PLATING APPARATUS, AND METHOD FOR PARTITIONING PLATING TANK INTO ANODE CHAMBER AND Cathode CHAMBER

Abstract

The purpose of the present invention is to facilitate maintenance of a diaphragm or the like in a face-down plating device. A plating apparatus is provided with: a plating tank for holding a plating solution; a substrate holder that holds the substrate with the surface to be plated facing downward; and an anode holder assembly that is attached to the plating tank so as to be capable of being drawn in the horizontal direction through an opening in the side wall of the plating tank. The anode holder is provided with one or a plurality of openings in the center part; the anode is arranged on the anode holder; the diaphragm is arranged above the anode and is arranged on the anode holder; the anode holder assembly has one or more sealing surfaces that seal the inside of the plating bath from the outside, and one or more sealing surfaces that divide the inside of the plating bath into an upper chamber and a lower chamber.

Description

TECHNICAL FIELD

[0001] The present application relates to a plating apparatus and a method of dividing a plating tank into an anode chamber and a cathode chamber. BACKGROUND

[0002] As a plating apparatus capable of performing plating processing on a substrate, a so-called face-down type or cup type plating apparatus as described in International Publication No. 2003 / 079684 (Patent Document 1) is known. Such a plating apparatus is provided with a plating tank that stores a plating solution and is provided with an anode, and a substrate holder (also referred to as a plating head) that is disposed at a position higher than the anode and holds a substrate as a cathode.

[0003] In such a face-down type plating apparatus, in terms of configuration, since the anode is disposed at the lowermost portion of the plating tank, in maintenance work such as anode replacement, it is necessary to remove all of the parts of the upper portion of the anode. This series of work is poor in workability and time-consuming, and there is a problem in that the operation rate of the plating apparatus also deteriorates. In order to solve this problem, in International Publication No. 2003 / 079684 (Patent Document 1), a structure is adopted in which a pull-out unit capable of being pulled out from the plating tank is provided and the anode is disposed in the pull-out unit.

[0004] Patent Document 1: International Publication No. 2003 / 079684

[0005] Further, in the plating tank, sometimes a film (diaphragm) is disposed in addition to the anode, the film is disposed above the anode, and divides an anode chamber on the anode side and a cathode chamber on the substrate side. The diaphragm seals the plating solution in each of the chambers from each other, allows metal ions in the plating solution to pass from the anode chamber to the cathode chamber, and on the other hand, prevents additives in the plating solution from passing from the cathode chamber to the anode chamber. Such a diaphragm is a consumable part that needs to be replaced periodically, but is disposed below the parts on the substrate holder side such as a resistance body, a paddle, and the like, and is mounted to the plating tank via a sealing structure so as to divide and seal each of the chambers from each other, and thus there is a problem in that time is required for removal and mounting at the time of replacement. In addition, since the diaphragm is separated from the anode, there is a concern that the size in the height direction of the unit after integration becomes large. SUMMARY

[0006] The present application aims to solve at least a part of the above problems. One of the objects of the present application is to make maintenance of a diaphragm or the like in a face-down type plating apparatus easy. In addition, one of the objects of the present application is to make mounting of a diaphragm to a plating tank in a face-down type plating apparatus easy. In addition, one of the objects of the present application is to seal each of the chambers in a plating tank easily and reliably by a diaphragm in a face-down type plating apparatus.

[0007] According to one aspect of the present application, there is provided a plating apparatus including: a plating tank for holding a plating solution; a substrate holder for holding a substrate with a plating surface facing downward; and an anode holder assembly that is detachably installed in the plating tank in a horizontal direction via an opening of a side wall of the plating tank, and has an anode holder having one or more openings in a central portion, an anode installed in the anode holder, and a diaphragm installed in the anode holder above the anode, the anode holder assembly having one or more sealing surfaces that seal the plating tank from the outside and one or more sealing surfaces that divide the plating tank into upper and lower chambers.

[0008] According to one aspect of the present application, there is provided a method of dividing a plating tank into an anode chamber and a cathode chamber, including the steps of: preparing an anode holder having an anode and a diaphragm installed therein, and having one or more sealing surfaces that seal the plating tank from the outside and one or more sealing surfaces that divide the plating tank into upper and lower chambers; and installing the anode holder in the plating tank via an opening of a side wall of the plating tank, and sealing the plating tank from the outside with the anode holder and dividing the plating tank into the upper and lower chambers with the diaphragm. BRIEF DESCRIPTION OF DRAWINGS

[0009] Figure 1 FIG. 1 is a perspective view showing the overall structure of a plating apparatus according to one embodiment.

[0010] Figure 2 FIG. 2 is a plan view showing the overall structure of the plating apparatus according to one embodiment.

[0011] Figure 3 FIG. 3 is a perspective view of the plating module as viewed from the front side and lower side.

[0012] Figure 4 FIG. 4 is a perspective view of a longitudinal cross-section of the plating module.

[0013] Figure 5 FIG. 5 is a perspective view of a transverse cross-section of the plating module.

[0014] Figure 6A FIG. 6 is an enlarged perspective view showing a part of the anode holder assembly.

[0015] Figure 6B FIG. 7 is an explanatory view for explaining the installation structure of the diaphragm and the anode.

[0016] Figure 7 FIG. 8 is a perspective view of a longitudinal cross-section of the plating module at the cathode solution inlet.

[0017] Figure 8is a plan view of the anode holder assembly.

[0018] Figure 9 is a perspective view of the anode holder assembly as viewed from above.

[0019] Figure 10 is a perspective view of the anode holder assembly as viewed from below. DETAILED DESCRIPTION

[0020] Hereinafter, a plating apparatus 1000 of an embodiment of the present application will be described with reference to the drawings. Further, the drawings are schematically illustrated in order to easily understand the features of the object, and the dimensional ratios and the like of each constituent element are not necessarily the same as actual ones. In addition, in several drawings, an orthogonal coordinate of X-Y-Z is illustrated as a reference. In the orthogonal coordinate, the Z direction corresponds to the upper side, and the -Z direction corresponds to the lower side (the direction of the action of gravity).

[0021] Figure 1 is a perspective view showing the overall structure of the plating apparatus 1000 of the present embodiment. Figure 2 is a plan view showing the overall structure of the plating apparatus 1000 of the present embodiment. As shown in Figure 1 and Figure 2 The plating apparatus 1000 is provided with a load port 100, a transfer robot 110, an aligner 120, a pre-wetting module 200, a pre-dip module 300, a plating module 400, a cleaning module 500, a spin-rinse-dry apparatus 600, a transfer apparatus 700, and a control module 800.

[0022] The load port 100 is a module for carrying a substrate housed in a cassette such as a FOUP into or out of the plating apparatus 1000. In the present embodiment, four load ports 100 are arranged in parallel in the horizontal direction, but the number and arrangement of the load ports 100 are arbitrary. The transfer robot 110 is a robot for transferring a substrate, and is configured to transfer a substrate between the load port 100, the aligner 120, the pre-wetting module 200, and the spin-rinse-dry apparatus 600. When a substrate is transferred between the transfer robot 110 and the transfer apparatus 700, the transfer robot 110 and the transfer apparatus 700 can transfer the substrate via a temporary placement table (not illustrated).

[0023] The aligner 120 is a module for aligning the orientation plane, notch, or the like of the substrate to a prescribed direction. In the present embodiment, two aligners 120 are arranged side by side in the horizontal direction, but the number and arrangement of the aligners 120 are arbitrary. The pre-wetting module 200 wets the plating surface of the substrate before plating processing with a processing liquid such as pure water or degassed water, thereby replacing air inside a pattern formed on the surface of the substrate with the processing liquid. The pre-wetting module 200 is configured to perform a pre-wetting process that is a process for making it easy to supply plating liquid to the inside of the pattern by replacing the processing liquid inside the pattern with the plating liquid at the time of plating. In the present embodiment, two pre-wetting modules 200 are arranged side by side in the vertical direction, but the number and arrangement of the pre-wetting modules 200 are arbitrary.

