A portable attenuator

Abstract

The application belongs to the technical field of attenuators, and specifically discloses a portable attenuator, which comprises a shell, a radiator is installed in the shell, the radiator comprises an upper radiator and a lower radiator which are connected with each other, heat dissipation fins are connected to the ends of the upper radiator and the lower radiator which are away from each other, a plurality of attenuation pieces are installed between the upper radiator and the lower radiator, and the attenuation values of the plurality of attenuation pieces are different from each other; the plurality of attenuation pieces are sequentially distributed along a plurality of folding paths, one end of the shell is connected with an input end connector, the other end of the shell is connected with an output end connector, and the two attenuation pieces located at the two ends are connected with the input end connector and the output end connector respectively; the adjacent attenuation pieces and the attenuation pieces and the input end connector and the output end connector are all connected in series through circuit boards. The application can reduce the volume of the attenuator and increase the heat dissipation capacity.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of attenuators, in particular to a portable attenuator. BACKGROUND

[0002] With the rapid development of communication, electronic measurement, broadcast television and military fields, the traditional attenuator is difficult to meet the requirements of flexible adjustment of signal strength, high-precision control and multi-functional integration in mobile scenarios such as field testing and on-site debugging due to its large size, poor flexibility, single function and other limitations. At the same time, the requirements of signal processing are continuously improved in application scenarios such as 5G network construction, satellite communication development and scientific research experiment, which promotes the research and development of portable attenuators. The portable attenuator aims to provide a convenient, accurate and integrated signal attenuation solution for diversified scenarios such as field testing and on-site debugging, in order to adapt to the development trend of modern electronic technology.

[0003] The deficiencies of the traditional portable attenuator in high-power signal processing, heat dissipation and temperature monitoring are particularly prominent. When processing high-power signals, the traditional portable attenuator has large power and considerable heat generation. The performance stability of the traditional portable attenuator is often affected by the insufficient heat dissipation capacity. Moreover, the traditional portable attenuator lacks effective temperature monitoring means, which makes it difficult to ensure the safe operation of the equipment. SUMMARY

[0004] The present application provides a portable attenuator, which aims to reduce the volume of the attenuator while increasing the heat dissipation.

[0005] The present application realizes the following technical scheme: a portable attenuator, comprising a shell, a heat sink is installed in the shell, the heat sink comprises an upper heat sink and a lower heat sink connected to each other, one end of the upper heat sink and the lower heat sink away from each other is connected with a heat dissipation fin, a plurality of attenuation pieces are installed between the upper heat sink and the lower heat sink, the attenuation values of the plurality of attenuation pieces are different; a plurality of attenuation pieces are sequentially distributed along a plurality of folding paths, one end of the shell is connected with an input connector, the other end of the shell is connected with an output connector, two attenuation pieces located at the beginning and the end are connected with the input connector and the output connector respectively; the adjacent attenuation pieces and the attenuation pieces and the input connector and the output connector are connected in series through a circuit board.

[0006] Compared with the prior art, the present application has the following advantages and beneficial effects:

[0007] The upper heat sink and the lower heat sink form a clamping structure in the scheme, which can wrap multiple attenuation pieces between the two, expand the heat dissipation area through the double-sided contact between the upper heat sink and the lower heat sink, and cooperate with the heat dissipation fins on the upper heat sink and the lower heat sink to quickly conduct the heat generated by the attenuation pieces during work to the outside of the shell, avoiding drift of attenuation performance or damage to the device due to high temperature.

[0008] In addition, the multiple attenuation pieces are arranged in a "folded" compact arrangement in the shell according to the design of the multiple attenuation pieces distributed in multiple folding paths, which can accommodate more attenuation pieces under the same shell length compared to the traditional linear arrangement, or greatly shorten the shell axial size under the same number of attenuation pieces, directly realizing the miniaturization of the device, reducing the space size of the device, and meeting the stringent requirements of portable devices for space limitations. In addition, the folded arrangement of multiple attenuation pieces can increase the contact area with the heat sink, thereby expanding the heat dissipation area and speeding up the heat dissipation speed.

[0009] The folding layout avoids the problem of excessive length of the device caused by the increase in the number of attenuation pieces, making the device easier to carry and store, and adapting to outdoor testing, mobile debugging and other scenarios.

