Electronic device

Abstract

Disclosed is an electronic device including a sensor layer and a sensor driver configured to drive the sensor layer and configured to selectively operate in a first mode to sense a touch input or in a second mode to sense a pen input, in which the sensor layer includes first electrodes arranged in a first direction, and second electrodes arranged in a second direction, first sensing patterns spaced apart in a second direction crossing the first direction and first bridge patterns between the first sensing patterns; a second electrode arranged in the second direction and including second sensing patterns spaced apart in the first direction and a second bridge pattern between the second sensing patterns; and a pen sensing electrode on the same layer as one of the first bridge pattern and the second bridge pattern, and extending in an extending direction of the one of the first bridge pattern and the second bridge pattern.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2024-0052427 filed in the Korean Intellectual Property Office on April 19, 2024, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The embodiments of the present disclosure described herein relate to an electronic device for sensing input of a pen. Background Art

[0004] Multimedia electronic devices such as televisions, mobile phones, tablet computers, notebook computers, car navigation units, game consoles, etc. include display devices for displaying images. The electronic device may include a sensor layer (or input sensor) capable of providing a touch-based input method that enables a user to intuitively and conveniently input information or instructions in a simple and easy manner in addition to conventional input methods such as buttons, keyboards, mice, etc. The sensor layer can sense the user's touch or pressure. At the same time, there is an increasing demand for pens for users who are accustomed to using writing tools to input information or pens for precise touch input in specific applications (e.g., applications for sketching or drawing). Summary of the Invention

[0005] Embodiments of the present disclosure provide an electronic device for sensing an input of a pen.

[0006] According to one or more embodiments, an electronic device includes a sensor layer and a sensor driver, wherein the sensor driver is configured to drive the sensor layer and is configured to selectively operate in a first mode to sense touch input or in a second mode to sense pen input, wherein the sensor layer includes: first electrodes arranged in a first direction and including first sensing patterns spaced apart in a second direction intersecting the first direction and first bridging patterns between the first sensing patterns; second electrodes arranged in the second direction and including second sensing patterns spaced apart in the first direction and second bridging patterns between the second sensing patterns; and a pen sensing electrode on the same layer as one of the first bridging patterns and the second bridging patterns and extending in an extension direction of one of the first bridging patterns and the second bridging patterns.

[0007] The pen sensing electrode may be at the same layer as the second bridge pattern, wherein the pen sensing electrode and the second bridge pattern extend in the first direction.

[0008] The pen sensing electrode may have a bar shape extending in the first direction.

[0009] An outer edge of the pen sensing electrode can face an outer edge of the second bridge pattern adjacent to the pen sensing electrode.

[0010] The pen sensing electrode can alternate with the second bridge pattern in the second direction.

[0011] A portion of one of the pen sensing electrodes can overlap with portions of two of the second electrodes.

[0012] Portions of two of the pen sensing electrodes can be in a sensing cell in which one of the first electrodes crosses one of the second electrodes.

[0013] The first electrodes and the second sensing pattern can be at different layers than the second bridge pattern, wherein, in one of the first electrodes, the first sensing pattern and the first bridge pattern are integral, and wherein, in one of the second electrodes, the second sensing pattern and the second bridge pattern are connected by a contact hole.

[0014] The pen sensing electrode can be at the same layer as the second bridge pattern, wherein the pen sensing electrode and the second bridge pattern extend in the second direction.

[0015] The second sensing pattern can include a first protrusion on one side in the first direction and a second protrusion on an opposite side in the first direction, the first protrusion and the second protrusion extending in the first direction, wherein the second bridge pattern is connected to the second protrusion of one of the second sensing patterns and to the first protrusion of another of the second sensing patterns.

[0016] The first bridge pattern can include a first line portion, a second line portion, and a third line portion, wherein the first line portion is configured to extend from a side of one of the first sensing patterns toward another of the first sensing patterns adjacent to the one of the first sensing patterns, the second line portion is configured to extend from a side of the another of the first sensing patterns toward the one of the first sensing patterns, and the third line portion connects the first line portion and the second line portion and extends in the first direction, wherein the second protrusion of the one of the second sensing patterns is between the another of the first sensing patterns and the third line portion, and wherein the first protrusion of the another of the second sensing patterns is between the one of the first sensing patterns and the third line portion.

[0017] The pen sensing electrode can be at the same layer as the first bridge pattern, wherein the pen sensing electrode and the first bridge pattern extend in the second direction.

[0018] The pen sensing electrode can have a bar shape extending in the second direction, wherein an outer edge of the pen sensing electrode faces an outer edge of the first bridge pattern adjacent to the pen sensing electrode.

[0019] The pen sensing electrode can define a hole surrounding the first bridge pattern in a plan view, wherein the pen sensing electrode overlaps the first electrode in a one-to-one manner.

[0020] The first sensing pattern and the second electrode can be at different layers from the first bridge pattern, wherein the first sensing pattern and the first bridge pattern are connected through a contact hole in one of the first electrodes, and wherein the second sensing pattern and the second bridge pattern are integral in one of the second electrodes. BRIEF DESCRIPTION OF DRAWINGS

[0021] The above and other aspects of the present disclosure will become apparent by describing in detail embodiments thereof with reference to the attached drawings.

[0022] FIG. 1A is a perspective view of an electronic device according to one or more embodiments of the present disclosure.

[0023] FIG. 1B is a rear perspective view of an electronic device according to one or more embodiments of the present disclosure.

[0024] FIG. 2 is a perspective view of an electronic device according to one or more embodiments of the present disclosure.

[0025] FIG. 3 is a perspective view of an electronic device according to one or more embodiments of the present disclosure.

[0026] FIG. 4 is a schematic cross-sectional view of a display panel according to one or more embodiments of the present disclosure.

[0027] FIG. 5 is a view for explaining an operation of an electronic device according to one or more embodiments of the present disclosure.

[0028] FIG. 6A is a cross-sectional view of a display panel according to one or more embodiments of the present disclosure.

[0029] FIG. 6B is a cross-sectional view of a sensor layer according to one or more embodiments of the present disclosure.

[0030] FIG. 7 is a plan view of a sensor layer according to one or more embodiments of the present disclosure.

[0031] FIG. 8Ais a plan view showing a portion of the sensing region according to one or more embodiments of the present disclosure.

[0032] FIG. 8B is a plan view showing a first conductive layer of a portion of the sensing region according to one or more embodiments of the present disclosure.

[0033] FIG. 8C is a plan view showing a second conductive layer of a portion of the sensing region according to one or more embodiments of the present disclosure.

[0034] FIG. 8D is a cross-sectional view of the sensor layer taken along the line I-I' shown in FIG. 8A

[0035] FIG. 9A is a plan view showing a portion of the sensing region according to one or more embodiments of the present disclosure. FIG. 8C

[0036] FIG. 9B is a plan view showing a portion of the sensing region according to one or more embodiments of the present disclosure. FIG. 8B

[0037] FIG. 10A is a plan view showing a portion of the sensing region according to one or more embodiments of the present disclosure.

[0038] FIG. 10B is a plan view showing a first conductive layer of a portion of the sensing region according to one or more embodiments of the present disclosure.

[0039] FIG. 10C is a plan view showing a second conductive layer of a portion of the sensing region according to one or more embodiments of the present disclosure.

[0040] FIG. 11A is a plan view showing a portion of the sensing region according to one or more embodiments of the present disclosure.

[0041] FIG. 11B is a plan view showing a first conductive layer of a portion of the sensing region according to one or more embodiments of the present disclosure.

[0042] FIG. 12A is a plan view showing a portion of the sensing region according to one or more embodiments of the present disclosure.

[0043] FIG. 12B is a plan view showing a second conductive layer of a portion of the sensing region according to one or more embodiments of the present disclosure.

[0044] FIG. 13A ​​​is a plan view of the first conductive layer showing a portion of the sensing area according to one or more embodiments of the present disclosure.

[0045] FIG. 13B is FIG. 13A is an enlarged plan view of the area CC' shown in

[0046] FIG. 14 is a plan view of the first conductive layer showing a portion of the sensing area according to one or more embodiments of the present disclosure.

[0047] FIG. 15A is a schematic diagram showing one channel according to one or more embodiments of the present disclosure.

[0048] FIG. 15B is an equivalent circuit diagram showing the relationship between one channel and a pen according to one or more embodiments of the present disclosure.

[0049] FIG. 16A is a graph depicting the current intensity according to the position of a pen relative to one channel.

[0050] FIG. 16B is a graph depicting the signal intensity according to the position of a pen relative to one channel.

[0051] FIG. 17 is a plan view of the sensor layer according to one or more embodiments of the present disclosure.

[0052] FIG. 18A is a plan view of the first conductive layer showing a portion of the sensing area according to one or more embodiments of the present disclosure.

[0053] FIG. 18B is a plan view of the second conductive layer showing a portion of the sensing area according to one or more embodiments of the present disclosure.

[0054] FIG. 18C is a cross-sectional view of the sensor layer according to one or more embodiments of the present disclosure taken along FIG. 18A and FIG. 18B is a cross-sectional view of the sensor layer taken along the line II-II' shown in

[0055] FIG. 18D is a cross-sectional view of the sensor layer according to one or more embodiments of the present disclosure taken along FIG. 18A and FIG. 18B is a cross-sectional view of the sensor layer taken along the line III-III' shown in

[0056] FIG. 19 is a plan view of the first conductive layer showing a portion of the sensing area according to one or more embodiments of the present disclosure.

[0057] FIG. 20A is a plan view showing a portion of a sensing region according to one or more embodiments of the present disclosure.

[0058] FIG. 20B is a plan view showing a lower conductive layer of a portion of a sensing region according to one or more embodiments of the present disclosure.

[0059] FIG. 20C is a plan view showing a first conductive layer of a portion of a sensing region according to one or more embodiments of the present disclosure.

[0060] FIG. 20D is a cross-sectional view of a sensor layer according to one or more embodiments of the present disclosure taken along the line IV-IV' shown in FIG. 20A

[0061] FIG. 21A is a plan view showing a portion of a sensing region according to one or more embodiments of the present disclosure.

[0062] FIG. 21B is a plan view showing a lower conductive layer of a portion of a sensing region according to one or more embodiments of the present disclosure.

[0063] FIG. 21C is a plan view showing a first conductive layer of a portion of a sensing region according to one or more embodiments of the present disclosure.

[0064] FIG. 22A is a plan view showing a second conductive layer according to one or more embodiments of the present disclosure.

[0065] FIG. 22B is a plan view showing a first conductive layer according to one or more embodiments of the present disclosure.

[0066] FIG. 22C is a plan view showing a lower conductive layer according to one or more embodiments of the present disclosure.

[0067] FIG. 23 is a view showing an operation of a sensor driver according to one or more embodiments of the present disclosure.

[0068] FIG. 24 is a view showing an operation of a sensor driver according to one or more embodiments of the present disclosure.

[0069] FIG. 25 is a view for explaining a first mode according to one or more embodiments of the present disclosure.

[0070] FIG. 26 is a view for explaining a second mode according to one or more embodiments of the present disclosure.​

[0071] FIG. 27A is a graph depicting a waveform of a first signal according to one or more embodiments of the present disclosure.

[0072] FIG. 27B is a graph depicting a waveform of a second signal according to one or more embodiments of the present disclosure.

[0073] FIG. 28A is a view for explaining a second mode according to one or more embodiments of the present disclosure.

[0074] FIG. 28B is a view for explaining a second mode based on one sensing unit according to one or more embodiments of the present disclosure. DETAILED DESCRIPTION

[0075] Aspects of some embodiments of the present disclosure and methods implementing the same can be more readily understood by reference to the following detailed description and the accompanying drawings. The described embodiments are provided as examples so that the present disclosure will be thorough and complete, and will fully convey the scope of the aspects of the present disclosure to those skilled in the art. Therefore, processes, elements, and techniques that are redundant, irrelevant to the description of the embodiments, or unnecessary to an understanding of the aspects of the present disclosure by one of ordinary skill in the art can be omitted. Unless otherwise indicated, the same reference characters, numerals or combinations thereof in all the drawings and the written description show the same or similar elements and thus, repetitive description thereof can be omitted.

[0076] The described embodiments can have various modifications and can be implemented in different forms and should not be construed as being limited to the embodiments set forth herein. "Can" or "may" used in describing the embodiments corresponds to one or more embodiments of the present disclosure.

[0077] One of ordinary skill in the art will understand that, in light of the overall content of the present disclosure, each suitable feature of various embodiments of the present disclosure can be incorporated partially or wholly or in conjunction with each other and can be technically interlocked and operated in various suitable ways, and unless otherwise stated or implied, each embodiment can be implemented independently of each other or in conjunction with each other in any suitable way.

[0078] In the drawings, the relative sizes of elements, layers, and regions can be exaggerated for clarity and / or descriptive purposes. In other words, because the dimensions of elements in the drawings are arbitrary:

[0079] Various implementations are described herein with reference to cross-sectional illustrations that are schematic representations of schematics embodiments and / or intermediate structures of implementations. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Additionally, the particular structures or functional descriptions disclosed herein are not to be interpreted as meaning that the implementations disclosed herein are limited to the particular structures or functional descriptions described. Thus, the implementations disclosed herein are not to be interpreted as being limited to the shapes of the illustrations as presented herein but are to include deviations in shapes that result, for example, from manufacturing.

[0080] For example, an implant region that is shown as rectangular will typically have rounded or curved features at its edges and / or a gradient of implant concentration, rather than a binary change from the implant region to the non-implant region. Likewise, a buried region formed by implantation can result in some implantation in the region between the buried region and the surface through which implantation occurred.

[0081] For ease of description, spatially relative terms, such as “below”, “beneath”, “lower”, “bottom”, “under”, “above”, “upper”, “top”, “higher”, “upside”, “side” (e.g., as in “sidewall”), and the like, can be used herein for the purpose of describing the orientation of one element or feature relative to another element(s) or feature(s) as shown in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or in operation, in addition to the orientations depicted in the figures. For example, if a device in the figures is turned over, elements described as “below”, “beneath”, or “under” other elements or features would then be oriented “above”, “upside”, or “over” the other elements or features. Thus, the exemplary terms “below” and “under” can encompass both orientations, up and down. The device can be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. Similarly, when a first part is described as being “on” a second part, it can mean that the first part is disposed on the upper side or lower side of the second part, without being limited to a particular side based on the gravitational direction.

[0082] Furthermore, the phrase "in plan view" means when viewing the subject part from above, and the phrase "in schematic cross-sectional view" means when viewing a schematic cross-section of the subject part obtained by cutting the subject part vertically from the side. The term "overlapping" or "overlapped" means that a first object can be above or below a second object or to one side of the second object, and vice versa. Furthermore, the term "overlapping" can include stacking, facing or facing towards, extending over, covering or partially covering, or any other suitable term as would be understood and appreciated by one of ordinary skill in the art. The expression "not overlapping" can include the meaning of "spaced apart from" or "offset from" or "offset" as well as any other suitable equivalent as would be understood and appreciated by one of ordinary skill in the art. The terms "facing" and "facing towards" can mean that a first object can be directly or indirectly opposite a second object. In case a third object is interposed between the first object and the second object, the first object and the second object can be understood as indirectly opposite each other, although still facing each other.

[0083] It will be understood that when an element, layer, region or component is referred to as being "on" or "connected to" or "(operably or communicatively) coupled to" another element, layer, region or component, it can be directly or indirectly on, connected to or coupled to the other element, layer, region or component, and one or more intervening elements, layers, regions or components can be present. In addition, it can generally refer to either direct or indirect coupling or connection and unitary or non-unitary coupling or connection. For example, when a layer, region or component is referred to as being "electrically connected" or "electrically coupled" to another layer, region or component, it can be directly electrically connected or directly electrically coupled to the other layer, region and / or component, or one or more intervening layers, regions or components can be present. The one or more intervening components can include switches, resistors, capacitors, etc. In describing implementations, unless explicitly described as directly connected, expressions of connection indicate electrical connection, and "directly connected / directly coupled" or "directly on" mean that one component is directly connected or directly coupled to another component or directly on another component without intervening components.

[0084] Also in this specification, when a part of a layer, film, region, plate, and the like is formed on another part, the direction of formation is not limited to the upward direction, but includes a case where the part is formed on a side surface or in the downward direction. Conversely, when a part of a layer, film, region, plate, and the like is formed "under" another part, this includes not only a case where the part is "directly under" the other part, but also a case where there is yet another part between the part and the other part. Meanwhile, other expressions of the relationship between components such as "between", "directly between", or "adjacent to" and "directly adjacent to" can be similarly interpreted. It will be understood that when an element or layer is referred to as being "between" two elements or layers, it can be the only element or layer between the two elements or layers or one or more intervening elements or layers can also be present.

[0085] For purposes of the present disclosure, expressions such as "at least one of... or "any of... or "one or more of... when preceding the terms of a list of elements, modify the entire list of elements and do not modify the individual elements of the list. For example, "at least one of X, Y, and Z" and "at least one of a group consisting of X, Y, and Z" can be interpreted to be only X, only Y, only Z, any combination of two or more of X, Y, and Z (such as, for example, XYZ, XY, YZ, and XZ), or any permutation of any of the above examples. Similarly, the expression "at least one of A and B" can include A, B, or A and B. As used herein, "or" means "and / or" and the term "and / or" includes any and all combinations of one or more of the associated listed items. For example, the expression "A and / or B" can include A, B, or A and B. Similarly, expressions such as "at least one of...", "one or more of", "a plurality" and other phrases containing like verbs can be interpreted to be modifying the entire list of elements when preceding the terms of a list of elements, rather than modifying the individual elements of the list. When the statement "C to D" is made, it means C or more and D or less, unless otherwise stated.

