Planarization apparatus and article manufacturing method

Abstract

A planarization apparatus includes a plurality of processors including a first processor and a second processor and configured to perform planarization processing of a substrate in each of the processors. The first processor is disposed within a conveying range of one of the substrate and the leveling member by a first conveying robot disposed on a conveying path between the loading unit and the adjuster and configured to convey the one of the substrate and the leveling member. The second processor is disposed within a conveying range of one of the substrate and the leveling member by a second conveying robot disposed on a conveying path between the adjuster and the supplier and configured to convey the one of the substrate and the leveling member. The invention also relates to a manufacturing method of the product.

Description

TECHNICAL FIELD

[0001] The present application relates to a planarization apparatus and an article manufacturing method. BACKGROUND

[0002] As a method of manufacturing an article such as a semiconductor device or a MEMS, an imprint method of molding a stamper material on a substrate by using a mold is known. The imprint technique is a microfabrication technique for forming a pattern of a cured product by bringing a mold into contact with a stamper material supplied onto a substrate and applying a curing energy to the stamper material to transfer a concave / convex pattern of the mold onto the cured product.

[0003] A technique of planarizing a surface of a substrate by using the imprint technique is also proposed (see Japanese Patent Publication No. 2011-529626). Conventionally, a technique of planarizing a step of a substrate surface by forming a coating film on the substrate using an existing coating apparatus (spin coater) is provided. However, this technique is not sufficient to planarize a step of a substrate surface on a nanometer scale basis. On the other hand, in the technique disclosed in Japanese Patent Publication No. 2011-529626, by supplying a polymerizable material based on a step of a substrate and curing the polymerizable material while bringing a template having a flat surface into contact with the supplied polymerizable material, the precision of planarization can be improved.

[0004] In the planarization processing proposed in Japanese Patent Publication No. 2011-529626, a substrate is planarized by a supply step, a contact step, a curing step, and a separation step. The planarization apparatus differs from the imprint apparatus in that the planarization apparatus brings a flat member (referred to as a "superstrate") on which no pattern is formed into contact with a composition supplied to the entire area of a substrate surface and cures the composition in this state.

[0005] Therefore, in the planarization apparatus, the curing time of the composition supplied to the entire area of a substrate surface is longer than the curing time in the imprint apparatus. In addition, the planarization apparatus requires a large amount of curing energy, and the adhesion force acting when the flat member is brought into contact with and separated from the composition supplied to the entire area of a substrate surface is on the order of several hundred N. Therefore, the above-mentioned contact step, curing step, and separation step can each require several tens of seconds, and the planarization processing of each substrate takes a lot of time after the composition supply step. If the four steps in the planarization processing are sequentially performed, the throughput of the planarization apparatus is limited to at most several tens of substrates per hour. In order to improve the productivity of the planarization apparatus, it is necessary to minimize the processing time of each step or cluster the planarization apparatus to simultaneously process a plurality of substrates.

[0006] Japanese Patent Publication No. 2016-149576 discloses a processing apparatus in which a plurality of coating processors for applying an organic material to a substrate and a plurality of heat processing units for performing a heating process on the substrate are arranged and clustered.

[0007] With regard to the planarization apparatus, each processor for performing a composition supply process, a contact process, a curing process, and a separation process is also considered to be clustered. However, simple processor clustering increases the floor space of the apparatus. In addition, if the processors are clustered, the number of transport destinations of the substrate increases, so that the load of the transport mechanism increases and the throughput decreases. SUMMARY

[0008] The present application provides a technology that is advantageous in reducing the floor space of a planarization apparatus and increasing the throughput.

[0009] The present application provides, in a first aspect thereof, a planarization apparatus including a plurality of processors including a first processor and a second processor and configured to perform a planarization process of a substrate using a planarizing member in each of the plurality of processors, the planarization apparatus including: a loading unit configured to load one of the substrate and the planarizing member into the planarization apparatus; a supplier configured to perform a supply process of supplying a composition for the planarization process to the substrate; a transport path through which one of the substrate and the planarizing member is transported between one end where the loading unit is located and the other end where the supplier is located; an adjuster arranged in the middle of the transport path and configured to place one of the substrate and the planarizing member to be loaded into one of the plurality of processors and perform a pre-alignment of the placed substrate; a first transport robot arranged on the transport path between the loading unit and the adjuster and configured to transport one of the substrate and the planarizing member; and a second transport robot arranged on the transport path between the adjuster and the supplier and configured to transport one of the substrate and the planarizing member, wherein the first processor is arranged within a transport range of the first transport robot for one of the substrate and the planarizing member, and the second processor is arranged within a transport range of the second transport robot for one of the substrate and the planarizing member.

