System and method for removing edge defects of high-silicon silicon steel and related equipment

Abstract

The invention discloses a system and a method for removing edge defects of high-silicon silicon steel and related equipment, relates to the field of strip steel rolling, and mainly aims to solve the problem that the identification and treatment of the edge defects of the high-silicon silicon steel depend on manpower too much at present. The system comprises a shearing module which adjusts the stroke of a cutter based on a hydraulic servo system; and the grinding module is used for tracking the contour of the defect based on a slewing mechanism. The method is used for the edge defect removal process of the high-silicon silicon steel.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of strip rolling, in particular to a high-silicon silicon steel edge defect removal system, method and related equipment. BACKGROUND

[0002] In the production process of high-silicon silicon steel, due to its own characteristics of greater brittleness, the strip steel is extremely prone to edge cracking. In the process of rolling, this edge cracking defect will be further enlarged, and in severe cases, it may even lead to strip breaking, which brings great challenges to the stable production of high-silicon silicon steel cold rolling.

[0003] At present, there are many deficiencies in the treatment method and equipment of strip steel edge defects, and the identification and treatment of high-silicon silicon steel edge defects still rely too much on manual work. SUMMARY

[0004] In view of the above problems, the present application provides a high-silicon silicon steel edge defect removal system, method and related equipment, the main purpose is to solve the problem that the identification and treatment of high-silicon silicon steel edge defects still rely too much on manual work.

[0005] To solve the above at least one technical problem, in a first aspect, the present application provides a high-silicon silicon steel edge defect removal system, which comprises:

[0006] A shearing module, which adjusts the tool stroke based on a hydraulic servo system;

[0007] A grinding module, which tracks the profile of the defect based on a rotary mechanism.

[0008] Optionally, the shearing module comprises:

[0009] A three-stage hydraulic damping assembly for staged pressurization to dynamically match the shearing force.

[0010] Optionally, the grinding module comprises:

[0011] A laser ranging sensor and a pressure feedback device.

[0012] Optionally, the system further comprises:

[0013] An oil mist recovery assembly comprising a cyclone separator and an electrostatic adsorber.

[0014] In a second aspect, the present application provides a high-silicon silicon steel edge defect removal method for the above high-silicon silicon steel edge defect removal system, which comprises:

[0015] Obtaining the shape information and defect information of the target strip steel;

[0016] generate a defect processing instruction based on the profile information and the defect information, wherein the defect processing instruction is used to control a production line to slow down and move the target strip steel to a processing area, and the processing area is equipped with the shearing module and the grinding module;

[0017] control the shearing module and the grinding module to remove the defect of the target strip steel based on the profile information and the defect information.

[0018] Optionally, the defect information includes a defect length and a defect depth, and the control of the shearing module and the grinding module to remove the defect of the target strip steel based on the profile information and the defect information includes:

[0019] start the grinding module when the defect length is less than or equal to a first length threshold and the defect depth is less than or equal to a first depth threshold;

[0020] start the shearing module and the grinding module when the defect length is greater than the first length threshold and less than or equal to a second length threshold, and the defect depth is greater than the first depth threshold and less than or equal to a second depth threshold;

[0021] trigger a stop alarm when the defect length is greater than the second length threshold and the defect depth is greater than the second depth threshold.

[0022] Optionally, the method further includes:

[0023] record defect data of a production line where the target strip steel is located;

[0024] optimize production parameters of the production line based on the defect data.

[0025] In a third aspect, an embodiment of the present application also provides a high-silicon silicon steel edge defect removal device, including:

[0026] an acquisition unit configured to acquire profile information and defect information of a target strip steel;

[0027] a generation unit configured to generate a defect processing instruction based on the profile information and the defect information, wherein the defect processing instruction is used to control a production line to slow down and move the target strip steel to a processing area, and the processing area is equipped with the shearing module and the grinding module;

[0028] a control unit configured to control the shearing module and the grinding module to remove the defect of the target strip steel based on the profile information and the defect information.

