Substrate processing apparatus and substrate processing method

Abstract

The invention provides a substrate processing apparatus and a substrate processing method. A substrate processing apparatus that optically detects a foreign matter in a supply path through which a fluid supplied to a substrate flows is miniaturized. The substrate processing apparatus includes: a supply path through which a fluid supplied to a substrate flows; and a foreign matter detection means in which a part of the supply path constitutes a flow path forming section, light is formed toward the flow path forming section by means of a light projecting section, and as a result, light is emitted from the flow path forming section, and the foreign matter is detected by means of the foreign matter detection means. And a foreign matter detection unit capable of detecting a foreign matter in the fluid on the basis of a signal obtained by receiving light emitted from the flow path forming unit by a light receiving unit, in which the light projecting unit and the light receiving unit in the foreign matter detection unit are provided in regions that do not face each other among the upper, lower, left, right, front and rear regions with the flow path forming unit as a reference.

Description

[0001] This application is a divisional application of the patent application No. 202010074294.8, filed on January 22, 2020, entitled "Substrate processing device, substrate processing system, and substrate processing method". TECHNICAL FIELD

[0002] The present disclosure relates to a substrate processing device, a substrate processing system, and a substrate processing method. BACKGROUND

[0003] In a manufacturing process of a semiconductor device, processing is performed by supplying various kinds of processing liquids to a semiconductor wafer (hereinafter referred to as a wafer) which is a substrate in a circular shape. It is studied to suppress occurrence of defects in the wafer by detecting foreign matter in the processing liquid. In Patent Literature 1, there is described a liquid processing device including a pipe for supplying a resist to a wafer and a sensor portion which is a liquid-borne particle counter interposed in the pipe.

[0004] Patent Literature 1: Japanese Patent Application Laid-Open No. 5-251328 SUMMARY

[0005] Problems to be solved by the invention

[0006] The present disclosure provides a technology capable of miniaturizing a substrate processing device which optically detects foreign matter in a supply path through which a fluid supplied to a substrate flows.

[0007] Solutions to the problems

[0008] The substrate processing device of the present disclosure includes:

[0009] a supply path through which a fluid supplied to a substrate flows; and

[0010] a foreign matter detection unit which is constituted of a part of the supply path, a light emitting portion of which forms light toward a flow path forming portion of the supply path, as a result of which light is emitted from the flow path forming portion, and which is capable of detecting foreign matter in the fluid based on a signal obtained by a light receiving portion receiving the light emitted from the flow path forming portion, wherein

[0011] the light emitting portion and the light receiving portion in the foreign matter detection unit are provided in non-opposing regions among regions above and below and left and right and front and back of the flow path forming portion.

[0012] Effects of the invention

[0013] According to the present disclosure, it is possible to miniaturize a substrate processing device which optically detects foreign matter in a supply path through which a fluid supplied to a substrate flows. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 is a schematic configuration view of a resist coating apparatus as an embodiment of the present disclosure.

[0015] Figure 2 is a plan view of the resist coating assembly.

[0016] Figure 3 is a longitudinal sectional side view of a foreign matter detection unit assembled to the resist coating assembly.

[0017] Figure 4 is a longitudinal sectional rear view of the foreign matter detection unit.

[0018] Figure 5 is a perspective view of the foreign matter detection unit.

[0019] Figure 6 is a schematic side view of the foreign matter detection unit.

[0020] Figure 7 is a schematic front view of the foreign matter detection unit.

[0021] Figure 8 is an exploded perspective view of the foreign matter detection unit.

[0022] Figure 9 is a timing chart showing an operation of the resist coating apparatus.

[0023] Figure 10 is an explanatory view showing a positional relationship of each part of the foreign matter detection unit.

[0024] Figure 11 is a longitudinal sectional side view showing a modification of the foreign matter detection unit.

[0025] Figure 12 is a longitudinal sectional side view showing a modification of a flow path forming portion provided to the foreign matter detection unit.

[0026] Figure 13 is a rear view of the flow path forming portion of the modification.

[0027] Figure 14 is a longitudinal sectional side view showing another modification of a flow path forming portion provided to the foreign matter detection unit.

[0028] Figure 15 is a rear view showing still another modification of a flow path forming portion provided to the foreign matter detection unit.

[0029] Figure 16 is a plan view showing the modification of the foreign matter detection unit.

[0030] Figure 17 It is a longitudinal sectional side view showing a modified example of the foreign object detection unit.

[0031] Figure 18 This is a top view of a coating and developing device incorporating a resist coating device.

[0032] Figure 19 It is a schematic side view of the coating and developing device.

[0033] Figure 20 It is an explanatory diagram showing the arrangement of a foreign matter detection unit in the coating and developing device. DETAILED DESCRIPTION

[0034] Reference Figure 1 The schematic diagram of the resist coating device 1 of one embodiment of the substrate processing device disclosed in the present invention is explained. The resist coating device 1 supplies a resist as a processing liquid to a wafer W as a substrate to form a resist film. The resist coating device 1 includes, for example, 12 nozzles 11 (11A to 11L), of which 11 nozzles 11A to 11K spray resist to form a resist film on the wafer W. The nozzle 11L sprays a diluent onto the wafer W. The diluent is supplied to the wafer W before the resist is supplied, and is a processing liquid for pre-wetting (Japanese: プリウエット) to improve the wettability of the wafer W with respect to the resist. The resist coating device 1 includes a foreign matter detection unit 2 for optically detecting foreign matter in these resists and diluents.

[0035] The downstream ends of process liquid supply pipes 12 (12A-12L) are connected to nozzles 11A-11L, forming supply paths for the process liquid. The upstream ends of process liquid supply pipes 12A-12K are connected to process liquid supply units 13A-13K, respectively, via valves V1. The process liquid supply units 13 (13A-13K) include bottles that store resist and pumps that pressurize and deliver the resist from the bottles to nozzles 11A-11K, respectively. The resists stored in the process liquid supply units 13A-13K are of different types, and one type of resist selected from 11 types is supplied to wafer W.

[0036] The downstream end of a processing liquid supply pipe 12L is connected to the nozzle 11L, and the upstream end of the processing liquid supply pipe 12L is connected to a processing liquid supply unit 13L via a valve V1. The processing liquid supply unit 13L is configured identically to the processing liquid supply units 13A to 13K, except that it stores the aforementioned diluent instead of the resist. A flow path forming portion 14 (14A to 14L) is interposed between the nozzles 11A to 11L and the valve V1 in the processing liquid supply pipes 12A to 12L. Thus, the flow path forming portion 14 constitutes a portion of the supply path for the fluid supplied to the wafer W.

[0037] Figure 2A plan view of the resist coating apparatus 1 shows one example of a more detailed structure. In the figure, reference numeral 21 is a spin chuck that constitutes a substrate placing portion that horizontally and adsorptively holds the central portion of the back surface of each wafer W. The spin chuck 21 is connected to a rotation mechanism 22 (not shown in the figure) to be able to rotate the wafer W in a state where the wafer W is held, in a manner that enables resist to be rotationally coated on the wafer W. Reference numeral 23 in the figure is a cup that surrounds the side of the wafer W in order to suppress scattering of the processing liquid. In this example, the group of the spin chuck 21, the rotation mechanism 22, and the cup 23 is arranged along the lateral direction. Figure 2

[0038] Reference numeral 24 in the figure is an arm that supports the nozzles 11A to 11L at the tip end portion thereof. Reference numeral 25 in the figure is a moving mechanism that connects the base end portion of the arm 24 and is locked to a guide rail 26 that extends along the arrangement direction of the cups 23. By moving the moving mechanism 25, each nozzle 11A to 11L moves to a position where the processing liquid can be ejected toward the central portion of the wafer W held by the spin chuck 21. The guide rail 26 is provided on the inner side of each cup 23, and a housing 31 that is square and horizontally long is provided on the further inner side of the guide rail 26.

[0039] Reference is made to a longitudinal cross-sectional side view that shows the inside of the housing 31, Figure 3 a longitudinal cross-sectional rear view that shows the inside of the housing 31, Figure 4 a perspective view that shows the inside of the housing 31, Figure 5 The explanation will continue. In the explanation, the length direction of the housing 31 is set as the left-right direction. The housing 31 includes a main body portion 32, an upper cover 33, and a lateral cover 34. The upper cover 33 and the lateral cover 34 are attached to the main body portion 32 by, for example, a fixing member such as a screw, and are thus detachable with respect to the main body portion 32. As will be described later in detail, the flow path forming portion 14 described above is provided in the housing 31 in a manner that is aligned along the left-right direction. The upper cover 33 constitutes a wall portion that is positioned vertically upward with respect to the alignment of the flow path forming portions 14, and the lateral cover 34 constitutes a wall portion that is positioned rearward with respect to the alignment of the flow path forming portions 14.

