Circuit board chip mounter and dispensing mechanism

Abstract

The invention relates to the field of circuit board processing automation equipment, and discloses a circuit board chip mounter and a dispensing mechanism, the circuit board chip mounter comprises a support, the top of the support is provided with a positioner, the exterior of the positioner is provided with a material taking device through screws, the material taking device comprises a mounting table and a positioning plate, and the top of the mounting table is provided with a pneumatic pump; a conveying pipe connected with the output end of the pneumatic pump is arranged in the mounting table, the bottom end of the conveying pipe is fixedly connected with a main flow divider, the output end of the main flow divider is fixedly connected with four secondary flow dividers, the output ends of the secondary flow dividers are fixedly connected with four material taking heads, and the multiple material taking heads are mounted in the positioning plate; the material taking head comprises a fixed box fixedly mounted at the top of the positioning plate and a movable shell slidably connected into the positioning plate. According to the device and the method, the glue is synchronously blow-dried while the surface mounting operation is completed, an additional drying station is not needed, and the influence of vibration and temperature and humidity environment changes on the surface mounting stability of the component in the conveying process is avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of circuit board processing automation equipment, in particular to a circuit board chip mounter and a dispensing mechanism. BACKGROUND

[0002] The circuit board chip mounter is widely used in the field of electronic manufacturing, and is used for accurately mounting surface mount components on a circuit board in the production process of consumer electronics, automotive electronics, communication equipment and the like, and is the core equipment of a surface mount technology production line. With the rapid development of the electronic industry, higher requirements are put forward for the mounting accuracy, production efficiency and process flow integration of the circuit board chip mounter. In the mounting process, not only the accurate grabbing and mounting of components need to be realized, but also the glue in the dispensing area after mounting needs to be dried to ensure the production quality and subsequent assembly reliability of the circuit board.

[0003] The existing circuit board chip mounter usually uses vacuum adsorption or mechanical clamping to realize component grabbing in the material taking and mounting link, and after completing the mounting action, additional drying stations (such as ovens, UV curing equipment, etc.) are needed to dry the glue. Taking a common vacuum adsorption type chip mounter as an example, the material taking head adsorbs the components by negative pressure, and after mounting, the circuit board needs to be transmitted to a separate drying area to solidify the glue by using heat radiation, ultraviolet irradiation and the like. However, in the transmission process of the circuit board from the mounting station to the drying station, the drying effect of the glue and the stability of the component mounting are easily affected by factors such as vibration, changes in environmental temperature and humidity, which is difficult to meet the needs of the electronic manufacturing industry for efficient and accurate production.

[0004] Therefore, in view of the above problems, a circuit board chip mounter and a dispensing mechanism are proposed to solve the above problems. SUMMARY

[0005] In order to make up for the above shortcomings, the present application provides a circuit board chip mounter and a dispensing mechanism, which aims to improve the problem in the prior art that the drying effect of the glue and the stability of the component mounting are easily affected by factors such as vibration, changes in environmental temperature and humidity in the transmission process of the circuit board from the mounting station to the drying station.

[0006] In order to achieve the above purpose, the present application adopts the following technical solutions: A circuit board chip mounter, comprising a support, a positioner is installed on the top of the support, and a material taking device is installed on the outside of the positioner through screws; The material taking device comprises a mounting table and a positioning plate, a gas pressure pump is installed on the top of the mounting table, a conveying pipe connected with the output end of the gas pressure pump is arranged in the mounting table, a main shunt is fixedly connected to the bottom end of the conveying pipe, four secondary shunts are fixedly connected to the output end of the main shunt, four material taking heads are fixedly connected to the output end of the secondary shunts, and the plurality of material taking heads are installed in the inside of the positioning plate. The material taking head comprises a fixed box fixedly installed on the top of the positioning plate and a movable shell slidably connected in the positioning plate, the top of the movable shell is slidably connected in the fixed box, and a light spring is arranged between the top of the movable shell and the inner wall of the bottom of the fixed box, a double-head piston is slidably connected in the movable shell, and an inflatable suction cup is threadedly connected to the bottom of the movable shell; As a further description of the above technical solution: A flexible baffle is mounted at the outlet of the bottom of the movable shell, a plurality of gas injection channels are formed in the interior of the movable shell, a sliding cylinder is slidably arranged at one end of the gas injection channel, a return spring is arranged between the outer side of the sliding cylinder and the inner side wall of the gas injection channel, and a spray head is arranged at the other end of the gas injection channel; As a further description of the above technical solution: A plurality of gas outlets are formed in the outer side of the sliding cylinder, a rubber head is arranged at one end of the sliding cylinder close to the gas channel in the interior of the movable shell, and the inner side of the rubber head is concave; As a further description of the above technical solution: The outer diameter of the piston at one end of the top of the double-head piston is greater than that of the piston at the other end of the bottom, and a limiting ring is fixedly connected to the outer side of the movable shell and slidably connected to the interior of the positioning plate; As a further description of the above technical solution: The main shunt comprises a shunt box, the top of the shunt box is sealingly connected to the bottom of the conveying pipe, four shunt channels are formed in the outer side of the shunt box, four shunt pipes corresponding to the shunt channels are fixedly connected to the outer side of the shunt box, a rotating disc is rotatably connected to the interior of the shunt box, a plurality of plugging heads are fixedly arranged on the outer side of the rotating disc, an annular sliding groove is formed in the inner side of the rotating disc, the outer side of the plugging head is slidably connected to the interior of the annular sliding groove and is shaped to be adapted to the shape of the inner end of the shunt channel, the shunt channel is sequentially divided into a pressurizing section, a stable section and an outer spraying section from inside to outside, the inner diameter of the pressurizing section gradually decreases from inside to outside, the inner diameters of the stable section are the same, and the inner diameter of the outer spraying section gradually increases from inside to outside, and the secondary shunt has the same structure as the main shunt; As a further description of the above technical solution: A motor is fixedly connected to the central position of the positioning plate, the rotating disc in the main shunt is fixedly installed on the output end of the motor, a transmission device is arranged on the output end of the motor, and the rotating discs in the four secondary shunts are driven by the transmission device; As a further description of the above technical solution: A control box is arranged on the inner side of the support, a conveying belt one is arranged on the top of the support, a partition plate is arranged on the outer side of the conveying belt one, a feeder is arranged on the inner side of the support, and the shapes of the inner sides of the two partition plates and the shape of the interior of the feeder are adapted to the shape of the positioning plate; As a further description of the above technical solution: The locator comprises a transverse guide rail, a longitudinal guide rail and a mounting plate, the transverse guide rail is arranged at the top of the support, the longitudinal guide rail is arranged outside the output end of the transverse guide rail, and the mounting plate is arranged at the output end of the longitudinal guide rail and connected with the mounting table; A dispensing mechanism of a circuit board chip mounter, applicable to any one of the circuit board chip mounters, comprises a bottom plate arranged at the top of the support, a dispensing device arranged at the top of the bottom plate, the dispensing device comprising a mounting frame, a controller arranged outside the mounting frame, a positioning guide rail arranged outside the mounting frame, a dispensing head arranged at the output end of the positioning guide rail, and a conveying belt two connected with the conveying belt one arranged at the top of the bottom plate, a dispensing jig arranged at the top of the conveying belt two, and a PCB board placed on the top of the conveying belt one and the inner side of the dispensing jig; Further description of the above technical solutions: The dispensing jig comprises a base arranged on the conveying belt two, a peripheral baffle arranged outside the base, an L-shaped partition baffle mounted on the inner side of the base through screws, and a clamping plate one and a clamping plate two slidably connected to the outer sides of the two ends of the L-shaped partition baffle.

