A multi-surface polishing forming control system and control method

Abstract

The application discloses a multi-surface polishing forming control system and a control method, relates to the field of industrial manufacturing, and solves the problem of poor control effect of the existing multi-surface polishing forming control system, and comprises a data acquisition module, a region recognition module and a polishing control module.The data acquisition module carries out laser reflection analysis on regional characteristic points to obtain real-time polishing thickness, and carries out under-polishing characteristic point screening on the regional characteristic points according to the real-time polishing thickness to obtain polishing surface real-time acquisition data.The region recognition module carries out regional aggregative analysis on the under-polishing characteristic points according to the polishing surface real-time acquisition data, divides under-polishing regions of the target polishing surface according to an analysis result, and obtains polishing region division data.The polishing control module carries out polishing control on the target polishing surface according to the polishing region division data, and carries out forming quality monitoring and polishing quality evaluation on the target polishing surface after polishing is completed.The application can improve the control efficiency of the multi-surface polishing forming control system.

Description

TECHNICAL FIELD

[0001] The application belongs to the field of industrial manufacturing, and relates to a multi-surface polishing technology, in particular to a multi-surface polishing forming control system and a control method. BACKGROUND

[0002] The existing multi-surface polishing forming control system has the following defects when polishing a workpiece:

[0003] 1. The existing multi-surface polishing forming control system can only polish a workpiece along a fixed track by setting a fixed program, and cannot calculate the real-time polishing thickness of each region feature point by using the laser reflection principle during the polishing process, so it is difficult to determine whether the region feature point is underpolished according to the real-time polishing thickness, which may lead to insufficient polishing time in some regions and poor workpiece polishing quality.

[0004] 2. The existing multi-surface polishing forming control system needs to stop the polishing equipment for underpolishing area identification and quality detection of the workpiece polishing surface, and cannot detect the underpolishing points in real time while the polishing operation is being performed, so it is difficult to identify the underpolishing area by analyzing the underpolishing points in an aggregated manner, and it is even more difficult to control the polishing head to adjust the polishing track in real time to perform supplementary polishing operation on the underpolishing area, which leads to low workpiece polishing efficiency and affects the production efficiency of the enterprise.

[0005] Therefore, we propose a multi-surface polishing forming control system and a control method. SUMMARY

[0006] In view of the deficiencies of the prior art, the application aims to provide a multi-surface polishing forming control system and a control method, and the application aims to improve the control efficiency of the multi-surface polishing forming control system.

[0007] In order to achieve the above-mentioned purpose, the application adopts the following technical scheme: a multi-surface polishing forming control system, and the specific working process of each module is as follows:

[0008] The data acquisition module: performs laser reflection analysis on the region feature points in the target polishing surface, obtains the real-time polishing thickness of each region feature point according to the analysis result, and performs underpolishing feature point screening on the region feature points according to the real-time polishing thickness to obtain real-time collection data of the polishing surface.

[0009] The region identification module: performs region aggregation analysis on the underpolishing feature points according to the real-time collection data of the polishing surface, divides the target polishing surface into underpolishing areas according to the analysis result, and obtains polishing area division data.

[0010] The polishing control module controls polishing of the target polishing surface according to the polishing area division data, and monitors the forming quality and evaluates the polishing quality of the target polishing surface after polishing.

[0011] Further, the polishing surface real-time acquisition data is acquired, and the acquisition is specifically as follows:

[0012] A target workpiece is acquired from a workpiece being polished, and a target workpiece surface to be polished is acquired from the target workpiece, to obtain a plurality of workpiece polishing surfaces, and a target polishing surface is selected from the plurality of workpiece polishing surfaces;

[0013] In the target polishing surface, a polishing thickness real-time monitoring area is acquired from a work surface area not covered by the polishing head, and the polishing thickness real-time monitoring area is divided into a plurality of area feature points, and a sample area feature point is selected from the plurality of area feature points;

[0014] The sample area feature point is analyzed for a polishing position, and a real-time polishing thickness corresponding to the sample area feature point is acquired according to the analysis;

[0015] In the process of monitoring the polishing thickness of the target polishing surface, a historical time point is selected from a historical period in which the sample area feature point is not polished, to obtain a first feature time point, and a time point corresponding to a current time is set as a second feature time point;

[0016] The sample area feature point at the first feature time point is analyzed for a laser emission distance, and a first-time laser emission distance is acquired according to the analysis result;

[0017] The sample area feature point at the second feature time point is analyzed for a laser emission distance, and a second-time laser emission distance is acquired according to the analysis result;

[0018] The sample area feature point is monitored for a polishing thickness according to the first-time laser emission distance and the second-time laser emission distance, and a real-time polishing thickness corresponding to the sample area feature point is acquired according to the monitoring result;

[0019] The process of acquiring the real-time polishing thickness corresponding to the sample area feature point is repeated to acquire a real-time polishing thickness corresponding to each area feature point;

[0020] A target polishing thickness corresponding to the target polishing surface is acquired, and an area feature point with a real-time polishing thickness less than the target polishing thickness is set as an under-polishing feature point, to obtain polishing surface real-time acquisition data.

