Touch control assembly and manufacturing method thereof
By using a curved conductor with a conductive inner core and outer coating, combined with an adhesive layer design of specific thickness and initial adhesion, the pollution and energy consumption problems of the ITO process are solved, enabling the manufacturing of an environmentally friendly and energy-saving touch assembly, and reducing the visibility of the conductor and the risk of damage to the protective cover.
Patent Information
- Application Number
- CN202410430756.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-10
- Publication Date
- 2025-10-17
AI Technical Summary
Existing touch module processes using indium tin oxide (ITO) transparent electrodes suffer from problems such as limited rare metal reserves, severe production pollution, high energy consumption, and improper waste disposal causing environmental pollution.
It uses a curved wire containing a conductive inner core and an outer coating, and replaces ITO with a winding technology. Combined with an adhesive layer design with specific thickness and initial adhesion, it avoids jumper wires and high-temperature damage, and fills the gaps between wires to reduce visibility.
It effectively solves the problems of high pollution and high energy consumption in ITO process, avoids damage to jumpers and protective covers, reduces the visibility of wires, and realizes environmentally friendly and energy-saving touch assembly manufacturing.
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Figure CN120803289A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present disclosure relates to a touch assembly and a manufacturing method thereof. BACKGROUND
[0002] With the development of touch modules, they have been widely used in industrial electronics and consumer electronics. Touch products applied to various large-size products will become more and more common.
[0003] However, a conventional process of the touch module uses indium tin oxide (ITO) as a transparent electrode. The production of ITO requires the use of rare metal indium. The reserves of indium are limited and the mining process will cause environmental pollution. In addition, the conventional process will also generate a large amount of ITO waste, which needs to be properly treated, otherwise it will cause environmental pollution. Moreover, the conventional process requires the use of high-temperature, high-pressure vacuum coating equipment, which consumes more energy.
[0004] Therefore, how to propose a touch assembly and a manufacturing method thereof that can solve the above problems is one of the problems that the industry urgently wants to invest in research and development resources to solve. SUMMARY
[0005] Therefore, the purpose of the present disclosure is to propose a touch assembly and a manufacturing method thereof that can solve the above problems.
[0006] In order to achieve the above purpose, according to an embodiment of the present disclosure, a touch assembly includes a protective cover, a first adhesive layer, a plurality of curved wires, and a second adhesive layer. The first adhesive layer is disposed on the protective cover. The thickness of the first adhesive layer is in the range of 20 μm to 200 μm. The initial adhesion of the first adhesive layer is in the range of 1800 gf / in to 4000 gf / in. The curved wires are disposed on the first adhesive layer and include a first group of wires and a second group of wires. The first group of wires extends along a first direction. The second group of wires extends along a second direction and overlaps the first group of wires. Each curved wire includes a conductive core and an outer layer. The second adhesive layer covers the curved wires and the first adhesive layer.
[0007] In one or more embodiments of the present disclosure, each curved wire is an enameled wire.
[0008] In one or more embodiments of the present disclosure, the material of the outer layer is selected from the group consisting of polyvinyl formal, polyurethane, polyamide, polyester, polyester-polyimide, polyamide-polyimide, and polyimide.
[0009] In one or more embodiments of the present disclosure, the wire diameter of the conductive core is in the range of 2 μm to 5 μm.
[0010] In one or more embodiments of the present disclosure, the thickness of the outer layer is in a range from 1 μm to 3 μm.
[0011] In one or more embodiments of the present disclosure, the thickness of the second adhesive layer is in a range from 25 μm to 150 μm.
[0012] In one or more embodiments of the present disclosure, the first adhesive layer and the second adhesive layer fill gaps between the first group of conductive wires and gaps between the second group of conductive wires.
[0013] To achieve the above object, according to one embodiment of the present disclosure, a method for manufacturing a touch assembly includes: disposing a plurality of curved wires on a first adhesive layer, wherein the curved wires include a first group of conductive wires and a second group of conductive wires, the first group of conductive wires extends along a first direction, the second group of conductive wires extends along a second direction and overlaps the first group of conductive wires, wherein each curved wire includes a conductive inner core and an outer layer; covering a second adhesive layer on the curved wires and the first adhesive layer; and adhering the first adhesive layer to a protective cover plate.
[0014] In one or more embodiments of the present disclosure, the step of adhering the first adhesive layer to the protective cover plate includes: transferring a combination including the first adhesive layer, the curved wires and the second adhesive layer onto the protective cover plate.