[0007] The present application has the following advantages: 1. In the present application, the cooperation of the air injection channel in the material taking head, the sliding cylinder and the inflatable suction cup realizes the synchronization of patching and glue drying. When the air pressure pump reverses the air suction, the double-head piston moves upward, the air pressure in the movable shell decreases, the sliding cylinder slides outward under the action of the return spring, and the air injection channel is connected with the airflow channel in the movable shell. The airflow is sprayed out through the air outlet of the air injection channel and the nozzle, and directly acts on the mounted components and the glue area. The glue is dried at the same time as the patching operation is completed, without the need for an additional drying station, and the stability of the mounted components is avoided to be affected by vibration, temperature and humidity changes during the conveying process.

[0008] 2. In the present application, the rotating disc of the main flow divider and the plugging head cooperate with the secondary flow divider to accurately adjust the air distribution of the material taking head. The rotating disc of the main flow divider is driven by the motor to rotate, the plugging head slides in the annular sliding groove, and is combined with different flow channels to control the air distribution to the specified secondary flow divider, and then the secondary flow divider accurately distributes the air to the corresponding material taking head. According to the patching requirements, the air charging state of the material taking head can be freely switched, and different component gripping positions can be flexibly adapted without replacing the material taking mechanism, thereby improving the adaptability of the equipment to various patching tasks. BRIEF DESCRIPTION OF DRAWINGS

[0009] Figure 1 A three-dimensional schematic view of a circuit board chip mounter and a dispensing mechanism is provided for the present application; Figure 2 A structural schematic view of a locator of a circuit board chip mounter and a dispensing mechanism is provided for the present application; Figure 3A structure schematic view of a material taking device of a circuit board chip mounter and a glue dispensing mechanism according to the present application; Figure 4 A structure schematic view of a positioning plate of a circuit board chip mounter and a glue dispensing mechanism according to the present application; Figure 5 A structure schematic view of a main shunt of a circuit board chip mounter and a glue dispensing mechanism according to the present application; Figure 6 A structure schematic view of a material taking head of a circuit board chip mounter and a glue dispensing mechanism according to the present application; Figure 7 A structure schematic view of a glue dispensing device of a circuit board chip mounter and a glue dispensing mechanism according to the present application; Figure 6 A structure schematic view of a glue dispensing device of a circuit board chip mounter and a glue dispensing mechanism according to the present application; Figure 8 A structure schematic view of a glue dispensing device of a circuit board chip mounter and a glue dispensing mechanism according to the present application; Figure 9 A structure schematic view of a glue dispensing device of a circuit board chip mounter and a glue dispensing mechanism according to the present application.

