A carrier rack, semiconductor substrate cleaning and drying assembly, processing apparatus, and drying method

Abstract

The present application relates to the technical field of semiconductor wet processing equipment, in particular to a carrier support, a semiconductor substrate cleaning and drying assembly, a processing equipment and a drying method. The carrier support provided by the present application comprises a supporting plate arranged in a supporting frame and used for supporting a carrier and a support plate movably arranged on the supporting plate; a plurality of support portions used for supporting semiconductor substrates in the carrier are arranged on the support plate, the support portions have contact structures, and the contact structures extend along the arrangement direction of the semiconductor substrates in the carrier to make the contact structures point contact or line contact with the semiconductor substrates in the carrier; and the supporting plate and the supporting plate are configured to trigger the relative movement between the supporting plate and the supporting plate to lift the semiconductor substrates in the carrier in response to the contact with the bottom of the drying container during the lowering of the carrier support. The support plate is movably arranged on the supporting plate, and the two are integrated into an integrated type, which is convenient to install and adjust.

Description

Technical Field

[0001] This invention relates to the field of semiconductor wet process equipment technology, and in particular to a carrier support, a semiconductor substrate cleaning and drying assembly, processing equipment and drying method. Background Technology

[0002] Marangoni dryers are wafer cleaning equipment used for wafer cleaning and drying. They utilize the Marangoni effect, which refers to the flow phenomenon caused by the difference in surface tension of liquids. Through this effect, moisture or solvents on the wafer surface can be effectively removed, thereby achieving a drying effect without watermarks or pollution.

[0003] In existing technologies, wafer supports typically hold wafers using structures such as Y-grooves. However, this design results in a large contact area between the wafer and the support. Due to this large clamping area, the portion of the wafer in contact with the support cannot be fully exposed to the cleaning solution and drying airflow, leading to ineffective cleaning and drying in these areas. This not only affects the overall cleanliness of the wafer, making it prone to leaving watermarks or chemical residues on the surface, but also impacts wafer quality and the yield of subsequent processes. Summary of the Invention

[0004] The purpose of this invention is to provide a carrier support, a semiconductor substrate cleaning and drying assembly, a processing device, and a drying method to solve the technical problem that the clamped area of ​​the wafer cannot be effectively cleaned during the cleaning process in the prior art.

[0005] In a first aspect, the present invention provides a carrier support for a semiconductor substrate cleaning and drying assembly, the semiconductor substrate cleaning and drying assembly including a drying container and a lifting mechanism for lifting a carrier into the drying container, the lifting mechanism including a support frame, and the carrier support including: a tray disposed in the support frame for supporting the carrier and a support plate movably disposed on the tray;

[0006] The support plate is provided with a plurality of support portions for supporting semiconductor substrates inside the carrier. The support portions have contact structures, and the contact structures extend along the arrangement direction of the semiconductor substrates inside the carrier so that the contact structures make point contact or line contact with the semiconductor substrates inside the carrier.

[0007] The tray and the support plate are configured to trigger relative movement between the tray and the support plate in response to contact with the bottom of the drying container during the descent of the carrier support, thereby lifting the semiconductor substrate inside the carrier.

[0008] In an optional embodiment, the pallet is connected to a plurality of support elements for supporting the vehicle, and the support elements cause the vehicle to tilt.

[0009] In an optional embodiment, the support plate is capable of forming an inclined posture of the semiconductor substrate in the carrier after the relative movement between the support plate and the support plate.

[0010] In an optional embodiment, the contact structure is located at the top end of the support part, and the support part comprises a flow guide structure configured to guide the liquid to flow away from the contact area between the semiconductor substrate in the carrier and the support part when the support part holds the semiconductor substrate in the carrier.

[0011] In an optional embodiment, a plurality of positioning members matched with the carrier are connected to the upper side of the support plate.

[0012] In an optional embodiment, a first hollow hole is arranged on the support plate.

[0013] In an optional embodiment, a second hollow hole is arranged on the support plate.

[0014] In a second aspect, the present application provides a semiconductor substrate cleaning and drying assembly comprising the carrier support of any one of the preceding embodiments.

[0015] In a third aspect, the present application provides a semiconductor substrate processing device comprising the semiconductor substrate cleaning and drying assembly of the preceding embodiments.

[0016] In a fourth aspect, the present application provides a semiconductor substrate drying method implemented by the semiconductor substrate cleaning and drying assembly of the preceding embodiments, and the semiconductor substrate drying method comprises the steps of:

[0017] Placing the carrier on the support plate and immersing it in the cleaning liquid, holding the semiconductor substrate by the relative movement between the support plate and the support plate, forming point contact or line contact between the semiconductor substrate and the contact structure of the support part, applying the first solution to the liquid surface of the cleaning liquid to form a first solution film, controlling the uniform descent of the liquid level of the cleaning liquid, and supplementing the first solution during the descent process. The semiconductor substrate processing device comprises the semiconductor substrate cleaning and drying assembly of the preceding embodiments.

[0018] Compared with the prior art, the carrier support, semiconductor substrate cleaning and drying assembly, processing device and drying method provided by the present application have the following technical advantages:

[0019] The carrier support provided by the application is used in a semiconductor substrate cleaning and drying assembly, the semiconductor substrate cleaning and drying assembly comprises a drying container and a lifting mechanism for lifting a carrier into the drying container, the lifting mechanism comprises a support frame, the carrier support comprises a supporting plate arranged in the support frame and used for supporting the carrier and a supporting plate movably arranged on the supporting plate, a plurality of supporting portions for supporting semiconductor substrates in the carrier are arranged on the supporting plate, the supporting portions have contact structures, and the contact structures extend along the arrangement direction of the semiconductor substrates in the carrier to make the contact structures in point contact or line contact with the semiconductor substrates in the carrier, and the supporting plate and the supporting plate are configured to trigger relative movement between the supporting plate and the supporting plate to lift the semiconductor substrates in the carrier in response to the bottom of the drying container being contacted during the lowering of the carrier support.

[0020] In the cleaning process, the carrier support can be placed in the support frame of the lifting mechanism, the carrier loaded with semiconductor substrates can be placed on the supporting plate, the lifting mechanism slowly lifts the carrier loaded with semiconductor substrates into the drying container of the semiconductor substrate cleaning and drying assembly, and during the lowering of the carrier, the contact structures of the supporting portions on the supporting plate are not in contact with the semiconductor substrates until the relative movement between the supporting plate and the supporting plate is triggered to lift the semiconductor substrates in the carrier after the carrier support is lowered to contact the bottom of the drying container. Due to the point contact or line contact between the contact structures and the semiconductor substrates in the carrier, the contact area is relatively small, the cleaning exposure area of the surface of the semiconductor substrates is maximized, the problem of incomplete local cleaning caused by a large contact area in the prior art is effectively solved, and the cleaning quality of the semiconductor substrates and the subsequent process yield are improved. Meanwhile, the carrier support is replaced in a pick-and-place manner on the support frame, does not need to be adjusted and positioned, and can be compatible with semiconductor substrates of different sizes at the same time. The supporting plate is movably arranged on the supporting plate, and the two are integrated into an integrated type, which is convenient to install and adjust. When used, the semiconductor substrates only need to be lifted to a certain height in the carrier, and the semiconductor substrates can not need to be separated from the carrier during the entire drying process, that is, the pressing degree between the semiconductor substrates and the carrier is reduced to a first solution film, which can enter the space between the semiconductor substrates and the carrier for water removal. This makes it compatible with a wider range, and the breakage rate and the bending degree are greatly reduced.

[0021] The semiconductor substrate cleaning and drying assembly provided by the application comprises the above-mentioned carrier support, and thus the technical advantages and effects achieved by the semiconductor substrate cleaning and drying assembly include the technical advantages and effects achieved by the above-mentioned carrier support, which will not be described in detail here.

[0022] The semiconductor substrate processing equipment provided by the application comprises the above-mentioned semiconductor substrate cleaning and drying assembly, and thus the technical advantages and effects achieved by the semiconductor substrate processing equipment include the technical advantages and effects achieved by the above-mentioned semiconductor substrate cleaning and drying assembly, which will not be described in detail here.

[0023] The semiconductor substrate drying method provided by the application is implemented by the semiconductor substrate cleaning and drying assembly, and the technical advantages and effects thereof include those of the semiconductor substrate cleaning and drying assembly, which will not be described in detail here.

[0024] Other features and advantages of the present application will be described in detail in the following detailed description of the embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the specific embodiments or the prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0026] Figure 1 The semiconductor substrate processing equipment structure schematic diagram provided by the embodiment of the present application is shown in the figure.

[0027] Figure 2 The drying container structure schematic diagram provided by the embodiment of the present application is shown in the figure.

[0028] Figure 3 The first perspective view of the drying container provided by the embodiment of the present application is shown in the figure.

[0029] Figure 4 The automatic opening and closing mechanism structure schematic diagram provided by the embodiment of the present application is shown in the figure.

[0030] Figure 5 The first perspective view of the automatic opening and closing mechanism provided by the embodiment of the present application is shown in the figure.

