Laser- and Chemical Etching-Based Embedded Deep Trench Processing Equipment and Technology for PCBs

Abstract

This invention relates to the field of PCB processing, specifically to a PCB embedded deep trench processing device and process based on laser and chemical etching. It includes a base and a clamping seat holding the circuit board. The clamping seat flips along one side of the base. A drying seat and etching components are respectively arranged around the clamping seat. A ring rail is connected to the outer side of the base, forming a sliding connection with the clamping seat. After flipping, the clamping seat can slide along the ring rail above the drying seat and cleaning components. Chemical etching is incorporated into the process of this solution. Rough machining is performed by drilling first, followed by chemical etching for more precise finishing. Furthermore, the ring rail allows for rapid switching between different water tanks, reducing the switching time of the PCB board between different environments. The flipping structure design allows the circuit board on the surface of the clamping seat to be placed downwards, thus avoiding chemical residue during cleaning between the developing seat, washing seat, and etching seat.

Description

Technical Field

[0001] This invention relates to the field of PCB processing, specifically to a PCB embedded deep trench processing device and process based on laser and chemical etching. Background Technology

[0002] PCB copper embedding involves placing a whole copper block into a drilled hole in the PCB, forming a structure where the copper block is embedded in the PCB board. The main purpose of copper embedding is for heat dissipation and to control the connectivity of certain areas in the circuit, such as the conduction of circuits between layers or the mutual conduction between multiple layers. It is generally used as a ground line in the circuit.

[0003] There are two types of copper embedding. The first is full embedding, which means that the entire PCB is completely penetrated during the hole and slot process, and the copper block is exposed on both sides of the PCB. The other is called semi-embedded, which means that blind holes are opened on the PCB surface and then the copper block is embedded in the blind holes. The purpose of semi-embedded is also for heat dissipation. The difference between semi-embedded and full embedding is that semi-embedded makes it impossible for some PCB layers to conduct electricity. It is also one of the commonly used processes in PCB copper embedding technology.

[0004] However, the current PCB semi-buried copper process has the problem of large blind hole tolerance. For example, the customer requires 50μm, but the existing milling machine can only control it to about 100μm during drilling and milling. The large tolerance will cause the copper block to shift within the PCB board. Therefore, the current solution is to reduce the tolerance of PCB semi-buried copper, improve the drilling accuracy, and avoid copper block displacement.

[0005] To address these issues, those skilled in the art have designed a PCB embedded deep trench processing device and process based on laser and chemical etching. Summary of the Invention

[0006] To address the aforementioned technical shortcomings, the purpose of this invention is to provide a PCB embedded deep trench processing device and process based on laser and chemical etching.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: including a base and a clamping seat for holding the circuit board, the clamping seat is flipped along one side of the base, and a drying seat and a corrosion component are respectively arranged around the clamping seat. A ring rail is connected to the outside of the base and forms a sliding connection with the clamping seat. After the clamping seat is flipped, it can slide through the ring rail to above the drying seat and the cleaning component, and the side of the clamping seat that holds the circuit board is in contact with the drying seat and the cleaning component.

[0008] Preferably, a driving component is provided on one side of the base, and the driving component drives the clamping seat to rotate. The driving component includes an adsorption magnetic rod and a transmission component. The adsorption magnetic rod is connected to the bottom of the clamping seat. The adsorption magnetic rod can adsorb the bottom of the clamping seat by magnetic adsorption. During the adsorption process, the clamping seat is rotated. The bottom of the clamping seat can be quickly and selectively fixed by a simple magnetic adsorption method.

[0009] Preferably, the drive assembly further includes a sprocket, a transmission chain, a drive motor, and a support frame connected to the magnetic adsorption rod. The drive motor is located inside the base and drives the magnetic adsorption rod to rotate back and forth through the sprocket and transmission chain at the shaft end. The support frame is fixedly connected to the base and forms a rotatable connection with the magnetic adsorption rod and the sprocket. The drive assembly is mainly responsible for driving the clamping seat to rotate back and forth. Through the sprocket, transmission chain, and drive motor, the magnetic adsorption rod is driven to rotate, and the magnetic adsorption rod, in turn, drives the clamping seat to rotate from the base to the ring track through the adsorption belt.

[0010] Preferably, the clamping seat includes a connecting seat, a lower pressing seat, an electromagnet, and a driving assembly. The connecting seat forms a magnetic adsorption with the magnetic rod through the electromagnet. The lower pressing seat is slidably connected to the bottom of the connecting seat. The electromagnet controls whether the clamping seat is adsorbed with the magnetic rod by turning the power on and off.

