Film pasting mechanism and film pre-pasting method

Abstract

A film pasting mechanism comprises a film material supply part, a film material adsorption part and a film material adsorption wheel. The film material supply part is used for providing a film material in the feeding direction. The film material adsorption part is arranged corresponding to the film material supply part, and the film material adsorption part is used for adsorbing the film material supplied from the film material supply part. And the film material adsorption wheel is arranged corresponding to the film material adsorption piece and is used for adsorbing the film material and supporting and smoothing the film material. The film material adsorption part can independently move relative to the film material adsorption wheel so as to drive the film material to be close to the substrate.

Description

TECHNICAL FIELD

[0001] The present application relates to a film laminating mechanism and a pre-laminating method for laminating a film material to a substrate. BACKGROUND

[0002] With the miniaturization and high performance of electronic devices, electronic circuit substrates mounted on the electronic devices widely use multilayered circuit substrates, i.e., so-called multilayer boards (Multilayer PCB). The multilayer board is formed by alternately stacking a plurality of layers, the surface of a part of the layers is printed with a circuit having a concave-convex shape, and a part of other layers is a resin film having insulating properties. For example, in order to manufacture a multilayer board of a multilayer structure, the following steps must be repeatedly performed: a step of forming a circuit pattern on a base material, a step of stacking a resin film on the base material, and a step of hardening the resin film.

[0003] The operation of stacking the film material on the base material can be performed by a film laminator. However, the existing film laminator has a problem in that the film laminating operation cannot be smoothly performed due to the warping of the substrate or the wrinkling of the film material. SUMMARY

[0004] In view of the above problem, the present application provides a film laminating mechanism and a pre-laminating method in a film laminating process, which helps to solve the problem that the existing film laminator cannot smoothly perform the film laminating operation.

[0005] The film laminating mechanism disclosed in the present application includes a film material supply, a film material suction member, and a film material suction wheel. The film material supply is configured to supply the film material in a feeding direction. The film material suction member is disposed corresponding to the film material supply and is configured to suction the film material supplied from the film material supply. The film material suction wheel is disposed corresponding to the film material suction member and is configured to suction the film material and support and flatten the film material. The film material suction member is independently movable relative to the film material suction wheel to move the film material close to the substrate.

[0006] The pre-laminating method in a film laminating process disclosed in the present application includes: performing a film material positioning procedure to attach the film material to the film material suction member; performing an initial film laminating procedure to make the film material suction member suction the film material and move close to the substrate to attach an end portion of the film material to the substrate; stopping the film material suction member from suctioning the film material; and after the film material suction member stops suctioning the film material, performing a subsequent film laminating procedure to move the substrate to allow the film material suction wheel to suction the film material and support and flatten the film material by the film material suction wheel to attach the remaining portion of the film material to the substrate.

[0007] According to the film laminating mechanism and the pre-laminating method disclosed in the present application, the film material suction wheel provides support and flattening effects for the end portion of the film material. When the film material suction wheel rotates, since the film material suction wheel suctions the film material, the film material is prevented from sliding and rubbing against the outer circumferential surface of the film material suction wheel, thereby avoiding scratches or wrinkles on the film material.

[0008] In addition, since the suction force of the film suction member can be adjusted according to the actual needs of each procedure, the film can be held with a weak suction force during standby to avoid deformation and wrinkles, and the suction force can be increased when the film is to be attached.

[0009] The above description of the present application and the following description of the embodiments are intended to demonstrate and explain the principles of the present application, and to provide further explanation of the claims of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0010] Figure 1 FIG. 1 is a schematic view of a film attaching mechanism according to an embodiment of the present application, and

[0011] Figure 2 FIG. 2 is a schematic view of a film attaching mechanism loading a film according to the embodiment of the present application. Figure 1

[0012] Figures 3 to 9 FIG. 3 is a schematic view of a pre-film attaching method according to an embodiment of the present application. DETAILED DESCRIPTION

[0013] The detailed features and advantages of the present application are described in detail in the following embodiments, which are sufficient for any person skilled in the art to understand the technical content of the present application and to implement it, and any person skilled in the art can easily understand the present application according to the content disclosed in the specification, claims and drawings. The following embodiments further illustrate the ideas of the present application, but do not limit the scope of the present application in any way.

