Display module, display device, beauty instrument and vehicle

Abstract

The invention discloses a display module, a display device, a beauty instrument and a vehicle. The display module comprises a display panel, a driving chip and a circuit board assembly, the display panel comprises a display area and a peripheral area arranged around the display area, the driving chip is arranged on the backlight side of the display panel, the driving chip and the display panel are arranged in a spaced mode, and the orthographic projection of the driving chip on the display panel is located in the peripheral area; the circuit board assembly is arranged between the display panel and the driving chip and connected with the display panel and the driving chip. Therefore, the driving chips and other heating devices can be arranged in the peripheral area of the display panel at intervals, the influence on the display area is effectively avoided, and the service life of the display panel is prolonged.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, more particularly, to a display module, a display device, a beauty instrument and a vehicle. BACKGROUND

[0002] At present, an organic light emitting diode (OLED) display panel as a display component of an electronic device has been widely applied to various electronic products, and gradually applied in various vehicle fields. However, the OLED display is single-pixel driven, and the pixel display organic light emitting material is extremely sensitive to the temperature environment, and the temperature is too high to cause the life to decay too fast. SUMMARY

[0003] The present application provides a display module, a display device, a beauty instrument and a vehicle.

[0004] The display module of the present application includes a display panel, a driving chip and a circuit board assembly, the display panel includes a display area and a peripheral area surrounding the display area, the driving chip is arranged on the backlight side of the display panel and is spaced apart from the display panel, the driving chip is located in the inside of the peripheral area in the orthographic projection of the display panel, and the circuit board assembly is arranged between the display panel and the driving chip and respectively connected to the display panel and the driving chip.

[0005] In the display module of the present application, the display module includes a display panel, a driving chip and a circuit board assembly, the display panel includes a display area and a peripheral area surrounding the display area, the driving chip is arranged on the backlight side of the display panel and is spaced apart from the display panel, the driving chip is located in the inside of the peripheral area in the orthographic projection of the display panel, and the circuit board assembly is arranged between the display panel and the driving chip and respectively connected to the display panel and the driving chip. In this way, the driving chip and other heat generating devices can be spaced apart from the peripheral area of the display panel, effectively avoiding the impact on the display area and prolonging the service life of the display panel.

[0006] In some embodiments, the circuit board assembly includes a first circuit board and a second circuit board, the driving chip is arranged on the side of the first circuit board away from the display panel, and the second circuit board is connected to the first circuit board and the display panel respectively.

[0007] In this way, the driving chip can drive the display panel to work through the first circuit board and the second circuit board, and at the same time, the first circuit board and the second circuit board can block the heat generated by the driving chip to avoid affecting the display panel.

[0008] In some embodiments, the second circuit board is a flexible circuit board.

[0009] Thus, the first circuit board and the display panel can be arranged on different planes, and the second circuit board can be a flexible circuit board, so that the second circuit board can be bent to connect the first circuit board and the display panel.

[0010] In some embodiments, the second circuit board includes a first end and a second end, the first end is connected to the first circuit board, and the second end is connected to the display panel.

[0011] Thus, the first end and the second end of the second circuit board can be connected on different planes respectively, so as to ensure that the driving chip can be connected and drive the display panel through the second circuit board.

[0012] In some embodiments, the first end is connected to an end of the first circuit board close to the driving chip.

[0013] Thus, the second circuit board and the driving chip can be arranged relatively close to each other, that is, the positions directly opposite the peripheral area, so that the driving chip can quickly respond to the display panel through the circuit board.

[0014] In some embodiments, the first end is connected to an end of the first circuit board away from the driving chip.

[0015] Thus, the second circuit board and the driving chip can be arranged relatively far away from each other, so that more space can be left at the bottom of the display module, and thus the driving chip can be arranged farther away from the display area.

[0016] In some embodiments, the first circuit board includes a first side and a second side opposite to each other, the first side faces the display panel, the second side is away from the display panel, and the first end and the driving chip are both connected to the second side.

[0017] Thus, the connection part of the first end and the driving chip are both arranged on the second side, so as to reduce the influence on the display panel.

[0018] In some embodiments, the display module further includes a connecting adhesive layer, which is arranged between the first circuit board and the display panel.

[0019] Thus, the connecting adhesive layer can connect the first circuit board and the display panel, so as to ensure the stability of the entire display module.

[0020] In some embodiments, the display module further includes a shielding layer, which is arranged on a side of the driving chip away from the first circuit board.

[0021] Thus, the shielding layer can shield electromagnetic influence and improve the anti-electromagnetic interference capability.

[0022] In some embodiments, the shielding layer comprises a surrounding part and a connecting part connected together, the surrounding part is arranged on the side of the driving chip away from the display panel, and the connecting part extends from the surrounding part to the side close to the display panel and connects the display panel.

