Photosensitive composition, cured product, display device, and method for producing cured product

Abstract

The photosensitive composition according to the present invention can have both excellent sensitivity during exposure and suppression of residue after development. In addition, a cured product provided in a display device having excellent reliability and luminance of a light-emitting element can be provided. The present invention is a photosensitive composition containing (A) a binder resin and (C) a photosensitizer, the photosensitive composition further containing at least one component selected from the group consisting of a chlorine element-containing component, a bromine element-containing component, a chloride ion-containing component, and a bromide ion-containing component, and the photosensitive composition further containing water, and the following conditions (1) and (3) are also satisfied. (1) The total content of chlorine element and bromine element in the total solid content of the photosensitive composition is 0.0010-1,000 mass ppm, and / or the total content of chloride ions and bromide ions in the total solid content of the photosensitive composition is 0.0010-1,000 mass ppm. And (3) the content of water in the photosensitive composition is 0.010 to 3.0 mass%.

Description

Technical Field

[0001] The present invention relates to a photosensitive composition, a cured product, a display device, and a method for producing the cured product. Background Art

[0002] In recent years, in thin displays such as smartphones, technologies related to organic electroluminescent (hereinafter referred to as "organic EL") displays, quantum dot displays or micro light-emitting diode (hereinafter referred to as "LED") displays are being widely studied. For example, the pixel segmentation layer of the organic EL display is formed by photolithography. In order to reduce the process time in the manufacture of the organic EL display, the material used is required to have high sensitivity during exposure. In addition, it is also necessary to simultaneously suppress the development residue when forming a positive or negative pattern using photolithography. In addition, since the pixel segmentation layer and the thin-layer transistor (hereinafter referred to as "TFT") planarization layer are formed adjacent to or close to the light-emitting element, outgassing from these layers will cause the life of the light-emitting element to be reduced. Therefore, in order to achieve high durability of the organic EL display, it is necessary to improve the reliability of the light-emitting element through the composition of the pixel segmentation layer, the heat resistance of the material used, and other physical properties.

[0003] Furthermore, Micro LED displays are expected to be used not only in televisions and smartphones, but also in new applications such as digital signage, AR, VR, and transparent displays. In Micro LED displays, light from the LEDs, which serve as light sources, is emitted in all directions. Therefore, if light is absorbed by surrounding components such as insulating layers, protective layers, and partitions, light extraction efficiency decreases. Therefore, there is a demand for improving brightness through the composition of insulating layers, protective layers, and partitions, as well as the physical properties of the materials used.

[0004] Examples of the photosensitive composition include positive-type photosensitive compositions containing polyimide as a resin (see, for example, Patent Document 1) and positive-type photosensitive compositions containing polysiloxane as a resin (see, for example, Patent Document 2).

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Laid-Open No. 2002-091343

[0008] Patent Document 2: Japanese Patent Application Laid-Open No. 2006-178436 Summary of the Invention

[0009] Problems to be solved by the invention

[0010] However, the composition described in Patent Literature 1 or Patent Literature 2 has a problem in terms of both sensitivity at the time of exposure, inhibition of residue after development, reliability of a light-emitting element, and luminance of light emission. Therefore, it is desired to further improve the properties of the photosensitive composition. An object of the present application is to provide a cured product of a display device that has both excellent sensitivity at the time of exposure and inhibition of residue after development, and that has excellent reliability of a light-emitting element and luminance of light emission. Another object of the present application is to provide a display device that has excellent reliability of a light-emitting element and luminance of light emission.

[0011] Means for solving the problem

[0012] In order to solve the above-mentioned problems, the photosensitive composition and the display device of the present application have the following configurations [1] to

[22] .

[0013] [1] A photosensitive composition, which is a photosensitive composition containing (A) a binder resin and (C) a photosensitive agent, wherein

[0014] the photosensitive composition further contains one or more components selected from the group consisting of a component containing a chlorine element, a component containing a bromine element, a component containing a chloride ion, and a component containing a bromide ion,

[0015] the photosensitive composition further contains water,

[0016] the photosensitive composition further satisfies the following conditions (1) and (3).

[0017] (1) the total content of the chlorine element and the bromine element in the total solid content of the photosensitive composition is 0.0010 to 1,000 mass ppm, and / or the total content of the chloride ion and the bromide ion in the total solid content of the photosensitive composition is 0.0010 to 1,000 mass ppm

[0018] (3) the content of water in the photosensitive composition is 0.010 to 3.0 mass%.

[0019] [2] The photosensitive composition described in the aforementioned [1], which further satisfies the following condition (2).

[0020] (2) the total content of the chlorine element and the bromine element in the total solid content of the photosensitive composition is 0.0010 to 1,000 mass ppm, and the total content of the chloride ion and the bromide ion in the total solid content of the photosensitive composition is 0.0010 to 1,000 mass ppm.

[0021] [3] The photosensitive composition according to any one of the preceding [1] to [2], which contains one or more selected from the group consisting of sulfate ions, sulfite ions, nitrate ions, nitrite ions, phosphate ions, phosphite ions, hypophosphite ions, formate ions, acetate ions, and oxalate ions, and satisfies the following condition (4);

[0022] and / or

[0023] contains one or more selected from the group consisting of phosphates, phosphonic acids, phosphonates, phosphites, hypophosphorous acids, and hypophosphites, and satisfies the following condition (5).

[0024] (4) The total content of sulfate ions, sulfite ions, nitrate ions, nitrite ions, phosphate ions, phosphite ions, hypophosphite ions, formate ions, acetate ions, and oxalate ions in the total solid content of the photosensitive composition is 0.0010 to 30,000 mass ppm.

[0025] (5) The total content of phosphates, phosphonic acids, phosphonates, phosphites, hypophosphorous acids, and hypophosphites in the total solid content of the photosensitive composition is 0.0010 to 30,000 mass ppm.

[0026] [4] The photosensitive composition according to any one of the preceding [1] to [3], which further contains a tertiary amine compound and / or a quaternary ammonium ion, and satisfies the following condition (6).

[0027] (6) The total content of the tertiary amine compound and the quaternary ammonium ion in the total solid content of the photosensitive composition is 0.0010 to 50,000 mass ppm.

[0028] [5] The photosensitive composition according to any one of the preceding [1] to [4], which further contains one or more selected from the group consisting of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, (2-methoxy-1-propyl) acetate, (2-ethoxy-1-propyl) acetate, methyl allyl methyl ether, and methyl allyl ethyl ether,

[0029] and satisfies the following condition (9a).

[0030] (9a) The total content of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, (2-methoxy-1-propyl) acetate, (2-ethoxy-1-propyl) acetate, methyl allyl methyl ether, and methyl allyl ethyl ether in the photosensitive composition is 0.0010 to 1,000 mass ppm.

[0031] [6] The photosensitive composition according to any one of the preceding [1] to [5], further containing one or more selected from the group consisting of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, (2-methoxy-1-propyl) acetate, (2-ethoxy-1-propyl) acetate, methyl allyl methyl ether, and methyl allyl ethyl ether,

[0032] and satisfies the following (9b).

[0033] (9b) The total content of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, (2-methoxy-1-propyl) acetate, (2-ethoxy-1-propyl) acetate, methyl allyl methyl ether, and methyl allyl ethyl ether in the photosensitive composition exceeds 1,000 mass ppm and is 10,000 mass ppm or less.

[0034] [7] A photosensitive composition, which is a photosensitive composition containing (A) a binder resin and (C) a photosensitive agent, wherein

[0035] The (A) binder resin contains (Al) a weak acid group-containing resin, the (Al) weak acid group-containing resin containing one or more selected from the group consisting of (Alx-2) resin: polyimide, (Alx-3) resin: polyimide precursor, (Alx-4) resin: polybenzoxazole, (Alx-5) resin: polybenzoxazole precursor, (Alx-6) resin: polyamide-imide, (Alx-7) resin: polyamide-imide precursor, and (Alx-8) resin: polyamide,

[0036] The photosensitive composition further contains one or more selected from the group consisting of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, (2-methoxy-1-propyl) acetate, (2-ethoxy-1-propyl) acetate, methyl allyl methyl ether, and methyl allyl ethyl ether,

[0037] and satisfies the following (9c).

[0038] (9c) The total content of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, (2-methoxy-1-propyl) acetate, (2-ethoxy-1-propyl) acetate, methyl allyl methyl ether, and methyl allyl ethyl ether in the photosensitive composition is 0.0010 to 10,000 mass ppm.

[0039] [8] The photosensitive composition according to any one of the preceding [1] to [7], further containing one or more selected from the group consisting of an amide compound represented by General Formula (21), a cyclic urea compound represented by General Formula (22), a urea compound represented by General Formula (23), an oxazolidinone compound represented by General Formula (24), and an isoxazolidinone compound represented by General Formula (25), and satisfying the following condition (12).

[0040] (12) The total content of the amide compound represented by General Formula (21), the cyclic urea compound represented by General Formula (22), the urea compound represented by General Formula (23), the oxazolidinone compound represented by General Formula (24), and the isoxazolidinone compound represented by General Formula (25) in the total solid content of the photosensitive composition is 0.010 mass% or more and 5.0 mass% or less.

[0041] [Chemical Formula 1]

[0042]

[0043] In General Formulas (21) to (25), R 47 ~R 56 each independently represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, or a hydroxyalkyl group having 1 to 6 carbon atoms. R 130 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a hydroxyalkyl group having 1 to 6 carbon atoms, a hydroxyalkoxy group having 1 to 6 carbon atoms, a hydroxy group, an amino group, a monoalkylamino group having 1 to 6 carbon atoms, or a dialkylamino group having 2 to 12 carbon atoms. R 132 , R 133 , and R 137 ~R 142 each independently represents an alkyl group having 1 to 6 carbon atoms. β and γ each independently represent an integer of 0 to 6. b, c, h, i, j, k, 1, and m each independently represent an integer of 0 to 2. In the case where β is 0, b is 0. In the case where γ is 0, c is 0.

[0044] [9] The photosensitive composition according to any one of the preceding [1] to [8], wherein the aforementioned (A) binder resin satisfies the following (P1a) condition.

[0045] (P1a) The content of fluorine element in the structure of the (A) binder resin is 10,000 mass ppm or less.

[0046]

[10] The photosensitive composition according to any one of the preceding [1] to [9], satisfying the following (1a) condition.

[0047] (1a) The content of fluorine element in the total solid content of the photosensitive composition is 1,000 mass ppm or less.

[0048]

[11] The photosensitive composition according to any one of the preceding [1] to

[10] , wherein the aforementioned (A) binder resin contains (Al) a weak acid group-containing resin,

[0049] The (Al) weak acid group-containing resin has one or more groups selected from the group consisting of phenolic hydroxyl group, hydroxyl imide group, hydroxyl amide group, silanol group, 1,1-bis(trifluoromethyl)hydroxymethyl group, and mercapto group as a (WA) weak acid group.

[0050]

[12] The photosensitive composition according to the preceding

[11] , wherein the aforementioned (Al) weak acid group-containing resin contains (Alx-1) a resin: polysiloxane.

[0051]

[13] The photosensitive composition according to the preceding

[12] , wherein, when a diluted solution is prepared by diluting the aforementioned photosensitive composition with water, the solid content concentration of the diluted solution being 1 / 100 times the solid content concentration of the photosensitive composition, the hydrogen ion exponent of the diluted solution is 5.5 or more and 7.0 or less.

[0052]

[14] The photosensitive composition according to any one of the preceding [1] to [6] and [8] to

[11] , wherein the aforementioned (A) binder resin contains (Al) a weak acid group-containing resin, the (Al) weak acid group-containing resin containing one or more selected from the group consisting of (Alx-2) a resin: polyimide, (Alx-3) a resin: polyimide precursor, (Alx-4) a resin: polybenzoxazole, (Alx-5) a resin: polybenzoxazole precursor, (Alx-6) a resin: polyamide-imide, (Alx-7) a resin: polyamide-imide precursor, and (Alx-8) a resin: polyamide.

[0053]

[15] The photosensitive composition according to any one of the preceding [1] to

[11] and

[14] , wherein the aforementioned (A) binder resin contains (Al) a weak acid group-containing resin, the (Al) weak acid group-containing resin containing one or more selected from the group consisting of (Alx-2) a resin: polyimide, (Alx-3) a resin: polyimide precursor, (Alx-4) a resin: polybenzoxazole, (Alx-5) a resin: polybenzoxazole precursor, (Alx-6) a resin: polyamide-imide, (Alx-7) a resin: polyamide-imide precursor, and (Alx-8) a resin: polyamide (hereinafter referred to as "polyimide-based resin having a weak acid group").

[0054] The polyimide-based resin having a weakly acidic group has (DA1) a first amine residue: an amine residue having a phenolic hydroxyl group, the (DA1) first amine residue having at least two (Ia) structures: cyclic structures having a phenolic hydroxyl group, the (DA1) first amine residue further having (IIa) a structure: a structure linking at least two of the (Ia) structures.

[0055]

[16] The photosensitive composition according to any one of the preceding [1] to

[15] , further containing one or more selected from the group consisting of 1-methoxy-2-propanol, 1-ethoxy-2-propanol, methyl acetate, ethyl acetate, allyl methyl ether, allyl ethyl ether, isopropenyl methyl ether, and isopropenyl ethyl ether,

[0056] and satisfies the following (8).

[0057] (8) The total content of 1-methoxy-2-propanol, 1-ethoxy-2-propanol, methyl acetate, ethyl acetate, allyl methyl ether, allyl ethyl ether, isopropenyl methyl ether, and isopropenyl ethyl ether in the photosensitive composition is 0.0010 to 30,000 mass ppm.

[0058]

[17] The photosensitive composition according to any one of the preceding [1] to

[16] , wherein the aforementioned (C) photosensitive agent contains (C1) a naphthoquinone diazide compound,

[0059] The photosensitive composition further contains one or more selected from the group consisting of N-methylpyrrolidone, N-ethylpyrrolidone, 1,4-dioxane, and tetrahydrofuran, and satisfies the following (11).

[0060] (11) The total content of N-methylpyrrolidone, N-ethylpyrrolidone, 1,4-dioxane, and tetrahydrofuran in the photosensitive composition is 0.0010 to 1,000 mass ppm.

[0061]

[18] The photosensitive composition according to any one of the preceding [1] to

[17] , which is used for forming a barrier layer formed between adjacent light emitting elements or a planarization layer formed so as to cover at least a part of a light emitting element in a Micro LED display or a Mini LED display.

[0062]

[19] A cured product obtained by curing the photosensitive composition according to any one of the preceding [1] to

[18] .

[0063]

[20] A display device provided with the cured product according to the preceding

[19] .

[0064]

[21] A method for producing a cured product, comprising:

[0065] (1) a step of forming a coating film of the photosensitive composition described in any one of the aforementioned [1] to

[18] on a substrate;

[0066] (2) a step of irradiating the coating film of the aforementioned photosensitive composition with active chemical rays through a photomask;

[0067] (3) a step of forming a pattern of the aforementioned photosensitive composition by developing using a developing solution; and

[0068] (4) a step of obtaining a cured pattern of the aforementioned photosensitive composition by heating the aforementioned pattern.

[0069]

[22] A display device having a substrate, a rewiring layer, an interlayer insulating layer of the rewiring layer, and a light emitting element, and further having a partition layer and / or a planarization layer, wherein

[0070] the light emitting element is a semiconductor chip, and

[0071] the area of the rewiring layer is larger than the area of the light emitting element in plan view,

[0072] the partition layer is formed between adjacent light emitting elements,

[0073] the planarization layer is formed so as to cover at least a portion of the light emitting element,

[0074] the partition layer and / or the planarization layer contain one or more components selected from the group consisting of a component containing a chlorine element, a component containing a bromine element, a component containing a chloride ion, and a component containing a bromide ion, and satisfy the following (X1a) and / or (X1b).

[0075] (X1a) the total content of chlorine element and bromine element in the partition layer is 0.0010 to 1,000 mass ppm, and / or the total content of chloride ion and bromide ion in the partition layer is 0.0010 to 1,000 mass ppm

[0076] (X1b) the total content of chlorine element and bromine element in the planarization layer is 0.0010 to 1,000 mass ppm, and / or the total content of chloride ion and bromide ion in the planarization layer is 0.0010 to 1,000 mass ppm.

[0077] Effects of the Invention

[0078] The photosensitive composition of the present invention can achieve both excellent sensitivity during exposure and reduced residue after development. Furthermore, it can provide a cured product for use in a display device with excellent light-emitting element reliability and luminous brightness. Furthermore, the display device of the present invention can provide a display device with excellent light-emitting element reliability and luminous brightness. BRIEF DESCRIPTION OF THE DRAWINGS

[0079] [ Figure 1 ] is a schematic cross-sectional view of a Micro LED display having a partition layer and a planarization layer.

[0080] [ Figure 2 ] is a schematic cross-sectional view of another type of Micro LED display having a partition layer and a planarization layer.

[0081] [ Figure 3 ] are a schematic cross-sectional view and a top view showing an example of a display device 100A in which a pixel division layer has a stepped shape including a thick film portion and a thin film portion.

[0082] [ Figure 4 ] is a plan view showing a manufacturing process of steps 1 to 4 of a substrate of an organic EL display used for evaluating luminescent characteristics. DETAILED DESCRIPTION

[0083] Hereinafter, the photosensitive compositions according to the first embodiment, the second embodiment, and the third embodiment of the present invention will be described. However, the present invention is not limited to the following embodiments, and various modifications are permitted as long as the purpose of the invention is achieved and the scope does not exceed the gist of the invention. It should be noted that when the description is made as the photosensitive composition of the present invention, the description is related to the photosensitive composition according to the first embodiment, the second embodiment, and the third embodiment of the present invention. On the other hand, when describing a photosensitive composition of a specific embodiment, it is described as the photosensitive composition according to the first embodiment, etc. It should be noted that the main chain of the resin refers to the chain with the longest chain length among the chains constituting the resin containing the structural unit. The so-called side chain of the resin refers to a chain in the chain constituting the resin containing the structural unit that is branched from the main chain or bonded to the main chain and has a shorter chain length than the main chain. The end of the resin refers to a structure that blocks the main chain, for example, a structure derived from a blocking agent, etc.

[0084] <Photosensitive composition>

[0085] The photosensitive composition of the first embodiment of the present invention has the configuration of [1] above. By adopting the configuration of [1] above, the photosensitive composition of the first embodiment of the present invention can achieve both excellent sensitivity during exposure and reduced residue after development. In addition, it can provide a cured product included in a display device with excellent light-emitting element reliability and light-emitting brightness.

[0086] It is inferred that this is because, by containing a trace amount of the above-mentioned chlorine element-containing component, bromine element-containing component, chloride ion-containing component, or bromide ion-containing component in the photosensitive composition, thereby utilizing their anions, the anions from these components, the protons in the photosensitive composition are locally activated. Therefore, it is considered that the effect of promoting dissolution in the developer is utilized, thereby achieving excellent sensitivity at the time of exposure and suppression of post-development residue. In addition, it is also considered that because the surface of the substrate is surface-modified by these components, the effect of suppressing post-development residue is achieved by preventing the attachment of residue at the opening portion.

[0087] Furthermore, it is considered that by containing a specific amount of water in the photosensitive composition, thereby utilizing the hydrogen bond of the water molecules, the stability of their anions, the anions from these components in the photosensitive composition is improved, which contributes to achieving the effect of excellent sensitivity at the time of exposure and suppression of post-development residue.

[0088] In addition, it is considered that by intentionally containing a trace amount of the above-mentioned components, the polarization structure, charge balance in the cured product is controlled. As a result, it is inferred that ion migration, electromigration caused by metal impurities, ion impurities that adversely affect the light emission characteristics are suppressed, and by suppressing the migration, aggregation of metals in the electrode, wiring, the effect of excellent reliability of the light emitting element is achieved. Furthermore, it is inferred that when a pattern of the photosensitive composition is formed on the metal or the like wiring, the surface of the wiring that becomes the opening portion or the surface of the wiring that interfaces with the pattern is surface-modified by the above-mentioned components contained in a trace amount in the photosensitive composition. In addition, it is considered that the wiring surface is also surface-modified by the migration of these components contained in the cured product. As a result, it is considered that the conductivity of the metal or the like wiring can be controlled, and the effect of low-voltage driving, thereby achieving high light emission brightness, is achieved.

[0089] The photosensitive composition of the second aspect of the present application has the above-mentioned [7]. By being configured as the above-mentioned [7], the photosensitive composition of the second aspect of the present application can achieve both excellent sensitivity at the time of exposure and suppression of post-development residue. Furthermore, it is possible to provide a cured product that is provided in a display device in which the reliability of the light emitting element and the light emission brightness are excellent.

[0090] It is inferred that this is because, by containing a trace amount of the above-mentioned chlorine element-containing component, bromine element-containing component, chloride ion-containing component, or bromide ion-containing component in the photosensitive composition, thereby utilizing their anions, the anions from these components, the protons in the photosensitive composition are locally activated. Therefore, it is considered that the effect of promoting dissolution in the developer is utilized, thereby achieving excellent sensitivity at the time of exposure and suppression of post-development residue. In addition, it is also considered that because the surface of the substrate is surface-modified by these components, the effect of suppressing post-development residue is achieved by preventing the attachment of residue at the opening portion.

[0091] In addition, it is considered that by intentionally containing a trace amount of the following-described second specific compound, the polarization structure and charge balance in the cured product are controlled by utilizing the interaction with the following-described polyimide-based resin having a weakly acidic group. As a result, it is inferred that ion migration and electromigration caused by metal impurities and ionic impurities that adversely affect the light emission characteristics are inhibited, and excellent reliability of the light emitting element is achieved by migration inhibition and aggregation inhibition of the metal in the electrode and wiring. Furthermore, it is inferred that when a pattern of the photosensitive composition is formed on the wiring of metal or the like, the wiring surface that becomes an opening portion or the wiring surface that interfaces with the pattern is surface-modified by the above-described compound in the photosensitive composition. In addition, it is considered that together with the following-described polyimide-based resin having a weakly acidic group, the polar structure in the compound contained in the cured product captures a trace amount of metal impurities and ionic impurities in the cured product, and these impurities migrate to the wiring surface, thereby functioning as carriers in the wiring. As a result, it is considered that the electrical conductivity of the wiring of metal or the like can be controlled, and the effect of low-voltage driving and thus high light emission brightness can be achieved.

[0092] The photosensitive composition of the third aspect of the present application is a photosensitive composition containing (A) a binder resin and (C) a photosensitive agent, and further containing (AS) a silicone resin having a trifunctional organosilane unit represented by General Formula (11) and / or a tetrafunctional organosilane unit represented by General Formula (12) at a total content ratio of 90 to 100 mol% (mole %) in the (AS) silicone resin.

[0093] [Chemical Formula 2]

[0094]

[0095] In General Formula (11) and General Formula (12), R 66 represents an alkyl group having 1 to 6 carbon atoms. 3 Each independently represents a bonding point in the resin. The above-described substituent and structure can have a heteroatom, and can be any of an unsubstituted or substituted one.

[0096] By being configured as described above, the photosensitive composition of the third aspect of the present application can exhibit excellent sensitivity at the time of exposure, suppression of residue after development, and excellent storage stability. Furthermore, a cured product that is provided in a display device that exhibits excellent luminance can be provided. It is believed that this is because, by including the (AS) silicone resin having the specific organosilane unit described above in the photosensitive composition, the effect of excellent sensitivity at the time of exposure and suppression of residue after development is achieved by the action of promoting dissolution in a developing solution by the silanol group in the resin. In addition, it is also believed that the effect of suppressing residue after development is achieved by preventing the attachment of residue at the opening portion due to the surface modification of the substrate surface by the resin.

[0097] In addition, it is believed that, by including the resin described above in the photosensitive composition, the polar group possessed by other resins in the photosensitive composition becomes stable by the interaction via hydrogen bonding by the silanol group in the resin. In particular, in the case where a polysiloxane is included in the photosensitive composition, the stabilization of the silanol group in the polysiloxane is suitable. Furthermore, it is believed that, by the coordination bond based on π electrons between the silicon atom having a 3d orbital, which is a vacant atomic orbital, in the resin and the aromatic ring possessed by other resins in the photosensitive composition, the polarized structure and charge balance in the photosensitive composition can be controlled. As a result, it is inferred that the effect of excellent storage stability is achieved. Furthermore, it is inferred that, when a pattern of the photosensitive composition is formed on a wiring such as a metal, the surface of the wiring that becomes the opening portion or the surface of the wiring that interfaces with the pattern is surface-modified by the resin due to the resin described above in the photosensitive composition. In addition, it is believed that the silanol group in the resin included in the cured product captures trace amounts of metal impurities and ionic impurities in the cured product, and these impurities migrate to the surface of the wiring, thereby functioning as carriers in the wiring. As a result, it is believed that the conductivity of the wiring such as a metal can be controlled, and the effect of low-voltage driving, thereby achieving high luminance, is achieved.

[0098] <(A) Binder Resin>

[0099] The photosensitive composition of the present application contains (A) a binder resin. The (A) binder resin is a resin having heat resistance that remains at least partially in a cured product obtained by curing the composition. The (A) binder resin is preferably a resin that forms a crosslinked structure by reaction and is cured. The reaction is not particularly limited and can be a reaction based on heating, a reaction based on the irradiation of energy rays, or the like, and a crosslinked structure can also be formed using the (F) crosslinking agent described later. The (A) binder resin is preferably a thermosetting resin.

[0100] (A) The binder resin is preferably an alkali-soluble resin having an acidic group or an organic solvent-soluble resin having an organic solvent-soluble structure. The binder resin is preferably a resin having solubility for forming a positive or negative pattern by imparting photosensitivity to the composition using the (C) photosensitive agent described later.

[0101] (A) The binder resin more preferably has an acidic group in the structural unit of the resin. From the viewpoint of the pattern processability using an alkali developer, the acidic group is preferably a phenolic hydroxyl group, a hydroxyl imide group, a hydroxyl amide group, a silanol group, a 1,1-bis(trifluoromethyl)hydroxymethyl group, a mercapto group, a carboxyl group, a carboxylic anhydride group, or a sulfonic acid group, and further from the viewpoint of improving the sensitivity at the time of exposure and suppressing the residue after development, a carboxyl group, a carboxylic anhydride group, or a sulfonic acid group is more preferable.

