Full-bridge power module lead frame and package

Abstract

The invention provides a full-bridge power module lead frame and packaging, and relates to the technical field of semiconductor packaging. The full-bridge power module lead frame isolates the control side from the power side in a first direction through the power frame. Meanwhile, a large-area first base island is used as a carrier on the control side, three power driving devices are attached in a side-by-side symmetrical arrangement mode, and inner pin reserved areas with a plurality of inner pins are arranged on the side, away from the power supply frame, of the first base island for the three power driving devices correspondingly; the path of the inner pin is short and is not in contact with the first base island, so that the function of each power driving device is led out, and a control signal can be transmitted to the power driving device at a high speed in a minimum electrical interference mode. Besides, in the second direction, each inner pin reserved area and a lead finger reserved area with a plurality of lead fingers on the first base island are arranged in a staggered manner, so that the stability and the reliability of the mechanical structure are further improved under the condition that the electrical transmission of the control side is not influenced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor packaging, in particular to a full-bridge power module lead frame and packaging. BACKGROUND

[0002] For a three-phase motor, it can generally be driven to work in forward rotation or reverse rotation through the cooperation of a driving circuit and a three-phase full-bridge circuit. In order to reduce the size of the circuit and reduce signal delay, the three-phase full-bridge circuit and the driving circuit are usually integrated into a small-sized packaging. However, as the packaging size becomes smaller and smaller, electrical interference is prone to occur between strong current and weak current transmission inside the packaging. In order to reduce the electrical interference received by the weak current input on the control side of the driving circuit, the area where the inner pins of the lead frame are connected with the outer pins is usually provided with independent inner pins, and each independent inner pin is electrically connected to the driving circuit on the base island through a lead to reduce the signal transmission path and thus reduce the interference received in the transmission path.

[0003] However, such a setting causes each pin on the control side of the lead frame to exist independently in the form of an island, and the large base island of the driving device is insufficiently mechanically supported, so that the stability and reliability of the mechanical structure are low, and a large mechanical stress generated on the control side due to environmental factors such as temperature or vibration is prone to occur, which eventually leads to the interruption of the electrical connection relationship on the control side. SUMMARY

[0004] The present application provides a full-bridge power module lead frame, which aims to solve the technical problem of how to make the hardware structure of the control side of the power module more reliable without affecting the electrical function.

[0005] To achieve the above-mentioned purpose, the present application provides a full-bridge power module lead frame, which comprises:

[0006] a power side, a control side, and a power supply frame;

[0007] In a first direction, the power side and the control side are isolated by the power supply frame;

[0008] The control side comprises:

[0009] a first base island provided with three power driving devices, each of which is symmetrically arranged side by side;

[0010] three inner pin reserved areas, each of which is arranged on a side of the first base island away from the power supply frame, and in a second direction, both ends of each of the inner pin reserved areas exist corresponding lead finger reserved areas on the first base island, and each lead finger in each of the lead finger reserved areas provides external electrical connection and mechanical support for the control side.

[0011] In an embodiment, each of the inner pins reserved areas is provided with a plurality of inner pins, and each of the inner pins has the same length and is arranged side by side;

[0012] Each of the inner pins in the same inner pin reserved area is connected to the bonding area of the corresponding power driving device on the first base island through a lead wire.

[0013] In an embodiment, the power side comprises six second base islands each provided with a power switch device;

[0014] The second base islands are divided into upper bridge base islands and lower bridge base islands;

[0015] Each of the upper bridge base islands and each of the lower bridge base islands are arranged side by side and staggered, and two adjacent upper bridge base islands are connected through a connecting rib near one side of the power supply frame, and a reserved gap is provided between each of the lower bridge base islands and the adjacent upper bridge base island.

[0016] In an embodiment, an inner pin is provided between each of the upper bridge base islands and the corresponding lower bridge base island;

[0017] The inner pin is connected to the bonding area of the corresponding power driving device on the first base island through a corresponding lead wire, so that two power switch devices in a group of the upper bridge base islands and the lower bridge base islands form a half-bridge structure, and the inner pin provides a floating power supply for the half-bridge structure.