[0029] In order to achieve the above object, according to a fourth aspect of the present application, a computer readable storage medium is provided, which comprises a stored program, wherein the steps of the high-silicon silicon steel edge defect removal method described above are implemented when the program is executed by a processor.

[0030] In order to achieve the above object, according to a fifth aspect of the present application, an electronic device is provided, comprising at least one processor and at least one memory connected to the processor; wherein the processor is configured to invoke program instructions in the memory to execute the steps of the high-silicon silicon steel edge defect removal method described above.

[0031] By means of the above technical solutions, the high-silicon silicon steel edge defect removal system, method and related device provided by the present application can solve the problem that the identification and processing of the edge defects of high-silicon silicon steel currently rely too much on manual work. The present application comprises a shearing module based on a hydraulic servo system to adjust the tool stroke, and a polishing module based on a rotary mechanism to track the profile of the defects. In the above scheme, the depth integration of the defect processing solves the problems of low automation and frequent manual intervention in the traditional process. The shearing module can flexibly adjust the cutting depth according to the defect size to avoid material waste caused by excessive cutting. The polishing module can real-time fit the strip profile through the rotary mechanism to eliminate the residual stress concentration phenomenon caused by shearing, thereby reducing the rolling edge crack rate. The linkage control of the two modules can improve the overall production efficiency of the unit.

[0032] Correspondingly, the high-silicon silicon steel edge defect removal device, equipment and computer readable storage medium provided by the embodiments of the present application also have the above technical effects.

[0033] The above description is only a summary of the technical solutions of the present application. In order to enable the technical means of the present application to be more clearly understood, the specific embodiments of the present application can be implemented according to the content of the description, and in order to enable the above and other purposes, characteristics and advantages of the present application to be more apparent and easy to understand, the following specific embodiments of the present application are described. BRIEF DESCRIPTION OF DRAWINGS

[0034] Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The accompanying drawings are intended to depict only preferred embodiments of the application, and therefore should not be considered to limit the scope of the application in any way. Similarly, like reference numerals have been used in the drawings to depict like parts of the application. In the drawings:

[0035] Figure 1 A composition schematic diagram of a high-silicon silicon steel edge defect removal system provided by an embodiment of the present application is shown;

[0036] Figure 2A flowchart of a high-silicon silicon steel edge defect removal method provided by an embodiment of the present application is shown.

[0037] Figure 3 A composition schematic block diagram of a high-silicon silicon steel edge defect removal device provided by an embodiment of the present application is shown.

[0038] Figure 4 A composition schematic block diagram of a high-silicon silicon steel edge defect removal electronic device provided by an embodiment of the present application is shown. DETAILED DESCRIPTION

[0039] Exemplary embodiments of the present application will be described in detail with reference to the drawings. Although exemplary embodiments of the present application are shown in the drawings, it is understood that the present application can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that this application will be thoroughly and completely understood, and will fully convey the scope of the application to those skilled in the art.

[0040] To solve the problem that the current defect identification and processing of the high-silicon silicon steel edge is too dependent on manual work, an embodiment of the present application provides a high-silicon silicon steel edge defect removal device, as shown in the figure. Figure 1 The device comprises:

[0041] A shearing module that adjusts the tool stroke based on a hydraulic servo system;

[0042] A polishing module that tracks the profile of the defect based on a rotary mechanism.

[0043] Exemplarily, the shearing module and the polishing module together constitute a cutting and grinding device. The shearing module can perform accurate shearing operation according to the detected defect information, and the variable shearing depth adjustment capability is realized through a series of mechanical structures and control systems. For example, by adjusting the position and angle of the tool, shearing of different depths is realized. The polishing module has high flexibility and adaptability, and can perform follow-up polishing according to the specific situation of the defect. Through a series of mechanical transmission and control systems, the polishing head can closely adhere to the edge defect for polishing.

