Shielding film assembling and disassembling device

Abstract

The invention relates to the technical field of electronic components, and discloses a shielding film assembling and disassembling device, which comprises a main shell, a shielding film, a shielding film and a shielding film, the packaging assembly comprises a plastic packaging part and a replacement part, the plastic packaging part is located in the main shell and located above the chip, the plastic packaging part is used for conducting plastic packaging on the chip, and the replacement part is arranged on the plastic packaging part and used for replacing the chip. After the plastic package of the chip is completed by the plastic package part, the insulating film is replaced on the plastic package part through the replacement part; the connecting pieces are arranged on the periphery of the chip in the circumferential direction, and the insulating film is connected with the chip in a limiting mode through the connecting pieces; and the plurality of control pieces are arranged in the main shell along the circumferential direction, and when external current is introduced into the control pieces, the control pieces control the connecting pieces to be connected with the mounting points of the chip in a limiting manner. Packaging and dismounting are combined, magnetic connection and dismounting are achieved, the packaging effect and connection stability are guaranteed, mounting and dismounting are convenient, and efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic components, in particular to a shielding film assembly and disassembly device. Background Art

[0002] Traditional chip shield removal methods include removing them by screwing, heating to soften solder joints or glue, cutting and prying. During removal, the device must be turned off and unplugged. For devices like mobile phones, the battery must also be removed. Use a pointed screwdriver to remove the screws securing the shield. Heat the solder joints or glue on the shield with a soldering iron or heat gun, keeping the soldering iron temperature at around 250-300°C. After heating, carefully pry or lift the shield from the edges or corners with flat-nosed pliers or tweezers to separate it from the motherboard and completely remove it from the chip. If it sticks, reheat or carefully separate it with tools. Use detergent and cotton swabs to clean dust, oil, and solder residue from the surface of the shield.

[0003] Traditional disassembly methods have the following disadvantages:

[0004] The operation is difficult and risky: heating and softening require precise control of temperature and time; when cutting and prying, the force and angle must be controlled, making the operation difficult.

[0005] Easy to cause damage: Improper temperature control when heating and softening the shielding cover will damage the chip and heat-sensitive components. Excessive force when using other tools to disassemble it will damage surrounding components. The disassembly process may also cause the shielding cover to deform, resulting in high maintenance costs.

[0006] Inefficient and ineffective: Heating and removing the shield cover not only requires waiting for the heating process, but also requires the operation to be performed step by step, resulting in low efficiency. It also generates debris, greatly increasing the difficulty of cleaning.

[0007] Therefore, there is an urgent need for a shielding film assembly and disassembly device to solve the above problems. Summary of the Invention

[0008] The purpose of the present invention is to provide a shielding film assembly and disassembly device to solve the problems existing in the above-mentioned prior art.

[0009] To achieve the above-mentioned purpose, the present invention provides the following solution: The present invention provides a shielding film assembly and disassembly device, comprising:

[0010] A main housing, covering the chip;

[0011] The packaging assembly includes a plastic sealing member and a replacement member. The plastic sealing member is located in the main housing and above the chip. The plastic sealing member is used to plastic seal the chip. The replacement member is provided on the plastic sealing member. After the plastic sealing member has completed plastic sealing of the chip, the insulating film on the plastic sealing member is replaced by the replacement member.

[0012] A plurality of connectors are circumferentially arranged around the chip, and the insulating film is positionally connected to the chip via the connectors;

[0013] A plurality of control components are circumferentially arranged in the main housing. When external current is passed through the control components, the connection components are controlled to be connected to the mounting points of the chip in a limited manner.

[0014] According to a shielding film assembly and disassembly device provided by the present invention, the plastic package includes a packaging shell, which is divided into an upper cavity and a lower cavity by a partition, a heating channel is connected to the top of the packaging shell, and the heating channel is connected to the upper cavity, a number of nanotubes are arranged in the upper cavity, a number of adsorption electrodes are arranged on the inner wall of the lower cavity, an insulating film is arranged at the bottom of the lower cavity, and an electrostatic generator is arranged on the packaging shell. When the electrostatic generator provides electric charge to the adsorption electrode, the insulating film falls off from the lower cavity and adheres to the chip.