[0086] It will be understood that, although the terms “first,” “second,” “third,” etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section described below could be termed a second element, component, region, layer or section without departing from the spirit and scope of the present disclosure. An element described as “first” need not necessarily be “second,” and vice versa. The terms “first,” “second,” etc. can also be used herein to distinguish different categories or different groups of elements. For the sake of brevity, the terms “first,” “second,” etc. can be used herein to designate the “first category (or first group)” and the “second category (or second group),” respectively, as opposed to “first” and “second” categories (or groups).

[0087] In examples, the x-axis, the y-axis, and / or the z-axis are not limited to the three axes of a rectangular coordinate system, and can be interpreted in a broader sense. For example, the x-axis, the y-axis, and the z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other. The same applies to the first direction, the second direction, and / or the third direction.

[0088] The terminology used herein is for the purpose of describing embodiments only and is not intended to be limiting of the present disclosure. As used herein, the singular forms “a,” “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises,” “comprising,” “includes” and / or “including,” when used herein, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0089] As used herein, the terms “substantially,” “about,” “approximately,” and like terms are used as terms of approximation and not as terms of degree, and are intended to account for the inherent deviations in measured or calculated values that would be recognized by those of ordinary skill in the art. For example, “substantially” can include a range of + / - 5% of a recited value. In view of the discussed measurement and the error associated with measuring a particular quantity (i.e., the limitations of the measurement system), as used herein, “about” or “approximately” includes the recited value and means within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art. For example, “about” can mean within one or more standard deviations, or within + / - 30%, + / - 20%, + / - 10%, + / - 5% of the recited value. Additionally, “may” as used while describing embodiments of the present disclosure indicates “one or more implementations of the present disclosure.”

[0090] The electronic device or electric device and / or any other related device or component according to embodiments of the present disclosure described herein can be implemented using any suitable hardware, firmware (e.g., application specific integrated circuit), software, or a combination of software, firmware, and hardware to process data or digital signals. For example, various components of these devices can be formed on one integrated circuit (IC) chip or on separate IC chips. Also, various components of these devices can be implemented on a flexible printed circuit film, a tape carrier package (TCP), a printed circuit board (PCB), or formed on one substrate. The circuit hardware can include, for example, application specific integrated circuits (ASICs), general or special purpose central processing units (CPUs) configured to execute instructions stored in non-transitory storage media, digital signal processors (DSPs), graphics processing units (GPUs), and programmable logic devices such as field programmable gate arrays (FPGAs).

[0091] Software components can indicate executable code and / or data that can be addressed by the memory medium. Thus, software components can be, for example, object-oriented software components, class components, and task components, and can include processes, functions, attributes, procedures, subroutines, segments of program code, drivers, firmware, microcode, data, databases, data structures, tables, arrays, or variables. Furthermore, a variety of components of the devices can be processes or threads running on one or more processors in one or more computing devices, executing computer program instructions and interacting with other system components for performing the various functionalities described herein. The computer program instructions are stored in memory that can be implemented in a computing device using a standard memory device, such as, for example, a random access memory (RAM). The computer program instructions can also be stored in other non-transitory computer readable media such as, for example, a CD-ROM, a flash drive, and the like. Also, those skilled in the art will appreciate that the functions of the various computing devices can be combined or integrated into a single computing device, or the functions of a particular computing device can be distributed across one or more other computing devices without departing from the spirit and scope of the embodiments of the present disclosure.

[0092] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and / or the present disclosure, and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0093] FIG. 1A is a perspective view of an electronic device 1000 according to one or more embodiments of the present disclosure. FIG. 1B is a rear perspective view of an electronic device 1000 according to one or more embodiments of the present disclosure.

[0094] Referring to FIG. 1A and FIG. 1B The electronic device 1000 can be a device activated according to an electrical signal. For example, the electronic device 1000 can display an image and can sense an input applied from the outside. The external input can be a user input. The user input can include various types of external inputs such as a part of a user's body, a pen PN, light, heat, or pressure.

[0095] The electronic device 1000 can include a first display panel DP1 and a second display panel DP2. The first display panel DP1 and the second display panel DP2 can be separate panels that are separated from each other. The first display panel DP1 can be referred to as a main display panel, and the second display panel DP2 can be referred to as an auxiliary display panel or an external display panel.

[0096] The first display panel DP1 can include a first display portion DA1-F, and the second display panel DP2 can include a second display portion DA2-F. The second display panel DP2 can have an area that is smaller than an area of the first display panel DP1. The first display portion DA1-F and the second display portion DA2-F can have areas that correspond to sizes of the first display panel DP1 and the second display panel DP2, respectively, and the area of the first display portion DA1-F can be greater than the area of the second display portion DA2-F.

[0097] In the unfolded state of the electronic device 1000, the first display portion DA1-F can have a plane that is substantially parallel to the first direction DR1 and the second direction DR2. The thickness direction of the electronic device 1000 can be parallel to a third direction DR3 that intersects the first direction DR1 and the second direction DR2. Accordingly, a front surface (or an upper surface) and a rear surface (or a lower surface) of components constituting the electronic device 1000 can be defined based on the third direction DR3.

[0098] The first display panel DP1 or the first display portion DA1-F can include a folding area FA that is folded and unfolded, and a plurality of non-folding areas NFA1 and NFA2 that are spaced apart from each other with the folding area FA therebetween. The second display panel DP2 can overlap one of the plurality of non-folding areas NFA1 and NFA2. For example, the second display panel DP2 can overlap the first non-folding area NFA1.

[0099] A display direction of a first image IM1a displayed on a portion (e.g., the second non-folding area NFA2) of the first display panel DP1 can be opposite to a display direction of a second image IM2a displayed on the second display panel DP2. For example, the first image IM1a can be displayed in a third direction DR3, and the second image IM2a can be displayed in a fourth direction DR4 opposite to the third direction DR3.

[0100] In one or more embodiments of the disclosure, the folding area FA can be bent about a folding axis extending in a direction parallel to the long side of the electronic device 1000 (e.g., in a direction parallel to the second direction DR2). In the folded state of the electronic device 1000, the folding area FA has a certain curvature and a certain radius of curvature. The electronic device 1000 can be folded in an inward folding manner such that the first non-folding area NFA1 and the second non-folding area NFA2 face each other and the first display portion DA1-F is not exposed to the outside.

[0101] In one or more embodiments of the disclosure, the electronic device 1000 can be folded in an outward folding manner such that the first display portion DA1-F is exposed to the outside. In one or more embodiments of the disclosure, the electronic device 1000 can be folded in an inward folding or outward folding manner in the unfolded state. However, the disclosure is not limited thereto.

[0102] Although FIG. 1A An example in which one folding area FA is defined (or provided or included) in the electronic device 1000 is illustrated, but the disclosure is not limited thereto. For example, a plurality of folding axes and a plurality of folding areas corresponding to the plurality of folding axes can be defined in the electronic device 1000, and the electronic device 1000 can be folded about the plurality of folding axes in an inward folding or outward folding manner in the unfolded state.

[0103] According to one or more embodiments of the disclosure, at least one of the first display panel DP1 and the second display panel DP2 can sense an input of the pen PN without a digitizer. Since the digitizer for sensing the pen PN is omitted, an increase in thickness and weight of the electronic device 1000 and a decrease in flexibility of the electronic device 1000 due to the addition of the digitizer can not occur. Accordingly, not only the first display panel DP1 but also the second display panel DP2 can be designed to sense the pen PN.

[0104] FIG. 2 is a perspective view of an electronic device 1000-1 according to one or more embodiments of the disclosure. FIG. 3 is a perspective view of an electronic device 1000-2 according to one or more embodiments of the disclosure.

[0105] FIG. 2 An example in which the electronic device 1000-1 is a mobile phone is illustrated, and the electronic device 1000-1 can include a display panel DP. FIG. 3 An example in which the electronic device 1000-2 is a notebook computer is illustrated, and the electronic device 1000-2 can include a display panel DP. Although FIG. 3 is a perspective view of the electronic device 1000-2, but FIG. 3The coordinate axes included therein are displayed based on a display panel DP within the electronic device 1000-2.

[0106] In one or more embodiments of the disclosure, the display panel DP can sense an input applied from the outside. The external input can be a user input. The user input can include various types of external inputs such as a part of a user's body, a pen PN (refer to FIG. 1A ), light, heat, or pressure.

[0107] According to one or more embodiments of the disclosure, the display panel DP can sense an input of the pen PN without a digitizer. Because the digitizer for sensing the pen PN is omitted, an increase in the thickness and weight of the electronic device 1000-1 or 1000-2 due to the addition of the digitizer can not occur.

[0108] Although a foldable electronic device 1000 is illustrated in FIG. 1A and a bar-type electronic device 1000-1 is illustrated in FIG. 2 , the disclosure to be described below is not limited thereto. For example, the following description can be applied to various electronic devices such as a rollable electronic device, a slidable electronic device, and a stretchable electronic device.

[0109] FIG. 4 is a schematic cross-sectional view of a display panel DP according to one or more embodiments of the disclosure.

[0110] Referring to FIG. 4 , the display panel DP can include a display layer 100 and a sensor layer 200.

[0111] The display layer 100 can be a component that substantially generates an image. The display layer 100 can be an emissive display layer. For example, the display layer 100 can be an organic light emitting display layer, an inorganic light emitting display layer, an organic-inorganic light emitting display layer, a quantum dot display layer, a micro-LED display layer, or a nano-LED display layer. The display layer 100 can include a base layer 110, a circuit layer 120, a light emitting element layer 130, and an encapsulation layer 140.

[0112] The base layer 110 can be a means that provides a base surface on which the circuit layer 120 is located. The base layer 110 can have a multi-layer structure or a single-layer structure. The base layer 110 can be a glass substrate, a metal substrate, a silicon substrate, or a polymer substrate, but is not particularly limited thereto.

[0113] The circuit layer 120 can be located on the base layer 110. The circuit layer 120 can include an insulating layer, a semiconductor pattern, a conductive pattern, and a signal line. The insulating layer, the semiconductor layer, and the conductive layer can be formed on the base layer 110 by a process such as coating or deposition. The insulating layer, the semiconductor layer, and the conductive layer can be selectively patterned by performing a photolithography process a plurality of times.

[0114] The light emitting element layer 130 can be located on the circuit layer 120. The light emitting element layer 130 can include a light emitting element. For example, the light emitting element layer 130 can include an organic light emitting material, an inorganic light emitting material, an organic-inorganic light emitting material, a quantum dot, a quantum rod, a micro-LED, or a nano-LED.

[0115] The encapsulation layer 140 can be located on the light emitting element layer 130. The encapsulation layer 140 can protect the light emitting element layer 130 from foreign substances such as moisture, oxygen, and dust particles.

[0116] The sensor layer 200 can be located on the display layer 100. The sensor layer 200 can sense an external input applied from the outside. The sensor layer 200 can be an integrated sensor that is continuously formed in a process of manufacturing the display layer 100. Alternatively, the sensor layer 200 can be an external sensor attached to the display layer 100. The sensor layer 200 can be referred to as a sensor, an input sensing layer, an input sensing panel, or an electronic device for sensing an input coordinate.

[0117] According to one or more embodiments of the disclosure, the sensor layer 200 can sense both an input by a passive input means such as a part of a user's body and an input by an input device that generates a magnetic field having a specific resonance frequency. The input device can be referred to as a pen, an input pen, a magnetic pen, a stylus, or an electromagnetic resonance pen.

[0118] FIG. 5 is a view for explaining an operation of the electronic device 1000 according to one or more embodiments of the disclosure.

[0119] Referring to FIG. 5 , the electronic device 1000 can include the display layer 100, the sensor layer 200, a display driver 100C, a sensor driver 200C, a main driver 1000C, and a power circuit 1000P.

[0120] The sensor layer 200 can sense a first input 2000 or a second input 3000 externally applied. Each of the first input 2000 and the second input 3000 can be an input made by a device capable of providing a change in capacitance of the sensor layer 200 or by a device capable of inducing an induced current in the sensor layer 200. For example, the first input 2000 can be a passive input made by a part of a user's body. The second input 3000 can be an input made by a pen PN or an RFIC tag. For example, the pen PN can be a passive type or an active type.

[0121] In one or more embodiments of the disclosure, the pen PN can be a device that generates a magnetic field having a specific resonance frequency. The pen PN can transmit an output signal based on an electromagnetic resonance scheme. The pen PN can be referred to as an input device, an input pen, a magnetic pen, a stylus, or an electromagnetic resonance pen.

[0122] The pen PN can include an RLC resonance circuit, and the RLC resonance circuit can include an inductor L and a capacitor C. In one or more embodiments of the disclosure, the RLC resonance circuit can be a variable resonance circuit that changes a resonance frequency. In this case, the inductor L can be a variable inductor, and / or the capacitor C can be a variable capacitor. However, the disclosure is not particularly limited thereto.

[0123] The inductor L generates a current by a magnetic field formed in the electronic device 1000 (e.g., the sensor layer 200). However, the disclosure is not particularly limited thereto. For example, when the pen PN operates in an active type, the pen PN can generate a current even without a magnetic field being provided from the outside to the pen PN. The generated current is transferred to the capacitor C. The capacitor C charges the current input from the inductor L and discharges the charged current to the inductor L. Thereafter, the inductor L can emit a magnetic field having a resonance frequency. An induced current can flow in the sensor layer 200 by the magnetic field emitted from the pen PN. The induced current can be transferred to the sensor driver 200C as a reception signal (or a sensing signal or another signal).

[0124] The main driver 1000C can control overall operations of the electronic device 1000. For example, the main driver 1000C can control operations of the display driver 100C and the sensor driver 200C. The main driver 1000C can include at least one microprocessor, and can further include a graphic controller. The main driver 1000C can be referred to as an application processor, a central processing unit, or a main processor.

[0125] The display driver 100C can drive the display layer 100. The display driver 100C can receive image data and control signals from the main driver 1000C. The control signals can include various signals. For example, the control signals can include an input vertical synchronization signal, an input horizontal synchronization signal, a main clock signal, and a data enable signal.

[0126] The sensor driver 200C can drive the sensor layer 200. The sensor driver 200C can receive control signals from the main driver 1000C. The control signals can include a clock signal of the sensor driver 200C. In addition, the control signals can further include a mode determination signal for determining a driving mode of the sensor driver 200C and the sensor layer 200.

[0127] The sensor driver 200C can be implemented with an integrated circuit (IC), and can be electrically connected with the sensor layer 200. For example, the sensor driver 200C can be directly mounted in a specific area of the display panel. Alternatively, the sensor driver 200C can be mounted on a separate printed circuit board using a chip on film (COF) method, and can be electrically connected with the sensor layer 200.

[0128] The sensor driver 200C and the sensor layer 200 can selectively operate in a first mode or a second mode. For example, the first mode can be a mode for sensing a touch input (e.g., the first input 2000). The second mode can be a mode for sensing an input of the pen PN (e.g., the second input 3000). The first mode can be referred to as a touch sensing mode, and the second mode can be referred to as a pen sensing mode.

[0129] Switching between the first mode and the second mode can be performed in various ways. For example, the sensor driver 200C and the sensor layer 200 can be driven in the first mode and the second mode in a time-division manner, and can sense the first input 2000 and the second input 3000. Alternatively, switching between the first mode and the second mode can be performed by a selection or an action (or an input) of a user, or can be performed by activating or deactivating a corresponding application, one of the first mode and the second mode can be activated or deactivated, or a driving mode can be switched from one mode to another mode. In another case, while the sensor driver 200C and the sensor layer 200 alternately operate in the first mode and the second mode, when the first input 2000 is sensed, the sensor driver 200C and the sensor layer 200 can remain in the first mode, and when the second input 3000 is sensed, the sensor driver 200C and the sensor layer 200 can remain in the second mode.

[0130] The sensor driver 200C can calculate input coordinate information based on a signal received from the sensor layer 200, and can provide a coordinate signal having the coordinate information to the main driver 1000C. The main driver 1000C performs an operation corresponding to a user input based on the coordinate signal. For example, the main driver 1000C can operate the display driver 100C, thereby displaying a new application image on the display layer 100.

[0131] The power supply circuit 1000P can include a power management integrated circuit (PMIC). The power supply circuit 1000P can generate a plurality of driving voltages for driving the display layer 100, the sensor layer 200, the display driver 100C, and the sensor driver 200C. For example, the plurality of driving voltages can include a gate high voltage, a gate low voltage, a first driving voltage (e.g., an ELVSS voltage), a second driving voltage (e.g., an ELVDD voltage), an initialization voltage, etc., but is not particularly limited to the examples.

[0132] FIG. 6A is a cross-sectional view of a display panel DP according to one or more embodiments of the disclosure.

[0133] Referring to FIG. 6A At least one buffer layer BFL is formed on an upper surface of the base layer 110 (as used herein, "formed on" or "located on" can mean "over"). The buffer layer BFL can improve a coupling force between the base layer 110 and the semiconductor pattern. The buffer layer BFL can be formed of a plurality of layers. Optionally, the display layer 100 can further include a barrier layer. The buffer layer BFL can include at least one of a silicon oxide, a silicon nitride, and a silicon oxynitride. For example, the buffer layer BFL can include a structure in which a silicon oxide layer and a silicon nitride layer are alternately stacked over each other.

