Weighing and appearance detection equipment

Abstract

The invention discloses weighing and appearance detection equipment. The weighing and appearance detection equipment comprises a flower basket, the flower basket feeding and discharging area at least comprises a flower basket feeding track and a flower basket discharging track; the mechanical arm comprises a fixing frame, a flower basket rotating assembly and clamping modules used for being clamped on the two sides of the flower basket, and the flower basket rotating assembly adjusts the flower basket to be switched between the obliquely upward transferring posture and the horizontal taking and placing posture at the open end; the detection transfer area comprises a sorting frame and a wafer carrying module which are adjacently arranged, and the sorting frame comprises a plurality of flower basket placing positions; the wafer carrying module picks up undetected wafers and moves the undetected wafers to a detection area, and picks up detected wafers to a qualified flower basket or an unqualified flower basket; the detection area comprises a morphology detection platform and a weighing detection platform which are arranged at an interval, and a wafer position adjusting device deviating from the wafer carrying module; a light source and a first visual camera are arranged above the morphology detection platform; the weighing detection platform is provided with at least one weighing unit and a sealing cover arranged above the weighing unit.

Description

Technical Field

[0001] This invention relates to the field of wafer inspection equipment technology, specifically to a weighing and appearance inspection device. Background Technology

[0002] Currently, wafers, as the core basic material for semiconductor manufacturing, are usually made from high-purity single-crystal silicon through processes such as cutting, grinding, and polishing. In the precision manufacturing process, the weight change and surface morphology characteristics of wafers are key process indicators: weighing operations can monitor the increase or decrease of material in the thin film deposition or etching process in real time, while morphology detection is used to identify defects such as surface particle contamination, scratches, and warping.

[0003] In the prior art, inspection equipment is set up to inspect the morphology of wafers in order to avoid the occurrence of defective products, especially whether the weight of the wafer is compliant and whether the wafer has cracks and chipping. For this purpose, multiple inspection stations need to be set up. In order to improve the efficiency of wafer loading and unloading, wafer baskets are usually set up to accommodate multiple wafers, and the wafer baskets are clamped and transferred.

[0004] The aforementioned weighing and morphology inspection stations are set up independently, with the two sets of equipment located in different positions on the production line. This increases the space occupancy rate of the cleanroom. Furthermore, due to the long transfer distance between the weighing and morphology inspection stations, the risk of dust adhering to the wafer surface increases during wafer transfer. In addition, both the inspection and weighing stations require manual loading and unloading. Currently, manual assistance is also needed at the inspection and weighing stations. Workers need to remove the wafers to be inspected from the baskets, complete the inspection, and then put them back into the baskets, resulting in low inspection efficiency. Moreover, manual operation further increases the risk of wafer breakage.

[0005] Therefore, improvements are needed to the existing wafer loading / unloading and morphology / weight inspection stations. Summary of the Invention

[0006] In view of the shortcomings of the existing technology, the purpose of this invention is to provide a weighing and appearance inspection device.

[0007] The above-mentioned technical objective of the present invention is achieved through the following technical solution: a weighing and appearance inspection device, comprising: The flower basket includes an open end for the wafer to enter and a limiting end disposed away from the open end; The basket loading and unloading area includes at least a basket feeding track and a basket discharging track, and at one end of the basket loading and unloading area, there are untested basket loading positions and qualified basket unloading positions. A misalignment detection module for detecting the position of the wafer inside the basket is provided on the path of the basket feeding track. The robotic arm includes a fixed frame mounted on the end of the robotic arm and a flower basket rotating assembly rotatably connected to the lower end of the fixed frame. The lower end of the flower basket rotating assembly is provided with clamping modules for clamping the two sides of the flower basket, and the flower basket rotating assembly can switch between a transfer posture in which the flower basket is tilted upward at the open end and a horizontal picking and placing posture. The inspection area includes adjacent sorting racks and wafer handling modules. The sorting rack includes multiple flower basket placement positions to receive at least untested flower baskets, place qualified flower baskets and unqualified flower baskets, as well as empty flower baskets; the sorting rack, the untested flower basket loading position and the qualified flower basket unloading position are all located in the movement path of the robot arm; The wafer handling module includes a multi-axis moving wafer transfer assembly, which picks up untested wafers and moves them to the testing area, and picks up tested wafers to the qualified or unqualified baskets. The inspection area includes a morphology inspection platform and a weighing inspection platform arranged at intervals, as well as a wafer positioning device that is away from the wafer handling module. The morphology detection platform is equipped with a light source and a first vision camera for detecting wafer string and morphology above it; the weighing detection platform is equipped with at least one weighing unit and a lifting and lowering sealing cover set above the weighing unit. The wafer positioning device includes a wafer transfer assembly for holding and transferring the wafer, a rotating assembly connected to the wafer transfer assembly, a wafer lifting assembly for actuating the rotating assembly to move about the weighing detection platform and the topography detection platform, and a wafer translation assembly for actuating the rotating assembly to move into or away from the detection position, wherein the rotating assembly transfers the wafer surface to be attached to the topography detection platform.

[0008] Furthermore, the flower basket loading and unloading area includes a flower basket inlet / outlet module, a flower basket transport module, and a flower basket transfer module arranged in sequence; the flower basket inlet / outlet module includes a flower basket feeding carrier and a flower basket discharging carrier arranged adjacent to each other, the flower basket transport module is arranged above the flower basket transfer module, and grabs the flower basket and transfers it between the flower basket transfer module and the flower basket inlet / outlet module, the flower basket feeding track and the flower basket discharging track constitute the flower basket transfer module, and the end of the flower basket transfer module is provided with a flower basket limiting component to constrain the current position of the flower basket.

[0009] Furthermore, the misalignment detection module includes a second vision camera and an infrared backlight plate arranged on both sides of the flower basket feeding track. In the flower basket transfer module, the open end of the flower basket is set perpendicular to the moving direction of the flower basket transfer module.

[0010] Furthermore, the flower basket rotating assembly includes a telescopic unit and a rotating frame rotatably disposed at the lower end of the fixed frame. The upper end of the telescopic unit is hinged to the upper end of the fixed frame, and the lower end of the telescopic unit is hinged to the upper end of the rotating frame. The clamping module is disposed on the rotating frame. The rotating frame is maintained in the transfer posture and the pick-up and place posture by the telescopic movement of the telescopic unit. The wafer is disposed facing the wafer handling module in the pick-up and place posture.

[0011] Furthermore, a queue-jumping area is provided between the flower basket loading / unloading area and the detection and transfer area. The queue-jumping area is provided with a queue-jumping platform, a queue-jumping flower basket unloading track, and an empty flower basket buffer track, which are arranged adjacently and located in the rotation path of the robot arm. The sorting rack is provided with a queue-jumping flower basket placement position. The queue-jumping platform is electrically connected to the robot arm and prioritizes grabbing the queue-jumping flower baskets on the queue-jumping platform.

[0012] Furthermore, an empty flower basket buffer track is provided in the rotation path of the robot arm, and a flower basket detection module is provided on the empty flower basket buffer track. The flower basket detection module is used to scan and identify flower basket strings.

[0013] Furthermore, the wafer handling module includes a wafer multi-axis moving component for actuating the wafer transfer assembly to move between the sorting rack and the detection area; The wafer transfer assembly includes a suction plate and a connecting mold base. The connecting mold base is provided with a negative pressure component that communicates with the suction plate. The suction plate is provided with an adsorption area that communicates with the negative pressure component. The adsorption area matches the contour of the wafer. The connecting mold base is disposed on the moving end of the wafer multi-axis moving assembly and the rotating assembly.

[0014] Furthermore, the testing area is equipped with a testing stand arranged between the wafer handling module and the wafer positioning device, and the weighing testing platform and the morphology testing platform are vertically spaced on the testing stand.

[0015] Furthermore, the basket feeding carrier and the basket transfer module are arranged in the same direction, and the basket handling module and the sorting rack define a parallel arrangement space in the same direction. The wafer handling module, the robot arm, and the detection area are arranged sequentially in the parallel arrangement space. The queue-jumping platform, the queue-jumping basket unloading track, and the empty basket buffer track are arranged vertically between the sorting rack and the basket handling module.

[0016] Furthermore, a manual inspection station is also provided on one side of the inspection area. The manual inspection station is arranged along the wafer handling module and is equipped with a three-dimensional microscope and a wafer placement platform.

[0017] Compared with the prior art, the present invention has the following advantages and beneficial effects: The present invention realizes the fully automated closed loop of wafer loading and unloading and wafer inspection, and constructs a fully unmanned system from automatic basket loading, precise wafer positioning, multi-dimensional inspection to intelligent sorting. Through the coordinated action of the robotic arm and the basket rotating component, dynamic attitude control of the wafer is realized during the transfer process. With the pre-screening mechanism of the misalignment detection module, non-conforming wafers are temporarily stored on the sorting rack to correct the error of secondary loading of misaligned baskets. Furthermore, untested wafers, qualified wafers, unqualified wafers and empty baskets are placed in different positions on the sorting rack, so that the equipment can simultaneously complete inspection, sorting and empty basket recycling within a single operation cycle.