[0010] Legend: 1, support; 2, control box; 3, conveying belt one; 4, partition; 5, positioner; 501, horizontal guide rail; 502, vertical guide rail; 503, mounting plate; 6, material taking device; 61, mounting table; 62, air pressure pump; 63, conveying pipe; 64, main shunt; 641, shunt box; 642, annular chute; 643, shunt passage; 644, shunt pipe; 645, rotating disc; 646, plugging head; 65, secondary shunt; 66, motor; 67, transmission device; 68, material taking head; 681, fixed box; 682, movable shell; 683, double-head piston; 684, inflatable suction cup; 685, flexible baffle; 686, air jet passage; 687, sliding cylinder; 688, return spring; 689, nozzle; 69, positioning plate; 7, feeder; 8, bottom plate; 9, glue dispensing device; 91, mounting frame; 92, controller; 93, positioning guide rail; 94, glue dispensing head; 95, conveying belt two; 96, glue dispensing jig; 961, base; 962, peripheral baffle; 963, L-shaped partition baffle; 964, clamping plate one; 965, clamping plate two; 10, PCB. DETAILED DESCRIPTION

[0011] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0012] Reference Figures 1 to 7The application provides a circuit board chip mounter, which comprises a support 1, the support 1 provides a stable mounting platform for various components of the equipment, guarantees the overall stability of the equipment in the running process, and is provided with a positioner 5 on the top, the positioner 5 is used for accurately adjusting the position of a material taking device 6, so that the material taking device 6 can accurately move to a suitable position for obtaining electronic components and placing the electronic components on a PCB 10, the positioner 5 is externally provided with the material taking device 6 through screw mounting, the material taking device 6 is a core execution structure for completing electronic component grabbing and transferring, a power source such as an air pressure pump 62 and an air path structure such as a conveying pipe 63 are integrated through a mounting table 61, the main shunt 64 and the secondary shunt 65 are used for realizing reasonable distribution of air flow, and the material taking head 68 is used for completing grabbing of the electronic components, the functions of various components are integrated, and key action connection from material taking to chip mounting is realized. The material taking device 6 comprises a mounting table 61 and a positioning plate 69. The mounting table 61 is mainly used for mounting the air pressure pump 62 to provide a stable mounting position for the air pressure pump 62. An inner conveying pipe 63 connected with the output end of the air pressure pump 62 is arranged in the mounting table 61, which plays a role of bearing and preliminarily integrating the air circuit. The air pressure pump 62 is mounted at the top of the mounting table 61. The air pressure pump 62 serves as a power source during the whole material taking and patching process, generates air pressure, and provides air pressure power for the inflation adsorption, air jet drying and other actions of the material taking head 68. Different direction and pressure air flows are outputted to drive the material taking head 68 to complete a series of actions such as grabbing elements, releasing elements and drying glue. The conveying pipe 63 connected with the output end of the air pressure pump 62 is arranged in the mounting table 61. The conveying pipe 63 is used for transmitting the air flow generated by the air pressure pump 62, stably transmitting the air flow at the output end of the air pressure pump 62 to the main flow divider 64, and serving as a channel structure for air pressure transmission. The bottom end of the conveying pipe 63 is fixedly connected with the main flow divider 64. The main flow divider 64 performs first flow division on the air flow transmitted by the air pressure pump 62. According to the requirements of the patching operation, the air flow is reasonably distributed to four secondary flow dividers 65. Through the cooperation of the internal rotating disc 645 and the plugging head 646, precise control of air flow distribution is realized, so that the air flow can enter the corresponding secondary flow divider 65 according to the program setting. The output end of the main flow divider 64 is fixedly connected with the four secondary flow dividers 65. The secondary flow divider 65 performs second precise flow division on the air flow on the basis of the flow division of the main flow divider 64. The structure of the secondary flow divider 65 cooperates with that of the main flow divider 64 to further distribute the air flow to the corresponding material taking head 68, so that each material taking head 68 can obtain appropriate air pressure and air flow, ensure that different material taking heads 68 can complete grabbing or other actions according to requirements, and improve the precision and flexibility of air flow distribution. The output end of the secondary flow divider 65 is fixedly connected with the four material taking heads 68. The material taking head 68 directly contacts with the electronic element to complete the grabbing, transferring and placing actions of the electronic element. Through the inflation adsorption element, air jet auxiliary cleaning and glue drying actions, the operation on the element from material taking to patching is realized. The plurality of material taking heads 68 are mounted in the positioning plate 69. The positioning plate 69 provides a mounting position for the material taking head 68, positions and limits the material taking head 68, so that the plurality of material taking heads 68 can work in order within the preset space range, ensures the position stability of the material taking head 68 during the material taking and patching process, and facilitates the accurate alignment of the material taking head 68 with the patching position on the electronic element and the PCB board 10. The material taking head 68 comprises a fixed box 681 fixedly installed at the top of the positioning plate 69, the fixed box 681 providing guidance and limiting structure for sliding of a movable shell 682, being in sliding connection with the top of the movable shell 682 inside, and assisting the reset of the movable shell 682 through the lightweight spring arranged between the top of the movable shell 682, so as to guarantee that the movable shell 682 can return to the initial position under the action of appropriate force after completing the downward grabbing action, and prepare for the next material taking action, and the movable shell 682 in sliding connection inside the positioning plate 69, the movable shell 682 being the main movable structure inside the material taking head 68, realizing the up-down movement of the material taking head 68 by sliding inside the positioning plate 69, its inside accommodating a double-head piston 683, arranging a gas jet channel 686 and other structures, and completing the downward grabbing element and upward reset and other actions under the action of gas pressure, and the outside of the movable shell 682 being fixedly connected with a limiting ring, the limiting ring limiting the sliding of the movable shell 682 inside the positioning plate 69, limiting the sliding range of the movable shell 682, so that the movable shell 682 can only slide in the preset track and range, guaranteeing the stability and accuracy of the movable shell 682 in the up-down movement process, avoiding affecting the material taking and patch precision due to the sliding deviation of the movable shell 682, and the outside of the limiting ring being in sliding connection inside the positioning plate 69. The top of the movable shell 682 is in sliding connection inside the fixed box 681, and the top of the movable shell 682 and the inner wall of the bottom of the fixed box 681 are provided with a lightweight spring arranged therebetween, the lightweight spring being installed between the top of the movable shell 682 and the inner wall of the bottom of the fixed box 681, when the movable shell 682 slides downward to complete the material taking action under the action of gas pressure, and when the gas pressure disappears or reverses, the movable shell 682 is pulled upward to reset by the elastic force of the lightweight spring, so that the movable shell 682 returns to the initial position, and prepares for the next material taking action, the inside of the movable shell 682 being in sliding connection with the double-head piston 683, the double-head piston 683 sliding inside the movable shell 682, and due to the fact that the outer diameter of the top one end of the piston is greater than the outer diameter of the bottom one end of the piston, different stress effects can be generated under the action of gas pressure, when moving downward, the gas pressure acting on the inside of the movable shell 682 can be increased, assisting the downward sliding of the movable shell 682 to realize the action of the grabbing element, and when moving upward, the gas pressure environment inside the movable shell 682 is changed, creating conditions for the gas jet action of the gas jet channel 686.

