Polishing device

Abstract

The embodiment of the invention provides a polishing device which comprises an X-axis mechanism, a Y-axis mechanism, a Z-axis mechanism, a first swing mechanism and a second swing mechanism. The Z-axis mechanism is connected with the X-axis mechanism and can move in the X-axis direction under driving of the X-axis mechanism. The first swing mechanism is connected with the Z-axis mechanism and can move in the Z-axis direction under driving of the Z-axis mechanism. The second swing mechanism is connected with the Y-axis mechanism and can move in the Y-axis direction under driving of the Y-axis mechanism. Wherein the first swing mechanism comprises a grinding head assembly capable of swinging in the Y-axis direction, the second swing mechanism comprises a tool assembly capable of swinging in the Y-axis direction, the tool assembly is configured to support a workpiece to be polished in the workpiece polishing process, and the grinding head assembly is configured to machine the workpiece to be polished in the workpiece polishing process; the X-axis direction, the Y-axis direction and the Z-axis direction are perpendicular to one another.

Description

Technical Field

[0001] This specification relates to the field of optical processing equipment, and in particular to a polishing device. Background Art

[0002] The processing of optical components mainly includes processes such as polishing, grinding, and lapping. Polishing is a process that uses grinding or liquid chemical methods to remove surface defects of optical components and make the surface smooth, so as to improve the quality and performance of optical components. At present, polishing devices have been widely used and play an important role in optical manufacturing, electronics, semiconductors and other fields. In order to improve the precision of polishing, polishing devices have gradually adopted automated control technology and intelligent systems. For example, high-precision CNC polishing machines for optical components (such as aspheric optical lenses, etc.) generally perform polishing through multi-axis linkage. For complex surface shapes, it is difficult to make the fixed position of the polishing head contact the normal line of the lens contour for polishing. The polishing of some optical components has very high requirements for surface accuracy. Usually, the lens needs to be bonded to the jig during polishing. The coaxiality and level of the lens bonded to the jig are difficult to adjust, and the process time is very long. It is not convenient to adjust on the machine, and it is not conducive to frequently removing the lens for inspection during processing.

[0003] Therefore, it is hoped to provide a polishing device that can realize multi-axis linkage of polishing of various types of optical elements, and can also realize detection and adjustment of optical elements, thereby improving polishing accuracy. Summary of the Invention

[0004] One of the embodiments of the present specification provides a polishing device, comprising: an X-axis mechanism, a Y-axis mechanism, a Z-axis mechanism, a first swing mechanism and a second swing mechanism; the Z-axis mechanism is connected to the X-axis mechanism and is movable along the X-axis direction under the drive of the X-axis mechanism; the first swing mechanism is connected to the Z-axis mechanism and is movable along the Z-axis direction under the drive of the Z-axis mechanism; the second swing mechanism is connected to the Y-axis mechanism and is movable along the Y-axis direction under the drive of the Y-axis mechanism; wherein, the first swing mechanism includes a grinding head assembly that is swingable around the Y-axis direction, the second swing mechanism includes a tooling assembly that is swingable around the Y-axis direction, the tooling assembly is configured to support the workpiece to be polished during the workpiece polishing process, and the grinding head assembly is configured to process the workpiece to be polished during the workpiece polishing process; the X-axis direction, the Y-axis direction and the Z-axis direction are perpendicular to each other.

[0005] One of the embodiments of the present specification provides a control method for a polishing device, which is used to control the operation of the polishing device as described above. The control method is executed by a host computer, and the control method includes: obtaining the workpiece type of the workpiece to be polished; determining the grinding head type based on the workpiece type; determining a preset swing angle of a tooling assembly based on the grinding head type and the workpiece type, and controlling the tooling assembly to swing to the preset swing angle; controlling the grinding head assembly to swing or not swing around the Y-axis direction based on polishing parameters, and controlling the movement of at least one of the X-axis mechanism, the Y-axis mechanism, and the Z-axis mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] This specification will be further described in the form of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting, and in these embodiments, like numbers represent like structures, wherein:

[0007] Figure 1 is a schematic diagram of the overall structure of a polishing device according to some embodiments of this specification;

[0008] Figure 2 is an exemplary structural diagram of a polishing device according to some embodiments of this specification;

[0009] Figure 3 is an exemplary structural diagram of a first swing mechanism and a second swing mechanism according to some embodiments of this specification;

[0010] Figure 4 is a front view of an exemplary structure of a tooling assembly according to some embodiments of this specification;

[0011] Figure 5 is a top view of an exemplary structure of a tooling assembly according to some embodiments of this specification;

[0012] Figure 6 is an exemplary schematic diagram of adjusting the rotational coaxiality of a workpiece to be polished according to some embodiments of this specification;

[0013] Figure 7 is an exemplary flow chart of a method for controlling a polishing device according to some embodiments of this specification;

[0014] Figure 8 is an exemplary polishing diagram of a symmetrical aspheric lens according to some embodiments of this specification;

[0015] Figure 9 is another exemplary polishing diagram of a symmetrical aspheric lens according to some embodiments of this specification;

[0016] Figure 10is an exemplary polishing diagram of a symmetrical conical lens according to some embodiments of this specification;

[0017] Figure 11 is an exemplary module diagram of a control system of a polishing device according to some embodiments of this specification;

[0018] Explanation of reference numerals: 10 X-axis mechanism; 11 first slider; 12 X-axis driving member; 13 X-axis base; 14 X-axis linear guide; 20 Y-axis mechanism; 21 second slider; 22 Y-axis driving member; 23 Y-axis base; 24 Y-axis linear guide; 30 Z-axis mechanism; 31 third slider; 32 Z-axis driving member; 33 Z-axis base; 34 Z-axis linear guide; 40 first swing mechanism; 410 first swing driving member; 420 grinding head driving member; 43 0 polishing grinding head; 50 second swing mechanism; 510 second swing driving member; 501 workpiece to be polished; 502 first fastening assembly; 503 second fastening assembly; 520 polishing tool; 521 pad; 522 tool panel; 523 tool intermediate plate; 524 elastic component; 525 sealing component; 526 bottom plate; 527 rotating workpiece axis; 530 workpiece rotation driving member; 60 machine platform; 70 coaxiality tester; 80 coaxiality adjustment mechanism. DETAILED DESCRIPTION

[0019] Exemplary embodiments or implementations will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, like numbers in different figures represent like or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments are not intended to represent all implementations consistent with the present application. Instead, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0020] The terms used in this application are for the purpose of describing particular embodiments only and are not intended to limit this application. As used in this application and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0021] It should be understood that the words “first”, “second” and similar terms used in the specification and claims of this application do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as “a” or “an” do not indicate a quantity limitation, but rather indicate the presence of at least one. Unless otherwise indicated, words such as “front”, “rear”, “lower” and / or “upper” are for ease of description only and are not limited to one position or one spatial orientation. Words such as “include” or “comprising” mean that the elements or objects appearing before “include” or “comprising” cover the elements or objects listed after “include” or “comprising” and their equivalents, and do not exclude other elements or objects.

[0022] The processing of optical components primarily involves polishing, grinding, and lapping. To improve polishing precision, polishing equipment is increasingly adopting automated control technologies and intelligent systems, but some challenges remain. For example, during the polishing process, it's difficult to position the polishing head in contact with the normal line of the lens's profile for complex surfaces. Furthermore, the lens is bonded to a jig during polishing, making it difficult to adjust its coaxiality and level. This process is time-consuming, inconvenient to adjust on the machine, and inconvenient to remove and inspect the lens during processing.

[0023] Therefore, some embodiments of the present specification provide a polishing device that can solve the problems of the limited application range of the above-mentioned polishing device and the difficulty in adjusting the coaxiality and levelness of the workpiece to be polished.

[0024] The polishing device is used to polish a workpiece to be polished. The workpiece to be polished is a workpiece that needs to be polished. In some embodiments, the workpiece to be polished can be an optical element, such as an optical lens. Optical lenses can include various types, such as symmetrical aspheric lenses, symmetrical conical lenses, complex curved surfaces, or other types of optical lenses. These are only examples and do not limit the type of workpiece to be polished. In some embodiments, the workpiece to be polished can also be an optical element such as an optical prism, a filter, a lens, or a combination of multiple optical elements. In some embodiments, the workpiece to be polished can also be a plastic workpiece, a ceramic workpiece, a metal workpiece, etc. The examples of the workpiece to be polished here are only examples and do not limit the type of the workpiece to be polished.

[0025] Figure 1 It is a schematic diagram of the overall structure of the polishing device shown in some embodiments of this specification.

[0026] In some embodiments, the polishing apparatus may include an X-axis mechanism 10, a Y-axis mechanism 20, a Z-axis mechanism 30, a first swing mechanism 40, and a second swing mechanism 50. In some embodiments, the X-axis mechanism 10, the Y-axis mechanism 20, and the Z-axis mechanism 30 may be mounted on a table 60 of the polishing apparatus.

