Vapor chamber and electronic equipment

Abstract

The embodiment of the invention provides a vapor chamber and electronic equipment, the vapor chamber comprises a first cover plate, a second cover plate and a capillary layer, the first cover plate and the second cover plate are stacked, the first cover plate and the second cover plate are connected, the first cover plate and the second cover plate define a cavity, and the capillary layer is located in the cavity; the second cover plate comprises a first metal layer and a first high polymer material layer, the first metal layer and the first high polymer material layer are stacked, the first metal layer is connected between the first high polymer material layer and the first cover plate, and the surface roughness Rz of the surface, connected with the first high polymer material layer, of the first metal layer belongs to [0.5 mu m, 5 mu m]. According to the scheme of the embodiment of the invention, the process yield of the vapor chamber can be improved, so that the vapor chamber has relatively good structural reliability and working performance.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation, in particular to a vapor chamber and an electronic device. BACKGROUND

[0002] Electronic devices such as mobile phones, computers, and servers are equipped with vapor chambers. The working medium in the vapor chamber can perform two-phase circulation to diffuse the heat of the heat source to a larger area, avoiding the problem of temperature being too high due to heat accumulation in a local area, and improving the working reliability and performance of the electronic device. However, the manufacturability of conventional vapor chambers is poor, and process defects such as structure delamination and vapor chamber surface bubbling are prone to occur. This results in unreliable structure of the vapor chamber, affecting its working performance. SUMMARY

[0003] The present application provides a vapor chamber and an electronic device, which can improve the process yield of the vapor chamber, so that the vapor chamber has good structural reliability and working performance.

[0004] In a first aspect, the present application provides a vapor chamber, comprising a first cover plate, a second cover plate, and a capillary layer, the first cover plate and the second cover plate are laminated, the first cover plate is connected to the second cover plate, the first cover plate and the second cover plate enclose a cavity, and the capillary layer is located in the cavity; the second cover plate comprises a first metal layer and a first polymer material layer, the first metal layer and the first polymer material layer are laminated, the first metal layer is connected between the first polymer material layer and the first cover plate, and the surface roughness Rz of the surface of the first metal layer connected to the first polymer material layer is in the range of [0.5 μm, 5 μm]. In the present application, the areas of the first cover plate and the second cover plate can be substantially the same, and the periphery of the first cover plate can be connected to the periphery of the second cover plate; or, one of the first cover plate and the second cover plate has a larger area, and the other has a smaller area, the cover plate with the smaller area can be located within the boundary of the cover plate with the larger area, and the periphery of the cover plate with the smaller area can be connected to the cover plate with the larger area.

[0005] In the present application, by setting the surface roughness of the surface of the first metal layer connected to the first polymer material layer in the above range, the surface of the first metal layer connected to the first polymer material layer can be smooth, the pores on the micro interface between the two can be significantly reduced, the tightness of the two can be enhanced, and the problems of vapor chamber surface bubbling and metal layer and polymer material layer delamination caused by gas expansion in the pores during the local high-temperature process in the process of the vapor chamber can be improved, thereby improving the process yield of the vapor chamber, and the vapor chamber has good structural reliability and working performance.

[0006] In the embodiment of the present application, by using a composite material to manufacture the second cover plate, the advantages of metal materials and polymer materials can be combined, so that the second cover plate has both good thermal conductivity and strength, good flexibility, and is light in weight.

[0007] In one implementation of the first aspect, the capillary layer and the first metal layer are integrally connected. Integrally connected means that the capillary layer and the first metal layer are not assembled together via mechanical components (such as screws, rivets, clips, or other connectors, or adhesives), and the connection between the capillary layer and the first metal layer has no obvious interface gap and is continuous or fused.

[0008] Exemplarily, the capillary layer is formed on the first metal layer through a surface treatment and forming process, and the capillary layer is a portion of the first metal layer. The surface treatment and forming process includes, but is not limited to, etching, laser engraving, electroplating, 3D printing, etc. Exemplarily, the capillary layer is welded to the first metal layer.

[0009] By integrating the capillary layer with the first metal layer, the capillary layer and the first metal layer are fully integrated, reducing the air gap between them, which helps improve the heat dissipation performance of the vapor chamber. It also avoids the need for mechanical components to connect the capillary layer and the first metal layer, making the vapor chamber lighter and thinner.

[0010] In an implementation of the first aspect, the capillary layer includes a capillary through-hole layer and multiple support bodies, and the multiple support bodies are connected between the capillary through-hole layer and the first metal layer; the capillary through-hole layer is provided with multiple capillary through holes, among which there is a first capillary through hole, and a channel is formed between any two adjacent support bodies, and at least a part of the projection of the first capillary through hole in the thickness direction of the capillary through hole layer falls between the two adjacent support bodies.

[0011] In this implementation, the first metal layer can be a flat layer structure. A plurality of support bodies and capillary through-hole layers can be formed on the first metal layer. The support body is used to support the capillary through-hole layer and form a flow channel for the working medium. The capillary through-holes on the capillary through-hole layer are connected to the channel, and the capillary through-holes are used to provide capillary force so that the working medium can flow from the channel into the capillary through-holes. By designing the gas-liquid channel in the capillary layer, this implementation can improve the thermal conductivity of the temperature spreader, increase its maximum heat transfer Qmax, and reduce its weight, which helps to improve the heat dissipation capacity of the electronic device, increase the maximum main frequency duration of the chip in the electronic device, and facilitate the realization of a lighter and thinner whole machine.

[0012] In an implementation of the first aspect, the first polymer material layer includes a first base layer and multiple first protrusions, and the multiple first protrusions are all protruding from the side of the first base layer facing the first cover plate; the first metal layer covers the first base layer, and each support body covers a first protrusion.

[0013] In the present implementation, each support body and the convex portion covered thereby can be considered to jointly form a support column structure. Since each support body and the convex portion covered thereby jointly form a support column structure, and the convex portion is made of a relatively light polymer material, the support column structure is relatively light, which is conducive to reducing the weight of the vapor chamber. In addition, the processing precision of such a structure is relatively high, which can ensure the structural precision of the vapor chamber.

[0014] In an implementation form of the first aspect, the second cover plate is provided with a plurality of first recesses on the side facing away from the first cover plate, each first recess is recessed towards the first cover plate, and the first metal layer is located in part of each first recess as a support body, and a channel is formed between any two adjacent support bodies. Each support body is connected with the capillary layer. The capillary layer is provided with a plurality of capillary through holes, and the plurality of capillary through holes include first capillary through holes, and at least part of the projection of the first capillary through holes in the thickness direction of the capillary layer falls between the two adjacent support bodies.

[0015] In the present implementation, the first metal layer is used to form the support body, so that the thickness and weight of the second cover plate can be reduced. In addition, the processing precision of the second cover plate is relatively high, which can ensure the structural precision of the vapor chamber.

[0016] In an implementation form of the first aspect, each first recess is filled with a heat-conducting material. The heat-conducting material has good heat-conducting performance, and includes but is not limited to a heat-conducting glue containing graphene components, a phase change material (PCM), etc. The heat-conducting material is used to discharge air (air is a poor conductor of heat) in the recess, so as to enhance the heat conduction between the second cover plate and the heat source.

[0017] In an implementation form of the first aspect, the plurality of capillary through holes include a plurality of groups arranged in sequence along a first direction, each group includes at least two capillary through holes arranged in sequence along a second direction, and the first direction intersects the second direction. For any two adjacent groups, at least one capillary through hole in one group is distributed between every two adjacent capillary through holes in the other group along the second direction.

[0018] In the present implementation, the arrangement of the capillary through holes can be referred to as cross arrangement. Compared with the matrix or chessboard arrangement, the cross arrangement can increase the density and number of the capillary through holes in the capillary layer under the premise that the area of the capillary layer is constant, so that more parts of the capillary layer can provide capillary force, and the liquid working medium can be continuously subjected to the capillary force during the flow, thereby increasing the liquid supplementing and backflow speed, which is conducive to improving the heat conduction and heat dissipation efficiency.

[0019] In an implementation form of the first aspect, the opening areas of at least two capillary through holes in the plurality of capillary through holes are different from each other.

[0020] In the present implementation, the positions with smaller opening areas can be close to the heat source, and the capillary force of the capillary through holes at these positions is larger, which can realize rapid liquid supplement and backflow of the working medium, and is beneficial to rapid heat conduction and heat dissipation in the high-temperature area. The positions with larger opening areas can be away from the heat source, and the flow resistance at these positions is smaller, which is beneficial to the backflow of the condensed working medium through the capillary through holes to the channels between the support bodies, and is beneficial to improving the backflow speed and further improving the heat conduction and heat dissipation efficiency. In the present implementation, the opening area of the capillary through hole can increase, for example.

[0021] In an implementation form of the first aspect, at least one of the plurality of support bodies is in a columnar structure or a strip structure.

[0022] In the present implementation, the support bodies are made into a columnar structure, so that the support bodies are distributed in a point-like manner, and a channel network is formed between the support bodies. When the working medium at a position of the channel network evaporates during the operation of the vapor chamber, multiple surrounding positions can supplement the liquid working medium to the position. This design makes the vapor chamber not sensitive to the position of the heat source, and the vapor chamber can conduct heat and dissipate heat for multiple heat sources; or the position of the vapor chamber can be fixed and the position of the heat source can be adjusted as needed, so that the vapor chamber can always conduct heat and dissipate heat normally. In addition, the defect that a position cannot be supplemented with liquid working medium after evaporation of the working medium and the position is overheated can be improved, and the phenomenon of unstable flow of the working medium during boiling and evaporation is reduced.

[0023] In the present implementation, the support bodies are made into a strip structure. Since the width of the channel between adjacent support bodies is basically constant, the flow directionality of the liquid working medium in the channel is strong, and the flow resistance is small, which enables the liquid working medium to be quickly supplemented to the evaporation position, and further ensures the heat conduction and heat dissipation effect.

[0024] In an implementation form of the first aspect, a plurality of first support bodies are arranged in the plurality of support bodies, and the plurality of first support bodies are arranged in sequence along a first direction. Each first support body is in a strip structure extending along a second direction, and the first direction intersects the second direction.

[0025] In the present implementation, at least part of the support bodies are made into a strip structure. Since the width of the channel between adjacent first support bodies is basically constant, the flow directionality of the liquid working medium in the channel is strong, and the flow resistance is small, which enables the liquid working medium to be quickly supplemented to the evaporation position, and further ensures the heat conduction and heat dissipation effect.

[0026] In an implementation form of the first aspect, the plurality of first support bodies comprises a first group and a second group, the first group and the second group are adjacent and arranged along a first direction, and the first group and the second group each comprises at least two first support bodies arranged in sequence along a second direction; a projection of a gap between any two adjacent first support bodies in the first group in the first direction falls on a first support body in the second group.