[0010] The present application provides, in a second aspect thereof, an article manufacturing method including forming a planarization film on a substrate using the planarization apparatus defined in the second aspect, and processing the substrate on which the planarization film is formed, wherein an article is manufactured from the processed substrate.

[0011] Further features of the present application will become apparent from the following description of exemplary embodiments (with reference to the attached drawings). BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 is a view showing the configuration of the planarization apparatus;

[0013] Figure 2A and Figure 2B are views showing the loading unit and the placement unit, respectively;

[0014] Figure 3 is a view for explaining the process of transporting the substrate from the loading unit to the supply;

[0015] Figure 4 is a view for explaining the process of transporting the substrate from the supply to the processor;

[0016] Figure 5 is a view for explaining the process of transporting the substrate from the processor to the loading unit;

[0017] Figure 6 is a timing chart for transporting a plurality of substrates;

[0018] Figures 7A to 7E is a view for explaining the substrate exchange operation;

[0019] Figure 8 is a view showing the process of transporting the mold to the processor via the placement unit;

[0020] Figure 9 is a view showing the process of transporting the mold to the processor without passing through the placement unit;

[0021] Figure 10 is a view showing the configuration of the planarization apparatus;

[0022] Figures 11A to 11D is a view for explaining the planarization process; and

[0023] Figure 12 is a view showing the configuration of the processor. DETAILED DESCRIPTION

[0024] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments are not intended to limit the scope of the claimed invention. In the embodiments, a plurality of features are described, but the invention is not limited to all of these features, and a plurality of such features can be appropriately combined. Furthermore, in the drawings, the same reference numerals are assigned to the same or similar structures, and redundant description thereof is omitted.

[0025] First, an outline of the planarization process will be described. The base pattern on the substrate has a concave / convex profile derived from the pattern formed in the previous step. In the case of a normal logic process wafer, there are concave / convex portions of about 80 nm to 100 nm derived from the pattern. The steps derived from the moderate undulations of the entire substrate can be corrected by the focus tracking function of the scanning exposure device used in the photolithography step. However, fine concave / convex portions that are small enough to fall within the exposure slit area of the exposure device cannot be corrected by the above-mentioned focus tracking function. If there are many concave / convex portions, they can fall outside the depth of focus (DOF) of the exposure device. As a conventional method of smoothing the base pattern of the substrate, a method of forming a planarization layer, such as spin on carbon (SOC) or chemical mechanical polishing (CMP), is used. However, the conventional technique undesirably fails to obtain sufficient planarization performance, and the concave-convex difference of the base obtained by the formation of multiple layers tends to increase.

[0026] To solve this problem, a planarization apparatus that planarizes a substrate by applying a jet-and-flash imprint lithography (JFIL) technique has been studied. Reference is made to Figures 11A to 11D An outline of the planarization process using the JFIL technique will be described. In the planarization process using the JFIL technique, a substrate can be planarized by Figure 11A the supply step shown in Figure 11B the contact step shown in Figure 11C the curing step shown in Figure 11D and the separation step shown in Figures 11A to 11D In , a circuit pattern has been formed on the surface of a substrate W held by a substrate chuck C, and there can be concave / convex portions derived from the pattern of, for example, about 80 nm to 100 nm. The requirement of the planarization apparatus according to this embodiment is to planarize the surface concave / convex portions derived from the pattern.

[0027] Figure 11A In the supply step shown in Figure 11A , a composition ML as a formable material is supplied from a dispenser DP to the surface of a substrate W on a substrate chuck C. Note that in

[0028] In the contact step shown in Figure 11BIn the contact step shown in FIG, a cover plate SS, a flat member (unpatterned member) having a flat surface without a pattern formed thereon and an outer diameter equal to or larger than the outer diameter of the substrate W, is brought into contact with the composition ML. The cover plate is also referred to as a "flattening template." In this contact step, the cover plate SS is pressed against the entire surface of the substrate W. As a result, the composition ML is spread ("filled" or "spread") in a layered manner.

[0029] exist Figure 11C In the curing step shown in , while the cover sheet SS is in contact with the composition ML on the substrate W, ultraviolet light from the light source IL is irradiated all over the surface of the substrate W at once (or by repeating partial exposure). This cures the composition ML that has spread in a layered manner.

