Design and manufacturing method of multilayer glass-based magnetic core spiral inductor based on TGV

Abstract

The invention discloses a TGV-based multilayer glass-based magnetic core spiral inductor design and manufacturing method, and belongs to the field of microelectronic integrated system three-dimensional inductors. The multilayer glass-based magnetic core spiral inductor based on the TGV comprises a first TGV structure, a second TGV structure, a first substrate layer, a second substrate layer, a first conductor structure, a second conductor structure, a first magnetic core structure and a second magnetic core structure. And the plurality of first TGV structures are arranged in two rows at equal intervals. And a plurality of second TGV structures with the same type and size are distributed under the first TGV structure in the same type. The TGV technology, the RDL metal layer technology and the bonding technology are combined to construct the multi-layer spiral inductor in a three-dimensional space, and the occupied area on the plane is reduced; meanwhile, the multilayer glass-based magnetic core spiral inductor is characterized in that a magnetic material is filled in a substrate cavity in a spiral ring shape to serve as a magnetic core, the inductance value and the quality factor of the inductor are greatly improved, and the multilayer glass-based magnetic core spiral inductor can be applied to system integration with smaller size and higher performance.

Description

Technical Field

[0001] The present invention belongs to the technical field of three-dimensional inductance of microelectronic integrated systems, and relates to a TGV-based multi-layer high-performance three-dimensional spiral inductor element with a magnetic core, a simulation design method, and a manufacturing process. Background Art

[0002] As an important component of passive components, inductors are widely used in network systems and devices such as power distribution networks, filters, and duplexers. Traditional on-chip planar spiral inductors have large parasitic values ​​and a low quality factor. The inductor's magnetic field is perpendicular to the substrate and passes through the metal layer, resulting in significant eddy current losses. They also occupy a large area, seriously hindering the miniaturization of the overall integrated system.

[0003] Through-Glass-Via (TGV) technology achieves vertical chip stacking through the TGV structure, greatly improving the integration of circuits and shortening the interconnection distance between chips, thereby increasing the signal transmission speed and improving the quality and performance of the overall system. This technology has been vigorously developed in recent years, and the process technology has become increasingly mature. For example, the Chinese invention patent with the document number CN 119008578 A discloses a TGV packaging structure and method based on a coating process. There is a ring-shaped gap between the upper opening edge of the TGV blind hole of the packaged glass substrate and the conductive metal, and the ring-shaped gap is filled with a coating layer; the packaging method includes a multi-step process, which can significantly reduce the process cost and process difficulty, achieve the improvement of TGV cracks, and is compatible with a high-density TGV arrangement design.

[0004] The glass substrate used in this technology has excellent insulation properties, which can improve device losses. Compared with silicon-based inductors, it offers better performance, lower losses, and a simpler process. Therefore, TGV-based three-dimensional passive devices have research and application potential. However, there is currently little research on the TGV process and its integrated inductor devices. Therefore, the design of TGV-based integrated passive inductor components is of great significance.

[0005] In addition, in the existing microsystem integration process, high-frequency inductor devices are susceptible to parasitic effects and nonlinear characteristics of magnetic core materials in high-frequency working environments, resulting in insufficient stability in the application of inductance value L and quality factor Q. Traditional design methods rely on empirical trial and error or single parameter adjustment, making it difficult to achieve multi-variable collaborative optimization. There is a lack of a guidance model for accurately determining the relevant process parameters of the inductor according to demand, resulting in a large workload for designing inductors with specific frequencies and specific inductance values. The present invention establishes a quantitative relationship model between TGV inductor diameter, height and other parameters and inductance performance through a linear regression model and the least squares method, and proposes an efficient and accurate inductance performance control scheme, which significantly improves the design efficiency and device performance in high-frequency application scenarios. Summary of the Invention

[0006] One of the objectives of the present invention is to provide a TGV-based multilayer glass-based magnetic core spiral inductor. By combining the TGV process, RDL metal layers, and bonding, a multilayer spiral inductor is constructed in three dimensions, thereby reducing the occupied area on the plane. At the same time, the multilayer glass-based magnetic core spiral inductor fills the substrate cavity inside the spiral ring with magnetic material to serve as the magnetic core, greatly improving the inductance value and quality factor of the inductor, and can be applied to more miniaturized and higher-performance system integration.