[0010] In the scheme, the folded attenuation pieces are clamped and wrapped by the upper and lower heat sinks, and the heat dissipation structure can tightly fit each attenuation piece in the folding path to maximize the utilization of the heat dissipation area in a limited space - both saving axial space through folding and allowing the heat sink to efficiently cover all attenuation pieces, thereby increasing the heat dissipation while reducing the size of the attenuator, ensuring the heat dissipation efficiency of the device in a compact space.

[0011] Further, the distribution path of the multiple attenuation pieces includes multiple straight line segments and multiple turning segments, the circuit board is arranged along the distribution path of the multiple attenuation pieces, the adjacent two straight line segments are connected through the turning segment, and the multiple attenuation pieces are sequentially distributed on the circuit board of the multiple straight line segments.

[0012] Beneficial effects: In the scheme, the straight line segment provides a stable mounting carrier for the attenuation piece, ensuring uniform stress and fixed position of the attenuation piece during work; the turning segment changes the path direction through angle turning, allowing the overall layout to be folded in a limited shell space.

[0013] The segmented path design of the scheme can flexibly adjust the length of the straight line segment and the turning angle according to the shape of the shell (such as square, strip, etc.), adapt to different shell sizes of portable devices, further compress the device volume, and improve the portability.

[0014] The attenuation piece is fixed on the straight line segment circuit board, and the turning segment serves as a connection transition to form a rigid frame, reducing the risk of displacement or loosening of the attenuation piece during movement or vibration of the device, and improving the impact resistance.

[0015] Further, the circuit board comprises a plurality of first circuit boards and a plurality of second circuit boards, the second circuit board is L-shaped, the first circuit board is linear, the first circuit board is located in the linear segment, and the second circuit board is located in the turning segment; the first circuit board is located between two adjacent attenuation pieces and between the attenuation piece and the input connector and the output connector.

[0016] Beneficial effect: The linear first circuit board is suitable for connecting the linear segment between adjacent attenuation pieces (including the linear connection of the attenuation piece and the input / output connector), which can ensure that the signal path is short and straight and the impedance is stable during linear transmission; the L-shaped second circuit board is specially adapted to the turning segment, which precisely connects the adjacent linear segments through the right-angle bending structure, avoids structural stress caused by line distortion or folding at the turning point, and reduces the additional loss of the signal transmission path.

[0017] Further, a plurality of attenuation piece mounting grooves, a plurality of first circuit board mounting grooves and a plurality of second circuit board mounting grooves are formed on the upper heat sink or the lower heat sink along the distribution path of the plurality of attenuation pieces, the plurality of attenuation pieces are connected in the plurality of attenuation piece mounting grooves in sequence, the plurality of first circuit boards are connected in the plurality of first circuit board mounting grooves in sequence, and the plurality of second circuit boards are connected in the plurality of second circuit board mounting grooves in sequence; both ends of the attenuation piece are connected with lead wires, and both the first circuit board and the second circuit board are connected with transmission lines, and the lead wires at both ends of the attenuation piece are connected with the transmission lines.

[0018] Beneficial effect: The attenuation piece, the first circuit board and the second circuit board are respectively embedded in the corresponding mounting groove, the mounting groove can limit the displacement (such as the deviation when shaking and shaking) of each component in space, ensure the fixed relative position of the attenuation piece and the circuit board, and avoid signal interruption or attenuation value drift caused by poor contact.

[0019] The mounting groove is formed along the attenuation piece distribution path, so that the attenuation piece, the circuit board and the heat sink form a "nested" overall structure, reducing the gap and loosening risk between components, improving the mechanical strength of the whole device, and especially adapting to the use demand of frequent movement and collision in portable scene. The attenuation piece is directly installed in the attenuation piece mounting groove of the heat sink, the contact area between them is large and closely fitted, and the heat generated by the attenuation piece during work can be quickly conducted to the upper heat sink, the lower heat sink and the heat dissipation fins, and dissipated efficiently through the heat dissipation fins; at the same time, the circuit board is installed in the mounting groove of the heat sink, and its working heat can also be conducted out through the heat sink, avoiding the influence of local heat accumulation on the performance of electronic components.

