A high-efficiency heat-dissipation silicon carbide power module

Abstract

The present application relates to the technical field of power module, particularly relates to a high-efficiency heat dissipation silicon carbide power module. The high-efficiency heat dissipation silicon carbide power module comprises a heat dissipation assembly, a module assembly and a shell. The heat dissipation assembly comprises a base, a groove, an inlet, an outlet, a heat dissipation substrate, a turbulence assembly, a first baffle and a second baffle. The turbulence assembly adopts an arc-shaped structure in which first turbulence teeth and second turbulence teeth are alternately arranged, a dynamic flow channel with a distance that is first contracted and then expanded or first expanded and then contracted is formed through opposite or opposite setting of openings, the cooling liquid is caused to generate turbulence and break the main flow direction in flowing, and the heat exchange efficiency is greatly improved. The first baffle and the second baffle are arranged in a stepped and reduced flow passage along the cooling liquid flow direction, so that the cooling liquid flow rate is gradually increased, and the problem of heat exchange efficiency decrease in subsequent areas caused by the increase of cooling liquid temperature is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of power modules, in particular to a high-efficiency heat dissipation silicon carbide power module. BACKGROUND

[0002] With the rapid development of power electronics technology, silicon carbide (SiC) power modules have been widely used in new energy vehicles, industrial frequency conversion and other fields due to their advantages of high temperature resistance, high breakdown field strength, low conduction loss, etc. However, the high frequency and high power characteristics of silicon carbide devices generate a large amount of heat during operation. If the heat is not dissipated in time, the high junction temperature of the module will lead to degradation or even failure of the device, which seriously restricts the reliability and service life of the module.

[0003] Most existing silicon carbide power modules use liquid cooling heat dissipation structure, but the heat dissipation design of the traditional liquid cooling module still has deficiencies: on the one hand, the cooling liquid flow channel is mostly a simple straight-through or conventional turbulence structure, and the generation of turbulent flow during the flow of the cooling liquid is insufficient, and the heat exchange efficiency with the heat dissipation substrate is limited; on the other hand, the cooling liquid gradually increases in temperature during the flow through the module due to the continuous heat exchange, and the subsequent heat dissipation capacity decreases, resulting in a difference in chip temperature difference near the inlet and outlet, and the cooling liquid near the outlet decreases in temperature and flow rate, and the heat exchange efficiency decreases significantly, which easily causes uneven junction temperature in different areas of the module and prominent local overheating problem. SUMMARY

[0004] Therefore, the present application provides a high-efficiency heat dissipation silicon carbide power module to solve the above technical problems.

[0005] The application discloses a high-efficiency heat-dissipation silicon carbide power module, which comprises a heat-dissipation assembly, a plurality of module assemblies arranged on the heat-dissipation assembly and a shell arranged on the module assemblies. The heat-dissipation assembly comprises a base, a groove arranged on the base, an inlet arranged at one end of the base, an outlet arranged at the other end of the base, a heat-dissipation substrate arranged on the base and a plurality of turbulence assemblies arranged on the heat-dissipation substrate. Two first baffles arranged on the heat-dissipation substrate and two second baffles arranged on the heat-dissipation substrate, the inlet and the outlet are arranged on opposite sides of the base, and the turbulence assemblies are arranged on the end surface of the heat-dissipation substrate facing the groove. The plurality of turbulence assemblies are arranged in columns, each turbulence assembly has the same structure, the arrangement directions of the plurality of turbulence assemblies are parallel to the arrangement directions of the inlet and the outlet, the turbulence assembly comprises a plurality of first turbulence teeth and a plurality of second turbulence teeth, the first turbulence teeth and the second turbulence teeth in the turbulence assembly are arranged in a straight line and the arrangement directions thereof are perpendicular to the arrangement directions of the inlet and the outlet, and the first turbulence teeth and the second turbulence teeth have an arc structure. The opening directions of the first turbulence teeth and the second turbulence teeth are opposite and perpendicular to the arrangement directions of the inlet and the outlet, and the first turbulence teeth and the second turbulence teeth in the turbulence assembly are arranged alternately. The adjacent turbulence assemblies are staggered, the arrangement directions of the two first baffles are perpendicular to the arrangement directions of the inlet and the outlet, the distance between the two first baffles close to the inlet is greater than the distance between the two first baffles close to the outlet, and the structure and arrangement direction of the second baffles are the same as those of the first baffles.