[0018] Furthermore, through optimized design of reasonable space and area planning, and modular partitioning and three-dimensional integration, this invention significantly improves the compactness and smoothness of the wafer inspection process. Specifically, the basket feeding carrier, basket transfer module, sorting rack, and wafer handling module are arranged in the same direction to form a straight material flow, avoiding cross-transfer, shortening the movement path of the robot arm, and improving the wafer turnover efficiency. In the vertical direction, a vertically arranged queue-jumping platform is added between the sorting rack and the basket handling module, allowing emergency baskets to be processed first without affecting the continuity of the main process, thus realizing dynamic task scheduling. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall layout of the present invention; Figure 2 This is a layout diagram of the flower basket loading and unloading area of ​​the present invention; Figure 3 This is a schematic diagram of the structure of the flower basket entry / exit module, the flower basket transport module, and the flower basket transfer module of the present invention. Figure 4 This is a schematic diagram of the structure of the flower basket transfer module of the present invention; Figure 5 This is a schematic diagram of the structure of the flower basket limiting component of the present invention; Figure 6 This is a schematic diagram of the structure of the flower basket feeding carrier of the present invention; Figure 7 This is a schematic diagram of the detection transfer area, the queue insertion area, and the detection area of ​​the present invention. Figure 8 This is a schematic diagram showing the arrangement of the detection transfer area, the queueing area, and the detection area of ​​the present invention. Figure 9 This is a schematic diagram of the sorting rack of the present invention; Figure 10 This is a schematic diagram of the arrangement of the sorting rack of the present invention; Figure 11 This is a schematic diagram of the wafer handling module of the present invention; Figure 12 This is a cross-sectional view of the suction plate of the present invention; Figure 13 This is a partial schematic diagram of the suction plate of the present invention; Figure 14 This is a schematic diagram of the structure of the robotic arm of the present invention; Figure 15 This is a schematic diagram of the flower basket rotating assembly of the present invention in the picking and placing posture; Figure 16 This is a schematic diagram of the flower basket rotating assembly of the present invention in the transfer posture; Figure 17 This is a schematic diagram showing the interaction between the clamping module of the present invention and the flower basket; Figure 18 This is a cross-sectional schematic diagram of the clamping module and the flower basket of the present invention; Figure 19 This is a schematic diagram of the flower basket structure of the present invention; Figure 20 This is a schematic diagram of the wafer handling module, inspection stand, and wafer positioning device of the present invention. Figure 21 This is a schematic diagram of the detection stand and wafer positioning device of the present invention; Figure 22 for Figure 21 Enlarged view of point A in the middle; Figure 23 This is a schematic diagram of the detection stand of the present invention; Figure 24 This is a schematic diagram of the detection translation component of the present invention; Figure 25 This is a cross-sectional view of the detection stand of the present invention; Figure 26 This is a schematic diagram of the wafer alignment device of the present invention; Figure 27 This is a schematic diagram of the structure of the suction plate in the wafer positioning device of the present invention; Figure 28 This is a schematic diagram of the structure of the manual inspection station of the present invention; In the diagram: 1. Flower basket; 1.1. Open end; 1.2. Limiting end; 1.3. Frame; 1.4. Limiting edge; 1.5. Closing section; 1.6. Partition. 2. Wafer; a) Flower basket loading and unloading area; b) Inspection and transfer area; c) Inspection area; d) Queue-jumping area; 3. Flower basket in / out module; 3.1 Flower basket feeding carrier; 3.2 Flower basket discharging carrier; 3.3 In / out track; 3.4 Shelf; 3.5 Lifting platform; 3.51 Lifting plate; 3.52 Mounting plate; 3.53 Guide column; 3.54 Support base plate; 3.55 Lifting cylinder; 3.56 First contact block; 3.57 Second contact block; 3.58 First buffer cylinder; 3.59 Second buffer cylinder; 4. Flower basket handling module; 4.1. Three-axis moving assembly; 4.2. Flower basket gripping assembly; 4.21. Clamping plate; 4.22. Clamping cylinder; 5. Flower basket transfer module; 5.1 Flower basket feeding track; 5.2 Flower basket discharging track; 5.3 Flower basket limiting assembly; 5.31 First limiting cylinder; 5.32 Second limiting cylinder; 5.33 Third limiting block; 5.34 Fourth limiting cylinder; 5.35 Fifth limiting cylinder; 5.4 Flower basket limiting platform; 6. Robotic arm; 6.1 Fixing frame; 6.11 Upper fixing plate; 6.12 Lower fixing plate; 6.13 Upright frame; 6.2 Flower basket rotating assembly; 6.21 Clamping module; 6.211 Clamping cylinder; 6.212 Clamping block; 6.22 Telescopic unit; 6.23 Rotating frame; 6.24 Actuating end; 6.25 First rotating seat; 7. Sorting rack; 7.1 Automatic testable flower basket area; 7.2 Automatic qualified flower basket area; 7.3 Unqualified flower basket area; 7.4 Queue-jumping flower basket area; 7.41 Queue-jumping qualified position; 7.42 Queue-jumping testable position; 7.5 Storage and transfer module; 8. Wafer handling module; 8.1 First wafer transfer assembly; 8.2 Multi-axis wafer moving assembly; 8.3 Telescopic module 9. Misalignment detection module; 9.1. Second vision camera; 9.2. Infrared backlight panel; 10. Shape inspection platform; 10.1. First-person vision camera; 10.2. Light source; 10.3. Placement stage; 10.4. Static electricity elimination module; 10.5. Adjustment frame; 10.51. Rotary hole; 10.52. Arc-shaped channel; 10.6 Detection of translation components; 10.61 Translation frame; 10.62 Support frame; 10.621 First vertical adjustment slot; 10.622 Second vertical adjustment slot; 10.63 First vision mounting block; 10.631 Horizontal adjustment slot; 10.64 Second vision mounting block; 10.65 Translation unit; 11. Weighing and testing platform; 11.1. Weighing unit; 11.2. Sealing cover; 11.3. Sealing frame; 11.4. Sealing lifting assembly; 12. Wafer positioning device; 12.1 Second wafer transfer assembly; 12.2 Rotary assembly; 12.21 Gear; 12.22 Rack; 12.23 Linear actuation module; 12.3 Wafer lifting assembly; 12.31 Linear movement module; 12.32 First moving frame; 12.4 Wafer translation assembly; 12.41 Vertical movement module; 12.42 Second moving frame; 12.5 Adjustment base; 13. Queue-jumping platform; 13.1. Queue-jumping flower basket unloading track; 13.2. Empty flower basket buffer track; 13.3. Queue-jumping pushing module; 13.4. Queue-jumping non-compliance platform; 13.5. Flower basket detection module; 14. Suction plate; 14.1. Connecting mold base; 14.11. Connecting plate; 14.12. Insert groove; 14.13. Limiting plate; 14.2. Negative pressure assembly; 14.21. Negative pressure block; 14.22. Negative pressure connector; 14.3. Adsorption area; 14.31. First air passage groove; 14.32. Second air passage groove; 14.33. Air passage hole; 14.34. Plate; 15. Inspection stand; 16. Manual inspection table; 16.1. 3D microscope; 16.2. Wafer placement platform; Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] It should be understood that although the terms upper, middle, lower, top, one end, etc., appear in this document to describe various elements, these elements are not limited by these terms. These terms are only used to distinguish the elements from each other for ease of understanding, and are not used to define any directional or sequential restrictions.