[0020] In addition, the mounting grooves provide clear assembly bases for the components, and the operator can sequentially embed the attenuating sheets and the circuit boards into the corresponding groove positions according to the paths, without the need for complex positioning tools, thereby reducing assembly, and when a certain attenuating sheet or circuit board fails, the corresponding component can be directly taken out from the mounting groove without the need for disassembling the entire heat sink or the series connection structure. The lead lines at both ends of the attenuating sheets are connected with the first circuit board and the second circuit board through the transmission lines, so that the series connection between the attenuating sheets is realized.

[0021] Further, grooves are formed in the upper heat sink and the lower heat sink, the shapes of the grooves are consistent with the distribution paths of the plurality of attenuating sheets, and the plurality of attenuating sheets are accommodated in the grooves after the upper heat sink and the lower heat sink are buckled with each other.

[0022] Beneficial effects: The groove shape is completely matched with the folding and distribution path of the attenuating sheet, and the multiple distributed attenuating sheets and circuit boards can be wrapped in the groove as a whole. After the upper heat sink and the lower heat sink are buckled, a compact closed space is formed, and the components can avoid occupying extra redundant space in the shell.

[0023] Further, the transmission lines on the first circuit board and the second circuit board are located on the same horizontal plane as the lead lines on the attenuating sheets, and the transmission line arrangement structure on the second circuit board is the same as the shape of the second circuit board.

[0024] Beneficial effects: The transmission lines and the attenuating sheet lead lines are located on the same horizontal plane, which can improve the connection accuracy and matching degree, avoid lead line bending or vertical transition caused by height difference, and maintain the continuity of the signal transmission path. The second circuit board is L-shaped, and the transmission line arrangement structure is consistent with the shape of the board, which can smoothly transition the transmission direction of the signal at the turning section, and smoothly and continuously connect the attenuating sheets at both ends of the second circuit board with the transmission lines at both ends of the second circuit board.

[0025] Further, a plurality of fans are installed in the shell, and heat dissipation holes are formed in the shell to communicate with the inside of the shell.

[0026] Beneficial effects: The plurality of fans installed in the shell in the scheme can form directional airflow, accelerate air circulation inside the shell, and quickly take away and discharge the heat conducted to the surface of the heat sink from the heat dissipation holes. Compared with passive heat dissipation relying solely on the heat sink, active heat dissipation of the fan can significantly improve the heat dissipation efficiency, and is especially suitable for scenarios where multiple attenuating sheets work at high power at the same time, and can effectively avoid overheating of devices caused by heat accumulation.

[0027] Further, notches are formed at four corners of the upper heat sink and the lower heat sink, the notches and the side walls of the shell form mounting spaces for installing fans, and the fans are provided in four, and the four fans are respectively installed in the four mounting spaces.

[0028] Beneficial effect: The four corners of the upper and lower heat sinks belong to the area with lower utilization rate in the traditional structure. The installation space formed after the opening of the notch does not need to occupy the core layout area of the attenuation sheet and the circuit board. Without sacrificing the space of the signal transmission component, the exclusive installation position is provided for the fan, which perfectly adapts to the demand of miniaturization and high-density integration of the device.

[0029] In addition, the four-corner symmetrical layout balances the weight of the structure, and the four fans are installed at the four corners, which can make the overall weight distribution of the device more uniform, avoid the deviation of the gravity center caused by the unilateral installation of the fan, and especially for portable devices, the stability during holding or placing can be improved.

[0030] Further, the shell comprises an upper cover plate, a lower cover plate, a front panel, a rear panel and two side plates, the upper cover plate, the lower cover plate, the front panel, the rear panel and the two side plates are mutually enclosed to form a cavity, and the upper heat sink and the lower heat sink are located in the cavity; the two ends of the upper cover plate and the lower cover plate are connected with the front panel and the rear panel respectively, and the two side plates are connected with the two sides of the upper cover plate and the lower cover plate respectively.

[0031] The heat dissipation holes are arranged on the two side plates; the two ends of the two side plates extend out of the front panel and the rear panel respectively, and the front part and the rear part of the side plate are provided with handle holes.

[0032] Beneficial effect: In the present scheme, the upper cover plate, the lower cover plate, the front panel, the rear panel and the two side plates form a closed cavity, which provides a stable installation space for the upper heat sink, the lower heat sink and the internal attenuation sheet, the circuit board and other core components. Through the multi-surface enclosing structure, external impact is resisted, and connection loosening caused by internal component shaking is avoided.