[0011] Preferably, the second drive assembly includes a drive wheel that is slidably connected to the ring rail and an output motor for driving the drive wheel. The drive wheel pushes the clamping seat to slide in a ring on the ring rail. At least two ring rails are installed and located on both sides of the clamping seat. The output motor drives the drive wheel to rotate, causing the clamping seat to slide in a ring on the ring rail. The specific position is controlled to correspond to the cleaning equipment.

[0012] Preferably, the lower pressure seat and the connecting seat are elastically connected by a spring rod. The electromagnet is located at the bottom of the lower pressure seat. The elastic connection allows for rapid rebound when the electromagnet loses its magnetic attraction. During the repeated up-and-down rebound, the circuit board can be cleaned more effectively.

[0013] Preferably, the upper surface of the lower pressure seat is provided with a placement groove and a clamping piece. The clamping piece is distributed diagonally in the placement groove. Since the machining is rough machining and the placement groove is about the same size as the circuit board, it is only necessary to limit the circuit board in the vertical direction by using the clamping piece.

[0014] Preferably, the cleaning assembly includes a developing unit, a washing unit, and an etching unit. The developing unit, washing unit, and etching unit are all distributed along a ring track, and the washing unit is located between the developing unit and the etching unit. The developing unit contains an alkaline developing solution to dissolve the resin in the unexposed areas. Meanwhile, the etching unit uses an etching solution to dissolve the copper layer in the unprotected areas. The washing unit uses clean water to perform a cleaning function.

[0015] Preferably, the bottom of the developing seat, washing seat, and etching seat is provided with a permanent magnet, and the permanent magnet is magnetically attracted to the electromagnet at the bottom of the pressing seat.

[0016] PCB embedded deep trench processing technology based on laser and chemical etching includes:

[0017] S1. Place the circuit board into the placement slot and fix it with clamps. Then, use a milling cutter to rough machine the surface of the circuit board and cut out the groove.

[0018] S2. After rough machining, the residual PP material in the retrieval tank is removed by laser to expose the copper surface.

[0019] S3. Based on S, apply UV-curable water-based anti-etching ink to the circuit board and expose it for curing, and cover the retrieval area.

[0020] S4. The circuit board after the anti-etching ink has been cured is flipped over by a pair of clamps in the drive assembly so that the side with the circuit board is facing down. The clamps are pushed into the developing unit by the second drive assembly so that the uncured anti-etching ink on the surface of the circuit board is developed. The developed circuit board is then driven into the upper surface of the washing unit for washing to remove any residual developing solution.

[0021] S5. Then, drive the washed circuit board into the etching seat for etching to remove the copper surface remaining in the etch tank until the new PP material layer is exposed. Then, drive the etched circuit board into the upper surface of the washing seat for washing to remove the residual etching solution.

[0022] S6. Finally, the cleaned circuit board is driven into the air drying seat and dried by air cooling. After drying, it is restored to the base, completing the fine processing of the circuit board tray.

[0023] The beneficial effects of this invention are as follows: By incorporating chemical etching into the process of this solution, a more precise finishing process is achieved by first drilling for rough processing and then performing chemical etching. Furthermore, a circular track is used to quickly switch between different water tanks, reducing the switching time of the PCB board between different environments. The flip-top structural design allows the circuit board on the surface of the clamping seat to be placed downwards. This avoids chemical residues when cleaning or removing materials between the developing, washing, and etching seats. In addition, a drying seat is provided to blow air and dry the entire circuit board. This not only improves the accuracy of PCB board processing but also reduces the problem of long switching times between processes.

[0024] Before flipping, the entire device is positioned above the base, and the base provides all-around control over the clamping seat, preventing the device from wobbling back and forth when drilling deep holes. The device also utilizes the characteristic of electromagnets that can regain their magnetism by switching on and off the power. By switching the electromagnet on and off at high frequency, the connecting seat can be moved up and down quickly within the washing seat, improving the cleaning effect. At the same time, the electromagnet can be kept energized for a long time, allowing it to be immersed in the developing and etching seats for an extended period. Furthermore, the magnetic attraction can also drive the entire clamping seat to rotate back and forth, making the switching of working states quick and convenient. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments of the present invention will be briefly described below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0026] Figure 1 This is a schematic diagram of the main structure of the present invention.

[0027] Figure 2 This is a schematic diagram of the forward-flipping structure of the clamping seat of the present invention.

[0028] Figure 3 This is a schematic diagram of the clamping seat sliding to the developing seat according to the present invention.

