Semiconductor heat treatment equipment

Abstract

The invention provides semiconductor heat treatment equipment which comprises a process pipe, a base, a temperature measuring component, a guide component and an adjusting assembly, the process pipe is vertically arranged on the base, the process pipe and the base are coaxially arranged, the temperature measuring component comprises a horizontal section and a vertical section, the horizontal section penetrates through the base from the outside of the base to the inside of the base, and the vertical section is partially arranged in the process pipe. The vertical section is partially arranged in the base and connected with the horizontal section, and the axial direction of the vertical section is parallel to the axial direction of the process pipe; the guide component is arranged outside the base and connected with the base, and the adjusting assembly is arranged outside the base, connected with the horizontal section, matched with the guide component and used for adjusting the position of the horizontal section in the axial direction of the horizontal section under the guidance of the guide component so as to adjust the position of the vertical section in the radial direction of the process pipe. According to the semiconductor heat treatment equipment provided by the invention, the applicability of the temperature measuring component can be improved, and the use safety of the temperature measuring component can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, in particular, to a semiconductor heat treatment equipment. BACKGROUND

[0002] The temperature uniformity of a semiconductor vertical furnace, which is a semiconductor heat treatment equipment, has an impact on the film forming quality of the semiconductor vertical furnace.

[0003] An existing semiconductor vertical furnace includes a process tube, a temperature measuring component and a heating component, wherein the process tube is vertically arranged, and in order to improve the production capacity, the height of the process tube is usually more than 1500mm, the heating component is arranged outside the process tube, the temperature measuring component includes a horizontal section and a vertical section, the horizontal section penetrates from outside the process tube to inside the process tube, the vertical section is arranged inside the process tube and connected with the horizontal section, and extends from the bottom to the top of the process tube. In a semiconductor heat treatment process, a plurality of wafers are carried by a wafer boat in a vertical direction, the heating component heats the process tube by heat radiation, the temperature measuring component detects the temperature of a plurality of temperature zones from the bottom to the top of the process tube, and the semiconductor vertical furnace can control the heating power of the heating component according to the temperature measurement result, so as to control the temperature uniformity of the semiconductor vertical furnace.

[0004] In actual application, different process tubes and film forming processes have different requirements for process temperature, so different process tubes and film forming processes have different requirements for the distance between the temperature measuring component and the wafer. However, the distance between the temperature measuring component and the wafer of the existing semiconductor vertical furnace cannot be adjusted, which causes poor applicability of the temperature measuring component. In addition, when the existing semiconductor vertical furnace performs a semiconductor heat treatment process, the part of the temperature measuring component inside the process tube is in a vacuum environment inside the process tube, while the inside of the temperature measuring component is in communication with the atmosphere, and the inside of the temperature measuring component is in a normal pressure environment. Therefore, the temperature measuring component may be sucked towards the inside of the process tube along the horizontal section of the temperature measuring component due to the pressure difference between the inside and the outside, causing the temperature measuring component to collide with the wafer boat, and then causing process failure or product damage. SUMMARY

[0005] The present application aims to at least solve one of the technical problems in the prior art, and proposes a semiconductor heat treatment equipment which can improve the applicability of the temperature measuring component and improve the use safety of the temperature measuring component.

[0006] The application provides a semiconductor heat treatment device, which comprises a process tube, a base, a temperature measuring component, a guiding component and an adjusting assembly, the process tube is vertically arranged on the base, and the process tube and the base are coaxially arranged, the temperature measuring component comprises a horizontal section and a vertical section, the horizontal section penetrates the base from outside to inside, and the vertical section is partially arranged in the process tube and partially arranged in the base and connected with the horizontal section, and the axial direction of the vertical section is parallel to the axial direction of the process tube.

[0007] The guiding component is arranged outside the base and connected with the base, the adjusting assembly is arranged outside the base and connected with the horizontal section and cooperatively arranged with the guiding component, and is used for adjusting the position of the horizontal section in the axial direction of the horizontal section under the guidance of the guiding component, so as to adjust the position of the vertical section in the radial direction of the process tube.