[0030] exist Figure 11D In the separation step shown in FIG, the cover sheet SS is separated from the cured composition ML on the substrate W. Consequently, the surface concave / convex portions of the substrate W resulting from the pattern are flattened. Note that the purpose here is not to correct the flatness of components with low spatial frequencies (such as the profile of the entire substrate that is distorted relative to an absolute plane). For such components, the focus tracking control of the exposure device is used in the subsequent patterning step to compensate for non-planar components.

[0031] In this manner, the planarization process applying the imprint technology is a technology that supplies a composition according to the steps of the substrate, brings a thin flat member called a superstrate into contact with the supplied composition, and cures the composition, thereby performing nanometer-scale planarization.

[0032] Figure 12 : is a diagram showing the construction of a processor that performs the flattening process described above. In the specification and the drawings, directions will be expressed in an XYZ coordinate system, in which a horizontal plane is defined as the XY plane. The processor supports a substrate that is a processing target so that the surface of the substrate is parallel to the horizontal plane (XY plane). Therefore, in the following description, directions that are orthogonal to each other in a plane along the holding surface of the substrate in the processor are defined as the X-axis and the Y-axis, and a direction perpendicular to the X-axis and the Y-axis is defined as the Z-axis. In addition, in the following description, directions parallel to the X-axis, Y-axis, and Z-axis of the XYZ coordinate system are referred to as the X-direction, the Y-direction, and the Z-direction, respectively, and a rotational direction about the X-axis, a rotational direction about the Y-axis, and a rotational direction about the Z-axis are referred to as the θX direction, the θY direction, and the θZ direction, respectively.

[0033] exist Figure 12In this case, the cover plate SS is a flat member (a patternless member), and can be used as a flat reference surface after the planarization process. In this embodiment, a substrate chuck C is mounted on a substrate stage T. On the substrate chuck C, sensors 501 measured upward in the Z direction are arranged in two channels in the paper depth direction, for example. These sensors 501 can measure the Z direction position and the levelness (ΘX, ΘY) of the cover plate SS. Further, by observing the edge portion of the cover plate SS while scanning the substrate stage T in the Y direction, these sensors 501 can measure the positional offset amount of the cover plate SS in the X direction and the Y direction with respect to the chuck 502.

[0034] A cavity 503 partitioned by a member transparent with respect to an exposure light source (corresponding to the light source IL shown in Figure 11C The cavity 503 is formed above the cover plate SS. When the cover plate SS is brought into contact with the composition on the substrate W, the pressure in the cavity 503 is set to a positive pressure with respect to the atmospheric pressure. By this operation, the cover plate SS is formed in a convex shape with respect to the substrate W, so that the cover plate can first come into contact with the center of the substrate, thereby reducing the air trapped between the cover plate SS and the composition. A mover 504a of a linear motor is fixed to the chuck 502. The mover 504a can be moved with respect to a stator 504b of the linear motor via a spring hinge 505. The position of the linear motor arranged as described above is controlled using a position sensor (not shown). Three sets of the mover 504a, the stator 504b, the spring hinge 505, and the position sensor are mounted on one processor. With this configuration, the chuck 502 is positioned with respect to three axes of Z, ΘX, and ΘY according to a predetermined drive curve in the contact step and the separation step.

[0035] The illumination / diffusion observation system 410 is arranged above the cover plate SS. The illumination / diffusion observation system 410 can include an exposure light source, and an optical system for observing the diffusion state of the composition.

[0036] Figure 1 is a view showing the configuration of the planarization apparatus 1 according to the embodiment. The planarization apparatus 1 has a cluster configuration in which a plurality of processors cooperate with each other. In the first embodiment, the planarization apparatus 1 includes four processors. Each of the first processor 110, the second processor 111, the third processor 113, and the fourth processor 112 can have the configuration shown in the Figure 12 above.

[0037] The planarization apparatus 1 includes a loading unit 101 for loading a substrate or a flat member into the planarization apparatus. The loading unit 101 can be, for example, a transfer unit to which a substrate transferred from a substrate transfer module also called an Equipment Front End Module (EFEM) is supplied. The loading unit 101 can include a substrate transfer slot that can transfer a substrate and a pre-alignment device. The pre-alignment device formed in the loading unit 101 performs pre-alignment of a substrate to be transferred to the supplier 109.

[0038] The planarization apparatus 1 includes a supplier 109 that performs a supply process of supplying a substrate with a composition used for a planarization process. Details of the supplier 109 will be described later.

