Multi-audio input processing circuit and system thereof

Abstract

The invention belongs to the technical field of audio signal processing, and relates to a multi-audio input processing circuit which comprises a power management module, a plurality of audio interface modules, an audio processor module, an audio sound effect processing module, an audio signal digital-to-analog conversion module and an audio signal power amplifier. Audio input of multiple input modes is received through the multiple audio interface modules, multiple audio signals can be transmitted at the same time, and the multiple audio signals are sequentially subjected to corresponding audio processing through the audio processor module, the audio sound effect processing module, the audio signal digital-to-analog conversion module and the audio signal power amplifier. The invention also relates to a multi-audio input processing system. According to the technical scheme provided by the invention, the audio quality and the hearing effect can be improved, the use requirements of various different user scenes can be met, the product performance is improved, and the user experience is improved.

Description

Technical Field

[0001] The present application relates to the technical field of audio signal processing, and more specifically, to a multi-audio input processing circuit and system thereof. Background Art

[0002] Existing headphones are all dual-channel, and their audio input methods are relatively limited: only Bluetooth or Bluetooth and a 3.5mm jack. This means that there are few audio input interfaces and they cannot directly transmit three or more channels of audio signals. Secondly, the single audio input method also limits the audio adjustment methods of the headphones, resulting in limited usage scenarios and a poor user experience. In addition, to achieve more than two channels and 3D audio effects, audio algorithms are used to simulate multi-channel audio. However, the audio quality and multi-channel audio effects processed by audio algorithms are mediocre, and the stability is poor, making it difficult to meet user needs. Summary of the Invention

[0003] The technical problem to be solved by this application is that the existing single audio input method has limitations in usage scenarios, and the existing audio algorithm has poor virtual multi-channel audio effect, which is difficult to meet user needs.

[0004] In order to solve the above technical problems, the embodiment of the present application provides a multi-audio input processing circuit, which adopts the following technical solutions:

[0005] It includes power management module, multiple audio interface modules, audio processor module, audio sound effect processing module, audio signal digital-to-analog conversion module and audio signal power amplifier;

[0006] The power management module is connected to the multiple audio interface modules and the audio processor module, and is used to provide working power for the multiple audio interface modules, the audio processor module, the display module, the audio and sound effect processing module, the audio signal digital-to-analog conversion module, and the audio signal power amplifier;

[0007] The multiple audio interface modules are connected to the audio processor module, and are used to receive audio signals of multiple input modes, and transmit the audio signals of different input modes to the audio processor module after pre-processing;

[0008] The audio processor module is connected to the audio and sound effect processing module, and is used to decode and encode the pre-processed audio signal to obtain digital audio signals of multiple channels, and transmit them to the audio and sound effect processing module respectively;

[0009] The audio effect processing module is connected to the audio signal digital-to-analog conversion module, and is used to perform sound effect processing on the digital audio signals of multiple channels to obtain enhanced digital audio signals, and transmit the enhanced digital audio signals to the audio signal digital-to-analog conversion module;

[0010] The audio signal digital-to-analog conversion module is connected to the audio signal power amplifier, and is used to convert the enhanced digital audio signal into an analog audio signal and transmit it to the audio signal power amplifier;

[0011] The audio signal power amplifier is connected to the earphone, and is used to perform audio signal amplification processing on the analog audio signal and output the amplified audio signal to the earphone, so as to drive the earphone to produce sound.

[0012] In order to solve the above technical problems, the embodiment of the present application further provides a multi-audio input processing system, which adopts the following technical solution:

[0013] The invention comprises an earphone and the multi-audio input processing circuit as described above, wherein the audio signal power amplifier of the multi-audio input processing circuit is connected to the earphone.

[0014] Compared with the prior art, this application has the following beneficial effects:

[0015] The multi-audio input processing circuit provided in the present application includes a power management module, multiple audio interface modules, an audio processor module, an audio sound effect processing module, an audio signal digital-to-analog conversion module and an audio signal power amplifier. It receives audio inputs of multiple input modes through multiple audio interface modules, can transmit multiple audio signals at the same time, and performs corresponding audio processing on the multiple audio signals in sequence through the audio processor module, audio sound effect processing module, audio signal digital-to-analog conversion module and audio signal power amplifier, which can improve audio quality and listening effects, and can meet the usage needs of various different user scenarios, increase product performance and enhance user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the solutions in this application, a brief introduction will be given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0017] Figure 1 This is a structural block diagram of an embodiment of a multi-audio input processing circuit provided by the present application;

[0018] Figure 2 This is a circuit schematic diagram of an embodiment of an audio processor module in a multi-audio input processing circuit provided by the present application;