[0134] The semiconductor patterns SC, AL, DR, and SCL can be located on the buffer layer BFL. The semiconductor patterns SC, AL, DR, and SCL can include polysilicon. However, not limited thereto, the semiconductor patterns SC, AL, DR, and SCL can include amorphous silicon, low temperature polysilicon, or an oxide semiconductor.

[0135] FIG. 6AOnly a portion of the semiconductor patterns SC, AL, DR, and SCL is shown, and the semiconductor patterns can be additionally located in other regions. The semiconductor patterns SC, AL, DR, and SCL can be arranged across pixels according to corresponding rules. The semiconductor patterns SC, AL, DR, and SCL can have different electrical properties according to whether or not doping is performed. The semiconductor patterns SC, AL, DR, and SCL can include first regions SC, DR, and SCL having high conductivity and a second region AL having low conductivity. The first regions SC, DR, and SCL can be doped with N-type or P-type dopants. A P-type transistor can include a doped region doped with P-type dopants, and an N-type transistor can include a doped region doped with N-type dopants. The second region AL can be an undoped region, or can be a region that is more lightly doped than the first regions SC, DR, and SCL.

[0136] The first regions SC, DR, and SCL can have higher conductivity than the second region AL, and can substantially function as electrodes or signal lines. The second region AL can substantially correspond to an active region AL (or a channel) of the transistor 100PC. In other words, a portion AL of the semiconductor patterns SC, AL, DR, and SCL can be the active region AL of the transistor 100PC, another portion SC or DR can be the source region SC or the drain region DR of the transistor 100PC, and the other portion SCL can be a connection electrode or a connection signal line SCL.

[0137] Each of the pixels can have an equivalent circuit including a plurality of transistors, one capacitor, and at least one light emitting element, and the equivalent circuit of the pixel can be modified in various forms. In FIG. 6A In the equivalent circuit, one transistor 100PC and one light emitting element 100PE included in the pixel are shown.

[0138] The source region SC, the active region AL, and the drain region DR of the transistor 100PC can be formed of the semiconductor patterns SC, AL, DR, and SCL. The source region SC and the drain region DR can extend in opposite directions from the active region AL in a cross section. In FIG. 6A In the equivalent circuit, a portion of the semiconductor patterns SC, AL, DR, and SCL formed of the connection signal line SCL is shown. In one or more embodiments, the connection signal line SCL can be connected to the drain region DR of the transistor 100PC when viewed from above the plane.

[0139] The first insulating layer 10 can be located on the buffer layer BFL. The first insulating layer 10 can overlap the plurality of pixels in common, and can cover the semiconductor patterns SC, AL, DR, and SCL. The first insulating layer 10 can be an inorganic layer and / or an organic layer, and can have a single layer structure or a multi-layer structure. The first insulating layer 10 can include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. The first insulating layer 10 can be a single silicon oxide layer. Not only the first insulating layer 10 but also the insulating layers of the circuit layer 120 to be described below can be an inorganic layer and / or an organic layer, and can have a single layer structure or a multi-layer structure. The inorganic layer can include at least one of the above-described materials, but is not limited thereto.

[0140] The gate GT of the transistor 100PC is located on the first insulating layer 10. The gate GT can be a part of a metal pattern. The gate GT overlaps the active area AL. The gate GT can be used as a mask in a process of doping or reducing the semiconductor patterns SC, AL, DR, and SCL.

[0141] The second insulating layer 20 can be located on the first insulating layer 10, and can cover the gate GT. The second insulating layer 20 can overlap the pixels in common. The second insulating layer 20 can be an inorganic layer and / or an organic layer, and can have a single layer structure or a multi-layer structure. The second insulating layer 20 can include at least one of silicon oxide, silicon nitride, and silicon oxynitride. The second insulating layer 20 can have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0142] The third insulating layer 30 can be located on the second insulating layer 20. The third insulating layer 30 can have a single layer structure or a multi-layer structure. For example, the third insulating layer 30 can have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0143] The first connection electrode CNE1 can be located on the third insulating layer 30. The first connection electrode CNE1 can be connected to the connection signal line SCL through a contact hole CNT-1 passing through the first insulating layer 10, the second insulating layer 20, and the third insulating layer 30.

[0144] The fourth insulating layer 40 can be located on the third insulating layer 30. The fourth insulating layer 40 can be a single silicon oxide layer. The fifth insulating layer 50 can be located on the fourth insulating layer 40. The fifth insulating layer 50 can be an organic layer.

[0145] The second connection electrode CNE2 can be located on the fifth insulating layer 50. The second connection electrode CNE2 can be connected to the first connection electrode CNE1 through a contact hole CNT-2 passing through the fourth insulating layer 40 and the fifth insulating layer 50.

[0146] A sixth insulating layer 60 can be located on the fifth insulating layer 50 and can cover the second connection electrode CNE2. The sixth insulating layer 60 can be an organic layer.

[0147] A light emitting element layer 130 can be located on the circuit layer 120. The light emitting element layer 130 can include a light emitting element 100PE. For example, the light emitting element layer 130 can include an organic light emitting material, an inorganic light emitting material, an organic-inorganic light emitting material, a quantum dot, a quantum rod, a micro-LED, or a nano-LED. Hereinafter, the light emitting element 100PE will be described as an organic light emitting element. However, the present disclosure is not particularly limited thereto.

[0148] The light emitting element 100PE can include a first electrode AE, an emission layer EL, and a second electrode CE.

[0149] The first electrode AE can be located on the sixth insulating layer 60. The first electrode AE can be connected to the second connection electrode CNE2 through a contact hole CNT-3 passing through the sixth insulating layer 60.

[0150] A pixel definition layer 70 can be located on the sixth insulating layer 60 and can cover a portion of the first electrode AE. The pixel definition layer 70 has an opening 70-OP defined therein. The opening 70-OP of the pixel definition layer 70 exposes at least a portion of the first electrode AE.

[0151] The first display part DA1-F (refer to FIG. 1) can include an emission region PXA and a non-emission region NPXA adjacent to the emission region PXA. The non-emission region NPXA can surround (e.g., in a plan view) the emission region PXA. The emission region PXA is defined to correspond to a partial region of the first electrode AE exposed by the opening 70-OP. FIG. 1A

[0152] The emission layer EL can be located on the first electrode AE. The emission layer EL can be located in a region corresponding to the opening 70-OP. Although FIG. 6A An example in which the emission layer EL is located in the opening 70-OP is illustrated, but the present disclosure is not particularly limited thereto. For example, the emission layer EL can extend to cover a portion of a side surface of the pixel definition layer 70 defining the opening 70-OP and an upper surface of the pixel definition layer 70.

[0153] In one or more embodiments of the present disclosure, the emission layer EL can be formed individually for each of the pixels. When the emission layer EL is formed individually for each of the pixels, the emission layers EL can each emit at least one of blue light, red light, and green light. However, not being limited thereto, the emission layer EL can be connected to the pixels and can be commonly included in the pixels. In this case, the emission layer EL can provide blue light or white light.

[0154] ​The second electrode CE can be located on the emission layer EL. The second electrode CE can have an integral shape (e.g., can be integrally formed) and can be commonly included in a plurality of pixels.

[0155] In one or more embodiments of the disclosure, a hole control layer can be located between the first electrode AE and the emission layer EL. The hole control layer can be commonly located in the emission area PXA and the non-emission area NPXA. The hole control layer can include a hole transport layer, and can further include a hole injection layer. An electron control layer can be located between the emission layer EL and the second electrode CE. The electron control layer can include an electron transport layer, and can further include an electron injection layer. The hole control layer and the electron control layer can be commonly formed in a plurality of pixels using an opening mask or an inkjet process.

[0156] The encapsulation layer 140 can be located on the light emitting element layer 130. The encapsulation layer 140 can include inorganic layers, organic layers, and inorganic layers which are sequentially stacked one above another. However, the layers constituting the encapsulation layer 140 are not limited thereto. The inorganic layers can protect the light emitting element layer 130 from moisture and oxygen, and the organic layers can protect the light emitting element layer 130 from foreign substances such as dust particles. The inorganic layers can include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layers can include an acrylic organic layer, but are not limited thereto.

[0157] The sensor layer 200 can include a base layer 201, a first conductive layer 202, an intermediate insulating layer 203, a second conductive layer 204, and a cover insulating layer 205.

[0158] The base layer 201 can be an inorganic layer including at least one of silicon nitride, silicon oxynitride, and silicon oxide. Alternatively, the base layer 201 can be an organic layer including an epoxy resin, an acrylic resin, or an imide-based resin. The base layer 201 can have a single layer structure or can have a multi-layer structure stacked in a third direction DR3. In one or more embodiments of the disclosure, the sensor layer 200 can not include the base layer 201.

[0159] Each of the first conductive layer 202 and the second conductive layer 204 can have a single layer structure, or can have a multi-layer structure stacked in the third direction DR3.

[0160] Each of the first conductive layer 202 and the second conductive layer 204 having a single layer structure can include a metal layer or a transparent conductive layer. The metal layer can include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The transparent conductive layer can include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium zinc tin oxide (IZTO), or the like. In addition, the transparent conductive layer can include a conductive polymer such as poly(3,4-ethylenedioxythiophene) (PEDOT), a metal nanowire, or graphene.

[0161] Each of the first conductive layer 202 and the second conductive layer 204 having a multi-layer structure can include a metal layer. The metal layer can have a three-layer structure of titanium / aluminum / titanium, for example. The conductive layer having a multi-layer structure can include at least one metal layer and at least one transparent conductive layer.

[0162] In one or more embodiments of the disclosure, the thickness of the first conductive layer 202 can be greater than or equal to the thickness of the second conductive layer 204. When the thickness of the first conductive layer 202 is greater than the thickness of the second conductive layer 204, the resistance of a component included in the first conductive layer 202 (e.g., the resistance of an electrode, a sensing pattern, or a bridging pattern) can decrease. In addition, because the first conductive layer 202 is positioned under the second conductive layer 204, even if the thickness of the first conductive layer 202 increases, the probability that a component included in the first conductive layer 202 will be visually recognized due to reflection of external light can be lower than the probability that a component included in the second conductive layer 204 will be visually recognized due to reflection of external light.

[0163] At least one of the intermediate insulating layer 203 and the cover insulating layer 205 can include an inorganic film. The inorganic film can include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0164] At least one of the intermediate insulating layer 203 and the cover insulating layer 205 can include an organic film. The organic film can include at least one of an acrylic resin, a methacrylic resin, a polyisoprene resin, a vinyl resin, an epoxy resin, a urethane-based resin, a cellulose resin, a siloxane-based resin, a polyimide resin, a polyamide resin, and a perylene-based resin.

[0165] Although it has been described that the sensor layer 200 includes the first conductive layer 202 and the second conductive layer 204 (that is, a total of two conductive layers), the disclosure is not particularly limited thereto. For example, the sensor layer 200 can include three or more conductive layers.

[0166] FIG. 6B is a cross-sectional view of a sensor layer 200 according to one or more embodiments of the disclosure.

[0167] Referring to FIG. 6A and FIG. 6B A second width 204wt of the second mesh line MS2 included in the second conductive layer 204 can be greater than or equal to a first width 202wt of the first mesh line MS1 included in the first conductive layer 202. When the user USR views the first mesh line MS1 and the second mesh line MS2 from the side, since the first mesh line MS1 has a smaller width than the second mesh line MS2, the probability that the first mesh line MS1 will be visually recognized by the user USR can decrease.

[0168] Each of the first mesh line MS1 and the second mesh line MS2 can include a first metal layer M1 and a second metal layer M2 located between the first metal layer M1. For example, the first metal layer M1 can include titanium (Ti), and the second metal layer M2 can include aluminum (Al). However, this is illustrative, and the present disclosure is not particularly limited thereto.

[0169] In one or more embodiments of the present disclosure, a first thickness TK1 of the second metal layer M2 of the first mesh line MS1 and a second thickness TK2 of the second metal layer M2 of the second mesh line MS2 can be substantially the same as each other, but are not particularly limited thereto. For example, the first thickness TK1 can be greater than the second thickness TK2. Alternatively, the second thickness TK2 can be greater than the first thickness TK1. In one or more embodiments of the present disclosure, each of the first thickness TK1 and the second thickness TK2 can be 1000 angstroms or more, for example, 6000 angstroms.

[0170] FIG. 7 is a plan view of the sensor layer 200 according to one or more embodiments of the present disclosure.

[0171] Referring to FIG. 7 In the sensor layer 200, a sensing area 200A and a peripheral area 200NA adjacent to the sensing area 200A can be defined.

[0172] The sensor layer 200 can include a plurality of first electrodes 210, a plurality of second electrodes 220, and a plurality of third electrodes 230 located in the sensing area 200A.

[0173] Each of the first electrodes 210 can cross the second electrodes 220. The first electrodes 210 can extend in a second direction DR2. The first electrodes 210 can be arranged to be spaced apart from each other in a first direction DR1. Each of the second electrodes 220 can extend in the first direction DR1. The second electrodes 220 can be arranged to be spaced apart from each other in the second direction DR2. A sensing unit SU of the sensor layer 200 can be an area in which one of the first electrodes 210 and one of the second electrodes 220 cross each other.

[0174] Although six first electrodes 210, ten second electrodes 220, and sixty sensing units SU are shown in FIG. 7 The number of first electrodes 210 and the number of second electrodes 220 are not limited thereto.

[0175] Each of the third electrodes 230 can extend in the second direction DR2. The third electrodes 230 can be arranged to be spaced apart from each other in the first direction DR1. One third electrode 230 can at least partially overlap one first electrode 210. The third electrodes 230 can be referred to as pen sensing electrodes or auxiliary electrodes. According to one or more embodiments of the present disclosure, a capacitance (or coupling capacitance) between one first electrode 210 and one third electrode 230 can be adjusted by adjusting an overlapping area between one first electrode 210 and one third electrode 230. Alternatively, according to one or more embodiments of the present disclosure, one first electrode 210 can overlap a plurality (e.g., two) of third electrodes 230. In this case, a capacitance (or coupling capacitance) between one first electrode 210 and the plurality of third electrodes 230 can be adjusted by adjusting an overlapping area between one first electrode 210 and the plurality of third electrodes 230.

[0176] Although FIG. 7 An example in which the third electrodes 230 overlap the first electrodes 210 in a one-to-one manner is shown, but this is illustrative, and embodiments are not limited thereto. For example, one third electrode 230 can overlap a plurality of first electrodes 210.

[0177] In one or more embodiments, each of the third electrodes 230 can extend in the first direction DR1, and the third electrodes 230 can be arranged to be spaced apart from each other in the second direction DR2. In this case, one third electrode 230 can at least partially overlap one second electrode 220 (or a plurality of second electrodes 220). According to one or more embodiments of the present disclosure, a capacitance (or coupling capacitance) between one second electrode 220 and one third electrode 230 (or a plurality of third electrodes 230) can be adjusted by adjusting an overlapping area between one second electrode 220 and one third electrode 230 (or a plurality of third electrodes 230).

[0178] In one or more embodiments of the present disclosure, at least some of the third electrodes 230 can be connected in parallel. FIG. 7 An example in which two third electrodes 230 are connected in parallel to form a third electrode group 230pc and three third electrode groups 230pc can be arranged in the first direction DR1 is shown. However, the number of third electrodes 230 constituting the third electrode group 230pc is not limited thereto. For example, one third electrode group 230pc can include only one third electrode 230, or can include three or more third electrodes 230.

[0179] As the number of third electrodes 230 included in the third electrode group 230pc and connected in parallel increases, the resistance of the third electrode group 230pc can decrease, and power efficiency and sensing sensitivity can be improved. Conversely, as the number of third electrodes 230 included in the third electrode group 230pc decreases, the annular coil pattern formed using the third electrode group 230pc can be implemented in a more diverse form.

[0180] The sensor layer 200 can further include a plurality of first traces 210t located in the peripheral area 200NA, a plurality of first pads PD1 connected to the first traces 210t in a one-to-one correspondence, a plurality of second traces 220t, and a plurality of second pads PD2 connected to the second traces 220t in a one-to-one correspondence. The first traces 210t can be electrically connected to the first electrodes 210 in a one-to-one correspondence. The second traces 220t can be electrically connected to the second electrodes 220 in a one-to-one correspondence.

[0181] The sensor layer 200 can further include a third trace 230rt1 located in the peripheral area 200NA, a plurality of third pads PD3 connected to one end and the opposite end of the third trace 230rt1, a fourth trace 230rt2, and a fourth pad PD4 connected to the fourth trace 230rt2 in a one-to-one correspondence.

[0182] The third trace 230rt1 can be electrically connected to the third electrodes 230. In one or more embodiments of the disclosure, the third trace 230rt1 can be electrically connected to all of the third electrodes 230. The third trace 230rt1 can include a first line portion 231t extending in the first direction DR1 and electrically connected to the third electrodes 230, a second line portion 232t extending from a first end of the first line portion 231t in a direction opposite to the second direction DR2, and a third line portion 233t extending from a second end of the first line portion 231t in a direction opposite to the second direction DR2.