[0039] The planarization apparatus 1 includes a transfer path 15 through which a substrate or a flat member is transferred between one end where the loading unit 101 is located and the other end where the supplier 109 is located. In the present embodiment, the transfer path 15 is formed of a first transfer path 103 and a second transfer path 105 each extending in the X direction.

[0040] The planarization apparatus 1 includes a placement unit 108 arranged in the middle of the transfer path. The placement unit 108 is configured to place a substrate or a flat member to be loaded into one of a plurality of processors. In the present embodiment, the placement unit 108 is arranged between the first transfer path 103 and the second transfer path 105. The placement unit 108 is also configured to perform pre-alignment of a placed substrate. In one example, the placement unit 108 can include a substrate transfer slot that can transfer a substrate and a pre-alignment device. The pre-alignment device formed in the placement unit 108 performs pre-alignment of a substrate to be transferred to one of the processors. Thus, the placement unit 108 is not only a placement unit, and functions as an adjuster with a substrate pre-alignment function.

[0041] The planarization apparatus 1 includes a first transfer robot 102 as a transfer mechanism for transferring a substrate or a flat member. The first transfer robot 102 is arranged on the transfer path between the loading unit 101 and the placement unit 108, and is configured to transfer a substrate or a flat member. The first transfer robot 102 is installed on the first transfer path 103, and can transfer a substrate by moving the first transfer robot on the first transfer path 103 even if the distance between the loading unit 101 and the placement unit 108 is large.

[0042] The flattening apparatus 1 includes a second conveying robot 104. The second conveying robot 104 is arranged on a conveying path between the placement unit 108 and the supplier 109 and is configured to convey a substrate or a flattening member. The second conveying robot 104 is mounted on a second conveying path 105 and can convey a substrate by moving the second conveying robot 104 along the second conveying path 105, even if the distance between the placement unit 108 and the supplier 109 is large.

[0043] Note that the effective travel distances of first conveying path 103 and second conveying path 105 may differ from each other. However, the time required to move the maximum travel distance of each conveying path must be within the time required for the conveying robot to make a 180° turn. This is because if the travel time of each conveying path is longer than the turn time of the conveying robot, the throughput of the equipment will decrease.

[0044] The first processor 110 is arranged within the conveying range of the first conveying robot 102 for conveying substrates or flattened members. This allows the substrates or flattened members to be conveyed from the first conveying robot 102 to the first processor 110. The second processor 111 is arranged within the conveying range of the second conveying robot 104 for conveying substrates or flattened members. This allows the substrates or flattened members to be conveyed from the second conveying robot 104 to the second processor 111.

[0045] In this embodiment, the first conveying robot 102 is configured to convey substrates or flat members between the loading unit 101, the placement unit 108, and the first processor 110. The second conveying robot 104 is configured to convey substrates or flat members between the placement unit 108, the supplier 109, and the second processor 111.

[0046] The planarizing apparatus 1 further includes a third conveying robot 106 . The third conveying robot 106 is configured to convey the substrate or the planarizing member between the first processor 110 , the second processor 111 , and the placement unit 108 .

[0047] In this embodiment, the third processor 113 is arranged within the conveying range of the first conveying robot 102 for the substrate or the flattening member, and the fourth processor 112 is arranged within the conveying range of the second conveying robot 104 for the substrate or the flattening member. The flattening apparatus 1 may further include a fourth conveying robot 107 configured to convey the substrate or the flattening member between the third processor 113, the fourth processor 112, and the placement unit 108.

[0048] The supplier 109 supplies the composition as a formable material to the surface of the substrate. The supplier 109 can include a stage that moves while holding the substrate, and a dispenser that dispenses the composition. The dispenser can be a jet module configured to supply the composition in a droplet state. By relatively scanning and driving the stage and the dispenser multiple times, the composition is supplied to the entire surface of the substrate. At this time, the composition can be supplied while applying a distribution of the amount of the composition in accordance with the arrangement of the concave / convex pattern or the like formed on the surface of the substrate. For example, the composition is supplied so that the droplet density is higher for a portion where the ratio of the concave portion of the pattern on the substrate surface is higher, and the droplet density is lower for a portion where the ratio of the concave portion is lower. For this purpose, when the composition is supplied by the dispenser, a substrate alignment measurement can be performed to preliminarily match the position of the pattern formed on the substrate with the position of the density pattern of the composition to be supplied.