[0023] In this way, the surrounding part of the shielding layer can form a space surrounding the circuit board and the driving chip with the display panel, thereby improving the protection capability of the shielding layer.

[0024] In some embodiments, the display module further comprises a sealing adhesive layer configured to connect the surrounding part and the peripheral area.

[0025] In this way, the sealing adhesive layer cooperates with the shielding layer and the display panel to form a closed space to ensure the stable operation of the circuit board and the driving chip.

[0026] In some embodiments, the display module further comprises a flame-retardant adhesive layer arranged on the side of the sealing adhesive layer away from the connecting part.

[0027] In this way, the flame-retardant adhesive layer can improve the flame-retardant capability of the display module.

[0028] The display device of the embodiments of the present application comprises the display module of any one of the above embodiments.

[0029] The beauty instrument of the embodiments of the present application comprises the display module of any one of the above embodiments.

[0030] The vehicle of the embodiments of the present application comprises the display module of any one of the above embodiments.

[0031] In the display module, the display device, and the beauty instrument and the vehicle of the embodiments of the present application, the display module comprises a display panel, a driving chip, and a circuit board assembly, the display panel comprises a display area and a peripheral area arranged around the display area, the driving chip is arranged on the backlight side of the display panel and is arranged spaced apart from the display panel, the orthographic projection of the driving chip on the display panel is located inside the peripheral area, and the circuit board assembly is arranged between the display panel and the driving chip and connects the display panel and the driving chip, respectively. In this way, the heat generating devices such as the driving chip can be arranged spaced apart in the peripheral area of the display panel, thereby effectively avoiding affecting the display area and prolonging the service life of the display panel.

[0032] Additional aspects and advantages of the present application will be in part apparent and in part pointed out hereinafter. BRIEF DESCRIPTION OF DRAWINGS

[0033] The above and / or additional aspects and advantages of the present application will become apparent and more readily appreciated from the following description, taken in conjunction with the following drawings in which:

[0034] Figure 1 is a cross-sectional structure schematic diagram of a display module of an embodiment of the present application;

[0035] Figure 2 is another cross-sectional structure schematic diagram of a display module of an embodiment of the present application;

[0036] Figure 3 is a module schematic diagram of a display device of an embodiment of the present application;

[0037] Figure 4 is a module schematic diagram of a beauty instrument of an embodiment of the present application;

[0038] Figure 5 is a module schematic diagram of a vehicle of an embodiment of the present application.

[0039] Main element symbol explanation:

[0040] Display module 100;

[0041] Display panel 10, display area 11, peripheral area 12, driving chip 20, circuit board assembly 30, first circuit board 31, first side 311, second side 312, second circuit board 32, first end 321, second end 322, connecting glue layer 40, shielding layer 50, surrounding part 51, connecting part 52, closed glue layer 60, flame-retardant glue layer 70, cover plate layer 80, optical glue layer 90, polarizer layer 110, module support 120, control chip 130, ink layer 140, display device 200, beauty instrument 300, vehicle 400. DETAILED DESCRIPTION

[0042] Embodiments of the present application are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the accompanying drawings are exemplary and are only used to explain the present application and cannot be understood as a limitation of the present application.

[0043] In the present application, unless specifically defined and limited otherwise, "on" or "under" of a first feature with respect to a second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, "over", "above" and "on" of a first feature with respect to a second feature include that the first feature is directly above and obliquely above the second feature, or only means that the first feature is higher in horizontal height than the second feature. "Under", "below" and "under" of a first feature with respect to a second feature include that the first feature is directly below and obliquely below the second feature, or only means that the first feature is lower in horizontal height than the second feature.

[0044] The following disclosure provides many different embodiments, or examples, for implementing different structures of the present application. For the purpose of simplification, the components and arrangements of specific examples are described in the following. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeatedly refer to numbers and / or letters in different examples, and such repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those skilled in the art can realize the application of other processes and / or the use of other materials.

[0045] Please refer to Figure 1 and Figure 2 , the display module 100 of the embodiment of the present application includes a display panel 10, a driving chip 20 and a circuit board assembly 30, the display panel 10 includes a display area 11 and a peripheral area 12 arranged around the display area 11, the driving chip 20 is arranged on the backlight side of the display panel 10 and is arranged spaced apart from the display panel 10, the driving chip 20 is in the orthographic projection of the display panel 10 inside the peripheral area 12, and the circuit board assembly 30 is arranged between the display panel 10 and the driving chip 20 and respectively connected to the display panel 10 and the driving chip 20.