[0013] The bottom of the movable shell 682 is threadedly connected with an inflatable suction cup 684, which is in direct contact with the electronic component, inflates and expands under the action of air pressure, and uses the adsorption force generated by the air pressure difference to grab the electronic component. It is a direct structure to realize the grabbing of the electronic component, and the size and stability of the adsorption force directly affect the grabbing effect of the electronic component, ensuring that the electronic component can be reliably grabbed and released. The bottom outlet of the movable shell 682 is provided with a flexible baffle 685, which can be pushed open by the inflatable suction cup 684 when the inflatable suction cup 684 inflates and pushes outward, facilitating the contact of the inflatable suction cup 684 with the electronic component; when the inflatable suction cup 684 retracts, it can play a certain shielding role to prevent dust and other impurities from entering the interior of the inflatable suction cup 684, thereby protecting the inflatable suction cup 684 and ensuring the cleanliness and normal adsorption function of the inflatable suction cup 684. A plurality of air injection channels 686 are formed in the interior of the movable shell 682. The air injection channel 686 is a gas path structure for realizing the air injection function of the material taking head 68, and is used for transmitting airflow so that the airflow can be injected from the interior of the movable shell 682 through the sliding cylinder 687, the nozzle 689 and other structures. After the pasting is completed, the airflow can be injected to blow dry the glue, and the electronic component and the PCB 10 can be cleaned before and after taking the material, thereby providing a clean environment for the pasting operation and improving the pasting quality. One end of the air injection channel 686 is slidably provided with a sliding cylinder 687. The sliding cylinder 687 slides in the air injection channel 686. A plurality of air outlets are formed on the outside of the sliding cylinder 687 and can be connected or disconnected with the airflow channel in the interior of the movable shell 682 during the sliding process, thereby realizing the control of the air injection function of the air injection channel 686. Through cooperation with the return spring 688, the position of the sliding cylinder 687 can be changed under different air pressure environments, thereby controlling whether the airflow is injected and the timing of the injection. A plurality of air outlets are formed on the outside of the sliding cylinder 687, and a rubber head is arranged at one end of the sliding cylinder 687 close to the gas channel in the interior of the movable shell 682. The rubber head can better adhere to or separate from the gas channel in the interior of the movable shell 682 during the sliding process of the sliding cylinder 687, thereby playing a role in auxiliary sealing and controlling the opening and closing of the airflow channel, ensuring that the airflow can smoothly pass through when air injection is needed, and effectively blocking the airflow when air injection is not needed, thereby improving the accuracy of airflow control of the air injection channel 686. The inner side of the rubber head is concave.The outer side of the sliding cylinder 687 is provided with a reset spring 688 between the inner side wall of the air jet channel 686, which plays a reset role on the sliding cylinder 687. When the air pressure in the movable shell 682 changes, the sliding cylinder 687 can be pushed or pulled back to the initial position, ensuring that the air jet channel 686 can accurately realize the on-off control of the air flow in different working states, so that the air jet action can be performed according to the timing and duration set by the program. The other end of the air jet channel 686 is provided with a nozzle 689, which sprays the air flow in the air jet channel 686 in a specific direction and form, and can accurately act on the surface of the electronic component or the glue area of the PCB 10, realizing the functions of auxiliary cleaning and glue drying. It is the terminal structure of the air jet channel 686 to realize the function, and the direction and range of the jet flow directly affect the cleaning and drying effect. The main distributor 64 includes a distribution box 641, which is the main structure of the main distributor 64, provides installation space for structures such as the rotating disc 645 and the distribution channel 643, and is sealed and connected to the conveying pipe 63 at the top to ensure that the air flow can stably enter the inside of the main distributor 64 and is the basic carrier for the main distributor 64 to realize the air flow distribution function. The top of the distribution box 641 is sealingly connected to the bottom of the conveying pipe 63, and four distribution channels 643 are provided on the outside of the distribution box 641. The distribution channel 643 is a channel structure for the main distributor 64 to realize air flow distribution, and through the structures of different inner diameters of the booster section, the stable section and the outer jet section arranged from inside to outside, the air flow is pressurized, stabilized and processed, so that the air flow can maintain appropriate pressure and flow rate when distributed to the secondary distributor 65, ensuring the stability and accuracy of the subsequent material taking head 68. In addition, four distribution pipes 644 corresponding to the distribution channels 643 are fixedly connected to the outside of the distribution box 641. The distribution pipe 644 is connected with the distribution channel 643, stably transmits the air flow distributed by the distribution channel 643 to the secondary distributor 65, plays a role of connecting the distribution channel 643 and the secondary distributor 65, and ensures that the air flow can smoothly enter the secondary distributor 65 from the main distributor 64, realizing the orderly transmission of the air flow between the main distributor 64 and the secondary distributor 65.