[0018] In an embodiment, a plurality of glue locking holes are provided on the first base island, the power supply frame and each of the second base islands;

[0019] The glue locking hole is in any one of a circular shape or an elliptical shape, and is used as a flow channel of plastic sealing material during a plastic sealing process and is finally filled with plastic sealing material to improve the bonding force between the plastic sealing material and the full-bridge power module lead frame.

[0020] In an embodiment, the first base island and each of the second base islands are located on the same plane, and the area below the first base island and each of the second base islands is subjected to a half-etching or stamping process, thereby forming a corresponding preset pattern area;

[0021] The preset pattern area comprises a plurality of preset patterns arranged in a matrix.

[0022] In an embodiment, when the half-etching process is used, the preset pattern is in a hemispherical shape, and the depth of the preset pattern is half of the thickness of the lead frame;

[0023] Or, when the stamping process is used, the preset pattern is in a conical shape, and the depth of the preset pattern is 1 / 10 of the thickness of the lead frame.

[0024] In an embodiment, the power switching device comprises a single MOS tube;

[0025] Or, the power switching device comprises a combination of an IGBT tube and a fast recovery diode.

[0026] In an embodiment, in the first direction, the edge of the plastic package body close to the control side has a plurality of outer pins in full pin distribution, and the pin spacing between any two adjacent outer pins is the same;

[0027] In the first direction, the edge of the plastic package body close to the power side has a plurality of outer pins in asymmetric distribution, and each outer pin is unevenly spaced;

[0028] The alignment reference of the two groups of outer pins is the same, and the pin spacing between any two adjacent outer pins of different voltage output types is not less than 1.8mm;

[0029] Wherein, the outer pin is extended to the outside of the plastic package body by any one of the lead fingers or inner pins.

[0030] In addition, to achieve the above-mentioned purpose, the embodiment of the application further provides a full-bridge power module package, which adopts the full-bridge power module lead frame as described above.

[0031] The embodiment of the application provides a full-bridge power module lead frame and package, the full-bridge power module lead frame comprises a power side, a control side and a power supply frame; in a first direction, the power side and the control side are isolated by the power supply frame; the control side comprises a first base island provided with three power drive devices, and each power drive device is symmetrically arranged side by side; three inner pin reserved areas, each inner pin reserved area is arranged on the side of the first base island away from the power supply frame, and in a second direction, both ends of each inner pin reserved area exist corresponding lead finger reserved areas on the first base island, and each lead finger in each lead finger reserved area provides external electrical connection and mechanical support for the control side.

[0032] The control side and the power side are distinguished and isolated in the first direction by the power supply frame, and the weak current control part and the strong current driving part are electrically isolated in the whole. Meanwhile, on the control side, a large-area first base island is used as a carrier, three power driving devices are arranged by side-by-side symmetric arrangement, and a plurality of inner pin reserved areas with inner pins are arranged for the three power driving devices on the side of the first base island away from the power supply frame. The inner pin path is short and does not contact the first base island, so as to ensure that the function leads of the power driving devices can be extracted and the control signals can be transmitted to the power driving devices at high speed in the way of minimum electrical interference. In addition, in the second direction, each inner pin reserved area is staggered with a plurality of pin finger reserved areas with pin fingers on the first base island, so as to further improve the mechanical structural stability and reliability without affecting the electrical transmission of the control side. BRIEF DESCRIPTION OF DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor based on the drawings shown.

[0034] Figure 1 It is a plane structure schematic diagram of the first embodiment of the full-bridge power module lead frame of the present application.

[0035] Figure 2 It is a cross-sectional schematic diagram of the first embodiment of the full-bridge power module lead frame of the present application.

[0036] Figure 3 It is an electrical connection schematic diagram of the first embodiment of the full-bridge power module lead frame of the present application.

[0037] Figure 4 It is a plane structure schematic diagram of the second embodiment of the full-bridge power module lead frame of the present application.

[0038] Figure 5 It is a cross-sectional schematic diagram of the second embodiment of the full-bridge power module lead frame of the present application.

[0039] Figure 6 It is an electrical connection schematic diagram of the second embodiment of the full-bridge power module lead frame of the present application.

