A solder ball management system and method

Abstract

This invention relates to the field of integrated circuit design technology, and particularly to a solder ball management system and method. The solder ball management system includes: an information acquisition module for acquiring solder ball layers and port layers from an input design layout, wherein the port layer includes multiple ports; a solder ball creation module for creating solder balls on the solder ball layers based on a preset creation mode; and a solder ball connection module for connecting solder balls to the ports, and / or connecting solder balls from different solder ball layers. The solder ball management system of this application achieves automatic creation, arrangement, and connection of solder balls through the collaboration of multiple functional modules, solving the problems of low efficiency and yield in existing solder ball layout management.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit design technology, and in particular to a solder ball management system and method. Background Technology

[0002] As semiconductor processes gradually approach their physical limits, multi-chip systems have become an important development direction in the post-Moore's Law era due to their advantages such as improved yield, reduced cost, and heterogeneous integration. In such advanced packaging designs, the layout and connection management of solder balls, which are responsible for interconnecting between chips, are crucial and directly affect the system's signal integrity, power distribution network performance, and final yield.

[0003] Currently, while existing electronic design automation (EDA) tools possess basic solder ball generation and routing functions, most are designed for single-chip or traditional substrate designs and lack dedicated support for collaborative design of multi-chip systems. In actual design, engineers often need to rely on multiple tool platforms or manual operations to complete the arrangement, interconnection, and optimization of solder balls on different chips, which is cumbersome and inefficient. Especially when dealing with solder ball connections across chips, existing methods are difficult to achieve global optimization, which can easily lead to problems such as excessively long signal paths, cross-connection interference, and power / ground network mismatch. At the same time, the creation, connection, exchange, and removal of solder balls have not formed a unified lifecycle management, resulting in a large amount of modification work when design changes occur and making it easy to introduce human error. Summary of the Invention

[0004] To address the technical problems of low efficiency and yield in existing solder ball layout management, this invention provides a solder ball management system and method.

[0005] The present invention provides a solder ball management system, comprising: an information acquisition module for acquiring a solder ball layer and a port layer from an input design layout, wherein the port layer includes multiple ports; a solder ball creation module for creating solder balls on the solder ball layer based on a preset creation mode; a solder ball connection module for connecting the solder balls to the ports, and / or connecting solder balls from different solder ball layers; a solder ball connection exchange module for exchanging the connection relationships between two pairs of solder balls and the ports, or between two pairs of solder balls; a solder ball connection release module for disconnecting the connection relationship between the solder balls and the ports and / or between two solder balls; and a solder ball removal module for removing some or all of the solder balls on the solder ball layer.

[0006] Preferably, the preset creation mode is used to provide a layout scheme for the solder balls, which includes a global creation mode, a local creation mode, a center creation mode, a matrix creation mode, and a chessboard creation mode.

[0007] Preferably, the solder ball creation module includes a constraint unit, which is used to add distance constraints and / or area constraints to the preset creation mode.

[0008] Preferably, the solder ball connection module includes an optimization unit, which is used to perform cross-optimization on the connection results between the solder ball and the port, as well as the connection results between the solder balls.

[0009] To solve the above-mentioned technical problems, the present invention provides another technical solution as follows: a solder ball management method, applied to the solder ball management system as described in any of the above claims, comprising: obtaining a solder ball layer and a port layer based on a design layout, wherein the port layer includes multiple ports; creating solder balls on the solder ball layer based on a preset creation mode; connecting the solder balls to the ports; and / or connecting solder balls from different solder ball layers.

[0010] Preferably, connecting the solder ball to the port includes: acquiring the solder ball to be connected and the port, and establishing a solder ball queue and a port queue; acquiring the solder ball connection order of the solder ball queue and the port connection order of the port queue; and connecting the solder ball to the port according to the solder ball connection order and the port connection order.

[0011] Preferably, obtaining the connection order of the welding balls in the welding team's formation includes: obtaining the starting point position and connection direction of the welding balls; and sorting the welding balls based on the starting point position and the connection direction.

[0012] Preferably, connecting the solder balls of different solder ball layers includes: obtaining a first solder ball layer and a second solder ball layer, wherein the first solder ball layer includes a first solder ball group and the second solder ball layer includes a second solder ball group; sorting each solder ball in the first solder ball group; and finding the nearest solder ball in the second solder ball group for each solder ball in the first solder ball group according to the order and connecting them, until all solder balls in the first solder ball group or the second solder ball group are connected.