[0006] Further, the bottom of the groove is provided with a turbulence boss, one end of the turbulence boss is arranged in a spaced manner with the inlet and is connected with the bottom slope of the groove, the other end of the turbulence boss is arranged in a spaced manner with the outlet and is connected with the bottom slope of the groove, and the two sides of the turbulence boss are connected with the side walls of the groove.

[0007] Further, the maximum distance between the two second baffles is smaller than the minimum distance between the two first baffles.

[0008] Further, the first baffles and the second baffles are arranged in the arrangement direction of the inlet to the outlet in sequence, the first baffles and the second baffles are arranged on the end surface of the heat-dissipation substrate facing the groove and are arranged between the plurality of module assemblies respectively.

[0009] Further, the module assembly comprises a ceramic insulation layer, a lower copper layer arranged on the ceramic insulation layer, an upper copper layer arranged on the ceramic insulation layer, a plurality of silver paste layers arranged on the upper copper layer, a plurality of chips arranged on the ceramic insulation layer, a positive power terminal arranged on the ceramic insulation layer, a negative power terminal arranged on the ceramic insulation layer, a three-phase terminal arranged on the ceramic insulation layer, and a plurality of copper clips for connecting the chips.

[0010] Further, the ceramic insulation layer is located between the upper copper layer and the lower copper layer, the lower copper layer is located on the end surface of the ceramic insulation layer facing the heat dissipation substrate, the upper copper layer is located on the end surface away from the heat dissipation substrate and is provided with a channel, and the corners of the upper copper layer are provided with stress holes.

[0011] Further, the chips are symmetrically arranged on the upper copper layer, and the copper clips are used to connect the chips and the upper copper layer.

[0012] Further, the positive power terminal and the negative power terminal are located at the same end of the ceramic insulation layer, the three-phase terminal is located at the other end of the ceramic insulation layer, one end of the positive power terminal and the negative power terminal is connected with the upper copper layer, and the other end is inserted into the shell, one end of the three-phase terminal is connected with the upper copper layer, and the other end is inserted into the shell.

[0013] Further, the shell is provided with a through hole and two reinforcing ribs separating the through hole, the reinforcing ribs separate a plurality of module assemblies, and the positions of the second baffle and the first baffle correspond to the positions of the two reinforcing ribs, respectively.

[0014] Compared with the prior art, the high-efficiency heat dissipation silicon carbide power module provided by the application significantly improves the heat dissipation performance and reliability through the cooperative design of each component. The spoiler assembly on the heat dissipation substrate adopts an arc-shaped structure with the first spoiler teeth and the second spoiler teeth arranged alternately, and the opening is arranged facing or away from each other to form a dynamic flow channel with a distance that first contracts and then expands or first expands and then contracts, which promotes the generation of turbulent flow of the cooling liquid in the flow and breaks the main flow direction, greatly improving the heat exchange efficiency. The first baffle and the second baffle are arranged in stages along the cooling liquid flow direction to reduce the flow cross section, so that the cooling liquid flow rate gradually increases, which makes up for the problem of decreased heat exchange efficiency in the subsequent area due to the increase in cooling liquid temperature, avoids the high junction temperature of the module assembly near the outlet due to the decrease in flow rate and insufficient heat exchange, and realizes the uniformization of the module junction temperature distribution. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1A structural schematic diagram of a high-efficiency heat-dissipation silicon carbide power module provided by the application.