[0040] Figure 7 It is a plane structure schematic diagram of the third embodiment of the full-bridge power module lead frame of the present application.

[0041] Figure 8 It is a structure schematic diagram of a preset pattern.

[0042] Figure 9 Another structural schematic diagram of the preset pattern;

[0043] Figure 10 A top view of a package shape of a third embodiment of a full-bridge power module lead frame of the application.

[0044] The implementation, functional features and advantages of the application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0045] It should be understood that the specific embodiments described herein are merely intended to explain the application and are not intended to limit the application.

[0046] The application provides a full-bridge power module lead frame, referring to Figure 1 , Figure 2 and Figure 3 , the full-bridge power module lead frame comprises:

[0047] a power side, a control side and a power supply frame 7;

[0048] in a first direction, the power side and the control side are isolated by the power supply frame 7;

[0049] the control side comprises:

[0050] a first base island 15 provided with three power driving devices 2, each of the power driving devices 2 is symmetrically arranged side by side;

[0051] three inner pin reserved areas, each of the inner pin reserved areas is arranged on a side of the first base island 15 away from the power supply frame 7, and in a second direction, both ends of each of the inner pin reserved areas are provided with a corresponding lead finger reserved area on the first base island 15, and each lead finger 11 in each of the lead finger reserved areas provides external electrical connection and mechanical support for the control side.

[0052] It should be understood that in the embodiment, as shown in Figure 1 , the vertical direction in Figure 1 can be taken as the first direction, and correspondingly, Figure 1 the horizontal direction in is the second direction. Based on this, in the first direction, the power supply frame 7 of the full-bridge power module lead frame is in the shape of a wide U, the area above the U is arranged as the control side for inputting weak current type control signals (generally connected with a control chip or a controller), and the area below the U is arranged as the power side for outputting strong current type power signals (generally connected with a load such as a three-phase motor).

[0053] It is easy to understand that please refer to Figure 3It is understood that, in the embodiment, the power side is provided with three-phase upper and lower bridge circuits, and the control side is provided with three power driving devices 2. Based on the electrical connection relationship between the power side and the control side, a three-phase full-bridge circuit can be formed. Each power driving device 2 is used to drive a corresponding set of upper and lower bridge circuits to work, that is, to drive the power switching device 3 in the upper and lower bridge circuits to switch the on-off state.

[0054] It should be noted that, as shown in Figure 1 , the power supply frame 7 refers to a wide U-shaped frame structure for providing power supply for the entire power module. In the application circuit, a common mode choke, Y capacitor, multi-stage LC filter and other high-frequency filter structures can be provided for filtering high-frequency noise. In the embodiment, in the first direction, the control side above and the power side below are both provided with a reserved gap for ensuring the safety creepage distance. Such arrangement makes the distance between the control side and the power side as far as possible, so that the high-frequency noise cannot be transmitted to the other side.

[0055] As can be easily understood, as shown in Figure 1 , in the embodiment, the first base island 15 refers to a large-area base island. In the first direction, the first part of the first base island 15 close to the power supply frame 7 is used to place three power driving devices 2, and the second part away from the power supply frame 7 is used to set a plurality of lead finger reserved areas. Among them, the lead finger reserved area refers to an area for setting a plurality of lead fingers 11, and the corresponding lead finger 11 inside the lead finger reserved area has an electrical connection relationship with the corresponding power driving device 2. In addition, each lead finger 11 in the lead finger reserved area can extend from the first base island 15 to the outside of the plastic package 16, thereby forming an external lead 18. That is, it can be considered that the external lead 18 formed by the extension of any one of the lead fingers 11 in the lead finger reserved area has a mechanical connection relationship with the first base island 15.

[0056] It should be noted that, in the embodiment, in the first part of the first base island 15, one of the power driving devices 2 can be arranged at the center, and the other two can be arranged on both sides of the central power driving device 2 at the same distance from the center, so that the three power driving devices 2 are arranged in parallel and symmetrically. In this way, the respective signal lines corresponding to the three power driving devices 2 can also be arranged in a parallel and symmetric manner, which can not only reduce the wiring interference between each power driving device 2, but also ensure higher synchronization of the signal transmission and reception of the three power driving devices 2.