[0040] The foreign matter detection unit 2 is constituted by the flow path forming portion 14, the light path forming portion 4, the light source 51, the light guide portion 52, the counting portion 53, and the housing 31 that are provided in the housing 31. If a general description of the foreign matter detection unit 2 is given in advance, it is configured to form light that is directed toward a selected one of the flow path forming portions 14A to 14L, and as a result, it is possible to receive the light emitted from the selected flow path forming portion 14 by the light receiving element. Then, by the light reception, the foreign matter in the fluid flowing in the flow path forming portion 14 from which the light is emitted is detected.

[0041] In the explanation of the housing 31 that follows, the left side and the right side each refer to the left side and the right side when viewed from the front toward the rear. Thus, the member disposed on the right side is on the right side in the longitudinal cross-sectional rear view Figure 4 ​The flow path forming portion 14A is arranged on the left side. The flow path forming portion 14A is arranged in a position in the housing 31 that is forward and on the right side, and is arranged in a straight line along the left and right sides as described above. The flow path forming portions 14A to 14L are arranged with a slight gap between them, and are each fixed to the main body portion 32 of the housing 31. The flow path forming portions 14A to 14L are each similarly configured, and a representative one of them, the flow path forming portion 14A shown in FIG. 1, will be described. Figure 3 The flow path forming portion 14A is formed in a square and hexahedral block shape, and is formed of quartz or sapphire in a manner that enables the passage of laser light, which will be described later, for the purpose of performing optical detection of foreign matter.

[0042] A flow path 15 is formed in the flow path forming portion 14A. The flow path 15 is composed of a first flow path 16, a second flow path 17, and a third flow path 18 that are connected in this order toward the downstream side and are each formed along each side of the flow path forming portion 14A. The first flow path 16 extends horizontally toward the rear in the downstream direction, the second flow path 17 extends vertically toward the upper side in the downstream direction, and the third flow path 18 extends horizontally toward the front in the downstream direction. In addition, an upstream end of the first flow path 16 forms an inlet 16A for the treatment liquid toward the flow path forming portion 14A, and a downstream end of the third flow path 18 forms an outlet 18A for the treatment liquid from the flow path forming portion 14A. Thus, the first flow path 16 and the second flow path 17 are arranged orthogonal to each other, and the third flow path 18 connects the second flow path 17 and the outlet 18A. Also, since the inlet 16A and the outlet 18A are each opened in the front end surface of the flow path forming portion 14A, they are arranged on the same surface. In addition, if the first flow path 16, the second flow path 17, and the third flow path 18 included in the flow path forming portion 14A are each regarded as a partial flow path, the plurality of partial flow paths intersect each other.

[0043] A downstream end of a pipe 54 is connected to the inlet 16A of the first flow path 16 described above, and an upstream end of a pipe 55 is connected to the outlet 18A of the third flow path 18, and the treatment liquid flows from the pipe 54 to the pipe 55 through the flow path 15 of the flow path forming portion 14A. These pipes 54 and 55 constitute a treatment liquid supply path 12B shown in FIG. 1. Figure 1 The pipe 54 is flexible and is different from the flow path forming portion 14A in that it does not transmit laser light. The upstream side of the pipe 54 and the downstream side of the pipe 55 pass through the front wall of the housing 31 and are drawn out to the outside of the housing 31.

[0044] In addition, the flow path 15 of the flow path forming portions 14A to 14L is represented as flow paths 15A to 15L. As described above, the flow path forming portions 14A to 14L are arranged in a straight line along the left and right sides, and therefore the flow paths 15A to 15L are also arranged in a straight line along the left and right sides. In addition, the flow paths 15A to 15L are each formed of the first flow path 16, the second flow path 17, and the third flow path 18. Figure 5The flow path forming portions 14B to 14L are connected to the pipes 54 and 55 as well as the flow path forming portion 14A. The pipes 54 and 55 connected to the flow path forming portions 14B to 14L are used to supply the processing liquid to the flow path forming portions 14B to 14L. Figure 1 The processing liquid supply pipes 12B to 12L are shown in FIG. 2.

[0045] The light guide portion 52 and the light source 51 as the second light projecting portion are provided in order toward the left side of the row of the flow path forming portions 14A to 14L (the right side in the drawing). Figure 4 The light source 51 projects laser light for detecting foreign matter toward the light guide portion 52 in the row direction of the flow path forming portions 14A to 14L. The light guide portion 52 includes, for example, a plurality of collimators. The cross section of the light beam of the laser light projected from the light source 51 is shaped by the light guide portion 52, and is further projected to the right side to the reflection portion 44 described later. In addition, for example, the light guide portion 52 includes a light shutter that constitutes a light projecting switching mechanism that opens and closes the light path toward the reflection portion 44. When the detection of foreign matter is not performed, the light shutter shields the laser light, and the light projection to the flow path forming portions 14A to 14L is not performed. In addition, when the detection of foreign matter is not performed, the output of the light source 51 for generating the laser light can be reduced. By performing the output control to the minimum required extent, the heat generation from the light source 51 is reduced, the heat influence on the surroundings is suppressed, and the performance deterioration of the light source 51 is suppressed, and long-time use is enabled.

[0046] Next, the light path forming portion 4 will be described. The light path forming portion 4 includes a sliding stage 41, a guide rail 42, a moving mechanism 43, a reflection portion 44, a condensing lens 45, a support portion 46, a detection optical system 47, a light receiving portion 48, and a light absorbing portion 56, and these components are integrated into a unit. The rear end portion of the sliding stage 41 is positioned at a position further rearward than the row of the flow path forming portions 14A to 14L, and the front end portion of the sliding stage 41 is positioned below the row of the flow path forming portions 14A to 14L. Further, the sliding stage 41 is clamped to the guide rail 42 provided below the sliding stage 41, and the guide rail 42 extends left and right. The moving mechanism 43 is provided rearward of the guide rail 42, and the sliding stage 41 is connected to the moving mechanism 43. The sliding stage 41 is moved in the length direction of the guide rail 42, that is, in the left and right directions, by the moving mechanism 43. The reflection portion 44 that constitutes the first light projecting portion and the condensing lens 45 are provided at the front end portion on the sliding stage 41, and the condensing lens 45 is positioned above the reflection portion 44. In addition, the light guide portion 52 and the light source 51 as the second light projecting portion are provided in order toward the left side of the row of the flow path forming portions 14A to 14L (the right side in the drawing). Figure 5 The condensing lens 45 is omitted in FIG. 2.

[0047] A support portion 46 in the form of an upright plate is formed on the rear end portion of the slide table 41 so as to extend upward. On the support portion 46, a detection optical system 47, a light-receiving portion 48 as a light-receiving element are provided in this order toward the rear. The detection optical system 47 includes a lens, and light incident on the detection optical system 47 is condensed on the light-receiving portion 48 as described later. In addition, the upper end portion of the support portion 46 is formed so as to project an arm 57 toward the front, and a light-absorbing portion 56 as a light beam damper is provided at the tip end portion of the arm 57. A wavelength filter (not shown) that passes only a specific wavelength is also provided inside the detection optical system 47. Thus, the SN ratio (signal-to-noise ratio) is increased. That is, a difference between the peak value of a signal indicating detection of a foreign object and a background signal is easily produced, and thus detection of a foreign object with high reliability can be performed.

[0048] The slide table 41, the reflection portion 44, the condensing lens 45, the detection optical system 47, the light-receiving portion 48, and the light-absorbing portion 56 are integrally moved along the arrangement direction (left-right direction) of the flow path forming portions 14A to 14L by the moving mechanism 43. When moving in this way, the detection optical system 47 and the light-receiving portion 48 are disposed at a height opposite to each flow path 16 of each flow path forming portion 14A to 14L. In addition, the light-absorbing portion 56 is disposed so as to face the reflection portion 44 across the flow path forming portion 14 irradiated with light among the flow path forming portions 14A to 14L. In addition, although not shown, the moving mechanism 43 can be configured to adjust the light-receiving distance from the flow path forming portion 14 to the point at which light is received by the light-receiving portion 48 by changing the distance between the flow path forming portion 14 and the light-receiving portion 48. More specifically, a mechanism that allows at least the detection optical system 47 and the light-receiving portion 48 to relatively move in a direction different from the arrangement direction of the flow path forming portion 14 with respect to the flow path forming portion 14 can also be included. That is, the light-receiving distance is set for each flow path forming portion 14A to 14L, and when light is projected toward one flow path forming portion 14, the position of the detection optical system 47 and the position of the light-receiving portion 48 are adjusted so as to become the light-receiving distance set for that flow path forming portion 14. Thus, even in the case where the focal points of light from each flow path forming portion 14 toward the light-receiving portion 48 are not consistent in the arrangement direction due to a deviation in shape and position of the flow path forming portions 14 caused by manufacturing and assembly, the light-receiving distance can be adjusted in cooperation with the focal point of each flow path forming portion 14. Thus, detection of a foreign object with higher accuracy can be performed.