[0183] In one or more embodiments of the disclosure, each of the resistance of the second line portion 232t and the resistance of the third line portion 233t can be substantially the same as the resistance of one of the third electrodes 230. Accordingly, the second line portion 232t and the third line portion 233t can function as the third electrodes 230, and the same effect as placing the third electrodes 230 in the peripheral area 200NA can be obtained. For example, one of the second line portion 232t and the third line portion 233t and one of the third electrodes 230 can form a coil. Accordingly, a pen located in an area adjacent to the peripheral area 200NA can also be sufficiently charged by a loop including the second line portion 232t or the third line portion 233t.

[0184] In one or more embodiments of the present disclosure, the widths of the second line portions 232t and the third line portions 233t in the first direction DR1 can be adjusted to adjust the resistance of the second line portions 232t and the resistance of the third line portions 233t. However, this is merely illustrative, and the first line portions 231t, the second line portions 232t, and the third line portions 233t can have substantially the same width.

[0185] The fourth traces 230rt2 can be connected to the third electrode groups 230pc in a one-to-one corresponding manner. That is, the number of the fourth traces 230rt2 can correspond to the number of the third electrode groups 230pc. In FIG. 7 In the drawings, three fourth traces 230rt2 and three third electrode groups 230pc are shown as an example.

[0186] In one or more embodiments of the present disclosure, the fourth traces 230rt2 and the fourth pads PD4 can be omitted, and a charging driving mode for charging a pen can be omitted. In this case, the sensor layer 200 can sense an input of an active pen capable of emitting a magnetic field even without a magnetic field being provided from the sensor layer 200.

[0187] FIG. 8A FIG. 20 is an enlarged plan view illustrating a portion of the sensing area 200A according to one or more embodiments of the present disclosure. FIG. 8B FIG. 21 is a plan view illustrating the first conductive layer 202 of a portion of the sensing area 200A according to one or more embodiments of the present disclosure. FIG. 8C FIG. 22 is a plan view illustrating the second conductive layer 204 of a portion of the sensing area 200A according to one or more embodiments of the present disclosure. FIG. 8D FIG. 23 is a cross-sectional view of the sensor layer 200 taken along the line I-I' shown in FIG. 20, according to one or more embodiments of the present disclosure. FIG. 8A FIG. 24 is a plan view of the area AA' shown in FIG. 20. FIG. 9A FIG. 25 is an enlarged plan view of the area AA' shown in FIG. 20. FIG. 8C FIG. 26 is an enlarged plan view of the area BB' shown in FIG. 20. FIG. 9B FIG. 27 is an enlarged plan view of the area BB' shown in FIG. 20. FIG. 8B FIG. 28 is an enlarged plan view of the area BB' shown in FIG. 20.

[0188] FIG. 8A to FIG. 8C FIG. 29 is an enlarged view illustrating a portion of two first electrodes 210 and two second electrodes 220 crossing each other, and a portion of three third electrodes 230 overlapping the two second electrodes 220.

[0189] Referring to FIG. 30, FIG. 8A to FIG. 8DEach of the first electrodes 210 can include first sensing patterns 211 and first bridge patterns 212. In one first electrode 210, the first sensing patterns 211 can be arranged in the second direction DR2, and each of the first bridge patterns 212 can be located between the first sensing patterns 211 to connect adjacent first sensing patterns 211. The first bridge patterns 212 can extend in the second direction DR2. The first sensing patterns 211 and the first bridge patterns 212 can form an integral shape (e.g., can be integrally formed) with respect to one first electrode 210. In the case of the first sensing patterns 211 and the first bridge patterns 212 forming an integral shape, the first sensing patterns 211 can be referred to as first sensing portions or first sensing parts, and the first bridge patterns 212 can be referred to as first bridge portions, first bridge parts, first connection portions, or first connection parts.

[0190] Each of the second electrodes 220 can include second sensing patterns 221 and second bridge patterns 222. In one second electrode 220, the second sensing patterns 221 can be arranged in the first direction DR1, and each of the second bridge patterns 222 can connect adjacent second sensing patterns 221. The second sensing patterns 221 and the second bridge patterns 222 can be electrically connected to each other through the contact holes CNa. Each of the second bridge patterns 222 can extend in the first direction DR1. The second sensing patterns 221 and the second bridge patterns 222 can be located on different layers with respect to one second electrode 220 so as to be spaced apart from each other.

[0191] The first electrodes 210 can be located on the same layer as the second sensing patterns 221. For example, the second sensing patterns 221 adjacent to each other in the first direction DR1 can be spaced apart from each other, and one first electrode 210 can be between the second sensing patterns 221 adjacent to each other. The second bridge patterns 222 can be located on a layer different from the layer on which the first electrodes 210 are located. The second bridge patterns 222 can be insulated from the first electrodes 210, and can cross the first electrodes 210.

[0192] The third electrodes 230 can be located on the same layer as the second bridge patterns 222. Each of the third electrodes 230 can extend in the same direction as the extension direction of the second bridge patterns 222. The third electrodes 230 can extend in the same direction as the arrangement direction of the second sensing patterns 221 or the extension direction of the second electrodes 220. The third electrodes 230 can extend in the first direction DR1. The extension direction of the third electrodes 230 can be the same as the extension direction of the bridge patterns located on the same layer, the arrangement direction of the sensing patterns connected by the bridge patterns located on the same layer, or the extension direction of the electrode including the bridge patterns located on the same layer.

[0193] The third electrodes 230 can be spaced apart from the second bridge patterns 222. The third electrodes 230 can alternate with the second bridge patterns 222 of the second electrodes 220 in the second direction DR2. The second bridge patterns 222 included in one second electrode 220 can be located between the third electrodes 230 adjacent to each other in the second direction DR2. In other words, the second bridge patterns 222 arranged in the first direction DR1 can be located between the third electrodes 230 adjacent to each other in the second direction DR2. The outer edges of the second bridge patterns 222 and the third electrodes 230 adjacent to each other can face each other. In other words, portions of the outer edges of the second bridge patterns 222 and portions of the outer edges of the third electrodes 230 adjacent to each other can face each other.

[0194] Each of the third electrodes 230 can have a bar shape extending in one direction. When the shape of the electrode is close to a bar shape, a resistance path can be shortened. Accordingly, the resistance of the third electrode 230 can decrease as the resistance path of the third electrode 230 is shortened. Accordingly, the pen sensing sensitivity of the sensor layer 200 can be improved.

[0195] Each of the third electrodes 230 can extend in the same direction as the extending direction of the bridge pattern located on the same layer. Accordingly, the third electrode 230 can be designed to have a wide width while having a bar shape. That is, a space in which the third electrode 230 of the bar shape can have an increased width or a maximum width can be provided. Unlike one or more embodiments, when each of the third electrodes extends in a direction perpendicular to the extending direction of the bridge pattern located on the same layer, the width of the third electrode can be relatively narrow due to the length of the bridge pattern in the extending direction.

[0196] One third electrode 230 can overlap each of the sensing patterns included in the first electrodes 210 or the second electrodes 220 having the same extending direction. In one or more embodiments, a portion of one third electrode 230 can overlap a portion of each of the second sensing patterns 221 included in one second electrode 220, and another portion of one third electrode 230 can overlap a portion of each of the second sensing patterns 221 included in another second electrode 220. That is, one third electrode 230 can overlap portions of two second electrodes 220. A portion of each of the second sensing patterns 221 included in one second electrode 220 can overlap a portion of one third electrode 230, and another portion of each of the second sensing patterns 221 included in one second electrode 220 can overlap a portion of another third electrode 230. That is, one second electrode 220 can overlap portions of two third electrodes 230.

[0197] The two third electrodes 230 spaced apart from each other can be included in one sensing unit SU in which one of the first electrodes 210 and one of the second electrodes 220 cross each other. One third electrode 230 can be commonly included in the sensing units SU adjacent to each other in a direction perpendicular to an extension direction of the third electrode 230 (for example, in the second direction DR2).

[0198] Referring to FIG. 8A , FIG. 8B and FIG. 8D , the second bridge pattern 222 of the second electrode 220 and the third electrode 230 can be located on the same layer and can include the same material. For example, the second bridge pattern 222 and the third electrode 230 can be included in the first conductive layer 202.

[0199] Referring to FIG. 8A , FIG. 8C and FIG. 8D , the first sensing pattern 211 and the first bridge pattern 212 of the first electrode 210 and the second sensing pattern 221 of the second electrode 220 can be located on the same layer and can include the same material. For example, the first electrode 210 and the second sensing pattern 221 can be included in the second conductive layer 204. The second sensing pattern 221 and the second bridge pattern 222 can be electrically connected to each other through the contact hole CNa defined in the middle insulating layer 203.

[0200] The first sensing pattern 211 and the second sensing pattern 221 can be located above the third electrode 230. Since the first sensing pattern 211 and the second sensing pattern 221 that sense a capacitance in the first mode are located in the upper conductive layer (that is, the second conductive layer 204), a capacitance can be easily formed with the first input 2000 (refer to FIG. 5 ) such as a touch input, and the sensing sensitivity of the first input can also be improved. The third electrode 230 that induces or senses electromagnetic induction in the second mode can be located in the lower conductive layer (that is, the first conductive layer 202) different from the conductive layer in which the first sensing pattern 211 and the second sensing pattern 221 are located, and thus most of the lower conductive layer can be used to place the third electrode 230. Accordingly, a design for reducing or minimizing the resistance of the third electrode 230 can be performed, and the sensing sensitivity of the second input can be further improved.

[0201] Referring to FIG. 8B , FIG. 8C , FIG. 9A and FIG. 9BThe first electrode 210, the second electrode 220, and the third electrode 230 can each have a mesh structure. The mesh structure can include a plurality of mesh lines. Each of the plurality of mesh lines can have a shape extending in a certain direction. The plurality of mesh lines can be connected to each other. The shape can have various shapes such as a straight line, a line with a protrusion, and a line that is not flat. An opening surrounded at least partially by the mesh lines can be defined (or provided or formed) in the mesh structure. The opening can overlap the emission area PXA (refer to FIG. 6A ), and the mesh lines can overlap the non-emission area NPXA (refer to FIG. 6A ). However, the present disclosure is not particularly limited thereto.

[0202] FIG. 9A and FIG. 9B shows an example in which the mesh structure includes mesh lines extending in a first cross direction CDR1 crossing the first direction DR1 and the second direction DR2 and mesh lines extending in a second cross direction CDR2 crossing the first cross direction CDR1. However, the extending directions of the mesh lines constituting the mesh structure are not particularly limited to those shown in FIG. 9A and FIG. 9B . For example, the mesh structure can include only mesh lines extending in the first direction DR1 and the second direction DR2, or can include mesh lines extending in the first direction DR1, the second direction DR2, the first cross direction CDR1, and the second cross direction CDR2. That is, the mesh structure can be modified in various forms.

[0203] Meanwhile, in FIG. 8A to FIG. 8C , the boundaries between the components are briefly shown by lines. That is, the lines shown in FIG. 8A to FIG. 8C can be understood to correspond to cutting lines along which the mesh structures shown in FIG. 9A and FIG. 9B are cut, and in FIG. 9A and FIG. 9B , the cutting lines are shown by dotted lines. Furthermore, even in the drawings to be described below, the boundaries between the components are briefly shown by lines. That is, the lines shown in the drawings to be described below can be understood to correspond to cutting lines along which the mesh structures shown in FIG. 9A and FIG. 9B are cut.

[0204] FIG. 10A is a plan view showing a portion of the sensing area 200Aa according to one or more embodiments of the present disclosure. FIG. 10B is a plan view showing a portion of the sensing area 200Aa according to one or more embodiments of the present disclosure. FIG. 10Cis a plan view illustrating a second conductive layer 204 a of a portion of a sensing region 200Aa according to one or more embodiments of the present disclosure.

[0205] FIG. 10A to FIG. 10C 1 is an enlarged view showing portions of two first electrodes 210 a and two second electrodes 220 a crossing each other, and portions of three third electrodes 230 a overlapping the two first electrodes 210 a .

[0206] refer to FIG. 10A to FIG. 10C Each of the first electrodes 210a may include a first sensing pattern 211a and a first bridge pattern 212a. The first sensing pattern 211a and the first bridge pattern 212a may be electrically connected to each other through a contact hole CNa. For each first electrode 210a, the first sensing pattern 211a and the first bridge pattern 212a may be located on different layers so as to be spaced apart from each other.

[0207] Each of the second electrodes 220a may include a second sensing pattern 221a and a second bridge pattern 222a. For each second electrode 220a, the second sensing pattern 221a and the second bridge pattern 222a may form a single unit (e.g., may be integrally formed). When the second sensing pattern 221a and the second bridge pattern 222a form a single unit, the second sensing pattern 221a may be referred to as a second sensing portion or a second sensing part, and the second bridge pattern 222a may be referred to as a second bridge portion, a second bridge portion, a second connecting portion, or a second connecting portion.

[0208] The second electrode 220a may be located on the same layer as the first sensing pattern 211a. For example, first sensing patterns 211a adjacent to each other in the second direction DR2 may be spaced apart from each other, with one second electrode 220a located between adjacent first sensing patterns 211a. The first bridge pattern 212a may be located on a layer different from the layer on which the second electrode 220a is located. The first bridge pattern 212a may be insulated from the second electrode 220a and may intersect the second electrode 220a.

[0209] The third electrode 230a may be located on the same layer as the first bridge pattern 212a. Each of the third electrodes 230a may extend in the same direction as the first bridge pattern 212a. The third electrode 230a may extend in the same direction as the arrangement direction of the first sensing pattern 211a or the extension direction of the first electrode 210a. The third electrode 230a may extend in the second direction DR2. The extension direction of the third electrode 230a may be the same as the extension direction of the bridge pattern located on the same layer, the arrangement direction of the sensing patterns connected by the bridge pattern located on the same layer, or the extension direction of the electrode including the bridge pattern located on the same layer.

[0210] The third electrode 230a can be spaced apart from the first bridge pattern 212a. The third electrode 230a can alternate with the first bridge pattern 212a of the first electrode 210a in the first direction DR1. The first bridge pattern 212a included in one first electrode 210a can be located between the third electrodes 230a adjacent to each other in the first direction DR1. In other words, the first bridge pattern 212a arranged in the second direction DR2 can be located between the third electrodes 230a adjacent to each other in the first direction DR1. The outer edges of the first bridge pattern 212a and the third electrode 230a adjacent to each other can face each other. In other words, portions of the outer edges of the first bridge pattern 212a and the third electrode 230a adjacent to each other can face each other.

[0211] Each of the third electrodes 230a can have a bar shape extending in one direction. When the shape of the electrode approaches a bar shape, the resistance path can be shortened. Accordingly, the resistance of the third electrode 230a can decrease as the resistance path of the third electrode 230a is shortened. Accordingly, the pen sensing sensitivity of the sensor layer 200a can be improved.

[0212] Each of the third electrodes 230a can extend in the same direction as the extension direction of the bridge pattern located on the same layer. Accordingly, the third electrode 230a can be relatively wide while having a bar shape. That is, a space in which the third electrode 230a of the bar shape can have an increased width or a maximum width can be provided.

[0213] In one or more embodiments, a portion of one third electrode 230a can overlap with a portion of each of the first sensing patterns 211a included in one first electrode 210a, and another portion of one third electrode 230a can overlap with a portion of each of the first sensing patterns 211a included in another first electrode 210a. That is, one third electrode 230a can overlap with portions of two first electrodes 210a. A portion of each of the first sensing patterns 211a included in one first electrode 210a can overlap with a portion of one third electrode 230a, and another portion of each of the first sensing patterns 211a included in one first electrode 210a can overlap with a portion of another third electrode 230a. That is, one first electrode 210a can overlap with portions of two third electrodes 230a.

[0214] The first bridge pattern 212a of the first electrode 210a and the third electrode 230a can be located on the same layer and can include the same material. For example, the first bridge pattern 212a and the third electrode 230a can be included in the first conductive layer 202a.

[0215] The first sensing pattern 211a of the first electrode 210a and the second sensing pattern 221a and the second bridge pattern 222a of the second electrode 220a can be located on the same layer and can include the same material. For example, the first sensing pattern 211a and the second electrode 220a can be included in the second conductive layer 204a. The first sensing pattern 211a and the first bridge pattern 212a can be electrically connected to each other through the contact hole CNa defined in the middle insulating layer 203.

[0216] FIG. 11A FIG. 21B is a plan view illustrating a portion of the sensing area 200Ab according to an embodiment of the present disclosure. FIG. 11B FIG. 22B is a plan view illustrating the first conductive layer 202b of a portion of the sensing area 200Ab according to an embodiment of the present disclosure.

[0217] FIG. 11A and FIG. 11B FIG. 23B is a magnified view illustrating a portion of two first electrodes 210a and two second electrodes 220a crossing each other and a portion of two third electrodes 230b overlapping the two first electrodes 210a.

[0218] Referring to FIG. 10C , FIG. 11A and FIG. 11B Each of the first electrodes 210a can include the first sensing pattern 211a and the first bridge pattern 212a. The first sensing pattern 211a and the first bridge pattern 212a can be electrically connected to each other through the contact hole CNa. Each of the second electrodes 220a can include the second sensing pattern 221a and the second bridge pattern 222a. The second sensing pattern 221a and the second bridge pattern 222a can form an integral shape (e.g., can be integrally formed) with respect to one second electrode 220a.

