A semiconductor trimming forming chuck device and a trimming forming apparatus

Abstract

This invention discloses a gripper device for semiconductor lead wire forming, comprising a hopper for placing stacked semiconductor lead frames and automatically lifting the uppermost semiconductor lead frame to a preset position, and a track for transporting the semiconductor lead frames. It also includes a gripper mechanism with at least two hooks, the hooks of which can insert into the gap between two semiconductor lead frames; a first pushing mechanism for pushing the hooks outward as the gripper mechanism moves downward toward the preset position, allowing the hooks to return to their original position and insert into the gap between the two uppermost semiconductor lead frames after passing the preset position, and allowing the hooks to pass straight up as the gripper mechanism moves upward; and a second pushing mechanism for pushing the hooks outward while simultaneously limiting the semiconductor lead frames to align with the track as the gripper mechanism moves downward toward the track. The gripper mechanism of this invention is a purely mechanical structure, requiring no electrical control, making its structure simpler and more reliable.

Description

Technical Field

[0001] This invention relates to gripper devices, and more specifically, to gripper devices for semiconductor lead cutting and forming equipment. This invention also relates to lead cutting and forming equipment. Background Technology

[0002] Semiconductor lead cutting and forming equipment is used to cut the connecting ribs on semiconductor chip packaging products, so that the semiconductor chip packaging products are punched and separated from the lead frame, and the leads are bent and shaped.

[0003] Semiconductor lead-cutting and forming equipment requires a feeding mechanism for material handling during operation. This mechanism typically includes a material box and a gripper device. The material box holds stacked semiconductor lead frames to be processed and automatically lifts the top layer to a set height. The gripper device, at the set height, grasps the top layer of semiconductor lead frames, places it on a conveyor track, and sends it into the lead-cutting and forming equipment for lead cutting and forming. Existing grippers, such as those disclosed in Chinese patent application CN119480767A entitled "A Gripper for Automatic Semiconductor Lead Cutting and Forming," feature a gripper structure with multiple grippers symmetrically arranged on both sides. Parallel pneumatic grippers control the opening angle of these grippers to hold the sides of the semiconductor lead frames. This technology requires a combination of parallel pneumatic grippers and a mechanical structure to control the grippers, which is cumbersome and structurally complex. Summary of the Invention

[0004] To address the shortcomings of the prior art, the present invention provides a gripper device for semiconductor lead cutting and forming equipment with a relatively simple structure and no need for electrical control clamping.

[0005] The above-mentioned technical objective of the present invention is achieved through the following technical solution:

[0006] A gripper device for semiconductor lead cutting and forming includes a hopper for placing stacked semiconductor lead frames and automatically lifting the uppermost semiconductor lead frame to a preset position, and a track for conveying the semiconductor lead frames, and further includes:

[0007] The gripper mechanism has at least two grippers that are symmetrical on both sides, and the hooks of the grippers can be inserted into the gap between two adjacent semiconductor lead frames.

[0008] The first pushing mechanism is located on the two outer sides of the material box at the same height as the preset position. When the gripper mechanism moves downward and approaches the preset position, it pushes the gripper hook to open outward. After the hook part passes, it is allowed to reset and insert into the gap between the two uppermost semiconductor lead frames. When the gripper mechanism moves upward, it is allowed to pass straight up through the gap.

[0009] The second pushing mechanism, located on both sides of the track, is used to push the clamping hooks outward and simultaneously limit the semiconductor lead frame to align with the transport plane of the track when the gripper mechanism moves downward and approaches the transport plane of the track.

[0010] Furthermore, the gripper mechanism includes a mounting plate, two clamping plates respectively hinged to both sides of the mounting plate, and an elastic element for keeping the two clamping plates clamped together, with the clamping hook disposed at the bottom end of the clamping plates.

[0011] Furthermore, the gripper mechanism also includes a baffle and an adjusting member. The baffle is movable up and down on the mounting plate and its bottom surface abuts against the top of the clamping plate to limit the minimum opening angle of the clamping plate. The adjusting member is used to adjust and fix the position of the baffle.

[0012] Furthermore, two vertical threaded guide posts are provided on both sides of the top surface of the mounting plate. The baffle has two baffles that are respectively connected to the threaded guide posts on both sides. The adjusting component includes two adjusting screws and four nuts. The four nuts are threaded to the threaded guide posts. The two adjusting screws are respectively threaded to the two baffles. The tail end of the adjusting screw passes through the baffle and abuts against the top surface of the mounting plate, so that the top surface of the baffle abuts against the bottom surface of the nut.