[0022] like Figures 1 to 28 As shown, a weighing and appearance inspection device includes a basket loading / unloading area a, a robotic arm 6, and an inspection and transfer area b arranged sequentially. The basket 1, as a carrier of the wafer 2, is used to carry multiple wafers and transfer multiple wafers between different workstations. The basket includes an open end 1.1 for wafers to enter and a limiting end 1.2 set away from the open end 1.1. In the vertical direction, multiple spaced spaces are arranged inside the basket so that the wafers are arranged vertically at intervals in the basket. The flower basket loading and unloading area a serves as the loading space for untested flower baskets and the unloading space for qualified flower baskets. It includes at least a flower basket feeding track 5.1 and a flower basket discharging track 5.2. At one end of the flower basket loading and unloading area a, the flower basket feeding track 5.1 forms the loading position for untested flower baskets, and the flower basket discharging track 5.2 forms the unloading position for qualified flower baskets. The untested flower baskets are loaded together with the untested flower baskets to form an automatic loading and unloading position. The untested flower baskets are transferred to the inspection and transfer area b by the robot arm 6, and the full qualified flower baskets that have been inspected in the inspection and transfer area b are transferred to the flower basket discharging track 5.2. Among them, a misalignment detection module 9 is provided on the path of the basket feeding track 5.1 for detecting the position of the wafer in the basket. The misalignment detection module 9 is used to detect the vertical position of the wafer in the basket. If the wafer is misaligned in the vertical interval space, the basket is temporarily marked as a defective basket and placed in the defective position in the detection transfer area b. After adjusting the position of the wafer in the basket, a second feeding detection is performed. The robotic arm 6 includes a fixed frame 6.1 mounted on the end effector 6.24 of the robotic arm 6, and a basket rotation assembly 6.2 rotatably connected to the lower end of the fixed frame 6.1. The end effector 6.24 of the robotic arm 6 is configured to rotate around its axis, thereby adjusting the posture of the basket 4 when placed in the next workstation. The lower end of the basket rotation assembly 6.2 is provided with a clamping module 6.21 for clamping both sides of the basket. The robotic arm 6 uses the clamping module 6.21 to transfer the basket between the detection and transfer area b and the basket loading and unloading area a. The basket rotation assembly 6.2 adjusts the basket to switch between a transfer posture with the open end 1.1 tilted upward and a horizontal pick-and-place posture. That is, during the transfer of the basket, the basket is held in the transfer posture, which can effectively prevent the wafer from falling out of the basket, and switches to a horizontal pick-and-place posture when the basket is transferred to the target position. The detection transfer area b includes adjacent sorting racks 7 and wafer handling modules 8, which are preferably arranged in parallel to optimize the space of the equipment. The sorting rack 7 includes multiple flower basket placement positions to receive at least untested flower baskets, place qualified flower baskets and unqualified flower baskets, as well as empty flower baskets; the sorting rack 7, the untested flower basket loading position and the qualified flower basket unloading position are all located in the motion path of the robot arm 6; The wafer handling module 8 includes a first wafer transfer component 8.1 with multi-axis movement. The wafer transfer component is capable of translational movement on at least the XYZ axes to pick up wafers at different positions in the sorting rack 7 and return the inspected wafers to the sorting rack 7. That is, the wafer transfer component picks up untested wafers and moves them to the inspection area c, and picks up inspected wafers and places them into the qualified or unqualified baskets according to the inspection results. The detection area c includes a topography detection platform 10 and a weighing detection platform 11 arranged at intervals, and a wafer positioning device 12 located away from the wafer handling module 8. The topography detection platform 10 and the weighing platform are preferably arranged vertically at intervals to further optimize the space occupied by the detection area c. For this purpose, the wafer positioning device 12 can extend and retract at least in the Z direction and relative to the detection platform to pick up and position the wafer. The morphology inspection platform 10 is equipped with a light source 10.2 and a first vision camera 10.1 for detecting wafer string and morphology. The first vision camera 10.1 is used to detect the morphology and string of the wafer. The weighing inspection platform 11 is equipped with at least one weighing unit 11.1 and a lifting and lowering sealing cover 11.2 installed above the weighing unit 11.1. The sealing cover 11.2 protects the wafer and avoids the influence of external factors on the wafer weighing results. The wafer positioning device 12 includes a second wafer transfer assembly 12.1 for holding and transferring wafers, a rotating assembly 12.2 connected to the second wafer transfer assembly 12.1, a wafer lifting assembly 12.3 that actuates the rotating assembly 12.2 to move about the weighing detection platform 11 and the topography detection platform 10, and a wafer translation assembly 12.4 that actuates the rotating assembly 12.2 to move into or away from the detection position. The rotating assembly 12.2 transfers the wafer surface to the topography detection platform 10. The wafer positioning device 12 performs multi-dimensional operations on the wafer, thereby realizing topography detection and weighing operations on both sides of the wafer. After the detection is completed, the wafer transfer assembly picks up the wafer from the detection platform and places it in the sorting rack 7.

[0023] The ends of the first wafer transfer assembly 8.1 and the second wafer transfer assembly 12.1 are preferably suction plates 14, which pick up the wafer by adsorption.

[0024] Depending on the type of incoming wafer, the rotating assembly operates on the wafer. For example, if the incoming material is a single wafer, the rotating assembly only needs to adjust the wafer to fit with the topography inspection platform or weighing unit. Of course, the wafer can also be rotated to inspect the front and back sides of the wafer, thereby improving the inspection accuracy. For example, if the incoming material is a wafer substrate, one surface of the wafer is covered by the chip in the wafer substrate. Therefore, the rotating assembly needs to flip the wafer to avoid interference from the chip in the topography inspection.

[0025] (Flower basket) like Figure 19As shown, the basket includes two side frames 1.3, which are connected at least at the top or bottom, and an open wafer receiving space is formed between the two frames 1.3. A cavity 1.6 is formed on each frame 1.3 for placing the outer edge of the wafer. The open end 1.1 of the basket is used for wafer entry and exit and for detecting wafer misalignment. The length of the cavity 1.6 is less than the diameter of the wafer. The wafer picking space is defined between the two cavities 1.6.

[0026] One end of the frame 1.3 forms an open end 1.1, and the other side of the frame 1.3 is provided with a stop at the rear of the cavity 1.6 and a limiting end 1.2 that prevents the wafer from leaving the other end of the frame 1.3.

[0027] Further reference Figure 18 As shown, the flower basket also includes a limiting edge 1.4 set on the back of the frame 1.3. The limiting edge 1.4 defines a limiting end 1.2 on the back of the frame 1.3, and a tapering section 1.5 with a diameter smaller than the outer diameter of the wafer. The tapering section 1.5 is connected to the partition cavity 1.6. The tapering section 1.5 matches and limits the rear end of the wafer to ensure the stability of the wafer in the flower basket.

[0028] The suction plate 14 extends into the material handling space. By using the suction plate 14, the mechanical squeezing of the wafer edge by the traditional grippers is avoided, while the periphery of the wafer is still within the cavity 1.6 of the frame 1.3, which effectively reduces the risk of edge chipping.

[0029] (Flower basket loading and unloading area a) like Figures 1 to 8 As shown, as a further embodiment of the flower basket loading and unloading area a, it also includes a flower basket loading and unloading module 3, a flower basket transport module 4 and a flower basket transfer module 5 arranged in sequence. The end of the flower basket transfer module 5 is provided with a flower basket limiting component 5.3 to constrain the current position of the flower basket.

[0030] The flower basket loading / unloading module 3 includes an adjacent flower basket feeding carrier 3.1 and a flower basket unloading carrier 3.2, each with multiple shelves 3.4 for supporting multiple flower baskets. The flower basket feeding carrier 3.1 and the flower basket unloading carrier 3.2 are arranged parallel to each other along the X-direction and can move linearly in that direction. The flower basket transport module 4 is positioned above the flower basket transfer module 5 and is responsible for transferring flower baskets between the flower basket transfer module 5 and the flower basket loading / unloading module 3. The flower basket transport module 4 is arranged along the Y-direction, perpendicular to the flower basket loading / unloading module 3, and spans both sides of the module. The flower basket transfer module 5 consists of a flower basket feeding track 5.1 and a flower basket unloading track 5.2, which linearly moves the flower baskets along the X-direction, achieving automatic transfer and positioning of the flower baskets.

[0031] In this embodiment, the flower basket loading / unloading module 3 includes two adjacent loading / unloading tracks 3.3, which are arranged parallel to each other. A flower basket feeding carrier 3.1 and a flower basket unloading carrier 3.2 are respectively mounted on the two loading / unloading tracks 3.3, allowing movement between a manual loading / unloading position and an automatic loading / unloading position near the flower basket transfer module 5. The loading / unloading tracks 3.3 can be electric or pneumatic linear modules.

[0032] Combination Figure 2 and Figure 6 As shown, the flower basket feeding carrier 3.1 and the flower basket discharging carrier 3.2 are equipped with multiple shelves 3.4, which are connected by support columns at intervals. The shelves 3.4 are provided with limiting protrusions to constrain the position of the flower basket. The limiting protrusions are set according to the outline of the flower basket to ensure the accurate positioning of the flower basket on the carrier.

[0033] Further reference Figure 6 The bottom of the basket feeding carrier 3.1 and the basket discharging carrier 3.2 is equipped with a lifting platform 3.5. The lifting platform 3.5 includes a lifting plate 3.51 fixed to the bottom of the bottom end plate 3.4, and a mounting plate 3.52 disposed below the lifting plate 3.51. Guide columns 3.53 are provided around the periphery of the lifting plate 3.51 and the mounting plate 3.52, and a supporting base plate 3.54 is provided at the bottom of the guide columns 3.53. A lifting cylinder 3.55 is provided in the middle of the lifting plate 3.51 and the mounting plate 3.52. A first contact block 3.56 is provided at the bottom of the lifting plate 3.51, and a second contact block 3.57 is provided on the supporting base plate 3.54. A vertical first buffer cylinder 3.58 and a second buffer cylinder 3.59 are provided on the mounting plate 3.52. The first buffer cylinder 3.58 is arranged opposite to the first contact block 3.56, and the second buffer cylinder 3.59 is arranged opposite to the second contact block 3.57.