[0027] In the implementation form, the first support bodies of the strip structure can be arranged in a cross manner, and the channels extending along the second direction between the first support bodies can be referred to as grooves. Due to the formation of the grooves, the liquid working medium in the grooves has strong flow directionality and small flow resistance, which is beneficial to quickly replenish the liquid working medium to the evaporation position, and thus ensures the heat conduction and heat dissipation effect. Moreover, a gap can be formed between the adjacent support bodies in each group, the gap is communicated with the groove to form a channel network communicated in up, down, left and right directions. When the working medium in a position of the channel network is vaporized and evaporated during the operation of the vapor chamber, the liquid working medium can be replenished to the position from multiple surrounding positions, so that the vapor chamber is not sensitive to the position of the heat source, and the vapor chamber can conduct heat and dissipate heat for multiple heat sources; or, the position of the vapor chamber can be fixed and the position of the heat source can be adjusted as needed, so that the vapor chamber can always conduct heat and dissipate heat normally. The defect that the position is overheated due to the lack of replenishment of the liquid working medium after the vaporization and evaporation of the working medium can be improved, and the instability of the flow of the working medium during boiling and evaporation is reduced. In addition, the gap between the adjacent support bodies in each group is small, and the gap can be smaller than the width of the groove between the adjacent support bodies. The gap can provide a certain capillary force, which is beneficial to improve the flowability of the liquid working medium, ensure the rapid replenishment of the liquid working medium, and thus improve the heat conduction and heat dissipation effect.

[0028] In an implementation form of the first aspect, the second cover plate further comprises a second metal layer, the first metal layer, the first polymer material layer and the second metal layer are sequentially stacked, the second metal layer is connected with the first polymer material layer, and a surface roughness Rz of a surface of the second metal layer connected with the first polymer material layer is equal to [0.5 μm, 5 μm].

[0029] In the present implementation, the structural strength and rigidity of the second cover plate can be increased by adding the second metal layer, and the mechanical properties of the second cover plate can be improved. In the present implementation, the second cover plate is made of a composite material, which can combine the advantages of metal materials and polymer materials, so that the second cover plate has good thermal conductivity and strength, good flexibility, and light weight. By setting the surface roughness of the surface of the second metal layer connected to the first polymer material layer in the above range, the surface of the second metal layer connected to the first polymer material layer can be smooth, the pores on the micro interface between the two can be significantly reduced, the bonding tightness of the two can be enhanced, and the problems of blistering of the surface of the heat spreader, delamination of the metal layer and the polymer material layer caused by the expansion of the gas in the pores during the local high-temperature process in the process of the heat spreader can be improved, so that the process yield of the heat spreader can be improved, and the heat spreader has good structural reliability and working performance.

[0030] In an implementation form of the first aspect, the first cover plate comprises a working area, the working area participates in enclosing the cavity; the working area comprises a plurality of second protrusions and a plurality of second recesses, the plurality of second protrusions and the plurality of second recesses are arranged alternately, and each second recess is surrounded by a plurality of second protrusions; each second protrusion protrudes in a direction away from the second cover plate; and each second recess is recessed towards the second cover plate and connected to the capillary layer.

[0031] In the present implementation, the first cover plate can be an equal-thickness structure. By forming a concave-convex structure on the first cover plate, a support column of the heat spreader can be manufactured on the first cover plate, the rigidity and strength of the heat spreader can be ensured, and the mechanical properties of the heat spreader can be improved.

[0032] In an implementation form of the first aspect, the first cover plate comprises a working area, the working area participates in enclosing the cavity; the working area comprises a second base layer and a plurality of third protrusions, the plurality of third protrusions are protruded on a side of the second base layer facing the second cover plate, and are connected to the capillary layer.

[0033] In the present implementation, the first cover plate can be an unequal-thickness structure. By forming protrusions on the first cover plate, a support column of the heat spreader can be manufactured on the first cover plate, the rigidity and strength of the heat spreader can be ensured, and the mechanical properties of the heat spreader can be improved.

[0034] In an implementation form of the first aspect, the first cover plate comprises a third metal layer, the third metal layer is connected to the first metal layer.

[0035] In the present implementation, the third metal layer can be a single material or a composite material of metal and metal. Such a first cover plate has low cost and good mechanical properties.

[0036] In an implementation form of the first aspect, the first cover plate further comprises a second polymer material layer connected to the third metal layer, the second polymer material layer, the third metal layer and the first metal layer are sequentially stacked, and a surface roughness of a surface of the third metal layer connected to the second polymer material layer is Rz∈[0.5 μm, 5 μm].

[0037] In the implementation form, the first cover plate is manufactured by using the composite material, the advantages of the metal material and the polymer material can be combined, so that the first cover plate has good thermal conductivity and strength, good flexibility and light weight. By setting the surface roughness of the surface of the third metal layer connected to the second polymer material layer in the above range, the surface of the third metal layer connected to the second polymer material layer is smooth, the pores on the micro interface between the third metal layer and the second polymer material layer are significantly reduced, the bonding tightness of the third metal layer and the second polymer material layer is enhanced, and the problems of blistering of the surface of the vapor chamber, delamination of the metal layer and the polymer material layer and the like caused by expansion of the gas in the pores in the local high-temperature process in the process of the vapor chamber are improved, so that the process yield of the vapor chamber can be improved, and the vapor chamber has good structural reliability and working performance.

[0038] In an implementation form of the first aspect, the first cover plate further comprises a fourth metal layer, the fourth metal layer, the second polymer material layer and the third metal layer are sequentially stacked, the fourth metal layer is connected to the second polymer material layer, and a surface roughness of a surface of the fourth metal layer connected to the second polymer material layer is Rz∈[0.5 μm, 5 μm].

[0039] In the implementation form, the fourth metal layer is added to increase the structural strength and rigidity of the first cover plate and improve the mechanical properties of the first cover plate. By setting the surface roughness of the surface of the fourth metal layer connected to the second polymer material layer in the above range, the surface of the fourth metal layer connected to the second polymer material layer is smooth, the pores on the micro interface between the fourth metal layer and the second polymer material layer are significantly reduced, the bonding tightness of the fourth metal layer and the second polymer material layer is enhanced, and the problems of blistering of the surface of the vapor chamber, delamination of the metal layer and the polymer material layer and the like caused by expansion of the gas in the pores in the local high-temperature process in the process of the vapor chamber are improved, so that the process yield of the vapor chamber can be improved, and the vapor chamber has good structural reliability and working performance.

[0040] In an implementation form of the first aspect, the material of the polymer material layer in the vapor chamber comprises polyimide, polypropylene, polytetrafluoroethylene, polyethylene terephthalate, polyethylene naphthalate, polydimethylsiloxane, polyethylene, polymethyl ethylene carbonate, polyvinyl chloride, polyvinylidene chloride, polystyrene or polyamide. The above materials are polymer materials, and the above polymer materials have reliable performance and are easy to mass-produce. The polymer material layer is the first polymer material layer or the second polymer material layer in the above implementation forms.

[0041] In an implementation form of the first aspect, the glass transition temperature of the polymer material layer in the vapor chamber is greater than or equal to 320℃. The polymer material layer is the first polymer material layer or the second polymer material layer in the above-mentioned implementation forms. The glass transition temperature is also referred to as the glass transition temperature, and is usually represented by Tg. The glass transition temperature is the temperature at which the polymer changes from the high-elastic state to the glass state. By setting the glass transition temperature of the polymer material layer in the above-mentioned larger range, the polymer material layer has better high-temperature resistance, and can maintain stable performance in the local high-temperature process of the vapor chamber process (such as welding of the first cover plate and the second cover plate, manufacturing of the capillary layer at a high temperature of 300℃ or above, etc.), which is beneficial to improve the process yield of the vapor chamber, and makes the vapor chamber have better structural reliability and working performance.

[0042] In a second aspect, the embodiments of the present application provide an electronic device, which comprises a shell and the vapor chamber. The vapor chamber in the electronic device of the embodiments of the present application has better structural reliability and working performance, which can improve the heat dissipation capacity of the electronic device, increase the maximum frequency duration of the chip in the electronic device, and is beneficial to realize the thin and light of the whole machine.

[0043] In an implementation form of the second aspect, the electronic device further comprises a display screen, the display screen is arranged in the shell and surrounds the shell to form an accommodation space, and the vapor chamber is located in the accommodation space.

[0044] In the implementation form, the vapor chamber can be connected with the display screen, so that the vapor chamber can avoid the components below the vapor chamber, which is beneficial to make the vapor chamber have a larger area, and further improve the heat dissipation effect of the vapor chamber. According to the needs, the vapor chamber can also be connected with the shell. BRIEF DESCRIPTION OF DRAWINGS

[0045] Figure 1 is a schematic diagram of an assembly structure of the electronic device of the embodiments of the present application;

[0046] Figure 2 is a schematic diagram of an exploded structure of the electronic device of Figure 1

[0047] Figure 3 is a schematic diagram of an A-A cross-sectional structure of the electronic device of Figure 1

[0048] Figure 4 is a schematic diagram of a side cross-sectional structure of the vapor chamber of an embodiment;

[0049] Figure 5 is a schematic diagram of a side cross-sectional structure of the second cover plate of the vapor chamber in Figure 4

[0050] Figure 6 ​​​is a structural schematic diagram of a bonding interface between a first metal layer and a first polymer material layer in a second cover plate;

[0051] Figure 7 is Figure 4 is a side sectional structural schematic diagram of a first cover plate of a uniform temperature plate in

[0052] Figure 8 and Figure 9 are abnormal foaming schematic diagrams caused by local high temperature processes;

[0053] Figure 10 is an abnormal structure delamination schematic diagram caused by a local high temperature process;

[0054] Figure 11 is another side sectional structural schematic diagram of a first cover plate;

[0055] Figure 12 is a connection structural schematic diagram of a capillary layer in a uniform temperature plate and a second cover plate;

[0056] Figure 13 is a side sectional structural schematic diagram of a capillary layer;

[0057] Figure 14 is a three-dimensional structural schematic diagram of a capillary layer;

[0058] Figure 15 is Figure 14 is a partial top view structural schematic diagram of a capillary through-hole layer in a capillary layer in

[0059] Figure 16 is another partial top view structural schematic diagram of a capillary through-hole layer;

[0060] Figure 17 is another partial top view structural schematic diagram of a capillary through-hole layer;

[0061] Figure 18 is another partial top view structural schematic diagram of a capillary through-hole layer;

[0062] Figure 19 is Figure 14 is a partial top view structural schematic diagram of a support body in a capillary layer in

[0063] Figure 20 is another partial top view structural schematic diagram of a support body;

[0064] Figure 21 is another partial top view structural schematic diagram of a support body;