[0015] According to a shielding film assembly and disassembly device provided by the present invention, a plurality of heating plates are arranged in the heating channel, the heating channel forms a zigzag channel through the plurality of heating plates, and the temperature gradually decreases from the uppermost heating plate to the lowermost heating plate.

[0016] According to a shielding film assembly and disassembly device provided by the present invention, a pump is fixedly connected to the packaging shell, the input end of the pump is connected to the lower cavity, and the output end of the pump is connected to the upper cavity.

[0017] According to a shielding film assembly and disassembly device provided by the present invention, the replacement part includes a new film storage chamber fixedly connected to the packaging shell, an insulating film is stored in the new film storage chamber, and a guide device is fixedly connected to the packaging shell. When the electrostatic generator provides charge to the adsorption electrode, the insulating film enters the packaging shell through the guide device and is flatly adsorbed on the bottom end of the lower cavity.

[0018] According to a shielding film assembly and disassembly device provided by the present invention, the connecting part includes a magnetic conduction buckle, and the magnetic conduction buckle includes a base. Several bases are circumferentially arranged on the peripheral side of the chip. A buckle is provided on the base. The bottom of the buckle is located inside the base, and the bottom of the buckle is rotatably connected to several magnetic strips. When the buckle is magnetized, several magnetic strips are expanded into a ring shape to adapt to the inside of the base, and the top of the buckle extends out of the base to form a pointed cone structure.

[0019] According to a shielding film assembly and disassembly device provided by the present invention, the insulating film at the bottom end of the lower cavity is penetrated by the buckle to form a buckle groove, and the buckle groove is limitedly connected to the pointed cone-shaped structure at the top end of the buckle.

[0020] According to a shielding film assembly and disassembly device provided by the present invention, the control component is a two-in-one coil, and the two-in-one coil includes a superconducting coil, the superconducting coil is covered with a thin insulating coating on the outside, the thin insulating coating is covered with a liquid helium cooling layer on the outside, the liquid helium cooling layer is covered with an insulating heat-insulating layer on the outside, an electromagnetic coil is arranged on the outside of the insulating heat-insulating layer, and a shielding shell is fixedly connected to the electromagnetic coil.

[0021] According to the shielding film assembly and disassembly device provided by the present invention, a refrigeration unit is fixedly connected to the main shell, and the refrigeration unit is communicated with the liquid helium cooling layer.

[0022] According to the shielding film assembly and disassembly device provided by the present invention, the main shell is provided with a monitoring device and a temperature sensor.

[0023] Compared with the prior art, the present invention has the following advantages and technical effects:

[0024] The present invention provides a shielding film assembly and disassembly device. The main housing is covered on the chip. An insulating film is installed on the plastic sealing member by replacing the member. The main housing is moved downward to connect the plastic sealing member to the connector. The chip is plastic sealed by the plastic sealing member. At the same time, the connector is controlled by the control member to achieve the connection between the shielding film and the chip, thereby achieving stable plastic sealing. During subsequent disassembly, the control member controls the connection point between the connector and the chip to separate the shielding film and the chip. This application combines packaging and disassembly to achieve magnetic connection and disassembly, ensuring the packaging effect and connection stability, facilitating installation and disassembly, and improving efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive work.