[0049] As described above, the detection of foreign matter is performed on the selected one of the flow path forming portions 14A to 14L. At the time of the detection of foreign matter, the reflecting portion 44 and the condenser lens 45 are located vertically below the flow path forming portion 14 corresponding to the selected flow path forming portion 14. Also, the detection optical system 47 and the light receiving portion 48 are located behind the flow path forming portion 14 corresponding to the selected flow path forming portion 14. In addition, the light absorbing portion 56 is located vertically above the flow path forming portion 14. Further, Figure 3 , Figure 4 The arrangement of each portion when the flow path forming portion 14A is the selected flow path forming portion 14 is shown.

[0050] Figure 3 The dotted arrows in the drawing indicate the optical path. Reference is also made to the schematic view of FIG. 6, in which the optical path is also indicated by dotted arrows. Figure 6 , Figure 7 The laser light irradiated from the light source 51 via the light guide portion 52 is reflected by the reflecting portion 44 toward the upper side, i.e., the longitudinal direction, and passes through the condenser lens 45. Then, the laser light is incident on the first flow path 16 of the flow path forming portion 14A perpendicularly to the flow direction of the processing liquid in the first flow path 16, and a foreign matter detection region 40 as a condensing point having relatively high energy is formed in the first flow path 16. The optical axis of the laser light reflected by the reflecting portion 44 and passing through the first flow path 16 is obliquely directed toward the upper side when viewed from the front and rear directions, and the light does not pass through the flow path forming portion 14A other than the first flow path 16, i.e., the second flow path 17 and the third flow path 18. Then, the light thus passing through the flow path forming portion 14A is irradiated on the light absorbing portion 56 and is absorbed (see FIG. 6). Figure 3 , Figure 7 The foreign matter detection region 40 is formed by forming the optical path in this way during the passage of the resist through the flow path forming portion 14A. Also, if the foreign matter P enters the foreign matter detection region 40 with the flow of the resist, scattered light is generated.

[0051] Also, the light of the scattered light that is incident on the detection optical system 47 is irradiated on the light receiving portion 48. That is, the side-scattered light from the first flow path 16 of the flow path forming portion 14 toward the second flow path 17 side (rear side) is irradiated on the light receiving portion 48, and the light receiving portion 48 photoelectrically converts the light and outputs an electric signal of an intensity corresponding to the intensity of the received side-scattered light. Further, the case where the selected flow path forming portion 14 is the flow path forming portion 14A is shown, but the optical path is formed in the same way and the scattered light is irradiated on the light receiving portion 48 in the case where another foreign matter detection portion is selected. Figure 6

[0052] Returning to the use of​Figures 3 to 5 31. A counting unit 53 is provided in front of the light guide unit 52 and the light source 51. The counting unit 53 includes, for example, a substrate on which a CPU or the like is mounted. For example, the counting unit 53 is connected to the light receiving unit 48 by a cable not shown in the figure, receives the above-mentioned electric signal from the light receiving unit 48, and detects foreign matter based on the electric signal. As the detection of the foreign matter, for example, including counting and grading of the foreign matter, the counting unit 53 outputs a detection signal corresponding to the detection result to the control unit 100 constituting the resist coating device 1. In addition, the above-mentioned grading is to count the foreign matter in each range of a specified size.

[0053] In addition, if Figure 8 As shown, the above-mentioned light guide portion 52, light source 51, light path forming portion 4 and counting portion 53 are configured to be able to be loaded and unloaded by being installed on the main body portion 32 of the shell 31 using fixing parts such as bolts and nuts. Therefore, when the upper cover 33 and / or the horizontal cover 34 are removed from the main body 32, these light guide portions 52, light source 51, light path forming portion 4 and counting portion 53 can be taken out of the shell 31. The reference numeral 35 in the figure is a pin provided at the bottom of the shell 31, and the pin 35 is used to guide the horizontal position of the light path forming portion 4 when the light path forming portion 4 is installed in the shell 31. More specifically, the pin 35 limits the position of the light path forming portion 4 in the front-to-back direction of the guide rail 42. With respect to the light guide portion 52, light source 51, light path forming portion 4 and counting portion 53, components that respectively guide the installation positions in the shell 31 in the same way as the pin 35 can also be provided in the shell 31. In addition, Figure 8 Zhongye and Figure 5 Similarly, illustration of the pipes 54 and 55 connected to the flow path forming portion 14 other than the flow path forming portion 14L is omitted.

[0054] Next, the composition Figure 1 、 Figure 3 1 and 2. The control unit 100 of the resist coating device 1 shown in FIG. 1 is described. The control unit 100 is composed of a computer, and for example, the above-mentioned counting unit 53 is connected to the control unit 100. The control unit 100 has a program storage unit not shown in the figure. The program storage unit stores a program in which commands (step groups) are incorporated in the manner of forming a resist film and detecting foreign matter on the wafer W. According to the program, a control signal is output from the control unit 100 to each part of the resist coating device 1, thereby performing each action described later. The program is stored in the program storage unit in a state of being stored in a storage medium such as a hard disk, an optical disk, a magneto-optical disk, a memory card or a DVD.

[0055] Next, refer to Figure 9A timing chart for explaining the processing of the wafer W and the detection of foreign matter in the resist coating apparatus 1 described above will be described. In the timing chart, the timing of adjusting the pressure of the pump of one of the processing liquid supply sections 13 and the timing of opening and closing the valve VI of the processing liquid supply pipe 12 corresponding to the one of the processing liquid supply sections 13 are shown. In addition, the timing of opening the shutter of the light guide section 52 to irradiate the laser light to the light path forming section 4, the timing of moving each part constituting the light path forming section 4, and the timing of the counting section 53 receiving the signal acquired by the light receiving section 48 and detecting the foreign matter are shown.

[0056] First, the wafer W is transported to the rotary chuck 21 by a not-shown substrate output mechanism, and the nozzle 11L is transported above the wafer W in a state where the wafer W is held to the rotary chuck 21, and the pump of the processing liquid supply section 13L sucks the diluent to start the adjustment in a manner that the pressure in the pump becomes a predetermined pressure (time tl). For example, the movement of the nozzle 11L and the operation of the pump are performed in parallel, and the sliding stage 41 of the light path forming section 4 is moved. Also, the reflecting section 44 and the condenser lens 45 are positioned below the flow path forming section 14L, the detection optical system 47 and the light receiving section 48 are positioned behind the flow path forming section 14L, and the light absorbing section 56 is positioned above the flow path forming section 14L.

[0057] Next, the nozzle 11L is stationary above the wafer W (time t2). Next, the valve VI of the processing liquid supply pipe 12L is opened, and the diluent is pressurized and supplied from the pump to the nozzle 11L. Simultaneously with the pressurized supply of the diluent, the laser light is irradiated from the light source 51 to the reflecting section 44, the laser light is reflected by the reflecting section 44 to be directed upward as described in, for example, FIG. 2, and the foreign matter detection area 40 is formed in the flow path forming section 14L (time t3). Then, when the foreign matter enters the foreign matter detection area 40 formed in the flow path forming section 14L described above, the scattered light is generated, and the scattered light is irradiated to the light receiving section 48 via the detection optical system 47. Figure 3 、 Figure 4

[0058] On the other hand, the pressurized diluent passes through the flow path 15 of the flow path forming section 14L, and is sprayed from the nozzle 11L to the center portion of the wafer W. Then, when the opening degree becomes a predetermined opening degree, the increase of the opening degree of the valve VI is stopped (time t4). After that, when the flow of the diluent in the flow path 15 is stabilized, the signal is acquired from the light receiving section 48 by the counting section 53, and the detection of the foreign matter is performed. Next, the acquisition of the signal from the light receiving section 48 by the counting section 53 is stopped (time t6), the irradiation of the light from the light source 51 is stopped and the valve VI of the processing liquid supply pipe 12L is closed (time t7), and the spraying of the diluent to the wafer W is stopped. The wafer W is rotated, and the sprayed diluent is stretched to the peripheral portion of the wafer W by the centrifugal force to perform the pre-wetting.​

[0059] Next, the resist stored in any one of the processing liquid supply parts 13A to 13K is supplied to the wafer W. Here, it is assumed that the resist of the processing liquid supply part 13A is supplied to the wafer W. When the resist of the processing liquid supply part 13A is supplied to the wafer W in this way, the nozzle 11A is positioned above the wafer W instead of the nozzle 11L, and the resist is supplied to the nozzle from the processing liquid supply part 13A instead of the diluent supplied to the nozzle from the processing liquid supply part 13L. In addition, the valve V1 of the processing liquid supply pipe 12A is opened and closed instead of the valve V1 of the processing liquid supply pipe 12L. Moreover, the various parts constituting the optical path forming part 4 move to the position corresponding to the flow path forming part 14A instead of moving to the position corresponding to the flow path forming part 14L, and form an optical path in the flow path forming part 14A.