[0027] The machine platform 60 is the base of the polishing apparatus. In some embodiments, the machine platform 60 includes mounting bases for various axes, such as a Y-axis base, an X-axis base, and a Z-axis base. The X-axis base is located at the top of the machine platform 60; the Y-axis base is located at the bottom; and the Z-axis base is located in the middle of the machine platform 60. The X-axis mechanism 10 is mounted on the X-axis base; the Y-axis mechanism 20 is mounted on the Y-axis base; and the Z-axis mechanism 30 is mounted on the Z-axis base.

[0028] like Figure 1 As shown, the polishing device 100 may include an X-axis mechanism 10 , a Y-axis mechanism 20 , a Z-axis mechanism 30 , a first swing mechanism 40 , and a second swing mechanism 50 .

[0029] The X-axis mechanism 10 refers to a structure arranged in the X-axis direction of the polishing device. The X-axis mechanism 10 can drive the device installed in the X-axis direction to move along the X-axis direction within a preset range. The preset range is set according to actual needs. Figure 1 As shown, the X-axis direction may be the horizontal direction after the polishing device 100 is fixed. The X-axis mechanism 10 is fixed to the upper portion of the machine table 60 of the polishing device 100.

[0030] The Y-axis mechanism 20 is a driving device structure arranged in the Y-axis direction of the polishing device, which can drive the device installed in the Y-axis direction to move along the Y-axis within a preset range. The preset range is set according to actual needs. Figure 1 As shown, the Y-axis direction may be a horizontal direction perpendicular to the X-axis direction after the polishing device 100 is fixed. The Y-axis mechanism 20 is fixed to the middle of the machine table 60 of the polishing device 100.

[0031] The Z-axis mechanism 30 is a driving device structure arranged in the Z-axis direction of the polishing device, which can drive the device installed in the Z-axis direction to move along the Z-axis within a preset range. The preset range is set according to actual needs. Figure 1 As shown, the Z-axis direction may be a vertical direction perpendicular to the X-axis direction and the Y-axis direction after the polishing device 100 is fixed. The Z-axis mechanism 30 is located at the lower part of the machine table 60 of the polishing device 100.

[0032] In some embodiments, the X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other. Figure 1 As shown, the X-axis is perpendicular to the Z-axis, and the Y-axis is perpendicular to the plane formed by the X-axis and the Z-axis. By coordinating the X-axis, Y-axis, and Z-axis directions, multi-axis linkage polishing can be achieved, thereby increasing the applicability of the polishing device.

[0033] In some embodiments, the Z-axis mechanism 30 is connected to the X-axis mechanism 10 and is movable along the X-axis direction under the drive of the X-axis mechanism 10. Figure 1As shown, the Z-axis mechanism 30 can be slidably connected to the X-axis mechanism 10. Driven by the X-axis mechanism 10, the Z-axis mechanism 30 can move back and forth along the X-axis direction.

[0034] Figure 2 is an exemplary structural diagram of a polishing device according to some embodiments of the present specification.

[0035] In some embodiments, as Figure 2 As shown, the X-axis mechanism 10 may include an X-axis driving member 12 mounted on an X-axis base 13 , an X-axis linear guide 14 , and a first slider 11 slidable along the X-axis linear guide 14 .

[0036] The X-axis driver 12 is a device for providing a power source for movement in the X-axis direction. For example, the X-axis driver can be various motors, such as a servo motor. The X-axis driver 12 is mounted on the X-axis base 13. The X-axis linear guide 14 is a guide structure arranged along the X-axis direction. The X-axis linear guide 14 is fixedly mounted on the X-axis base 13. The length of the X-axis linear guide 14 is less than the length of the X-axis base 13. The first slider 11 is a component that can slide in the X-axis direction. The first slider 11 is mounted on the X-axis base 13. The first slider 11 is slidably connected to the X-axis linear guide 14, and the first slider 11 can move in the X-axis direction along the X-axis linear guide 14.

[0037] In some embodiments, the Z-axis mechanism 30 may be disposed on the first slider 11. The Z-axis mechanism 30 is fixedly connected to the first slider 11, and the movement of the first slider 11 in the X-axis direction may drive the Z-axis mechanism 30 to move synchronously in the X-axis direction.

[0038] In some embodiments, as Figure 2 As shown, the Y-axis mechanism 20 includes a Y-axis driving member 22 mounted on a Y-axis base 23 , a Y-axis linear guide 24 , and a second slider 21 slidable along the Y-axis linear guide 24 .

[0039] The Y-axis driver is a device for providing a power source for movement in the Y-axis direction. For example, the Y-axis driver 22 can be various motors, such as a servo motor. The Y-axis driver 22 is mounted on the Y-axis base 23. The Y-axis linear guide 24 is a guide structure arranged along the Y-axis direction. The Y-axis linear guide 24 is fixedly mounted on the Y-axis base 23. The length of the Y-axis linear guide 24 is less than the length of the Y-axis base 23. The second slider 21 is a component that can slide in the Y-axis direction. The second slider 21 is mounted on the Y-axis base 23. The second slider 21 is slidably connected to the Y-axis linear guide 24, and the second slider 21 can move in the Y-axis direction along the Y-axis linear guide 24.

[0040] In some embodiments, the second swing mechanism can be provided on the second slider 21. Figure 2As shown, the second swing mechanism 50 is fixedly connected to the second slider 21 , and the movement of the second slider 21 in the Y-axis direction can drive the synchronous movement of the second swing mechanism 50 in the Y-axis direction.

[0041] In some embodiments, as Figure 2 As shown, the Z-axis mechanism 30 includes a Z-axis driving member 32 mounted on a Z-axis base 33 , a Z-axis linear guide rail 34 , and a third slider 31 slidable along the Z-axis linear guide rail 34 .

[0042] The Z-axis driver 32 is a device for providing a power source for movement in the Z-axis direction. For example, the Z-axis driver 32 can be various motors, such as a servo motor. The Z-axis driver 32 is mounted on the Z-axis base 33. The Z-axis linear guide 34 is a guide rail structure arranged along the Z-axis direction. The Z-axis linear guide 34 is fixedly mounted on the Z-axis base 33. The length of the Z-axis linear guide 34 is less than the length of the Z-axis base 33. The third slider 31 is a component that can slide in the Z-axis direction. The third slider 31 is mounted on the Z-axis base 33. The third slider 31 is slidably connected to the Z-axis linear guide 34 and can move in the Z-axis direction along the Z-axis linear guide 34.

[0043] In some embodiments, the first swing mechanism 40 may be provided on the third slider 31. Figure 2 As shown, the first swing mechanism 40 is fixedly connected to the third slider 31 , and the movement of the second slider 21 in the Z-axis direction can drive the synchronous movement of the first swing mechanism 40 in the Z-axis direction.

[0044] In some embodiments of the present specification, by respectively arranging corresponding driving parts, linear guides and sliders on the X-axis, Y-axis and Z-axis, the sliders can be driven to move in the X-axis direction, the Y-axis direction and the Z-axis direction respectively, thereby respectively driving the Z-axis mechanism, the second swing mechanism and the first swing mechanism connected to the slider to move, thereby realizing multi-axis linkage and adjusting the displacement in multiple directions, so that more complex workpieces to be polished can be polished.

[0045] In some embodiments, the X-axis mechanism 10 may further include a first ball screw and a first nut mounted on the X-axis base 13. The first ball screw and the first nut are used to connect the first slider 11 and the X-axis driver 12, thereby converting the rotational motion generated by the X-axis driver 12 into axial motion, driving the first slider 11 to move along the X-axis linear guide 14, thereby driving the Z-axis mechanism 30 on the first slider 11 to move along the X-axis linear guide 14.

[0046] In some embodiments, the Y-axis mechanism 20 may further include a second ball screw and a second nut mounted on the Y-axis base 23. The second ball screw and the second nut are used to convert the rotational motion of the Y-axis mechanism 20 into axial motion. The second ball screw and the second nut are used to connect the second slider 21 and the Y-axis driver 22, thereby converting the rotational motion generated by the Y-axis driver 22 into axial motion, driving the second slider 21 to move along the Y-axis linear guide 24, thereby driving the second swing mechanism on the second slider 21 to move along the Y-axis linear guide 24.

[0047] In some embodiments, the Z-axis mechanism 30 may further include a third ball screw and a third nut mounted on the Z-axis base 33. The third ball screw and the third nut are used to connect the third slider 31 and the Z-axis driver 32, thereby converting the rotational motion generated by the Z-axis driver 32 into axial motion, driving the third slider 31 to move along the Z-axis linear guide 34, thereby driving the first swing mechanism 40 on the third slider 31 to move along the Z-axis linear guide 34.