[0019] Figure 3 This is a circuit schematic diagram of an embodiment of a JACK input unit in the multi-audio input processing circuit provided by the present application;

[0020] Figure 4 This is a circuit schematic diagram of an embodiment of a USB input unit in the multi-audio input processing circuit provided by the present application;

[0021] Figure 5 This is a circuit schematic diagram of an embodiment of an optical fiber input unit in the multi-audio input processing circuit provided by the present application;

[0022] Figure 6 This is a circuit schematic diagram of an embodiment of an HDMI input unit in a multi-audio input processing circuit provided by the present application;

[0023] Figure 7 This is a circuit diagram of an embodiment of a DC power input unit in the power management module provided by the present application;

[0024] Figure 8 This is a circuit diagram of an embodiment of a DC power output unit in the power management module provided by the present application;

[0025] Figure 9 This is a circuit diagram of an embodiment of a power supply unit in a power management module provided by the present application;

[0026] Figures 10 to 13 This is a circuit diagram of the audio signal power amplifier provided by this application;

[0027] Figure 14 This is a circuit schematic diagram of an embodiment of a display module in a multi-audio input processing circuit provided by the present application;

[0028] Figure 15 This is a circuit schematic diagram of an embodiment of an earphone speaker interface circuit in a multi-audio input processing system provided by the present application;

[0029] Figure 16 This is a circuit schematic diagram of an embodiment of an earphone microphone circuit in a multi-audio input processing system provided by this application. DETAILED DESCRIPTION

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of the application are only for the purpose of describing specific embodiments and are not intended to limit this application. The terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0031] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0032] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings.

[0033] The present application embodiment provides a multi-audio input processing circuit, see Figure 1 As shown, it includes a power management module 10 , various audio interface modules 20 , an audio processor module 30 , an audio effect processing module 40 , an audio signal digital-to-analog conversion module 50 and an audio signal power amplifier 60 .

[0034] Among them, the power management module 10 is connected to the various audio interface modules 20 and the audio processor module 30, and is used to provide working power for the various audio interface modules 20, the audio processor module 30, the audio sound effect processing module 40, the audio signal digital-to-analog conversion module 50 and the audio signal power amplifier 60; the various audio interface modules 20 are connected to the audio processor module 30, and are used to receive audio signals of various input modes, and pre-process the audio signals of different input modes and transmit them to the audio processor module 30; the audio processor module 30 is connected to the audio sound effect processing module 40, and is used to decode and encode the pre-processed audio signals to obtain to the digital audio signals of multiple channels and transmit them to the audio sound effect processing module 40; the audio sound effect processing module 40 is connected to the audio signal digital-to-analog conversion module 50, for performing sound effect processing on the digital audio signals of multiple channels to obtain enhanced digital audio signals, and transmit them to the audio signal digital-to-analog conversion module 50; the audio signal digital-to-analog conversion module 50 is connected to the audio signal power amplifier 60, for converting the enhanced digital audio signals into analog audio signals, and transmit them to the audio signal power amplifier 60; the audio signal power amplifier 60 is connected to the earphone, for performing audio signal amplification processing on the analog audio signal, and outputting it to the earphone to drive the earphone to make sound.

[0035] The multiple audio interface modules 20 can simultaneously receive audio signals of multiple input modes and transmit them to the audio processor module 30 for encoding and decoding into digital audio signals of multiple channels. The audio sound effect processing module 40 performs EQ (Equalizer) and audio effect processing on the digital audio signals of multiple channels to improve the audio quality and listening effect. Then the audio signal digital-to-analog conversion module 50 performs digital-to-analog conversion on the audio signal after sound effect processing and converts it into analog audio signals corresponding to multiple channels. The analog audio signals corresponding to multiple channels are then amplified by the audio signal power amplifier 60 and output to the speakers of the corresponding channels of the headphones to achieve multi-channel audio sound effect listening effect.

[0036] The multi-channels may be 4 channels, 6 channels or 8 channels, etc., which are not limited here and can be set according to actual conditions.

[0037] In some embodiments, the various audio interface modules 20 include a JACK input unit 21 , a USB input unit 22 , a Bluetooth input unit 23 , an optical fiber input unit 24 , and an HDMI input unit 25 .