[0060] Except for this difference, the same as when the diluent is supplied to the wafer W, each part is in accordance with Figure 9 The timing diagram is shown. Thus, foreign matter in the resist is detected in parallel with the supply of resist to the wafer W. The resist supplied to the wafer W is then spin-coated onto the surface of the wafer W by the rotation of the wafer W, forming a resist film. The wafer W is then transported from the spin chuck 21 by the substrate transport mechanism.

[0061] According to the resist coating apparatus 1, the reflecting unit 44, which serves as a light projecting unit, irradiates light toward the flow path forming portion 14 from one of the regions (specifically, the lower region) in front of, behind, above, below, to the left, and to the right of the flow path forming portion 14. Furthermore, a light receiving unit 48 is provided in another region (specifically, the rear region) that is not opposite to the reflecting unit 44 across the flow path forming portion 14.

[0062] Assume that the reflector 44 and the light receiving unit 48 are arranged so as to face each other across the flow path forming unit 14. In this relative arrangement, the reflector 44 or the light receiving unit 48 is considered to be located between the piping 54 and the piping 55 connected to the flow path forming unit 14. However, if these components are arranged in this manner, to avoid interference with the reflector 44 or the light receiving unit 48 located between the piping 54 and 55, the length of the second flow path 17 in the longitudinal direction of the flow path forming unit 14 must be increased. As a result, the height of the flow path forming unit 14 increases. Furthermore, if the reflector 44 and the light receiving unit 48 are arranged so as to face each other, the reflector 44, the flow path forming unit 14, and the light receiving unit 48 are arranged in a row, resulting in an increase in the length in the lateral direction of the arrangement. In other words, if the reflector 44 and the light receiving unit 48 are arranged across the flow path forming unit 14, the foreign matter detection unit 2 and thus the resist coating device 1 including these components may become larger.

[0063] However, as described above, since the reflection portion 44 and the light receiving portion 48 are arranged so as not to face each other with the flow path forming portion 14 therebetween, it is not necessary to increase the height of the flow path forming portion 14, nor is it necessary to provide a space due to the arrangement of the reflection portion 44, the flow path forming portion 14, and the light receiving portion 48. Thus, it is possible to downsize the resist coating apparatus 1. With respect to the patent document 1 described above, a particle counter for detecting foreign matter in the flow path of the resist connected to the nozzle is described. However, the positional relationship between the flow path and each portion constituting the particle counter is not described. That is, the structure of the substrate processing apparatus of the present disclosure is not shown in the patent document 1.

[0064] In addition, in the resist coating apparatus 1, one or more other flow path forming portions 14 are arranged in a row in a direction (specifically, the left-right direction) different from the direction toward the side on which the reflection portion 44 is located and the direction toward the side on which the light receiving portion 48 is located with respect to one flow path forming portion 14. Further, the reflection portion 44 and the light receiving portion 48 are moved along the row of the flow path forming portions 14 with respect to the row of the flow path forming portions 14 by the moving mechanism 43, and thus are shared. By forming the row of the flow path forming portions 14 in such a direction, the reflection portion 44 and the light receiving portion 48 do not face each other with each of the flow path forming portions 14 therebetween when a plurality of flow path forming portions 14 are provided, as described above. Thus, even when a plurality of flow path forming portions 14 are provided, it is possible to prevent the foreign matter detection unit 2 from being large-sized. Further, since the reflection portion 44 and the light receiving portion 48 are shared as described above, it is possible to reduce the number of components constituting the foreign matter detection unit 2, and to prevent it from being large-sized. By thus preventing the foreign matter detection unit 2 from being large-sized, it is possible to prevent the resist coating apparatus 1 from being large-sized.

[0065] Further, with respect to the inlet 16A and the outlet 18A of the flow path forming portion 14, the inlet 16A and the outlet 18A are opened in a direction (specifically, a front direction) different from the direction in which the reflection portion 44 is provided and the direction in which the light receiving portion 48 is provided, with the flow path forming portion 14 as a reference. According to such a structure, it is possible to prevent the pipes 54 and 55 connected to the inlet 16A and the outlet 18A, respectively, from being routed to the lower side of the reflection portion 44 and the rear side of the light receiving portion 48, respectively, with respect to the row of the flow path forming portion 14. Therefore, when the reflection portion 44 and the light receiving portion 48 are maintained, it is not necessary to remove the pipes 54 and 55. When the condenser lens 45 and the detection optical system 47 provided in the same direction as the reflection portion 44 and the light receiving portion 48, respectively, are maintained, with the flow path forming portion 14 as viewed, it is also not necessary to remove the pipes 54 and 55. Thus, since it is not necessary to remove the pipes 54 and 55, it is possible to easily perform maintenance. Further, with respect to the pipes 54 and 55, it is not limited to the above-described manner of being routed in the front direction so as to pass through the front wall of the housing 31 from the inlet 16A and the outlet 18A of the flow path forming portion 14 opened. It is also possible to route the pipes 54 and 55 in such a manner as to extend in the front direction within the housing 31 and then be bent in a downward direction and pass through the bottom wall of the housing 31.

[0066] Further, the inlet 16A and the outlet 18A described above are provided on the same face in the flow path forming portion 14, and scattered light generated by the first flow path 16 constituting the inlet 16A is received by the light receiving portion 48 provided on the side (specifically, the rear side) of the second flow path 17 formed orthogonally to the first flow path 16. According to such a structure, the respective end portions of the pipes 54 and 55 connected to the inlet 16A and the outlet 18A and the light receiving portion 48 are opposed across the flow path forming portion 14, and the deviation in height therebetween is suppressed, and thus it is possible to suppress the height of the foreign matter detection unit 2. Further, when the pipes 54 and 55 are routed in a direction opposite to the direction in which the light receiving portion 48 is located, as viewed from the flow path forming portion 14, even when the plurality of flow path forming portions 14 are arranged in a row as described above, it is possible to prevent the pipes 54 and 55 from becoming an obstacle, even when each of the flow path forming portions 14 is designed so as to be close to each other. Thus, it is possible to more reliably achieve the reduction in size of the resist coating apparatus 1.

[0067] Further, the reflection portion 44 reflects light in such a manner that the light is perpendicularly incident with respect to the flow direction of the first flow path 14 described above, and the optical axis of the reflected light is constituted so as not to pass through the second flow path 17 and the third flow path 18. Thus, the generation of unnecessary scattered light is suppressed, the noise contained in the signal output from the light receiving portion 48 is reduced, and it is possible to improve the detection accuracy of foreign matters.

[0068] Further, as described above, the inlet 16A and the outlet 18A are opened in the same face of the flow path forming portion 14, that is, in the same direction, whereby the elongation directions of the pipes 54 and 55 are made to coincide with each other. By thus making the elongation directions coincide with each other, the pipes 54 and 55 can be disposed in such a manner as to penetrate the same wall portion (specifically, the front wall) in the housing 31. As for the wall portion of the housing 31, in which the pipes 54 and 55 do not penetrate, the wall portion can be easily configured as a cover that is detachable with respect to the main body portion 32 of the housing 31. The cover that is easily detachable is provided in order to easily perform maintenance on each portion in the housing 31, and, as for the housing 31 from which the cover is detached, since the larger the area of the opening portion is, the easier it is for the worker to insert his or her hand into the housing 31 to perform work, maintenance is easily performed. That is, the configuration in which the inlet 16A and the outlet 18A are provided in the same face of the flow path forming portion 14 as described above has the advantage that the number of covers that are detachable is increased to increase the area of the opening portion of the housing 31 when each cover is detached, and maintenance is easily performed on each portion in the housing 31.