[0048] The swing mechanism refers to a mechanism that can swing along a certain direction. In some embodiments, the swing mechanism may include a first swing mechanism 40 and a second swing mechanism 50.

[0049] In some embodiments, the first swing mechanism 40 may be connected to the Z-axis mechanism 30 and may be movable along the Z-axis direction under the drive of the Z-axis mechanism 30. Figure 1 As shown, the first swing mechanism 40 can be slidably connected to the Z-axis mechanism 30 . Driven by the Z-axis mechanism 30 , the first swing mechanism 40 can move back and forth along the Z-axis direction.

[0050] In some embodiments, the first swing mechanism 40 may include a grinding head assembly that is swingable about the Y-axis direction.

[0051] The grinding head assembly is a combined device structure for grinding a workpiece to be polished. In some embodiments, the grinding head assembly can be configured to process the workpiece to be polished during the workpiece polishing process. The workpiece to be polished refers to the workpiece that needs to be polished. For more information about the workpiece to be polished, please refer to the above and related descriptions. In some embodiments, such as Figure 3 As shown, the workpiece 501 to be polished is located below the grinding head assembly.

[0052] In some embodiments, the grinding head assembly may include a polishing grinding head 430. The polishing grinding head 430 is a device for polishing and grinding a workpiece. The polishing grinding head 430 removes impurities, burrs, and other rough parts on the workpiece surface through friction and grinding with the workpiece surface, making the workpiece surface smooth and bright, thereby increasing the aesthetics and service life of the workpiece. In some embodiments, such as Figure 3As shown, the polishing head 430 is fixed below the grinding head assembly, and the polishing head 430 can rotate relative to the grinding head assembly.

[0053] In some embodiments, the polishing head 430 may include at least one of a spherical polishing head and a cylindrical polishing head. Spherical polishing heads have a spherical shape and are suitable for machining curved or uneven workpiece surfaces, enabling uniform polishing and improving surface finish. Cylindrical polishing heads have a cylindrical shape and a cylindrical working portion. Cylindrical polishing heads can quickly smooth workpiece surfaces, remove burrs and roughness, and improve surface quality, making them suitable for plane machining or edge polishing.

[0054] In some embodiments, the first swing mechanism 40 may further include a first swing assembly, the first swing assembly is mounted on the third slider 31, the grinding head assembly is mounted on the first swing assembly, and the first swing assembly can drive the grinding head assembly to swing around the Y axis. For more information, please refer to Figure 3 Related instructions.

[0055] The second swing mechanism 50 is a device structure for driving the tooling assembly to swing.

[0056] In some embodiments, the second swing mechanism 50 is connected to the Y-axis mechanism 20 and is movable along the Y-axis direction under the drive of the Y-axis mechanism 20. Figure 1 As shown, the second swing mechanism 50 can be slidably connected to the Y-axis mechanism 20. Under the drive of the Y-axis mechanism 20, the second swing mechanism 50 can move back and forth along the Y-axis direction.

[0057] In some embodiments, the second swing mechanism 50 may include a tooling assembly that is swingable about the Y-axis. The tooling assembly refers to a component that plays a supporting role. In some embodiments, the tooling assembly can be configured to support the workpiece 501 to be polished during the workpiece polishing process.

[0058] In some embodiments, the grinding head assembly and the tooling assembly can swing about the Y-axis within an angle range of -90° to 90°. The swing angle refers to the angle between the central axis of the grinding head assembly or the tooling assembly and the swing axis. For example, the swing axis can be the Z-axis, and the swing angle refers to the angle at which the central axis of the tooling assembly deviates from the Z-axis. In some embodiments, both the grinding head assembly and the tooling assembly can swing about the Y-axis within a range of -90° to 90°, thereby enabling multi-angle polishing of the workpiece to be polished.

[0059] In some embodiments, the tooling assembly may include a polishing tool 520. The polishing tool 520 may be configured to secure a workpiece 501 to be polished during a workpiece polishing process.

[0060] In some embodiments, the second swing mechanism may further include a second swing assembly, the second swing assembly is mounted on the second slider 21, the tooling assembly is mounted on the second swing assembly, and the second swing assembly can drive the tooling assembly to swing around the Y axis. Figure 3 And related instructions.

[0061] In some embodiments, the tooling assembly may further include a rotating workpiece shaft 527 and a negative pressure source, and the polishing tooling 520 may include a pad 521, a tooling plate, and a base plate 526, etc. For details, see below. Figure 4 And related instructions.

[0062] In some embodiments, the grinding head type can be determined by the workpiece type; based on the grinding head type and the workpiece type, the preset swing angle of the second swing axis can be determined, and the second swing axis can be controlled to swing to the preset swing angle; based on the polishing parameters, the grinding head assembly and the tooling assembly are controlled to swing around the Y-axis direction, and at least one of the X-axis mechanism 10, the Y-axis mechanism 20, the Z-axis mechanism 30 and the first swing mechanism 40 is controlled to move to achieve polishing. For more information, please refer to Figure 7 Related description. In some embodiments, by adjusting the swing amplitude of the first swing mechanism 40 and / or the second swing mechanism 50, precise adjustment of the polishing angle of the workpiece 501 to be polished can be achieved. If the two parts (the first swing mechanism 40 and the second swing mechanism 50) swing at the same time, it may cause the accuracy to deteriorate and the amount of calculation to increase. Therefore, in some embodiments, the first swing mechanism 40 and / or the second swing mechanism 50 can be adjusted separately. For example, the first swing mechanism 40 is adjusted to a preset fixed angle, and then the swing angle of the second swing mechanism 50 is adjusted; for another example, the second swing mechanism 50 is adjusted to a preset fixed angle, and then the swing angle of the first swing mechanism 40 is adjusted.

[0063] In some embodiments of this specification, by providing a first swing mechanism and a second swing mechanism, the upper and lower structures of the polishing device can swing, thereby better adjusting the polishing angle. Furthermore, by coordinating the X-axis mechanism, the Y-axis mechanism, and / or the Z-axis mechanism with the first swing mechanism and / or the second swing mechanism, a variety of workpieces can be polished, thereby increasing the use cases and polishing accuracy of the polishing device.

[0064] It should be noted that the above description of the polishing device and its mechanisms is for convenience only and does not limit this specification to the scope of the embodiments. It is understood that those skilled in the art, after understanding the principles of the device, may arbitrarily combine the various mechanisms without departing from these principles.

[0065] Figure 3It is an exemplary structural diagram of the first swing mechanism and the second swing mechanism shown in some embodiments of this specification.

[0066] In some embodiments, the first swing mechanism 40 may further include a first swing assembly. The first swing assembly is a component that drives the grinding head assembly to swing. For more information about the first swing mechanism 40 and the grinding head assembly, see Figure 1 And related instructions.

[0067] In some embodiments, the grinding head assembly is mounted on a first swing assembly, and the first swing assembly can drive the grinding head assembly to swing around the Y-axis direction. Figure 1 And related instructions.

[0068] In some embodiments, the first swing assembly is mounted on the third slider 31. When the Z-axis driver 32 is working, the third slider 31 can be driven to move along the Z-axis direction, thereby driving the first swing assembly to move along the Z-axis direction. Figure 1 And related instructions.

[0069] In some embodiments, the first swing assembly includes a first swing drive 410. The first swing drive 410 is a power source for driving the polishing grinding head 430 to swing around the Y-axis. For example, the first swing drive 410 can be configured as a limited angle motor, and the rotor of the limited angle motor can swing around the Y-axis within a swing angle range of -90° to 90°. In some embodiments, as Figure 3 As shown, the first swing driving member 410 can be installed on the third slider 31. For details about the polishing grinding head 430, see Figure 1 And related instructions.

[0070] In some embodiments, the grinding head assembly may include a grinding head driver 420. The grinding head driver 420 is a power source for driving the polishing grinding head 430 to rotate at high speed. For example, the grinding head driver 420 may be a high-speed grinding head motor. High-speed grinding head motors are widely used in grinding, drilling, and milling, and are also suitable for high-speed grinding of micro-holes and grooves in bearings.

[0071] In some embodiments, as Figure 3 As shown, the grinding head driving member 420 can be installed on the first swing driving member 410. When polishing the workpiece 501, the grinding head driving member 420 can drive the polishing grinding head 430 to rotate at high speed to achieve the polishing effect of the polishing grinding head 430.

[0072] In some embodiments, the Z-axis driving member 32 can drive the third slider 31 to move along the Z-axis direction, thereby driving the first swing driving member 410 on the third slider 31 to move along the Z-axis direction, and further driving the polishing grinding head 430 on the grinding head driving member 420 to move along the Z-axis direction. For details about the Z-axis driving member 32, see Figure 2 And related instructions.