[0031] Figure 6 The second perspective view of the automatic opening and closing mechanism provided by the embodiment of the present application is shown in the figure.

[0032] Figure 7 The inside schematic diagram of the automatic opening and closing mechanism provided by the embodiment of the present application is shown in the figure.

[0033] Figure 8 The inside partial exploded view of the automatic opening and closing mechanism provided by the embodiment of the present application is shown in the figure.

[0034] Figure 9 The cylinder structure schematic diagram provided by the embodiment of the present application is shown in the figure.

[0035] Figure 10 The schematic diagram of the lifting mechanism with carrier provided by the embodiment of the present application is shown in the figure.

[0036] Figure 11 The schematic diagram of the lifting mechanism without carrier provided by the embodiment of the present application is shown in the figure.

[0037] Figure 12 A schematic diagram of the upper side structure of the carrier support provided by an embodiment of the present application is shown in FIG. 1A.

[0038] Figure 13 A schematic diagram of the lower side structure of the carrier support provided by an embodiment of the present application is shown in FIG. 1B.

[0039] Figure 14 A schematic diagram of the exhaust manifold structure provided by an embodiment of the present application is shown in FIG. 2A.

[0040] Figure 15 A schematic diagram of the piping of the semiconductor substrate processing apparatus provided by an embodiment of the present application is shown in FIG. 3A.

[0041] Figure 16 A schematic diagram of the Figure 15 enlarged view of A in FIG. 4A.

[0042] Figure 17 A schematic diagram of the Figure 15 enlarged view of B in FIG. 4A.

[0043] Figure 18 A schematic diagram of the lifting mechanism structure provided by an embodiment of the present application is shown in FIG. 5A.

[0044] Figure 19 A schematic diagram of the second mounting plate group structure provided by an embodiment of the present application is shown in FIG. 6A.

[0045] Figure 20 A schematic diagram of the partial structure of the Figure 19 provided by an embodiment of the present application.

[0046] Icon: 1 - main body; 11 - exhaust manifold; 111 - plant exhaust system joint; 112 - exhaust adjusting plate; 113 - exhaust port; 114 - first exhaust valve; 115 - second exhaust valve; 116 - third exhaust valve; 117 - fourth exhaust valve; 118 - exhaust joint; 2 - drying container; 21 - inner container; 211 - flow guide structure; 212 - liquid inlet pipe; 213 - inner tank liquid outlet pipe; 214 - flow equalizing member; 215 - support structure; 216 - liquid inlet connecting port; 22 - outer container; 221 - overflow collection structure; 222 - outer tank liquid outlet pipe; 23 - outer tank cover plate; 231 - lifting perforation; 232 - detection sensor; 24 - liquid distribution device; 3 - automatic opening and closing mechanism; 31 - tank cover plate; 311 - integrated gas distribution channel; 3111 - gas joint; 312 - gas outlet; 313 - elastic sealing structure; 314 - guide component; 32 - gas cylinder mounting box; 321 - gas cylinder; 3211 - throttle valve; 3212 - position sensor; 3213 - buffer; 322 - gas cylinder connecting plate; 33 - guide rail mounting box; 331 - linear guide rail; 332 - guide rail connecting plate; 34 - tank cover cover plate; 35 - water collecting plate; 36 - gas supply pipe; 361 - gas filter; 362 - primary pressure regulating valve; 37 - second gas pipe; 371 - fourth valve; 372 - gas heating device; 373 - flow controller; 374 - temperature sensor; 38 - tank cover connecting plate; 4 - pressure supply system; 41 - liquid supply pipe; 411 - fifth valve; 412 - second valve; 413 - first solution flow meter; 42 - first gas pipe; 421 - third valve; 43 - pressure relief valve; 44 - safety valve; 45 - liquid supplement pipe; 451 - first pump; 452 - first solution filter; 5 - slow discharge flow path; 51 - second pump; 52 - first valve; 53 - liquid discharge flow meter; 6 - carrier support; 61 - support plate; 611 - support element; 612 - positioning member; 613 - first hollow hole; 614 - positioning groove; 62 - support plate; 621 - support part; 6211 - inclined surface; 622 - support column; 623 - second hollow hole; 7 - liquid level meter; 71 - air pressure conducting component; 711 - secondary pressure regulating valve; 712 - air inlet flow adjusting valve; 72 - differential pressure detection assembly; 8 - lifting mechanism; 81 - electric sliding table; 811 - sliding block; 812 - first mounting plate set; 813 - second mounting plate set; 8131 - first mounting plate; 8131a - first bent plate; 8132 - second mounting plate; 8132a - second bent plate; 8132b - long circular hole; 8133 - third mounting plate; 8133a - third bent plate; 8133b - first limiting bolt; 8133c - second limiting bolt; 8133d - universal bearing; 814 - pulling plate; 815 - support frame; 8151 - support member; 8151a - support block; 8151b - positioning block; 9 - carrier; 91 - semiconductor substrate. DETAILED DESCRIPTION

[0047] The technical solutions of the present application will be described clearly and completely below in combination with embodiments. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative work belong to the protection scope of the present application.

[0048] In the description of the present application, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0049] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0050] In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the fact that a person skilled in the art can realize it, and when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, nor is it within the protection scope required by the present application.

[0051] The present application will be described in further detail below through specific embodiments and in combination with the drawings.

[0052] The specific structure is as shown in Figures 1 to 20

[0053] ​The embodiment provides a semiconductor substrate cleaning and drying assembly used for a semiconductor substrate processing device, the semiconductor substrate processing device comprises a main body 1, and the semiconductor substrate cleaning and drying assembly comprises: a drying container 2 connected to the main body 1 and a liquid distribution device 24 used for applying a first solution; the drying container 2 comprises an inner container 21 and an outer container 22, the outer container 22 is connected to the top outer wall of the inner container 21, and the outer wall of the inner container 21 and the outer container 22 surround an overflow collection structure 221, the top outer side of a pair of opposite side walls of the inner container 21 is respectively provided with a flow guide structure 211, and an overflow gap is arranged between the flow guide structure 211 and the side wall of the outer container 22, so that the cleaning liquid overflowing in the inner container 21 flows into the overflow collection structure 221 through the overflow gap; the liquid distribution device 24 is correspondingly arranged above the flow guide structure 211, and the liquid distribution device 24 is provided with a distribution port, the first solution is applied to the flow guide structure 211 through the distribution port, and then is guided to the liquid surface in the inner container 21 through the flow guide structure 211 to form a first solution film.

[0054] In the embodiment, the liquid first solution is used to directly form the first solution film on the liquid surface in the inner container 21 through the flow guide structure 211, the problem of uneven diffusion and condensation droplet formation of gaseous first solution is overcome, the consistency of film thickness is much higher than that of gaseous first solution, the existence of water marks on the semiconductor substrate 91 is effectively reduced, the liquid first solution is directly formed, so that the phase change process is not needed, the response speed is faster, the drying mode of the semiconductor substrate 91 and the carrier is not separated, the semiconductor substrate 91 is prevented from being damaged during transportation, and the semiconductor substrate 91 of various materials, various specifications and various thicknesses can be compatible.

[0055] In the embodiment, the flow guide structure 211 can be an inclined flow guide plate, an inclined flow guide groove or other structures meeting the flow guide function. The first solution can be an IPA solution or other solutions with lower surface tension than water. The liquid distribution device 24 can be a pipe, a groove or the like, as long as the distribution requirement can be met. The top outer side of at least one side wall of the inner container 21 is provided with the flow guide structure 211, that is, the top outer side of one side wall is provided with the flow guide structure 211, or the top outer side of each of a plurality of side walls is provided with the flow guide structure 211.

[0056] In the optional technical solution of the embodiment, a liquid storage device used for storing the first solution and a liquid supply device used for conveying the first solution in the liquid storage device to the liquid distribution device are further included. The liquid storage device can be a liquid storage tank, a liquid storage bottle or a liquid storage box, as long as the liquid storage requirement can be met.

[0057] In the optional technical solution of the embodiment, the liquid storage device comprises a pressure supply system 4 for storing the first solution, and the liquid supply device comprises a liquid supply pipe 41; the pressure supply system 4 is arranged outside the drying container 2 and is in communication with the liquid distribution device 24 through the liquid supply pipe 41; the fifth valve 411, the second valve 412 and the first solution flow meter 413 are arranged on the liquid supply pipe 41. The first solution flow meter 413 is used for monitoring the flow of the first solution during application; the fifth valve 411 is used for adjusting the flow of the first solution; and the second valve 412 is a pneumatic valve for controlling the application of the first solution. The structure of the second valve 412 is simple, and compared with the existing bubble method and steam method, the second valve 412 can effectively solve the problems of the risk of combustion and explosion due to the open system and the large consumption of the first solution, and can store the first solution in the pressure supply system 4, thereby avoiding volatilization, reducing the consumption of the first solution, saving costs, and improving the safety factor.