[0015] In one or more embodiments of the present disclosure, the step of disposing the curved wires on the first adhesive layer includes: winding an enameled wire on the first adhesive layer; and cutting the enameled wire to form the curved wires.
[0016] In one or more embodiments of the present disclosure, the step of disposing the curved wires on the first adhesive layer further includes: before the step of winding the enameled wire on the first adhesive layer, disposing a pre-embedded wire on the first adhesive layer, wherein the step of winding the enameled wire on the first adhesive layer is such that the enameled wire partially covers the pre-embedded wire. The step of cutting the enameled wire to form the curved wires includes: peeling the pre-embedded wire from the first adhesive layer, causing the enameled wire to break to form the curved wires.
[0017] In one or more embodiments of the present disclosure, the diameter of the pre-embedded wire is greater than the diameter of the enameled wire.
[0018] In one or more embodiments of the present disclosure, the step of covering the second adhesive layer on the curved wires and the first adhesive layer includes: applying a water glue on the first adhesive layer to cover the curved wires; and hardening the water glue to form the second adhesive layer.
[0019] In one or more embodiments of the present disclosure, the step of covering the second adhesive layer on the curved wires and the first adhesive layer further includes: covering a pressing plate on the water glue; and rolling the pressing plate with a roller.
[0020] In one or more embodiments of the present disclosure, the step of cutting the enameled wire to form the curved conductive wire is performed by a laser cutting process.
[0021] In one or more embodiments of the present disclosure, the method of manufacturing the touch assembly further comprises: before the step of cutting the enameled wire to form the curved conductive wire, covering a second adhesive layer on the enameled wire and the first adhesive layer, wherein the step of cutting the enameled wire to form the curved conductive wire is performed simultaneously with the second adhesive layer.
[0022] In one or more embodiments of the present disclosure, the step of attaching the first adhesive layer to the protective cover is performed before the step of disposing the curved conductive wire on the first adhesive layer.
[0023] In one or more embodiments of the present disclosure, the thickness of the first adhesive layer is in a range of 20 μm to 200 μm. The initial adhesion of the first adhesive layer is in a range of 1800 gf / in to 4000 gf / in.
[0024] In one or more embodiments of the present disclosure, the step of covering the second adhesive layer on the curved conductive wire and the first adhesive layer is performed such that the first adhesive layer and the second adhesive layer fill the gaps between the first group of conductive wires and the gaps between the second group of conductive wires.
[0025] In one or more embodiments of the present disclosure, the method of manufacturing the touch assembly further comprises: soldering the circuit board to the curved conductive wire.
[0026] In summary, in the touch assembly of the present disclosure, since each curved conductive wire is a wire comprising a conductive inner core and an outer covering layer, the winding technology can be used to manufacture the curved conductive wire in the touch assembly, thereby avoiding the high pollution and high energy consumption problems of the conventional complex process of using indium tin oxide (ITO) as a transparent electrode. By limiting the thickness and initial adhesion of the first adhesive layer in a specific range, the problem of the curved conductive wire jumping relative to the first adhesive layer during the winding process can be effectively avoided. In the method of manufacturing the touch assembly of the present disclosure, the combination of the first adhesive layer, the curved conductive wire, and the second adhesive layer is transferred to the protective cover after the lamination process of the second adhesive layer, thereby effectively avoiding the problem of damage to the black matrix layer on the protective cover caused by high temperature in the lamination process. In addition, by laminating the curved conductive wire between the first adhesive layer and the second adhesive layer, the gaps between the curved conductive wires can be filled by the first adhesive layer and the second adhesive layer, thereby effectively reducing the visibility of the curved conductive wire from one side of the second adhesive layer (i.e., reducing the generation of shadows).
[0027] The above merely illustrates the problems to be solved by the present disclosure, the technical means for solving the problems, and the effects thereof. The specific details of the present disclosure will be described in the embodiments and the related drawings below. BRIEF DESCRIPTION OF DRAWINGS
[0028] To make the above and other objects, features, advantages and embodiments of the present disclosure more apparent and understandable, the accompanying drawings are described as follows:
[0029] Figure 1 A schematic diagram illustrating a touch assembly according to one embodiment of the present disclosure;
[0030] Figure 2 To illustrate Figure 1 A partial cross-sectional view of some components in FIG;
[0031] Figure 3 FIG1 is a flow chart illustrating a method for manufacturing a touch assembly according to one embodiment of the present disclosure;
[0032] Figure 4 FIG1 is a flow chart illustrating a method for manufacturing a touch assembly according to another embodiment of the present disclosure;
[0033] Figures 5A to 5J Schematic diagrams respectively illustrating intermediate steps of a method for manufacturing a touch assembly according to an embodiment of the present disclosure;
[0034] Figure 6 To illustrate Figure 5I A partial cross-sectional view of
[0035] Figures 7A to 7H Schematic diagrams respectively illustrate intermediate steps of a method for manufacturing a touch assembly according to one embodiment of the present disclosure.