[0021] Further, the first-time laser emission distance is acquired, and the acquisition is specifically as follows:

[0022] A laser emission and entry plane vertical to the ground is arranged in front of the sample area feature point, a time value of emitting the target laser beam from the laser emission and entry plane to the sample area feature point is set as a first laser emission time value, the laser emission and entry plane receives the laser beam reflected by the sample area feature point, and a first laser receiving time value is obtained;

[0023] A propagation speed of the target laser beam in the polishing environment is obtained, and a laser actual propagation speed is obtained;

[0024] The first laser emission time value, the first laser receiving time value, and the laser actual propagation speed are calculated to obtain a first time laser emission distance;

[0025] The first time laser emission distance is calculated, and the specific formula is as follows:

[0026] ;

[0027] Wherein, Fjl1 is the first time laser emission distance, Jt1 is the first laser receiving time value, Ft1 is the first laser emission time value, and Vcb is the laser actual propagation speed.

[0028] Further, the real-time polishing thickness is obtained, and the specific process is as follows:

[0029] In the space region where the target polishing surface is located, a plane vertical to the laser emission and entry plane is made through the ground to obtain a polishing thickness projection plane, a projection point of the target laser beam emission point on the polishing thickness projection plane is obtained to obtain a laser emission projection point, and a projection point of the sample area feature point on the polishing thickness projection plane is obtained to obtain a region feature projection point;

[0030] In the polishing thickness projection plane, a first laser path connecting line is obtained by connecting the laser emission projection point and the region feature projection point, a difference between a second time laser emission distance and the first time laser emission distance is calculated to obtain a polishing extension distance, an extension line of the first laser path connecting line is made through the region feature projection point, an end point of the extension line when the extension distance reaches the polishing extension distance is set as a laser path extension point, and a second laser path connecting line is set as a connecting line between the region feature projection point and the laser path extension point;

[0031] In the polishing thickness projection plane, a first polishing feature line is obtained by making a perpendicular line through the laser path extension point and the ground, a straight line vertical to the first polishing feature line is made through the region feature projection point, an intersection point of the obtained straight line and the first polishing feature line is set as an updated polishing position point, and a polishing thickness marking line is set as a connecting line between the region feature projection point and the updated polishing position point;

[0032] In the thickness feature triangle, the angle value of the target laser beam incident on the area feature projection point is obtained, the polishing feature angle value is obtained, and the polishing feature angle value and the polishing extension distance are calculated to obtain the real-time polishing thickness corresponding to the sample area feature point;

[0033] The real-time polishing thickness corresponding to the sample area feature point is calculated, and the specific formula is as follows:

[0034] ;

[0035] Wherein, Psh is the real-time polishing thickness corresponding to the sample area feature point, Ycj is the polishing feature angle value, and a is the polishing feature angle value.

[0036] Further, the polishing area division data is obtained, and the specific process is as follows:

[0037] The polishing surface real-time collection data is obtained, the under-polishing feature points in the target polishing surface are obtained according to the polishing surface real-time collection data, the target polishing surface is imaged, the target polishing surface image is obtained, the under-polishing feature points in the target polishing surface image are marked, and the target polishing surface marking image is obtained.

[0038] The Euclidean distance of any two under-polishing feature points in the target polishing surface marking image is obtained, and the Euclidean distance connection interval is set. If the Euclidean distance between any two under-polishing feature points is in the Euclidean distance connection interval, the two under-polishing feature points are connected as a feature edge, a plurality of under-polishing feature edges are obtained, and the closed area surrounded by the under-polishing feature edges is obtained. A plurality of quasi-under-polishing areas are obtained.

[0039] Any one of the plurality of quasi-under-polishing areas is selected, and the feature point aggregation analysis of the sample quasi-under-polishing area is performed, and the area screening data corresponding to the sample quasi-under-polishing area is obtained according to the analysis result.