[0024] The pre-dip module 300 is configured to perform a pre-dip process that is a process for cleaning or activating the plating substrate surface by etching and removing an oxidation film having a large resistance that exists on the surface of a seed layer formed on the plating surface of the substrate before plating processing, for example, with a processing liquid such as sulfuric acid or hydrochloric acid. In the present embodiment, two pre-dip modules 300 are arranged side by side in the vertical direction, but the number and arrangement of the pre-dip modules 300 are arbitrary. The plating module 400 performs plating processing on the substrate. In the present embodiment, there are two groups of twelve plating modules 400 arranged three in the vertical direction and four in the horizontal direction, and a total of twenty-four plating modules 400 are provided, but the number and arrangement of the plating modules 400 are arbitrary.

[0025] The cleaning module 500 is configured to perform a cleaning process on the substrate in order to remove plating liquid or the like remaining on the substrate after plating processing. In the present embodiment, two cleaning modules 500 are arranged side by side in the vertical direction, but the number and arrangement of the cleaning modules 500 are arbitrary. The spin-rinse-dry device 600 is a module for drying the substrate after the cleaning process by rotating the substrate at high speed. In the present embodiment, two spin-rinse-dry devices 600 are arranged side by side in the vertical direction, but the number and arrangement of the spin-rinse-dry devices 600 are arbitrary. The conveyance device 700 is a device for conveying the substrate between the plurality of modules in the plating device 1000. The control module 800 is configured to control the plurality of modules of the plating device 1000, and for example, can be constituted by a general-purpose computer or a dedicated computer provided with an input-output interface with an operator.

[0026] An example of a series of plating processes based on the plating apparatus 1000 will be described. First, the substrate housed in the cassette is carried into the load port 100. Next, the substrate is taken out of the cassette of the load port 100 by the transfer robot 110, and carried to the aligner 120. The aligner 120 aligns the orientation plane, notch, or the like of the substrate to a prescribed direction. The transfer robot 110 hands over the substrate whose direction has been aligned by the aligner 120 to the pre-wetting module 200.

[0027] The pre-wetting module 200 performs a pre-wetting process on the substrate. The transfer device 700 carries the substrate on which the pre-wetting process has been performed to the pre-dip module 300. The pre-dip module 300 performs a pre-dip process on the substrate. The transfer device 700 carries the substrate on which the pre-dip process has been performed to the plating module 400. The plating module 400 performs a plating process on the substrate.

[0028] The transfer device 700 carries the substrate on which the plating process has been performed to the cleaning module 500. The cleaning module 500 performs a cleaning process on the substrate. The transfer device 700 carries the substrate on which the cleaning process has been performed to the spin-rinse-dry device 600. The spin-rinse-dry device 600 performs a drying process on the substrate. The transfer robot 110 receives the substrate from the spin-rinse-dry device 600, and carries the substrate on which the drying process has been performed to the cassette of the load port 100. Finally, the cassette housing the substrate is carried out from the load port 100.

[0029] Further, Figure 1 , Figure 2 The structure of the plating apparatus 1000 described in the foregoing is merely an example, and the structure of the plating apparatus 1000 is not limited to Figure 1 , Figure 2 the structure described in the foregoing.

[0030] [Plating Module]

[0031] Next, the plating module 400 will be described. Further, the plurality of plating modules 400 included in the plating apparatus 1000 according to the present embodiment have the same structure, and thus one plating module 400 will be described.

[0032] Figure 3 is a perspective view of the plating module as viewed from the front side below. Figure 4 is a perspective view of a longitudinal cross section of the plating module. Figure 5 is a perspective view of a lateral cross section of the plating module. Figure 6A is an enlarged perspective view of a portion of the anode holder assembly. Figure 6B is an explanatory view for explaining the mounting structure of the diaphragm and the anode. Figure 7 is a perspective view of a longitudinal cross section of the plating module at the cathode liquid inlet. Figure 8 is a plan view of the anode holder assembly. Figure 9is a perspective view as viewed from above the anode holder assembly. Figure 10 is a perspective view as viewed from below the anode holder assembly. Further, Figure 3 The direction indicated by an arrow Y in indicates the front-rear direction of the plating module 400, with the front plate (cover portion) 640 side of the anode holder 610 being set as the front and the opposite side being set as the rear side.

[0033] As shown in Figure 4 The plating device 1000 according to the present embodiment is a type of plating device called a face-down type or a cup type that horizontally holds a substrate Wf and performs plating. The plating module 400 of the plating device 1000 according to the present embodiment mainly includes a plating bath 10, a substrate holder 20 that holds a substrate Wf and is also called a plating head, a rotation mechanism, an inclination mechanism, and a lift mechanism (not shown) that rotates, inclines, and lifts the substrate holder 20, a diaphragm 50 that divides the inside of the plating bath 10 into a cathode chamber Cc and an anode chamber Ca, and an anode 60 that is disposed opposite the substrate Wf below the substrate Wf. Among these, the inclination mechanism can be omitted.

[0034] The plating bath 10 according to the present embodiment is composed of a bottomed container having an opening in the upper portion. The plating bath 10 according to the present embodiment includes an upper bath 11 and a lower bath 12. The plating bath 10 forms an internal space in the shape of a substantially cylinder that stores a plating solution by the upper bath 11 and the lower bath 12. As the plating solution, a solution containing ions of a metal element that constitutes a plated film is sufficient, and specific examples thereof are not particularly limited. In the present embodiment, as one example of plating processing, copper plating processing is used, and as one example of the plating solution, a copper sulfate solution is used. In addition, in the present embodiment, a prescribed additive is contained in the plating solution. However, the structure is not limited to this, and the structure in which the plating solution does not contain an additive can also be provided.

[0035] Inside the plating bath 10, a paddle 30 is disposed in the vicinity of the substrate Wf. The paddle 30 reciprocates in a direction substantially parallel to the plated surface of the substrate Wf, and generates a strong flow of the plating solution on the surface of the substrate Wf. Thereby, the ions in the plating solution in the vicinity of the surface of the substrate Wf are homogenized, and the in-plane uniformity of the plated film formed on the surface of the substrate Wf is improved.

[0036] In the inside of the plating bath 10, a porous resistance body 40 is arranged below the paddle 30. Specifically, the resistance body 40 is configured of a plate member having a plurality of pores (fine holes). The plating solution on the lower side than the resistance body 40 can flow through the resistance body 40 to the position on the upper side than the resistance body 40. This resistance body 40 is a member provided to achieve the uniformization of the electric field formed between the anode 60 and the substrate Wf. By arranging such a resistance body 40 in the plating bath 10, the uniformization of the film thickness of the plating film (plating layer) formed on the substrate Wf can be easily achieved. Further, the resistance body 40 is not an essential structure in the present embodiment, and the present embodiment can also be configured without the resistance body 40.

[0037] In the present embodiment, the anode holder assembly 6 is arranged in the lower tank 12 of the plating bath 10, and the anode holder assembly 6 is configured to have the diaphragm 50, the anode 60, and the variable anode cover 650. That is, by inserting and mounting the anode holder assembly 6 in the plating bath 10, the diaphragm 50, the anode 60, and the variable anode cover 650 are arranged in the plating bath 10.

[0038] In the present embodiment, the diaphragm 50 and the anode 60 are arranged below the variable anode cover 650 in the inside of the plating bath 10. Figure 5 Figure 6A In the present embodiment, the structure in which the anode 60 is arranged in close contact with the diaphragm 50 is adopted. The diaphragm 50 divides / delimits the inside of the plating bath 10 into the anode chamber Ca (chamber on the lower side of the diaphragm 50) and the cathode chamber Cc (chamber on the upper side of the diaphragm 50). The diaphragm 50 is configured by, for example, superimposing a neutral membrane and an ion exchange membrane. The structure of the diaphragm 50 is one example, and other structures can be adopted. The diaphragm 50 is pressed and fixed to the holder main body 620 from below by the seal pressing ring 51 in a state in which the seal 704 is sandwiched between the outer peripheral portion (annular portion 621) of the holder main body 620 / anode holder 610. Figure 6A Figure 6B A seal surface 704A is formed between the lower surface of the outer peripheral portion (annular portion 621) of the holder main body 620 / anode holder 610 and the upper surface of the outer peripheral portion of the diaphragm 50. The seal 704 can be arranged, for example, in a seal groove provided annularly on the lower surface of the annular portion 621 of the holder main body 620 / anode holder 610. In this way, in the present embodiment, in the anode holder assembly 6, the structure in which the inside of the plating bath 10 is divided by the diaphragm 50 can be adopted. Therefore, by sealing between the outer peripheral portion (annular portion 621) of the holder main body 620 / anode holder 610 and the plating bath 10, the inside of the plating bath 10 becomes a structure in which the anode chamber Ca and the cathode chamber Cc are divided by the diaphragm 50.

