Heat dissipation film, display module and display device

Abstract

The invention discloses a heat dissipation film, a display module and a display device. The display module comprises a display panel and a heat dissipation film, the cover plate is located on one side of the display panel; the heat dissipation film is located on the side, away from the cover plate, of the display panel; the low-temperature injection molding material at least partially surrounds the edge of the display panel; wherein the heat dissipation film comprises a heat dissipation layer and a first auxiliary structure, the heat dissipation layer and the first auxiliary structure are sequentially arranged away from the display panel, and the first auxiliary structure at least partially covers at least part of the edge of the heat dissipation layer; the low-temperature injection molding material at least partially covers an area between the edge of the cover plate and the edge of the heat dissipation film, and at least partially covers the first auxiliary structure.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular, to a heat dissipation film, a display module and a display device. BACKGROUND

[0002] In an organic light-emitting diode (OLED) display module, in order to reduce the frame of the display module, a low-temperature injection molding process is applied to the process of the display module.

[0003] However, the adhesion of the heat dissipation film in the contact surface in contact with the low-temperature injection molding (LIPO) glue in the display module is the worst, which leads to the problem that the LIPO glue is easy to delaminate from the surface of the heat dissipation film during the whole machine disassembly process. SUMMARY

[0004] Embodiments of the present disclosure provide a heat dissipation film, a display module and a display device to solve the problem of low adhesion of the heat dissipation film in the prior art.

[0005] In a first aspect, to solve the above technical problem, the present disclosure provides a display module, comprising:

[0006] a display panel;

[0007] a cover plate located on one side of the display panel;

[0008] a heat dissipation film located on the side of the display panel away from the cover plate; and

[0009] a low-temperature injection molding glue at least partially surrounding the edge of the display panel; wherein

[0010] the heat dissipation film comprises a heat dissipation layer and a first auxiliary structure arranged in sequence away from the display panel, and the first auxiliary structure at least partially covers at least part of the edge of the heat dissipation layer;

[0011] the low-temperature injection molding glue at least partially covers the area between the edge of the cover plate and the edge of the heat dissipation film, and at least partially covers the first auxiliary structure.

[0012] In a possible implementation, the adhesion between the first auxiliary structure and the low-temperature injection molding glue is greater than the adhesion between the heat dissipation layer and the low-temperature injection molding glue.

[0013] In a possible implementation, the Gurley value of the surface of the first auxiliary structure away from the heat dissipation layer is greater than the Gurley value of the surface of the heat dissipation layer close to the first auxiliary structure.

[0014] In a possible implementation, the display panel includes a display area, a binding area, and a bending area connecting the display area and the binding area; the heat dissipation layer includes a first copper foil layer;

[0015] The heat dissipation film has an inner area and an edge area surrounding the inner area, and further includes a foam layer on a side of the heat dissipation layer close to the display panel;

[0016] The heat dissipation layer has a first edge and a second edge connected as a closed figure, and the first edge is arranged at a position corresponding to the bending area; wherein, in the edge area, a part corresponding to the first edge is a first sub-edge area, and a part corresponding to the second edge is a second sub-edge area;

[0017] The first auxiliary structure is at least partially located in the second sub-edge area.

[0018] In a possible implementation, the first auxiliary structure is located at two end portions of the second sub-edge area close to the first edge and adjacent to the first edge.

[0019] Alternatively, the first auxiliary structure is located in the second sub-edge area.

[0020] In a possible implementation, the first auxiliary structure is also located in the first sub-edge area.

[0021] In a possible implementation, the first auxiliary structure includes a first ink layer, or a black polymer layer.

[0022] In a possible implementation, at least part of the edge area of the heat dissipation layer has a concave-convex pattern, and a patterned part of the heat dissipation layer having the concave-convex pattern is multiplexed as the first auxiliary structure.

[0023] In a possible implementation, the first ink layer includes:

[0024] A first sub-ink layer is located on a side of the heat dissipation layer away from the foam;

[0025] A second sub-ink layer is located on a side of the first sub-ink layer away from the heat dissipation layer; the second sub-ink layer has a plurality of hollow patterns arranged along the edge area.

[0026] In a possible implementation, the black polymer layer includes:

[0027] A pressure-sensitive adhesive layer is located on a side of the heat dissipation layer away from the foam layer;

[0028] A substrate layer is located on a side of the pressure-sensitive adhesive layer away from the heat dissipation layer.

[0029] a black coating layer on a side of the substrate layer distal to the pressure sensitive adhesive layer; the black coating layer having a dyne value greater than the dyne value of the heat dissipation layer.

[0030] In one possible implementation, the patterned portion has at least one of a plurality of first through holes and a plurality of blind holes arranged along an edge of the heat dissipation layer.

[0031] The plurality of first through holes and portions between adjacent first through holes collectively form the concave-convex pattern.

[0032] Alternatively, the plurality of blind holes and portions between adjacent blind holes collectively form the concave-convex pattern.

[0033] In one possible implementation, the display module further includes:

[0034] A flexible circuit board is bonded to the display panel and fixed to the heat dissipation film on a side of the heat dissipation film distal to the display panel.

[0035] A cover tape is located on a side of the flexible circuit board distal to the heat dissipation film; the cover tape covers an area outside a device area of the flexible circuit board.

[0036] An edge area of the cover tape near the bending position of the display panel is provided with a second auxiliary structure, which has the same structure as the first auxiliary structure.

[0037] In one possible implementation, the cover tape further includes:

[0038] An insulating tape is located on a side of the flexible circuit board distal to the heat dissipation film.

[0039] A second copper foil layer is located on a side of the insulating tape distal to the flexible circuit board.

[0040] In one possible implementation, the cover tape further includes:

[0041] A graphite layer is located between the insulating tape and the second copper foil layer.

[0042] In one possible implementation, the display panel further includes:

[0043] A spacer layer is located on a side of the heat dissipation film distal to the display panel, and an end of the spacer layer near the bending position of the display panel is surrounded by the bending part of the display panel on three sides; the end of the spacer layer near the bending part is provided with a protruding part that extends out of the bending part.

[0044] In one possible implementation, the cover plate includes:

[0045] A body;

[0046] A second ink layer is arranged on the body near the display panel and along the edge of the body.

[0047] In one possible implementation, the second ink layer includes:

[0048] A third sub-ink layer is arranged on the cover plate near the display panel.

[0049] A fourth sub-ink layer is arranged on the third sub-ink layer away from the cover plate; the fourth sub-ink layer has a plurality of hollow patterns arranged along the edge of the cover plate.

[0050] The embodiments of the present disclosure further provide a heat dissipation film having an inner region and an edge region surrounding the inner region, wherein the heat dissipation film includes:

[0051] A foam layer;

[0052] A heat dissipation layer is arranged on one side of the foam layer; the heat dissipation layer has a first edge and a second edge, the first edge and the second edge are connected to form a closed pattern, and the length of the first edge is less than the length of the second edge; wherein, in the edge region, the part corresponding to the first edge is a first sub-edge region, and the part corresponding to the second edge is a second sub-edge region; and

[0053] A first auxiliary structure is at least partially arranged in the second sub-edge region.

[0054] In one possible implementation, the adhesion between the first auxiliary structure and the low-temperature injection molding glue is greater than the adhesion between the heat dissipation layer and the low-temperature injection molding glue.

[0055] In one possible implementation, the surface energy of the surface of the first auxiliary structure away from the heat dissipation layer is greater than the surface energy of the surface of the heat dissipation layer near the first auxiliary structure.

[0056] In one possible implementation, the first auxiliary structure includes:

[0057] A first ink layer;

[0058] Or, a black polymer layer.

[0059] In one possible implementation, the first ink layer includes:

[0060] A first sub-ink layer is arranged on the heat dissipation layer away from the foam.

[0061] a second sub-ink layer located on a side of the first sub-ink layer away from the heat dissipation layer; the second sub-ink layer has a plurality of hollow patterns arranged along the edge region.

[0062] In a possible implementation, the black polymer layer comprises:

[0063] a pressure-sensitive adhesive layer located on a side of the heat dissipation layer away from the foam layer;

[0064] a substrate layer located on a side of the pressure-sensitive adhesive layer away from the heat dissipation layer;

[0065] a black coating layer located on a side of the substrate layer away from the pressure-sensitive adhesive layer; the black coating layer has a higher dyne value than the heat dissipation layer.

[0066] In a possible implementation, at least part of the edge region of the heat dissipation layer has a concave-convex pattern, and the patterned part of the heat dissipation layer having the concave-convex pattern is used as the first auxiliary structure.

[0067] In a possible implementation, the patterned part has at least one of a plurality of first through holes and a plurality of blind holes arranged along the edge of the heat dissipation layer.

[0068] The plurality of first through holes and the part between adjacent first through holes jointly constitute the concave-convex pattern.

[0069] Alternatively, the plurality of blind holes and the part between adjacent blind holes jointly constitute the concave-convex pattern.

[0070] In a possible implementation, the first auxiliary structure is located at both ends of the second sub-edge region close to the first edge and adjacent to the first edge.

[0071] Alternatively, the first auxiliary structure is located in the second sub-edge region.

[0072] In a possible implementation, the first auxiliary structure is also located in the first sub-edge region.

[0073] In a possible implementation, the heat dissipation film has a second through hole penetrating in the thickness direction, the second through hole is located in the inner region and away from the end opposite to the first edge; the heat dissipation film further comprises:

[0074] a protective film located on a side of the first auxiliary structure away from the foam layer and covering the heat dissipation layer, the protective film has a tear tab protruding from the heat dissipation layer.

[0075] The protective film includes a first sub-protective film and a second sub-protective film; the first sub-protective film is located between one side of the internal area close to the second through hole and the second side, and the side of the first sub-protective film close to the first auxiliary structure is not bonded to the first auxiliary structure; the second sub-protective film is located on the side of the first sub-protective film away from the heat dissipation layer, and covers and adheres to the first sub-protective film, and at least covers a partial area of ​​the heat dissipation layer.