[0007] A second objective of the present invention is to provide a design method for a TGV-based multi-layer glass-based magnetic core spiral inductor. By using methods such as neural networks and linear regression, the comprehensive influencing factors of various process parameters on inductance performance are implicitly or explicitly extracted, and a quantitative model is designed. According to the corresponding inductance value requirements, the corresponding process parameters and expected quality factors are calculated, which significantly improves the design efficiency and device performance in high-frequency application scenarios, and helps to quickly achieve the requirements of specific inductance and maximum quality factor.

[0008] A third object of the present invention is to provide a method for manufacturing a multi-layer glass-based magnetic core spiral inductor based on TGV, which does not require secondary etching and significantly reduces process cost and process complexity compared to traditional silicon-based processes.

[0009] The purpose of the present invention is achieved through the following technical solutions:

[0010] In a first aspect, the present invention discloses a TGV-based multi-layer glass-based magnetic core spiral inductor, comprising a first TGV structure, a second TGV structure, a first substrate layer and a second substrate layer, a first conductor structure, a second conductor structure, a first magnetic core structure, and a second magnetic core structure.

[0011] A plurality of first TGV structures are arranged in two rows at equal intervals, and a plurality of second TGV structures of the same type and size are distributed in the same type directly below the first TGV structures.

[0012] Preferably, the number of the first TGV structures is an even number, and is at least two.

[0013] Preferably, the multi-layer glass-based magnetic core spiral inductor based on the TGV process further includes a bonding layer, and the first TGV structure and the corresponding second TGV structure are connected through the bonding layer.

[0014] Preferably, the bonding layer includes an upper metal bump and a lower metal bump, and an intermediate transition layer connecting the two.

[0015] Preferably, the intermediate transition layer is made of copper, tin, gold-indium, tin-lead eutectic or copper-tin eutectic material.

[0016] Preferably, the multi-layer glass-based magnetic core spiral inductor based on the TGV process further includes an electrical connection module, wherein the electrical connection module includes a first conductor structure and a second conductor structure, wherein the first conductor structure can be electrically conductive with part or all of the first TGV structure, and the second conductor structure can be electrically conductive with part or all of the second TGV structure.

[0017] Preferably, the first TGV structure, the second TGV structure, the first conductor structure, the second conductor structure and the bonding layer together form a three-dimensional conductor spiral structure that is electrically conductive.

[0018] Preferably, the conductor material of the three-dimensional conductor spiral structure may be any one of metal silver and its alloy materials, metal copper and its alloy materials, metal iron and its alloy materials.

[0019] Preferably, the multi-layer glass-based magnetic core spiral inductor based on the TGV process further includes two first substrate layers and second substrate layers of the same type and size, the first TGV structure is entirely provided in the first substrate layer, and the second TGV structure is entirely provided in the second substrate layer.

[0020] Preferably, the first substrate layer and the second substrate layer are made of glass.

[0021] Preferably, the multi-layer glass-based magnetic core spiral inductor based on the TGV process also includes two magnetic core structures of the same type and size, the three-dimensional conductor spiral structure is wound around the periphery of the magnetic core structure, the first magnetic core structure is entirely arranged in the first substrate layer, and the second magnetic core structure is entirely arranged in the second substrate layer.

[0022] Preferably, the material of the magnetic core structure may be manganese-zinc ferrite, nickel-zinc ferrite, sendust or iron-silicon alloy.