[0044] By the above technical scheme, the high-silicon silicon steel edge defect removal system provided by the application solves the problem that current edge defect identification and processing of high-silicon silicon steel excessively relies on manual operation, and the system comprises a shearing module, the shearing module is based on a hydraulic servo system to adjust the tool stroke, and a polishing module, the polishing module is based on a rotary mechanism to track the profile of the defect. In the above scheme, the depth integration of the defect processing solves the problems of low automation and frequent manual intervention in the traditional process. The shearing module can flexibly adjust the cutting depth according to the defect size, avoiding material waste caused by excessive cutting. The polishing module can real-time fit the strip profile through the rotary mechanism, eliminating the phenomenon of residual stress concentration caused by shearing, and reducing the edge crack rate. The linkage control of the two modules greatly improves the overall production efficiency of the unit.

[0045] In an embodiment, the shearing module comprises:

[0046] A three-stage hydraulic damping assembly is used for staged pressurization to dynamically match the shearing force.

[0047] For example, the three-stage hydraulic damping system can steplessly adjust the shearing force in the range of 500-2000N, realizes the optimal cutting ratio (shearing width / defect width≤1.2) for defects with a width of 0.5-3mm, reduces the energy consumption by 65% compared with the traditional crescent shears, and controls the height of the cutting burr to be less than 0.02mm.

[0048] Based on the above scheme, the three-stage hydraulic structure can accurately control the damping force output range, and realizes the real-time matching of the shearing force and the working condition demand through staged pressurization. In the case of sudden working conditions such as water hammer and safety valve discharge, the staged pressurization design can effectively absorb the impact energy, avoid the resonance risk caused by the traditional single damping mode, improve the maximum carrying capacity of the system, and realize the collaborative optimization of the hydraulic system and the mechanical structure.

[0049] In an embodiment, the polishing module comprises:

[0050] A laser ranging sensor and a pressure feedback device.

[0051] For example, the laser ranging sensor has an accuracy of ±0.01mm, and combined with pressure closed-loop control, the error between the polishing track and the defect edge is less than 0.05mm. The pressure adaptive mechanism improves the polishing consistency of different curvature strips by 3 times, and the surface roughness Ra value is stable and less than or equal to 0.8μm.

[0052] In an embodiment, the system further comprises:

[0053] An oil mist recovery assembly, the oil mist recovery assembly comprises a cyclone separator and an electrostatic adsorber.

[0054] Exemplarily, the oil mist recovery assembly adopts a double-channel design, and the cyclone separator improves the cutting fluid recovery rate. The electrostatic adsorption unit can control the PM2.5 emission concentration.

[0055] The embodiment of the present application provides a high-silicon silicon steel edge defect removal method, which is used for the high-silicon silicon steel edge defect removal device as shown in the figure, and the method comprises the following steps: Figure 2

[0056] S101, acquiring shape information and defect information of a target strip steel;

[0057] S102, generating a defect processing instruction based on the shape information and the defect information, wherein the defect processing instruction is used for controlling a production line to slow down and moving the target strip steel to a processing area, and the processing area is loaded with a shearing module and a grinding module;

[0058] S103, controlling the shearing module and the grinding module to remove defects of the target strip steel based on the shape information and the defect information.

[0059] Specifically, in a rolling process of a cold rolling mill, an entrance surface defect detection system monitors a state of a strip steel edge in real time. When a surface defect detection device scans a defect, shape information and defect information are transmitted to a production line PLC (Programmable Logic Controller) and a shearing and grinding equipment. The production line executes speed reduction, positioning and shutdown according to position information, so that the defect stays in a working area of the shearing and grinding equipment. When the defect is positioned, the defect is selected to stay in a shearing equipment area or a grinding equipment area according to a defect size and a requirement. After the strip steel stops, a defect shearing equipment moves inward to shear according to the defect size, so that the defect is completely removed. After shearing is completed, the production line runs at a low speed through the grinding equipment, and the grinding equipment grinds a shearing cut in a process that the strip steel runs at a low speed, so that shearing stress of the cut is effectively removed. When the defect is small and does not need to be sheared, the defect is directly positioned in the grinding equipment area and runs at a low speed, and the grinding equipment removes the defect.