[0057] As can be easily understood, please refer to Figure 1 and Figure 3, for setting a plurality of inner pins 10, which do not have a direct mechanical connection relationship with the first base island 15, but are electrically connected to the power driving devices 2 on the first base island 15 through the lead wires 20. In the embodiment, on the side of the first base island 15 away from the power supply frame 7, three inner pin reserved areas are also provided, and each inner pin 10 in each inner pin reserved area is connected to a corresponding power driving device 2 on the first base island 15 through a corresponding lead wire. In addition, each inner pin 10 in the inner pin reserved area can extend directly to the outside of the plastic package 16, and can also form an outer pin 18, that is, the outer pin 18 formed by the outer extension of any one inner pin 10 in the inner pin reserved area does not have a direct mechanical connection relationship with the first base island 15.

[0058] It should be noted that the lead fingers 11 are connected to the first base island 15, but the actual length is relatively long, mainly serving the function of mechanical support; the inner pins 10 are not connected to the first base island 15, mainly serving the function of ensuring the function of driving devices to be led out and high-speed signal transmission. Therefore, in the embodiment, the number of inner pins 10 provided in each inner pin reserved area is relatively large, and usually the individual outer pins 18 farthest from the corresponding power driving device 2 and the corresponding power driving device 2 are set as a lead finger reserved area, and the majority of outer pins 18 close to the corresponding power driving device 2 are set as an inner pin reserved area.

[0059] It should be noted that, as shown in Figure 1 In the embodiment, each inner pin reserved area can also be symmetrically arranged side by side corresponding to each power driving device 2, so that in the first direction, the approximate position of any one power driving device 2 and one inner pin reserved area is in the same column, and in the second direction, each inner pin reserved area is in the same row. Since the two adjacent power driving devices 2 have the same spacing, the same spacing also exists between the two adjacent inner pin reserved areas.

[0060] It is easy to understand that in the embodiment, in the second direction, one lead finger reserved area can be correspondingly arranged between every two inner pin reserved areas, and two corresponding lead finger reserved areas are arranged on the left and right sides of the three power driving devices 2, so that the control side forms a structure composed of four lead finger reserved areas and three inner pin reserved areas.

[0061] In the specific implementation, in the first direction, the power side is isolated from the control side by the power supply frame 7, and the inner pin reserved areas for forming the outer pins 18 and the lead finger reserved areas are arranged away from the power supply frame 7 and the power side, so that the distance between the control side and the power side is as far as possible, and the electrical interference between the power side for transmitting strong electricity and the control side for transmitting weak electricity is greatly reduced. In the second direction, the outer pins 18 of the control side are formed by extending the inner pins 10 and the lead fingers 11 outward from the plastic package 16. Since the lead fingers 11 have mechanical connection structures with the first base island 15, based on the staggered arrangement mode, the lead fingers 11 in the lead finger reserved areas can provide uniform mechanical support to the entire control side. The inner pins 10 can form the shortest and mutually non-interfering electrical connection relationship with the corresponding power driving devices 2 on the first base island 15 through the respective lead wires 20, so as to ensure that the externally transmitted weak electric type control signals can be synchronously transmitted to the power driving devices 2, and the structure design will not cause great electrical interference to the control side.

[0062] Further, in the embodiment, a plurality of inner pins 10 are arranged in each of the inner pin reserved areas, and the lengths of the inner pins 10 are the same and arranged side by side.

[0063] The inner pins 10 in the same inner pin reserved area are respectively connected to the bonding areas of the corresponding power driving devices 2 on the first base island 15 through the lead wires 20.

[0064] It should be noted that, for a better understanding, please refer to Figure 1 In the embodiment, for any inner pin reserved area, a plurality of inner pins 10 are arranged side by side in the inner pin reserved area, and the lengths of the inner pins 10 are the same. Each inner pin 10 can be connected to the bonding area of the corresponding power driving device 2 on the first base island 15 through the corresponding lead wire 20, so that the corresponding pin of each power driving device 2 establishes an electrical connection relationship with the corresponding one or more outer pins 18. In this way, the synchronism of the high-speed signal transmission of the inner pins 10 in the same inner pin reserved area can be ensured.