[0049] In the present embodiment, as shown in FIG. 1, the loading unit 101, the placement unit 108, and the supplier 109 are arranged in a row on a conveyance path. The first processor 110 and the second processor 111 are arranged in a row in a direction parallel to the direction (X direction) in which the conveyance path extends. Figure 1 is a plan view of the planarization apparatus 1 when viewed from above in the Z direction. In a side view when viewed from the Y direction, it should be understood that the first processor 110 is arranged at a position between the loading unit 101 and the placement unit 108. In the side view, it should also be understood that the second processor 111 is arranged at a position between the placement unit 108 and the supplier 109. Figure 1

[0050] The third processor 113 and the fourth processor 112 are arranged on opposite sides of the first processor 110 and the second processor 111 across the conveyance path. In the present embodiment, the third conveyance robot 106 and the fourth conveyance robot 107 are arranged in a row in a direction intersecting the conveyance path at a position where the placement unit 108 is arranged. That is, the third conveyance robot 106 and the fourth conveyance robot 107 are arranged in a row in the Y direction to sandwich the placement unit 108 therebetween. In this case, the third conveyance robot 106 is arranged between the first processor 110 and the second processor 111, and the fourth conveyance robot 107 is arranged between the third processor 113 and the fourth processor 112.

[0051] ​The planarization processing in each of the first processor 110, the second processor 111, the third processor 113, and the fourth processor 112 will be described. In the contacting step, each processor presses a superstate SS against the entire area of the substrate surface by contacting the superstate SS with the composition, the outer diameter of which is equal to or greater than the outer diameter of the substrate, thereby causing the composition to spread in layers. In the curing step, the composition is cured while the superstate SS is in contact with the composition on the substrate. The composition can be a photocurable composition that is cured by ultraviolet light emitted from a light source (included in the illumination / diffusion observation system 410). In the separating step, the superstate SS is separated from the cured composition on the substrate. This planarizes the surface of the substrate.

[0052] The configuration of the loading unit 101 and the placement unit 108 will be described with reference to Figure 2A and Figure 2B The configuration of the loading unit 101 and the placement unit 108 will be described with reference to Figure 2A is a view showing the configuration of the loading unit 101, Figure 2B is a view showing the configuration of the placement unit 108. The loading unit 101 can include a substrate placement portion 201 on which a substrate is placed, and a pre-alignment device 202 arranged below the substrate placement portion 201 and configured to perform pre-alignment on a substrate placed on the substrate placement portion 201. The placement unit 108 can include a substrate placement portion 203 on which a substrate is placed, and a pre-alignment device 204 arranged below the substrate placement portion 203 and configured to perform pre-alignment on a substrate placed on the substrate placement portion 203. In each of the loading unit 101 and the placement unit 108, a plurality of shelves on which a plurality of substrates can be stored can be provided. The number of substrates (the number of shelves) that can be stored in the loading unit 101 and the placement unit 108 can be the same or different. Note that it is assumed that a substrate is placed on each of the loading unit 101 and the placement unit 108, but a superstate SS can be placed. The pre-alignment devices 202 and 204 can have the same configuration or different configurations. In each of the loading unit 101 and the placement unit 108, the arrangement of the substrate placement portion and the pre-alignment device can be reversed.

[0053] The process of transporting a substrate W from the loading unit 101 to the supplier 109 will be described with reference to Figure 3 The process of transporting a substrate W from the loading unit 101 to the supplier 109 will be described with reference to

[0054] The process of transporting a substrate W from the loading unit 101 to the supplier 109 will be described with reference to Figure 4The process of transferring a substrate W from the supplier 109 to the first processor 110 will be described. A substrate W that has undergone the transfer process by the supplier 109 is placed on the pre-alignment device 204 of the placement unit 108 by the second transfer robot 104. The third transfer robot 106 receives the substrate W pre-aligned by the pre-alignment device 204 and transfers the substrate to the first processor 110, where it undergoes a planarization process. The third transfer robot 106 can transfer subsequent substrates to the second processor 111. The fourth transfer robot 107 transfers the substrate to the third processor 113 and the fourth processor 112.

[0055] Note that, when conveying the substrate from the supplier 109 to the second processor 111 , the second conveying robot 104 conveys the substrate from the supplier 109 to the second processor 111 without passing through the placement unit 108 .

[0056] Will refer to Figure 5 The process of transferring a substrate W from the first processor 110 to the loader unit 101 will be described. The substrate W processed by the first processor 110 is transferred by the third transfer robot 106 to the substrate placement portion 203 of the placement unit 108. Subsequently, the substrate W placed on the substrate placement portion 203 is transferred by the first transfer robot 102 to the substrate placement portion 201 of the loader unit 101 and then unloaded outside the apparatus.