[0040] The area screening data corresponding to each quasi-under-polishing area is obtained, and the polishing area division data is obtained.

[0041] Further, the feature point analysis of the sample quasi-under-polishing area is performed, and the specific process is as follows:

[0042] The area value of the sample quasi-under-polishing area is obtained, and the sample area area value is obtained.

[0043] If the sample area area value is less than the under-polishing area preset area value, the sample quasi-under-polishing area is ignored.

[0044] If the sample area area value is greater than or equal to the under-polishing area preset area value, the feature point analysis of the sample quasi-under-polishing area is performed.

[0045] Further, the area screening data is acquired, specifically as follows:

[0046] The minimum concave polygon containing the sample quasi-undersurface region is acquired, the number of area feature points covered by the minimum concave polygon is counted to obtain a first feature point number value, the number of undersurface feature points covered by the minimum concave polygon is counted to obtain a second feature point number value, the ratio of the second feature point number value to the first feature point number value is calculated to obtain the area undersurface point proportion corresponding to the sample quasi-undersurface region;

[0047] A region undersurface point proportion benchmark interval is set, if the region undersurface point proportion is in the region undersurface point proportion benchmark interval, the sample quasi-undersurface region is directly divided into an undersurface region, if the region undersurface point proportion is not in the region undersurface point proportion benchmark interval, the sample quasi-undersurface region is repeatedly divided into multiple quasi-undersurface regions, and feature analysis is performed on each quasi-undersurface region until the area value of each quasi-undersurface region is less than the undersurface region preset area value, and the acquired undersurface region is set as the area screening data corresponding to the sample quasi-undersurface region.

[0048] Further, the target polishing surface is controlled for polishing, specifically as follows:

[0049] The polishing area division data is acquired, each undersurface region in the target polishing surface is acquired according to the polishing area division data, and the polishing head is automatically controlled to polish each undersurface region in the target polishing surface until there is no undersurface region in the target polishing surface, and the target polishing surface without undersurface region is set as an undersurface-free polishing surface;

[0050] The undersurface-free polishing surface is monitored for forming quality, and the polishing quality is evaluated according to the monitoring result.

[0051] Further, the undersurface-free polishing surface is monitored for forming quality, specifically as follows:

[0052] The real-time polishing thickness corresponding to each area feature point in the undersurface-free polishing surface is acquired, the preset polishing thickness corresponding to each area feature point is calculated, the difference between the real-time polishing thickness and the preset polishing thickness is calculated, and the absolute value of the obtained difference is taken to obtain the polishing thickness deviation corresponding to each area feature point, the ratio of the polishing thickness deviation corresponding to each area feature point to the preset polishing thickness is calculated to obtain multiple polishing actual deviation degrees, and the average of the obtained multiple polishing actual deviation degrees is calculated to obtain the overall polishing deviation degree;

[0053] The polishing actual deviation degree difference value of any two region feature points in an adjacent state is calculated, the polishing actual deviation degree corresponding to any two region feature points in an adjacent state is calculated by using an average number, the adjacent average deviation degree is obtained, the ratio of the polishing deviation degree difference value and the adjacent average deviation degree is calculated, a plurality of adjacent polishing error ratios are obtained, and the plurality of adjacent polishing error ratios are calculated by using an average number, so as to obtain the region polishing deviation;

[0054] The overall polishing deviation degree and the region polishing deviation degree are calculated to obtain a molding quality evaluation coefficient corresponding to the non-undersized polishing surface;

[0055] A molding quality evaluation preset interval is obtained, if the molding quality evaluation coefficient is in the molding quality evaluation preset interval, it is evaluated that the non-undersized polishing surface is qualified in molding and polishing, and if the molding quality evaluation coefficient is not in the molding quality evaluation preset interval, it is evaluated that the non-undersized polishing surface is unqualified in molding and polishing.

[0056] A multi-surface polishing molding control method, comprising the following steps:

[0057] Step S1: laser reflection analysis is performed on region feature points in a target polishing surface, real-time polishing thickness corresponding to each region feature point is obtained according to the analysis result, and undersized feature points are screened according to the real-time polishing thickness, so as to obtain polishing surface real-time collection data;

[0058] Step S2: region aggregation analysis is performed on the undersized feature points according to the polishing surface real-time collection data, undersized region division is performed on the target polishing surface according to the analysis result, and polishing region division data is obtained;

[0059] Step S3: polishing control is performed on the target polishing surface according to the polishing region division data, and molding quality monitoring and polishing quality evaluation are performed on the target polishing surface after polishing.