[0065] The embodiment of the present application provides a full-bridge power module lead frame, the full-bridge power module lead frame distinguishes and isolates the control side from the power side in the first direction through the power supply frame, and electrically isolates the weak-current control part from the strong-current driving part as a whole. Meanwhile, a large-area first base island is used as a carrier on the control side, three power driving devices are attached in a side-by-side symmetrical manner, and a plurality of inner pin reserved areas with inner pins are arranged for the three power driving devices on the side, away from the power supply frame, of the first base island, the inner pin path is short and does not contact the first base island, so that the functional leads of the power driving devices can be extracted, and the control signals can be transmitted to the power driving devices at a high speed in a manner that electrical interference is minimized. In addition, in the second direction, each inner pin reserved area is staggered with a plurality of lead finger reserved areas with lead fingers on the first base island, so that the mechanical structural stability and reliability are further improved without affecting the electrical transmission of the control side.

[0066] Based on the first embodiment of the full-bridge power module lead frame of the present application, in the second embodiment of the full-bridge power module lead frame of the present application, the same or similar contents as the above embodiment one can be referred to the above introduction, and will not be described in detail. On this basis, please refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 and Figure 6 In the embodiment, the power side comprises six second base islands respectively provided with power switching devices 3.

[0067] The second base islands are divided into upper bridge base islands 8 and lower bridge base islands 9.

[0068] Each of the upper bridge base islands 8 and the lower bridge base islands 9 are arranged side by side and staggered, and two adjacent upper bridge base islands 8 are connected through a connecting rib 13 on the side close to the power supply frame 7, and a reserved gap is arranged between each lower bridge base island 9 and the adjacent upper bridge base island 8.

[0069] It should be noted that the power switching device 3 refers to a single electronic element or a combination of a plurality of electronic elements which can switch the on-off state to control the current output. In the embodiment, the power side is provided with six second base islands, and a corresponding power switching device 3 is attached on each second base island, and the model and physical characteristics of each power switching device 3 can be the same.

[0070] It is easy to understand that the upper bridge base island 8 refers to the base island of the power switch device 3 attached to form the upper half bridge of the half bridge circuit, and the lower bridge base island 9 refers to the base island of the power switch device 3 attached to form the lower half bridge of the half bridge circuit. In the embodiment, one of the second base islands can be used as the upper bridge base island 8, and the other adjacent second base island can be used as the lower bridge base island 9 to form a half bridge structure, and the six second base islands can form three groups of half bridge structures in the arrangement mode. At this time, in the second direction, the three groups of half bridge structures can be placed side by side in sequence, so that each upper bridge base island 8 and each lower bridge base island 9 are staggered in the same row. Since each upper bridge base island 8 needs the same high-voltage side power supply voltage, each two adjacent upper bridge base islands 8 can be electrically connected by the connecting rib 13 on the side close to the power supply frame 7 to avoid inconsistent power supply voltages of the three half bridge structures, and also to reduce parasitic parameters.

[0071] It is worth noting that in the embodiment, a reserved gap for ensuring a safe creepage distance is provided between each two adjacent second base islands to prevent electrical interference between adjacent second base islands.

[0072] Further, the power switch device 3 includes a single MOS tube;

[0073] Or, the power switch device 3 includes a combination of an IGBT tube 4 and a fast recovery diode 5.

[0074] It should be noted that each power drive device 2 of the first base island 15 can be connected to the gate bonding area of the corresponding power switch device 3 of the two second base islands through the corresponding lead 20 to control the switching on-off state of a group of half bridge structures. In the embodiment, as shown in Figures 1 to 3 The power switch device 3 is usually composed of a single electronic element, such as a single MOS tube, and each MOS tube can be arranged side by side.