[0029] Figure 4 This is a schematic diagram of the clamping seat sliding to the washing seat according to the present invention.

[0030] Figure 5 This is a schematic diagram of the clamping seat sliding to the etching seat according to the present invention.

[0031] Figure 6 This is a schematic diagram of the inside of the clamping seat of the present invention.

[0032] In the picture:

[0033] 1. Base; 101. Drive assembly one; 1011. Adsorption magnetic rod; 2. Clamping seat; 201. Connecting seat; 202. Pressing seat; 2021. Placement slot; 2022. Clamping plate; 203. Electromagnet; 204. Drive assembly two; 3. Drying seat; 4. Developing seat; 5. Washing seat; 6. Etching seat; 7. Circular rail. Detailed Implementation

[0034] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0035] The accompanying drawings are for illustrative purposes only and are schematic diagrams, not actual images. They should not be construed as limiting the scope of this patent. To better illustrate the embodiments of the present invention, some parts in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0036] In the accompanying drawings of the embodiments of the present invention, the same or similar reference numerals correspond to the same or similar components. In the description of the present invention, it should be understood that if terms such as "upper," "lower," "left," "right," "inner," and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting the present patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0037] In the description of this invention, unless otherwise explicitly specified and limited, the term "connection" or similar designation indicating a connection between components should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0038] Example 1: This invention provides a PCB embedded deep trench processing device and process based on laser and chemical etching, such as... Figure 1-6 As shown, the device includes a base 1 and a clamping seat 2 that holds the circuit board. The clamping seat 2 flips along one side of the base 1. A drying seat 3 and a corrosion component are respectively arranged around the clamping seat 2. A ring rail 7 that is slidably connected to the outside of the base 1 is connected to the clamping seat 2. After the clamping seat 2 flips, it can slide through the ring rail 7 to the top of the drying seat 3 and the cleaning component. The side of the clamping seat 2 that holds the circuit board is in contact with the drying seat 3 and the cleaning component.

[0039] A drive assembly 101 is provided on one side of the base 1, and the drive assembly 101 drives the clamping seat 2 to rotate. The drive assembly 101 includes an adsorption magnetic rod 1011 and a transmission assembly. The adsorption magnetic rod 1011 is connected to the bottom of the clamping seat 2. The adsorption magnetic rod 1011 can adsorb the bottom of the clamping seat 2 by magnetic adsorption. During the adsorption process, the clamping seat 2 is rotated.

[0040] The drive assembly 101 also includes a sprocket, a transmission chain, a drive motor, and a support frame connected to the magnetic adsorption rod 1011. The drive motor is located inside the base 1 and drives the magnetic adsorption rod 1011 to rotate back and forth through the sprocket and transmission chain at the shaft end. The two sprockets, the transmission chain, and the drive motor can drive the clamping seat 2 to rotate back and forth. The support frame is fixedly connected to the base 1. The support frame can play a role in controlling the rotation of the clamping seat 2 and forms a rotatable connection with the magnetic adsorption rod 1011 and the sprocket.

[0041] The clamping seat 2 includes a connecting seat 201, a pressing seat 202, an electromagnet 203, and a driving assembly 204. The connecting seat 201 forms a magnetic attraction with the magnetic rod 1011 through the electromagnet 203. The electromagnet 203 can be automatically and controllably energized or de-energized. The magnetic recovery is controlled by energizing and de-energizing. It selectively attracts the magnetic rod 1011. After rotation, the clamping seat 2 is placed on the ring rail 7 before the magnetic attraction is released and sliding begins. The pressing seat 202 is slidably connected to the bottom of the connecting seat 201.

[0042] The second drive assembly 204 includes a drive wheel that is slidably connected to the ring rail 7 and an output motor for driving the drive wheel. The drive wheel pushes the clamping seat 2 to slide in a ring on the ring rail 7. The ring rail 7 has at least two rails installed on both sides of the clamping seat 2. The second drive assembly 204 drives the clamping seat 2 itself to slide on the ring rail 7 and controls the specific position after sliding.

[0043] The lower pressure seat 202 and the connecting seat 201 are elastically connected by a spring rod. The elastic connection can quickly rebound when the electromagnet 203 loses its magnetic attraction. During the repeated up and down rebound, the circuit board can be cleaned better. The electromagnet 203 is located at the bottom of the lower pressure seat 202.

[0044] The upper surface of the lower pressure seat 202 is provided with a placement groove 2021 and a clamping piece 2022. The clamping piece 2022 is distributed at the diagonal of the placement groove 2021. Since the machining is rough machining and the placement groove 2021 is comparable in size to the circuit board, it is only necessary to limit the circuit board in the vertical direction by using the clamping piece 2022.