[0076] In a third aspect, an embodiment of the present disclosure provides a display device, comprising the display module as described in the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0077] Figure 1 This is a top view of the back of a display module in the related art;

[0078] Figure 2 for Figure 1 Cross-section along AA' direction;

[0079] Figure 3 for Figure 1 Cross-section along BB' direction;

[0080] Figure 4 for Figure 1 Cross-section along CC' direction;

[0081] Figure 5 A top view of a heat dissipation film provided in an embodiment of the present disclosure;

[0082] Figure 6 Provided for the embodiments of the present disclosure Figure 5 Cross-section along the DD' direction;

[0083] Figure 7 A top view of another heat dissipation film provided in an embodiment of the present disclosure;

[0084] Figure 8 A top view of another heat dissipation film provided in an embodiment of the present disclosure;

[0085] Figure 9 A top view of another heat dissipation film provided in an embodiment of the present disclosure;

[0086] Figure 10 A top view of a first ink layer provided in an embodiment of the present disclosure;

[0087] Figure 11 A schematic structural diagram of a heat dissipation film provided in an embodiment of the present disclosure;

[0088] Figure 12 A schematic structural diagram of another heat dissipation film provided in an embodiment of the present disclosure;

[0089] Figure 13 and Figure 14 A schematic structural diagram of another heat dissipation film provided in an embodiment of the present disclosure;

[0090] Figure 15 and Figure 16 A schematic diagram of the dimensions of a first through hole provided in an embodiment of the present disclosure;

[0091] Figure 17 A schematic structural diagram of a patterned portion provided in an embodiment of the present disclosure;

[0092] Figure 18 A schematic structural diagram of another patterned portion provided in an embodiment of the present disclosure;

[0093] Figure 19 and Figure 20 A schematic structural diagram of another heat dissipation film provided in an embodiment of the present disclosure;

[0094] Figure 21 A schematic structural diagram of another heat dissipation film provided in an embodiment of the present disclosure;

[0095] Figure 22 and Figure 23 A top view of another heat dissipation film provided in an embodiment of the present disclosure;

[0096] Figure 24 Provided for the embodiments of the present disclosure Figure 23 Cross-section along the EE' direction;

[0097] Figure 25 A schematic diagram of the coverage area of ​​a first sub-protective film provided in an embodiment of the present disclosure;

[0098] Figure 26 A top view of another heat dissipation film provided in an embodiment of the present disclosure;

[0099] Figure 27 Provided for the embodiments of the present disclosure Figure 26 Cross-section along the FF' direction;

[0100] Figure 28 A top view of another heat dissipation film provided in an embodiment of the present disclosure;

[0101] Figure 29 A top view of a display module provided by an embodiment of the present disclosure before low-temperature injection molding is performed;

[0102] Figure 30 Provided for the embodiments of the present disclosure Figure 29 A top view of the display module after low-temperature plastic injection molding;

[0103] Figure 31Another structural schematic diagram of a display module provided by the embodiment of the present disclosure is shown in FIG. 6;

[0104] Figure 32 Another structural schematic diagram of a display module provided by the embodiment of the present disclosure is shown in FIG. 6;

[0105] Figure 33 Another structural schematic diagram of a display module provided by the embodiment of the present disclosure is shown in FIG. 6;

[0106] Figure 34 Another structural schematic diagram of a display module provided by the embodiment of the present disclosure is shown in FIG. 6;

[0107] Figure 35 Another structural schematic diagram of a display module provided by the embodiment of the present disclosure is shown in FIG. 6; Figure 34

[0108] Figure 36 Another structural schematic diagram of a display module provided by the embodiment of the present disclosure is shown in FIG. 6;

[0109] Figure 37 Another structural schematic diagram of a display module provided by the embodiment of the present disclosure is shown in FIG. 6;

[0110] Figure 38 Another structural schematic diagram of a display module provided by the embodiment of the present disclosure is shown in FIG. 6; Figure 37

[0111] Figure 39 Another structural schematic diagram of a display module provided by the embodiment of the present disclosure is shown in FIG. 6;

[0112] Figure 40 Another structural schematic diagram of a display module provided by the embodiment of the present disclosure is shown in FIG. 6;

[0113] Figure 41 Another structural schematic diagram of a display module provided by the embodiment of the present disclosure is shown in FIG. 6; Figure 39

[0114] Figure 42 Another structural schematic diagram of a display module provided by the embodiment of the present disclosure is shown in FIG. 6;

[0115] Figure 43 Another structural schematic diagram of a display module provided by the embodiment of the present disclosure is shown in FIG. 6; Figure 42

[0116] Figure 44 Another structural schematic diagram of a display module provided by the embodiment of the present disclosure is shown in FIG. 6;

[0117] Figure 45 Another structural schematic diagram of a display module provided by the embodiment of the present disclosure is shown in FIG. 6;

[0118] Figure 46 Another structural schematic diagram of a display module provided by the embodiment of the present disclosure is shown in FIG. 6;​​​​

[0119] Figure 47 Another structural schematic diagram of a display module provided by an embodiment of the present disclosure is provided.

[0120] Figure 48 Another structural schematic diagram of a display module provided by an embodiment of the present disclosure is provided.

[0121] Figure 49 Another structural schematic diagram of a display module provided by an embodiment of the present disclosure is provided.

[0122] Reference signs:

[0123] Cover plate 1', display panel 2', heat dissipation film 3', flexible circuit board 4', body 11', ink layer 12', LIPO glue 5', support back film 6', cushion layer 7', cover tape 8', device area 4a';

[0124] Inner area 1a, edge area 1b, foam layer 11, heat dissipation layer 12, patterned part 1M, first edge 12a, second edge 12b, first sub-edge area 1b1, second sub-edge area 1b2, first auxiliary structure 13, first sub-ink layer 131, second sub-ink layer 132, pressure-sensitive adhesive layer 133, substrate layer 134, black coating layer 135, polymer layer 136, first through hole H1, blind hole M', second through hole H2, protective film 14, first sub-protective film 141, second sub-protective film 142, third sub-protective film 143, upper area 1A, lower area 1B, first sub-area 1B1, second sub-area 1B2, third sub-area 1B3, fourth sub-protective film 144, fifth sub-protective film 145, sixth sub-protective film 146;

[0125] Heat dissipation film 1, cover plate 2, body 21, second ink layer 22, display panel 3, low-temperature injection molding glue 4, third sub-ink layer 221, fourth sub-ink layer 222, flexible circuit board 5, cover tape 6, second auxiliary structure 61, insulating adhesive tape 62, second copper foil layer 63, graphite layer 64, cushion layer 7, protruding part 7a, buffer glue 8. DETAILED DESCRIPTION

[0126] An embodiment of the present disclosure provides a heat dissipation film, a display module and a display device, so as to solve the problem of low bonding performance of the heat dissipation film.

[0127] It should be understood that the specific structures and functional details disclosed in the embodiments of the present disclosure are only representative, and are for the purpose of describing the exemplary embodiments of the present disclosure. However, the present disclosure can be embodied in many alternative forms or combinations, and should not be interpreted as being limited to only the embodiments described herein.

[0128] In the description of the disclosure, it needs to be understood that the terms "center", "transverse", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the disclosure and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the disclosure. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first", "second" can be explicitly or implicitly included one or more features. In the description of the disclosure, unless otherwise specified, the meaning of "a plurality of" is two or more. In addition, the term "includes" and any variations thereof are intended to cover non-exclusive inclusion.

[0129] In the description of the disclosure, it needs to be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the disclosure can be understood according to the specific circumstances.

[0130] The term "and / or" in the embodiments of the disclosure is only to describe the association relationship of the associated objects, which means that there can be three kinds of relationships, for example, A and / or B, which can represent the three cases of A alone, A and B together, and B alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects are a "or" relationship.

[0131] In order to make the above-mentioned purposes, features and advantages of the disclosure more obvious and easy to understand, the disclosure will be further described below with reference to the drawings and examples. However, the example embodiments can be implemented in various forms, and should not be understood as being limited to the embodiments described herein; on the contrary, these embodiments are provided to make the disclosure more comprehensive and complete, and to fully convey the ideas of the example embodiments to those skilled in the art. The same reference signs in the drawings represent the same or similar structures, so repeated description thereof will be omitted. The expressions of position and direction described in the disclosure are described with reference to the drawings, but changes can also be made as needed, and the changes made are included in the protection scope of the disclosure. The drawings of the disclosure are only used to show the relative positional relationship and do not represent the true proportion.

[0132] It should be noted that specific details are set forth in the following description to facilitate a full understanding of the present disclosure. However, the present disclosure can be implemented in a variety of ways different from those described herein, and those skilled in the art can make similar generalizations without violating the connotation of the present disclosure. Therefore, the present disclosure is not limited to the specific embodiments disclosed below. The subsequent description of the specification is a preferred embodiment of the present disclosure, but the description is for the purpose of illustrating the general principles of the present disclosure and is not intended to limit the scope of the present disclosure. The scope of protection of the present disclosure shall be as defined by the appended claims.

[0133] Please refer to Figure 1 This is a top view of the back of a display module in the related art, the display module comprising:

[0134] Protective layer, such as cover plate ( Figure 1 ), a display panel 2', a functional film layer, such as a heat dissipation film 3' and a flexible circuit board 4', the cover plate 1' is located on one side of the display panel 2', such as the light emitting side, the heat dissipation module, such as the heat dissipation film 3' is located on the other side opposite to the display panel 2', such as the back side of the light emitting side of the display panel 2', and the flexible circuit board 4' is bound to the display panel 2' and is arranged on the heat dissipation film 3'.

[0135] Please refer to Figures 2-4 , Figure 2 for Figure 1 The cross-section along the AA' direction, Figure 3 for Figure 1 The cross-section along the BB' direction, Figure 4 for Figure 1 The display module also includes:

[0136] An adhesive layer, such as an optical clear adhesive (OCA), is located on the side of the cover plate 1' close to the display panel 2'. The cover plate 1' includes a body 11' and an ink layer 12'. The ink layer 12' is located on the side of the body 11' close to the optical clear adhesive and is disposed along the edge of the cover plate 1'.

[0137] Polarizer (POL), located between the optical adhesive and the display panel 2';

[0138] A supporting backing film 6' is located between the display panel 2' and the heat dissipation module. The supporting backing film 6' is used to support the display panel 2'. The display panel 2' is usually a flexible display panel, such as an OLED display panel. If the display panel 2' is a liquid crystal display panel, the supporting backing film 6' is not required.

[0139] The raising layer 7 ′ is located at a side of the heat dissipation film 3 ′ away from the display panel 2 ′ in the bending region of the display panel 2 ′.

[0140] In order to reduce the frame width of the display module, a low temperature injection molding process (LIPO) is used to set LIPO glue 5' along the edge of the display panel 2'. As shown in Figures 1-3 , the LIPO glue 5' is set along the edge of the heat dissipation film 3', and a part of the LIPO glue 5' covers the edge area of the heat dissipation film 3' and extends to the edge area of the cover plate 1', as shown in Figure 4 , the part of the heat dissipation film 3' close to the flexible circuit board 4' and covered by the bending area of the display panel 2' is not in contact with the LIPO glue 5'. In the contact surface of the display module in contact with the LIPO glue 5', the adhesion of the surface of the heat dissipation film 3' is the worst, and most of the edge area of the heat dissipation film 3' will be in contact with the LIPO glue 5', which causes the LIPO glue 5' to be easily layered with the surface of the heat dissipation film 3' during the whole machine disassembly process.

