Wafer etching assist device
By setting electrodes and adjustment mechanisms in the wafer etching auxiliary device, and using cooling gas to uniformly dissipate heat from the bottom of the wafer, the problem of uneven wafer temperature is solved, thereby improving etching quality and production efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SUZHOU WINMAX TECH CORP
- Filing Date
- 2025-07-08
- Publication Date
- 2026-05-12
AI Technical Summary
Existing wafer etching auxiliary equipment has poor heat dissipation in the contact area between the wafer and the equipment, resulting in uneven temperature and affecting etching quality and stability.
A wafer etching auxiliary device is used, which sets multiple electrodes and adjustment mechanisms at the bottom of the wafer, uses cooling gas to uniformly dissipate heat from the electrodes and the wafer, controls the gas pressure and uses an electromagnet to attract iron sheets to move a fan-shaped plate to form a cooling gas flow groove, thus ensuring the temperature uniformity at the bottom of the wafer.
It improves the uniformity and precision of wafer etching, reduces changes in electrode material properties, and enhances the stability and production efficiency of the etching process.
Smart Images
Figure CN120809619B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of wafer etching technology, and more particularly to a wafer etching auxiliary device. Background Technology
[0002] Wafer etching refers to the selective removal of unwanted material from the surface of a wafer using chemical or physical methods to form specific patterns and structures on the wafer. During the etching process, etchants are usually used, which react chemically with specific materials on the wafer surface, or physical methods, such as ion bombardment, are used to remove unwanted parts. During wafer etching, auxiliary devices are needed to help optimize the etching process and improve the accuracy, efficiency and quality of the etching.
[0003] In dry etching, wafer temperature control is crucial for achieving ideal etching results. Existing wafer etching aids typically spray cooling gas from the bottom of the wafer during the adsorption and fixation process to reduce the heat generated on the wafer surface by plasma bombardment during dry etching. However, the gas ejection path on the upper surface of existing equipment is fixed, resulting in poor heat dissipation in the area where the wafer contacts the equipment. This can easily lead to uneven temperature distribution across different areas of the wafer, thereby reducing the etching quality. Summary of the Invention
[0004] This application proposes a wafer etching auxiliary device that has the advantages of uniform heat dissipation at the bottom of the wafer and heat dissipation at the electrodes. This device solves the problem that the heat dissipation effect in the area where the wafer contacts the device is poor, which easily leads to uneven temperature in different areas of the wafer and thus reduces the etching quality of the wafer.
[0005] To achieve the above objectives, this application adopts the following technical solution: a wafer etching auxiliary device, comprising a housing, an interface fixedly connected to the bottom of the housing, a controller fixedly installed inside the housing, a control valve fixedly installed inside the controller, a base fixedly connected to the upper surface of the housing, a clamping plate fixedly connected to the upper surface of the base, a plurality of electrodes fixedly installed on the lower surface of the clamping plate, electrical connectors fixedly connected to both ends of the electrodes, a top cover fixedly connected to the upper surface of the clamping plate, and a notched ring fixedly connected to the middle of the top cover;
[0006] Multiple adjustment mechanisms are provided on the upper surface of the top cover;
[0007] A fixed ring is fixedly connected to the middle of the card plate. A spring is fixedly connected to the upper surface of the fixed ring. A movable plate is fixedly connected to the upper end of the spring. A sealing ring is fixedly connected to the upper surface of the movable plate. An air outlet sleeve is provided in the middle of the sealing ring and is fixedly connected to the fixed ring.
[0008] Preferably, the base includes a seat body, the upper surface of which has multiple air chambers, and an air outlet is provided between two adjacent air chambers. A one-way valve is fixedly installed inside the air outlet. The above structure enables the control valve to open during the wafer adsorption process, allowing cooling gas to first enter the middle of the controller, seat body, and card plate, and then enter the air chamber, thereby dissipating heat from the electrode. When the gas pressure inside the air chamber is high enough, the one-way valve will open, thereby expelling the gas containing electrode heat from the electrode through the air outlet, helping to maintain the electrode's working temperature within a relatively stable range.
[0009] Preferably, the adjustment mechanism includes two elastic blocks, with a sector plate fixedly connected to the upper part of the two elastic blocks. A rectangular groove is formed in the middle of the lower surface of the sector plate, and an electromagnet is fixedly installed inside the rectangular groove. A slider is fixedly connected to the inner end of the sector plate, and a baffle is fixedly connected to the inner side of the slider. An iron plate is provided below the electromagnet. When the above structure is working, the electromagnet is energized, causing it to attract the iron plate directly below, thereby driving the sector plate to move downward and forming a groove for cooling gas to pass through. The sector plate also drives the baffle to move downward through the slider, causing the moving plate to drive the sealing ring to slide downward, so that the gas inside the gas outlet sleeve can be discharged and enter the groove, while the cooling gas will flow outward along the groove until it is discharged, thereby dissipating heat to the bottom of the wafer.