[0060] Exemplarily, the present application monitors a strip steel edge in real time through a high-precision sensor, accurately identifies shape information and defect information of a target strip steel, and then transmits relevant information to a production line PLC and a shearing and grinding equipment. The production line PLC positions the defect in a working area of the shearing and grinding equipment according to position information. The shearing and grinding equipment receives a working instruction, and executes two actions of shearing+grinding or single grinding according to a defect size. After the shearing and grinding equipment finishes work, the mill resumes normal operation.

[0061] In one embodiment, the defect information comprises a defect length and a defect depth, and the control of the shearing module and the grinding module to remove the defect of the target strip steel based on the shape information and the defect information comprises the following steps:​

[0062] in the case that the defect length is less than or equal to a first length threshold and the defect depth is less than or equal to a first depth threshold, starting the polishing module;

[0063] in the case that the defect length is greater than the first length threshold and less than or equal to a second length threshold and the defect depth is greater than the first depth threshold and less than or equal to a second depth threshold, starting the shearing module and the polishing module;

[0064] in the case that the defect length is greater than the second length threshold and the defect depth is greater than the second depth threshold, triggering a stop alarm.

[0065] Specifically, the above defect grading algorithm performs differentiated processing strategies according to defect length L (mm) and depth D (μm):

[0066] L≤50 and D≤200: only starting the polishing module;

[0067] 50

[0068] L>150 and D>500: triggering a stop alarm.

[0069] It can be understood that the above 50 is a first length threshold, 200 is a first depth threshold, 150 is a second length threshold, and 500 is a second depth threshold. The above specific data can be changed according to actual production.

[0070] Illustratively, the cutting and grinding integrated part selects a suitable processing mode according to the grading of the defect. If the defect is more serious, shearing + polishing is required; if the defect is small, only polishing is required. When shearing operation is performed, the device automatically adjusts the cutting depth according to the size and shape of the defect, ensuring that the defective part can be accurately cut off. In the polishing process, the polishing device is attached to the strip edge or the cut through the rotary mechanism, and the defects of different depths and shapes are polished to ensure that the polished strip cut is smooth and flat. At the same time, the entire working process of the device is strictly monitored and controlled to ensure the stable operation of the device and the reliability of the processing effect.

[0071] Based on the above scheme, the grading algorithm improves the defect recognition accuracy and shortens the processing decision response time. Compared with the fixed mode processing, the material utilization rate is greatly improved, and the equipment wear rate is reduced.

[0072] In one embodiment, the method further comprises:

[0073] recording defect data of a target strip steel in a production line;

[0074] optimizing production parameters of the production line based on the defect data.

[0075] For example, the application records the position, type and corresponding unit information of the surface defects of the strip steel, and constructs a correlation model of defects and process parameters by combining the parameter data such as temperature and tension in the production process. This data-driven analysis method enables process personnel to accurately locate the root cause of the problem. For example, by analyzing linear roughness defect data, the rolling speed and water cutting process of the hot rolling line are optimized to reduce the defect rate.

[0076] The above scheme dynamically adjusts key parameters based on defect data. For example, by real-time monitoring of thickness mutation defects, the rolling mill speed and tension control strategy of the cold rolling line are automatically optimized, which not only protects the equipment but also reduces the impact of defects on downstream processes. This collaborative mechanism enables quality control to shift from passive detection to active prevention.

[0077] Further, as an implementation of the above-mentioned Figure 2 As an implementation of the method shown in the above-mentioned Figure 3 As shown in the above-mentioned

[0078] The acquisition unit 21 is configured to acquire the shape information and defect information of the target strip steel.

[0079] The generation unit 22 is configured to generate a defect processing instruction based on the shape information and the defect information, wherein the defect processing instruction is used to control the production line to slow down and move the target strip steel to a processing area, and the processing area is equipped with the shearing module and the polishing module.