[0065] Figure 22 is a three-dimensional arrangement structural schematic diagram of a support body;

[0066] Figure 23is another schematic view of the three-dimensional arrangement of the support body;

[0067] Figure 24 is Figure 23 is a schematic view of the top arrangement of the support body of

[0068] Figures 25-28 is a schematic view of the position relationship between the capillary through hole and the support body in several embodiments from a top perspective;

[0069] Figure 29 is a schematic view of the connection structure between the capillary layer and the second cover plate in another embodiment;

[0070] Figure 30 is a schematic view of the connection structure between the capillary layer and the second cover plate in another embodiment;

[0071] Figure 31 is a schematic view of the connection structure between the capillary layer and the second cover plate in another embodiment;

[0072] Figure 32 is a schematic view of the side structure of the vapor chamber in another embodiment;

[0073] Figure 33 is a schematic view of the side structure of the first cover plate in an embodiment;

[0074] Figure 34 is a schematic view of the side structure of the vapor chamber in another embodiment;

[0075] Figure 35 is a schematic view of the side structure of the vapor chamber in another embodiment;

[0076] Figure 36 is a schematic view of the side structure of the first cover plate in another embodiment;

[0077] Figure 37 is a schematic view of the side structure of the first cover plate in another embodiment;

[0078] Figure 38 is a schematic view of the side structure of the first cover plate in another embodiment;

[0079] Figure 39 is a schematic view of the side structure of the first cover plate in another embodiment. DETAILED DESCRIPTION

[0080] The embodiments of the present application provide an electronic device and a vapor chamber in the electronic device. The electronic device includes but is not limited to a mobile phone (such as a straight phone or a folding phone), a notebook computer, a tablet computer, a desktop computer, a vehicle-mounted device, a wearable device, a smart speaker, a smart screen, a server, a network device (such as a switch or a router), a communication device (such as a base station or a data center), an LED lamp, or an industrial production device.

[0081] Figure 1 A perspective structure of an electronic device 1 is shown, Figure 2 As Figure 1 An exploded structure of the electronic device 1 is shown, Figure 3 As Figure 1 An A-A cross-sectional structure of the electronic device 1 is shown.

[0082] As Figure 1 As Figure 2 The electronic device 1 can be a mobile phone, for example. The electronic device 1 can include a display screen 11, a housing 12, and a vapor chamber 13.

[0083] The housing 12 can be an assembly assembled by several components or a single component. The housing 12 can be a middle frame, for example. As Figures 1-3 The display screen 11 is mounted on one side of the housing 12 and can form a containing space 1a together with the housing 12. Several components 14 can be arranged in the containing space 1a. The components 14 can be mechanical components or electronic devices. As Figure 3 The electronic device 1 can further include a housing 15 connected to the housing 12 and located on the opposite side of the display screen 11 relative to the housing 12. The housing 15 can be a back cover, for example. The housing 15 and the housing 12 can form the containing space 1a, in which several electronic devices can be arranged, including but not limited to a circuit board, a battery, a loudspeaker, a rear camera, and the like.

[0084] Some of the electronic devices in the electronic device 1 are heat sources. A heat source refers to a single device or a module or a module that can generate heat when working. The heat source includes but is not limited to a camera module, a sensor, a system on chip (SOC), a charging module (Charge IC), a battery, a system in package (SIP) module, a loudspeaker module, a circuit board assembly, and the like.

[0085] As Figure 3As shown, the vapor chamber 13 can be located in the accommodation space la. As an example, the vapor chamber 13 can be connected with the display screen 11, so that the vapor chamber 13 can avoid the components 14 below the vapor chamber 13, which is beneficial to make the vapor chamber 13 have a larger area, and further beneficial to improve the heat conduction effect of the vapor chamber 13. According to needs, the vapor chamber 13 can also be connected with the shell 12.

[0086] It can be understood that the vapor chamber 13 is arranged near the heat source. As an example, the heat source can be not connected with the vapor chamber 13, and the heat source and the vapor chamber 13 are connected through other components (not the thermal interface material), and the heat source and the vapor chamber 13 are connected through the other components. For example Figure 3 As shown, the electronic devices in the accommodation space la serve as the heat source, and the heat source and the vapor chamber 13 are separated by the shell 12 (for example, the middle plate of the middle frame), and the heat source and the vapor chamber 13 are connected through the shell 12. Alternatively, the heat source can be connected with the vapor chamber 13, for example, connected through the thermal interface material. For example, refer to Figure 3 As shown, the middle plate can be provided with a through hole, and the electronic devices in the accommodation space la can pass through the through hole and be connected with the vapor chamber 13 in the accommodation space la.

[0087] It can be understood that the position, number and shape of the vapor chamber 13 described above are only examples, and the embodiments of the present application do not limit the position, number and shape of the vapor chamber 13. For example, the vapor chamber 13 can be arranged at any position in the shell of the electronic device 1, and is not limited to being arranged in the accommodation space la.

[0088] The structure of the vapor chamber 13 of the embodiments of the present application will be described in detail below.

[0089] Figure 4 The partial side structure of the vapor chamber 13 in the first embodiment is shown.

[0090] As Figure 4As shown, the temperature equalizing plate 13 may include a first cover plate 131, a second cover plate 132 and a capillary layer 133. The first cover plate 131 and the second cover plate 132 may both be roughly plate-shaped structures, and the two may be stacked, that is, the two may be arranged along their own thickness direction. The periphery of the first cover plate 131 and the periphery of the second cover plate 132 are connected together and form the periphery 13a of the temperature equalizing plate 13. The periphery 13a may be referred to as the connection area 13a. The middle portion of the first cover plate 131 protrudes relative to the periphery of the first cover plate 131, and the middle portion of the second cover plate 132 protrudes relative to the periphery of the second cover plate 132, and the middle portion of the first cover plate 131 and the middle portion of the second cover plate 132 may both protrude in directions away from each other and enclose a cavity 13c. The middle portion of the first cover plate 131 and the middle portion of the second cover plate 132 may constitute the middle portion 13b of the temperature equalizing plate 13, and the middle portion 13b may be referred to as the working area 13b. It is understandable that the connection area 13a surrounds the outer periphery of the working area 13b. The capillary layer 133 is located in the cavity 13c, or in other words, in the working area 13b.

[0091] The cavity 13c may be filled with a working medium, including but not limited to water, acetone, ethanol, methanol, etc. The working medium may conduct heat through two-phase changes (ie, through evaporation and condensation, switching between liquid phase and gas phase).

[0092] In the first embodiment, the second cover plate 132 may face the heat source, and the first cover plate 131 may face away from the heat source. Figure 3 and Figure 4 As shown, for example, the first cover plate 131 may face the display screen 11 , and the second cover plate 132 may face away from the display screen 11 .

[0093] The various structures of the temperature uniform plate 13 will be described below one by one.

[0094] Figure 5 Indicated Figure 4 The second cover plate 132 in FIG. Figure 5 As shown, the second cover plate 132 may include a first metal layer 132a, a first polymer material layer 132b and a second metal layer 132c, which are arranged in sequence along the thickness direction of the second cover plate 132, and the first polymer material layer 132b connects the first metal layer 132a and the second metal layer 132c. Figure 4 As shown, the first metal layer 132 a faces the first cover plate 131 .

[0095] like Figure 5As shown, the first metal layer 132a has a surface 132d facing the first polymer material layer 132b, and the surface 132d is connected (or bonded) to the first polymer material layer 132b. The surface roughness Rz of the surface 132d is in the range of [0.5 μm, 5 μm], for example, the Rz can be 0.5 μm, 1.5 μm, 2 μm, 5 μm, etc. In the embodiments of the present application, the surface roughness Rz is defined according to the national standard, for example, it can represent the sum of the maximum profile peak height and the maximum valley depth within a sampling length. The sampling length is determined according to the range of the surface roughness Rz.

[0096] Figure 6 The microstructure of the surface 132d of the first metal layer 132a is shown, or the micro-interface between the first metal layer 132a and the first polymer material layer 132b is shown.

[0097] As shown, Figure 5 The second metal layer 132c has a surface 132e facing the first polymer material layer 132b, and the surface 132e is connected (or bonded) to the first polymer material layer 132b. The surface roughness Rz of the surface 132e is in the range of [0.5 μm, 5 μm], for example, the Rz can be 0.5 μm, 1.5 μm, 2 μm, 5 μm, etc.

[0098] In the embodiments, the surface roughness of at least one of the surfaces 132d and 132e can be limited as above.

[0099] In the embodiments of the present application, for convenience, the first metal layer 132a and the second metal layer 132c, as well as the third metal layer 131a and the fourth metal layer 131c to be described below, can be collectively referred to as metal layers, and the first polymer material layer 132b and the second polymer material layer 131b to be described below can be collectively referred to as polymer material layers. By setting the surface roughness of the surface of the metal layer connected to the polymer material layer in the above range, the surface of the metal layer connected to the polymer material layer can be relatively smooth, the pores on the micro-interface between the two can be significantly reduced, the bonding tightness of the two can be enhanced, and the problems such as bubbling of the surface of the heat spreader, delamination of the metal layer and the polymer material layer caused by the expansion of the gas in the pores during the local high-temperature process (for example, the temperature ≥ 300°) in the process of the heat spreader 13 can be improved, thereby the process yield of the heat spreader can be improved, and the heat spreader has better structural reliability and working performance. This effect will be described below.

[0100] As shown, Figure 5As shown, along the extending direction, the second cover plate 132 can be divided into a connecting area 132f and a working area 132g, the connecting area 132f is connected to the outer periphery of the working area 132g, and the working area 132g is protruded compared with the connecting area 132f. The working area 132g can be a flat plate structure. The connecting area 132f is used to connect with the first cover plate 131, and the working area 132g is used to participate in surrounding the cavity 13c. It can be understood that the first metal layer 132a, the first polymer material layer 132b and the second metal layer 132c can be distributed in the connecting area 132f and the working area 132g.

[0101] In the embodiment, the material of the first metal layer 132a is metal, including but not limited to pure copper, copper alloy, stainless steel, titanium alloy, aluminum, magnesium, etc.

[0102] In the embodiment, the material of the first polymer material layer 132b is polymer material, including but not limited to polyimide (PI), polypropylene (PP), polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polydimethylsiloxane (PDMS), polyethylene (PE), polypropylene carbonate (PPC), polyvinyl chloride (PVC), polyvinylidene chloride (PVdC), polystyrene (PS), polyamide (PA), etc.