[0010] Preferably, the plurality of electrodes are arranged circumferentially at equal intervals, with a gap between the electrodes and the bottom of the air chamber, and the electrical connector passes through the base and is electrically connected to the controller.
[0011] Preferably, the lower surface of the card plate is adapted to the electrode, and the card plate is fixedly connected to the fixing ring.
[0012] Preferably, the sealing ring and the vent sleeve are slidably sleeved together, and the upper surface of the moving plate abuts against multiple baffles. In operation, the baffles push the moving plate downward, and the moving plate drives the sealing ring downward and compresses the spring, so that the gas inside the vent sleeve can be discharged from the through hole at the top. When the moving plate is not pushed by the baffles, the spring pushes it back upward, and the sealing ring seals the vent sleeve, so that the gas inside will no longer be discharged.
[0013] Preferably, the elastic block is fixedly connected to the top cover, the sector plate is slidably connected to the top cover, the slider is slidably connected to the notch ring, and the iron sheet is fixedly connected to the upper surface of the top cover. The above structure enables multiple elastic blocks to support the wafer together during operation. When the electromagnet is energized, it attracts the iron sheet directly below, causing the single sector plate to move downward. The elastic block below will deform. When the electromagnet is de-energized, the elastic block will return to its original state, thereby pushing the sector plate to reset.
[0014] Preferably, two adjacent sector plates are slidably connected, and the plurality of sector plates are arranged circumferentially at equal intervals.
[0015] Preferably, the depth of the notch on the upper surface of the notch ring is greater than the thickness of the slider, and the thickness of the baffle is greater than the depth of the notch in the notch ring. This structure allows the slider and baffle to move downwards along with the fan-shaped plate during operation, so that the gas inside the outlet sleeve can flow out while also forming a groove to guide the gas out. When the fan-shaped plate does not move downwards in its initial position, the slider and baffle will block the notch on the upper surface of the notch ring to prevent the cooling gas from flowing out.
[0016] Preferably, the sector plates, top cover, and clamping plate are all made of dielectric material. The above structure enables the wafer to be placed on the upper surface of multiple sector plates during operation, and the wafer to be located at the center of multiple sector plates. Subsequently, the controller applies voltage to multiple electrodes to generate an electric field between the clamping plate, top cover, sector plates and wafer. This electric field causes polarization charges to be generated on the surface of the sector plates. After the wafer (workpiece) is placed on the sector plates, its back side forms a charge with the opposite polarity to the polarization charge due to electrostatic induction. The opposite charges attract each other, making the wafer stick tightly to the surface of the sector plates.
[0017] The beneficial effects of this invention are as follows:
[0018] 1. This invention uses an electromagnet energized to attract an iron sheet directly below it, thereby moving a sector plate downwards to form a groove for cooling gas to pass through. The sector plate also moves a baffle downwards via a slider, causing the moving plate to slide the sealing ring downwards. This allows the gas inside the exhaust sleeve to be discharged and enter the groove, while the cooling gas flows outwards along the groove until it is discharged. This cooling gas dissipates heat from the bottom of the wafer, thus solving the problem of poor heat dissipation in the area where the wafer contacts the equipment in existing equipment, which easily leads to uneven temperature in different areas of the wafer and thus reduces the etching quality of the wafer.
[0019] 2. In this invention, during the wafer adsorption process, the control valve is opened, and cooling gas first enters the middle of the controller, base, and card plate, and then enters the interior of the gas chamber, thereby dissipating heat from the electrode. When the gas pressure inside the gas chamber is high enough, the one-way valve will open, thereby expelling the gas containing electrode heat from the electrode through the outlet. This helps maintain the electrode's operating temperature within a relatively stable range, reducing changes or deformation of the electrode material properties caused by temperature variations, and thus improving the stability of the wafer during adsorption. Attached Figure Description
[0020] The accompanying drawings, which form part of this specification, illustrate embodiments disclosed in this application and, together with the specification, serve to explain the principles of this application in a clear and understandable manner.