[0013] Furthermore, both baffles have outwardly extending protrusions on their outer sides, and the elastic element includes two springs located on both sides of the mounting plate, with each spring's two ends abutting against the protrusion on its side and the clamping plate, respectively.

[0014] Furthermore, the inner side of the hook portion of the clamp is provided with an inclined surface. The first pushing mechanism includes the same number of pushing bars as the clamp and respectively hinged to the two outer sides of the material box. Each pushing bar can rotate within an acute angle in the horizontal upward direction. When the clamp mechanism moves downward and approaches the preset position, the inclined surface of the hook portion of the clamp abuts against the pushing bar, causing the clamp to open outward.

[0015] Furthermore, the second pushing mechanism includes two symmetrically fixed pushing plates on the two outer sides of the track. Each pushing plate includes a limiting part and a pushing part. The limiting part is higher than the side of the track and is used to limit the side of the semiconductor lead frame. The number of pushing parts on the two pushing plates is the same as the number of clamping hooks. The pushing part is higher than the side of the track and lower than the limiting part. When the gripper mechanism moves downward and approaches the conveying plane of the track, the inclined surface of the hook part abuts against the pushing part, causing the hook to open outward.

[0016] A lead-cutting and forming device includes a main body for cutting and forming semiconductor lead frames, a material box for placing stacked semiconductor lead frames and automatically lifting the top semiconductor lead frame to a preset position, a track for conveying semiconductor lead frames, and an XZ axis drive mechanism. It also includes a gripper device of any of the above technical solutions. The first pushing mechanism and the second pushing mechanism are respectively disposed on the material box and the track. The gripper mechanism is fixedly connected to the drive mechanism and is driven by the drive mechanism to clamp and place the semiconductor lead frames on the material box onto the track.

[0017] Furthermore, there are two material boxes, the track is located between the two material boxes, there are two first pushing mechanisms respectively located on the two material boxes, and the first pushing mechanism and the second pushing mechanism are at the same height. There are two gripper mechanisms arranged side by side on the driving mechanism, which are driven by the driving mechanism to move synchronously, and the distance between the two gripper mechanisms is equal to the distance from any material box to the track.

[0018] In summary, the present invention has the following beneficial effects: When the gripper mechanism moves downward toward the material box and approaches a preset position, it is pushed by the first pushing mechanism, causing the gripper hook to open outward. After the gripper hook passes through, it is allowed to reset and insert into the gap between the two uppermost semiconductor lead frames, thereby clamping the uppermost conductor lead frame. When moving upward, the first pushing mechanism does not obstruct its passage. When the gripper mechanism moves downward toward the conveying plane of the track, the second pushing mechanism pushes the gripper hook to open outward, placing the semiconductor lead frame on the conveying plane of the track. The opening and clamping of the gripper mechanism of the present invention are both purely mechanical structures, requiring no electrical equipment for control, making the structure simpler and more reliable. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the exploded three-dimensional structure and a partially enlarged structure of the present invention;

[0020] Figure 2 This is a front view schematic diagram of the working state of the gripper structure of the present invention;

[0021] Figure 3 This is a front view schematic diagram of another working state of the gripper structure of the present invention;

[0022] Figure 4 This is a three-dimensional structural diagram of the arrangement of the dual material box and dual gripper structure of the present invention.

[0023] Figure label:

[0024] Material box 1; semiconductor lead frame 10; track 2; gripper mechanism 3; mounting plate 31; threaded guide post 311; clamping plate 32; elastic element 33; hook 34; baffle 35; adjusting screw 361; nut 362; first pushing mechanism 4; pushing bar 41; stop block 42; second pushing mechanism 5; pushing plate 51; limiting part 511; pushing part 512; drive mechanism 6. Detailed Implementation

[0025] To make the technical problems, solutions, and beneficial effects of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0026] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly or indirectly attached to that other component. When a component is referred to as being "connected to" another component, it can be directly or indirectly connected to that other component.

[0027] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0029] Reference Figures 1 to 4 A semiconductor lead frame forming gripper device includes a material box 1 and a track 2. The material box 1 is used to hold stacked semiconductor lead frames 10. The material box 1 automatically pushes all semiconductor lead frames 10 upward, raising the uppermost semiconductor lead frame 10 to a preset position. The track 2 is used to transport the semiconductor lead frames 10. It also includes:

[0030] The gripper mechanism 3 is provided with at least two gripping hooks 34 symmetrical on both sides, and the hooks of the gripping hooks 34 can be inserted into the gap between two adjacent semiconductor lead frames 10; preferably, four gripping hooks 34 are used, two on each side.