[0103] For example, the glass transition temperature Tg of the first polymer material layer 132b is greater than or equal to 320°. The glass transition temperature is also called glass transition temperature, which is the temperature at which the polymer changes from a high-elastic state to a glass state. By setting the glass transition temperature of the first polymer material layer 132b in the above range, the first polymer material layer 132b has good high-temperature resistance, and can keep stable performance in the local high-temperature process of the manufacturing process of the uniform temperature plate 13 (such as welding of the first cover plate 131 and the second cover plate 132, manufacturing of the capillary layer 133 at a high temperature above 300°, etc.), which is beneficial to improve the process yield of the uniform temperature plate 13, and make the uniform temperature plate 13 have good structural reliability and working performance.

[0104] In the first embodiment, the material of the second metal layer 132c is a metal, including but not limited to pure copper, copper alloy, stainless steel, titanium alloy, aluminum, magnesium, and metal oxides, wherein the metal oxides include but are not limited to titanium dioxide and aluminum oxide. The material of the second metal layer 132c can be the same as or different from the material of the first metal layer 132a.

[0105] In the first embodiment, the second cover plate 132 can be entirely made of flexible copper clad laminate (FCCL) material, such as a non-adhesive FCCL double-sided board material. The first metal layer 132a and the second metal layer 132c are both copper foils, and the first polymer material layer 132b can be a PI film.

[0106] According to the above description, the second cover plate 132 is formed by a composite of metal and non-metal, and the second cover plate 132 can be referred to as a metal-non-metal composite layer.

[0107] In this embodiment, the second cover plate 132 is manufactured using a composite material, which can combine the advantages of metal materials and polymer materials, so that the second cover plate 132 has good thermal conductivity and strength, good flexibility, and is light in weight.

[0108] Figure 7 Indicated Figure 4 The partial side section structure of the first cover plate 131 in FIG. Figure 7 As shown, the first cover plate 131 may include a fourth metal layer 131c, a second polymer material layer 131b and a third metal layer 131a, which are arranged in sequence along the thickness direction of the first cover plate 131, and the second polymer material layer 131b connects the third metal layer 131a and the fourth metal layer 131c. Figure 7 and Figure 4 As shown, the third metal layer 131 a faces the second cover plate 132 .

[0109] like Figure 7 As shown, the third metal layer 131a has a surface 131d facing the second polymer material layer 131b, and the surface 131d is connected (or bonded) to the second polymer material layer 131b. The surface roughness of the surface 131d is Rz∈[0.5μm, 5μm], for example, Rz can be 0.5μm, 1.5μm, 2μm, 5μm, etc. The fourth metal layer 131c has a surface 131e facing the second polymer material layer 131b, and the surface 131e is connected (or bonded) to the second polymer material layer 131b. The surface roughness of the surface 131e is Rz∈[0.5μm, 5μm], for example, Rz can be 0.5μm, 1.5μm, 2μm, 5μm, etc. In this embodiment, the surface roughness of at least one of the surface 131d and the surface 131e can be defined as above.

[0110] In the first embodiment, by setting the surface roughness of the surface of the metal layer connected with the polymer material layer in the above range, the surface of the metal layer can be relatively smooth, the air gap between the metal layer and the polymer material layer after the combination of the two can be significantly reduced, the combination tightness of the two can be enhanced, and the problems such as the generation of bubbles (as shown in Figures 8-9 , delamination (as shown in Figure 10 , delamination of the first metal layer 132a and the first polymer material layer 132b) and the like between the metal layer and the polymer material layer in the local high-temperature process (for example, the process temperature ≥ 300°) in the process of the uniform temperature plate 13 can be improved. This effect will be described below.

[0111] In one embodiment of the present embodiment, as shown in Figure 7 , along the extension direction, the first cover plate 131 can be divided into a connecting area 131f and a working area 131g, the connecting area 131f is connected around the outer periphery of the working area 131g, and the working area 131g is protruded compared with the connecting area 131f. It can be understood that the third metal layer 131a, the second polymer material layer 131b and the fourth metal layer 131c can be distributed in the connecting area 131f and the working area 131g. The connecting area 131f is used for connecting with the first cover plate 131, and the working area 131g is used for participating in surrounding the cavity 13c.

[0112] As shown in Figure 7 , both sides of the working area 131g in the thickness direction can have a concave-convex structure. The working area 131g can include a plurality of convex portions 131h and a plurality of concave portions 131i. The convex portion 131h is protruded compared with the connecting area 131f, and in combination with Figure 7 and Figure 4 , the convex portion 131h is protruded away from the second cover plate 132, and the convex portion 131h is spaced apart from the second cover plate 132. The concave portion 131i is recessed compared with the connecting area 131f, and in combination with Figure 7 and Figure 4 , the concave portion 131i is recessed towards the second cover plate 132 and connected with the capillary layer 133. The concave portion 131i serves as a support column in the uniform temperature plate 13, and is used for ensuring the rigidity and strength of the uniform temperature plate 13 and improving the mechanical properties of the uniform temperature plate 13.

[0113] As shown in Figure 7 , the convex portion 131h and the concave portion 131i in the working area 131g can be alternately arranged, that is, arranged in the manner of convex portion 131h-concave portion 131i-convex portion 131h-concave portion 131i-convex portion 131h……. It can be understood that, for a side view perspective, if viewed from a top view perspective, a plurality of convex portions 131h can be distributed around each concave portion 131i; in addition to the convex portion 131h connected with the connecting area 131f (for example Figure 7 , the convex portion 131h connected with the connecting area 131f is not arranged around each concave portion 131i.Figure 7 The two protrusions 131h at the leftmost and rightmost positions of the working area 131g can be surrounded by a plurality of concave portions 131i. The arrangement of the protrusions 131h and the concave portions 131i can form support columns at multiple positions of the vapor chamber 13, so that the vapor chamber 13 has sufficient rigidity and strength, and has good mechanical properties.

[0114] Figure 7 The thickness of the first cover plate 131 at each position is substantially uniform. An example of a first cover plate 131 with a uniform thickness will be described below. Figure 7 The thickness of the first cover plate 131 at each position is not uniform.

[0115] In another embodiment of the present embodiment, as shown in FIG. 6, one side (e.g., the lower side) of the working area 131g has a concave-convex structure, and the other side (e.g., the upper side) is a flat surface. The working area 131g can include a base layer 131j, which has a flat structure. The same side (e.g., the lower side) of the base layer 131j is provided with a plurality of protrusions 131k, which are spaced apart from each other. Figure 11 The protrusions 131k face the second cover plate 132 and are connected to the capillary layer 133. The protrusions 131k act as support columns in the vapor chamber 13, and are used to ensure the rigidity and strength of the vapor chamber 13, and to improve the mechanical properties of the vapor chamber 13. Figure 11 Figure 4 The protrusions 131k face the second cover plate 132 and are connected to the capillary layer 133. The protrusions 131k act as support columns in the vapor chamber 13, and are used to ensure the rigidity and strength of the vapor chamber 13, and to improve the mechanical properties of the vapor chamber 13.

[0116] In the first embodiment, the material of the first cover plate 131 and the material of the second cover plate 132 can be the same.

[0117] For example, the third metal layer 131a is made of a metal, including but not limited to pure copper, copper alloy, stainless steel, titanium alloy, aluminum, magnesium, etc.

[0118] ​For example, the material of the second polymer material layer 131b is a polymer material, including but not limited to polyimide (PI), polypropylene (PP), poly tetrafluoroethylene (PTFE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polydimethylsiloxane (PDMS), polyethylene (PE), polypropylene carbonate (PPC), polyviny chloride (PVC), polyvinylidene chloride (PVdC), polystyrene (PS), polyamide (PA), etc.

[0119] For example, the glass transition temperature Tg of the second polymer material layer 131b is greater than or equal to 320°. By setting the glass transition temperature of the second polymer material layer 131b in the above range, the second polymer material layer 131b has good high-temperature resistance, and can maintain stable performance in the local high-temperature process of the process of the uniform temperature plate 13 (such as welding of the first cover plate 131 and the second cover plate 132, manufacturing of the capillary layer 133 at a high temperature of 300° or above, etc.), which is beneficial to improve the process yield of the uniform temperature plate 13, and makes the uniform temperature plate 13 have good structural reliability and working performance.

[0120] For example, the material of the fourth metal layer 131c is metal, including but not limited to pure copper, copper alloy, stainless steel, titanium alloy, aluminum, magnesium, metal oxide, wherein the metal oxide includes but is not limited to titanium dioxide, aluminum oxide, etc. The material of the fourth metal layer 131c can be the same as or different from the material of the third metal layer 131a.

[0121] For example, the first cover plate 131 can be made of FCCL material as a whole, for example, made of glue-free FCCL double-sided panel material. Wherein, the third metal layer 131a and the fourth metal layer 131c are both copper foil, and the second polymer material layer 131b can be a PI film.

[0122] According to the above, the first cover plate 131 is composed of metal and non-metal, and the first cover plate 131 can be referred to as a metal-non-metal composite layer.

[0123] In the embodiment, the first cover plate 131 is made of composite material, which combines the advantages of metal material and polymer material, so that the first cover plate 131 has good thermal conductivity and strength, good flexibility, and light weight.

[0124] In combination Figure 7 (or Figure 11 )、 Figure 5 and Figure 4 , the connecting area 131f of the first cover plate 131 is connected with the connecting area 132f of the second cover plate 132, for example, by welding to form a connection. The connecting area 131f and the connecting area 132f constitute the connecting area 13a of the uniform temperature plate 13. The working area 131g of the first cover plate 131 is spaced apart from the working area 132g of the second cover plate 132, and the area between them is the cavity 13c, and the two constitute the working area 13b of the uniform temperature plate 13.

[0125] As described above, the connecting area 131f of the first cover plate 131 and the connecting area 132f of the second cover plate 132 can be welded together. Local high temperature will be generated during welding, for example, the temperature can reach 300°. As described above, by setting the surface roughness of the surface of the metal layer connected with the polymer material layer within a smaller range, the surface of the metal layer and the polymer material layer can be relatively smooth, the pores on the micro interface between the two can be significantly reduced, the bonding tightness of the two can be enhanced, and thus the problems of blistering of the surface of the uniform temperature plate, delamination of the metal layer and the polymer material layer caused by expansion of gas in the pores during welding can be improved, and the process yield of the uniform temperature plate 13 can be improved, so that the uniform temperature plate 13 has good structural reliability and working performance.

[0126] In one embodiment of the present embodiment, the capillary layer 133 can be pre-manufactured and assembled into the cavity 13c. As shown in Figure 12 , the capillary layer 133 can be connected with the first metal layer 132a, for example, can be welded to the first metal layer 132a and integrated with the first metal layer 132a. Integrated means that the capillary layer 133 and the first metal layer 132a are not assembled together by mechanical parts (such as screws, rivets, buckles, etc. connecting parts, or adhesive connecting medium), and there is no obvious interface gap at the connection between the capillary layer 133 and the first metal layer 132a, but it is in a continuous or fused state. The above explanation about integration is applicable hereinafter.