[0034] With the above structure, the lifting cylinder 3.55 provides vertical movement for the basket feeding carrier 3.1 and the basket discharging carrier 3.2, facilitating the basket's disengagement from the limiting profile defined by the limiting convex boundary. The first buffer cylinder 3.58 and the second buffer cylinder 3.59 provide buffering during vertical movement and effectively suppress the carrier's lateral movement after vertical movement through bidirectional constraints, thereby protecting the wafers on the carrier.

[0035] like Figures 1 to 3As shown, the flower basket transport module 4 includes a three-axis moving assembly 4.1 and a flower basket gripping assembly 4.2 disposed at the moving end of the three-axis moving assembly 4.1. The flower basket gripping assembly 4.2 consists of a clamping cylinder 4.22 and a clamping plate 4.21 disposed at the moving end of the clamping cylinder 4.22. The clamping plate 4.21 preferably acts on the open end 1.1 and the limiting end 1.2 of the flower basket, and the working surfaces of the open end 1.1, the limiting end 1.2, and the clamping plate 4.21 are planar. The linear direction of the flower basket transfer module 5 is perpendicular to the open end 1.1. The clamping plate 4.21 is preferably a flexible component to avoid movement caused by rigid contact with the flower basket.

[0036] The three-axis motion component 4.1 is a conventional multi-axis linear drive module in this field, and will not be described in detail here.

[0037] like Figures 1 to 5 As shown, the flower basket feeding track 5.1 is configured to carry flower baskets toward the robot arm module 6, and the flower basket discharging track 5.2 is configured to move toward the flower basket discharging carrier 3.2. The flower basket gripping component 4.2 is used to grip untested flower baskets on the flower basket feeding carrier 3.1 and transport them to the flower basket feeding track 5.1, or to transport qualified flower baskets that have been inspected on the flower basket discharging track 5.2 to the flower basket discharging carrier 3.2. When the flower basket transport module 4 is working, both the flower basket feeding carrier 3.1 and the flower basket discharging carrier 3.2 are located at the automatic flower basket loading and unloading position.

[0038] like Figure 4 As shown, the moving ends of the flower basket feeding track 5.1 and the flower basket discharging track 5.2 are equipped with flower basket limiting platforms 5.3, and the limiting platforms are equipped with limiting protrusions that match the contour of the flower basket. The flower basket feeding track 5.1 and the flower basket discharging track 5.2 can be selected as electric or pneumatic linear modules.

[0039] like Figure 4 and Figure 5 As shown, as a further embodiment of the flower basket limiting component 5.3, the flower basket limiting component 5.3 is specifically disposed on the limiting platform of the flower basket feeding track 5.1, and the flower basket limiting component 5.3 is configured with respect to the outline of the flower basket. The flower basket limiting assembly 5.3 includes a first limiting cylinder 5.31 corresponding to the open end 1.1 of the flower basket, a second limiting cylinder 5.32 corresponding to the limiting end 1.2, and a third limiting block 5.33 and a fourth limiting cylinder 5.34 corresponding to the side of the frame 1.3 of the flower basket. The moving end of the limiting cylinder assembly is provided with a clamping surface adapted to the corresponding side wall of the frame 1.3. The moving directions of the first limiting cylinder 5.31 and the second limiting cylinder 5.32 are both perpendicular to the linear direction of the flower basket feeding track 5.1. The third limiting block 5.33 and the fourth limiting cylinder 5.34 are arranged in the linear direction of the basket feed track 5.1. The third limiting block 5.33 is located outside the starting end of the basket feed track 5.1, i.e., outside the linear trajectory. The fourth limiting cylinder 5.34 is located on one side of the linear feed direction at the starting end, and its actuating end is equipped with a fifth limiting cylinder 5.35. The actuating end of the first limiting cylinder 5.31 is equipped with a first limiting block, and the actuating end of the second limiting cylinder 5.32 is equipped with a second limiting block. The actuating end of the fifth limiting cylinder 5.35 is equipped with a fifth limiting cylinder 5.35. A fourth limiting block is provided on the working end. The action direction of the fourth limiting cylinder 5.34 is perpendicular to the linear direction, and the action direction of the fifth limiting cylinder 5.35 is set towards the side wall of the frame 1.3. In this way, after the flower basket handling module 4 places the full flower basket at the starting end, the action of the flower basket limiting component 5.3 ensures the positional stability of the full flower basket, so as to ensure stable cooperation with the robot arm module 6. Moreover, the setting of the fifth limiting cylinder 5.35 and the fourth limiting cylinder 5.34 in the linear direction avoids the feeding direction of the flower basket, and the spatial layout is more reasonable.

[0040] (Misalignment detection module 9) Further reference Figure 7 As shown, the misalignment detection module 9 includes a second vision camera 9.1 and an infrared backlight 9.2 arranged on both sides of the basket feed track 5.1. The second vision camera 9.1 is also electrically connected to a spacing measuring tool. The position of the wafer in the wafer accommodating space is shown through the second vision camera 9.1 and the infrared backlight 9.2. It should be noted that the second vision camera 9.1 can be used to detect whether there are stacking, misalignment and missing layers of wafers in the cavity 1.6. The open end 1.1 of the basket is perpendicular to the linear direction of the basket feed track 5.1 and the basket discharge track 5.2, so that the open end 1.1 faces the second vision camera 9.1.

[0041] In this process, a reference line between two adjacent cavities 1.6 is constructed in the visual results using computer software, and the position of the wafer in the cavity 1.6 is corrected using this reference line. When wafers are stacked, the thickness increases. The difference in thickness can be seen by measuring the width of the wafer using a spacing measurement tool. In this process, a virtual vertical reference spacing is constructed between two vertically adjacent wafers. When a wafer is missing a layer, the vertical spacing between the two adjacent wafers will increase. By measuring the vertical spacing between adjacent wafers using a spacing measurement tool, it can be seen that the spacing difference is significant, and the spacing becomes about twice as large when a layer is missing. According to the vertical reference spacing, when a wafer is misaligned, the vertical spacing between adjacent wafers will be different. The spacing between the left and right sides of the wafer is measured using a spacing measurement tool to obtain information on whether the wafer is misaligned.

[0042] Any of the aforementioned defects such as stacking, misalignment, or missing layers can define the current flower basket as a defective product and place it in the defective position on the sorting rack 7.

[0043] (Robotic arm 6) like Figure 1 , Figure 8 as well as Figures 14 to 19 As shown, the flower basket rotating assembly 6.2 includes a telescopic unit 6.22 and a rotating frame 6.23 rotatably mounted on the lower end of the fixed frame 6.1. The upper end of the telescopic unit 6.22 is hinged to the upper end of the fixed frame 6.1, and the lower end is hinged to the upper end of the rotating frame 6.23. The clamping module 6.21 is mounted on the rotating frame 6.23. The rotating frame 6.23 is maintained in the transfer posture and the pick-up and place posture by the telescopic movement of the telescopic unit 6.22. The transfer posture and the pick-up and place posture of the flower basket correspond to the posture of the clamping module 6.21, and the wafer is positioned facing the wafer transport module 8 in the pick-up and place posture.

[0044] The telescopic unit 6.22 is configured as an electric or pneumatic cylinder module with active extension and retraction actions. The mounting bracket 6.1 has an upper mounting plate 6.11 and a lower mounting plate 6.12 spaced apart vertically, and the telescopic unit 6.22 is disposed between the upper mounting plate 6.11 and the lower mounting plate 6.12 to provide space for the telescopic unit 6.22.

[0045] from Figure 16 As can be seen, the flower basket is tilted away from the open end 1.1 in the tilted position. At this time, the lower end of the flower basket gradually swings outward, while the upper end gradually tilts inward, thereby constraining the wafer to the limiting end 1.2 under its own gravity.

[0046] Combination Figures 14 to 16 As shown, the free end of the telescopic unit 6.22 has a rotation axis L1 about the rotating frame 6.23, the rotating frame 6.23 has a rotation axis L2 about the fixed frame 6.1, and the actuating end 6.24 has a pre-configured vertical rotation axis Z. Rotation axes L1 and L2 are parallel, with L1 located above L2 and outside L2, away from the rotation axis Z of the actuating end 6.24. During operation, the extension of the telescopic unit 6.22 forces the rotating frame 6.23 to rotate outwards around axis L1. At this time, the fixed and free ends of the telescopic unit 6.22 undergo adaptive rotation along axis L1 between the fixed frame 6.1 and the rotating frame 6.23 until the rotating frame 6.23 tilts to the desired angle. The rotation axes L1 and L2 are offset vertically, forming a lever-type kinematic pair to compensate for the actuating torque.