[0075] It is easy to understand that as another case, a combination of an IGBT tube 4 and a fast recovery diode can be used instead of a single MOS tube. In the embodiment, as shown in Figures 4 to 6 The power switch device 3 can also be composed of an IGBT tube 4 and a fast recovery diode 5 for assisting the IGBT tube 4 in quickly recovering the on-off state, and each power drive device 2 of the first base island 15 can be connected to the gate bonding area of the corresponding IGBT tube 4 of the two second base islands through the corresponding lead 20, and the midpoint of the two IGBT tubes 4 is also connected to two fast recovery diodes 5, so that each fast recovery diode 5 is connected in reverse parallel with the corresponding IGBT tube 4. The distribution of this case is as shown in Figure 4As shown, in the second direction, each IGBT tube 4 and the corresponding fast recovery diode 5 can be located in the same column, and the IGBT tube 4 is arranged close to the power frame 7; and in the first direction, each IGBT tube 4 is arranged side by side, and each fast recovery diode 5 is arranged side by side, so as to facilitate the wiring design of each signal line on the power side.

[0076] Generally speaking, the combination of IGBT tube 4 and fast recovery diode 5 can achieve greater current and higher power requirements instead of a single MOS tube.

[0077] Based on the first embodiment and / or the second embodiment of the full-bridge power module lead frame of the present application, in the third embodiment of the full-bridge power module lead frame of the present application, the same or similar contents as the above first embodiment and / or the second embodiment of the full-bridge power module lead frame can be referred to the above description, and will not be described hereinafter. On this basis, please refer to Figure 1 , Figure 4 , Figure 7 , Figure 8 , Figure 9 and Figure 10 In the present embodiment, each of the upper bridge base islands 8 and the corresponding lower bridge base island 9 is provided with an inner pin 10;

[0078] The inner pin 10 is connected to the bonding area of the corresponding power drive device 2 on the first base island 15 through the corresponding lead 20, so that two power switching devices 3 in each group of the upper bridge base island 8 and the lower bridge base island 9 form a half-bridge structure, and the inner pin 10 provides a floating power supply for the half-bridge structure.

[0079] It should be noted that in the present embodiment, any one of Figure 1 , Figure 4 or Figure 7 can be referred to in the power side, for each group of half-bridge structure, the upper bridge base island 8 and the corresponding lower bridge base island 9 are also provided with an inner pin 10, and the outer extension of the outer pin 18 is used to connect the power supply, the inner pin 10 is connected to the bonding area of the corresponding power drive device 2, which is mainly used as the floating power supply of the phase half-bridge structure, and the voltage is floating relative to the phase.

[0080] It is easy to understand that in the present embodiment, the current output to the load of the half-bridge structure can be controlled by controlling the on-off state of the power switching device 3 of the upper bridge base island 8 and the power switching device 3 of the lower bridge base island 9.

[0081] Further, in the present embodiment, the first base island 15, the power frame 7 and each second base island are provided with a plurality of glue locking holes 12;

[0082] The glue locking holes 12 are in any one of a circular shape or an elliptical shape, and are used as a flow channel for the plastic sealing material during the plastic sealing process and are finally filled with the plastic sealing material, so as to improve the bonding force between the plastic sealing material and the lead frame of the full-bridge power module.

[0083] It should be noted that any one of the drawings in Figure 1 , Figure 4 or Figure 7 may be referred to in the present embodiment. In the present embodiment, a plurality of glue locking holes 12 are further arranged on the first base island 15, the power supply frame 7 and each second base island. Each glue locking hole 12 can be in any one of a circular shape or an elliptical shape (including an elliptical shape formed by a straight line and a semicircle). During the plastic sealing process, the glue locking holes 12 can be used as a flow channel for the plastic sealing material and are finally filled with the plastic sealing material, so as to improve the bonding effect between the plastic sealing material and the lead frame of the full-bridge power module.

[0084] Further, in the present embodiment, the first base island 15 and each second base island are located on the same plane, and the area below the first base island 15 and each second base island is subjected to a half-etching or stamping process, so as to form a corresponding preset pattern area.

[0085] The preset pattern area includes a plurality of preset patterns 14 arranged in a matrix.