[0013] Preferably, after the solder balls of different solder ball layers are connected, the process includes: performing cross-detection on the connection results of the solder balls of different solder ball layers; if the connection lines of two pairs of solder balls intersect, then swap the connection relationship between the two pairs of solder balls until all solder ball connection lines no longer intersect.

[0014] Compared with the prior art, the solder ball management system and method provided by the present invention have the following advantages:

[0015] 1. This invention provides a solder ball management system. Through the coordinated operation of three core modules—information acquisition, solder ball creation, and connection—this system achieves standardization and automation of the entire solder ball management process, improving work efficiency and reducing errors caused by manual operation. The information acquisition module accurately extracts data from the solder ball layer and port layer, avoiding human error and laying a precise data foundation for subsequent operations. The solder ball creation module supports flexible generation of solder ball layouts. The connection module simultaneously supports interconnection between solder balls and ports or cross-layer solder balls, breaking the limitations of the traditional single connection mode and significantly improving the efficiency and consistency of circuit layout design.

[0016] 2. The solder ball management system provided in this embodiment of the invention has a solder ball creation module that provides multiple creation modes, enabling the system to adapt to different layout requirements and significantly enhancing its adaptability to complex scenarios.

[0017] Understandably, the global creation mode is suitable for scenarios where solder balls need to be evenly distributed across the entire layer, the local creation mode can be used for precise layout of specific areas of the layout, the center creation mode can achieve symmetrical solder ball distribution around key components, and the matrix creation and chessboard creation respectively meet the requirements of regular high-density layout and staggered anti-interference layout.

[0018] 3. The solder ball management system provided in this embodiment of the invention includes a constraint unit in its solder ball creation module. The introduction of the constraint unit allows the solder ball creation process to be restricted by distance or area rules. Distance constraints can avoid soldering short circuits or signal crosstalk caused by excessively small solder ball spacing. Area constraints can prohibit the creation of solder balls in prohibited areas of the layout, ensuring the stability of the package structure and effectively solving the problems of "physical conflict" and "performance risks" in solder ball layout, thereby generating the optimal layout under constraint conditions.

[0019] 4. The solder ball management system provided in this embodiment of the invention includes an optimization unit in its solder ball creation module. The optimization unit detects and resolves connection crossover issues, avoids signal interference caused by wire crossover, and significantly improves the electrical performance and layout rationality of solder ball connections.

[0020] 5. The solder ball management system provided in this embodiment of the invention further includes a solder ball connection exchange module for exchanging solder ball connection relationships, a solder ball connection release module for releasing solder ball connection relationships, and a solder ball removal module for removing solder balls. Through the newly added exchange, release, and removal modules, a complete closed loop of "creation-connection-adjustment-cancellation" is formed, realizing the "full lifecycle controllability" of solder ball management, enhancing the dynamic adjustment capability of the system, enabling users to flexibly modify connection relationships or remove redundant solder balls, adapt to design change requirements, and improve design iteration efficiency.

[0021] 6. This invention also provides a solder ball management method, applied to the above-mentioned solder ball management system, which transforms the modular functions of the system into executable process steps, ensuring the standardization and repeatability of operations, and realizing full-process automation from layout processing to solder ball connection; the steps of "obtaining layer information - creating solder balls - completing connection" are logically clear, reducing the threshold for manual operation, and providing a unified process framework for subsequent steps, which significantly improves the consistency of output from engineers with different experience levels.

[0022] 7. The solder ball management method provided in this embodiment of the invention establishes a queue of solder balls and ports and connects them in an orderly manner, ensuring the orderliness and predictability of the connection process, eliminating the congestion problem caused by the traditional "nearest connection", and realizing the precision and efficiency of "solder ball-port" connection; establishing a queue can avoid connection chaos, obtaining the connection order can optimize the connection logic according to actual needs, and connecting in order ensures that the operation is traceable.

[0023] 8. The solder ball management method provided in this embodiment of the invention sorts the solder ball array based on the starting point position and connection direction, so that the solder ball connection order is more in line with the actual design requirements, reduces wiring length and crossover, and avoids excessively long connection paths caused by disordered sorting, which leads to signal transmission extension.