[0080] The control unit 23 is configured to control the shearing module and the polishing module to remove the defects of the target strip steel based on the shape information and the defect information.

[0081] The processor includes a core, and the core retrieves corresponding program units from the memory. The core can be set to one or more, and the core parameters can be adjusted to implement a high-silicon silicon steel edge defect removal method, which can solve the problem that the current defect recognition and processing of high-silicon silicon steel edges rely too much on manual work.

[0082] The embodiment of the application provides a computer readable storage medium, and the computer readable storage medium includes a stored program, which is executed by a processor to implement the high-silicon silicon steel edge defect removal method.

[0083] The embodiment of the present application provides a processor used for running a program, wherein the high-silicon silicon steel edge defect removal method is executed when the program is running.

[0084] The embodiment of the present application provides an electronic device, which comprises at least one processor and at least one memory connected with the processor; wherein the processor is used for calling program instructions in the memory to execute the high-silicon silicon steel edge defect removal method.

[0085] The embodiment of the present application provides an electronic device 30, as shown in the figure, the electronic device comprises at least one processor 301 and at least one memory 302 connected with the processor, and a bus 303; wherein the processor 301 and the memory 302 complete mutual communication through the bus 303; the processor 301 is used for calling program instructions in the memory to execute the high-silicon silicon steel edge defect removal method. Figure 4

[0086] The intelligent electronic device in the present application can be a PC, a PAD, a mobile phone and the like.

[0087] The present application also provides a computer program product suitable for executing the program initialized with the steps of the high-silicon silicon steel edge defect removal method when executed on the process management electronic device.

[0088] It should be noted that in the above embodiments, the description of each embodiment has its own emphasis, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0089] Those skilled in the art should understand that the embodiments of the present application can be provided as a method, a system, or a computer program product. Therefore, the present application can adopt a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware aspects. Moreover, the present application can adopt a computer program product in the form of one or more computer usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer usable program codes.

[0090] The present application is described with reference to the flowcharts and / or block diagrams according to the method, device (system), and computer program product of the embodiments of the present application. It should be understood that each flow and / or block in the flowcharts and / or block diagrams, and the combination of the flows and / or blocks in the flowcharts and / or block diagrams can be realized by computer program instructions. These computer program instructions can be provided to the processor of a general-purpose computer, a special-purpose computer, an embedded computer, or other programmable data processing devices to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing devices produce a machine that implements the functions described in the flowcharts and / or block diagrams. Figure 1 ​one or more processes and / or blocks Figure 1 an apparatus for performing the functions specified in the flowchart or multiple flows and / or blocks.

[0091] These computer program instructions can also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instructions apparatus implementing the flowchart Figure 1 one or more processes and / or blocks Figure 1 an apparatus for performing the functions specified in the flowchart or multiple flows and / or blocks.

[0092] These computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process so that the instructions which execute on the computer or other programmable apparatus provide processes for implementing the flowchart Figure 1 one or more processes and / or blocks Figure 1 an apparatus for performing the functions specified in the flowchart or multiple flows and / or blocks.

[0093] The embodiments of the present application also provide a computer program product, which includes computer software instructions, when the computer software instructions are run on a processing device, cause the processing device to perform the flowchart or function according to the embodiments of the present application. Figure 2 the flowchart of the control of the memory in the corresponding embodiments.

[0094] The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the flowchart or function according to the embodiments of the present application is produced. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable apparatus. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another, for example, the computer instructions can be transmitted from one website, computer, server or data center to another website, computer, server or data center through wired (such as coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (such as infrared, wireless, microwave, etc.) mode. The computer-readable storage medium can be any available medium that the computer can store or be integrated into a server, data center, etc. data storage device containing one or more available media sets. The available media can be a magnetic medium (for example, a floppy disk, a hard disk, a magnetic tape), an optical medium (for example, a DVD), or a semiconductor medium (for example, a solid state disk (SSD)), etc.