[0069] Further, in the resist coating device 1, the laser light is irradiated from the light source 51 along the row of the flow path forming portions 14, and the laser light is irradiated toward the selected one of the flow path forming portions 14 by the reflection portion 44 that moves along the row of the flow path forming portions 14. That is, the configuration is such that the light source 51 is fixedly provided in the housing 31 at a position away from the moving region of the reflection portion 44. Since the light source 51 is thus fixed, it is possible to prevent the space in which a cable (not shown) for supplying electric power to the light source 51 is routed from becoming large. Thus, it is possible to more reliably suppress the increase in size of the foreign matter detection unit 2. Further, since the light source 51 does not move within the housing 31, the light source 51 is easily detachable and replaceable.

[0070] Further, the light absorbing portion 56 is provided at a position opposite to the reflection portion 44 with the flow path forming portion 14 interposed therebetween. Thus, it is possible to prevent the laser light that has passed through the flow path forming portion 14 from being irradiated toward the wall surface of the housing 31 and the reflected light from being incident on the light receiving portion 48, and it is thus possible to further reduce the noise in the output signal of the light receiving portion 48 to improve the detection accuracy of the foreign matter. The light absorbing portion 56 can be provided in the housing 31 for each of the flow path forming portions 14, but, as has been described, by configuring the light absorbing portion 56 to move along the row of the flow path forming portions 14 and to be shared by each of the flow path forming portions 14, it is possible to reduce the manufacturing cost, and thus this configuration is preferable. Further, instead of providing the light absorbing portion 56, for example, the top surface of the housing 31 (the lower surface of the upper cover 33) can also be configured in such a manner as to be capable of absorbing the laser light. Specifically, the configuration can be such that a paint for absorbing the laser light is applied to the top surface. Further, in this case, in order to prevent the temperature of the upper cover 33 that absorbs light from rising, a cooling fin that protrudes toward the outside of the housing 31, for example, can be provided as a cooling member in the upper cover 33.

[0071] In the resist coating device 1 in which the detection of foreign matter is thus performed, the purity of the processing liquid immediately before being ejected toward the wafer W is monitored. Thus, it is possible to accurately identify whether the wafer W being processed has generated an abnormality. According to the detection result of foreign matter, it is also possible to output a control signal from the control section 100 so as to stop the processing of the wafer W by the control section 100, in which case, it is possible to prevent the subsequent wafer W delivered to the device 1 from being subjected to abnormal processing. In addition, with respect to the resist coating device 1, a structure is adopted in which foreign matter in the flow paths of a plurality of processing liquids can be detected respectively, and in the case where an abnormality has occurred in the wafer W, it is possible to determine which of the flow paths is the source of generation of foreign matter. Thus, there is an advantage in that the repair of the device with respect to an abnormality can be performed promptly.

[0072] Further, as the detection of foreign matter, the particle diameter of foreign matter and the total number of foreign matter can be obtained based on the output signal from the light receiving section 48, the first correspondence relationship indicating the correspondence between the output signal from the light receiving section 48 and the particle diameter, and the second correspondence relationship indicating the correspondence between the output signal from the light receiving section 48 and the total number of foreign matter flowing in the flow path. Moreover, with respect to the upstream side of one of the processing liquid supply tubes 12, for example, a structure is adopted in which the processing liquid supply source of a test liquid containing a test particle of a known size at a prescribed concentration is connected. A device structure can also be adopted in which, with respect to the test liquid, the detection described in the embodiment is performed, based on the detection result, the first correspondence relationship and the second correspondence relationship are newly obtained, and thus each of the correspondence relationships is corrected. Figure 9

[0073] In addition, with respect to the housing 31, it can be either laid horizontally or inverted. That is, with respect to the positions of each of the portions with the flow path formation section 14 as a reference, the positions are not limited to those described above. Specifically, it can be either a configuration in which the light receiving section 48 is positioned in the longitudinal direction and the reflection section 44 is positioned in the lateral direction with respect to the flow path formation section 14, or a configuration in which each of the flow path formation sections 14 is arranged along the longitudinal direction.

[0074] Moreover, with respect to the positional relationship of the flow path formation section 14, the light projecting section, and the light receiving section 48, the specific examples shown in the drawings are not limiting. The positional relationship is supplemented by referring to the three-dimensional coordinates shown in FIG. 17. Figure 10 Figure 10 ​​The origin of the coordinate axis in the coordinate system is set to the above-described foreign matter detection region 40 formed in the flow path 15 of the flow path forming portion 14. Thus, the axis direction of the X axis of the coordinate indicates the left and right directions as viewed from the foreign matter detection region 40, the axis direction of the Y axis indicates the front and rear directions as viewed from the foreign matter detection region 40, and the axis direction of the Z axis indicates the upper and lower directions as viewed from the foreign matter detection region 40. As described above, the light projecting portion and the light receiving portion 48 are provided in non-opposing regions in the regions above and below and to the left and right and front and rear of the flow path forming portion 14. That is, when the light axis L is formed by the reflection portion 44 serving as the light projecting portion to project light toward the foreign matter detection region 40, the light receiving portion 48 is not provided in the direction of the extension of the light axis L passing through the origin.

[0075] Since the light receiving portion 48 is not provided in this way, as described above, the foreign matter detection unit 2 can be prevented from being enlarged due to the structure in which the light projecting portion and the light receiving portion are separated by the flow path forming portion. In Figure 10 In the example shown in the drawing, the light axis L (indicated by a dotted line arrow) is formed by the reflection portion 44 along the Z axis. Thus, the light receiving portion 48 is not provided in the Z axis. Similarly, for example, when the light axis L is formed by the reflection portion 44 along the X axis, the light receiving portion 48 is not provided in the X axis. Further, in the Figure 10 In the description of the embodiment, the light projecting portion is described as the reflection portion 44, and the light projecting portion herein refers to a member that projects light in such a manner that the direction of the light path toward the foreign matter detection region is determined. Thus, for example, the light source 51 can be mounted on the sliding stage 41, and the light source 51 can project laser light directly toward the flow path forming portion 14 without passing through the reflection portion 44, in which case the light projecting portion is the light source 51.

[0076] Further, the position of the laser light with respect to the flow path forming portion 14 is not limited to the example described above. However, if the flow path direction of the treatment liquid in the foreign matter detection region 40 formed by the irradiation of the laser light is parallel to the irradiation direction, the light cannot be continuously irradiated toward the foreign matter flowing in the flow path, and accurate detection cannot be performed, and thus the light is irradiated in such a manner that these directions are not parallel but intersect each other. Further, the intersection herein includes orthogonal intersection and oblique intersection. Further, in the example of the structure described above, the treatment liquid is supplied in the flow path forming portion 14 in such a manner that the treatment liquid is supplied from the lower side to the upper side, but the supply direction is not limited to this direction.

[0077] Further, with respect to the flow path 15 of the flow path forming portion 14 described above, the flow path 15 is bent as described above in order to introduce the treatment liquid into the housing 31 as a region in which measurement is performed and to discharge the treatment liquid from the housing 31. Thus, with respect to the flow path 15 of the flow path forming portion 14, the example of the structure described above is not limiting. Figure 11The example shown does not provide the upper lateral third flow path 18, but the second flow path 17 is open at the upper end of the flow path forming portion 14, whereby the flow path 15 of the flow path forming portion 14 is formed in an L shape in side view. Also, the downstream side of the pipe 54 is bent, whereby it penetrates the front wall of the housing 31. As for the pipe 54, it can also be provided to penetrate the upper portion of the housing 31, but according to the reasons already explained, it is preferable to provide a structure that penetrates the front wall of the housing 31 together with the pipe 55.

[0078] Figure 12 、 Figure 13 A structural example of another flow path forming portion 14 is shown in Figure 12 is a longitudinal sectional side view of the flow path forming portion 14, Figure 13 is a rear view of the flow path forming portion 14. In this example, as in the example already explained in Figure 3 The flow path 15 of the flow path forming portion 14 is composed of a first flow path 16, a second flow path 17, and a third flow path 18, as in the example already explained. The lower end portion of the flow path 15 projects toward the rear, and a spherical lens portion 19 is formed that bulges in a manner that constitutes a convex lens shape when viewed from the second flow path 17. Also, as for the intersection portions 201, 202 where the partial flow paths that constitute the flow path 15 intersect each other, a structure is provided that has a curvature. This will be explained more specifically. In the example shown in Figure 13 the example shown, the corners to the left and right of the upper end portion and the lower end portion of the second flow path 17 when viewed toward the front are rounded, whereby the upper end portion and the lower end portion are provided in a substantially semicircular shape, and are formed as the intersection portions 201, 202 already explained that have a curvature. The intersection portions 201, 202 are provided with a curvature in order to prevent stagnation of the flow of the processing liquid at the bent portion of the flow path 15. If foreign matter is left in the foreign matter detection region 40 as a result of this stagnation, it is possible that particles will be generated as a result of the left over, but by providing the intersection portions 201, 202, it is possible to more reliably prevent such a bad situation from occurring. Also, the lower end portion of the rear end face of the flow path forming portion 14 projects toward the rear, and a convex lens portion 27 is formed. When viewed in the front-rear direction, the center of the spherical lens portion 19 and the center of the convex lens portion 27 coincide with each other. The convex lens portion 27 and the spherical lens portion 19 are provided in order to more reliably introduce the side scatter light that is irradiated from the foreign matter detection region 40 toward the detection optical system 47, and to improve the detection accuracy.