[0024] 9. The solder ball management method provided in this embodiment of the invention achieves high efficiency and low loss in cross-layer solder ball connection through the steps of "acquiring cross-layer solder ball groups - sorting - connecting nearby". The sorting step ensures that the connection logic is orderly, and the connection nearby can minimize the cross-layer connection length, reduce inter-layer signal interference and delay, and reduce parasitic effects.

[0025] 10. The solder ball management method provided in this embodiment of the invention completely solves the "connection crossover" problem in cross-layer solder ball connections through cross-detection and exchange mechanisms. Cross-detection can accurately identify conflicting connections, while exchanging connection relationships optimizes the layout without changing the number of solder balls, avoiding signal crosstalk and wiring difficulties caused by crossover, and improving connection reliability and electrical performance. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the structure of a solder ball management system provided in an embodiment of the present invention. Figure 1 .

[0028] Figure 2 This is a solder ball layout generated based on a global creation mode in a solder ball management system provided by an embodiment of the present invention.

[0029] Figure 3 This is a solder ball layout generated based on a local creation mode in a solder ball management system provided by an embodiment of the present invention.

[0030] Figure 4 This is a solder ball layout generated based on a central creation mode in a solder ball management system provided by an embodiment of the present invention.

[0031] Figure 5 This is a solder ball layout generated based on a matrix creation mode in a solder ball management system provided by an embodiment of the present invention.

[0032] Figure 6 This invention provides a solder ball layout generated based on a chessboard creation mode in a solder ball management system.

[0033] Figure 7 This is a solder ball layout generated by setting constraints in a solder ball management system provided in an embodiment of the present invention.

[0034] Figure 8 This is a schematic diagram of the structure of a solder ball creation module in a solder ball management system provided in an embodiment of the present invention. Figure 1 .

[0035] Figure 9 This is a schematic diagram of the structure of a solder ball creation module in a solder ball management system provided in an embodiment of the present invention. Figure 2 .

[0036] Figure 10 This is a schematic diagram of the structure of a solder ball management system provided in an embodiment of the present invention. Figure 2 .

[0037] Figure 11 This is a schematic diagram of the connection between solder balls and ports in a solder ball management system provided by an embodiment of the present invention.

[0038] Figure 12 This is a flowchart of the steps of a solder ball management method provided in an embodiment of the present invention.

[0039] Figure 13 This is a flowchart illustrating the steps involved in connecting solder balls and ports in a solder ball management method provided by an embodiment of the present invention.

[0040] Figure 14 This is a flowchart illustrating the steps of sorting welding team columns in a welding ball management method provided by an embodiment of the present invention.

[0041] Figure 15This is a schematic diagram of the welding team queue arrangement in a welding ball management method provided in an embodiment of the present invention.

[0042] Figure 16 This is a flowchart illustrating the steps involved in connecting solder balls in a solder ball management method provided by an embodiment of the present invention.

[0043] Figure 17 This is a schematic diagram of the automatic wiring structure in a solder ball management method provided in an embodiment of the present invention.

[0044] Figure 18 This is a flowchart of the cross-optimization steps in a solder ball management method provided in an embodiment of the present invention.

[0045] Figure 19 This is a schematic diagram of the cross-connection structure in a solder ball management method provided in an embodiment of the present invention.

[0046] Figure 20 This is a schematic diagram of the structure after the first wire exchange in a solder ball management method provided in an embodiment of the present invention.

[0047] Figure 21 This is a schematic diagram of the structure after the second wire exchange in a solder ball management method provided in an embodiment of the present invention.

[0048] Explanation of reference numerals in the attached diagram:

[0049] 10. Solder ball management system;

[0050] 1. Information Acquisition Module; 11. Constraint Unit; 12. Optimization Unit; 2. Solder Ball Creation Module; 3. Solder Ball Connection Module; 4. Solder Ball Connection Exchange Module; 5. Solder Ball Connection Deactivation Module; 6. Solder Ball Removal Module. Detailed Implementation

[0051] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0052] In the embodiments provided by this invention, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined based on A. However, it should also be understood that determining B based on A does not mean determining B solely based on A; B can also be determined based on A and / or other information.