[0021] This disclosure will become clearer with reference to the accompanying drawings and the following detailed description, wherein:
[0022] Figure 1 This is a schematic diagram of the external structure of the present invention;
[0023] Figure 2 This is a half-sectional schematic diagram of the casing of the present invention;
[0024] Figure 3 for Figure 2 Enlarged view of the center;
[0025] Figure 4 This is a half-sectional schematic diagram of the fixing ring of the present invention;
[0026] Figure 5 This is a half-sectional schematic diagram of the card plate of the present invention;
[0027] Figure 6 This is a schematic diagram of the air cavity structure of the present invention;
[0028] Figure 7 This is a schematic diagram of the rectangular groove structure of the present invention.
[0029] The components are as follows: 1. Housing; 2. Interface; 3. Controller; 4. Control valve; 5. Base; 51. Seat; 52. Air chamber; 53. Air outlet; 54. One-way valve; 6. Clamping plate; 7. Electrode; 8. Electrical connector; 9. Top cover; 10. Notched ring; 11. Adjustment mechanism; 111. Elastic block; 112. Sector plate; 113. Rectangular groove; 114. Electromagnet; 115. Slider; 116. Baffle; 117. Iron sheet; 12. Fixing ring; 13. Spring; 14. Moving plate; 15. Sealing ring; 16. Air outlet sleeve. Detailed Implementation
[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0031] Please see Figure 1-7This invention discloses a wafer etching auxiliary device, including a housing 1, an interface 2 fixedly connected to the bottom of the housing 1, a controller 3 fixedly installed inside the housing 1, a control valve 4 fixedly installed inside the controller 3, a base 5 fixedly connected to the upper surface of the housing 1, a clamping plate 6 fixedly connected to the upper surface of the base 5, a plurality of electrodes 7 fixedly installed on the lower surface of the clamping plate 6, electrical connectors 8 fixedly connected to both ends of the electrodes 7, a top cover 9 fixedly connected to the upper surface of the clamping plate 6, and a notched ring 10 fixedly connected to the middle of the top cover 9;
[0032] Multiple adjustment mechanisms 11 are provided on the upper surface of the top cover 9;
[0033] A fixed ring 12 is fixedly connected to the middle of the card plate 6. A spring 13 is fixedly connected to the upper surface of the fixed ring 12. A movable plate 14 is fixedly connected to the upper end of the spring 13. A sealing ring 15 is fixedly connected to the upper surface of the movable plate 14. An air outlet sleeve 16 is provided in the middle of the sealing ring 15 and is fixedly connected to the fixed ring 12.
[0034] The base 5 includes a seat body 51. Multiple air chambers 52 are provided on the upper surface of the seat body 51. An air outlet 53 is provided between two adjacent air chambers 52. A one-way valve 54 is fixedly installed inside the air outlet 53.
[0035] Its function is to control the opening of valve 4 during the wafer adsorption process, allowing cooling gas to first enter the controller 3, the base 51, and the middle of the card plate 6, and then enter the interior of the gas chamber 52, thereby dissipating heat from the electrode 7. When the gas pressure inside the gas chamber 52 is high enough, it will open the one-way valve 54, thereby discharging the gas containing the heat of the electrode 7 from the outlet 53, helping to maintain the working temperature of the electrode within a relatively stable range, reducing changes or deformation of the electrode material properties caused by temperature changes, and thus improving the stability of the wafer during adsorption.
[0036] The adjustment mechanism 11 includes two elastic blocks 111. A sector plate 112 is fixedly connected to the upper part of the two elastic blocks 111. A rectangular groove 113 is opened in the middle of the lower surface of the sector plate 112. An electromagnet 114 is fixedly installed inside the rectangular groove 113. A slider 115 is fixedly connected to the inner end of the sector plate 112. A baffle 116 is fixedly connected to the inner side of the slider 115. An iron sheet 117 is provided below the electromagnet 114.
[0037] Its function is to use an electromagnet 114 to be energized, causing it to attract the iron plate 117 directly below, thereby moving the fan-shaped plate 112 downward to form a groove for cooling gas to pass through. The fan-shaped plate 112 also moves the baffle 116 downward via the slider 115, causing the moving plate 14 to slide the sealing ring 15 downward, so that the gas inside the exhaust sleeve 16 can be discharged and enter the groove. The cooled gas will flow outward along the groove until it is discharged, thereby dissipating heat to the bottom of the wafer. This maximizes the heat dissipation of the bottom of the wafer. By periodically repeating the above operation, the temperature distribution on the entire wafer surface can be made more uniform, thereby improving the uniformity and accuracy of etching, and accelerating the heat removal speed during the etching process. This allows the wafer to be maintained within a relatively ideal processing temperature range, and also helps to maintain the stability of the etching process, increase the processing rate, and thus improve the overall production efficiency.