[0060] As described above, due to the adoption of the above technical solutions, the present application has the following advantages:

[0061] 1. The present application performs region feature point laser reflection analysis on a polishing surface by using a laser reflection principle, obtains real-time polishing thickness corresponding to each region feature point according to the analysis result, and screens undersized feature points according to the real-time polishing thickness, so as to effectively identify the undersized position in the polishing plane to provide data support for equipment polishing molding control, thereby improving the control accuracy of the multi-surface polishing molding control system;

[0062] 2、The present application carries out real-time under-polishing point detection on the non-covered area of the polishing head while polishing, identifies the under-polishing area through the aggregative analysis of the under-polishing points, and controls the polishing head to adjust the polishing track in real time to carry out supplementary polishing operation on the under-polishing area, thereby effectively improving the polishing efficiency and quality of the workpiece. BRIEF DESCRIPTION OF DRAWINGS

[0063] In order to facilitate the understanding of those skilled in the art, the present application will be further described below in conjunction with the drawings.

[0064] Figure 1 It is the overall system block diagram of the present application;

[0065] Figure 2 It is the implementation step diagram of the present application;

[0066] Figure 3 It is the polishing thickness marking line schematic diagram of the present application;

[0067] Figure 4 It is the polishing feature angle schematic diagram of the present application. DETAILED DESCRIPTION

[0068] The technical solutions of the present application will be described below in conjunction with the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application. EMBODIMENT

[0069] Please refer to Figure 1 The present application provides a technical solution: a multi-surface polishing forming control system and control method, comprising a data acquisition module, a region identification module, a polishing control module and a server, the data acquisition module, the region identification module and the polishing control module are connected with the server respectively, and the server controls the data acquisition module, the region identification module and the polishing control module respectively;

[0070] The data acquisition module carries out laser reflection analysis on the region feature points in the target polishing surface, obtains the real-time polishing thickness corresponding to each region feature point according to the analysis result, and carries out under-polishing feature point screening on the region feature points according to the real-time polishing thickness, to obtain the real-time collection data of the polishing surface;

[0071] Specifically as follows:

[0072] The workpiece being polished is obtained to obtain a target workpiece, the workpiece surface of the target workpiece needing to be polished is obtained to obtain a plurality of workpiece polishing surfaces, and a target polishing surface is selected from the plurality of workpiece polishing surfaces;

[0073] It should be noted here that:

[0074] In this application, the target workpiece referred to here has multiple workpiece surfaces being polished, and the target polishing surface referred to here is the working surface being polished.

[0075] In the target polishing surface, the working surface area not covered by the polishing head is obtained to obtain a polishing thickness real-time monitoring area, and the polishing thickness real-time monitoring area is divided into a plurality of regional feature points, and a sample regional feature point is randomly selected from the obtained plurality of regional feature points;

[0076] The sample regional feature point is analyzed for polishing position, and the real-time polishing thickness corresponding to the sample regional feature point is obtained according to the analysis;

[0077] In the process of monitoring the polishing thickness of the target polishing surface, a historical time point is randomly selected in a historical period during which the sample regional feature point is not polished to obtain a first feature time point, and a time point corresponding to the current time is set as a second feature time point;

[0078] The sample regional feature point at the first feature time point is analyzed for laser emission distance, and the first time laser emission distance is obtained according to the analysis result;

[0079] Specifically as follows:

[0080] A laser emission and entry plane perpendicular to the ground is arranged in front of the sample regional feature point, the time value of emitting the target laser beam from the laser emission and entry plane to the sample regional feature point is set as a first laser emission time value, the laser emission and entry plane receives the laser beam reflected by the sample regional feature point, and the receiving time value is obtained to obtain a first laser receiving time value;

[0081] It should be noted here that:

[0082] In this application, the laser referred to here is a direct laser, the laser referred to here is a direct laser, and the laser emission device referred to here is a visible red light semiconductor laser emitter with a wavelength of 650 nm.

