving downward, the ring clamping groove at the bottom of the tank cover 25 is clamped with the top end of the reaction tank 21, and in the process of moving downward of the tank cover 25, the sealing gasket ring 26 gradually contacts the inclined ring cover 27, and under the pressure of the cylinder 8, the sealing gasket ring 26 is tightly attached to the inclined ring cover 27, and in the process of reaction, the material and the reaction environment are preheated through the heater 24, so that the material and the reaction environment reach the preheating temperature, and then the gas is guided into the inside of the reaction tank 21 through the gas guiding mechanism 3, and reacts under the high-temperature environment to form a dense coating film on the surface of the material, and the participating gas is guided into the bottom cover disc 23 from the gas guiding groove at the bottom of the reaction tank 21, and is finally guided out from the waste gas pipe 28 and treated in the exhaust gas treatment equipment.

[0046] In the gas guiding mechanism 3, the gas material in the gas tank 6 is guided into the connecting pipe 34 through the pipeline under the driving of the gas pump 4, and the gas is guided into the inside of the cavity cover 31 through the connection of the connecting pipe 34 and the fixed pipe 35, and is sprayed obliquely downward through the nozzle 33, and the sprayed gas is guided through the cooperation of the nozzle 33 and the inner guide disc 32, so that the gas moves to the material direction to perform the coating work, and in the process of reaction, the rubber gasket cylinder 36 is sealed by the connection cooperation of the fixed pipe 35 and the connecting pipe 34 through the compression of the inner sliding cover 37 to the rubber gasket cylinder 36, so as to improve the sealing performance and avoid the gas leakage phenomenon in the long-time chemical vapor deposition work.

[0047] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting; it is not intended to exclude myriad other embodiments of the present application that other inventors can develop based on the same general inventive concepts embodied by the described embodiments. That is, although the present application is described in terms of particular embodiments and implementations, it is to be understood that the terminology used is for the purpose of descriptive clarity and that it should be taken in its broadest possible sense. For example, the terms "a", "an", and "the" include both singular and plural referents unless the context clearly dictates otherwise. The terms "comprises", "comprising", "includes", "including" and the like can be used in conjunction with the term "consisting of to include the elements or steps listed after such conjunctive language, but not to the exclusion of other elements or steps. The singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. The term "plurality" means two or more. The term "consisting essentially of to provide that the composition or process include additional steps, elements, compounds, compositions of matter, or materials not specifically recited. The use of the terms "first", "second", and the like does not imply any particular ordering, but rather are used to denote distinct and separate steps. Where the context requires, the singular forms "a", "an" and "the" include their corresponding plural referents unless the context clearly dictates otherwise. Terms such as "above" and "below" refer to positions relative to the orientation of the figures and are used for purposes of illustration and description only. Terms such as "first" and "second" are used to identify various elements, but the elements should not be limited by these terms. The use of the terms "first" and "second" are not necessarily intended to connote chronological order, but rather serve as labels to distinguish one element from another. The use of the terms "a", "an", and "the" and / or the use of articles in the singular and plural sense are intended to cover a

[0048] While the embodiments of the application have been shown and described herein, it is understood that modifications, substitutions, combinations, and variations of the embodiments can be undertaken by those skilled in the art without departing from the spirit and scope of the present application, which is defined by the following claims and their equivalents.

Claims

1. A chemical vapor deposition apparatus that is easy to cool, characterized in that, include: The frame (1) has an air pump (4) and a liquid pump (5) fixedly installed on its top, and an air tank (6) and a liquid tank (7) fixedly installed on its top. The frame (1) also has a side groove plate (9) fixedly installed on its top. The side groove plate (9) has a sliding groove on its outer side, and the side groove plates (9) are symmetrically installed on the top of the frame (1). A cylinder (8) is fixedly installed on the outer side of each side groove plate (9). The reaction mechanism (2) is installed on the top of the frame (1) and provides a reaction site for chemical vapor deposition reaction. A cavity column (12) is fixedly installed inside the reaction mechanism (2). Gas guiding mechanism (3), which is installed inside the reaction mechanism (2); A slotted plate (13) is fixedly installed on the top of the cavity column (12), and a circular groove is formed at the center of the bottom of the slotted plate (13). A flow guiding cavity is formed at the center of the cavity column (12), and the flow guiding cavity of the cavity column (12) corresponds to the circular groove of the slotted plate (13). Slots are uniformly formed on the outer side of the slotted plate (13), and a guide ring (16) is fixedly installed at the circular groove at the top of the slotted plate (13). Through holes are uniformly formed at the bottom of the outer side of the guide ring (16). A support plate (14) is fixedly installed on the top. A cooling cavity is formed between the bottom of the support plate (14) and the top of the empty slot plate (13). The bottom of the support plate (14) is tightly fitted with the top of the guide ring (16). An agitator (15) is rotatably installed on the top of the outer side of the guide ring (16). Arc-shaped agitators are evenly installed on the outer side of the agitator (15). The bottom of the arc-shaped agitators is tightly fitted with the bottom of the inner wall of the empty slot plate (13). The gap between the top of the arc-shaped agitators and the bottom of the support plate (14) gradually increases from the inside to the outside. The bottom of the empty slot tray (13) is uniformly provided with reflux holes, and the reflux holes are connected to the cooling cavity formed between the empty slot tray (13) and the support tray (14). An inner ring cover (17) is fixedly installed at the reflux hole at the bottom of the empty slot tray (13). A reflux pipe (10) is fixedly installed at the bottom of the inner ring cover (17). The end of the reflux pipe (10) away from the inner ring cover (17) passes through the reaction mechanism (2) and is fixedly connected to the liquid tank (7). By taking advantage of the fact that the gap between the agitator blade and the bottom of the support plate (14) gradually increases from the inside to the outside, the agitator blade has a smaller driving force on the coolant on the outside when it rotates. This allows the coolant on the outside to be quickly introduced into the inner ring cover (17) through the return hole of the empty slot plate (13) under the drive of the liquid pump (5), and then returned to the liquid tank (7) through the return pipe (10).