[0008] Optionally, the adjusting assembly comprises a fixing component and an adjusting component, the fixing component is connected with the base, the guiding component is connected with the base through the fixing component, and the axial direction of the guiding component is parallel to the axial direction of the horizontal section, and the adjusting component can move relative to the guiding component in the axial direction of the guiding component, so as to adjust the position of the horizontal section in the axial direction of the horizontal section.

[0009] Optionally, the fixing component comprises a fixing tube and a fixing frame, the guiding component comprises a plurality of guiding screws, and the adjusting component comprises an adjusting block and a plurality of adjusting nuts.

[0010] The base is provided with a first through hole for the horizontal section to pass through, the fixing tube is fixed with the base and corresponds to the first through hole, and is used for allowing the horizontal section to pass through, the fixing frame is arranged on the outer circumferential wall of the fixing tube, a plurality of guiding screws are arranged on the fixing frame in the circumferential direction of the fixing tube, and the axial direction of each guiding screw is parallel to the axial direction of the horizontal section.

[0011] The horizontal section is provided with a fixing slot in the circumferential direction, a part of the adjusting block is fixedly inserted into the fixing slot, another part of the adjusting block is provided with a plurality of second through holes for allowing the plurality of guiding screws to pass through one by one, at least two adjusting nuts are arranged on each guiding screw, and the adjusting nuts are arranged on both sides of each second through hole.

[0012] Optionally, the adjusting block is further provided with a limiting structure, and the horizontal section is further provided with a cooperative structure, the limiting structure is limitedly cooperated with the cooperative structure, and is used for limiting the rotation of the horizontal section.

[0013] Optionally, the limiting structure is a limiting socket in polygonal shape, and the matching structure is a polygonal shape matching the limiting socket.

[0014] Optionally, the semiconductor heat treatment equipment further comprises a sealing assembly sealingly matched with the fixed tube and the horizontal section passing through the fixed tube, for sealing the gap between the fixed tube and the horizontal section.

[0015] Optionally, the sealing assembly comprises a sealing ring, a top ring and a locking nut, the inner circumferential wall of the fixed tube has a stepped surface, the stepped surface is away from the interior of the base and protrudes relative to the inner circumferential wall of the fixed tube, the sealing ring and the top ring are both sleeved on the horizontal section, and the sealing ring is located between the top ring and the stepped surface, the outer circumferential wall of the fixed tube is provided with a fastening thread, the locking nut is threadedly matched with the fastening thread and abuts against the top ring.

[0016] Optionally, the assembly channel in the fixed tube for the horizontal section to pass through comprises a first channel section and a second channel section, the first channel section is away from the interior of the base relative to the second channel section, and the radial dimension of the first channel section is greater than that of the second channel section, and the stepped surface is formed at the communication between the first channel section and the second channel section.

[0017] Optionally, the temperature measuring component comprises a thermocouple sleeve, a thermocouple sleeve and a thermocouple body, the thermocouple body is sleeved in the thermocouple sleeve and the thermocouple sleeve, the thermocouple body is used for detecting the temperature in the process tube, the thermocouple sleeve corresponds to the vertical section, and the thermocouple sleeve corresponds to the horizontal section.

[0018] Optionally, the semiconductor heat treatment equipment further comprises a heating component arranged outside the process tube, for heating the process tube.

[0019] The present application has the following beneficial effects:

[0020] The semiconductor heat treatment device provided by the application can adjust the position of the horizontal section in the axial direction of the horizontal section under the guidance of the guide component, so as to adjust the position of the vertical section in the radial direction of the process tube, thereby adjusting the distance between the vertical section and the wafer boat, and then adjusting the distance between the temperature measuring component and the wafer for different process tubes and film forming processes, and further improving the applicability of the temperature measuring component. BRIEF DESCRIPTION OF DRAWINGS BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 The structure schematic diagram of the semiconductor heat treatment provided by the embodiment of the application is provided.

[0022] Figure 2 The three-dimensional explosion structure schematic diagram of the adjusting assembly, the base and the temperature measuring component provided by the embodiment of the application is provided.

[0023] Figure 3 The structure schematic diagram of the distance between the vertical section of the temperature measuring component and the inner wall of one side of the process tube being X1 is provided.

[0024] Figure 4 The structure schematic diagram of the distance between the vertical section of the temperature measuring component and the inner wall of one side of the process tube being X2 is provided.