[0086] It should be noted that the present embodiment can be understood in combination with Figure 1 , Figure 7 , Figure 8 and Figure 9 . In the present embodiment, the first base island 15 and each second base island are located on the same plane, and the area below each base island towards the bottom surface of the plastic sealing body 16 is subjected to a half-etching process or a stamping process, so as to form nine preset pattern areas, so as to enhance the mechanical bonding effect between the plastic sealing material and the lead frame and improve the anti-delamination capability of the product. In each preset pattern area, a plurality of preset patterns 14 arranged in a matrix can be formed. The preset patterns 14 can be in a circular shape or a square shape when viewed from a top angle.

[0087] Further, in the present embodiment, when the half-etching process is used, the preset patterns 14 are in a semispherical shape, and the depth of the preset patterns 14 is half of the thickness of the lead frame.

[0088] Or, when the stamping process is used, the preset patterns 14 are in a conical shape, and the depth of the preset patterns 14 is 1 / 10 of the thickness of the lead frame.

[0089] It should be noted that, in the present embodiment, as shown in Figure 8As shown, each preset pattern 14 can be formed by a half-etching process, and each can be a hemispherical solid pattern. In this case, based on a comprehensive consideration of reliability, conductivity, and heat dissipation, the depth of the preset pattern 14 can be set to half the thickness of the lead frame. As another specific case, as shown, each preset pattern 14 can also be formed by a stamping process, and each can be a conical solid pattern. In this case, based on a comprehensive consideration of stamping process capability, reliability, conductivity, and heat dissipation, the depth of the preset pattern 14 can be set to 1 / 10 of the thickness of the lead frame. Figure 9

[0090] Further, in the present embodiment, in the first direction, the edge of the plastic package 16 close to the control side has a plurality of outer pins 18 in full-pin distribution, and the pin pitch between any two adjacent outer pins 18 is the same;

[0091] In the first direction, the edge of the plastic package 16 close to the power side has a plurality of outer pins 18 in asymmetric distribution, and each outer pin 18 is unevenly spaced;

[0092] The alignment reference of the two groups of outer pins 18 is the same, and the pin pitch between two adjacent outer pins 18 of different voltage output types is not less than 1.8 mm;

[0093] Among them, the outer pin 18 is extended to the outside of the plastic package 16 by any one of the lead fingers 11 or the inner pins 10.

[0094] It should be noted that the present embodiment can be understood in combination with Figure 8 and Figure 10 In the present embodiment, each outer pin 18 is extended to the outside of the plastic package 16 by any one of the inner pin 10 or the lead finger 11, and is arranged in the first direction of the control side or the power side, so that the pins of the control side and the power side are as far apart as possible. For the control side, each outer pin 18 is evenly spaced and also in full-pin distribution (in the first direction, the long edge above the plastic package 16 is evenly covered by each outer pin 18, which is used to reduce the path difference of each signal transmission). For the control side, each outer pin 18 is asymmetrically distributed, and the pitch between each outer pin 18 is not uniform. However, whether it is a group of outer pins 18 located on the power side or a group of outer pins 18 located on the control side, the alignment reference remains the same, that is, if the power side is also in full-pin distribution, the outer pin distribution of the control side and the power side of the plastic package 16 is mirror symmetric. Since the adjacent outer pins 18 on the power side output different types of voltages, for example, one outer pin 18 is used to transmit high voltage and the adjacent other outer pin 18 is used to transmit low voltage, in order to avoid electrical interference between them, the pin pitch between two adjacent outer pins 18 of different voltage output types is not less than 1.8 mm.​

[0095] It is worth mentioning that the application will be understood in combination with Figure 2 , Figure 5 and Figure 10 In the embodiment, the outer pin 18 is further provided with an outer pin forming area 19, which is used to assist the outer pin 18 to be shaped as a seagull. In addition, the edge of the upper / lower surface 17 of the plastic package is slightly narrower than the edge of the plastic package 16. This design can form an included angle between the bottom surface and the side surface of the upper / lower mold of the plastic package, which is slightly larger than 90°. This structure is helpful for plastic filling and demolding, and can enhance the mechanical properties and reliability of the plastic package 16 and the like.

[0096] In addition, the application further provides a full-bridge power module package, which adopts the full-bridge power module lead frame as described above.