[0031] The first pushing mechanism 4 is located on the two outer sides of the material box 1 at the same height as the preset position. When the gripper mechanism 3 moves downward and approaches the preset position, it pushes the hook 34 to open outward. After the hook part of the hook 34 passes, it is allowed to reset and insert into the gap between the two uppermost semiconductor lead frames 10. When the gripper mechanism 3 moves upward, it is allowed to pass straight up through the hook part.

[0032] The second pushing mechanism 5 is located on both sides of the track 2. When the gripper mechanism 3 moves downward and approaches the conveying plane of the track 2, it pushes the gripper hook 34 to open outward and simultaneously limits the semiconductor lead frame 10 to align it with the conveying plane of the track 2.

[0033] Semiconductor lead frames 10 are equipped with semiconductor devices such as ICs. The thickness is greater than that of the leads. After stacking, there will be gaps at the edges of two adjacent semiconductor lead frames 10. The hooks 34 have smaller edge thicknesses and can be inserted into the gaps.

[0034] In one embodiment, such as Figures 1 to 3 As shown, the gripper mechanism 3 includes a mounting plate 31, two clamping plates 32 respectively hinged to both sides of the mounting plate 31, and an elastic member 33 for keeping the two clamping plates 32 clamped. A hook 34 is disposed at the bottom end of the clamping plate 32. Preferably, the hook 34 and the clamping plate 32 are an integral structure. The gripper mechanism 3 also includes a baffle 35 and an adjusting member. The baffle 35 is movably disposed on the mounting plate 31, with its bottom surface abutting against the top of the clamping plate 32 to limit the minimum opening angle of the clamping plate 32. The adjusting member is used to adjust and fix the position of the baffle 35. By adjusting the position of the baffle 35, the minimum opening angle of the clamping plate 32 is adjusted to accommodate the clamping needs of semiconductor lead frames 10 of different specifications.

[0035] In one embodiment, such as Figures 1 to 3As shown, the mounting plate 31 has two vertical threaded guide posts 311 on both sides of its top surface. The baffle 35 has two guide posts 311 that are respectively connected to the two threaded guide posts 311. The adjusting component includes two adjusting screws 361 and four nuts 362. The four nuts 362 are threaded to the threaded guide posts 311. The two adjusting screws 361 are threaded to the two baffles 35 respectively. The tail end of the adjusting screw 361 passes through the baffle 35 and abuts against the top surface of the mounting plate 31, so that the top surface of the baffle 35 abuts against the bottom surface of the nut 362. When the baffle 35 needs to be raised, first adjust the nut 362 to the required height, then turn the adjusting screw 361 so that its tail end abuts against the top surface of the mounting plate 31 and rotates, pushing the baffle 35 upward until the top surface of the baffle 35 abuts against the bottom surface of the nut 362, thus completing the adjustment. When the baffle 35 needs to be lowered, first loosen the adjusting screw 361 so that the baffle is lowered to a certain height, turn the nut 362 to lower it to the required height, then turn the adjusting screw 361 again to push the baffle 35 upward until the top surface of the baffle 35 abuts against the bottom surface of the nut 362.

[0036] In one embodiment, such as Figures 1 to 3 As shown, both baffles 35 have outwardly extending protrusions on their outer sides. The elastic element 33 includes two springs located on both sides of the mounting plate 31, with each spring's ends abutting against the protrusion on its side and the clamping plate 32, respectively. In this structure, the spring compression varies bidirectionally with the position of the baffles 35, resulting in a significant change. When clamping a larger semiconductor lead frame 10, the height of the baffles 35 is lowered, causing the clamping plate 32 to open outward. The simultaneous lowering of the baffles 35 and the opening of the clamping plate 32 compress the spring's deformation from two directions, resulting in a greater elastic force than a unidirectional change. This allows for a greater clamping force from the clamping plate 32, accommodating the need to clamp larger and heavier semiconductor lead frames 10. The operation and working principle are reversed when clamping smaller semiconductor lead frames 10.