[0023] In a second aspect, the present invention discloses a design method for a TGV-based multi-layer glass-based magnetic core spiral inductor. The combined influence of the core size, TGV diameter d, height (i.e., glass substrate thickness) h, same-side TGV center distance p, and opposite-side TGV center distance p1 on the inductance value L and quality factor Q is characterized by influencing factors K1 and K2. The required inductance value L1 and the corresponding quality factor Q1 are calculated by the following formula:

[0024] L1=K1*L0

[0025] Q1=K2*Q0

[0026] Among them, L0 and Q0 are the inductance value and quality factor of the basic inductor device model, respectively, which will be directly given in practical applications.

[0027] Preferably, the empirical expressions of K1 and K2 are as follows:

[0028] A1=[a1 a2 a3 a4 a5 a6 a7]

[0029] A2=[b1 b2 b3 b4 b5 b6 b7]

[0030] B=[1d hp p1 d 2 p 2 h * p1] T

[0031] K1=A1B

[0032] K2=A2B

[0033] Where d, h, p, and p1 are the TGV diameter, TGV height, and center-to-center distance of TGVs in the same row and column, respectively. The regression coefficients for the inductance and quality factor can be adjusted based on the formula, inductance magnetic field variations, and other related factors. The regression terms for K1 and K2 can be different.

[0034] Preferably, the coefficient matrices of K1 and K2 are calculated by the following matrix formula:

[0035] K1=A1B1=L 11 / L0

[0036] K2=A2B2=Q 11 / Q0

[0037] Among them, L 11 and Q 11 The data matrix of the inductance value and quality factor training set obtained by simulation based on the initial inductor model.

[0038] Preferably, the size of the magnetic core generally has a positive effect on the inductance value and quality factor of the inductor. Therefore, the size of the magnetic core of the inductor is set to change regularly with the parameters such as the diameter, height, and center distance of the TGV.

[0039] Preferably, the variation law of the core size can be determined by the following formula:

[0040]

[0041] w core =p1-2*d

[0042] l core =p+d

[0043] Among them, t core 、w core and l coreare the thickness, width and length of the core respectively, and the center of the core is at the center of the TGV array.

[0044] Preferably, a neural network, iterative calculation, or other methods can be used to obtain the desired inductance value L, along with the data set for the designed TGV diameter, height, same-side center distance, and opposite-side center distance. The error is determined by the modeling method used. The optimal parameter set can be selected based on the maximum calculated quality factor Q and process rationality.

[0045] In a third aspect, the present invention discloses a method for manufacturing a TGV-based multi-layer glass-based magnetic core spiral inductor, comprising the following steps:

[0046] S1: Prepare two glass substrate layers of the same type and size and clean them.

[0047] S2: Using laser-induced etching, a plurality of through-hole units penetrating the substrate layer and cavity units not penetrating the substrate layer are machined from one side of the glass substrate. The plurality of through-hole units are arranged in two rows with equal spacing, centered around the cavity unit. The cavity opening surface is designated as the first surface of the glass substrate, and the other surface is designated as the second surface.

[0048] S3: Depositing a titanium metal layer and a copper seed layer on the second surface of the glass substrate layer by using a sputtering process.

[0049] Preferably, depositing a titanium metal layer can improve the adhesion between the metal conductor and the glass and enhance process reliability.

[0050] S4: Completely fill the center conductor in the TGV hole using the copper electroplating process.

[0051] S5: Grinding the second surface of the glass substrate using a chemical mechanical polishing process to remove excess copper layer on the second surface.

[0052] S6: Place the two glass substrates with their first surfaces facing up on a tray. Use a dropper to drip a mixture of nickel-zinc ferrite and benzocyclobutene (BCB) onto the entire surface. Set a temperature profile to solidify the magnetic material, forming a magnetic core.

[0053] Preferably, before curing, the substrate is evacuated for 5 minutes to allow the magnetic material to fill the entire cavity.

[0054] S7: Grind the first surface of the glass substrate using a chemical mechanical polishing process to remove excess magnetic material from the first surface of the substrate to expose the glass substrate.

[0055] S8: Use photolithography and electroplating processes to manufacture designated redistribution layers, pads, and bonding bumps on both sides of the glass substrate.