[0073] In some embodiments of this specification, the polishing head 430 can move in various directions based on the cooperation of the first swing drive 410, the X-axis drive 12, the Z-axis drive 32 and the grinding head drive 420 to polish different parts of the workpiece 501 to be polished.

[0074] In some embodiments, the second swing mechanism 50 may further include a second swing assembly. The second swing assembly is a component that drives the tooling assembly to swing. For details about the tooling assembly, see Figure 1 And related instructions.

[0075] In some embodiments, the tooling assembly may be mounted on a second swing assembly, and the second swing assembly may drive the tooling assembly to swing around the Y-axis.

[0076] In some embodiments, the second swing assembly can be mounted on the second slider 21. When the Y-axis driver 22 is in operation, the second slider 21 can be driven to move along the Y-axis direction, thereby driving the second swing assembly to move along the Y-axis direction. For details about the second slider 21 and the Y-axis driver 22, see Figure 2 And related instructions.

[0077] In some embodiments, the second swing assembly includes a second swing drive 510. The second swing drive 510 is a power source for driving the tooling assembly to swing around the Y-axis direction, for example, a limited angle motor. Figure 3 As shown, the second swing driving member 510 is installed on the second sliding block 21.

[0078] In some embodiments, the tooling assembly includes a workpiece rotation driver 530. The workpiece rotation driver 530 is a power source for driving the polishing tooling 520 to rotate, for example, a stepper motor. Figure 3 As shown, when the workpiece 501 to be polished is being polished, the workpiece rotation driving member 530 can drive the workpiece 501 to be polished to rotate so as to achieve polishing of different parts of the workpiece 501 to be polished.

[0079] In some embodiments, as Figure 3As shown, the polishing tooling 520 is located on the workpiece rotation drive member 530, and the Y-axis drive member 22 can drive the second slider 21 to move along the X-axis direction, thereby driving the second swing drive member 510 on the second slider 21 to move along the Y-axis direction, and then driving the polishing tooling 520 on the workpiece rotation drive member 530 to move along the Y-axis direction. The polishing tooling 520 drives the workpiece to be polished 501 to move along the Y-axis direction.

[0080] In some embodiments of the present specification, the workpiece to be polished can be moved and adjusted based on the cooperation of the second swing driving member, the Y-axis driving member and the workpiece rotation driving member.

[0081] In some embodiments of this specification, the first swing assembly, the third slider, and the grinding head assembly are assembled together to achieve swinging of the grinding head assembly; and the second swing assembly, the second slider, and the tooling assembly are assembled together to achieve swinging of the tooling assembly. This allows for positional adjustment of the grinding head assembly and the tooling assembly.

[0082] It should be noted that the above description of the first and second swing assemblies and their components is for ease of description only and does not limit this specification to the embodiments described. It is understood that those skilled in the art, after understanding the principles of the device, may arbitrarily combine the various components without departing from these principles.

[0083] Figure 4 is a front view of an exemplary structure of a tooling assembly according to some embodiments of the present specification.

[0084] In some embodiments, the tooling assembly further includes a rotating workpiece axis 527 and a negative pressure source.

[0085] In some embodiments, the rotating workpiece shaft 527 is a device that connects the workpiece rotary drive 530 and the polishing tool 520. In some embodiments, as Figure 4 As shown, the rotating workpiece axis 527 can be disposed along the central axis DD of the polishing tool 520 .

[0086] A negative pressure source (not shown) is used to attract the workpiece 501 to the surface of the polishing tool 520. In some embodiments, the negative pressure source can be configured as a vacuum suction device. The polishing tool 520 is provided with a central hole structure (e.g., a central hole, which can be used to provide a channel for vacuum suction).

[0087] In some embodiments, the polishing tool 520 may include a pad 521 , a tooling plate, and a base plate 526 .

[0088] The pad 521 is a structure for supporting the workpiece 501 to be polished. In some embodiments, the pad 521 may include a pad concave surface, a pad flat surface, and a first hole. The upper surface of the pad 521 includes the pad concave surface. The pad concave surface can be used to support the workpiece 501 to be polished. The pad flat surface is the lower surface of the pad. Figure 4 As shown, the workpiece 501 to be polished can be placed on the concave surface of the pad 521 and fixed by vacuum adsorption through the negative pressure source and the hole structure in the center of the polishing tool 520. The concave surface design of the pad can limit the radial displacement of the workpiece 501 to be polished, making polishing easier.

[0089] The first hole is a channel on the pad 521 that provides a gas conduction path. The first hole penetrates the pad 521. Penetrating means penetrating along the thickness direction. In some embodiments, the surface direction of the pad concave surface and the pad flat surface is parallel to the radial direction of the first hole.

[0090] The tooling plate is a structural member used to support the pad 521. In some embodiments, the tooling plate includes a first plate surface, a second plate surface, and a second hole. The first plate surface is the upper surface of the tooling plate, and the second plate surface is the lower surface of the tooling plate. In some embodiments, the first plate surface includes a recess. Figure 4 As shown, the pad surface of the pad 521 can be placed against the recess of the first plate surface.

[0091] The second hole is a channel on the tooling plate that provides a gas conduction path. In some embodiments, the surface direction of the first plate surface and the second plate surface is parallel to the radial direction of the second hole.

[0092] In some embodiments, the bottom plate 526 includes a bottom plate plane, a lower axis plane, and a third hole. The bottom plate plane is the upper surface of the bottom plate 526, and the lower axis plane is the lower surface of the bottom plate 526. In some embodiments, the second plate surface of the tooling plate is mounted on the bottom plate plane.

[0093] The third hole is a channel providing a gas conduction path on the bottom plate 526. In some embodiments, the plane direction of the bottom plate plane and the lower shaft plane is parallel to the radial direction of the third hole, and the lower shaft plane is mounted on the rotating workpiece shaft 527.

[0094] In some embodiments, the first, second, and third holes are interconnected, forming a conductive structure within the polishing tool 520 that is electrically connected to the negative pressure source. When the negative pressure source is in operation, the conductive structure formed by the first, second, and third holes can attract the workpiece 501 to be polished, causing it to adhere to the surface of the polishing tool 520. In some embodiments, the number of the first, second, and third holes can be one or more, and the number and size of the first, second, and third holes can be adjusted based on actual needs.

[0095] In some embodiments, the polishing tool 520 may only include a tool plate and a base plate 526, without a pad 521. The workpiece 501 to be polished may be placed in the recess of the first surface of the tool plate and fixed by vacuum adsorption.

[0096] In some embodiments of the present specification, by arranging a rotating workpiece shaft, a pad, a tooling plate and a base plate on the polishing tool, and setting a first hole, a second hole and a third hole through the pad, the tooling plate and the base plate for conduction, the vacuum adsorption fixation of the workpiece to be polished can be achieved by a negative pressure source. The workpiece to be polished 501 is supported by the concave surface of the pad, and the position of the workpiece to be polished in the concave surface of the pad can be adjusted in the radial direction, thereby facilitating the subsequent adjustment of the rotational coaxiality of the workpiece to be polished. The pad plane of the pad 521 abuts against the recess of the first plate surface, and the position of the pad in the recess of the first plate surface can also be adjusted in the radial direction, which is also convenient for the subsequent adjustment of the rotational coaxiality of the workpiece to be polished. Adjusting the rotational coaxiality of the workpiece to be polished by adjusting the position of the pad in the radial direction can simplify the operation and reduce the wear of the workpiece to be polished.

[0097] In some embodiments of the present specification, the size of the recess included in the pad concave surface and / or the first plate surface in the radial direction can be set according to actual needs, thereby achieving the amplitude of the position adjustment of the workpiece to be polished in the pad concave surface and / or the amplitude of the position adjustment of the pad in the recess of the first plate surface, thereby achieving different degrees of adjustment of the rotational coaxiality of the workpiece to be polished. For example, the amplitude of the position adjustment of the pad in the recess of the first plate surface is greater than the amplitude of the position adjustment of the workpiece to be polished in the pad concave surface, and the coarse adjustment of the rotational coaxiality of the workpiece to be polished is achieved by adjusting the position of the pad in the recess of the first plate surface, and the fine adjustment of the rotational coaxiality of the workpiece to be polished is achieved by adjusting the position of the workpiece to be polished in the pad concave surface. For more information on coaxiality and rotational coaxiality, please refer to the following and Figure 6 Related description.

[0098] In some embodiments, the tooling plate includes a tooling panel 522 and a tooling middle plate 523, and the second hole includes a first sub-hole and a second sub-hole. Figure 4 As shown, the first sub-hole is located on the tooling panel 522, and the second sub-hole is located on the tooling middle plate 523. The first plate surface is the upper surface of the tooling panel 522, and the second plate surface is the lower surface of the tooling middle plate 523.