[0033] The heat dissipation holes are arranged on the two side plates, which, in combination with the arrangement of the internal fan, can form a directional air duct with "lateral air inlet / exhaust". The airflow driven by the fan flows transversely along the cavity, and the internal and external air is quickly exchanged through the heat dissipation holes of the side plate, so as to avoid the formation of vortex in the cavity.

[0034] The two ends of the side plate extend out of the front panel and the rear panel and are provided with handle holes, so that the handle holes naturally form an "exposed handle structure". The user can directly carry the device through the handle holes without the need for additional installation of independent handles, thereby saving the shell space and assembly process.

[0035] The cavity structure physically isolates the internal heat dissipation area (heat sink, fan, attenuation sheet) from the external environment through the enclosing of the panels, so as to avoid direct contact of dust and water vapor with the core components. At the same time, the front panel and the rear panel can be arranged with signal interfaces, control buttons and other functional components, and the side plate is mainly used for heat dissipation and handle function, forming a "clear functional division" layout, which is convenient for assembly and maintenance.

[0036] Further, a thermometer is installed on the shell, the thermometer has a display, and a temperature probe of the thermometer is connected to the heat sink.

[0037] Beneficial effects: In this scheme, the temperature probe is directly connected to the heat sink, and the heat sink is in close contact with the heat core components such as the attenuation sheet and the circuit board, so that the probe can accurately capture the core temperature during the actual operation of the device (rather than the ambient temperature on the surface of the shell), avoiding the risk of overheating caused by temperature monitoring lag or deviation (for example, the attenuation sheet may be overheated for a long time under high-power signals, which may cause performance attenuation or burning). The thermometer can monitor the temperature of the heat sink and quickly respond to temperature changes. The display on the thermometer can display the current temperature of the heat sink, and the display can intuitively feedback abnormalities (such as sudden temperature rise) to facilitate the operator to stop and troubleshoot in time. BRIEF DESCRIPTION OF DRAWINGS

[0038] The accompanying drawings, which are included to provide a further understanding of the embodiments of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the principles of the application. In the drawings:

[0039] Figure 1 It is a front view of an embodiment of a portable attenuator of the application;

[0040] Figure 2 It is a rear view of an embodiment of a portable attenuator of the application;

[0041] Figure 3 It is a top view of an embodiment of a portable attenuator of the application;

[0042] Figure 4 It is a side view of an embodiment of a portable attenuator of the application;

[0043] Figure 5 It is a partial sectional view of an embodiment of a portable attenuator of the application;

[0044] Figure 6 It is a schematic view of the internal structure in the top direction of an embodiment of a portable attenuator of the application;

[0045] Figure 7 It is a schematic view of the structure of the attenuator, the first circuit board and the second circuit board in an embodiment of a portable attenuator of the application;

[0046] Figure 8 It is a partial schematic view of the upper heat sink in an embodiment of a portable attenuator of the application.

[0047] In the drawings, the marks and corresponding names of parts are:

[0048] upper heat sink 1, first circuit board mounting slot 101, attenuation sheet mounting slot 102, notch 103, first circuit board fixing hole 104, attenuation sheet fixing hole 105, second circuit board fixing hole 106, second circuit board mounting slot 107, heat dissipation fin 108;

[0049] lower heat sink 2; side plate 3, handle hole 301, heat dissipation hole 302;

[0050] upper cover plate 4, lower cover plate 5, front panel 6, rear panel 7, foot pad 8;

[0051] attenuation sheet 9, flange hole 901, lead wire 902, flange 903;

[0052] first circuit board 10, first microstrip line 1001, first connecting hole 1002;

[0053] second circuit board 11, second microstrip line 1101, second connecting hole 1102;

[0054] fan 12, thermometer 14, input end connector 15, output end connector 16, power supply indication switch 17, power supply socket 18, ground terminal 19. DETAILED DESCRIPTION

[0055] In order to make the objects, technical solutions and advantages of the present application clearer, further detailed description will be given below in combination with examples and drawings, and the schematic embodiments of the present application and the description thereof are only used to explain the present application, and do not limit the present application.

[0056] As one embodiment of the present application, as shown in Figures 1-5 the present embodiment provides a portable attenuator, which comprises a shell, a heat sink is installed in the shell, the heat sink comprises an upper heat sink 1 and a lower heat sink 2 connected with each other, the upper heat sink 1 and the lower heat sink 2 are connected with heat dissipation fins 108 at the ends away from each other, the heat dissipation fins 108 are used to increase the contact area with air and accelerate heat conduction, a plurality of attenuation sheets 9 are installed between the upper heat sink 1 and the lower heat sink 2, and the attenuation values of the plurality of attenuation sheets 9 are different.