[0036]
Explanation of symbols
[0037] 100: Touch screen assembly
[0038] 110: Protective cover
[0039] 120: first adhesive layer
[0040] 130:Bent wire
[0041] 130A: Enameled wire
[0042] 131: Conductive core
[0043] 132: Outer covering
[0044] 140: Second adhesive layer
[0045] 140A: Water-based glue
[0046] 150: Circuit board
[0047] 151: Bonding pad
[0048] 152:Metal layer
[0049] 910: Winding Machine
[0050] 920:Glue coating machine
[0051] 930: Welding machine
[0052] 940:Press plate
[0053] 950: Roller
[0054] 960: Cutting Machine
[0055] EW: Pre-buried wire
[0056] G1: The first group of wires
[0057] G2: The second group of wires
[0058] RF1,RF2,RF3: Release film
[0059] S110, S120, S130, S140, S210, S220, S230, S240: Steps DETAILED DESCRIPTION
[0060] The following drawings illustrate various embodiments of the present disclosure. For clarity, many practical details are included in the following description. However, it should be understood that these practical details are not intended to limit the present disclosure. In other words, these practical details are not essential for some embodiments of the present disclosure. Furthermore, to simplify the drawings, some commonly used structures and components are depicted in simplified schematic form.
[0061] Please refer to Figure 1 as well as Figure 2 . Figure 1 FIG1 is a schematic diagram illustrating a touch assembly 100 according to one embodiment of the present disclosure. Figure 2 To illustrate Figure 1 A partial cross-sectional view of some components in . Figure 1 and Figure 2As shown, in this embodiment, the touch assembly 100 includes a protective cover 110, a first adhesive layer 120, a plurality of curved conductive wires 130, a second adhesive layer 140, and a circuit board 150. The first adhesive layer 120 is disposed on the protective cover 110. The curved conductive wires 130 are disposed on the first adhesive layer 120 and include a first group of conductive wires G1 and a second group of conductive wires G2. The first group of conductive wires G1 extend along a first direction and are arranged at intervals. The second group of conductive wires G2 extend along a second direction and overlap the first group of conductive wires G1 and are arranged at intervals. In some embodiments, the first direction and the second direction are perpendicular to each other, such as the X-axis direction and the Y-axis direction. The second adhesive layer 140 covers the curved conductive wires 130 and the first adhesive layer 120. The circuit board 150 is electrically connected to the curved conductive wires 130. The circuit board 150 is, for example, a flexible printed circuit board, but the present disclosure is not limited thereto.
[0062] like Figure 2 Specifically, each curved conductive wire 130 includes a conductive core 131 and a covering 132. The covering 132 comprises an insulating material. Therefore, the conductive cores 131 of the first and second groups of conductive wires G1 and G2 are electrically insulated by the covering 132. This allows touch signals (such as mutual capacitance sensing signals) between the first and second groups of conductive wires G1 and G2 to be extracted to the circuit board 150.
[0063] In this embodiment, each curved conductive wire 130 is an enameled wire. Thus, the curved conductive wire 130 can be fabricated in the touch control assembly 100 using wire winding technology, thereby eliminating the high pollution and high energy consumption issues associated with conventional complex processes using indium tin oxide (ITO) as transparent electrodes.
[0064] In practical applications, the curved conductive wire 130 can also be a combination of enameled wire and ITO transparent electrode. For example, one of the first group of conductive wires G1 and the second group of conductive wires G2 of the curved conductive wire 130 is enameled wire, while the other group of conductive wires G1 and G2 is ITO transparent electrode.
[0065] In some embodiments, the conductive core 131 of the curved conductive wire 130 is made of silver, copper, aluminum, tungsten, or similar metals.
[0066] In some embodiments, the conductive core 131 of the curved wire 130 is made of a material including palladium-copper alloy, silver-palladium-copper alloy, molybdenum-rhenium alloy, aluminum alloy, nickel alloy, or similar alloys.