[0099] In some embodiments, the first hole, the first sub-hole, the second sub-hole and the third hole are connected and connected to the negative pressure source. Figure 4 As shown, a first hole is opened in the center of the pad 521 , a first sub-hole is opened in the center of the tooling panel 522 , a second sub-hole is opened in the center of the tooling middle plate 523 , and a third hole is opened in the center of the bottom plate 526 .

[0100] In some embodiments, the polishing tool 520 may further include an elastic component 524 and a sealing component 525 .

[0101] The sealing assembly 525 is a component used to seal the polishing tool 520. For example, the sealing assembly 525 can include any component with a sealing function, such as a sealing ring. In some embodiments, the sealing assembly 525 can be set on the contact surface of the tooling middle plate 523 and the bottom plate 526, such as the lower surface of the tooling panel 522 or the upper surface of the bottom plate 526. For example, Figure 4 As shown, the sealing assembly 525 can be disposed on the upper surface of the bottom plate 526. Sealing by the sealing assembly 525 can ensure that the negative pressure source vacuum adsorbs the workpiece 501 to be polished.

[0102] The elastic component 524 is a component for providing elasticity. Figure 4 As shown, the elastic component 524 can be a disc spring washer, etc. The disc spring washer is in a conical disk shape and can be used singly or in multiples in series or in parallel.

[0103] In some embodiments, the tooling panel 522, the tooling intermediate plate 523, and the bottom plate 526 each include at least one screw hole with a preset corresponding relationship. The preset corresponding relationship is a correspondence between the screw holes on the tooling panel 522, the tooling intermediate plate 523, and the bottom plate 526, for example, a one-to-one correspondence between the centers of the screw holes.

[0104] In some embodiments, the screw holes between the tooling panel 522 and the tooling intermediate plate 523 can be fastened by a first fastening assembly 502. By controlling the tightness of the first fastening assembly 502, the position of the tooling panel 522 and the tooling intermediate plate 523 can be adjusted, thereby adjusting the first coaxiality between the tooling panel 522 and the tooling intermediate plate 523. The first fastening assembly 502 is a component used to fasten the tooling panel 522 and the tooling intermediate plate 523. For example, the first fastening assembly 502 can include screws (such as hexagon socket screws), with the number of screws corresponding to the number of screw holes. The coaxiality requirements between different structural components (the corresponding coaxiality thresholds) can be preset according to actual needs. The first coaxiality can represent the degree of overlap between the central axes of the tooling panel and the tooling intermediate plate. By adjusting the tightness of the first fastening assembly 502, the first coaxiality between the tooling panel 522 and the tooling intermediate plate 523 can be adjusted.

[0105] In some embodiments, the tooling middle plate 523 and the base plate 526 can be sealed by a sealing assembly 525, and the screw holes between the tooling middle plate 523 and the base plate 526 can be fastened by the elastic assembly 524 and the second fastening assembly 503, and the level of the polishing tooling 520 can be adjusted. The second fastening assembly 503 is a component for fastening the tooling middle plate 523 and the base plate 526. The second fastening assembly 503 may include screws (such as hexagon socket screws, etc.), and the number of screws corresponds to the number of screw holes. Level means that the central axis of the polishing tooling 520 is perpendicular to the horizontal plane. The level of the polishing tooling 520 can be adjusted by adjusting the tightness of the first fastening assembly 502. In some embodiments, the second fastening assembly 503, the elastic assembly 524 and the screw holes can be set to the same number.

[0106] Figure 5 FIG. 1 is a top view of an exemplary structure of a tooling assembly according to some embodiments of this specification. Figure 5 As shown, the tooling panel 522 may include 4 screw holes, the tooling middle plate 523 may include 8 screw holes, and the bottom plate 526 may include 4 screw holes. The above screw holes may be evenly spaced and concentrically distributed. The first fastening assembly 502 includes 4 hexagon socket screws, and the second fastener 503 includes 4 hexagon socket screws. The elastic assembly 524 includes four sets of disc spring washers, each set of disc spring washers is used in conjunction with each hexagon socket screw. The tooling panel 522 and the tooling middle plate 523 are fixed by 4 hexagon socket screws, and the tooling middle plate 523 and the bottom plate 526 are fixed by 4 hexagon socket screws and four sets of disc spring washers, and the level of the polishing tool 520 is adjusted.

[0107] By providing an elastic component and a sealing component, the polishing tool achieves a better sealing effect, thereby ensuring the vacuum adsorption effect of the workpiece to be polished. Screw holes are provided on the tooling panel, tooling middle plate, and bottom plate, and are fastened using the first fastening component and the second fastening component. By adjusting the tightness of the fastening, the first coaxiality between the tooling panel and tooling middle plate, as well as the level of the polishing tool, can be adjusted, thereby improving the precision and accuracy of polishing.

[0108] In some embodiments, the second coaxiality between the polishing tool 520 and the workpiece rotary drive 530 and the third coaxiality between the workpiece to be polished 501 and the workpiece rotary drive 530 can be adjusted by the first fastening assembly 502. Figure 4 As shown, the central axis of the workpiece rotation driving member 530 is the axis DD.

[0109] It is understandable that there may be a size difference between the second coaxiality and the third coaxiality during the actual installation process. The second coaxiality can characterize the degree of overlap of the central axis between the polishing tool and the workpiece rotary drive member. The third coaxiality can characterize the degree of overlap of the central axis between the workpiece to be polished and the workpiece rotary drive member. In some embodiments, the third coaxiality needs to be less than or equal to 2 microns, that is, the coaxiality threshold corresponding to the third coaxiality is 2 microns. The coaxiality threshold corresponding to the second coaxiality can be set according to actual needs. By controlling the tightness of the first fastening component 502, the position of the tooling panel 522 and the tooling intermediate plate 523 can be adjusted, thereby adjusting the position of the polishing tool 520 relative to the workpiece rotary drive member 530, and the position of the workpiece to be polished 501 relative to the workpiece rotary drive member 530, thereby adjusting the second coaxiality and the third coaxiality.

[0110] In some embodiments, the level of the tooling panel 522 and the surface level of the polishing tool 520 relative to the workpiece rotary drive 530 can be adjusted by the second fastening assembly 503. The level of the tooling panel 522 includes the surface of the tooling panel 522 coinciding with a horizontal plane. The surface level of the polishing tool 520 relative to the workpiece rotary drive 530 includes the contact surface of the polishing tool 520 and the workpiece rotary drive 530 coinciding with a horizontal plane. By controlling the tightness of the second fastening assembly 503, the horizontal position of the tooling panel 522 can be adjusted, thereby adjusting the position of the polishing tool 520 relative to the workpiece rotary drive 540, and thus adjusting the level of the tooling panel 522 and the surface level of the polishing tool 520 relative to the workpiece rotary drive 540.

[0111] In some embodiments of the present invention, by adjusting the second coaxiality and the third coaxiality, the coaxiality of the polishing tool and the workpiece to be polished with the workpiece rotating drive member can be ensured. By ensuring that the tool panel is level and the surface of the polishing tool relative to the workpiece rotating drive member is level, the polishing tool and the workpiece to be polished will not be offset when the workpiece rotating drive member is driven, thereby improving the accuracy of polishing.

[0112] It should be noted that the above description of the tooling assembly and its components is for convenience only and does not limit this specification to the scope of the embodiments. It is understood that those skilled in the art, after understanding the principles of the device, may arbitrarily combine the various components without departing from such principles.

[0113] Figure 6 1 is an exemplary schematic diagram of adjusting the rotational coaxiality of a workpiece to be polished according to some embodiments of the present specification.

[0114] In some embodiments, the second swing mechanism 50 further includes a coaxiality tester 70 and a coaxiality adjustment mechanism 80 .

[0115] The coaxiality tester 70 is a device for measuring coaxiality. For example, the coaxiality tester 70 can be configured as a laser coaxiality tester, etc. The laser coaxiality tester can achieve accurate coaxiality measurement using laser.

[0116] In some embodiments, the coaxiality tester 70 can test the rotational coaxiality of the workpiece 501. The rotational coaxiality of the workpiece 501 can reflect the degree of overlap between the central axes of the workpiece 501 at different positions during rotation.

[0117] The coaxiality adjustment mechanism 80 is a device for correcting coaxiality deviation. In some embodiments, the coaxiality adjustment mechanism 80 can be a coaxiality adjustment mechanism for the pad 521. By adjusting the displacement of the pad 521, the rotational coaxiality of the workpiece 501 to be polished is adjusted, thereby ensuring the accuracy and effectiveness of the polishing process.

[0118] In some embodiments, the coaxiality adjustment mechanism 80 can adjust the rotational coaxiality by moving the adjustment pad 521 along the central axis direction and / or along the horizontal plane.