[0141] Further, as shown in Figure 4 , the side of the flexible circuit board 4' away from the display panel 2' usually sets a cover tape 8', which is used to cover the area of the device area 4a' of the flexible circuit board 4' away from the display panel 2' except the area, so as to protect the circuit on the flexible circuit board 4'. As shown in Figure 4 , a part of the edge area of the cover tape 8' also needs to be in contact with the LIPO glue 5', and the adhesion of the surface of the cover tape 8' is also not high, which causes the cover tape 8' to be easily layered with the LIPO glue 5'.

[0142] To solve the above technical problems, the present disclosure provides a heat dissipation film, a display module and a display device, which will be described in detail below with reference to the accompanying drawings.

[0143] Please refer to Figure 5 and Figure 6 , Figure 5 , a top view of a heat dissipation film provided by the present disclosure, Figure 6 , a cross-sectional view of the DD' direction in Figure 5 , as shown in Figure 5 , the heat dissipation film has an internal area 1a and an edge area 1b, the edge area 1b surrounds the internal area 1a, and the heat dissipation film comprises:

[0144] a foam layer 11;

[0145] The heat dissipation layer 12, for example, a metal layer, can be a first copper foil layer, a silver foil layer, an aluminum foil layer, etc. The heat dissipation layer 12 is located on one side of the foam layer 11. The heat dissipation layer 12 has a first edge 12a and a second edge 12b. The first edge 12a and the second edge 12b are connected to form a closed figure. The length of the first edge 12a is less than the length of the second edge 12b. In the display module, the first edge 12a of the heat dissipation layer 12 usually corresponds to the edge shared by the bending part of the display panel and the body of the display panel. In the edge area 1b, the part corresponding to the first edge 12a is the first sub-edge area 1b1, and the part corresponding to the second edge 12b is the second sub-edge area 1b2. In some embodiments, the length of the first edge 12a is less than 1 / 3 of the length of the second edge 12b, which facilitates determining that the first edge 12a corresponds to the edge shared by the bending part of the display panel and the body of the display panel.

[0146] The first auxiliary structure 13 is located at least in the second sub-edge area 1b2.

[0147] In some embodiments, the adhesion performance of the first auxiliary structure 13 is greater than the adhesion performance of the heat dissipation layer 12. Therefore, in the process of manufacturing the display module, the first auxiliary structure 13 can be bonded with LIPO glue. Compared with the LIPO glue directly bonded with the heat dissipation layer 12 (such as the first copper foil layer) in the related art, the adhesion performance of the heat dissipation film and the LIPO glue can be improved, and the problem that the LIPO glue and the heat dissipation film are easily separated during disassembly of the display module can be solved. The shape of the heat dissipation film can be rectangular, circular, or other shapes close to circular, or other shapes. The shape can be set according to product needs. For example, a phone watch is circular, and the shape of the heat dissipation film used in the phone watch can be set to circular or approximately circular.

[0148] In the display module, the LIPO glue can be arranged on the lower bezel of the display module, as shown in FIG. 1. Figure 5 As shown in FIG. 2, the first auxiliary structure 13 is located at the two ends of the second sub-edge area 1b2 close to the first edge 12a and adjacent to the first edge 12a. Figure 7 As shown in FIG. 3, another top view of the heat dissipation film provided by the embodiments of the present disclosure is shown. The first auxiliary structure 13 is not only located at the two ends of the second sub-edge area 1b2 close to the first edge 12a, but also located in the first sub-edge area 1b1.

[0149] By arranging the first auxiliary structure 13 at the two ends of the second sub-edge area 1b2 close to the first edge 12a and adjacent to the first edge 12a, the adhesion performance of the heat dissipation film and the LIPO glue can be improved when the display module is subjected to the low-temperature injection molding process, and the problem that the LIPO glue and the heat dissipation film are easily separated during disassembly of the display module can be solved. By further arranging the first auxiliary structure 13 in the first sub-edge area 1b1, the consistency of the manufacturing process of the first auxiliary structure 13 can be improved, and the manufacturing process is facilitated.

[0150] In the display module, the LIPO glue can also surround the edge of the display module to form a closed pattern. Please refer to Figure 8 Another top view of the heat dissipation film provided by the embodiment of the present disclosure is shown in FIG. 13. The first auxiliary structure 13 is located in the second sub-edge area 1b2. In this way, when low-temperature injection molding is required at the edge of the display module, the adhesion between the heat dissipation film and the LIPO glue is improved, and the problem of delamination between the LIPO glue and the heat dissipation film during disassembly of the display module is solved.

[0151] Please refer to Figure 9 Another top view of the heat dissipation film provided by the embodiment of the present disclosure is shown in FIG. 13. The first auxiliary structure 13 is located in the second sub-edge area 1b2. In this way, when low-temperature injection molding is required at the edge of the display module, the adhesion between the heat dissipation film and the LIPO glue is improved, and the problem of delamination between the LIPO glue and the heat dissipation film during disassembly of the display module is solved.

[0152] In the embodiment provided by the present disclosure, the heat dissipation film is set as a foam layer 11 and a heat dissipation layer 12 arranged in a stack, and the first auxiliary structure 13 is at least partially located in the second sub-edge area 1b2. The adhesion of the surface of the edge area 1b of the heat dissipation film that is at least in contact with the LIPO glue can be improved by using the first auxiliary structure 13. Therefore, after the heat dissipation film with the above structure is arranged in the display module, the heat dissipation film and the LIPO glue can be firmly connected together, thereby solving the problem of delamination between the LIPO glue and the heat dissipation film during disassembly.

[0153] In some embodiments, the adhesion between the first auxiliary structure 13 and the low-temperature injection molding glue is greater than the adhesion between the heat dissipation layer 12 and the low-temperature injection molding glue.

[0154] For example, the heat dissipation layer 12 is a first copper foil layer, the first auxiliary structure 13 can be made of a material with a higher da Vinci value than the da Vinci value of the first copper foil layer, so that the adhesion between the first auxiliary structure 13 and the low-temperature injection molding glue is greater than the adhesion between the first copper foil layer and the low-temperature injection molding glue. In addition, at least part of the edge area of the heat dissipation film is patterned, and the patterned part is reused as the first auxiliary structure 13, so that the adhesion between the first auxiliary structure 13 and the low-temperature injection molding glue is greater than the adhesion between the first copper foil layer and the low-temperature injection molding glue.

[0155] Please continue to refer to Figure 6 The first auxiliary structure 13 is located on the side of the heat dissipation layer 12 away from the foam layer 11.

[0156] The surface of the first auxiliary structure 13 away from the heat dissipation layer 12 has a greater Dahin value than the surface of the heat dissipation layer 12 close to the first auxiliary structure 13.

[0157] For example, the heat dissipation layer 12 is a first copper foil layer, and the surface of the first auxiliary structure 13 away from the heat dissipation layer 12 has a greater Dahin value than the surface of the first copper foil layer close to the first auxiliary structure 13; or the heat dissipation layer 12 is a silver foil layer, and the surface of the first auxiliary structure 13 away from the heat dissipation layer 12 has a greater Dahin value than the surface of the silver foil layer close to the first auxiliary structure 13.

[0158] By arranging the first auxiliary structure 13 away from the heat dissipation layer 12 and making the surface of the first auxiliary structure 13 away from the heat dissipation layer 12 have a greater Dahin value than the surface of the heat dissipation layer 12 close to the first auxiliary structure 13, the adhesion of the first auxiliary structure 13 away from the heat dissipation layer 12 can be improved.

[0159] In some embodiments, the first auxiliary structure 13 includes a coating layer or a black polymer layer. The coating layer has a greater Dahin value than the heat dissipation layer 12, and the black polymer layer away from the heat dissipation layer 12 has a greater Dahin value than the heat dissipation layer 12.

[0160] In some embodiments, the coating layer includes a first ink layer, and the first ink layer has a thickness ranging from 2 μm to 10 μm and a width ranging from 3 mm to 5 mm.

[0161] Generally, the Dahin value of ink is greater than 36A, and the Dahin value of copper foil is 28A. Therefore, the Dahin value of ink is much greater than that of copper foil. Thus, by arranging the first auxiliary structure 13 as a first ink layer, the adhesion of the first auxiliary structure 13 can be improved. In some embodiments, the first ink layer can be composed of ink with a Dahin value greater than 40A. Generally, a protective film is arranged on the copper foil surface of the heat dissipation film, and the transfer of organic polymer components (such as silicone oil) in the protective film to the copper foil surface can cause the adhesion of the copper foil and glue to decrease. In addition, during the process of delivering the display module to the whole machine end, the adhesion of LIPO glue to the copper foil surface in the heat dissipation film decreases more as the storage time increases. Therefore, by arranging the first ink layer to be composed of ink with a Dahin value greater than 40A, the adhesion of the heat dissipation film and LIPO glue can be improved by the first ink layer, and the adhesion of the first ink layer and LIPO glue can be reduced due to the oxidation of the copper foil in the heat dissipation film or the pollution of the organic polymer material in the protective film, thereby improving the adhesion of the heat dissipation film and LIPO glue in the display module.

[0162] In some embodiments, the coating layer can also cover the side of the heat dissipation layer 12 away from the foam layer 11, so that when the display module is attached to the whole machine and the position of the heat dissipation film is attached to the whole machine, the coating layer can improve the reliability of the attachment of the heat dissipation film to the whole machine because the coating layer covers the side of the heat dissipation film 12 away from the foam layer 11.

[0163] In other embodiments, the color of the coating layer can be different from the color of the heat dissipation layer 12, which facilitates the differentiation between the coating layer and the heat dissipation layer 12 and facilitates detection.

[0164] In other embodiments, the coating layer can also be made of an antistatic material, and the Darcy value of the antistatic material is greater than the Darcy value of the heat dissipation layer 12, so that when the copper rod rubbing test is performed on the surface of the cover plate of the display module, the static electricity accumulated on the surface of the cover plate can be transferred through the coating layer, avoiding the problem of green color caused by high static electricity accumulation on the copper rod.

[0165] In some embodiments, the resistance of the antistatic material ranges from 10 6 to 10 11 , so that the static electricity accumulated on the surface of the cover plate in the display module can be quickly transferred through the coating layer, avoiding display problems caused by local charge concentration.

[0166] Since the Darcy value of the side of the black polymer layer away from the surface of the heat dissipation layer 12 is set to be greater than the Darcy value of the side of the heat dissipation layer 12 close to the black polymer layer, the adhesion performance of the first auxiliary structure 13 can also be improved.

[0167] Please refer to Figure 10 A top view of a first ink layer is provided for the embodiments of the present disclosure, and the first ink layer has a plurality of hollow patterns arranged along the edges of the first ink layer. The shapes of the hollow patterns include but are not limited to long strip shape, wave shape, oval shape, etc.