[0039] ​​In the anode chamber Ca, an anolyte (plating solution) is supplied from an anolyte inlet 12C provided in the bottom wall of the plating bath 10, and is discharged from an anolyte outlet (not shown) provided in the side wall of the plating bath 10. In the cathode chamber Cc, a catholyte (plating solution) is supplied from a catholyte inlet 680, and is discharged from a catholyte outlet (not shown). The cathode chamber Cc is supplied with a plating solution (catholyte) containing an additive such as a promoter, and the anode chamber Ca is supplied with a plating solution (anolyte) containing no additive or having a low additive concentration. The diaphragm 50 allows metal ions in the plating solution to pass from the anode chamber Ca to the cathode chamber Cc, and prevents the additive in the plating solution from passing from the cathode chamber Cc to the anode chamber Ca.

[0040] The anode 60 is arranged in close contact with the lower surface of the diaphragm 50. The specific type of the anode 60 is not particularly limited, and a dissolving anode or a non-dissolving anode can be used. In the present embodiment, a non-dissolving anode is used as the anode 60. The specific type of the non-dissolving anode is not particularly limited, and platinum, iridium oxide, or the like can be used.

[0041] In the present embodiment, a variable anode cover 650 is provided on the upper surface side (substrate Wf side) of the anode 60 and the diaphragm 50. The variable anode cover 650 is an electric field adjusting member, has an opening portion exposing the anode 60 on the inner side of a vane 651, and adjusts the range of the anode 60 exposed by the vane 651, thereby adjusting the electric field from the anode 60 toward the substrate Wf. As shown in FIG. 6, the variable anode cover 650 of the present embodiment has a plurality of vanes 651, and adjusts the opening size of the opening portion exposing the anode 60 by the same mechanism as that of the aperture of a camera. Figure 5

[0042] <Anode Holder Assembly>

[0043] Hereinafter, details of the anode holder assembly (also referred to as a pull-out unit) 6 will be described. In the present embodiment, the diaphragm 50, the anode 60, and the variable anode cover 650 are attached to the anode holder 610, and they are integrally configured as the anode holder assembly 6 (also referred to as a pull-out unit) 6. Figure 3 Figure 4 ) In other embodiments, the variable anode cover 650 can be omitted, or can be provided separately from the anode holder assembly 6. The anode holder assembly 6 is attached to the plating bath 10 (lower bath 12) so as to be pullable. As shown in FIGS. 6 and 7, the anode holder assembly 6 is inserted into the plating bath 10 from an opening 12B provided in the front side of the plating bath 10, and is attached to the plating bath 10. The opening 12B of the plating bath 10 is closed by a front plate (cover portion) 640 of the anode holder 610, and is liquid-tightly sealed by seal members 702, 703 (described later). Figure 3 Figure 4

[0044] ​​​​The anode holder assembly 6 includes: an anode holder 610; and the diaphragm 50, the anode 60, and the variable anode cover 650 attached to the anode holder 610. In other embodiments, the variable anode cover 650 can be omitted, or can be provided separately from the anode holder assembly 6.

[0045] (anode holder)

[0046] The anode holder 610 includes a holder main body 620 and a front plate 640. The holder main body 620 is a component that holds the diaphragm 50, the anode 60, and the variable anode cover 650. The front plate 640 is a component that plugs the opening 12B of the plating tank 10 and seals the inside of the plating tank 10 from the outside liquid-tightly. Since the holder main body 620 is a component that constitutes the main part of the anode holder 610, the outer peripheral portion of the anode holder 610 represents the outer peripheral portion of the holder main body 620, and the outer peripheral portion of the holder main body 620 represents the outer peripheral portion of the anode holder 610.

[0047] • holder main body

[0048] The holder main body 620 includes: a ring-shaped portion 621; a diaphragm support portion 622 provided integrally on the inner side of the ring-shaped portion 621; and a flange 623 provided on the upper surface of the ring-shaped portion 621. The ring-shaped portion 621 and the flange 623 constitute the outer peripheral portion of the holder main body 620 / anode holder 610. The ring-shaped portion 621 and the flange 623 can be collectively referred to as the outer peripheral portion of the holder main body 620 / anode holder 610, or can be referred to as the outer peripheral portion of the holder main body 620 / anode holder 610, respectively.

[0049] As shown in FIG. 1, the ring-shaped portion 621 constitutes the lower portion of the outer peripheral portion of the holder main body 620 / anode holder 610, and the diaphragm support portion 622 having a plurality of openings exposing the diaphragm 50 (a region corresponding to the anode 60) is arranged on the inner side thereof. In other embodiments, the diaphragm support portion 622 can be omitted, and the portion of the diaphragm support portion 622 can be a single opening. Figure 4

[0050] The diaphragm support portion 622 is a mesh portion including a plurality of openings, as shown in FIG. 1 and FIG. 2, and is a component that supports the diaphragm 50 from above by abutting against the upper surface of the diaphragm 50, as shown in FIG. 3 and FIG. 4. Figure 8 Figure 9 Figure 4 Figure 5 Figure 4 Figure 5 ​​​​​​As shown, the diaphragm support portion 622 comprises: a honeycomb structure (inside the circumscribed circle Rm), hexagonal beams 622A arranged in a honeycomb shape and having multiple honeycomb-shaped openings; and multiple beams 622B extending radially, connected from the outermost vertex of the honeycomb structure to the annular portion 621 of the retainer body 620 / anode retainer 610. Figure 8 Rm in the figure represents the circumscribed circle of the honeycomb structure, and the inner side of the circumscribed circle Rm roughly shows the honeycomb structure. The circumscribed circle Rm roughly corresponds to the outer shape (projected shape) of the substrate Wf. Figure 8 As shown, the center of the honeycomb structure, i.e., the center Cm of the circumscribed circle Rm, is offset from the rotation center / rotation axis Cw of the substrate holder 20 (substrate Wf). This structure prevents the plated film formed on substrate Wf from picking up the pattern of the diaphragm support portion 622, thereby suppressing or preventing a decrease in the uniformity of the plated film thickness. If the center Cm of the honeycomb structure is not offset (offset) from the rotation center Cw of substrate Wf, even if substrate Wf rotates, there is a high probability that a region with a high rate of electric field shielding by beam 622A will form.

[0051] The flange 623 constitutes the upper portion of the outer periphery of the holder body 620 / anode holder 610 and constitutes a mounting portion toward the interior of the plating tank 10. Figure 8 and Figure 9 As shown, the flange 623 is an annular component having an opening in the center portion that exposes the diaphragm 50 (the area corresponding to the anode 60). The flange 623 is firmly and liquid-tightly fixed to the annular portion 621 of the holder body 620 / anode holder 610 by a fixing method based on a fastening component, welding, joining, etc. A seal may be arranged between the flange 623 and the annular portion 621 to fix the two liquid-tightly. In the present embodiment, the flange 623 and the annular portion 621 are provided separately, but in the case where the variable anode cover 650 is not installed on the anode holder 610, the flange 623 and the annular portion 621 may be provided integrally. An annular sealing groove is formed on the upper surface of the flange 623 over the entire circumference, and an annular seal 701 is arranged in the sealing groove. In the present embodiment, as Figure 4 As shown in FIG. 1 and FIG. 2 , an annular protrusion slightly higher than other portions is provided on the inner portion of the upper surface of the flange 623 , and a seal 701 is arranged on the annular protrusion.

