Micro-channel evaporator and vapor chamber heat exchange device

Abstract

The invention discloses a micro-channel evaporator and a vapor chamber heat exchange device, and relates to the technical field of evaporators. The high-temperature medium channel and the low-temperature medium channel are arranged in parallel; the heat exchange plate type assemblies are arranged between the low-temperature medium channel and the high-temperature medium channel at intervals, a plurality of capillary channels are formed in the heat exchange plate type assemblies, and the two ends of the capillary channels communicate with the low-temperature medium channel and the high-temperature medium channel correspondingly; wherein the heat exchange plate type assembly is provided with an insertion groove used for being inserted into the vapor chamber, and the capillary channel is arranged around the inner wall of the insertion groove; according to the micro-channel evaporator and the vapor chamber heat exchange device, the temperature of a heat source can be homogenized and guided out through the vapor chamber serving as a heat bridge, then the vapor chamber is inserted into the inserting groove and makes contact with the heat exchange plate type assembly for heat exchange, the size of the evaporator can be effectively reduced, and the heat exchange efficiency is improved through vapor chamber heat at the heat source end and the evaporator. And the heat diffusion of a local high-heat-source area is accelerated.

Description

Technical Field

[0001] The present invention relates to the technical field of evaporators, and more specifically, to a microchannel evaporator. Furthermore, the present invention also relates to a vapor chamber heat exchange device including the microchannel evaporator. Background Art

[0002] With the significant increase in power density in new energy vehicles, energy storage systems, and 5G base stations, thermal management systems are placing higher demands on evaporators for heat transfer efficiency, compactness, and temperature uniformity. Microchannel evaporators, due to their high heat transfer performance and compact structure, have become a mainstream solution.

[0003] Existing microchannel evaporators usually adopt a horizontal tube structure, with multiple horizontal microchannel tubes arranged above and below, and collecting pipes (liquid distributors and gas collectors) set on both sides; the refrigerant enters from the liquid distributor on one side, flows through the horizontal microchannels, and is discharged to the gas collector on the other side.

[0004] However, when implementing this solution, the applicant discovered that the existing technology had the following problems:

[0005] When in use, existing microchannel evaporators are mostly made in plate shape and directly contact with the heat source for heat exchange, that is, the evaporator wraps the heat source for heat exchange. The volume of the microchannel evaporator needs to be greater than or equal to the heat source, resulting in a large volume and increased cost. At the same time, the microchannels in the microchannel evaporator are all arranged in parallel, and heat can only diffuse along the length direction of the microchannel, and cannot diffuse perpendicular to the length direction of the microchannel. For point-like heat sources, the microchannels at their edge positions cannot be used for heat exchange, which is not conducive to heat diffusion in local high heat source areas, that is, it cannot meet the point-like temperature uniformity requirements of high power density modules.

[0006] In summary, how to solve the problem that the existing microchannel evaporator is bulky and not conducive to heat diffusion in the local high heat source area is an urgent problem to be solved by those skilled in the art. Summary of the Invention

[0007] In view of this, the purpose of the present invention is to provide a microchannel evaporator, which can use a heat spreader as a thermal bridge to evenly distribute the temperature of the heat source, and then insert it into a slot to contact and exchange heat with a heat exchange plate assembly, thereby effectively reducing the volume of the evaporator. The heat spreader is used to evenly distribute heat at the heat source end and the evaporator, thereby accelerating the heat diffusion in the local high heat source area and meeting the point-like temperature uniformity requirements.

[0008] Another object of the present invention is to provide a vapor chamber heat exchange device including the above-mentioned microchannel evaporator, which has the same technical features and can solve the same technical problems.

[0009] In order to achieve the above object, the present invention provides the following technical solutions:

[0010] A microchannel evaporator comprising:

[0011] Low temperature medium channel;

[0012] a high-temperature medium channel, arranged in parallel with the low-temperature medium channel;

[0013] A plurality of heat exchange plate assemblies are arranged at intervals between the low-temperature medium channel and the high-temperature medium channel, and a plurality of capillary channels are provided in the heat exchange plate assemblies, and the two ends of the capillary channels are respectively connected to the low-temperature medium channel and the high-temperature medium channel;

[0014] The heat exchange plate assembly is provided with a slot for inserting a heat spreader, and the capillary channel is arranged around the inner wall of the slot.