[0056] S9: Use a tin intermediate layer and a bonding process to metal bond the two glass substrates mentioned above, so that the rewiring structure, the TGV structure and the bonding structure form a three-dimensional conductor structure of the spirally wound magnetic core.

[0057] Beneficial effects:

[0058] 1. The present invention discloses a TGV-based multilayer glass-based magnetic core spiral inductor and its design method. The TGV-based multilayer spiral inductor with a magnetic core addresses the need for miniaturization of passive devices. By utilizing TGV technology, RDL metal layer technology, and bonding technology to effectively utilize vertical space, it can reduce the occupied area in the planar direction. The device is manufactured on a glass substrate, which can significantly reduce the device's loss in the high-frequency band and can be flexibly integrated with other devices. The device fills the substrate cavity inside the spiral ring with magnetic material to act as a magnetic core, thereby improving the inductance value and quality factor of the inductor.

[0059] 2. The TGV-based multilayer glass-based magnetic core spiral inductor and its design method disclosed in the present invention realize quantifiable and reusable high-frequency inductor design by establishing a mathematical model of process parameters and inductance performance; by extracting the influencing factors of parameters on the device inductance value and quality factor, a multi-parameter coupling model is established to achieve simultaneous optimization of the inductance value and quality factor; through independent or coordinated adjustment of the inductor structure parameters, the relevant process specifications of the device with specific frequency and specific inductance value requirements are efficiently determined, shortening the parameter and performance simulation time, and improving the design accuracy and efficiency of the multilayer glass-based magnetic core spiral inductor.

[0060] 3. The manufacturing method of the TGV-based multi-layer glass-based magnetic core spiral inductor disclosed in the present invention, on the basis of achieving beneficial effects 1 and 2, adopts a TGV-based glass-based process for the integration process of the inductor element. Compared with the traditional silicon-based process, the steps are simpler and no secondary etching is required, which can significantly reduce its process cost and process complexity. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] Figure 1 This is a schematic diagram of the overall structure of a TGV-based multi-layer magnetic core spiral inductor element provided in Example 1 of the present invention.

[0062] Figure 2 This is a schematic diagram of a partially enlarged structure of a bonding layer of a TGV-based multi-layer magnetic core spiral inductor component provided in Example 1 of the present invention.

[0063] Figure 3 A schematic diagram of the relative positions of the TGV and the magnetic core of a TGV-based multi-layer magnetic core spiral inductor component provided in Example 1 of the present invention.

[0064] Figure 4A manufacturing process roadmap of a TGV-based multi-layer magnetic core spiral inductor component is provided in Example 1 of the present invention, wherein: Figure 4 (a) is a schematic diagram of the wafer cleaning process of the present invention, Figure 4 (b) is a schematic diagram of etching through holes and cavities on a wafer using laser induced etching according to the present invention, Figure 4 (c) is a schematic diagram of preparing a TGV seed layer according to the present invention, Figure 4 (d) is a schematic diagram of filling a TGV through-hole with a copper conductor according to the present invention. Figure 4 (e) is a schematic diagram of filling the wafer cavity with magnetic core material according to the present invention, Figure 4 (f) is a schematic diagram of the flattening process of the front and back surfaces of the wafer according to the present invention. Figure 4 (g) is a schematic diagram of the present invention using photolithography technology to pattern the front and back sides of the wafer, Figure 4 (h) is a schematic diagram of preparing RDL and bonding bumps on the front and back sides of the wafer according to the present invention. Figure 4 (i) is a schematic diagram of bonding two glass wafers according to the present invention.

[0065] Figure numerals: 1—first TGV structure, 2—second TGV structure, 3—first substrate layer, 4—second substrate layer, 5—first conductor structure, 6—second conductor structure, 7—first magnetic core structure, 8—second magnetic core structure, 9—upper metal bump, 10—middle transition layer, 11—lower metal bump, 12—cavity unit, 13—through-hole unit. DETAILED DESCRIPTION

[0066] In order to better illustrate the purpose and advantages of the present invention, the embodiments of the technical solution of the present invention will be described in detail below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention and are therefore only used as examples and are not intended to limit the scope of protection of the present invention.