[0052] ·Front panel

[0053] like Figure 3 and Figure 4 As shown, the front plate 640 includes a front plate body 641 and a frame member 642. The frame member 642 is fitted to the outer peripheral surface of the front plate body 641 so as to be movable in the front-back direction relative to the front plate body 641. The front plate body 641 and the frame member 642 are fitted together with a strength that does not fall off from each other.Figure 4 As shown, the outer peripheral surface of the front plate body 641 is, for example, configured with an annular seal 703 throughout the entire circumference, and the seal 703 seals the front plate body 641 and the frame member 642 liquid-tightly. The seal 703 is, for example, configured in a sealing groove that is set as an annular shape throughout the entire circumference of the outer peripheral surface of the front plate body 641. The seal 703 can also be configured in a sealing groove that is set as an annular shape throughout the entire circumference of the inner peripheral surface of the frame member 642. A flange 12A that protrudes downward and in the left and right directions is provided around the opening 12B of the lower groove 12 of the coating tank 10. An annular seal 702 is configured around the opening 12B on the front surface of the flange 12A, and the seal 702 seals the flange 12A and the front plate 640 (frame member 642). The seal 702 is, for example, disposed within an annular sealing groove extending around the entire perimeter of the opening 12B on the front surface of the flange 12A. The flange 12A constitutes a portion of the lower tank 12 and may be integral with the lower tank 12, or may be separate from the rest of the lower tank 12 and secured fluid-tightly thereto by means of fastening components, welding, bonding, or other methods. Alternatively, the seal 702 may be disposed within an annular sealing groove extending around the entire perimeter of the rear surface of the frame member 642.

[0054] Furthermore, the flange 12A may be omitted if a sufficient area can be ensured on the side wall (front surface) of the lower groove 12 for the frame member 642 of the front plate 640 to abut against.

[0055] like Figure 3 and Figure 4 As shown, front plate 640 is fixed to the flange 12A of lower groove 12 by a plurality of fastening components 802 that penetrate frame member 642. Fastening component 802 can be bolt, screw or other arbitrary fastening components. But, from the viewpoint of the maintenance of anode holder assembly 6 (anode holder 610), it is preferably a component that is easily disassembled. The frame member 642 of front plate 640 is fixed to the flange 12 of coating tank 10 by fastening component 802, thereby is sealed by sealant 702 between frame member 642 and flange 12A. At this moment, frame member 642 can move in the front-back direction relative to front plate main body 641, makes sealant 702 suitably elastically deformed, and can give full play to the sealing performance of sealant 702. As a result, when the anode holder 610 (anode holder assembly 6 ) is mounted in the plating tub 10 , the interior of the plating tub 10 is sealed liquid-tightly from the outside by the seal 702 between the front plate 640 of the anode holder 610 and the flange 12A of the plating tub 10 .

[0056] (diaphragm)

[0057] like Figure 4 、 Figure 6AAs shown, the outer peripheral portion of the diaphragm 50 is attached to the lower surface of the outer peripheral portion (annular portion 621) of the holder body 620 / anode holder 610 via a seal 704. Figure 6A As shown, a plurality of fastening members 803 penetrate the sealing pressing ring 51, the diaphragm 50, and the seal 704 and are screwed into the annular portion 621, so that the outer periphery of the diaphragm 50 is attached to the outer periphery (annular portion 621) of the holder body 620 / anode holder 610 in a state sealed by the seal 704. The seal 704 can be arranged, for example, in a sealing groove ( Figure 6A The plurality of fastening members 803 may be bolts, screws, or any other fastening members, and may be evenly arranged, for example, around the entire circumference of the sealing pressing ring 51. The diaphragm support portion 622 and the annular portion 621 may also be collectively referred to as a diaphragm support portion.

[0058] (anode)

[0059] like Figure 6B As shown, the anode 60 is mounted on the outer periphery (annular portion 621) of the holder body 620 / anode holder 610 via the anode fixing plate 62 and the diaphragm pressing piece 810 in such a manner as to be in close contact with the lower surface of the diaphragm 50. The anode 60 is supported from below and held in a predetermined position by a plurality of diaphragm pressing pieces 810. These plurality of diaphragm pressing pieces 810 penetrate the anode fixing plate 62 and abut against the lower surface of the anode 60, pressing the anode 60 against the diaphragm 50. At this time, although Figure 6A and Figure 6B Although not shown, the upper surface of the diaphragm 50 is supported by the diaphragm support portion 622 ( Figure 5 The anode fixing plate 62 is pressed from above, so the diaphragm 50 and the anode 60 are held by the upper diaphragm support portion 622 and the lower diaphragm pressing member 810. The anode fixing plate 62 is also called a back plate.

[0060] The diaphragm pressing member 810 can be provided as a bolt, a spacer or any other supporting member. Figure 6B In order to emphasize the gap between the anode 60 and the anode fixing plate 62 formed by the plurality of diaphragm press members 810 , it is schematically shown.

[0061] like Figure 6A As shown, the anode fixing plate 62 is outside the sealing pressing ring 51 through a plurality of spacers 804A (in Figure 6AThe anode retaining plate 62 is secured to the outer periphery (annular portion 621) of the retainer body 620 / anode retainer 610 by a plurality of fastening members 804 that penetrate the anode retaining plate 62 and the spacer 804A and are screwed into the annular portion 621. This creates a gap between the outer periphery of the retainer body 620 / anode retainer 610 and the anode retaining plate 62 (between the sealing pressing ring 51 and the anode retaining plate 62, and between the annular member 621 and the anode retaining plate 62). Gas (e.g., oxygen) generated at the anode 60 can flow through this gap to the outside of the retainer body 620 / anode retainer 610.

[0062] The plurality of fastening members 804 may be bolts, screws, or any other fastening members, and may be evenly arranged around the entire circumference of the outer side of the seal pressing ring 51 , for example.

[0063] like Figure 6B As shown, a predetermined gap is formed between the lower surface of the anode 60 and the anode fixing plate 62 by the front end side of the diaphragm pressure piece 810. In addition, on the outer peripheral side of the anode 60, gaps are provided at one or more circumferential locations between the sealing pressing ring 51 and the anode fixing plate 62, and between the annular member 621 and the anode fixing plate 62. Gas accumulated between the lower surface of the anode 60 and the anode fixing plate 62 is discharged outward through the aforementioned gaps. The anode fixing plate (back plate) 62 has the function of adjusting the amount of gas accumulated on the lower surface of the anode 60 to a predetermined amount, thereby suppressing a large amount of gas from simultaneously escaping from the lower surface of the anode, thereby causing a change in the anode voltage. This can prevent a decrease in the uniformity of the coating thickness.

[0064] In the present embodiment, the anode 60 is a plate-like component having a large number of through holes (not shown). The anode 60 can be a porous (metal mesh) structure, or other plate-like components provided with a plurality of through holes (see International Publication No. 2023 / 188371). Since the anode 60 has a large number of through holes, the upper surface of the anode 60 is always kept wet due to the plating solution (anode solution) supplied from the through holes even during the electrode reaction. Since the diaphragm 50 is an ion-permeable membrane that can be permeated and wetted by the plating solution, the anode 60 reacts with the plating solution on the surface of the substrate side (where the diaphragm 50 is in close contact or near it), and cations (such as hydrogen ions H +) is transferred to the cathode chamber Cc, that is, the substrate side, through the diaphragm 50. Therefore, an ion conduction path (current path) is formed from the surface of the substrate side of the anode 60 (where the diaphragm 50 is in close contact or in the vicinity thereof) through the inside of the diaphragm 50 to the substrate Wf. On the other hand, the bubbles of gas generated on the surface of the anode 60 cannot pass through the diaphragm 50, but move to the back surface (lower surface) side of the anode 60 through the large number of through holes of the anode 60. After accumulating on the lower surface of the anode 60 (between the anode 60 and the back plate 62), the bubbles move to the outside of the sealing pressing ring 51 and are discharged to the outside of the plating tank 10 through the exhaust passage (not shown).

[0065] Since the upper surface of the anode 60 is in close contact with the lower surface of the diaphragm 50, it is possible to suppress or prevent the gas generated from the anode 60 from accumulating between the anode 60 and the diaphragm 50, and to suppress or prevent the above-mentioned gas from moving toward the cathode chamber, and it is possible to suppress or prevent the above-mentioned gas from affecting the electric field between the anode 60 and the substrate Wf, thereby reducing the uniformity of the thickness of the coating film formed on the substrate Wf.