[0026] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0027] Figure 2 This is a schematic diagram of the magnetic conduction buckle structure of the present invention;

[0028] Figure 3 This is a schematic diagram of the two-in-one coil structure of the present invention;

[0029] Figure 4 This is a schematic diagram of the main housing of the present invention in an installed state;

[0030] Figure 5 This is a schematic diagram of the chip in the plastic packaging state of the present invention;

[0031] Among them, 1. chip; 2. magnetic conduction buckle; 21. base; 22. buckle; 3. two-in-one coil; 31. superconducting coil; 32. insulating thin coating; 33. liquid helium cooling layer; 34. insulating heat insulation layer; 35. electromagnetic coil; 36. shielding shell; 4. monitoring equipment; 5. packaging shell; 6. new film storage chamber; 7. electrostatic generator; 8. adsorption electrode; 9. nanotube; 10. heating channel; 11. pump; 12. partition; 13. refrigeration unit; 14. temperature sensor; 15. buckle groove; 16. heating plate; 17. guide device. DETAILED DESCRIPTION

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0033] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0034] Reference Figure 1-Figure 5 The present invention provides a shielding film assembly and disassembly device, comprising:

[0035] Main housing, covering the chip 1;

[0036] The packaging assembly includes a plastic sealing member and a replacement member. The plastic sealing member is located in the main housing and above the chip 1. The plastic sealing member is used to seal the chip 1. The replacement member is arranged on the plastic sealing member. After the plastic sealing member seals the chip 1, the replacement member is used to replace the insulating film on the plastic sealing member.

[0037] A plurality of connectors are circumferentially arranged around the chip 1, and the insulating film is positionally connected to the chip 1 through the connectors;

[0038] A plurality of control components are arranged in the main housing along the circumferential direction. When external current is passed through the control components, the control connecting components are connected to the mounting points of the chip 1 in a limiting manner.

[0039] In one embodiment of the present invention, the main shell cover is arranged on the chip 1, an insulating film is installed on the plastic sealing part by replacing the part, the main shell is moved downward to connect the plastic sealing part with the connecting part, the chip 1 is plastic sealed by the set plastic sealing part, and at the same time, the connecting part is controlled by the set control part to realize the connection between the shielding film and the chip 1, thereby realizing stable plastic sealing. During subsequent disassembly, the control part is used to control the connection point between the connecting part and the chip 1 to separate, thereby realizing the separation of the shielding film and the chip 1.

[0040] As an optional embodiment, the plastic package includes a packaging shell 5, which is divided into an upper cavity and a lower cavity by a partition 12. A heating channel 10 is connected to the top of the packaging shell 5, and the heating channel 10 is connected to the upper cavity. A number of nanotubes 9 are arranged in the upper cavity, and a number of adsorption electrodes 8 are arranged on the inner wall of the lower cavity. An insulating film is arranged at the bottom of the lower cavity, and an electrostatic generator 7 is arranged on the packaging shell 5. When the electrostatic generator 7 provides charge to the adsorption electrode 8, the insulating film falls off from the lower cavity and adheres to the chip 1.

[0041] In one embodiment of the present invention, a thermoplastic substrate is softened by heating through a heating channel 10. The upper cavity is equipped with nanotubes 9 containing transistors, which serve to stabilize and protect the transistors. A middle layer, a partition 12 made of two semicircular pieces, facilitates the smooth transfer of the packaging material. During the foaming phase, an electrical signal is applied to the transistors within the nanotubes 9, causing them to vibrate and generate ultrasonic waves, which promote the formation of pores and complete the foaming structure of the material. The foaming principle utilizes the piezoelectric effect and the cavitation effect of ultrasonic waves. A high-frequency alternating voltage is applied to the transistors, generating ultrasonic waves due to the piezoelectric effect. When ultrasonic waves propagate through the soft material, they form periodic compression waves and rarefaction waves. During the rarefaction wave phase, the local pressure of the medium drops sharply, causing dissolved gases in the liquid or the liquid itself to vaporize, forming tiny bubbles. During the subsequent compression wave phase, the bubbles are rapidly contracted and violently collapsed by the high pressure. The instantaneous release of energy impacts the internal structure of the material, promoting the formation of micropores and ultimately forming a foamed structure.

[0042] As an optional embodiment, a plurality of heating plates 16 are provided in the heating channel 10 , and the heating channel 10 forms a zigzag channel through the plurality of heating plates 16 , and the temperature gradually decreases from the uppermost heating plate 16 to the lowermost heating plate 16 .