[0219] The third electrodes 230b can be located on the same layer as the first bridge patterns 212a. Each of the third electrodes 230b can extend in the same direction as the extension direction of the first bridge patterns 212a. The third electrodes 230b can extend in the second direction DR2.

[0220] The hole 230-h can be defined in each of the third electrodes 230b. Each of the first bridge patterns 212a can be located in the corresponding hole 230-h and can be insulated from the third electrodes 230b. The first bridge pattern 212a can be surrounded by the corresponding hole 230-h. The outer edge of the first bridge pattern 212a can face the inner edge of the third electrode 230b defining the corresponding hole 230-h.

[0221] One third electrode 230b can overlap one first electrode 210a. The third electrode 230b can overlap the first electrode 210a in a one-to-one correspondence.

[0222] In one or more embodiments, the third electrode 230b can be used to supplement a signal transmitted from the first electrode 210a to the sensor driver 200C (refer to FIG. 2) in the second direction DR2. In this case, when the phase of a signal induced in the third electrode 230b coincides with the phase of a signal induced in the first electrode 210a, the greatest effect can be obtained. Accordingly, the center of the first electrode 210a in the second direction DR2 can overlap the center of the third electrode 230b in the second direction DR2. Also, the center of the first electrode 210a in the first direction DR1 can overlap the center of the third electrode 230b in the first direction DR1. However, embodiments are not limited thereto. FIG. 5

[0223] FIG. 12A FIG. 21 is a plan view illustrating a portion of a sensing area 200Ac according to one or more embodiments of the present disclosure. FIG. 12B FIG. 22 is a plan view illustrating a second conductive layer 204c of a portion of the sensing area 200Ac according to one or more embodiments of the present disclosure.

[0224] FIG. 12A FIG. 23 is a plan view illustrating a portion of two first electrodes 210c and two second electrodes 220c crossing each other and a portion of three third electrodes 230c overlapping the two first electrodes 210c. FIG. 12B Referring to

[0225] FIG. 12A , FIG. 12B , each of the first electrodes 210c can include a first sensing pattern 211c and a first bridge pattern 212c. The first sensing pattern 211c and the first bridge pattern 212c can form an integral shape (e.g., can be integrally formed) with respect to one first electrode 210c.

[0226] ​​Each of the first bridge patterns 212c can have a curved shape. For example, the first bridge pattern 212c can include a first line portion L1, a second line portion L2, and a third line portion L3. When one first bridge pattern 212c connects one first sensing pattern 211c and another first sensing pattern 211c adjacent to each other, the first line portion L1 can be a portion extending in a direction from a side of the one first sensing pattern 211c toward the another first sensing pattern 211c (e.g., in a direction opposite to the second direction DR2). The third line portion L3 can be a portion extending in a direction from a side of the another first sensing pattern 211c toward the one first sensing pattern 211c (e.g., in the second direction DR2). The second line portion L2 can be a portion connecting the first line portion L1 and the third line portion L3 and extending in the first direction DR1. A recess or indentation (hereinafter referred to as a first recess) can be provided in the first electrode 210c by the one first sensing pattern 211c and the first line portion L1 and the second line portion L2. A recess or indentation (hereinafter referred to as a second recess) can be provided in the first electrode 210c by the another first sensing pattern 211c and the second line portion L2 and the third line portion L3.

[0227] Each of the second electrodes 220c can include a second sensing pattern 221c and a second bridge pattern 222c. The second sensing pattern 221c and the second bridge pattern 222c can be electrically connected to each other by a contact hole CNa.

[0228] Each of the second sensing patterns 221c can include a first protrusion X1 and a second protrusion X2. Each of the first protrusion X1 and the second protrusion X2 can extend in the first direction DR1. The first protrusion X1 can be located on a side of the second sensing pattern 221c in the first direction DR1, and the second protrusion X2 can be located on an opposite side of the second sensing pattern 221c in the first direction DR1. The first protrusion X1 can be located in the first recess of the adjacent first electrode 210c. The second protrusion X2 can be located in the second recess of the adjacent first electrode 210c. The second bridge pattern 222c is connected to the second protrusion X2 of one of the second sensing patterns 221c and to the first protrusion X1 of another of the second sensing patterns 221c.

[0229] Because each of the second sensing patterns 221c includes a first protrusion X1 and a second protrusion X2, each of the second bridge patterns 222c can extend in the second direction DR2. That is, for each second electrode 220c, each of the second bridge patterns 222c can extend in a direction perpendicular to the arrangement direction of the second sensing patterns 221c. Therefore, each of the third electrodes 230c can extend in the second direction DR2, which is the same direction as the extension direction of the second bridge pattern 222c. The third electrode 230c can have a stripe shape extending in the second direction DR2.

[0230] The extension direction of each of the third electrodes 230c may be the same as the extension direction of the bridge pattern located on the same layer, but may be perpendicular to the arrangement direction of the sensing patterns connected by the bridge pattern located on the same layer or the extension direction of the electrodes including the bridge pattern located on the same layer. Alternatively, the third electrode 230c may extend in the same direction as the arrangement direction of the first sensing patterns 211c.

[0231] A portion of one third electrode 230c may overlap with a portion of each of the first sensing patterns 211c included in one first electrode 210c, and another portion of one third electrode 230c may overlap with a portion of each of the first sensing patterns 211c included in another first electrode 210c.

[0232] FIG. 13A FIG. 2 is a diagram showing a sensing area 200A (refer to FIG. 2 ) according to one or more embodiments of the present disclosure. FIG. 8A ) is a plan view of a portion of the first conductive layer 202d. FIG. 13B yes FIG. 13A An enlarged plan view of the region CC' is shown in FIG.

[0233] refer to FIG. 13A and FIG. 8A , the first conductive layer 202d may include a second electrode 220 (refer to FIG. 13B ) and the third electrodes 230. Each of the second bridge patterns 222 may extend in the first direction DR1. Each of the third electrodes 230 may extend in the first direction DR1, which is the same direction as the extension direction of the second bridge pattern 222.

[0234] The first conductive layer 202d may further include dummy patterns DMP. Each of the dummy patterns DMP may be floating or electrically floating. The dummy patterns DMP may be located between the third electrodes 230 adjacent to each other in the second direction DR2. In addition, the dummy patterns DMP may be located between the second bridge patterns 222 adjacent to each other in the first direction DR1.

[0235] According to one or more embodiments of the present disclosure, a dummy pattern DMP can be disposed in spaces in which electrodes are not located in the first conductive layer 202d. As shown in FIG. 21A, the dummy pattern DMP can be disposed in spaces in which the first electrodes 210 (see FIG. 20A) are not located in the first conductive layer 202d. FIG. 8A As shown in FIG. 21B, the dummy pattern DMP can also have a mesh structure. Thus, mesh lines can be located entirely in the sensing area 200A (see FIG. 20A), and thus the probability that the pattern will be visually recognized due to reflection of external light can be reduced. That is, an electronic device 1000 (see FIG. 20A) in which visibility according to reflection of external light is improved can be provided. FIG. 1A FIG. 8C

[0236] Meanwhile, according to one or more embodiments of the present disclosure, the second conductive layer 204 (see FIG. 20A) can also include a dummy pattern. That is, a dummy pattern can be disposed in spaces in which electrodes are not located in the second conductive layer 204 (see FIG. 20A). For example, the dummy pattern can be located between the first electrodes 210 (see FIG. 20A) and the second sensing pattern 221 (see FIG. 20A) adjacent to each other. FIG. 8C FIG. 8C FIG. 8C FIG. 14

[0237] FIG. 8A FIG. 22 is a plan view illustrating a portion of the first conductive layer 202e according to one or more embodiments of the present disclosure. FIG. 14 Referring to FIG. 22, the first conductive layer 202e can include the second bridge pattern 222 of the second electrode 220 (see FIG. 20A) and third electrodes 230e. Each of the second bridge pattern 222 can extend in the first direction DR1. Each of the third electrodes 230e can extend in the first direction DR1, which is the same direction as the extension direction of the second bridge pattern 222.

[0238] FIG. 8A FIG. 15A Recesses 230-r (or recessed portions) can be defined in the third electrodes 230e, respectively. Each of the recesses 230-r can be a portion that is recessed or indented in a direction perpendicular to the extension direction of the second bridge pattern 222 (e.g., in the second direction DR2). The recesses 230-r defined in the third electrodes 230e adjacent to each other in the second direction DR2 can face each other, and can provide spaces in which each of the second bridge patterns 222 is located. That is, at least a portion of each of the second bridge patterns 222 can be located in the recesses 230-r of the third electrodes 230e facing each other.

[0239]

[0240] FIG. 15B FIG. 23 is a schematic view illustrating one channel according to one or more embodiments of the present disclosure.​​​​​​​​​FIG. 7 is an equivalent circuit diagram showing a relationship between one channel and a pen according to one or more embodiments of the present disclosure.

[0241] Referring to FIG. 15A , FIG. 15B and FIG. 15A , the first electrode 210 and the third electrode 230 overlapping the first electrode 210 are shown when viewed in the third direction DR3. In FIG. 15B and FIG. 16A , one first electrode 210 and one third electrode 230 are schematically shown as at least partially overlapping each other.

[0242] One end of the third electrode 230 can be floating, and the opposite end of the third electrode 230 can be grounded. For example, the opposite end of the third electrode 230 can be electrically connected to the third trace 230rt1, and the third trace 230rt1 can be grounded. However, the present disclosure is not particularly limited thereto. For example, the third trace 230rt1 can be grounded through a bias capacitor.

[0243] Capacitors Cbc1, Cbc2, Cbc3, and Cbc4 can be defined in the first electrode 210. The capacitors Cbc1, Cbc2, Cbc3, and Cbc4 can be referred to as a parasitic capacitor or a base capacitor. According to one or more embodiments of the present disclosure, the capacitors Cbc1, Cbc2, Cbc3, and Cbc4 can also serve to increase the strength of a signal.

[0244] When the pen PN is closely approached to the first electrode 210, a first induced electromotive force Vs(t) and a second induced electromotive force Va(t) can be respectively generated in the first electrode 210 and the third electrode 230 by a magnetic field generated by the pen PN. A first induced current IN-M and a third induced current IN-B can be generated from the first induced electromotive force Vs(t), and a second induced current IN-A can be generated from the second induced electromotive force Va(t). Accordingly, the total induced current IN input to the input terminal IT can correspond to the sum of the first induced current IN-M, the second induced current IN-A, and the third induced current IN-B.

[0245] For example, it is assumed that the capacitance of each of the capacitors Cbc1, Cbc2, Cbc3, and Cbc4 is Cb, and the capacitance of each of the first coupling capacitors Ccp11, Ccp12, Ccp13, and Ccp14 is Cc.

[0246] The first induced current IN-M varying with time can be represented by the following equation.

[0247]

[0248] The second time-varying induced current IN-A can be represented by the following equation.

[0249]

[0250] The third time-varying induced current IN-B can be represented by the following equation.

[0251]

[0252] FIG. 16B is a graph depicting the intensity of the current according to the position of the pen with respect to a channel. FIG. 15A is a graph depicting the intensity of the signal according to the position of the pen with respect to a channel.

[0253] Referring to FIG. 15B , FIG. 16A and FIG. 15A , the opposite end of the capacitor among the capacitors Cbc1, Cbc2, Cbc3, and Cbc4, which is located between the input terminal IT and the pen PN, can be all grounded, and thus the current can not flow. Accordingly, when the position of the pen PN is moved from the first point PP1 to the second point PP2, the first induced current IN-M can gradually decrease. In addition, the second induced current IN-A can gradually increase, and the third induced current IN-B can gradually decrease.

[0254] Referring to FIG. 15B , FIG. 16B and FIG. 17 , when the position of the pen PN is moved from the first point PP1 to the second point PP2, the total induced current IN can gradually decrease. However, as described above, the total induced current IN can correspond to the sum of the first induced current IN-M, the second induced current IN-A, and the third induced current IN-B, and the intensity of the total induced current IN at the second point PP2 can be ensured to be greater than or equal to a certain value.

[0255] FIG. 17 is a plan view of a sensor layer 200-1 according to one or more embodiments of the disclosure.

[0256] Referring to FIG. 7 , in the sensor layer 200-1, a sensing area 200A-1 and a peripheral area 200NA-1 adjacent to the sensing area 200A-1 can be defined.

[0257] The sensor layer 200-1 can include a plurality of first electrodes 210-1, a plurality of second electrodes 220-1, a plurality of third electrodes 230-1, and a plurality of fourth electrodes 240-1 located in the sensing area 200A-1. That is, when referring to the above FIG. 17The sensor layer 200 described above can further include fourth electrodes 240 in the sensor layer 200-1. The sensing unit SU-1 of the sensor layer 200-1 can be an area in which one of the first electrodes 210-1 and one of the second electrodes 220-1 cross each other.

[0258] The fourth electrodes 240 can be arranged in the second direction DR2. Each of the fourth electrodes 240 can extend in the first direction DR1. One of the fourth electrodes 240 can at least partially overlap one of the second electrodes 220-1. According to one or more embodiments of the disclosure, a capacitance (or coupling capacitance) between one of the second electrodes 220-1 and one of the fourth electrodes 240 can be adjusted by adjusting an overlapping area between one of the second electrodes 220-1 and one of the fourth electrodes 240. Optionally, according to one or more embodiments of the disclosure, one of the second electrodes 220-1 can overlap a plurality (e.g., two) of the fourth electrodes 240. In this case, a capacitance (or coupling capacitance) between one of the second electrodes 220-1 and the plurality of the fourth electrodes 240 can be adjusted by adjusting an overlapping area between one of the second electrodes 220-1 and the plurality of the fourth electrodes 240.

[0259] Although FIG. 17 An example in which the third electrodes 230-1 overlap the first electrodes 210-1 in a one-to-one manner and the fourth electrodes 240 overlap the second electrodes 220-1 in a one-to-one manner is shown, but this is illustrative, and embodiments are not limited thereto. For example, one of the third electrodes 230-1 can overlap a plurality of the first electrodes 210-1. Optionally, one of the fourth electrodes 240 can overlap a plurality of the second electrodes 220-1.

[0260] In one or more embodiments of the disclosure, at least some of the fourth electrodes 240 can be electrically connected to form one fourth electrode group 240pc. FIG. 17 An example in which five of the fourth electrodes 240 are connected to the same trace to form one fourth electrode group 240pc is shown. Thus, in FIG. 7 In the above-described embodiment, two fourth electrode groups 240pc are shown to be arranged in the second direction DR2. However, the number of the fourth electrodes 240 constituting one fourth electrode group 240pc is not limited thereto. For example, the number of the fourth electrodes 240 constituting one fourth electrode group 240pc can be 10, and in this case, the sensor layer 200-1 can include only one fourth electrode group 240pc.

[0261] The sensor layer 200-1 can further include a third trace 230rt1 in the peripheral region 200NA-1, a plurality of third pads PD3 connected to one end and an opposite end of the third trace 230rt1, a fourth trace 230rt2, fourth pads PD4 connected to the fourth trace 230rt2 in a one-to-one correspondence, a fifth trace 240t, and fifth pads PD5 connected to the fifth trace 240t in a one-to-one correspondence. That is, when compared with the above-described sensor layer 200, the sensor layer 200-1 can further include the fifth trace 240t and the fifth pads PD5 connected to the fifth trace 240t in a one-to-one correspondence. FIG. 17 The sensor layer 200-1 can further include the fifth trace 240t and the fifth pads PD5 connected to the fifth trace 240t in a one-to-one correspondence when compared with the above-described sensor layer 200.

[0262] The fifth traces 240t can be spaced apart from each other, and the sensing region 200A-1 is between the fifth traces 240t. The fifth traces 240t can be electrically connected to the fourth electrode groups 240pc in a one-to-one correspondence. FIG. 18A An example in which two fourth electrode groups 240pc are arranged and two fifth traces 240t are connected to the two fourth electrode groups 240pc, respectively, is illustrated. The fifth trace 240t connected to one fourth electrode group 240pc and the fifth trace 240t connected to the other fourth electrode group 240pc can be spaced apart from each other, and the sensing region 200A-1 is between the fifth trace 240t connected to one fourth electrode group 240pc and the fifth trace 240t connected to the other fourth electrode group 240pc. However, the present disclosure is not particularly limited thereto.

[0263] FIG. 17 is a plan view illustrating a portion of the first conductive layer 202-1 of the sensing region 200A-1 (refer to FIG. 18B ) according to one or more embodiments of the present disclosure. FIG. 17 is a plan view illustrating a portion of the second conductive layer 204-1 of the sensing region 200A-1 (refer to FIG. 18C ) according to one or more embodiments of the present disclosure. FIG. 18A is a cross-sectional view of the sensor layer 200-1 taken along the line II-II' shown in FIG. 18B and FIG. 18D according to one or more embodiments of the present disclosure. FIG. 18A is a cross-sectional view of the sensor layer 200-1 taken along the line III-III' shown in FIG. 18B and FIG. 18B according to one or more embodiments of the present disclosure.

[0264] FIG. 18A is an enlarged view illustrating a portion of the two first electrodes 210-1 and the two second electrodes 220-1 crossing each other, and FIG. 18A to FIG. 18Dis an enlarged view showing a portion of two third electrodes 230-1 and two fourth electrodes 240 crossing each other.