[0127] Alternatively, in another embodiment of the present invention, the capillary layer 133 can also be formed during the manufacturing process of the second cover plate 132. The capillary layer 133 itself is part of the second cover plate 132, and the capillary layer 133 is integrally connected to the first metal layer 132a. For example, the capillary layer 133 can be formed on the first metal layer 132a through surface treatment and molding processes, such as etching, laser engraving, electroplating, 3D printing, etc.

[0128] In this embodiment, by integrally connecting the capillary layer 133 and the first metal layer 132a, the capillary layer 133 and the first metal layer 132a are fully bonded, reducing the air gap between them and improving the uniform temperature and heat dissipation performance of the vapor chamber 13. Furthermore, the use of mechanical components to connect the capillary layer 133 and the first metal layer 132a can be avoided, thereby achieving a lighter and thinner vapor chamber 13.

[0129] As described above, the integrated capillary layer 133 can be manufactured through several processes, such as welding, laser engraving, etc. When these processes are performed, local high temperatures will be generated, for example, the temperature can reach 300°. In this embodiment, by setting the surface roughness of the surface of the metal layer connected to the polymer material layer within a smaller range, the surface where the metal layer and the polymer material layer are combined can be made smoother, significantly reducing the pores on the microscopic interface between the two, and enhancing the bonding tightness between the two, thereby improving the problems of blistering on the surface of the heat spreader and delamination of the metal layer and the polymer material layer caused by the expansion of gas in the pores during the manufacturing process of the capillary layer 133, thereby improving the process yield of the heat spreader 13, so that the heat spreader 13 has better structural reliability and working performance.

[0130] In another embodiment, the connection method between the capillary layer 133 and the first metal layer 132a is not limited, as long as the capillary layer 133 is fixed in the cavity 13c. The following description will be continued by taking the capillary layer 133 and the first metal layer 132a as an example.

[0131] Figure 13 The side cross-sectional structure of the capillary layer 133 in one implementation manner of this embodiment is illustrated.

[0132] like Figure 13 As shown, the capillary layer 133 may include a capillary through-hole layer 133 a and a plurality of support bodies 133 c .

[0133] The capillary through hole layer 133a can be a substantially flat layered structure, and its thickness is, for example, less than or equal to 30 μm. The capillary through hole layer 133a is provided with a plurality of capillary through holes 133b. The capillary through holes 133b are used to provide capillary force. For example, the opening area of ​​the capillary through holes 133b is ≤ 2000 μm. 2 , the center distance between adjacent capillary through holes 133b is ≤500μm.

[0134] All the support bodies 133c are connected to one side of the capillary through-hole layer 133a, and these support bodies 133c are spaced apart in pairs. Figure 13 and Figure 12 As shown, the capillary through-hole layer 133a and the first metal layer 132a are stacked and arranged at intervals, and the support body 133c is connected between the capillary through-hole layer 133a and the first metal layer 132a. The support body 133c plays the role of supporting the capillary through-hole layer 133a, and the gap between the support bodies 133c can also be used as a channel (which will be explained below).

[0135] like Figure 13 As shown, the width of the support body 133c is larger than the diameter of the capillary through hole 133b, and the gap between two adjacent support bodies 133c is also larger. Among the capillary through holes 133b on the capillary layer 133, there is at least one first capillary through hole. At least a portion of the projection of the first capillary through hole along the thickness direction of the capillary through hole layer 133a falls within the gap, that is, the first capillary through hole is connected to the gap.

[0136] Figure 14 FIG. 1 illustrates a three-dimensional decomposition structure of the capillary layer 133 in one embodiment. Figure 14 As shown, the capillary through hole 133b can be or approximate to a circular hole, and the support body 133c can be or approximate to a cylinder. It is understandable that Figure 14 This is merely an example and does not limit the structure, size, number, relative position, etc. of the capillary through hole 133b and the support body 133c of this embodiment.

[0137] Figures 15-18 The arrangement patterns of the capillary through holes 133b in several embodiments are illustrated respectively.

[0138] like Figure 15 As shown, in one embodiment, the capillary through holes 133b on the capillary through hole layer 133a can be arranged in a matrix or a checkerboard pattern. These capillary through holes 133b can be arranged in multiple columns in the first direction and in multiple rows in the second direction. The centers of all the capillary through holes 133b in any two rows (or any two columns) can be connected to form a rectangle. The first direction intersects the second direction, for example, the first direction is perpendicular to the second direction. Figure 15 The first direction is horizontal and the second direction is vertical. This is just an example and is not actually limited to this in the embodiments of the present application. Figure 15 The arrangement shown is convenient for manufacture.

[0139] like Figure 16As shown, in another embodiment, the capillary through holes 133b on the capillary through hole layer 133a may include a plurality of groups arranged in sequence along the first direction, such as group H1, group H2, group H3, group H4 and group H5, etc. Each group includes at least two capillary through holes 133b arranged in sequence along the second direction. For any two adjacent groups, along the second direction, at least one capillary through hole 133b in the other group is distributed between every two adjacent capillary through holes 133b in one group. For example, for adjacent groups H1 and H2, along the second direction, a capillary through hole 133b in group H2 is distributed between every two adjacent capillary through holes 133b in group H1, and a capillary through hole 133b in group H1 is distributed between two adjacent capillary through holes 133b in group H2. This arrangement can be called a cross arrangement. It can be considered Figure 16 The scheme is based on Figure 15 The solution adjusts the pore size and / or pore spacing of the capillary through holes 133b and adds a group between two adjacent groups, thereby changing the density and number of the capillary through holes. This allows more parts of the capillary through hole layer 133a to provide capillary force, so that the liquid working medium can be continuously affected by the capillary force during the flow process. It can be understood that Figure 16 The number and relative positions of the capillary through holes 133b shown are merely for illustration, and are not actually limited in the embodiments of the present application.

[0140] like Figure 17 As shown, in another embodiment, among all the capillary through holes 133b on the capillary through hole layer 133a, at least two capillary through holes 133b have opening areas different from each other, for example Figure 17 The opening areas of the three capillary through holes 133b shown are different from each other. For circular holes, different opening areas also mean different pore diameters. The positions of these capillary through holes 133b with different opening areas can be determined as needed, not limited to Figure 17 shown.

[0141] For example, along a certain direction, e.g. Figure 17 In the first direction shown, the opening area of ​​the capillary through-holes 133b on the capillary through-hole layer 133a may show an increasing trend. For example, from group H1 to group H3, the opening area of ​​the capillary through-holes 133b increases successively. The "increasing trend" includes a gradual increase, and also includes that the opening area shows an increasing trend as a whole but may be repeated locally. For example, positions with smaller opening areas may be close to the heat source. The capillary force of the capillary through-holes 133b at these positions is larger, which can achieve rapid rehydration and reflux of the working fluid; positions with larger opening areas may be far away from the heat source. The flow resistance at these positions is smaller, which facilitates the condensed working fluid to pass through the capillary through-holes 133b and reflux to the channels between the support bodies 133c. It can be understood that even capillary through-holes 133b with a larger opening area can provide a capillary force that meets the requirements.

[0142] like Figure 18 As shown, in another embodiment, the capillary through hole 133b can be a narrow and long gap, and the opening area of ​​such a capillary through hole 133b is sufficient to provide a capillary force. For example, a plurality of such capillary through holes 133b can be arranged regularly, for example, arranged in sequence along the first direction. It is understandable that such capillary through holes 133b can also be arranged arbitrarily as needed, not limited to Figure 18 All the capillary through holes 133b on the capillary through hole layer 133a may be slits, or only a portion of the capillary through holes 133b may be slits.

[0143] Figures 14-18 These examples only list some possible structures and arrangements of the capillary through holes 133b, and are not intended to be exhaustive. Depending on actual needs, the capillary layer 133 may have one or more structures of capillary through holes 133b, or one or more arrangements of the capillary through holes 133b. Furthermore, each structure of the capillary through holes 133b may be combined with one or more arrangements.

[0144] Figures 19-21 The top view structure and arrangement pattern of the support body 133c in different embodiments are respectively illustrated. Figure 19 As shown, the cross section of the support body 133c may be or approximate to a circle, and the support body 133c may be or approximate to a cylinder. Figure 20 As shown, the cross section of the support body 133c may be or approximate to an ellipse, and the support body 133c may be or approximate to an elliptical cylinder. Figure 21 As shown, the cross section of the support body 133c can be or approximately rectangular, and the support body 133c can be a square column. In another embodiment, the support body 133c can be a prism of other shapes, and its cross section can be any other polygon, such as a pentagon, a hexagon, etc.

[0145] like Figures 19-21As shown, multiple support bodies 133c can be distributed in a point-like manner, and gaps can be formed in various directions between the support bodies 133c, that is, channels can be formed in various directions, and these channels are interconnected to form a channel network. When the temperature plate 13 is working, after the working fluid at a certain position in the channel network evaporates, multiple positions around it can replenish liquid working fluid to that position. As a result, the temperature plate 13 is insensitive to the position of the heat source. The temperature plate 13 can correspond to multiple heat sources and conduct heat and dissipate heat for multiple heat sources; or, the position of the temperature plate 13 can be fixed and the position of the heat source can be adjusted as needed, so that the temperature plate 13 can always conduct heat and dissipate heat normally. In addition, it can also improve the defect that a certain position cannot be replenished with liquid working fluid after the working fluid evaporates, resulting in excessive temperature rise at that position, thereby reducing the phenomenon of unstable boiling, evaporation and flow of the working fluid. The above principle will be further explained below.

[0146] Figure 22 FIG. 1 illustrates the three-dimensional structure and arrangement of the support body 133c in another embodiment. Figure 22 As shown, a plurality of support bodies 133c can be arranged in sequence along the first direction, and each support body 133c can be a strip structure extending along the second direction. The second direction is the length direction of the support body 133c, and the size of each support body 133c along the second direction is greater than its size along other directions. Thus, a channel extending along the second direction can be formed between any two adjacent support bodies 133c, and the channel can be called a groove. The width of the groove can be uniform or substantially uniform at all locations, and the grooves can be parallel. The groove is used for the flow of liquid working medium. Reference Figure 22 As shown, since the width of the groove is substantially constant, the liquid working medium in the groove has a strong flow directionality and a small flow resistance, which allows the liquid working medium to be quickly replenished to the evaporation position, thereby ensuring the heat conduction and heat dissipation effect. The above principle will be further explained below.

[0147] In this embodiment, all the supports 133c in the capillary layer 133 can be made of Figure 22 The structure and arrangement style shown in the figure can be called the first support body. Alternatively, only a part of the support body 133c is used. Figure 22 The structure and arrangement style shown in the figure can be referred to as the first support body 133c; the other part of the support body 133c can adopt other structures and arrangement styles, for example, Figures 19-21 One or more structures and arrangement styles.