[0046] In the display module 100 of the embodiment of the present application, the display module 100 includes a display panel 10, a driving chip 20 and a circuit board assembly 30, the display panel 10 includes a display area 11 and a peripheral area 12 arranged around the display area 11, the driving chip 20 is arranged on the backlight side of the display panel 10 and is arranged spaced apart from the display panel 10, the driving chip 20 is in the orthographic projection of the display panel 10 inside the peripheral area 12, and the circuit board assembly 30 is arranged between the display panel 10 and the driving chip 20 and respectively connected to the display panel 10 and the driving chip 20. In this way, the heat generating devices such as the driving chip 20 can be arranged spaced apart in the peripheral area 12 of the display panel 10, effectively avoiding affecting the display area 11 and prolonging the service life of the display panel 10.

[0047] In the display module 100 of the embodiment of the present application, the display module 100 comprises a display panel 10, a driving chip 20 and a circuit board assembly 30. The display panel 10 is divided into a display area 11 and a peripheral area 12 arranged around the display area 11. The driving chip 20 is arranged on the backlight side of the display panel 10 and is spaced apart from the display panel 10, and the orthographic projection of the driving chip 20 is located inside the peripheral area 12 of the display panel 10, avoiding corresponding to the display area 11. This arrangement enables the driving chip 20 and other heat generating devices to be away from the main display area 11, thereby avoiding affecting the display area 11 and helping to reduce the temperature of the display area 11 and prolong the service life of the display panel 10.

[0048] Specifically, the circuit board assembly 30 is arranged between the display panel 10 and the driving chip 20 and is connected to the display panel 10 and the driving chip 20, respectively. Such a design not only makes the assembly of the display module 100 more compact and efficient, but also ensures the connection reliability and stability between the display panel 10 and the driving chip 20. In summary, by spacing the driving chip 20 and other heat generating devices in the peripheral area 12 of the display panel 10, the display module 100 of the present application can effectively reduce the thermal influence on the main display area 11, thereby prolonging the service life of the display panel 10 and improving the reliability and stability of the entire display module 100.

[0049] Further, such spacing arrangement of the embodiment of the present application also helps to optimize the heat dissipation effect of the display module 100. By concentrating the heat generating devices in the peripheral area 12, the heat can be effectively dispersed and the accumulation of heat inside the display module 100 can be reduced, thereby reducing the working temperature of the entire display module 100. A low temperature environment helps to improve the performance and stability of the display panel 10 and further prolong its service life. The design of the orthographic projection of the driving chip 20 inside the peripheral area 12 also helps to optimize the display effect. Since the driving chip 20 is matched with the layout of the display panel 10, the path length of the circuit signal transmission can be reduced, the signal transmission delay can be reduced, and the response speed and stability of the display image can be improved. By placing the circuit board assembly 30 between the display panel 10 and the driving chip 20, not only is the connection more convenient and reliable, but also the interference between the circuit board assembly 30 and the external environment can be effectively isolated, thereby improving the anti-interference ability and reliability of the entire display module 100.

[0050] The display module 100 of the embodiments of the present application not only considers the optimization of heat management and display effect in structural design, but also has certain flexibility and applicability. Since the heat generating devices such as the driving chip 20 are arranged at the peripheral area 12 of the display panel 10, this design is not only suitable for conventional flat display panels 10, but also can be easily applied to curved, flexible or other non-traditional shape display panels 10. By arranging the circuit board assembly 30 between the display panel 10 and the driving chip 20 and connecting them respectively, the display module 100 of the present application is also more convenient when repairing and maintaining. The connection between the circuit board assembly 30 and the display panel 10 and the driving chip 20 is in a relatively independent position, which makes it possible to replace or repair one of the components without affecting the working state of the other components, reducing the complexity and time cost of maintenance. This structural design also helps to reduce the manufacturing cost of the entire display module 100. By reasonably arranging each component and optimizing the assembly process, the material and labor costs can be effectively reduced, and the production efficiency and capacity utilization can be improved, thereby reducing the overall manufacturing cost of the display module 100.

[0051] In the display module 100 of the embodiments of the present application, the display module 100 can be applied in products with a larger bottom shell space, and the heat generating elements such as the driving chip 20 are placed in this space. By effectively managing the heat distribution of the heat generating devices, not only the service life of the display panel 10 can be prolonged, but also the power consumption of the entire device can be reduced. Low power consumption design not only helps to prolong the battery life of the device, but also helps to reduce the heating problem of the device during long time use, improving the stability and comfort of the device.

[0052] In the display module 100 of the embodiments of the present application, the application range of the display module 100 is not limited to meet different needs. For example, whether it is a smart phone, a tablet computer, a television or a car display or an aerospace display, etc., the appropriate display module 100 can be selected according to the specific needs, so as to realize more personalized product design and customized user experience.