[0058] In the optional technical solution of the embodiment, the pressure supply system 4 is connected with a first gas pipe 42 for charging gas into the pressure supply system 4, the gas keeps the pressure in the pressure supply system 4 at a predetermined pressure, and the first solution is delivered into the liquid distribution device 24; and the third valve 421 is arranged on the first gas pipe 42. The third valve 421 is a valve for providing gas pressure to the pressure supply system 4 and is in an open state, so that the pressure in the pressure supply system 4 is always kept at a set pressure. When the second valve 412 is opened, the first solution in the pressure supply system 4 enters the liquid distribution device 24 through the liquid supply pipe 41 under the driving of the gas pressure, and is sprayed from the distribution port to the flow guide structure 211. The first solution flows uniformly along the flow guide plate to the upper layer of the liquid surface to form a thin film of the first solution. Due to the gas pressure, the gas environment in the drying container 2 is prevented from being polluted.

[0059] In the optional technical solution of the embodiment, the pressure supply system 4 is provided with a pressure relief valve 43 and a safety valve 44. When the pressure in the pressure supply system 4 accidentally exceeds the safety set value, the internal pressure will open the safety valve 44 to achieve automatic pressure relief. The closed pressure supply system 4 design + safety valve 44 dynamic pressure relief (response time ≤0.1s), eliminates the leakage of the first solution.

[0060] In the optional technical solution of the embodiment, the pressure supply system 4 is connected with a liquid supplement pipe 45 for supplementing the first solution into the pressure supply system 4, so that the liquid level in the pressure supply system 4 is higher than the predetermined L liquid level; and the first pump 451 and the first solution filter 452 are arranged on the liquid supplement pipe 45 in sequence along the flow direction of the first solution in the liquid supplement pipe 45. Before supplementing the liquid into the pressure supply system 4, the third valve 421 must be closed and the pressure relief valve 43 must be opened for pressure relief operation. The first solution is extracted from the liquid supply bottle by the first pump 451, filtered through the first solution filter 452, and then enters the pressure supply system 4, so that the liquid level in the pressure supply system 4 is higher than the predetermined L liquid level, meeting the working requirements.

[0061] In an alternative technical solution of the embodiment, the pipe wall of the liquid distribution device 24 is provided with a plurality of distribution ports along the axial direction of the liquid distribution device 24. The application effect and uniformity are ensured. In the embodiment, the pipe wall of the liquid distribution device 24 is provided with one distribution port along the axial direction of the liquid distribution device 24, and the distribution port is a long port, which also has the above-mentioned effects.

[0062] In an alternative technical solution of the embodiment, the distribution port is directed to the outside of the top opening of the inner container 21. The first solution is effectively applied to the flow guide structure 211, and then uniformly flows along the flow guide structure 211 to the liquid surface in the inner container 21 to form a first solution film.

[0063] In an alternative technical solution of the embodiment, the flow guide structure 211 is located above the top opening of the inner container 21. The flow guide effect of the flow guide structure 211 is effectively ensured, and the first solution is prevented from being non-uniform due to too high flow rate.

[0064] The embodiment is not limited to the gas pressurization method for supplying liquid from the liquid storage device. The liquid storage device can also supply liquid to the liquid distribution device by natural gravity, and a pump can also be arranged on the liquid supply pipe to supply liquid from the liquid storage device to the liquid distribution device.

[0065] In an alternative technical solution of the embodiment, the semiconductor substrate cleaning and drying assembly further comprises a cleaning liquid inlet and outlet pipeline system connected to the drying container 2. The cleaning liquid inlet and outlet pipeline system comprises a liquid inlet pipe 212, a slow discharge flow path 5, an inner tank liquid discharge pipe 213, and an outer tank liquid discharge pipe 222. The liquid inlet pipe 212 is connected to the inner container 21 and is used to inject cleaning liquid into the inner container 21. The slow discharge flow path 5 is connected to the inner container 21 and the outer container 22 and is used to discharge the cleaning liquid in the inner container 21 to the overflow collection structure 221. The inner tank liquid discharge pipe 213 is connected to the inner container 21 and is used to discharge the cleaning liquid in the inner container 21. The outer tank liquid discharge pipe 222 is connected to the outer container 22 and is used to discharge the cleaning liquid in the overflow collection structure 221. In the embodiment, when the inner container 21 discharges liquid slowly, the cleaning liquid in the inner container 21 is discharged upward to the overflow collection structure 221 through the slow discharge flow path 5, which effectively offsets the direct influence of gravity on the discharge rate. When the cleaning liquid enters the outer container 22 through the slow discharge flow path 5, the cleaning liquid does not fill the outer container 22, which effectively avoids the siphon phenomenon and further avoids the fluctuation of the discharge speed. The structure design ensures the accuracy and stability of the discharge speed, avoids the error caused by manual adjustment, and further improves the cleaning effect and the stability of the subsequent drying process.

[0066] In an optional technical solution of the embodiment, the liquid inlet pipe 212 is arranged in the inner container 21 and located at the bottom of the inner container 21; the outer wall of the bottom of the inner container 21 is provided with a liquid inlet connecting port 216, and the liquid inlet pipe 212 is connected with the liquid inlet connecting port 216; the pipe wall of the liquid inlet pipe 212 is provided with a liquid inlet port. The liquid is introduced from the bottom of the inner container 21 upwards, so as to avoid splashing and ensure the overflow effect.

[0067] In an optional technical solution of the embodiment, along the axial direction of the liquid inlet pipe 212, the liquid inlet ports are arranged in multiple rows. The liquid inlet effect and uniformity are ensured. In the embodiment, along the axial direction of the liquid inlet pipe 212, the liquid inlet port can be arranged in one row, and the liquid inlet port is a long port, which also has the above-mentioned effect.

[0068] In an optional technical solution of the embodiment, along the circumferential direction of the liquid inlet pipe 212, the liquid inlet ports are arranged in two rows. The liquid inlet efficiency is improved.

[0069] In an optional technical solution of the embodiment, the two rows of liquid inlet ports are directed to opposite sides of the bottom of the inner container 21. The liquid inlet effect is avoided from being affected by facing the bottom of the inner container 21.

[0070] In an optional technical solution of the embodiment, a gap is arranged between the liquid inlet pipe 212 and the bottom of the inner container 21. The liquid inlet effect is further ensured.

[0071] In an optional technical solution of the embodiment, the liquid inlet pipe 212 is arranged in multiple roots, preferably two roots, and located at two sides of the inner container 21.

[0072] In an optional technical solution of the embodiment, the inner container 21 is provided with a flow uniformizing member 214, the flow uniformizing member 214 is located at the bottom of the inner container 21 and above the liquid inlet pipe 212. The flow uniformizing member 214 is provided with multiple turbulence holes, the flow uniformizing member 214 plays a role of liquid inlet turbulence, ensures the stability of the liquid surface, and can prevent the pipe from being blocked and damaged by falling sundries above. The bottom of the inner container 21 is provided with a support structure 215, and the flow uniformizing member 214 is arranged on the support structure 215, so as to ensure the stability of the flow uniformizing member 214.

[0073] In an optional technical solution of the embodiment, the slow drainage flow path 5 is connected with a second pump 51, a first valve 52 and a drainage flow meter 53, and the second pump 51 and the drainage flow meter 53 are both electrically connected to the controller, so that the controller controls the flow of the second pump 51 according to the signal feedback of the drainage flow meter 53 on the liquid flow rate in the slow drainage flow path 5. In the embodiment, the controller is connected to the main body 1, and during the slow drainage process, the inner tank drainage pipe 213 is closed, and the cleaning liquid in the inner container 21 starts to be drained through the slow drainage flow path 5. The first valve 52 is opened, the drainage flow meter 53 monitors the flow rate of the cleaning liquid in the slow drainage flow path 5 in real time, and feeds back the data to the controller. The controller automatically adjusts the flow of the second pump 51 according to the feedback information, so as to realize accurate control of the drainage speed of the cleaning liquid. Compared with the prior art which needs to manually adjust multiple valves to control the drainage speed, the application adopts an automatic control mode, which can improve the convenience of operation, ensure the accuracy and stability of the drainage speed, avoid errors caused by manual adjustment, and thus improve the cleaning effect and the stability of the subsequent drying process.

[0074] The embodiment is not limited to the cooperation of the second pump 51 and the drainage flow meter 53 to realize closed-loop flow control, but can also be the cooperation of the regulating valve and the drainage flow meter 53 to realize closed-loop flow control.

[0075] It should be noted that slow drainage refers to accurately controlling the drainage speed to slowly lower the liquid level in the inner container 21. This control mode can properly maintain the contact time of the liquid level with the surface of the semiconductor substrate 91, and avoid the influence of too fast water flow on the cleaning effect.

[0076] In an optional technical solution of the embodiment, one end of the slow drainage flow path 5 is connected to the bottom of the inner container 21, and the other end is connected to the top outer wall of the outer container 22; and the outer tank drainage pipe 222 is connected to the bottom of the outer container 22. The connection is convenient and the drainage effect is good.