[0119] In some embodiments, the coaxiality tester 70 and the coaxiality adjustment mechanism 80 can be installed on the machine platform 60, for example, they can be installed at the lower part of the machine platform 60 near the tooling assembly, or they can be installed at other suitable locations on the machine platform 60. In some embodiments, such as Figure 6 As shown, the working surface of the coaxiality tester 70 can be set horizontally with the workpiece 501 to be polished, and the working surface of the coaxiality adjustment mechanism 80 can be set horizontally with the pad 521.

[0120] In some embodiments of the present specification, by providing a coaxiality tester and a coaxiality adjustment mechanism, the rotational coaxiality can be detected. When the rotational coaxiality is high, adjustments can be made in time to improve the accuracy of the polishing process.

[0121] In some embodiments, when the polishing tool 520 is installed on the machine 60 for the first time, the level of the polishing tool 520 is first adjusted using the second fastening assembly 503. The second coaxiality between the polishing tool 520 and the workpiece rotation drive 530 is adjusted using the first fastening assembly 502. After the adjustment is completed, the screws of the tool panel 522 and the tool intermediate plate 523 are tightened. When polishing the workpiece, the workpiece 501 to be polished is inserted into the concave surface of the pad. The inner diameter of the concave surface of the pad matches the outer diameter of the workpiece 501 to be polished. A negative pressure source is used to apply vacuum to the workpiece to be polished, and the rotational coaxiality of the workpiece to be polished is tested using a coaxiality tester. The feedback is sent to the coaxiality adjustment mechanism 80, which adjusts the displacement of the pad 521 to adjust the rotational coaxiality of the workpiece to be polished, so that the rotational coaxiality of the workpiece to be polished is less than or equal to the coaxiality threshold corresponding to the rotational coaxiality.

[0122] In some embodiments, the second swing mechanism may further include an automatically adjusting coaxial device.

[0123] The automatic coaxial adjustment device is a device that can automatically adjust the coaxiality. In some embodiments, the automatic coaxial adjustment device can be installed on the machine table 60, and can automatically adjust the displacement of the pad 521 to adjust the rotational coaxiality of the workpiece 501 to be polished.

[0124] In some embodiments, the automatic coaxial adjustment device can achieve automatic adjustment in a variety of ways. For example, the automatic coaxial adjustment device can use a closed-loop control system to automatically adjust the position and posture of the pad 521 based on the coaxiality measured by the coaxiality tester 70. In some embodiments, the automatic coaxial adjustment device can adjust the displacement of the pad 521 based on the rotational coaxiality being greater than the coaxiality threshold corresponding to the rotational coaxiality. The coaxiality threshold corresponding to the rotational coaxiality can be set as needed, for example, the coaxiality threshold corresponding to the rotational coaxiality can be 3 microns.

[0125] In some embodiments of the present specification, the production efficiency and accuracy of the polishing device can be greatly improved by automatically adjusting the coaxial device, reducing errors caused by manual operation, and improving working stability and reliability.

[0126] In some embodiments, the automatic coaxial adjustment device may include a photoelectric sensing device and a pushing device.

[0127] The photoelectric sensing device is used to sense the target point of the workpiece 501 to be polished. The photoelectric sensing device can be configured as a photoelectric sensor, etc. The pushing device is used to push the workpiece 501 to be polished. The target point is the point on the workpiece 501 to be polished that needs to be adjusted or pushed.

[0128] In some embodiments, in response to sensing the target point, the pushing device may push the pad 521 to move so as to adjust the rotational coaxiality of the workpiece 501 to be polished.

[0129] In some embodiments of the present specification, the automatic coaxial adjustment device can achieve precise adjustment of the rotational coaxiality of the workpiece to be polished through a photoelectric sensing device and a pushing device.

[0130] It should be noted that the above description of the coaxiality tester 70, coaxiality adjustment mechanism 80, and automatic coaxial adjustment device, etc., is for illustrative purposes only and does not limit the scope of application of this specification. It is understood that those skilled in the art, after understanding the principles of the device, may freely combine the various mechanisms without departing from these principles.

[0131] Figure 7 is an exemplary flow chart of a method for controlling a polishing device according to some embodiments of the present specification.

[0132] In some embodiments, the polishing device can implement the control method 700 of the polishing device through the host computer. In some embodiments, the control method 700 of the polishing device is used to control the operation of the polishing device. For more information about the polishing device, please refer to Figures 1 to 6 Related description.

[0133] In some embodiments, the host computer may be configured as a processor, such as a combination of one or more of a microcontroller (MCU), an embedded processor (Embedded Processor), and a graphics processing unit (GPU).

[0134] In some implementations, the host computer can implement the control method 700 of the polishing device through steps 710 to 740.

[0135] Step 710: Obtain the type of the workpiece to be polished.

[0136] The workpiece type of the workpiece to be polished 501 refers to the type of structure and / or material of the workpiece to be polished. For details about the workpiece to be polished 501, please refer to the above description.

[0137] In some embodiments, the workpiece 501 to be polished may be a lens, which may be a symmetrical aspheric lens, a symmetrical conical lens, a complex curved surface, or the like.

[0138] In some embodiments, the host computer can obtain the workpiece type of the workpiece to be polished 501 uploaded by the user through the user terminal through the network. The user terminal can be a mobile terminal, a computer, etc. The user can be an operator or manager of the polishing device.

[0139] Step 720: Determine the grinding head type based on the workpiece type.

[0140] The grinding head type refers to the type of the polishing grinding head 430, for example, at least one of a spherical polishing grinding head or a cylindrical polishing grinding head. In some embodiments, the host computer can determine the grinding head type in a variety of ways based on the workpiece type. For example, the host computer can search a preset table based on the workpiece type to determine the corresponding grinding head type. The preset table includes a mapping relationship between the workpiece type and the grinding head type, and the mapping relationship can be considered to be set according to demand. For example, the spherical polishing grinding head has a spherical shape and is suitable for processing curved or uneven workpiece surfaces. It can polish evenly and improve the surface finish. For another example, the cylindrical polishing grinding head has a cylindrical shape and a working part that is a cylindrical surface. The cylindrical polishing grinding head can quickly smooth the workpiece surface, remove burrs and roughness, improve surface quality, and is suitable for plane processing or edge polishing.

[0141] Step 730 : Determine a preset swing angle of the tooling assembly based on the grinding head type and the workpiece type, and control the tooling assembly to swing to the preset swing angle.

[0142] The preset swing angle refers to the angle between the center axis of the tooling assembly and the Z axis. For example, Figure 10 As shown, the central axis of the tooling assembly is the S axis, and the preset swing angle α is the angle between the S axis and the Z axis, and the range of α is -90° to 90°. For more information about tooling assemblies, see Figure 1 And related instructions.

[0143] In some embodiments, the preset swing angle can be between -90° and 90°. In some embodiments, the host computer can determine different preset swing angles for the second swing axis based on different grinding head types and workpiece types, and control the second swing axis to swing to the preset swing angle. For example, the host computer can determine the preset swing angle for the second swing axis based on the grinding head type and workpiece type by searching a first preset table. The first preset table includes a mapping relationship between grinding head type and workpiece type and preset swing angles. The mapping relationship can be determined manually or based on historical data.

[0144] Step 740: Based on the polishing parameters, the grinding head assembly is controlled to swing or not swing around the Y-axis direction, and at least one of the X-axis mechanism, the Y-axis mechanism and the Z-axis mechanism is controlled to move. Figure 1 And related instructions.

[0145] Polishing parameters refer to parameters related to the polishing process. In some embodiments, polishing parameters include parameters related to polishing performed by the polishing head 430, such as the rotational speed of the polishing head 430 and the polishing time. In some embodiments, polishing parameters include operating parameters of the workpiece 501 to be polished, such as the rotational speed and rotational direction of the workpiece 501 to be polished. In some embodiments, polishing parameters include parameters related to the movement and / or swinging of various components of the polishing apparatus, such as the movement distances of the X-axis mechanism 10, the Y-axis mechanism 20, and the Z-axis mechanism 30, or the swing angles of the first swing mechanism 40 and the second swing mechanism 50 during the polishing process.

[0146] In some embodiments, the host computer can obtain polishing parameters input by the user from the user terminal. In some embodiments, the host computer can determine the polishing parameters by searching a second preset table based on the grinding head type, the workpiece type, and the preset swing angle. The second preset table contains a mapping relationship between the grinding head type, the workpiece type, the preset swing angle, and the polishing parameters. The mapping relationship can be determined manually or based on historical data.

[0147] In some embodiments, as Figure 8 As shown, when the grinding head assembly swings, the central axis S1 of the grinding head assembly forms an angle with the Z axis.

[0148] In some embodiments, the polishing parameters may include a polishing trajectory of the polishing head 430. In some embodiments, the host computer may determine the polishing trajectory based on a variety of methods, for example, by using a preset algorithm. The preset algorithm may be manually selected from existing trajectory algorithms based on demand.