[0053] In addition, the display module 100 of the embodiment of the present application comprises a cover layer 80, an optically clear adhesive (OCA) layer 90, a polarizer layer 110, a display panel 10 and a module support 120 which are sequentially stacked, the module support 120 is arranged at the backlight side of the display panel 10, and the cover layer 80, the OCA layer 90 and the polarizer layer 110 are all arranged at the light-emitting side of the display panel 10. The display module 100 of the embodiment of the present application further comprises an ink layer 140 and a structure layer such as an anisotropic conductive film (ACF) which are not shown in the figure, and the specific structure is not limited herein. In an embodiment, the ink layer 140 is arranged at the bottom of the display module 100 to shield part of the display panel 10, thereby forming a peripheral area 12 which is used to shield other accessories in the display module 100.

[0054] Please refer to Figure 1 and Figure 2 In some embodiments, the circuit board assembly 30 comprises a first circuit board 31 and a second circuit board 32, the driving chip 20 is arranged at the side of the first circuit board 31 away from the display panel 10, and the second circuit board 32 is connected to the first circuit board 31 and the display panel 10 respectively.

[0055] In this way, the driving chip 20 can drive the display panel 10 to work through the first circuit board 31 and the second circuit board 32, and meanwhile, the first circuit board 31 and the second circuit board 32 can block the heat generated by the driving chip 20 from affecting the display panel 10.

[0056] Specifically, the first circuit board 31 and the second circuit board 32 are ingeniously arranged between the driving chip 20 and the display panel 10 to achieve more efficient heat dispersion and isolation. The driving chip 20 is arranged at the side of the first circuit board 31 away from the display panel 10, and the second circuit board 32 is connected to the first circuit board 31 and the display panel 10 respectively. This layout makes the driving chip 20 drive the display panel 10 to work through the first circuit board 31 and the second circuit board 32. Meanwhile, the space between the first circuit board 31 and the second circuit board 32 can play a heat-blocking role, effectively blocking the heat generated by the driving chip 20 from affecting the display panel 10. In this way, not only the heat management capability of the display module 100 is improved, but also the heat influence of the driving chip 20 on the display panel 10 is reduced, further prolonging the service life of the display panel 10. At the same time, the separate connection of the first circuit board 31 and the second circuit board 32 also helps to reduce the interference during circuit signal transmission, improving the signal stability and reliability of the display module 100.

[0057] Further, the design of the first circuit board 31 and the second circuit board 32 also has certain flexibility and scalability. Since they can be connected to the driving chip 20 and the display panel 10 respectively and are arranged between the driving chip 20 and the display panel 10, they can easily adapt to display modules 100 of different sizes and shapes, including flat, curved, flexible, and other types. In addition, the gap between the first circuit board 31 and the second circuit board 32 also provides the possibility of further optimizing the performance and functionality of the display module 100. Additional components such as heat sinks, power management modules, and control chips 130 can be added in this gap to further improve the thermal management capability and stability of the display module 100, or other functional modules such as touch sensors, environmental sensors, etc. can be added to expand the functionality of the display module 100.

[0058] Referring to Figure 1 and Figure 2 In some embodiments, the second circuit board 32 is a flexible circuit board.

[0059] In this way, the first circuit board 31 and the display panel 10 can be arranged on different planes, and the second circuit board 32 can be a flexible circuit board so that the second circuit board 32 can be bent to connect the first circuit board 31 and the display panel 10.

[0060] Specifically, the second circuit board 32 is designed as a flexible circuit board, which further improves the flexibility and applicability of the display module 100. The flexible circuit board has bending and folding properties and can bend or fold within a certain range, so it can adapt to different installation space and shape requirements. Since the second circuit board 32 is flexible, the first circuit board 31 and the display panel 10 can be arranged on different planes, and the second circuit board 32 can be attached to different planes to connect the first circuit board 31 and the display panel 10. This design makes the display module 100 more flexible to adapt to various complex device structures and appearance design requirements, including curved, arc-shaped, folded, and other forms. By using a flexible circuit board as the second circuit board 32, not only can more personalized and innovative display module 100 designs be achieved, but also the manufacturing cost of the display module 100 can be reduced. Compared with rigid circuit boards, flexible circuit boards are lighter and thinner in material, lower in cost, and can be mass-produced in the production process, thus reducing overall manufacturing costs and improving production efficiency.

[0061] Further, the use of flexible circuit boards can also improve the reliability and stability of the display module 100. Since flexible circuit boards have good anti-vibration and anti-impact performance, they can better adapt to various environments and challenges during device use, thereby improving the durability and reliability of the display module 100. Since flexible circuit boards have bending properties, they can more easily adapt to different shapes and sizes of device housings, enabling more compact and efficient installation. This allows the display module 100 to be more flexible in embedding into various electronic devices, whether it is a curved phone, a folding screen TV, or other innovative devices, and can easily achieve perfect integration with the appearance of the device.