[0038] Among them, the JACK input unit 21 is connected to the Bluetooth input unit 23, and is used to transmit the received JACK analog audio signal to the Bluetooth input unit 23; the USB input unit 22 is connected to the Bluetooth input unit 23, and is used to transmit the received USB audio signal to the Bluetooth input unit 23; the Bluetooth input unit 23 is connected to the audio processor module 30, and is used to receive Bluetooth mode audio signals, JACK analog audio signals and USB audio signals, and decode and encode the Bluetooth mode audio signals, JACK analog audio signals and USB audio signals, and transmit them to the audio processor module 30; the optical fiber input unit 24 is connected to the audio processor module 30, and is used to convert the received audio optical signal into an audio electrical signal, and transmit it to the audio processor module 30; the HDMI input unit 25 is connected to the audio processor module 30, and is used to transmit the received HDMI audio signal to the audio processor module 30.

[0039] In this embodiment, multiple audio interface modules 20 can receive audio signals of different input modes, including but not limited to 3.5mm JACK input mode, Bluetooth input mode, USB input mode, optical fiber input mode and HDMI input mode. Different input modes are encoded and decoded by corresponding input units.

[0040] In some embodiments, the audio processor module 30 includes an audio processor chip, and the audio processor chip 31 is provided with a Bluetooth module signal transmission pin, an optical fiber signal transmission pin, an HDMI signal transmission pin, an audio signal transmission pin and a power transmission pin; the Bluetooth module signal transmission pin is connected to the Bluetooth input unit 23; the optical fiber signal transmission pin is connected to the optical fiber input unit 24; the HDMI signal transmission pin is connected to the HDMI input unit 25; the audio signal transmission pin is connected to the audio sound effect processing module 40; and the power transmission pin is connected to the power management module 10.

[0041] For details, see Figure 2 As shown, the Bluetooth module signal transmission pins include pin 3, pin 4, pin 25, pin 26, pin 49 and pin 54; the HDMI signal transmission pins include pin 28, pin 29, pin 73, pin 83 to pin 92; the audio signal transmission pins include pin 9 to pin 15 and pin 44 connected to the audio sound effect processing module 40; the optical fiber signal transmission pin includes pin 72; the power transmission pins include pin 1, which serves as a 5V power input, and the power transmission pin 47, which serves as a 3.3V power output.

[0042] In some embodiments, current limiting resistors are respectively provided between the pins connected to the audio processor chip U31 and the audio and sound effect processing module 40 .

[0043] In some embodiments, the JACK input unit 21 includes a JACK analog audio interface J01, which is provided with an audio data input pin, a left analog audio signal input pin and a right analog audio signal input pin; the audio data input pin is connected to the Bluetooth input unit 23 through a current limiting resistor; the left analog audio signal input pin is connected to the Bluetooth input unit 23 through a series resistor and capacitor; the right analog audio signal input pin is connected to the Bluetooth input unit 23 through a series resistor and capacitor.

[0044] For details, see Figure 3 As shown, the audio data input pin is pin 2, the left analog audio signal input pin is pin 4, and the right analog audio signal input pin is pin 5; pin 2 is connected to the Bluetooth input unit 23 through a current-limiting resistor R3; pin 4 is connected to the Bluetooth input unit 23 through a series resistor R4 and capacitor C4, and pin 5 is connected to the Bluetooth input unit 23 through a series resistor R5 and capacitor C5; the common connection point of pin 1 and pin 3 is connected to the Bluetooth input unit 23 through isolation capacitors C6 and C7.

[0045] In some embodiments, the common connection point of pin 1 and pin 3 is grounded through resistor R1; an electrostatic protection tube ESD3 is set between pin 2 and the current limiting resistor R3, an electrostatic protection tube ESD2 is set between pin 4 and resistor R4, and an electrostatic protection tube ESD1 is set between pin 5 and resistor R5; a grounded resistor R7 is set between resistor R4 and capacitor C4, and a grounded resistor R6 is set between resistor R5 and capacitor C5; one end of capacitor C1 is respectively connected to one end of capacitor C4 and capacitor C3, and the other end of capacitor C1 is connected between resistor R5 and capacitor C5; one end of capacitor C2 is connected between resistor R5 and capacitor C5, and the other end is grounded; the other end of capacitor C3 is grounded; in addition, the JACK input unit 21 is also provided with a resistor R2, and the two ends of resistor R2 are respectively connected to pin 2 and the working power supply VCC.

[0046] See also Figure 4As shown, the USB input unit 22 includes a USB interface J02, a first electrostatic tube ESD5, a second electrostatic tube ESD6, a first resistor R10 and a second resistor R11. The USB interface J02 is provided with positive audio signal pins DP1 and DP2 and negative audio signal pins DN1 and DN2. The positive audio signal pins DP1 and DP2 are connected to the Bluetooth input unit 23 through the first resistor R10, and the negative audio signal pins DN1 and DN2 are connected to the Bluetooth input unit 23 through the second resistor R11; the first end of the first electrostatic tube ESD5 is respectively connected to the positive audio signal pins DP1 and DP2 and the first resistor R10, and the second end of the first electrostatic tube ESD5 is grounded; the first end of the second electrostatic tube ESD6 is connected to the negative audio signal pins DN1 and DN2 and the second resistor R11, and the second end of the second electrostatic tube ESD6 is grounded.