[0057] As shown in Figure 6 the plurality of attenuation sheets 9 are sequentially distributed along a plurality of folding paths, as shown in Figures 1-3 one end of the shell is connected with an input end connector 15, and the other end of the shell is connected with an output end connector 16, and in the present embodiment, the input end connector 15 and the output end connector 16 are connected and fixed with the front side and the rear side of the shell through bolts or screws. As shown in Figure 6As shown, two attenuation pieces 9 at the two ends are connected with the input connector 15 and the output connector 16 respectively; the adjacent attenuation pieces 9 and the attenuation pieces 9 and the input connector 15 and the output connector 16 are connected in series through the circuit board.

[0058] In one embodiment, as shown in the figure, the distribution path of the plurality of attenuation pieces 9 in the embodiment includes a plurality of straight segments and a plurality of turning segments, the circuit board is arranged along the distribution path of the plurality of attenuation pieces 9, the adjacent two straight segments are connected through the turning segment, and the plurality of attenuation pieces 9 are sequentially distributed on the circuit board of the plurality of straight segments. Figure 6

[0059] In the embodiment, the circuit board includes a plurality of first circuit boards 10 and a plurality of second circuit boards 11, the second circuit board 11 is in L shape, the first circuit board 10 is in straight line type, the first circuit board 10 is located at the straight segment, and the second circuit board 11 is located at the turning segment; the first circuit board 10 is located between the adjacent two attenuation pieces 9 and between the attenuation piece 9 and the input connector 15 and the output connector 16.

[0060] In the embodiment, the distribution path of the plurality of attenuation pieces 9 presents a plurality of right-angle zigzag folding structures as a whole, specifically: starting from the input connector 15, 2-3 attenuation pieces 9 are first arranged vertically in a straight line direction, a 90° right-angle horizontal left turn is made at a preset position, 3-5 attenuation pieces 9 are arranged, a 90° right-angle vertical upward turn is made again, 2-3 attenuation pieces 9 are arranged, a 90° right-angle horizontal right turn is made at a preset position, and the right-angle turning logic is repeated (each turn is 90°), a continuous folding path is formed, and finally extended to the output connector 16. The plurality of attenuation pieces 9 in the application are arranged and distributed according to the curved path shown in the figure, which greatly saves the length of the portable attenuator and saves the space of the entire attenuator, facilitating carrying. Figure 6

[0061] Each attenuation piece 9 and the input connector 15 and the output connector 16 are connected in series through the first circuit board 10, and the L-shaped second circuit board 11 is used for connection at the turning position.

[0062] In one embodiment, the attenuation piece 9 in the embodiment is taken as an example for description with 19 pieces set, but the attenuation values of each attenuation piece 9 are different, A=20log 10 P in / P out , wherein A is the attenuation value, P in is the input power of the attenuation piece 9, and P out is the output power of the attenuation piece 9.

[0063] ​​The calculation principle is that 19 attenuators 9 averagely bear 1000W power, the attenuation value of the first 18 attenuators 9 is calculated according to the above formula from the input connector 15, and the last attenuator 9 at the output connector 16 is matched according to the total attenuation value of the portable attenuator.

[0064] Since the input power P in and the output power P out of each attenuator 9 are different, the finally calculated attenuation value A is naturally different. This is directly related to the distribution logic that 19 attenuators 9 averagely bear 1000W power - the signal power gradually decreases along the attenuator from the input end to the output end, and each attenuator 9 bears a different power segment, so the ratio of P in and P out is different, and the attenuation value is also different. The portable attenuator has too much power, which is an average power of 1000W, and the attenuation value of 19 attenuators 9 is calculated according to the average power, and each attenuator 9 needs to bear about 50-60W power.