[0062] Further, the material properties of flexible circuit boards also make their performance superior in high-temperature or low-temperature environments. In contrast, rigid circuit boards may be affected by thermal expansion and contraction under extreme temperature conditions, causing circuit connections to break or components to be damaged. In contrast, flexible circuit boards, due to their material properties, can better adapt to temperature changes, maintain stable circuit connections, and improve the reliability and stability of the entire display module 100 in different environments. In addition, the design of flexible circuit boards also helps to reduce the number of connection points between circuit boards, thereby reducing the risk of connection point failure. Rigid circuit boards may have problems such as breakage of solder or connection lines at connection points, while flexible circuit boards can use a more continuous line layout, reducing the number of connection points, improving the reliability and stability of the overall connection, and reducing the likelihood of failure.

[0063] Referring to Figure 1 and Figure 2 In some embodiments, the second circuit board 32 includes a first end 321 and a second end 322, the first end 321 being connected to the first circuit board 31, and the second end 322 being connected to the display panel 10.

[0064] In this way, the first end 321 and the second end 322 of the second circuit board 32 can be connected on different planes, respectively, to ensure that the driving chip 20 can be connected and drive the display panel 10 through the second circuit board 32.

[0065] Specifically, the second circuit board 32 is subdivided into a first end 321 and a second end 322, improving the installation flexibility and adaptability of the display module 100. The first end 321 is connected to the first circuit board 31, while the second end 322 is directly connected to the display panel 10, so that the two ends of the second circuit board 32 can be connected on different planes respectively, to ensure that the driving chip 20 can be connected to and drive the display panel 10 through the second circuit board 32. In addition, the second circuit board 32 also helps to reduce the length of the connection line between the driving circuit and the display panel 10, reduce the impedance and power consumption of signal transmission, and improve the performance stability and display effect of the display module 100. The shorter connection line length can reduce the delay and distortion of signal transmission, ensuring that the driving circuit can accurately drive the display panel 10 and provide stable and clear image display.

[0066] Please refer to Figure 1 and Figure 2 In some embodiments, the first end 321 is connected to the first circuit board 31 near one end of the driving chip 20.

[0067] In this way, the second circuit board 32 and the driving chip 20 can be arranged in a relatively close position, that is, the position directly opposite the peripheral area 12 of the display panel 10, so that the driving chip 20 can quickly respond to and control the display panel 10 through the circuit board.

[0068] Specifically, the first end 321 is arranged near the side of the first circuit board 31 close to the driving chip 20, so that the second circuit board 32 and the driving chip 20 can be arranged in a relatively close position, that is, the position directly opposite the peripheral area 12 of the display panel 10. In this way, the driving chip 20 can quickly respond to and control the display panel 10 through the circuit board. By arranging the first end 321 close to the driving chip 20, a more compact connection between the driving chip 20 and the second circuit board 32 is achieved, thereby accelerating the speed and response time of electrical signal transmission. This compact layout helps to reduce the path length and delay of signal transmission, improving the rapid response capability of the display module 100 to input signals, thereby more timely updating and displaying image content.

[0069] Further, arranging the second circuit board 32 and the driving chip 20 in close proximity also helps to reduce the length and impedance of the circuit line, further improving the stability and reliability of signal transmission. The shorter connection line can reduce signal attenuation and interference during signal transmission, ensuring that the driving chip 20 can accurately control the display panel 10 to present a clearer and more stable image effect. By arranging the first end 321 close to the driving chip 20, the second circuit board 32 and the driving chip 20 can be arranged in a relatively close position, so that the driving chip 20 can quickly respond to and control the display panel 10 through the circuit board, improving the performance and display effect of the display module 100.

[0070] Referring to Figure 1 and Figure 2 In some embodiments, the first end 321 is connected to the first circuit board 31 away from the driving chip 20.

[0071] In this way, the second circuit board 32 and the driving chip 20 can be arranged at a relatively far position, so that more space can be left for the bottom of the display module 100, and thus the driving chip 20 can be arranged at a position farther away from the display area 11.

[0072] Specifically, the first end 321 is arranged on the side of the first circuit board 31 away from the driving chip 20, so that the second circuit board 32 and the driving chip 20 can be arranged at a relatively far position, effectively leaving more space for the bottom of the display module 100. Because the first end 321 is far away from the driving chip 20, more space can be left for the bottom of the display module 100, which provides more options for the layout of the driving chip 20. By placing the driving chip 20 at a position away from the display area 11, the physical interference and heat impact on the display area 11 can be minimized. This helps to reduce the impact of the heat generated by the driving chip 20 on the display panel 10, prolongs the service life of the display panel 10, and improves the stability and reliability of the entire display module 100.