[0067] Unless otherwise specified, in the present invention, if there are terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", "x direction", "y direction", "z direction", etc., indicating orientation or positional relationship, they are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the terms describing the orientation or positional relationship in the present invention are only used for illustrative purposes and cannot be understood as limiting this patent. For ordinary technicians in this field, they can understand the specific meanings of the above terms in conjunction with the drawings and according to specific circumstances.

[0068] Example 1:

[0069] like Figure 1 As shown, the TGV-based multi-layer glass-based magnetic core spiral inductor disclosed in this embodiment includes a first TGV structure, a second TGV structure, a first substrate layer and a second substrate layer, a first conductor structure, a second conductor structure, a first magnetic core structure, and a second magnetic core structure.

[0070] A plurality of first TGV structures are arranged in two rows at equal intervals, and a plurality of second TGV structures of the same type and size are distributed in the same type directly below the first TGV structures.

[0071] The number of the first TGV structures is an even number and is at least two.

[0072] The multi-layer glass-based magnetic core spiral inductor based on the TGV process further includes a bonding layer, and the first TGV structure and the corresponding second TGV structure are connected through the bonding layer.

[0073] The bonding layer includes an upper metal bump, a lower metal bump, and an intermediate transition layer connecting the two.

[0074] The intermediate transition layer is made of copper, tin, gold-indium, tin-lead eutectic or copper-tin eutectic material.

[0075] The multi-layer glass-based magnetic core spiral inductor based on the TGV process also includes an electrical connection module, which includes a first conductor structure and a second conductor structure. The first conductor structure can be electrically connected to part or all of the first TGV structure, and the second conductor structure can be electrically connected to part or all of the second TGV structure.

[0076] The first TGV structure, the second TGV structure, the first conductor structure, the second conductor structure and the bonding layer together form a three-dimensional conductor spiral structure that is electrically conductive.

[0077] The conductor material of the three-dimensional conductor spiral structure can be any one of metal silver and its alloy materials, metal copper and its alloy materials, metal iron and its alloy materials.

[0078] The multi-layer glass-based magnetic core spiral inductor based on the TGV process also includes two first substrate layers and second substrate layers of the same type and size. The first TGV structure is entirely provided in the first substrate layer, and the second TGV structure is entirely provided in the second substrate layer.

[0079] The first substrate layer and the second substrate layer are made of glass.

[0080] The multi-layer glass-based magnetic core spiral inductor based on the TGV process also includes two magnetic core structures of the same type and size, the three-dimensional conductor spiral structure is wound around the periphery of the magnetic core structure, the first magnetic core structure is entirely arranged in the first substrate layer, and the second magnetic core structure is entirely arranged in the second substrate layer.

[0081] The material of the magnetic core structure may be manganese zinc ferrite, nickel zinc ferrite, sendust or iron silicon alloy.

[0082] Based on the dimensional conditions of the glass substrate and TGV process, as well as the application environment of miniaturized inductors, Table 1 shows the structural parameter values ​​of a basic TGV double-layer spiral inductor model at a 2.4 GHz operating frequency. At this frequency, the inductance L0 of the basic inductor model is 1.16 nH, and the quality factor Q0 is 30.44.

[0083]

[0084] See Figure 3 , the relative position and size of the core are determined by the following formula:

[0085]

[0086] w core =p1-2*d

[0087] l core =p+d

[0088] Among them, t core 、w core and l core are the thickness, width and length of the core respectively.