[0025] Figure 5 The structure schematic diagram of the temperature measuring component provided by the embodiment of the application is provided.

[0026] Figure 6 The structure schematic diagram of the fixing component and the base provided by the embodiment of the application is provided.

[0027] Figure 7 The structure schematic diagram of the adjusting baffle provided by the embodiment of the application is provided.

[0028] Figure 8 The three-dimensional cross-sectional structure schematic diagram of the fixing component and the base provided by the embodiment of the application is provided.

[0029] Figure 9 The cross-sectional structure schematic diagram of the fixing component and the base provided by the embodiment of the application is provided.

[0030] BRIEF DESCRIPTION OF DRAWINGS:

[0031] 11-process pipe; 12-base; 13-first through hole; 2-temperature measuring component; 21-horizontal section; 22-vertical section; 3-adjusting assembly; 31-fixing component; 311-fixing pipe; 312-fixing frame; 314-step surface; 32-adjusting component; 321-adjusting baffle; 322-adjusting nut; 323-second through hole; 324-limiting structure; 4-sealing assembly; 41-sealing ring; 42-top ring; 43-locking nut; 5-assembly channel; 51-first channel section; 52-second channel section; 6-heating component; 7-crystal boat; 8-guiding component.

[0032] 211-fixing slot; 212-matching structure; 22-vertical section; 23-thermocouple body; 3-adjusting assembly; 31-fixing component; 311-fixing pipe; 312-fixing frame; 314-step surface; 32-adjusting component; 321-adjusting baffle; 322-adjusting nut; 323-second through hole; 324-limiting structure; 4-sealing assembly; 41-sealing ring; 42-top ring; 43-locking nut; 5-assembly channel; 51-first channel section; 52-second channel section; 6-heating component; 7-crystal boat; 8-guiding component. DETAILED DESCRIPTION

[0033] In order to make the skilled in the art better understand the technical solutions of the present application, the semiconductor heat treatment equipment provided by the present application is described in detail below with reference to the drawings.

[0034] As shown in Figures 1-4 the embodiment of the present application provides a semiconductor heat treatment equipment, which comprises a process pipe 11, a base 12, a temperature measuring component 2 and an adjusting assembly 3. The process pipe 11 is vertically arranged on the base 12, and the process pipe 11 and the base 12 are coaxially arranged. The temperature measuring component 2 comprises a horizontal section 21 and a vertical section 22. The horizontal section 21 penetrates the base 12 from outside to inside of the base 12. Part of the vertical section 22 is arranged in the process pipe 11, and part of the vertical section 22 is arranged in the base 12 and connected with the horizontal section 21. The axial direction of the vertical section 22 is parallel to the axial direction of the process pipe 11. A guiding component 8 is arranged outside the base 12 and connected with the base 12. The adjusting assembly 3 is arranged outside the base 12 and connected with the horizontal section 21, and is arranged in cooperation with the guiding component 8. The adjusting assembly 3 is used to adjust the position of the horizontal section 21 in the axial direction of the horizontal section 21 under the guidance of the guiding component 8, so as to adjust the position of the vertical section 22 in the radial direction of the process pipe 11.

[0035] Specifically, in actual application, the process tube 11 can be vertically arranged on the base 12, the axial direction of the base 12 and the axial direction of the process tube 11 can both be vertical directions, the radial direction of the base 12 and the radial direction of the process tube 11 can both be horizontal directions, the horizontal section 21 can be horizontally arranged and pass through the base 12 from outside the base 12 to inside the base 12, the axial direction of the horizontal section 21 can be a horizontal direction, the radial direction of the horizontal section 21 can be a vertical direction, and the vertical section 22 can be vertically arranged and vertically extend from inside the base 12 to inside the process tube 11 in the axial direction of the base 12 and the axial direction of the process tube 11, the axial direction of the vertical section 22 can be a vertical direction, and the radial direction of the vertical section 22 can be a horizontal direction. In a semiconductor heat treatment process, the wafer boat 7 is vertically located in the process tube 11, the wafer boat 7 carries multiple wafers in a vertical direction, a heating component 6 can be arranged outside the process tube 11, the heating component 6 can heat the process tube 11 through heat radiation, the vertical section 22 of the temperature measuring component 2 can be located on one side of the wafer boat 7 and used to detect the temperature in the process tube 11, in actual application, the process tube 11 can be divided into multiple temperature zones in the axial direction of the process tube 11, the temperature measuring component 2 can detect the temperature of the multiple temperature zones respectively and feed back the temperature measurement results to a semiconductor heat treatment equipment, and the semiconductor heat treatment equipment can adjust the heating power of the heating component 6 according to the temperature measurement results, thereby adjusting the temperature uniformity of the process tube 11 in the axial direction of the process tube 11.