[0168] By arranging a plurality of hollow patterns along the edges of the first ink layer, the roughness of the first ink layer can be increased, so that after the LIPO glue is coated on the surface of the first ink layer, a part of the LIPO glue can be embedded in the hollow patterns, further improving the adhesion performance of the contact surface between the LIPO glue and the heat dissipation film.

[0169] Please refer to Figure 11 A structure diagram of a heat dissipation film is provided for the embodiments of the present disclosure, and the first auxiliary structure 13 in the heat dissipation film is a first ink layer. The first ink layer comprises:

[0170] A first sub-ink layer 131 is located on the side of the heat dissipation layer 12 away from the display panel, i.e. the side away from the foam layer 11;

[0171] The second sub-ink layer 132 is located on the side of the first sub-ink layer 131 away from the display panel or cover plate; the second sub-ink layer 132 has a plurality of hollow patterns arranged along the edge of the display panel.

[0172] By setting the first ink layer to include the first sub-ink layer 131 and the second sub-ink layer 132, and arranging a plurality of hollow patterns along the edge of the second sub-ink layer 132, the first ink layer forms a groove, which can improve the shear force between the LIPO glue and the first ink layer. During the low-temperature injection molding process, the LIPO glue enters the groove to form a mosaic structure, and after photocuring, a stable structure is formed. Through reasoning tests, the thrust of the present scheme can be increased by about 75% compared to the conventional design of the first ink layer without a groove, which can effectively improve the bonding performance between the LIPO glue and the contact interface, and avoid delamination of the LIPO glue and the contact interface during disassembly.

[0173] Please refer to Figure 12 Another structure diagram of a heat dissipation film provided by the embodiments of the present disclosure is provided, the first auxiliary structure 13 in the heat dissipation film is a black high polymer layer, and the black high polymer layer includes:

[0174] The pressure-sensitive adhesive layer 133 is located on the side of the heat dissipation layer 12 away from the foam layer 11;

[0175] The substrate layer 134 is located on the side of the pressure-sensitive adhesive layer 133 away from the heat dissipation layer 12; the material used by the substrate layer 134 includes polyethylene terephthalate (abbreviated as PET);

[0176] The black coating layer 135 is located on the side of the substrate layer 134 away from the pressure-sensitive adhesive layer 133; the da Vinci value of the black coating layer 135 is greater than the da Vinci value of the heat dissipation layer 12.

[0177] In some embodiments, the thickness of the black coating layer 135 ranges from 3 μm to 6 μm.

[0178] The black coating layer 135 can be an ink layer, which is cured after printing ink by ultraviolet light irradiation, or a coating layer composed of other black materials with a da Vinci value greater than that of the heat dissipation layer 12.

[0179] In some embodiments, a plurality of hollow patterns can also be arranged in the black coating layer 135 to increase the roughness of the surface of the black high polymer layer, thereby further improving the bonding performance of the heat dissipation film in the edge area 1b.

[0180] By setting the black high polymer layer to include the pressure-sensitive adhesive layer 133, the substrate layer 134 and the black coating layer 135 arranged in layers, and making the da Vinci value of the black coating layer 135 greater than the da Vinci value of the heat dissipation layer 12, the bonding performance of the heat dissipation film in the edge area 1b is improved. Please refer to Figure 13 andFigure 14 Another structure diagram of the heat dissipation film provided by the embodiments of the present disclosure is shown in FIG. 2B.

[0181] At least part of the edge area 1b of the heat dissipation film has the concave-convex pattern, and the patterned part 1M of the heat dissipation film having the concave-convex pattern is used as the first auxiliary structure 13.

[0182] As shown in FIG. 2B, the concave-convex pattern can be arranged in the part of the heat dissipation film located in the second sub-edge area 1b2, or as shown in FIG. 2C, the concave-convex pattern can be arranged in the whole edge area 1b of the heat dissipation film. Figure 13 Figure 14

[0183] In the embodiments provided by the present disclosure, by arranging the concave-convex pattern in at least part of the edge area 1b of the heat dissipation film and using the patterned part 1M of the heat dissipation film having the concave-convex pattern as the first auxiliary structure 13, the roughness of the patterned part 1M can be improved. After the LIPO glue is coated on the patterned part 1M, the LIPO glue will be embedded in the concave-convex pattern, thereby improving the adhesion of the patterned part 1M and the LIPO glue and preventing the delamination of the heat dissipation film and the LIPO glue during disassembly. In addition, since the concave-convex pattern is arranged in at least part of the edge area 1b of the heat dissipation film, no additional film layer is needed, so the thickness of the heat dissipation film can not be increased.

[0184] Please refer to Figure 13 and Figure 14 for more details. The patterned part 1M has at least one of a plurality of first through holes H1 and a plurality of blind holes M' arranged along the edge of the heat dissipation film; that is, a plurality of first through holes H1 or a plurality of blind holes M' can be arranged in part or all of the edge area 1b of the heat dissipation film, or a plurality of first through holes H1 and a plurality of blind holes M' can be arranged in part or all of the edge area 1b of the heat dissipation film; the shapes and sizes of the plurality of first through holes H1 and the plurality of blind holes M' can be the same or different, and no specific limitation is made.

[0185] The plurality of first through holes H1 and the part between adjacent first through holes H1 jointly constitute the concave-convex pattern.

[0186] Alternatively, the plurality of blind holes M' and the part between adjacent blind holes M' jointly constitute the concave-convex pattern.

[0187] During the low-temperature injection molding process of the display module, the LIPO glue enters the blind holes M' or the first through holes H1 in the patterned part 1M to form an inlaid structure, and after light curing, a stable structure is formed. Through reasoning tests, compared with the conventional structure without holes in the heat dissipation layer, the thrust of the scheme provided by the present disclosure can be improved by about 80%, which can effectively improve the adhesion between the LIPO glue and the contact interface and avoid the delamination of the LIPO glue and the contact interface during disassembly. ​​

[0188] Please refer to Figure 15 and Figure 16 A schematic diagram of the dimensions of a first through hole provided in an embodiment of the present disclosure is provided, wherein the orthographic projection length of the short side of the first through hole H1 in the second direction Y is a, and the value range of a is 2 mm to 4 mm; the orthographic projection length of the long side of the first through hole H1 in the first direction X is b, and the value range of b is 2 mm to 6 mm; the spacing between two adjacent first through holes H1 is c, and the value range of c is 4 mm to 8 mm; the inclination angle of the first through hole H1 is θ, and the value range of θ is 15° to 75°.

[0189] The size of the blind hole M' may refer to the size of the first through hole H1 described above, and will not be described in detail here.

[0190] The shape of the first through hole H1 or the blind hole M' includes but is not limited to a strip shape, a wave shape, a crescent shape, and the like.

[0191] Please refer to Figure 17 This is a schematic structural diagram of a patterned portion provided in an embodiment of the present disclosure. The patterned portion 1M is composed of a foam layer 11 and a heat dissipation layer 12. For example, Figure 17 The patterned portion 1M includes a first through hole H1 and a blind hole M'. The first through hole H1 penetrates the foam layer 11 and the heat dissipation layer 12, and the blind hole M' penetrates the heat dissipation layer 12. This can increase the contact area between the LIPO glue and the heat dissipation film and prevent the LIPO glue from falling off.

[0192] Please refer to Figure 18 A structural schematic diagram of another patterned portion provided in an embodiment of the present disclosure, wherein the patterned portion 1M includes a first through hole H1 and a blind hole M'. The first through hole H1 penetrates the heat dissipation layer 12, and the blind hole M' is arranged on the side of the heat dissipation layer 12 away from the foam layer 11. This can increase the roughness of the heat dissipation layer 12 and improve the contact area and adhesion between the heat dissipation layer 12 and the LIPO glue.

[0193] Please refer to Figure 19 and Figure 20 A schematic structural diagram of another heat dissipation film provided in an embodiment of the present disclosure, wherein the first auxiliary structure 13 includes:

[0194] The stacked multilayer polymer layer 136 is indented layer by layer on at least one side of the edge, in the direction from the foam layer 11 toward the heat dissipation layer 12. This indented side of the multilayer polymer layer 136 forms a stepped structure (as shown by the bold black lines in the figure). The indented edges of the multilayer polymer layer 136 are parallel to the edges of the heat dissipation layer 12. The polymer layer 136 can be made of PET or other polymer materials, without limitation.

[0195] For example,Figure 19 The multi-layer polymer layer 136 is shown as being away from the edge of the heat dissipation layer 12 and is gradually indented in the direction from the foam layer 11 to the heat dissipation layer 12; Figure 20 As shown, the side of the multi-layer polymer layer 136 away from the edge of the heat dissipation layer 12 and the side of the multi-layer polymer layer 136 close to the edge of the heat dissipation layer 12 may be indented layer by layer in the direction from the foam layer 11 to the heat dissipation layer 12 .

[0196] Please refer to Figure 21 A schematic structural diagram of another heat dissipation film provided in an embodiment of the present disclosure, wherein the first auxiliary structure 13 includes:

[0197] The multi-layer polymer layer 136 is stacked and has a groove 136M. The groove 136M is located on a side of the multi-layer polymer layer away from the heat dissipation layer 12 .

[0198] By setting the first auxiliary structure 13 as a stacked multi-layer polymer layer 136, setting a groove 136M on the side of the multi-layer polymer layer 136 away from the heat dissipation film material 12, or, in the direction from the foam layer 11 to the heat dissipation layer 12, the multi-layer polymer layer 136 is indented layer by layer on the edge of at least one side, the push-pull force of the LIPO glue can be increased in the direction from the inner area 1a to the edge area 1b, thereby preventing the LIPO glue from falling off.

[0199] Please refer to Figures 22-24 , Figure 22 and Figure 23 A top view of another heat dissipation film provided in an embodiment of the present disclosure, Figure 24 Provided for the embodiments of the present disclosure Figure 23 The cross-section in the EE' direction is as follows: Figure 22 and Figure 23 As shown, the heat dissipation film has a second through hole H2 running through the thickness direction, and the second through hole H2 is located in the inner area 1a and away from one end of the first side 12a; the second through hole H2 can be a through hole corresponding to a camera, a fill light, etc. set in the display module, and the shape of the second through hole H2 can be circular, rectangular or other shapes, without specific limitation; in some embodiments, the second through hole H2 is not limited to one, and can be at least one arbitrary shape, or a combination of multiple shapes.

[0200] like Figures 22-24 As shown, the heat dissipation film also includes:

[0201] The protective film 14 is located on a side of the first auxiliary structure 13 away from the foam layer 11 and covers the heat dissipation layer 12. The protective film 14 has a tear handle protruding from the heat dissipation layer 12 (as shown in the black filled area in the figure);

[0202] The protective film 14 includes a first sub-protective film 141 and a second sub-protective film 142;Figure 22 and Figure 24 The first sub-protection film 141 is located between the side of the inner region 1a close to the second through hole H2 and the second side 12b, and the side of the first sub-protection film 141 close to the first auxiliary structure 13 is not bonded to the first auxiliary structure 13, that is, the side is a glue-free surface. Figure 23 and Figure 24 The second sub-protection film 142 is located on the side of the first sub-protection film 141 away from the heat dissipation layer 12, and covers and bonds the first sub-protection film 141, and covers at least part of the heat dissipation layer 12.