[0057] Figures 3 to 5 There is shown a process of conveying a specific one substrate W. Next, a process of continuously conveying a plurality of substrates will be described.

[0058] Figure 6is a timing chart of conveying a plurality of substrates. For example, as described above, one substrate is conveyed to the loading unit 101, the placement unit 108, the supplier 109, the placement unit 108, the first processor 110, the placement unit 108, and the loading unit 101 in this order. While the first substrate is loaded to the supplier 109, a second substrate is placed on the loading unit 101. While the second substrate is loaded to the supplier 109, the dispensing process of the first substrate ends. Each of the first conveyance robot 102, the second conveyance robot 104, the third conveyance robot 106, and the fourth conveyance robot 107 has two hands for holding a substrate. Therefore, for example, since each of the third conveyance robot 106 and the fourth conveyance robot 107 can hold a substrate to be unloaded from a processor while holding a substrate to be loaded to the processor, a substrate exchange operation is possible. Details of the substrate exchange operation will be described later. Therefore, while the second substrate is loaded to the supplier 109, the substrate exchange operation is performed. This can recover the first substrate from the supplier 109. The recovered first substrate is conveyed to the first processor 110. The number of substrates processed per unit time by the supplier 109 is more than twice the number of substrates processed per unit time by each of the plurality of processors. In one example, the processing time per substrate of the supplier 109 is 1 / 4 or less of the processing time per substrate of each of the first processor 110, the second processor 111, the third processor 113, and the fourth processor 112. Therefore, while the first processor 110 performs a planarization process on the first substrate, a second substrate that has undergone a supply process by the supplier 109 is conveyed to the second processor 111. While the second processor 111 performs a planarization process on the second substrate, a third substrate that has undergone a supply process by the supplier 109 is conveyed to the fourth processor 112. While the fourth processor 112 performs a planarization process on the third substrate, a fourth substrate that has undergone a supply process by the supplier 109 is conveyed to the third processor 113. While a fifth substrate is conveyed to the first processor 110, the planarization process of the first substrate ends, and the first substrate is recovered by the substrate exchange operation. In this way, a plurality of substrates are continuously conveyed.

[0059] Details of the substrate exchange operation will be described with reference to Figures 7A to 7E Details of the substrate exchange operation will be described with reference to Figures 7A to 7E is a view showing a process of recovering a first substrate 703 that has undergone a supply process by the supplier 109 and placing a second substrate 704 by using two hands. The supplier 109 includes a substrate chuck 701 and a lift pin 702 that is caused to protrude from and sink into a chuck surface of the substrate chuck 701 by a lifting mechanism. A conveyance robot (the second conveyance robot 104) has two hands 705 and 706. The two hands 705 and 706 are stacked in the height direction (Z direction).

[0060] The first substrate 703 that has undergone the supply process by the supplyer 109 is lifted by the lift pins 702 and separated from the substrate chuck 701. At this time, the hand 705 does not hold the substrate because it is used as a substrate recovery hand, and the hand 706 holds the second substrate 704 because it is used as a substrate placement hand. Figure 7A The hand 705 goes under the first substrate 703 lifted from the substrate chuck 701. Figure 7B After that, the hand 705 holds and recovers the first substrate 703. Figure 7C Subsequently, the hand 706 holding the second substrate 704 goes over the substrate chuck 701. Figure 7D Then, the hand 706 places the second substrate 704 on the lift pins 702 and then retreats. Figure 7E Through this series of operations, the substrate exchange operation is performed.

[0061] Note that the vertical positions of the hands 705 and 706 can be reversed. The above example has explained the substrate exchange operation in the supplyer 109 by the second transport robot 104, but the substrate exchange operation can be performed in each of the first processor 110, the second processor 111, the third processor 113, and the fourth processor 112 in the same manner.

[0062] Each time a predetermined number of substrates are planarized, the cover plate SS for planarization processing in each of the first processor 110, the second processor 111, the third processor 113, and the fourth processor 112 can be exchanged. This is because the surface of the cover plate SS that contacts the formable material can be contaminated by the formable material or the like, thereby causing defects on the substrate surface when the planarization processing is performed. In order to transport the cover plate SS, the same first transport robot 102 and the second transport robot 104 as those used to transport the substrate can be used. It has been described that each of the first to fourth transport robots has two hands for holding the substrate. In addition to this, each of the first to fourth transport robots can have one hand for transporting the cover plate SS.