[0095] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the above-described system, device and unit can refer to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0096] In several embodiments provided in the present application, it should be understood that the disclosed system, device and method can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the division of units is only a logical function division, and actual implementation can have another division manner, for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the units shown or discussed can be indirect coupling or communication connection through some interface, device or unit, and can be electrical, mechanical or other forms.

[0097] The units described as separate components can or can not be physically separate, and the components shown as units can or can not be physical units, that is, can be located in one place, or can be distributed on a plurality of network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the embodiment scheme.

[0098] In addition, each functional unit in each embodiment of the present application can be integrated in one processing unit, or each unit can be physically present separately, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of a software functional unit.

[0099] If the integrated unit is realized in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer readable storage medium. Based on this understanding, the technical solutions of the present application essentially or the part that contributes to the prior art or the whole or part of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a storage medium, and includes a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the embodiments of the method of the present application. The foregoing storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, and various program code storage media.

[0100] The above, the above examples are only used to illustrate the technical solutions of the present application, but not limit them; although the present application is described in detail with reference to the foregoing examples, those skilled in the art should understand that the technical solutions recorded in the foregoing examples can still be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A high-silicon silicon steel edge defect removal system, characterized by, The shear module adjusts the cutter stroke based on a hydraulic servo system. The polishing module tracks the profile of the defect based on a rotary mechanism. The shear module comprises:

2. The method of claim 1, wherein, A three-stage hydraulic damping assembly for staged pressurization to dynamically match the shear force. The polishing module comprises:

3. The method of claim 1, wherein, A laser ranging sensor and a pressure feedback device. Further comprising:

4. The method of claim 1, wherein, An oil mist recovery assembly comprising a cyclone separator and an electrostatic precipitator. Comprising:

5. A method for removing edge defects of high-silicon silicon steel, used in the system for removing edge defects of high-silicon silicon steel according to any one of claims 1 to 4, characterized in that, Obtaining the profile information and defect information of the target strip steel; Generating a defect processing instruction based on the profile information and the defect information, wherein the defect processing instruction is used to control the line speed reduction and move the target strip steel to a processing area, and the processing area carries the shear module and the polishing module; Controlling the shear module and the polishing module to remove the defects of the target strip steel based on the profile information and the defect information. The defect information includes defect length and defect depth, and the control of the shear module and the polishing module to remove the defects of the target strip steel based on the profile information and the defect information comprises:

6. The method of claim 5, wherein, In the case where the defect length is less than or equal to a first length threshold value, and the defect depth is less than or equal to a first depth threshold value, the polishing module is started; In the case where the defect length is greater than the first length threshold value and less than or equal to a second length threshold value, and the defect depth is greater than the first depth threshold value and less than or equal to a second depth threshold value, the shear module and the polishing module are started; In the case where the defect length is greater than the second length threshold value, and the defect depth is greater than the second depth threshold value, a stop alarm is triggered. Further comprising:

7. The method of claim 5, wherein, Recording the defect data of the target strip steel in the production line; Optimizing the production parameters of the production line based on the defect data. Further comprising:

8. A high-silicon silicon steel edge defect removal apparatus characterized by comprising: An acquisition unit for acquiring the profile information and defect information of the target strip steel; A generation unit for generating a defect processing instruction based on the profile information and the defect information, wherein the defect processing instruction is used to control the line speed reduction and move the target strip steel to a processing area, and the processing area carries the shear module and the polishing module; A control unit for controlling the shear module and the polishing module to remove the defects of the target strip steel based on the profile information and the defect information. The computer readable storage medium comprises a stored program, wherein the program is executed by a processor to implement the steps of the high-silicon silicon steel edge defect removal method according to any one of claims 5 to 7.

9. A computer-readable storage medium, characterized in that, The electronic device comprises at least one processor and at least one memory connected to the processor; wherein the processor is used to call the program instructions in the memory, and execute the steps of the high-silicon silicon steel edge defect removal method according to any one of claims 5 to 7.

10. An electronic device, comprising: ​

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