[0036] The semiconductor heat treatment equipment provided by the embodiment of the present application can adjust the position of the horizontal section 21 in the axial direction of the horizontal section 21 under the guidance of the guide component 8, thereby adjusting the position of the vertical section 22 in the radial direction of the process tube 11, so as to adjust the distance between the vertical section 22 and the wafer boat 7, adjust the distance between the temperature measuring component 2 and the wafer for different process tubes 11 and film forming processes, and improve the applicability of the temperature measuring component 2. After the distance between the vertical section 22 and the wafer is adjusted to a proper distance, the position of the horizontal section 21 can be fixed in the axial direction of the horizontal section 21 by means of the adjusting assembly 3, so as to fix the position of the vertical section 22 in the radial direction of the process tube 11, thereby reducing the possibility that the temperature measuring component 2 is sucked into the process tube 11 and collides with the wafer boat 7 due to the internal and external pressure difference in the semiconductor heat treatment process, reducing the possibility of process failure or damage, and improving the use safety of the temperature measuring component 2.

[0037] Specifically, in actual application, under the guide of the guide component 8, the adjusting assembly 3 adjusts the horizontal section 21 to move towards the base 12 in the axial direction of the horizontal section 21, and can adjust the vertical section 22 to move towards the wafer boat 7 in the radial direction of the process tube 11, so as to adjust the distance between the vertical section 22 and the wafer, and reduce the distance between the vertical section 22 and the wafer; under the guide of the guide component 8, the adjusting assembly 3 adjusts the horizontal section 21 to move away from the base 12 in the axial direction of the horizontal section 21, and can adjust the vertical section 22 to move away from the wafer boat 7 in the radial direction of the process tube 11, so as to adjust the distance between the vertical section 22 and the wafer, and increase the distance between the vertical section 22 and the wafer. After the distance between the vertical section 22 and the wafer is adjusted to a proper distance, the position of the horizontal section 21 can be fixed in the axial direction of the horizontal section 21 by means of the adjusting assembly 3, so as to fix the position of the vertical section 22 in the radial direction of the process tube 11, and the distance between the vertical section 22 and the wafer can be fixed. When it is necessary to adjust the distance between the vertical section 22 and the wafer, the position of the horizontal section 21 can be adjusted in the axial direction of the horizontal section 21 by canceling the fixation of the position of the horizontal section 21 in the axial direction of the horizontal section 21 by the adjusting assembly 3, so as to adjust the position of the vertical section 22 in the radial direction of the process tube 11, and then the distance between the vertical section 22 and the wafer can be adjusted.

[0038] As shown in Figure 3 and Figure 4 optionally, the range of the movement of the vertical section 22 in the radial direction of the process tube 11 can be the distance X1-distance X2, wherein the distance X1 and the distance X2 are the distances between the vertical section 22 and the inner wall on the same side of the process tube 11, and the distance X1 is greater than the distance X2.

[0039] As shown in Figure 2 and Figure 5 in an embodiment of the present application, the temperature measuring component 2 can comprise a thermowell, a thermowell sleeve and a thermowell body 23, the thermowell body 23 is arranged in the thermowell sleeve and the thermowell, the thermowell body 23 is used for detecting the temperature in the process tube 11, the thermowell corresponds to the vertical section 22, and the thermowell sleeve corresponds to the horizontal section 21.