[0016] Figure 2 A high-efficiency heat-dissipation silicon carbide power module Figure 1 A high-efficiency heat-dissipation silicon carbide power module

[0017] Figure 3 A high-efficiency heat-dissipation silicon carbide power module Figure 1 A high-efficiency heat-dissipation silicon carbide power module

[0018] Figure 4 A high-efficiency heat-dissipation silicon carbide power module Figure 3 A high-efficiency heat-dissipation silicon carbide power module

[0019] Figure 5 A high-efficiency heat-dissipation silicon carbide power module Figure 1 A high-efficiency heat-dissipation silicon carbide power module

[0020] Figure 6 A high-efficiency heat-dissipation silicon carbide power module Figure 1 A high-efficiency heat-dissipation silicon carbide power module

[0021] Figure 7 A high-efficiency heat-dissipation silicon carbide power module Figure 1 A high-efficiency heat-dissipation silicon carbide power module

[0022] BRIEF DESCRIPTION OF DRAWINGS: heat-dissipation assembly 10, base 11, groove 12, inlet 13, outlet 14, heat-dissipation substrate 15, turbulence assembly 16, first turbulence tooth 161, second turbulence tooth 162, first baffle 17, second baffle 18, turbulence boss 19, module assembly 20, ceramic insulation layer 21, lower copper layer 22, upper copper layer 23, stress hole 231, silver paste layer 24, chip 25, positive power terminal 26, negative power terminal 27, three-phase terminal 28, copper clip 29, shell 30, through hole 31, reinforcing rib 32. DETAILED DESCRIPTION

[0023] The specific embodiments of the application are further described in detail below. It should be understood that the description of the embodiments of the application herein is not intended to limit the protection scope of the application.

[0024] As Figures 1 to 7As shown, it is the structural schematic diagram of the high-efficiency heat dissipation silicon carbide power module provided by the present application. The high-efficiency heat dissipation silicon carbide power module comprises a heat dissipation assembly 10, a plurality of module assemblies 20 arranged on the heat dissipation assembly 10, and a shell 30 arranged on the module assembly 20. It is conceivable that the high-efficiency heat dissipation silicon carbide power module also comprises other functional modules, such as connecting assemblies, mounting assemblies and the like, which are known to those skilled in the art and will not be described here.

[0025] The heat dissipation assembly 10 comprises a base 11, a groove 12 arranged on the base 11, an inlet 13 arranged at one end of the base 11, an outlet 14 arranged at the other end of the base 11, a heat dissipation substrate 15 arranged on the base 11, and a plurality of turbulence assemblies 16 arranged on the heat dissipation substrate 15, two first baffles 17 arranged on the heat dissipation substrate 15, and two second baffles 18 arranged on the heat dissipation substrate 15.

[0026] The base 11 and the heat dissipation substrate 15 are used to carry the above-mentioned various functional modules. The groove 12 is opened on the end face of the base 11 facing the heat dissipation substrate 15. The groove 12 is used to accommodate the turbulence assembly 16 and the cooling liquid. The bottom of the groove 12 is provided with a turbulence boss 19.

[0027] The inlet 13 penetrates through the side wall of the base 11 at one end and communicates with the groove 12 at the other end, and the outlet 14 penetrates through the side wall of the base 11 at one end and communicates with the groove 12 at the other end. The inlet 13 and the outlet 14 are respectively located on opposite sides of the base 11, and the inlet 13 and the outlet 14 are respectively used as the liquid inlet and the liquid outlet of the cooling liquid. One end of the turbulence boss 19 is arranged in a spaced manner with the inlet 13 and connected with the bottom slope of the groove 12, the other end of the turbulence boss 19 is arranged in a spaced manner with the outlet 14 and connected with the bottom slope of the groove 12, and the two sides of the turbulence boss 19 are connected with the side wall of the groove 12, so that the turbulence boss 19 is located between the inlet 13 and the outlet 14, so that when the cooling liquid enters, it will accumulate on one side of the turbulence boss 19, and then gradually flow onto the surface of the turbulence boss 19 through the slope compression flow passage cross-sectional area, and then speed up and pressurize at the inlet. When the cooling liquid flows out at the other end of the turbulence boss 19, the flow passage cross-sectional area is expanded through the slope, so that the high-speed fluid is slowed down and depressurized at the outlet before flowing out, reducing the impact and flowing out more gently.