[0073] Referring to Figure 1 and Figure 2 In some embodiments, the first circuit board 31 includes a first side 311 and a second side 312 opposite to each other, the first side 311 faces the display panel 10, and the second side 312 faces away from the display panel 10, and the first end 321 and the driving chip 20 are both connected to the second side 312.

[0074] In this way, the connecting part 52 of the first end 321 and the driving chip 20 are both arranged on the second side 312 to reduce the impact on the display panel 10.

[0075] Specifically, the first circuit board 31 is designed to have a first side 311 facing the display panel 10 and a second side 312 facing away from the display panel 10. At the same time, the first end 321 and the driving chip 20 are both connected at the second side 312. In this way, the impact on the display panel 10 is effectively reduced, providing better protection for the stability and reliability of the display module 100. By placing the connection part 52 of the first end 321 and the driving chip 20 at the second side 312, the adverse factors such as heat and electromagnetic radiation between the driving chip 20 and the display panel 10 can be isolated. The second side 312 faces away from the display panel 10, so that any potential heat or electromagnetic interference will not directly affect the normal operation of the display panel 10. This helps to maintain the stability and long-term performance of the display panel 10, prolonging its service life. Concentrating the connection part 52 of the first end 321 and the driving chip 20 at the second side 312 also helps to simplify the design and layout of the display module 100. By concentrating the arrangement of the connection part 52 and the driving chip 20, the wiring and component arrangement of the circuit board can be more effectively planned, reducing the complexity and length of the circuit on the board, improving the reliability and stability of the entire display module 100.

[0076] Referring to Figure 1 and Figure 2 In some embodiments, the display module 100 further comprises a connecting adhesive layer 40, which is arranged between the first circuit board 31 and the display panel 10.

[0077] In this way, the connecting adhesive layer 40 can connect the first circuit board 31 and the display panel 10 to ensure the stability of the entire display module 100.

[0078] Specifically, the connecting adhesive layer 40 is arranged between the first circuit board 31 and the display panel 10, serving as a connection and fixation. The introduction of the connecting adhesive layer 40 ensures the tight connection between the first circuit board 31 and the display panel 10, thereby ensuring the connection stability and reliability of the entire display module 100. The connecting adhesive layer 40 acts like an adhesive, tightly bonding the first circuit board 31 and the display panel 10 together. By filling the small gaps and spaces between the first circuit board 31 and the display panel 10, the connecting adhesive layer 40 can effectively prevent their movement or loosening, ensuring the stability of their position and alignment. This is crucial for the long-term stable operation of the display module 100, especially in mobile devices or in a vibrating environment. In addition, the connecting adhesive layer 40 can also improve the shock resistance and impact resistance of the display module 100. During daily use or transportation, the device may be subjected to varying degrees of vibration or impact, and the connecting adhesive layer 40 can effectively absorb and disperse these external forces, reducing the impact on the circuit board and the display panel 10, and reducing the risk of device damage.

[0079] Referring to Figure 1 and Figure 2 In some embodiments, the display module 100 further comprises a shielding layer 50 covering the side of the driving chip 20 away from the first circuit board 31.

[0080] In this way, the shielding layer 50 can shield electromagnetic influence and improve the anti-electromagnetic interference capability.

[0081] Specifically, the shielding layer 50 is designed to cover the side of the driving chip 20 away from the first circuit board 31, and its main function is to shield electromagnetic influence to improve the anti-electromagnetic interference capability of the entire display module 100. The shielding layer 50 effectively blocks and absorbs electromagnetic radiation and interference from the external environment. It can effectively reduce the influence of electromagnetic waves on the driving chip 20 and other electronic components, ensuring their normal work and stability. Especially in high-frequency and high-density electronic devices, electromagnetic interference may cause signal distortion, performance degradation, and even device failure, so the introduction of the shielding layer 50 is crucial to ensure the normal operation of the display module 100. In addition, the shielding layer 50 is precisely positioned on the side of the driving chip 20 away from the first circuit board 31, which enables it to block electromagnetic interference from the surroundings of the driving chip 20 to the maximum extent. By placing the shielding layer 50 in this position, the display module 100 can ensure effective shielding while minimizing the impact on other circuit components, maintaining the stability and performance of the entire system.

[0082] Referring to Figure 1 and Figure 2 In some embodiments, the shielding layer 50 comprises a surrounding part 51 and a connecting part 52 connected together, the surrounding part 51 is arranged on the side of the driving chip 20 away from the display panel 10, and the connecting part 52 extends from the surrounding part 51 to the side close to the display panel 10 and connects the display panel 10.