[0014] Please refer to Figure 1 and Figure 2 , wherein Figure 1 FIG. 1 is a schematic view of a film attaching mechanism according to an embodiment of the present application, and Figure 2 FIG. 2 is a schematic view of a film attaching mechanism loading a film according to the embodiment of the present application. Figure 1 In the present embodiment, the film attaching mechanism 1 comprises a film supply mechanism 10 and a clamping member 20. The film attaching mechanism 1 of the present embodiment comprises two film supply mechanisms 10 to implement double-sided film attaching work of a substrate (not shown), but the present application is not limited thereto. In some other embodiments, the film attaching mechanism 1 can comprise a single film supply mechanism 10 to implement single-sided film attaching work of a substrate.

[0015] The film supply mechanism 10 comprises a film supply member 110, a film suction member 120, a film shearing member 130 and a film suction wheel 140. The film supply member 110 is used to supply a film (not shown). Further, the film supply member 110 can be a roller provided with a film roll, or a conveying roller that conveys the film to the film suction member 120 in a predetermined feeding direction D1. In addition, the film supply member 110 can further comprise a roller (not shown) for separating the film or winding up the waste film. ​

[0016] The film suction member 120 is, for example but not limited to, a suction plate with negative pressure holes, which is arranged corresponding to the film supply member 110. The film suction member 120 is used to suck the film provided from the film supply member 110.

[0017] The film cutting member 130 is arranged corresponding to the film suction member 120, and the film cutting member 130 is used to cut the film. In the embodiment, the film cutting member 130 is a wire cutting knife, which can be arranged between the film suction member 120 and the film suction wheel 140 along the feeding direction D1. More specifically, the film cutting member 130 is a guillotine knife, the length of the blade of which is equal to or greater than the width of the film, so as to allow the film cutting member 130 to move in a direction perpendicular to the plane of the film to cut the film at one time. The film cutting member 130 is used to cut the film into the film roll maintained on the film supply member 110 and the consumed film which can be attached to the substrate.

[0018] The film suction wheel 140 is, for example but not limited to, a roller with an arc surface, which is arranged corresponding to the film suction member 120. The film suction wheel 140 is used to suck the film, and support the film to be flattened. Further, the film suction wheel 140 can include a shaft 141 and a body 142. The body 142 is rotatably arranged on the shaft 141, and the outer circumferential surface 1421 of the body 142 can have a plurality of suction holes (not shown). The suction holes are used to suck the film 101, so as to fix the film 101 on the outer circumferential surface 1421 of the body 142.

[0019] The substrate 100 can pass through the film supply mechanism 10 along the inboard direction D2. The substrate 100 is, for example but not limited to, a silicon wafer, a circuit board, a glass plate or a metal plate. Further, a substrate carrying table (not shown) can be provided, which includes a plurality of rollers (not shown) capable of carrying and conveying the substrate 100. The film suction member 120 can be independently moved relative to the film suction wheel 140, so as to drive the film 101 to approach the substrate 100.

[0020] The clamping member 20 is, for example but not limited to, a clamping jaw, which is used to clamp the substrate 100 and the film 101 on the surface of the substrate 100. The clamping member 20 can be independently moved relative to the film suction wheel 140, so as to drive the substrate 100 to pass through the film suction wheel 140 relative to the side of the film suction member 120 far away.