[0014] The inside of the flow divider box 641 is rotatably connected with a rotating disc 645, which is installed inside the flow divider box 641 and can rotate under the driving of the motor 66. The externally fixed and distributed plugging heads 646 cooperate with the flow distribution channels 643, and the corresponding relationship between the plugging heads 646 and the flow distribution channels 643 is changed by rotation, so as to realize accurate control of air flow distribution, determine which flow distribution channel 643 the air flow enters, and further control the air flow distribution to the corresponding secondary flow divider 65. It is the key rotating structure for realizing accurate distribution of the primary flow divider 64. The rotating disc 645 has a plurality of plugging heads 646 fixedly distributed on the outside thereof. The plugging heads 646 are fixedly distributed on the outside of the rotating disc 645 and slide in the annular sliding groove 642 when the rotating disc 645 rotates. The shape of the plugging heads 646 is adapted to the shape of the inner end of the flow distribution channel 643. By cooperating with different flow distribution channels 643, the flow distribution channel 643 is opened or closed, so as to control whether the air flow enters the corresponding flow distribution channel 643, which is the execution structure of the primary flow divider 64 for realizing accurate air flow distribution. The inside of the rotating plate is provided with an annular sliding groove 642, which provides a track and a limit for the sliding of the plugging head 646, so that the plugging head 646 can stably slide along the annular sliding groove 642 during the rotation of the rotating disc 645, ensuring that the plugging head 646 can accurately cooperate with the flow distribution channel 643 to realize accurate control of air flow distribution, improve the accuracy and stability of the primary flow divider 64, and the shape of the plugging head 646 is adapted to the shape of the inner end of the flow distribution channel 643. The flow distribution channel 643 is sequentially divided into a pressurizing section, a stable section and an outer spraying section from inside to outside. The inner diameter of the pressurizing section gradually decreases from inside to outside, the inner diameter of the stable section is the same, and the inner diameter of the outer spraying section gradually increases from inside to outside. The secondary flow divider 65 has the same structure as the primary flow divider 64. The center of the positioning plate 69 is fixedly connected with the motor 66, which provides power for the rotation of the rotating disc 645 and drives the rotating disc 645 to rotate at a programmed angle and speed, so that the plugging head 646 can accurately reach the position cooperating with the flow distribution channel 643 to realize accurate control of air flow distribution. It is the power source for realizing automatic and accurate distribution of the primary flow divider 64. The rotating disc 645 inside the primary flow divider 64 is fixedly installed on the output end of the motor 66. The output end of the motor 66 is provided with a transmission device 67, which is installed on the output end of the motor 66 to transmit the power of the motor 66 to the rotating disc 645 inside the secondary flow divider 65, so that the rotating disc 645 of the secondary flow divider 65 can rotate cooperatively with the rotating disc 645 of the primary flow divider 64, ensuring the synchronization and coordination of the primary flow divider 64 and the secondary flow divider 65 during air flow distribution, improving the working efficiency and accuracy of the whole flow distribution system. The rotating discs 645 inside the four secondary flow dividers 65 are driven by the transmission device 67. The inner side of the support 1 is provided with a control box 2, and the control box 2 is internally integrated with a control circuit and a control system, which is used to coordinate the work of each component of the circuit board chip mounter, and controls the start and stop of the air pressure pump 62, the direction and pressure of the air flow, the position adjustment of the positioner 5, the material taking and chip mounting actions of the material taker 6, etc. through program setting and instruction sending, and is the control core of the whole equipment. The top of the support 1 is provided with a conveying belt one 3, which is the main structure for conveying the PCB board 10 and is used to convey the PCB board 10 to be mounted to a specified position in the equipment, so that the PCB board 10 can pass through the material taking, glue dispensing and chip mounting stations in sequence, realizes the automatic transmission of the PCB board 10 in the equipment, provides material conveying guarantee for continuous and large-scale mounting operation, and the outer side of the conveying belt one 3 is provided with a partition plate 4. The partition plate 4 is installed on the outer side of the conveying belt one 3, plays a limiting role on the PCB board 10 on the conveying belt, prevents the PCB board 10 from deviating in the conveying process, guarantees that the PCB board 10 can move along the preset path on the conveying belt one 3, so that the PCB board 10 can accurately reach the specified position of material taking and chip mounting, and improves the position precision of the mounting operation. The inner side of the support 1 is provided with a feeder 7, and the inner shape of the feeder 7 is matched with the shape of the positioning plate 69. The feeder 7 is used to place electronic components to be mounted, arranges the electronic components in order in the feeder 7 according to the mounting requirements of the PCB board 10, provides a stable material taking source for the taking head 68 of the material taker 6, so that the taking head 68 can accurately obtain the electronic components, is an important material storage and supply structure for realizing automatic material taking, and the inner shape of the two partition plates 4 and the inner shape of the feeder 7 are matched with the shape of the positioning plate 69. The positioner 5 includes a horizontal guide rail 501, a vertical guide rail 502 and a mounting plate 503. The horizontal guide rail 501 is installed at the top of the support 1, provides a track and power for the vertical movement of the positioner 5, so that the positioner 5 can move in the horizontal direction along the horizontal guide rail 501, adjusts the horizontal position of the material taker 6 on the horizontal plane, guarantees that the material taker 6 can accurately move to the horizontal coordinate position of material taking and chip mounting, the vertical guide rail 502 is installed outside the output end of the horizontal guide rail 501, cooperates with the horizontal guide rail 501, provides a track and power for the vertical movement of the positioner 5, so that the positioner 5 can move in the horizontal direction along the vertical guide rail 502, adjusts the vertical position of the material taker 6 on the horizontal plane, cooperates with the horizontal guide rail 501 to realize the accurate positioning of the material taker 6 on the horizontal plane, guarantees the accuracy of the material taking and chip mounting position, the mounting plate 503 is installed at the output end of the vertical guide rail 502 and is connected with the mounting table 61, plays a role of connecting the positioner 5 and the material taker 6, transmits the position adjustment function of the positioner 5 to the material taker 6, so that the material taker 6 can accurately move with the movement of the positioner 5, guarantees the position accuracy of the material taker 6 in the material taking and chip mounting process; Referring to Figure 1 , Figure 8 and Figure 9In still another embodiment, the circuit board chip mounter provided by the present application is a dispensing mechanism of a circuit board chip mounter, which is applicable to the circuit board chip mounter described above and comprises a bottom plate 8, which provides a mounting base for the dispensing mechanism and is arranged at the top of the support 1 to bear components of the dispensing mechanism such as the dispenser 9 and the second conveying belt 95, so as to ensure that each component of the dispensing mechanism can be stably mounted and worked at a preset position and provide a stable platform for dispensing operation. The bottom plate 8 is arranged at the top of the support 1, and the dispenser 9 is mounted at the top of the bottom plate 8. The dispenser 9 is the core structure of the dispensing mechanism and is used to realize dispensing operation on the PCB 10. The dispensing head 94 is driven to move by the positioning guide rail 93 according to the position and parameters set by the program, so as to accurately dispense glue at the specified position of the PCB 10 and provide a glue base for subsequent chip mounting operation, so as to ensure that the electronic component can be stably pasted on the PCB 10 by the glue. The dispenser 9 comprises a mounting frame 91, which provides mounting positions for each component of the dispenser 9, such as the controller 92 and the positioning guide rail 93, so as to integrate the components of the dispenser 9, orderly mount and work each component of the dispenser 9 at a preset position, and ensure the stability of the overall structure of the dispenser 9 and the working reliability. The controller 92 is mounted at the outside of the mounting frame 91 and is used to control the working of the dispenser 9, set dispensing parameters such as dispensing amount, dispensing position, dispensing speed, control the movement of the positioning guide rail 93 and the dispensing action of the dispensing head 94, so that the dispenser 9 can automatically and accurately complete dispensing operation according to the preset program, and is the control core of the dispenser 9. The positioning guide rail 93 is arranged at the outside of the mounting frame 91 and provides a track and power for the movement of the dispensing head 94, so as to drive the dispensing head 94 to move in the plane above the PCB 10, make the dispensing head 94 accurately reach each dispensing position on the PCB 10, realize accurate dispensing on the PCB 10, and ensure the accuracy of the dispensing position and the automation of the dispensing operation.