[0203] In the process of manufacturing the display module, the camera or the light supplement lamp needs to be placed in the second through hole H2, so that the second through hole H2 is easy to be contaminated. Therefore, after the heat dissipation film is attached, and before the protective film 14 is removed, the protective film 14 covering the part of the protective film 14 near the second through hole H2 needs to be removed multiple times to remove the dirt in the second through hole H2. However, repeatedly removing and attaching the protective film 14 will cause the silicone oil on the bonding surface of the protective film 14 to transfer to the first auxiliary structure 13, thereby greatly reducing the Darcy value of the surface of the first auxiliary structure 13 and reducing the bonding ability of the first auxiliary structure 13.

[0204] It should be noted that, for the convenience of observation, Figure 22 The attachment region of the first sub-protection film 141 is shown separately, Figure 24 The first auxiliary structure 13 in the above embodiment adopts a structure form Figure 14 The structure form in the above embodiment, Figure 24 The first auxiliary structure 13 in the above embodiment can also adopt the structure form in the above-mentioned other schemes, which will not be described here.

[0205] The present disclosure sets a first sub-protective film 141 between one side of the inner region 1a of the heat dissipation film close to the second through hole H2 and the second side 12b, so that the first sub-protective film 141 covers the first auxiliary structure 13 between one side of the inner region 1a close to the second through hole H2 and the second side 12b, and makes the first sub-protective film 141 and the first auxiliary structure 13 not adhere to each other, so that the side of the first sub-protective film 141 close to the first auxiliary structure 13 will not contain silicone oil, thereby facilitating the removal of dirt inside the second through hole H2 during the assembly process of the display module, and preventing the silicone oil from being transferred to the side of the first auxiliary structure 13 close to the first sub-protective film 141 due to repeated peeling-sticking of the first sub-protective film 141, and preventing environmental dirt from contaminating the area covered by the first sub-protective film 141, so that the heat dissipation film and the LIPO glue are not adhered to each other. The dyne value of the contact surface is maintained at a high level. Compared with the solution without the first sub-protective film 141, the dyne value can be increased by 2 to 3 levels, so that the heat dissipation film can meet the bonding performance requirements of the LIPO glue and the bonding surface; at the same time, since the second sub-protective film 142 covering the heat dissipation layer 12 is provided on the side of the first sub-protective film 141 away from the heat dissipation layer 12, and the second sub-protective film 142 is bonded to the first sub-protective film 141, when the first sub-protective film 141 is repeatedly peeled off, the first sub-protective film 141 will not be displaced relative to the second sub-protective film 142, and the first sub-protective film 141 will not be lost. When the user peels off the first sub-protective film 141 with the tearing handle and releases the tearing handle, the second sub-protective film 142 will drive the first sub-protective film 141 to adhere to the surface of the first auxiliary structure 13.

[0206] Please refer to Figure 25 This is a schematic diagram of the coverage area of ​​a first sub-protective film provided in an embodiment of the present disclosure. The first sub-protective film 141 covers at least a portion of the second sub-edge region 1b2.

[0207] like Figure 25 As shown, in the second sub-edge region 1b2, the first sub-protection film 141 may further extend toward the first side 12a, which may further prevent the adhesive performance of the first auxiliary structure 13 from being degraded.

[0208] Please refer to Figure 26 and Figure 27 , Figure 26 A top view of another heat dissipation film provided in an embodiment of the present disclosure, Figure 27 Provided for the embodiments of the present disclosure Figure 26 In the cross-sectional view taken along the FF' direction, the heat dissipation film is divided into an upper region 1A and a lower region 1B having a first common edge. The first edge 12a is located on the side of the lower region 1B away from the upper region 1A. The protective film 14 further includes:

[0209] The third sub-protective film 143 covers and adheres at least the portion of the heat dissipation film 12 located in the area where the inner region 1a overlaps with the upper region 1A. For example, the third sub-protective film 143 may cover the area where the inner region 1a overlaps with the upper region 1A, or the third sub-protective film 143 may cover the entire inner region 1a.

[0210] like Figure 27 As shown, the second sub-protection film 142 covers the first sub-protection film 141, the third sub-protection film 143, and a portion of the edge region 1b adjacent to the edge of the third sub-protection film 143 ( Figure 27 Not shown); the third sub-protective film 143 is attached to the second sub-protective film 142; the tearing hand of the second sub-protective film 142 overlaps with the tearing hand of the first sub-protective film 141, and does not overlap with the tearing hand of the third sub-protective film 143 (reference Figure 26 The tearing handle of the first sub-protection film 141 and the tearing handle of the third sub-protection film 143).

[0211] The second sub-protection film 142 may be Figure 23 The heat dissipation layer 12 is completely covered as shown. During the production process of the display module, it is usually necessary to install a flexible circuit board, a fingerprint module, etc. on the surface of the heat dissipation film in the display module. If the second sub-protective film 142 covering the heat dissipation film 12 is removed before installing the flexible circuit board, the fingerprint module, etc., the dyne value of the heat dissipation film in the edge area 1b will be reduced during the installation of the above-mentioned components, thereby reducing the bonding performance of the heat dissipation film.

[0212] The second sub-protective film 142 can also cover the upper area 1A of the heat dissipation film. When a flexible circuit board, a fingerprint module, etc. are installed in the lower area 1B of the heat dissipation film in the display module, it is not necessary to remove the first sub-protective film 141, the second sub-protective film 142 and the third sub-protective film 143, thereby preventing the dyne value of the portion of the heat dissipation film located in the upper area 1A from decreasing.

[0213] Please continue to refer to Figure 27 A gap is set between the first sub-protection film 141 and the third sub-protection film 143 , which can prevent the silicone oil in the third sub-protection film 143 from escaping to the side of the first sub-protection film 141 close to the first auxiliary structure 13 .

[0214] It should be noted that, since the second sub-protection film 142 covers the first sub-protection film 141 and the third sub-protection film 143, in order to observe the first sub-protection film 141 and the third sub-protection film 143, Figure 26 The second sub-protecting film 142 is not shown.

[0215] Please refer to Figure 28Another top view of the heat dissipation film provided by the embodiment of the present disclosure is shown in FIG. 1B. The lower region 1B includes a first sub-region 1B1, a second sub-region 1B2, and a third sub-region 1B3. The second sub-region 1B2 and the third sub-region 1B3 have a second common side. The extension direction of the second common side is perpendicular to the extension direction of the first side 12a. The first sub-region 1B1 and the second sub-region 1B2 have a third common side, and the first sub-region 1B1 and the third sub-region 1B3 have a fourth common side. The third common side and the fourth common side are connected, and the connection point is one end of the second common side close to the second sub-region 1B2. The third protective film 143 covers the upper region 1A.

[0216] The protective film 14 further includes:

[0217] A fourth sub-protective film 144 is attached to the first sub-region 1B1.

[0218] A fifth sub-protective film 145 is attached to the second sub-region 1B2.

[0219] A sixth sub-protective film 146 is attached to the third sub-region 1B3.

[0220] The first sub-region 1B1 can be determined according to the orthographic projection area of the flexible circuit in the display module on the heat dissipation film. The second sub-region 1B2 can be determined according to the orthographic projection area of the fingerprint module (such as an ultrasonic fingerprint module) in the display module on the heat dissipation film. The third sub-region 1B3 can be determined according to the orthographic projection area of the chip support in the display module on the heat dissipation film.

[0221] During the manufacturing process of the display module, the first sub-protective film 141 corresponding to the flexible circuit board in the heat dissipation film can be removed before the flexible circuit board is installed. The second sub-protective film 142 corresponding to the fingerprint module in the heat dissipation film can be removed when the fingerprint module is installed. The third sub-protective film 143 corresponding to the fingerprint module in the heat dissipation film can be removed when the chip support is installed. In this way, the sub-protective films of the entire lower region 1B will not be removed due to the installation of one component, thereby effectively preventing the adhesion performance of the heat dissipation film from being reduced.

[0222] Please refer to Figure 28 The tear tab of the fourth sub-protective film 144 and the tear tab of one of the fifth sub-protective film 145 and the sixth sub-protective film 146 are located on the same side of the heat dissipation layer 12. In this way, when different sub-protective films 14 are removed, the other sub-protective films 14 can be prevented from being mistakenly removed.

[0223] Based on the same inventive concept, the embodiment of the present disclosure provides a display module. Please refer to Figure 29 and Figure 30 , Figure 29 A top view of the display module provided by the embodiment of the present disclosure before the low-temperature injection molding of the adhesive is shown in FIG. 1B. Figure 30 A top view of the display module provided by the embodiment of the present disclosure is shown in FIG. 1B.Figure 29 A top view of the display module after low-temperature plastic injection molding is performed, wherein the display module comprises:

[0224] Display panel 3;

[0225] The cover plate 2 is located on one side of the display panel 3; illustratively, the cover plate 2 is located on the display side of the display surface 3;

[0226] a heat dissipation film 1 , located on a side of the display panel 3 away from the cover plate 2 ; and

[0227] like Figure 30 As shown, the low temperature injection molding glue 4 (ie LIPO glue) at least partially surrounds the edge of the display panel 3, wherein,

[0228] The heat dissipation film 1 includes a heat dissipation layer 12 and a first auxiliary structure 13 which are sequentially arranged away from the display panel 3 , wherein the first auxiliary structure 13 at least partially covers at least a portion of the edge of the heat dissipation layer 13 ;

[0229] The low-temperature injection molding adhesive 4 at least partially covers the area between the edge of the cover plate 2 and the edge of the heat dissipation film 1 , and at least partially covers the first auxiliary structure 13 .

[0230] In some embodiments, the bonding force between the first auxiliary structure 13 and the low-temperature injection molding adhesive 4 is greater than the bonding force between the heat dissipation layer 12 and the low-temperature injection molding adhesive 4; exemplarily, the heat dissipation layer 12 is a first copper foil layer, the edge area of ​​the first copper foil layer is patterned, and the patterned edge area is reused as the first auxiliary structure 13, and the bonding force between the portion of the first copper foil layer located in the patterned edge area and the low-temperature injection molding adhesive 4 is greater than the bonding force between the portion of the first copper foil layer located in the unpatterned area (such as the internal area) and the low-temperature injection molding adhesive 4.