[0015] Preferably, the end of the low-temperature medium channel is connected to a low-temperature medium filling port, and the end of the high-temperature medium channel is connected to a high-temperature medium outlet.

[0016] The low-temperature medium filling port and the high-temperature medium outlet are located at different ends of the microchannel evaporator.

[0017] Preferably, the cryogenic medium channel includes a first cavity, a cryogenic medium distribution pipe and a cryogenic medium filling port;

[0018] The first cavity is used to communicate with the capillary channel, the low-temperature medium distribution pipe is built into the first cavity, and the low-temperature medium filling port is communicated with the low-temperature medium distribution pipe;

[0019] The wall of the low-temperature medium distribution pipe is provided with several groups of through holes along the length direction. The through holes are arranged at equal intervals, or the through holes at one end close to the low-temperature medium filling port are spaced smaller than those at the other end.

[0020] Preferably, the high-temperature medium channel includes a second cavity, a high-temperature medium manifold and a high-temperature medium outlet;

[0021] The second cavity is used to communicate with the capillary channel, the high-temperature medium manifold is built into the second cavity, and the high-temperature medium outlet is communicated with the high-temperature medium manifold;

[0022] The wall of the high-temperature medium confluence pipe is provided with a plurality of through holes along the length direction, and the through holes at one end close to the high-temperature medium outlet are spaced farther apart than those at the other end.

[0023] Preferably, the arrangement height of the high-temperature medium channel is higher than the arrangement height of the low-temperature medium channel;

[0024] A reflux channel is provided between the high-temperature medium channel and the low-temperature medium channel, for allowing the liquid medium in the high-temperature medium channel to flow back to the low-temperature medium channel.

[0025] Preferably, the inlet end of the reflux channel is connected to the low position of the outlet end of the high-temperature medium channel;

[0026] The outlet end of the reflux channel is communicated with an end of the low-temperature medium channel away from the inlet end.

[0027] Preferably, the reflux channel is connected in series with a U-shaped bend structure to form a liquid seal at the U-shaped bend structure.

[0028] Preferably, the planes where two adjacent heat exchange plate assemblies are located are parallel, and both ends of the heat exchange plate assemblies are detachably connected to the low-temperature medium channel and the high-temperature medium channel respectively.

[0029] Preferably, the opening directions of two adjacent groups of slots are the same or opposite.

[0030] A vapor chamber heat exchange device, comprising a vapor chamber and any one of the above-mentioned microchannel evaporators;

[0031] One end of the heat spreader is fixedly inserted into the slot.

[0032] Compared with the prior art, the microchannel evaporator provided by the present invention has at least the following beneficial effects:

[0033] 1. Slots are provided in the heat exchange plate assembly so that a vapor chamber serving as a thermal bridge can be inserted. The vapor chamber then transfers heat from the heat source to the heat exchange plate assembly for heat exchange. This reduces the size of the heat exchange plate assembly, eliminating the need for it to be equal to or larger than the heat source, thereby reducing the cost of use.

[0034] 2. The reduced volume of the heat exchange plate assembly can shorten the length of the capillary channel, that is, the refrigerant path in the capillary channel is shorter, which prevents the refrigerant from being affected by gravity and lateral pressure drop, resulting in overcooling at the inlet, overheating at the outlet, insufficient phase change, and local "dry spot" problems.

[0035] 3. By utilizing the heat-dissipating characteristics of the vapor chamber, the heat in the high heat source area can be automatically diffused to the surrounding area, solving the heat diffusion problem in the local high heat source area. After the vapor chamber is inserted into the slot, it can simultaneously contact and exchange heat with multiple capillary channels in the heat exchange plate assembly. The heat in the high heat source area of ​​the vapor chamber can diffuse to the surrounding area and then be exchanged with the remaining capillary channels in the surrounding area, thereby improving the heat exchange effect of the heat exchange plate assembly.