[0149] In some embodiments, the host computer can control the grinding head assembly to swing or not swing about the Y-axis direction based on the polishing parameters, and control the movement of at least one of the X-axis mechanism 10, the Y-axis mechanism 20, and the Z-axis mechanism 30. The host computer can also control the rotation of the polishing grinding head and the rotation of the workpiece 501 to be polished based on the polishing parameters.

[0150] In some embodiments, the preset position of the polishing head of the grinding head assembly is a preset position of the polishing head 430 during polishing. In some embodiments, the preset position of the polishing head is perpendicular to the normal of the surface of the workpiece 501 to be polished, and the preset position includes at least one of a linear diameter point, a cylindrical surface, etc. of the polishing head.

[0151] Different workpiece types and grinding head types require different preset swing angles and polishing parameters, and corresponding control methods vary. The following examples illustrate three combinations: a symmetrical aspherical lens and a spherical polishing head, a symmetrical aspherical lens and a cylindrical polishing head, and a symmetrical conical lens and a spherical polishing head.

[0152] Figure 8 Schematic diagram of exemplary polishing of a symmetrical aspherical lens according to some embodiments of the present specification.

[0153] In some embodiments, when the workpiece 501 to be polished is a symmetrical aspherical lens, the host computer may determine that the polishing head 430 is a spherical polishing head, and the preset swing angle is 0°.

[0154] In some embodiments, the host computer can control the swinging of the grinding head assembly about the Y-axis direction and the movement of the X-axis mechanism 10 and the Z-axis mechanism 30 based on the polishing parameters. In some embodiments, the host computer can control the rotation of the polishing grinding head 430 based on the speed and polishing time of the polishing grinding head 430 in the polishing parameters to polish the workpiece 501. In some embodiments, the host computer can control the rotation of the workpiece 501 based on the speed and rotation direction of the workpiece in the polishing parameters, so that different parts of the workpiece 501 can be polished.

[0155] For example, Figure 8 As shown, the host computer can control the tooling assembly to swing around the Y-axis until it is parallel to the Z-axis direction and then stop swinging; control the grinding head driving member 420 to drive the polishing grinding head 430 to rotate for polishing; control the movement of the first slider 11 of the X-axis mechanism 10 and the third slider 31 of the Z-axis mechanism 30 based on the polishing trajectory in the polishing parameters, thereby controlling the movement of the polishing grinding head 430 in the X-axis and Z-axis directions; at the same time, control the grinding head assembly to swing around the Y-axis direction, and control the linear diameter point with a larger outer diameter of the spherical polishing grinding head to remain perpendicular to the normal of the contact surface of the symmetrical aspheric lens.

[0156] In some embodiments of this specification, the spherical polishing head can be controlled to polish different positions of the symmetrical aspheric lens through coordinated polishing of the X-axis and Z-axis; at the same time, the spherical polishing head is used to polish the area with a relatively high linear speed to improve the polishing efficiency.

[0157] Figure 9 is another exemplary polishing diagram of a symmetrical aspheric lens according to some embodiments of this specification.

[0158] In some embodiments, when the workpiece 501 to be polished is a symmetrical aspheric lens, the host computer may determine that the polishing head 430 is a cylindrical polishing head, and the preset swing angle is 90°.

[0159] In some embodiments, the host computer can control the movement of the X-axis mechanism 10 and the Y-axis mechanism 20 based on the polishing parameters. In some embodiments, the host computer can control the rotation of the polishing head 430 and the rotation of the workpiece 501 to be polished based on the polishing parameters, as described above.

[0160] For example, Figure 9As shown, the host computer can control the tooling assembly to swing around the Y axis to 90° and then stop swinging; control the movement of the first slider 11 of the X-axis mechanism 10 and the second slider 21 of the Y-axis mechanism 20, thereby controlling the movement of the grinding head assembly in the X-axis and Y-axis directions; thereby achieving polishing of different parts of the aspheric lens; and at the same time, control the grinding head assembly to swing around the Y-axis direction to keep the cylindrical surface of the cylindrical polishing grinding head perpendicular to the normal of the contact surface of the symmetrical aspheric lens.

[0161] In some embodiments of the present specification, the cylindrical polishing head can be controlled to polish different positions of the symmetrical aspheric lens through coordinated polishing of the X-axis and Y-axis; at the same time, the cylindrical surface with a relatively high speed of the cylindrical polishing head is used for polishing to improve the polishing efficiency.

[0162] Figure 10 Schematic diagram of exemplary polishing of a symmetrical conical lens according to some embodiments of the present specification.

[0163] In some embodiments, when the workpiece 501 to be polished is a symmetrical conical lens, the host computer may determine that the polishing head 430 is a spherical polishing head and the preset swing angle is the angle of the symmetrical conical lens. For example, if the conical angle of the symmetrical conical lens is 10°, the preset swing angle is 10°.

[0164] In some embodiments, the host computer can control the movement of the X-axis mechanism 10 based on the polishing parameters. In some embodiments, the host computer can control the rotation of the polishing head 430 and the rotation of the workpiece 501 to be polished based on the polishing parameters, as described above.

[0165] For example, Figure 10 As shown, the host computer can control the tooling assembly to swing around the Y axis to a preset swing angle α and then stop swinging, so that the polished surface of the symmetrical conical lens is level; control the movement of the first slider 11 of the X-axis mechanism 10, thereby controlling the movement of the spherical polishing grinding head in the X-axis direction, thereby achieving polishing of different parts of the symmetrical conical lens.

[0166] In some embodiments of this specification, the cylindrical polishing head can be controlled to polish different positions of the symmetrical aspheric lens by moving the cylindrical polishing head in the X-axis direction; at the same time, the spherical polishing head is used to polish the areas with relatively high speed to improve the polishing efficiency.

[0167] In some embodiments of this specification, different grinding head types and polishing parameters are determined based on the different types of workpieces to be polished, and different polishing methods can be provided for different workpiece types, thereby improving the polishing effect and increasing the applicable scenarios of the polishing device.

[0168] In some embodiments, the host computer may further determine quality data of the workpiece after polishing; and adjust polishing parameters based on the quality data.

[0169] Quality data is a parameter used to reflect the polishing quality of the workpiece after polishing, such as surface finish, flatness, etc. The quality data can be expressed in grades or scores. In some implementations, the host computer can determine the quality data of the workpiece after polishing by a variety of methods. For example, the host computer can measure the surface finish and flatness of the workpiece after polishing by a profilometer, and determine the quality data by searching a third preset table based on the surface finish and flatness. The third preset table includes a mapping relationship between surface finish and flatness and quality data. The profilometer can measure the surface morphology and contour of the workpiece by means of sensors or laser scanning, thereby obtaining parameters such as surface finish and flatness. For another example, the host computer can obtain manual quality inspection data uploaded by the user from the user terminal, and determine the manual quality inspection data as the quality data of the workpiece after polishing.

[0170] In some implementations, the host computer can determine adjusted polishing parameters based on the quality data and update the polishing parameters to the adjusted polishing parameters. For example, if the quality data is less than a preset threshold, the host computer can search a fourth preset table and determine the reference polishing parameters corresponding to the quality data in the fourth preset table as the adjusted polishing parameters. The fourth preset table includes a mapping between the quality data and the reference polishing parameters.

[0171] During the actual polishing process, the polishing quality may be reduced due to external factors or wear of the workpiece itself. In some embodiments of this specification, the polishing parameters can be adjusted based on the quality data of the polished workpiece to improve the actual polishing effect.

[0172] Figure 11 is an exemplary module diagram of a control system of a polishing device according to some embodiments of the present specification.

[0173] In some embodiments, as Figure 11 As shown, the control system 1100 of the polishing device includes an acquisition module 1110 , a first determination module 1120 , a second determination module 1130 and a control module 1140 .

[0174] In some embodiments, the acquisition module 1110 may be configured to acquire the type of the workpiece 501 to be polished.

[0175] In some embodiments, the first determination module 1120 may be configured to determine the grinding head type based on the workpiece type.

[0176] In some embodiments, the second determining module 1130 may be configured to determine a preset swing angle of the tooling assembly based on the grinding head type and the workpiece type, and control the tooling assembly to swing to the preset swing angle.

[0177] In some embodiments, the control module 1140 can be configured to control the grinding head assembly to swing or not swing in the Y-axis direction based on the polishing parameters, and control at least one of the X-axis mechanism 10, the Y-axis mechanism 20, and the Z-axis mechanism 30 to move, so that the polishing grinding head 430 polishes the workpiece 501 to be polished. For more information about the above, please refer to Figures 1 to 10 And related instructions.