[0021] In the embodiment, the film suction member 120 is movable, so as to have a standby position relative to the substrate 100 and a film attaching position relative to the substrate 100. The film suction member 120 in the standby position can refer to as shown in FIG. 1A. Figure 2 and Figure 6 The film suction member 120 in the film attaching position can refer to as shown in FIG. 1B. Figures 3 to 5When in the standby position, the film material adsorption wheel 140 is closer to the substrate 100 than the film material adsorption member 120. When in the film lamination position, the film material adsorption member 120 is closer to the substrate 100 than the film material adsorption wheel 140.

[0022] In this embodiment, the film supply mechanism 10 of the film laminating mechanism 1 may further include a film suction auxiliary member 150. The film suction auxiliary member 150 may be, for example but not limited to, a suction nozzle having a negative pressure hole (not shown), which is positioned corresponding to the film cutting member 130. The film suction auxiliary member 150 is used to absorb the film cut by the film cutting member 130. Specifically, the film suction auxiliary member 150 may be positioned between the film suction member 120 and the film suction wheel 140 along the feeding direction D1. The film suction auxiliary member 150 can pick up the end of the film.

[0023] In this embodiment, the film material supply mechanism 10 of the film laminating mechanism 1 may further include a heater 160. The heater 160 is movably disposed on the backside of the film material holding member 120. The heater 160 may be connected to a power source (not shown), such as a stepper motor or a cylinder. The power source can drive the heater 160 to move upward or downward relative to the film material holding member 120, thereby moving the heater 160 toward or away from the substrate 100.

[0024] The following describes a method for performing pre-film lamination using the film lamination mechanism 1 . Figures 3 to 9 This is a schematic diagram of a pre-lamination method according to one embodiment of the present invention. The figure shows laminating film material 101 onto the upper and lower surfaces of a substrate 100. However, to simplify the description, the following process only describes laminating the film material onto one substrate surface, omitting the description of laminating the film material onto the other surface. Film material 101 may be, for example, but not limited to, ABF film, dry film, or metal foil. Film material 101 is supplied to film material adsorbent 120 via film material supply 110.

[0025] First, the film material positioning procedure is performed to attach the film material 101 to the film material adsorbing member 120. Figure 2 As shown, the film material 101 is provided to the film material suction member 120 by the film material supply member 110, and the film material suction member 120 and the film suction auxiliary member 150 suction the film material 101. Specifically, the end of the film material 101 may include a first section 101a and a second section 101b connected to each other, wherein the second section 101b is closer to the substrate 100 than the first section 101a. The film material suction member 120 can suction and pick up the first section 101a, and the film suction auxiliary member 150 can suction and pick up the second section 101b.

[0026] Next, the initial film attaching process is performed, so that the film material adsorbing member 120 adsorbs the film material 101 and moves close to the substrate 100, so as to attach the end of the film material 101 to the surface of the substrate 100. Figure 2 andFigure 3 As shown, the film-aid 150 stops suction to release the second section 101b of the film 101, and the film-suction accessory 120 keeps suction to pick up the first section 101a of the film 101. The film-suction accessory 120 moves relatively away from the film-aid 150 to attach the second section 101b onto the surface of the substrate 100. In Figure 3 In some embodiments, the film-suction accessory 120 below can provide some support to the substrate 100, so that the substrate 100 does not sag.

[0027] In some embodiments, the suction force of the film-suction accessory 120 is adjustable. For example, the suction force of the film-suction accessory 120 can be adjusted by controlling the suction force of each negative pressure hole of the film-suction accessory 120 or by turning on / off the suction function of some negative pressure holes.

[0028] In the film positioning procedure, the film-suction accessory 120 can have a first suction force to pick up the first section 101a of the film 101. In other embodiments, the film-suction accessory can not pick up the film during the film positioning procedure, and only the film-aid picks up the film. In the initial film attaching procedure, the film-suction accessory 120 can have a second suction force to pick up the first section 101a of the film 101. That is, the second suction force can be greater than the first suction force.