[0015] The output end of the positioning guide rail 93 is mounted and arranged with a dispensing head 94, which directly contacts the PCB board 10 to dispense glue at the designated position of the PCB board 10. The structure and function of the dispensing head 94 ensure that the glue can be dispensed in a suitable form and dosage on the PCB board 10, and it is the direct execution structure of the dispensing operation. The performance and precision of the dispensing head 94 directly affect the dispensing quality. The top of the bottom plate 8 is provided with a conveying belt two 95 connected with the conveying belt one 3. The conveying belt two 95 cooperates with the conveying belt one 3 to convey the PCB board 10 after dispensing, so that the PCB board 10 can be smoothly moved from the dispensing station to the patching station, realizing the automatic transmission of the PCB board 10 between the dispensing and patching stations, ensuring that the patching operation can be continuously and orderly carried out. The top of the conveying belt two 95 is provided with a dispensing jig 96, which is used to fix and position the PCB board 10, so that the PCB board 10 can maintain a stable position during dispensing and patching, ensuring that the dispensing head 94 can accurately dispense glue at the designated position of the PCB board 10, and ensuring that the pick-and-place device 6 can accurately patch at the designated position of the PCB board 10, improving the positional accuracy of dispensing and patching. The inner side of the dispensing jig 96 is placed with the PCB board 10 on the top of the conveying belt one 3; The dispensing jig 96 comprises a base 961 arranged on the conveying belt 95. The base 961 serves as the basic structure of the dispensing jig 96 and provides mounting platforms for components such as the L-shaped partition plate 963, the clamping plate one 964, the clamping plate two 965, etc. These components can be mounted and work at the preset positions, so that the dispensing jig 96 can stably limit and fix the PCB board 10. The outer side of the base 961 is provided with a peripheral baffle 962 mounted on the outer side of the base 961. The peripheral baffle 962 plays a peripheral limiting role for the PCB board 10, preventing the PCB board 10 from escaping from the side during dispensing and patching, and ensuring the positional stability of the PCB board 10 in the dispensing jig 96, thereby providing a stable basic condition for dispensing and patching operations. The inner side of the base 961 is provided with the L-shaped partition plate 963 mounted on the inner side of the base 961 by screws. The L-shaped partition plate 963 is mounted on the inner side of the base 961 by screws and cooperates with the clamping plate one 964 and the clamping plate two 965 to limit the side edges of the PCB board 10. By utilizing its shape characteristics, the L-shaped partition plate 963 positions the PCB board 10 from two adjacent edges, ensuring the positional accuracy of the PCB board 10 in the dispensing jig 96, so that the PCB board 10 can accurately reach the specified position for dispensing and patching. The outer sides of the two ends of the L-shaped partition plate 963 are respectively slidably connected with the clamping plate one 964 and the clamping plate two 965. The clamping plate one 964 is slidably connected to the outer side of one end of the L-shaped partition plate 963 and can slide within a certain range. According to the size of the PCB board 10, the distance between the L-shaped partition plate 963, the clamping plate two 965 and the clamping plate one 964 is adjusted to clamp and fix the side edges of the PCB board 10, adapt to the limiting requirements of PCB boards 10 of different sizes, and improve the universality and adaptability of the dispensing jig 96. The clamping plate two 965 is slidably connected to the outer side of the other end of the L-shaped partition plate 963 and cooperates with the clamping plate one 964 to clamp and fix the PCB board 10 from the other side edge. Together with the clamping plate one 964, the clamping plate two 965 realizes self-adaptive clamping of PCB boards 10 of different sizes and ensures the positional stability of the PCB board 10 during dispensing and patching.