[0148] based on Figure 22 The embodiment shown, Figure 23 The three-dimensional structure and arrangement of the support body 133c in another embodiment are shown. Figure 24 for Figure 23 Top view of .

[0149] As shown in Figure 23 and Figure 24 , the plurality of support bodies 133c can be arranged into groups along the first direction, such as group S1, group S2, group S3, group S4, group S5 and group S6. Each group can include at least two support bodies 133c arranged in sequence along the second direction, such as two support bodies 133c arranged in sequence along the second direction in group S1, and three support bodies 133c arranged in sequence along the second direction in group S2. One of any two adjacent groups can be referred to as a first group, and the other as a second group. For example, group S1 can be referred to as a first group, and group S2 as a second group, or group S1 as a second group, and group S2 as a second group. Of course, group S2 and group S3 can also be referred to as a first group and a second group, respectively. It can be understood that, Figure 23 and Figure 24 the number of support bodies 133c in

[0150] As shown in Figure 24 , the projection of the gap between any two adjacent support bodies 133c in the first group in the first direction falls on one support body 133c in the second group. For example, the projection of the gap G1 between the two adjacent support bodies 133c in group S1 in the first direction can fall on the middle support body 133c in group S2; the projection of the gap G2 between the two adjacent support bodies 133c in group S2 in the first direction can fall on the upper support body 133c in group S1, and the projection of the gap G3 between the two adjacent support bodies 133c in group S2 in the first direction can fall on the lower support body 133c in group S1.

[0151] As shown in Figure 24 , a groove (i.e., a channel extending along the second direction) is formed between each pair of adjacent groups, and the width of the groove is substantially constant.

[0152] As described above, it can be understood that Figure 24 the embodiments shown in Figure 22 can integrate the embodiments of Figure 21The advantages of the implementation method are: due to the formation of the groove, the liquid working medium in the groove has a strong flow directionality and a small flow resistance, which is conducive to the rapid replenishment of the liquid working medium to the evaporation position, thereby ensuring the heat conduction and heat dissipation effect. Moreover, a gap (such as gap G1, gap G2 and gap G3) can be formed between adjacent support bodies 133c in each group, and the gap is also a kind of channel between adjacent support bodies 133c. The gap is connected with the groove to form a channel network connected up and down and left and right. When the temperature equalizer 13 is working, after the working medium at a certain position of the channel network is vaporized and evaporated, multiple positions around it can replenish the liquid working medium to this position, so that the temperature equalizer 13 is insensitive to the position of the heat source. The temperature equalizer 13 can correspond to multiple heat sources and perform heat conduction and heat dissipation on multiple heat sources; or, the position of the temperature equalizer 13 can be fixed and the position of the heat source can be adjusted as needed, so that the temperature equalizer 13 can always perform heat conduction and heat dissipation normally. This can also improve the problem of excessive temperature rise at a certain location due to a lack of liquid refrigerant after the refrigerant vaporizes and evaporates, thereby reducing the phenomenon of unstable refrigerant flow during boiling and evaporation. Furthermore, the gaps between adjacent support bodies 133c within each group (e.g., gap G1, gap G2, and gap G3) are relatively small, and can be smaller than the width of the grooves between adjacent support bodies 133c. This gap can provide a certain capillary force, which is conducive to improving the fluidity of the liquid refrigerant, ensuring rapid replenishment of the liquid refrigerant, and thus improving the thermal conductivity and heat dissipation effect. The above principle will be further explained below.

[0153] In this embodiment, all the supports 133c in the capillary layer 133 can be made of Figure 22 Alternatively, all supports 133c may be used Figure 24 Alternatively, a portion of the support body 133c may be used Figure 22 The other part of the support body 133c can be made of Figure 24 Alternatively, a portion of the support body 133c may be used Figure 22 and / or Figure 24 The other part of the support body 133c can be Figures 19-21 In this embodiment, as long as one or more solutions are adopted Figure 22 or Figures 19-24 The support body 133c of the illustrated embodiment can be referred to as a first support body.

[0154] Figures 25-28 These examples only list some possible structures and arrangements of the support bodies 133c, and are not intended to be exhaustive. Depending on actual needs, the capillary layer 133 may have one or more structures of the support bodies 133c, or one or more arrangements of the support bodies 133c. Furthermore, each structure of the support bodies 133c may be combined with one or more arrangements.

[0155] Figures 25-28 In a top view, the positional relationship between the capillary through holes 133b and the support bodies 133c in several embodiments is schematically shown, wherein the support bodies 133c below the capillary through hole layer 133a are schematically shown by dashed lines. It can be understood that, Figure 25 The structure and arrangement pattern of the capillary through holes 133b and the structure and arrangement pattern of the support bodies 133c in the above embodiments are examples and are not a limitation of the present embodiment.

[0156] As shown in Figure 25 , in an embodiment, the support body 133c can overlap with at least one capillary through hole 133b, that is, the support body 133c can block at least part of the capillary through hole 133b. Exemplarily, the support body 133c can overlap with multiple capillary through holes 133b; there can be multiple such support bodies 133c, for example, each support body 133c in the capillary layer 133 can overlap with multiple capillary through holes 133b.

[0157] Unlike Figure 26 , as shown in Figure 26 , in another embodiment, at least one support body 133c does not overlap with the capillary through hole 133b, that is, the support body 133c completely avoids the capillary through hole 133b, and the support body 133c can be arranged in a non-punch area in the capillary through hole layer 133a. Exemplarily, each support body 133c in the capillary layer 133 does not overlap with the capillary through hole 133b, that is, each support body 133c can be arranged in the non-punch area.

[0158] Unlike Figure 27 , as shown in Figure 28 , the circular capillary through hole 133b can be matched with the strip-shaped support body 133c.

[0159] As shown in Figures 25-28 , in another embodiment, the capillary through hole 133b can be a slit, the support body 133c can be a strip-shaped structure, and the extension direction of the slit can intersect with the extension direction of the strip-shaped structure. Thus, the support body 133c can overlap with multiple capillary through holes 133b, and the groove between two adjacent support bodies 133c can communicate with multiple slits. It can be understood that the width of the groove between two adjacent support bodies 133c can be large enough to accommodate more liquid working medium, so that the multiple slits communicating with the groove can fully absorb the liquid working medium, and finally ensure the heat conduction efficiency.

[0160] Based on Figure 12It can be understood that, in the embodiment, the design (including at least one of structure and arrangement style) of the capillary through hole 133b can be used in combination with the design (including at least one of structure and arrangement style) of the support body 133c, and each design of the capillary through hole 133b can be matched with one or more designs of the support body 133c.

[0161] In the above embodiment, as Figure 29 shown, the working area 132g of the second cover plate 132 is substantially a flat layer structure, and the support body 133c is directly protruded on the first metal layer 132a. Based on the above embodiment, the structure of the working area 132g can be adjusted so as to have a plurality of protrusions, and then the support body 133c covering the protrusions is formed. This will be described below.

[0162] Figure 29 Another embodiment is shown, which is a partial side sectional structure of the capillary layer 133 and the second cover plate 132, and the second metal layer 132c is not shown. As Figure 29 shown, the first polymer material layer 132b can include a base layer 132h and a plurality of protrusions 132i, the base layer 132h can be a flat layer structure, and the protrusions 132i are protruded on the same side (for example, the upper side) of the base layer 132h. In combination with Figure 4 and Figure 29 shown, the protrusions 132i are protruded on the side of the base layer 132h facing the first cover plate 131. The first metal layer 132a covers the base layer 132h. Each support body 133c covers one protrusion 132i and connects the first metal layer 132a and the capillary through hole layer 133a. It can be considered that each support body 133c and the protrusion 132i it covers together constitute a support column structure.

[0163] For example, the first metal layer 132a and the support body 133c can be the same material, such as pure copper or copper alloy.

[0164] For example, the first polymer material layer 132b with protrusions 132i can be manufactured by etching (such as PI etching), laser engraving, and hot pressing processes, and then a copper layer is formed on the first polymer material layer 132b by electroplating process. In the copper layer, the part covering the base layer 132h can be referred to as the first metal layer 132a, and the part covering the protrusion 132i can be referred to as the support body 133c. It can be understood that, Figure 12 The boundary line between the first metal layer 132a and the support body 133c is shown only for the purpose of clear display.

[0165] Compared with the embodiment shown in Figure 29 , Figure 30In the illustrated embodiment, since the support body 133c and the convex portion 132i it covers together form a support column structure, and the convex portion 132i is made of a relatively lightweight polymer material, the support column structure is relatively light, which helps reduce the weight of the temperature vapor chamber 13. In addition, this structure has a high processing precision, which can ensure the structural accuracy of the temperature vapor chamber 13.

[0166] Figure 30 FIG. 1 shows a partial side cross-sectional structure of the working area 132g and the capillary layer 133 in another embodiment, wherein the second metal layer 132c is not shown. Figure 30 As shown, the thickness of each position of the second cover plate 132 can be basically the same, and a plurality of recesses 132j ​​can be provided on the side of the working area 132g facing away from the first cover plate 131. The recesses 132j ​​are formed by the first metal layer 132a and the first polymer material layer 132b being recessed together. The recesses 132j ​​can be in the shape of a pit or a groove, and their diameter can be, for example, between 100 μm and 200 μm, and their depth can be, for example, about 20 μm. Figure 4 and Figure 12 As shown, each recess 132j ​​is recessed toward the first cover plate 131, or in other words, is recessed toward the cavity 13c of the temperature uniform plate 13. Therefore, each recess 132j ​​forms a protrusion on the inner wall of the cavity 13c, and recesses are formed between adjacent protrusions. The portion of the first metal layer 132a located in each recess 132j ​​serves as a support body 133c, and each support body 133c is connected to the capillary through-hole layer 133a. A channel is formed between any two adjacent support bodies 133c, and the shape of the channel can be determined as needed, for example, it can be a strip-shaped groove, or a pit-shaped groove. The channel is connected to the capillary through-hole 133b. In this embodiment, it can be considered that the capillary layer 133 is the capillary through-hole layer 133a, or the capillary layer 133 includes the capillary through-hole layer 133a and the portion of the first metal layer 132a located in each recess 132j.

[0167] Compared to Figure 30 The embodiment shown, Figure 30 The embodiment shown can use the first metal layer 132a to form the support body 133c, thereby reducing the thickness and weight of the second cover plate 132. Figure 30 The second cover plate 132 has a high processing precision, which can ensure the structural precision of the temperature homogenizing plate 13 .

[0168] based on Figure 31 As shown, in another embodiment, as Figure 31 As shown, the second cover plate 132 may also include a second metal layer 132 c , and the concave portion 132 j is formed by the first metal layer 132 a , the first polymer material layer 132 b , and the second metal layer 132 c . Figure 30The embodiment shown has a second metal layer 132c added to the second cover plate 132, so that the structural strength and rigidity of the second cover plate 132 is better, and the mechanical performance is better.