[0067] In this embodiment, the thickness of the first adhesive layer 120 is in the range of 20 μm to 200 μm. The initial adhesion force of the first adhesive layer 120 is in the range of 1800 gf / in to 4000 gf / in. It should be noted that when the hardness of the curved wire 130 is high (for example, the material of the conductive core 131 of the curved wire 130 is an alloy), the curved wire 130 is prone to breakaway stress when winding on the first adhesive layer 120, thereby causing a jumper problem. By limiting the thickness and initial adhesion force of the first adhesive layer 120 to the aforementioned specific ranges, the problem of the curved wire 130 jumping relative to the first adhesive layer 120 during the winding process can be effectively avoided. In detail, when either the thickness or the initial adhesion force of the first adhesive layer 120 is less than the lower limit of the aforementioned range, a jumper problem will easily occur. When the thickness of the first adhesive layer 120 is greater than the upper limit of its range, it will lead to an increase in the overall volume, weight and cost of the touch assembly 100. When the initial tack of the first adhesive layer 120 is greater than the upper limit of the range, not only is the material selection limited, but the reworkability is also reduced.
[0068] In some embodiments, the material of the outer covering layer 132 of the curved conductive line 130 includes polyvinyl formal, polyurethane, polyamide, polyester, polyester-polyimide, polyamide-polyimide, or polyimide, but the present disclosure is not limited thereto.
[0069] In some embodiments, the wire diameter of the conductive core 131 of the curved conductive wire 130 is in the range of 2 μm to 20 μm. Preferably, the wire diameter of the conductive core 131 is in the range of 2 μm to 5 μm to enhance the visibility of the touch assembly 100. That is, the visibility of the curved conductive wire 130 can be reduced. In some embodiments, the thickness of the outer covering 132 of the curved conductive wire 130 is in the range of 1 μm to 3 μm. For example, in one embodiment, the wire diameter of the conductive core 131 is approximately 5 μm, and the thickness of the outer covering 132 is approximately 2 μm (i.e., the wire diameter of the curved conductive wire 130 is approximately 7 μm), but the present disclosure is not limited thereto.
[0070] like Figure 2 As shown, in this embodiment, the first adhesive layer 120 and the second adhesive layer 140 fill the gaps between the first group of conductive lines G1 and the second group of conductive lines G2. This eliminates the gaps between the curved conductive lines 130 and the first and second adhesive layers 120, 140 caused by indentations, effectively reducing the visibility of the curved conductive lines 130 when viewed from the side of the second adhesive layer 140 (i.e., reducing shadows).
[0071] In some embodiments, at least one of the first adhesive layer 120 and the second adhesive layer 140 is an optical clear adhesive (OCA) layer or a liquid optical clear adhesive (LOCA) layer, but the present disclosure is not limited thereto.
[0072] In some embodiments, the thickness of the second adhesive layer 140 is in a range from 25 μm to 150 μm. When the thickness of the second adhesive layer 140 is less than the lower limit of the aforementioned range, the aforementioned voids are not easily eliminated; when the thickness of the second adhesive layer 140 is greater than the lower limit of the aforementioned range, the overall volume, weight, and cost of the touch assembly 100 are increased.
[0073] Please refer to Figure 3 A flowchart of a manufacturing method of a touch assembly according to an embodiment of the present disclosure is shown in FIG. 1. As shown in FIG. 1, the manufacturing method of the touch assembly comprises steps S110 to S140. Figure 3 As shown in FIG. 1, the manufacturing method of the touch assembly comprises steps S110 to S140. Figure 1 Figure 2 In the present embodiment, the manufacturing method of the touch assembly comprises steps S110 to S140.
[0074] Step S110: The first adhesive layer 120 is attached to the protective cover plate 110.
[0075] In some embodiments, step S110 is performed by laminating the first adhesive layer 120 on the protective cover plate 110 at about 130 degrees Celsius for about 40 minutes, but the present disclosure is not limited thereto.
[0076] In some embodiments, a black matrix (BM) layer can be formed on the protective cover plate 110 before step S110. After step S110, the first adhesive layer 120 is in contact with the black matrix layer.
[0077] Step S120: A plurality of curved conductive wires 130 is disposed on the first adhesive layer 120.
[0078] In some embodiments, step S120 can comprise: winding an enameled wire 130A (see FIG. 2A) on the first adhesive layer 120; and cutting the enameled wire 130A to form the curved conductive wires 130. Figure 5C Figure 7B In some embodiments, the step of cutting the enameled wire 130A to form the curved conductive wires 130 is performed by a laser cutting process, but the present disclosure is not limited thereto.
[0079] In some embodiments, the step of cutting the enameled wire 130A to form the curved conductive wires 130 is performed by a laser cutting process, but the present disclosure is not limited thereto.
[0080] Step S130: The second adhesive layer 140 is covered on the curved conductive wires 130 and the first adhesive layer 120.