[0089] See Figure 1 Based on HFSS three-dimensional electromagnetic simulation software, the basic inductor model is modeled. Through finite element simulation, the inductor inductance value L1 and quality factor matrix Q1 of the inductor under different parameter segments in Table 1 are obtained, as well as the normalized training set L 11 =L1 / L0 and Q 11 =Q1 / Q0. The changes in each parameter are as follows:

[0090] d∈[20μm,70μm], with a step size of 10μm

[0091] h∈[200μm,500μm], with a step size of 25μm

[0092] p∈[80μm,180μm], with a step size of 10μm

[0093] p1∈0[10μm,400μm], with a step size of 20μm

[0094] A linear regression model was constructed for the four parameters of TGV diameter, TGV height, ipsilateral TGV spacing, and heterolateral TGV spacing. The coefficient matrix is:

[0095] A1=[a1 a2 a3 a4 a5 a6 a7]

[0096] A2=[b1 b2 b3 b4 b5 b6 b7]

[0097] The linear regression term designed based on the calculation formula of the solenoid inductance is:

[0098] B=[1 dhp p1 d 2 p 2 h * p1] T

[0099] The regression coefficients of the inductance and quality factor can be adjusted according to the formula, the change of the inductance magnetic field and other related contents, and the regression terms can be different for K1 and K2.

[0100] The impact factor at this time is:

[0101] K1=A1B

[0102] K2=A2B

[0103] The following matrix calculation formula is solved based on the least squares iteration method to calculate the core influence factors K1 and K2:

[0104] K1=L 11 / L0

[0105] K2=Q 11 / Q0

[0106] The calculated values ​​of the A1 and A2 coefficient matrices are shown in the table:

[0107] <![CDATA[a1]]> <![CDATA[a2]]> <![CDATA[a3]]> <![CDATA[a4]]> <![CDATA[a5]]> <![CDATA[a6]]> <![CDATA[a7]]> <![CDATA[a8]]> -5.6454 -0.0426 0.0029 0.1138 0.0018 <![CDATA[1.6324*10 -4 ]]> <![CDATA[-4.0307*10 -4 ]]> <![CDATA[1.1125*10 -5 ]]> <![CDATA[b1]]> <![CDATA[b2]]> <![CDATA[b3]]> <![CDATA[b4]]> <![CDATA[b5]]> <![CDATA[b6]]> <![CDATA[b7]]> <![CDATA[b8]]> -3.5469 0.0480 <![CDATA[-2.4353*10 -4 ]]> 0.0528 0.0013 <![CDATA[-2.7198*10 -4 ]]> <![CDATA[-1.8112*10 -4 ]]> <![CDATA[3.0979*10 -6 ]]>

[0108] The required inductance value, L, is 2.4 nH. Based on the above explicit model, the four process parameters, d = 20 μm, h = 200 μm, p = 110 μm, and p1 = 100 μm, can be calculated and fitted to optimize the core size. The core size is determined by the above equation and the four process parameters, and the Q value is 39. Note that the results of the above explicit model solution may vary depending on the solution type, accuracy, and model method, and may even be unsolvable. A solution model should be designed based on the actual application to obtain the required parameter values.

[0109] Based on the application model and structural parameters determined above, the specific structure of the TGV multi-layer glass-based magnetic core inductor with the required inductance value can be determined, thereby carrying out the manufacturing process of the inductor component described in the present invention.

[0110] S1: If Figure 4 As shown in (a), two 4-inch glass wafers of identical size and material are prepared. The subsequent process operations are identical for both wafers; any differences are described separately. They are cleaned according to the "RCA" standard to remove impurities from the wafer surface.

[0111] S2: If Figure 4 As shown in (b), a laser-induced etching process is used to machine several through-hole units with a diameter of 20μm and a height of 200μm that penetrate the entire wafer, as well as cavity units that do not penetrate the wafer. The same number of through-hole units are arranged in two rows with equal spacing around the cavity unit. The center-to-center distance between the through-hole units on the same side of the cavity is 110μm, and the center-to-center distance between the through-hole units on the opposite sides is 100μm.

[0112] S3: If Figure 4 As shown in Figure (c), a 20nm titanium layer and a 500nm copper layer are deposited on the back of the glass substrate using a sputtering process. The titanium layer improves adhesion between the metal conductor and the glass, enhancing process reliability. The copper layer serves as a seed layer, preparing for subsequent electroplating.

[0113] S4: As Figure 4 As shown in (d), the electroplating process is used to complete the filling of the wafer backside and the center conductor in the TGV hole at a current density of 0.1ASD.