[0079] Figure 14 is a longitudinal sectional side view showing the structure of yet another flow path forming portion 14. The flow path 15 of the flow path forming portion 14 is formed in a U shape in side view. Thus, as for the flow path 15, the curvature of a region 49 near the center in the length direction thereof on the downstream side compared to the curvature of a region near the inlet 16A (on the upstream side in the liquid flow direction) is large. Also, it is possible to bend the processing liquid supply pipe 12 in a U shape within the housing 31, and to form a structure that is substantially the same as the Figure 14The flow path 15 of the same shape as the flow path 15 of the flow path forming portion 14 shown in FIG. 1 is routed in the housing 31, and the detection of foreign matter is performed by irradiating the processing liquid supply pipe 12 with light. As for the portion of the processing liquid supply pipe 12 in the housing 31, in order to perform the detection thereof, it is configured to have light transmissivity. In addition, in a case where the shape of the inner wall of the flow path has an influence on the trajectory of the irradiated light when the detection of foreign matter is performed, or in a case where it is desired to reduce the noise of the detected signal, at least the portion of the inner wall through which the irradiated light passes can be flattened. In addition, the inner wall portion can also be mirror finished. At this time, the surface roughness of the portion that is mirror finished is, for example, on the order of nanometers. This is not limited to Figure 14 The example of the flow path forming portion 14 shown in FIG. 1 is the same in other examples.

[0080] Figure 15 is a rear view that shows the structure of still another flow path forming portion 14. The flow path 15 of this flow path forming portion 14 is composed of a first flow path 16, a second flow path 17, and a third flow path 18, and as for the second flow path 17 thereof, it is configured to be narrower on the downstream side than on the upstream side. More specifically, if the example of the structure shown in FIG. 3 is described, Figure 15 the second flow path 17 narrows in width on the left and right sides of the flow path as it goes upward. As Figure 14 , Figure 15 The purpose of increasing or decreasing the curvature of the downstream side of the flow path 15 as in the example shown in FIG. 4 is to eliminate the stagnant portion and improve the displacement efficiency of the flow-through liquid. This prevents the foreign matter from being trapped in the flow path 15, and it is possible to reduce the risk of the generation of trapped particles. In addition, other than this, when the detection of foreign matter is performed while the flow-through liquid is flowing, it is possible to perform detection with high reliability while reducing the influence of the residue or mixture generated by the portion that flows first. In addition, by providing the cross portions 201 and 202 having curvatures as described above, the same effect can be obtained. Thus, it is more desirable to provide a curvature at the cross portion near the detection target portion to which light is applied, but in a case where a curvature is provided at other cross portions as well, it is possible to improve the displacement efficiency. Figure 13 The purpose of increasing or decreasing the curvature of the downstream side of the flow path 15 as in the example shown in FIG. 4 is to eliminate the stagnant portion and improve the displacement efficiency of the flow-through liquid. This prevents the foreign matter from being trapped in the flow path 15, and it is possible to reduce the risk of the generation of trapped particles. In addition, other than this, when the detection of foreign matter is performed while the flow-through liquid is flowing, it is possible to perform detection with high reliability while reducing the influence of the residue or mixture generated by the portion that flows first. In addition, by providing the cross portions 201 and 202 having curvatures as described above, the same effect can be obtained. Thus, it is more desirable to provide a curvature at the cross portion near the detection target portion to which light is applied, but in a case where a curvature is provided at other cross portions as well, it is possible to improve the displacement efficiency.

[0081] In addition, as for the foreign matter detection unit 2, a plurality of groups (measurement groups) of the light source 51, the light guide portion 52, and the light path forming portion 4 can be provided with respect to the flow path forming portions 14A to 14L. In Figure 16The illustrated example shows a top view of a foreign matter detection unit 2 equipped with two of the aforementioned measurement groups. One measurement group, comprising light source 51, light guide 52, and optical path forming section 4, detects foreign matter in flow path forming sections 14A to 14F, while the other measurement group, comprising light source 51, light guide 52, and optical path forming section 4, detects foreign matter in flow path forming sections 14G to 14L. Specifically, one group forms an optical path for a flow path forming section selected from flow path forming sections 14A to 14F, while the other group forms an optical path for a flow path forming section selected from flow path forming sections 14G to 14L.

[0082] For example, as will be described later, there is a case where a structure is provided in which a plurality of resist coating devices 1 share a foreign matter detection unit 2. In this case, the time difference of the resist flow between one flow path forming portion 14 and another flow path forming portion 14 is small or does not exist, and therefore it is considered that the optical path forming portion 4 cannot move between the position corresponding to one flow path forming portion 14 and the position corresponding to the other flow path forming portion 14. However, in such a case, by Figure 16 By providing multiple measurement groups as shown, it is possible to independently detect one flow path forming section 14 and the other flow path forming section 14. Thus, in this foreign matter detection unit 2, it is possible to simultaneously illuminate both flow path forming sections 14 with light and detect foreign matter. Furthermore, it is possible to continuously illuminate light between the two flow path forming sections 14, that is, to simultaneously stop illuminating one flow path forming section 14 and start illuminating the other flow path forming section 14, thereby detecting foreign matter in each flow path forming section 14. Furthermore, the aforementioned measurement groups may be three or more.

[0083] In addition, the foreign body detection unit 2 can also be as follows Figure 17 As shown in the figure. Figure 17 The foreign body detection unit 2 shown in FIG. Figure 3 Among the differences between the foreign object detection unit 2 described above, the inclusion of a partition wall 63 is mentioned. This partition wall 63 extends rearward from the front wall of the housing 31, passing through the pipes 54, 55 and the lower sides of the flow path forming sections 14A to 15L. It then bends upward, passes through the rear sides of the flow path forming sections 14A to 15L, and contacts the top wall of the housing 31. The partition wall 63 divides the interior of the housing 31 into a first configuration area 61, which includes the flow path forming section 14, and a second configuration area 62, which includes the optical path forming section 4, the light source 51, the light guide section 52, and the counter section 53. The inclusion of this partition wall 63 is possible because the rows of flow path forming sections 14 do not overlap with the movement area of ​​the optical path forming section 4 when viewed in the left-right direction. To enable light to be irradiated into each flow path forming section 14 and foreign object detection to be performed, the partition wall 63 is constructed in a light-transmitting manner, such as from quartz, or from a metal plate with holes or localized quartz windows that avoid the optical path during detection.

[0084] The partition wall 63 constitutes a heat insulating member. To be more specific, it is considered that the light source 51, the light path forming portion 4, and the counting portion 53 located in the second arrangement region 62 respectively generate heat due to the energy of the current and the laser light supplied thereto. However, since the first arrangement region 61 is partitioned from the second arrangement region 62 by the partition wall 63, heat generated from each portion of the second arrangement region 62 is less likely to be transferred to the first arrangement region 61. Thus, it is possible to suppress the temperature rise of the first arrangement region 61, and it is possible to reliably prevent the deterioration of the resist flowing through the flow path forming portions 14A to 14K located in the first arrangement region 61 due to heat.

[0085] Further, there are provided an N2 gas supply portion 64 that supplies N2 (nitrogen) gas as an inactive gas to the first arrangement region 61, and an exhaust portion 65 that exhausts the gas from the first arrangement region 61. As described above, since the light source 51, the light path forming portion, and the counting portion 53 generate heat, it is considered that explosion-proof measures are taken by setting the surroundings of the flow path forming portions 14 in the housing 31 to be an N2 gas environment. By providing the partition wall 63 as described above, it is possible to supply N2 gas only to the first arrangement region 61 in the housing 31, and thus explosion-proof measures are taken. As a result, it is possible to suppress the amount of N2 gas used, compared to the case where N2 gas is supplied to the entire inside of the housing 31.