[0040] Specifically, in actual application, the thermocouple sleeve can pass through the base 12 from outside the base 12 to inside the base 12, the thermocouple sleeve can be partially arranged in the process pipe 11 and partially arranged in the base 12 and connected with the thermocouple sleeve, and the axial direction of the part of the thermocouple sleeve is parallel to the axial direction of the process pipe 11, the thermocouple body 23 can pass through the thermocouple sleeve and the thermocouple sleeve, thereby being capable of passing through the base 12 from outside the base 12 to inside the base 12 and being capable of extending upward from inside the base 12 to inside the process pipe 11 to detect the temperature in the process pipe 11, and the thermocouple sleeve is wrapped around the thermocouple body 23, so that the thermocouple body 23 is in a sealed temperature measuring space which is isolated from the environment in the process pipe 11.

[0041] Optionally, one end of the thermocouple body 23 can be connected with the thermocouple sleeve.

[0042] Optionally, one end of the thermocouple body 23 can be fixedly connected with the thermocouple sleeve through a colloid.

[0043] Optionally, the thermocouple sleeve and the thermocouple sleeve can be an integral structure.

[0044] Optionally, the thermocouple sleeve and the thermocouple sleeve can be an integral structure by machining or welding.

[0045] Optionally, the material of the thermocouple sleeve can be quartz, silicon carbide or ceramic.

[0046] Optionally, the material of the thermocouple sleeve can be quartz, silicon carbide or ceramic.

[0047] As shown in Figures 2-4 , Figure 6 , Figure 8 and Figure 9 , in an embodiment of the present application, the adjusting assembly 3 can include a fixing component 31 and an adjusting component 32, the fixing component 31 is connected with the base 12, the guide component 8 is connected with the base 12 through the fixing component 31, and the axial direction of the guide component 8 is parallel to the axial direction of the horizontal section 21, and the adjusting component 32 is capable of moving relative to the guide component 8 in the axial direction of the guide component 8, so as to adjust the position of the horizontal section 21 in the axial direction of the horizontal section 21.

[0048] In actual application, the adjusting member 32 can be moved in the axial direction of the guide member 8 to drive the horizontal section 21 connected with the adjusting member 32 to move in the direction parallel to the axial direction of the guide member 8, and since the axial direction of the guide member 8 is parallel to the axial direction of the horizontal section 21, the horizontal section 21 can be driven to move in the axial direction of the horizontal section 21 to achieve the adjustment of the movement of the horizontal section 21 in the axial direction of the horizontal section 21, and by fixing the adjusting member 32 with the guide member 8, the position of the horizontal section 21 in the axial direction of the horizontal section 21 can be fixed by the adjusting member 32 in the direction parallel to the axial direction of the horizontal section 21, so that the position of the horizontal section 21 in the axial direction of the horizontal section 21 can be fixed.

[0049] As shown in Figures 2-4 , Figure 6 , Figure 8 and Figure 9 , in an embodiment of the present application, the fixing member 31 can include a fixing tube 311 and a fixing frame 312, the guide member 8 can include a plurality of guide screws, and the adjusting member 32 can include an adjusting baffle 321 and a plurality of adjusting nuts 322; the base 12 is provided with a first through hole 13 through which the horizontal section 21 passes, the fixing tube 311 is fixed with the base 12 and corresponds to the first through hole 13 for the horizontal section 21 to pass through, and the fixing frame 312 is arranged on the outer peripheral wall of the fixing tube 311, the plurality of guide screws are arranged on the fixing frame 312 in the circumferential direction of the fixing tube 311 and the axial direction of each guide screw is parallel to the axial direction of the horizontal section 21; the horizontal section 21 is provided with a fixing slot 211 in the circumferential direction, a part of the adjusting baffle 321 is fixedly inserted into the fixing slot 211, and the other part is provided with a plurality of second through holes 323 through which the plurality of guide screws pass one by one, at least two adjusting nuts 322 are arranged on each guide screw, and the two sides of each second through hole 323 are respectively provided with an adjusting nut 322.