[0265] Referring to FIG. 18B to FIG. 18D Each of the first electrodes 210-1 can include a first sensing pattern 211-1 and a first bridge pattern 212-1. In one first electrode 210-1, the first sensing patterns 211-1 can be arranged in the second direction DR2, and each of the first bridge patterns 212-1 can be located between the first sensing patterns 211-1 to connect adjacent first sensing patterns 211-1. The first bridge patterns 212-1 can extend in the second direction DR2. The first sensing patterns 211-1 and the first bridge patterns 212-1 can form an integral shape (e.g., can be integrally formed) with respect to one first electrode 210-1.

[0266] Each of the second electrodes 220-1 can include a second sensing pattern 221-1 and a second bridge pattern 222-1. In one second electrode 220-1, the second sensing patterns 221-1 can be arranged in the first direction DR1, and each of the second bridge patterns 222-1 can connect adjacent second sensing patterns 221-1. The second sensing patterns 221-1 and the second bridge patterns 222-1 can be located on respective different layers so as to be spaced apart from each other with respect to one second electrode 220-1. The second sensing patterns 221-1 and the second bridge patterns 222-1 can be electrically connected to each other through a contact hole CNa passing through the intermediate insulating layer 203. Each of the second bridge patterns 222-1 can extend in the first direction DR1.

[0267] Each of the third electrodes 230-1 can include a third sensing pattern 231 and a third bridge pattern 232. In one third electrode 230-1, the third sensing patterns 231 can be arranged in the second direction DR2, and each of the third bridge patterns 232 can connect adjacent third sensing patterns 231. The third sensing patterns 231 and the third bridge patterns 232 can be located on different layers so as to be spaced apart from each other with respect to one third electrode 230-1. The third sensing patterns 231 and the third bridge patterns 232 can be electrically connected to each other through a contact hole CNb passing through the intermediate insulating layer 203. Each of the third bridge patterns 232 can extend in the second direction DR2.

[0268] Each of the fourth electrodes 240 can include a fourth sensing pattern 241 and a fourth bridge pattern 242. In one fourth electrode 240, the fourth sensing patterns 241 can be arranged in the first direction DR1, and each of the fourth bridge patterns 242 can be located between the fourth sensing patterns 241 to connect adjacent fourth sensing patterns 241. The fourth bridge patterns 242 can extend in the first direction DR1. The fourth sensing patterns 241 and the fourth bridge patterns 242 can form an integral shape (e.g., can be integrally formed) with respect to one fourth electrode 240. The pen sensing electrodes can include first and second pen sensing electrodes. The third electrode 230-1 can be referred to as the first pen sensing electrode, and the fourth electrode 240 can be referred to as the second pen sensing electrode. Optionally, the auxiliary electrodes can include first and second auxiliary electrodes. The third electrode 230-1 can be referred to as the first auxiliary electrode, and the fourth electrode 240 can be referred to as the second auxiliary electrode.

[0269] As shown in FIG. 21, the first electrode 210-1 and the second sensing pattern 221-1 can be located on the same layer. Also, the third bridge pattern 232 can be located on the same layer as the first electrode 210-1 and the second sensing pattern 221-1. For example, the first electrode 210-1, the second sensing pattern 221-1, and the third bridge pattern 232 can be included in the second conductive layer 204-1. FIG. 18A Each of the third bridge patterns 232 can extend in the same direction as an extension direction of the first bridge pattern 212-1. The third bridge pattern 232 can extend in the same direction as an arrangement direction of the first sensing pattern 211-1 in one first electrode 210-1 or in an extension direction of one first electrode 210-1.

[0270] The third bridge pattern 232 can be spaced apart from and insulated from the first electrode 210-1 and the second sensing pattern 221-1. The outer edges of the third bridge pattern 232 and the first electrode 210-1 adjacent to each other can face each other. In other words, portions of the outer edges of the third bridge pattern 232 and the first electrode 210-1 adjacent to each other can face each other.

[0271]

[0272] ​In one or more embodiments, each of the third bridge patterns 232 can extend in parallel to the corresponding first bridge pattern 212-1. For example, the third bridge pattern 232 can be spaced apart from the corresponding first bridge pattern 212-1 in the first direction DR1 and can be located between two first sensing patterns 211-1 connected by the corresponding first bridge pattern 212-1. Accordingly, other types of bridge patterns located in the same layer and extending in the same direction (that is, the first bridge pattern 212-1 and the third bridge pattern 232) can be positioned such that the outer edges face each other. In order to provide a space in which the third bridge pattern 232 is located, a hole can not be formed in the first bridge pattern 212-1 (or the first electrode 210-1), and an increase in the resistance of the first electrode 210-1 can be reduced or minimized.

[0273] In one or more embodiments, recesses (or recessed portions) can be defined in the first sensing patterns 211-1, respectively. Each of the recesses in the first sensing patterns 211-1 can be a portion recessed in the extension direction of the third bridge pattern 232. The recesses defined in the first sensing patterns 211-1 adjacent to each other in the second direction DR2 can face each other and can provide a space in which each of the third bridge patterns 232 is located.

[0274] As shown in FIG. 18C , FIG. 18D and FIG. 19 , the third sensing pattern 231 and the fourth electrode 240 can be located on the same layer. In addition, the second bridge pattern 222-1 can be located on the same layer as the third sensing pattern 231 and the fourth electrode 240. For example, the second bridge pattern 222-1, the third sensing pattern 231, and the fourth electrode 240 can be included in the first conductive layer 202-1.

[0275] Each of the second bridge patterns 222-1 can extend in the same direction as the extension direction of the fourth bridge pattern 242. The second bridge pattern 222-1 can extend in the same direction as the arrangement direction of the fourth sensing pattern 241 in one fourth electrode 240 or extend in the extension direction of one fourth electrode 240.

[0276] The second bridge pattern 222-1 can be spaced apart from and can be insulated from the third sensing pattern 231 and the fourth electrode 240. The outer edges of the second bridge pattern 222-1 and the fourth electrode 240 adjacent to each other can face each other. In other words, portions of the outer edges of the second bridge pattern 222-1 and portions of the outer edges of the fourth electrode 240 adjacent to each other can face each other.

[0277] In one or more embodiments, each of the second bridge patterns 222-1 can extend in parallel to the corresponding fourth bridge pattern 242. For example, the second bridge pattern 222-1 can be spaced apart from the corresponding fourth bridge pattern 242 in the second direction DR2, and can be located between two fourth sensing patterns 241 connected by the corresponding fourth bridge pattern 242. Thus, other types of bridge patterns located in the same layer and extending in the same direction (that is, the second bridge pattern 222-1 and the fourth bridge pattern 242) can be positioned such that the outer edges face each other. In order to provide a space in which the second bridge pattern 222-1 is located, a hole can not be formed in the fourth bridge pattern 242 (or the fourth electrode 240), and an increase in the resistance of the fourth electrode 240 can be reduced or minimized.

[0278] In one or more embodiments, recesses (or recessed portions) can be defined in the fourth sensing patterns 241, respectively. Each of the recesses in the fourth sensing patterns 241 can be a portion recessed in the extension direction of the second bridge pattern 222-1. The recesses defined in the fourth sensing patterns 241 adjacent to each other in the first direction DR1 can face each other, and can provide a space in which each of the second bridge patterns 222-1 is located.

[0279] The third sensing pattern 231 in one third electrode 230-1 can overlap one first electrode 210-1. The third sensing pattern 231 in one third electrode 230-1 can overlap the first sensing pattern 211-1 in one first electrode 210-1, respectively. The third electrode 230-1 can overlap the first electrode 210-1 in a one-to-one correspondence. The term "overlap" used herein also means that at least a portion of one third electrode 230-1 overlaps at least a portion of one first electrode 210-1.

[0280] One fourth electrode 240 can overlap the second sensing pattern 221-1 in one second electrode 220-1. The fourth sensing pattern 241 in one fourth electrode 240 can overlap the second sensing pattern 221-1 in one second electrode 220-1, respectively. The fourth electrode 240 can overlap the second electrode 220-1 in a one-to-one correspondence. The term "overlap" used herein also means that at least a portion of one fourth electrode 240 overlaps at least a portion of one second electrode 220-1.

[0281] One third electrode 230-1 and one fourth electrode 240 crossing each other can be located in one sensing unit SU-1 in which one first electrode 210-1 and one second electrode 220-1 cross each other.

[0282] FIG. 17is a plan view illustrating a portion of a sensing area 200A-1 (refer to FIG. 1A) according to one or more embodiments of the present disclosure. FIG. 19 is a plan view illustrating a portion of a first conductive layer 202-1a of the sensing area 200A-1 (refer to FIG. 1A) according to one or more embodiments of the present disclosure.

[0283] Referring to FIG. 20A , the second bridge pattern 222-1a, the third sensing pattern 231, and the fourth electrode 240a can be located on the same layer and can include the same material. For example, the second bridge pattern 222-1a, the third sensing pattern 231, and the fourth electrode 240a can be included in the first conductive layer 202-1a.

[0284] Each of the fourth electrodes 240a can include a fourth sensing pattern 241a and a fourth bridge pattern 242a. The fourth sensing pattern 241a and the fourth bridge pattern 242a can form an integral shape (e.g., can be integrally formed) with respect to one fourth electrode 240a.

[0285] A hole 240-h can be defined in each of the fourth electrodes 240a. For example, the hole 240-h can be defined in each of the fourth bridge patterns 242a. Each of the second bridge patterns 222-1a can be located in the corresponding hole 240-h and can be insulated from the fourth electrodes 240a. The second bridge pattern 222-1a can be surrounded by the corresponding hole 240-h. An outer edge of the second bridge pattern 222-1a can face an inner edge of the fourth electrode 240a defining the corresponding hole 240-h.

[0286] FIG. 20B is an enlarged plan view illustrating a portion of a sensing area 200A-1b according to one or more embodiments of the present disclosure. FIG. 20C is a plan view illustrating a portion of a lower conductive layer 206b of the sensing area 200A-1b according to one or more embodiments of the present disclosure.

[0287] FIG. 20D is a plan view illustrating a portion of a first conductive layer 202-1b of the sensing area 200A-1b according to one or more embodiments of the present disclosure. FIG. 20A is a cross-sectional view of a sensor layer 200-1b taken along line IV-IV' shown in FIG. 20A to FIG. 20C is a cross-sectional view of a sensor layer 200-1b taken along line IV-IV' shown in

[0288] FIG. 20A to FIG. 20D is an enlarged view illustrating a portion of two first electrodes 210-1b and two second electrodes 220-1b crossing each other, a portion of three third electrodes 230-1b overlapping the two first electrodes 210-1b, and a portion of three fourth electrodes 240b overlapping the two second electrodes 220-1b.

[0289] Referring to FIG. 8A to FIG. 8D , each of the first electrodes 210-1b can include a first sensing pattern 211-1b and a first bridge pattern 212-1b. The first sensing pattern 211-1b and the first bridge pattern 212-1b can form an integral shape (e.g., can be integrally formed) with respect to one first electrode 210-1b. Each of the second electrodes 220-1b can include a second sensing pattern 221-1b and a second bridge pattern 222-1b. The second sensing pattern 221-1b and the second bridge pattern 222-1b can be electrically connected to each other through a contact hole CNa.

[0290] The first electrodes 210-1b and the second sensing patterns 221-1b can be located on the same layer. For example, the first electrodes 210-1b and the second sensing patterns 221-1b can be included in the second conductive layer 204-1b.

[0291] Meanwhile, the sensor layer 200-1b can include the base layer 201, a lower conductive layer 206b, a lower insulating layer 207, the first conductive layer 202-1b, the intermediate insulating layer 203, the second conductive layer 204-1b, and the cover insulating layer 205. That is, when compared with the sensor layer 200 described above with reference to FIG. 4 , the sensor layer 200-1b can further include the lower conductive layer 206b and the lower insulating layer 207. That is, the sensor layer 200-1b can include three conductive layers. The lower insulating layer 207 can be located between the base layer 201 and the intermediate insulating layer 203, and the lower conductive layer 206b can be located on the base layer 201 and can be covered by the lower insulating layer 207. Meanwhile, in some embodiments, the lower conductive layer 206b can be omitted from the sensor layer 200-1b. For example, the lower conductive layer 206b can be located under the display layer 100 (with reference to FIG. 4 ) or can be included in the display layer 100 (with reference to FIG. 21A ).

[0292] The third electrodes 230-1b can be located on a layer different from the layers on which the first electrodes 210-1b, the second electrodes 220-1b, and the fourth electrodes 240b are located. For example, the third electrodes 230-1b can be included in the lower conductive layer 206b. Each of the third electrodes 230-1b can extend in the second direction DR2. The third electrodes 230-1b can have a strip shape extending in the second direction DR2. When the third electrodes 230-1b are implemented with a separate conductive layer such as the lower conductive layer 206b, the shape of the third electrodes 230-1b can be more freely designed. For example, the third electrodes 230-1b can be more densely disposed using the lower conductive layer 206b, and in this case, the pen sensing sensitivity can be improved.

[0293] The second bridge pattern 222-1b can be located on a layer different from a layer on which the first electrode 210-1b and the second sensing pattern 221-1b are located. The second bridge pattern 222-1b can be located on the same layer as the fourth electrode 240b. For example, the second bridge pattern 222-1b and the fourth electrode 240b can be included in the first conductive layer 202-1b. Each of the second bridge patterns 222-1b can extend in the first direction DR1.

[0294] Each of the fourth electrodes 240b can extend in the same direction as an extension direction of the second bridge pattern 222-1b. The fourth electrode 240b can extend in the same direction as an arrangement direction of the second sensing pattern 221-1b or an extension direction of the second electrode 220-1b. The fourth electrode 240b can extend in the first direction DR1. The fourth electrode 240b can have a bar shape extending in the first direction DR1. The extension direction of the fourth electrode 240b can be the same as an extension direction of a bridge pattern located on the same layer, an arrangement direction of a sensing pattern connected by a bridge pattern located on the same layer, or an extension direction of an electrode including a bridge pattern located on the same layer.

[0295] The fourth electrode 240b can be spaced apart from the second bridge pattern 222-1b. The second bridge pattern 222-1b included in one second electrode 220-1b can be located between the fourth electrodes 240b adjacent to each other in the second direction DR2. In other words, the second bridge pattern 222-1b arranged in the first direction DR1 can be located between the fourth electrodes 240b adjacent to each other in the second direction DR2. The outer edges of the second bridge pattern 222-1b and the fourth electrode 240b adjacent to each other can face each other. In other words, a portion of the outer edge of the second bridge pattern 222-1b and a portion of the outer edge of the fourth electrode 240b adjacent to each other can face each other.

[0296] Each of the fourth electrodes 240b can have a bar shape extending in one direction. When the shape of the electrode approaches a bar shape, a resistance path can be shortened. Accordingly, the resistance of the fourth electrode 240b can decrease as the resistance path of the fourth electrode 240b is shortened. Accordingly, the pen sensing sensitivity of the sensor layer 200-1b can be improved.

[0297] Each of the fourth electrodes 240b can extend in the same direction as an extension direction of the bridge pattern located on the same layer. Accordingly, the fourth electrodes 240b can be designed to be relatively wide while having a bar shape. That is, a space in which the fourth electrodes 240b of the bar shape can have an increased width or a maximum width can be provided. When each of the fourth electrodes extends in a direction perpendicular to an extension direction of the bridge pattern located on the same layer, unlike one or more embodiments, the width of the fourth electrodes can be relatively narrow due to the length of the bridge pattern in the extension direction.

[0298] One third electrode 230-1b can overlap each of the sensing patterns included in the first electrodes 210-1b or the second electrodes 220-1b having the same extension direction. In one or more embodiments, a portion of one third electrode 230-1b can overlap each of the first sensing patterns 211-1b included in one first electrode 210-1b, and another portion of one third electrode 230-1b can overlap each of the first sensing patterns 211-1b included in another first electrode 210-1b. That is, one third electrode 230-1b can overlap portions of two first electrodes 210-1b. One first electrode 210-1b can overlap portions of two third electrodes 230-1b.

[0299] One fourth electrode 240b can overlap each of the sensing patterns included in the first electrodes 210-1b or the second electrodes 220-1b having the same extension direction. In one or more embodiments, a portion of one fourth electrode 240b can overlap each of the second sensing patterns 221-1b included in one second electrode 220-1b, and another portion of one fourth electrode 240b can overlap each of the second sensing patterns 221-1b included in another second electrode 220-1b. That is, one fourth electrode 240b can overlap portions of two second electrodes 220-1b. One second electrode 220-1b can overlap portions of two fourth electrodes 240b.

[0300] The two third electrodes 230-1b spaced apart from each other and the two fourth electrodes 240b spaced apart from each other can be included in one sensing unit SU-1b in which one of the first electrodes 210-1b and one of the second electrodes 220-1b cross each other. One third electrode 230-1b can be commonly included in the sensing units SU-1b adjacent to each other in a direction perpendicular to an extension direction of the third electrode 230-1b (e.g., in the first direction DR1). One fourth electrode 240b can be commonly included in the sensing units SU-1b adjacent to each other in a direction perpendicular to an extension direction of the fourth electrode 240b (e.g., in the second direction DR2).

[0301] FIG. 21B FIG. 1C is a plan view illustrating a portion of a sensing area 200A-1c according to an embodiment of the disclosure. FIG. 21C FIG. 1D is a plan view illustrating a lower conductive layer 206c of a portion of the sensing area 200A-1c according to an embodiment of the disclosure. FIG. 21A to FIG. 21C FIG. 1E is a plan view illustrating a first conductive layer 202-1c of a portion of the sensing area 200A-1c according to an embodiment of the disclosure.