[0016] Working principle: First, place the PCB board 10 on the base 961, then self-adaptively clamp the PCB board 10 by moving the clamping plate one 964 and the clamping plate two 965, turn on the dispensing mechanism, and move the dispensing head 94 driven by the positioning guide rail 93 of the dispenser 9. According to the program setting, the dispensing head 94 dispenses at the specified position of the PCB board 10 on the dispensing jig 96.

[0017] Subsequently, the circuit board patch machine starts, the support 1 as the foundation support, the control box 2 starts to coordinate the operation of each component. The conveyor belt one 3 transports the PCB board 10 to be pasted, the PCB board 10 is transported to the designated position of the conveyor belt one 3, the feeder 7 starts to top up the patch raw material upward, at the same time, the positioner 5 starts to work, the horizontal guide rail 501, the vertical guide rail 502 drive the mounting plate 503 to move, and then the material taking device 6 moves to the appropriate material taking position. Then the air pressure pump 62 on the top of the mounting table 61 starts, the generated airflow is transmitted to the main flow divider 64 through the conveying pipe 63. Inside the main flow divider 64, the rotating disc 645 rotates by the motor 66 driving, the obturator 646 on the rotating disc 645 slides in the annular sliding groove 642, according to the program control, a plurality of obturators 646 cooperate with the corresponding flow dividing channels 643, the opening state of the flow dividing channel 643 is freely combined, and the shape of the flow dividing channel 643 makes the gas increase in pressure to a certain extent during the process of passing through the flow divider, so as to ensure that the gas pressure will not be excessively lost, so as to adapt to different material taking requirements, and the airflow is distributed to the corresponding secondary flow divider 65 through the main flow divider 64. The secondary flow divider 65 has the same structure as the main flow divider 64, which further accurately divides the airflow, so that the airflow is finally transmitted to the material taking head 68.

[0018] At the material taking head 68, the airflow enters the fixed box 681, and acts on the double-head piston 683 in the movable shell 682. Since the outer diameter of the top end of the double-head piston 683 is larger than that of the bottom end, the double-head piston 683 is further pressurized during downward movement, and under the action of air pressure, the inflatable suction cup 684 inflates and pushes the flexible baffle 685 outward, and after the inflatable suction cup 684 completes inflation, the movable shell 682 slides downward against the elastic force of the light spring, and the inflatable suction cup 684 at the bottom of the movable shell 682 approaches and contacts the electronic component to be taken, so as to adsorb the electronic component required for pasting. When the adsorption is completed, the patch raw material is transported to the patching area by the positioner 5, and is positioned under the limiting of the partition plate 4. At the same time, since the feeder 7 is specially made according to the PCB board 10 as a template, the raw material placement position is the position of the PCB board 10 to be pasted, and there is no need for repositioning. At this time, the air pressure pump 62 operates reversely to perform air extraction, so that the double-head piston 683 moves upward, the inflatable suction cup 684 retracts into the flexible baffle 685 to prevent dust from interfering with the subsequent adsorption effect, and because the air pressure at the bottom of the double-head piston 683 decreases, the sliding cylinder 687 in the air jet channel 686 in the movable shell 682 slides outward to make the air outlet hole communicate with the airflow passage in the movable shell 682, so that the airflow enters the air jet channel 686 and is sprayed out by the air jet head 689, so as to blow dry the glue on the patching surface after the patching is completed, and at the same time, the surface of the component is cleaned.