[0028] The heat dissipation substrate 15 is fixed on the base 11 by fasteners and seals the groove 12, thereby covering the groove 12 to form a channel for the cooling liquid to flow through.

[0029] The turbulence component 16 is arranged on the end surface of the heat dissipation substrate 15 facing the groove 12, and is located in the groove 12 and immersed in the cooling liquid, thereby exchanging heat with the flowing cooling liquid to take away the heat of the chip.

[0030] The plurality of turbulence components 16 arranged in columns, each of which has the same structure, and the arrangement direction of the plurality of turbulence components 16 is parallel to the arrangement direction of the inlet 13 and the outlet 14, so that the flowing cooling liquid flows through the plurality of columns of turbulence components 16 in turn.

[0031] The turbulence component 16 includes a plurality of first turbulence teeth 161 and a plurality of second turbulence teeth 162.

[0032] The first turbulence teeth 161 and the second turbulence teeth 162 in the turbulence component 16 are arranged in a straight line and the arrangement direction is perpendicular to the arrangement direction of the inlet 13 and the outlet 14.

[0033] The first turbulence teeth 161 and the second turbulence teeth 162 have an arc structure, and the opening direction of the first turbulence teeth 161 and the second turbulence teeth 162 is opposite and perpendicular to the arrangement direction of the inlet 13 and the outlet 14.

[0034] The first turbulence teeth 161 and the second turbulence teeth 162 in the turbulence component 16 are arranged alternately, so that each column of the first turbulence teeth 161 has two second turbulence teeth 162 adjacent above and below, and each column of the second turbulence teeth 162 has two first turbulence teeth 161 adjacent above and below, thereby forming two different channels.

[0035] When the openings of the first turbulence teeth 161 and the second turbulence teeth 162 are arranged opposite to each other, the inner arcs of the first turbulence teeth 161 and the second turbulence teeth 162 are arranged opposite to each other, and the distance between the first turbulence teeth 161 and the second turbulence teeth 162 presents a change trend of first contraction, then expansion, and finally contraction, so that the cooling liquid flow separates at the expansion section and compresses at the contraction section due to the change of the distance between the first turbulence teeth 161 and the second turbulence teeth 162, thereby generating turbulent flow and improving heat exchange efficiency.

[0036] When the openings of the first turbulence teeth 161 and the second turbulence teeth 162 are arranged opposite to each other, the outer arcs of the first turbulence teeth 161 and the second turbulence teeth 162 are arranged opposite to each other, and the distance between the first turbulence teeth 161 and the second turbulence teeth 162 presents a change trend of first expansion, then contraction, and finally expansion, and since the distance between the first turbulence teeth 161 and the second turbulence teeth 162 gradually decreases, the cross-sectional area of the flow passage is compressed, so that the flow velocity of the cooling liquid is improved, thereby improving the heat exchange efficiency.

[0037] The adjacent turbulence components 16 are staggered, so that the turbulence teeth in one turbulence component 16 are staggered between two turbulence teeth in the adjacent turbulence component 16, and form a staggered layout. When the cooling liquid passes through the first turbulence component 16, it is divided by the first turbulence teeth 161 and the second turbulence teeth 162 in the turbulence component 16, and the divided cooling liquid is again divided by the first turbulence teeth 161 and the second turbulence teeth 162 in the second turbulence component 16 when it passes through the second turbulence component 16 due to the staggered distribution, and the process is repeated, so that the cooling liquid is further divided, the main flow direction is broken, and the turbulence and heat exchange efficiency is maximized.