[0077] In an optional technical solution of the embodiment, the semiconductor substrate cleaning and drying assembly further comprises an automatic opening and closing mechanism 3 arranged at the top opening of the drying container 2, and the automatic opening and closing mechanism 3 is connected to the main body 1; the automatic opening and closing mechanism 3 comprises a pair of driving assemblies and a pair of groove cover plates 31 connected to the pair of driving assemblies respectively, and the pair of driving assemblies are connected to close the top opening or separated to open the top opening by driving the pair of groove cover plates 31; the upper side of the groove cover plate 31 is provided with an integrated gas distribution channel 311, and the lower side of the groove cover plate 31 is provided with a gas outlet 312 connected to the integrated gas distribution channel 311 through the groove cover plate 31. The automatic opening and closing mechanism 3 drives the pair of groove cover plates 31 to close and open the top opening through the pair of driving assemblies, which has a simple structure and is convenient to open and close.

[0078] In an optional technical solution of the embodiment, the driving assembly includes a cylinder 321 and a linear guide rail 331; the cylinder 321 and the linear guide rail 331 are both connected to the groove cover plate 31, and the cylinder 321 is used to drive the groove cover plate 31 to move, and the linear guide rail 331 is used to guide the movement of the groove cover plate 31. The structure is simple, and the driving is stable. However, it is not limited to this, and the cylinder 321 can be replaced by a linear motor, an electric cylinder, a sliding table or the like, and the driving assembly can only include the cylinder 321 or the linear motor, the electric cylinder, the sliding table or the like.

[0079] Specifically, the automatic opening and closing mechanism 3 further includes a groove cover plate 34, a water receiving plate 35, and oppositely arranged cylinder mounting boxes 32 and guide rail mounting boxes 33; the cylinder 321 is arranged in the cylinder mounting box 32, and a cylinder connecting plate 322 is connected to a sliding block 811 of the cylinder 321; the linear guide rail 331 is arranged in the guide rail mounting box 33, and a guide rail connecting plate 332 is connected to the sliding block 811 of the linear guide rail 331; the cylinder connecting plate 322 and the guide rail connecting plate 332 are connected by a groove cover connecting plate 38, and the groove cover plate 31 is connected to the lower side of the groove cover connecting plate 38; the groove cover plate 34 is arranged on the integrated gas distribution channel 311, and one end is connected to the butt joint end of the groove cover plate 31, and the other end is connected to the upper side of the groove cover connecting plate 38; the two ends of the water receiving plate 35 are connected to the cylinder mounting box 32 and the guide rail mounting box 33 respectively. The water receiving plate 35 is used to prevent liquid from dripping on the equipment when the main equipment manipulator passes from above, causing corrosion and rust. In the embodiment, one cylinder mounting box 32 is arranged, and a pair of guide rail mounting boxes 33 are arranged, and a support is arranged on the guide rail mounting box 33, and the support is connected to the main body 1.

[0080] The cylinder 321 of the embodiment is a rodless cylinder 321, and the core function thereof is to drive the opening and closing actions of the groove cover plate 31; a throttle valve 3211 is arranged on the cylinder 321, the exhaust speed of the cylinder 321 is controlled by adjusting the airflow rate of the exhaust port 113 of the cylinder 321, so as to accurately control the movement speed of the cylinder 321 to perform the opening or closing action, two throttle valves 3211 are arranged on each cylinder 321, the opening speed and the closing speed are independently controlled, and the running speeds of the two cylinders 321 must be kept synchronous by adjusting the respective throttle valves 3211; a position sensor 3212 is further arranged on the cylinder 321, which is used to detect the position of the piston of the cylinder 321, and provide a travel end feedback signal for the opening and closing to position; a buffer 3213 is further arranged on the cylinder 321, which is installed in the threaded holes at both ends of the cylinder 321, the adjusting screw rod of the buffer 3213 abuts against the sliding block 811 inside the cylinder 321, provides a buffering and damping action when the cylinder 321 opening and closing movement approaches the end point, absorbs the impact and reduces the noise, and at the same time, the extension and retraction amount of the screw rod of the buffer 3213 can be adjusted by rotating the buffer 3213, so as to realize the fine adjustment of the effective stroke of the cylinder 321 (shorten the stroke by rotating in, and lengthen the stroke by rotating out), and the position of the screw rod end of the adjusted buffer 3213 also plays an accurate mechanical hard limit action.

[0081] In an optional technical solution of the embodiment, the abutting end of the slot cover plate 31 is provided with an elastic sealing structure 313. The sealing property when the slot cover plate 31 is closed is ensured. The elastic sealing structure 313 can be a sealing gasket or other structure capable of achieving sealing through elasticity.

[0082] In an optional technical solution of the embodiment, the lower side of the slot cover plate 31 is provided with a guide component 314 for guiding the movement of the slot cover plate 31. The guide component 314 cooperates with the top opening to ensure the stability of the movement of the slot cover plate 31. The guide component 314 can be a guide block, a guide groove or other component capable of achieving the guiding function.

[0083] In an optional technical solution of the embodiment, the integrated gas distribution channel 311 is connected with a gas joint 3111; the integrated gas distribution channel 311 is internally hollow, and the gas outlet 312 and the gas joint 3111 are both in communication with the internal hollow of the integrated gas distribution channel 311. Gas is supplied into the integrated gas distribution channel 311 through the gas joint 3111, and then sprayed out through the gas outlet 312, that is, the integrated gas distribution channel 311 forms a communicating vessel, and a plurality of gas outlets 312 can be installed thereon. Preferably, a plurality of integrated gas distribution channels 311 are arranged on each slot cover plate 31, and a plurality of nozzle mounting portions are arranged on each integrated gas distribution channel 311. The gas outlet 312 can be selectively connected with the nozzle mounting portion according to the requirement, and the gas outlet 312 can be of different caliber. Specifically, the position and caliber size of the gas outlet 312 can be adjusted according to the shape and position of the carrier 9 to control the emphasis of the hot gas drying. The gas outlet 312 with a larger caliber is used for the position where liquid is prone to be left or the position where the carrier 9 is far away from the automatic opening and closing mechanism 3, and is installed at the corresponding position, so as to ensure the drying efficiency.

[0084] In an optional technical solution of the embodiment, a gas supply pipe 36 for supplying gas is further included, the second gas pipe 37 is connected between the gas supply pipe 36 and the slot cover plate 31, and the gas outlet 312 is in communication with the second gas pipe 37; the gas supply pipe 36 is provided with a gas filter 361 and a primary pressure regulating valve 362; the gas filter 361 purifies the gas required by the whole machine, and the primary pressure regulating valve 362 is used for setting the main air inlet pressure in the gas supply pipe 36; the second gas pipe 37 is provided with a fourth valve 371 for controlling the on-off of the blowing gas and a gas heating device 372. The gas in the second gas pipe 37 is heated by the gas heating device 372, and the heated gas is sprayed into the drying container 2 through the gas outlet 312, so as to realize the heating and drying of the semiconductor substrate 91. The heated gas can quickly take away the trace amount of water left on the surface of the semiconductor substrate 91, and can also effectively reduce the retention of moisture in the inner container 21, so as to ensure that the drying process is complete and free of water marks.

[0085] In an optional technical solution of the embodiment, the second gas pipe 37 is further provided with a flow controller 373 for monitoring and adjusting the gas flow and a temperature sensor 374 for monitoring the gas temperature at the outlet of the gas heating device 372; the gas heating device 372, the flow controller 373 and the temperature sensor 374 are all electrically connected to the controller, so that the controller controls the start of the gas heating device 372 according to the signal feedback of the flow controller 373, and controls the power of the gas heating device 372 according to the signal feedback of the temperature sensor 374. The flow controller 373 precisely adjusts the gas flow; the temperature sensor 374 detects the temperature at the outlet of the gas heating device 372 in real time and feeds back the data to the controller; the controller automatically adjusts the heating power based on the temperature feedback, forms a feedback control, and realizes precise temperature control. When the flow controller 373 detects that the gas flow is lower than the set value, the system will lock the gas heating device 372 to start, preventing dry burning; the gas heating device 372 is provided with an over-temperature protection device, which automatically cuts off the power supply to realize safety interlocking when the internal temperature exceeds the safety threshold. The over-temperature protection device adopts the prior art, which will not be described here.

[0086] In the embodiment, through the cooperative design of the modular automatic opening and closing mechanism 3 and the integrated gas distribution channel 311, the following comprehensive advantages are achieved: first, the high integration of the opening and closing action of the groove cover plate 31 and the gas conveying function reduces the dependence on external pipelines; second, the cooperation of the elastic sealing structure 313 and the movement guide component 314 ensures the long-term sealing reliability under high-frequency opening and closing; third, the flow controller 373, the gas heating device 372 and the temperature sensor 374 form a temperature control gas supply system, which is configured to dynamically adjust the gas temperature and flow according to the preset process parameters. Due to the decoupling design of the temperature control gas supply system and the cover body structure, it is convenient to adapt to different process gas requirements.

[0087] In the embodiment, the slow discharge flow path can be a pipeline, but also a flow path of other structures, as long as the requirements are met. The flow controller 373 can be a pump, a valve or other devices that can control the flow. The gas heating device 372 can be a heater, a heat exchanger or other devices that can heat the gas.