[0066] (Variable anode mask)

[0067] like Figure 4 As shown, the variable anode cover 650 is mounted on the annular portion 621 of the holder body 620 / anode holder 610 at a position closer to the diaphragm support portion 622 ( Figure 5 The variable anode mask 650 has: a plurality of blades 651; and an annular driving component 652, which is equipped with a plurality of blades 651 and adjusts the aperture (opening diameter) based on the blades 651. Figure 3 、 Figure 5 The drive shaft 670 shown in FIG. 1 is moved in the front-to-back direction by an actuator (not shown), thereby rotating the drive component 652 and adjusting the aperture (opening diameter) based on the multiple blades 651. In one example, the following structure can be provided: an actuator (not shown) is arranged on the side surface of the lower tank 12 of the plating tank 10 adjacent to the front plate 640 (opening 12B of the lower tank 12) of the anode holder 610. The axis of the actuator extends parallel to the drive shaft 670, and the axis of the actuator and the drive shaft 670 are connected at their front ends via a connecting component 671 (see International Publication No. 2003 / 079684 (Patent Document 1)). The drive shaft 670 and the front plate 640 (front plate body 641) are sealed by an appropriate seal (not shown, for example, see Patent Document 1). The actuator can be composed of a well-known linear actuator (e.g., a motor or ball screw).

[0068] (First sealing surface)

[0069] like Figure 9The flange 623 of the holder main body 620 / anode holder 610 is a ring-shaped member having an opening in the center that exposes the diaphragm 50 (a region corresponding to the anode 60). As shown in Figure 4 , Figure 5 , Figure 8 and Figure 9 A seal 701 is disposed on the upper surface of the flange 623 over the entire circumference. The seal 701 seals between the outer circumferential portion (flange 623) of the holder main body 620 / anode holder 610 and the lower surface of the flange 12D of the plating tank 10. Between the upper surface of the outer circumferential portion (flange 623) of the holder main body 620 / anode holder 610 and the lower surface of the flange 12D of the plating tank 10, which are opposed to each other while sandwiching the seal 701, a seal surface 701A (see Figure 4 ) that seals between the outer circumferential portion of the holder main body 620 / anode holder 610 and the plating tank 10 is formed. As shown in Figure 4 , Figure 5 The seal 701 is configured to elastically deform with an appropriate pressure to exhibit sealing properties when the plurality of fastening members 801 that are fastened to the flange 623 of the holder main body 620 / anode holder 610 through the flanges 11A of the upper tank 11 and the flange 12D of the lower tank 12 of the plating tank 10 fix the outer circumferential portion (flange 623) of the holder main body 620 / anode holder 610 to the flange 12D of the plating tank 10. The plurality of fastening members 801 are, for example, disposed equally over the entire circumference. The fastening members 801 can be bolts, screws, or other arbitrary fastening members.

[0070] (Second seal surface)

[0071] As shown in Figure 4 , a ring-shaped seal 702 is disposed on the front surface of the flange 12A of the lower tank 12 of the plating tank 10 over the entire circumference around the opening 12B. The seal 702 seals between the flange 12A of the plating tank 10 and the frame member 642 of the front plate 640. In other words, the opening 12B of the plating tank 10 is liquid-tightly sealed. Between the front surface of the flange 12A of the plating tank 10 and the back surface of the frame member 642 of the front plate 640, which are opposed to each other while sandwiching the seal 702, a seal surface 702A (see Figure 4 ) that seals between the front plate 640 and the plating tank 10 is formed. As shown in Figure 3 , Figure 4As shown, the front plate 640 of the anode holder 610 is fixed to the flange 12A of the plating tank 10 by the plurality of fastening members 802, and the seal 702 is elastically deformed with an appropriate pressure and functions as a seal. At this time, the frame member 642 of the front plate 640 is movable in the front-rear direction with respect to the front plate body 641, and thus the frame member 642 is moved with respect to the front plate body 641 so that the frame member 642 elastically deforms the seal 702 with an appropriate pressure in accordance with the degree of fastening of the plurality of fastening members 802. As shown in FIG. 6, the frame member 642 is pressed against the flange 12A independently of the front plate body 641 by the fastening of the fastening members 802, and thus the seal 703 is appropriately compressed and elastically deformed, and becomes in an appropriately sealed state. For example, the seal 702 is elastically deformed in the upper and lower portions with an appropriate pressing force by changing the degree of fastening of the fastening members 802 in the upper and lower portions. Figure 4 As shown, the plurality of fastening members 802 can be disposed, for example, equally over the entire circumference.

[0072] Here, when the flange 623 of the holder body 620 / anode holder 610 is fixed to the flange 12D of the plating tank 10 by the fastening member 801, that is, when the seal 701 is elastically deformed, the flange 12D of the plating tank 10 is subjected to a force in the up-down direction by the fastening member 801, and thus the seal 702 disposed on the flange 12A of the plating tank 10 is subjected to a force in the up-down direction, and can not be in an appropriate state of sealing between the flange 12A and the frame member 642. Therefore, in the present embodiment, the frame member 642 is made movable in the front-rear direction with respect to the front plate body 641 in the front plate 640, and the frame member 642 is pressed against the flange 12A independently of the front plate body 641 by the fastening of the fastening members 802, and thus the seal 703 is appropriately compressed and elastically deformed, and becomes in an appropriately sealed state. For example, the seal 702 is elastically deformed in the upper and lower portions with an appropriate pressing force by changing the degree of fastening of the fastening members 802 in the upper and lower portions.

[0073] (Third sealing surface)

[0074] In addition, in the front plate 640, the front plate body 641 and the frame member 642 are sealed by the annular seal 703. Between the outer circumferential surface of the front plate body 641 and the inner circumferential surface of the frame member 642 that sandwich the seal 703, a sealing surface 703A that seals between the front plate body 641 and the frame member 642 is formed (see FIG. 6). Figure 4 As a result, the inside of the plating tank 10 is appropriately sealed with respect to the outside. The frame member 642 is fitted and attached to the front plate body 641 with a strength that does not fall off from the front plate body 641. The seal 703 is disposed, for example, in an annular seal groove provided over the entire circumference on the outer circumferential surface of the front plate body 641. Further, the seal 703 can be disposed in a seal groove provided in an annular shape over the entire circumference on the inner circumferential surface of the frame member 642.

[0075] (Catholyte passage)

[0076] As shown in FIG. 6, Figure 7 and Figure 10As shown, in the anode holder 610, a cathode liquid passage 681 is provided at the lower portion of the holder body 620 / anode holder 610, which is connected to the cathode liquid inlet 680 of the front plate 640. The cathode liquid passage 681 is formed by removing a portion of the thickness at the lower portion of the outer periphery (annular portion 621) of the holder body 620 / anode holder 610, and is divided by the lower surface of the thin-walled portion of the annular portion 621 of the holder body 620 / anode holder 610, the front plate body 641, the bottom wall 613, and the side walls 614 to 617. The side wall 614 is provided in a shape that follows the outer periphery of the diaphragm support portion 622 ( Figure 7 、 Figure 10 ), one or more notches 614a are provided on the upper portion of the side wall 614 ( Figure 7 The notch 614a forms the outlet of the cathode liquid passage 681. That is, the cathode liquid passage 681 has an inlet connected to the cathode liquid inlet 680 and an outlet (notch 614a) opening above the diaphragm 50. The cathode liquid flowing in from the cathode liquid inlet 680 passes through the cathode liquid passage 681 and is supplied from the notch 614a to the top of the diaphragm support portion 622 (that is, the cathode chamber Cc above the diaphragm 50).

[0077] like Figure 7 As shown, the catholyte inlet 680 is located at the bottom of the cathode chamber Cc below the holder body 620 / anode holder 610, thereby minimizing the amount of residual catholyte in the cathode chamber Cc. The bottom surface (bottom wall 613) of the catholyte passage 681 is also located below the anode fixing plate 62 and at the bottom of the cathode chamber Cc.

[0078] (Bus Bar)

[0079] A bus bar 660 ( Figure 3 、 Figure 5 ).like Figure 10 As shown, bus bar 660 extends rearward from front plate 640 (front plate body 641) to near the center of the lower surface of anode 60. For example, it is electrically and mechanically connected to boss 60A (terminal portion) via fastening member 805. Boss 60A is electrically and mechanically connected to anode 60 near the center of the lower surface of anode 60 and protrudes downward. Bus bar 660 and front plate 640 (front plate body 641) are sealed by an appropriate seal (not shown; see, for example, Patent Document 1). Fastening member 805 may be a bolt, screw, or any other fastening member.