[0086] Further, with respect to the flow path forming portions 14, it is not limited to be provided in plural, but only one can be provided. In addition, it is not limited to house all of the above-described members in the housing 31, and for example, the counting portion 53 can be provided outside the housing 31. In addition, the housing 31 can be configured so that only one of the upper cover 33 and the lateral cover 34 is detachable. In addition, the plurality of flow path forming portions 14 need not be independent one by one. That is, it is not necessary to form each flow path forming portion 14 as a separate member, but it is also possible to form a plurality of flow paths in one member and to be integrated.

[0087] Moreover, it is also possible to provide that only any one of the light guide 52, the light source 51, the light path forming section 4, and the counting section 53, which are described as being provided in the housing 31, is detachable with respect to the housing 31. In the above-described example, the portions constituting the light path forming section 4 are provided to be detachable with respect to the housing 31 together, but the detachability is not limited to this. For example, it is possible to provide that the moving mechanism 43 is detachable with respect to the housing 31 independently of the sliding table 41, or it is possible to provide that the support section 46 and the reflection section 44 each having the light receiving section 48 are independently detachable with respect to the sliding table 41. That is, it is possible to provide a structure in which at least any one of the reflection section 44, the light receiving section 48, and the moving mechanism 43 as the light projecting section is detachable with respect to the housing 31. In addition, instead of using the reflection member 44 as the light projecting section, it is possible to use a fiber laser. Due to the flexibility of the fiber, the fiber laser is able to follow the movement of the light path forming section 4 by the moving mechanism 43, and by changing only the length of the fiber, it is possible to provide a laser generation section (the light source 51 in the above-described example) that is a heat source at a desired position separate from the light receiving section 48 and the flow path forming section 14. Thus, it is easy to reduce the heat influence.

[0088] In addition, with respect to the light receiving side as well as the light projecting side, a reflection plate that is operated by a moving mechanism is provided, and with respect to the light receiving section 48 that receives light emitted from the flow path forming section 14 and reflected by the reflection plate, it is possible to provide a structure in which the light receiving section 48 is fixedly placed at a position different from the movement path of the reflection plate.

[0089] Next, a coating and developing apparatus 7 of one example of a substrate processing system including the above-described resist coating apparatus 1 will be described with reference to a plan view of Figure 18 and a longitudinal sectional side view of Figure 19 The coating and developing apparatus 7 performs operations of forming a resist film by coating a resist on the surface of a wafer W and forming a resist pattern by developing the resist film after exposure. The coating and developing apparatus 7 is configured to connect a carrier module B1, an inspection module B2, a multipurpose module B3, a processing module B4, and an interface module B5 in a straight line in the lateral direction. These modules B1 to B5 each have a housing and are partitioned from each other. A reference numeral B6 in the drawing is an exposure apparatus connected to the interface module B5.

[0090] A wafer W placed in a carrier C of a placement table 71 of the carrier module B1 is transferred between the carrier C and the inspection module B2 by a transfer mechanism 73. A reference numeral 72 in the drawing is an opening and closing section that opens and closes a partition wall of the carrier module B1 and a lid of the carrier C. The inspection module B2 includes an inspection assembly 74 that inspects the wafer W after formation of a resist pattern and a transfer assembly TRS that transfers the wafer W between the multipurpose module B3 and the processing module B4.

[0091] The multi-purpose module B3 includes a plurality of transfer assemblies TRS for transferring the wafer W between the respective unit modules E1 to E6 constituting the processing module B4 and the inspection module B2. The plurality of transfer assemblies TRS are stacked one on another to constitute a tower T1. In addition, a conveyance mechanism 70 is provided so as to be able to ascend and descend with respect to the respective assemblies constituting the tower T1 in order to transfer the wafer W.

[0092] The processing module B4 is configured by stacking the unit modules E1 to E6 which perform liquid processing on the wafer W from the bottom in this order, and the conveyance and processing of the wafer W are performed in parallel with one another in the unit modules E1 to E6. The unit modules E1 to E3 are configured identically to one another. In Figure 18 The unit module E1 is shown in FIG. 6, and will be described as a representative. The unit module E1 is provided with a conveyance area 76 which extends from the multi-purpose module B3 side toward the interface module B5 side. The conveyance mechanism Fl which conveys the wafer W with respect to the respective assemblies constituting the tower T1 described above and the respective assemblies constituting the processing module B4 is provided in the conveyance area 76. When viewed in the length direction of the conveyance area 76, a heating assembly 79 is provided on one side of the left and right, and a setting area 77, 78 of the resist coating device 1 is provided on the other side of the left and right. Note that the left and right described herein do not necessarily coincide with the left and right used in the description of the foreign matter detection unit 2.

[0093] The setting areas 77, 78 are arranged along the length direction of the conveyance area 76. Further, the two cups 23, the two spin chuck 21, the arm 24 which supports the nozzles 11A to 11L, the moving mechanism 25, and the housing 31 constituting the foreign matter detection unit 2 are provided in the setting areas 77, 78, respectively. That is, a plurality of sets of the substrate placement portion and the nozzles are provided in the unit module E1. The cups 23 described above are arranged in a row along the length direction of the conveyance area 76. In addition, when viewed from the row of the cups 23, the housing 31 is provided on the side opposite to the conveyance area 76. Further, with respect to the processing liquid supply pipes 12A to 12L and the processing liquid supply portions 13A to 13L connected to the nozzles 11A to 11L, the pipes and the portions are routed from the setting areas 77, 78 toward the multi-purpose module B3, and are connected to the pump constituting the processing liquid supply portion 13 provided in the multi-purpose module B3.

[0094] The unit modules E4 to E6 are configured identically to the unit modules E1 to E3 except that a developer assembly which supplies a developer to the setting areas 77, 78 to perform development is provided. Figure 19 In FIG. 6, the conveyance mechanisms in the unit modules E2 to E6 which correspond to the conveyance mechanism Fl of the unit module E1 are denoted as conveyance mechanisms F2 to F6.

[0095] Interface module B5 includes towers T2, T3, and T4, which extend vertically across unit modules E1 to B6. Tower T2 includes transfer assemblies TRS located at heights corresponding to each unit module E1 to E6. The aforementioned conveyor mechanisms F1 to F6 transport wafers W to the transfer assemblies TRS at the corresponding heights. Interface module B5 also includes a freely elevating conveyor mechanism 81 for transferring wafers W between towers T2 and T3, a freely elevating conveyor mechanism 82 for transferring wafers W between towers T2 and T4, and a conveyor mechanism 83 for transferring wafers W between tower T2 and exposure unit B6. Components located in towers T2 and T3 are omitted for clarity.

[0096] The transport path of wafers W in the coating and developing apparatus 7 will be described. The wafers W are transported from the carrier C to the transfer module TRS in the inspection module B2 by the transport mechanism 73. Then, the wafers W are transported to the transfer module TRS0 in the tower T1 of the multi-purpose module B3 by the transport mechanism 75. From this point on, the wafers W are distributed and transported to the unit modules E1, E2, and E3 by the transport mechanism 70.

[0097] The allocated wafer W is transported to the cup 23 of the resist coating device 1 of each unit module E1 to E3 via the transfer modules TRS1 to TRS3, and receives pre-wetting and resist coating processes. Figure 9 Next, after the wafer W is transported to the heating assembly 79 and heated, it is transported to the transfer assemblies TRS11, TRS21, and TRS31 of the tower T2 and then transported to the exposure unit B6 via the towers T2 and T3 by the transport mechanisms 81 and 83 to expose the resist film.

[0098] The exposed wafer W is transported between towers T2 and T4 using conveying mechanisms 83 and 82, and is respectively transported to the transfer components TRS41, TRS51, and TRS61 of tower T1 corresponding to unit modules E4 to E6. The wafer W is then transported to the heating component 79 and subjected to post-exposure heating treatment (post-exposure baking). Next, the wafer W is transported to the developing component and a developer is supplied to the wafer W to form a resist pattern. The wafer W is then transported to the inspection component 74 of the inspection module B2 with the help of the transfer components TRS4 to TRS6 of tower T1 and the conveying mechanism 75, and after being inspected, it is returned to the carrier C with the help of the conveying mechanism 73.