[0053] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Those skilled in the art should also recognize that the embodiments described in the specification are optional embodiments, and the actions and modules involved are not necessarily essential to the invention.

[0054] In various embodiments of the present invention, it should be understood that the sequence number of each process does not necessarily imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0055] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, or they may sometimes be executed in reverse order, depending on the functions involved. It is particularly important to note that each block in a block diagram and / or flowchart, and combinations of blocks in block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0056] Please see Figure 1 This invention provides a solder ball management system, comprising: an information acquisition module for acquiring a solder ball layer and a port layer from an input design layout, wherein the port layer includes multiple ports; a solder ball creation module for creating solder balls on the solder ball layer based on a preset creation mode; and a solder ball connection module for connecting solder balls to ports and / or connecting solder balls from different solder ball layers.

[0057] It should be noted that the solder ball management system provided by the present invention can be applied to the design of multi-core systems to manage the solder balls that connect the cores throughout their entire life cycle. It can not only realize the arrangement and connection of solder balls in a single core, but also support the protocol design and arrangement connection between solder balls in multiple cores.

[0058] This invention provides a solder ball management system. Through the coordinated operation of three core modules—information acquisition, solder ball creation, and connection—the system achieves standardization and automation of the entire solder ball management process, improving work efficiency and reducing errors caused by manual operation. The information acquisition module accurately extracts data from the solder ball layer and port layer, avoiding human error and laying a precise data foundation for subsequent operations. The solder ball creation module supports flexible generation of solder ball layouts. The connection module simultaneously supports interconnection between solder balls and ports or cross-layer solder balls, breaking the limitations of traditional single connection modes and significantly improving the efficiency and consistency of circuit layout design.

[0059] Specifically, there are signal connections between the information acquisition module, the solder ball creation module, and the solder ball connection module.

[0060] It should be noted that the information acquisition module is used to parse the design layout input by the user and can automatically identify and extract the solder ball layer and port layer in the design layout. The information acquisition module supports data parsing of layout design formats including but not limited to GDSII (Graphic Design System II Stream Format), OASIS (Open Artwork System Interchange Standard), LEF (Library Exchange Format), DEF (Design Exchange Format), etc., and is also compatible with data variants generated by different EDA (Electronic Design Automation) tools.

[0061] It should be understood that the design layout input by the user can be a conventional chip design layout or a multi-chip system design layout.

[0062] In some embodiments, the user inputs the design layout of the multi-core system into the information acquisition module. The information acquisition module parses the design layout to identify the solder ball layer and port layer of each core in the multi-core system. Specifically, the solder ball layer of the core is generally located at the top and / or bottom layer of the core, and the port layer usually contains multiple port information. The information processing module transmits the parsed information to the solder ball creation module. The solder ball creation module automatically creates a solder ball array on the solder ball layer according to the preset creation mode selected by the user and related information, and then establishes electrical connections between the solder balls and ports, as well as between different solder ball layers, through the solder ball connection module.

[0063] Specifically, the preset creation modes are used to provide layout schemes for solder balls, including global creation mode, local creation mode, center creation mode, matrix creation mode, and chessboard creation mode.

[0064] The solder ball management system provided in this embodiment of the invention has a solder ball creation module that provides multiple creation modes. Users can select the corresponding creation mode to create solder ball arrays according to actual application needs, enabling the system to adapt to different layout requirements and significantly enhancing its adaptability to complex scenarios.

[0065] It should be noted that the global creation mode refers to generating a uniform solder ball array within the entire solder ball layer boundary, at a user-defined spacing, avoiding the boundary. It is suitable for scenarios where solder balls need to be evenly distributed throughout the entire layer. See [link to relevant documentation]. Figure 2 ;

[0066] Local creation mode refers to generating a solder ball array within a user-specified area based on user-defined spacing. In other words, the solder balls are only arranged within a specified local area, which may include, but is not limited to, rectangles, circles, and polygons. Local creation mode is suitable for precise layout of specific areas on a board. (See also...) Figure 3 ;

[0067] The center-creation mode refers to generating solder balls symmetrically outwards from a user-specified fixed point. This results in a centrally symmetrical layout of the solder balls, suitable for solder ball arrangements that need to be placed around critical components. (See also...) Figure 4 ;

[0068] The matrix creation mode will create a regular solder ball matrix based on the number of rows, columns, and starting coordinates input by the user. (See also...) Figure 5 The chessboard creation mode uses an interleaved layout to generate solder balls, which allows for the creation of more solder balls within the same area, increasing solder ball density. Its interleaved layout also effectively reduces crosstalk between signals. (See also...) Figure 6 .