[0065] In one embodiment, as shown in Figure 7 and Figure 8 , a plurality of attenuator mounting grooves 102, a plurality of first circuit board mounting grooves 101 and a plurality of second circuit board mounting grooves 107 are arranged along the distribution path of the plurality of attenuators 9 on the upper heat sink 1 or the lower heat sink 2, the attenuator mounting grooves 102 and the first circuit board mounting grooves 101 are located on the straight sections, and the second circuit board mounting grooves 107 are located on the turning sections; the plurality of attenuators 9 are connected in the plurality of attenuator mounting grooves 102 in sequence, the plurality of first circuit boards 10 are connected in the plurality of first circuit board mounting grooves 101 in sequence, and the plurality of second circuit boards 11 are connected in the plurality of second circuit board mounting grooves 107 in sequence; the attenuators 9 are connected with lead wires 902 at both ends, the first circuit boards 10 and the second circuit boards 11 are connected with transmission lines, and the lead wires 902 at both ends of the attenuators 9 are connected with the transmission lines. In this embodiment, the transmission lines on the second circuit boards 11 and the first circuit boards 10 are microstrip lines.

[0066] In this embodiment, the attenuators 9 are fixedly connected with flanges 903 at the bottom, flange holes 901 are arranged on the left and right parts of the flanges 903; the first circuit boards 10 are connected with transmission lines at the middle positions, and the transmission lines on the first circuit boards 10 are first microstrip lines 1001 in this embodiment; first connecting holes 1002 are arranged on the left and right parts of the first circuit boards 10; a plurality of second connecting holes 1102 are arranged on the second circuit boards 11 to match the second circuit board mounting grooves 107, the transmission lines on the second circuit boards 11 are second microstrip lines 1101, and the second microstrip lines 1101 are L-shaped to match the shape of the second circuit boards 11, so as to facilitate the connection of the lead wires 902 on the attenuators 9 on the turning sections and the straight sections.

[0067] The attenuation sheet mounting groove 102, the first circuit board mounting groove 101 and the second circuit board mounting groove 107 are all arranged on the upper heat sink 1 in this embodiment. The depth of the attenuation sheet mounting groove 102 is different from that of the first circuit board mounting groove 101 and the second circuit board mounting groove 107. In this embodiment, the thickness of the attenuation sheet 9 after being connected with the flange 903 is greater than that of the first circuit board 10 and the second circuit board 11. Therefore, the depth of the attenuation sheet mounting groove 102 is greater than that of the first circuit board mounting groove 101 and the second circuit board mounting groove 107. In this way, the flange 903 on the attenuation sheet 9 is in contact with the attenuation sheet mounting groove 102 after the attenuation sheet 9 and the circuit boards are mounted, and the microstrip lines on the first circuit board 10 and the second circuit board 11 are located on the same horizontal plane as the lead lines 902 on the attenuation sheet 9. The transmission line arrangement structure on the second circuit board 11 is the same as the shape of the second circuit board 11, that is, the transmission line on the second circuit board 11 is also arranged in an L shape. In this way, the attenuation sheet 9 on the straight line segment is smoothly connected.

[0068] In this embodiment, two attenuation sheet fixing holes 105 opposite to the flange holes 901 are arranged at the bottom of the attenuation sheet mounting groove 102. Two first circuit board fixing holes 104 opposite to the first connecting holes 1002 are arranged at the bottom of the first circuit board mounting groove 101. Two second circuit board fixing holes 106 opposite to the second connecting holes 1102 are arranged at the bottom of the second circuit board mounting groove 107.

[0069] The flange holes 901 on the flange 903 at the bottom of the attenuation sheet 9 are aligned with the attenuation sheet fixing holes 105 in the attenuation sheet mounting groove 102 and are fixed by screws. The first circuit board 10 is located in the first circuit board mounting groove 101 and the first circuit board fixing holes 104 are aligned with the first connecting holes 1002 and are fixed by screws. The second circuit board 11 is located in the second circuit board mounting groove 107 and the second circuit board fixing holes 106 are aligned with the second connecting holes 1102 and are fixed by screws. In this way, the first circuit board 10, the second circuit board 11 and the attenuation sheet 9 are fastened on the upper heat sink 1.

[0070] In this embodiment, the lead lines 902 of the attenuation sheet 9 are welded with the transmission lines (microstrip lines) on the circuit boards. The series connection of the 19 attenuation sheets 9 and the transmission lines on the first circuit board 10 and the second circuit board 11 forms a passageway.