[0102] (A) The binder resin preferably has a radical polymerizable group, and more preferably has a radical polymerizable group in the structural unit of the resin. The radical polymerizable group preferably has an ethylenically unsaturated double bond group, and more preferably is a photoreactive group, an alkenyl group having 2 to 5 carbon atoms, or an alkynyl group having 2 to 5 carbon atoms. The photoreactive group is preferably a styryl group, a cinnamoyl group, a maleimide group, a nadimide group, or a (meth)acryloyl group, and from the viewpoint of improving the sensitivity at the time of exposure, a (meth)acryloyl group is more preferable. On the other hand, the alkenyl group having 2 to 5 carbon atoms or the alkynyl group having 2 to 5 carbon atoms is preferably a vinyl group, an allyl group, a 2-methyl-2-propenyl group, a crotonoyl group, a 2-methyl-2-butenyl group, a 3-methyl-2-butenyl group, a 2,3-dimethyl-2-butenyl group, an ethynyl group, or a 2-propargyl group, and from the viewpoint of improving the sensitivity at the time of exposure, a vinyl group or an allyl group is more preferable.

[0103] <(A1) Resin and (A2) Resin>

[0104] (A) The binder resin preferably contains the (Al) resin having a weakly acidic group and / or the (A2) resin having no weakly acidic group. In the case of the photosensitive composition according to the second aspect of the present application, the (A) binder resin contains the (Al) resin having a weakly acidic group. In the case of the photosensitive composition according to the first aspect and the third aspect of the present application, the (A) binder resin preferably contains the (Al) resin having a weakly acidic group.

[0105] From the viewpoint of improving sensitivity at the time of exposure, the (A) binder resin preferably contains (A1) a weak acid group-containing resin having one or more kinds of groups selected from the group consisting of a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, a 1,1-bis(trifluoromethyl)hydroxymethyl group, and a mercapto group as the (WA) weak acid group, and more preferably has the (WA) weak acid group in a structural unit of the resin. Hereinafter, these groups are sometimes collectively referred to as the "(WA) weak acid group". By the (WA) weak acid group in the structural unit of the resin, the (WA) weak acid group is meant to be in a repeating unit of the resin. In such a case, the resin has at least two (WA) weak acid groups. In addition, the (WA) weak acid group outside the structural unit of the resin, for example, a case where the (WA) weak acid group is at a terminal of the resin, a case where the (WA) weak acid group is in only one structural unit (not repeating). From the viewpoint of improving sensitivity at the time of exposure and suppressing residue after development, the (WA) weak acid group is preferably a phenolic hydroxyl group, a silanol group, or a 1,1-bis(trifluoromethyl)hydroxymethyl group (hereinafter referred to as a "particular (WA) weak acid group"). Note that, in the case where the (A) binder resin satisfies the conditions of the following (P1a) and / or (P2a) described later, or in the case where the photosensitive composition of the present application satisfies the conditions of the following (1a) and / or (2a) described later, the acid group possessed by the (A) binder resin is preferably a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, a mercapto group, a carboxyl group, a carboxylic anhydride group, or a sulfonic acid group, and the (WA) weak acid group is preferably one or more kinds of groups selected from the group consisting of a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, and a mercapto group.

[0106] In the case of the above-described (A1) weak acid group-containing resin, the solubility of the exposed portion is improved by the moderate acidity of the (WA) weak acid group and the interaction with the (C) photosensitive agent described later, and thus the effect of improving the sensitivity at the time of exposure becomes remarkable. The particular (WA) weak acid group among the (WA) weak acid groups makes the effect of suppressing residue after development remarkable by the alkali solubility promotion. In addition, in the case where the composition has positive photosensitivity, the particular (WA) weak acid group among the (WA) weak acid groups can improve the solubility contrast between the exposed portion and the unexposed portion by the strong interaction with the (C) photosensitive agent, and also improve the solubility promotion of the exposed portion, and thus the effects of improving the sensitivity at the time of exposure and suppressing residue after development become remarkable.

[0107] From the viewpoint of inhibiting post-development residue, the (A) binder resin preferably contains (A2) a resin having no weakly acidic group. The (A2) resin having no weakly acidic group preferably has an acidic group different from the (WA) weakly acidic group, more preferably has an acidic group different from the (WA) weakly acidic group in a structural unit of the resin. From the viewpoint of improving sensitivity at the time of exposure and inhibiting post-development residue, the acidic group different from the (WA) weakly acidic group is more preferably a carboxyl group, a carboxylic anhydride group, or a sulfonic acid group.

[0108] From the viewpoint of improving sensitivity at the time of exposure, preferably, the (A) binder resin contains (A1) a resin containing a weakly acidic group, and the (A1) resin containing a weakly acidic group has a radically polymerizable group. Examples and preferences related to the radically polymerizable group are as described above in the description of the (A) binder resin.

[0109] The (A) binder resin preferably contains (A1) a resin containing a weakly acidic group and / or (A2) a resin having no weakly acidic group, the (A1) resin containing a weakly acidic group contains (A1x) a resin having one or more kinds selected from the group consisting of an imide structure, an amide structure, an oxazole structure, and a siloxane structure (hereinafter referred to as "an imide structure or the like") in a structural unit of the resin, and / or (A1y) a resin having a phenolic hydroxyl group in a structural unit of the resin, and the (A2) resin having no weakly acidic group contains (A2x) a resin having a radically polymerizable group and / or (A2y) a resin having no radically polymerizable group.

[0110] From the viewpoint of improving sensitivity at the time of exposure and inhibiting post-development residue, the (A) binder resin preferably contains (A1) a resin containing a weakly acidic group and (A2) a resin having no weakly acidic group.

[0111] Note that, in the case of the (A1x) resin, the (A1y) resin, the (A2x) resin, and the (A2y) resin, in the case where each of these has a structure or a group that constitutes the other resin, the classification method shown in Table 1-1 below is used to classify into one kind. In the case where one kind of resin can belong to two or more of the (A1x) resin, the (A1y) resin, the (A2x) resin, and the (A2y) resin, the classification method is used to determine which kind of resin it belongs to.

[0112] [Table 1-1]

[0113] [Table 1-1]

[0114]

[0115] (A) The binder resin preferably contains (Alx) resin and / or (Al y) resin, more preferably (Alx) resin, and further preferably (Alx) resin and (Al y) resin. In addition, (A) the binder resin preferably contains (Alx) resin and / or (Al y) resin, and further contains (A2x) resin, more preferably (Alx) resin, (Al y) resin, and (A2x) resin. In addition, (A) the binder resin also preferably contains (Alx) resin, (Al y) resin, or (A2x) resin, and further contains (A2y) resin. In addition, from the viewpoint of improving the properties brought about by each resin, (A) the binder resin also preferably contains two or more selected from the group consisting of (Alx) resin, (Al y) resin, (A2x) resin, and (A2y) resin.

[0116] (A1x) Resin

[0117] In the case where the (A) binder resin contains the (Al) weak-acid-group-containing resin, from the viewpoint of improving the sensitivity at the time of exposure, improving the reliability of the light-emitting element, and improving the luminance of light emission, the (Al) weak-acid-group-containing resin preferably contains (Alx) resin. From the viewpoint of improving the sensitivity at the time of exposure, improving the reliability of the light-emitting element, and improving the luminance of light emission, (Alx) resin preferably contains one or more selected from the group consisting of (Alx-1) resin: polysiloxane, (Alx-2) resin: polyimide, (Alx-3) resin: polyimide precursor, (Alx-4) resin: polybenzoxazole, (Alx-5) resin: polybenzoxazole precursor, (Alx-6) resin: polyamide-imide, (Alx-7) resin: polyamide-imide precursor, (Alx-8) resin: polyamide, maleimide resin, maleimide-styrene resin, maleimide-triazine resin, maleimide-oxazine resin, and copolymers thereof, more preferably one or more selected from the group consisting of (Alx-1) resin, (Alx-2) resin, (Alx-3) resin, (Alx-4) resin, (Alx-5) resin, (Alx-6) resin, (Alx-7) resin, (Alx-8) resin, and copolymers thereof, and further preferably (Alx-1) resin. (Alx) resin can be any of a single resin or a copolymer thereof.

[0118] In the case where the (A) binder resin contains the (Al) weak-acid-group-containing resin, from the viewpoint of improving the sensitivity at the time of exposure, improving the reliability of the light-emitting element, and improving the luminance of light emission, the (Al) weak-acid-group-containing resin preferably contains polysiloxane as (Alx-1) resin.

[0119] It is inferred that the above-described (Alx) resin suppresses ion migration and electromigration by having an imide structure, an amide structure, an oxazole structure, or a siloxane structure in the structural units of the resin, and thus these structures capture metal impurities, ionic impurities, and the like that adversely affect the electrical insulation, and thus the reliability of the light-emitting element is improved. In addition, it is inferred that the light-emitting brightness is improved by controlling the conductivity of a metal wiring or the like using these structures.

[0120] On the other hand, from the viewpoint of improving the sensitivity at the time of exposure, suppressing the residue after development, and improving the reliability of the light-emitting element, the (A2x) resin and the (A2y) resin preferably contain one or more selected from the group consisting of a polyimide, a polyimide precursor, a polybenzoxazole, a polybenzoxazole precursor, a polyamide-imide, a polyamide-imide precursor, a polyamide, a maleimide resin, a maleimide-styrene resin, a maleimide-triazine resin, a maleimide-oxazine resin, and a copolymer thereof.

[0121] From the viewpoint of improving the sensitivity at the time of exposure and improving the reliability of the light-emitting element, the (Alx) resin preferably has a radical polymerizable group. Examples and preferable embodiments of the radical polymerizable group are described above in the description of the (A) binder resin. The radical polymerizable group is preferably obtained by reacting a part of a phenolic hydroxyl group and / or a carboxyl group possessed by the resin with a compound having a radical polymerizable group.

[0122] From the viewpoint of improving the sensitivity at the time of exposure, suppressing the residue after development, improving the reliability of the light-emitting element, and improving the light-emitting brightness, the (Alx) resin preferably contains an (Alx) resin having no radical polymerizable group and an (Alx) resin having a radical polymerizable group. It is considered that, by being configured as described above, the (Alx) resin having no radical polymerizable group suppresses the residue after development by the use of an acidic group or an organic solvent-soluble structure, and achieves the capturing ability of metal impurities, ionic impurities, and the like, the control of the conductivity of a metal wiring or the like, and the like, and on the other hand, the (Alx) resin having a radical polymerizable group achieves the improvement of the sensitivity at the time of exposure and the improvement of the cross-linking degree of the film due to the promotion of radical polymerization, and the like. As a result, the effect of improving the reliability of the light-emitting element by suppressing outgassing becomes remarkable. By such functional separation of the (Alx) resin, the effects of improving various characteristics become remarkable.

[0123] The acid equivalent of the (Alx) resin is preferably 200 g / mol or more from the viewpoint of improving sensitivity at the time of exposure. On the other hand, the acid equivalent of the (Alx) resin is preferably 600 g / mol or less from the viewpoint of suppressing residue after development. The exposure here refers to irradiation of active chemical rays (radiation), and examples thereof include irradiation of visible light, ultraviolet rays, electron beams, or X-rays. Hereinafter, the exposure refers to irradiation of active chemical rays (radiation). The double bond equivalent of the (Alx) resin is preferably 200 g / mol or more from the viewpoint of suppressing residue after development. On the other hand, the double bond equivalent of the (Alx) resin is preferably 3,000 g / mol or less from the viewpoint of improving sensitivity at the time of exposure.

[0124] <Polysiloxane>

[0125] The (Alx-1) resin is a (Alx) resin having a silanol group and containing a siloxane structure in the structural unit of the resin. As the (Alx-1) resin, for example, a resin obtained by hydrolyzing one or more selected from the group consisting of a tri-functional organosilane, a tetra-functional organosilane, a di-functional organosilane, and a mono-functional organosilane, and dehydrating and condensing the same can be given.

[0126] The (Alx-1) resin preferably has a tri-functional organosilane unit represented by General Formula (9) and a tetra-functional organosilane unit represented by General Formula (10) from the viewpoint of improving sensitivity at the time of exposure, suppressing residue after development, improving reliability of the light emitting element, and improving luminance of the light emitting element.

[0127] [Chemical Formula 3]

[0128]

[0129] In General Formula (9) and General Formula (10), R 61 represents a hydrogen atom or a monovalent organic group. 3 Each independently represents a bonding point in the resin.

[0130] In General Formula (9) and General Formula (10), R 61 is preferably a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, a halogenated alkyl group having 1 to 10 carbon atoms, a halogenated cycloalkyl group having 4 to 10 carbon atoms, or a halogenated aryl group having 6 to 15 carbon atoms. The above-mentioned substituents and structures can have a hetero atom, and can be any of unsubstituted or substituted.

[0131] From the viewpoint of improving sensitivity at the time of exposure, the contained ratio of the tri-functional organosilane unit represented by General Formula (9) in the (Alx-1) resin is preferably 50 to 100 mol%, more preferably 60 to 100 mol%, and further preferably 70 to 100 mol% in terms of molar ratio of Si atoms.

[0132] From the viewpoint of suppressing residue after development, the contained ratio of the tetra-functional organosilane unit represented by General Formula (10) in the (Alx-1) resin is preferably 1 mol% or more, more preferably 5 mol% or more, and further preferably 10 mol% or more in terms of molar ratio of Si atoms. On the other hand, from the viewpoint of improving reliability of the light emitting element, the contained ratio of the tetra-functional organosilane unit represented by General Formula (10) is preferably 40 mol% or less, more preferably 30 mol% or less, and further preferably 20 mol% or less in terms of molar ratio of Si atoms.

[0133] From the viewpoint of improving storage stability, low tapering of the pattern shape, and improving mechanical properties, the contained ratio of the di-functional organosilane unit in the (Alx-1) resin is preferably 1 mol% or more, more preferably 5 mol% or more, and further preferably 10 mol% or more in terms of molar ratio of Si atoms. On the other hand, from the viewpoint of improving reliability of the light emitting element, the contained ratio of the di-functional organosilane unit is preferably 40 mol% or less, more preferably 30 mol% or less, and further preferably 20 mol% or less in terms of molar ratio of Si atoms.

[0134] From the viewpoint of improving storage stability, the contained ratio of the mono-functional organosilane unit in the (Alx-1) resin is preferably 1 mol% or more, more preferably 5 mol% or more, and further preferably 10 mol% or more in terms of molar ratio of Si atoms. On the other hand, from the viewpoint of improving reliability of the light emitting element, the contained ratio of the mono-functional organosilane unit is preferably 40 mol% or less, more preferably 30 mol% or less, and further preferably 20 mol% or less in terms of molar ratio of Si atoms.

[0135] From the viewpoint of the pattern processability using an alkaline developer, the (Alx-1) resin preferably has an organosilane unit containing an acidic group, and from the viewpoint of improving the sensitivity at the time of exposure, more preferably has an organosilane unit containing a (WA) weakly acidic group. From the viewpoints of improving the sensitivity at the time of exposure, suppressing the residue after development, improving the chemical resistance, and improving the reliability of the light-emitting element, the (Alx-1) resin preferably contains a (WA) weakly acidic group and has an organosilane unit containing a fused polycyclic structure, a fused polycyclic heterocyclic structure, or an aromatic structure, and more preferably has an organosilane unit containing a 1,1-bis(trifluoromethyl)-1-hydroxymethylphenyl group or a phenolic hydroxyl group. In addition, from the viewpoints of improving the sensitivity at the time of exposure and suppressing the residue after development, the (Alx-1) resin preferably also has an organosilane unit containing a carboxyl group, a carboxylic anhydride group, or a sulfonic acid group. Examples and preferable ones of the acidic group and the (WA) weakly acidic group are described above in the description of the (A) binder resin. From the viewpoint of improving the above-described properties, the content ratio of the organosilane unit containing an acidic group in the (Alx-1) resin is preferably 1 mol% or more, more preferably 5 mol% or more, and further preferably 10 mol% or more, in terms of the molar ratio of Si atoms. On the other hand, from the viewpoint of the pattern processability using an alkaline developer, the content ratio of the organosilane unit containing an acidic group is preferably 40 mol% or less, more preferably 30 mol% or less, and further preferably 20 mol% or less, in terms of the molar ratio of Si atoms.

[0136] From the viewpoints of improving the sensitivity at the time of exposure, improving the chemical resistance, and improving the reliability of the light-emitting element, the (Alx-1) resin preferably has an organosilane unit containing a radically polymerizable group, and more preferably has an organosilane unit containing a styryl group, a (meth)acryloyl group, a vinyl group, or an allyl group. Examples and preferable ones of the radically polymerizable group are described above in the description of the (A) binder resin.

[0137] From the viewpoints of suppressing the residue after development, improving the chemical resistance, and improving the reliability of the light-emitting element, the (Alx-1) resin preferably has an organosilane unit containing an epoxy group or an oxetanyl group, and more preferably has an organosilane unit containing a cyclohexyl epoxy group, a glycidyl group, or an oxetanyl group.

[0138] From the viewpoints of improving the sensitivity at the time of exposure, suppressing the residue after development, improving the chemical resistance, and improving the reliability of the light-emitting element, the (Alx-1) resin preferably has an organosilane unit containing a fused polycyclic structure, a fused polycyclic heterocyclic structure, or an aromatic structure, and more preferably has an organosilane unit containing a naphthyl group, an anthryl group, a biphenyl group, a phenyl group, a tolyl group, or a methoxyphenyl group, and further preferably has an organosilane unit containing a naphthyl group or an anthryl group.

[0139] From the viewpoint of suppressing post-development residue, improving reliability of the light-emitting element, and improving luminance of light emission, the (Alx-1) resin preferably has an organosilane unit to which (G) inorganic particles described later are bonded. Hereinafter, the (Alx-1) resin having the organosilane unit is also sometimes referred to as "inorganic particle-containing polysiloxane" collectively. The inorganic particle-containing polysiloxane is preferably a resin obtained by hydrolysis and dehydration condensation of one or more selected from the group consisting of a trifunctional organosilane, a tetrafunctional organosilane, a difunctional organosilane, and a monofunctional organosilane in the presence of (G) inorganic particles. The (G) inorganic particles are preferably silica particles. Examples and preferable aspects of the (G) inorganic particles are described later in the description of the (G) inorganic particles.

[0140] <Resin of Polymide Type and Other Resins>

[0141] Hereinafter, polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamide-imide, polyamide-imide precursor, polyamide, and copolymers thereof as the (Alx) resin, the (A2x) resin, or the (A2y) resin are described collectively. These resins are also sometimes referred to as "resin of polymide type" collectively. As the polyimide precursor, for example, polyamic acid, polyamic acid ester, polyamic acid amide, or polyisoimide can be given. As the polyimide, for example, a resin obtained by dehydration ring closure of the polyimide precursor can be given. As the polybenzoxazole precursor, for example, polyhydroxyamide can be given. As the polybenzoxazole, for example, a resin obtained by dehydration ring closure of the polybenzoxazole precursor can be given. As the polyamide-imide precursor, for example, a resin obtained by reaction of a tri-carboxylic anhydride or the like with a diamine or the like can be given. As the polyamide-imide, for example, a resin obtained by dehydration ring closure of the polyamide-imide precursor can be given. As the polyamide, for example, a resin obtained by reaction of a di-carboxylic acid chloride or the like with a diamine or the like can be given.

[0142] From the viewpoint of improving sensitivity at the time of exposure, the polyimide precursor preferably has an amic acid ester structural unit and / or an amic acid amide structural unit. In addition, the polyimide precursor can have an imide ring-closed structural unit obtained by imide ring closure of a part of the amic acid structural unit, the amic acid ester structural unit, or the amic acid amide structural unit. The above-described polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamide-imide, and polyamide-imide precursor can be a copolymer with polyamide.

[0143] In the photosensitive composition of the second aspect of the present application, the (Al) resin containing a weakly acidic group contains one or more selected from the group consisting of (Alx-2) resin: polyimide, (Alx-3) resin: polyimide precursor, (Alx-4) resin: polybenzoxazole, (Alx-5) resin: polybenzoxazole precursor, (Alx-6) resin: polyamide-imide, (Alx-7) resin: polyamide-imide precursor, and (Alx-8) resin: polyamide (hereinafter referred to as "polyimide-based resin having a weakly acidic group").

[0144] From the viewpoint of improving sensitivity at the time of exposure, improving reliability of the light-emitting element, and improving luminance of light emission, the photosensitive composition of the first aspect and the third aspect of the present application preferably contains one or more selected from the group consisting of the above-described polyimide-based resin having a weakly acidic group.

[0145] The above-described polyimide-based resin having a weakly acidic group preferably has an amine residue containing a (WA) weakly acidic group and / or a carboxylic acid residue containing a (WA) weakly acidic group.

[0146] <(DA1) First amine residue: amine residue having a phenolic hydroxyl group>

[0147] In the case where the (A) binder resin contains one or more selected from the group consisting of the above-described polyimide-based resin having a weakly acidic group, from the viewpoint of improving sensitivity at the time of exposure, suppressing residue after development, improving reliability of the light-emitting element, and improving luminance of light emission, the polyimide-based resin having a weakly acidic group preferably has a (DA1) first amine residue: amine residue having a phenolic hydroxyl group, and more preferably the (DA1) first amine residue has at least two (Ia) structures: cyclic structure having a phenolic hydroxyl group, and further has a (IIa) structure: structure linking the at least two (Ia) structures.

[0148] From the viewpoint of improving reliability of the light-emitting element, the cyclic structure in the (Ia) structure is preferably an aromatic structure or a fused polycyclic structure, and more preferably a carbon number 6 to 15 aromatic structure or a carbon number 6 to 20 fused polycyclic structure. The aromatic structure is preferably a biphenyl structure or a benzene structure. The fused polycyclic structure is preferably a fluorene structure, an anthracene structure, or a naphthalene structure. Note that the phenolic hydroxyl group in the (DA1) first amine residue can react with a structure and / or a group in the resin to form a benzoxazole ring. That is, in a resin having a benzoxazole ring in a structural unit of the resin, the benzoxazole ring can have the (DA1) first amine residue.

[0149] From the viewpoint of improving sensitivity at the time of exposure, suppressing residue after development, improving reliability of the light-emitting element, and improving luminance of the light-emitting element, the structure of (IIa) is preferably an alkylene group, a sulfonyl group, a fused polycyclic structure, a hydrocarbon group containing an ether bond, an ether bond, a sulfide bond, a carbonyl group, a carboxylate bond, an amide bond, a urea bond, a carbamate bond, a carbonate bond, a cycloalkylene group, an arylene group, a fused polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyl oxygen group, or a hydrocarbon group containing a carbonyl amide group. The alkylene group, the cycloalkylene group, or the arylene group is preferably an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, or an arylene group having 6 to 15 carbon atoms. The hydrocarbon group containing an ether bond is preferably an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, or an arylene group having 6 to 15 carbon atoms. The hydrocarbon group containing a carbonyl oxygen group and the hydrocarbon group containing a carbonyl amide group each preferably have 1 to 15 carbon atoms, and the hydrocarbon group is preferably an aliphatic structure, an alicyclic structure, an aromatic structure, a fused polycyclic structure, or a fused polycyclic heterocyclic structure.

[0150] From the viewpoint of improving sensitivity at the time of exposure, suppressing residue after development, improving reliability of the light-emitting element, and improving luminance of the light-emitting element, the first amine residue of (DA1) preferably has an amine residue represented by General Formula (31).

[0151] [Chemical Formula 4]

[0152]

[0153] In General Formula (31), R 71 and R 72 each independently represent a carboxyl group, a mercapto group, or a sulfonic acid group. R 73 represents an alkyl group having 1 to 6 carbon atoms. R 74 and R 75 each independently represent an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an alkenyloxy group having 2 to 10 carbon atoms, or an acyl group having 1 to 10 carbon atoms. X 31 and X 32 each independently represent a direct bond, a hydrocarbon group, a hydrocarbon group containing an ether bond, or an amide group to which a hydrocarbon group is bonded. Y 31 represents an alkylene group, a sulfonyl group, a fused polycyclic structure, a hydrocarbon group containing an ether bond, an ether bond, a sulfide bond, a carbonyl group, a carboxylate bond, an amide bond, a urea bond, a carbamate bond, a carbonate bond, a cycloalkylene group, an arylene group, a fused polycyclic heterocyclic structure, a hydrocarbon group containing a carbonyl oxygen group, or a hydrocarbon group containing a carbonyl amide group. a and b each independently represent an integer of 1 to 4. g and h each independently represent an integer of 0 to 3. o and p each independently represent an integer of 0 to 3. w represents an integer of 0 to 6. Note that 1 ≤ a + g ≤ 4, and 1 ≤ b + h ≤ 4. 1 and2 Each independently represents a bonding point in the resin.

[0154] In General Formula (31), X 31 and X 32 The hydrocarbon group in the hydrocarbon group, the ether bond-containing hydrocarbon group, and the hydrocarbon group bonded to the amide group in General Formula (31) is preferably an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, an arylene group having 6 to 15 carbon atoms, or an aralkylene group having 10 to 20 carbon atoms. Y 31 The hydrocarbon group in the hydrocarbon group, the ether bond-containing hydrocarbon group, and the hydrocarbon group bonded to the amide group in General Formula (31) is preferably an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, an arylene group having 6 to 15 carbon atoms, or an aralkylene group having 10 to 20 carbon atoms. Y 31 The hydrocarbon group in the hydrocarbon group, the ether bond-containing hydrocarbon group, and the hydrocarbon group bonded to the amide group in General Formula (31) is preferably an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, an arylene group having 6 to 15 carbon atoms, or an aralkylene group having 10 to 20 carbon atoms. Y

[0155] From the viewpoint of the effects of the present invention described above, the total of the contained ratios of the amine residues represented by General Formula (31) in the polyimide-based resin having a weakly acidic group is preferably 10 mol% or more, more preferably 20 mol% or more, further preferably 30 mol% or more, and particularly preferably 50 mol% or more. On the other hand, from the viewpoint of the effects of the present invention described above, the total of the contained ratios of the amine residues represented by General Formula (31) is preferably 100 mol% or less, more preferably 90 mol% or less, and further preferably 70 mol% or less.