[0083] In this way, the surrounding part 51 of the shielding layer 50 can form a space surrounding the circuit board and the driving chip 20 with the display panel 10, improving the protection capability of the shielding layer 50.

[0084] Specifically, the surrounding part 51 is arranged on the side of the driving chip 20 away from the display panel 10, and the connecting part 52 extends from the surrounding part 51 to the side close to the display panel 10 and is connected to the display panel 10. This design enables the shielding layer 50 to form a space around the display panel 10 and the driving chip 20, thereby significantly improving the shielding ability of the shielding layer 50. By arranging the surrounding part 51 on the side of the driving chip 20 away from the display panel 10, the shielding layer 50 can effectively isolate the driving chip 20 and the circuit components around it, forming a closed space. In this way, the shielding layer 50 can effectively isolate external electromagnetic radiation and interference from the outside, preventing their influence on the driving chip 20 and other electronic components. At the same time, the connecting part 52 is closely connected to the display panel 10, ensuring the sealing between the shielding layer 50 and the display panel 10, and further enhancing the shielding effect of the shielding layer 50.

[0085] Further, the introduction of the shielding layer 50 also helps to improve the reliability and durability of the display module 100. The shielding layer 50 not only prevents external electromagnetic interference from affecting electronic components, but also effectively prevents the driving chip 20 and other key components from being mechanically damaged or corroded, prolonging the service life of the display module 100. In addition, since the connecting part 52 extends to the side close to the display panel 10 and is connected to the display panel 10, the coverage of the shielding layer 50 is expanded, forming a complete shielding area. This shielding area surrounds the display panel 10 and the driving chip 20, effectively wrapping them inside, forming a closed protective environment. This wrap-around design greatly enhances the shielding ability of the shielding layer 50 against electromagnetic interference, improving the stability and reliability of the entire display module 100.

[0086] Please refer to Figure 1 and Figure 2 In some embodiments, the display module 100 further includes a sealing adhesive layer 60 configured to connect the surrounding part 51 and the peripheral area 12.

[0087] In this way, the sealing adhesive layer 60 cooperates with the shielding layer 50 and the display panel 10 to form a closed space to ensure the stable operation of the circuit board and the driving chip 20.

[0088] Specifically, the sealing adhesive layer 60 is configured to connect the surrounding part 51 and the peripheral area 12, and its main function is to form a closed space, cooperating with the shielding layer 50 and the display panel 10, to ensure the stable operation of the circuit board and the driving chip 20. The circuit board and the driving chip 20 are effectively isolated inside. This closed design can prevent dust, water vapor and other substances in the external environment from entering the inside of the display module 100, reducing the risk of pollution or corrosion of the circuit board and the driving chip 20, thereby ensuring their stable operation and long-term reliability. At the same time, the sealing adhesive layer 60 also helps to prevent the display module 100 from being affected by mechanical damage or vibration. The sealing adhesive layer 60 has a certain elasticity and shock absorption, which can effectively buffer external impact or vibration and protect the circuit board and the driving chip 20 from damage. This is particularly important for mobile devices or devices that are frequently transported, which can effectively prolong the service life of the display module 100.

[0089] Further, the sealing adhesive layer 60 also helps to improve the waterproof performance of the display module 100. By sealing the circuit board and the driving chip 20 inside the adhesive layer, it can effectively prevent water vapor, liquid and other external liquids from penetrating into the inside of the display module 100, reducing the risk of water corrosion or short circuit of the circuit board and the driving chip 20, and further improving the reliability and stability of the display module 100.

[0090] Please refer to Figure 1 and Figure 2 In some embodiments, the display module 100 further comprises a fire-retardant adhesive layer 70, which is arranged on the side of the sealing adhesive layer 60 away from the connecting part 52.

[0091] In this way, the fire-retardant adhesive layer 70 can improve the fire-retardant ability of the display module 100.

[0092] Specifically, the fire-retardant adhesive layer 70 is arranged on the side of the sealing adhesive layer 60 away from the connecting part 52, and its main function is to improve the fire-retardant ability of the display module 100, thereby enhancing its fire resistance. Once exposed to high temperature, the fire-retardant adhesive layer 70 can quickly act to stop the spread and diffusion of flames, effectively preventing the spread of fire to the inside of the display module 100, reducing the damage and danger of fire to the device. This is of great significance for some occasions with high requirements for fire safety, such as public places, vehicles 400, etc. By arranging the fire-retardant adhesive layer 70 on the side of the sealing adhesive layer 60 away from the connecting part 52, the effect of the fire-retardant adhesive layer 70 is effectively guaranteed. Such a design makes the fire-retardant adhesive layer 70 cover as much as possible the key parts of the entire display module 100, ensuring that it can play a fire-retardant role in time when a fire occurs, and minimizing the impact of fire on the device.