[0050] In actual application, the horizontal section 21 can be firstly inserted through the fixed tube 311 and the first through hole 13, and at least one adjusting nut 322 can be installed on each guide screw, then a part of the adjusting block 321 can be fixedly inserted into the fixed slot 211, and the plurality of guide screws can be correspondingly inserted through the plurality of second through holes 323 arranged on the other part of the adjusting block 321 which is located outside the fixed slot 211, so as to assemble the adjusting block 321 with the fixed slot 211 and the plurality of guide screws respectively, i.e. to assemble the adjusting block 321 with the horizontal section 21 and the fixed part 31 respectively, and then at least one adjusting nut 322 can be installed on each guide screw. At this time, each guide screw is provided with at least two adjusting nuts 322 respectively, and each second through hole 323 is provided with at least one adjusting nut 322 on both sides respectively, and then the adjusting nuts 322 on each guide screw can be rotated to move along the axial direction of each guide screw, so as to drive the adjusting block 321 to move along the direction parallel to the axial direction of the plurality of guide screws, and since the axial direction of each guide screw is parallel to the axial direction of the horizontal section 21, the adjusting block 321 can be driven to move along the direction parallel to the axial direction of the horizontal section 21, so as to drive the horizontal section 21 to move along the axial direction of the horizontal section 21, and the horizontal section 21 can be adjusted along the axial direction of the horizontal section 21.

[0051] When it is needed to fix the position of the horizontal section 21 along the axial direction of the horizontal section 21, all the adjusting nuts 322 on both sides of each second through hole 323 can be locked with the adjusting block 321 to lock and fix all the adjusting nuts 322 on each guide screw, so as to lock and fix the adjusting block 321 on the plurality of guide screws, i.e. to lock and fix the adjusting block 321 along the direction parallel to the axial direction of the horizontal section 21, and then the position of the horizontal section 21 along the axial direction of the horizontal section 21 can be fixed.

[0052] Optionally, the fixed slot 211 can be annular.

[0053] Optionally, the fixed tube 311 can be welded with the base 12.

[0054] Optionally, the plurality of guide screws can be welded with the fixed frame 312.

[0055] Optionally, each guide screw can be provided with two adjusting nuts 322 respectively, and each second through hole 323 can be provided with one adjusting nut 322 on both sides respectively. However, the number of adjusting nuts 322 provided on each guide screw is not limited, and the number of adjusting nuts provided on both sides of each second through hole 323 is not limited.

[0056] As shown in FIG. 1, Figure 2 , Figure 5And Figure 7 As shown in the figure, in an embodiment of the present application, the adjusting baffle 321 can further be provided with a limiting structure 324, and the horizontal section 21 can further be provided with a cooperating structure 212, the limiting structure 324 and the cooperating structure 212 are in limiting cooperation, for limiting the self-rotation of the horizontal section 21.

[0057] With the limiting cooperation of the limiting structure 324 and the cooperating structure 212, the self-rotation of the horizontal section 21 can be limited, that is, with the limiting cooperation of the limiting structure 324 and the cooperating structure 212, the self-rotation of the horizontal section 21 can be reduced or even avoided, so that the self-rotation of the horizontal section 21 due to the vibration of the semiconductor heat treatment equipment can be reduced or even avoided, thereby the deflection of the vertical section 22 due to the self-rotation of the horizontal section 21 can be reduced or even avoided, so that the change of the distance between the vertical section 22 and the wafer can be reduced or even avoided, thereby the stability and accuracy of the temperature measurement of the temperature measurement component 2 can be improved, and further the process quality of the semiconductor heat treatment process can be improved, and further the friction between the vertical section 22 and the process tube 11, the wafer boat 7 or the wafer due to the deflection of the vertical section 22 caused by the self-rotation of the horizontal section 21 can be reduced or even avoided, thereby the environmental cleanliness in the process tube 11 can be improved, and further the process quality of the semiconductor heat treatment process can be improved.

[0058] As shown in the figure, Figure 2 , Figure 5 and Figure 7 As shown in the figure, in an embodiment of the present application, the limiting structure 324 is a limiting socket with a polygonal shape, and the cooperating structure 212 is a polygonal shape matching the shape of the limiting socket in the fixed slot 211.

[0059] With such a design, when a part of the adjusting baffle 321 is fixedly inserted into the fixed slot 211, the cooperating structure can be inserted into the limiting socket, so that the rotation of the cooperating structure inserted into the limiting socket is limited by the limiting socket, and the self-rotation of the cooperating structure in the limiting socket is limited, thereby limiting the self-rotation of the horizontal section 21.

[0060] As shown in the figure, Figures 2-4 As shown in the figure, in an embodiment of the present application, the semiconductor heat treatment equipment can further include a sealing assembly 4, the sealing assembly 4 is in sealing cooperation with the fixed tube 311 and the horizontal section 21 passing through the fixed tube 311, for sealing the gap between the fixed tube 311 and the horizontal section 21.