[0083] The propagation speed of the target laser beam in the polishing environment is obtained to obtain the actual laser propagation speed;

[0084] The first laser emission time value, the first laser receiving time value, and the actual laser propagation speed are calculated to obtain the first time laser emission distance;

[0085] The first time laser emission distance is calculated, and the specific formula is as follows:

[0086] ;

[0087] Wherein, Fjl1 is the first time laser emission distance, Jt1 is the first laser receiving time value, Ft1 is the first laser emission time value, Vcb is the actual laser propagation speed;

[0088] The sample area feature point at the second characteristic time point is analyzed for laser emission distance, and the second time laser emission distance is obtained according to the analysis result;

[0089] Specifically as follows:

[0090] A laser entry and exit plane perpendicular to the ground is arranged in front of the sample area feature point, the time value of emitting the target laser beam from the laser entry and exit plane to the sample area feature point is set as the second laser emission time value, the laser entry and exit plane receives the laser beam reflected by the sample area feature point, and the receiving time value is obtained to obtain the second laser receiving time value;

[0091] The propagation speed of the target laser beam in the polishing environment is obtained to obtain the actual laser propagation speed;

[0092] The second laser emission time value, the second laser receiving time value and the actual laser propagation speed are calculated to obtain the second time laser emission distance;

[0093] The second time laser emission distance is calculated, and the specific formula is as follows:

[0094] ;

[0095] Wherein, Fjl2 is the second time laser emission distance, Jt2 is the second laser receiving time value, Ft2 is the second laser emission time value, Vcb is the actual laser propagation speed;

[0096] In the space region where the target polishing surface is located, a plane perpendicular to the laser entry and exit plane is made through the ground to obtain a polishing thickness projection plane, a projection point of the target laser beam emission point on the polishing thickness projection plane is obtained to obtain a laser emission projection point, and a projection point of the sample area feature point on the polishing thickness projection plane is obtained to obtain a region feature projection point;

[0097] In the polishing thickness projection plane, a first laser path connecting line is obtained by connecting the laser emission projection point and the region feature projection point, the difference between the second time laser emission distance and the first time laser emission distance is calculated to obtain a polishing extension distance, an extension line of the first laser path connecting line is made through the region feature projection point, and the endpoint of the extension line when the extension distance reaches the polishing extension distance is set as a laser path extension point, and a second laser path connecting line is set by connecting the region feature projection point and the laser path extension point.

[0098] It should be noted here that:

[0099] In this application, the path length corresponding to the first laser path connection is the first laser emission distance, and the second laser path connection is the polishing extension distance.

[0100] Please refer to Figure 3 In the polishing thickness projection plane, a vertical line is drawn through the laser path extension point and the ground to obtain a first polishing characteristic line. A straight line is drawn through the area feature projection point and perpendicular to the first polishing characteristic line. The intersection of the obtained straight line and the first polishing characteristic line is set as the updated polishing position point. The line connecting the area feature projection point and the updated polishing position point is set as the polishing thickness marker line.

[0101] A line is drawn through the laser path extension point and the area feature projection point to obtain a second polishing characteristic line. A closed triangle formed by the polishing thickness marker line, the first polishing characteristic line, and the second polishing characteristic line is set as a thickness feature triangle.

[0102] In the thickness feature triangle, the angle value of the target laser beam incident at the area feature projection point is obtained to obtain a polishing characteristic angle value. The polishing characteristic angle value and the polishing extension distance are used to calculate the real-time polishing thickness corresponding to the sample area feature point.

[0103] The real-time polishing thickness corresponding to the sample area feature point is calculated, and the specific formula is as follows:

[0104] ;

[0105] Where Psh is the real-time polishing thickness corresponding to the sample area feature point, Ycj is the polishing characteristic angle value, and a is the polishing characteristic angle value.

[0106] It should be noted here that:

[0107] Please refer to Figure 4 In this application, in the thickness feature triangle, the included angle formed by the second polishing characteristic line and the polishing thickness marker line is set as the polishing characteristic angle. Since the angle of incidence of the target laser beam at the area feature projection point and the polishing characteristic angle are each other's vertical angles, the angle value corresponding to the polishing characteristic angle is the polishing characteristic angle value.

[0108] The process of obtaining the real-time polishing thickness corresponding to the sample area feature point is repeated to obtain the real-time polishing thickness corresponding to each area feature point.

[0109] acquire a target polishing thickness corresponding to the target polishing surface, set a region feature point with a real-time polishing thickness less than the target polishing thickness as an under-polishing feature point, and obtain polishing surface real-time collection data;

[0110] It should be noted here that:

[0111] In the present application, the target polishing thickness referred to here is specifically the polishing thickness set by the polishing equipment operator. When the real-time polishing thickness of each region feature point in the target polishing surface is the target polishing thickness, the polishing of the target polishing surface is complete.