[0047] As a preferred embodiment, two rotating frames 6.23 are arranged opposite each other in the horizontal direction. The open ends 1.1 of the flower basket on the two rotating frames 6.23 are positioned opposite each other, while the limiting ends 1.2 are positioned opposite each other. Correspondingly, there are also two telescopic units 6.22 and two clamping modules 6.21. The clamping module 6.21 is located at the lower end of the rotating frame 6.23 and includes two clamping blocks 6.212 that can move relative to each other. During the rotation to the tilting and picking-up posture, the two rotating frames 6.23 and the clamping module 6.21 drive the flower basket from a level posture to a figure-eight posture that is far apart from each other.

[0048] In other embodiments, the space for the flower basket rotating assembly 6.2 is optimized to reduce the risk of interference with other components on the work platform. For example... Figure 15 and Figure 16 As shown, the two flower basket rotating components 6.2 are defined as the left module and the right module, with the rotation axis Z of the execution end 6.24 as the boundary. A vertically extending support 6.13 is provided between the upper fixed plate 6.11 and the lower fixed plate 6.12, and the lower fixed plate 6.12 has first rotating seats 6.25 at both ends. The free ends of the two telescopic units 6.22 are respectively connected to the rotating seats, and the two telescopic units 6.22 are arranged on opposite sides of the support 6.13 of the fixed frame 6.1 in a cross arrangement. The first rotating seats 6.25 are located on the outer edge of the contour of the lower fixed plate 6.12 and are diagonally arranged on the end face of the rotating frame 6.23. This arrangement effectively utilizes the space between the fixed frame 6.1 and the rotating frame 6.23, improves the compactness of the components, reduces the extension of the telescopic units 6.22 in the peripheral space, and avoids interference with other components of the working platform.

[0049] (Queue-jumping area d) like Figure 1 and Figure 7 and Figure 8 As shown, a queueing area d is provided between the flower basket loading and unloading area a and the detection and transfer area b. The queueing area d is provided with a queueing platform 13, a queueing flower basket unloading track 13.1 and an empty flower basket buffer track 13.2 located in the rotation path of the robot arm 6.

[0050] The queue-jumping platform 13, the queue-jumping flower basket unloading track 13.1, and the empty flower basket buffer track 13.2 are arranged adjacent to each other in the X direction and move and extend linearly along the Y direction. The queue-jumping platform 13 is preferably located near the sorting rack 7, and the queue-jumping flower basket unloading track 13.1 and the empty flower basket buffer track 13.2 are located near the flower basket handling module.

[0051] As a key connection point, the queue-jumping platform 13 allows the emergency wafer 14 basket 9 to be directly inserted into the inspection process without interrupting the current inspection task, thus improving the system's flexibility in handling priority tasks. For this purpose, the sorting rack 7 is equipped with a queue-jumping basket placement position, which includes the placement of untested wafers, qualified wafers, and unqualified wafers.

[0052] As one way for the robotic arm 6 to handle queue-jumping flower baskets, the queue-jumping platform 13 is electrically connected to the robotic arm 6. The queue-jumping platform 13 is equipped with a sensor. When a flower basket waiting to be queued is detected on the queue-jumping platform 13, the robotic arm 6 will prioritize grabbing the flower basket waiting to be queued on the queue-jumping platform 13. Alternatively, a sensor is provided on the execution end 6.24 of the robotic arm 6. This sensor is used to detect whether there is a flower basket waiting to be queued on the queue-jumping platform 13 in the motion path. If there is, the robot will prioritize grabbing the flower basket waiting to be queued on the queue-jumping platform 13.

[0053] Optionally, the bottom of the queue-jumping platform 13 is provided with a linear moving module, which is used to move the queue-jumping platform 13 into or away from the rotation path of the robot arm 6, so as to place the flower basket to be queued on the queue-jumping platform 13. The queue-jumping platform 13 is also provided with the aforementioned shelf 3.4 and the limiting protrusion for constraining the position of the flower basket.

[0054] Optionally, to facilitate the differentiation between the queue-jumping basket 9 and the baskets of the automatic detection section on the sorting rack 7, it is preferable to set the number of full-load wafers in the queue-jumping basket 9 to be different from the number of full-load wafers in the automatic section baskets. For example, the number of full-load wafers in the automatic section baskets is 12, and the number of full-load wafers in the queue-jumping basket 9 is 6.

[0055] Furthermore, a non-conforming platform 13.4 is also installed above the queue-jumping basket unloading track 13.1. After the queue-jumping basket is inspected, the robot arm 6 places the full and qualified queue-jumping basket in the queue-jumping basket unloading track 13.1, and places the queue-jumping basket containing the non-conforming wafers on the non-conforming platform 13.4 to complete the sorting of the queue-jumping wafers.

[0056] Specifically, an empty basket buffer track 13.2 is also provided in the rotation path of the robot arm 6. The empty basket buffer track 13.2 is equipped with a basket detection module 13.5, which is used to scan and identify basket strings. The basket detection module 13.5 includes a vision camera. As an example, during the automatic feeding process, the robot arm 6 places the baskets that are not fully loaded into the sorting rack 7. The robot arm 6 has pre-scanned the baskets with strings on the empty basket buffer track 13.2 and placed them in the qualified and unqualified placement positions of the sorting rack 7. After detection, qualified wafers in the baskets that are not fully loaded are placed in the empty baskets in the qualified placement positions, and unqualified wafers are placed in the empty baskets in the unqualified placement positions. Thus, all baskets that are unloaded after detection have been scanned with strings, which is convenient for subsequent data entry.

[0057] (Sorting rack 7) like Figure 9 and Figure 10 As shown, as a further embodiment of the sorting rack 7, the sorting rack 7 is provided with multiple compartments for placing flower baskets, and the multiple compartments are configured according to the flower basket classification: automatic test area 7.1, automatic qualified flower basket area 7.2, unqualified flower basket area 7.3, and queue-jumping flower basket area 7.4; wherein, the queue-jumping flower basket area 7.4 is divided into queue-jumping qualified position 7.41 and queue-jumping test position in the vertical direction.

[0058] By setting up a sorting rack 7 on one side of the inspection area c, which serves as a transfer and accommodation space for queued wafers and automated wafers, wafers are accurately classified according to inspection results and task priority, avoiding the risk of mixing and forming a closed-loop inspection and sorting system. Urgent wafers can be re-inspected and temporarily stored within the same sorting rack 7, reducing efficiency losses caused by cross-area handling. This also reduces manual intervention and effectively shortens the wafer transfer path, minimizing the risk of damage and dust adhesion.

[0059] The bottom of the sorting rack 7 is also equipped with a storage and transfer module 7.5. The storage and transfer module 7.5 can be selected as a linear movement module and moves linearly between the robot arm 6 module and the wafer handling module 8, so as to smoothly dock the sorting rack 7 to the position that cooperates with the robot arm 6 module and the wafer handling module 8, or move the sorting rack 7 to the boundary position of the wafer inspection platform to facilitate manual sorting operations.

[0060] (Wafer transport module 8) like Figure 7 and Figure 8 and Figure 11As shown, the wafer handling module 8 includes a wafer multi-axis moving component 8.2 for actuating the first wafer transfer component 8.1 to move between the sorting rack 7 and the detection area c. The wafer multi-axis moving component 8.2 drives the first wafer transfer component 8.1 to move linearly in the XYZ three-axis directions, thereby placing the wafer into the corresponding basket or removing the wafer from the basket. The wafer multi-axis moving component 8.2 can be a three-axis moving track, which is actually a conventional moving mechanism in the art and will not be described in detail here.

[0061] The first wafer transfer assembly 8.1 includes a suction plate 14 and a connecting mold base 14.1. The connecting mold base 14.1 is provided with a negative pressure assembly 14.2 communicating with the suction plate 14. The suction plate 14 is provided with an adsorption area 14.3 communicating with the negative pressure assembly 14.2. The adsorption area 14.3 of the suction plate 14 is preferably arranged facing downward, so as to extend into the cavity 1.6 corresponding to the upper end surface of the wafer for adsorption. The adsorption area 14.3 matches the contour of the wafer. The connecting mold base 14.1 is arranged on the moving end of the wafer multi-axis moving assembly 8.2 and the rotating assembly 12.2.