[0088] In the optional technical solution of the embodiment, the semiconductor substrate cleaning and drying assembly further comprises a lifting mechanism 8 for lifting the carrier 9 into the drying container 2, the lifting mechanism 8 being connected to the main body 1; the outer groove cover plate 23 is arranged on the drying container 2, the outer groove cover plate 23 being provided with a top opening and a lifting hole 231, the automatic opening and closing mechanism 3 being arranged at the top opening, and the lifting mechanism 8 being arranged in the lifting hole 231; a detection sensor 232 is arranged on the inner side of the outer groove cover plate 23, and the detection sensor 232 is located on the movement path of the carrier 9, the lifting mechanism 8, the automatic opening and closing mechanism 3 and the detection sensor 232 all being electrically connected to the controller, so that the controller controls the working states of the automatic opening and closing mechanism 3 and the lifting mechanism 8 according to the opening and closing states of the automatic opening and closing mechanism 3 and the signal feedback of the detection sensor 232. When the automatic opening and closing mechanism 3 is in the closed state and the lifting mechanism 8 performs the lifting action, once the detection sensor 232 is blocked by the carrier 9 and detects that there is material, the lifting mechanism 8 will immediately stop automatically, at this time, the automatic opening and closing mechanism 3 needs to be manually opened, and then the lifting mechanism 8 can continue to perform the lifting operation. This design prevents the carrier 9 from colliding with the automatic opening and closing mechanism 3 to cause debris and equipment damage through the forced manual confirmation mechanism. When the automatic opening and closing mechanism 3 is in the open state, if the carrier 9 does not move out of the detection range of the detection sensor 232 (that is, the detection sensor 232 continuously detects that there is material), the controller will prohibit the closing operation of the automatic opening and closing mechanism 3, and only when the lifting mechanism 8 is lowered to move out of the detection range of the detection sensor 232 or the carrier 9 is removed, the locking state can be released and the closing operation of the automatic opening and closing mechanism 3 is allowed. This design avoids the risk of debris caused by the carrier 9 being clamped when the automatic opening and closing mechanism 3 is closed through physical space verification. The outer container 22 is provided with the outer groove cover plate 23.

[0089] In the embodiment, an upper limit position sensor and a lower limit position sensor can also be arranged in the drying container 2, the upper limit position sensor cooperating with the lifting mechanism 8 to limit the lifting mechanism 8 to only lift to a preset upper limit position, and the lower limit position sensor cooperating with the lifting mechanism 8 to limit the lifting mechanism 8 to only lower to a preset lower limit position.

[0090] In the optional technical solution of the embodiment, an alarm device electrically connected to the controller is further included. A high-precision infrared detection sensor 232 is arranged at the top opening of the drying container 2 to detect the position of the carrier 9 in real time. When the carrier 9 does not move out of the detection range of the detection sensor 232, the controller automatically locks the closing action of the automatic opening and closing mechanism 3 and triggers the alarm device. If the lifting mechanism 8 does not reach the safe position, the rotating mechanism and the automatic opening and closing mechanism 3 of the semiconductor substrate cleaning and drying assembly are disabled to avoid mechanical collision. The alarm device is an audible and visual alarm, and the prompting effect is obvious.

[0091] In an optional technical solution of the embodiment, the lifting mechanism 8 comprises an electric sliding table 81 connected to the main body 1, a first mounting plate set 812 connected to a sliding block 811 of the electric sliding table 81, a second mounting plate set 813 connected to one end of the first mounting plate set 812 away from the sliding block 811, a pulling plate 814 connected to one end of the second mounting plate set 813 away from the first mounting plate set 812, and a support frame 815 connected to the pulling plate 814 away from the second mounting plate set 813. The pulling plate 814 is arranged through the lifting hole 231. The lifting mechanism 8 uses the existing electric sliding table 81 and sliding block 811, drives the sliding block 811 to move through the electric sliding table 81, and realizes the synchronous lifting of the support frame 815. When the electric sliding table 81 drives the sliding block 811 to move up and down, the sliding block 811 transmits the motion through the first mounting plate set 812, the second mounting plate set 813 and the pulling plate 814 in stages, so that the support frame 815 stably rises and falls. The two opposite inner side walls of the support frame 815 are respectively connected with support pieces 8151, and the support piece 8151 comprises a support block 8151a connected to the support frame 815 through a fastener and a positioning block 8151b connected to the support block 8151a.

[0092] The second mounting plate set 813 comprises a first mounting plate 8131 connected to the first mounting plate set 812, a second mounting plate 8132 connected to one end of the first mounting plate 8131 away from the first mounting plate set 812, and a third mounting plate 8133 connected to one end of the second mounting plate 8132 away from the first mounting plate 8131, and the pulling plate 814 is connected to the third mounting plate 8133; the first mounting plate 8131 is bent on both sides to form a first bent plate 8131a, the second mounting plate 8132 is bent on both sides to form a second bent plate 8132a, and the third mounting plate 8133 is bent on both sides to form a third bent plate 8133a; the second bent plate 8132a abuts against the outside of the first bent plate 8131a, the first bent plate 8131a is provided with a plurality of threaded holes, and the second bent plate 8132a is provided with a plurality of long circular holes 8132b matched with the threaded holes. The second mounting plate 8132 is bent on both sides to form a second bent plate 8132a, which abuts against the outside of the first bent plate 8131a of the first mounting plate 8131. The threaded holes provided on the first bent plate 8131a are matched with the long circular holes 8132b on the second bent plate 8132a, so that the second mounting plate 8132 can be adjusted in position along the length direction of the long circular holes 8132b (the same as the length extension direction of the second mounting plate 8132). The third mounting plate 8133 is connected to the second mounting plate 8132 by a plurality of fasteners, and the third mounting plate 8133 is threadedly connected with a plurality of first limiting bolts 8133b abutting against one end of the second mounting plate 8132 to adjust the distance between the third mounting plate 8133 and the second mounting plate 8132, and the third bent plate 8133a is threadedly connected with a plurality of second limiting bolts 8133c abutting against one end of the outer wall of the second bent plate 8132a to adjust the distance between the third bent plate 8133a and the second bent plate 8132a. The third mounting plate 8133 is connected to the second mounting plate 8132 by a plurality of fasteners, and the distance between the third mounting plate 8133 and the second mounting plate 8132 is adjusted by a plurality of first limiting bolts 8133b. One end of the first limiting bolt 8133b abuts against the second mounting plate 8132, and after rotation adjustment, the relative position of the third mounting plate 8133 and the second mounting plate 8132 can be changed, and finally the third mounting plate 8133 and the second mounting plate 8132 are connected by a plurality of fasteners.

[0093] Meanwhile, the third bending plate 8133a is matched with the outer wall of the second bending plate 8132a through the second limiting bolt 8133c, one end of the plurality of second limiting bolts 8133c abuts against the outer wall of the second bending plate 8132a, and the spacing between the third bending plate 8133a and the second bending plate 8132a can be adjusted by rotating the second limiting bolt 8133c. The position of the support frame 815 can be accurately fine-adjusted in three vertical directions through the combination adjustment of the long circular hole 8132b, the first limiting bolt 8133b and the second limiting bolt 8133c and other related structures. In some embodiments, a fastener can also be connected between the first mounting plate 8131 and the second mounting plate 8132 to further fix the position between the first mounting plate 8131 and the second mounting plate 8132. The third mounting plate 8133 is connected with the second mounting plate 8132 through the universal bearing 8133d. The universal bearing 8133d can guarantee the relative connection relationship between the third mounting plate 8133 and the second mounting plate 8132, and facilitate the adjustment of the position relationship between the third mounting plate 8133 and the second mounting plate 8132 through the first limiting bolt 8133b and the second limiting bolt 8133c.

[0094] The carrier holder 6 provided by the embodiment is used in a semiconductor substrate cleaning and drying assembly, and includes a supporting plate 61 arranged in the support frame 815 and used for supporting a carrier 9, and a supporting plate 62 movably arranged on the supporting plate 61. A plurality of supporting portions 621 used for supporting semiconductor substrates 91 in the carrier 9 are arranged on the supporting plate 62. The supporting portions 621 have a contact structure, and the contact structure extends along the arrangement direction of the semiconductor substrates 91 in the carrier 9 to make the contact structure in point contact or line contact with the semiconductor substrates 91 in the carrier 9. The supporting plate 61 and the supporting plate 62 are configured to trigger relative movement between the supporting plate 61 and the supporting plate 62 to lift the semiconductor substrates 91 in the carrier 9 in response to the bottom of the drying container 2 during the lowering of the carrier holder 6.