[0156] From the viewpoint of improving the reliability of the light-emitting element and improving the luminance of the light-emitting element, the polyimide-based resin having a weakly acidic group preferably further has (DA2) a second amine residue: an amine residue having no phenolic hydroxyl group, and satisfying the following condition (α1) and / or condition (α2), and more preferably satisfies the following condition (α1) and condition (α2) from the viewpoint of suppressing the residue after development.

[0157] (α1) (DA2) the 2nd amine residue has at least two (Ib) structures: a cyclic structure having no phenolic hydroxyl group, and (IIb) structure: a structure linking the at least two (Ib) structures, the (IIb) structure being an alkylene group, a sulfonyl group, a fused polycyclic structure, an ether bond-containing hydrocarbon group, a direct bond, an ether bond, a thioether bond, a carbonyl group, a carboxylate bond, an amide bond, a urea bond, a carbamate bond, a carbonate bond, a cycloalkylene group, an arylene group, a fused polycyclic heterocyclic structure, a carbonyloxy group-containing hydrocarbon group, or a carbonylamide group-containing hydrocarbon group

[0158] (α2) (DA2) the 2nd amine residue has (IIIb) structure: a silicone structure and / or a siloxane structure.

[0159] From the viewpoint of improving the reliability of the light-emitting element, the cyclic structure in the (Ib) structure is preferably an aromatic structure or a fused polycyclic structure, and is more preferably an aromatic structure having 6 to 15 carbon atoms or a fused polycyclic structure having 6 to 20 carbon atoms. The aromatic structure is preferably a biphenyl structure or a benzene structure. The fused polycyclic structure is preferably a fluorene structure, an anthracene structure, or a naphthalene structure.

[0160] The alkylene group, the cycloalkylene group, or the arylene group in the (IIb) structure is preferably an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, or an arylene group having 6 to 15 carbon atoms. The hydrocarbon group in the ether bond-containing hydrocarbon group is preferably an alkylene group having 1 to 10 carbon atoms, a cycloalkylene group having 4 to 10 carbon atoms, or an arylene group having 6 to 15 carbon atoms. The carbonyloxy group-containing hydrocarbon group and the carbonylamide group-containing hydrocarbon group preferably have 1 to 15 carbon atoms, and the hydrocarbon group is preferably an aliphatic structure, an alicyclic structure, an aromatic structure, a fused polycyclic structure, or a fused polycyclic heterocyclic structure.

[0161] The silicone structure and the siloxane structure in the (IIIb) structure are preferably a structure having a valence of two or more which is bonded to at least two alkylene groups and is linked via the alkylene groups. The structure having a valence of two or more is more preferably a structure having a valence of three or more, and is further preferably a structure having a valence of four or more. On the other hand, the structure having a valence of two or more is preferably a structure having a valence of six or less. The number of silicon atoms in the silicone structure and / or the siloxane structure is preferably two or more, more preferably three or more, and further preferably four or more. On the other hand, the number of silicon atoms is preferably 15 or less, more preferably 10 or less, and further preferably 8 or less. The silicone structure is preferably a dialkyl silicone structure and / or a monoalkyl silicone structure, and the siloxane structure is preferably a monoalkyl siloxane structure. The number of carbon atoms of the alkyl group in the dialkyl silicone structure, the monoalkyl silicone structure, and the monoalkyl siloxane structure is preferably one or more, more preferably two or more, and further preferably three or more. On the other hand, the number of carbon atoms of the alkyl group is preferably 10 or less, more preferably 8 or less, and further preferably 6 or less.

[0162] As for the polyimide-based resin having a weakly acidic group, it is preferable that the total of the contained ratios of the (DA1) first amine residue in all amine residues be 20 mol% or more and 90 mol% or less, and the total of the contained ratios of the (DA2) second amine residue in all amine residues be 10 mol% or more and 80 mol% or less. From the viewpoint of the effects of the above-described invention, the total of the contained ratios of the (DA2) second amine residue in all amine residues is preferably 10 mol% or more, more preferably 20 mol% or more, further preferably 30 mol% or more, and particularly preferably 40 mol% or more. On the other hand, from the viewpoint of the effects of the above-described invention, the total of the contained ratios of the (DA2) second amine residue is preferably 80 mol% or less, more preferably 70 mol% or less, and further preferably 60 mol% or less.

[0163] As for the above-described (DA1) first amine residue, the effect of improving the sensitivity at the time of exposure and suppressing the residue after development becomes remarkable by the alkali dissolution promoting action of the amine residue having a phenolic hydroxyl group. It is also considered that the cross-linking reaction between resins and the ring-closing reaction of the resin are efficiently performed by these structures. Therefore, it is inferred that the cross-linking structure of the resin ring, the imide structure or the oxazole structure after ring-closing promote the surface modification of the wiring surface, and the luminance is improved by the conductivity control of the wiring by metal or the like. In addition, it is inferred that these structures promote the capture of metal impurities, ionic impurities, and the like, which adversely affect the electrical insulation, and thus the reliability of the light-emitting element is improved.

[0164] From the viewpoint of improving the sensitivity at the time of exposure, the polyimide-based resin preferably has a carboxylic acid residue having a fluorine atom and / or an amine residue having a fluorine atom. The total of the contained ratios of the carboxylic acid residue having a fluorine atom and the amine residue having a fluorine atom in all carboxylic acid residues and all amine residues is preferably 10 to 100 mol%, more preferably 30 to 100 mol%, and further preferably 50 to 100 mol%. The preferable ranges related to the total of the contained ratios of the amine residue having a fluorine atom in all amine residues and the total of the contained ratios of the carboxylic acid residue having a fluorine atom in all carboxylic acid residues are also the same as described above, respectively.

[0165] From the viewpoint of improving the storage stability, the polyimide-based resin preferably has a structure in which the end of the resin is capped with a monoamine, a dicarboxylic anhydride, or a monocarboxylic acid derivative. From the viewpoint of improving the sensitivity at the time of exposure and improving the reliability of the light-emitting element, the polyimide-based resin preferably has, at the end of the resin, a radically polymerizable group or a cross-linkable group which can react with a resin or the like, and more preferably has a maleimide group or a nadimide group. As an acid monomer having such a group, for example, maleic anhydride or nadic anhydride can be given.

[0166] The maleimide resin is a resin having at least two maleimide groups. The maleimide-styrene resin is a resin having a maleimide group and a unit from a styrene derivative. The maleimide-triazine resin is a resin having a maleimide group and a unit containing a triazine structure. The maleimide-oxazine resin is a resin having a maleimide group and a unit containing an oxazine structure. These are resins different from the polyimide-based resin.

[0167] < Content of fluorine element in the structure of the binder resin (A) >

[0168] From the viewpoint of suppressing post-development residue, improving the reliability of the light-emitting element, and improving the luminance of light emission, the binder resin (A) is also preferably satisfies the following condition (Pla). The binder resin (A) is more preferably also satisfies the following condition (P2a). In the case where the binder resin (A) is a polyimide-based resin, the same applies, and from the viewpoint of suppressing post-development residue, improving the reliability of the light-emitting element, and improving the luminance of light emission, it is also preferably satisfies the following condition (Pla), and more preferably also satisfies the following condition (P2a).

[0169] (P1a) The content of fluorine element in the structure of the binder resin (A) is 10,000 mass ppm or less

[0170] (P2a) The content of fluoride ion in the structure of the binder resin (A) is 10,000 mass ppm or less.

[0171] From the viewpoint of the effects of the above-described invention, the content of fluorine element in the structure of the binder resin (A) is preferably 0 mass ppm or more, more preferably 0.010 mass ppm or more, further preferably 0.030 mass ppm or more, more further preferably 0.050 mass ppm or more, particularly preferably 0.070 mass ppm or more, and most preferably 0.10 mass ppm or more. On the other hand, from the viewpoint of the effects of the above-described invention, the content of fluorine element is preferably 10,000 mass ppm or less, more preferably 5,000 mass ppm or less, further preferably 1,000 mass ppm or less, more further preferably 500 mass ppm or less, particularly preferably 300 mass ppm or less, and most preferably 100 mass ppm or less. Furthermore, the content of fluorine element is preferably 50 mass ppm or less, more preferably 30 mass ppm or less, further preferably 10 mass ppm or less, more further preferably 5 mass ppm or less, particularly preferably 3 mass ppm or less, and most preferably 1 mass ppm or less.

[0172] The preferable range of the content of fluoride ions in the structure of the (A) binder resin is also the same as the preferable range of the content of the fluorine element in the structure of the (A) binder resin described above, respectively.

[0173] The content of the fluorine element in the structure of the (A) binder resin can also be 0 mass ppm. The content of the fluoride ions in the structure of the (A) binder resin can also be 0 mass ppm.

[0174] It is inferred that by making the content of the fluorine element in the (A) binder resin in the photosensitive composition be below a certain value, the content of the fluorine element, the fluoride ions, or the anion containing the fluorine element from the resin in the resin becomes below a certain value, and thus the proton in the photosensitive composition is locally activated by the interaction such as hydrogen bonding of each component in the photosensitive composition. Therefore, it is considered that the effect of suppressing the residue after development is significantly improved by the effect of promoting the dissolution in the developing solution. In addition, it is considered that by intentionally making the content of the above component in the resin be below a certain value, the content of the above component in the cured product of the photosensitive composition can also be reduced, and the polar structure, the charge balance in the cured product can be controlled. As a result, it is inferred that the reliability and the luminance of the light emitting element are improved by suppressing the ion migration, the electromigration caused by the metal impurities, the ionic impurities that adversely affect the light emitting properties or the electrical insulation properties. In addition, it is inferred that the reliability of the display device is improved due to the migration suppression, the aggregation suppression of the metal in the electrode or the metal in the metal wiring.

[0175] <(A1y) Resin>

[0176] From the viewpoint of improving the sensitivity at the time of exposure and suppressing the residue after development, the (A1) resin containing a weakly acidic group preferably contains an (A1y) resin. From the viewpoint of improving the sensitivity at the time of exposure and suppressing the residue after development, the (A1y) resin preferably contains one or more selected from the group consisting of a phenol aldehyde resin, a polyhydroxystyrene, a phenolic group-containing epoxy resin, and a phenolic group-containing acrylic resin. The (A1y) resin can be any of a single resin or a copolymer thereof.

[0177] The phenol aldehyde resin is preferably a Novolac resin, a Resol resin, or a phenol aralkyl resin. The phenol aldehyde resin preferably has a fused polycyclic structure, a fused polycyclic heterocyclic structure, an aromatic structure, or a heterocyclic structure.

[0178] The polyhydroxystyrene preferably has a unit from a (meth)acrylate derivative containing a fused polycyclic structure, a fused polycyclic heterocyclic structure, or an aromatic structure or a unit from a styrene derivative.

[0179] As the epoxy resin containing a phenolic group, for example, a resin obtained by reacting a polyfunctional epoxy compound with a phenol compound having an epoxy-reactive group can be mentioned, and a Cardo resin containing a phenolic group or an epoxy-modified resin containing a phenolic group is preferable. The epoxy-modified resin containing a phenolic group is preferably an epoxy ester resin containing a phenolic group. The Cardo resin containing a phenolic group preferably has a fused polycyclic structure or a fused polycyclic heterocyclic structure. The epoxy resin containing a phenolic group preferably has a fused polycyclic structure, a fused polycyclic heterocyclic structure, or an aromatic structure.

[0180] As the acrylic resin containing a phenolic group, for example, a resin obtained by further reacting the acrylic resin described later with a phenol compound having an addition-reactive group can be mentioned. In addition, a resin obtained by free-radical copolymerization of a copolymerization component having a phenolic hydroxyl group with another copolymerization component such as a (meth)acrylic acid derivative can also be mentioned. Note that the acrylic resin containing a phenolic group is a different resin from polyhydroxystyrene. The acrylic resin containing a phenolic group preferably has a unit derived from a (meth)acrylate derivative including a fused polycyclic structure, a fused polycyclic heterocyclic structure, or an aromatic structure, or a unit derived from a styrene derivative.

[0181] The fused polycyclic structure, the fused polycyclic heterocyclic structure, the aromatic structure, or the heterocyclic structure in these resins is preferably a fluorene structure, an anthracene structure, a naphthalene structure, a tricyclo[5.2.1.02, 6]decane structure, an adamantane structure, a xanthene structure, an isoindolinone structure, a biphenyl structure, a benzene structure, a bisphenol A structure, a bisphenol F structure, a bisphenol AF structure, an isocyanuric acid structure, or a triazine structure. 2,6 ]decane structure, an adamantane structure, a xanthene structure, an isoindolinone structure, a biphenyl structure, a benzene structure, a bisphenol A structure, a bisphenol F structure, a bisphenol AF structure, an isocyanuric acid structure, or a triazine structure.

[0182] <(A2x) Resin and (A2y) Resin>

[0183] From the viewpoint of improving sensitivity at the time of exposure and suppressing residue after development, the (A2) resin not having a weakly acidic group preferably contains an (A2x) resin, and preferably further contains an (A2y) resin. From the viewpoint of improving sensitivity at the time of exposure and suppressing residue after development, the (A2x) resin and / or the (A2y) resin preferably contains one or more selected from the group consisting of a resin containing a polycyclic side chain, an acid-modified epoxy resin, and an acrylic resin. The (A2x) resin and the (A2y) resin can be any of a single resin or a copolymer thereof.

[0184] From the viewpoint of improving the reliability of the light-emitting element, the resin having a polycyclic side chain is preferably a Cardo resin having a fused polycyclic structure or a fused polycyclic heterocyclic structure. From the viewpoint of improving the reliability of the light-emitting element, the acid-modified epoxy resin is preferably an epoxy (meth)acrylate resin having a fused polycyclic structure, a fused polycyclic heterocyclic structure, or an aromatic structure. From the viewpoint of improving the reliability of the light-emitting element, the acrylic resin preferably has a unit derived from a (meth)acrylate derivative including a fused polycyclic structure, a fused polycyclic heterocyclic structure, or an aromatic structure, or a unit derived from a styrene derivative. In addition, it is also preferable to have a unit derived from a (meth)acrylate derivative having an epoxy group. The fused polycyclic structure, the fused polycyclic heterocyclic structure, or the aromatic structure in these resins is preferably a fluorene structure, an anthracene structure, a naphthalene structure, a tricyclo[5.2.1.02'6]decane structure, an adamantane structure, a xanthene structure, an isoindolinone structure, a biphenyl structure, or a benzene structure. 2,6 ]decane structure, an adamantane structure, a xanthene structure, an isoindolinone structure, a biphenyl structure, or a benzene structure.

[0185] From the viewpoint of improving the sensitivity at the time of exposure, low tapering of the pattern shape, and improving the reliability of the light-emitting element, the total of the contained ratios of the (Alx) resins in the total of 100 mass% of the (A) binder resins is preferably 10 mass% or more, more preferably 30 mass% or more, further preferably 50 mass% or more, and particularly preferably 70 mass% or more. On the other hand, from the viewpoint of suppressing residues after development, the total of the contained ratios of the (Alx) resins is preferably 100 mass% or less, more preferably 90 mass% or less, and further preferably 80 mass% or less. In addition, from the viewpoint of improving the sensitivity at the time of exposure, suppressing residues after development, and low tapering of the pattern shape, the contained ratio of the (Al y) resin is preferably 5.0 mass% or more, more preferably 10 mass% or more, further preferably 20 mass% or more, and particularly preferably 30 mass% or more. On the other hand, from the viewpoint of improving the reliability of the light-emitting element, the contained ratio of the (Al y) resin is preferably 70 mass% or less, more preferably 60 mass% or less, and further preferably 50 mass% or less. In addition, from the viewpoint of improving the sensitivity at the time of exposure, suppressing residues after development, and low tapering of the pattern shape, the total of the (A2x) resins and the contained ratios of the (A2x) resins is preferably 5.0 mass% or more, more preferably 10 mass% or more, further preferably 20 mass% or more, and particularly preferably 30 mass% or more. On the other hand, from the viewpoint of improving the reliability of the light-emitting element, the total of the contained ratios of the (A2x) resins and the (A2y) resins is preferably 70 mass% or less, more preferably 60 mass% or less, and further preferably 50 mass% or less.

[0186] From the viewpoint of improving the characteristics of each resin, the content ratio of the (A) binder resin in the total solid content of the photosensitive composition of the present application is preferably 10% by mass or more. On the other hand, from the viewpoint of improving the characteristics of each resin, the content ratio of the (A) binder resin is preferably 75% by mass or less. Note that the total solid content of the composition refers to the total of the mass of all components in the composition excluding the solvent. In addition, the solid content concentration can be calculated from the mass of the composition 1 g heated at 150°C for 30 minutes to evaporate and dry, and the mass remaining after heating.

[0187] (B) Free-radical polymerizable compound

[0188] The photosensitive composition of the present application preferably further contains a (B) free-radical polymerizable compound (hereinafter referred to as "(B) compound") and / or a (F) crosslinking agent. The (B) compound refers to a compound having a free-radical polymerizable group. Examples and preferences relating to the free-radical polymerizable group are as described above in the description of the (A) binder resin. From the viewpoint of promoting free-radical polymerization, improving sensitivity at the time of exposure, and improving the reliability of the light-emitting element, the free-radical polymerizable group is preferably a (meth)acryloyl group. From the viewpoint of improving sensitivity at the time of exposure and improving the reliability of the light-emitting element, the number of free-radical polymerizable groups possessed by the (B) compound is preferably 2 or more, more preferably 3 or more, and further preferably 4 or more. On the other hand, from the viewpoint of improving the reliability of the light-emitting element, the number of free-radical polymerizable groups is preferably 12 or less, more preferably 10 or less, further preferably 8 or less, and particularly preferably 6 or less.

[0189] In the case where the photosensitive composition of the present application contains the (A) binder resin and the (B) compound, from the viewpoint of low tapering of the pattern shape and improving the reliability of the light-emitting element, the content of the (A) binder resin is preferably 25 parts by mass or more, more preferably 35 parts by mass or more, and further preferably 45 parts by mass or more, in the case where the total of the (A) binder resin and the (B) compound is 100 parts by mass. On the other hand, from the viewpoint of improving sensitivity at the time of exposure and suppressing residue after development, the content of the (A) binder resin is preferably 85 parts by mass or less, more preferably 80 parts by mass or less, and further preferably 75 parts by mass or less. In addition, from the viewpoint of improving the above-described characteristics, the content of the (B) compound is preferably 15 parts by mass or more, in the case where the total of the (A) binder resin and the (B) compound is 100 parts by mass. On the other hand, from the viewpoint of improving the above-described characteristics, the content of the (B) compound is preferably 75 parts by mass or less.

[0190] (C) Photosensitizer

[0191] The photosensitive composition of the present application contains (C) a photosensitizer. The (C) photosensitizer refers to a compound which undergoes bond cleavage, reaction or structural change by exposure and generates other compounds, thereby imparting positive or negative photosensitivity to the composition. The (C) photosensitizer preferably contains one or more selected from the group consisting of (C1) a naphthoquinone diazide compound (hereinafter referred to as "(C1) compound"), (C2) a photopolymerization initiator (hereinafter referred to as "(C2) compound"), (C3) a photoacid generator (hereinafter referred to as "(C3) compound"), and (C4) a photobase generator (hereinafter referred to as "(C4) compound"). In the case of imparting positive photosensitivity to the composition, it is preferable to contain the (C1) compound and / or the (C3) compound, and it is also preferable to further contain the (C2) compound or the (C4) compound. In the case of imparting negative photosensitivity to the composition, it is preferable to contain the (C2) compound and / or the (C3) compound, and it is also preferable to further contain the (C1) compound or the (C4) compound.

[0192] From the viewpoint of improving sensitivity at the time of exposure and suppressing residue after development, the (C) photosensitizer preferably contains the (C1) naphthoquinone diazide compound, and further contains the (C3) photoacid generator and / or the (C4) photobase generator.

[0193] In the case where the total of the (A) binder resin and the (B) compound is 100 parts by mass, the content of the (C) photosensitizer is preferably 1.0 parts by mass or more from the viewpoint of improving sensitivity at the time of exposure. On the other hand, the content of the (C) photosensitizer is preferably 30 parts by mass or less from the viewpoint of suppressing residue after development.

[0194] (C1) Naphthoquinone Diazide Compound

[0195] The (C1) compound refers to a compound which undergoes structural change by exposure and generates indenecarboxylic acid and / or sulfoindenecarboxylic acid. In the case of containing the (C1) compound, it is suitable for forming a positive pattern. At the time of exposure, the acidic compound formed by structural change of the (C1) compound makes the exposed portion of the film of the composition selectively soluble in an alkaline developer, and thus the effect of improving resolution after development becomes remarkable.

[0196] The (C1) compound is preferably a 1,2-diazido naphthoquinone-5-sulfonic acid ester of a compound having a phenolic hydroxyl group (hereinafter, referred to as "5-ester") or a 1,2-diazido naphthoquinone-4-sulfonic acid ester (hereinafter, referred to as "4-ester"). From the viewpoint of improving the resolution after development, the (C1) compound preferably contains the 5-ester, and from the viewpoint of improving the sensitivity at the time of exposure, the (C1) compound preferably contains the 4-ester. From the viewpoints of improving the sensitivity at the time of exposure, suppressing the residue after development, and improving the resolution after development, the (C1) compound more preferably contains both the 5-ester and the 4-ester.

[0197] From the viewpoint of improving the resolution after development, the total of the contained ratios of the 1,2-diazido naphthoquinone-5-sulfonic acid ester group (hereinafter, referred to as "5-ester group") and the 1,2-diazido naphthoquinone-4-sulfonic acid ester group (hereinafter, referred to as "4-ester group") in the (C1) compound in the total of the moles of the phenolic hydroxyl group, the 5-ester group, and the 4-ester group (hereinafter, referred to as "esterification rate") is preferably 50 mol% or more, more preferably 55 mol% or more, and further preferably 60 mol% or more. On the other hand, from the viewpoint of improving the sensitivity at the time of exposure, the esterification rate is preferably 100 mol% or less, more preferably 90 mol% or less, further preferably 80 mol% or less, and particularly preferably 70 mol% or less. In the case of the (C1) compound, it is also preferable to mix two or more (C1) compounds having different esterification rates so as to have the above esterification rate.

[0198] From the viewpoint of improving the sensitivity at the time of exposure, the total of the contained ratios of the compound having one 5-ester group or 4-ester group in the molecule and the compound having two 5-ester groups or 4-ester groups in the molecule in the total of 100 mol% of the (C1) compound (hereinafter, referred to as "low ester substituent ratio") is preferably 60 mol% or more, more preferably 70 mol% or more, and further preferably 80 mol% or more. On the other hand, from the viewpoint of improving the resolution after development, the low ester substituent ratio is preferably 100 mol% or less, more preferably 95 mol% or less, and further preferably 90 mol% or less.

[0199] In addition, from the viewpoint of improving the sensitivity at the time of exposure, the ratio of the low ester substituent in the total of 100 mol% of the (C1) compound is preferably 0 mol% or more, more preferably 10 mol% or more, further preferably 20 mol% or more, and particularly preferably 30 mol% or more. On the other hand, from the viewpoint of suppressing the residue after development, the low ester substituent ratio is preferably less than 60 mol%, more preferably 50 mol% or less, and further preferably 40 mol% or less.

[0200] As a method of producing the (C1) compound, for example, there can be mentioned a method in which a compound having a phenolic hydroxyl group is subjected to an esterification reaction with a diazidonaphthoquinone sulfonic acid, a method in which a compound having a phenolic hydroxyl group is subjected to an esterification reaction with diazidonaphthoquinone sulfonyl chloride, and the like. The diazidonaphthoquinone sulfonyl chloride is preferably 1,2-diazidonaphthoquinone-5-sulfonyl chloride or 1,2-diazidonaphthoquinone-4-sulfonyl chloride.

[0201] <(C2) Photopolymerization Initiator >

[0202] The (C2) compound is a compound which undergoes bond cleavage and / or reaction and generates a radical by exposure. In the case where the (C2) compound is contained, it is suitable for forming a negative pattern. Even if the radical generated from the (C2) compound is in a small amount at the time of exposure, the radical polymerization of the above-mentioned (B) compound and the like proceeds in a chain, and thus the effect of improving the sensitivity at the time of exposure becomes remarkable.

[0203] The (C2) compound is preferably a benzil ketal compound, an α-hydroxy ketone compound, an α-amino ketone compound, a bisimidazole compound, a phosphine oxide compound, an oxime ester compound, an acridine compound, a titanocene compound, a benzophenone compound, an acetophenone compound, an aromatic ketone ester compound, or a benzoic acid ester compound, and more preferably an α-hydroxy ketone compound, an α-amino ketone compound, a bisimidazole compound, a phosphine oxide compound, or an oxime ester compound, and further preferably an oxime ester compound, from the viewpoint of improving the sensitivity at the time of exposure and improving the reliability of the light emitting element.

[0204] The above-mentioned α-hydroxy ketone compound, α-amino ketone compound, bisimidazole compound, phosphine oxide compound, and oxime ester compound have the effect of increasing the crosslinking degree of a cured product by radical generation at the time of heating, promoting the ring closure reaction of a resin based on the interaction of a hydroxyl group, an amino group, an imidazole structure, a phosphine oxide structure, or an oxime ester structure, and thus the effect of improving the reliability of the light emitting element becomes remarkable.

[0205] <(C3) Photo-acid Generator >

[0206] The (C3) compound is a compound which undergoes bond cleavage and / or reaction and generates an acid by exposure. In the case where the (C3) compound is contained, it is suitable for forming a negative pattern from the viewpoint of promoting cationic polymerization and the like. On the other hand, in the case where a resin and the like have an acid group which is protected with an acid dissociation group, it is suitable for forming a positive pattern from the viewpoint of dissociating the acid group by exposure, and the effect of improving the sensitivity at the time of exposure becomes remarkable.

[0207] As the (C3) compound, for example, an ionic compound or a non-ionic compound can be given. The ionic compound is preferably a triorganosulfonium salt-based compound. The non-ionic compound is preferably a halogen-containing compound, a diazomethane compound, a sulfone compound, a sulfonate compound, a carboxylate compound, a sulfimide compound, a phosphate compound, or a sulfobenzotriazole compound.