[0112] The region identification module performs region aggregation analysis on the under-polishing feature points according to the polishing surface real-time collection data, divides the under-polishing regions of the target polishing surface according to the analysis result, and obtains polishing region division data;

[0113] Specifically as follows:

[0114] Obtain polishing surface real-time collection data, acquire under-polishing feature points in the target polishing surface according to the polishing surface real-time collection data, perform image collection on the target polishing surface, obtain a target polishing surface image, mark the under-polishing feature points in the target polishing surface image, and obtain a target polishing surface marked image;

[0115] Perform under-polishing feature point aggregation analysis on the target polishing surface marked image, spatially divide the under-polishing regions according to the analysis result, and obtain polishing region division data according to the division result;

[0116] Specifically as follows:

[0117] Obtain the Euclidean distance between any two under-polishing feature points in the target polishing surface marked image, and set a Euclidean distance connection interval. If the Euclidean distance between any two under-polishing feature points is within the Euclidean distance connection interval, the two corresponding under-polishing feature points are connected as a feature edge, a plurality of under-polishing feature edges are obtained, and a closed region surrounded by the under-polishing feature edges is acquired, and a plurality of quasi-under-polishing regions are obtained;

[0118] It should be noted here that:

[0119] In the present application, the Euclidean distance is within the Euclidean distance connection interval, and the two corresponding under-polishing feature points are connected as a feature edge. The Euclidean distance within the Euclidean distance connection interval referred to here includes the case of being at the interval boundary.

[0120] Select a sample quasi-under-polishing region from the plurality of quasi-under-polishing regions obtained, perform feature point aggregation analysis on the sample quasi-under-polishing region, and acquire region screening data corresponding to the sample quasi-under-polishing region according to the analysis result;

[0121] If the sample area numerical value is less than the under-polishing area preset area value, the sample under-polishing area is ignored; if the sample area numerical value is greater than or equal to the under-polishing area preset area value, the sample under-polishing area is subjected to feature point analysis;

[0122] It should be noted here that:

[0123] In the present application, the under-polishing area preset area value specifically refers to the minimum area numerical value that can be locally polished by the polishing equipment.

[0124] Specifically as follows:

[0125] The minimum concave polygon containing the sample under-polishing area is obtained using a graphic algorithm, the number of feature points covered by the minimum concave polygon is counted to obtain a first feature point number value, the number of under-polishing feature points covered by the minimum concave polygon is counted to obtain a second feature point number value, the ratio of the second feature point number value to the first feature point number value is calculated to obtain the area under-polishing point proportion corresponding to the sample under-polishing area, a region under-polishing point proportion benchmark interval is set, if the area under-polishing point proportion is within the region under-polishing point proportion benchmark interval, the sample under-polishing area is directly divided into an under-polishing area, if the area under-polishing point proportion is not within the region under-polishing point proportion benchmark interval, the sample under-polishing area is repeatedly divided into multiple under-polishing areas, and feature analysis is performed on each under-polishing area until the area numerical value of the under-polishing area is less than the under-polishing area preset area value, and the obtained under-polishing area is set as the region screening data corresponding to the sample under-polishing area;

[0126] It should be noted here that:

[0127] In the present application, the under-polishing area includes the case where the area under-polishing point proportion is within the boundary of the region under-polishing point proportion benchmark interval;

[0128] In the present application, the historical polishing log corresponding to the polishing equipment is obtained, the historical under-polishing area is obtained according to the historical polishing log, the area under-polishing point proportion corresponding to each historical under-polishing area is obtained, and the obtained multiple area under-polishing point proportions are numerically compared, the area under-polishing point proportion with the largest value is set as the upper limit of the region under-polishing point proportion benchmark interval, and the area under-polishing point proportion with the smallest value is set as the lower limit of the region under-polishing point proportion benchmark interval, to obtain the region under-polishing point proportion benchmark interval.

[0129] The process of obtaining the region screening data corresponding to the sample under-polishing area is repeated, the region screening data corresponding to each under-polishing area is obtained, and polishing region division data is obtained;

[0130] The polishing control module controls polishing of the target polishing surface according to the polishing area division data, and monitors forming quality and evaluates polishing quality of the target polishing surface after polishing is completed;

[0131] Specifically as follows:

[0132] Obtaining polishing area division data, obtaining each under-polishing area in the target polishing surface according to the polishing area division data, and automatically controlling the polishing head to polish each under-polishing area in the target polishing surface until there is no under-polishing area in the target polishing surface, and setting the target polishing surface without under-polishing area as a non-under-polishing polishing surface;