[0114] S5: If Figure 4 As shown in (e), the wafer is placed face-up on a tray. A dropper is used to apply a specific ratio of nickel-zinc ferrite and benzocyclobutene to the entire surface. Vacuum is applied for 5 minutes, and a temperature profile is set to solidify the magnetic material, forming a core structure.

[0115] S6: As Figure 4 As shown in (f), both surfaces of the glass substrate are polished using a chemical mechanical polishing process. The magnetic material covering the front surface is removed until the copper pillars are exposed. A small amount of magnetic material and excess electroplated copper are removed from the back surface until the copper pillars are exposed.

[0116] S8: Figure 4 (g) and Figure 4 As shown in (h), the designated redistribution layer, pads, and bonding bumps are manufactured on both sides of the glass wafer using photolithography and electroplating processes.

[0117] S9: As Figure 4As shown in (i), the two glass sheets are metal-bonded using a tin intermediate layer and a bonding process, so that the redistribution structure, the TGV structure, and the bonding structure form a three-dimensional conductor structure of a spirally wound magnetic core.

[0118] The above specific description further illustrates the purpose, technical solutions and beneficial effects of the invention in detail. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. TGV-based multi-layer glass-based magnetic core spiral inductor, characterized in that: It comprises a first TGV structure (1), a second TGV structure (2), a first substrate layer (3), a second substrate layer (4), a first conductor structure (5), a second conductor structure (6), a first magnetic core structure (7), and a second magnetic core structure (8); A plurality of first TGV structures (1) are arranged in two rows at equal intervals; and a plurality of second TGV structures (2) of the same type and size are distributed in the same type directly below the first TGV structures (1).

2. The TGV-based multi-layer glass-based magnetic core spiral inductor according to claim 1, characterized in that: It also includes a bonding layer, through which the first TGV structure (1) and the corresponding second TGV structure (2) are connected.

3. The TGV-based multi-layer glass-based magnetic core spiral inductor according to claim 2, characterized in that: The invention also includes an electrical connection module, wherein the electrical connection module includes a first conductor structure (5) and a second conductor structure (6), wherein the first conductor structure (5) can be electrically connected to part or all of the first TGV structure (1), and the second conductor structure (6) can be electrically connected to part or all of the second TGV structure (2).

4. The TGV-based multi-layer glass-based magnetic core spiral inductor according to claim 3, characterized in that: It also includes two first substrate layers (3) and second substrate layers (4) of the same type and size, wherein the first TGV structure (1) is entirely provided in the first substrate layer (3), and the second TGV structure (2) is entirely provided in the second substrate layer (4).

5. The TGV-based multi-layer glass-based magnetic core spiral inductor according to claim 1, characterized in that: The invention also includes two first magnetic core structures (7) and second magnetic core structures (8) of the same type and size. The three-dimensional conductor spiral structure is wound around the periphery of the magnetic core to form a solenoid inductor. The first magnetic core structure (7) is entirely arranged in the first substrate layer (3), and the second magnetic core structure (8) is entirely arranged in the second substrate layer (4).

6. The TGV-based multi-layer glass-based magnetic core spiral inductor according to claim 5, characterized in that: The bonding layer includes an upper metal bump (9), a lower metal bump (11), and an intermediate transition layer (10) connecting the two; The intermediate transition layer (10) is made of copper, tin, gold-indium, tin-lead eutectic or copper-tin eutectic material; The first TGV structure (1), the second TGV structure (2), the first conductor structure (5), the second conductor structure (6), and the bonding layer together constitute a three-dimensional conductor spiral structure; The conductor material of the three-dimensional conductor spiral structure is any one of metal silver and its alloy materials, metal copper and its alloy materials, metal iron and its alloy materials; The material of the first substrate layer (3) and the second substrate layer (4) is glass; The material of the magnetic core structure is manganese zinc ferrite, nickel zinc ferrite, sendust or iron silicon alloy.