[0208] <(C4) photo-base generator>

[0209] The (C4) compound refers to a compound that undergoes bond cleavage and / or reaction and generates a base by exposure to light. In the case where the (C4) compound is contained, from the viewpoint of promoting anionic polymerization and the like, a negative-type pattern is suitable. On the other hand, in the case where a resin or the like has an acidic group protected with a base-dissociable group, from the viewpoint of dissociating the acidic group by exposure to light, a positive-type pattern is suitable, and the effect of improving sensitivity at the time of exposure becomes remarkable.

[0210] As the (C4) compound, for example, an ionic compound or a non-ionic compound can be given. The ionic compound is preferably a diazabicycloalkene salt-based compound, a triazabicycloalkene salt-based compound, an α-keto acid quaternary ammonium salt-based compound, a benzyl quaternary ammonium salt-based compound, a guanidinium salt-based compound, or a biguanidinium salt-based compound. The ionic compound preferably has a ketoprofen structure, an oxo-xanthene structure, a benzofuran structure, or a naphthalene structure. The non-ionic compound is preferably a nitrobenzyl carbamate compound, an anthryl carbamate compound, a benzoin-based carbamate compound, an anthraquinone-based carbamate compound, a hydroxycinnamic amide-based compound, or a coumarin amide-based compound.

[0211] <(D) colorant>

[0212] The photosensitive composition of the present application preferably further contains a (D) colorant. The (D) colorant refers to a compound that is colored by absorbing light of a wavelength (380 to 780 nm) of visible light. The (D) colorant is preferably a pigment or a dye. From the viewpoint of suppressing reflection of external light, the (D) colorant preferably contains a black agent or a mixture of colorants of two or more colors. The black agent preferably contains an organic black pigment and / or an inorganic black pigment. The black in the (D) colorant is as described in

[0284] to

[0285] of International Publication No. 2019 / 087985.

[0213] From the viewpoint of suppressing reflection of external light and improving the reliability of the element, the contained ratio of the (D) colorant in the total solid content of the photosensitive composition of the present application is preferably 5.0% by mass or more, more preferably 10% by mass or more, and further preferably 20% by mass or more. On the other hand, from the viewpoint of improving the sensitivity at the time of exposure and suppressing residue after development, the contained ratio of the (D) colorant is preferably 70% by mass or less, and more preferably 50% by mass or less.

[0214] From the viewpoint of suppressing residue after development, low tapering of the pattern shape, and improving the reliability of the light-emitting element, the organic black pigment preferably contains one or more selected from the group consisting of a benzofuranone-based black pigment, a perylene-based black pigment, and a methine-based black pigment, and from the viewpoint of improving the sensitivity at the time of exposure, more preferably contains a benzofuranone-based black pigment. The organic black pigment is also preferably an anthraquinone-based black pigment, an aniline-based black pigment, an azo-based black pigment, or carbon black. The carbon black is preferably resin-coated, dye-coated, oxidized, surface-modified with an organic group having an ionic group, or surface-treated with a sulfonic acid group.

[0215] From the viewpoint of suppressing residue after development and low tapering of the pattern shape, the mixture of two or more colorants preferably contains a mixture of two or more color pigments and / or a mixture of two or more color dyes, and more preferably contains blue and / or purple, and red and orange, the color pigments are anthraquinone-based pigments, diketopyrrolopyrrole-based pigments, perylene-based pigments, isoindoline-based pigments, isoindolinone-based pigments, imidazolone-based pigments, quinacridone-based pigments, pyranthrene-based pigments, phthalocyanine-based pigments, indanthrone-based pigments, or dioxazine-based pigments, and the color dyes are squarylium-based dyes, xanthene-based dyes, triarylmethane-based dyes, or phthalocyanine-based dyes.

[0216] From the viewpoint of suppressing residue after development and low tapering of the pattern shape, the inorganic black pigment preferably contains one or more selected from the group consisting of a metal element-containing nitride, a metal element-containing carbide, and a metal element-containing oxynitride, the metal element is one or more selected from the group consisting of zirconium, vanadium, niobium, hafnium, and tantalum, more preferably contains one or more selected from the group consisting of a zirconium-containing nitride, a zirconium-containing carbide, and a zirconium-containing oxynitride, and from the viewpoint of improving the sensitivity at the time of exposure, further preferably contains one or more selected from the group consisting of a zirconium-containing nitride, a zirconium-containing carbide, and a zirconium-containing oxynitride.

[0217] <(E) dispersant>

[0218] The photosensitive composition of the present application also preferably further contains (E) a dispersant. The (E) dispersant refers to a compound having a structure that interacts with the surface of a pigment and a structure that hinders the approach of pigments to each other. From the viewpoint of improving the dispersion stability of pigments, the (E) dispersant preferably has a basic group, an acidic group, or a salt structure thereof, and more preferably has a basic group or a salt structure thereof.

[0219] <(F) Crosslinking Agent>

[0220] The photosensitive composition of the present application preferably further contains (B) a compound and / or (F) a crosslinking agent. The (F) crosslinking agent refers to a compound having a crosslinkable group that can react with a resin or the like, a cationically polymerizable group, or an anionically polymerizable group. From the viewpoint of improving the sensitivity at the time of exposure and improving the reliability of the light-emitting element, the (F) crosslinking agent preferably has one or more groups selected from the group consisting of an alkoxyalkyl group, a hydroxyalkyl group, an epoxy group, an oxetanyl group, and a blocked isocyanate group (hereinafter referred to as "specific crosslinkable group"). The alkoxyalkyl group is preferably an alkoxy methyl group or an alkoxy ethyl group, and more preferably a methoxy methyl group or a methoxy ethyl group. The hydroxyalkyl group is preferably a hydroxymethyl group or a hydroxyethyl group. From the viewpoint of improving the sensitivity at the time of exposure and improving the reliability of the light-emitting element, the (F) crosslinking agent preferably has two or more specific crosslinkable groups, more preferably three or more, further preferably four or more, and particularly preferably six or more. On the other hand, from the viewpoint of improving the reliability of the light-emitting element, the (F) crosslinking agent preferably has twelve or fewer specific crosslinkable groups, more preferably ten or fewer, and further preferably eight or fewer.

[0221] From the viewpoint of improving the sensitivity at the time of exposure and improving the reliability of the light-emitting element, the content of the (F) crosslinking agent is preferably 1.0 parts by mass or more when the total of the (A) binder resin and the (B) compound is 100 parts by mass. On the other hand, from the viewpoint of suppressing the residue after development and improving the reliability of the light-emitting element, the content of the (F) crosslinking agent is preferably 30 parts by mass or less.

[0222] From the viewpoint of suppressing the residue after development and improving the reliability of the light-emitting element, the (F) crosslinking agent preferably contains (F1) a compound having at least two phenolic hydroxyl groups and at least two specific crosslinkable groups and / or (F2) a compound having a structure including a heterocyclic structure and at least two specific crosslinkable groups. The preferred content of each of these (F) crosslinking agents is the same as described above.

[0223] From the viewpoint of improving the reliability of the light-emitting element, the (F1) compound preferably has at least two structures in which a phenolic hydroxyl group and a specific cross-linkable group are bonded to one aromatic structure, and more preferably has at least two structures in which a phenolic hydroxyl group and at least two specific cross-linkable groups are bonded to one aromatic structure. From the viewpoint of improving the reliability of the light-emitting element, the heterocyclic structure in the (F2) compound is preferably a nitrogen-containing cyclic structure, more preferably a cyclic structure having at least two nitrogen atoms, and further preferably an isocyanuric acid structure, a triazine structure, a glycoluril structure, an imidazolidinone structure, a pyrazole structure, an imidazole structure, a triazole structure, a tetrazole structure, or a purine structure. The number of nitrogen atoms in the heterocyclic structure in the (F2) compound is preferably greater than or equal to 1, more preferably greater than or equal to 2, and further preferably greater than or equal to 3. Meanwhile, the number of nitrogen atoms is preferably less than or equal to 6, more preferably less than or equal to 4.

[0224] <(G) Inorganic Particles>

[0225] From the viewpoints of improving the reliability of the light-emitting element and improving the luminance of light emission, the photosensitive composition of the present application preferably further contains (G) inorganic particles. The mode in which the photosensitive composition of the present application contains (G) inorganic particles can be any of a mode in which (G) inorganic particles are contained in the above-described inorganic particle-containing polysiloxane and a mode in which (G) inorganic particles are added to the photosensitive composition. The photosensitive composition of the present application preferably contains the above-described inorganic particle-containing polysiloxane and further contains (G) inorganic particles, and also preferably does not contain the above-described inorganic particle-containing polysiloxane and further contains (G) inorganic particles. The (G) inorganic particles refer to particles in which a main component contains an element selected from the group consisting of metal elements, metalloid elements, and semiconductor elements. Note that the main component refers to a component that is contained in the largest amount on the basis of mass among the components. From the viewpoint of improving the reliability of the light-emitting element, the (G) inorganic particles preferably have a hydroxyl group and / or a silanol group on the surface of the particles. From the viewpoints of improving the reliability of the light-emitting element and improving the luminance of light emission, the (G) inorganic particles preferably contain one or more kinds selected from the group consisting of silicon dioxide particles, aluminum oxide particles, titanium oxide particles, vanadium oxide particles, chromium oxide particles, iron oxide particles, cobalt oxide particles, copper oxide particles, zinc oxide particles, zirconium oxide particles, niobium oxide particles, tin oxide particles, and cerium oxide particles, and more preferably contain silicon dioxide particles from the viewpoint of suppressing reflection of external light.

[0226] It is considered that the above-described silica particles capture metal impurities, ionic impurities, and the like that adversely affect the electrical insulation property, using the acidity and negative charge of the hydroxyl group and / or silanol group on the surface of the particles. In addition, it is inferred that the captured impurities are continuously maintained even if heat treatment or voltage application is performed, due to the firm structure of the particles, and thus the reliability of the light emitting element is improved. In addition, it is considered that the reflection and scattering of incident external light can be reduced using the silica particles that are biased on the surface of the cured product. As a result, the influence of light interference with the incident external light is suppressed, and thus the effect of improving the luminance of light emission becomes significant.

[0227] From the viewpoint of improving the reliability of the light emitting element and improving the luminance of light emission, the inclusion ratio of the (G) inorganic particles in the total solid content of the photosensitive composition of the present application is preferably 5.0% by mass or more, more preferably 10% by mass or more, further preferably 20% by mass or more, and particularly preferably 30% by mass or more. On the other hand, from the viewpoint of suppressing the residue after development, the inclusion ratio of the (G) inorganic particles is preferably 90% by mass or less, more preferably 70% by mass or less, further preferably 60% by mass or less, and particularly preferably 50% by mass or less. The inclusion ratio of the (G) inorganic particles refers to the total of the (G) inorganic particles in the above-described inorganic particle-containing polysiloxane and the (G) inorganic particles added to the photosensitive composition.

[0228] <Other additives and solvents>

[0229] The photosensitive composition of the present application preferably also contains a thermal color developer, an oxidation color developer, a dissolution promoter, a non-ink agent, a sensitizer, a chain transfer agent, a polymerization inhibitor, a silane coupling agent, or a surfactant. These additives can use known substances. The photosensitive composition of the present application preferably also contains a solvent. In the case where the photosensitive composition of the present application contains a pigment and also contains a dispersant, the solvent is preferably a compound having an acetate bond, a propionate bond, or a butyrate bond from the viewpoint of improving the dispersion stability of the pigment.

[0230] <Content of chlorine element, bromine element, chloride ion, and bromide ion>

[0231] The photosensitive composition of the first mode of the present application also contains one or more components selected from the group consisting of a component containing a chlorine element, a component containing a bromine element, a component containing a chloride ion, and a component containing a bromide ion (hereinafter referred to as "specific halogen component"), and satisfies the following condition (1).

[0232] (1) the total content of chlorine and bromine in the total solid content of the photosensitive composition is 0.0010 to 1,000 mass ppm, and / or the total content of chloride ions and bromide ions in the total solid content of the photosensitive composition is 0.0010 to 1,000 mass ppm.

[0233] From the viewpoint of improving sensitivity at the time of exposure, suppressing post-development residue, improving reliability of the light-emitting element, and improving luminance of the light-emitting element, the photosensitive composition of the second and third modes of the present application preferably further contains one or more selected from the group consisting of a chlorine element-containing component, a bromine element-containing component, a chloride ion-containing component, and a bromide ion-containing component, and satisfies the condition of (1) above. In addition, the photosensitive composition of the present application has the effect of suppressing generation of foreign matter at the time of storage and improving storage stability by having the content of the specific halogen component described above within a specific range.

[0234] The chlorine element-containing component and the bromine element-containing component are preferably a chloroalkyl compound, a chlorocycloalkyl compound, a chloroaryl compound, a bromoalkyl compound, a bromocycloalkyl compound, or a bromoaryl compound. The chloride ion-containing component and the bromide ion-containing component preferably contain an ammonium ion, a primary ammonium ion, a secondary ammonium ion, a tertiary ammonium ion, or a quaternary ammonium ion as a cation species. The quaternary ammonium ion is preferably a specific quaternary ammonium ion described later, and more preferably satisfies the condition of (6) described later.

[0235] From the viewpoint of improving sensitivity at the time of exposure, suppressing post-development residue, improving storage stability, improving reliability of the light-emitting element, and improving luminance of the light-emitting element, the total content of chlorine and bromine in the total solid content of the photosensitive composition, and the total content of chloride ions and bromide ions in the total solid content of the photosensitive composition are preferably 0.010 mass ppm or more, more preferably 0.030 mass ppm or more, further preferably 0.050 mass ppm or more, more further preferably 0.070 mass ppm or more, and particularly preferably 0.10 mass ppm or more. On the other hand, from the viewpoint of improving sensitivity at the time of exposure, suppressing post-development residue, improving storage stability, improving reliability of the light-emitting element, and improving luminance of the light-emitting element, the total content of chlorine and bromine, and the total content of chloride ions and bromide ions are preferably 500 mass ppm or less, more preferably 300 mass ppm or less, further preferably 100 mass ppm or less. Furthermore, they are preferably 50 mass ppm or less, more preferably 30 mass ppm or less, further preferably 10 mass ppm or less, more further preferably 5 mass ppm or less, particularly preferably 3 mass ppm or less, and most preferably 1 mass ppm or less.

[0236] The photosensitive composition of the present application preferably also satisfies the following (2) from the viewpoint of improving sensitivity at the time of exposure, suppressing post-development residue, improving storage stability, improving reliability of a light-emitting element, and improving light-emitting brightness.

[0237] (2) The total content of chlorine and bromine elements in the total solid content of the photosensitive composition is 0.0010 to 1,000 mass ppm, and the total content of chloride ions and bromide ions in the total solid content of the photosensitive composition is 0.0010 to 1,000 mass ppm.

[0238] In the case of satisfying the above condition (2), the photosensitive composition of the present application preferably contains a chlorine element-containing component and / or a bromine element-containing component, and also contains a chloride ion-containing component and / or a bromide ion-containing component.

[0239] It is considered that by containing a trace amount of the above specific halogen component in the photosensitive composition, the polar group possessed by the resin in the photosensitive composition is stabilized through interaction with the specific halogen component. In particular, in the case of containing polysiloxane in the photosensitive composition, stabilization of silanol groups in the polysiloxane is suitable. Furthermore, it is considered that through interaction with the resin in the photosensitive composition via a non-shared electron pair, an empty atomic orbital, i.e., a 3d orbital, it is possible to control the polarized structure, charge balance in the photosensitive composition. As a result, the effect of improving storage stability becomes remarkable.

[0240] The description of the improvement in sensitivity at the time of exposure, suppression of post-development residue, improvement in reliability of a light-emitting element, and improvement in light-emitting brightness in the photosensitive composition of the second and third modes of the present application is as described above for the photosensitive composition of the first mode of the present application.

[0241] <Content of Fluorine Element>

[0242] The photosensitive composition of the present application preferably satisfies the following (1a) from the viewpoint of suppressing post-development residue, improving reliability of a light-emitting element, and improving light-emitting brightness. The photosensitive composition of the present application more preferably also satisfies the following (2a).

[0243] (1a) The content of fluorine element in the total solid content of the photosensitive composition is 1,000 mass ppm or less

[0244] (2a) The content of fluoride ions in the total solid content of the photosensitive composition is 1,000 mass ppm or less.

[0245] From the viewpoint of the effects of the present invention described above, the content of the fluorine element in the total solid content of the photosensitive composition is preferably 0 mass ppm or more, more preferably 0.010 mass ppm or more, further preferably 0.030 mass ppm or more, more further preferably 0.050 mass ppm or more, particularly preferably 0.070 mass ppm or more, most preferably 0.10 mass ppm or more. On the other hand, from the viewpoint of the effects of the present invention described above, the content of the fluorine element is preferably 1,000 mass ppm or less, more preferably 500 mass ppm or less, further preferably 300 mass ppm or less, particularly preferably 100 mass ppm or less. In addition, the content of the fluorine element is preferably 50 mass ppm or less, more preferably 30 mass ppm or less, further preferably 10 mass ppm or less, more further preferably 5 mass ppm or less, particularly preferably 3 mass ppm or less, most preferably 1 mass ppm or less.

[0246] The preferable range of the content of the fluoride ion in the total solid content of the photosensitive composition is also the same as the preferable range of the content of the fluorine element in the total solid content of the photosensitive composition described above.

[0247] The content of the fluorine element in the total solid content of the photosensitive composition can be 0 mass ppm. The content of the fluoride ion in the total solid content of the photosensitive composition can also be 0 mass ppm. In the case where the content of the fluorine element in the total solid content of the photosensitive composition and / or the content of the fluoride ion in the total solid content of the photosensitive composition exceeds 0 mass ppm, it is preferable that (A) the binder resin, (C) the photosensitive agent, (B) the compound, or (F) the crosslinking agent have a fluorine atom or a fluoride ion in the structure, or further contain a component containing a fluorine element and / or a component containing a fluoride ion, in the photosensitive composition of the present invention.

[0248] The component containing a fluorine element is preferably a phenol compound having a substituent containing a fluoroalkyl group, a fluoroalkyl compound, a fluorocycloalkyl compound, or a fluoroaryl compound. The component containing a fluoride ion preferably contains an ammonium ion, a primary ammonium ion, a secondary ammonium ion, a tertiary ammonium ion, or a quaternary ammonium ion as a cation species. The quaternary ammonium ion preferably has a linear or branched hydrocarbon group. The hydrocarbon group is preferably an alkyl group having 1 to 15 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, or a hydroxyalkyl group having 1 to 6 carbon atoms, more preferably an alkyl group having 1 to 10 carbon atoms, further preferably an alkyl group having 1 to 6 carbon atoms.

[0249] It is inferred that in the photosensitive composition, by making the content of the compound having a fluorine atom in the structure, the component containing a fluorine element, etc. be below a certain value, the content of the fluorine element, the fluoride ion, or the anion containing the fluorine element from these components becomes below a certain value, and thus the protons in the photosensitive composition are locally activated by the interaction such as hydrogen bonding of the components in the photosensitive composition. Therefore, it is considered that the effect of suppressing the residue after development becomes remarkable by the effect of promoting the dissolution in the developing solution. In addition, it is considered that by intentionally making the content of the above components below a certain value, the polarized structure, the charge balance in the cured product are controlled. As a result, it is inferred that the reliability and the luminous brightness of the light emitting element are improved by suppressing the ion migration, the electromigration due to the metal impurities, the ionic impurities which adversely affect the light emitting properties or the electrical insulation properties. In addition, it is inferred that the reliability of the display device is improved due to the migration suppression, the aggregation suppression of the metal in the electrode or the metal in the metal wiring.

[0250] <Content of water>

[0251] The photosensitive composition of the first mode of the present application further contains water, and satisfies the condition of the following (3).

[0252] (3) The content of water in the photosensitive composition is 0.010 to 3.0 mass%.

[0253] From the viewpoint of improving the sensitivity at the time of exposure, suppressing the residue after development, and improving the reliability of the light emitting element, the photosensitive composition of the second mode and the third mode of the present application preferably further contains water, and satisfies the condition of the above (3). In addition, the photosensitive composition of the present application becomes remarkable in the effect of suppressing the generation of foreign matters at the time of storage, and improving the storage stability by making the content of water within a certain range.

[0254] From the viewpoint of improving the sensitivity at the time of exposure, suppressing the residue after development, improving the storage stability, and improving the reliability of the light emitting element, the content of water in the photosensitive composition is preferably 0.030 mass% or more, more preferably 0.050 mass% or more, further preferably 0.070 mass% or more, particularly preferably 0.10 mass% or more. On the other hand, from the viewpoint of improving the sensitivity at the time of exposure, suppressing the residue after development, improving the storage stability, and improving the reliability of the light emitting element, the content of water is preferably 2.5 mass% or less, more preferably 2.2 mass% or less, further preferably 2.0 mass% or less. Furthermore, it is preferably 1.7 mass% or less, more preferably 1.5 mass% or less, further preferably 1.2 mass% or less, more further preferably 1.0 mass% or less, particularly preferably 0.70 mass% or less, most preferably 0.50 mass% or less.

[0255] It is considered that by making the content of water in the photosensitive composition within the above range, the polarity groups possessed by the resin in the photosensitive composition become stabilized by the interactions of the dipole moment, hydrogen bond, and the like of the water molecules. Particularly in the case where a polysiloxane is contained in the photosensitive composition, stabilization of the silanol groups in the polysiloxane is suitable. As a result, the effect of improving the storage stability becomes remarkable. In addition, it is inferred that the above water captures metal impurities, ionic impurities, and the like that adversely affect the electrical insulation property by the interactions of the dipole moment, hydrogen bond, and the like of the water molecules, and thus ion migration, electromigration is suppressed, and the reliability of the light-emitting element is improved.

[0256] The description of the improvement of the sensitivity at the time of exposure and the suppression of the post-development residue caused by the content of water in the photosensitive composition of the second and third modes of the present application is as described above for the photosensitive composition of the first mode of the present application.

[0257] <Content of Specific Anion and Specific Phosphorus Compound>

[0258] From the viewpoints of improving the sensitivity at the time of exposure, suppressing the post-development residue, improving the storage stability, improving the reliability of the light-emitting element, and improving the luminance of light emission, the photosensitive composition of the present application preferably contains one or more selected from the group consisting of sulfate ions, sulfite ions, nitrate ions, nitrite ions, phosphate ions, phosphite ions, hypophosphite ions, formate ions, acetate ions, and oxalate ions (hereinafter referred to as "specific anions"), and satisfies the following condition (4); and / or

[0259] contains one or more selected from the group consisting of phosphoric acid esters, phosphonic acids, phosphonic acid esters, phosphorous acid esters, hypophosphorous acids, and hypophosphorous acid esters (hereinafter referred to as "specific phosphorus compounds"), and satisfies the following condition (5).

[0260] (4) The total content of sulfate ions, sulfite ions, nitrate ions, nitrite ions, phosphate ions, phosphite ions, hypophosphite ions, formate ions, acetate ions, and oxalate ions in the total solid content of the photosensitive composition is 0.0010 to 30,000 mass ppm

[0261] (5) The total content of phosphoric acid esters, phosphonic acids, phosphonic acid esters, phosphorous acid esters, hypophosphorous acids, and hypophosphorous acid esters in the total solid content of the photosensitive composition is 0.0010 to 30,000 mass ppm.

[0262] In the case where the above condition (4) is satisfied, the photosensitive composition of the present application preferably contains a component containing a specific anion. The component containing a specific anion preferably contains an ammonium ion, a primary ammonium ion, a secondary ammonium ion, a tertiary ammonium ion, or a quaternary ammonium ion as a cation species. The quaternary ammonium ion is preferably a specific quaternary ammonium ion described later, and more preferably satisfies the condition of (6) described later.

[0263] The specific phosphorus compound is preferably a compound having a substituent containing a carbon element, and having an acidic group containing a phosphorus element. The substituent containing a carbon element preferably has an aliphatic group having a valence of 1 to 2 and a carbon atom number of 1 to 18, an alicyclic group having a valence of 1 to 2 and a carbon atom number of 4 to 18, an aromatic group having a valence of 1 to 2 and a carbon atom number of 6 to 15, a fluorine-containing aliphatic group having a valence of 1 to 2 and a carbon atom number of 1 to 18, a fluorine-containing alicyclic group having a valence of 1 to 2 and a carbon atom number of 4 to 18, or a fluorine-containing aromatic group having a valence of 1 to 2 and a carbon atom number of 6 to 15. The specific phosphorus compound is preferably a monoester phosphate, a diester phosphate, a phosphonic acid, a monoester phosphonic acid, a monoester phosphorous acid, a diester phosphorous acid, a hypophosphorous acid, or a monoester hypophosphorous acid.

[0264] From the viewpoint of improving sensitivity at the time of exposure, suppressing residue after development, improving storage stability, improving reliability of a light-emitting element, and improving luminance of a light-emitting element, the total of the content of the specific anion and the total of the content of the specific phosphorus compound in the total solid content of the photosensitive composition is preferably 0.010 mass ppm or more, more preferably 0.030 mass ppm or more, further preferably 0.050 mass ppm or more, more further preferably 0.070 mass ppm or more, and particularly preferably 0.10 mass ppm or more. On the other hand, from the viewpoint of improving sensitivity at the time of exposure, suppressing residue after development, improving storage stability, improving reliability of a light-emitting element, and improving luminance of a light-emitting element, the total of the content of the specific anion and the total of the content of the specific phosphorus compound is preferably 25,000 mass ppm or less, more preferably 20,000 mass ppm or less, further preferably 15,000 mass ppm or less. Furthermore, it is preferably 12,000 mass ppm or less, more preferably 10,000 mass ppm or less, further preferably 7,000 mass ppm or less, more further preferably 5,000 mass ppm or less, particularly preferably 3,000 mass ppm or less, and most preferably 1,000 mass ppm or less. Furthermore, from the viewpoint of improving the above-described properties, it is preferably 500 mass ppm or less, more preferably 300 mass ppm or less, further preferably 100 mass ppm or less. Furthermore, it is preferably 50 mass ppm or less, more preferably 30 mass ppm or less, further preferably 10 mass ppm or less, more further preferably 5 mass ppm or less, particularly preferably 3 mass ppm or less, and most preferably 1 mass ppm or less.