[0062] like Figure 12 and Figure 13As shown, for the first wafer transfer assembly 8.1, there are two suction plates 14. Each suction plate 14 is a sheet-like plate with an arc-shaped claw at its front end, which extends correspondingly to the outline of the wafer. The wafer multi-axis moving assembly 8.2 includes a telescopic module 8.3 facing the sorting rack 7. The telescopic module 8.3 can be a linear pneumatic cylinder or an electric cylinder. A connecting mold base 14.1 is disposed on the telescopic module 8.3 of the wafer multi-axis moving assembly 8.2. 14.1 Includes a connecting plate 14.11, the lower part of which is provided with a groove 14.12 for the rear end of the suction plate 14 to be inserted. The groove 14.12 is also provided with a negative pressure block 14.21 for fixing the suction plate 14 to the connecting plate 14.11. The negative pressure block 14.21 is connected to a negative pressure assembly 14.2. The negative pressure assembly 14.2 includes at least a negative pressure connector 14.22 connected to the negative pressure block 14.21, and an adsorption area 14.3. An arc-shaped first air passage groove 14.31 is formed on the claw. The rear end of the suction plate 14 is provided with a through air passage hole 14.33. The upper surface of the suction plate 14 is provided with a second air passage groove 14.32 connecting the air passage hole 14.33 and the first air passage groove 14.31. A negative pressure block 14.21 covers the air passage hole 14.33. The negative pressure block 14.21 is provided with a channel for connecting the negative pressure connector 14.22. A sealing plate is provided on the second air passage groove 14.32. 14.34, thereby forming a negative pressure channel by the negative pressure block 14.33, the first air channel groove 14.31 and the second air channel groove 14.32. Based on the sheet-like plate suction plate 14, the wafer is adsorbed. Through the above improvements, the negative pressure block 14.21 forms part of the negative pressure channel while providing a fixed position for the suction plate 14. In addition, the suction plate 14 in this embodiment can be set to a smaller thickness, and the forming difficulty of the air channel groove on the suction plate 14 is reduced.

[0063] The connecting plate 14.11 is also provided with a limiting seat on the upper part. A limiting post is provided on the limiting seat and facing the sorting and storage rack. A limiting plate 14.13 is provided at the end of the limiting post. The limiting plate 14.13 is arranged parallel above the suction plate 14 and the suction plate 14 extends out of the limiting plate 14.13. After the suction plate 14 enters the basket and is in place, the limiting plate 14.13 abuts against the sorting and storage rack to limit the suction plate 14 and prevent it from moving excessively.

[0064] (morphology detection platform 10) like Figures 20 to 25 As shown, a detection bracket 15 is provided on the detection area c between the wafer handling module 8 and the wafer positioning device 12. The weighing detection platform 11 and the topography detection platform 10 are vertically spaced on the detection bracket 15. A sealing lifting assembly 11.4 connected to the sealing cover 11.2 is provided on the detection bracket 15. The sealing cover 11.2 covers at least outside the weighing part of the weighing unit 11.1. The sealing cover 11.2 is actuated to rise or fall by the sealing lifting assembly 11.4.

[0065] As a further embodiment of the topography inspection platform 10, the topography inspection platform 10 is provided with at least one placement platform 10.3, a first vision camera 10.1 and a light source 10.2 are disposed above the placement platform 10.3, and the inspection bracket 15 includes a first frame disposed above the topography inspection platform 10 and an adjustment frame 10.5 disposed on the first frame. The first frame extends vertically on the topography inspection platform 10, and the adjustment frame 10.5 is rotatably disposed on the first frame. An electrostatic discharge module 10.4 is disposed on the adjustment frame 10.5, and the angle position of the electrostatic discharge module 10.4 is adjusted by the adjustment frame 10.5.

[0066] from Figure 23 As can be seen, the electrostatic discharge module 10.4 extends about the placement stage 10.3 and is adjustable in orientation toward the topography inspection platform 10. Preferably, the electrostatic discharge module 10.4 is arranged below the light source 10.2 and is angled toward the topography inspection platform 10 to suppress static charge during the inspection process and protect the wafer from electrostatic damage.

[0067] In this embodiment, the electrostatic discharge module 10.4 includes an air ionization component, specifically, positive and negative DC high voltages alternately act on the coupled electrode needles. That is, the DC high voltage source uses an AC implementation to act on the electrode needles through the coupling device to generate corona discharge, ionizing air molecules and generating a large number of positive and negative polarity air ions. It also includes air nozzles, which are arranged about the length of the morphology detection platform 10 or about the arrangement direction of the placement stage 10.3, so as to deliver compressed air to the surface of the object with static electricity, neutralize the positive and negative static charges, and achieve the purpose of efficiently and reliably eliminating static electricity on the object surface.

[0068] As an example, the static electricity elimination module 10.4 can be selected as a gas-source anti-electric shock pulse AC ion bar with model AP-AB1228, which is a calming and static-dissipating device.

[0069] like Figure 22As shown, as a further embodiment of the adjustment frame 10.5, the adjustment frame 10.5 includes a rotating hole 10.51 that mates with the first frame, and an arc-shaped channel 10.52 concentrically arranged with the rotating hole 10.51. The end of the adjustment frame 10.5 away from the first frame is fixedly connected to the static discharge module 10.4. Both the rotating hole 10.51 and the arc-shaped channel 10.52 are used to provide connecting parts, such as screws, bolts, or other threaded connecting parts, so that the adjustment frame 10.5 can rotate and adjust around the center of the rotating hole 10.51 and the arc-shaped channel 10.52. The length of the arc-shaped channel 10.52 limits the rotation angle range of the adjustment frame 10.5. After the static discharge module 10.4 is adjusted to the expected angle, the threaded connecting parts on the rotating hole 10.51 or the arc-shaped channel 10.52 are further engaged to fix the adjustment frame 10.5 on the first frame.

[0070] Preferably, there are multiple placement stages 10.3, spaced apart in the horizontal direction, with no specific number limited. Above the topography detection platform 10, there is a detection translation component 10.6 and a translation frame 10.61 disposed on the moving end of the detection translation component 10.6. The detection translation component 10.6 is arranged in the orientation of the placement stage 10.3. The light source 10.2 and the first vision camera 10.1 are both disposed on the translation frame 10.61. The detection translation component 10.6 includes at least a translation unit 10.65 that provides horizontal movement of the translation frame 10.61. As an example, the translation unit 10.65 can be selected as a leverless cylinder.

[0071] like Figure 24 As shown, as a further embodiment of the detection translation component 10.6, the translation frame 10.61 includes a vertically extending support frame 10.62, a first vision mounting block 10.63 and a second vision mounting block 10.64 connected to the support frame 10.62 and the first vision camera 10.1, and a light source 10.2 mounting block connected to the support frame 10.62 and the light source 10.2.

[0072] The first vision mounting block 10.63 extends horizontally, and a first vertical adjustment groove 10.621 is provided between the first vision mounting block 10.63 and the support frame 10.62. The first vertical adjustment groove 10.621 can be set on the vertical surface of the support frame 10.62. After the vertical position adjustment between the first vision mounting block 10.63 and the support frame 10.62 is completed, it is fastened and fixed by a threaded connector.

[0073] The second vision mounting block 10.64 and the first vision mounting block 10.63 extend in the same horizontal direction and provide a fixed position for the first vision camera 10.1. A horizontal adjustment groove 10.631 is provided between the first vision mounting block 10.63 and the second vision mounting block 10.64. The horizontal adjustment groove 10.631 can be set on the first vision mounting block 10.63. After the horizontal position adjustment between the first vision mounting block 10.63 and the second vision mounting block 10.64 is completed, it is fastened and fixed by a threaded connector. A second vertical adjustment groove 10.622 is provided between the light source 10.2 mounting block and the support frame 10.62. The second vertical adjustment groove 10.622 can be set on the vertical surface of the support frame 10.62. After the horizontal position adjustment between the light source 10.2 mounting block and the support frame 10.62 is completed, it is fastened and fixed by a threaded connector.

[0074] Preferably, the detection translation component 10.6 also includes a translation base plate disposed below the translation frame 10.61. A slide rail slider is provided between the translation base plate and the translation frame 10.61, wherein the slide rail is fixedly connected to the translation base plate and the slider is fixedly connected to the bottom of the translation frame 10.61. There are two sets of slide rail sliders, which are arranged in parallel and spaced apart. The translation unit 10.65 is disposed between the two sets of slide rail sliders to ensure the stability of the operation of the detection translation component 10.6. In addition, a presence or absence sensor is provided on the slide rail slider on the side close to the morphology detection platform 10. The presence or absence sensor is used to detect whether the adsorption component is located on the morphology detection platform 10 to control the first vision camera 10.1.

[0075] In the above embodiments, the light source 10.2 on the translation frame 10.61 and the first vision camera 10.1 are finely positioned through the horizontal adjustment slot 10.631 and the vertical adjustment slot to adapt to the coverage requirements of the morphology detection area c of wafers of different sizes. The translation unit 10.65 provides the horizontal movement of the translation frame 10.61 so that the first vision camera 10.1 can be directly facing the wafer on the placement stage 10.3, thereby improving the accuracy of visual inspection.

[0076] Specifically, the light source 10.2 is set as a parallel shadowless light source 10.2 and covers the shape detection platform 10. The parallel shadowless light uniformly covers the surface, so that the defect contour presents high contrast in the imaging of the first vision camera 10.1, improving the defect recognition accuracy. The uniformity of light intensity of the parallel shadowless light source 10.2 avoids the difference in detection sensitivity in different areas of the same wafer due to uneven illumination.