[0047] In some embodiments, the USB interface J02 is further provided with an output power pin VBUS and communication pins CC1 and CC2, wherein the output power pin VBUS is connected to the working power supply VDC, and an electrostatic protection tube ESD4, a capacitor C8 and a capacitor C9 are provided between the output power pin VBUS and the working power supply VDC for filtering out interference signals; pin CC1 is grounded through a resistor R9, and pin CC2 is grounded through a resistor R8.

[0048] See also Figure 5 As shown, the optical fiber input unit 24 includes an optical fiber interface J03, a third electrostatic tube ESD7, a fourth electrostatic tube ESD8, a first magnetic bead FB01, a second magnetic bead FB02, a first filter capacitor C10, a second filter capacitor C11 and a third filter capacitor C12, and the optical fiber interface is provided with a power access pin VCC, a signal output pin VOUT and a ground pin GND; the power access pin VCC is connected to the working power supply VCC through the first magnetic bead FB01, the signal output pin VOUT is respectively connected to the first end of the second magnetic bead FB02 and the first end of the fourth electrostatic tube ESD8, and the ground pin GND is grounded; The first end of the third electrostatic tube ESD7 is connected to the power access pin VCC, and the second end of the third electrostatic tube ESD7 is grounded; the first end of the first filter capacitor C10 is connected to the power access pin VCC, and the second end of the first filter capacitor C10 is grounded; the first end of the second filter capacitor C11 is connected to the working power supply VCC, and the second end of the second filter capacitor C11 is grounded; the second end of the fourth electrostatic tube ESD8 is grounded; the second end of the second magnetic bead FB02 is connected to the audio processor module 30; the first end of the third filter capacitor C12 is connected to the second end of the second magnetic bead FB02, and the second end of the third filter capacitor C12 is grounded.

[0049] In some embodiments, the HDMI input unit 25 includes an HDMI input interface J04, which is provided with corresponding pins connected to the audio processor module 30. For specific connection circuits, see Figure 6 shown.

[0050] In some embodiments, the Bluetooth input unit 23 includes a Bluetooth receiving chip, which decodes and encodes the Bluetooth mode audio signal, the JACK analog audio signal, and the USB audio signal.

[0051] In some embodiments, the power management module 10 includes a connected DC power input unit 11, a first DC power conversion and output unit 12, and a second DC power conversion and output unit 13. The DC power input unit 11 is configured to receive DC input power and transmit it to the first DC power conversion and output unit 12. The first DC power conversion and output unit 12 is configured to convert the DC input power into working power and transmit it to the audio processor module 30, the audio signal digital-to-analog conversion module 50, the audio signal power amplifier 60, and the second DC power conversion and output unit 13. The second DC power conversion and output unit 13 is connected to the Bluetooth input unit 23 and is configured to transmit the working power to the Bluetooth input unit 23.

[0052] In some embodiments, see Figure 7 The DC power input unit 11 includes a power interface J05, an ESD protection tube ESD13, a first capacitor C14, a second capacitor C15, a third capacitor C16, a fourth capacitor C17, a fifth capacitor C18, a sixth capacitor C19, a third magnetic bead FB03, a fourth magnetic bead FB04 and a third resistor R20; the power interface is provided with pins 1 to 5, pin 1 is connected to the DC input power supply VCC_DCIN through the third magnetic bead FB03, and the common connection point of pins 2 and 3 is connected to the DC input power supply VCC_DCIN through the fourth magnetic bead FB04. ground, pin 4 and pin 5 are grounded; the first end and the second end of the ESD protection tube ESD13 are connected to the common connection point of pin 2 and pin 3, and the third end of the ESD protection tube ESD13 is connected to pin 1; the first capacitor C14, the second capacitor C15, the third capacitor C16, the fourth capacitor C17, and the fifth capacitor C18 are connected in parallel to the ESD protection tube ESD13; the first end of the sixth capacitor C19 is connected to the DC input power supply VCC_DCIN through the third resistor R20, and the second end of the sixth capacitor C19 is grounded.