[0081] In some embodiments, step S130 is performed by continuously laminating the second adhesive layer 140 on the first adhesive layer 120 at about 130 degrees Celsius for about 40 minutes, but the present disclosure is not limited thereto.
[0082] Step S140 : Soldering the circuit board 150 to the bent wire 130 .
[0083] In some embodiments, step S140 is performed by a laser welding process, but the present disclosure is not limited thereto.
[0084] Please refer to Figure 4 , which is a flow chart illustrating a method for manufacturing a touch control assembly according to another embodiment of the present disclosure. Figure 4 As shown, and with reference Figure 1 and Figure 2 In this embodiment, the manufacturing method of the touch assembly includes steps S210 to S240.
[0085] Step S210 : disposing a plurality of bent conductive lines 130 on the first adhesive layer 120 .
[0086] In some embodiments, step S210 may include: using the enameled wire 130A (see Figure 5C and Figure 7B ) is wound on the first adhesive layer 120; and the enameled wire 130A is cut to form a bent wire 130.
[0087] Step S220 : Covering the second adhesive layer 140 on the bent conductive line 130 and the first adhesive layer 120 .
[0088] In some embodiments, step S220 is performed by continuously laminating the second adhesive layer 140 on the first adhesive layer 120 at about 130 degrees Celsius for about 40 minutes, but the present disclosure is not limited thereto.
[0089] Step S230 : Soldering the circuit board 150 to the bent wire 130 .
[0090] In some embodiments, step S230 is performed by a laser welding process, but the present disclosure is not limited thereto.
[0091] Step S240 : transferring the assembly including the first adhesive layer 120 , the bent conductive line 130 , the second adhesive layer 140 and the circuit board 150 onto the protective cover 110 .
[0092] Compared to Figure 3 The embodiment shown, Figure 4In the embodiment shown, the combination of the first adhesive layer 120, the curved conductive line 130 and the second adhesive layer 140 is transferred to the protective cover 110 only after the lamination process of the second adhesive layer 140, thereby effectively avoiding the problem of high temperature in the lamination process damaging the black matrix layer on the protective cover 110.
[0093] Please refer to Figures 5A to 5J . Figures 5A to 5J Schematic diagrams illustrating the intermediate steps of a method for manufacturing a touch assembly according to an embodiment of the present disclosure. Figure 4 A specific embodiment of the manufacturing method shown will be described in detail below.
[0094] like Figure 5A As shown, in this step, release films RF1 and RF2 are respectively attached to opposite sides of the first adhesive layer 120 .
[0095] like Figure 5B As shown, this step is a continuation of Figure 5A In this step, the release film RF2 is torn off, and then the embedded wire EW is set on the surface of the first adhesive layer 120 originally attached with the release film RF2. The embedded wire EW can be wound on the first adhesive layer 120 using a winding machine 910. The embedded wire EW after winding is U-shaped, as shown in FIG. Figure 5B However, the present disclosure is not limited thereto.
[0096] like Figure 5C As shown, this step is a continuation of Figure 5B In this step, the enameled wire 130A is wound on the first adhesive layer 120. The winding method is, for example, winding the enameled wire 130A along a reciprocating and circuitous path on the first adhesive layer 120, so that the enameled wire 130A partially covers the pre-buried wire EW. Specifically, as Figure 5C As shown, the wound enameled wire 130A is disposed on the first adhesive layer 120 in a checkerboard pattern, and three edges of the checkerboard pattern overlap the embedded wire EW.
[0097] like Figure 5D As shown, this step is a continuation of Figure 5C The step shown. In this step, a single enameled wire 130A is cut to form a plurality of curved conductors 130. Specifically, this step can be performed by peeling the pre-buried wire EW from the first adhesive layer 120, causing the enameled wire 130A to break and form the curved conductor 130. The mechanism of peeling the pre-buried wire EW to break the enameled wire 130A is similar to the disassembly of the outer packaging of a cigarette box. Compared to the method of cutting the enameled wire 130A with a knife, this step will not leave a knife mark on the first adhesive layer 120. It can be seen that step S210 can be performed in sequence Figure 5B 、 Figure 5CWith Figure 5D The step S220 can be implemented by sequentially performing the steps shown in
[0098] In some embodiments, the wire diameter of the embedded wire EW is larger than that of the enameled wire 130A. In this way, the thicker embedded wire EW has a larger tensile strength than the thinner enameled wire 130A, so that the embedded wire EW can be prevented from being broken during the peeling of the embedded wire EW and the breaking of the enameled wire 130A. In one embodiment, the wire diameter of the embedded wire EW is about 20 μm, and the wire diameter of the enameled wire 130A is about 5 μm, but the present disclosure is not limited thereto.