[0038] Multiple electrodes 7 are arranged equidistantly around the circumference, with a gap between the electrodes 7 and the bottom of the air chamber 52, and the electrical connector 8 passes through the base 51 and is electrically connected to the controller 3.
[0039] The lower surface of the card plate 6 is adapted to the electrode 7, and the card plate 6 is fixedly connected to the fixing ring 12.
[0040] The sealing ring 15 is slidably sleeved with the vent sleeve 16. The upper surface of the moving plate 14 abuts against multiple baffles 116. The function of the baffles 116 is to push the moving plate 14 downward, and the moving plate 14 will drive the sealing ring 15 downward and squeeze the spring 13, so that the gas inside the vent sleeve 16 can be discharged from the top through hole. When the moving plate 14 is not pushed by the baffles 116, the spring 13 will push it to return to its original position, and the sealing ring 15 will seal the vent sleeve 16, and the gas inside will no longer be discharged.
[0041] Among them, the elastic block 111 is fixedly connected to the top cover 9, the sector plate 112 is slidably connected to the top cover 9, the slider 115 is slidably connected to the notch ring 10, and the iron sheet 117 is fixedly connected to the upper surface of the top cover 9. Its function is that multiple elastic blocks 111 together support the wafer, and when the electromagnet 114 is energized, it attracts the iron sheet 117 directly below, so that when a single sector plate 112 moves downward, the elastic block 111 below will deform. When the electromagnet 114 is de-energized, the elastic block 111 will return to its original state, thereby pushing the sector plate 112 to reset.
[0042] Among them, two adjacent sector plates 112 are slidably connected, and multiple sector plates 112 are arranged equidistantly around their circumference.
[0043] The depth of the notch on the upper surface of the notch ring 10 is greater than the thickness of the slider 115, and the thickness of the baffle 116 is greater than the depth of the notch in the notch ring 10. Their function is that when the sector plate 112 moves downward, the slider 115 and the baffle 116 will move downward as well, so that the gas inside the exhaust sleeve 16 flows out and a groove is formed to guide the gas out. When the sector plate 112 does not move downward in the initial position, the slider 115 and the baffle 116 will block the notch on the upper surface of the notch ring 10 to prevent the cooling gas from flowing out.
[0044] Among them, the sector plate 112, top cover 9, and clamping plate 6 are all made of dielectric material. Their function is to place the wafer on the upper surface of multiple sector plates 112 and place the wafer at the center of multiple sector plates 112. Then, the controller 3 applies voltage to multiple electrodes 7 to generate an electric field between the clamping plate 6, top cover 9, sector plate 112 and wafer. This electric field causes polarization charge to be generated on the surface of sector plate 112. After the wafer (workpiece) is placed on sector plate 112, its back side forms a charge with the opposite polarity to the polarization charge due to electrostatic induction. The opposite charges attract each other, making the wafer stick tightly to the surface of sector plate 112.
[0045] Working principle:
[0046] The existing gas supply device is connected to interface 2 and continuously supplies gas;
[0047] The wafer is placed on the upper surface of multiple sector plates 112 and positioned at the center of the multiple sector plates 112. Then, the controller 3 applies voltage to multiple electrodes 7 to generate an electric field between the card plate 6, the top cover 9, the sector plates 112 and the wafer. This electric field causes polarization charges to be generated on the surface of the sector plates 112. After the wafer (workpiece) is placed on the sector plates 112, its back side forms a charge with the opposite polarity to the polarization charge due to electrostatic induction. The opposite charges attract each other, causing the wafer to adhere tightly to the surface of the sector plates 112. Then, the upper surface of the wafer is etched using existing equipment.
[0048] During the wafer adsorption process, control valve 4 is opened, and cooling gas first enters the middle of controller 3, base 51, and card plate 6, and then enters the interior of gas chamber 52 to dissipate heat from electrode 7. When the gas pressure inside gas chamber 52 is high enough, one-way valve 54 will open, thereby discharging the gas inside electrode 7 containing the heat of electrode 7 from the outlet 53. This helps maintain the working temperature of the electrode within a relatively stable range, reducing changes or deformation of electrode material properties caused by temperature changes, thereby improving the stability of the wafer when it is adsorbed.