[0077] (Weighing and testing platform 11) Further reference Figure 21 , Figure 23 and Figure 25As shown, in a further embodiment of the weighing detection platform 11, a second frame is provided on the weighing detection platform 11, and the morphology detection platform 10 is clamped on the second frame, so that a space is created between the first frame and the second frame to arrange the weighing unit 11.1 and the sealing cover 11.2. The sealing lifting assembly 11.4 is specifically arranged on the first frame, and the sealing lifting assembly 11.4 can be selected as a vertically arranged linear cylinder. The sealing cover 11.2 is arranged on the actuating end of the linear cylinder, and a sealing frame 11.3 is provided above the weighing unit 11.1. A sealing frame 11.3 is installed on the outside of the weighing unit 11.1. The sealing frame 11.3 is provided with a through groove for the weighing part of the weighing unit 11.1 to extend out, and a sealing plate is provided around the through groove. A sealing cover 11.2 abuts against the sealing frame 11.3. The sealing cover 11.2 and the periphery of the sealing frame 11.3 abut against each other to form a seal within the weighing space. The sealing plate is provided to ensure the sealing of the through groove. After the sealing frame 11.3 is installed, the weighing part extends out of the through groove, and then the sealing plate is installed and fixed.

[0078] In other embodiments, the mating surfaces of the sealing frame 11.3 and the sealing cover 11.2 of the weighing unit 11.1 are provided with elastic seals to ensure airtightness during the weighing process and prevent airflow interference with high-precision weighing. Of course, a negative pressure component 14.2 can also be connected to the sealing frame 11.3 or the sealing cover 11.2 to further reduce internal airflow interference.

[0079] (Wafer positioning device 12) Further reference Figure 20 and Figure 21 ,as well as Figure 26 and Figure 27 As shown, the second wafer transfer assembly 12.1 also uses a suction plate 14 to adsorb the wafer. The suction plate 14, negative pressure assembly 14.2, and adsorption area 14.3 in the first wafer transfer assembly 8.1 and the second wafer transfer assembly 12.1 have the same structure. The only difference is that, for the second wafer transfer assembly 12.1, the connecting mold base 14.1 of the suction plate 14 is set on the moving end of the rotating assembly 12.2. This will not be described in detail here.

[0080] During the inspection process, the rotating component 12.2 can also drive the wafer to flip for secondary weighing. The wafer lifting component 12.3 and the wafer translation component 12.4 work together to move the wafer through lifting and lowering to achieve displacement on the topography inspection platform 10 and the weighing inspection platform 11. The wafer translation component 12.4 moves the wafer into or out of the topography inspection platform 10 and the weighing inspection platform 11.

[0081] Reference Figure 26As shown, the wafer translation assembly 12.4 is configured to move perpendicular to the arrangement direction of the placement stage 10.3, specifically including a linear movement module 12.31 perpendicular to the arrangement direction of the placement stage 10.3 and a first moving frame 12.32 disposed on the actuating end of the linear movement module 12.31, the first moving frame 12.32 having a vertically extending vertical plane; The wafer lifting assembly 12.3 is set on a vertical plane, specifically including a vertical moving module 12.41 and a second moving frame 12.42 set on the moving end of the vertical moving module 12.41. The rotating assembly 12.2 is set on the second moving frame 12.42. The movement of the adsorption assembly in the vertical and horizontal directions is realized by the movement of the first moving frame 12.32 and the second moving frame 12.42. The linear moving module 12.31 can be selected as a leverless cylinder, and slide rails and sliders are set on both sides of the leverless cylinder. The vertical moving module 12.41 can be selected as a linear slide table.

[0082] Further reference Figure 27 As shown, as a further embodiment of the wafer rotation module, the wafer rotation module also includes an adjustment seat 12.5 connecting the connecting mold base 14.1 of the suction plate 14 and the rotation component 12.2. The adjustment seat 12.5 is specifically fixed below the first moving frame 12.32. The rotation component 12.2 includes a gear 12.21 and a rack 12.22 disposed on the adjustment seat 12.5, and a linear actuation module 12.23 for actuating the rack 12.22 to move linearly back and forth. The rack 12.22 has a rack on the side opposite to the gear 12.21. A slide rail slider is provided between the rack 12.22 mounting plate 3.52 and the adjusting seat 12.5. The rack 12.22 mounting plate 3.52 extends horizontally. A linear cylinder is provided on one side of the slide rail slider on the adjusting seat 12.5, which is positioned along the length of the rack 12.22 to drive the rack 12.22 to move linearly back and forth. The gear 12.21 is axially fixedly connected to the adsorption assembly, so that the movement of the rack 12.22 drives the gear 12.21 to rotate, thereby driving the adsorption assembly to rotate.

[0083] In the above embodiments, in order to optimize the spatial layout of the overall equipment, the arrangement of the upper and lower areas of the flower basket, the detection and transfer area b, the detection area c, and the queue-jumping area d is further described.

[0084] Specifically, the flower basket feeding carrier 3.1 and the flower basket transfer module 5 are arranged parallel to each other in the X direction, and the flower basket feeding carrier 3.1 and the flower basket discharging carrier 3.2 extend in the Y direction. The flower basket handling module 4 is arranged at the end of the flower basket in-out module 3 along the Y direction, and the flower basket transfer module 5 is arranged below the flower basket handling module 4 and extends in the X direction about the flower basket in-out module 3. The robotic arm 6 is located on the negative Y side of the end of the basket transfer module 5. The sorting rack 7 is located on the X side of the end of the basket in / out module 3 and extends along the Y direction. The wafer handling module 8 is located on the same X side as the sorting rack 7. The detection bracket 15 and the wafer positioning device 12 are located on the positive Y side of the basket in / out module 3 about the X direction. The queueing platform 13, the queueing basket unloading track 13.1 and the empty basket buffer track 13.2 are arranged adjacent to each other in the X direction and move and extend linearly along the Y direction. Among them, the flower basket handling module 4, the flower basket feeding track 5.1 and the sorting rack 7 define the U-shaped arrangement area. The robot arm 6 is arranged at the inner end of the U-shaped arrangement area, while the queue-jumping platform 13, the queue-jumping flower basket unloading track 13.1 and the empty flower basket buffer track 13.2 are arranged along the Y direction on the opening side of the U-shaped arrangement area.

[0085] A parallel arrangement space is defined between the basket handling module 4 and the sorting rack 7, with the wafer handling module 8, the robot arm 6, and the detection area c arranged in sequence in the parallel arrangement space. The queue-jumping platform 13, the queue-jumping basket unloading track 13.1, and the empty basket buffer track 13.2 are arranged vertically between the sorting rack 7 and the basket handling module 4.

[0086] like Figure 28 As shown, specifically, a manual inspection station 16 is also provided on one side of the inspection area c. The manual inspection station 16 is set along the wafer transport module 8. The manual inspection station 16 is equipped with a three-dimensional microscope 16.1 and a wafer placement platform 16.2, so as to perform fine inspection on wafers with special requirements through the three-dimensional microscope 16.1.

[0087] During the work process: In the basket loading and unloading area, the basket feeding carrier moves away from the feeding direction to load baskets containing untested wafers, while the basket feeding carrier moves towards the feeding direction. The basket handling module moves and grabs the untested baskets. If the basket handling module grabs an untested basket on the bottom shelf, the lifting platform rises, lifting the bottom shelf to the grabbing height. The basket handling module moves and places the untested basket on the basket limiting platform of the basket feeding track. Then, the basket limiting component moves and straightens the basket, at which point the open end of the basket is perpendicular to the moving direction of the basket feeding track. The basket feeding track moves to the untested basket loading position. During this process, the misalignment detection module scans the wafer position in the untested basket. If there is a misalignment in the wafer position, the basket is marked as a misaligned basket and prepared for the robot to grab and temporarily store it in the unqualified basket area. If there is no misalignment in the wafer position, the robot grabs the basket to the automatic test basket area of ​​the sorting rack. In the inspection and transfer area, during the transfer of the untested flower basket to the sorting rack, the flower basket rotating component of the robotic arm rotates to adjust the untested flower basket to an inclined transfer posture, with the open end of the flower basket facing upwards. At this time, the clamping module grabs the two sides of the flower basket and releases the open end. After the open end of the untested flower basket is aligned with the automatic test flower basket area, the flower basket rotating component and the untested flower basket are adjusted to a straight pick-and-place posture until the untested flower basket enters the automatic test flower basket area.

[0088] During the robot's operation, when passing the queue-jumping platform, if there are untested flower baskets that have jumped the queue, the robot will prioritize grabbing the flower baskets that have jumped the queue and move them to the queue-jumping position in the queue-jumping flower basket area.