[0231] In other embodiments, at least a portion of the edge region 1b of the heat dissipation film 1 has a concave-convex pattern, and the patterned portion 1M (eg, Figure 17 As shown) multiplexed as the first auxiliary structure 13, as Figure 31 The figure shows a schematic structural diagram of another display module provided by an embodiment of the present disclosure. For relevant implementation schemes in which the patterned portion 1M adopts other structures, reference can be made to the description of the heat dissipation film side, which will not be repeated here.

[0232] In other embodiments, the dyne value of the surface of the first auxiliary structure 13 away from the heat dissipation layer 12 is greater than the dyne value of the surface of the heat dissipation layer 12 near the first auxiliary structure 13. For example, the heat dissipation layer 12 is a first copper foil layer. Since the dyne value of ink is greater than that of copper foil, the dyne value of the first auxiliary structure 12 made of ink is greater than that of the first copper foil layer. Since the surface of the first auxiliary structure 13 away from the heat dissipation layer 12 is the contact surface between the heat dissipation film 1 and the low-temperature injection molding adhesive 4, it can also be said that the dyne value of the surface of the first auxiliary structure 13 away from the heat dissipation layer 12 is greater than the dyne value of the surface of the heat dissipation layer 12 near the first auxiliary structure 13.

[0233] By setting the dyne value of the surface of the first auxiliary structure 13 away from the heat dissipation layer 12 to be greater than the dyne value of the surface of the heat dissipation layer 12 close to the first auxiliary structure 13, the bonding force between the first auxiliary structure 13 and the low-temperature injection molding adhesive 4 can be made greater than the bonding force between the heat dissipation layer 12 and the low-temperature injection molding adhesive 4, thereby preventing the heat dissipation layer 12 and the low-temperature injection molding adhesive 4 from being delaminated when the device is disassembled.

[0234] In some embodiments, the first auxiliary structure 13 includes a first ink layer or a black polymer layer. The specific structures of the first ink layer and the black polymer layer can refer to the above description of the heat dissipation film side, which will not be repeated here.

[0235] In other embodiments, the first auxiliary structure 13 may be composed of multiple polymer layers 136 stacked together. Figure 19 The structure shown in FIG. 1 corresponds to a display module as shown in FIG. Figure 32 As shown, Figure 32 This is a schematic structural diagram of another display module provided by an embodiment of the present disclosure. The multi-layer polymer layer 136 may also adopt other structures. Please refer to the description of the heat dissipation film side above, which will not be repeated here.

[0236] Low temperature injection molding glue 4 can be like Figure 29 As shown, it is arranged at the lower frame of the display module, and can also be arranged along the edge of the display module to form a closed figure.

[0237] Please refer to Figure 33 A schematic structural diagram of a display module provided in an embodiment of the present disclosure, wherein the display panel includes a display area AA, a binding area CC, and a bending area BB connecting the display area AA and the binding area CC; the heat dissipation layer 12 includes a first copper foil layer;

[0238] like Figure 5 As shown, the heat dissipation film 1 has an inner region 1a and an edge region 1b, and the edge region 1b surrounds the inner region 1a. Figure 6 The heat dissipation film 1 shown further includes a foam layer 11 located on a side of the heat dissipation layer 12 close to the display panel 3;

[0239] As shown in Figure 5 , the heat dissipation layer 12 has a first edge 12a and a second edge 12b, the first edge 12a and the second edge 12b are connected to form a closed figure, in combination Figure 5 and Figure 33 , the first edge 12a is arranged at the bending area BB; wherein, as shown in Figure 5 , in the edge area 1b, the part corresponding to the first edge 12a is the first sub-edge area 1b1, and the part corresponding to the second edge 12b is the second sub-edge area 1b2; the part of the display panel 3 located in the bending area CC is the bending part of the display panel 3, and the part of the display panel 3 located in the plane of the display area AA is the body of the display panel 3;

[0240] The first auxiliary structure 13 is at least partially located in the second sub-edge area 1b2.

[0241] When the display module is implemented with low-temperature injection molding at the lower frame, the part of the first auxiliary structure 13 located in the second sub-edge area 1b2 can be as shown in Figure 29 , located at the end of the second sub-edge area 1b2 close to the first edge 12a; the first auxiliary structure 13 can also be as shown in Figure 7 , further located in the first sub-edge area 1b1. Correspondingly, the low-temperature injection molding glue 4 surrounds the edges of the display panel 3, the first edge 12a and at least part of the first auxiliary structure 13 as shown in Figure 30 .

[0242] By arranging the first auxiliary structure 13 at both ends of the second sub-edge area 1b2 close to the first edge 12a and adjacent to the first edge 12a, the adhesion performance of the heat dissipation film and the LIPO glue can be improved when the display module is implemented with low-temperature injection molding process at the lower frame, and the problem of delamination between the LIPO glue and the heat dissipation film when the display module is disassembled can be improved. By further arranging the first auxiliary structure 13 in the first sub-edge area 1b1, the consistency of the manufacturing process of the first auxiliary structure 13 can be improved, which is convenient for manufacturing. Correspondingly, the low-temperature injection molding glue 4 surrounds the entire edge of the display panel 3.

[0243] When the edges of the display module are all implemented with low-temperature injection molding, the first auxiliary structure 13 can be located in the second sub-edge area 1b2 as shown in Figure 8 , so that when the edges of the display module need to be implemented with low-temperature injection molding, the adhesion performance of the heat dissipation film 1 and the low-temperature injection molding glue 4 can be improved, and the problem of delamination between the low-temperature injection molding glue 4 and the heat dissipation film 1 when the display module is disassembled can be improved as shown in Figure 9The first auxiliary structure 13 shown can also be located in the second sub-edge area 1b2 and the first sub-edge area 1b1 (i.e. also in the edge area 1b), so that not only can the heat dissipation film 1 be firmly connected with the low-temperature injection molding glue 4, thereby improving the problem of delamination between the low-temperature injection molding glue 4 and the heat dissipation film 1 when disassembling, but also can improve the process consistency of manufacturing the first auxiliary structure 13, so that the heat dissipation film 1 can adapt to the width of various bending areas BB.

[0244] Please continue to refer to Figure 33 , the cover plate 2 comprises:

[0245] the body 21;

[0246] the second ink layer 22 is located on the side of the body 21 close to the display panel 3 and is arranged along the edge of the body 21.

[0247] Because the second ink layer 22 is arranged on the side of the body 21 of the cover plate 2 close to the display panel 3, and the Darcy value of the ink is usually very large, so that the low-temperature injection molding glue 4 can be firmly bonded with the cover plate 2; and because the first auxiliary structure 13 for improving the bonding performance of the heat dissipation film 1 is arranged on the bonding surface of the heat dissipation film 1 and the low-temperature injection molding glue 4, so that the low-temperature injection molding glue 4 can be firmly bonded with the bonding surface of the heat dissipation film 1 during the implementation of low-temperature injection molding, thereby improving the problem of delamination.

[0248] Please refer to Figure 34 and Figure 35 , Figure 34 a back view of the cover plate provided by the embodiment of the present disclosure, Figure 35 a sectional view of the direction GG' in Figure 34 , the second ink layer 22 comprises:

[0249] the third sub-ink layer 221 is located on the side of the cover plate 2 close to the display panel 3;

[0250] the fourth sub-ink layer 222 is located on the side of the third sub-ink layer 221 away from the cover plate 2 (not shown in Figure 34 and Figure 35 ), and the fourth sub-ink layer 222 has a plurality of hollow patterns arranged along the edge of the display panel 3. The shape of the hollow pattern includes but is not limited to a strip shape, a wave shape, an oval shape, etc. Taking the strip shape in Figure 15 and Figure 16 as an example, the length of the normal projection of the short side of the hollow pattern in the second direction is a, the value range of a is 2mm-4mm; the length of the normal projection of the long side of the hollow pattern in the first direction is b, the value range of b is 0.6mm-1.2mm; the spacing between adjacent two hollow patterns is c, the value range of c is 4mm-8mm; the inclination angle of the hollow pattern is θ, the value range of θ is 15°-75°.

[0251] The width W of the second ink layer 22 ranges from 1 mm to 1.5 mm.

[0252] The thickness of the fourth sub-ink layer 222 ranges from 5 μm to 7 μm.

[0253] During the low-temperature injection molding process, the low-temperature injection molding adhesive 4 penetrates the hollowed-out pattern of the second ink layer 22, forming an inlaid structure. After light curing, it forms a stable structure. Speculative testing has shown that compared to a design without hollowed-out patterns, the above-mentioned solution provided by this disclosure can increase thrust by approximately 75%, effectively improving the adhesion between the low-temperature injection molding adhesive 4 and the contact surface of the cover plate 2, and preventing delamination of the low-temperature injection molding adhesive 4 from the contact surface during disassembly.

[0254] By setting the second ink layer 22 to include a third sub-ink layer 221 and a fourth sub-ink layer 222, and setting a plurality of hollow patterns arranged along the edge of the cover plate 2 in the fourth sub-ink layer 222, the bonding performance between the low-temperature injection molding glue 4 and the contact surface of the cover plate 2 can be effectively improved, thereby avoiding the delamination of the low-temperature injection molding glue 4 and the contact interface during the disassembly process.

[0255] Please refer to Figure 36 This is a schematic structural diagram of another display module provided in an embodiment of the present disclosure, wherein the display module further includes:

[0256] The flexible circuit board 5 is bound to the display panel 3 and fixed to the heat dissipation film 1 on a side of the heat dissipation film 1 away from the display panel 3;

[0257] The cover tape 6 is located on the side of the flexible circuit board 5 away from the heat dissipation film 1; the cover tape 6 covers the area outside the device area of ​​the flexible circuit board 5; the position of the device area can be referred to Figure 1 ;

[0258] The edge area of ​​the cover tape 6 close to the bending area BB of the display panel 3 is provided with a second auxiliary structure 61. The second auxiliary structure 61 and the first auxiliary structure ( Figure 30 The structure is the same as that of FIG.

[0259] The same structure means that the second auxiliary structure 61 and the first auxiliary structure 13 are the same in at least one of the aspects of material, thickness, width range, adhesion, dyne value, etc., and may also include at least one of the same film layer stacking structure or pattern.

[0260] like Figure 37 The cover tape 6 is provided with a third through hole H3, which is used to expose the flexible circuit board 5 ( Figure 37 The device area on the substrate is not shown).

[0261] The second auxiliary structure 61 is composed of a first ink layer or a black polymer layer, and the thickness and width range thereof can be the same as those of the first auxiliary structure, which will not be described herein.

[0262] In the embodiments provided in the present disclosure, the second auxiliary structure 61 is arranged near the edge area of the bending portion of the cover tape 6 relative to the display panel 3, and the second auxiliary structure 61 adopts the same structure as the first auxiliary structure, so that the dyne value of the bonding area between the cover tape 6 and the low-temperature injection molding glue 4 can be improved, and the bonding performance of the bonding area between the cover tape 6 and the low-temperature injection molding glue 4 can be improved, thereby preventing the cover tape 6 from being separated from the low-temperature injection molding glue 4 during disassembly.