[0038] The arrangement direction of the two first baffles 17 is perpendicular to the arrangement direction of the inlet 13 and the outlet 14, and the distance between the two ends of the two first baffles 17 near the inlet 13 is greater than the distance between the two ends of the two first baffles 17 near the outlet 14, so that the distance between the two first baffles 17 in the flow direction of the cooling liquid gradually decreases, thereby reducing the flow cross section to increase the flow rate of the cooling liquid.

[0039] The structure and arrangement direction of the second baffle 18 are the same as those of the first baffle 17, and the difference is that the maximum distance between the two second baffles 18 is less than the minimum distance between the two first baffles 17, so that the flow cross section between the two second baffles 18 is smaller than that between the two first baffles 17, and the flow cross section is further reduced to increase the flow rate of the cooling liquid.

[0040] The first baffle 17 and the second baffle 18 are arranged on the end face of the heat dissipation base plate 15 facing the groove 12, and are located between the plurality of module assemblies 20 respectively. The first baffle 17 and the second baffle 18 are arranged in sequence in the arrangement direction from the inlet 13 to the outlet 14, so that the flow rate gradient of the cooling liquid is improved at the boundary of the plurality of module assemblies 20 through two-stage baffles. The heat exchange efficiency is related to the flow rate and temperature of the cooling liquid. When the cooling liquid just enters the spoiler assembly 16, the heat exchange efficiency is guaranteed because the temperature of the cooling liquid is still low at this time. When the cooling liquid continues to flow and exchange heat, the temperature of the cooling liquid gradually increases, resulting in a decrease in the heat exchange efficiency of the subsequent area. At this time, in order to guarantee the heat exchange efficiency of the subsequent module assembly area, the flow passage cross section is preliminarily compressed through the two first baffles 17, so as to enhance the flow rate and improve the heat exchange efficiency of the subsequent area. When the cooling liquid flows through the two second baffles 18, the flow rate is increased again. In this way, the flow rate of the cooling liquid is gradually increased, which compensates for the decrease in the heat exchange efficiency caused by the increase in the temperature of the cooling liquid, avoids the problem of poor heat exchange effect near the outlet, and makes the module junction temperature distribution more uniform.

[0041] In the embodiment, the module assembly 20 has three. The three module assemblies 20 have the same structure, and each module assembly 20 includes a ceramic insulating layer 21, a lower copper layer 22 arranged on the ceramic insulating layer 21, an upper copper layer 23 arranged on the ceramic insulating layer 21, a plurality of silver paste layers 24 arranged on the upper copper layer 23, a plurality of chips 25 arranged on the ceramic insulating layer 21, a positive power terminal 26 arranged on the ceramic insulating layer 21, a negative power terminal 27 arranged on the ceramic insulating layer 21, a three-phase terminal 28 arranged on the ceramic insulating layer 21, and a plurality of copper clips 29 connected to the chips 25.

[0042] The ceramic insulating layer 21 is located between the upper copper layer 23 and the lower copper layer 22. The lower copper layer 22 is located on the end face of the ceramic insulating layer 21 facing the heat dissipation base plate 15 and is welded to the heat dissipation base plate 15 through a tin-silver-copper solder layer, so that heat is transmitted downward from the chip 25. The upper copper layer 23 located away from the heat dissipation base plate 15 is used to arrange various electronic components and is provided with corresponding channels to separate the upper copper layer 23 into different areas as conductive layers. The corner position of the upper copper layer 23 is provided with a stress hole 231 for providing deformation buffering and allowing the copper layer to expand into the hole when it expands slightly, rather than the ceramic insulating layer 21, to avoid delamination or cracking.