[0302] FIG. 21A to FIG. 21C FIG. 1F is an enlarged view illustrating a portion of two first electrodes 210-1c and two second electrodes 220-1c crossing each other, a portion of three third electrodes 230-1c overlapping the two first electrodes 210-1c, and a portion of three fourth electrodes 240c overlapping the two second electrodes 220-1c.

[0303] Referring to FIG. 20D , each of the first electrodes 210-1c can include a first sensing pattern 211-1c and a first bridge pattern 212-1c. The first sensing pattern 211-1c and the first bridge pattern 212-1c can form an integral shape (e.g., can be integrally formed) with respect to one first electrode 210-1c. Each of the second electrodes 220-1c can include a second sensing pattern 221-1c and a second bridge pattern 222-1c. The second sensing pattern 221-1c and the second bridge pattern 222-1c can be electrically connected to each other through a contact hole CNa.

[0304] The first electrode 210-1c and the second sensing pattern 221-1c can be located on the same layer. For example, the first electrode 210-1c and the second sensing pattern 221-1c can be included in the second conductive layer 204-1b (refer to FIG. 1B). FIG. 20D

[0305] ​The second bridge pattern 222-1c can be located on a layer different from the layer on which the first electrode 210-1c and the second sensing pattern 221-1c are located. The second bridge pattern 222-1c can be located on the same layer as the fourth electrode 240c. For example, the second bridge pattern 222-1c and the fourth electrode 240c can be included in the lower conductive layer 206c. The second sensing pattern 221-1c and the second bridge pattern 222-1c can be electrically connected to each other through a contact hole CNa defined in the middle insulating layer 203 (refer to FIG. 2A) and the lower insulating layer 207 (refer to FIG. 2A). FIG. 20D ) and the lower insulating layer 207 (refer to FIG. 22A ).

[0306] Each of the second bridge patterns 222-1c can extend in the first direction DR1. Each of the fourth electrodes 240c can extend in the same direction as the extension direction of the second bridge pattern 222-1c. The fourth electrode 240c can have a bar shape extending in the first direction DR1.

[0307] The third electrode 230-1c can be located on a layer different from the layer on which the first electrode 210-1c, the second electrode 220-1c, and the fourth electrode 240c are located. For example, the third electrode 230-1c can be included in the first conductive layer 202-1c. Each of the third electrodes 230-1c can extend in the second direction DR2. The third electrode 230-1c can have a bar shape extending in the second direction DR2.

[0308] A hole 230-hc can be defined in each of the third electrodes 230-1c. Two second sensing patterns 221-1c adjacent to each other in the first direction DR1 can be connected to the corresponding second bridge pattern 222-1c through the contact hole CNa. For one second bridge pattern 222-1c, one contact hole CNa to which one second sensing pattern 221-1c is connected can be located in the hole 230-hc defined in the third electrode 230-1c in the plan. The hole 230-hc can surround the corresponding contact hole CNa. The hole 230-hc defined in each of the third electrodes 230-1c can provide a space in which the contact hole CNa through which the second sensing pattern 221-1c and the second bridge pattern 222-1c are connected is defined. Meanwhile, for one second bridge pattern 222-1c, the other contact hole CNa to which the other second sensing pattern 221-1c is connected can be located outside the third electrode 230-1c.

[0309] FIG. 22B is a plan view illustrating a second conductive layer 204-1d according to one or more embodiments of the present disclosure. FIG. 22C is a plan view illustrating a first conductive layer 202-1d according to one or more embodiments of the present disclosure. FIG. 22A to FIG. 22Cis a plan view showing the lower conductive layer 206d according to one or more embodiments of the present disclosure.

[0310] FIG. 22A to FIG. 22C Four first electrodes 210-1d and six second electrodes 220-1d that cross each other, four third electrodes 230-1d that overlap the four first electrodes 210-1d, and six fourth electrodes 240d that overlap the six second electrodes 220-1d are shown. In FIG. 22A , twenty-four sensing units SU-1d in which one of the first electrodes 210-1d and one of the second electrodes 220-1d cross each other are shown. However, the number of the first electrodes 210-1d, the second electrodes 220-1d, the third electrodes 230-1d, and the fourth electrodes 240d is not limited thereto.

[0311] As shown in FIG. 22A , each of the first electrodes 210-1d can include a first sensing pattern 211-1d and a first bridge pattern 212-1d. The first sensing pattern 211-1d and the first bridge pattern 212-1d can form an integral shape (e.g., can be integrally formed) with respect to one first electrode 210-1d.

[0312] As shown in FIG. 22C and FIG. 22B , each of the second electrodes 220-1d can include a second sensing pattern 221-1d and a second bridge pattern 222-1d. The second sensing pattern 221-1d and the second bridge pattern 222-1d can be electrically connected to each other through a contact hole CNa. The second sensing pattern 221-1d and the second bridge pattern 222-1d can be located on different layers so as to be spaced apart from each other with respect to one second electrode 220-1d. For example, the first electrode 210-1d and the second sensing pattern 221-1d can be included in the second conductive layer 204-1d, and the second bridge pattern 222-1d can be included in the lower conductive layer 206d.

[0313] As shown in FIG. 22C , the third electrodes 230-1d can be included in the first conductive layer 202-1d. Each of the third electrodes 230-1d can extend in the second direction DR2. The third electrodes 230-1d can be arranged to be spaced apart from each other in the first direction DR1.

[0314] In one or more embodiments, each of the third electrodes 230-1d can include a first-first division electrode 230dv1 and a first-second division electrode 230dv2. The first-first division electrode 230dv1 and the first-second division electrode 230dv2 can extend in the second direction DR2 and can be spaced apart from each other in the first direction DR1. The first-first division electrode 230dv1 and the first-second division electrode 230dv2 can have line symmetry with respect to a line extending in the second direction DR2. A portion of each of the first-first division electrode 230dv1 and the first-second division electrode 230dv2 forming one third electrode 230-1d can overlap with a portion of the corresponding first electrode 210-1d. That is, the third electrode 230-1d can overlap with the first electrode 210-1d in a one-to-one corresponding manner.

[0315] In one or more embodiments, the first conductive layer 202-1d can further include dummy patterns DMPd. Each of the dummy patterns DMPd can be floating or electrically floating. The dummy patterns DMPd can be located between the first-first division electrode 230dv1 and the first-second division electrode 230dv2 adjacent to each other in the first direction DR1. The dummy patterns DMPd can extend in the second direction DR2.

[0316] A recess (or a concave portion) can be defined in each of the first-first division electrode 230dv1 and the first-second division electrode 230dv2 and the dummy pattern DMPd located therebetween. The recess defined in each of the first-first division electrode 230dv1 and the first-second division electrode 230dv2 and the dummy pattern DMPd located therebetween can be a portion recessed in an extension direction of the second bridge pattern 222-1d (e.g., the first direction DR1). The recesses defined in the first-first division electrode 230dv1 and the dummy pattern DMPd adjacent to each other or in the first-second division electrode 230dv2 and the dummy pattern DMPd adjacent to each other can face each other to provide a space defining a contact hole CNa through which the second sensing pattern 221-1d and the second bridge pattern 222-1d are connected.

[0317] As FIG. 17As illustrated in FIG. 2, the fourth electrode 240d can be included in the lower conductive layer 206d. That is, the second bridge pattern 222-1d and the fourth electrode 240d can be located on the same layer. Each of the fourth electrode 240d can extend in the same direction as the extension direction of the second bridge pattern 222-1d. For example, each of the second bridge pattern 222-1d and the fourth electrode 240d can extend in the first direction DR1.

[0318] Each of the fourth electrode 240d can include a second-first division electrode 240dv1, a second-second division electrode 240dv2, a second-third division electrode 240dv3, and a second-fourth division electrode 240dv4. The second-first division electrode 240dv1, the second-second division electrode 240dv2, and the second-third division electrode 240dv3 can extend in the first direction DR1 and can be arranged to be spaced apart from each other in the second direction DR2. The second-fourth division electrode 240dv4 can include a first sub-electrode 241dv4 and a second sub-electrode 242dv4 extending in the first direction DR1 and spaced apart from each other in the first direction DR1. That is, one of the second-first division electrode 240dv1, the second-second division electrode 240dv2, the second-third division electrode 240dv3, and the second-fourth division electrode 240dv4 can include two sub-electrodes.

[0319] In one or more embodiments, for one fourth electrode 240d, the second-first division electrode 240dv1 and the second-second division electrode 240dv2 can be positioned adjacent to each other, and the second-third division electrode 240dv3 and the second-fourth division electrode 240dv4 can be positioned adjacent to each other. For another fourth electrode 240d, the second-first division electrode 240dv1 and the second-second division electrode 240dv2 can be positioned adjacent to each other, and the second-third division electrode 240dv3 and the second-fourth division electrode 240dv4 can be positioned adjacent to each other. Between the second-first division electrode 240dv1 and the second-second division electrode 240dv2 and the second-third division electrode 240dv3 and the second-fourth division electrode 240dv4 in one fourth electrode 240d, the second-first division electrode 240dv1 and the second-second division electrode 240dv2 or the second-third division electrode 240dv3 and the second-fourth division electrode 240dv4 in another fourth electrode 240d can be positioned.

[0320] A recess (or a concave portion) can be defined in some of the second-first division electrode 240dv1, the second-second division electrode 240dv2, the second-third division electrode 240dv3, and the second-fourth division electrode 240dv4. Each of the recesses can be a portion that is concaved in a direction perpendicular to an extension direction of the second bridge pattern 222-1d (e.g., in the second direction DR2). The recesses defined in the division electrodes adjacent to each other in the second direction DR2 among the second-first division electrode 240dv1, the second-second division electrode 240dv2, the second-third division electrode 240dv3, and the second-fourth division electrode 240dv4 can face each other to provide a space in which the second bridge pattern 222-1d is located.

[0321] The sensor layer 200-1 (refer to FIG. 22B ) can further include a third trace 230rt1d and a fourth trace 230rt2d. The third trace 230rt1d and the fourth trace 230rt2d can be electrically connected with the third electrode 230-1d. The third trace 230rt1d and the fourth trace 230rt2d can be located on the same layer as the third electrode 230-1d. For example, the third trace 230rt1d and the fourth trace 230rt2d can be included in the first conductive layer 202-1d. The third trace 230rt1d can include a first line portion 231td, a second line portion 232td, and a third line portion 233td. FIG. 22B An example in which the second line portion 232td and the third line portion 233td have relatively thick widths in the first direction DR1 is illustrated. In addition, FIG. 7 An example in which the first line portion 231td overlaps the peripheral area 200NA-1 and the second line portion 232td and the third line portion 233td overlap the sensing area 200A-1 is illustrated. However, embodiments are not limited thereto. For example, as in the embodiments described in reference to FIG. 17 and FIG. 17 The second line portion 232t and the third line portion 233t can overlap the peripheral area 200NA or 200NA-1.

[0322] The sensor layer 200-1 (refer to FIG. 20D ) can further include a fifth trace 240td. The fifth trace 240td can be referred to as a first type trace. The fifth trace 240td can be electrically connected with the fourth electrode 240d. The fifth trace 240td can be located on a layer different from a layer on which the fourth electrode 240d is located. For example, the fifth trace 240td can be included in the first conductive layer 202-1d and can be located on the same layer as the third electrode 230-1d.

[0323] The fifth trace 240td may at least partially overlap the sensing region 200A-1. The fifth trace 240td located on a layer different from the layer on which the fourth electrode 240d is located may overlap the fourth electrode 240d, or may cross the fourth electrode 240d while being insulated from the fourth electrode 240d. Each of the fifth traces 240td may be formed by defining a lower insulating layer 207 (refer to FIG. FIG. 1A ) is connected to the corresponding fourth electrode 240d. Each of the fifth traces 240td can be connected to the end portion of the first sub-electrode 241dv4 or the second sub-electrode 242dv4 in the corresponding second to fourth separation electrodes 240dv4. Since the fifth trace 240td at least partially overlaps with the sensing area 200A-1, the space between the first and second sub-electrodes 241dv4 and 242dv4 can be reduced. FIG. 17 ) on the front surface of the device, and a narrow frame can be achieved.

[0324] Sensor layer 200-1 (reference FIG. 22A to FIG. 22C ) may further include a sixth trace 240rt located in the peripheral area 200NA-1. The sixth trace 240rt may be referred to as a second-type trace. The sixth trace 240rt may connect the second-first separator electrode 240dv1, the second-second separator electrode 240dv2, the second-third separator electrode 240dv3, and the second-fourth separator electrode 240dv4 in one fourth electrode 240d. The sixth trace 240rt may connect the first end or the second end of two separator electrodes among the second-first separator electrode 240dv1, the second-second separator electrode 240dv2, the second-third separator electrode 240dv3, and the second-fourth separator electrode 240dv4. For example, in one fourth electrode 240d, the sixth trace 240rt may sequentially connect the first sub-electrode 241dv4 of the second-fourth separating electrode 240dv4, the second-first separating electrode 240dv1, the second-third separating electrode 240dv3, the second-second separating electrode 240dv2, and the second sub-electrode 242dv4 of the second-fourth separating electrode 240dv4.

[0325] The sixth trace 240rt can include first layer lines 241rt and second layer lines 242rt. Each of the first layer lines 241rt can extend in the second direction DR2, and each of the second layer lines 242rt can extend in the first direction DR1. The second layer lines 242rt can be directly connected to the first end or the second end of the second-first division electrode 240dv1, the first end or the second end of the second-second division electrode 240dv2, the first end or the second end of the second-third division electrode 240dv3, and the first end or the second end of the second-fourth division electrode 240dv4. The first layer lines 241rt can connect the second layer lines 242rt to connect the second-first division electrode 240dv1, the second-second division electrode 240dv2, the second-third division electrode 240dv3, and the second-fourth division electrode 240dv4 of one fourth electrode 240d. The first layer lines 241rt and the second layer lines 242rt can be located on different layers. The second layer lines 242rt can be included in the lower conductive layer 206d and can be located on the same layer as the fourth electrode 240d. The first layer lines 241rt can be included in the first conductive layer 202-1d and can be located on the same layer as the third electrode 230-1d. The first layer lines 241rt and the second layer lines 242rt can be electrically connected to each other through the contact hole CNd.

[0326] Although the first trace 210t (refer to FIG. 17 ) connected to the first electrode 210-1d and the second trace 220t (refer to FIG. 17 ) connected to the second electrode 220-1d are omitted in FIG. 17 , the sensor layer 200-1 (refer to FIG. 17 ) can further include the first trace 210t (refer to FIG. 17 ) and the second trace 220t (refer to FIG. 17 ) located in the peripheral area 200NA-1. For example, the first trace 210t (refer to FIG. 17 ) and the second trace 220t (refer to FIG. 23 ) can be included in the second conductive layer 204-1d.

[0327] FIG. 5 is a view illustrating an operation of a sensor driver 200C (refer to FIG. 5 ) according to one or more embodiments of the disclosure.

[0328] Referring to FIG. 23 and FIG. 24 , the sensor driver 200C can selectively drive in one of a first operation mode DMD1, a second operation mode DMD2, and a third operation mode DMD3.

[0329] The first operation mode DMD1 can be referred to as a touch and pen standby mode, the second operation mode DMD2 can be referred to as a touch activation and pen standby mode, and the third operation mode DMD3 can be referred to as a pen activation mode. The first operation mode DMD1 can be a mode in which the sensor driver 200C waits for the first input 2000 and the second input 3000. The second operation mode DMD2 can be a mode in which the sensor driver 200C senses the first input 2000 and waits for the second input 3000. The third operation mode DMD3 can be a mode in which the sensor driver 200C senses the second input 3000.

[0330] In one or more embodiments of the disclosure, the sensor driver 200C can first be driven in the first operation mode DMD1. When the first input 2000 is sensed in the first operation mode DMD1, the sensor driver 200C can switch (or change) to the second operation mode DMD2. Alternatively, when the second input 3000 is sensed in the first operation mode DMD1, the sensor driver 200C can switch (or change) to the third operation mode DMD3.

[0331] In one or more embodiments of the disclosure, when the second input 3000 is sensed in the second operation mode DMD2, the sensor driver 200C can switch to the third operation mode DMD3. When the first input 2000 is released (or not sensed) in the second operation mode DMD2, the sensor driver 200C can switch to the first operation mode DMD1. When the second input 3000 is released (or not sensed) in the third operation mode DMD3, the sensor driver 200C can switch to the first operation mode DMD1.

[0332] FIG. 5 is a view illustrating an operation of the sensor driver 200C (refer to FIG. 2) according to one or more embodiments of the disclosure. FIG. 5 ) of the sensor driver 200C (refer to FIG. 2) according to one or more embodiments of the disclosure.

[0333] Referring to FIG. 23 , FIG. 24 and FIG. 24 , operations in the first operation mode DMD1, the second operation mode DMD2, and the third operation mode DMD3 are shown in order of time (t).

[0334] In the first operation mode DMD1, the sensor driver 200C can be repeatedly driven in the second mode MD2-d and the first mode MD1-d. During the second mode MD2-d, the sensor layer 200 can be scanned to detect the second input 3000. During the first mode MD1-d, the sensor layer 200 can be scanned to detect the first input 2000. Although FIG. 17An example in which the sensor driver 200C continues to operate in the first mode MD1-d after the second mode MD2-d is shown, but the order is not limited thereto.