[0263] Please refer to Figure 38 for the Figure 37 cross-sectional view in the HH' direction, the cover tape 6 further comprises:

[0264] The insulating adhesive tape 62 is located on the side of the flexible circuit board 5 away from the heat dissipation film 1.

[0265] The second copper foil layer 63 is located on the side of the insulating adhesive tape 62 away from the flexible circuit board 5.

[0266] As Figure 39 shown is a top view of another cover tape provided in the embodiments of the present disclosure, the second copper foil layer 63 can also be provided with a through hole or a blind hole in the edge area of the bending area BB (see Figure 33 ) of the display panel 3, so that this part of the area can be reused as the second auxiliary structure 61, thereby improving the bonding performance of the bonding area between the cover tape 6 and the low-temperature injection molding glue 4, and preventing the cover tape 6 from being separated from the low-temperature injection molding glue 4 during disassembly. Figure 40 As shown is a structure schematic view of another display module provided in the embodiments of the present disclosure. In the same display module, the first auxiliary structure 13 and the second auxiliary structure 61 can have the same structure, so that the consistency of the bonding performance of the low-temperature injection molding glue 4 along the edges of the display module can be improved.

[0267] Figure 41 Please refer to Figure 39 for the cross-sectional view in the JJ' direction, the cover tape 6 further comprises:

[0268] The graphite layer 64 is located between the insulating adhesive tape 62 and the second copper foil layer 63.

[0269] By arranging the graphite layer 64 between the insulating adhesive tape 62 and the second copper foil layer 63, the resistance of the second copper foil layer 63 can be reduced.

[0270] In the low-temperature injection molding process, the low-temperature injection molding glue 4 on the upper, left and right sides of the display module is bonded with the first auxiliary structure, and the low-temperature injection molding glue 4 on the lower side is bonded with the second auxiliary structure 61, which can effectively improve the bonding performance between the low-temperature injection molding glue 4 and the contact surface, and avoid the delamination of the low-temperature injection molding glue 4 and the contact surface during the disassembly process.

[0271] Please refer to Figure 42 and Figure 43 , Figure 42 a top view of the display module near the lower frame provided by the embodiment of the present disclosure, Figure 43 a partial enlarged view of the frame region in Figure 42 , the display panel 3 further comprises:

[0272] The raised layer 7 is located on the side of the heat dissipation film 1 away from the display panel 3, and one end of the raised layer 7 close to the bending part of the display panel 3 is surrounded by three sides of the bending part of the display panel 3 (as shown in Figure 33 , as shown in Figure 43 , one end of the raised layer 7 close to the bending part of the display panel 3 is provided with a protruding part 7a, and the protruding part 7a protrudes out of the bending part of the display panel 3. The protruding part 7a is used as the dam position for dispensing glue in the low-temperature injection molding process.

[0273] The protruding part 7a is located outside the second auxiliary structure 61 in the orthographic projection of the heat dissipation film 1, and the raised layer 7 is recessed relative to the display panel 3 on the remaining sides except the side where the protruding part 7a is located.

[0274] By locally expanding the two ends of one side of the raised layer 7 close to the bending part of the display panel 3 to form the protruding part 7a, the protruding part 7a can be used as the dam position for dispensing glue in the low-temperature injection molding process, which can block the glue of the low-temperature injection molding glue 4 (as shown in Figure 44 , the top view of another display module provided by the embodiment of the application), thereby avoiding the overflow of the dam glue, and further avoiding the influence on the filling of the low-temperature injection molding glue 4, and also avoiding the influence on the strength of the low-temperature injection molding glue 4, so as to avoid the influence on the strength of the display module.

[0275] Meanwhile, the low-temperature injection molding mold used in the low-temperature injection molding process is increased with a vent hole design, which can avoid the gas inside the cavity formed by the low-temperature injection molding mold from being unable to be discharged during the pressurization process, generating bubbles, affecting the strength of the glue, and improving the reliability of the display module.

[0276] It should be noted that the low-temperature injection molding glue 4 is not shown in Figure 43 and Figure 44 , Figure 44 only the filling area of the low-temperature injection molding glue 4 in the lower frame of the display module is shown, and the low-temperature injection molding glue 4 arranged in the remaining area is not shown.

[0277] Please refer to Figure 45 Another structural schematic diagram of a display module is provided for the embodiments of the present disclosure, and the display module further comprises:

[0278] The buffer glue 8 is located between the low-temperature injection glue 4 and the contact surface opposite to the low-temperature injection glue 4; wherein the Young's modulus of the buffer glue 8 is less than the Young's modulus of the low-temperature injection glue 4.

[0279] Exemplarily, the contact surface opposite to the low-temperature injection glue 4 can be the side of the heat dissipation film 1 close to the low-temperature injection glue 4, for example, if the first auxiliary structure 13 is arranged in the heat dissipation film 1, then the contact surface opposite to the low-temperature injection glue 4 in the heat dissipation film 1 is the side of the first auxiliary structure 13 close to the low-temperature injection glue 4; the contact surface opposite to the low-temperature injection glue 4 can also be the side of the second sub-ink layer 132 of the cover plate 2 close to the low-temperature injection glue 4; the contact surface opposite to the low-temperature injection glue 4 can also be the side of the cover tape 6 (not shown in the figure) close to the low-temperature injection glue 4, for example, if the second auxiliary structure 61 is arranged in the cover tape 6, then the contact surface opposite to the low-temperature injection glue 4 in the cover tape 6 is the side of the second auxiliary structure 61 close to the low-temperature injection glue 4. Figure 45

[0280] In some embodiments, the Young's modulus of the buffer glue 8 is 10% to 30% of the Young's modulus of the low-temperature injection glue 4.

[0281] In other embodiments, the Young's modulus of the buffer glue 8 ranges from 50 mPa to 200 mPa.

[0282] Exemplarily, the buffer glue 8 can be formed on the contact surface opposite to the low-temperature injection glue 4 before the low-temperature injection process is implemented, for example, the buffer glue 8 can be formed by dispensing through a process similar to a piezoelectric ceramic valve, or the buffer glue 8 can be formed and solidified through an injection process, and the solidification can be ultraviolet curing or heating curing. The low-temperature injection glue 4 is formed after the buffer glue 8 is formed.

[0283] By arranging the buffer glue 8 between the low-temperature injection glue 4 and the contact surface opposite to the low-temperature injection glue 4, the low-temperature injection glue 4 and the contact surface opposite to the low-temperature injection glue 4 can be prevented from directly contacting each other, and a buffer layer is formed between the low-temperature injection glue 4 and the contact surface opposite to the low-temperature injection glue 4; when the low-temperature injection glue 4 is subjected to external impact, the buffer glue 8 can dissipate and decompose the stress due to the fact that the Young's modulus of the buffer glue 8 is less than the Young's modulus of the low-temperature injection glue 4, thereby reducing the impact on the contact surface and even the screen, and thus the risk of delamination between the low-temperature injection glue 4 and the corresponding contact surface can be greatly reduced.

[0284] Please continue to refer to Figure 45 ​The buffer glue 8 can be arranged on the surface of the corresponding contact surface and can be flush with the edge of the corresponding contact surface close to the edge of the display panel 3. For example, the buffer glue 8 is arranged on the surface of the heat dissipation layer of the heat dissipation film 1 away from the display panel 3, and the edge of the buffer glue 8 close to the display panel 3 can be flush with the edge of the heat dissipation layer 12.

[0285] In some embodiments, the width of the buffer glue 8 ranges from 50 μm to 300 μm, and the thickness of the buffer glue 8 ranges from 100 μm to 300 μm, so that the buffer glue 8 and the low-temperature injection glue 4 can be better bonded together, and the delamination phenomenon can be prevented during disassembly.

[0286] Please refer to Figure 46 For another structural schematic diagram of the display module provided by the embodiment of the present disclosure, the buffer glue 8 can also be arranged on the surface of the corresponding contact surface and can wrap the side of the corresponding contact surface. For example, the contact surface of the buffer glue 8 is the edge portion of one surface of the heat dissipation film 1 away from the display panel 3, and the buffer glue 8 can wrap the edge portion of one surface of the heat dissipation film 1 away from the display panel 3 and the side of the heat dissipation film 1 connected with the edge portion.

[0287] By arranging the buffer glue 8 on the surface of the corresponding contact surface and wrapping the side wall of the contact surface, the delamination problem of the low-temperature injection glue 4 during disassembly can be better avoided.

[0288] Please refer to Figure 47 For another structural schematic diagram of the display module provided by the embodiment of the present disclosure, the buffer glue 8 can also extend from the corresponding contact surface to the surface of the second sub-ink layer 132, so that the buffer glue 8 can completely wrap the side wall of the display module, and the delamination problem of the low-temperature injection glue 4 can be better avoided. For example, the contact surface of the buffer glue 8 is one surface of the first auxiliary structure 13 of the heat dissipation film 1 away from the display panel 3, and the buffer glue 8 extends from the surface of the first auxiliary structure 13 to part of the surface of the second sub-ink layer 132, so that the buffer glue 8 completely wraps the side wall of the display module. The side wall of the display module includes the side wall of the heat dissipation film 1, the side wall of the display panel 3, and the side wall between the display panel 3 and the cover plate 2.

[0289] Please continue to refer to Figure 47 and Figure 48 , Figure 48 For another structural schematic diagram of the display module provided by the embodiment of the present disclosure, wherein Figure 47 the corresponding is a cross-sectional view of the display module at a non-bottom frame position, Figure 48 is a cross-sectional view of the display module at a bottom frame position, and one surface of the buffer glue 8 close to the low-temperature injection glue 4 is a right-angle surface, so that the difficulty of arranging a mold for the buffer glue 8 can be reduced, and the complex film layer structure of the bottom frame area can be more easily adapted.

[0290] Please refer toFigure 49 Another structural schematic diagram of a display module provided by an embodiment of the present disclosure is shown in FIG. 8. The side of the buffer glue 8 close to the low-temperature injection glue 4 has a stepped structure. For example, the edge of the display module has a stepped structure (as shown by the bold solid line of the side of the buffer glue 8 away from the low-temperature injection glue 4 in FIG. 8), and the different stepped surfaces of the edge of the display module can be provided with buffer glue 8 of different thicknesses. In this way, the side of the buffer glue 8 close to the low-temperature injection glue 4 also has a stepped structure (as shown by the bold solid line of the side of the buffer glue 8 close to the low-temperature injection glue 4 in FIG. 8). For example, thicker buffer glue 8 is provided at weaker positions, and thinner buffer glue 8 is provided at low-risk positions, and the low-temperature injection glue 4 is thicker, so as to ensure that the buffer glue 8 and the low-temperature injection glue 4 are stably connected together with the display module and play a better supporting role. Figure 49 Figure 49 In the embodiments provided by the present disclosure, by providing the buffer glue 8 between the low-temperature injection glue 4 and the edge of the display module, not only can the buffer glue 8 play a buffering role, but also the low-temperature injection glue 4 can play a role of shaping support because the Young's modulus of the low-temperature injection glue 4 is higher than that of the buffer glue 8. In this way, by using the "hard + soft" combination of the low-temperature injection glue 4 and the buffer glue 8, the reliability of the display module can be improved.