[0099] As shown in Figure 5E , the step S210 is followed by a step S211. In the step S211, the water adhesive 140A can be coated on the first adhesive layer 120 by using the glue coater 920. Specifically, the water adhesive 140A is coated on the outer edge of the first adhesive layer 120. In some embodiments, the water adhesive 140A is a light-cured adhesive. For example, the light-cured adhesive can be hardened after being irradiated by ultraviolet light. In this way, the water adhesive 140A coated on the outer edge of the first adhesive layer 120 can be hardened into an outer wall by simultaneously irradiating light in the step S211. Figure 5D As shown in
[0100] , the step S210 is followed by a step S212. In the step S212, the water adhesive 140A can be continuously coated on the first adhesive layer 120 by using the glue coater 920 to cover the curved wire 130. That is, the water adhesive 140A is coated and filled in the space inside the aforementioned outer wall in the step S212. In other embodiments, the step S212 can also use a glue coating method such as scraping, dispensing, slitter, filling, or the like. Figure 5F Figure 5E As shown in , the step S210 is followed by a step S213. In the step S213, the pressing plate 940 is covered on the water adhesive 140A, and the roller 950 is rolled on the pressing plate 940. In this way, the water adhesive 140A can be hardened into the second adhesive layer 140 with a uniform thickness by simultaneously irradiating light in the step S213.
[0101] Figure 5G As shown in Figure 5F , the step S210 is followed by a step S214. In the step S214, the pressing plate 940 can be removed after the water adhesive 140A is hardened into the second adhesive layer 140. It can be understood that the step S220 can be implemented by sequentially performing the steps shown in ,
[0102] , Figure 5H , Figure 5G and Figure 5E . Figure 5F Figure 5G Figure 5H
[0103] As shown in Figure 5I , the step S210 is followed by a step S215. In the step S215, the water adhesive 140A can be coated on the first adhesive layer 120 by using the glue coater 920. Specifically, the water adhesive 140A is coated on the outer edge of the first adhesive layer 120. In some embodiments, the water adhesive 140A is a light-cured adhesive. For example, the light-cured adhesive can be hardened after being irradiated by ultraviolet light. In this way, the water adhesive 140A coated on the outer edge of the first adhesive layer 120 can be hardened into an outer wall by simultaneously irradiating light in the step S215. Figure 5H In this step, the circuit board 150 is soldered to the bent wire 130 (ie, step S230 ).
[0104] Please refer to Figure 6 , which is a drawing Figure 5I A partial cross-sectional view of Figure 6 As shown, a welding machine 930 can be used to weld the circuit board 150 to the curved wire 130. A bonding pad 151 is provided on the circuit board 150. A metal layer 152 is provided on the bonding pad 151. For example, the material of the metal layer 152 includes tin, but the present disclosure is not limited to this. For example, the welding machine 930 is a laser welding machine. The laser can penetrate the first adhesive layer 120 and the second adhesive layer 140 and hit the curved wire 130 in contact with the metal layer 152. In some embodiments, the melting point of the outer covering layer 132 of the curved wire 130 is lower than the melting point of the metal layer 152, so that the high temperature generated by the laser can first vaporize the outer covering layer 132 to expose the conductive core 131 of the curved wire 130, and then melt the metal layer 152 to weld to the conductive core 131.
[0105] like Figure 5J As shown, this step is a continuation of Figure 5I In this step, the combination of the first adhesive layer 120, the bent conductive wire 130, the second adhesive layer 140 and the circuit board 150 is transferred onto the protective cover 110 (ie, step S240). Figure 5J In the embodiment shown, the aforementioned combination is to first peel off the release film RF1, and then transfer the first adhesive layer 120 to the protective cover 110. In addition, in this step, the release film RF3 can also be attached to the second adhesive layer 140 to protect the second adhesive layer 140.
[0106] Please refer to Figures 7A to 7H . Figures 7A to 7H Schematic diagrams illustrating the intermediate steps of a method for manufacturing a touch assembly according to an embodiment of the present disclosure. Figure 4 Another specific embodiment of the manufacturing method shown will be described in detail below.
[0107] like Figure 7A As shown, in this step, release films RF1 and RF2 are respectively attached to opposite sides of the first adhesive layer 120 .
[0108] like Figure 7B As shown, this step is a continuation of Figure 7A In this step, the release film RF2 is torn off, and then the enameled wire 130A is wound on the first adhesive layer 120. The winding method is, for example, to wind the wire on the first adhesive layer 120 along a reciprocating and circuitous path. Specifically, as Figure 7BAs shown, the wound enameled wire 130A is arranged on the first adhesive layer 120 in a chessboard pattern.