[0097] Therefore, the full-bridge power module package provided by the application should also have all the technical features of all the embodiments of the full-bridge power module lead frame as described above, and should also have all the beneficial effects brought by all the embodiments of the full-bridge power module lead frame as described above, which will not be repeated here.

[0098] The above is only the preferred embodiment of the application, and does not limit the patent scope of the application. Any equivalent structural transformation, direct or indirect application in other related technical fields based on the content of the specification and drawings of the application are also included in the patent protection scope of the application.

Claims

1. A full-bridge power module lead frame, characterized in that: The full-bridge power module lead frame includes: Power side, control side and power supply framework; In a first direction, the power side and the control side are isolated by the power supply frame; The control side includes: A first base island is provided with three power driver devices, wherein the power driver devices are symmetrically arranged side by side; There are three inner pin reserved areas, each of which is arranged on a side of the first base island away from the power frame, and in the second direction, there are corresponding lead finger reserved areas on the first base island at both ends of each of the inner pin reserved areas, and each lead finger in each lead finger reserved area provides external electrical connection and mechanical support for the control side.

2. The full-bridge power module lead frame according to claim 1, wherein: A plurality of inner pins are provided in each inner pin reserved area, and the inner pins are of the same length and are arranged side by side; Each of the inner pins located in the same inner pin reserved area is connected to a bonding area corresponding to one of the power driver devices on the first base island through a lead wire.

3. The full-bridge power module lead frame according to claim 1, wherein: The power side includes: six second base islands respectively provided with power switching devices; The second base island is divided into an upper bridge base island and a lower bridge base island; The upper bridge base islands and the lower bridge base islands are arranged side by side and staggered, and the two adjacent upper bridge base islands are connected by connecting bars on the side close to the power frame, and a reserved gap is provided between each lower bridge base island and the adjacent upper bridge base island.

4. The full-bridge power module lead frame according to claim 3, wherein: An inner pin is provided between each upper bridge base island and a corresponding lower bridge base island; The inner pins are respectively connected to the bonding areas of the corresponding power driver devices on the first base island through corresponding leads, so that the two power switching devices in a corresponding group of the upper bridge base island and the lower bridge base island form a half-bridge structure, and the inner pins provide a floating power supply for the half-bridge structure.

5. The full-bridge power module lead frame according to claim 3, wherein: The first base island, the power frame and each of the second base islands are each provided with a plurality of glue locking holes; The glue locking hole is either circular or elliptical, and is used as a circulation channel for the molding compound during the molding process and is finally filled with the molding compound to enhance the bonding strength between the molding compound and the lead frame of the full-bridge power module.

6. The full-bridge power module lead frame according to claim 3, wherein: The first base island and each of the second base islands are located on the same plane, and the areas below the first base island and each of the second base islands are half-etched or stamped to form corresponding preset pattern areas; The preset graphic area includes a plurality of preset graphics distributed in a matrix.

7. The full-bridge power module lead frame according to claim 6, wherein: When the half-etching process is adopted, the preset pattern is hemispherical, and the depth of the preset pattern is half of the thickness of the lead frame; Alternatively, when the stamping process is adopted, the preset pattern is conical, and the depth of the preset pattern is 1 / 10 of the thickness of the lead frame.

8. The full-bridge power module lead frame according to claim 3, wherein: The power switch device includes a single MOS tube; Alternatively, the power switching device includes a combination of an IGBT tube and a fast recovery diode.

9. The full-bridge power module lead frame according to claim 1, wherein: In the first direction, the edge of the plastic package body close to the control side has a plurality of external pins in a full pin distribution, and the pin spacing between any two adjacent external pins is the same; In the first direction, the edge of the plastic package body close to the power side has a plurality of external pins that are asymmetrically distributed, and the external pins are distributed at uneven intervals; The alignment reference of the two groups of external pins is the same, and the pin spacing between two adjacent external pins of different voltage output types is not less than 1.8 mm; The outer pins are formed by extending any one of the lead fingers or the inner pins to the outside of the plastic package.

10. A full-bridge power module package, characterized in that: The full-bridge power module package adopts the full-bridge power module lead frame according to any one of claims 1 to 9.

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