[0036] 4. The design of setting up several heat exchange plate components between the low-temperature medium channel and the high-temperature medium channel can meet the insertion of multiple heat sinks, thereby meeting the heat exchange of multi-point non-uniform heating systems such as battery modules, distributed power electronics or data center cooling units.

[0037] The vapor chamber heat exchange device provided by the present invention includes the above-mentioned microchannel evaporator and has the same beneficial effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0039] Figure 1 This is a schematic structural diagram of a specific microchannel evaporator provided by the present invention;

[0040] Figure 2 The present invention provides Figure 1 Enlarged view of point A in the middle;

[0041] Figure 3 A cross-sectional view of a specific microchannel evaporator provided by the present invention;

[0042] Figure 4 The present invention provides Figure 3 Enlarged view of point B in the middle;

[0043] Figure 5 The present invention provides Figure 3 Cross-sectional view at CC;

[0044] Figure 6 This is a structural diagram of a specific embodiment of a vapor chamber heat exchange device provided by the present invention;

[0045] Figure 7 This is a schematic structural diagram of a second embodiment of a vapor chamber heat exchange device provided by the present invention;

[0046] Figure 8 This is a structural schematic diagram of another embodiment of the microchannel evaporator provided by the present invention;

[0047] Figure 9 This is a schematic diagram of the bottom structure of another embodiment of the microchannel evaporator provided by the present invention.

[0048] In the picture:

[0049] 1. Low-temperature medium channel; 11. Low-temperature medium filling port; 12. Low-temperature medium distribution pipe;

[0050] 2. High-temperature medium channel; 21. High-temperature medium outlet; 22. High-temperature medium manifold;

[0051] 3. Heat exchange plate assembly; 31. Capillary channel; 32. Slot;

[0052] 4. Reflux channel; 41. U-shaped bend structure;

[0053] 5. Heat sink. DETAILED DESCRIPTION

[0054] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0055] The core of the present invention is to provide a microchannel evaporator, which can use a heat spreader as a thermal bridge to evenly distribute the temperature of the heat source, and then insert it into a slot to contact and exchange heat with a heat exchange plate assembly, thereby effectively reducing the volume of the evaporator. The heat spreader also averages heat at the heat source end and the evaporator, accelerating the heat diffusion in the local high heat source area to meet the point-like temperature uniformity requirements.

[0056] Another core of the present invention is to provide a vapor chamber heat exchange device including the above-mentioned microchannel evaporator, which has the same technical features and can solve the same technical problems.

[0057] Please refer to Figure 1-Figure 5 , a microchannel evaporator, comprising:

[0058] Low temperature medium channel 1;

[0059] A high-temperature medium channel 2 is arranged in parallel with the low-temperature medium channel 1;

[0060] A plurality of heat exchange plate assemblies 3 are arranged at intervals between the low-temperature medium channel 1 and the high-temperature medium channel 2, and a plurality of capillary channels 31 are provided in the heat exchange plate assemblies 3, and the two ends of the capillary channels 31 are connected to the low-temperature medium channel 1 and the high-temperature medium channel 2 respectively;

[0061] The heat exchange plate assembly 3 is provided with a slot 32 for inserting the heat spreader 5 , and the capillary channel 31 is arranged around the inner wall of the slot 32 .

[0062] like Figure 1As shown, several heat exchange plate assemblies 3 are arranged between the parallel low-temperature medium channel 1 and the high-temperature medium channel 2. A capillary channel 31 is provided in each heat exchange plate assembly 3. When the low-temperature heat exchange medium flows from the low-temperature medium channel 1 to the high-temperature medium channel 2 through the capillary channel 31, it can exchange heat with the heat exchange plate assembly 3. Therefore, a slot 32 is provided in each heat exchange plate assembly 3, which enables the heat spreader 5 to be inserted into the heat exchange plate assembly 3 for contact heat exchange, thereby increasing the contact area of ​​the microchannel evaporator for heat exchange and helping to miniaturize the microchannel evaporator.

[0063] At the same time, the heat spreader 5 is used as a heat bridge to transfer heat, thereby achieving separation between the microchannel evaporator and the heat source. There is no need for the microchannel evaporator to wrap the heat source, thereby reducing the volume of the microchannel evaporator and shortening the length of the capillary channel 31. As a result, a heat exchange medium with heat absorption capacity is always present in the capillary channel 31, avoiding the problem of local dry spots in the capillary channel 31.