[0093] Please refer to Figure 3The display device 200 of the embodiment of the present application comprises the display module 100 of any one of the above embodiments.

[0094] Please refer to Figure 4 The cosmetic instrument 300 of the embodiment of the present application comprises the display module 100 of any one of the above embodiments.

[0095] Please refer to Figure 5 The vehicle 400 of the embodiment of the present application comprises the display module 100 of any one of the above embodiments.

[0096] In the display module 100, the display device 200, the cosmetic instrument 300 and the vehicle 400 of the embodiment of the present application, the display module 100 comprises the display panel 10, the driving chip 20 and the circuit board assembly 30, the display panel 10 comprises the display area 11 and the peripheral area 12 arranged around the display area 11, the driving chip 20 is arranged on the backlight side of the display panel 10 and is arranged spaced apart from the display panel 10, the driving chip 20 is located inside the peripheral area 12 in the orthographic projection of the display panel 10, and the circuit board assembly 30 is arranged between the display panel 10 and the driving chip 20 and is connected with the display panel 10 and the driving chip 20 respectively. In this way, the heat generating devices such as the driving chip 20 can be arranged spaced apart from the peripheral area 12 of the display panel 10, so as to effectively avoid affecting the display area 11 and prolong the service life of the display panel 10.

[0097] In the embodiment of the present application, the specific type of the display device 200 is not limited, so as to meet different requirements. In addition, the cosmetic instrument 300 and the vehicle 400 to which the display module 100 of the embodiment of the present application is applied are also not limited. For example, the display module 100 can be applied on the vehicle 400 such as aerospace, so as to improve the safety of the vehicle 400.

[0098] In the description of the embodiments of the present application, the terms “first”, “second” are only used for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by “first”, “second” can explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, the meaning of “a plurality of” is two or more, unless otherwise specifically limited.

[0099] In the description of the specification, the description using the terms "one embodiment", "some embodiments", "certain embodiments", "an example", "a specific example", or "some examples" etc. means that the particular feature, structure, material or characteristic being described is included in at least one embodiment or example of the application. The illustrative appearances of the above-mentioned terms in various places in the specification are not necessarily intended to refer to the same embodiment or example. Moreover, the particular features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0100] Although the embodiments of the present application have been shown and described above, it is understood that the above-described embodiments are exemplary and are not to be construed as limiting the present application, and that variations, modifications, substitutions and changes can be made to the above-described embodiments by those skilled in the art in the range of the present application.

Claims

1. A display module, characterized by The display module comprises: a display panel comprising a display area and a peripheral area surrounding the display area; a driving chip disposed on a backlight side of the display panel and spaced apart from the display panel, wherein a normal projection of the driving chip on the display panel is located inside the peripheral area; a circuit board assembly disposed between the display panel and the driving chip and connected to the display panel and the driving chip respectively.

2. The display module of claim 1, wherein, The circuit board assembly comprises a first circuit board and a second circuit board, wherein the driving chip is disposed on a side of the first circuit board away from the display panel, and the second circuit board is connected to the first circuit board and the display panel respectively.

3. The display module of claim 2, wherein, The second circuit board is a flexible circuit board.

4. The display module of claim 3, wherein, The second circuit board comprises a first end and a second end, wherein the first end is connected to the first circuit board, and the second end is connected to the display panel.

5. The display module of claim 4, wherein, The first end is connected to an end of the first circuit board close to the driving chip.

6. The display module of claim 4, wherein, The first end is connected to an end of the first circuit board away from the driving chip.

7. The display module of claim 5 or 6, wherein, The first circuit board comprises opposite first and second sides, wherein the first side faces the display panel, the second side faces away from the display panel, and the first end and the driving chip are both connected to the second side.

8. The display module of claim 2, wherein, The display module further comprises a connecting adhesive layer disposed between the first circuit board and the display panel.

9. The display module of claim 2, wherein, The display module further comprises a shielding layer covering a side of the driving chip away from the first circuit board.

10. The display module of claim 9, wherein, The shielding layer comprises a surrounding part and a connecting part connected together, wherein the surrounding part is disposed on a side of the driving chip away from the display panel, and the connecting part extends from the surrounding part to a side close to the display panel and is connected to the display panel.

11. The display module of claim 10, wherein, The display module further comprises a sealing adhesive layer configured to connect the surrounding part and the peripheral area.

12. The display module of claim 11, wherein, The display module further comprises a flame-retardant adhesive layer disposed on a side of the sealing adhesive layer away from the connecting part.

13. A display device comprising: The display module comprises any one of claims 1-12.

14. A cosmetic device, characterized by The display module comprises any one of claims 1-12.

15. A vehicle, characterized by The display module comprises any one of claims 1-12.

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