[0291] In addition, because the buffer glue 8 is provided between the low-temperature injection glue 4 and the edge of the display module, chemical corrosion and other problems caused by material incompatibility between the low-temperature injection glue 4 and the film material in the display module can be prevented.

[0292] Based on the same inventive concept, an embodiment of the present disclosure provides a display device including the display module as described above.

[0293] The display device can be an electroluminescent display, an electroluminescent display screen, an electroluminescent television, and the like, and can also be a mobile device such as a mobile phone, a tablet computer, a notebook computer, a personal digital assistant (PDA), and a vehicle-mounted computer. The display device includes a frame, a display panel, a circuit board, a display driving IC, and other electronic accessories arranged in the frame.

[0294] The display device can be an electroluminescent display, an electroluminescent display screen, an electroluminescent television, and the like, and can also be a mobile device such as a mobile phone, a tablet computer, a notebook computer, a personal digital assistant (PDA), and a vehicle-mounted computer. The display device includes a frame, a display panel, a circuit board, a display driving IC, and other electronic accessories arranged in the frame.

[0295] ​The display panel can be a liquid crystal display (LCD) panel, an organic light emitting diode (OLED) display panel, a quantum dot light emitting diode (QLED) display panel, a micro light emitting diode (Micro LED) display panel, or the like, and the present disclosure does not make a specific limitation thereon.

[0296] Although preferred embodiments of the present disclosure have been described, those skilled in the art who have the benefit of the present disclosure can make additional changes and modifications to these embodiments once the basic inventive concept is appreciated. Accordingly, it is intended that the appended claims be construed to include all such changes and modifications as fall within the scope of the present disclosure.

[0297] Obviously, various modifications and changes can be made to the present disclosure by those skilled in the art without departing from the spirit and scope of the present disclosure. Accordingly, it is intended that the present disclosure embrace all such modifications and changes as fall within the scope of the claims of the present disclosure and their equivalents.

Claims

1. A display module, comprising: a display panel; a cover plate located on one side of the display panel; a heat dissipation film located on a side of the display panel away from the cover plate; and a low-temperature injection glue at least partially surrounding an edge of the display panel; wherein the heat dissipation film comprises a heat dissipation layer and a first auxiliary structure arranged in sequence away from the display panel, and the first auxiliary structure at least partially covers at least part of an edge of the heat dissipation layer; the low-temperature injection glue at least partially covers an area between an edge of the cover plate and an edge of the heat dissipation film, and at least partially covers the first auxiliary structure. 2.The display module of claim 1, wherein a bonding force between the first auxiliary structure and the low-temperature injection glue is greater than a bonding force between the heat dissipation layer and the low-temperature injection glue. a Gurley value of a surface of the first auxiliary structure away from the heat dissipation layer is greater than a Gurley value of a surface of the heat dissipation layer close to the first auxiliary structure.

3. The display module of claim 1 or 2, wherein, the display panel comprises a display area, a binding area, and a bending area connecting the display area and the binding area; and the heat dissipation layer comprises a first copper foil layer; 4. The display module of any one of claims 1-3, wherein, the heat dissipation film has an inner area and an edge area surrounding the inner area, and further comprises a foam layer located on a side of the heat dissipation layer close to the display panel; the heat dissipation layer has a first edge and a second edge connected as a closed figure, and the first edge is arranged corresponding to the bending area; wherein, in the edge area, a part corresponding to the first edge is a first sub-edge area, and a part corresponding to the second edge is a second sub-edge area; the first auxiliary structure is at least partially located in the second sub-edge area. 5.The display module of claim 4, wherein the first auxiliary structure is located in the second sub-edge area close to two end portions of the first edge and adjacent to the first edge. Or, the first auxiliary structure is located in the second sub-edge area. The first auxiliary structure is also located in the first sub-edge area.

6. The display module of claim 5, wherein, The first auxiliary structure comprises a first ink layer, or a black polymer layer.

7. The display module of any one of claims 1-6, wherein, At least part of the edge area of the heat dissipation layer has a concave-convex pattern, and a patterned part of the heat dissipation layer having the concave-convex pattern is used as the first auxiliary structure.

8. The display module of any of claims 1-2 and 4-6, wherein, The first ink layer comprises:

9. The display module of claim 7, wherein, a first sub-ink layer located on a side of the heat dissipation layer away from the foam; a second sub-ink layer located on a side of the first sub-ink layer away from the heat dissipation layer; and the second sub-ink layer has a plurality of hollow patterns arranged along the edge area. The black polymer layer comprises:

10. The display module of claim 7, wherein, a pressure-sensitive adhesive layer located on a side of the heat dissipation layer away from the foam layer; a substrate layer located on a side of the pressure-sensitive adhesive layer away from the heat dissipation layer; a black coating layer located on a side of the substrate layer away from the pressure-sensitive adhesive layer; and the black coating layer has a Gurley value greater than that of the heat dissipation layer. The patterned part has at least one of a plurality of first through holes and a plurality of blind holes arranged along the edge of the heat dissipation layer; 11. The display module of claim 8, wherein, the plurality of first through holes and the part between adjacent first through holes together constitute the concave-convex pattern. ​ Or, the plurality of blind holes and the part between adjacent blind holes jointly constitute the concave-convex pattern.

12. The display module of any one of claims 1-11, wherein, The display module further comprises: A flexible circuit board is bound to the display panel and fixed to the heat dissipation film on a side of the heat dissipation film away from the display panel; A cover tape is located on a side of the flexible circuit board away from the heat dissipation film; the cover tape covers an area outside a device area of the flexible circuit board; An edge area of the cover tape near the bending position of the display panel is provided with a second auxiliary structure, which has the same structure as the first auxiliary structure.

13. The display module of claim 12, wherein, The cover tape further comprises: An insulating tape is located on a side of the flexible circuit board away from the heat dissipation film; A second copper foil layer is located on a side of the insulating tape away from the flexible circuit board.

14. The display module of claim 13, wherein, The cover tape further comprises: A graphite layer is located between the insulating tape and the second copper foil layer.

15. The display module of any one of claims 1-14, wherein, The display panel further comprises: A cushion layer is located on a side of the heat dissipation film away from the display panel, and an end of the cushion layer near the bending position of the display panel is surrounded by the bending part of the display panel on three sides; an end of the cushion layer near the bending part is provided with a protruding part that extends out of the bending part.

16. The display module of any one of claims 1-15, wherein, The cover plate comprises: A body; A second ink layer is located on a side of the body near the display panel and arranged along an edge of the body.

17. The display module of claim 16, wherein, The second ink layer comprises: A third sub-ink layer is located on a side of the cover plate near the display panel; A fourth sub-ink layer is located on a side of the third sub-ink layer away from the cover plate; the fourth sub-ink layer has a plurality of hollow patterns arranged along an edge of the cover plate.

18. A heat dissipating film having an inner region and a peripheral region, the peripheral region surrounding the inner region, wherein, The heat dissipation film comprises: A foam layer; A heat dissipation layer is located on a side of the foam layer; the heat dissipation layer has a first edge and a second edge, the first edge and the second edge are connected to form a closed figure, and the length of the first edge is less than the length of the second edge; wherein, in the edge area, the part corresponding to the first edge is a first sub-edge area, and the part corresponding to the second edge is a second sub-edge area; and A first auxiliary structure is at least partially located in the second sub-edge area.

19. The heat dissipating film of claim 18, wherein, The adhesion between the first auxiliary structure and the low-temperature injection molding glue is greater than the adhesion between the heat dissipation layer and the low-temperature injection molding glue.

20. The heat dissipating film of claim 18, wherein, The surface of the first auxiliary structure on a side away from the heat dissipation layer has a greater Dahin value than the surface of the heat dissipation layer on a side near the first auxiliary structure.

21. The heat dissipating film of any one of claims 18-20, wherein, The first auxiliary structure comprises: A first ink layer; Or, a black high polymer layer.

22. The heat dissipating film of claim 21, wherein, The first ink layer comprises: A first sub-ink layer is located on a side of the heat dissipation layer away from the foam; A second sub-ink layer is located on a side of the first sub-ink layer away from the heat dissipation layer; the second sub-ink layer has a plurality of hollow patterns arranged along the edge area.

23. The heat dissipating film of claim 21, wherein, The black high polymer layer comprises: A pressure-sensitive adhesive layer is located on a side of the heat dissipation layer away from the foam layer; A substrate layer is located on a side of the pressure-sensitive adhesive layer away from the heat dissipation layer; A black coating is located on a side of the substrate layer away from the pressure-sensitive adhesive layer; the black coating has a greater Dahin value than the heat dissipation layer.

24. The heat dissipating film of claim 18 or 19, wherein, At least part of the edge region of the heat dissipation layer has a concave-convex pattern, and the patterned part of the heat dissipation layer with the concave-convex pattern is used as the first auxiliary structure.

25. The heat dissipating film of claim 24, wherein, The patterned part has at least one of a plurality of first through holes and a plurality of blind holes arranged along the edge of the heat dissipation layer; The plurality of first through holes and the part between adjacent first through holes jointly constitute the concave-convex pattern; Or, the plurality of blind holes and the part between adjacent blind holes jointly constitute the concave-convex pattern.

26. The heat dissipating film of any one of claims 18-25, wherein, The first auxiliary structure is located at both ends of the second sub-edge region close to the first edge and adjacent to the first edge. Or, the first auxiliary structure is located in the second sub-edge region.

27. The display module of claim 26, wherein, The first auxiliary structure is also located in the first sub-edge region.

28. The heat dissipating film of any of claims 18-27, wherein, The heat dissipation film has a second through hole penetrating in the thickness direction, and the second through hole is located in the internal region and away from the end opposite to the first edge; the heat dissipation film further comprises: A protective film located on the side of the first auxiliary structure away from the foam layer and covering the heat dissipation layer, and the protective film has a tear tab protruding from the heat dissipation layer; The protective film comprises a first sub-protective film and a second sub-protective film; the first sub-protective film is located between the edge of the internal region close to the second through hole and the second edge, and the side of the first sub-protective film close to the first auxiliary structure is not bonded to the first auxiliary structure; the second sub-protective film is located on the side of the first sub-protective film away from the heat dissipation layer and covers and bonds the first sub-protective film, and covers at least part of the heat dissipation layer.

29. A display device comprising the display module of any one of claims 1-16.

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