[0265] By containing the specific anion or the specific phosphorus compound described above in the photosensitive composition, the effects of improving the sensitivity at the time of exposure and suppressing the residue after development become remarkable, also by the effects of promoting the dissolution in the developing solution and preventing the attachment of the residue at the opening portion. In addition, the effects of improving the storage stability become remarkable, by the stabilization of the polar group possessed by the resin in the photosensitive composition, and the control of the polarized structure, charge balance in the photosensitive composition. Furthermore, it is inferred that the reliability of the light emitting element is improved, by the migration suppression, aggregation suppression of the metal resulting from the control of the polarized structure, charge balance in the cured product. Furthermore, it is inferred that the light emission brightness is improved, by the control of the electrical conductivity resulting from the surface modification of the wiring surface.

[0266] <Content of tertiary amine compound and quaternary ammonium ion>

[0267] From the viewpoint of improving the sensitivity at the time of exposure, suppressing the residue after development, improving the storage stability, improving the reliability of the light emitting element, and improving the light emission brightness, the photosensitive composition of the present application preferably further contains a tertiary amine compound and / or a quaternary ammonium ion, and satisfies the following condition (6).

[0268] (6) The total content of the tertiary amine compound and the quaternary ammonium ion in the total solid content of the photosensitive composition is 0.0010 to 50,000 mass ppm.

[0269] In the case where the above condition (6) is satisfied and the quaternary ammonium ion is contained, the photosensitive composition of the present application preferably contains a component containing the quaternary ammonium ion. The component containing the quaternary ammonium ion preferably contains an anion species. The anion species is preferably the chloride ion described above, the bromide ion described above, or the specific anion described above, and more preferably satisfies the above condition (1), condition (2), or condition (4).

[0270] The tertiary amine compound preferably contains a compound represented by General Formula (18) (hereinafter referred to as "specific tertiary amine compound"). The quaternary ammonium ion preferably contains a compound represented by General Formula (19) (hereinafter referred to as "specific quaternary ammonium ion").

[0271] [Chemical Formula 5]

[0272]

[0273] In General Formula (18) and General Formula (19), R 31 ~R 37 each independently represents an alkyl group having 1 to 15 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, or a hydroxyalkyl group having 1 to 6 carbon atoms. In General Formula (18) and General Formula (19), R31 ~R 37 Each of R1to R4is preferably independently an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 4 to 7 carbon atoms, or an aryl group having 6 to 10 carbon atoms. The substituents and structures described above can have a heteroatom and can be any of unsubstituted or substituted.

[0274] From the viewpoint of improving sensitivity at the time of exposure, inhibiting residue after development, improving storage stability, improving reliability of the light-emitting element, and improving luminance of light emission, the total content of the tertiary amine compound and the quaternary ammonium ion in the total solid content of the photosensitive composition is preferably 0.010 mass ppm or more, more preferably 0.030 mass ppm or more, further preferably 0.050 mass ppm or more, more further preferably 0.070 mass ppm or more, and particularly preferably 0.10 mass ppm or more. On the other hand, from the viewpoint of improving sensitivity at the time of exposure, inhibiting residue after development, improving storage stability, improving reliability of the light-emitting element, and improving luminance of light emission, the total content of the tertiary amine compound and the quaternary ammonium ion is preferably 30,000 mass ppm or less, more preferably 25,000 mass ppm or less, further preferably 20,000 mass ppm or less, particularly preferably 15,000 mass ppm or less. Furthermore, it is preferably 12,000 mass ppm or less, more preferably 10,000 mass ppm or less, further preferably 7,000 mass ppm or less, more further preferably 5,000 mass ppm or less, particularly preferably 3,000 mass ppm or less, and most preferably 1,000 mass ppm or less. Furthermore, from the viewpoint of improving the above-described properties, it is preferably 500 mass ppm or less, more preferably 300 mass ppm or less, and further preferably 100 mass ppm or less. Furthermore, it is preferably 50 mass ppm or less, more preferably 30 mass ppm or less, further preferably 10 mass ppm or less, more further preferably 5 mass ppm or less, particularly preferably 3 mass ppm or less, and most preferably 1 mass ppm or less.

[0275] By containing a trace amount of the above-described tertiary amine compound or the above-described quaternary ammonium ion in the photosensitive composition, the effects of improving sensitivity at the time of exposure and inhibiting residue after development become remarkable, similarly by the effects of promoting dissolution in a developing solution and preventing attachment of residue at an opening. In addition, the effects of improving storage stability become remarkable by stabilization of the polar group possessed by the resin in the photosensitive composition and control of the polarized structure and charge balance in the photosensitive composition. Furthermore, it is inferred that the reliability of the light-emitting element is improved by migration inhibition and aggregation inhibition of metal resulting from control of the polarized structure and charge balance in the cured product. Furthermore, it is inferred that the luminance of light emission is improved by control of conductivity resulting from surface modification of the wiring surface.

[0276] <Content of methanol and ethanol>

[0277] From the viewpoint of improving sensitivity at the time of exposure, inhibiting residue after development, improving storage stability, and improving luminance, the photosensitive composition of the present application preferably further contains methanol and / or ethanol, and satisfies the following (7).

[0278] (7) The content of methanol and ethanol in the photosensitive composition is a total of 0.0010 to 30,000 mass ppm.

[0279] From the viewpoint of improving sensitivity at the time of exposure, inhibiting residue after development, improving storage stability, and improving luminance, the content of methanol and ethanol in the photosensitive composition is preferably a total of 0.010 mass ppm or more, more preferably 0.030 mass ppm or more, further preferably 0.050 mass ppm or more, more further preferably 0.070 mass ppm or more, particularly preferably 0.10 mass ppm or more. On the other hand, from the viewpoint of improving sensitivity at the time of exposure, inhibiting residue after development, improving storage stability, and improving luminance, the content of methanol and ethanol is preferably a total of 25,000 mass ppm or less, more preferably 20,000 mass ppm or less, further preferably 15,000 mass ppm or less. Furthermore, it is preferably 12,000 mass ppm or less, more preferably 10,000 mass ppm or less, further preferably 7,000 mass ppm or less, more further preferably 5,000 mass ppm or less, particularly preferably 3,000 mass ppm or less, most preferably 1,000 mass ppm or less. Furthermore, from the viewpoint of improving the above-mentioned properties, it is preferably 500 mass ppm or less, more preferably 300 mass ppm or less, further preferably 100 mass ppm or less. Furthermore, it is preferably 50 mass ppm or less, more preferably 30 mass ppm or less, further preferably 10 mass ppm or less, more further preferably 5 mass ppm or less, particularly preferably 3 mass ppm or less, most preferably 1 mass ppm or less.

[0280] By containing a trace amount of the above-mentioned methanol or ethanol in the photosensitive composition, the effect of improving sensitivity at the time of exposure and inhibiting residue after development becomes remarkable by utilizing the effect of promoting dissolution in a developing solution due to the hydrophilicity of the compound. In addition, the surface of the substrate is surface-modified by the compound, so the effect of inhibiting residue after development becomes remarkable by preventing the attachment of residue at the opening portion.

[0281] In addition, it is considered that by intentionally containing a trace amount of the above-mentioned compound, the polarity group of the resin in the photosensitive composition becomes stable by the interaction via hydrogen bonding by the hydroxyl group in the compound. In particular, in the case where a polysiloxane is contained in the photosensitive composition, stabilization of the silanol group in the polysiloxane is suitable. Furthermore, it is considered that by the hydroxyl group in the compound, the polarized structure, charge balance in the photosensitive composition can be controlled. As a result, the effect of improving the storage stability becomes remarkable. Furthermore, it is inferred that when a pattern of the photosensitive composition is formed on a wiring such as a metal, by the above-mentioned compound in the photosensitive composition, the wiring surface that becomes an opening portion or the wiring surface that interfaces with the pattern is surface-modified by the compound. In addition, it is considered that the hydroxyl group in the compound contained in the cured product captures a trace amount of metal impurities, ionic impurities in the cured product, and these impurities migrate to the wiring surface, thereby functioning as a carrier in the wiring. As a result, it is inferred that the conductivity of the wiring such as a metal can be controlled, low-voltage driving can be achieved, and thus the luminance is improved.

[0282] <Content of the 1st Specific Compound (Alcohol Compound, Ester Compound, and Ether Compound)>

[0283] From the viewpoint of improving the sensitivity at the time of exposure, suppressing the residue after development, improving the storage stability, and improving the luminance, the photosensitive composition of the present application preferably further contains one or more selected from the group consisting of 1-methoxy-2-propanol, 1-ethoxy-2-propanol, methyl acetate, ethyl acetate, allyl methyl ether, allyl ethyl ether, isopropenyl methyl ether, and isopropenyl ethyl ether (hereinafter referred to as "1st specific compound") and satisfies the following condition (8).

[0284] (8) The total content of 1-methoxy-2-propanol, 1-ethoxy-2-propanol, methyl acetate, ethyl acetate, allyl methyl ether, allyl ethyl ether, isopropenyl methyl ether, and isopropenyl ethyl ether in the photosensitive composition is 0.0010 to 30,000 mass ppm.

[0285] From the viewpoint of improving sensitivity at the time of exposure, inhibiting residue after development, improving storage stability, and improving luminance, the total content of the first specific compound in the photosensitive composition is preferably 0.010 mass ppm or more, more preferably 0.030 mass ppm or more, further preferably 0.050 mass ppm or more, more further preferably 0.070 mass ppm or more, and particularly preferably 0.10 mass ppm or more. On the other hand, from the viewpoint of improving sensitivity at the time of exposure, inhibiting residue after development, improving storage stability, and improving luminance, the total content of the first specific compound is preferably 25,000 mass ppm or less, more preferably 20,000 mass ppm or less, further preferably 15,000 mass ppm or less. In addition, it is preferably 12,000 mass ppm or less, more preferably 10,000 mass ppm or less, further preferably 7,000 mass ppm or less, more further preferably 5,000 mass ppm or less, particularly preferably 3,000 mass ppm or less, and most preferably 1,000 mass ppm or less. In addition, from the viewpoint of improving the above-described properties, it is preferably 500 mass ppm or less, more preferably 300 mass ppm or less, and further preferably 100 mass ppm or less. In addition, it is preferably 50 mass ppm or less, more preferably 30 mass ppm or less, further preferably 10 mass ppm or less, more further preferably 5 mass ppm or less, particularly preferably 3 mass ppm or less, and most preferably 1 mass ppm or less.

[0286] By containing a trace amount of the above-described first specific compound in the photosensitive composition, the effects of improving sensitivity at the time of exposure and inhibiting residue after development become remarkable, similarly, by the effects of promoting dissolution in a developer and preventing attachment of residue at an opening portion. In addition, the effects of improving storage stability become remarkable, by stabilization of the polar group possessed by the resin in the photosensitive composition, and control of the polarized structure, charge balance in the photosensitive composition. In addition, it is inferred that the luminance is improved, by surface modification of the wiring surface and control of conductivity caused by migration of metal impurities and ionic impurities to the wiring surface.

[0287] <Content of the Second Specific Compound (Alcohol Compound, Ester Compound, and Ether Compound)>

[0288] The photosensitive composition of the second aspect of the present application further contains one or more selected from the group consisting of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, (2-methoxy-1-propyl) acetate, (2-ethoxy-1-propyl) acetate, methyl allyl methyl ether, and methyl allyl ethyl ether (hereinafter referred to as "second specific compound"), and satisfies the following condition (9c).

[0289] (9c) The total content of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, (2-methoxy-1-propyl) acetate, (2-ethoxy-1-propyl) acetate, methyl allyl methyl ether, and methyl allyl ethyl ether in the photosensitive composition is 0.0010 to 10,000 mass ppm.

[0290] From the viewpoint of improving sensitivity at the time of exposure, suppressing residue after development, improving storage stability, and improving luminance, the photosensitive composition of the first and third modes of the present application preferably further contains one or more selected from the group consisting of the above-mentioned 2nd specific compounds, and satisfies the condition of (9c) above.

[0291] From the viewpoint of improving sensitivity at the time of exposure, suppressing residue after development, improving storage stability, and improving luminance, the photosensitive composition of the present application more preferably further contains one or more selected from the group consisting of the 2nd specific compounds, and satisfies the condition of (9b) below.

[0292] (9b) The total content of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, (2-methoxy-1-propyl) acetate, (2-ethoxy-1-propyl) acetate, methyl allyl methyl ether, and methyl allyl ethyl ether in the photosensitive composition exceeds 1,000 mass ppm and is 10,000 mass ppm or less.

[0293] From the viewpoint of improving sensitivity at the time of exposure, suppressing residue after development, improving storage stability, and improving luminance, the photosensitive composition of the present application further preferably further contains one or more selected from the group consisting of the 2nd specific compounds, and satisfies the condition of (9a) below.

[0294] (9a) The total content of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, (2-methoxy-1-propyl) acetate, (2-ethoxy-1-propyl) acetate, methyl allyl methyl ether, and methyl allyl ethyl ether in the photosensitive composition is 0.0010 to 1,000 mass ppm.

[0295] From the viewpoint of improving sensitivity at the time of exposure, suppressing residue after development, improving storage stability, and improving luminance, the total of the amounts of the second specific compound in the photosensitive composition is preferably 0.010 mass ppm or more, more preferably 0.030 mass ppm or more, further preferably 0.050 mass ppm or more, more further preferably 0.070 mass ppm or more, and particularly preferably 0.10 mass ppm or more. On the other hand, from the viewpoint of improving sensitivity at the time of exposure, suppressing residue after development, improving storage stability, and improving luminance, the total of the amounts of the second specific compound is preferably 7,000 mass ppm or less, more preferably 5,000 mass ppm or less, further preferably 3,000 mass ppm or less, and particularly preferably 1,000 mass ppm or less. Furthermore, from the viewpoint of improving the above-mentioned properties, it is preferably 500 mass ppm or less, more preferably 300 mass ppm or less, and further preferably 100 mass ppm or less. Furthermore, it is preferably 50 mass ppm or less, more preferably 30 mass ppm or less, further preferably 10 mass ppm or less, more further preferably 5 mass ppm or less, particularly preferably 3 mass ppm or less, and most preferably 1 mass ppm or less.

[0296] By containing a trace amount of the above-mentioned second specific compound in the photosensitive composition, the effects of improving sensitivity at the time of exposure, suppressing residue after development, improving storage stability, and improving luminance become remarkable, as with the first specific compound. In the case where the photosensitive composition of the present application contains the above-mentioned polyimide-based resin, from the viewpoint of improving sensitivity at the time of exposure, improving reliability of the light-emitting element, and improving luminance, the photosensitive composition of the present application more preferably satisfies the above-mentioned condition (9c). In the case where the photosensitive composition of the present application satisfies the above-mentioned condition (9c), the polyimide-based resin more preferably contains a polyimide-based resin having a weak acid group.

[0297] <Specific ketone compound>

[0298] From the viewpoint of improving sensitivity at the time of exposure, suppressing residue after development, improving storage stability, and improving luminance, the photosensitive composition of the present application preferably further contains 4-methyl-3-penten-2-one and / or 4-methyl-4-penten-2-one (hereinafter referred to as "specific ketone compound") and satisfies the following condition (10).

[0299] (10) The total of the amounts of 4-methyl-3-penten-2-one and 4-methyl-4-penten-2-one in the photosensitive composition is 0.010 to 10.0 mass %.

[0300] From the viewpoint of improving sensitivity at the time of exposure, suppressing residue after development, improving storage stability, and improving luminance, the total of the content of the specific ketone compound in the photosensitive composition is preferably 0.030 mass% or more, more preferably 0.050 mass% or more, further preferably 0.070 mass% or more, particularly preferably 0.10 mass% or more. On the other hand, from the viewpoint of improving sensitivity at the time of exposure, suppressing residue after development, improving storage stability, and improving luminance, the total of the content of the specific ketone compound is preferably 7.0 mass% or less, more preferably 5.0 mass% or less, further preferably 3.0 mass% or less, more further preferably 2.5 mass% or less, particularly preferably 2.2 mass% or less, most preferably 2.0 mass% or less. Furthermore, it is preferably 1.7 mass% or less, more preferably 1.5 mass% or less, further preferably 1.2 mass% or less, more further preferably 1.0 mass% or less, particularly preferably 0.70 mass% or less, most preferably 0.50 mass% or less.

[0301] By containing a trace amount of the above specific ketone compound in the photosensitive composition, the effects of improving sensitivity at the time of exposure, suppressing residue after development, improving storage stability, and improving luminance become remarkable, as with the first specific compound.

[0302] <Specific heterocyclic compound>

[0303] From the viewpoint of improving sensitivity at the time of exposure, suppressing residue after development, improving storage stability, and improving luminance, the photosensitive composition of the present application preferably further contains one or more selected from the group consisting of N-methylpyrrolidone, N-ethylpyrrolidone, 1,4-dioxane, and tetrahydrofuran (hereinafter referred to as "specific heterocyclic compound") and satisfies the following condition (11). In the case where the (C) photosensitizer contains the (Cl) naphthoquinone diazide compound, the photosensitive composition of the present application more preferably further contains one or more selected from the group consisting of the specific heterocyclic compound and satisfies the following condition (11), from the viewpoint of the effects of the present application.

[0304] (11) The total of the content of N-methylpyrrolidone, N-ethylpyrrolidone, 1,4-dioxane, and tetrahydrofuran in the photosensitive composition is 0.0010 to 1,000 mass ppm.

[0305] From the viewpoint of improving sensitivity at the time of exposure, suppressing residue after development, improving storage stability, and improving luminance, the total content of the specific heterocyclic compounds in the photosensitive composition is preferably 0.010 mass ppm or more, more preferably 0.030 mass ppm or more, further preferably 0.050 mass ppm or more, more further preferably 0.070 mass ppm or more, and particularly preferably 0.10 mass ppm or more. On the other hand, from the viewpoint of improving sensitivity at the time of exposure, suppressing residue after development, improving storage stability, and improving luminance, the total content of the second specific compounds is preferably 500 mass ppm or less, more preferably 300 mass ppm or less, further preferably 100 mass ppm or less. In addition, it is preferably 50 mass ppm or less, more preferably 30 mass ppm or less, further preferably 10 mass ppm or less, more further preferably 5 mass ppm or less, particularly preferably 3 mass ppm or less, and most preferably 1 mass ppm or less.

[0306] By containing a trace amount of the above specific heterocyclic compound in the photosensitive composition, the effects of improving sensitivity at the time of exposure, suppressing residue after development, improving storage stability, and improving luminance become remarkable, as with the first specific compound.

[0307] <Content of Specific Nitrogen-Containing Compound>

[0308] From the viewpoint of improving reliability of the light-emitting element and improving luminance, the photosensitive composition of the present application preferably further contains one or more selected from the group consisting of an amide compound represented by General Formula (21), a cyclic urea compound represented by General Formula (22), a urea compound represented by General Formula (23), an oxazolidinone compound represented by General Formula (24), and an isoxazolidinone compound represented by General Formula (25) (hereinafter referred to as "specific nitrogen-containing compound"), and satisfies the following condition (12).

[0309] (12) The total content of the amide compound represented by General Formula (21), the cyclic urea compound represented by General Formula (22), the urea compound represented by General Formula (23), the oxazolidinone compound represented by General Formula (24), and the isoxazolidinone compound represented by General Formula (25) in the total solid content of the photosensitive composition is 0.010 mass% or more and 5.0 mass% or less.

[0310] [Chemical Formula 6]

[0311]

[0312] In General Formulas (21) to (25), R 47 ~R 56each independently represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, or a hydroxyalkyl group having 1 to 6 carbon atoms. R 130 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a hydroxyalkyl group having 1 to 6 carbon atoms, a hydroxyalkoxy group having 1 to 6 carbon atoms, a hydroxy group, an amino group, a monoalkylamino group having 1 to 6 carbon atoms, or a dialkylamino group having 2 to 12 carbon atoms. R 132 , R 133 , and R 137 to R 142 each independently represents an alkyl group having 1 to 6 carbon atoms. β and γ each independently represent an integer of 0 to 6. b, c, h, i, j, k, 1, and m each independently represent an integer of 0 to 2. In the case where β is 0, b is 0. In the case where γ is 0, c is 0.

[0313] As the specific nitrogen-containing compound, for example, N,N-dimethylformamide, N,N-diethylformamide, N,N-dimethylacetamide, N,N-dimethylpropionamide, N,N-dimethylisobutyramide, N,N-dimethyl-3-methoxypropionamide, N,N-dimethyl-3-butoxypropionamide, 1,3-dimethyl-2-imidazolinone, 1,3-diethyl-2-imidazolinone, N,N'-dimethylpropyleneurea, 1,1,3,3-tetramethylurea, or 1,1,3,3-tetraethylurea can be given.

[0314] From the viewpoint of improving the reliability of the light-emitting element and improving the luminance of light emission, the total of the content of the specific nitrogen-containing compound in the total solid content of the photosensitive composition is preferably 0.030 mass% or more, more preferably 0.050 mass% or more, further preferably 0.070 mass% or more, particularly preferably 0.10 mass% or more. On the other hand, from the viewpoint of improving the reliability of the light-emitting element and improving the luminance of light emission, the total of the content of the specific nitrogen-containing compound is preferably 4.0 mass% or less, more preferably 3.5 mass% or less, further preferably 3.0 mass% or less. Further preferably 2.5 mass% or less, more preferably 2.0 mass% or less, further preferably 1.5 mass% or less, more further preferably 1.0 mass% or less, particularly preferably 0.70 mass% or less, most preferably 0.50 mass% or less.

[0315] It is inferred that the metal impurities, ion impurities, and the like, which adversely affect the electrical insulation, are captured by the nitrogen-containing structure having a non-shared electron pair through the specific nitrogen-containing compound containing a trace amount of the above, and thus the ion migration and the electromigration are suppressed, and the reliability of the light emitting element is improved. In addition, it is inferred that the wiring surface is surface-modified by the migration of the specific nitrogen-containing compound contained in the cured product, and the light emitting brightness is improved by the control of the conductivity of the wiring using a metal or the like. In the case where the photosensitive composition of the present application contains the above-mentioned polyimide-based resin, the photosensitive composition of the present application is more preferably satisfies the above-mentioned condition (12) from the viewpoint of improving the sensitivity at the time of exposure, improving the reliability of the light emitting element, and improving the light emitting brightness. In the case where the photosensitive composition of the present application satisfies the above-mentioned condition (12), the polyimide-based resin is more preferably contains a polyimide-based resin having a weakly acidic group.

[0316] <Content of Specific Silicone Resin>

[0317] The photosensitive composition of the third aspect of the present application further contains an (AS) silicone resin, the (AS) silicone resin has a trifunctional organosilane unit represented by General Formula (11) and / or a tetrafunctional organosilane unit represented by General Formula (12), and the total content ratio of the trifunctional organosilane unit represented by General Formula (11) and the tetrafunctional organosilane unit represented by General Formula (12) in the (AS) silicone resin is 90 to 100 mol%.

[0318] [Chemical Formula 7]

[0319]

[0320] In General Formula (11) and General Formula (12), R 66 represents an alkyl group having 1 to 6 carbon atoms. 3 Each independently represents a bonding point in the resin. In General Formula (11) and General Formula (12), R 66 is preferably an alkyl group having 1 to 4 carbon atoms, and is more preferably a methyl group or an ethyl group. The above-mentioned substituent and structure can have a heteroatom, and can be any of an unsubstituted or a substituted one.

[0321] From the viewpoint of improving the sensitivity at the time of exposure, suppressing the residue after development, improving the storage stability, and improving the light emitting brightness, it is preferable that the photosensitive composition of the first aspect and the second aspect of the present application further contains an (AS) silicone resin, the (AS) silicone resin has a trifunctional organosilane unit represented by the above-mentioned General Formula (11) and / or a tetrafunctional organosilane unit represented by the above-mentioned General Formula (12), and the total content ratio of the trifunctional organosilane unit represented by the above-mentioned General Formula (11) and the tetrafunctional organosilane unit represented by the above-mentioned General Formula (12) in the (AS) silicone resin is 90 to 100 mol%.

[0322] From the viewpoint of improving sensitivity at the time of exposure, inhibiting residue after development, improving storage stability, and improving luminance, the ratio of the content of the above-described tri-functional organosilane unit represented by General Formula (11) in the (AS) silicone resin and the ratio of the content of the above-described tetra-functional organosilane unit represented by General Formula (12) in the (AS) silicone resin is preferably 95 to 100 mol%, more preferably 97 to 100 mol%, and further preferably 99 to 100 mol% in terms of the molar ratio of Si atoms.

[0323] From the viewpoint of improving sensitivity at the time of exposure, inhibiting residue after development, improving storage stability, and improving luminance, the photosensitive composition of the present application preferably also satisfies the following condition of (S1).

[0324] (S1) The content of the (AS) silicone resin in the total solid content of the photosensitive composition is 0.0010 to 1,000 mass ppm.

[0325] From the viewpoint of improving sensitivity at the time of exposure, inhibiting residue after development, improving storage stability, and improving luminance, the content of the (AS) silicone resin in the total solid content of the photosensitive composition is preferably 0.010 mass ppm or more, more preferably 0.030 mass ppm or more, further preferably 0.050 mass ppm or more, more further preferably 0.070 mass ppm or more, and particularly preferably 0.10 mass ppm or more. On the other hand, from the viewpoint of improving sensitivity at the time of exposure, inhibiting residue after development, improving storage stability, and improving luminance, the content of the (AS) silicone resin is preferably 500 mass ppm or less, more preferably 300 mass ppm or less, further preferably 100 mass ppm or less. Furthermore, it is preferably 50 mass ppm or less, more preferably 30 mass ppm or less, further preferably 10 mass ppm or less, more further preferably 5 mass ppm or less, particularly preferably 3 mass ppm or less, and most preferably 1 mass ppm or less.

[0326] From the viewpoint of improving sensitivity at the time of exposure, inhibiting residue after development, improving storage stability, and improving luminance, the (AS) silicone resin preferably contains (AS1) a resin formed from the tri-functional organosilane unit represented by General Formula (11) and / or (AS2) a resin formed from the tetra-functional organosilane unit represented by General Formula (12).