[0043] In one embodiment of the present invention, a thermoplastic substrate is introduced from the top of the heating channel 10 and is heated and softened through the zigzag heating channel. The temperature of the heating plate 16 is designed to decrease from high to low from top to bottom to ensure that the material is initially softened and heated evenly.

[0044] As an optional embodiment, a pump 11 is fixedly connected to the packaging shell 5, the input end of the pump 11 is connected to the lower cavity, and the output end of the pump 11 is connected to the upper cavity.

[0045] In one embodiment of the present invention, a pump 11 is provided to continuously pump the air from the lower layer to the upper layer, forming a situation where the upper air pressure is high and the lower air pressure is low. When the insulating film is attached to the chip 1, the pressure difference is used to promote the film to fit tightly to the chip, completing the plastic sealing.

[0046] As an optional embodiment, the replacement part includes a new film storage chamber 6, which is fixedly connected to the packaging shell 5. The new film storage chamber 6 stores an insulating film. A guide device 17 is fixedly connected to the packaging shell 5. When the electrostatic generator 7 provides charge to the adsorption electrode 8, the insulating film enters the packaging shell 5 through the guide device 17 and is flatly adsorbed on the bottom of the lower cavity.

[0047] In one embodiment of the present invention, during device operation, an electrostatic generator 7 provides an electric charge to an adsorption electrode 8. When removing the old membrane, the electrostatic generator 7 charges the adsorption electrode 8 negatively. When replacing the new membrane, the electrostatic generator 7 charges the adsorption electrode 8 positively. Because the new membrane is coated with a negative ion coating, the positively charged adsorption electrode 8 attracts the new membrane. Subsequently, a guide device 17 smoothly lays the new membrane. The entire process utilizes the attraction and repulsion of static electricity to efficiently and accurately complete the replacement of the insulating film.

[0048] As an optional embodiment, the connecting part includes a magnetic conduction buckle 2, which includes a base 21. Several bases 21 are circumferentially arranged on the side of the chip 1. A buckle 22 is provided on the base 21. The bottom of the buckle 22 is located inside the base 21, and several magnetic strips are rotatably connected to the bottom of the buckle 22. When the buckle 22 is magnetized, the several magnetic strips are expanded into a ring shape and adapted to the inside of the base 21. The top of the buckle 22 extends out of the base 21 and is a pointed cone structure.

[0049] In one embodiment of the present invention, the buckle 22 is made of a hard ferrite material, which has unique magnetizing and demagnetizing properties. One end of the buckle 22 located inside the base 21 is composed of a plurality of magnetic strips made of hard ferrite magnetic materials. When fixing the shielding cover, through the magnetization operation, the hard ferrites are dispersed due to the repulsion of the same poles, and fit tightly into the inside of the circular base 21 to achieve a stable fixation. When disassembly is required, demagnetization is performed, and the repulsive force between the hard ferrites disappears, and they are aggregated together, making it easy to remove from the circular base 21 and easily complete disassembly. The base 21 is made of high magnetic permeability material and has a certain thickness. Its magnetic permeability shows a gradient characteristic from high to low from the inside to the outside. This characteristic causes the magnetic field to be continuously reflected inside the base 21, thereby effectively avoiding interference with surrounding electronic components.

[0050] As an optional embodiment, the insulating film at the bottom end of the lower cavity is penetrated by the buckle 22 to form a buckle groove 15, and the buckle groove 15 is limitedly connected to the pointed cone structure at the top end of the buckle 22.

[0051] In one embodiment of the present invention, when the buckle 22 penetrates the insulating film, a buckle groove 15 is formed on the insulating film, and the buckle 22 is engaged with the buckle groove 15. At this time, the electrostatic generator 7 is controlled to make the adsorption electrode 8 negatively charged, which repels the negative ion coating on the film, causing the insulating film to fall off. At the same time, the hard ferrite at the bottom of the buckle 22 is magnetized. Under the action of the magnetic field, the hard ferrite repels each other with the same poles and disperses to the surroundings, fitting tightly inside the circular base 21, providing stable support for the shielding cover, thereby realizing the installation of the shielding cover.