[0053] In some embodiments, see Figure 8The first DC power conversion and output unit 12 includes a first power chip U120, a power input filter subunit 121, an output control subunit 122 and a power output filter subunit 123; the first power chip U11 is provided with a high-voltage drive pin BS, an input pin IN, a power signal pin PG, an enable pin EN, a power switch pin LX, a voltage feedback pin FB, a soft start control pin SS and a ground pin GND; the high-voltage drive pin BS is connected to the output control subunit 122, the input pin IN is connected to the DC input power supply VCC_DCIN, the power signal pin PG and the enable pin EN are connected to the power input filter subunit 121, the power switch pin LX and the voltage feedback pin FB are connected to the output control subunit 122, the soft start control pin SS is grounded through the filter capacitor C23, and the ground pin GND is grounded; the power input filter subunit 121 is connected to the DC input power supply VCC_DCIN; the output control subunit 122 is connected to the power output filter subunit 123; the power output filter subunit 123 outputs the working power supply VDD.

[0054] Specifically, the components and connection circuits of the power input filter subunit 121, the output control subunit 122 and the power output filter subunit 123 are shown in FIG. Figure 8 shown.

[0055] In some embodiments, see Figure 9 As shown, the second DC power conversion and output unit 13 includes a power output chip U131 and a voltage adjustment subunit 132; the power output chip U1131 is provided with a DC power input pin VIN, an enable pin EN, a power output pin VOUT and an adjustable voltage pin ADJ, the DC power input pin VIN is connected to the working power supply VDD, the enable pin EN is connected to the audio processor module 30, the power output pin VOUT is respectively connected to the voltage adjustment subunit 132 and the Bluetooth input unit 23, the adjustable voltage pin ADJ is connected to the voltage adjustment subunit 132, the voltage adjustment subunit 132 is connected to the Bluetooth input unit 23, and the power VBAT_BT output by the power output pin VOUT is used to power the Bluetooth input unit 23.

[0056] In some embodiments, the voltage adjustment subunit 132 includes a capacitor 31, a resistor 29, and a resistor R30, wherein the two ends of the capacitor 31 are respectively connected to the power output pin VOUT and the adjustable voltage pin ADJ, the resistor 29 and the resistor R30 are connected in series and connected to the power output pin VOUT, and the other end of the resistor R30 is grounded.

[0057] The enable pin EN is connected to the audio processor module 30 through a voltage divider circuit, which includes a resistor R27 and a resistor R28, wherein the two ends of the resistor R27 are respectively connected to the enable pin EN and the audio processor module 30, and one end of the resistor R28 is connected to the enable pin EN and the other end is grounded.

[0058] In this embodiment, the power supply unit 13 is further provided with filter capacitors C32 to C35 to filter out interference for the circuit and ensure the stability of the circuit.

[0059] In some embodiments, the audio effect processing module 40 includes an audio effect processing chip, and corresponding pins are set on the audio effect processing chip to connect with the audio processor module 30 and the audio signal digital-to-analog conversion module 50. The audio effect processing chip performs audio effect processing on the received digital audio signals of multiple channels, and transmits the enhanced digital audio signals to the audio signal digital-to-analog conversion module 50 after obtaining them.

[0060] In some embodiments, the audio signal power amplifier 60 includes a first dual-channel amplification unit 61, a second channel signal amplification unit 62, a third channel signal amplification unit 63, and a fourth channel signal amplification unit 64, wherein:

[0061] The first channel signal amplifying unit 61 is used to amplify the first channel audio signal of the received analog audio signal; the second channel signal amplifying unit 62 is used to amplify the second channel audio signal of the received analog audio signal; the third channel signal amplifying unit 63 is used to amplify the third channel audio signal of the received analog audio signal; the fourth channel signal amplifying unit 64 is used to amplify the fourth channel audio signal of the received analog audio signal.

[0062] In this embodiment, the first channel audio signal includes a first left channel signal and a first right channel signal, the second channel audio signal includes a second left channel signal and a second right channel signal, the third channel audio signal includes a third left channel signal and a third right channel signal, and the fourth channel audio signal includes a fourth left channel signal and a fourth right channel signal. The audio signal power amplifier 60 amplifies the eight-channel audio signals. Accordingly, the audio processor module 30 can decode and encode the audio signals received from multiple input modes into 8-channel digital audio signals for output. After the 8-channel digital audio signals are processed accordingly by the audio sound effect processing module 40 and the audio signal digital-to-analog conversion module 50, they are transmitted to the dual-channel signal amplification unit corresponding to the audio signal power amplifier 60 for signal amplification and output to the 8 speakers of the left and right headphones, thereby achieving an 8-channel audio sound effect.

[0063] As a specific example, the circuit designs corresponding to the first dual-channel amplifying unit 61, the second channel signal amplifying unit 62, the third channel signal amplifying unit 63 and the fourth channel signal amplifying unit 64 can be found in Figures 10 to 13 .