[0064] Moreover, when the heat spreader 5 is inserted into the slot 32, the heat spreader 5 can contact and exchange heat with the multiple capillary channels 31 inside the slot 32. At the same time, the heat spreader 5 utilizes the heat equalization characteristics to effectively increase the heat diffusion rate in the high heat source area and improve the heat exchange efficiency of the microchannel evaporator.

[0065] Furthermore, the thermal conductivity of the vapor chamber 5 is utilized to achieve physical decoupling between the heat flow field of the heat source and the heat exchange medium flow field in the microchannel evaporator, thereby improving the convenience of equipment maintenance.

[0066] At the same time, a detachable plug-in design is adopted between the heat spreader 5 and the microchannel evaporator, which helps to improve the on-site adaptability of the equipment and the flexibility of thermal control zoning.

[0067] In some embodiments, a low-temperature medium filling port 11 is provided at the end of the low-temperature medium channel 1 , and a high-temperature medium outlet 21 is provided at the end of the high-temperature medium channel 2 ;

[0068] The low-temperature medium filling port 11 and the high-temperature medium outlet 21 are located at different ends of the microchannel evaporator.

[0069] like Figure 1 and Figure 3 As shown, the end of the low-temperature medium channel 1 close to the low-temperature medium filling port 11 is the proximal end, and the other end is the distal end;

[0070] The end of the high-temperature medium channel 2 close to the high-temperature medium outlet 21 is the proximal end, and the other end is the distal end;

[0071] The proximal end of the low-temperature medium channel 1 is the high-pressure end, and the distal end is the low-pressure end;

[0072] The proximal end of the high-temperature medium channel 2 is the low-pressure end, and the distal end is the high-pressure end;

[0073] Therefore, the high-pressure end of the low-temperature medium channel 1 can be connected to the high-pressure end of the high-temperature medium channel 2, and the low-pressure end of the low-temperature medium channel 1 can be connected to the low-pressure end of the high-temperature medium channel 2 through the capillary channel 31. That is, the pressure drops at both ends of the capillary channels 31 at different positions are relatively close, thereby making the flow rate of the heat exchange medium in the capillary channels 31 at different positions close, and thus making the heat exchange effects of the capillary channels 31 at different positions close, that is, the heat exchange effects at different positions of the microchannel evaporator are close.

[0074] In some embodiments, the cryogenic medium channel 1 includes a first cavity, a cryogenic medium distribution pipe 12 and a cryogenic medium filling port 11;

[0075] The first cavity is used to communicate with the capillary channel 31, the low-temperature medium distribution pipe 12 is built into the first cavity, and the low-temperature medium filling port 11 is communicated with the low-temperature medium distribution pipe 12;

[0076] The wall of the cryogenic medium distribution pipe 12 is provided with several groups of through holes along its length. The through holes are arranged at equal intervals, or the through holes at one end close to the cryogenic medium filling port 11 are spaced smaller than those at the other end.

[0077] like Figure 3 As shown, the low-temperature medium channel 1 adopts the method of wrapping the low-temperature medium distribution pipe 12 with the first cavity, so that different length positions of the low-temperature medium channel 1 can be distributed to the low-temperature heat exchange medium, that is, the refrigerant of the low-temperature gas-liquid mixture, ensuring that the capillary channels 31 of the heat exchange plate components 3 at different positions can pass through the low-temperature refrigerant.

[0078] Furthermore, by expanding the capacity of the first cavity, the capillary channels 31 at the same position, that is, in the same heat exchange plate assembly 3 , can obtain low-temperature refrigerant with the same initial pressure and initial flow rate.

[0079] The low-temperature medium in the low-temperature medium distribution pipe 12 enters the first cavity through the through holes in the pipe wall. Therefore, when arranging the through holes, it can be selected to correspond one-to-one with the arrangement positions of the heat exchange plate components 3, that is, to be evenly arranged at equal intervals, so as to reduce the residence time of the low-temperature heat exchange medium in the first cavity and quickly enter the capillary channel 31 for heat exchange.