[0052] As an optional embodiment, the control component is a two-in-one coil 3, which includes a superconducting coil 31. The superconducting coil 31 is covered with a thin insulating coating 32 on the outside, the thin insulating coating 32 is covered with a liquid helium cooling layer 33 on the outside, the liquid helium cooling layer 33 is covered with an insulating thermal insulation layer 34 on the outside, and an electromagnetic coil 35 is arranged on the outside of the insulating thermal insulation layer 34, and a shielding shell 36 is fixedly connected to the electromagnetic coil 35.

[0053] In one embodiment of the present invention, the two-in-one coil 3 utilizes a radially layered design. The inner layer is a superconducting coil 31 covered with a thin insulating coating 32. Made of a niobium-titanium alloy with a critical temperature of 11K, the coating prevents short circuits and facilitates heat exchange. A liquid helium cooling layer 33, with a boiling point of 4.2K, ensures the superconducting coil 31 remains cool to its critical temperature. Further outward is an insulating layer 34, which reduces internal heat loss and isolates the electromagnetic coil 35. The outermost layer is a shielding shell 36 made of a high-permeability material to minimize interference with the external environment. During operation, current flowing in a specific direction creates a reverse magnetic field in the coil, thereby canceling out the original magnetic field and controlling the connection and removal of the clip 22.

[0054] As an optional embodiment, a refrigeration unit 13 is fixedly connected to the main shell, and the refrigeration unit 13 is in communication with the liquid helium cooling layer 33 .

[0055] As an optional embodiment, a monitoring device 4 and a temperature sensor 14 are provided on the main housing.

[0056] In one embodiment of the present invention, the temperature during use is monitored by a temperature sensor 14 , and various data are monitored by a monitoring device 4 .

[0057] The present invention provides a shielding film assembly and disassembly device. First, the circulating pump within the refrigeration unit 13 is activated to maintain the flow of liquid helium within the liquid helium cooling layer 33. This ensures uniform temperature across all regions of the liquid helium cooling layer 33, allowing the superconducting coil 31 to fully exchange heat with the liquid helium and maintain superconducting properties. Simultaneously, a thermoplastic encapsulating plastic, polytetrafluoroethylene, is added to the encapsulating shell 5. The material is heated through the heating channel 10, causing it to gradually soften. Simultaneously, an electrical signal is transmitted to the transistors within the lower nanotubes 9. The electrical signal excites the transistors, causing them to vibrate strongly and emit ultrasonic waves. These waves act on the softened material, causing its internal structure to change, causing it to expand and become covered with fine pores.

[0058] The temperature is detected by the temperature sensor 14. When the temperature reading approaches 11K, the packaging equipment is precisely controlled to slowly move downward and accurately align with the chip 1. After the upper end of the clip 22 successfully breaks through the insulation layer and is firmly fixed, the partition 12 and the pump 11 are quickly opened. At this time, the partition 12 is opened to allow the packaging material to smoothly enter the lower cavity; the electrostatic generator 7 is controlled to make the adsorption electrode 8 negatively charged, which repels the negative ion coating on the film, causing the insulating film to fall off. The pump 11 is started, and the air in the lower cavity is continuously pumped into the upper cavity. A significant pressure difference is formed between the upper and lower cavities. Due to this pressure difference, the packaging material is tightly attached to the chip 1, achieving a better packaging effect.

[0059] After the old film is removed, the electrostatic generator 7 is controlled to switch the adsorption electrode 8 to a positive state. The attraction between the positive and negative charges allows the new insulating film to be quickly adsorbed. Guided by a guide 17, the new film is smoothly transferred to the bottom layer of the equipment. The packaging equipment then slowly moves upward, preparing for the subsequent packaging process.