[0089] In the inspection area, the wafer handling module operates, with the suction plate picking up wafers from the automatic test basket or the queued test basket and placing the wafers on the morphology inspection platform. The number of wafers picked up can be two. Then, the first vision camera and the electrostatic discharge module work, with the inspection translation component driving the first vision camera to move and scan the wafers on the platform, acquiring and recording the wafer's string and morphology features, and marking whether the wafer's morphology is qualified. Subsequently, the wafer positioning device operates, transferring the wafer after morphology inspection to the weighing and testing platform. Then, the sealing cover descends and maintains the seal around the weighing unit, and the weighing unit acquires the weight data of the wafer. After the wafer inspection is completed, the wafer handling module places the inspected wafers into the baskets of the automatic pass basket area or into the pass queue position according to the pass or fail mark.

[0090] Once the baskets in the automatic qualified basket area or the qualified baskets in the queue are full of qualified wafers, the robot arm will move. The robot arm will grab an empty basket from the empty basket buffer track in advance. The basket will be scanned by the basket detection module. Once the qualified baskets in the robot arm area are full, the empty basket will be placed into the corresponding empty space. For the baskets in the automatic qualified basket area, in the basket loading and unloading area, qualified baskets are placed in the basket discharge track. Then the basket discharge track moves toward the basket discharge carrier. Then the basket handling module moves and the basket discharge carrier moves toward the robot arm to place the qualified baskets in the basket discharge carrier. After the wafer inspection of the current batch is completed, the basket discharge carrier retracts and is ready to unload.

[0091] For flower baskets in the non-conforming flower basket area, an automatic non-conforming platform can be set up for robotic arms to grab and place them, or a sorting rack can be moved for manual unloading of non-conforming flower baskets.

[0092] For flower baskets in the qualified queue area, the robot arm places the qualified flower basket in the queue basket unloading track. For flower baskets that are not qualified for queueing, the robot arm places them on the queue failure platform on one side of the queue platform.

[0093] This specific embodiment is merely an explanation of the present invention and is not intended to limit the invention. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but such modifications are protected by patent law as long as they are within the scope of the claims of the present invention.

Claims

1. A weighing and appearance inspection device, characterized in that, include: The flower basket (1) includes an open end (1.1) for the wafer (2) to enter, and a limiting end (1.2) disposed opposite to the open end (1.1); The basket loading and unloading area (a) includes at least a basket feeding track (5.1) and a basket discharging track (5.2), and at one end of the basket loading and unloading area (a) there are untested basket loading positions and qualified basket unloading positions, and a misalignment detection module (9) for detecting the position of the wafer in the basket is provided on the path of the basket feeding track (5.1); The robotic arm (6) includes a fixed frame (6.1) disposed on the execution end (6.24) of the robotic arm (6) and a flower basket rotating assembly (6.2) rotatably connected to the lower end of the fixed frame (6.1). The lower end of the flower basket rotating assembly (6.2) is provided with a clamping module (6.21) for clamping the two sides of the flower basket. The flower basket rotating assembly (6.2) adjusts the flower basket to switch between a transfer posture with the open end (1.1) tilted upward and a horizontal picking and placing posture. The detection transfer area (b) includes adjacent sorting racks (7) and wafer handling modules (8). The sorting rack (7) includes multiple flower basket placement positions to receive at least untested flower baskets, place qualified flower baskets and unqualified flower baskets, as well as empty flower baskets; the sorting rack (7), the untested flower basket loading position and the qualified flower basket unloading position are all located in the action path of the robot arm (6); The wafer handling module (8) includes a first wafer transfer component (8.1) that moves in a multi-axis manner. The first wafer transfer component (8.1) picks up untested wafers and moves them to the detection area (c), and picks up tested wafers to the qualified or unqualified basket. The detection area (c) includes a morphology detection platform (10) and a weighing detection platform (11) arranged at intervals, and a wafer positioning device (12) that is away from the wafer handling module (8). The top of the morphology detection platform (10) is provided with a light source (10.2) and a first vision camera (10.1) for detecting wafer string and morphology; the top of the weighing detection platform (11) is provided with at least one weighing unit (11.1) and a lifting and lowering sealing cover (11.2) provided above the weighing unit (11.1); The wafer positioning device (12) includes a second wafer transfer assembly (12.1) for holding and transferring the wafer, a rotating assembly (12.2) connected to the second wafer transfer assembly (12.1), a wafer lifting assembly (12.3) for actuating the rotating assembly (12.2) to move about the weighing detection platform (11) and the topography detection platform (10), and a wafer translation assembly (12.4) for actuating the rotating assembly (12.2) to move into or away from the detection position, wherein the rotating assembly (12.2) adjusts the wafer to fit onto the topography detection platform (10).

2. The weighing and appearance inspection equipment according to claim 1, characterized in that: The flower basket loading and unloading area (a) includes a flower basket loading and unloading module (3), a flower basket handling module (4), and a flower basket transfer module (5) arranged in sequence. The flower basket loading and unloading module (3) includes a flower basket feeding carrier (3.1) and a flower basket discharging carrier (3.2) arranged adjacent to each other. The flower basket handling module (4) is arranged above the flower basket transfer module (5) and grabs the flower basket to transfer between the flower basket transfer module (5) and the flower basket loading and unloading module (3). The flower basket feeding track (5.1) and the flower basket discharging track (5.2) constitute the flower basket transfer module (5). The end of the flower basket transfer module (5) is provided with a flower basket limiting component (5.3) to constrain the current position of the flower basket.

3. The weighing and appearance inspection equipment according to claim 1, characterized in that: The misalignment detection module (9) includes a second vision camera (9.1) and an infrared backlight plate (9.2) arranged on both sides of the flower basket feeding track (5.1) and the detection opening. The flower basket is in the flower basket transfer module (5), and the open end (1.1) of the flower basket is set perpendicular to the moving direction of the flower basket transfer module (5).

4. The weighing and appearance inspection equipment according to claim 1, characterized in that: The flower basket rotating assembly (12.2) (6.2) includes a telescopic unit (6.22) and a rotating frame (6.23) rotatably disposed at the lower end of the fixed frame (6.1). The upper end of the telescopic unit (6.22) is hinged to the upper end of the fixed frame (6.1), and the lower end of the telescopic unit (6.22) is hinged to the upper end of the rotating frame (6.23). The clamping module (6.21) is disposed on the rotating frame (6.23). The rotating frame (6.23) is maintained in the transfer posture and the pick-up and place posture by the telescopic action of the telescopic unit (6.22). The wafer is disposed facing the wafer handling module (8) in the pick-up and place posture.

5. The weighing and appearance inspection equipment according to claim 1, characterized in that: A queueing area (d) is provided between the flower basket loading / unloading area (a) and the detection and transfer area (b). The queueing area (d) is provided with a queueing platform (13), a queueing flower basket unloading track (13.1), and an empty flower basket buffer track (13.2) that are adjacent to each other and located in the rotation path of the robot (6). The sorting rack (7) is provided with a queueing flower basket placement position. The queueing platform (13) is electrically connected to the robot (6) and prioritizes grabbing the queueing flower baskets on the queueing platform (13).

6. The weighing and appearance inspection equipment according to claim 1, characterized in that: An empty flower basket buffer track (13.2) is also provided in the rotation path of the robot (6). A flower basket detection module (13.5) is provided on the empty flower basket buffer track (13.2). The flower basket detection module (13.5) is used to scan and identify flower basket strings.

7. The weighing and appearance inspection equipment according to claim 1, characterized in that: The wafer handling module (8) includes a multi-axis moving component for actuating the first wafer transfer assembly (8.1) to move between the sorting rack (7) and the detection area (c); The first wafer transfer assembly (8.1) includes a suction plate (14) and a connecting mold base (14.1). The connecting mold base (14.1) is provided with a negative pressure component (14.2) communicating with the suction plate (14). The suction plate (14) is provided with an adsorption area (14.3) communicating with the negative pressure component (14.2). The adsorption area (14.3) matches the outline of the wafer. The connecting mold base (14.1) is disposed on the moving end of the multi-axis moving assembly and the rotating assembly (12.2).

8. The weighing and appearance inspection equipment according to claim 1, characterized in that: The detection area (c) is provided with a detection bracket (15) arranged between the wafer handling module (8) and the wafer positioning device (12), and the weighing detection platform (11) and the morphology detection platform (10) are vertically spaced on the detection bracket (15).

9. A weighing and appearance inspection device according to claim 1, characterized in that: The basket feeding carrier (3.1) and the basket transfer module (5) are arranged in the same direction. The basket handling module (4) and the sorting rack (7) define a parallel arrangement space in the same direction. The wafer handling module (8), the robot (6), and the detection area (c) are arranged in the parallel arrangement space in sequence. The queue-jumping platform (13), the queue-jumping basket unloading track (13.1), and the empty basket buffer track (13.2) are arranged vertically between the sorting rack (7) and the basket handling module (4).

10. A weighing and appearance inspection device according to claim 1, characterized in that: A manual inspection station (16) is also provided on one side of the inspection area (c). The manual inspection station (16) is arranged along the wafer transport module (8). The manual inspection station (16) is equipped with a three-dimensional microscope (16.1) and a wafer placement platform (16.2).

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