[0080] In some embodiments, such as Figure 3As shown, the low-temperature medium filling port 11 and the high-temperature medium outlet 21 are located at different ends of the microchannel evaporator. At this time, the distance between the distal end of the low-temperature medium channel 1 and the proximal end of the high-temperature medium channel 2 is relatively close, so the negative pressure suction force at the distal end of the low-temperature medium channel 1 is greater than the negative pressure suction force at the proximal end. By making the through holes at the proximal end of the low-temperature medium distribution pipe 12 dense and the through holes at the distal end sparse, the refrigerant supply at the proximal end of the first cavity is increased and the refrigerant supply at the distal end of the first cavity is reduced, thereby balancing the heat exchange medium circulation speed of the capillary channels 31 in the heat exchange plate components 3 at different positions.

[0081] In some embodiments, the high-temperature medium channel 2 includes a second cavity, a high-temperature medium manifold 22 and a high-temperature medium outlet 21;

[0082] The second cavity is used to communicate with the capillary channel 31, the high-temperature medium manifold 22 is built into the second cavity, and the high-temperature medium outlet 21 is communicated with the high-temperature medium manifold 22;

[0083] The wall of the high-temperature medium confluence pipe 22 is provided with a plurality of through holes along its length, and the through holes at one end close to the high-temperature medium outlet 21 are spaced farther apart than those at the other end.

[0084] like Figure 3 、 Figure 4 and Figure 5 As shown, the high-temperature medium channel 2 adopts a method of wrapping the high-temperature medium manifold 22 with the second cavity, so that the high-temperature heat exchange medium after heat exchange through the capillary channel 31 preferentially enters the second cavity, and then enters the high-temperature medium manifold 22 through the through-holes in the wall of the high-temperature medium manifold 22, and is then collected by confluence. In some embodiments, the high-temperature medium manifold 22 is coaxially arranged with the second cavity, and the through-holes of the high-temperature medium manifold 22 are higher than the outlet of the capillary channel 31. Therefore, the liquid portion of the heat exchange medium passing through the capillary channel 31 remains in the second cavity, while the gas portion enters the high-temperature medium manifold 22, thereby achieving gas-liquid separation.

[0085] In some embodiments, the through-hole distribution spacing at the proximal end of the high-temperature medium manifold 22 is greater than the through-hole distribution spacing at the distal end to solve the problem of different negative pressure suction at different positions of the high-temperature medium manifold 22, so that the distal and proximal ends can obtain relatively close gaseous heat exchange medium collection speeds.

[0086] like Figure 4 As shown, since the high-temperature medium manifold 22 is mainly used to collect gaseous heat exchange medium, in order to improve the collection speed, the through holes are arranged in a ring array on the tube wall of the high-temperature medium manifold 22 to increase the speed of the gaseous heat exchange medium entering the high-temperature medium manifold 22.

[0087] In some embodiments, the arrangement height of the high-temperature medium channel 2 is higher than the arrangement height of the low-temperature medium channel 1;

[0088] A reflux channel 4 is provided between the high-temperature medium channel 2 and the low-temperature medium channel 1 for allowing the liquid medium in the high-temperature medium channel 2 to flow back to the low-temperature medium channel 1 .

[0089] When the low-temperature heat exchange medium passes through the capillary channel 31 in the form of a gas-liquid mixture, there is incomplete vaporization, that is, liquid heat exchange medium enters the high-temperature medium channel 2. When the amount of liquid heat exchange medium exceeds a certain amount, it will enter the compressor of the subsequent equipment, causing damage to the compressor, and the cold capacity in the liquid heat exchange medium is not fully utilized, resulting in low overall cold capacity utilization of the microchannel evaporator.

[0090] like Figure 1 、 Figure 3 and Figure 4 As shown, a reflux channel 4 is provided to allow the liquid heat exchange medium in the high-temperature medium channel 2 to flow back into the low-temperature medium channel 1 and pass through the capillary channel 31 for heat exchange again, thereby improving the cold utilization rate of the heat exchange medium.

[0091] In some embodiments, the inlet end of the reflux channel 4 is connected to the low position of the outlet end of the high-temperature medium channel 2;

[0092] The outlet end of the reflux channel 4 is connected to the end of the low-temperature medium channel 1 away from the inlet end.