[0063] The transport process of the cover plate SS will be described with reference to Figure 8 and Figure 9 . Figure 8The process of conveying the cover sheet SS to the second processor 111 via the placement unit 108 is shown. The cover sheet SS loaded from the loading unit 101 is placed on the pre-alignment device 202 of the loading unit 101. The cover sheet SS pre-aligned by the pre-alignment device 202 is placed on the substrate placement portion 203 of the placement unit 108 by the first transfer robot 102. Subsequently, the second transfer robot 104 receives the cover sheet SS from the placement unit 108 and conveys the cover sheet SS to the second processor 111. Another cover sheet to be conveyed to the fourth processor 112 can be conveyed in the same manner.

[0064] Figure 9 The process of transporting a cover sheet SS to the first processor 110 without passing through the placement unit 108 is shown. The cover sheet SS, pre-aligned by the pre-alignment device 202 of the loading unit 101, is transported to the first processor 110 by the first transport robot 102. Another cover sheet to be transported to the third processor 113 can be transported in the same manner. Thus, when the cover sheet SS is destined for the first processor 110 or the third processor 113, the first transport robot 102 transports the cover sheet SS from the loading unit 101 to the first processor 110 without passing through the placement unit 108.

[0065] <Second embodiment>

[0066] Will refer to Figure 10 A planarization apparatus 1 according to a second embodiment is described. Figure 1 ), the planarizing apparatus 1 includes four processors. On the other hand, in the second embodiment ( Figure 10 ), the planarization apparatus 1 includes two processors. In this embodiment, the two processors are a first processor 110 and a second processor 111. In this case, similar to the first embodiment, substrate transfer between the placement unit 108 and the first processor 110, and between the placement unit 108 and the second processor 111, is performed by the third transfer robot 106. In this embodiment, the planarization apparatus 1 includes neither the third processor 113 nor the fourth processor 112, and therefore does not include the fourth transfer robot 107.

[0067] Note that the configurations of the loading unit 101 and the placement unit 108 are the same as those in the first embodiment. Therefore, in this embodiment as well, the transport of substrates between the loading unit 101 and the placement unit 108 is performed by the first transport robot 102, and the transport of substrates between the placement unit 108 and the feeder 109 is performed by the second transport robot 104.

[0068] As described in the first embodiment, the number of substrates processed per unit time by the supply 109 is twice or more the number of substrates processed per unit time by each of the plurality of processors. However, in the second embodiment, the number of substrates loaded per unit time and the number of cover plates loaded per unit time are different from those in the first embodiment. As described above, the processing time per substrate of the supply 109 is 1 / 4 or less the processing time per substrate of each of the first and second processors 110 and 111. Therefore, if the number of substrates loaded per unit time is the same as in the first embodiment, the number of substrates processed by each of the first and second processors 110 and 111 is less than the number of substrates processed by the supply 109, and thus the substrate transport is delayed. Therefore, in the second embodiment, the number of substrates loaded per unit time is half that in the first embodiment. By using the transport method described above, the substrates can be continuously processed.

[0069] <Embodiment of article manufacturing method>

[0070] Next, a method of manufacturing an article (semiconductor IC element, liquid crystal display element, color filter, MEMS, etc.) by using the planarization apparatus described above will be described. The manufacturing method includes a step of planarizing a composition disposed on a substrate (wafer, glass substrate, etc.) by bringing the composition and a cover plate into contact with each other by using the planarization apparatus described above, a step of curing the composition, and a step of separating the composition and the cover plate from each other. Thereby, a planarized film is formed on the substrate. Then, the substrate on which the planarized film is formed is subjected to a process such as forming a pattern using a photolithography apparatus, and the processed substrate is processed in other known processing steps to manufacture an article. The other known steps include patterning exposure and accompanying pretreatment, etching, resist removal, dicing, bonding, packaging, etc. The manufacturing method can manufacture an article having higher quality compared to a conventional method.

[0071] While the present application has been described with reference to exemplary embodiments, it is to be understood that the application is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be construed in accordance with the broadest interpretation so as to encompass all the modifications and alternatives that are equivalent in spirit thereto.