[0019] Finally, it should be noted that the above only describes the preferred embodiments of the present application and is not intended to limit the present application. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art will appreciate that the technical solutions described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalent features, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A circuit board placement machine, comprising a bracket (1), characterized in that: A locator (5) is installed on the top of the bracket (1), and a material remover (6) is installed on the outside of the locator (5) by screws; The material taker (6) includes a mounting platform (61) and a positioning plate (69), an air pressure pump (62) is installed on the top of the mounting platform (61), and a delivery pipe (63) connected to the output end of the air pressure pump (62) is provided in the mounting platform (61), the bottom end of the delivery pipe (63) is fixedly connected to a main diverter (64), the output end of the main diverter (64) is fixedly connected to four secondary diverters (65), the output end of the secondary diverter (65) is fixedly connected to four material taking heads (68), and the multiple material taking heads (68) are installed inside the positioning plate (69); The material taking head (68) includes a fixed box (681) fixedly mounted on the top of the positioning plate (69) and a movable shell (682) slidably connected to the inside of the positioning plate (69), the top of the movable shell (682) is slidably connected to the inside of the fixed box (681), and a light spring is provided between the top of the movable shell (682) and the bottom inner wall of the fixed box (681), the inside of the movable shell (682) is slidably connected to a double-headed piston (683), and the bottom of the movable shell (682) is threadedly connected to an inflatable suction cup (684).

2. A circuit board placement machine according to claim 1, characterized in that: A flexible baffle (685) is installed at the bottom outlet of the movable shell (682), and a plurality of jet channels (686) are opened inside the movable shell (682), and a sliding cylinder (687) is slidably provided at one end of the jet channel (686), a return spring (688) is provided between the outer side of the sliding cylinder (687) and the inner side wall of the jet channel (686), and a nozzle (689) is provided at the other end of the jet channel (686).

3. A circuit board placement machine according to claim 2, characterized in that: The sliding cylinder (687) is provided with a plurality of air outlet holes on its exterior, and a rubber head is provided at one end of the sliding cylinder (687) close to the internal air passage of the movable shell (682), and the inner side of the rubber head is concave.

4. A circuit board placement machine according to claim 1, characterized in that: The outer diameter of the piston at the top end of the double-headed piston (683) is larger than the outer diameter of the piston at the bottom end, and the outside of the movable shell (682) is fixedly connected to a limit ring, and the outer side of the limit ring is slidably connected to the inside of the positioning plate (69).

5. A circuit board placement machine according to claim 1, characterized in that: The main flow divider (64) comprises a flow divider box (641), the top of the flow divider box (641) is sealed and connected to the bottom of the delivery pipe (63), four flow divider channels (643) are opened on the outside of the flow divider box (641), and four flow divider pipes (644) corresponding to the flow divider channels (643) are fixedly connected to the outside of the flow divider box (641), a rotating disk (645) is rotatably connected to the inside of the flow divider box (641), and a plurality of plugging heads ( 646), and an annular groove (642) is provided on the inner side of the rotating plate. The outer side of the plugging head (646) is slidably connected to the inner side of the annular groove (642) and its shape is adapted to the inner end shape of the diverter channel (643). The diverter channel (643) is divided into a boosting section, a stable section and an outer spraying section from the inside to the outside. The inner diameter of the boosting section gradually decreases from the inside to the outside, the inner diameter of the stable section is the same, and the inner diameter of the outer spraying section gradually increases from the inside to the outside. The secondary diverter (65) has the same structure as the main diverter (64).

6. A circuit board placement machine according to claim 5, characterized in that: The center position of the positioning plate (69) is fixedly connected to a motor (66), the rotating disk (645) inside the main diverter (64) is fixedly installed at the output end of the motor (66), the output end of the motor (66) is provided with a transmission (67), and the rotating disks (645) inside the four secondary diverters (65) are driven by the transmission (67).

7. A circuit board placement machine according to claim 1, characterized in that: A control box (2) is installed on the inner side of the bracket (1), a conveyor belt (3) is installed on the top of the bracket (1), a partition (4) is installed on the outer side of the conveyor belt (3), and a loader (7) is installed on the inner side of the bracket (1), and the inner shapes of the two partitions (4) and the internal shape of the loader (7) are adapted to the shape of the positioning plate (69).

8. The circuit board placement machine according to claim 1, characterized in that: The positioner (5) comprises a transverse guide rail (501), a longitudinal guide rail (502) and a mounting plate (503), wherein the transverse guide rail (501) is arranged on the top of the bracket (1), the longitudinal guide rail (502) is mounted outside the output end of the transverse guide rail (501), and the mounting plate (503) is mounted on the output end of the longitudinal guide rail (502) and connected to the mounting platform (61).

9. A dispensing mechanism for a circuit board placement machine, suitable for the circuit board placement machine according to any one of claims 1 to 8, comprising a bottom plate (8), characterized in that: The base plate (8) is arranged on the top of the bracket (1), and a glue dispenser (9) is installed on the top of the base plate (8). The glue dispenser (9) includes a mounting frame (91), a controller (92) is installed on the outside of the mounting frame (91), a positioning guide rail (93) is arranged on the outside of the mounting frame (91), and a glue dispensing head (94) is installed on the output end of the positioning guide rail (93). A conveyor belt 2 (95) connected to the conveyor belt 1 (3) is arranged on the top of the base plate (8), and a glue dispensing fixture (96) is arranged on the top of the conveyor belt 2 (95). A PCB board (10) is placed on the inner side of the glue dispensing fixture (96) and the top of the conveyor belt 1 (3).

10. The dispensing mechanism of a circuit board placement machine according to claim 9, characterized in that: The dispensing jig (96) includes a base (961) arranged on the second conveyor belt (95), an outer baffle (962) is arranged on the outer side of the base (961), an L-shaped baffle (963) is installed on the inner side of the base (961) by screws, and the outer sides of the two ends of the L-shaped baffle (963) are respectively slidably connected to a clamping plate 1 (964) and a clamping plate 2 (965).

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