[0093] The inlet of the reflux channel 4 is arranged at the outlet end of the high-temperature medium channel 2, which helps to make the liquid heat exchange medium in the high-temperature medium channel 2 converge at the inlet position of the reflux channel 4 along with the airflow of the gaseous heat exchange medium, thereby facilitating the reflux of the liquid heat exchange medium.

[0094] The outlet of the reflux channel 4 is set at the end of the low-temperature medium channel 1 away from the inlet section, so that the inlet and outlet ends of the reflux channel 4 are both in the low-pressure area of ​​the corresponding cavity, avoiding the reverse flow of the gaseous heat exchange medium caused by the pressure difference between the two ends.

[0095] In some embodiments, the reflux channel 4 is connected in series to the U-shaped bend structure 41 to form a liquid seal at the U-shaped bend structure 41 .

[0096] like Figure 2 As shown, a U-shaped bend structure 41 is provided in the reflux channel 4. When liquid passes through, part of it remains in the U-shaped bend structure 41 to form a liquid seal, which can also prevent gas from passing through, that is, prevent the gaseous heat exchange medium from passing through the reflux channel 4.

[0097] In some embodiments, the planes where two adjacent heat exchange plate assemblies 3 are located are parallel, and both ends of the heat exchange plate assemblies 3 are detachably connected to the low-temperature medium channel 1 and the high-temperature medium channel 2 , respectively.

[0098] like Figure 1 As shown, the planes where adjacent heat exchange plate assemblies 3 are located are parallel, so the planes where the inserted heat spreaders 5 are located are parallel, which facilitates the contact and heat exchange between the heat source arranged by the steam and the heat spreaders 5.

[0099] In addition, the heat exchange plate assembly 3 and the low-temperature medium channel 1 and the high-temperature medium channel 2 are detachably assembled, and a single heat exchange plate assembly 3 can be disassembled, assembled, and repaired, thereby improving maintenance convenience.

[0100] In some embodiments, the opening directions of two adjacent groups of slots 32 are the same or opposite.

[0101] like Figure 6 and Figure 7 As shown, the slot 32 can be designed to be open at both ends, or to be open at one end and closed at the other end. When the single-end is open, the opening direction can be consistent, such as Figure 6 As shown, the inserted heat spreaders 5 are neatly arranged on one side of the microchannel evaporator; when the opening directions are opposite, as shown in FIG. Figure 7 As shown, the inserted vapor chamber plates 5 are arranged in a fishbone shape on both sides of the microchannel evaporator.

[0102] In some embodiments, such as Figure 8 and Figure 9 As shown, the heat exchange plate structure 3 is a flat plate design, the slot 32 is eliminated, and the width direction of the heat exchange plate structure is consistent with the length direction of the low-temperature medium channel 1 and the high-temperature medium channel 2, so that multiple heat exchange plate structures 3 can together form a large plane for direct contact with the heat source for heat dissipation;

[0103] At the same time, multiple microchannel evaporators can be connected in parallel, so that the heat exchange plate structures 3 of the multiple microchannel evaporators together form a large plane for direct contact heat exchange with the heat source.

[0104] Specifically, in the application of power battery heat dissipation, after multiple microchannel evaporators are connected in parallel, all the heat exchange plate structures 3, as well as the high-temperature medium channels 2 and the low-temperature medium channels 1 at both ends of the heat exchange plate structures 3 together form a large plane. The power battery can be directly laid flat on the above-mentioned large plane and directly contact and exchange heat with the heat exchange plate structures 3.

[0105] In addition to the microchannel evaporator disclosed in each of the above embodiments, the present invention also provides a vapor chamber heat exchange device, comprising a vapor chamber 5 and any one of the above microchannel evaporators;

[0106] One end of the heat spreader 5 is fixedly inserted into the slot 32 , and the other end is used for contacting with the heat source for heat exchange.

[0107] For the structures of other parts of the vapor chamber heat exchange device, please refer to the prior art and will not be described in detail in this article.