7. The design method of the TGV-based multi-layer glass-based magnetic core spiral inductor according to claims 1, 2, 3, 4, 5 and 6, characterized in that: The combined influence of the core size, TGV diameter d, height (i.e., glass substrate thickness) h, TGV center distance p on the same side, and TGV center distance p1 on the opposite side on the inductor's inductance L and quality factor Q is represented by the influencing factors K1 and K2. The required inductance L1 and the corresponding quality factor Q1 are calculated using the following formula: L1=K1*L0 Q1=K2*Q0 Where L0 and Q0 are the inductance and quality factor of the basic inductor device model respectively; The empirical expressions of K1 and K2 are as follows: A1=[a1 a2 a3 a4 a5 a6 a7] A2=[b1 b2 b3 b4 b5 b6 b7] B=[1d h p p1 d 2 p 2 h * p1] T K1=A1B K2=A2B Where d, h, p and p1 are TGV diameter, TGV height, TGV center distance in the same row and TGV center distance in the same column respectively; The coefficient matrices of K1 and K2 are calculated using the following matrix formula: K1=A1B=L 11 / L0 K2=A2B=Q 11 / Q0 Among them, L 11 and Q 11 The data matrix of the inductance value and quality factor training set obtained by simulation based on the initial inductor model.

8. The design method of the TGV-based multi-layer glass-based magnetic core spiral inductor according to claim 7, characterized in that: The size of the magnetic core generally has a positive effect on the inductance value and quality factor of the inductor. The size of the magnetic core of the inductor is set to change regularly with the parameters of the TGV diameter, height, and center distance. The core size variation rule is determined by the following formula: w core =p1-2*d l core =p+d Among them, t core 、w core and l core are the thickness, width and length of the core respectively, and the center of the core is at the center of the TGV array.

9. The design method of the TGV-based multi-layer glass-based magnetic core spiral inductor according to claim 8, characterized in that: Based on the neural network and iterative calculation method, the designed TGV diameter, height, same-side center distance, and opposite-side center distance data set are obtained through the required inductance value L. The error is determined by the adopted model method; the selection of the optimal parameter group is determined by the maximum value of the calculated quality factor Q and the rationality of the process.

10. A method for manufacturing a TGV-based multilayer glass-based magnetic core spiral inductor, for manufacturing the TGV-based multilayer glass-based magnetic core spiral inductor according to claims 1, 2, 3, 4, 5 and 6, characterized in that: The following steps are included: S1: Prepare two glass substrate layers of the same type and size and clean them; S2: using a laser induced etching process, a plurality of through-hole units (12) penetrating the substrate layer and a cavity unit (11) not penetrating the substrate layer are processed on one side of the glass substrate, wherein the plurality of through-hole units (13) are arranged in two rows with equal intervals around the cavity unit (12); the cavity opening surface is set as the first surface of the glass substrate, and the other surface is set as the second surface; S3: depositing a titanium metal layer and a copper seed layer on the second surface of the glass substrate using a sputtering process; S4: Completely fill the center conductor in the TGV hole using the copper electroplating process; S5: grinding the second surface of the glass substrate using a chemical mechanical polishing process to remove excess copper layer on the second surface; S6: Place the two glass substrates with their first surfaces facing upwards on a tray, and use a dropper to drip a mixture of nickel-zinc ferrite and benzocyclobutene in a specific ratio onto the entire surface; set a temperature curve to solidify the magnetic material to form a magnetic core; Before solidification, the substrate is evacuated to allow the magnetic material to fill the entire cavity; S7: grinding the first surface of the glass substrate using a chemical mechanical polishing process to remove excess magnetic material from the first surface of the substrate to expose the glass substrate; S8: using photolithography and electroplating processes to prepare designated redistribution layers, pads, and bonding bumps on both sides of the glass substrate; S9: Use a tin intermediate layer and a bonding process to metal bond the two glass substrates mentioned above, so that the rewiring structure, the TGV structure and the bonding structure form a three-dimensional conductor structure of the spirally wound magnetic core.

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