[0045] The cleaning assembly includes a developing unit 4, a washing unit 5, and an etching unit 6. The developing unit 4, the washing unit 5, and the etching unit 6 are all distributed along the ring track 7, and the washing unit 5 is located between the developing unit 4 and the etching unit 6. The developing unit 4 contains an alkaline developing solution to dissolve the resin in the unexposed areas. Meanwhile, the etching unit 6 uses an etching solution to dissolve the copper layer in the unprotected areas. The washing unit 5 uses clean water to perform the function of cleaning.

[0046] The bottom of the developing seat 4, the washing seat 5 and the etching seat 6 are provided with permanent magnets, and the permanent magnets and the electromagnets 203 at the bottom of the pressing seat 202 are magnetically attracted to each other. When the permanent magnets and the electromagnets 203 are attracted, the pressing seat 202 can actively contact the liquid in the three pools. The cleaning time and cleaning frequency can also be determined by controlling the duration of power supply and the frequency of power supply.

[0047] PCB embedded deep trench processing technology based on laser and chemical etching includes:

[0048] S1. Place the circuit board into the placement slot 2021 and fix the circuit board with the clamp 2022. Then, use a milling cutter to rough process the surface of the circuit board and cut out the groove.

[0049] S2. After rough machining, the residual PP material in the retrieval tank is removed by laser to expose the copper surface.

[0050] S3. Based on S2, apply UV-curable water-based anti-etching ink to the circuit board and expose it for curing to cover the retrieval area.

[0051] S4. The circuit board after the anti-etching ink has been cured is flipped by the drive component 101 so that the side with the circuit board is facing down. The drive component 204 pushes the clamping seat 2 into the top of the developing seat 4 so that the uncured anti-etching ink on the surface of the circuit board is developed. The developed circuit board is then driven into the upper surface of the washing seat 5 for washing to remove the residual developing solution.

[0052] S5. Then, drive the washed circuit board into the etching seat 6 for etching to remove the copper surface remaining in the etch tank until the new PP material layer is exposed. Then, drive the etched circuit board into the upper surface of the washing seat 5 for washing to remove the residual etching solution.

[0053] S6. Finally, the cleaned circuit board is driven into the air drying seat 3 and dried by air cooling. After drying, it is restored to the base 1, completing the fine processing of the circuit board tray.

[0054] In use, the circuit board is placed in the placement slot 2021 and fixed. The surface of the circuit board is rough machined with a milling cutter to cut out a deep groove. The residual PP material in the groove is removed by laser to expose the copper surface. Anti-etching ink is then applied to the area outside the deep groove and exposed.

[0055] At this time, drive assembly 101 is turned on, and the clamping seat 2 is rotated back and forth through the sprocket and chain, so that the front and rear ends of the clamping seat 2 are stably placed above the ring rail 7. The electromagnet 203 that is magnetically attracted to the magnetic rod 1011 is turned off, and the magnetic rod 1011 is no longer stable. Then drive assembly 204 is turned on, and the internal drive wheel drives the entire clamping seat 2 to rotate on the ring rail 7.

[0056] First, the circuit board is driven to the top of the developing seat 4 to develop the uncured anti-etching ink on the surface of the circuit board. After development, the circuit board is driven into the upper surface of the washing seat 5 for washing to remove the residual developer. Then, the washed circuit board is driven into the etching seat 6 for etching to remove the residual copper surface in the etch tank until the new PP material layer is exposed. After etching, the circuit board is driven into the upper surface of the washing seat 5 for washing to remove the residual etching solution. Finally, the cleaned circuit board is driven into the top of the drying seat 3 for final drying by air cooling. After drying, the circuit board is restored to the base 1, completing the finishing process of the circuit board etch tank.

[0057] It should be stated that the above-described specific embodiments are merely preferred embodiments of the present invention and the technical principles employed. Those skilled in the art should understand that various modifications, equivalent substitutions, and variations can be made to the present invention. However, such variations, as long as they do not depart from the spirit of the present invention, should be within the scope of protection of the present invention. Furthermore, some terminology used in this specification and claims is not limiting, but merely for ease of description.