[0029] As shown, in the initial film attaching procedure, the film-suction accessory 120 in the standby position moves to the film attaching position. Further, the film-suction accessory 120 in the standby position can first increase the suction force from the first suction force to the second suction force, and then move the film 101 from the standby position to the film attaching position while keeping the film 101 picked up by the second suction force. Figure 3 Figure 2 Since the suction force of the film-suction accessory 120 can be adjusted according to the actual needs of each procedure, the film 101 can be kept by a weaker suction force to avoid deformation and wrinkles in the standby state, and the suction force can be increased when the film is to be attached.

[0030] Since the suction force of the film-suction accessory 120 can be adjusted according to the actual needs of each procedure, the film 101 can be kept by a weaker suction force to avoid deformation and wrinkles in the standby state, and the suction force can be increased when the film is to be attached.

[0031] Then, the film 101 is heat attached to the surface of the substrate 100 by the heating element 160. As shown, the heating element 160 can be lowered relative to the film-suction accessory 120 to be in thermal contact with the end of the film 101, so as to perform the heat welding procedure of heat attaching the film 101 to the surface of the substrate 100. Figure 4

[0032] Then, the substrate 100 and the film 101 are clamped by the clamping element 20. Further, the clamping element 20 can clamp the second section 101b of the film 101. As shown, Figure 4 and Figure 5 ​​As shown, the space S1 between the two film suction wheels 140 allows the substrate 100 to pass through and be accommodated. That is, the gap between the two film suction wheels 140 is large enough for the clamp 20 to pass through the space S1 and then move around the substrate 100. The clamp 20 can be driven to extend through the space S1 by a power source (not shown) such as an oil cylinder or a stepping motor.

[0033] In this embodiment, the substrate 100 and the film 101 are clamped by the clamp 20 before the film suction member 120 stops suctioning the film 101. Further, in this embodiment, the film suction member 120 still holds the film 101 when the clamp 20 clamps the substrate 100 and the film 101. This can prevent the substrate 100 from being bent and sagging because the clamp 20 has not clamped the substrate 100 in time. Figure 5

[0034] In addition, in the case where the film 101 below is heavy, clamping the substrate 100 and the film 101 by the clamp 20 can prevent the film 101 from sagging due to peeling from the substrate 100. For example, in the case where the film 101 is a copper foil, the copper foil attached to the lower surface of the substrate 100 can be prevented from peeling from the substrate 100. In some other embodiments, the clamp can clamp only the substrate without clamping the film on the upper and lower surfaces of the substrate.

[0035] After the initial film attaching process is completed, the film suction member 120 at the film attaching position is stopped from suctioning the first section 101a of the film 101. Specifically, the film suction member 120 can be released from the film 101 by turning off the suction function of each negative pressure hole of the film suction member 120. As shown in FIG. 1C, the film suction member 120 is stopped from suctioning the film 101 and returns to the initial position as shown in FIG. 1A. Figure 6 Figure 2 As the film suction member 120 returns to the initial position, the substrate 100 loses the support provided by the film suction member 120 below, but the substrate 100 can still be prevented from being bent and sagging because the clamp 20 clamps the substrate 100.

[0036] Next, a subsequent film attaching process is performed to move the substrate 100 to allow the film suction wheels 140 to suction the film 101 and to support and smooth the film 101 by the film suction wheels 140, so that the remaining part of the film 101 is attached to the surface of the substrate 100. As shown in FIG. 1D, the film 101 is attached to the surface of the substrate 100. Figures 5 to 7 ​​As shown, the substrate 100 is pulled by the clamping member 20 to move along the in-plate direction D2 by a predetermined distance. As the substrate 100 continuously moves, the film material 101 is also fed by a predetermined length, so that the film material suction wheel 140 can suck the film material 101, for example, the first section 101a of the film material 101. As the film material 101 is continuously fed, the rotating body 142 of the film material suction wheel 140 is pulled to rotate, so that the included angle a between the feeding direction D1 of the film material 101 and the moving direction (in-plate direction D2) of the substrate 100 gradually decreases. The film material suction wheel 140 provides support and flattening effect for the end portion (for example, the first section 101a) of the film material 101. When the film material suction wheel 140 rotates, since the film material suction wheel 140 sucks the film material 101, it can prevent the film material 101 from sliding and rubbing with the outer circumferential surface 1421 of the film material suction wheel 140, thereby avoiding scratches or wrinkles on the film material 101.