[0064] In some embodiments, the multi-audio input processing circuit also includes a display module 70, which is connected to the audio processor module 30. The display module 70 is driven by the audio processor module 30 and can display information such as the audio signal input interface type, audio effect mode, and volume.

[0065] Among them, see Figure 14 As shown, the display module 70 includes a display interface J06, which sets the data / command selection RS pin (pin 2), the chip selection CS pin (pin 3), the clock signal transmission SCL pin (pin 4), the data and address transmission SDA pin (pin 5), the reset RESET pin (pin 6), the power supply voltage VCC pin (pin 7), the LED-A pin (pin 9) and the LED-K pin (pin 10); the data / command selection RS pin, the chip selection CS pin, the clock signal transmission SCL pin, the data and address transmission SDA pin, the reset RESET pin and the LED-K pin are respectively connected to the audio processor module 30, and the power supply voltage VCC pin and the LED-A pin are connected to the working power supply VCC.

[0066] Among them, the display module 70 can be implemented using an LCD display. In this embodiment, pins 2 to 7, pins 9 and pin 10 are respectively provided with corresponding ESD tubes, namely ESD14 to ESD21, and pins 6, pins 7 and pins 9 are respectively provided with filter capacitors C36 to C39 for filtering. For specific connections, see Figure 14 shown.

[0067] The display module 70 of the present application can display relevant device working information, including the audio signal input interface type, audio effect mode and volume level, etc., to enhance user experience and facilitate user use.

[0068] The present application also provides a multi-audio input processing system, comprising headphones and the multi-audio input processing circuit as described above, wherein the audio signal power amplifier 60 of the multi-audio input processing circuit is connected to the headphones, such as Figure 1 shown.

[0069] In some embodiments, the earphones include an earphone speaker interface circuit and an earphone microphone circuit. The earphone speaker interface circuit is provided with an earphone speaker interface, and the audio processor module 30, the audio signal power amplifier 60 and the earphone microphone circuit are respectively connected through corresponding pins provided on the earphone speaker interface; the earphone microphone circuit is connected with a plurality of audio interface modules 20.

[0070] The earphone is composed of a left speaker 81 and a right speaker 82 , and the earphone speaker interface circuit and the earphone microphone circuit are respectively arranged in the left speaker 81 and the right speaker 82 .

[0071] The headphone speaker interface circuit includes a MINIDP interface. The MINIDP interface is provided with ML0+ pin and ML0- pin connected to the first dual-channel amplifier unit 61, ML1+ pin and ML1- pin connected to the second channel signal amplifier unit 62, ML2+ pin and ML2- pin connected to the third channel signal amplifier unit 63, and ML3+ pin and ML3- pin connected to the fourth channel signal amplifier unit 64. For specific circuit design, see Figure 15 shown.

[0072] The earphone microphone circuit is connected to the earphone speaker interface circuit through the MIC_IN terminal and is connected to the Bluetooth input unit 23 through the MICINR terminal and the MICINL terminal. For specific circuit design, see Figure 16 shown.

[0073] It should be noted that the rule parameters of components such as resistors, capacitors, ESD protection tubes, and magnetic beads involved in this application can be selected according to actual needs.

[0074] The multi-audio input processing circuit and system provided in this application are rich in product functions and can meet the usage requirements of various different user scenarios, such as games, live broadcasts, movies, etc., and solve the shortcomings of existing products with few audio input interfaces, providing users with rich audio input interfaces, and can achieve 8-channel multi-channel audio effects. It also has an LCD to display usage information, enhance product performance, and improve user experience.

[0075] Obviously, the embodiments described above are only some of the embodiments of the present application, rather than all of the embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application has been described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions described in the aforementioned specific embodiments, or to make equivalent replacements for some of the technical features therein. Any equivalent structure made using the contents of the present application specification and the accompanying drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the present application.