2. The chemical vapor deposition apparatus for easy cooling according to claim 1, characterized in that: A connector (18) is fixedly installed at the bottom of the cavity column (12). The bottom end of the connector (18) passes through the reaction mechanism (2) and extends to its bottom. A guide pipe (11) is fixedly installed at the bottom of the connector (18). The end of the guide pipe (11) away from the connector (18) is connected to the liquid outlet of the liquid pump (5). The liquid inlet of the liquid pump (5) is connected to the inside of the liquid tank (7) through a pipe. The air inlet of the air pump (4) is connected to the inside of the air tank (6) through a pipe.

3. The chemical vapor deposition apparatus for easy cooling according to claim 1, characterized in that: The reaction mechanism (2) includes a reaction tank (21), a tank base (22) is fixedly installed at the bottom of the reaction tank (21), the bottom of the tank base (22) is fixedly connected to the top of the frame (1), and a tank cover (25) is snapped onto the top of the reaction tank (21). Both sides of the tank cover (25) are provided with protruding plates, and the tank cover (25) slides and adapts to the sliding groove of the side groove plate (9) through the protruding plates.

4. The chemical vapor deposition apparatus for easy cooling according to claim 3, characterized in that: The output end of the cylinder (8) is fixedly connected to the protruding plate of the tank cover (25). The bottom of the reaction tank (21) is evenly provided with gas guide grooves, and a bottom cover plate (23) is fixedly installed at the gas guide groove at the bottom of the reaction tank (21). An exhaust pipe (28) is fixedly installed on the outside of the bottom cover plate (23). A heater (24) is fixedly installed at the center of the top of the tank cover (25). The heating end of the heater (24) passes through the tank cover (25) and extends to its bottom.

5. A chemical vapor deposition apparatus for easy cooling according to claim 4, characterized in that: The bottom of the can lid (25) is provided with a ring groove, and the can lid (25) is engaged with the top of the reaction vessel (21) through the ring groove. A sealing gasket (26) is fixedly installed on the inner wall of the can lid (25), and an inclined ring cover (27) is fixedly installed on the top of the inner wall of the reaction vessel (21). The top of the inclined ring cover (27) is inclined upward, and the outer side of the sealing gasket (26) is tightly fitted with the inner wall of the inclined ring cover (27).

6. A chemical vapor deposition apparatus for easy cooling according to claim 5, characterized in that: The gas guiding mechanism (3) includes a cavity cover (31), which is fixedly installed on the top of the inner wall of the reaction vessel (21) and is located between the inclined ring cover (27) and the empty slot plate (13). A nozzle (33) is fixedly installed on the inner wall of the cavity cover (31). The nozzle (33) is evenly installed on the inner wall of the cavity cover (31), and the inner diameter of the nozzle (33) gradually decreases as it moves away from the cavity cover (31).

7. A chemical vapor deposition apparatus for easy cooling according to claim 6, characterized in that: An inner guide plate (32) is fixedly installed at the bottom of the inner wall of the cavity cover (31). The end of the inner guide plate (32) away from the cavity cover (31) is inclined downward. A fixing tube (35) is fixedly installed on the outer side of the cavity cover (31). The end of the fixing tube (35) away from the cavity cover (31) passes through the reaction vessel (21) and extends to its outer side.

8. A chemical vapor deposition apparatus for easy cooling according to claim 7, characterized in that: A connecting pipe (34) is fixedly installed at one end of the fixed tube (35) away from the cavity cover (31). The end of the connecting pipe (34) close to the fixed tube (35) is located inside the fixed tube (35), and a rubber pad (36) is fixedly installed on the outside of the connecting pipe (34). The outside of the rubber pad (36) is in contact with the inner wall of the fixed tube (35).

9. A chemical vapor deposition apparatus for easy cooling according to claim 8, characterized in that: The end of the connecting pipe (34) away from the fixed pipe (35) is fixedly connected to the air outlet of the air pump (4) through a pipe, and an inner sliding cover (37) is slidably installed on the end of the connecting pipe (34) near the fixed pipe (35), and the outer diameter of the end of the inner sliding cover (37) away from the connecting pipe (34) gradually decreases.

Images