[0080] According to the above-described embodiment, the following effects are achieved.

[0081] (1) In the anode holder 610, the outer peripheral portion of the diaphragm 50 can be appropriately sealed from the outer peripheral portion of the holder main body 620 / anode holder 610 by the seal 704.

[0082] (2) The outer peripheral portion of the anode holder 610 can be appropriately sealed from the inside of the plating bath 10 by the seal 701 so that the inside of the plating bath 10 is divided into upper and lower chambers (anode chamber, cathode chamber).

[0083] (3) According to the above-described structures (1), (2), the inside of the plating bath 10 can be divided and sealed into the cathode chamber and the anode chamber by installing the anode holder 610 in the plating bath 10, up and down the diaphragm 50.

[0084] (4) The front plate 640 of the anode holder 610 can be appropriately sealed from the periphery of the opening 12B of the plating bath 10 by the seal 702. At this time, the seal 702 can be appropriately elastically deformed by moving the frame member 642 of the front plate 640 in the front-rear direction.

[0085] (5) The frame member 642 of the front plate 640 can be appropriately sealed from the front plate main body 641 by the seal 703.

[0086] (6) According to the above-described structures (4), (5), the inside of the plating bath 10 can be appropriately sealed from the outside by installing the anode holder 610 in the plating bath 10.

[0087] (Other Embodiments)

[0088] (1) In the case where the inside of the plating bath 10 is liquid-tightly sealed from the outside by the seal 704 by a method such as a structure in which the seal 704 between the front plate 640 and the plating bath 10 is designed, the front plate main body 641 and the frame member 642 can be provided as an integrated front plate 640 and the seal 703 can be omitted.

[0089] (2) In the above-described embodiment, the back plate 62 that adjusts the amount of accumulation of gas is provided on the lower surface side of the anode 60, but instead of the back plate 62, a bubble buffer ring provided so as to surround the anode 60 can be provided, and the amount of bubbles generated from the anode and accumulated on the lower surface can be adjusted by the height of the bubble buffer ring (International Publication No. 2023 / 188371)

[0090] From the above-described embodiments, the following modes can be grasped at least.

[0091] [1] According to one embodiment, there is provided a plating device including: a plating bath for holding a plating solution; a substrate holder for holding a substrate with a plating surface facing downward; and an anode holder assembly that is detachably installed in the plating bath in a horizontal direction via an opening of a side wall of the plating bath, and has an anode holder having one or more openings in a central portion, an anode installed in the anode holder, and a diaphragm installed in the anode holder above the anode, the anode holder assembly having one or more sealing surfaces that seal the inside of the plating bath from the outside, and one or more sealing surfaces that divide the inside of the plating bath into upper and lower chambers. For convenience of explanation, the one or more sealing surfaces that seal the inside of the plating bath from the outside are sometimes referred to as sealing surfaces for closing the plating bath, and the one or more sealing surfaces that divide the inside of the plating bath into upper and lower chambers are sometimes referred to as sealing surfaces for dividing the inside of the plating bath.

[0092] According to this embodiment, in a downward-facing plating device, the diaphragm and the anode, which need to be periodically maintained, can be integrated with the detachable anode holder, thereby making maintenance of the diaphragm and the anode easy. That is, the anode holder assembly that holds the anode and the diaphragm arranged in the lower portion of the plating bath can be removed from the plating bath, and replacement of the anode and the diaphragm (including replacement of the entire anode holder assembly) can be performed outside the plating bath.

[0093] According to this embodiment, by installing the anode holder assembly (anode holder) in the plating bath, the inside of the plating bath can be sealed from the outside and divided into upper and lower chambers (anode chamber, cathode chamber). That is, the inside of the plating bath can be sealed from the outside by one or more sealing surfaces for closing the plating bath, and divided into upper and lower chambers (anode chamber, cathode chamber) by one or more other sealing surfaces for dividing the inside of the plating bath.

[0094] In addition, by installing the anode holder in the plating bath, installation of the diaphragm in the plating bath is also performed, and thus installation of the diaphragm in the plating bath can be made easy.

[0095] [2] According to one embodiment, the one or more sealing surfaces that divide the inside of the plating bath into upper and lower chambers have: a first sealing surface that seals between the diaphragm and the anode holder; and a second sealing surface that seals between the outer peripheral portion of the anode holder and the plating bath.

[0096] According to this embodiment, before the anode holder assembly is installed in the plating bath, the diaphragm is installed in the anode holder in a sealed state, and thus when the anode holder assembly is installed in the plating bath, the inside of the plating bath can be divided into upper and lower chambers if the outer peripheral portion of the anode holder is sealed from the plating bath.

[0097] [3] According to one embodiment, the above-mentioned diaphragm is attached to the outer peripheral portion of the above-mentioned anode holder via the first sealing member at the outer peripheral portion of the diaphragm, and the first sealing surface is formed between the outer peripheral portion of the diaphragm and the outer peripheral portion of the anode holder.

[0098] According to this embodiment, the diaphragm and the anode holder can be reliably sealed by a simple structure.

[0099] [4] According to one embodiment, the above-mentioned plating bath has a first flange having a lower surface exposed to a space inside the plating bath, and the above-mentioned anode holder has a second flange provided at an upper portion of the outer peripheral portion, and the above-mentioned anode holder is attached to the above-mentioned lower surface of the above-mentioned first flange of the plating bath via a ring-shaped second sealing member at an upper surface of the above-mentioned second flange, and the second sealing surface is formed between the above-mentioned upper surface of the above-mentioned second flange of the anode holder and the above-mentioned lower surface of the above-mentioned first flange of the plating bath.

[0100] According to this embodiment, the anode holder and the plating bath can be reliably sealed throughout the entire circumference via the opposing surfaces of the anode holder and the plating bath in the vertical direction. Thus, the anode holder and the plating bath can be reliably sealed throughout the entire circumference without being affected by the sealing surface that seals the opening of the side wall of the plating bath.

[0101] [5] According to one embodiment, the above-mentioned second flange of the above-mentioned anode holder is attached to the above-mentioned first flange of the above-mentioned plating bath by one or more fastening members, and the above-mentioned second sealing member is configured to elastically deform between the above-mentioned first flange and the above-mentioned second flange by fastening the above-mentioned fastening members.

[0102] According to this embodiment, the outer peripheral portion of the anode holder can be fixed to a prescribed position inside the plating bath by one or more fastening members, and the second sealing member can be elastically deformed to reliably seal the outer peripheral portion of the anode holder and the plating bath.

[0103] [6] According to one embodiment, one or more sealing surfaces inside the above-mentioned plating bath that seal against the outside have a third sealing surface that seals the periphery of the above-mentioned opening of the plating bath and the above-mentioned anode holder.

[0104] According to this embodiment, the inside of the plating bath can be sealed against the outside around the periphery of the opening of the side wall of the plating bath into which the anode holder assembly is inserted.

[0105] [7] According to one embodiment, the anode holder has a front plate provided at one end side and blocking the opening of the plating tank, the front plate having a front plate main body and a frame member fitted to the front plate main body so as to be slidable, the frame member being attached to a side wall around the opening of the plating tank or a third flange provided around the opening of the plating tank via a third seal member, a third seal surface being formed between the frame member and the side wall around the opening of the plating tank or the third flange provided around the opening of the plating tank, the frame member being fitted to the front plate main body via a fourth seal member, a fourth seal surface being formed between an inner peripheral surface of the frame member and an outer peripheral surface of the front plate main body. In the case where the third flange is provided, the third flange becomes a part of the plating tank.

[0106] According to this embodiment, even if the third seal member is displaced by a force in the up-down direction, the frame member can be pressed in the front-rear direction against the side wall of the plating tank / third flange, and the third seal member can be reliably and appropriately elastically deformed between the plating tank and the frame member to exhibit a sealing property. Thus, the plating tank and the frame member can be reliably sealed by the third seal member. In addition, the front plate main body and the frame member can be sealed by the fourth seal member. As a result, the inside of the plating tank can be reliably sealed against the outside.