[0095] Specifically, the support plate 62 is provided with a plurality of support portions 621 for supporting the semiconductor substrates 91 in the carrier 9 and a plurality of support columns 622 for supporting the support plate 62, the support portions 621 have contact structures, and the contact structures extend along the arrangement direction of the semiconductor substrates 91 in the carrier 9 to make the contact structures in point contact or line contact with the semiconductor substrates 91 in the carrier 9, the support columns 622 are arranged through the tray 61 and can abut against the bottom of the drying container 2 to make the support plate 62 move relative to the tray 61 to lift the semiconductor substrates 91 in the carrier 9. In the cleaning process, the carrier support 6 can be placed in the support frame 815 of the lifting mechanism 8, the carrier 9 loaded with the semiconductor substrates 91 can be placed on the tray 61, the lifting mechanism 8 slowly lifts and lowers the carrier 9 loaded with the semiconductor substrates 91 into the drying container 2 of the semiconductor substrate cleaning and drying assembly, in the process of lowering the carrier 9, the contact structures of the support portions 621 on the support plate 62 are not in contact with the semiconductor substrates 91, and when the support columns 622 abut against the bottom of the drying container 2 and continue to lower, the tray 61 continues to lower with the lifting mechanism 8 and is separated from the support plate 62, the contact structures of the support portions 621 on the support plate 62 are in contact with the semiconductor substrates 91 and lift the semiconductor substrates 91 in the carrier 9, because the contact structures are in point contact or line contact with the semiconductor substrates 91 in the carrier 9, the contact area is relatively small, the cleaning exposure area of the surface of the semiconductor substrates 91 is maximized, the problem of incomplete local cleaning caused by a large contact area in the prior art is effectively solved, and the cleaning quality of the semiconductor substrates 91 and the subsequent process yield are improved. At the same time, the carrier support 6 is replaced in a pick-and-place manner on the support frame 815, does not need to be adjusted and positioned, and can be compatible with semiconductor substrates 91 of different sizes at the same time. The movable support plate 62 is arranged on the tray 61, and the two are integrated into a one-piece structure, which is convenient to install and adjust. When in use, the semiconductor substrates 91 are lifted to a certain height in the carrier 9, and the semiconductor substrates 91 can not need to be separated from the carrier 9 in the entire drying process, that is, the abutting degree between the semiconductor substrates 91 and the carrier 9 is reduced to a first solution film, which can enter the space between the semiconductor substrates 91 and the carrier 9 for water removal. This makes it compatible with a wider range, and the breakage rate and the bending degree are greatly reduced.

[0096] In the embodiment, the support columns 622 are arranged through the tray 61 and are used to trigger the relative movement between the tray 61 and the support plate 62. Alternatively, other structures such as levers, inclined surfaces, hydraulic mechanisms or the like can be used to trigger the relative movement between the tray 61 and the support plate 62.

[0097] In an optional technical solution of the embodiment, the tray 61 is connected with a plurality of support elements 611 for supporting the carrier 9, and the support elements 611 make the carrier 9 form an inclined posture.

[0098] Specifically, the height of the support element 611 extending out of the upper side of the support plate 61 is adjustable; the height of all support elements 611 extending out of the upper side of the support plate 61 decreases in turn, so that the carrier 9 forms an inclined posture. After the carrier 9 is placed on the support element 611, it can be inclined to avoid water storage. Specifically, the support element 611 can be a sharp head set screw installed in the screw hole of the support plate 61, the sharp head upwardly supports the carrier 9, the height is adjustable, four set screws are arranged for each carrier 9 and the installation heights are different, the carrier 9 placed thereon is in a forward, backward, left and right inclined state, the inclination angle of the carrier 9 is changed by adjusting the set screw, the angle range of the forward, backward, left and right is 0-10 degrees adjustable, such inclination can make the plane of the carrier 9 not store water, the locking nut is connected to the set screw from the lower side of the support plate 61 to prevent the set screw from rotating.

[0099] The embodiment is not limited to this, the support element 611 can also be realized by other forms to make the carrier 9 form an inclined posture, for example, the support element 611 uses a wedge block or an angle installation surface.

[0100] In an optional technical solution of the embodiment, after the relative movement between the support plate 61 and the support plate 62, the support plate 62 can make the semiconductor substrate 91 in the carrier 9 form an inclined posture.

[0101] Specifically, the height of the support element 611 extending out of the upper side of the support plate 61 is adjustable; the height of all support elements 611 extending out of the upper side of the support plate 61 decreases in turn, so that the carrier 9 forms an inclined posture. After the carrier 9 is placed on the support element 611, it can be inclined to avoid water storage. Specifically, the support element 611 can be a sharp head set screw installed in the screw hole of the support plate 61, the sharp head upwardly supports the carrier 9, the height is adjustable, four set screws are arranged for each carrier 9 and the installation heights are different, the carrier 9 placed thereon is in a forward, backward, left and right inclined state, the inclination angle of the carrier 9 is changed by adjusting the set screw, the angle range of the forward, backward, left and right is 0-10 degrees adjustable, such inclination can make the plane of the carrier 9 not store water, the locking nut is connected to the set screw from the lower side of the support plate 61 to prevent the set screw from rotating.

[0102] The embodiment is not limited to this, the support element 611 can also be realized by other forms to make the carrier 9 form an inclined posture, for example, the support element 611 uses a wedge block or an angle installation surface.

[0103] In an optional technical solution of the embodiment, the contact structure is located at the top end of the support part 621, the support part 621 includes a flow guide structure, the flow guide structure is configured to guide the liquid to flow in a direction away from the contact area between the semiconductor substrate 91 in the carrier 9 and the support part 621 when the support part 621 supports the semiconductor substrate 91 in the carrier 9.

[0104] Specifically, one side of the support part 621 is a vertical surface, and the other side is an inclined surface 6211. The inclined surface 6211 forms a flow guide structure, and the top end of the vertical surface intersects with the top end of the inclined surface 6211 to form a contact structure. The inclined surface 6211 plays a role in guiding the flow, and can guide the water droplets at the contact position of the semiconductor substrate 91 and the contact structure of the support part 621 to be drained away during the slow liquid discharge process.

[0105] It should be noted that the two sides of the support part 621 can also be inclined surfaces 6211, that is, both sides of the support part 621 have flow guide structures. The flow guide structure is not limited to the inclined surface 6211, but can also be a curved surface or a groove. In addition, the contact structure along the arrangement direction of the semiconductor substrate 91 in the carrier 9 can be a tooth-like structure, a linear structure or a point-like structure, and is not limited to being arranged at the top end of the support part 621, but can also be arranged at other positions as long as the requirements are met.

[0106] In an optional technical solution of the embodiment, a plurality of positioning members 612 matched with the carrier 9 are connected to the upper side of the supporting plate 61. These positioning members 612 are distributed around the carrier 9, which can effectively limit the movement of the carrier 9 and ensure the stability of the position of the carrier 9 during the lifting process, so that the carrier 9 will not shift or shake.

[0107] In an optional technical solution of the embodiment, a first hollow hole 613 is arranged on the supporting plate 61. The weight is reduced, and the drainage is facilitated.

[0108] In an optional technical solution of the embodiment, a second hollow hole 623 is arranged on the supporting plate 62. The weight is reduced, and the drainage is facilitated.

[0109] In an optional technical solution of the embodiment, a guide shaft sleeve is arranged between the support column 622 and the supporting plate 61. The guide shaft sleeve is the guide shaft sleeve of the support column 622, which plays a lubricating role to prevent the supporting plate 61 and the support plate 62 from being stuck when they move relative to each other.

[0110] The semiconductor substrate drying method provided by the embodiment is implemented by using the semiconductor substrate cleaning and drying assembly. The semiconductor substrate drying method comprises the steps of: placing the carrier 9 on the supporting plate 61 and immersing it in the cleaning liquid; lifting the semiconductor substrate 91 by the relative movement of the support plate 62 and the supporting plate 61, so that the semiconductor substrate 91 forms a point contact or a line contact with the contact structure of the support part 621; applying a first solution to the liquid surface of the cleaning liquid to form a first solution film; controlling the liquid level of the cleaning liquid to descend uniformly, and supplementing the first solution during the descending process.

[0111] In an optional technical solution of the embodiment, the support plate 61 is provided with a positioning groove 614 penetrating through the support plate 61 and matched with the positioning block 8151b. The support plate 61 is supported by the positioning block 8151b through the positioning groove 614 on the support plate 61, so as to ensure the stable position of the support plate 61 in the support frame 815. When the lifting mechanism 8 is lowered, the support plate 61 moves together with the support frame 815 until the carrier 9 is accurately positioned at the cleaning and drying position.

[0112] It should be noted that the support plate 62 can be installed on the support plate 61 to realize the tray function in the embodiment, and the support plate 62 can not be installed when the tray function is not needed.