[0327] From the viewpoint of improving the storage stability and improving the luminance of light emission, the weight average molecular weight of the (AS) silicone resin is preferably 10,000 or more, more preferably 20,000 or more, further preferably 30,000 or more, more further preferably 50,000 or more, and particularly preferably 70,000 or more. On the other hand, from the viewpoint of improving the sensitivity at the time of exposure and suppressing the residue after development, the weight average molecular weight of the (AS) silicone resin is preferably 1,000,000 or less, more preferably 500,000 or less, further preferably 300,000 or less, and particularly preferably 100,000 or less.

[0328] The description of the improvement of the sensitivity at the time of exposure, the suppression of the residue after development, the improvement of the storage stability, and the improvement of the luminance of light emission by the (AS) silicone resin in the photosensitive composition of the first and second modes of the present application is as described above in the description of the photosensitive composition of the third mode of the present application.

[0329] Note that the (AS) silicone resin in the photosensitive composition of the present application is a resin different from the (A1x-1) resin: polysiloxane in the (Ax) resin in the (A1) resin containing a weakly acidic group.

[0330] Hydrogen ion index of diluted solution

[0331] When the photosensitive composition of the present application is diluted with water to prepare a diluted solution, and the solid content concentration of the diluted solution is 1 / 100 times the solid content concentration of the photosensitive composition, from the viewpoint of improving the sensitivity at the time of exposure, suppressing the residue after development, and improving the storage stability, the hydrogen ion index of the diluted solution is preferably 5.5 or more, more preferably 5.7 or more, further preferably 6.0 or more, more further preferably 6.2 or more, and particularly preferably 6.5 or more. On the other hand, from the viewpoint of improving the sensitivity at the time of exposure, suppressing the residue after development, and improving the storage stability, the hydrogen ion index of the diluted solution is preferably 7.0 or less, more preferably 6.9 or less, and further preferably 6.8 or less.

[0332] When the photosensitive composition of the present application is diluted with water to prepare a diluted solution, and the solid content concentration of the diluted solution is 1 / 100 times the solid content concentration of the photosensitive composition, from the viewpoint of the effects of the above-described application, the hydrogen ion index of the diluted solution is likewise preferably 5.5 or more, more preferably 5.7 or more, further preferably 6.0 or more, more further preferably 6.2 or more, and particularly preferably 6.5 or more. On the other hand, from the viewpoint of the effects of the above-described application, the hydrogen ion index of the diluted solution is likewise preferably 7.0 or less, more preferably 6.9 or less, and further preferably 6.8 or less.

[0333] The hydrogen ion exponent of the diluted solution of the photosensitive composition can be measured using a commercially available pH meter. First, the photosensitive composition is diluted with water so that the concentration of the solid components of the diluted solution is 1 / 100 of the concentration of the solid components of the photosensitive composition. Next, the prepared diluted solution is stirred for 10 minutes or more so that the components in the photosensitive composition reach a distribution equilibrium. After the stirring, the hydrogen ion exponent of the diluted solution is measured using a pH meter. Note that in the case where the diluted solution separates into an organic layer and an aqueous layer after the stirring, the hydrogen ion exponent of the aqueous layer is measured.

[0334] <Photosensitive film of the present application>

[0335] The photosensitive film of the present application is a film in a semi-cured state (B stage) obtained by forming the photosensitive composition of the present application into a film. The semi-cured state means a state in which a crosslinked structure is not formed, or a state in which a crosslinked structure is formed by a partial reaction, but the film still has fluidity, or the like. For example, a state in which a coating film is subjected to reduced pressure drying after being applied to a substrate or the like so that a solvent is distilled off, or a state in which a coating film is heated at 40 to 150°C so that it is dried, means a state in which the film is soluble in an alkaline solution or an organic solvent. The photosensitive film means a film having photosensitivity of a positive type or a negative type, and capable of forming a self-supporting film as a single film. The self-supporting film means a film having a width of 1.5 cm or more, a length of 5.0 cm or more, and a thickness of 5.0 μm or more, which is formed in a state without a support. The photosensitive film is preferably a laminate provided on a support. The support is preferably a flexible substrate, and can be a rigid substrate.

[0336] <Cured product of the photosensitive composition of the present application>

[0337] The cured product of the present application is a cured product obtained by curing the photosensitive composition of the present application. The curing means a state in which a crosslinked structure is formed by a reaction so that the fluidity of the film disappears, or the like. The reaction is not particularly limited, and is preferably a reaction based on heating, a reaction based on irradiation of energy rays, or the like. The state in which a crosslinked structure is formed by heating so that the fluidity of the film disappears is referred to as thermal curing. As the heating conditions, for example, conditions of heating at 150 to 500°C for 5 to 300 minutes, or the like, are exemplified. The cured product of the present application can be a cured product obtained by curing the photosensitive film of the present application.

[0338] From the viewpoint of suppressing reflection of external light and improving the reliability of the element, the optical density at the wavelength of visible light per 1 μm of the film thickness of the cured product of the present application is preferably 0.20 or more, more preferably 0.50 or more, and further preferably 1.0 or more. On the other hand, from the viewpoint of improving the sensitivity at the time of exposure and improving the reliability of the element, the optical density is preferably 3.0 or less, more preferably 2.0 or less, and more preferably 1.5 or less. Note that the optical density is preferably that of the cured product obtained by heating the composition to cure it. By having the optical density within the above range, the incident external light can be shielded, and thus the effect of suppressing the reflection of external light becomes significant. In addition, the light degradation of the cured product itself and the layer inside it can be suppressed, and thus the effect of improving the reliability of the element becomes significant.

[0339] < Element and article having a cured product>

[0340] The element of the present application has the cured product of the present application. In addition, the article of the present application has the cured product of the present application. As the article, for example, electronic parts, electronic devices, mobile bodies, buildings, or windows, and the like can be given. As the electronic parts, for example, semiconductor devices, antennas, display devices, metal-clad laminate sheets, wiring substrates, semiconductor packages, active parts or passive parts including semiconductor devices can be given. The photosensitive composition of the present application is preferably used for the formation of electronic parts. As the semiconductor devices, for example, semiconductor devices having a fan-out wafer level package structure, a fan-out panel level package structure, or a package antenna structure can be given. As the antennas, for example, microstrip antennas or stripline antennas can be given. As the display devices, for example, organic EL displays, quantum dot displays, Micro LED displays, Mini LED displays, or liquid crystal displays can be given. As the metal-clad laminate sheets, for example, printed circuit substrates can be given.

[0341] The electronic component of the present application has the cured product of the present application. Further, the display device of the present application has the cured product of the present application. The cured product of the present application can have both excellent reliability of a light-emitting element and high light-emission luminance. Therefore, the photosensitive composition of the present application is preferably used for formation of a pixel partition layer, a planarization layer of a TFT, a protective layer of a TFT, an interlayer insulating layer of a TFT, or a gate insulating layer in an organic EL display, a quantum dot display, or a Micro LED display. Further, the photosensitive composition of the present application is also preferably used for formation of a partition wall layer or a planarization layer in a Micro LED display or a Mini LED display. Preferably, the partition wall layer is formed between adjacent light-emitting elements, and the planarization layer is formed so as to cover at least a part of the light-emitting element. Note that the light-emitting element is preferably a semiconductor chip. That is, the photosensitive composition of the present application is particularly preferably used for formation of a partition wall layer formed between adjacent light-emitting elements or a planarization layer formed so as to cover at least a part of the light-emitting element.

[0342] < Hollow structure >

[0343] The hollow structure of the present application has the cured product of the present application. The electronic component of the present application preferably has the hollow structure of the present application. The hollow structure of the present application has a hollow structure support material and a hollow structure ceiling material. The photosensitive film of the present application is suitable for formation of a hollow structure. As an electronic component having a hollow structure, for example, a MEMS (Micro Electro Mechanical Systems) or the like can be given.

[0344] < Display device >

[0345] Hereinafter, the display devices of the fourth mode, the fifth mode, the sixth mode, the seventh mode, the eighth mode, and the ninth mode of the present application will be described. However, the present application is not limited to each of the following embodiments, and various modifications within the scope of the present application that can achieve the object of the present application and do not depart from the gist of the present application are of course permissible. Note that, in the case of describing the display device of the present application, the description is related to the display device of the fourth mode, the fifth mode, the sixth mode, the seventh mode, the eighth mode, and the ninth mode of the present application. On the other hand, in the case of describing the display device of a specific mode, the display device of the fourth mode or the like is described.

[0346] The display device of the fourth aspect of the present application has the configuration of the above-mentioned

[22] . By being configured as the above-mentioned

[22] , the display device of the present application can provide a display device in which the reliability of the light emitting element and the luminance of light emission are excellent. It is considered that this is because, by intentionally containing a trace amount of the above-mentioned component containing a chlorine element, a component containing a bromine element, a component containing a chloride ion, or a component containing a bromide ion in the barrier layer and / or the planarization layer, the polarization structure in the cured product and the charge balance can be controlled. As a result, it is inferred that ion migration, electric migration, and the like, which occur due to metal impurities and ion impurities that adversely affect the light emitting characteristics, can be suppressed, and the effect of achieving excellent reliability of the light emitting element is achieved by suppressing the migration and aggregation of metals in the electrode and the wiring. Furthermore, it is considered that the surface of the wiring at the opening portion or the surface of the wiring at the interface with the pattern is surface-modified by the migration of these components contained in the cured product. As a result, it is considered that the conductivity of the wiring, and the like, can be controlled, and the effect of achieving low-voltage driving and high luminance of light emission can be achieved.

[0347] The display device of the fifth aspect of the present application is a display device having a substrate, a rewiring layer, an interlayer insulating layer between the rewiring layer, and a light emitting element, further having a barrier layer and / or a planarization layer, in which the light emitting element is a semiconductor chip, the area of the rewiring layer is larger than the area of the light emitting element in plan view, the barrier layer is formed between adjacent light emitting elements, and the planarization layer is formed so as to cover at least a part of the light emitting element,

[0348] The barrier layer and / or the planarization layer contain (XA1) a resin containing a weakly acidic group, the (XA1) resin containing a weakly acidic group containing one or more selected from the group consisting of (XA1x-2) a resin: polyimide, (XA1x-3) a resin: a polyimide precursor, (XA1x-4) a resin: polybenzoxazole, (XA1x-5) a resin: a polybenzoxazole precursor, (XA1x-6) a resin: polyamideimide, (XA1x-7) a resin: a polyamideimide precursor, and (XA1x-8) a resin: polyamide (hereinafter referred to as "a polyimide-based resin having a weakly acidic group").

[0349] The barrier layer and / or the planarization layer contain one or more selected from the group consisting of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, (2-methoxy-1-propyl) acetate, (2-ethoxy-1-propyl) acetate, methyl allyl methyl ether, and methyl allyl ethyl ether (hereinafter referred to as "a second specific compound"), and satisfy the conditions of (X9ca) and / or (X9cb) below.

[0350] (X9ca) the total content of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, (2-methoxy-1-propyl) acetate, (2-ethoxy-1-propyl) acetate, methylallyl methyl ether, and methylallyl ethyl ether in the barrier layer is 0.0010 to 10,000 mass ppm

[0351] (X9cb) the total content of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, (2-methoxy-1-propyl) acetate, (2-ethoxy-1-propyl) acetate, methylallyl methyl ether, and methylallyl ethyl ether in the planarization layer is 0.0010 to 10,000 mass ppm.

[0352] By being configured as described above, the display device of the present application can provide a display device in which the reliability and luminance of the light emitting element are excellent. It is presumed that this is due to the effect caused by the interaction with the above-mentioned polyimide-based resin having a weakly acidic group, which is brought about by intentionally containing a trace amount of the above-mentioned 2nd specific compound in the barrier layer and / or the planarization layer, as with the presumed mechanism in the photosensitive composition of the second aspect of the present application.

[0353] The display device of the sixth aspect of the present application is a display device having a substrate, a rewiring layer, an interlayer insulating layer of the rewiring layer, and a light emitting element, further having a barrier layer and / or a planarization layer, wherein the light emitting element is a semiconductor chip, the area of the rewiring layer is larger than the area of the light emitting element in plan view, the barrier layer is formed between adjacent light emitting elements, and the planarization layer is formed so as to cover at least a part of the light emitting element,

[0354] The barrier layer and / or the planarization layer contains an (XAS) silicone resin having a trifunctional organosilane unit represented by General Formula (11) and / or a tetrafunctional organosilane unit represented by General Formula (12), and the total content of the trifunctional organosilane unit represented by General Formula (11) and the tetrafunctional organosilane unit represented by General Formula (12) in the (XAS) silicone resin is 90 to 100 mol%.

[0355] [Chemical Formula 8]

[0356]

[0357] In General Formula (11) and General Formula (12), R 66 represents an alkyl group having 1 to 3 carbon atoms. 3 each independently represents a bonding point in the resin. The above-mentioned substituent and structure can have a heteroatom, and can be any of an unsubstituted or substituted one.

[0358] By being configured as described above, the display device of the present application can provide a display device with excellent luminance. It is presumed that this is because the silanol groups in the resin contained in the cured product capture trace amounts of metal impurities and ionic impurities in the cured product by intentionally containing the (AS) silicone resin having the specific organosilane unit described above in the partition wall layer and / or the planarization layer. It is thought that these impurities migrate to the wiring surface, thereby functioning as carriers in the wiring. As a result, it is thought that the conductivity of the wiring, such as metal, can be controlled, enabling low-voltage driving, thereby achieving the effect of high luminance.

[0359] <Resin and compound in partition wall layer and planarization layer>

[0360] The display device of the present application has a partition wall layer and / or a planarization layer. The partition wall layer and the planarization layer in the display device of the present application are preferably a cured product of a photosensitive composition, and more preferably contain a resin. The resin in the partition wall layer and the planarization layer preferably contains a (XA1) resin containing a weakly acidic group and / or a (XA2) resin not containing a weakly acidic group. The (XA1) resin containing a weakly acidic group in the partition wall layer and the planarization layer is preferably the (A1) resin containing a weakly acidic group described above or a resin having a structure from the resin. The (XA2) resin not containing a weakly acidic group is preferably the (A2) resin not containing a weakly acidic group described above or a resin having a structure from the resin. The examples and preferences of the resin in the partition wall layer and the planarization layer are described above in relation to the examples and preferences of the (A) binder resin. The resin in the partition wall layer and the planarization layer can be any of the (A) binder resin or a resin having a structure from the resin in the composition.

[0361] <Content of specific halogen component in partition wall layer and planarization layer>

[0362] In the display device of the fourth mode of the present application, the partition wall layer and / or the planarization layer contain one or more components selected from the group consisting of a component containing a chlorine element, a component containing a bromine element, a component containing a chloride ion, and a component containing a bromide ion (hereinafter referred to as "specific halogen component"), and satisfy the following conditions (X1a) and / or (X1b).

[0363] (X1a) The total content of the chlorine element and the bromine element in the partition wall layer is 0.0010 to 1,000 mass ppm, and / or the total content of the chloride ion and the bromide ion in the partition wall layer is 0.0010 to 1,000 mass ppm

[0364] (X1b) The total content of the chlorine element and the bromine element in the planarization layer is 0.0010 to 1,000 mass ppm, and / or the total content of the chloride ion and the bromide ion in the planarization layer is 0.0010 to 1,000 mass ppm.

[0365] As for the display device of the fifth and sixth modes of the present application, from the viewpoint of improving the reliability of the light-emitting element and improving the luminance of light emission, it is preferable that the barrier layer and / or the planarization layer contain one or more components selected from the group consisting of the above-described specific halogen components, and satisfy the above-described conditions (Xla) and / or (Xlb).

[0366] From the viewpoint of improving the reliability of the light-emitting element and improving the luminance of light emission, the display device of the present application preferably further satisfies the following conditions (X2a) and / or (X2b).

[0367] (X2a) The total of the content of chlorine elements and bromine elements in the barrier layer is 0.0010 to 1,000 mass ppm, and the total of the content of chloride ions and bromide ions in the barrier layer is 0.0010 to 1,000 mass ppm

[0368] (X2b) The total of the content of chlorine elements and bromine elements in the planarization layer is 0.0010 to 1,000 mass ppm, and the total of the content of chloride ions and bromide ions in the planarization layer is 0.0010 to 1,000 mass ppm.

[0369] In the case where the above-described conditions (X2a) and / or (X2b) are satisfied, the barrier layer and / or the planarization layer preferably contain a chlorine element-containing component and / or a bromine element-containing component, and further contain a chloride ion-containing component and / or a bromide ion-containing component.

[0370] The specific halogen component in the barrier layer and the specific halogen component in the planarization layer are preferably the specific halogen component in the above-described photosensitive composition or a component having a structure from the specific halogen component. The examples and preferences of the specific halogen component in the barrier layer and the specific halogen component in the planarization layer are described as the examples and preferences of the specific halogen component in the above-described photosensitive composition.

[0371] <Content of the 2nd specific compound in the barrier layer and in the planarization layer>

[0372] As for the display device of the fourth and sixth modes of the present application, from the viewpoint of improving the reliability of the light-emitting element and improving the luminance of light emission, it is preferable that the barrier layer and / or the planarization layer contain one or more components selected from the group consisting of the above-described 2nd specific compounds, and satisfy the above-described conditions (X9ca) and / or (X9cb).

[0373] The second specific compound in the separation wall layer and the second specific compound in the planarization layer are preferably the second specific compound in the photosensitive composition described above or a compound having a structure from the second specific compound. Examples and preferences related to the second specific compound in the separation wall layer and the second specific compound in the planarization layer are described above in relation to the second specific compound in the photosensitive composition.

[0374] <Content of the specific silicone in the separation wall layer and in the planarization layer>

[0375] In the display device of the fourth and fifth modes of the present application, it is preferable that the separation wall layer and / or the planarization layer contain an (XAS) silicone having a trifunctional organosilane unit represented by the general formula (11) described above and / or a tetrafunctional organosilane unit represented by the general formula (12) described above, the total content ratio of the trifunctional organosilane unit represented by the general formula (11) and the tetrafunctional organosilane unit represented by the general formula (12) in the (XAS) silicone being 90 to 100 mol%.

[0376] The display device of the present application preferably further satisfies the following conditions (XS1) and / or (XS2) from the viewpoint of improving the luminance of light emission.

[0377] (XS1) The content of the (XAS) silicone in the separation wall layer is 0.0010 to 1,000 mass ppm

[0378] (XS2) The content of the (XAS) silicone in the planarization layer is 0.0010 to 1,000 mass ppm.

[0379] The (AS) silicone in the separation wall layer and the (AS) silicone in the planarization layer are preferably the (AS) silicone in the photosensitive composition described above or a resin having a structure from the (AS) silicone. Examples and preferences related to the (AS) silicone in the separation wall layer and the (AS) silicone in the planarization layer are described above in relation to the (AS) silicone in the photosensitive composition.

[0380] <Micro LED display and Mini LED display>

[0381] The display devices of the fourth, fifth, and sixth aspects of the present invention are preferably Micro LED displays or Mini LED displays. It should be noted that, in a plan view, the area of ​​the redistribution layer is larger than the area of ​​the light-emitting element, which is the semiconductor chip. Therefore, the display device of the present invention has a fan-out wafer-level packaging structure or a fan-out panel-level packaging structure. The substrate, redistribution layer, interlayer insulating layer of the redistribution layer, light-emitting element, semiconductor chip, partition layer, and planarization layer can be made of known materials.

[0382] The display device of the present invention will be described with reference to the drawings. Figure 1 Schematic cross-sectional view of a MicroLED display having a partition layer and a planarization layer. The display device 1a has a plurality of light-emitting elements 2 and a plurality of partition layers 15 on a counter substrate 5, a planarization layer 21 is provided on the light-emitting element 2, and an interlayer insulating layer 3 is provided on the planarization layer 21. The light-emitting element 2 is preferably a semiconductor chip. The so-called "on the light-emitting element 2" can be not only the surface of the light-emitting element 2, but also the upper side of the supporting substrate or the light-emitting element 2. Figure 1 In the embodiment shown, a partition layer 15 is provided between a plurality of adjacent light-emitting elements 2, a planarization layer 21 is formed in a manner covering the light-emitting elements 2, and a plurality of interlayer insulating layers 3 are stacked on the planarization layer 21. However, the interlayer insulating layer 3 may also be a single layer. The light-emitting element 2 has a pair of electrode terminals 6 on the surface opposite to the surface in contact with the counter substrate 5, and each electrode terminal 6 is electrically connected to a metal wiring 4 extending in the planarization layer 21 and the interlayer insulating layer 3. It should be noted that if the plurality of metal wirings 4 are covered by the planarization layer 21 or the interlayer insulating layer 3, since these layers function as insulating films, they form a structure that maintains electrical insulation. The so-called metal wiring forming a structure that maintains electrical insulation means that the portion of the metal wiring that requires electrical insulation is covered by a cured product formed by curing a composition containing a resin. In addition, the light-emitting element 2 is electrically connected to the driving element 8 provided on the light-emitting element driving substrate 7 (which is provided at a position opposite to the counter substrate 5) via the metal wiring 4 and the metal wiring 4c, thereby being able to control the light emission of the light-emitting element 2. In addition, the light emitting element driving substrate 7 is electrically connected to the metal wiring 4 via the solder bump 10. In addition, a barrier metal 9 is provided to prevent metal diffusion of the metal wiring 4 and the like. It should be noted that the metal wiring 4c can also pass through the light emitting element driving substrate 7 and be electrically connected to the driving element 8. The side of the light emitting element 2 in the display device 1a that is in contact with the counter substrate 5 ( Figure 1 The lower side) is the light extraction side. Figure 1The Micro LED display is preferably manufactured in a Chip-first (RDL-last) structure in which the light emitting element 2 is disposed as a semiconductor chip on a support substrate or the like, and then the metal wiring 4 and the interlayer insulating layer 3 are formed. Thereafter, the light emitting element driving substrate is bonded, and then the support substrate or the like is peeled off, and then the opposing substrate 5 is attached.

[0383] Figure 2 A schematic cross-sectional view of another way of the Micro LED display having a partition wall layer and a planarization layer. The side of the light emitting element 2 in the display device lb that is in contact with the opposing substrate 5 (the upper side of the light emitting element 2) is the light extraction side. Figure 2 Figure 2 The Micro LED display is preferably manufactured in an RDL-first (Chip-last) structure in which the metal wiring 4 and the interlayer insulating layer 3 are formed on a support substrate or the like, and then the light emitting element 2 is disposed as a semiconductor chip. The support substrate or the like is preferably then peeled off, and then the opposing substrate 5 is attached, and then the light emitting element driving substrate 7 is bonded.

[0384] The light emitting element 2 is preferably a PN junction diode in which a P-type semiconductor and an N-type semiconductor are bonded. The length of one side of the light emitting element 2 is preferably 5 to 700 μm, and more preferably 5 to 100 μm. The interlayer insulating layer 3, the partition wall layer 15, and the planarization layer 21 are preferably cured products of a pattern-formed photosensitive composition. Note that a configuration in which the thickness of the planarization layer 21 is greater than the thickness of the partition wall layer 15 is also preferable. Further, the planarization layer 21 is preferably configured to cover a portion of the surface of the partition wall layer 15 that is opposite the surface in contact with the opposing substrate 5, and more preferably configured to cover the entire surface of the partition wall layer 15 that is opposite the surface in contact with the opposing substrate 5. From the viewpoint of improving mechanical properties, the interlayer insulating layer 3 more preferably contains the aforementioned polyimide-based resin. By containing the aforementioned polyimide-based resin, the warping of the wafer and the substrate is suppressed, the accuracy of the exposure process and the wafer and substrate handling process is improved, and the effect of improving the yield is significant. From the viewpoint of improving the reliability and light emission brightness of the light emitting element, the partition wall layer 15 and the planarization layer 21 are preferably cured products of the present application. From the viewpoint of improving the reliability and light emission brightness of the light emitting element, the partition wall layer 15 preferably contains the aforementioned (G) inorganic particles. From the viewpoint of the reliability of the light emitting element and the suppression of external light reflection, the partition wall layer 15 preferably contains the aforementioned (D) colorant.

[0385] <Organic EL Display and Quantum Dot Display>

[0386] The display device of the seventh way of the present application is a display device having a substrate, a first electrode, a second electrode, a pixel partition layer, a light emitting layer, and a TFT planarization layer, ​

[0387] wherein the pixel partition layer and / or the TFT planarization layer contains one or more components selected from the group consisting of the above-described specific halogen components, and satisfies the above-described conditions (X1a) and / or (X1b).

[0388] By being configured as described above, the display device of the present application can provide a display device in which the reliability of the light emitting element and the luminance of the light emission are excellent. It is presumed that this is based on the same reason as the presumed mechanism in the display device of the fourth aspect of the present application described above.

[0389] The display device of the eighth aspect of the present application is a display device having a substrate, a first electrode, a second electrode, a pixel partition layer, a light emitting layer, and a TFT planarization layer,

[0390] wherein the pixel partition layer and / or the TFT planarization layer contains (XA1) a weak-acid-group-containing resin, the (XA1) weak-acid-group-containing resin contains one or more selected from the group consisting of the above-described polyimide-based resins having a weak-acid group,

[0391] The pixel partition layer and / or the TFT planarization layer contains one or more selected from the group consisting of the above-described second specific compounds, and satisfies the above-described conditions (X9ca) and / or (X9cb).

[0392] By being configured as described above, the display device of the present application can provide a display device in which the reliability of the light emitting element and the luminance of the light emission are excellent. It is presumed that this is based on the same reason as the presumed mechanism in the display device of the fifth aspect of the present application described above.

[0393] The display device of the ninth aspect of the present application is a display device having a substrate, a first electrode, a second electrode, a pixel partition layer, a light emitting layer, and a TFT planarization layer,

[0394] wherein the pixel partition layer and / or the TFT planarization layer contains (XA1) a weak-acid-group-containing resin, the (XA1) weak-acid-group-containing resin contains one or more selected from the group consisting of the above-described polyimide-based resins having a weak-acid group,

[0395] By being configured as described above, the display device of the present application can provide a display device in which the luminance of the light emission is excellent. It is presumed that this is based on the same reason as the presumed mechanism in the display device of the sixth aspect of the present application described above.

[0396] The display device of the seventh, eighth, and ninth aspects of the present application is preferably an organic EL display or a quantum dot display, and is also preferably a display having an organic EL layer including a light-emitting layer and a quantum dot layer. The substrate, the first electrode, the second electrode, the pixel partition layer, the light-emitting layer, and the TFT planarization layer can use known materials.