[0133] Monitoring the forming quality of the non-under-polishing polishing surface, and evaluating the polishing quality according to the monitoring result;

[0134] Specifically as follows:

[0135] Obtaining the real-time polishing thickness corresponding to each area feature point in the non-under-polishing polishing surface, calculating the difference between the real-time polishing thickness and the preset polishing thickness corresponding to each area feature point, taking the absolute value of the obtained difference to obtain the polishing thickness deviation corresponding to each area feature point, calculating the ratio of the polishing thickness deviation corresponding to each area feature point to the preset polishing thickness to obtain a plurality of polishing actual deviation degrees, and calculating the average of the obtained plurality of polishing actual deviation degrees to obtain the overall polishing deviation degree;

[0136] Calculating the difference between the polishing actual deviation degrees of any two area feature points in an adjacent state to obtain a polishing deviation degree difference, calculating the average of the polishing actual deviation degrees corresponding to any two area feature points in an adjacent state to obtain an adjacent average deviation degree, calculating the ratio of the polishing deviation degree difference to the adjacent average deviation degree to obtain a plurality of adjacent polishing error ratios, and calculating the average of the obtained plurality of adjacent polishing error ratios to obtain a regional polishing deviation;

[0137] The overall polishing deviation degree and the regional polishing deviation degree are calculated to obtain a forming quality evaluation coefficient corresponding to the non-under-polishing polishing surface;

[0138] The forming quality evaluation coefficient corresponding to the non-under-polishing polishing surface is calculated, and the specific formula is as follows:

[0139] ;

[0140] Wherein, Cpg is the forming quality evaluation coefficient corresponding to the non-under-polishing polishing surface, Zpc is the overall polishing deviation degree, and Qpc is the regional polishing deviation degree;

[0141] The forming quality evaluation preset interval is obtained, if the forming quality evaluation coefficient is in the forming quality evaluation preset interval, the forming and polishing of the non-etch-polished polishing surface is qualified, and if the forming quality evaluation coefficient is not in the forming quality evaluation preset interval, the forming and polishing of the non-etch-polished polishing surface is unqualified.

[0142] It should be noted here that:

[0143] In the present application, the historical polishing log corresponding to the polishing equipment is obtained, the non-etch-polished polishing surface with unqualified forming and polishing is obtained according to the historical polishing log, a plurality of unqualified historical polishing surfaces are obtained, the forming quality evaluation coefficient corresponding to each unqualified historical polishing surface is obtained, and the plurality of forming quality evaluation coefficients obtained are numerically compared, the forming quality evaluation coefficient with the maximum value is set as the upper limit of the forming quality evaluation preset interval, and the forming quality evaluation coefficient with the minimum value is set as the lower limit of the forming quality evaluation preset interval, thereby obtaining the forming quality evaluation preset interval.

[0144] In the present application, the forming and polishing of the non-etch-polished polishing surface qualified here includes the case that the forming quality evaluation coefficient is at the boundary of the forming quality evaluation preset interval. Embodiment

[0145] Please refer to Figure 2 , based on another concept of the same invention, it is proposed to include the following steps:

[0146] Step S1: laser reflection analysis is performed on the regional feature points in the target polishing surface, the real-time polishing thickness corresponding to each regional feature point is obtained according to the analysis result, and the under-etch feature points are screened according to the real-time polishing thickness, thereby obtaining the real-time collection data of the polishing surface;

[0147] The step S1 further includes the following steps:

[0148] The workpiece being polished is obtained, thereby obtaining a target workpiece, the workpiece surface of the target workpiece that needs to be polished is obtained, thereby obtaining a plurality of workpiece polishing surfaces, and a target polishing surface is arbitrarily selected from the plurality of workpiece polishing surfaces;

[0149] In the target polishing surface, the working surface region not covered by the polishing head is obtained, thereby obtaining a polishing thickness real-time monitoring region, the polishing thickness real-time monitoring region is divided into a plurality of regional feature points, and a sample regional feature point is arbitrarily selected from the plurality of regional feature points;

[0150] The sample regional feature point is analyzed for polishing position, and the real-time polishing thickness corresponding to the sample regional feature point is obtained according to the analysis;

[0151] In the process of polishing thickness monitoring of the target polishing surface, a historical time point is randomly selected in a historical period in which the sample region feature point is not polished to obtain a first feature time point, and a time point corresponding to the current time is set as a second feature time point;

[0152] The laser emission distance of the sample region feature point at the first feature time point is analyzed, and the first time laser emission distance is obtained according to the analysis result;