[0037] In one embodiment, such as Figures 1 to 3 As shown, the inner side of the hook portion of the clamping hook 34 is provided with an inclined surface. The first pushing mechanism 4 includes the same number of pushing bars 41 as the clamping hooks 34, which are respectively hinged to the two outer sides of the material box 1. Each pushing bar 41 can rotate within an acute angle upwards. When the gripper mechanism 3 moves downwards and approaches a preset position, the inclined surface of the hook portion of the clamping hook 34 abuts against the pushing bar 41, causing the clamping hook 34 to open outwards. The first pushing mechanism 4 also includes a stop block 42 located below each pushing bar 41 at the material box, used to block the pushing bar 41 and keep it in a horizontal state.

[0038] When clamping, such as Figure 2 and Figure 3As shown, the gripper mechanism 3 moves downwards to approach a preset position. The inclined surface of the hook 34 abuts against the push bar 41, causing the hook 34 to open outwards. After the hook passes the push plate 51, the push plate 51 resets, causing the hook 34 to rotate inwards. The hook inserts into the gap between the two uppermost semiconductor lead frames 10. When the gripper mechanism moves upwards, it drives the uppermost semiconductor lead frame 10 to move upwards and causes the push bar 41 to rotate upwards. After the hook 34 leaves, the push bar 41 falls back to a horizontal state under the action of gravity.

[0039] In one embodiment, such as Figures 1 to 3 As shown, the second pushing mechanism 5 includes two symmetrically fixed pushing plates 51 on the two outer sides of the track 2. Each pushing plate 51 includes a limiting part 511 and a pushing part 512. The limiting part 511 extends beyond the side of the track 2 and is used to limit the side of the semiconductor lead frame 10. The number of pushing parts 512 on the two pushing plates 51 is the same as the number of hooks 34. The pushing part 512 extends beyond the side of the track 2 and is lower than the limiting part 511. When the gripper mechanism 3 moves downward and approaches the conveying plane of the track 2, the inclined surface of the hook of the hook 34 abuts against the pushing part 512, causing the hook 34 to open outward. During placement, the limiting parts 511 on both sides of the track 2 first limit the sides of the semiconductor lead frame 10. As the gripper mechanism 3 continues to move downward, the inclined surface of the hook 34 is pushed outward by the pushing part 512, thereby releasing the grip on the semiconductor lead frame 10 and falling into the transport plane of the track 2 under the limiting of the limiting parts 511.

[0040] Reference Figure 4 A lead-cutting and forming device includes a main body (not shown in the figure) for cutting and forming semiconductor lead frames 10, a material box 1 for placing stacked semiconductor lead frames 10 and automatically lifting the top semiconductor lead frame 10 to a preset position, a track 2 for conveying semiconductor lead frames 10, and an XZ axis drive mechanism 6. It also includes the aforementioned gripper device. A first pushing mechanism 4 and a second pushing mechanism 5 are respectively disposed on the material box 1 and the track 2. The gripper mechanism 3 is fixedly connected to the drive mechanism 6 and, driven by the drive mechanism 6, clamps the semiconductor lead frames 10 on the material box 1 and places them on the track 2. The drive mechanism 6 can move in both horizontal and vertical directions and mainly includes a horizontal guide rail and a vertical guide rail. The vertical guide rail is mounted on the horizontal guide rail, and the gripper mechanism 3 is disposed on the vertical guide rail. It is driven by common methods such as cylinders or linear motors, allowing the gripper mechanism 3 to move in both horizontal and vertical directions.

[0041] Preferred, such as Figure 4The device comprises two material boxes 1, with a track 2 positioned between them. Two first pushing mechanisms 4 are located on each of the two material boxes 1, and are at the same height. Two gripper mechanisms 3 are arranged side-by-side on a drive mechanism 6, moving synchronously under the drive mechanism 6. The distance between the two gripper mechanisms 3 is equal to the distance from either material box 1 to the track 2. When the first gripper mechanism 3 picks up the semiconductor lead frame 10 from the first material box 1 and moves to the track 2 to place it, the second gripper mechanism 3 picks up the semiconductor lead frame 10 from the second material box 1. When the first gripper mechanism 3 returns from the track 2 to the first material box 1 to pick up the semiconductor lead frame 10 again, the second gripper mechanism 3 moves to the track 2 to place the semiconductor lead frame 10, thus improving overall pick-and-place efficiency. The opening and clamping of the gripper mechanisms 3 are purely mechanical structures, requiring no electrical control, resulting in a simpler and more reliable structure.