[0043] The chips 25 are symmetrically arranged on the upper copper layer 23. In this embodiment, the upper bridge and the lower bridge of the module each have six chips 25, and the six chips 25 are symmetrically arranged in half. The symmetric arrangement ensures that the loop length of each chip 25 is consistent, effectively reduces the difference in stray inductance of the loop of each chip 25, and ensures the consistency of the switching off of each chip 25. The chip 25 itself should be a prior art, and its structure and working principle will not be described here.

[0044] The positive power terminal 26 and the negative power terminal 27 are located at the same end of the ceramic insulation layer 21, and the three-phase terminal 28 is located at the other end of the ceramic insulation layer 21. One end of the positive power terminal 26 and the negative power terminal 27 is connected with the upper copper layer 23, and the other end is inserted into the shell 30. One end of the three-phase terminal 28 is connected with the upper copper layer 23, and the other end is inserted into the shell 30. The negative power terminal 27 and the positive power terminal 26 are respectively used for the outflow and inflow of current, and the three-phase terminal 28 is used for the output of three-phase current.

[0045] The copper clip 29 is used to connect the chip 25 and the upper copper layer 23 to realize the communication of the circuit in the module assembly 20. The communication and flow of the circuit of the module assembly 20 should be a prior art, and will not be described here. Due to the symmetric arrangement of the chip 25, the copper clip 29 also adopts symmetric arrangement, which can effectively reduce the stray inductance of the connection part of each chip.

[0046] The shell 30 is provided with a through hole 31 and two reinforcing ribs 32 separating the through hole 31. The reinforcing ribs 32 are used to improve the strength of the shell 30, and at the same time separate a plurality of module assemblies 20 to avoid mutual interference. The positions of the second baffle 18 and the first baffle 17 respectively correspond to the positions of the two reinforcing ribs 32, thereby corresponding to the separation positions of a plurality of module assemblies 20.

[0047] The through hole 31 is filled with a sealing material such as silicone or liquid epoxy resin and is cured and shaped, thereby sealing the electronic devices in the module assembly 20, having higher mechanical strength and excellent insulation.

[0048] Compared with the prior art, the high-efficiency heat dissipation silicon carbide power module provided by the application significantly improves the heat dissipation performance and reliability through the cooperative design of components, the spoiler components 16 on the heat dissipation substrate 15 adopt the arc-shaped structure in which the first spoiler teeth 161 and the second spoiler teeth 162 are alternately arranged, the opening is oppositely or oppositely arranged to form a dynamic flow channel with a distance that is first contracted and then expanded or first expanded and then contracted, so as to promote the turbulent flow of the cooling liquid in the flow and break the main flow direction, and greatly improve the heat exchange efficiency. The first baffle 17 and the second baffle 18 are gradually reduced in flow passage section along the cooling liquid flow direction, so that the cooling liquid flow rate is gradually increased, the problem of heat exchange efficiency decrease in the subsequent area caused by the temperature rise of the cooling liquid is compensated, the junction temperature of the module components 20 near the outlet is avoided to be too high due to the low flow rate and insufficient heat exchange, and the uniformization of the module junction temperature distribution is realized.

[0049] The above is only the preferred embodiment of the application, and is not used to limit the protection scope of the application, and any modification, equivalent replacement or improvement within the spirit of the application is covered in the claim scope of the application.