[0060] Specific process: The adsorption electrodes are divided into two sides a and b, which can be controlled separately. The membrane passes through the guide device 17 from the a side and reaches the bottom without deviation. At this time, the a side electrode is charged and the b side motor is turned off. When it reaches the bottom, the b side motor is turned on and the a side electrode is turned off to attract the film to cover the bottom of the cavity. Then the a and b electrodes are turned on at the same time to keep the film fixed. The membrane only needs to be replaced when needed.

[0061] Next, magnetize the device. First, turn on the superconducting coil 31, followed by the electromagnetic coil 35. Adjust the current until the magnetic field reaches the appropriate intensity. Keep a close eye on the monitoring device 4. Once the data stabilizes, magnetize the hard ferrite at the bottom of the buckle 22. Under the influence of the magnetic field, like poles of the hard ferrite repel each other, dispersing them in all directions and fitting tightly within the circular base 21, providing stable support for the shield. This completes the installation of the shield.

[0062] When the shield needs to be replaced, the reverse magnetic field generated by the coil is used to demagnetize the hard ferrite at the bottom of the buckle 22. As the magnetic field acts, the magnetism of the hard ferrite is neutralized, the mutual repulsion disappears, and the hard ferrites aggregate together, weakening the fixing force between the shield and the base 21, making it easier to remove it.

[0063] This application adopts a magnetic shield disassembly device, and innovatively introduces an integrated structure of the electromagnetic coil 35 and the superconducting coil 31, breaking the traditional single-coil mode and avoiding space redundancy. At the same time, it combines the packaging equipment with the disassembly equipment to achieve multifunctionality.

[0064] The device utilizes a unique radially layered design, consisting of, from inside to outside, a superconducting coil 31 covered with a thin insulating coating 32, a liquid helium cooling layer 33, an insulating and heat-insulating layer 34, an electromagnetic coil 35, and a shielding shell 36. The insulating coating 32 prevents short circuits in the coils and facilitates heat exchange; the liquid helium cooling layer 33 maintains the operating temperature of the superconducting coil 31; the insulating and heat-insulating layer 34 reduces internal heat loss and insulates the electromagnetic coil 35; and the outermost shielding shell 36 effectively reduces external interference from the magnetic field.

[0065] The magnetic buckle 2 utilizes a unique magnetic conduction principle to achieve a tight engagement, providing a secure connection that effectively resists external forces, reduces loosening, and improves stability. Furthermore, the buckle 22 can be adaptively adjusted to various shapes, easily adapting to various complex installation environments and grounding requirements.

[0066] By introducing ultrasonic technology into the packaging equipment, the precise effect of ultrasound can achieve the controllable expansion of bubbles in the material. At the same time, the principle of pressure difference is cleverly used to greatly improve the fit between the packaging material and the chip, bringing the packaging effect to a new level.

[0067] Electrostatic force adsorption replaces the film. By changing the polarity of the adsorption electrode, the old film can be quickly detached and the new film can be accurately adsorbed, which is efficient, time-saving and improves practicality.

[0068] The ingenious integration of encapsulation and disassembly equipment significantly enhances the device's practical value. Meanwhile, the company innovates droplet encapsulation technology by using thermoplastics as the encapsulation material, leveraging their softening properties upon heating to achieve a tighter, more comprehensive encapsulation effect.

[0069] In the description of the present invention, it should be understood that the terms "longitudinal", "transverse", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0070] The embodiments described above are merely descriptions of preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Without departing from the spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by persons skilled in the art should fall within the scope of protection defined by the claims of the present invention.