[0069] Further, please refer to Figure 7 and Figure 8 The solder ball creation module includes constraint units, which are used to add distance constraints and / or area constraints to a preset creation mode.

[0070] The solder ball management system provided in this embodiment of the invention includes a constraint unit in its solder ball creation module. The introduction of the constraint unit allows the solder ball creation process to be restricted by distance or area rules. Distance constraints can avoid soldering short circuits or signal crosstalk caused by excessively small solder ball spacing, while area constraints can prohibit the creation of solder balls in prohibited areas of the layout, ensuring the stability of the package structure. This effectively solves the problems of "physical conflict" and "performance risks" in solder ball layout. Through the collaboration of rich creation modes and intelligent constraints, the system achieves rapid, flexible, and compliant generation of solder ball layout, greatly improving the efficiency and reliability of solder ball layout.

[0071] As a feasible implementation method, the solder ball creation module also supports constraint creation. That is, before creating a solder ball, in addition to selecting the creation mode, the user can also set the constraints for solder ball creation, such as setting distance constraints or area constraints.

[0072] In some embodiments, when a user selects a creation mode, they set a constraint range for the distance between two solder balls. In this case, the solder ball creation module checks the distance between each new solder ball and the existing solder balls before generating each new solder ball. If the distance is not within the preset constraint range, the creation of the solder ball at that position is prohibited, i.e., the generation of the solder ball is withdrawn. Otherwise, a new solder ball is created at that position.

[0073] In other embodiments, when selecting a creation mode, the user can define one or more no-hook zones. The size and shape of the no-hook zones can be set by the user according to actual needs. When creating solder balls, the solder ball creation module will automatically avoid the no-hook zones and will not generate solder balls in these areas. This design can ensure that when quickly generating solder ball arrays, the newly generated solder balls also avoid sensitive circuits, mechanical mechanisms, or reserved test areas on the chip.

[0074] Further, please refer to Figure 9 The solder ball connection module includes an optimization unit, which is used to perform cross-optimization on the connection results between solder balls and ports, as well as the connection results between solder balls.

[0075] It should be noted that after the solder ball creation module generates solder balls, the solder ball connection module can connect the solder balls to the ports of a specified core particle according to the user's settings, or connect solder balls from different core particles. For example, the solder ball on the top layer of core particle A can be connected to the solder ball on the bottom layer of core particle B, thereby achieving an electrical connection between the two core particles.

[0076] Understandably, after the solder ball connection module completes the connection between the solder ball and the port or solder ball, the optimization unit can detect the connection result and identify whether there is a crossover connection. If a crossover connection exists, the connection relationship between the two is swapped to eliminate the crossover connection. This process can be iterated until all crossover connections are eliminated, avoiding problems such as wiring tangles, increased signal delay, and aggravated crosstalk caused by crossover connections. This improves signal quality and wiring feasibility, and significantly enhances the electrical performance and layout rationality of the solder ball connection.

[0077] Further, please refer to Figure 10 The solder ball management system includes a solder ball connection exchange module: used to exchange the connection relationship between two pairs of solder balls and ports or the connection relationship between two pairs of solder balls; the solder ball connection exchange module supports the swapping of established connection relationships, and users can select two or more sets of solder ball connection relationships to exchange their connection targets.

[0078] For example: Please refer to Figure 11 The original connection was that solder ball A was connected to port 1 and solder ball B was connected to port 2. After the swap, solder ball A is connected to port 2 and solder ball B is connected to port 1.

[0079] This design allows users to flexibly adjust the logical connections even after the overall electrical connections are fixed, enabling them to perform localized optimizations and adjustments to the electrical connections of the core system.

[0080] In some embodiments, the solder ball management system further includes a solder ball connection release module for disconnecting the connection between a solder ball and a port and / or two solder balls; when the layout design changes or a connection error occurs, and it is necessary to delete the connection or partially reconnect, the user can select one or more solder balls according to the actual situation to disconnect them from the port or other solder balls; the solder ball connection release module supports batch release of solder ball connections.