Claims

1. A PCB embedded deep trench processing device based on laser and chemical etching, comprising a base (1) and a clamping seat (2) for holding the circuit board, characterized in that, The clamping seat (2) is flipped along one side of the base (1). The clamping seat (2) is provided with a drying seat (3) and a corrosion component on its four sides. The outer side of the base (1) is connected to a ring rail (7) that forms a sliding connection with the clamping seat (2). After the clamping seat (2) is flipped, it can slide through the ring rail (7) to the top of the drying seat (3) and the cleaning component. The side of the clamping seat (2) that holds the circuit board is in contact with the drying seat (3) and the cleaning component.

2. The PCB embedded deep trench processing device based on laser and chemical etching according to claim 1, characterized in that, A drive assembly (101) is provided on one side of the base (1), and the drive assembly (101) drives the clamping seat (2) to rotate. The drive assembly (101) includes an adsorption magnetic rod (1011) and a transmission assembly. The adsorption magnetic rod (1011) is connected to the bottom of the clamping seat (2).

3. The PCB embedded deep trench processing device based on laser and chemical etching according to claim 2, characterized in that, The drive assembly (101) also includes a sprocket, a transmission chain, a drive motor and a support frame connected to the magnetic rod (1011). The drive motor is located inside the base (1) and drives the magnetic rod (1011) to rotate back and forth through the sprocket and transmission chain at the shaft end. The support frame is fixedly connected to the base (1) and forms a rotatable connection with the magnetic rod (1011) and the sprocket.

4. The PCB embedded deep trench processing device based on laser and chemical etching according to claim 3, characterized in that, The clamping seat (2) includes a connecting seat (201), a pressing seat (202), an electromagnet (203), and a second driving component (204). The connecting seat (201) is magnetically attracted to the magnetic rod (1011) by the electromagnet (203). The pressing seat (202) is slidably connected to the bottom of the connecting seat (201).

5. The PCB embedded deep trench processing device based on laser and chemical etching according to claim 4, characterized in that, The second drive assembly (204) includes a drive wheel that is slidably connected to the ring rail (7) and an output motor for driving the drive wheel. The drive wheel pushes the clamping seat (2) to slide in a ring on the ring rail (7). At least two ring rails are installed on the ring rail (7) and located on both sides of the clamping seat (2).

6. The PCB embedded deep trench processing device based on laser and chemical etching according to claim 3, characterized in that, The lower pressure seat (202) and the connecting seat (201) are elastically connected by a spring rod, and the electromagnet (203) is located at the bottom of the lower pressure seat (202).

7. The PCB embedded deep trench processing device based on laser and chemical etching according to claim 3, characterized in that, The upper surface of the pressure seat (202) is provided with a placement groove (2021) and a clamping piece (2022), and the clamping piece (2022) is distributed at the diagonal of the placement groove (2021).

8. The PCB embedded deep trench processing device based on laser and chemical etching according to claim 4, characterized in that, The etching assembly includes a developing stand (4), a washing stand (5), and an etching stand (6). The developing stand (4), the washing stand (5), and the etching stand (6) are all distributed along the ring track (7), and the washing stand (5) is located between the developing stand (4) and the etching stand (6).

9. The PCB embedded deep trench processing device based on laser and chemical etching according to claim 8, characterized in that, The bottom of the developing seat (4), the washing seat (5) and the etching seat (6) are provided with permanent magnets, and the permanent magnets are magnetically attracted to the electromagnet (203) at the bottom of the pressing seat (202).

10. A PCB embedded deep trench processing technology based on laser and chemical etching, and the PCB embedded deep trench processing apparatus based on laser and chemical etching according to any one of claims 1-9, characterized in that, include: S1. Place the circuit board into the placement slot (2021) and fix the circuit board with the clamp (2022). Then, use a milling cutter to rough process the surface of the circuit board and cut out the groove. S2. After rough machining, the residual PP material in the retrieval tank is removed by laser to expose the copper surface. S3. Based on S2, apply UV-curable water-based anti-etching ink to the circuit board and expose it for curing to cover the retrieval area. S4. The circuit board after the anti-etching ink has been cured is flipped by the drive component one (101) so that the side with the circuit board is facing down. The drive component two (204) pushes the clamp (2) into the top of the developing unit (4) so ​​that the uncured anti-etching ink on the surface of the circuit board is developed. The developed circuit board is then driven into the upper surface of the washing unit (5) for washing to remove the residual developing solution. S5. Then drive the washed circuit board into the etching seat (6) for etching to remove the copper surface remaining in the etch tank until the new PP material layer is exposed. Then drive the etched circuit board into the upper surface of the washing seat (5) for washing to remove the residual etching solution. S6. Finally, the cleaned circuit board is driven into the air drying seat (3) and dried by air cooling. After drying, it is restored to the base (1) to complete the finishing of the circuit board grooving.

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