[0109] As shown, the second adhesive layer 140 is in sheet form. Figure 7C As shown, the second adhesive layer 140 is in sheet form. Figure 7B As shown, the second adhesive layer 140 is in sheet form. Figure 5H As shown, the second adhesive layer 140 is in sheet form.
[0110] As shown, the second adhesive layer 140 is in sheet form. Figure 7D As shown, the second adhesive layer 140 is in sheet form. Figure 7C As shown, the second adhesive layer 140 is in sheet form. Figure 7B As shown, the second adhesive layer 140 is in sheet form. Figure 7C As shown, the second adhesive layer 140 is in sheet form. Figure 7D As shown, the second adhesive layer 140 is in sheet form.
[0111] In some embodiments, the laser used by the cutting machine 960 is a picosecond laser, a femtosecond laser, a CO2 laser or the like, but the present disclosure is not limited thereto.
[0112] As shown, the second adhesive layer 140 is in sheet form. Figure 7E As shown, the second adhesive layer 140 is in sheet form. Figure 7D As shown, the second adhesive layer 140 is in sheet form.
[0113] As shown, the second adhesive layer 140 is in sheet form. Figure 7F As shown, the second adhesive layer 140 is in sheet form. Figure 7E As shown, the second adhesive layer 140 is in sheet form. Figure 6and related descriptions, which are not described here. Therefore, step S230 can be implemented by sequentially performing steps shown in Figure 7E and Figure 7F .
[0114] As shown in Figure 7G , this step is subsequent to the step shown in Figure 7F . In this step, protective paint can be sprayed on the soldered circuit board 150. The protective paint is, for example, three anti-glue, but the present disclosure is not limited thereto. In some embodiments, this step can also be subsequent to the step shown in Figure 5I .
[0115] As shown in Figure 7H , this step is subsequent to the step shown in Figure 7G . In this step, the combination including the first adhesive layer 120, the curved conductive wire 130, the second adhesive layer 140, and the circuit board 150 is transferred to the protective cover plate 110 (i.e., step S240). In the embodiment shown in Figure 7H , the aforementioned combination is transferred by peeling off the release film RF1 and then adhering the first adhesive layer 120 to the protective cover plate 110. The release film RF3 still adheres to the second adhesive layer 140 to protect the second adhesive layer 140.
[0116] From the above detailed description of the specific embodiments of the present disclosure, it can be clearly seen that, in the touch assembly of the present disclosure, since each curved conductive wire is a wire including a conductive inner core and an outer layer, the winding technology can be used to manufacture the curved conductive wire in the touch assembly, thereby avoiding the high pollution and high energy consumption problems of the conventional complex process of using indium tin oxide (ITO) as a transparent electrode. By limiting the thickness and the initial adhesion of the first adhesive layer within a specific range, the problem of the curved conductive wire jumping relative to the first adhesive layer in the winding process can be effectively avoided. In the manufacturing method of the touch assembly of the present disclosure, the combination of the first adhesive layer, the curved conductive wire, and the second adhesive layer is transferred to the protective cover plate after the lamination process of the second adhesive layer, thereby effectively avoiding the problem of damage to the black matrix layer on the protective cover plate caused by high temperature in the lamination process. In addition, by laminating the curved conductive wire between the first adhesive layer and the second adhesive layer, the gaps between the curved conductive wires can be filled by the first adhesive layer and the second adhesive layer, thereby effectively reducing the visibility (i.e., reducing the generation of shadows) of the curved conductive wire from one side of the second adhesive layer.
[0117] Although the present disclosure has been disclosed with embodiments as above, it is not intended to limit the present disclosure, and any person skilled in the art can make various modifications and decorations without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the appended claims.
Claims
1. A touch control assembly, characterized in that: Include: a protective cover; a first adhesive layer disposed on the protective cover, wherein a thickness of the first adhesive layer is in a range of 20 μm to 200 μm, and an initial tack of the first adhesive layer is in a range of 1800 gf / in to 4000 gf / in; a plurality of curved conductive wires disposed on the first adhesive layer and comprising a first group of conductive wires and a second group of conductive wires, the first group of conductive wires extending along a first direction, the second group of conductive wires extending along a second direction and overlapping the first group of conductive wires, wherein each of the plurality of curved conductive wires comprises a conductive inner core and an outer covering; as well as A second adhesive layer covers the plurality of bent conductive lines and the first adhesive layer.