[0107] [8] According to one embodiment, the frame member is attached to the side wall around the opening of the plating tank or the third flange provided around the opening of the plating tank by one or more fastening members, and the third seal member is configured to be elastically deformed between the frame member and the side wall or the third flange by fastening the fastening members.

[0108] According to this embodiment, the front plate can be attached to the side wall of the plating tank by the one or more fastening members, and the third seal member can be deformed so as to reliably seal between the opening of the plating tank and the front plate.

[0109] [9] According to one embodiment, the fourth seal member is configured to be elastically deformed between the frame member and the front plate main body by the frame member being fitted to the front plate main body.

[0110] According to this embodiment, the fourth seal member can be elastically deformed by the frame member being fitted to the front plate main body so as to reliably seal between the frame member and the front plate main body.

[0111]

[10] According to one embodiment, the anode holder has an outer peripheral portion and a diaphragm support portion having a plurality of openings inside the outer peripheral portion and supporting an upper surface of the diaphragm.

[0112] According to this aspect, the diaphragm can be appropriately pressed from above by the diaphragm support portion of the anode holder, and bending of the diaphragm upward can be suppressed.

[0113]

[11] According to one aspect, the plurality of openings of the diaphragm support portion include a plurality of openings of a first shape, and a plurality of openings of a second shape disposed outside the plurality of openings of the first shape, a center of a circumscribed circle of the plurality of openings of the first shape being eccentric from a center of rotation of the substrate holder.

[0114] According to this aspect, the center of the pattern of the diaphragm support portion is eccentric from the center of rotation / rotation axis of the substrate, and thus the shape of the pattern of the plating film transferred to the diaphragm support portion can be suppressed, and the uniformity of the film thickness of the plating film can be improved.

[0115]

[12] According to one aspect, the configuration constituted by the plurality of openings of the first shape is a honeycomb configuration.

[0116] According to this aspect, the diaphragm support portion can support the central portion of the diaphragm with a sufficient strength and ensure a larger opening area, where the possibility of bending is high. That is, bending of the diaphragm can be suppressed, and the influence on the electric field between the substrate and the anode can be suppressed.

[0117]

[13] According to one aspect, the plurality of openings of the second shape are formed between a plurality of beams extending radially from the apexes of the outermost periphery of the honeycomb configuration to the outer peripheral portion.

[0118] According to this aspect, the necessary support strength can be ensured and a larger opening area can be ensured in the vicinity of the outer peripheral portion of the diaphragm, where the possibility of bending is low.

[0119]

[14] According to one aspect, the anode is a plate-shaped member having a plurality of through-holes, and is disposed in close contact with the lower surface of the diaphragm, and the plating device further includes a back plate spaced apart from the anode by a predetermined distance below the anode, and the amount of gas generated from the anode stagnating on the lower surface of the anode is adjusted by the back plate.

[0120] According to this aspect, the anode and the diaphragm are in close contact with each other, and thus the size of the anode holder assembly in the height direction can be suppressed, and the anode holder assembly can be configured compactly.

[0121] According to this aspect, the anode is in close contact with the separator, so that the gas generated in the anode is inhibited or prevented from accumulating between the separator and the anode, and the electric field between the anode and the substrate is inhibited or prevented from being affected by the gas to affect the uniformity of the plating film thickness. In addition, the amount of gas remaining on the lower surface through the plurality of through-holes of the anode can be adjusted by the back panel, and the anode voltage is inhibited or prevented from fluctuating due to a large amount of gas simultaneously escaping from the lower surface of the anode. Thus, the film thickness uniformity of the plating film can be inhibited or prevented from being reduced.

[0122]

[15] According to one aspect, the anode holder has a catholyte inlet for supplying a plating solution as a catholyte to the cathode chamber.

[0123] According to this aspect, the catholyte inlet is provided in the anode holder, so that the structure of the plating tank can be made more compact.

[0124]

[16] According to one aspect, the catholyte inlet is disposed below the separator, and a catholyte passage is provided in the anode holder, the catholyte passage having an inlet communicating with the catholyte inlet below the separator, and an outlet opening above the separator.

[0125] According to this aspect, the catholyte inlet is disposed below the separator and at the lowermost part of the cathode chamber, so that the residual catholyte remaining in the cathode chamber can be minimized. In addition, the catholyte is introduced from the lower part of the anode holder and supplied to the upper part of the separator (cathode chamber), so that it is easy to form a sealing surface of the plating tank on the upper part of the outer periphery of the anode holder. According to this structure, it is easy to form a sealing surface between the outer periphery of the anode holder and the plating tank with a simple structure, and it is easy to sufficiently ensure the volume of the anode chamber.

[0126]

[17] According to one aspect, the plating device further includes a variable anode cover disposed above the separator.

[0127] According to this aspect, the variable anode cover can also be integrated with the anode holder that can be pulled out, and maintenance of the variable anode cover becomes easy.

[0128]

[18] According to one embodiment, there is provided a method of dividing a plating bath into an anode chamber and a cathode chamber, including the steps of: preparing an anode holder which is provided with an anode and a diaphragm, and has one or more sealing surfaces for sealing the inside of the plating bath from the outside, and one or more sealing surfaces for dividing the inside of the plating bath into upper and lower chambers; and installing the anode holder in the plating bath via an opening in the side wall of the plating bath, plugging the opening of the plating bath with the anode holder to seal the inside of the plating bath from the outside, and dividing the inside of the plating bath into the anode chamber and the cathode chamber above and below the diaphragm.

[0129] [A1] According to one embodiment, there is provided a plating apparatus including: a plating bath for holding a plating solution; a substrate holder for holding a substrate with a plating surface facing downward; an anode disposed opposite the substrate; a diaphragm disposed between the substrate and the anode; and a diaphragm support portion for pressing an upper surface of the diaphragm, having a plurality of first-shaped openings and a plurality of second-shaped openings disposed outside the plurality of first-shaped openings, and including a center of a circumscribed circle of the plurality of first-shaped openings being eccentric from a rotation center of the substrate holder.

[0130] According to this embodiment, the center of the pattern of the diaphragm support portion is eccentric from the rotation center / rotation center axis of the substrate, so that the shape of the pattern of the plating film transferred to the diaphragm support portion can be suppressed, and the uniformity of the film thickness of the plating film can be improved.

[0131] [A2] According to one embodiment, the configuration formed by the plurality of first-shaped openings is a honeycomb configuration.

[0132] According to this embodiment, the diaphragm support portion can be supported with sufficient strength and a larger opening area can be ensured in the central portion of the diaphragm where the possibility of bending is high. That is, the bending of the diaphragm can be suppressed and the influence on the electric field between the substrate and the anode can be suppressed.

[0133] [A3] According to one embodiment, the plurality of second-shaped openings are formed between a plurality of beams extending radially from the vertices of the outermost periphery of the honeycomb configuration to the outer peripheral portion.

[0134] According to this embodiment, the required support strength can be ensured and a larger opening area can be ensured in the vicinity of the outer peripheral portion of the diaphragm where the possibility of bending is low.

[0135] [A4] According to one embodiment, the anode is a plate-shaped member having a plurality of through-holes, and is disposed in close contact with the lower surface of the diaphragm, and the plating apparatus further includes a back panel spaced apart by a predetermined distance below the anode, and the amount of gas generated from the anode stagnating on the lower surface of the anode is adjusted by the back panel.

[0136] According to this aspect, the anode and the separator are in close contact with each other, and thus the height direction dimension of the anode holder assembly in which the anode and the separator are integrated can be suppressed, and the anode holder assembly can be configured compactly.

[0137] According to this aspect, the anode is in close contact with the separator, and thus the gas generated in the anode can be suppressed or prevented from accumulating between the separator and the anode, and the electric field between the anode and the substrate can be suppressed or prevented from being affected by the gas to affect the uniformity of the plating film thickness. In addition, the amount of gas remaining on the lower surface through the plurality of through holes of the anode can be adjusted by the back panel, and the anode voltage can be suppressed or prevented from fluctuating due to a large amount of gas simultaneously escaping from the lower surface of the anode. Thus, the film thickness uniformity of the plating film can be suppressed or prevented from decreasing.