Claims

1. A multi-audio input processing circuit, characterized in that: It includes power management module, multiple audio interface modules, audio processor module, audio sound effect processing module, audio signal digital-to-analog conversion module and audio signal power amplifier; The power management module is connected to the multiple audio interface modules and the audio processor module, and is used to provide working power for the multiple audio interface modules, the audio processor module, the display module, the audio and sound effect processing module, the audio signal digital-to-analog conversion module, and the audio signal power amplifier; The multiple audio interface modules are connected to the audio processor module, and are used to receive audio signals of multiple input modes, and transmit the audio signals of different input modes to the audio processor module after pre-processing; The audio processor module is connected to the audio and sound effect processing module, and is used to decode and encode the pre-processed audio signal to obtain digital audio signals of multiple channels and transmit them to the audio and sound effect processing module; The audio effect processing module is connected to the audio signal digital-to-analog conversion module, and is used to perform sound effect processing on the digital audio signals of multiple channels to obtain enhanced digital audio signals, and transmit the enhanced digital audio signals to the audio signal digital-to-analog conversion module; The audio signal digital-to-analog conversion module is connected to the audio signal power amplifier, and is used to convert the enhanced digital audio signal into an analog audio signal and transmit it to the audio signal power amplifier; The audio signal power amplifier is connected to the earphone, and is used to perform audio signal amplification processing on the analog audio signal and output the amplified audio signal to the earphone, so as to drive the earphone to produce sound.

2. The multi-audio input processing circuit according to claim 1, characterized in that: The multiple audio interface modules include a JACK input unit, a USB input unit, a Bluetooth input unit, an optical fiber input unit and an HDMI input unit; The JACK input unit is connected to the Bluetooth input unit and is used to transmit the received JACK analog audio signal to the Bluetooth input unit; The USB input unit is connected to the Bluetooth input unit and is used to transmit the received USB audio signal to the Bluetooth input unit; The Bluetooth input unit is connected to the audio processor module, and is used to receive the Bluetooth mode audio signal, the JACK analog audio signal and the USB audio signal, and decode and encode the Bluetooth mode audio signal, the JACK analog audio signal and the USB audio signal, and transmit them to the audio processor module; The optical fiber input unit is connected to the audio processor module and is used to convert the received audio optical signal into an audio electrical signal and transmit it to the audio processor module; The HDMI input unit is connected to the audio processor module and is used to decode and process the received HDMI audio signal and transmit it to the audio processor module.

3. The multi-audio input processing circuit according to claim 2, characterized in that: The audio processor module includes an audio processor chip, and the audio processor chip is provided with a Bluetooth module signal transmission pin, an optical fiber signal transmission pin, an HDMI signal transmission pin, an audio signal transmission pin and a power transmission pin; The Bluetooth module signal transmission pin is connected to the Bluetooth input unit; the optical fiber signal transmission pin is connected to the optical fiber input unit; the HDMI signal transmission pin is connected to the HDMI input unit; the audio signal transmission pin is connected to the audio and sound effect processing module; and the power transmission pin is connected to the power management module.

4. The multi-audio input processing circuit according to claim 2, characterized in that: The JACK input unit includes a JACK analog audio interface, which is provided with an audio data input pin, a left analog audio signal input pin, and a right analog audio signal input pin; the audio data input pin is connected to the Bluetooth input unit through a current-limiting resistor; the left analog audio signal input pin is connected to the Bluetooth input unit through a resistor and a capacitor in series; the right analog audio signal input pin is connected to the Bluetooth input unit through a resistor and a capacitor in series; The USB input unit includes a USB interface, a first electrostatic tube, a second electrostatic tube, a first resistor, and a second resistor. The USB interface is provided with a positive audio signal pin and a negative audio signal pin. The positive audio signal pin is connected to the Bluetooth input unit through the first resistor, and the negative audio signal pin is connected to the Bluetooth input unit through the second resistor; a first end of the first electrostatic tube is respectively connected to the positive audio signal pin and the first resistor, and a second end of the first electrostatic tube is grounded; a first end of the second electrostatic tube is respectively connected to the negative audio signal pin and the second resistor, and a second end of the second electrostatic tube is grounded; The optical fiber input unit includes an optical fiber interface, a third electrostatic tube, a fourth electrostatic tube, a first magnetic bead, a second magnetic bead, a first filter capacitor, a second filter capacitor and a third filter capacitor. The optical fiber interface is provided with a power access pin, a signal output pin and a ground pin; the power access pin is connected to the working power supply through the first magnetic bead, the signal output pin is respectively connected to the first end of the second magnetic bead and the first end of the fourth electrostatic tube, and the ground pin is grounded; the first end of the third electrostatic tube is connected to the power access pin, and the second end of the third electrostatic tube is grounded; the first end of the first filter capacitor is connected to the power access pin, and the second end of the first filter capacitor is grounded; the first end of the second filter capacitor is connected to the working power supply, and the second end of the second filter capacitor is grounded; the second end of the fourth electrostatic tube is grounded; the second end of the second magnetic bead is connected to the audio processor module; A first end of the third filter capacitor is connected to the second end of the second magnetic bead, and a second end of the third filter capacitor is grounded.