[0169] As shown in Figure 31 and Figure 30 Exemplarily, each recess 132j can be filled with a heat-conducting material 132m. Figure 31 and Figure 4 In order to clearly indicate the recess 132j and the heat-conducting material 132m, only one recess 132j is filled with the heat-conducting material 132m, which is only a schematic. The heat-conducting material 132m can completely fill the recess 132j, so that the second cover plate 132 has a flat outer surface. The heat-conducting material 132m has good heat-conducting performance, which includes but is not limited to heat-conducting glue containing graphene components, phase change materials (PCM), etc. The heat-conducting material 132m is used to expel air (air is a poor conductor of heat) in the recess 132j, so as to enhance the heat conduction between the second cover plate 132 and the heat source. It can be understood that in another embodiment, the heat-conducting material 132m can also not be provided.

[0170] The working principle of the vapor chamber 13 is described below.

[0171] Referring to Figure 16 , the first cover plate 131 can face away from the heat source, and the second cover plate 132 can face toward the heat source, and the heat of the heat source will be absorbed by the second cover plate 132. In the vapor chamber 13, the area close to the heat source is a high-temperature area, and the area far from the heat source is a low-temperature area. The liquid working medium in the high-temperature area will absorb heat and evaporate, flow from the high-temperature area to the low-temperature area, and condense in the low-temperature area. The liquid working medium will also fill the channels between the adjacent support bodies 133c and the capillary through holes 133b. For a certain place of the capillary layer 133, the evaporation of the liquid working medium in the channels and the capillary through holes 133b at that place will cause the liquid level at that place to drop. Since the capillary through hole 133b can provide a capillary force, the liquid level at that place can be supplemented by absorbing liquid working medium from other surrounding places, thereby realizing the circulating flow of the working medium. In the process of the flow of the working medium, the working medium will transfer heat from the high-temperature area to the low-temperature area, achieving the effect of heat conduction and heat dissipation.

[0172] Based on the above working principle, the working mechanism and technical effect of the capillary through hole 133b and the support body 133c described above can be understood.

[0173] For Figure 16 the capillary through hole 133b shown, since Figure 17The capillary through holes 133b are arranged in a cross pattern, which can increase the density and number of the capillary through holes 133b, so that more parts of the capillary layer 133 can increase the capillary force, so that the liquid working medium can be continuously affected by the capillary force during the flow process, thereby increasing the liquid replenishment and reflux speed, which is beneficial to improving the heat conduction and heat dissipation efficiency.

[0174] for Figures 19-21 The capillary through-holes 133b shown in FIG. 1 can have an increasing opening area. For example, the opening area of ​​the capillary through-holes 133b increases sequentially from group H1 to group H3. For example, locations with smaller opening areas can be closer to the heat source. At these locations, the capillary through-holes 133b have a stronger capillary force, enabling rapid refilling and reflux of the working fluid, facilitating rapid heat conduction and heat dissipation in high-temperature areas. Locations with larger opening areas can be farther from the heat source. At these locations, the flow resistance is lower, facilitating the condensed working fluid to flow back through the capillary through-holes 133b to the channels between the support bodies 133c, facilitating increased reflux speed and, in turn, improved heat conduction and heat dissipation efficiency.

[0175] for Figure 22 The support bodies 133c shown are distributed in a point-like manner, and a channel network is formed between the support bodies 133c. When the temperature equalizer 13 is working, after the working fluid at a certain position of the channel network evaporates, multiple positions around it can replenish the liquid working fluid to this position. This design makes the temperature equalizer 13 insensitive to the position of the heat source. The temperature equalizer 13 can correspond to multiple heat sources and conduct heat and dissipate heat for multiple heat sources; or, the position of the temperature equalizer 13 can be fixed and the position of the heat source can be adjusted as needed, so that the temperature equalizer 13 can always conduct heat and dissipate heat normally. In addition, it can also improve the defect that a certain position cannot be replenished with liquid working fluid after the working fluid evaporates, resulting in excessive temperature rise at this position, thereby reducing the phenomenon of unstable boiling, evaporation and flow of the working fluid.

[0176] for Figure 24 As shown in the support body 133c, since the width of the grooves between adjacent support bodies 133c is basically constant, the flow directionality of the liquid working medium in the grooves is strong and the flow resistance is small, which allows the liquid working medium to be quickly replenished to the evaporation position, thereby ensuring the heat conduction and heat dissipation effect.

[0177] for Figure 22 The support body 133c shown, which can be integrated Figure 21 and Figure 32The advantages of the embodiment are that: due to the formation of the groove, the liquid working medium in the groove has strong flow directionality and small flow resistance, which is conducive to the rapid replenishment of the liquid working medium to the evaporation position, thereby ensuring the heat dissipation effect. Moreover, gaps (for example, gaps G1, G2, and G3) can be formed between adjacent support bodies 133c in each group, which are communicated with the grooves to form a channel network that is communicated in up, down, left, and right directions. When the working medium in a certain position of the channel network vaporizes and evaporates during the operation of the vapor chamber 13, the liquid working medium can be replenished to the position from multiple surrounding positions, so that the vapor chamber 13 is not sensitive to the position of the heat source, and the vapor chamber 13 can correspond to multiple heat sources to conduct heat and dissipate heat for the multiple heat sources; or, the position of the vapor chamber 13 can be fixed and the position of the heat source can be adjusted as needed, so that the vapor chamber 13 can always conduct heat and dissipate heat normally. The defect that the position cannot be replenished with liquid working medium after the working medium vaporizes and evaporates and the position is overheated can be improved, and the phenomenon of unstable flow of the working medium boiling and evaporating is reduced. In addition, the gap (for example, gaps G1, G2, and G3) between adjacent support bodies 133c in each group is small, which can be smaller than the width of the groove between adjacent support bodies 133c, and the gap can provide a certain capillary force, which is conducive to improving the flowability of the liquid working medium, ensuring the rapid replenishment of the liquid working medium, and further improving the heat dissipation effect.

[0178] Based on the above embodiment, the material composition of the first cover plate 131 and the second cover plate 132 can be adjusted to obtain other embodiments. The following will be described.

[0179] Figure 32 The partial side cross-sectional structure of the vapor chamber 13 in Embodiment Two is shown. Compared with Embodiment One, Figure 4 and Figure 32 The first cover plate 131 can include a third metal layer 131a and a second high polymer material layer 131b, but does not have a fourth metal layer 131c, and the second cover plate 132 can include a first metal layer 132a and a first high polymer material layer 132b, but does not have a second metal layer 132c, and the first cover plate 131 and the second cover plate 132 can be a no-glue FCCL single-sided plate. The vapor chamber 13 in Embodiment Two is lighter and thinner, more flexible, more resistant to bending, and has lower process difficulty, which can meet the needs of products.

[0180] It can be understood that, Figure 4 The structure of the capillary layer 133 in Figure 23 is consistent with that in Embodiment One, which is only an example. In fact, the capillary layer 133 in Embodiment Two can also adopt the structure shown in Figure 33 .

[0181] As Figure 34As shown in one embodiment of Embodiment Two, the first cover plate 131 can adopt an equal-thickness design, and both sides of the thickness direction of the first cover plate 131 can have uneven structures to form support columns. Figure 34 As shown in another embodiment of Embodiment Two, the first cover plate 131 can adopt an unequal-thickness design, and one side (for example, the lower side) of the working area 131g of the first cover plate 131 has an uneven structure and forms a plurality of convex portions 131k as support columns; the other side (for example, the upper side) of the working area 131g is a flat surface.

[0182] Based on Embodiment Two, Figure 34 As shown, the local side cross-sectional structure of the vapor chamber 13 in Embodiment Three is illustrated. Compared with Embodiment Two, Figure 3 As shown in Embodiment Three: the second cover plate 132 can include a first metal layer 132a, a first polymer material layer 132b, and a second metal layer 132c, and the second cover plate 132 can be a double-sided FCCL panel without glue. The first cover plate 131 in Embodiment Three is relatively thin and flexible, and has a low process difficulty and a good bending resistance, which can meet the product requirements. In addition, the first polymer material layer 132b in the second cover plate 132 can face the heat source device, and the first polymer material layer 132b is relatively soft, which can reduce the impact on the heat source device and has a buffering protection effect. The insulation performance of the first polymer material layer 132b does not affect the operation of the heat source device. Figure 35 As shown, Figure 35 In one embodiment, the second polymer material layer 131b in the first cover plate 131 can be connected to the display screen 11, and the second polymer material layer 131b is relatively soft, which has a small impact on the display screen 11 and has a buffering protection effect on the display screen 11.

[0183] Based on Embodiment Two, Figure 36 As shown, the local side cross-sectional structure of the vapor chamber 13 in Embodiment Four is illustrated. Compared with Embodiment Two, Figure 36 As shown in Embodiment Four: the first cover plate 131 can include a third metal layer 131a, a second polymer material layer 131b, and a fourth metal layer 131c, and the first cover plate 131 can be a double-sided FCCL panel without glue. The second cover plate 132 in Embodiment Four is relatively thin and flexible, and has a low process difficulty and a good bending resistance, which can meet the product requirements. In addition, the first polymer material layer 132b in the second cover plate 132 can face the heat source device, and the first polymer material layer 132b is relatively soft, which can reduce the impact on the heat source device and has a buffering protection effect. The insulation performance of the first polymer material layer 132b does not affect the operation of the heat source device.

[0184] In the above embodiments, the first cover plate 131 is a metal-nonmetal composite material. Based on the above embodiments, the embodiments in which the first cover plate 131 is a metal or a metal composite material will be described below.

[0185] Figure 36A partial side sectional view of the first cover plate 131 in Embodiment Five is shown. Unlike the above embodiments, as shown in Figure 37 the first cover plate 131 in Embodiment Five includes a third metal layer 131a, but does not include a second polymer material layer 131b and a fourth metal layer 131c. The material of the third metal layer 131a can be pure copper or a copper alloy. The first cover plate 131 in Embodiment Five is relatively light and thin, and has a low cost, and can meet the needs of products.

[0186] As shown in Figure 38 in an embodiment of Embodiment Five, the first cover plate 131 can adopt an equal-thickness design, and both sides in the thickness direction of the first cover plate 131 can have a concave-convex structure to form support columns. Figure 38 As shown in in another embodiment of Embodiment Five, the first cover plate 131 can adopt an unequal-thickness design, one side (for example, the lower side) of the working area 131g of the first cover plate 131 has a concave-convex structure and forms a plurality of convex portions 131k, and the convex portions 131k serve as support columns; the other side (for example, the upper side) of the working area 131g is a flat surface.