[0037] Here, the film material suction wheel 140 supports and flattens the film material 101, which means that the film material 101 is supported and flattened by any operation (for example, the clamping member 20 pulls the substrate 100) to make the film material 101 abut against the outer circumferential surface 1421 of the film material suction wheel 140, and further flatten the film material 101 to avoid lifting wrinkles.

[0038] In addition, as shown, Figure 6 The shortest distance d between the film material suction wheel 140 and the substrate 100 is greater than or equal to the thickness of the film material 101. In this way, the film material suction wheel 140 does not apply force to the film material 101 towards the substrate 100 during the film pasting operation, which helps to avoid deformation of the film material 101.

[0039] As shown, Figure 7 and Figure 8 The film material cutting member 130 cuts the film material 101, and the film suction auxiliary member 150 can suck the end portion of the film material 101 to avoid shaking of the film material 101. The film suction auxiliary member 150 sucks the cut film material 101 (film roll material), provides support for the end portion (for example, the second section 101b) of the film material 101, and can assist the end portion of the film material 101 to be smoothly attached to the surface of another substrate during the next film pasting operation. In addition, the cut film material 101 (consumed film material) can be laid on the substrate 100.

[0040] As shown, Figure 9 The film material 101 (consumed film material) can be pressed onto the surface of the substrate 100 by a film pressing mechanism (not shown). Further, the clamping member 20 can release the substrate 100 and the film material 101. The film pressing mechanism (for example, a film pressing roller) is driven to press the film material 101 onto the surface of the substrate 100.

[0041] In summary, the film-attaching mechanism and the film-attaching method according to the present application provide the film-attaching wheel to support and smooth the end of the film. When the film-attaching wheel rotates, the film-attaching wheel can prevent the film from sliding and rubbing against the outer circumferential surface of the film-attaching wheel, thereby preventing the film from being scratched or wrinkled.

[0042] In addition, the film-attaching auxiliary member can support the end of the film after the film is cut, and can assist the film to be attached to another substrate surface in a subsequent film-attaching operation.

[0043] In addition, in the case of a heavy film, the clamping member can clamp the substrate and the film at the same time, thereby preventing the film from sagging due to peeling from the substrate.

[0044] In addition, the film-attaching auxiliary member can support the end of the film after the film is cut, and can assist the film to be attached to another substrate surface in a subsequent film-attaching operation.

[0045]

Symbol Description

[0046] 1: film-attaching mechanism

[0047] 100: substrate

[0048] 101: film

[0049] 101a: first section

[0050] 101b: second section

[0051] 10: film-attaching mechanism

[0052] 110: film-attaching member

[0053] 120: film-attaching auxiliary member

[0054] 130: film-cutting member

[0055] 140: film-attaching wheel

[0056] 141: rotating shaft

[0057] 142: rotating body

[0058] 1421: outer circumferential surface

[0059] 150: film-attaching auxiliary member

[0060] 160: heating member

[0061] 20: clamping member

[0062] d: shortest distance

[0063] S1: space

[0064] D1 : feed direction

[0065] D2: inboard direction

[0066] a: angle.

Claims

1. A film-sticking mechanism, characterized in that: Include: A film material supplying member, for supplying film material along a feeding direction; a film material adsorbing member, provided corresponding to the film material supplying member, and configured to adsorb the film material provided from the film material supplying member; as well as a film material adsorption wheel, arranged corresponding to the film material adsorption member, and used for adsorbing the film material and supporting and smoothing the film material; The film material adsorption component can independently move relative to the film material adsorption wheel to drive the film material to approach the substrate.