[0042] The above embodiments are merely explanations of the present invention and are not intended to limit the present invention. After reading this specification, those skilled in the art can make modifications to these embodiments without contributing any inventive step, but as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A gripper device for semiconductor lead cutting and forming, comprising a hopper for placing stacked semiconductor lead frames and automatically lifting the uppermost semiconductor lead frame to a preset position, and a track for conveying the semiconductor lead frames, characterized in that, Also includes: A gripper mechanism is provided with at least two gripping hooks symmetrical on both sides, and the hooks of the grippers can be inserted into the gap between two adjacent semiconductor lead frames. The gripper mechanism includes a mounting plate, two clamping plates respectively hinged to both sides of the mounting plate, and an elastic element for keeping the two clamping plates clamped. The gripping hooks are provided at the bottom end of the clamping plates. The first pushing mechanism is located on the two outer sides of the material box at the same height as the preset position. It is used to push the hook to open outward when the gripper mechanism moves downward and approaches the preset position. After the hook passes, it allows the hook to reset and insert into the gap between the two uppermost semiconductor lead frames. When the gripper mechanism moves upward, it allows the hook to pass straight up. The second pushing mechanism is located on both sides of the track. When the gripper mechanism moves downward and approaches the conveying plane of the track, it pushes the gripper hook to open outward and simultaneously limits the semiconductor lead frame, so that the semiconductor lead frame is aligned with the conveying plane of the track. The inner side of the hook of the clamp is provided with an inclined surface. The first pushing mechanism includes the same number of pushing bars as the clamp and respectively hinged to the two outer sides of the material box. Each pushing bar can rotate within an acute angle in the horizontal upward direction. When the clamp mechanism moves downward and approaches the preset position, the inclined surface of the hook of the clamp abuts against the pushing bar, causing the clamp to open outward. The second pushing mechanism includes two symmetrically fixed pushing plates on the two outer sides of the track. Each pushing plate includes a limiting part and a pushing part. The limiting part is higher than the side of the track and is used to limit the side of the semiconductor lead frame. The number of pushing parts on the two pushing plates is the same as the number of clamping hooks. The pushing part is higher than the side of the track and lower than the limiting part. When the clamping mechanism moves downward and approaches the conveying plane of the track, the inclined surface of the clamping hook part abuts against the pushing part, causing the clamping hook to open outward.

2. The gripper device for semiconductor lead cutting and forming according to claim 1, characterized in that: The gripper mechanism also includes a baffle and an adjusting member. The baffle is mounted on the mounting plate and its bottom surface abuts against the top of the clamping plate to limit the minimum opening angle of the clamping plate. The adjusting member is used to adjust and fix the position of the baffle.

3. The gripper device for semiconductor lead cutting and forming according to claim 2, characterized in that: The mounting plate has two vertical threaded guide posts on both sides of its top surface. The baffle has two baffles that are respectively connected to the threaded guide posts on both sides. The adjusting component includes two adjusting screws and four nuts. The four nuts are threaded to the threaded guide posts. The two adjusting screws are respectively threaded to the two baffles. The tail end of the adjusting screw passes through the baffle and abuts against the top surface of the mounting plate, so that the top surface of the baffle abuts against the bottom surface of the nut.

4. The gripper device for semiconductor lead cutting and forming according to claim 3, characterized in that: Both baffles have outwardly extending protrusions on their outer sides. The elastic element includes two springs located on both sides of the mounting plate, with each spring's two ends abutting against the protrusion on its side and the clamping plate, respectively.

5. A lead-cutting and forming device, comprising a main body for cutting and forming semiconductor lead frames, and an XZ-axis drive mechanism, characterized in that: It also includes the gripper device according to any one of claims 1 to 4 above, wherein the first pushing mechanism and the second pushing mechanism are respectively disposed on the material box and the track, and the gripper mechanism is fixedly connected to the driving mechanism and is driven by the driving mechanism to clamp and place the semiconductor lead frame on the material box on the track.

6. The rebar cutting and forming equipment according to claim 5, characterized in that: The material box has two parts, the track is located in the middle of the two material boxes, the first pushing mechanism has two parts and is respectively located on the two material boxes, and the first pushing mechanism and the second pushing mechanism are at the same height. The gripper mechanism has two parts and is arranged side by side on the driving mechanism, and is driven by the driving mechanism to move synchronously. The distance between the two gripper mechanisms is equal to the distance from either material box to the track.

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