[0061] With the sealing assembly 4 sealing the gap between the fixed tube 311 and the horizontal section 21, the internal environment of the process tube 11 and the base 12 can be prevented from communicating with the external environment of the process tube 11 and the base 12 through the gap between the fixed tube 311 and the horizontal section 21, thereby the process tube 11 and the base 12 can be sealed.

[0062] As Figures 2-4 And Figure 8 and Figure 9 shown, in an embodiment of the present application, the sealing assembly 4 can include a sealing ring 41, a top ring 42 and a locking nut 43, the inner peripheral wall of the fixed tube 311 can have a stepped surface 314, the stepped surface 314 faces away from the inside of the base 12, and is protruded relative to the inner peripheral wall of the fixed tube 311, the sealing ring 41 and the top ring 42 are both sleeved on the horizontal section 21, and the sealing ring 41 is located between the top ring 42 and the stepped surface 314, the outer peripheral wall of the fixed tube 311 is provided with a fastening thread, the locking nut 43 is threadedly connected with the fastening thread, and abuts against the top ring 42.

[0063] In actual application, the horizontal section 21 can be first passed through the fixed tube 311 and the first through hole 13, then the sealing ring 41 can be sleeved on the horizontal section 21, after that, the top ring 42 can be sleeved on the horizontal section 21, at this time, the sealing ring 41 is located between the top ring 42 and the stepped surface 314, then the locking nut 43 can be sleeved on the horizontal section 21, and the locking nut 43 is threadedly connected with the fastening thread of the outer peripheral wall of the fixed tube 311, at this time, the locking nut 43 and the fastening thread of the outer peripheral wall of the fixed tube 311 can not be locked, after the distance between the vertical section 22 and the wafer is adjusted to a proper distance, the position of the horizontal section 21 needs to be fixed in the axial direction of the horizontal section 21, then the locking nut 43 is locked with the fastening thread of the outer peripheral wall of the fixed tube 311, so that the locking nut 43 abuts against and presses the top ring 42, the sealing ring 41 is pressed on the stepped surface 314 by the top ring 42, the gap between the fixed tube 311 and the horizontal section 21 is sealed by the sealing ring 41, and the sealing of the process tube 11 and the base 12 can be realized.

[0064] As Figure 8 and Figure 9 shown, in an embodiment of the present application, the assembly passage 5 in the fixed tube 311 for the horizontal section 21 to pass through can include a first passage section 51 and a second passage section 52, the first passage section 51 is away from the inside of the base 12 relative to the second passage section 52, and the radial dimension of the first passage section 51 is greater than that of the second passage section 52, the stepped surface 314 is formed at the communication between the first passage section 51 and the second passage section 52.

[0065] That is, by making the assembly passage 5 include the first passage section 51 and the second passage section 52, and making the radial dimension of the first passage section 51 greater than that of the second passage section 52, the assembly passage 5 can be made into a variable-diameter structure, so that the stepped surface 314 can be formed in the assembly passage 5, and since the first passage section 51 is away from the inside of the base 12 relative to the second passage section 52, the stepped surface 314 can face away from the inside of the base 12.

[0066] AsFigure 1 As shown in the embodiment of the present application, the semiconductor heat treatment equipment can further comprise a heating component 6, which is arranged outside the process tube 11 and used for heating the process tube 11.

[0067] Optionally, the heating component 6 can be covered outside the process tube 11.

[0068] In summary, the semiconductor heat treatment equipment provided by the embodiment of the present application can improve the applicability of the temperature measuring component 2 and the use safety of the temperature measuring component 2.

[0069] It can be understood that the above embodiments are only exemplary embodiments for illustrating the principles of the present application, and the present application is not limited thereto. Various modifications and improvements can be made by those skilled in the art without departing from the spirit and essence of the present application, and these modifications and improvements are also considered as the protection scope of the present application.