Claims

1. A planarization apparatus, comprising a plurality of processors, the plurality of processors including a first processor and a second processor and configured to perform a planarization process of a substrate using a planarization member in each of the plurality of processors, the planarization apparatus comprising: a loading unit configured to load one of a substrate and a planarizing member into the planarizing apparatus; a supplier configured to perform a supply process of supplying a composition for the planarization process to the substrate; a conveying path through which one of the substrate and the leveling member is conveyed between one end where the loading unit is located and the other end where the supplier is located; an adjuster disposed in the middle of the transport path and configured to place one of the substrate and the leveling member to be loaded into one of the plurality of processors and perform pre-alignment of the placed substrate; a first conveying robot disposed on a conveying path between the loading unit and the conditioner and configured to convey one of the substrate and the leveling member; and a second conveying robot arranged on a conveying path between the conditioner and the supplier and configured to convey one of the substrate and the leveling member, wherein the first processor is arranged within a conveying range of the first conveying robot for conveying one of the substrate and the flattening member, and The second processor is arranged within a conveyance range of the second conveying robot for one of the substrate and the leveling member.

2. The planarization apparatus according to claim 1, wherein: The first transfer robot is configured to transfer one of the substrate and the leveling member between the loading unit, the conditioner, and the first processor, and The second transfer robot is configured to transfer one of the substrate and the leveling member between the conditioner, the supplier, and the second processor.

3. The flattening device according to claim 2 further includes a third conveying robot, which is configured to convey the substrate and one of the flattening members, and is configured to convey the substrate and one of the flattening members between the first processor, the second processor and the adjuster.

4. The planarization apparatus according to claim 3, wherein: The plurality of processors further comprises: a third processor disposed within a conveying range of the first conveying robot for one of the substrate and the flattening member; and a fourth processor disposed within a conveying range of the second conveying robot for conveying one of the substrate and the flattening member; and The planarizing apparatus further includes a fourth conveying robot configured to convey one of the substrate and the planarizing member between the third processor, the fourth processor, and the conditioner.

5. The planarization apparatus according to claim 4, wherein The loading unit, the conditioner, and the supplier are arranged in a row on the conveying path. The planarization apparatus according to claim 5 , wherein: The first processor and the second processor are arranged in a row in a direction parallel to a direction in which the conveying path extends, The first processor is arranged at a position between the loading unit and the conditioner in a side view of the flattening apparatus, and The second processor is arranged at a position between the regulator and the supplier in the side view.

7. The planarization apparatus according to claim 6, wherein: The third processor and the fourth processor are arranged on opposite sides of the first processor and the second processor across the conveyance path.

8. The planarization apparatus according to claim 7, wherein: The third conveying robot and the fourth conveying robot are arranged in a row in a direction intersecting the conveying path at a position where the adjuster is arranged, The third conveying robot is arranged between the first processor and the second processor, and The fourth conveying robot is arranged between the third processor and the fourth processor.

9. The planarization apparatus according to claim 6, wherein: In a case where the substrate is transferred from the supplier to the second processor, the second transfer robot transfers the substrate from the supplier to the adjuster and places the substrate, and the third transfer robot receives the substrate at the adjuster and transfers the substrate to the first processor.

10. The planarization apparatus according to claim 6, wherein In a case where the substrate is transferred from the supplier to the second processor, the second transfer robot transfers the substrate from the supplier to the second processor without passing through the conditioner.

11. The planarization apparatus according to claim 6, wherein When the flattened member is conveyed from the loading unit to the second processor, the first conveying robot conveys the flattened member from the loading unit to the adjuster and places the flattened member, and the second conveying robot receives the flattened member at the adjuster and conveys the flattened member to the second processor.

12. The planarization apparatus according to claim 6, wherein In a case where the flat member is transferred from the loading unit to the first processor, the first transfer robot transfers the flat member from the loading unit to the first processor without passing through the conditioner.

13. The planarization apparatus according to claim 1, wherein The first transport robot includes two hands configured to hold a substrate and one hand configured to hold a leveling member.

14. The planarization apparatus according to claim 1, wherein The number of substrates processed by the supplier per unit time is not less than twice the number of substrates processed by each of the plurality of processors per unit time.

15. The planarization apparatus according to claim 1, wherein For the substrate transferred from the loading unit, the supplier performs the supply process, and one of the processors performs the planarization process, and then the substrate is returned to the loading unit.

16. The planarization apparatus according to claim 1, wherein The conditioner includes a plurality of shelves configured to store a plurality of substrates or a plurality of flat members.

17. The planarization apparatus according to claim 1, wherein The planarization process is performed by bringing the planarization member into contact with the composition supplied onto the substrate by the supplier and thereby forming a planarization film on the substrate from the composition.

18. A method for manufacturing a product, comprising: forming a planarization film on a substrate using the planarization apparatus defined in any one of claims 1 to 17; as well as processing the substrate on which the planarization film is formed, Therein, an article is manufactured from the treated substrate.

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