[0081] The design of the solder ball connection release module provides an "undo" function for the electrical connections of the core system, greatly enhancing the fault tolerance and flexibility of the design process.

[0082] In some embodiments, the solder ball management system further includes a solder ball removal module for partially or completely removing solder balls from a solder ball layer; it supports deleting specified solder balls from a solder ball layer, specifically including two removal modes: one is partial removal, where the user can select or click on the solder balls to be deleted; the other is global removal, where the user can select one or more solder ball layers and delete all solder balls on the selected solder ball layers; this design can clear redundant solder balls, correct creation errors, or free up space for a new layout scheme, and is the basis for resource optimization and design iteration.

[0083] The solder ball management system provided in this embodiment of the invention further includes a solder ball connection exchange module for exchanging solder ball connection relationships, a solder ball connection release module for releasing solder ball connection relationships, and a solder ball removal module for removing solder balls. Through the newly added exchange, release, and removal modules, a complete closed loop of "creation-connection-adjustment-cancellation" is formed, realizing the "full lifecycle controllability" of solder ball management, enhancing the dynamic adjustment capability of the system, enabling users to flexibly modify connection relationships or remove redundant solder balls, adapt to design change requirements, and improve design iteration efficiency.

[0084] In other embodiments, the solder ball management system also includes a display module, which can display the hierarchical information of the design layout in real time, such as solder ball layer, port layer and solder balls, ports and other information on it. Users can select the corresponding solder ball layer to create solder balls, and click or drag solder balls or ports to perform operations such as swapping or removing them. The design of the display module transforms abstract instructions into intuitive images, making it easier for users to understand and operate.

[0085] Please see Figure 12 This invention also provides a solder ball management method, applied to any of the solder ball management systems described above, comprising:

[0086] Step S1: Obtain the solder ball layer and port layer based on the design layout. The port layer includes multiple ports.

[0087] Step S2: Create solder balls on the solder ball layer based on the preset creation mode;

[0088] Step S3: Connect the solder balls to the port, and / or connect solder balls from different solder ball layers.

[0089] This invention also provides a solder ball management method applied to the aforementioned solder ball management system. This method transforms the modular functions of the system into executable process steps, ensuring the standardization and repeatability of operations and achieving full automation from layout processing to solder ball connection. The steps of "obtaining layer information - creating solder balls - completing the connection" are logically clear, reducing the threshold for manual operation and providing a unified process framework for subsequent steps, which significantly improves the consistency of output from engineers with different experience levels.

[0090] It should be noted that the process of creating and connecting solder balls using the solder ball management system is as follows: the design layout is parsed through the information acquisition module to obtain the solder ball layer and port layer of the core; the solder ball layer to be created is selected and the creation mode is set; the solder ball is created on the solder ball layer based on the preset creation mode; finally, the solder ball is connected to the port or to the solder ball through the solder ball connection module.

[0091] Optionally, the preset creation modes include global creation mode, local creation mode, central creation mode, matrix creation mode, and chessboard creation mode. Users can select the corresponding solder ball creation mode according to their needs.

[0092] Specifically, before creating solder balls, constraints can be set for the solder balls to be created, such as limiting the spacing or placement of the solder balls.

[0093] Further, please refer to Figure 13 Connecting the solder ball to the port includes:

[0094] Step S31a: Obtain the solder balls and ports to be connected, and establish a solder ball queue and a port queue;

[0095] Step S32a: Obtain the solder ball connection order of the solder ball queue and the port connection order of the port queue;

[0096] Step S33a: Connect the solder balls to the ports according to the solder ball connection order and the port connection order.

[0097] It should be noted that when connecting the solder balls and ports within the core, the user needs to first select the solder balls and ports to be connected. The ports include power ports and signal ports. The user can select the corresponding ports to be connected according to actual needs and add the selected solder balls and ports to the solder ball team queue or port queue. Then, the solder balls and ports in the solder ball team queue and port queue are sorted, and the solder balls and ports are connected in sequence according to the sorting results.