Claims

1. A semiconductor heat treatment apparatus, characterized by comprising: The process tube is vertically arranged on the base, and the process tube and the base are coaxially arranged, the temperature measuring part comprises a horizontal section and a vertical section, the horizontal section is arranged from outside the base to inside the base, and the vertical section is partially arranged in the process tube and partially arranged in the base and connected with the horizontal section, and the axial direction of the vertical section is parallel to the axial direction of the process tube; The guide part is arranged outside the base and connected with the base, the adjusting assembly is arranged outside the base and connected with the horizontal section and cooperatively arranged with the guide part, and is used for adjusting the position of the horizontal section in the axial direction of the horizontal section under the guidance of the guide part, so as to adjust the position of the vertical section in the radial direction of the process tube.

2. The semiconductor heat processing apparatus according to claim 1, wherein The adjusting assembly comprises a fixing part and an adjusting part, the fixing part is connected with the base, the guide part is connected with the base through the fixing part, and the axial direction of the guide part is parallel to the axial direction of the horizontal section, and the adjusting part can move relative to the guide part in the axial direction of the guide part, so as to adjust the position of the horizontal section in the axial direction of the horizontal section.

3. The semiconductor heat treatment apparatus according to claim 2, wherein The fixing part comprises a fixing tube and a fixing frame, the guide part comprises a plurality of guide screws, and the adjusting part comprises an adjusting baffle and a plurality of adjusting nuts. The base is provided with a first through hole for the horizontal section to pass through, the fixing tube is fixed with the base and corresponds to the first through hole, and is used for allowing the horizontal section to pass through, the fixing frame is arranged on the outer peripheral wall of the fixing tube, a plurality of guide screws are arranged on the fixing frame in the circumferential direction of the fixing tube, and the axial direction of each guide screw is parallel to the axial direction of the horizontal section. A fixing slot is arranged in the circumferential direction of the horizontal section, a part of the adjusting baffle is fixedly inserted into the fixing slot, and another part is provided with a plurality of second through holes for allowing the plurality of guide screws to pass through one by one, at least two adjusting nuts are arranged on each guide screw, and the adjusting nuts are arranged on both sides of each second through hole.

4. The semiconductor heat treatment apparatus according to claim 3, wherein The adjusting baffle is further provided with a limiting structure, and the horizontal section is further provided with a cooperating structure, the limiting structure and the cooperating structure are limitingly matched, and are used for limiting the rotation of the horizontal section.

5. The semiconductor heat treatment apparatus according to claim 4, wherein The limiting structure is a limiting socket with a polygonal shape, and the cooperating structure is a polygonal shape matching the shape of the limiting socket in the fixing slot.

6. The semiconductor heat processing apparatus according to claim 3, wherein The semiconductor heat treatment equipment further comprises a sealing assembly, the sealing assembly is sealingly matched with the fixing tube and the horizontal section passing through the fixing tube, and is used for sealing the gap between the fixing tube and the horizontal section.

7. The semiconductor thermal processing apparatus of claim 6, wherein, The sealing assembly comprises a sealing ring, a top ring and a locking nut, an inner circumferential wall of the fixed tube has a stepped surface, the stepped surface faces away from the inside of the base and protrudes relative to the inner circumferential wall of the fixed tube, the sealing ring and the top ring are sleeved on the horizontal section, and the sealing ring is located between the top ring and the stepped surface, an outer circumferential wall of the fixed tube is provided with a fastening thread, the locking nut is threadedly connected with the fastening thread and abuts against the top ring.

8. The semiconductor thermal processing apparatus of claim 7, wherein, The assembly channel in the fixed tube for the horizontal section to pass through comprises a first channel section and a second channel section, the first channel section is away from the inside of the base relative to the second channel section, and a radial dimension of the first channel section is greater than a radial dimension of the second channel section, and the stepped surface is formed at a communication position of the first channel section and the second channel section.

9. The semiconductor heat treatment apparatus according to claim 1, wherein The temperature measuring component comprises a thermocouple sleeve, a thermocouple sleeve and a thermocouple body, the thermocouple body is arranged in the thermocouple sleeve and the thermocouple sleeve, the thermocouple body is used for detecting the temperature in the process tube, the thermocouple sleeve corresponds to the vertical section, and the thermocouple sleeve corresponds to the horizontal section.

10. The semiconductor thermal processing apparatus of claim 1, wherein, The semiconductor heat treatment equipment further comprises a heating component arranged outside the process tube and used for heating the process tube.

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