[0178] It should be noted that the above description of the control system and its modules of the polishing device is for convenience of description only and does not limit this specification to the scope of the embodiments. It is understandable that those skilled in the art, after understanding the principles of the system, may arbitrarily combine the modules or form a subsystem connected with other modules without deviating from the principles. In some embodiments, Figure 11 The acquisition module 1110, first determination module 1120, second determination module 1130, and control module 1140 disclosed herein may be different modules within a system, or a single module may implement the functions of two or more of the aforementioned modules. For example, the modules may share a storage module, or each module may have its own storage module. Such variations are within the scope of protection of this specification.

[0179] While the basic concepts have been described above, it will be apparent to those skilled in the art that the detailed disclosure is merely illustrative and does not limit this specification. Although not explicitly stated herein, various modifications, improvements, and revisions to this specification may be made by those skilled in the art. Such modifications, improvements, and revisions are suggested in this specification and remain within the spirit and scope of the exemplary embodiments of this specification.

[0180] This specification also uses specific terms to describe the embodiments of this specification. For example, "one embodiment," "an embodiment," and / or "some embodiments" refer to a feature, structure, or characteristic associated with at least one embodiment of this specification. Therefore, it should be emphasized and noted that references to "one embodiment," "an embodiment," or "an alternative embodiment" two or more times in different locations in this specification do not necessarily refer to the same embodiment. Furthermore, certain features, structures, or characteristics of one or more embodiments of this specification may be appropriately combined.

[0181] In addition, unless expressly stated in the claims, the order of the processing elements and sequences, the use of alphanumeric characters, or the use of other names described in this specification are not intended to limit the order of the processes and methods of this specification. Although the above disclosure discusses some of the invention embodiments currently considered useful through various examples, it should be understood that such details are for illustrative purposes only, and the appended claims are not limited to the disclosed embodiments. On the contrary, the claims are intended to cover all modifications and equivalent combinations that are consistent with the spirit and scope of the embodiments of this specification. For example, although the system components described above can be implemented by hardware devices, they can also be implemented only by software solutions, such as installing the described system on an existing server or mobile device.

[0182] Similarly, it should be noted that, in order to simplify the presentation of this specification and thus facilitate understanding of one or more embodiments of the invention, the foregoing descriptions of the embodiments of this specification sometimes combine multiple features into a single embodiment, figure, or description thereof. However, this disclosure method does not imply that the subject matter of this specification requires more features than those recited in the claims. In fact, an embodiment may have fewer features than all of the features of a single disclosed embodiment.

[0183] In some embodiments, numbers are used to describe the quantity of components and attributes. It should be understood that such numbers used in the description of the embodiments are modified by the modifiers "about", "approximately" or "substantially" in some examples. Unless otherwise stated, "about", "approximately" or "substantially" indicate that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the description and claims are approximate values, which may change according to the required characteristics of individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and adopt the general method of retaining digits. Although the numerical domains and parameters used to confirm the breadth of their range in some embodiments of this specification are approximate values, in specific embodiments, the settings of such numerical values ​​are as accurate as possible within the feasible range.

[0184] Each patent, patent application, patent application publication, and other materials, such as articles, books, specifications, publications, and documents, cited in this specification is hereby incorporated by reference in its entirety. This includes application history documents that are inconsistent with or conflict with the content of this specification, as well as documents (currently or subsequently attached to this specification) that limit the broadest scope of the claims of this specification. It should be noted that if the descriptions, definitions, and / or terminology used in the accompanying materials are inconsistent or conflicting with the content of this specification, the descriptions, definitions, and / or terminology used in this specification will control.

[0185] Finally, it should be understood that the embodiments described in this specification are intended only to illustrate the principles of the embodiments of this specification. Other variations may also fall within the scope of this specification. Therefore, by way of example and not limitation, alternative configurations of the embodiments of this specification may be considered consistent with the teachings of this specification. Accordingly, the embodiments of this specification are not limited to the embodiments explicitly described and illustrated in this specification.

Claims

1. A polishing device, characterized in that: include: X-axis mechanism, Y-axis mechanism, Z-axis mechanism, first swing mechanism and second swing mechanism; The Z-axis mechanism is connected to the X-axis mechanism and is movable along the X-axis direction under the drive of the X-axis mechanism; The first swing mechanism is connected to the Z-axis mechanism and is movable along the Z-axis direction under the drive of the Z-axis mechanism; The second swing mechanism is connected to the Y-axis mechanism and is movable along the Y-axis direction under the drive of the Y-axis mechanism; The first swing mechanism includes a grinding head assembly that is swingable about the Y-axis direction, and the second swing mechanism includes a tooling assembly that is swingable about the Y-axis direction, wherein the tooling assembly is configured to support the workpiece to be polished during the workpiece polishing process, and the grinding head assembly is configured to process the workpiece to be polished during the workpiece polishing process; The X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other.

2. The device according to claim 1, wherein The X-axis mechanism includes an X-axis driving member mounted on an X-axis base, an X-axis linear guide rail, and a first slider slidable along the X-axis linear guide rail, and the Z-axis mechanism is arranged on the first slider; The Y-axis mechanism includes a Y-axis driving member mounted on a Y-axis base, a Y-axis linear guide rail, and a second slider slidable along the Y-axis linear guide rail; The Z-axis mechanism includes a Z-axis driving member mounted on a Z-axis base, a Z-axis linear guide rail, and a third slider slidable along the Z-axis linear guide rail.

3. The device according to claim 2, wherein The first swing mechanism further includes a first swing assembly, the first swing assembly is mounted on the third slider, the grinding head assembly is mounted on the first swing assembly, and the first swing assembly can drive the grinding head assembly to swing around the Y-axis direction; The second swing mechanism further includes a second swing component, which is mounted on the second slider, and the tooling component is mounted on the second swing component, and the second swing component can drive the tooling component to swing around the Y-axis direction.

4. The device according to claim 3, characterized in that The first swing assembly includes a first swing driving member, the grinding head assembly includes a grinding head driving member, the first swing driving member is mounted on the third slider, and the grinding head driving member is mounted on the first swing driving member; The second swing assembly includes a second swing driving member, the tooling assembly includes a workpiece rotation driving member, the second swing driving member is mounted on the second sliding block, and the workpiece rotation driving member is mounted on the second swing driving member.

5. The device according to claim 1, wherein The tooling assembly includes a polishing tooling, The polishing tool is configured to fix the workpiece to be polished during the workpiece polishing process.

6. The device according to claim 5, characterized in that The tooling assembly further includes a rotating workpiece shaft and a negative pressure source, the polishing tooling includes a pad, a tooling plate and a base plate, the pad including a pad concave surface, a pad plane and a first hole, the first hole passing through the pad, the tooling plate including a first plate surface, a second plate surface and a second hole, the second hole passing through the tooling plate, the base plate including a base plate plane, a lower shaft plane and a third hole, the third hole passing through the base plate; The surface directions of the pad concave surface and the pad plane are parallel to the radial direction of the first hole, the pad concave surface is used to support the workpiece to be polished, the first plate surface includes a recess, and the pad plane abuts against the recess; The surface directions of the first plate surface and the second plate surface are parallel to the radial direction of the second hole, and the second plate surface is installed on the bottom plate plane; The surface directions of the bottom plate plane and the lower shaft plane are parallel to the radial direction of the third hole. The lower shaft plane is installed on the rotating workpiece axis. The first hole, the second hole and the third hole are connected and connected to the negative pressure source.

7. The device according to claim 6, characterized in that The second swing mechanism further includes a coaxiality tester and a coaxiality adjustment mechanism for the pad, and the coaxiality tester and the coaxiality adjustment mechanism are mounted on the machine platform; The coaxiality tester tests the rotational coaxiality of the workpiece to be polished, and the coaxiality adjustment mechanism adjusts the rotational coaxiality of the workpiece to be polished by adjusting the displacement of the pad.

8. The device according to claim 7, wherein The second swing mechanism further includes an automatic coaxial adjustment device, which is mounted on the machine platform and adjusts the rotational coaxiality of the workpiece to be polished by displacing the pad.

9. A control method for a polishing device, characterized in that: The control method is used to control the operation of the device according to any one of claims 1 to 8, and the control method is executed by a host computer. The control method includes: Obtaining the type of the workpiece to be polished; Determining a grinding head type based on the workpiece type; Determining a preset swing angle of a tooling assembly based on the grinding head type and the workpiece type, and controlling the tooling assembly to swing to the preset swing angle; Based on the polishing parameters, the grinding head assembly is controlled to swing or not swing around the Y-axis direction, and at least one of the X-axis mechanism, the Y-axis mechanism and the Z-axis mechanism is controlled to move.

10. The control method according to claim 9, wherein: The control method further includes: Determine the quality data of the workpiece after polishing; Based on the quality data, the polishing parameters are adjusted.

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