[0071] In one embodiment, a recess is formed on the lower heat sink 2 or the upper heat sink 1, and in this embodiment, the recess is formed on the lower heat sink 2, so as to be matched with the attenuation sheet 9 installed on the upper heat sink 1, the shape of the recess is consistent with the distribution path of the plurality of attenuation sheets 9, no accessories are needed to be installed in the lower heat sink, the depth of the recess is consistent, and after the upper heat sink 1 and the lower heat sink 2 are buckled with each other, the plurality of attenuation sheets 9 are accommodated in the recess, so that the recessed surfaces of the upper heat sink 1 and the lower heat sink 2 overlap with each other, and the assembly is more compact and stable.

[0072] In one embodiment, as shown in Figure 5 and Figure 6 , a plurality of fans 12 are installed in the shell, and a heat dissipation hole 302 is formed on the shell to communicate with the inside of the shell. Specifically, as shown in Figures 1-4 , the shell includes an upper cover plate 4, a lower cover plate 5, a front panel 6, a rear panel 7, and two side plates 3. The upper cover plate 4, the lower cover plate 5, the front panel 6, the rear panel 7, and the two side plates 3 are surrounded to form a cavity, and the upper heat sink 1 and the lower heat sink 2 are located in the cavity. The two ends of the upper cover plate 4 and the lower cover plate 5 are connected to the front panel 6 and the rear panel 7 by a plurality of screws, respectively, and the two side plates 3 are connected to the two sides of the upper cover plate 4 and the lower cover plate 5 by a plurality of screws, respectively.

[0073] In this embodiment, the heat dissipation hole 302 is formed on the two side plates 3, and the heat dissipation hole 302 is formed in a plurality of strip-shaped holes. The two ends of the two side plates 3 extend out of the front panel 6 and the rear panel 7, respectively, and the front part and the rear part of the side plate 3 are provided with a handle hole 301. In this embodiment, the handle hole 301 is in the shape of a rectangular through hole, which facilitates the hand to pick up the entire attenuator.

[0074] In one embodiment, as shown in Figure 6 , in this embodiment, a notch 103 is formed at each of the four corners of the upper heat sink 1 and the lower heat sink 2, and the notch 103 and the side wall of the shell form a mounting space for installing the fan 12. In this embodiment, the fan 12 is provided with four, and the four fans 12 are installed in the four mounting spaces. The four fans 12 have the same wind direction when working, that is, two in and two out to air-cool the heat dissipation fins 108.

[0075] The heat dissipation fins 108 on the upper heat sink 1 and the lower heat sink 2 are all outwardly arranged, and the fan 12 can better take away the heat and reduce the temperature after being started.

[0076] In this embodiment, the heat dissipation hole 302 is formed on the side plate 3 corresponding to the fan 12, that is, the heat dissipation hole 302 is formed on the front part and the rear part of the two side plates 3 in this embodiment, so that the fan 12 can more effectively dissipate heat for the internal heat sink.

[0077] In one embodiment, as shown in Figure 1As shown, four foot pads 8 are installed on the bottom of the lower cover plate 5 in this embodiment, and the foot pads 8 function to protect the lower cover plate 5 of the portable attenuator and also to reduce vibration when the portable attenuator is placed.

[0078] In one embodiment, as shown, a thermometer 14 is installed on the housing, and the thermometer 14 has a display. The temperature probe of the thermometer 14 is connected to the heat sink. Figure 1

[0079] In this embodiment, the thermometer 14 is an industrial thermometer, and the thermometer 14 has a display. The thermometer 14 and the input connector 15 are both installed on the front panel 6 of the portable attenuator by screws. The power socket 18 and the grounding terminal 19 are installed on the rear cover plate, and the output connector 16 is also installed on the rear panel 7 by a screw.

[0080] In this embodiment, a power indicator switch 17 is also installed on the front panel 6. When the power is started, the power indicator switch will light up. The temperature probe of the thermometer 14 is connected to the heat sink, and the thermometer 14 displays the current temperature of the heat sink.

[0081] The portable attenuator has a power of 1000W, and the 19 attenuating pieces 9 are calculated according to the average power. Each attenuating piece 9 needs to withstand a power of about 50-60W, and the heat generation is quite large. In order to reduce the volume of the attenuator and increase the heat dissipation of the attenuator, a heat sink with heat dissipation fins 108 is used as the main heat dissipation body in the attenuator. In addition, four fans 12 are used to dissipate heat from the heat dissipation fins 108, and the directions of the four fans 12 are the same. The thermometer 14 monitors the temperature of the heat sink in real time, and the use should be stopped immediately when the temperature exceeds the set temperature.