[0113] In an optional technical solution of the embodiment, the semiconductor substrate cleaning and drying assembly further comprises a liquid level meter 7. The liquid level meter 7 is arranged in the inner container 21 and comprises a gas pressure conduction component 71 connected with the gas supply pipe 36 for providing gas and a differential pressure detection assembly 72 electrically connected with the controller. The gas outlet end of the gas pressure conduction component 71 is located at the bottom of the inner container 21, and the differential pressure detection assembly 72 is arranged on the gas pressure conduction component 71. The controller detects the pressure difference between the liquid surface of the cleaning liquid in the inner container 21 and the gas outlet end of the gas pressure conduction component 71 through the differential pressure detection assembly 72 to obtain the liquid level of the cleaning liquid in the inner container 21. The liquid level meter 7 is used to control the water inlet and outlet, and has high precision and is not affected by the flow factor. The differential pressure detection assembly 72 outputs a differential pressure value proportional to the liquid level height, and offsets the influence of gas pressure fluctuation. The gas pressure conduction component 71 continuously inputs low-pressure gas (typical pressure 0.25 bar) to form micro-bubbles at the gas outlet end of the gas pressure conduction component 71, so as to prevent liquid backflow or crystallization from blocking the gas pressure conduction component 71. In addition, the gas acts as an inert gas to avoid liquid oxidation or pollution, and is especially suitable for ultra-pure chemicals.

[0114] In this embodiment, not only limited to the liquid level meter 7, but also other liquid level meters, such as the immersed static pressure liquid level meter, ultrasonic liquid level meter, radar liquid level meter, photoelectric liquid level meter and float type liquid level meter; but compared with other liquid level measurement technology, the liquid level meter 7 is outstanding in the following aspects: one, corrosion resistance and anti-blocking ability, the semiconductor cleaning liquid has strong corrosion. The gas pressure conducting part 71 of the liquid level meter 7 adopts corrosion-resistant high-cleanliness material, and the gas purging avoids direct contact of the liquid with the sensor core, and the service life is significantly better than that of the immersed static pressure liquid level meter. The polishing liquid contains particles and is easy to deposit. The gas continues to blow to keep the pipeline unblocked, while the probe of the ultrasonic or radar liquid level meter is easy to be disturbed by the attached matter. Two, high purity guarantee, due to non-contact measurement, only gas contacts liquid, avoids the introduction of metal ion pollution by photoelectric / floating ball type sensor, meets the semiconductor grade purity requirement (ppt level). And there is no risk of penetration, compared with the capacitive sensor (need electrode contact), eliminates the failure caused by medium penetration. Three, adaptability of complex working conditions, suitable for closed pressure vessels, directly compatible with nitrogen sealing storage tanks (common design in semiconductor process), differential pressure principle naturally offsets the influence of gas pressure fluctuation. Suitable for high temperature / high pressure environment, wide temperature range (-40~125℃), pressure up to 40bar, better than plastic material float or photoelectric sensor. Four, precision and reliability, can be compensated in full temperature range, the diffused silicon sensor has built-in temperature compensation, the precision is ±0.5%FS, avoids the signal scattering caused by ultrasonic wave due to steam / foam. And there is no mechanical moving part, there is no risk of jamming for magnetostrictive or float type, no moving parts, low maintenance. Five, real-time monitoring, multi-point control, the liquid level meter 7 feedbacks in real time.

[0115] In the optional technical scheme of the embodiment, the gas pressure conducting part 71 is provided with a two-stage pressure regulating valve 711 for adjusting the inlet gas pressure of the gas pressure conducting part 71. The gas pressure conducting part 71 is provided with an inlet gas flow regulating valve 712, which precisely adjusts the outlet gas rate by controlling the speed of gas entering the gas pressure conducting part 71.

[0116] When the content container 21 stores water, the air pressure conducting component 71 forms bubbles in the water, and the air flow adjustment of the air inflow flow regulating valve 712 directly affects the bubble generation frequency. The faster the flow rate, the more sensitive the liquid level meter 7 response (the liquid surface fluctuation increases), and the slower the flow rate, the response delay (the liquid surface tends to be stable). The air outlet end of the air pressure conducting component 71 is provided with a bevel to prevent the insertion of the content container 21 from being blocked in contact with the flat bottom. The content container 21 is provided with a fixing structure, and the air pressure conducting component 71 is fixed to the fixing structure. The fixing structure can be a fixing block, a fixing plate or other structures that can meet the needs. The air pressure conducting component 71 can be a metal pipe, an air pipe or other structures that can meet the needs. The liquid level meter 7 monitors the liquid level in the content container 21 in real time, and the feedback liquid level data is connected to the PLC system. The process sequence switching node is triggered by the predetermined liquid level threshold value to realize the automatic closed-loop control of the whole process such as water injection and water drainage. Slow drainage control: set liquid level value-set slow drainage flow-rate-slow drainage starts-reaches set liquid level-starts slow drainage-controller starts the second pump 51 according to the set flow rate-drainage flowmeter 53 monitors the flow rate in real time and feeds back to the controller, and the controller automatically calculates and adjusts the power of the second pump 51 according to the flow rate feedback by the drainage flowmeter 53, so as to achieve the set flow rate and form a closed-loop control. When reaching the next liquid level node, the controller automatically adjusts the power of the second pump 51 according to the flow rate feedback by the drainage flowmeter 53 to achieve the flow rate of this node until reaching the slow drainage end liquid level node, and then the slow drainage ends and enters the next step. The whole slow drainage process can have multiple variable speed nodes.

[0117] In an optional technical solution of the embodiment, the air pressure conducting component 71 is arranged in the flow equalizing member 214, and the air outlet end of the air pressure conducting component 71 is located between the flow equalizing member 214 and the bottom of the content container 21. The detection accuracy is ensured.

[0118] It should be noted that in some embodiments, the drying container 2 can also be a drying container 2 in the prior art, such as a drying container 2 comprising a first container connected to the main body 1 and a second container connected to the top outer wall of the first container, the second container and the outer wall of the first container surrounding an overflow collection structure 221, so that the cleaning liquid overflowing in the first container flows into the overflow collection structure 221, and the bottom of the overflow collection structure 221 is connected with a second liquid discharge pipe; the liquid inlet pipe 212 is connected to the side wall of the first container, the first liquid discharge pipe is connected to the bottom wall of the first container, the first solution bubbling box is connected to the side wall of the second container, and the box opening of the first solution bubbling box is higher than the top opening of the first container, and the tank cover is connected to the top opening of the second container; the first liquid discharge pipe comprises a first section connected to the first container, a second section connected to one end of the first section away from the first container, and a third section connected to one end of the second section away from the first section and used for discharging the cleaning liquid in the first container to the outside of the main body 1, the second pump 51, the first valve 52 and the flow meter are connected to the second section, the first liquid discharge pipe is connected with the sixth pipeline, one end of the sixth pipeline is connected to the intersection of the first section and the second section, the other end of the sixth pipeline is connected to the intersection of the second section and the third section, the sixth pipeline is connected with the ninth valve, the highest part of the second section is higher than the top opening of the first container, and the inner diameter of the third section gradually increases from one end close to the second section to the tail end of the third section.

[0119] The embodiment provides an exhaust manifold 11 for a semiconductor substrate processing device, the exhaust manifold 11 is hollow inside and connected to the main body 1; a factory exhaust system joint 111 is arranged on a first side of the exhaust manifold 11; an adjusting long hole, an exhaust adjusting plate 112 and an exhaust port 113 are arranged on a second side of the exhaust manifold 11, the exhaust adjusting plate 112 is arranged at the exhaust port 113 and connected to the adjusting long hole through a screw, and the exhaust adjusting plate 112 adjusts the connection position through the adjusting long hole to change the opening degree of the exhaust port 113. The factory exhaust system joint 111 of the exhaust manifold 11 is connected to the interface of the factory exhaust system one by one, which is convenient, the exhaust port 113 can timely exhaust the air in the main body 1 of the semiconductor substrate processing device, avoids pollution, and can also cool down.

[0120] In the optional technical solution of the embodiment, the exhaust ports 113 are arranged vertically in one row; both ends of the row of exhaust ports 113 are provided with adjusting long holes, and both ends of the exhaust adjusting plate 112 are connected to the adjusting long holes. The exhaust adjusting plate 112 can be moved forward and backward to open or close the exhaust ports 113, thereby improving the exhaust effect and occupying a small area. The third side of the exhaust manifold device 11 is provided with a first exhaust valve 114 which can be manually adjusted in opening degree, the first exhaust valve 114 is connected to the lifting mechanism 8 through a first hose to exhaust the area of the lifting mechanism 8. The fourth side of the exhaust manifold device 11 is provided with a second exhaust valve 115 and a third exhaust valve 116 which can be manually adjusted in opening degree, the second exhaust valve 115 is connected to the exhaust boxes on both sides of the drying container 2 through a second hose and the third exhaust valve 116 is connected to the exhaust boxes through a third hose to exhaust the exhaust boxes. The fourth side of the exhaust manifold device 11 is provided with a fourth exhaust valve 117 which can be manually adjusted in opening degree, the fourth exhaust valve 117 is connected to the three-way valve on the drain line of the drying container 2 through a fourth hose to exhaust the drying container 2. The first side of the exhaust manifold device 11 is also provided with a multifunctional area, the multifunctional area is provided with a plurality of exhaust joints 118; at least one exhaust joint 118 is connected to an exhaust negative pressure table through a gas pipe, and the exhaust negative pressure table is used to monitor the exhaust pressure in the exhaust manifold device 11. At least one exhaust joint 118 is connected to the air cylinder mounting box 32 through a gas pipe to exhaust the air cylinder mounting box 32. At least one exhaust joint 118 is connected to the guide rail mounting box 33 through a gas pipe to exhaust the guide rail mounting box 33. At least one exhaust joint 118 is connected to the pressure supply system 4 through a gas pipe to exhaust the pressure supply system 4. The whole exhaust manifold device 11 has a simple structure and can meet the overall exhaust demand of the semiconductor substrate processing equipment.