[0098] The solder ball management method provided in this invention establishes a queue of solder balls and ports and connects them in an orderly manner, ensuring the orderliness and predictability of the connection process. This eliminates the congestion problem caused by the traditional "nearest connection" and achieves precision and efficiency in "solder ball-port" connection. Establishing a queue can avoid connection chaos, obtaining the connection order can optimize the connection logic according to actual needs, and sequential connection ensures that the operation is traceable.

[0099] Further, please refer to Figure 14 To obtain the solder ball connection order of the soldering team, including:

[0100] Step S321a: Obtain the starting point position and connection direction of the solder ball;

[0101] Step S322a: Sort the solder balls based on the starting point position and connection direction.

[0102] It should be noted that the relative position of the starting point indicates from which relative position the solder ball begins to connect to the port, specifically including the bottom left, bottom right, top left, and top right corners; the connection direction indicates in which direction the solder balls are sorted starting from the starting point, specifically including the horizontal and vertical directions. Please refer to [link / reference needed]. Figure 15 It shows the order of solder balls connected horizontally, starting from the bottom left corner. Once the solder ball queue and port queue are sorted, the solder balls and ports are connected sequentially, such as connecting a solder ball ranked 1 to a port ranked 1, connecting a solder ball ranked 2 to a port ranked 2, and so on.

[0103] In some embodiments, the order in which ports are added to the port queue is the order in which they are connected.

[0104] The solder ball management method provided in this invention sorts the solder ball array based on the starting point position and connection direction, making the solder ball connection order more in line with actual design requirements, reducing wiring length and intersections, and avoiding excessively long connection paths caused by disordered sorting, which would lead to signal transmission delays.

[0105] Further, please refer to Figure 16 Connecting solder balls of different solder ball layers, including:

[0106] Step S31b: Obtain a first solder ball layer and a second solder ball layer, wherein the first solder ball layer includes a first solder ball group and the second solder ball layer includes a second solder ball group;

[0107] Step S32b: Sort each solder ball in the first solder ball group;

[0108] Step S33b: Find the nearest solder ball in the second solder ball group for each solder ball in the first solder ball group in sequence and connect them, until all solder balls in the first solder ball group or the second solder ball group are connected.

[0109] It should be noted that the first solder ball layer and the second solder ball layer belong to different core particles. That is, the connection of solder balls in different solder ball layers is essentially the connection of solder balls between different core particles.

[0110] In some embodiments, the solder ball creation module names each solder ball based on ASCII characters while creating the solder balls. Since ASCII characters have an inherent order, the first solder ball group can be sorted according to its name. After determining the solder ball order of the first solder ball group, the module finds the nearest solder ball in the second solder ball group according to the order and connects the two solder balls. This process continues until all solder balls in one of the solder ball groups are connected.

[0111] It should be noted that during the automatic solder ball connection process, the following may occur: Figure 17 The situation shown is that the connection between the two pairs of solder balls has crossed. When the connection crosses, the wiring of this pair of solder balls may require the use of flying wires or a large loop to complete the wiring, which will reduce the signal transmission rate between the solder balls.

[0112] The solder ball management method provided in this embodiment of the invention achieves high efficiency and low loss in cross-layer solder ball connections through the steps of "acquiring cross-layer solder ball groups - sorting - connecting nearby". The sorting step ensures that the connection logic is orderly, and the connection nearby can minimize the cross-layer connection length, reduce inter-layer signal interference and delay, and reduce parasitic effects.

[0113] Further, please refer to Figure 18 After the solder balls of different solder ball layers are connected, the result includes:

[0114] Step S34b: Cross-check the connection results of solder balls in different solder ball layers;

[0115] Step S35b: If the connection lines of two pairs of solder balls intersect, then swap the connection relationships between these two pairs of solder balls until all solder ball connections no longer intersect.

[0116] In some embodiments, after the solder balls are connected, the connection result needs to be cross-detected by the optimization unit, and the two lines that cross are swapped to solve the problem of line splitting or signal delay caused by the line crossing.