[0082] In actual use, a control unit and an alarm unit (such as an indicator light flickering and a buzzer) can be provided. The thermometer 14 monitors the temperature of the heat sink in real time. When the detected value is greater than the preset safety threshold, the sensing module built-in the thermometer 14 converts the temperature signal into an electrical signal. The electrical signal is transmitted to the control unit (such as a relay or a PLC) of the device. The control unit cuts off the main power circuit of the attenuator, so that the attenuating pieces 9 stop receiving input power. At the same time, the alarm unit can be triggered to prompt the operator that the temperature is abnormal.

[0083] ​It is to be understood that the embodiments that have been described above are merely illustrative of the principles of the application. Numerous modifications can be made to the application described without departing from the scope of the application as defined in the appending claims. Accordingly, the application is not to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A portable attenuator, comprising a housing, characterized in that, A radiator is installed inside the housing. The radiator includes an upper radiator and a lower radiator connected to each other. The ends of the upper radiator and the lower radiator that are far apart from each other are connected to heat dissipation fins. Multiple attenuation plates are installed between the upper radiator and the lower radiator, and the attenuation values ​​of the multiple attenuation plates are different. Multiple attenuators are sequentially distributed along multiple folded paths. One end of the housing is connected to an input connector, and the other end is connected to an output connector. The two attenuators at the beginning and end are connected to the input connector and the output connector, respectively. Adjacent attenuators are connected in series with each other and with the input and output connectors via circuit boards. The distribution path of the multiple attenuators includes multiple straight segments and multiple turning segments. The circuit boards are arranged along the distribution path of the multiple attenuators. Adjacent straight segments are connected by turning segments. The multiple attenuators are sequentially distributed on the circuit boards of the multiple straight segments. The circuit boards include multiple first circuit boards and multiple second circuit boards. The second circuit boards are L-shaped, and the first circuit boards are straight. The first circuit boards are located on the straight segments, and the second circuit boards are located on the turning segments. The first circuit boards are located between adjacent attenuators and between the attenuators and the input and output connectors. The upper or lower heat sink has multiple attenuator mounting slots, multiple first circuit board mounting slots, and multiple second circuit board mounting slots along the distribution path of the multiple attenuators. The multiple attenuators are sequentially connected to the multiple attenuator mounting slots, the multiple first circuit boards are sequentially connected to the multiple first circuit board mounting slots, and the multiple second circuit boards are sequentially connected to the multiple second circuit board mounting slots. Both ends of the attenuator are connected to leads, and both the first and second circuit boards are connected to transmission lines. The leads at both ends of the attenuator are connected to the transmission lines. The lower or upper heat sink has a groove, the shape of which is consistent with the distribution path of the multiple attenuators. After the upper and lower heat sinks are interlocked, the multiple attenuators are accommodated in the groove.

2. A portable attenuator according to claim 1, characterized in that, The transmission lines on the first and second circuit boards are located on the same horizontal plane as the leads on the attenuator, and the arrangement of the transmission lines on the second circuit board is the same as the shape of the second circuit board.

3. A portable attenuator according to any one of claims 1-2, characterized in that, Multiple fans are installed inside the housing, and the housing has ventilation holes that connect to its interior.

4. A portable attenuator according to claim 3, characterized in that, The upper and lower heat sinks each have notches at their four corners, and the notches and the side wall of the outer casing form an installation space for installing fans. Four fans are provided, and the four fans are installed in the four installation spaces respectively.

5. A portable attenuator according to claim 3, characterized in that, The outer casing includes an upper cover plate, a lower cover plate, a front panel, a rear panel, and two side panels. The upper cover plate, lower cover plate, front panel, rear panel, and two side panels form a cavity. The upper heat sink and the lower heat sink are located inside the cavity. The two ends of the upper cover plate and the lower cover plate are respectively connected to the front panel and the rear panel. The two side panels are respectively connected to the two sides of the upper cover plate and the lower cover plate. The heat dissipation holes are opened on the two side panels. The two ends of the two side panels extend out of the front panel and the rear panel, and the front and rear parts of the side panels are provided with handle holes.

6. A portable attenuator according to any one of claims 1-2, characterized in that, A thermometer is mounted on the housing, the thermometer has a display, and the temperature probe of the thermometer is connected to the heat sink.

Images