[0049] When etching the wafer, one or more electromagnets 114 arranged equidistantly around the circumference are energized, causing them to attract the iron sheet 117 directly below. This causes the fan-shaped plate 112 to move downward. During this process, the fan-shaped plate 112 will squeeze the elastic block 111, causing it to deform. The fan-shaped plate 112 will also not contact the wafer above, i.e., it will not have an attraction effect on the wafer. The fan-shaped plate 112 will also drive the slider 115 to move downward, and the slider 115 will drive the baffle 116 to move downward. The baffle 116 will push the moving plate 14 to slide downward. The moving plate 14 will drive the sealing ring 15 to slide downward and squeeze the spring 13, so that the gas inside the vent sleeve 16 can be discharged from the top through hole. The downward moving fan-shaped plate 112 and slider 115 will form a groove at the bottom of the wafer, and the cooled gas will flow outward along the groove until it is discharged. During this process, the cooled gas will dissipate heat to the bottom of the wafer.
[0050] By moving the fan-shaped plate 112 at the bottom of the wafer downwards in a certain order to form a groove, heat dissipation at the bottom of the wafer is maximized. By periodically repeating the above operation, the temperature distribution on the entire wafer surface can be made more uniform, thereby improving the uniformity and accuracy of etching, and accelerating the heat removal rate during the etching process. This allows the wafer to be maintained within a relatively ideal processing temperature range, and also helps to maintain the stability of the etching process, increase the processing rate, and thus improve the overall production efficiency.
[0051] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.
Claims
1. A wafer etching auxiliary device, comprising a housing (1), an interface (2) fixedly connected to the bottom of the housing (1), a controller (3) fixedly installed inside the housing (1), and a control valve (4) fixedly installed inside the controller (3), characterized in that, A base (5) is fixedly connected to the upper surface of the housing (1), a clamping plate (6) is fixedly connected to the upper surface of the base (5), a plurality of electrodes (7) are fixedly installed on the lower surface of the clamping plate (6), electrical connectors (8) are fixedly connected to both ends of the electrodes (7), a top cover (9) is fixedly connected to the upper surface of the clamping plate (6), and a notched ring (10) is fixedly connected to the middle of the top cover (9). Multiple adjustment mechanisms (11) are provided on the upper surface of the top cover (9); A fixed ring (12) is fixedly connected to the middle of the card plate (6). A spring (13) is fixedly connected to the upper surface of the fixed ring (12). A moving plate (14) is fixedly connected to the upper end of the spring (13). A sealing ring (15) is fixedly connected to the upper surface of the moving plate (14). An air outlet sleeve (16) fixedly connected to the fixed ring (12) is provided in the middle of the sealing ring (15). The base (5) includes a seat body (51), and a plurality of air chambers (52) are provided on the upper surface of the seat body (51). An air outlet (53) is provided between two adjacent air chambers (52), and a one-way valve (54) is fixedly installed inside the air outlet (53). The adjustment mechanism (11) includes two elastic blocks (111), and a sector plate (112) is fixedly connected to the upper part of the two elastic blocks (111). A rectangular groove (113) is opened in the middle of the lower surface of the sector plate (112). An electromagnet (114) is fixedly installed inside the rectangular groove (113). A slider (115) is fixedly connected to the inner end of the sector plate (112). A baffle (116) is fixedly connected to the inner side of the slider (115). An iron sheet (117) is provided below the electromagnet (114).
2. The wafer etching auxiliary device according to claim 1, characterized in that, Multiple electrodes (7) are arranged circumferentially at equal intervals, with a gap between the electrodes (7) and the bottom of the air cavity (52), and the electrical connector (8) passes through the base (51) and is electrically connected to the controller (3).
3. The wafer etching auxiliary device according to claim 2, characterized in that, The lower surface of the card plate (6) is adapted to the electrode (7), and the card plate (6) is fixedly connected to the fixing ring (12).
4. The wafer etching auxiliary device according to claim 3, characterized in that, The sealing ring (15) is slidably sleeved with the air outlet sleeve (16), and the upper surface of the moving plate (14) abuts against multiple baffles (116).
5. The wafer etching auxiliary device according to claim 4, characterized in that, The elastic block (111) is fixedly connected to the top cover (9), the fan-shaped plate (112) is slidably connected to the top cover (9), the slider (115) is slidably connected to the notch ring (10), and the iron sheet (117) is fixedly connected to the upper surface of the top cover (9).
6. The wafer etching auxiliary device according to claim 5, characterized in that, Two adjacent sector plates (112) are slidably connected, and a plurality of the sector plates (112) are circumferentially equidistant.
7. The wafer etching auxiliary device according to claim 6, characterized in that, The depth of the notch on the upper surface of the notched ring (10) is greater than the thickness of the slider (115), and the thickness of the baffle (116) is greater than the depth of the notch in the notched ring (10).
8. The wafer etching auxiliary device according to claim 7, characterized in that, The sector plate (112), top cover (9), and card plate (6) are all made of dielectric material.