[0121] It should be noted that the first exhaust valve 114, the second exhaust valve 115, the third exhaust valve 116 and the fourth exhaust valve 117 are all provided with adjusting plates which can rotate by 90°, the opening degree of the valve can be adjusted by manually rotating the plate, thereby controlling the exhaust amount of the area, which has a simple structure and is easy to operate.

[0122] The semiconductor substrate processing equipment provided in the embodiment includes the semiconductor substrate cleaning and drying assembly, and thus the technical advantages and effects achieved by the semiconductor substrate processing equipment include those achieved by the semiconductor substrate cleaning and drying assembly, which will not be repeated here.

[0123] The semiconductor substrate 91 cleaning and drying process provided in the embodiment is implemented by using the semiconductor substrate processing equipment, and thus the technical advantages and effects achieved by the semiconductor substrate 91 cleaning and drying process include those achieved by the semiconductor substrate processing equipment, which will not be repeated here.

[0124] The semiconductor substrate 91 cleaning and drying process includes the following steps:

[0125] Standby state before cleaning of semiconductor substrate 91: liquid inlet pipe 212 slowly injects cleaning liquid into inner container 21, the cleaning liquid in inner container 21 is in full water slow overflow state, the overflow cleaning liquid enters overflow collection structure 221, and is discharged through outer tank drain pipe 222; the lifting height of lifting mechanism 8 is in standby position, the automatic opening and closing mechanism 3 is in closed state, the gas outlet 312 on the automatic opening and closing mechanism 3 blows gas into the drying container 2, the liquid level in the pressure supply system 4 is higher than the predetermined L liquid level, and the first gas pipe 42 fills gas into the pressure supply system 4;

[0126] Cleaning of semiconductor substrate 91: detecting that the liquid level of the cleaning liquid in the inner container 21 reaches the overflow state liquid level and the temperature at the outlet of the gas heating device 372 reaches the predetermined temperature, the gas outlet 312 on the automatic opening and closing mechanism 3 stops blowing gas into the drying container 2, the automatic opening and closing mechanism 3 is opened, the carrier 9 is placed on the lifting mechanism 8, the lifting mechanism 8 is lowered to the cleaning position, the semiconductor substrate 91 in the carrier 9 is immersed in the cleaning liquid in the inner container 21, and the automatic opening and closing mechanism 3 is closed; the liquid inlet pipe 212 quickly injects cleaning liquid into the inner container 21, the cleaning liquid in the inner container 21 is in full water fast overflow state, and the liquid inlet pipe 212 stops injecting cleaning liquid into the inner container 21;

[0127] Slow liquid discharge: the first valve 52 and the second pump 51 are opened, and the slow discharge flow path 5 starts slow liquid discharge; during the liquid level drops, when the liquid level reaches the first predetermined position detected by the liquid level meter 7, the first valve 52 and the second pump 51 are closed, a first predetermined amount of first solution is injected into the liquid distribution device 24, the first solution is applied to the flow guide structure 211 through the distribution port, and then is guided to the liquid surface in the inner container 21 through the flow guide structure 211 to form a first solution film; after stopping injecting the first solution into the liquid distribution device 24, the first valve 52 and the second pump 51 are opened, and the slow discharge flow path 5 continues slow liquid discharge; when the liquid level reaches the position for supplementing the first solution detected by the liquid level meter 7 each time, a second predetermined amount of first solution is injected into the liquid distribution device 24; when the liquid level reaches the second predetermined position detected by the liquid level meter 7, the first valve 52 and the second pump 51 are closed;

[0128] Fast liquid discharge: the inner tank drain pipe 213 quickly discharges the cleaning liquid, when the liquid level reaches the third predetermined position detected by the liquid level meter 7, the lifting mechanism 8 rises to the second intermediate position, and after the cleaning liquid in the inner container 21 is completely discharged, the inner tank drain pipe 213 stops discharging after a set time;

[0129] Semiconductor substrate 91 drying: the gas supply pipe 36 and the second gas pipe 37 provide gas to the gas outlet 312 on the automatic opening and closing mechanism 3, and at the same time, the gas heating device 372 is opened, the gas is heated, the hot gas sprayed by the gas outlet 312 dries the semiconductor substrate 91 and the carrier 9, after drying for a set time, the lifting mechanism 8 rises to the first intermediate position, the gas heating device 372 is closed, and the gas supply pipe 36 and the second gas pipe 37 continue to provide gas to the gas outlet 312 on the automatic opening and closing mechanism 3 at a small flow rate;

[0130] Process end: the gas supply pipe 36 and the second gas pipe 37 stop providing gas to the gas outlet 312 on the automatic opening and closing mechanism 3, the automatic opening and closing mechanism 3 is opened, the lifting mechanism 8 rises to the standby position, the liquid inlet pipe 212 slowly injects cleaning liquid into the inner container 21, the carrier 9 on the lifting mechanism 8 is removed, the automatic opening and closing mechanism 3 is closed, and when the liquid level of the cleaning liquid in the inner container 21 reaches the fourth predetermined position, the liquid inlet pipe 212 rapidly injects cleaning liquid into the inner container 21, and when the liquid level of the cleaning liquid in the inner container 21 reaches the fifth predetermined position, the liquid inlet pipe 212 slowly injects cleaning liquid into the inner container 21, so that the cleaning liquid in the inner container 21 is in a full water slow overflow state;

[0131] Wherein, the lifting height points of the lifting mechanism 8 from high to low are: standby position, first intermediate position, second intermediate position and cleaning position.

[0132] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A carrier support for a semiconductor substrate cleaning and drying assembly, the semiconductor substrate cleaning and drying assembly comprising a drying container (2) and a lifting mechanism (8) for raising and lowering a carrier (9) into the drying container (2), the lifting mechanism (8) comprising a support frame (815), characterized in that, The vehicle support (6) includes: a tray (61) disposed in the support frame (815) and used to support the vehicle (9) and a support plate (62) movably disposed on the tray (61). The support plate (62) is provided with a plurality of support portions (621) for supporting semiconductor substrates (91) inside the carrier (9) and a plurality of pillars (622) for supporting the support plate (62). The support portions (621) have contact structures, and the contact structures extend along the arrangement direction of the semiconductor substrates (91) inside the carrier (9) so that the contact structures make point contact or line contact with the semiconductor substrates (91) inside the carrier (9). The pallet (61) and the support plate (62) are configured to trigger relative movement between the pallet (61) and the support plate (62) in response to contacting the bottom of the drying container (2) during the descent of the carrier support (6) to lift the semiconductor substrate (91) inside the carrier (9); The support column (622) passes through the tray (61) and can abut against the bottom of the drying container (2) so that the support plate (62) and the tray (61) can move relative to each other to lift the semiconductor substrate (91) in the carrier (9); The pallet (61) is connected to a plurality of support elements (611) for supporting the vehicle (9), and the support elements (611) cause the vehicle (9) to tilt. After the relative movement between the pallet (61) and the support plate (62), the support plate (62) can cause the semiconductor substrate (91) inside the carrier (9) to form an inclined posture.

2. The vehicle support according to claim 1, characterized in that, The contact structure is located at the top of the support (621), which includes a flow guiding structure configured to guide liquid to flow in a direction away from the contact area between the semiconductor substrate (91) in the carrier (9) and the support (621) when the support (621) supports the semiconductor substrate (91) in the carrier (9).

3. The vehicle support according to claim 1, characterized in that, The upper side of the pallet (61) is connected to a plurality of positioning elements (612) that cooperate with the carrier (9).

4. The vehicle support according to claim 1, characterized in that, The tray (61) is provided with a first hollow hole (613).

5. The vehicle support according to claim 1, characterized in that, The support plate (62) is provided with a second hollow hole (623).

6. A semiconductor substrate cleaning and drying assembly, characterized in that, Includes the vehicle support (6) as described in any one of claims 1-5.

7. A semiconductor substrate processing apparatus, characterized in that, Includes the semiconductor substrate cleaning and drying assembly as described in claim 6.

8. A method for drying a semiconductor substrate, characterized in that, Implemented using the semiconductor substrate cleaning and drying assembly of claim 6, the semiconductor substrate drying method includes the following steps: The carrier (9) is placed on the tray (61) and immersed in the cleaning solution. The semiconductor substrate (91) is lifted by the relative movement of the support plate (62) and the tray (61), so that the contact structure between the semiconductor substrate (91) and the support part (621) forms point contact or line contact. The first solution is applied to the surface of the cleaning solution to form a first solution film. The liquid level of the cleaning solution is controlled to drop at a uniform speed, and the first solution is replenished during the drop.

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