2. The film sticking mechanism according to claim 1, wherein the film material adsorbing member has a standby position relatively far from the substrate and a film sticking position relatively close to the substrate. When in the standby position, the film material adsorption wheel is closer to the substrate than the film material adsorption member, and At the film-attaching position, the film material adsorption component is closer to the substrate than the film material adsorption wheel. 3 . The film laminating mechanism according to claim 1 , wherein the shortest distance between the film material adsorption wheel and the substrate is greater than or equal to the thickness of the film material.

4. The film-sticking mechanism according to claim 1, wherein the film material adsorption wheel comprises a rotating shaft and a rotating body, the rotating body is rotatably arranged on the rotating shaft, the rotating body has a plurality of suction holes, and the plurality of suction holes are used to adsorb the film material so that the film material is fixed to the outer peripheral surface of the rotating body. 5.The film pasting mechanism of claim 1, wherein It also includes a film suction auxiliary piece, which is arranged between the film material adsorption piece and the film material adsorption wheel along the feeding direction, and is used to pick up the end of the film material. 6.The film pasting mechanism of claim 1, wherein It also includes a wire cutting knife, which is arranged between the film material adsorption component and the film material adsorption wheel along the feeding direction. 7.The film pasting mechanism of claim 1, wherein The device further comprises a clamping member for clamping the substrate and the film material and capable of independently moving relative to the film material adsorption wheel to drive the substrate to pass through a side of the film material adsorption wheel relatively away from the film material adsorption member. 8.The film pasting mechanism of claim 1, wherein The invention also comprises a film material cutting piece, which is used for cutting the film material so that at least a part of the film material is spread flat on the substrate.

9. A pre-lamination method in a film press process, characterized by, Include: Execute the film material positioning procedure to attach the film material to the film material adsorption piece; executing an initial film attaching procedure, causing the film material adsorbing member to adsorb the film material and move close to the substrate, so as to attach an end portion of the film material to the substrate; causing the film material adsorbing member to stop adsorbing the film material; as well as After the film material adsorption component stops adsorbing the film material, a subsequent film attaching procedure is performed to move the substrate to allow the film material adsorption wheel to adsorb the film material, and the film material adsorption wheel supports and smoothes the film material, so that the remaining part of the film material is attached to the substrate.

10. The pre-film lamination method in a lamination process according to claim 9, wherein the adsorption force of the film material adsorption member is adjustable, and during the film material positioning process, the film material adsorption member does not adsorb the film material or adsorbs the film material with a first adsorption force, In the initial film-attaching process, the film material adsorbing component adsorbs the film material with a second adsorbing force greater than the first adsorbing force.

11. The pre-attaching method of claim 10, wherein the film suction member is located at a standby position in the film positioning procedure, the film suction member is moved from the standby position to an attaching position in the initial attaching procedure, and the initial attaching procedure comprises: increasing a suction force of the film suction member located at the standby position to the second suction force to suction the film; and the film suction member keeps the second suction force to move the film from the standby position to the attaching position.

12. The pre-attaching method of claim 9, wherein after performing the initial attaching procedure and before the film suction member stops suctioning the film, the substrate and the film are gripped by a gripper.

13. The pre-attaching method of claim 9, wherein the film positioning procedure comprises: attaching a first section of the end portion of the film to the film suction member; and picking up a second section of the end portion of the film by a film picking auxiliary member.

14. The pre-attaching method of claim 13, wherein the initial attaching procedure comprises: stopping suctioning the second section by the film picking auxiliary member; and moving the film suction member relatively far away from the film picking auxiliary member to attach the second section of the film to the substrate.

15. The pre-attaching method of claim 9, wherein the subsequent attaching procedure comprises: continuously moving the substrate; suctioning the film by the film suction wheel; rotating the film suction wheel to reduce an included angle between a feeding direction of the film and a moving direction of the substrate; stopping suctioning the film by the film suction wheel; and cutting the film by a film cutting member to attach at least a portion of the film to the substrate. ​ ​

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