[0138] [A5] According to one aspect, the above-described plating device further includes a variable anode cover disposed above the separator.

[0139] According to this aspect, the exposed area of the anode is adjusted by the variable anode cover, and thus the improvement in the film thickness uniformity of the plating film thickness can also be achieved.

[0140] [A6] A plating method is provided in which a substrate is plated with the plated surface facing downward, the plating method including the steps of: preparing a plating bath having an anode facing the substrate, a separator disposed between the substrate and the anode, and a separator support portion pressing the upper surface of the separator and having a plurality of first-shaped openings and a plurality of second-shaped openings disposed outside the plurality of first-shaped openings; and rotating the substrate and plating the substrate while the center of rotation of the substrate is eccentric from the center of the circumscribed circle of the plurality of first-shaped openings of the separator support member.

[0141] According to this aspect, the center of the pattern of the separator support portion is eccentric from the center of rotation / rotation axis of the substrate, and thus the shape of the pattern of the plating film transferred to the separator support portion can be suppressed, and the film thickness uniformity of the plating film can be improved.

[0142] The above-described embodiments of the application are described for the purpose of facilitating understanding of the application, and are not intended to limit the application. The application can be changed and modified without departing from the spirit thereof, and the application naturally includes equivalents thereof. In addition, any combination of the embodiments and modified examples, and any combination or omission of the respective components described in the claims and the specification can be made within the scope in which at least a part of the above-described problems can be solved, or at least a part of the effects can be exerted.

[0143] The entire disclosures of International Publication No. 2003 / 079684 (Patent Document 1), the specification, claims, drawings, and abstract of International Publication No. 2023 / 188371 are hereby incorporated by reference in their entirety.

[0144] Explanation of Reference Signs

[0145] 6...anode holder assembly; 10...plating tank; 11...upper tank; 12...lower tank; 12A...flange; 12B...opening; 12C...anolyte inlet; 12D...flange; 20...substrate holder; 30...paddle; 40...resistor; 50...septum; 51...seal press ring; 60...anode; 60A...boss; 62...anode fixing plate; 400...plating module; 610...anode holder; 613...bottom wall; 614-617...side wall; 614a...notch; 620...holder main body; 621...annular portion; 622...septum support portion; 622A...beam; 622B...beam; 623...flange; 640...front plate; 641...front plate main body; 642...frame member; 650...variable anode cover; 651...blade; 652...drive member; 660...busbar; 670...drive shaft; 671...link member; 680...catholyte inlet; 681...catholyte passage; 701-704...seal; 701A-704A...seal surface; 801-805...fastening member; 804A...spacer; 810...septum press; 1000...plating apparatus; Rm...circumscribed circle; Cm...center of circumscribed circle; Cw...rotation center (rotation center axis); Wf...substrate.

Claims

1. A plating apparatus wherein, Possessing: a plating bath for holding a plating solution; a substrate holder for holding a substrate with a plating surface facing downward; and an anode holder assembly that is detachably installed in the plating bath in a horizontal direction via an opening of a side wall of the plating bath and has an anode holder having one or more openings in a central portion, an anode installed in the anode holder, and a diaphragm installed in the anode holder above the anode, the anode holder assembly has one or more sealing surfaces that seal the inside of the plating bath from the outside and one or more sealing surfaces that divide the inside of the plating bath into upper and lower chambers.

2. The plating apparatus according to claim 1, wherein the one or more sealing surfaces that divide the inside of the plating bath into upper and lower chambers have a first sealing surface that seals between the diaphragm and the anode holder and a second sealing surface that seals between an outer peripheral portion of the anode holder and the plating bath.

3. The plating apparatus according to claim 2, wherein the diaphragm is installed in the outer peripheral portion of the anode holder via a first sealing member, and the first sealing surface is formed between the outer peripheral portion of the diaphragm and the outer peripheral portion of the anode holder.

4. The plating apparatus according to claim 2, wherein the plating bath has a first flange having a lower surface that is exposed to a space inside the plating bath, the anode holder has a second flange provided to an upper portion of an outer peripheral portion, the anode holder is installed in the lower surface of the first flange of the plating bath via a ring-shaped second sealing member on an upper surface of the second flange, and the second sealing surface is formed between the upper surface of the second flange of the anode holder and the lower surface of the first flange of the plating bath.

5. The plating apparatus according to claim 4, wherein the second flange of the anode holder is installed in the first flange of the plating bath by one or more fastening members, and the second sealing member is configured to elastically deform between the first flange and the second flange by fastening the fastening members.

6. The plating apparatus according to any one of claims 1 to 5, wherein the one or more sealing surfaces that seal the inside of the plating bath from the outside have a third sealing surface that seals between the anode holder and a periphery of the opening of the plating bath.

7. The plating apparatus according to claim 6, wherein the anode holder has a front plate provided to one end side and blocking the opening of the plating bath, the front plate having a front plate main body and a frame member that is fitted to the front plate main body so as to be slidable therearound, the frame member is installed in a side wall of the periphery of the opening of the plating bath or a third flange provided to the periphery of the opening of the plating bath via a third sealing member, and the third sealing surface is formed between the frame member and the side wall of the periphery of the opening of the plating bath or the third flange provided to the periphery of the opening of the plating bath. ​ The frame member is fitted to the front plate body via a fourth seal member, and a fourth seal surface is formed between an inner peripheral surface of the frame member and an outer peripheral surface of the front plate body.

8. The plating apparatus according to claim 7, wherein The frame member is installed to a side wall around the opening of the plating bath or the third flange provided around the opening of the plating bath by one or more fastening members, and the third seal member is configured to be elastically deformed between the frame member and the side wall or the third flange by fastening the fastening members.

9. The plating apparatus according to claim 7, wherein The fourth seal member is configured to be elastically deformed between the frame member and the front plate body by the frame member being fitted to the front plate body.

10. The plating apparatus according to any one of claims 1 to 5, wherein The anode holder has an outer peripheral portion and a diaphragm support portion having a plurality of openings on an inner side of the outer peripheral portion and supporting an upper surface of the diaphragm.

11. The plating apparatus according to claim 10, wherein The plurality of openings of the diaphragm support portion have a plurality of first-shaped openings and a plurality of second-shaped openings disposed on an outer side of the plurality of first-shaped openings, A center of a circumscribed circle including the plurality of first-shaped openings is eccentric from a rotation center of the substrate holder.

12. The plating apparatus according to claim 11, wherein The configuration constituted by the plurality of first-shaped openings is a honeycomb configuration.

13. The plating apparatus according to claim 12, wherein The plurality of second-shaped openings are formed between a plurality of beams extending in a radial manner from apexes of an outermost periphery of the honeycomb configuration to the outer peripheral portion.

14. The plating apparatus according to claim 10, wherein The anode is a plate-shaped member having a plurality of through-holes and is disposed in close contact with a lower surface of the diaphragm, The plating apparatus further has a back plate spaced apart by a prescribed distance below the anode, An amount of gas generated from the anode stagnating on the lower surface of the anode is adjusted by the back plate.

15. The plating apparatus according to any one of claims 1 to 5, wherein The anode holder has a catholyte inlet for supplying a plating solution as a catholyte to the cathode chamber.

16. The plating apparatus according to claim 15, wherein The catholyte inlet is disposed at a position lower than the diaphragm, A catholyte passage is provided in the anode holder, the catholyte passage having an inlet communicating with the catholyte inlet lower than the diaphragm and an outlet opening above the diaphragm.

17. The plating apparatus according to any one of claims 1 to 5, wherein The plating apparatus further has a variable anode cover disposed above the diaphragm.

18. A method of dividing a plating tank into an anode chamber and a cathode chamber, wherein, including the following steps: An anode holder is prepared, the anode holder having an anode and a diaphragm installed therein and having one or more seal surfaces sealing the inside of the plating bath from the outside and one or more seal surfaces dividing the inside of the plating bath into upper and lower chambers; and and The anode holder is installed to the plating bath through an opening of a sidewall of the plating bath, the plating bath is sealed from the outside with the anode holder blocking the opening of the plating bath, and the plating bath is divided into the anode chamber and the cathode chamber by the diaphragm.

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