[0187] Figure 38 A partial side sectional view of the first cover plate 131 in Embodiment Six is shown. Unlike Embodiment Five, the material of the third metal layer 131a in Embodiment Six can be a metal composite material composed of different metals. As shown in Figure 39 the third metal layer 131a can include a metal layer 131m and a metal layer 131n, the metal layer 131m and the metal layer 131n are respectively different metal materials, the metal layer 131m includes but is not limited to stainless steel, titanium, aluminum, magnesium, etc., and the metal layer 131n can be pure copper or a copper alloy. The metal layer 131n faces the second cover plate 132 and is connected to the second cover plate 132. The scheme of Embodiment Six can increase the strength of the first cover plate 131 and improve the bending resistance of the first cover plate 131.

[0188] As shown in ​ in an embodiment of Embodiment Six, the first cover plate 131 can adopt an equal-thickness design, and both sides in the thickness direction of the first cover plate 131 can have a concave-convex structure to form support columns. ​ As shown in in another embodiment of Embodiment Six, the first cover plate 131 can adopt an unequal-thickness design, one side (for example, the lower side) of the working area 131g of the first cover plate 131 has a concave-convex structure and forms a plurality of convex portions 131k, and the convex portions 131k serve as support columns; the other side (for example, the upper side) of the working area 131g is a flat surface.

[0189] In the embodiments of the present application, in order to distinguish, the base layer 132h can be referred to as a first base layer, the base layer 131j can be referred to as a second base layer, the convex part 132i can be referred to as a first convex part, the convex part 131h can be referred to as a second convex part, the convex part 131k can be referred to as a third convex part, the concave part 132j can be referred to as a first concave part, and the concave part 131i can be referred to as a second concave part.

[0190] The scheme of the embodiments of the present application can improve the heat conduction performance of the vapor chamber 13, improve the maximum heat transfer amount Qmax of the vapor chamber 13, and also reduce the weight and thickness of the vapor chamber 13. The scheme of the embodiments of the present application helps to improve the heat dissipation capability of the electronic device 1, increase the maximum frequency duration of the chip in the electronic device 1, and is conducive to realizing the thin and light of the whole machine.

[0191] For the convenience of understanding, the related technical terms involved in the embodiments of the present application are explained and described below.

[0192] In the description of the embodiments of the present application, "a plurality of" means two or more, unless otherwise specified.

[0193] The terms "first", "second", and the like are used only for descriptive purposes, and cannot be understood as implying or suggesting relative importance or implicitly indicating the number of the indicated technical features. The features limited by "first" and "second" can explicitly or implicitly include one or more of the features.

[0194] "Connection" should be understood broadly, for example, "connection" can be detachable connection, or non-detachable connection; can be direct connection, or indirect connection through intermediate medium. "Fixed" should also be understood broadly, for example, "fixed" can be direct fixation, or indirect fixation through intermediate medium.

[0195] The orientation terms mentioned in the embodiments of the present application, such as "up", "down", "front", "back", "left", "right", "inner", "outer", "side", "top", "bottom", and the like, are only the directions of the drawings. The orientation terms are used to better and more clearly illustrate and understand the embodiments of the present application, and are not intended to indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and the like, so it cannot be understood as a limitation on the embodiments of the present application.

[0196] In the description of the embodiments of the present application, unless otherwise specified, "and / or" is only a description of the association relationship of the associated objects, which means that there can be three kinds of relationships. For example, A and / or B can represent the following three cases: A exists alone, A and B exist together, and B exists alone.

[0197] The above merely provides the specific implementation of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of the changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A vapor chamber (13), characterized in that, comprising a first cover plate (131), a second cover plate (132) and a capillary layer (133), the first cover plate (131) and the second cover plate (132) are laminated, the first cover plate (131) and the second cover plate (132) are connected and surround a cavity (13c), the capillary layer (133) is located in the cavity (13c); the second cover plate (132) comprises a first metal layer (132a) and a first polymer material layer (132b), the first metal layer (132a) and the first polymer material layer (132b) are laminated, the first metal layer (132a) is connected between the first polymer material layer (132b) and the first cover plate (131), the surface roughness Rz of the surface (132d) of the first metal layer (132a) connected with the first polymer material layer (132b) is ∈ [0.5 μm, 5 μm].

2. The vapor chamber (13) according to claim 1, characterized in that, the capillary layer (133) is integrated with the first metal layer (132a).

3. The vapor chamber (13) according to claim 1 or 2, characterized in that, the capillary layer (133) comprises a capillary through hole layer (133a) and a plurality of supports (133c), the plurality of supports (133c) are connected between the capillary through hole layer (133a) and the first metal layer (132a); the capillary through hole layer (133a) is provided with a plurality of capillary through holes (133b), the plurality of capillary through holes (133b) have a first capillary through hole (133b), a channel is formed between any two adjacent supports (133c), and at least a part of the projection of the first capillary through hole (133b) in the thickness direction of the capillary through hole layer (133a) falls between the two adjacent supports (133c).

4. The vapor chamber (13) according to claim 3, characterized in that, the first polymer material layer (132b) comprises a first base layer (132h) and a plurality of first protrusions (132i), the plurality of first protrusions (132i) are protruded on the side of the first base layer (132h) facing the first cover plate (131); the first metal layer (132a) covers the first base layer (132h), and each support (133c) covers one first protrusion (132i).

5. The vapor chamber (13) according to claim 1 or 2, characterized in that, The second cover plate (132) is provided with a plurality of first recesses (132j) on the side facing away from the first cover plate (131), each of the first recesses (132j) is recessed towards the first cover plate (131), and the first metal layer (132a) is located in part of each of the first recesses (132j) as a support body (133c), and a channel is formed between any two adjacent support bodies (133c); each of the support bodies (133c) is connected with the capillary layer (133); The capillary layer (133) is provided with a plurality of capillary through holes (133b), and the plurality of capillary through holes (133b) include first capillary through holes (133b), and at least part of the projection of the first capillary through holes (133b) in the thickness direction of the capillary layer (133) falls between two adjacent support bodies (133c).

6. The vapor chamber (13) according to claim 5, wherein, Each of the first recesses (132j) is filled with a thermally conductive material (132m).

7. The vapor chamber (13) according to any one of claims 3-6, wherein, The plurality of capillary through holes (133b) include a plurality of groups arranged in a first direction in sequence, each group includes at least two capillary through holes (133b) arranged in a second direction in sequence, and the first direction intersects the second direction; For any two adjacent groups, in the second direction, at least one capillary through hole (133b) in one group is distributed between every two adjacent capillary through holes (133b) in the other group.

8. The vapor chamber (13) according to any one of claims 3-7, wherein, The opening areas of at least two capillary through holes (133b) in the plurality of capillary through holes (133b) are different from each other.

9. The vapor chamber (13) according to any one of claims 3-8, wherein, At least one support body (133c) in the plurality of support bodies (133c) is a columnar structure or a strip structure.

10. The vapor chamber (13) according to any one of claims 3-9, wherein, The plurality of support bodies (133c) include a plurality of first support bodies (133c) arranged in a first direction in sequence, each of the first support bodies (133c) is a strip structure extending in a second direction, and the first direction intersects the second direction.

11. The vapor chamber (13) according to claim 10, wherein, The plurality of first support bodies (133c) include a first group (S1) and a second group (S2), the first group (S1) and the second group (S2) are adjacent and arranged in the first direction, and the first group (S1) and the second group (S2) each include at least two first support bodies (133c) arranged in the second direction in sequence. A projection of a gap between any two adjacent first supports (133c) in the first group (S1) in the first direction falls on one of the first supports (133c) in the second group (S2).

12. The vapor chamber (13) according to any one of claims 1-11, characterized in that, The second cover plate (132) further comprises a second metal layer (132c), the first metal layer (132a), the first polymer material layer (132b) and the second metal layer (132c) are sequentially stacked, the second metal layer (132c) is connected with the first polymer material layer (132b), and a surface roughness Rz of a surface (132e) of the second metal layer (132c) connected with the first polymer material layer (132b) is in a range of [0.5 μm, 5 μm].

13. The vapor chamber (13) according to any one of claims 1-12, characterized in that, The first cover plate (131) comprises a working area (131g) participating in enclosing the cavity (13c); The working area (131g) comprises a plurality of second convex portions (131h) and a plurality of second concave portions (131i), the plurality of second convex portions (131h) and the plurality of second concave portions (131i) are alternately arranged, a periphery of each second concave portion (131i) is provided with a plurality of second convex portions (131h), each second convex portion (131h) protrudes in a direction away from the second cover plate (132), and each second concave portion (131i) is recessed towards the second cover plate (132) and connected with the capillary layer (133).

14. The vapor chamber (13) according to any one of claims 1-12, characterized in that, The first cover plate (131) comprises a working area (131g) participating in enclosing the cavity (13c); The working area (131g) comprises a second base layer (131j) and a plurality of third convex portions (131k), the plurality of third convex portions (131k) are provided on a side of the second base layer (131j) facing the second cover plate (132) and connected with the capillary layer (133).

15. The vapor chamber (13) according to any one of claims 1-13, characterized in that, The first cover plate (131) comprises a third metal layer (131a), and the third metal layer (131a) is connected with the first metal layer (132a).

16. The vapor chamber (13) according to claim 15, characterized in that, The first cover plate (131) further comprises a second polymer material layer (131b) connected with the third metal layer (131a), the second polymer material layer (131b), the third metal layer (131a) and the first metal layer (132a) are sequentially stacked, and a surface roughness Rz of a surface (131d) of the third metal layer (131a) connected with the second polymer material layer (131b) is in a range of [0.5 μm, 5 μm].

17. The vapor chamber (13) according to claim 16, characterized in that, the first cover plate (131) further comprises a fourth metal layer (131c), the fourth metal layer (131c), the second polymer material layer (131b) and the third metal layer (131a) are sequentially laminated, the fourth metal layer (131c) is connected with the second polymer material layer (131b), and a surface roughness Rz of a surface (131e) of the fourth metal layer (131c) connected with the second polymer material layer (131b) is in a range of [0.5 μm, 5 μm].

18. The vapor chamber (13) according to any one of claims 1-17, characterized in that, a material of the polymer material layer in the vapor chamber comprises polyimide, polypropylene, polytetrafluoroethylene, polyethylene terephthalate, polyethylene naphthalate, polydimethylsiloxane, polyethylene, polymethyl ethylene carbonate, polyvinyl chloride, polyvinylidene chloride, polystyrene or polyamide.

19. The vapor chamber (13) according to any one of claims 1-18, characterized in that, a glass transition temperature of the polymer material layer in the vapor chamber is greater than or equal to 320℃.

20. An electronic device (1), characterized in that, comprising a shell (12) and the vapor chamber (13) according to any one of claims 1-19, the vapor chamber (13) is located in the shell (12).

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