[0397] In the display device of the present application, from the viewpoint of improving the reliability of the light-emitting element, preferably, the pixel partition layer has a stepped shape including a thick film portion and a thin film portion. By providing the pixel partition layer with a thick film portion, the portion that comes into contact with the vapor deposition mask when forming the light-emitting layer becomes only the thick film portion of the pixel partition layer, and the contact area of the pixel partition layer with the vapor deposition mask can be reduced. Therefore, by suppressing the damage to the pixel partition layer, the effect of suppressing the reduction in the yield of the panel and improving the reliability of the light-emitting element becomes significant. In addition, by providing the thin film portion with light shielding properties, the outgassing from the pixel partition layer and the film below it can be suppressed, and the effect of improving the reliability of the light-emitting element becomes significant. Figure 3 A schematic cross-sectional view and a plan view showing one example of the display device 100A in which the pixel partition layer has a stepped shape including a thick film portion and a thin film portion are shown.

[0398] <Method for producing cured product>

[0399] The method for producing a cured product of the present application has: (1) a step of forming a coating film of the photosensitive composition of the present application on a substrate; (2) a step of irradiating the coating film of the photosensitive composition with active chemical rays through a photomask; (3) a step of developing using a developing solution to form a pattern of the photosensitive composition; and (4) a step of heating the pattern to obtain a cured pattern of the photosensitive composition. Note that in these steps, each method described in

[0453] to

[0481] of International Publication No. 2019 / 087985 can be applied. The step of forming a coating film is preferably performed by pre-baking after coating to form a film. The step of obtaining a cured pattern is preferably performed by heating the pattern to thermally cure it.

[0400] Examples

[0401] Hereinafter, the present application will be further specifically described by citing examples, reference examples, and comparative examples, but the present application is not limited to these ranges. Note that in the case of using a shortened name for a compound used in the following description or table, the name corresponding to the shortened name is shown in Table 1-2.

[0402] [Table 1-2]

[0403]

[0404] <Examples of synthesis of each resin>

[0405] The composition of each resin obtained in Synthesis Examples 1 to 27 is shown in Tables 1-3 to 1-5-2 as the (A) binder resin. In each case, the monomer compound as a monomer, the copolymerization ratio was appropriately changed based on the method described in the known literature, and was synthesized by a known method. The copolymerization ratio of the monomers is shown in Tables 1-3 to 1-5-2.

[0406] In addition, the composition of each resin obtained in Synthesis Examples 28 to 31 is shown in Table 1-6 as the (AS) silicone resin. In each case, the monomer compound as a monomer, the copolymerization ratio was appropriately changed based on the method described in the known literature, and was synthesized by a known method. The copolymerization ratio of the monomers is shown in Table 1-6.

[0407] In the case of the hydroxyl group-containing diamine (HA) used in Synthesis Example 16, which has the following structure, it was synthesized by a known method based on the synthesis method described in Synthesis Example 1 in

[0374] to

[0376] of International Publication No. 2016 / 056451. Note that the resin obtained in Synthesis Example 16 using the hydroxyl group-containing diamine (HA) having the following structure is a polyimide precursor having an amic acid ester structural unit, an amic acid structural unit, and an imide ring-closed structure.

[0408] In Synthesis Examples 16 and 17, DFA as an esterification agent was allowed to react with the amic acid structural unit in the resin, and the structure was converted to an amic acid ester structural unit having a methyl group.

[0409] In Synthesis Example 23, GMA having an epoxy group was allowed to react with the carboxyl group from MAA in the resin, and ring-opening addition was performed on all the epoxy groups of GMA.

[0410] In Synthesis Example 26, DHBA having a carboxyl group was allowed to react with the epoxy group from GMA in the resin, and ring-opening addition was performed on all the epoxy groups of GMA.

[0411] In Synthesis Example 27, GMA having an epoxy group was allowed to react with the phenolic hydroxyl group from HPMA in the resin, and ring-opening addition was performed on all the epoxy groups of GMA.

[0412] [Chemical Formula 9]

[0413]

[0414] [Table 1-3]

[0415] [Table 1-3]

[0416]

[0417] [Table 1-4]

[0418]

[0419] [Table 1-5-1]

[0420]

[0421] [Table 1-5-2]

[0422]

[0423] [Table 1-6]

[0424] [Table 1-6]

[0425]

[0426] The structural units and structures possessed by each of the resins obtained in each of the synthesis examples, and the resins used in each of the examples, reference examples, and comparative examples are shown in Table 2-1. Note that the content of fluorine elements in the structures of the resins of polysiloxane (PS-5), polyimide (PI-1), polyimide precursor (PIP-1), polybenzoxazole (PB-1), polybenzoxazole precursor (PBP-1), and polyamide-imide (PAI-1) exceeds 10,000 mass ppm. The content of fluorine elements in the structures of the resins of polysiloxane (PS-1) to (PS-4), (PS-6) to (PS-11), polyimide (PI-2) to (PI-4), polyimide precursor (PIP-2), and other synthesis examples is 0 mass ppm.

[0427] [Table 2-1]

[0428]

[0429] <Preparation Examples of Each Pigment Dispersion Liquid>

[0430] The compositions of each of the dispersions obtained in Preparation Examples Bk-1 to Bk-3 are shown in Table 2-2 as pigment dispersion liquids. Each of the pigment dispersion liquids was prepared by the following method in Preparation Examples Bk-1 to Bk-3. In addition, the list and explanation of each of (D) colorant and (E) dispersant used in each of the examples, reference examples, and comparative examples are shown in Table 2-2.

[0431] Preparation of Preparation Examples Bk-1 to Bk-3 Pigment Dispersion Liquids (Bk-1) to (Bk-3)

[0432] Based on the method described in paragraphs

[0138] to

[0140] of International Publication No. 2022 / 196261, Preparation Example 1, using the colorants described in Table 2-2, and polyalkylene amine-polyoxyalkylene ether dispersant, i.e., ADP, as a dispersant, wet-type medium dispersion treatment was performed in a circulation manner so that the average primary particle diameter of the pigments became the values described in Table 2-2. Then, the obtained pigment dispersion liquids (Bk-1) to (Bk-3) were filtered using a filter of Celgard®. The average primary particle diameter of the pigments in the obtained pigment dispersion liquids is shown in Table 2-2. In addition, the average primary particle diameter of the pigments in the cured films, the crystallite size of the pigments in the pigment dispersion liquids, and the crystallite size of the pigments in the cured films are also shown in Table 2-2.

[0433] [Table 2-2]

[0434]

[0435] <Example 1>

[0436] Synthesis of a dispersion liquid of silica particles (SP-1)

[0437] Based on

[0132] to

[0134] of International Publication No. 2022 / 196261, the method described in Synthesis Example 3, using MEK-ST-40 as a dispersion liquid of silica particles, using KBM-503 as a surface modifier, and using MOP as a polymerization inhibitor, a dispersion liquid of silica particles (SP-1) was obtained. The silica particles (SP-1) as inorganic particles had a functional group of a methacryl group on the surface of the particles, the distribution range of the primary particle diameter was 10 to 16 nm, the average primary particle diameter was 12 nm, the range of the aspect ratio was 1.0 to 1.1, the average aspect ratio was 1.1, and the content of sodium element was 100 mass ppm.

[0438] <Method of evaluation in each example, reference example, and comparative example>

[0439] The evaluation methods in each of the examples, reference examples, and comparative examples are shown below. Note that, in the case of a glass substrate (Geomatec Corporation; hereinafter referred to as "ITO / Ag substrate") obtained by forming a film of APC (silver / palladium / copper = 98.07 / 0.87 / 1.06 (mass ratio)) to a thickness of 100 nm on glass by sputtering, and further forming a film of ITO to a thickness of 10 nm on the upper layer of the APC layer by sputtering, a 100-second UV-O3 cleaning treatment was performed using a table-top light surface treatment device (PL16-110; SEN-EI Co., Ltd.) and then the substrate was used. A Tempax glass substrate (AGC Techno Glass Corporation) and other substrates were used without being subjected to pretreatment.

[0440] In addition, for the film thickness measurement, a surface roughness and profile measuring machine (SURFCOM 1400D; Tokyo Precision Co., Ltd.) was used to measure the film thickness under conditions of a measurement magnification of 10,000 times, a measurement length of 1.0 mm, and a measurement speed of 0.30 mm / s.

[0441] (1) Weight-average molecular weight of resin

[0442] In the case of the above-described polyimides (PI-1) to (PI-4), polyimide precursors (PIP-1) and (PIP-2), polybenzoxazole (PB-1), polybenzoxazole precursor (PBP-1), and polyamide-imide (PAI-1), a 0.10 mass% N-methyl-2-pyrrolidone solution of each resin was prepared. Using a gel permeation chromatography (hereinafter referred to as "GPC") analysis device (Waters 2690; Waters Corporation), an N-methyl-2-pyrrolidone solution obtained by dissolving lithium chloride and phosphoric acid at 0.050 mol / L, respectively, was used as a mobile phase, and the weight-average molecular weight in terms of polystyrene was measured and calculated. In the case of other resins, a GPC analysis device (HLC-8220; Tosoh Corporation) was used, tetrahydrofuran or N-methyl-2-pyrrolidone was used as a mobile phase, and the weight-average molecular weight in terms of polystyrene was measured and calculated based on "JIS K7252-3 (2008)" using a method around room temperature.

[0443] (2) Content of chlorine element, bromine element, and fluorine element in resin, in composition, or in cured film

[0444] The content of chlorine element, bromine element, and fluorine element in the resin, in the composition, or in the cured film was measured by combustion ion chromatography under the following measurement conditions. In the case of each of the above resins, each resin was separated by GPC fractionation and then used. Note that, in the case where the resin includes resins having different structures from the structural unit constituting the resin, each resin was separated by GPC fractionation and then used. In the case of the resin in the composition, in either case where the composition includes a single resin or resins having different structures from the structural unit constituting the resin, the composition was subjected to methylene chloride extraction, and after ultracentrifugal separation, each resin was separated by GPC fractionation from the methylene chloride insolubles and then used. The resin, the composition, or the cured film was combusted and decomposed in a combustion tube of an analysis device, and the generated gas was absorbed into an absorption solution, and then a portion of the absorption solution was analyzed by ion chromatography. In the case where the content of an element is not described, the element was not detected. Note that the content in the total solid content of the composition was calculated from the obtained measurement value and the following formula.

[0445] (Content of chlorine element and bromine element in total solid content of composition) = (content of chlorine element and bromine element in composition) x 100 / (solid content concentration of composition [mass%])

[0446] <Combustion and absorption conditions>

[0447] System: AQF-2100H, GA-210 (manufactured by Mitsubishi Chemical Corporation)

[0448] Furnace temperature: 900°C at inlet, 1000°C at outlet

[0449] Gas: Ar / O2 200 mL / min, O2 400 mL / min

[0450] Absorption solution: H2O2 0.1 mass%

[0451] Absorption solution amount: 5 mL

[0452] <ion chromatography and anion analysis conditions>

[0453] System: ICS1600 (manufactured by DIONEX Corporation)

[0454] Mobile phase: 2.7 mmol / L Na2CO3, 0.3 mmol / L NaHCO3

[0455] Flow rate: 1.50 mL / min

[0456] Detector: conductivity detector

[0457] Injection amount: 100 μL.

[0458] (3) Content of anions and cations in the composition or in the cured film

[0459] The content of chloride ions, bromide ions, fluoride ions, specific anions, and quaternary ammonium ions in the composition or in the cured film was measured using ion chromatography under the following measurement conditions. The composition or the cured film was added to ultrapure water, and ions were extracted by shaking at room temperature. The extract was treated with a solid-phase extraction cartridge, and the cation components and anion components were analyzed using ion chromatography. For the anion components, when the measurement could not be performed under Ion Chromatography Analysis Condition 1 below, the measurement was performed under Ion Chromatography Analysis Condition 2 below. In the case where the content of an ion was not described, it means that the ion was not detected. Note that the content in the total solid content of the composition was calculated from the measured value obtained and the following formula.

[0460] (Content of anion or cation in total solid content of composition) = (content of anion or cation in composition) x 100 / (solid content concentration of composition [mass%])

[0461] < Ion Chromatography Analysis Condition 1 (anion components) >

[0462] Apparatus: IC-2010 (manufactured by Tosoh Corporation)

[0463] Separation column: TSKgel Super IC-Anion HS

[0464] Eluent: sodium bicarbonate

[0465] Column temperature: 40°C

[0466] Detector: conductivity meter

[0467] Sample injection amount: 250 μL

[0468] < Ion Chromatography Analysis Condition 2 (anion components) >

[0469] Apparatus: IC-2010 (manufactured by Tosoh Corporation)

[0470] Separation column: TSKgel Super IC-Anion HS

[0471] Eluent: sodium carbonate / sodium bicarbonate

[0472] Column temperature: 40°C

[0473] Detector: conductivity meter

[0474] Sample injection amount: 250 μL

[0475] < Ion Chromatographic Analysis Conditions 3 (Cationic Components) >

[0476] Apparatus: INTEGRION (manufactured by Thermo Fisher Scientific)

[0477] Separation column: IonPac CS19-4 μm

[0478] Eluent: Methanesulfonic acid

[0479] Detector: Conductivity meter

[0480] Sample injection amount: 100 μL.

[0481] (4) Content of Specific Compound in Composition or in Cured Film

[0482] The content of the specific phosphorus compound, the tertiary amine compound, the methanol, the ethanol, the first specific compound, the second specific compound, the specific ketone compound, and the specific heterocyclic compound in the composition or in the cured film was determined by gas chromatography mass spectrometry and liquid chromatography mass spectrometry using a standard curve based on a standard substance. Note that the content in the total solid content of the composition was calculated from the determined value obtained and the following formula.

[0483] (Content of specific compound in total solid content of composition) = (content of specific compound in composition) x 100 / (solid content concentration of composition [mass%]).

[0484] (5) Content of Water in Composition

[0485] As for the content of water in the composition, a Karl-Fischer moisture meter (MKS-520; manufactured by Kyowa Electronic Instrument Co., Ltd.) was used, Karl-Fischer reagent was used as a titration reagent, and the content was determined by volumetric titration based on "JIS K0113 (2005)".

[0486] (6) Content of Silicone Resin in Composition or in Cured Film

[0487] As for the content of (AS) silicone resin in the composition and the content of (XAS) silicone resin in the cured film, a GPC analysis device (HLC-8220; manufactured by Tosoh Corporation) was used, tetrahydrofuran or N-methyl-2-pyrrolidone was used as a mobile phase, and the component equivalent to silicone resin was fractionated, whereby the content was determined. Note that the content in the total solid content of the composition was calculated from the determined value obtained and the following formula.

[0488] (Content of silicone resin in total solid content of composition) = (content of silicone resin in composition) x 100 / (solid content concentration of composition [mass%]).

[0489] (7) Sensitivity

[0490] The sensitivity test pattern of the produced post-development film was observed using an FPD / LSI inspection microscope (OPTIPHOT-300; manufactured by Nikon Corporation). In the case of using a composition having positive photosensitivity, as an index of sensitivity, the optimum exposure amount (value of i-line illuminometer) at which a gap pattern corresponding to an opening portion could be formed in a 20 μm line and gap pattern with a dimension width of 20 μm was calculated. On the other hand, in the case of using a composition having negative photosensitivity, as an index of sensitivity, the exposure amount (value of i-line illuminometer) at which a gap pattern corresponding to an opening portion could be formed in a 20 μm line and gap pattern with a dimension width of 18 μm was calculated as the sensitivity. The sensitivity was determined to be 90 mJ / cm 2 The following, A+, A, B+, B, C+, and C were regarded as passing.

[0491] A+: Sensitivity was 30 mJ / cm 2 The following

[0492] A: Sensitivity exceeded 30 mJ / cm 2 and was 40 mJ / cm 2 The following

[0493] B+: Sensitivity exceeded 40 mJ / cm 2 and was 50 mJ / cm 2 The following

[0494] B: Sensitivity exceeded 50 mJ / cm 2 and was 60 mJ / cm 2 The following

[0495] C+: Sensitivity exceeded 60 mJ / cm 2 and was 75 mJ / cm 2 The following

[0496] C: Sensitivity exceeded 75 mJ / cm 2 and was 90 mJ / cm 2 The following

[0497] D: Sensitivity exceeded 90 mJ / cm 2 and was 150 mJ / cm 2 The following

[0498] E: Sensitivity exceeded 150 mJ / cm 2 .

[0499] (8) Development residue

[0500] The sensitivity test pattern of the developed film produced was observed using an FPD / LSI inspection microscope (OPTIPHOT-300; manufactured by Nikon Corporation). As an index of development residue, the presence or absence of residue in a 20 μm line and space pattern was observed, and the area occupied by the residue in the opening portion was calculated. The following criteria were used for the judgment, and A+, A, B+, B, C+, and C were regarded as acceptable when the area occupied by the residue was 20% or less.

[0501] A+: no residue

[0502] A: area occupied by residue is 3% or less

[0503] B+: area occupied by residue is more than 3% and 6% or less

[0504] B: area occupied by residue is more than 6% and 10% or less

[0505] C+: area occupied by residue is more than 10% and 15% or less

[0506] C: area occupied by residue is more than 15% and 20% or less

[0507] D: area occupied by residue is more than 20% and 50% or less

[0508] E: area occupied by residue is more than 50% and 100% or less.

[0509] (9) Light shielding property (optical density value (hereinafter referred to as "OD value"))

[0510] A cured film of the composition was produced on a Tempax glass substrate (manufactured by AGC Techno Glass Corporation) using the method described in Example 1 below. The incident light intensity (I0) and the transmitted light intensity (I) at three points in the plane of the cured film produced were measured using a transmittance meter (X-Rite 361T(V); manufactured by X-Rite Corporation). As an index of light shielding property, the OD value per 1 μm film thickness was calculated using the following equation, and the average value of the OD values at the three points in the plane was calculated.

[0511] OD value = log 10 (I0 / I).

[0512] (10) Reliability of light emitting element

[0513] at 10 mA / cm 2The organic EL display produced by the method described in Example 1 below was made to emit light using direct current driving, and whether there were non-emitting regions, uneven brightness, and other light emission defects was observed. In addition, as a durability test, the light-emitting element was heated to 80°C with the light-extraction side facing upward, and light having a wavelength of 365 nm and an illuminance of 0.6 mW / cm2was irradiated for 500 hours. After 500 hours, the light-emitting element was made to emit light at 10 mA / cm2, and the light emission characteristics were observed. 2 2 The organic EL display was made to emit light using direct current driving, and whether there were changes in the light emission characteristics was observed. As an index of the reliability of the light-emitting element, the area of the light-emitting region after the durability test was measured when the area of the light-emitting region before the durability test was taken to be 100%. The following criteria were used for the evaluation: A+, A, B+, B, C+, and C were taken to be acceptable when the area of the light-emitting region was 80% or more.

[0514] A+: the area of the light-emitting region was 100%

[0515] A: the area of the light-emitting region was 97% or more and less than 100%

[0516] B+: the area of the light-emitting region was 94% or more and less than 97%

[0517] B: the area of the light-emitting region was 90% or more and less than 94%

[0518] C+: the area of the light-emitting region was 85% or more and less than 90%

[0519] C: the area of the light-emitting region was 80% or more and less than 85%

[0520] D: the area of the light-emitting region was 60% or more and less than 80%

[0521] E: the area of the light-emitting region was less than 60%.

[0522] (11) Light emission brightness

[0523] The Micro LED display produced by the method described in Example 1 below was made to emit light, and the light extraction efficiency was measured as an index of the light emission brightness using an external quantum efficiency measuring device (manufactured by Hamamatsu Photonics K.K.; C9920). For the light extraction efficiency, the light extraction efficiency of the Micro LED display described in Example 1 was taken to be 1.00, and the relative value with respect to this value was calculated. The following criteria were used for the evaluation: A+, A, B+, B, C+, and C were taken to be acceptable when the relative value of the light extraction efficiency was 1.00.

[0524] A+: the relative value of the light extraction efficiency was 1.30 or more

[0525] ​A: The relative value of light extraction efficiency is 1.20 or more and less than 1.30

[0526] B+: The relative value of light extraction efficiency is 1.10 or more and less than 1.20

[0527] B: The relative value of light extraction efficiency is 1.00 or more and less than 1.10

[0528] C+: The relative value of light extraction efficiency is 0.95 or more and less than 1.00

[0529] C: The relative value of light extraction efficiency is 0.90 or more and less than 0.95

[0530] D: The relative value of light extraction efficiency is 0.70 or more and less than 0.90

[0531] E: The relative value of light extraction efficiency is less than 0.70.

[0532] (12) Storage stability

[0533] Each of the compositions prepared below was stored at 25°C for one week. After storage, a prebaked film of each of the compositions was formed on a 6-inch diameter Si wafer using the method described in Example 1 below. As an index of storage stability, the presence or absence of foreign matter on the prebaked film and the number of foreign matters were observed by visual observation. The number of foreign matters was determined as follows: A+, A, B+, B, C+, and C were regarded as acceptable when the number of foreign matters was 20 or less.

[0534] A+: No foreign matter

[0535] A: The number of foreign matters was 3 or less

[0536] B+: The number of foreign matters was more than 3 and 6 or less

[0537] B: The number of foreign matters was more than 6 and 10 or less

[0538] C+: The number of foreign matters was more than 10 and 15 or less

[0539] C: The number of foreign matters was more than 15 and 20 or less

[0540] D: The number of foreign matters was more than 20 and 50 or less

[0541] E: The number of foreign matters was more than 50.

[0542] <Compounds used in each of the examples, reference examples, and comparative examples>

[0543] The structures of the compounds used in each of the examples, reference examples, and comparative examples are shown below.

[0544] [Chemical Formula 10]

[0545]

[0546] [Chemical Formula 11]

[0547]

[0548] In addition, the compounds (hereinafter referred to as "specific halogen compounds") containing chlorine element, bromine element, chloride ion or bromide ion; the compounds containing specific anion; the specific phosphorus compounds; the tertiary amine compounds; the compounds containing quaternary ammonium ion (hereinafter referred to as "quaternary cationic compounds"); the specific heterocyclic compounds; the 1st specific compounds; the 2nd specific compounds; the specific ketone compounds; the compounds containing fluorine element or fluoride ion (hereinafter referred to as "specific fluorine compounds"), and the respective corresponding compounds used in each of the examples, reference examples and comparative examples are shown in Tables 2-3.

[0549] [Table 2-3]

[0550]

[0551] <Preparation of photosensitive composition>

[0552] The compositions 1 to 136 were prepared in the compositions described in Tables 3-1-1 to 3-11. In Tables 3-1-1 to 3-11, the values in parentheses represent the mass parts of the solid components of each component. Note that in the tables, the content of quaternary ammonium ion is described as the content of quaternary cation. In the case where the composition contains a pigment, a blending solution not containing a pigment dispersion liquid was first prepared, and then the composition was prepared by mixing the pigment dispersion liquid with the blending solution. As the solvent, PGMEA / EL / GBL = 50 / 40 / 10 (mass ratio) was used, and the composition was prepared so that the solid component concentration of the composition became 30 mass%. The obtained solution of the composition was filtered using a filter of 0.2 μm, and then used. In addition, using the same method, the compositions S1 to S7 were prepared in the compositions described in Table 2-4.

[0553] [Table 2-4]

[0554] [Table 2-4]

[0555]

[0556] <Example 1>

[0557] ​After coating the composition 1 on an ITO / Ag substrate using a spin coater (MS-A100; manufactured by MIKASA Corporation), a prebaked film having a film thickness of about 1.8 μm was produced by prebaking at 120°C for 120 seconds using a hot plate with a buzzer (HPD-3000BZN; manufactured by AS ONE Corporation). For the produced prebaked film, the time at which the prebaked film (unexposed portion) was completely dissolved (Breaking Point (BP) hereinafter) was measured by spray developing using a 2.38 mass% TMAH aqueous solution or cyclopentanone using a small-sized developing device for photolithography (AD-1200; manufactured by Takizawa Sangyo Corporation).

[0558] A prebaked film was produced by the same method, and for the produced prebaked film, patternwise exposure was performed using an alignment-type single-side exposure device (mask aligner PEM-6M; manufactured by Union Optical Co., LTD.) through a gray scale mask for sensitivity measurement (MDRM MODEL 4000-5-FS; manufactured by Opto-Line International Corporation) using i-line (wavelength 365 nm), h-line (wavelength 405 nm), and g-line (wavelength 436 nm) of an ultra-high pressure mercury lamp. After exposure, a post-development film was produced by developing using a 2.38 mass% TMAH aqueous solution using a small-sized developing device for photolithography (AD-1200; manufactured by Takizawa Sangyo Corporation), rinsing with water for 30 seconds, and setting the developing time to 60 seconds, 90 seconds, or 120 seconds.

[0559] Note that, in the development using a 2.38 mass% TMAH aqueous solution, the exposed film was produced in the same manner as in the above-described method, except that the development time was 60 seconds, 90 seconds, and 120 seconds, in each of which no pattern was formed after development. After exposure, the film after development was produced using a small-sized development device for photolithography (AD-1200; manufactured by Takizawa Sangyo Co., Ltd.), using cyclopentanone for development, and using water for rinsing for 30 seconds. In the same manner, the development time was set to 60 seconds, 90 seconds, or 120 seconds. For each of the films after development with a development time of 60 seconds, 90 seconds, and 120 seconds, the pattern after development was observed, and the optimum exposure amount (value of the i-ray illuminometer) that enabled formation of a space pattern corresponding to an opening portion in a line-and-space pattern with a dimension width of 20 μm was found. From these results, the optimum development time (60 seconds, 90 seconds, or 120 seconds) and the optimum exposure amount at the development time were determined. For the pattern after development with the optimum development time after exposure with the optimum exposure amount, a high-temperature inert gas oven (INH-9CD-S; manufactured by Koyo Thermo Systems Co., Ltd.) was used to perform heat curing at 200°C for 60 minutes, and a cured film having a thickness of about 1.2 μm was produced. The heat curing conditions were as follows: the temperature was increased to 200°C at a rate of 3.5°C / min in a nitrogen atmosphere having an oxygen concentration of 20 mass ppm or less, and the temperature was maintained at 200°C for 60 minutes, and then the temperature was decreased to 50°C.