Claims

1. A shielding film assembly and disassembly device, characterized in that: include: A main housing, the housing being arranged on the chip (1); A packaging component, comprising a plastic sealing component and a replacement component, wherein the plastic sealing component is located in the main housing and above the chip (1), the plastic sealing component is used to plastic seal the chip (1), and the replacement component is arranged on the plastic sealing component, and after the plastic sealing component has completed plastic sealing of the chip (1), the insulating film on the plastic sealing component is replaced by the replacement component; A plurality of connecting members are circumferentially arranged around the periphery of the chip (1), and the insulating film is positionally connected to the chip (1) via the connecting members; A plurality of control components are arranged in the main housing along the circumferential direction. When external current is passed through the control components, the connection components are controlled to be connected to the mounting points of the chip (1) in a limited manner.

2. A shielding film assembly and disassembly device according to claim 1, characterized in that: The plastic package comprises a packaging shell (5), wherein the packaging shell (5) is divided into an upper cavity and a lower cavity by a partition (12), a heating channel (10) is connected to the top of the packaging shell (5), and the heating channel (10) is connected to the upper cavity, a plurality of nanotubes (9) are arranged in the upper cavity, a plurality of adsorption electrodes (8) are arranged on the inner wall of the lower cavity, an insulating film is arranged at the bottom of the lower cavity, and an electrostatic generator (7) is arranged on the packaging shell (5), and when the electrostatic generator (7) provides electric charge to the adsorption electrode (8), the insulating film falls off from the lower cavity and adheres to the chip (1).

3. A shielding film assembly and disassembly device according to claim 2, characterized in that: A plurality of heating plates (16) are arranged in the heating channel (10), and the heating channel (10) forms a zigzag channel through the plurality of heating plates (16), and the temperature gradually decreases from the uppermost heating plate (16) to the lowermost heating plate (16).

4. The shielding film assembly and disassembly device according to claim 2, characterized in that: A pump (11) is fixedly connected to the packaging shell (5), the input end of the pump (11) is communicated with the lower cavity, and the output end of the pump (11) is communicated with the upper cavity.

5. The shielding film assembly and disassembly device according to claim 2, characterized in that: The replacement part includes a new film storage chamber (6) fixedly connected to the packaging shell (5), wherein an insulating film is stored in the new film storage chamber (6), and a guide device (17) is fixedly connected to the packaging shell (5). When the electrostatic generator (7) provides electric charge to the adsorption electrode (8), the insulating film enters the packaging shell (5) through the guide device (17) and is flatly adsorbed on the bottom end of the lower cavity.

6. The shielding film assembly and disassembly device according to claim 2, characterized in that: The connecting part includes a magnetic conduction buckle (2), and the magnetic conduction buckle (2) includes a base (21). Several bases (21) are arranged circumferentially on the peripheral side of the chip (1). A buckle (22) is arranged on the base (21). The bottom of the buckle (22) is located in the base (21), and the bottom of the buckle (22) is rotatably connected to several magnetic strips. When the buckle (22) is magnetized, the several magnetic strips are unfolded into a ring shape and adapted to the inside of the base (21). The top of the buckle (22) extends out of the base (21) and is a pointed cone structure.

7. The shielding film assembly and disassembly device according to claim 6, characterized in that: The insulating film at the bottom end of the lower cavity is penetrated by the buckle (22) to form a buckle groove (15), and the buckle groove (15) is limitedly connected to the pointed cone structure at the top end of the buckle (22).

8. The shielding film assembly and disassembly device according to claim 1, characterized in that: The control component is a two-in-one coil (3), which includes a superconducting coil (31), the superconducting coil (31) is coated with an insulating thin coating (32), the insulating thin coating (32) is coated with a liquid helium cooling layer (33), the liquid helium cooling layer (33) is coated with an insulating heat-insulating layer (34), an electromagnetic coil (35) is arranged outside the insulating heat-insulating layer (34), and a shielding shell (36) is fixedly connected to the electromagnetic coil (35).

9. The shielding film assembly and disassembly device according to claim 8, characterized in that: A refrigeration unit (13) is fixedly connected to the main shell, and the refrigeration unit (13) is in communication with the liquid helium cooling layer (33).

10. The shielding film assembly and disassembly device according to claim 1, characterized in that: The main housing is provided with a monitoring device (4) and a temperature sensor (14).

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