[0335] In the second operation mode DMD2, the sensor driver 200C can be repeatedly driven in the second mode MD2-d and the first mode MD1. During the second mode MD2-d, the drive sensor layer 200 can be scanned to detect the second input 3000. During the first mode MD1, the drive sensor layer 200 can be scanned to detect the coordinates of the first input 2000.

[0336] In the third operation mode DMD3, the sensor driver 200C can be driven in the second mode MD2. During the second mode MD2, the drive sensor layer 200 can be scanned to detect the coordinates of the second input 3000. In the third operation mode DMD3, the sensor driver 200C can not operate in the first mode MD1-d or MD1 until the second input 3000 is released (or not sensed).

[0337] Also referring to FIG. 25 In the first mode MD1-d and in the first mode MD1, all of the third electrodes 230-1 and the fourth electrodes 240 can be grounded or can receive a constant voltage. Alternatively, in the first mode MD1-d and the first mode MD1, the third electrodes 230-1 and the fourth electrodes 240 can all be floating. In another case, in the first mode MD1-d and the first mode MD1, a signal in phase with a transmission signal provided to the first electrodes 210-1 can be applied to the third electrodes 230-1 and the fourth electrodes 240. In this case, touch noise introduced through the third electrodes 230-1 and the fourth electrodes 240 can be reduced or prevented.

[0338] In the second mode MD2-d and the second mode MD2, the first ends of the third electrodes 230-1 and the first ends of the fourth electrodes 240 can all be floating. Also, in the second mode MD2-d and the second mode MD2, the second ends of the third electrodes 230-1 and the second ends of the fourth electrodes 240 can all be grounded or floating. Accordingly, compensation for a sensing signal can be improved or maximized through coupling between the first electrodes 210-1 and the third electrodes 230-1 and coupling between the second electrodes 220-1 and the fourth electrodes 240.

[0339] FIG. 5 is a view for explaining the first mode according to one or more embodiments of the disclosure.

[0340] Referring to FIG. 24 , FIG. 25 and FIG. 25The first mode MD1-d of the first operation mode DMD1 and the first mode MD1 of the second operation mode DMD2 can include a mutual capacitance detection mode. FIG. 25 is a view for explaining the mutual capacitance detection mode under the first mode MD1-d of the first operation mode DMD1 and under the first mode MD1 of the second operation mode DMD2.

[0341] Under the mutual capacitance detection mode, the sensor driver 200C can sequentially provide the transmission signal TX to the first electrode 210-1, and can detect the coordinates of the first input 2000 using the reception signal RX detected through the second electrode 220-1. For example, the sensor driver 200C can sense a change in mutual capacitance between the first electrode 210-1 and the second electrode 220-1, and can calculate the input coordinates.

[0342] FIG. 25 An example in which the transmission signal TX is provided to one first electrode 210-1 and the reception signal RX is output from the second electrode 220-1 is shown. In FIG. 26 , for the sake of clear representation of signals, one first electrode 210-1 to which the transmission signal TX is to be provided is displayed in dark color (e.g., in bold). The sensor driver 200C can sense a change in capacitance between the first electrode 210-1 and each of the second electrodes 220-1, and can detect the input coordinates of the first input 2000.

[0343] In one or more embodiments of the disclosure, at least one of the first mode MD1-d of the first operation mode DMD1 and the first mode MD1 of the second operation mode DMD2 can further include a self-capacitance detection mode. Under the self-capacitance detection mode, the sensor driver 200C can calculate the input coordinates by outputting a driving signal to the first electrode 210-1 and the second electrode 220-1 and by sensing a change in capacitance of each of the first electrode 210-1 and the second electrode 220-1.

[0344] FIG. 27A is a view for explaining a second mode (e.g., a charge driving mode) according to one or more embodiments of the disclosure. FIG. 27B is a graph depicting a waveform of a first signal SG1 according to one or more embodiments of the disclosure. FIG. 26 is a graph depicting a waveform of a second signal SG2 according to one or more embodiments of the disclosure.

[0345] Referring to ​ , Figure 27A and Figure 27B , the second mode MD2 can include a charge driving mode. The charge driving mode can include a search-charge driving mode and a tracking-charge driving mode.

[0346] The search-charge driving mode can be a driving mode before the position of the pen PN is sensed. Accordingly, the first signal SG1 or the second signal SG2 can be provided to all channels included in the sensor layer 200-1. That is, in the search-charge driving mode, the entire area of the sensor layer 200-1 can be scanned. When the pen PN is sensed in the search-charge driving mode, the sensor layer 200-1 can be driven in the track-charge driving mode. For example, in the track-charge driving mode, the sensor driver 200C can sequentially output the first signal SG1 and the second signal SG2 to an area overlapping a point at which the pen PN is sensed, instead of the entire sensor layer 200-1.

[0347] In the charge driving mode, the sensor driver 200C can apply the first signal SG1 to one pad among the third pad PD3 and the fourth pad PD4, and can apply the second signal SG2 to the other pad among the third pad PD3 and the fourth pad PD4. The second signal SG2 can be an inverse signal of the first signal SG1. For example, the first signal SG1 can be a sine signal.

[0348] Because the first signal SG1 and the second signal SG2 are applied to at least two pads, the current RFS can have a current path flowing from one pad to the other pad. Also, because the first signal SG1 and the second signal SG2 are sine signals having an anti-correlation, the direction of the current RFS can periodically change. In one or more embodiments of the disclosure, the first signal SG1 and the second signal SG2 can be square wave signals having an anti-correlation.

[0349] When the first signal SG1 and the second signal SG2 have an anti-correlation, noise caused by the first signal SG1 in the display layer 100 (refer to Figure 4 ) can be reduced or canceled by noise caused by the second signal SG2. Accordingly, a flickering phenomenon can not occur in the display layer 100, and the display quality of the display layer 100 can be improved.

[0350] In one or more embodiments of the disclosure, the first signal SG1 can be a sine signal. However, it is not limited thereto, and the first signal SG1 can be a square wave signal. The second signal SG2 can have a specific constant voltage. For example, the second signal SG2 can be a ground voltage. That is, a pad to which the second signal SG2 is applied can be considered to be grounded. Even in this case, the current RFS can flow from one pad to the other pad. Also, even though the other pad is grounded, because the first signal SG1 is a sine signal or a square wave signal, the direction of the current RFS can periodically change.

[0351] ReferenceFigure 26 The second signal SG2 is provided to a third pad PD3 connected with a third trace 230rt1, and the first signal SG1 is provided to a fourth pad PD4 connected with the third electrode 230-1. The current RFS can flow along a current path defined by the fourth pad PD4, a fourth trace 230rt2 connected to the fourth pad PD4, the third electrode 230-1, a portion of the third trace 230rt1 connected to the third pad PD3, and the third pad PD3. The current path can have a coil shape. Accordingly, in the second mode of the charging driving mode, the resonance circuit of the pen PN can be charged through the current path.

[0352] According to the present disclosure, a current path having a ring coil pattern can be implemented by components included in the sensor layer 200-1. Accordingly, the electronic device 1000 (refer to Figure 1A ) can charge the pen PN using the sensor layer 200-1. Accordingly, it is not necessary to separately add components having a coil for charging the pen PN, and thus an increase in thickness and weight of the electronic device 1000 and a reduction in flexibility of the electronic device 1000 can not occur.

[0353] In the charging driving mode, the first electrode 210-1, the second electrode 220-1, and the fourth electrode 240 can be grounded or electrically floated, or can receive a constant voltage. For example, the first electrode 210-1, the second electrode 220-1, and the fourth electrode 240 can be floated. In this case, the current RFS can not flow to the first electrode 210-1, the second electrode 220-1, and the fourth electrode 240.

[0354] Figure 28A is a view for explaining a second mode according to one or more embodiments of the present disclosure. Figure 28B is a view for explaining a second mode based on one sensing unit SU-1 according to one or more embodiments of the present disclosure.

[0355] Referring to Figure 5 , Figure 28A and Figure 28B , the second mode can include a charging driving mode and a pen sensing driving mode. Figure 28A and Figure 28B are views for explaining the pen sensing driving mode. In Figure 28B , the sensing unit SU-1 through which a first induced current Ia, a second induced current Ib, a third induced current Ic, and a fourth induced current Id generated by the pen PN flow is shown.

[0356] In one or more embodiments of the present disclosure, the wiring directions of one electrode and the other electrode of the sensor layer 200-1 that overlap each other can be different from each other. For example, the wiring direction of the first electrode 210x and the wiring direction of the third electrode 230x can be different from each other. Also, the wiring direction of the second electrode 220x and the wiring direction of the fourth electrode 240x can be different from each other. For example, in the embodiment of FIG. 10A, the wiring direction of the first electrode 210x and the wiring direction of the third electrode 230x can be different from each other. Also, the wiring direction of the second electrode 220x and the wiring direction of the fourth electrode 240x can be different from each other. Figure 28B Figure 28B In the embodiment of FIG. 10A, the first electrode 210x and the first trace 210t can be connected on the lower side of the sensing unit SU-1, and the third electrode 230x and the third trace 230rt1 can be connected on the upper side of the sensing unit SU-1. The second electrode 220x and the second trace 220t can be connected on the right side of the sensing unit SU-1, and the fourth electrode 240x and the fifth trace 240t can be connected on the left side of the sensing unit SU-1.

[0357] The RLC resonance circuit of the pen PN can emit a magnetic field having a resonance frequency while discharging the charged charge. Due to the magnetic field provided by the pen PN, a first induced current Ia can be generated in the first electrode 210x, and a second induced current Ib can be generated in the second electrode 220x. Also, a third induced current Ic can be generated in the third electrode 230x, and a fourth induced current Id can be generated in the fourth electrode 240x.

[0358] A first coupling capacitor Ccp1 can be formed between the third electrode 230x and the first electrode 210x, and a second coupling capacitor Ccp2 can be formed between the fourth electrode 240x and the second electrode 220x. The third induced current Ic can be transferred to the first electrode 210x through the first coupling capacitor Ccp1, and the fourth induced current Id can be transferred to the second electrode 220x through the second coupling capacitor Ccp2.

[0359] The sensor driver 200C can receive a first reception signal PRX1 based on the first induced current Ia and the third induced current Ic from the first electrode 210x, and can receive a second reception signal PRX2 based on the second induced current Ib and the fourth induced current Id from the second electrode 220x. The sensor driver 200C can detect an input coordinate of the pen PN based on the first reception signal PRX1 and the second reception signal PRX2.

[0360] The sensor driver 200C can receive the first reception signal PRX1 from the first electrode 210x and can receive the second reception signal PRX2 from the second electrode 220x. In this case, the first end of the third electrode 230x and the first end of the fourth electrode 240x can all be floated. Accordingly, compensation for the sensing signal can be improved or maximized through coupling between the first electrode 210x and the third electrode 230x and through coupling between the second electrode 220x and the fourth electrode 240x.

[0361] Further, the second end of the third electrode 230x and the second end of the fourth electrode 240x can be grounded or floated. Accordingly, the third induced current Ic and the fourth induced current Id can be sufficiently transferred to the first electrode 210x and the second electrode 220x through coupling between the first electrode 210x and the third electrode 230x and through coupling between the second electrode 220x and the fourth electrode 240x.

[0362] As described above, using the sensor layer can not only sense a touch input but also sense a pen input. Accordingly, a separate component (e.g., a digitizer) for sensing a pen does not need to be added to the electronic device, and thus, an increase in thickness and weight of the electronic device and a decrease in flexibility of the electronic device due to the addition of the digitizer can not occur.

[0363] Further, the sensor layer can include the first electrode and the second electrode that sense a touch input and a pen input and the third electrode (or the third electrode and the fourth electrode) that induces or identifies electromagnetic induction. In this case, a sensor layer in which the first electrode and the second electrode have a structure capable of improving a capacitance sensing sensitivity and in which the third electrode (or the third electrode and the fourth electrode) has a structure capable of reducing or minimizing resistance can be provided. Accordingly, an electronic device having improved pen sensitivity and touch sensitivity can be provided.

[0364] While the present disclosure has been described with reference to the embodiments thereof, it is to be understood that various other changes could be made and equivalents employed, without departing from the scope of the disclosure as defined in the appended claims and their functional equivalents.

Claims

1.An electronic device comprising: a sensor layer; and a sensor driver configured to drive the sensor layer and configured to selectively operate in a first mode to sense a touch input or in a second mode to sense a pen input, wherein the sensor layer comprises: first electrodes arranged in a first direction and including first sensing patterns spaced apart in a second direction crossing the first direction and first bridge patterns between the first sensing patterns; second electrodes arranged in the second direction and including second sensing patterns spaced apart in the first direction and second bridge patterns between the second sensing patterns; and pen sensing electrodes on a same layer as one of the first bridge patterns and the second bridge patterns and extending in an extension direction of the one of the first bridge patterns and the second bridge patterns. 2.The electronic device of claim 1, wherein, the pen sensing electrodes are at a same layer as the second bridge patterns, and wherein the pen sensing electrodes and the second bridge patterns extend in the first direction. 3.The electronic device of claim 2, wherein, the pen sensing electrodes have a bar shape extending in the first direction. 4.The electronic device of claim 2, wherein, outer edges of the pen sensing electrodes face outer edges of the second bridge patterns adjacent to the pen sensing electrodes. 5.The electronic device of claim 2, wherein the pen sensing electrodes alternate with the second bridge patterns in the second direction. 6.The electronic device of claim 2, wherein portions of one of the pen sensing electrodes overlap portions of two of the second electrodes. 7.The electronic device of claim 2, wherein portions of two of the pen sensing electrodes are in sensing cells where one of the first electrodes crosses one of the second electrodes. 8.The electronic device of claim 2, wherein, the first electrodes and the second sensing patterns are at different layers than the second bridge patterns, wherein in one of the first electrodes, the first sensing patterns and the first bridge patterns are integral, and wherein in one of the second electrodes, the second sensing patterns and the second bridge patterns are connected by contact holes. 9.The electronic device of claim 1, wherein the pen sensing electrodes are at a same layer as the second bridge patterns, and wherein the pen sensing electrodes and the second bridge patterns extend in the second direction. 10.The electronic device of claim 9, wherein the second sensing patterns include first protrusions on one side in the first direction and second protrusions on an opposite side in the first direction, the first protrusions and the second protrusions extending in the first direction, and wherein the second bridge patterns are connected to the second protrusions of one of the second sensing patterns and to the first protrusions of another of the second sensing patterns. 11.The electronic device of claim 10, wherein the first bridge pattern includes a first line portion, a second line portion, and a third line portion, wherein the first line portion is configured to extend from a side of one of the first sensing patterns toward another of the first sensing patterns adjacent to the one of the first sensing patterns, the second line portion is configured to extend from a side of the another of the first sensing patterns toward the one of the first sensing patterns, and the third line portion connects the first line portion and the second line portion and extends in the first direction, wherein the second protrusion of the one of the second sensing patterns is between the another of the first sensing patterns and the third line portion, and wherein the first protrusion of the another of the second sensing patterns is between the one of the first sensing patterns and the third line portion. 12.The electronic device of claim 1, wherein, the pen sensing electrode is at the same layer as the first bridge pattern, and wherein the pen sensing electrode and the first bridge pattern extend in the second direction. 13.The electronic device of claim 12, wherein, the pen sensing electrode has a strip shape extending in the second direction, and wherein an outer edge of the pen sensing electrode faces an outer edge of the first bridge pattern adjacent to the pen sensing electrode. 14.The electronic device of claim 12, wherein the pen sensing electrode defines a hole around the first bridge pattern in a plan view, and wherein the pen sensing electrode overlaps the first electrode in a one-to-one manner. 15.The electronic device of claim 12, wherein the first sensing pattern and the second electrode are at different layers from the first bridge pattern, wherein the first sensing pattern and the first bridge pattern in one of the first electrodes are connected by a contact hole, and wherein the second sensing pattern and the second bridge pattern are integral in one of the second electrodes. the first bridge pattern includes a first line portion, a second line portion, and a third line portion, wherein the first line portion is configured to extend from a side of one of the first sensing patterns toward another of the first sensing patterns adjacent to the one of the first sensing patterns, the second line portion is configured to extend from a side of the another of the first sensing patterns toward the one of the first sensing patterns, and the third line portion connects the first line portion and the second line portion and extends in the first direction, wherein the second protrusion of the one of the second sensing patterns is between the another of the first sensing patterns and the third line portion, and wherein the first protrusion of the another of the second sensing patterns is between the one of the first sensing patterns and the third line portion. the pen sensing electrode is at the same layer as the first bridge pattern, and wherein the pen sensing electrode and the first bridge pattern extend in the second direction. the pen sensing electrode has a strip shape extending in the second direction, and wherein an outer edge of the pen sensing electrode faces an outer edge of the first bridge pattern adjacent to the pen sensing electrode. the pen sensing electrode defines a hole around the first bridge pattern in a plan view, and wherein the pen sensing electrode overlaps the first electrode in a one-to-one manner. the first sensing pattern and the second electrode are at different layers from the first bridge pattern, wherein the first sensing pattern and the first bridge pattern in one of the first electrodes are connected by a contact hole, and wherein the second sensing pattern and the second bridge pattern are integral in one of the second electrodes.

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