[0099] In the coating and developing apparatus 7 described above, the housing 31 is provided in the vicinity of the cup 23. More specifically, the foreign matter detection unit 2 is provided in the same unit module E as the unit module E in which the cup 23 is provided. According to such a configuration, the length of the flow path from the flow path forming portion 14A to 14L to the nozzle 11A to 11L can be relatively shortened. If it is considered that foreign matter can be generated from the processing liquid supply pipe 12A to 12L, the length of the flow path is made short, thereby suppressing the difference in the amount of foreign matter between the flow path forming portion 14A to 14L and the nozzle 11A to 11L. Thus, the purity of the processing liquid supplied to the wafer W can be monitored with high accuracy.

[0100] However, the housings 31 are not limited to being provided in the vicinity of the cup 23 of the unit module El to E3, but can be provided in the inspection module B2 and the multipurpose module B3 which are located more distantly from the cup 23. Figure 18 The reference numerals 85 and 86 in FIG. 8 indicate one example of a housing arrangement region in the inspection module B2 and the multipurpose module B3, and a plurality of housings 31 can be arranged in the housing arrangement region 85 or the housing arrangement region 86, for example. That is, the foreign matter detection unit 2 can be provided in a module which is divided from the carrier module Bl and the processing module B4, and the processing liquid can be supplied from the flow path forming portion 14 of the foreign matter detection unit 2 thus configured to the nozzle 11A to 11L of each unit module El to E3. In order to suppress the occupied space, the housings 31 provided in the housing arrangement regions 85 and 86 are stacked with each other, for example.

[0101] In addition, in the example described above, the detection of foreign matter from all of the processing liquid sprayed from the nozzles 11A to 11L is described, but the detection of foreign matter from all of the processing liquid is not limited thereto, and the detection can be performed only on the processing liquid for which high purity is required. Figure 20 A configuration example in which the detection of foreign matter is performed only on the flow path forming portion 14A connected to the nozzle 11A of each resist coating apparatus 1 provided in the arrangement regions 77 and 78 of the unit modules El to E3 is shown. In this Figure 20 The housing 31 shown is provided in the housing arrangement region 85 or the housing arrangement region 86 described above, for example. Also, in the housing 31, instead of housing the flow path forming portions 14A to 14L, the flow path forming portions 14A corresponding to the nozzles 11A provided in each arrangement region 77 and 78 are housed. That is, in the Figure 20 In the example shown, a configuration in which one foreign matter detection unit 2 is shared by six resist coating apparatuses 1 is made. By making such a configuration, reduction of the manufacturing cost and the running cost of the coating and developing apparatus 7 can be sought. In addition, in a case where the foreign matter detection units 2 are shared among a plurality of resist coating apparatuses 1 as such, processing is sometimes performed simultaneously or uninterruptedly among the foreign matter detection units 2, and thus, a configuration in which Figure 16 The configuration in which a plurality of measurement groups are provided is effective.

[0102] Further, the processing liquid that becomes the detection target of the foreign matter is not limited to the resist, the thinner, and can be, for example, a developing solution, a cleaning liquid for cleaning the wafer W, a chemical solution for forming an antireflection film, a chemical solution for forming an insulating film, an adhesive for sticking the wafer W, and the like. Thus, as the substrate processing apparatus, the resist coating apparatus 1 is not limited, and a developing apparatus, a cleaning apparatus, and the like can also be used.

[0103] Further, regarding the processing liquid supply pipes 12A to 12K described above, a structure is provided in which, for example, the resist and the cleaning liquid are supplied alternately from the upstream side, and the thinner is sprayed from the nozzle 11 to a portion other than the wafer W. The thinner is the cleaning liquid of the processing liquid supply pipes 12A to 12K, and regarding the cleaning liquid, the same as the resist, the detection of the foreign matter can also be performed during the circulation of the processing liquid supply pipes 12A to 12K. In the case where the detection of the foreign matter is performed on the cleaning liquid in this way, the cleaning can be ended at an appropriate timing based on the detection result, and the waste of the processing liquid used for the cleaning can be prevented. Regarding the cleaning of the processing liquid supply pipes 12A to 12K, the detection of the foreign matter in the resist can also be performed automatically based on the detection result. In this way, the present disclosure can be applied to a case where the foreign matter in a liquid flowing in a flow path through which the processing liquid circulates is detected, and is not limited to the detection of the foreign matter contained in the processing liquid supplied to the wafer W.

[0104] Further, for example, in a developing apparatus, in order to dry the wafer W after development, a gas nozzle that supplies a nonreactive gas to the wafer W can also be provided. Further, the flow path connected to the upstream side of the gas nozzle can also be subjected to the detection of the foreign matter described above. That is, as the fluid in which the detection of the foreign matter is performed using the present technology, the liquid is not limited, and a gas can also be used.

[0105] Further, it should be considered that the embodiments disclosed this time are illustrative in all respects, and are not restrictive. The embodiments described above can be omitted, replaced, changed, and the like in various ways without departing from the scope of the appended claims and the spirit thereof.

Claims

1. A substrate processing apparatus, comprising: a supply path through which a fluid supplied to the substrate flows; and A foreign matter detection unit capable of detecting foreign matter in the fluid based on a signal obtained by a light receiving portion receiving side scattered light emitted from a foreign matter detection area, wherein the foreign matter detection area is formed by a light projecting portion directing light toward a flow path forming portion constituting a portion of the supply path into a flow path in the flow path forming portion. The substrate processing apparatus is characterized in that: The substrate processing apparatus further comprises: a housing for accommodating the flow path forming portion, the light projecting portion, and the light receiving portion; and an inlet and an outlet for the fluid provided on a front end surface of the flow path forming portion in a manner connected to a pipe for supplying the fluid from the outside of the housing to the flow path forming portion and another pipe for discharging the fluid from the flow path forming portion to the outside of the housing, respectively. The light projecting unit and the light receiving unit are provided in a direction different from a direction in which the inlet and the outlet are provided, with reference to the flow path forming portion.

2. The substrate processing apparatus according to claim 1, wherein: The flow path of the fluid in the flow path forming portion has a portion in which the downstream side is narrower and / or has a greater curvature than the upstream side in the liquid flow direction.

3. The substrate processing apparatus according to claim 1, wherein: The light axis from the light projecting portion is incident on the flow path in the flow path forming portion perpendicularly to the flow path, and the light forming direction passes through only one region in the flow path in the liquid flow direction.

4. The substrate processing apparatus according to claim 3, wherein: The flow path forming portion includes a first flow path including the inlet, a third flow path located in a vertical position relative to the upstream flow path and including the outlet, and a second flow path located between the first flow path and the third flow path along the flow direction of the fluid. The optical axis from the light projecting unit passes through one of the first flow path and the third flow path, and does not pass through the other.

5. The substrate processing apparatus according to claim 4, wherein: The foreign matter detection unit has: a plurality of the flow path forming portions arranged in a row in the left-right direction at intervals; and a moving mechanism that moves the light projecting unit and the light receiving unit to positions corresponding to the selected flow path forming units so that the light projecting unit and the light receiving unit are shared by the respective flow path forming units; The light receiving portion at a position for receiving the side scattered light faces the one pipe and the other pipe across the flow path forming portion in the front-rear direction.

6. The substrate processing apparatus according to claim 4, wherein: A foreign matter detection area through which the optical axis passes is formed in one of the first and third flow paths, and a first convex portion is formed in the one flow path, which protrudes rearward from a connection position with the second flow path and forms a convex lens shape. The light receiving unit receives the side scattered light from the foreign matter detection area toward the rear. A second convex portion having a convex lens shape is provided on the outer side surface of the flow path forming portion and on the rear side of the convex portion.

7. The substrate processing apparatus according to any one of claims 4 to 6, wherein: The width of the flow path in the flow path forming portion becomes narrower toward the downstream side in the liquid circulation direction.

8. A substrate processing method, the substrate processing method using a substrate processing apparatus, the substrate processing apparatus comprising: a supply path through which a fluid supplied to the substrate flows; and A foreign matter detection unit, wherein a light projecting portion projects light toward a flow path forming portion that partially constitutes the supply path, and as a result, light is emitted from the flow path forming portion. The foreign matter detection unit is capable of detecting foreign matter in the fluid based on a signal obtained by a light receiving portion receiving side scattered light emitted from the flow path forming portion. The substrate processing method is characterized by comprising the following steps: The flow path forming portion supplies the fluid from the outside of the housing accommodating the light projecting portion and the light receiving portion to the flow path forming portion via a pipe connected to the fluid inlet provided at the front end surface of the flow path forming portion; and The fluid is discharged to the outside of the housing by another pipe connected to the fluid outlet provided on the front end surface of the flow path forming portion, The light projecting unit and the light receiving unit are provided in a direction different from a direction in which the inlet and the outlet are provided, with reference to the flow path forming portion.

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