2. The touch control assembly according to claim 1, wherein: Each of the plurality of curved conductive wires is an enameled wire.
3. The touch control assembly according to claim 1, wherein: The material of the outer covering layer is selected from the group consisting of polyvinyl formal, polyurethane, polyamide, polyester, polyester-polyimide, polyamide-polyimide and polyimide.
4. The touch control assembly according to claim 1, wherein: The conductive core has a wire diameter ranging from 2 μm to 5 μm.
5. The touch control assembly according to claim 1, wherein: A thickness of the outer coating layer is in a range of 1 μm to 3 μm.
6. The touch control assembly according to claim 1, wherein: A thickness of the second adhesive layer is in a range of 25 μm to 150 μm.
7. The touch control assembly according to claim 1, wherein: The first adhesive layer and the second adhesive layer fill the gaps between the first group of conductive lines and the gaps between the second group of conductive lines.
8. A method for manufacturing a touch control assembly, characterized in that: Include: Disposing a plurality of curved conductive wires on a first adhesive layer, wherein the plurality of curved conductive wires include a first group of conductive wires and a second group of conductive wires, the first group of conductive wires extending along a first direction, the second group of conductive wires extending along a second direction and overlapping the first group of conductive wires, wherein each of the plurality of curved conductive wires includes a conductive core and an outer covering; covering a second adhesive layer on the plurality of bent conductive lines and the first adhesive layer; as well as The first adhesive layer is attached to a protective cover.
9. The method for manufacturing a touch control assembly according to claim 8, wherein: Laminating the first adhesive layer to the protective cover includes: A combination comprising the first adhesive layer, the plurality of bent conductive lines, and the second adhesive layer is transferred onto the protective cover.
10. The method for manufacturing a touch control assembly according to claim 9, wherein: The step of disposing the plurality of curved conductive lines on the first adhesive layer comprises: Winding an enameled wire on the first adhesive layer; and The enameled wire is cut to form the plurality of bent conductors.
11. The method for manufacturing a touch control assembly according to claim 10, wherein: The step of disposing the plurality of curved conductive lines on the first adhesive layer further comprises: Before the enameled wire is wound on the first adhesive layer, a pre-buried wire is arranged on the first adhesive layer, wherein the enameled wire is wound on the first adhesive layer so that the enameled wire partially covers the pre-buried wire. The cutting of the enameled wire to form the plurality of curved conductors comprises: The pre-buried wire is peeled off from the first adhesive layer, so that the enameled wire is broken to form the plurality of bent conductors.
12. The method for manufacturing a touch control assembly according to claim 11, wherein: The diameter of the embedded wire is greater than the diameter of the enameled wire.
13. The method for manufacturing a touch control assembly according to claim 11, wherein: The method of covering the second adhesive layer on the plurality of curved conductive lines and the first adhesive layer comprises: coating a water-based adhesive on the first adhesive layer to cover the plurality of curved conductive lines; and The hydrogel is hardened to form the second adhesive layer.
14. The method for manufacturing a touch control assembly according to claim 13, wherein: The method of covering the second adhesive layer on the plurality of curved conductive lines and the first adhesive layer further comprises: covering a pressing plate on the hydrogel; and The pressing plate is rolled by a roller.
15. The method for manufacturing a touch control assembly according to claim 10, wherein: The cutting of the enameled wire to form the plurality of bent conductors is performed by a laser cutting process.
16. The method for manufacturing a touch control assembly according to claim 15, wherein: Further including: Before cutting the enameled wire to form the plurality of curved conductors, the second adhesive layer is covered on the enameled wire and the first adhesive layer, wherein the cutting of the enameled wire to form the plurality of curved conductors is performed while cutting the second adhesive layer.
17. The method for manufacturing a touch control assembly according to claim 8, wherein: The first adhesive layer is adhered to the protective cover before the plurality of bent conductive lines are arranged on the first adhesive layer.
18. The method for manufacturing a touch control assembly according to claim 8, wherein: A thickness of the first adhesive layer is in a range of 20 μm to 200 μm, and an initial tack of the first adhesive layer is in a range of 1800 gf / in to 4000 gf / in.
19. The method for manufacturing a touch control assembly according to claim 8, wherein: The second adhesive layer is covered on the plurality of bent conductive lines and the first adhesive layer so that the first adhesive layer and the second adhesive layer fill the gaps between the first group of conductive lines and the gaps between the second group of conductive lines.
20. The method for manufacturing a touch control assembly according to claim 8, wherein: Further including: A circuit board is soldered to the plurality of bent wires.