[0117] Please see Figure 19 The example in the diagram has three pairs of intersecting lines: the line connecting 1 and a intersects with the line connecting 3 and b; the line connecting 4 and e intersects with the line connecting 2 and c; and the line connecting 4 and e intersects with the line connecting 5 and d. It should be noted that in the optimized method provided in this embodiment, a set of lines is exchanged only once in a single line exchange process. That is, the line connecting 4 and e intersects with both the lines connecting 2 and c and the line connecting 5 and d, but when exchanging line relationships, it only exchanges with one set of lines at a time. After the first line exchange, 3 connects to a, 1 connects to b, and 4 connects to c; these three sets of lines no longer intersect. Figure 20 As shown. However, the line connecting 2 and e intersects with the line connecting 5 and d. Therefore, a second swap is needed. After the swap, 2 and d are connected, and 5 and e are connected. The final result is as follows. Figure 21 As shown, the optimization of the intersection problem has been completed.

[0118] In other embodiments, after the solder balls and ports are connected, an optimization unit can be used to detect and optimize the connection results, and the specific optimization method is the same as the one described above.

[0119] The solder ball management method provided in this invention completely solves the "connection crossover" problem in cross-layer solder ball connections through cross-detection and exchange mechanisms. Cross-detection can accurately identify conflicting connections, while exchanging connection relationships optimizes the layout without changing the number of solder balls, avoiding signal crosstalk and wiring difficulties caused by crossover, and improving connection reliability and electrical performance.

[0120] The foregoing has provided a detailed description of a solder ball management system and method disclosed in the embodiments of the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of the present invention. Furthermore, those skilled in the art will recognize that, based on the ideas of the present invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of the present invention. Any modifications, equivalent substitutions, and improvements made within the principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A solder ball management system, characterized by, The solder ball management system comprises: An information acquisition module for acquiring a solder ball layer and a port layer from an input design layout, the port layer comprising a plurality of ports; A solder ball creation module for creating solder balls on the solder ball layer based on a preset creation mode; A solder ball connection module for connecting the solder balls with the ports and / or connecting the solder balls of different solder ball layers; A solder ball connection exchange module for exchanging the connection relationship between two pairs of the solder balls and the ports or the connection relationship between two pairs of the solder balls; A solder ball connection removal module for disconnecting the connection relationship between the solder balls and the ports and / or two solder balls; A solder ball removal module for removing part or all of the solder balls on the solder ball layer.

2. The solder ball management system of claim 1, wherein: The preset creation mode is used to provide a layout scheme of the solder balls, which comprises a global creation mode, a local creation mode, a center creation mode, a matrix creation mode and a chessboard creation mode.

3. The solder ball management system of claim 1, wherein: The solder ball creation module comprises a constraint unit for adding distance constraints and / or area constraints to the preset creation mode.

4. The solder ball management system of claim 1, wherein: The solder ball connection module comprises an optimization unit for cross-optimizing the connection results of the solder balls and the ports and the connection results between the solder balls.

5. A solder ball management method applied to the solder ball management system according to any one of claims 1 to 4, characterized in that, The method comprises: Acquiring a solder ball layer and a port layer based on a design layout, the port layer comprising a plurality of ports; Creating solder balls on the solder ball layer based on a preset creation mode; Connecting the solder balls with the ports and / or connecting the solder balls of different solder ball layers.

6. The solder ball management method of claim 5, wherein, Connecting the solder balls with the ports comprises: Acquiring the solder balls and the ports to be connected and establishing a solder ball queue and a port queue; Acquiring a solder ball connection sequence of the solder ball queue and a port connection sequence of the port queue; Connecting the solder balls with the ports according to the solder ball connection sequence and the port connection sequence.

7. The solder ball management method of claim 6, wherein, Acquiring a solder ball connection sequence of the solder ball queue comprises: Acquiring a starting point position and a connection direction of the solder balls; Sorting the solder balls based on the starting point position and the connection direction.

8. The solder ball management method of claim 5, wherein, Connecting the solder balls of different solder ball layers comprises: Acquiring a first solder ball layer and a second solder ball layer, the first solder ball layer comprising a first solder ball group and the second solder ball layer comprising a second solder ball group; Sorting each solder ball in the first solder ball group; Finding the closest solder ball in the second solder ball group for each solder ball in the first solder ball group according to the sequence and connecting them until all solder balls in the first solder ball group or the second solder ball group are connected.

9. The solder ball management method of claim 5, wherein, After the solder balls of different solder ball layers are connected, it comprises: Cross-detecting the connection results of the solder balls of different solder ball layers; If the lines of two pairs of the solder balls intersect, exchanging the connection relationship between the two pairs of the solder balls until there is no intersection in all solder ball lines.

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