[0108] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0109] The above describes in detail the microchannel evaporator and vapor chamber heat exchanger provided by the present invention. This article uses specific examples to illustrate the principles and implementation methods of the present invention. The description of the above examples is intended only to facilitate understanding of the method and core concepts of the present invention. It should be noted that those skilled in the art may make various improvements and modifications to the present invention without departing from the principles of the present invention, and such improvements and modifications fall within the scope of protection of the claims of the present invention.

Claims

1. A microchannel evaporator, characterized in that: include: Low temperature medium channel (1); a high-temperature medium channel (2), which is arranged in parallel with the low-temperature medium channel (1); A plurality of heat exchange plate assemblies (3) are arranged at intervals between the low-temperature medium channel (1) and the high-temperature medium channel (2), and a plurality of capillary channels (31) are arranged in the heat exchange plate assemblies (3), and two ends of the capillary channels (31) are respectively connected to the low-temperature medium channel (1) and the high-temperature medium channel (2); The heat exchange plate assembly (3) is provided with a slot (32) for inserting the heat spreader (5), and the capillary channel (31) is arranged around the inner wall of the slot (32).

2. The microchannel evaporator according to claim 1, characterized in that The end of the low-temperature medium channel (1) is connected to a low-temperature medium filling port (11), and the end of the high-temperature medium channel (2) is connected to a high-temperature medium outlet (21). The low-temperature medium filling port (11) and the high-temperature medium outlet (21) are located at different ends of the microchannel evaporator.

3. The microchannel evaporator according to claim 1, characterized in that The low-temperature medium channel (1) comprises a first cavity, a low-temperature medium distribution pipe (12) and a low-temperature medium filling port (11); The first cavity is used to communicate with the capillary channel (31), the low-temperature medium distribution pipe (12) is built into the first cavity, and the low-temperature medium filling port (11) is communicated with the low-temperature medium distribution pipe (12); The wall of the low-temperature medium distribution pipe (12) is provided with a plurality of groups of through holes along the length direction. The through holes are arranged at equal intervals, or the through holes at one end close to the low-temperature medium filling port (11) are spaced smaller than the through holes at the other end.

4. The microchannel evaporator according to claim 1, characterized in that The high-temperature medium channel (2) comprises a second cavity, a high-temperature medium manifold (22) and a high-temperature medium outlet (21); The second cavity is used to communicate with the capillary channel (31), the high-temperature medium manifold (22) is built into the second cavity, and the high-temperature medium outlet (21) is communicated with the high-temperature medium manifold (22); The wall of the high-temperature medium confluence pipe (22) is provided with a plurality of groups of through holes along the length direction, and the through holes at one end close to the high-temperature medium outlet (21) are spaced apart from each other.

5. The microchannel evaporator according to claim 1, characterized in that: The arrangement height of the high-temperature medium channel (2) is higher than the arrangement height of the low-temperature medium channel (1); A reflux channel (4) is provided between the high-temperature medium channel (2) and the low-temperature medium channel (1), for allowing the liquid medium in the high-temperature medium channel (2) to flow back to the low-temperature medium channel (1).

6. The microchannel evaporator according to claim 5, characterized in that: The inlet end of the reflux channel (4) is connected to the low position of the outlet end of the high-temperature medium channel (2); The outlet end of the reflux channel (4) is in communication with an end of the low-temperature medium channel (1) away from the inlet end.

7. The microchannel evaporator according to claim 5, characterized in that: The reflux channel (4) is connected in series with the U-shaped bend structure (41) to form a liquid seal at the U-shaped bend structure (41).

8. The microchannel evaporator according to any one of claims 1 to 7, characterized in that: The planes where two adjacent heat exchange plate assemblies (3) are located are parallel, and both ends of the heat exchange plate assemblies (3) are detachably connected to the low-temperature medium channel (1) and the high-temperature medium channel (2), respectively.

9. The microchannel evaporator according to any one of claims 1 to 7, characterized in that: The opening directions of two adjacent groups of slots (32) are the same or opposite.

10. A vapor chamber heat exchange device, characterized in that: Comprising a heat sink (5) and the microchannel evaporator according to any one of claims 1 to 9; One end of the heat spreader (5) is fixedly inserted into the slot (32).

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