[0560] The cured film was analyzed by nuclear magnetic resonance spectroscopy, infrared spectroscopy, gas chromatography mass spectrometry, liquid chromatography mass spectrometry, and time-of-flight secondary ion mass spectrometry, and the structural units of the resin contained in the cured film and the structures of the compounds contained in the cured film were analyzed. The cured film of Composition 1 contained the following resin and compound, and contained a resin having a structure derived from the resin contained in Composition 1 and a compound having a structure derived from the compound contained in Composition 1.

[0561] (XA1) Resin: a resin having a silanol group and having a siloxane structure in a structural unit; a phenol-aldehyde resin having a phenolic hydroxyl group in a structural unit.

[0562] <Production of Organic EL Display>

[0563] Next, a method for producing an organic EL display is described. Figure 4A schematic diagram of the substrate used is shown. First, on an alkali-free glass substrate 47 of 38 x 46 mm, APC (silver / palladium / copper = 98.07 / 0.87 / 1.06 (mass ratio)) was formed into a film of 100 nm as a non-transparent conductive metal layer by sputtering, and was subjected to patterning by etching to form an APC layer. Further, on the upper layer of the APC layer, amorphous ITO was formed into a film of 10 nm as a transparent conductive oxide film layer by sputtering, and was subjected to etching to form a reflective electrode as a first electrode portion 48. In addition, an auxiliary electrode portion 49 was also formed at the same time in order to lead out a second electrode (1). Figure 4

[0564] The obtained substrate was subjected to ultrasonic cleaning for 10 minutes using "Semico Clean" (registered trademark) 56 (manufactured by Furuuchi Chemical Co., Ltd.) and was cleaned using ultrapure water. Next, on the substrate, Composition 1 was applied using the above-described method and was subjected to pre-baking, and after being subjected to pattern exposure, development, and rinsing with a photomask having a prescribed pattern, it was subjected to heating to perform thermal curing. Note that the development time was set to 60 seconds, 90 seconds, or 120 seconds, and the optimum development time (60 seconds, 90 seconds, or 120 seconds) and the optimum exposure amount at that development time were previously determined. The pattern after exposure at the optimum exposure amount and development at the optimum development time was subjected to thermal curing at 200°C for 60 minutes. The thermal curing conditions were heating at a temperature increase rate of 3.5°C / min to 200°C under a nitrogen atmosphere having an oxygen concentration of 20 mass ppm or less, and heating treatment at 200°C for 60 minutes, followed by cooling to 50°C. Using the above-described method, a pixel partition layer portion 50 having the following shape was formed in the effective area of the substrate: square-shaped opening portions of 70 μm in width and 70 μm in length were arranged at an interval of 175 μm in the width direction and at an interval of 175 μm in the length direction, and each of the opening portions exposed the first electrode (2). Note that the opening portions eventually become the light-emitting pixels of the organic EL display. In addition, the effective area of the substrate was 16 mm square, and the thickness of the pixel partition layer portion 50 was formed to be about 1.5 μm. Figure 4

[0565] Next, using the substrate on which the first electrode portion 48, the auxiliary electrode portion 49, and the pixel partition layer portion 50 were formed, an organic EL display was produced. After nitrogen plasma treatment as a pretreatment, an organic EL layer portion 51 including a light-emitting layer was formed using a vacuum evaporation method (3). Figure 4 -3 ​​​Pa or less, during the vapor deposition, the substrate was rotated with respect to the vapor deposition source. First, 10 nm of a compound (HT-1) was vapor-deposited as a hole injection layer, and 50 nm of a compound (HT-2) was vapor-deposited as a hole transport layer. Next, on the light-emitting layer, a compound (GH-1) as a host material and a compound (GD-1) as a dopant material were vapor-deposited at a thickness of 40 nm in such a manner that the doping concentration was 10% by volume. Then, a compound (ET-1) as an electron transport material and a compound (LiQ) were stacked at a thickness of 40 nm and at a volume ratio of 1:1. Note that the compounds (compound (HT-1), compound (HT-2), compound (GH-1), compound (GD-1), compound (ET-1), and compound (LiQ)) used in the organic EL layer used the same compounds as those described in

[0599] to

[0600] of International Publication No. 2017 / 057281.

[0566] Next, after vapor-depositing 2 nm of the compound (LiQ), 10 nm of MgAg (magnesium / silver = 10 / 1 (volume ratio)) was vapor-deposited to produce the second electrode portion 52, and a transparent electrode (anode) (4) was formed. Figure 4 Then, under a low-humidity nitrogen atmosphere, the glass plate was bonded using an epoxy resin-based adhesive, and thus the sealing was performed, and four 5 mm square top emission type organic EL displays were produced on one substrate. Note that the film thickness referred to here is the display value of a quartz oscillation type film thickness monitor.

[0567] Production of a Micro LED display

[0568] An alkali-free glass substrate was used as a support substrate, a temporary bonding material containing polyimide was disposed on the support substrate, and an LED as a light-emitting element was disposed on the support substrate. The thickness of the LED was 2 μm, the length of one side was 10 μm, and the length of the other side was 20 μm. Next, the composition S1 was applied to the support substrate and the LED using the above-described method, and pre-baking was performed, and pattern exposure, development, and rinsing were performed through a photomask having a prescribed pattern, and a matrix pattern having the LED and a plurality of opening portions exposing the periphery thereof was formed. The shape of the opening portion was a rectangle, the length of one side was 15 μm, and the length of the other side was 25 μm. The pattern size between the opening portions of the opening portions having a length of 15 μm in the matrix pattern was 5 μm, and the pattern size between the opening portions having a length of 25 μm in the matrix pattern was also 5 μm. Then, heat curing was performed, and thus a partition layer having a film thickness of about 4 μm was formed. The heat curing conditions were that, under a nitrogen atmosphere having an oxygen concentration of 20 mass ppm or less, the temperature was increased at a rate of 3.5°C / min to 200°C, and after the heating treatment at 200°C for 60 minutes, the temperature was decreased to 50°C.

[0569] Next, the composition 1 was applied to the support substrate and the LED by the above method and pre-baked, and pattern exposure, development and rinsing were performed through a photomask having a prescribed pattern to form a plurality of opening patterns that penetrate the LED in the thickness direction. The shape of the opening patterns was circular, and the diameter of the bottom in the smallest pattern was 2 μm. Then, heat curing was performed by heating, whereby a planarization layer having a film thickness of about 4 μm was formed. The heat curing conditions were to heat to 200°C at a temperature increase rate of 3.5°C / min in a nitrogen atmosphere having an oxygen concentration of 20 mass ppm or less, and to perform a heating treatment at 200°C for 60 minutes, and then to cool to 50°C.

[0570] Next, a barrier metal of titanium was formed on the planarization layer and the barrier layer by sputtering, and further, a seed layer of copper was formed on the barrier metal by sputtering. Next, a photoresist layer was formed, and a metal wiring of copper that is electrically connected to the LED was formed on the opening pattern portion of the planarization layer and a part of the surface of the planarization layer by plating. Then, the photoresist layer, the seed layer, and the barrier metal at the portion where the metal wiring was not formed were removed. The thickness of the metal wiring formed on a part of the surface of the planarization layer was 5 μm.

[0571] Next, a positive photosensitive composition containing a polyimide and a polybenzoxazole precursor was applied to the planarization layer and the barrier layer by the above method and pre-baked, and after pattern exposure, development and rinsing were performed through a photomask having a prescribed pattern, heat curing was performed by heating, whereby an interlayer insulating layer having a film thickness of about 10 μm was formed. The heat curing conditions were to perform a heating treatment at 110°C for 30 minutes in a nitrogen atmosphere having an oxygen concentration of 100 mass ppm or less, and further to perform a heating treatment at 230°C for 60 minutes. Next, a barrier metal of titanium was formed on the interlayer insulating layer by sputtering, and further, a seed layer of copper was formed on the barrier metal by sputtering. Next, a photoresist layer was formed, and a metal wiring of copper that is electrically connected to the LED was formed on the opening pattern portion of the interlayer insulating layer and a part of the surface of the interlayer insulating layer by plating. Then, the photoresist layer, the seed layer, and the barrier metal at the portion where the metal wiring was not formed were removed. The thickness of the metal wiring formed on a part of the surface of the interlayer insulating layer was 5 μm. Then, the formation of the interlayer insulating layer and the formation of the metal wiring described above were repeated twice, and three layers of interlayer insulating layers were formed. The total film thickness of the three layers of interlayer insulating layers was 30 μm.

[0572] Next, on the metal wiring of the opening pattern portion of the interlayer insulating layer, a barrier metal is formed by sputtering, and a solder bump is formed. Then, by heating at 260°C for 1 minute, the solder is reflowed, and the light emitting element drive substrate is electrically connected to the light emitting element drive substrate having a drive IC as a drive element via the solder bump. Next, the support substrate is peeled off, and the opposing substrate is attached using an adhesive layer or the like, thereby producing a Micro LED display having LEDs as a plurality of light emitting elements.

[0573] Examples 2 to 136 and Comparative Examples 1 to 6

[0574] The same operation and evaluation as in Example 1 were performed using each composition shown in Tables 3-1-1 to 3-11. Note that, in Examples 1 to 120, Examples 127 to 136, and Comparative Examples 1 to 6, each composition was used as the composition for forming a pixel partition layer or the composition for forming a planarization layer, and the composition S1 was used as the composition for forming a barrier rib layer. On the other hand, in Examples 121 to 126, the composition 1 was used as the composition for forming a pixel partition layer or the composition for forming a planarization layer, and the compositions S2 to S7 were used as the composition for forming a barrier rib layer. The evaluation results thereof are shown in Tables 3-1-1 to 3-11. Note that, in Examples 76, Examples 82 to 86, Example 94, and Example 95, the content of fluorine element in the total solid content of the composition for forming a pixel partition layer exceeded 1,000 mass ppm. In Examples 1 to 75, Examples 77 to 81, Examples 87 to 93, Examples 96 to 98, Examples 106 to 120, Examples 127 to 136, and Comparative Examples 1 to 6, the content of fluorine element in the total solid content of the composition for forming a pixel partition layer was 0 mass ppm. In the compositions S1 to S7, the content of fluorine element in the total solid content of the composition for forming a barrier rib layer was 0 mass ppm. In Examples 99 to 105, the content of fluorine element in the total solid content of the composition for forming a pixel partition layer is described in Table 3-6-1.

[0575] Note that the hydrogen ion exponent of each composition prepared by Example 1 and Examples 73 to 81 is described in Tables 3-5. In addition, in each example, in the case where a composition having positive photosensitivity was used, the developing time was set to 60 seconds, 90 seconds, or 120 seconds. From these results, the optimum developing time (60 seconds, 90 seconds, or 120 seconds) and the optimum exposure amount at the developing time were determined. The pattern after exposure at the optimum exposure amount and development at the optimum developing time was heat cured at 200°C for 60 minutes. The heat curing conditions were such that, after heating treatment at 200°C for 60 minutes at a temperature increase rate of 3.5°C / min under a nitrogen atmosphere having an oxygen concentration of 20 ppm or less, the temperature was decreased to 50°C. On the other hand, in the case where a composition having negative photosensitivity was used, a photomask in which the light-transmitting portion and the light-blocking portion were exchanged was used, and the developing time was set to 1.3 times the measured BP. The pattern after exposure at the optimum exposure amount and development was heat cured at 220°C for 60 minutes. The heat curing conditions were such that, after heating treatment at 220°C for 60 minutes at a temperature increase rate of 3.5°C / min under a nitrogen atmosphere having an oxygen concentration of 20 ppm or less, the temperature was decreased to 50°C.

[0576] [Table 3-1-1]

[0577] [Table 3-1-1]

[0578]

[0579] [Table 3-1-2]

[0580] [Table 3-1-2]

[0581]

[0582] [Table 3-2]

[0583]

[0584] [Table 3-3]

[0585]

[0586] [Table 3-4]

[0587]

[0588] [Table 3-5]

[0589]

[0590] [Table 3-6-1]

[0591] [Table 3-6-1]

[0592]

[0593] [Table 3-6-2]

[0594] [Table 3-6-2]

[0595]

[0596] [Table 3-7]

[0597]

[0598] [Table 3-8]

[0599]

[0600] [Table 3-9]

[0601]

[0602] [Table 3-10]

[0603]

[0604] [Table 3-11]

[0605]

[0606] Comparative Example 1 and Comparative Example 2 do not contain the specific halogen compound, and thus various properties are deteriorated. In the case of Comparative Example 3, the content of chlorine element and the content of chloride ion do not satisfy the specific matters of the application of the present application. In addition, Comparative Example 4 does not contain the specific halogen compound, and the content of the specific anion exceeds 30,000 mass ppm (= 3.0 mass %). Comparative Example 5 does not contain the specific halogen compound, and the content of methanol exceeds 30,000 mass ppm (= 3.0 mass %). Thus, various properties of Comparative Examples 3 to 5 are deteriorated.

[0607] BRIEF DESCRIPTION OF DRAWINGS

[0608] 1a, 1b display device

[0609] 2 light emitting element

[0610] 3 interlayer insulating layer

[0611] 4, 4c metal wiring

[0612] 5 counter substrate

[0613] 6 electrode terminal

[0614] 7 light emitting element drive substrate

[0615] 8 drive element

[0616] 9 barrier metal

[0617] 10 solder bump

[0618] 15 barrier layer

[0619] 21 planarization layer

[0620] 47 alkali-free glass substrate

[0621] 48 first electrode portion

[0622] 49 auxiliary electrode portion

[0623] 50 pixel division layer portion

[0624] 51 organic EL layer portion including light emitting layer

[0625] 52 second electrode portion

[0626] 101 substrate

[0627] 102 metal wiring

[0628] 103 TFT element layer

[0629] 104 interlayer insulating layer

[0630] 105 TFT planarization layer / TFT protective layer

[0631] 106 pixel division layer having stepped shape

[0632] 107 first electrode

[0633] 108 light emitting layer

[0634] 109 second electrode

[0635] 110 sealing layer

[0636] 111 touch panel wiring / touch panel electrode

[0637] 112 color filter layer

[0638] 113 black matrix layer

[0639] 114 cover surface layer

[0640] 115 substrate

[0641] 116 thick film portion in pixel division layer

[0642] 100x cross-sectional axis in plan view

[0643] 106a opening portion of pixel division layer portion having stepped shape

[0644] 112a color filter layer portion

[0645] 113a opening portion of black matrix layer portion

[0646] 116a thick film portion in pixel division layer portion

Claims

1. A photosensitive composition, which is a photosensitive composition containing (A) a binder resin and (C) a photosensitive agent, wherein the photosensitive composition further contains one or more components selected from the group consisting of a chlorine element-containing component, a bromine element-containing component, a chloride ion-containing component, and a bromide ion-containing component, the photosensitive composition further contains water, the photosensitive composition further satisfies the following (1) and (3), (1) the total content of chlorine element and bromine element in the total solid content of the photosensitive composition is 0.0010 to 1,000 mass ppm, and / or the total content of chloride ion and bromide ion in the total solid content of the photosensitive composition is 0.0010 to 1,000 mass ppm; (3) the content of water in the photosensitive composition is 0.010 to 3.0 mass %.

2. The photosensitive composition according to claim 1, which further satisfies the following (2), (2) the total content of chlorine element and bromine element in the total solid content of the photosensitive composition is 0.0010 to 1,000 mass ppm, and the total content of chloride ion and bromide ion in the total solid content of the photosensitive composition is 0.0010 to 1,000 mass ppm.

3. The photosensitive composition according to claim 1, which contains one or more selected from the group consisting of sulfate ion, sulfite ion, nitrate ion, nitrite ion, phosphate ion, phosphite ion, hypophosphite ion, formate ion, acetate ion, and oxalate ion, and satisfies the following (4); and / or contains one or more selected from the group consisting of phosphoric acid ester, phosphonic acid, phosphonic acid ester, phosphorous acid ester, phosphinic acid, and phosphinous acid ester, and satisfies the following (5), (4) the total content of sulfate ion, sulfite ion, nitrate ion, nitrite ion, phosphate ion, phosphite ion, hypophosphite ion, formate ion, acetate ion, and oxalate ion in the total solid content of the photosensitive composition is 0.0010 to 30,000 mass ppm; (5) the total content of phosphoric acid ester, phosphonic acid, phosphonic acid ester, phosphorous acid ester, phosphinic acid, and phosphinous acid ester in the total solid content of the photosensitive composition is 0.0010 to 30,000 mass ppm.

4. The photosensitive composition according to claim 1, which further contains a tertiary amine compound and / or a quaternary ammonium ion, and satisfies the following (6), (6) the total content of tertiary amine compound and quaternary ammonium ion in the total solid content of the photosensitive composition is 0.0010 to 50,000 mass ppm.

5. The photosensitive composition according to claim 1, which further contains one or more selected from the group consisting of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, (2-methoxy-1-propyl) acetate, (2-ethoxy-1-propyl) acetate, methyl allyl methyl ether, and methyl allyl ethyl ether, and satisfies the following (9a), ​ (9a) the total content of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, (2-methoxy-1-propyl) acetate, (2-ethoxy-1-propyl) acetate, methyl allyl methyl ether, and methyl allyl ethyl ether in the photosensitive composition is 0.0010 to 1,000 mass ppm.

6. The photosensitive composition according to claim 1, further comprising one or more selected from the group consisting of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, (2-methoxy-1-propyl) acetate, (2-ethoxy-1-propyl) acetate, methyl allyl methyl ether, and methyl allyl ethyl ether, and satisfies the following (9b), (9b) the total content of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, (2-methoxy-1-propyl) acetate, (2-ethoxy-1-propyl) acetate, methyl allyl methyl ether, and methyl allyl ethyl ether in the photosensitive composition exceeds 1,000 mass ppm and is 10,000 mass ppm or less.

7. A photosensitive composition which is a photosensitive composition containing (A) a binder resin and (C) a photosensitive agent, wherein the (A) binder resin contains (Al) a weak acid group-containing resin, the (Al) weak acid group-containing resin contains one or more selected from the group consisting of (Alx-2) resin: polyimide, (Alx-3) resin: polyimide precursor, (Alx-4) resin: polybenzoxazole, (Alx-5) resin: polybenzoxazole precursor, (Alx-6) resin: polyamide-imide, (Alx-7) resin: polyamide-imide precursor, and (Alx-8) resin: polyamide, the photosensitive composition further contains one or more selected from the group consisting of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, (2-methoxy-1-propyl) acetate, (2-ethoxy-1-propyl) acetate, methyl allyl methyl ether, and methyl allyl ethyl ether, and satisfies the following (9c), (9c) the total content of 2-methoxy-1-propanol, 2-ethoxy-1-propanol, (2-methoxy-1-propyl) acetate, (2-ethoxy-1-propyl) acetate, methyl allyl methyl ether, and methyl allyl ethyl ether in the photosensitive composition is 0.0010 to 10,000 mass ppm.

8. The photosensitive composition according to any one of claims 5 to 7, further comprising one or more selected from the group consisting of an amide compound represented by general formula (21), a cyclic urea compound represented by general formula (22), a urea compound represented by general formula (23), an oxazolidinone compound represented by general formula (24), and an isoxazolidinone compound represented by general formula (25), and satisfying the following (12), The total content of the amide compound represented by General Formula (21), the cyclic urea compound represented by General Formula (22), the urea compound represented by General Formula (23), the oxazolidinone compound represented by General Formula (24), and the isoxazolidinone compound represented by General Formula (25) in the total solid content of the photosensitive composition is 0.010 mass% or more and 5.0 mass% or less, [Chemical Formula 1] In General Formulae (21) to (25), R 47 ~R 56 each independently represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 15 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, or a hydroxyalkyl group having 1 to 6 carbon atoms; R 130 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a hydroxyalkyl group having 1 to 6 carbon atoms, a hydroxyalkoxy group having 1 to 6 carbon atoms, a hydroxy group, an amino group, a monoalkylamino group having 1 to 6 carbon atoms, or a dialkylamino group having 2 to 12 carbon atoms; R 132 , R 133 , and R 137 ~R 142 each independently represents an alkyl group having 1 to 6 carbon atoms; β and γ each independently represent an integer of 0 to 6; b, c, h, i, j, k, 1, and m each independently represent an integer of 0 to 2; b is 0 when β is 0; and c is 0 when γ is 0.

9. The photosensitive composition according to any one of claims 1 to 7, wherein The (A) binder resin satisfies the following (P1a) condition, (P1a) The content of fluorine elements in the structure of the (A) binder resin is 10,000 mass ppm or less.

10. The photosensitive composition according to any one of claims 1 to 7, which satisfies the following (la) condition, (la) The content of fluorine elements in the total solid content of the photosensitive composition is 1,000 mass ppm or less.

11. The photosensitive composition according to any one of claims 1 to 7, wherein The (A) binder resin contains an (Al) weak-acid-group-containing resin, The (Al) weak-acid-group-containing resin has one or more groups selected from the group consisting of a phenolic hydroxyl group, a hydroxyl imide group, a hydroxyl amide group, a silanol group, a 1,1-bis(trifluoromethyl)hydroxymethyl group, and a mercapto group as a (WA) weak-acid group.

12. The photosensitive composition of claim 11, wherein, The (Al) weak-acid-group-containing resin contains an (Alx-1) resin: a polysiloxane.

13. The photosensitive composition of claim 12, wherein, When the photosensitive composition is diluted with water to prepare a diluted solution, the solid content concentration of the diluted solution is 1 / 100 times the solid content concentration of the photosensitive composition, and the hydrogen ion index of the diluted solution is 5.5 or more and 7.0 or less.

14. The photosensitive composition of claim 5 or 6, wherein The (A) binder resin contains an (Al) weak-acid-group-containing resin, and the (Al) weak-acid-group-containing resin contains one or more selected from the group consisting of an (Alx-2) resin: a polyimide, an (Alx-3) resin: a polyimide precursor, an (Alx-4) resin: a polybenzoxazole, an (Alx-5) resin: a polybenzoxazole precursor, an (Alx-6) resin: a polyamide-imide, an (Alx-7) resin: a polyamide-imide precursor, and an (Alx-8) resin: a polyamide.

15. The photosensitive composition according to any one of claims 5 to 7, wherein The (A) binder resin contains an (Al) weak-acid-group-containing resin, and the (Al) weak-acid-group-containing resin contains one or more selected from the group consisting of an (Alx-2) resin: a polyimide, an (Alx-3) resin: a polyimide precursor, an (Alx-4) resin: a polybenzoxazole, an (Alx-5) resin: a polybenzoxazole precursor, an (Alx-6) resin: a polyamide-imide, an (Alx-7) resin: a polyamide-imide precursor, and an (Alx-8) resin: a polyamide (hereinafter referred to as a “polyimide-based resin having a weak-acid group”). The polyimide-based resin having a weak-acid group has a (DA1) first amine residue: an amine residue having a phenolic hydroxyl group, the (DA1) first amine residue has at least two (la) structures: cyclic structures having a phenolic hydroxyl group, and the (DA1) first amine residue further has a (IIa) structure: a structure linking at least two of the (la) structures.

16. The photosensitive composition according to any one of claims 1 to 7, further comprising one or more selected from the group consisting of 1-methoxy-2-propanol, 1-ethoxy-2-propanol, methyl acetate, ethyl acetate, allyl methyl ether, allyl ethyl ether, isopropenyl methyl ether, and isopropenyl ethyl ether, and satisfies the following condition (8), (8) the total content of 1-methoxy-2-propanol, 1-ethoxy-2-propanol, methyl acetate, ethyl acetate, allyl methyl ether, allyl ethyl ether, isopropenyl methyl ether, and isopropenyl ethyl ether in the photosensitive composition is 0.0010 to 30,000 mass ppm.

17. The photosensitive composition according to any one of claims 1 to 7, wherein the (C) photosensitive agent comprises a (C1) naphthoquinone diazide compound, the photosensitive composition further comprises one or more selected from the group consisting of N-methylpyrrolidone, N-ethylpyrrolidone, 1,4-dioxane, and tetrahydrofuran, and satisfies the following condition (11), (11) the total content of N-methylpyrrolidone, N-ethylpyrrolidone, 1,4-dioxane, and tetrahydrofuran in the photosensitive composition is 0.0010 to 1,000 mass ppm.

18. The photosensitive composition according to any one of claims 1 to 7, which is used for the formation of a barrier layer formed between adjacent light emitting elements or a planarization layer formed so as to cover at least a part of a light emitting element in a Micro LED display or a Mini LED display.

19. A cured product obtained by curing the photosensitive composition according to any one of claims 1 to 7.

20. A display device comprising the cured product according to claim 19.

21. A method for producing a cured product, comprising: (1) a step of forming a coating film of the photosensitive composition according to any one of claims 1 to 7 on a substrate; (2) a step of irradiating the coating film of the photosensitive composition with active chemical rays through a photomask; (3) a step of developing the photosensitive composition using a developing solution to form a pattern of the photosensitive composition; and (4) a step of heating the pattern to obtain a cured pattern of the photosensitive composition.

22. A display device comprising a substrate, a rewiring layer, an interlayer insulating layer of the rewiring layer, and a light emitting element, and further comprising a barrier layer and / or a planarization layer, wherein the light emitting element is a semiconductor chip, and in a plan view, the area of the rewiring layer is larger than the area of the light emitting element, the barrier layer is formed between adjacent light emitting elements, the planarization layer is formed so as to cover at least a part of the light emitting element, the planarization layer is formed so as to cover at least a part of the light emitting element, The barrier layer and / or the planarization layer contains one or more components selected from the group consisting of a chlorine element-containing component, a bromine element-containing component, a chloride ion-containing component, and a bromide ion-containing component, and satisfies the following (X1a) and / or (X1b), (X1a) the total of the contents of chlorine element and bromine element in the barrier layer is 0.0010 to 1,000 mass ppm, and / or the total of the contents of chloride ion and bromide ion in the barrier layer is 0.0010 to 1,000 mass ppm; (X1b) the total of the contents of chlorine element and bromine element in the planarization layer is 0.0010 to 1,000 mass ppm, and / or the total of the contents of chloride ion and bromide ion in the planarization layer is 0.0010 to 1,000 mass ppm.

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