5. The multi-audio input processing circuit according to claim 2, characterized in that: The power management module includes a connected DC power input unit, a DC power output unit and a power supply unit; The DC power input unit is used to receive DC input power and transmit it to the DC power output unit; the DC power output unit is used to convert the DC input power into working power and transmit it to the power supply unit; the power supply unit is connected to the audio processor module and the Bluetooth input unit, and is used to transmit the working power to the audio processor module and the Bluetooth input unit.

6. The multi-audio input processing circuit according to claim 5, characterized in that: The DC power input unit includes a power interface, an ESD protection tube, a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a fifth capacitor, a sixth capacitor, a third magnetic bead, a fourth magnetic bead and a third resistor; the power interface is provided with pins 1 to 5, the pin 1 is connected to the DC input power supply through the third magnetic bead, the common connection point of the pin 2 and the pin 3 is grounded through the fourth magnetic bead, and the pin 4 and the pin 5 are grounded; the first end and the second end of the ESD protection tube are connected to the common connection point of the pin 2 and the pin 3, and the third end of the ESD protection tube is connected to the pin 1; the first capacitor, the second capacitor, the third capacitor, the fourth capacitor, and the fifth capacitor are connected in parallel with the ESD protection tube; the first end of the sixth capacitor is connected to the DC input power supply through the third resistor, and the second end of the sixth capacitor is grounded; The DC power output unit includes a first power supply chip, a power input filter subunit, an output control subunit, and a power output filter subunit; the first power supply chip is provided with a high-voltage drive pin BS, an input pin IN, a power signal pin PG, an enable pin EN, a power switch pin LX, a voltage feedback pin FB, a soft start control pin SS, and a ground pin GND; the high-voltage drive pin BS is connected to the output control subunit, the input pin IN is connected to the DC input power supply, the power signal pin PG and the enable pin EN are connected to the power input filter subunit, the power switch pin LX and the voltage feedback pin FB are connected to the output control subunit, the soft start control pin SS is grounded via a filter capacitor, and the ground pin GND is grounded; the power input filter subunit is connected to the DC input power supply; The output control subunit is connected to the power output filter subunit; the power output filter subunit outputs the working power; The power supply unit includes a power output chip and a voltage adjustment subunit; the power output chip is provided with a DC power input pin VIN, an enable pin EN, a power output pin VOUT and an adjustable voltage pin ADJ, the DC power input pin VIN is connected to the working power supply, the enable pin EN is connected to the audio processor module, the power output pin VOUT is respectively connected to the voltage adjustment subunit and the Bluetooth input unit, the adjustable voltage pin ADJ is connected to the voltage adjustment subunit, and the voltage adjustment subunit is connected to the Bluetooth input unit.

7. The multi-audio input processing circuit according to claim 2, characterized in that: The audio signal power amplifier includes a first dual-channel amplification unit, a second channel signal amplification unit, a third channel signal amplification unit, and a fourth channel signal amplification unit, wherein: The first channel signal amplifying unit is used to perform first channel audio signal amplification processing on the received analog audio signal; The second channel signal amplifying unit is used to perform second channel audio signal amplification processing on the received analog audio signal; The third channel signal amplifying unit is used to perform third channel audio signal amplification processing on the received analog audio signal; The fourth channel signal amplifying unit is configured to perform fourth channel audio signal amplification processing on the received analog audio signal.

8. The multi-audio input processing circuit according to any one of claims 1 to 7, characterized in that: The circuit further includes a display module, wherein the display module is connected to the audio processor module; Among them, the display module includes a display interface, which sets the data / command selection RS pin, the chip selection CS pin, the clock signal transmission SCL pin, the data and address transmission SDA pin, the reset RESET pin, the power supply voltage VDD pin, the LED-A pin and the LED-K pin; the data / command selection RS pin, the chip selection CS pin, the clock signal transmission SCL pin, the data and address transmission SDA pin, the reset RESET pin and the LED-K pin are respectively connected to the audio processor module, and the power supply voltage VDD pin and the LED-A pin are connected to the working power supply.

9. A multi-audio input processing system, characterized in that: The invention comprises an earphone and the multi-audio input processing circuit according to any one of claims 1 to 8, wherein the audio signal power amplifier of the multi-audio input processing circuit is connected to the earphone.

10. The multi-audio input processing system according to claim 9, characterized in that: The earphone includes an earphone speaker interface circuit and an earphone microphone circuit. The earphone speaker interface circuit is provided with an earphone speaker interface, and the audio processor module, the audio signal power amplifier and the earphone microphone circuit are respectively connected through corresponding pins provided on the earphone speaker interface; the earphone microphone circuit is connected to the multiple audio interface modules.

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