Claims

1. A high-efficiency heat-dissipating silicon carbide power module, characterized in that: The high-efficiency heat dissipation silicon carbide power module includes a heat dissipation assembly, multiple module components arranged on the heat dissipation assembly, and a housing on the module components. The heat dissipation assembly includes a base, a groove on the base, an inlet at one end of the base, an outlet at the other end of the base, a heat dissipation substrate on the base, multiple flow-deflecting components on the heat dissipation substrate, two first baffles on the heat dissipation substrate, and two second baffles on the heat dissipation substrate. The inlet and the outlet are located on opposite sides of the base. The flow-deflecting components are disposed on the end face of the heat dissipation substrate facing the groove. The multiple flow-deflecting components are arranged in a row, each having the same structure. The arrangement direction of the multiple flow-deflecting components is parallel to the arrangement direction of the inlet and the outlet. The flow-deflecting assembly includes a plurality of first flow-deflecting teeth and a plurality of second flow-deflecting teeth. The first and second flow-deflecting teeth in the flow-deflecting assembly are arranged in a straight line at intervals and the arrangement direction is perpendicular to the arrangement direction of the inlet and the outlet. The first and second flow-deflecting teeth have an arc-shaped structure. The opening directions of the first and second flow-deflecting teeth are opposite and perpendicular to the arrangement direction of the inlet and the outlet. The first and second flow-deflecting teeth in the flow-deflecting assembly are arranged alternately, and adjacent flow-deflecting assemblies are staggered. The arrangement direction of the two first baffles is perpendicular to the arrangement direction of the inlet and the outlet. The distance between the ends of the two first baffles near the inlet is greater than the distance between the ends of the two first baffles near the outlet. The structure and arrangement direction of the second baffle are the same as those of the first baffle.

2. The high-efficiency heat dissipation silicon carbide power module as described in claim 1, characterized in that: A flow-dispersing protrusion is provided at the bottom of the groove. One end of the flow-dispersing protrusion is spaced apart from the inlet and connected to the bottom slope of the groove. The other end of the flow-dispersing protrusion is spaced apart from the outlet and connected to the bottom slope of the groove. Both sides of the flow-dispersing protrusion are connected to the sidewalls of the groove.

3. The high-efficiency heat dissipation silicon carbide power module as described in claim 1, characterized in that: The maximum distance between the two second baffles is less than the minimum distance between the two first baffles.

4. The high-efficiency heat dissipation silicon carbide power module as described in claim 1, characterized in that: The first baffle and the second baffle are arranged sequentially in the direction from the inlet to the outlet. The first baffle and the second baffle are disposed on the end face of the heat dissipation substrate facing the groove and are respectively located between the plurality of module components.

5. The high-efficiency heat dissipation silicon carbide power module as described in claim 1, characterized in that: The module assembly includes a ceramic insulating layer, a lower copper layer disposed on the ceramic insulating layer, an upper copper layer disposed on the ceramic insulating layer, multiple silver paste layers disposed on the upper copper layer, multiple chips disposed on the ceramic insulating layer, a positive power terminal disposed on the ceramic insulating layer, a negative power terminal disposed on the ceramic insulating layer, a three-phase terminal disposed on the ceramic insulating layer, and multiple copper clips connecting the chips.

6. The high-efficiency heat dissipation silicon carbide power module as described in claim 5, characterized in that: The ceramic insulating layer is located between the upper copper layer and the lower copper layer. The lower copper layer is located on the end face of the ceramic insulating layer facing the heat dissipation substrate, and the upper copper layer is located on the end face away from the heat dissipation substrate and has channels. Stress holes are provided at the corners of the upper copper layer.

7. The high-efficiency heat dissipation silicon carbide power module as described in claim 5, characterized in that: The chips are symmetrically distributed on the upper copper layer, and the copper clip is used to connect the chips and the upper copper layer. The chips are symmetrically distributed.

8. The high-efficiency heat dissipation silicon carbide power module as described in claim 5, characterized in that: The positive power terminal and the negative power terminal are located at the same end of the ceramic insulating layer, and the three-phase terminal is located at the other end of the ceramic insulating layer. One end of the positive power terminal and the negative power terminal is connected to the upper copper layer, and the other end is inserted into the outer casing. One end of the three-phase terminal is connected to the upper copper layer, and the other end is inserted into the outer casing.

9. The high-efficiency heat dissipation silicon carbide power module as described in claim 1, characterized in that: The outer casing is provided with a through hole and two reinforcing ribs that separate the through hole. The reinforcing ribs separate multiple module components. The positions of the second baffle and the first baffle correspond to the positions of the two reinforcing ribs, respectively.

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