[0153] Specifically as follows:

[0154] A laser emission and entry plane perpendicular to the ground is arranged in front of the sample region feature point, the time value of emitting the target laser beam from the laser emission and entry plane to the sample region feature point is set as a first laser emission time value, the laser emission and entry plane receives the laser beam reflected by the sample region feature point, and the first laser receiving time value is obtained by acquiring the receiving time value;

[0155] The propagation speed of the target laser beam in the polishing environment is obtained to obtain the actual laser propagation speed;

[0156] The first laser emission time value, the first laser receiving time value and the actual laser propagation speed are calculated to obtain the first time laser emission distance;

[0157] The first time laser emission distance is calculated, and the specific formula is as follows:

[0158] ;

[0159] Wherein, Fjl1 is the first time laser emission distance, Jt1 is the first laser receiving time value, Ft1 is the first laser emission time value, and Vcb is the actual laser propagation speed;

[0160] The laser emission distance of the sample region feature point at the second feature time point is analyzed, and the second time laser emission distance is obtained according to the analysis result;

[0161] Specifically as follows:

[0162] A laser emission and entry plane perpendicular to the ground is arranged in front of the sample region feature point, the time value of emitting the target laser beam from the laser emission and entry plane to the sample region feature point is set as a second laser emission time value, the laser emission and entry plane receives the laser beam reflected by the sample region feature point, and the second laser receiving time value is obtained by acquiring the receiving time value;

[0163] The propagation speed of the target laser beam in the polishing environment is obtained to obtain the actual laser propagation speed;

[0164] The second laser emission time value, the second laser receiving time value and the actual laser propagation speed are used to calculate the second laser emission distance;

[0165] The second laser emission distance is calculated according to the following formula:

[0166] ;

[0167] Wherein, Fjl2 is the second laser emission distance, Jt2 is the second laser receiving time value, Ft2 is the second laser emission time value, Vcb is the actual laser propagation speed;

[0168] In the space region where the target polishing surface is located, a plane perpendicular to the laser in-out plane is drawn through the ground to obtain a polishing thickness projection plane, a projection point of the target laser beam emission point on the polishing thickness projection plane is obtained to obtain a laser emission projection point, and a projection point of the sample region feature point on the polishing thickness projection plane is obtained to obtain a region feature projection point;

[0169] In the polishing thickness projection plane, a first laser path connecting line is obtained by drawing a line connecting the laser emission projection point and the region feature projection point, a polishing extension distance is obtained by calculating the difference between the second laser emission distance and the first laser emission distance, and a laser path extension point is obtained by drawing an extension line of the first laser path connecting line through the region feature projection point, the end point of the extension line when the extension distance reaches the polishing extension distance is set as the laser path extension point, and a second laser path connecting line is obtained by setting a line connecting the region feature projection point and the laser path extension point as the second laser path connecting line;

[0170] In the polishing thickness projection plane, a first polishing feature line is obtained by drawing a perpendicular line through the laser path extension point and the ground, a line perpendicular to the first polishing feature line is drawn through the region feature projection point, and an intersection point of the line and the first polishing feature line is set as an updated polishing position point, and a polishing thickness marking line is obtained by setting a line connecting the region feature projection point and the updated polishing position point as the polishing thickness marking line;

[0171] In the thickness feature triangle, a polishing feature angle value is obtained by acquiring an angle value of the incidence of the target laser beam at the region feature projection point, and a real-time polishing thickness corresponding to the sample region feature point is obtained by calculating the polishing feature angle value and the polishing extension distance;

[0172] The real-time polishing thickness corresponding to the sample region feature point is calculated according to the following formula:

[0173] ;

[0174] Wherein, Psh is the real-time polishing thickness corresponding to the sample region feature point, Ycj is the polishing feature angle value, and a is the polishing feature angle value.

[0175] The acquisition process of the real-time polishing thickness corresponding to the sample area feature points is repeated to acquire the real-time polishing thickness corresponding to each area feature point respectively;

[0176] The target polishing thickness corresponding to the target polishing surface is acquired, the area feature points with a real-time polishing thickness less than the target polishing thickness are set as under-polishing feature points, and polishing surface real-time collection data is obtained;

[0177] It should be noted here that:

[0178] Step S1 analyzes the area feature points of the polishing surface by the laser reflection principle, can acquire the polishing thickness data of each area feature point in real time, and accurately selects the under-polishing feature points based on these data, realizes the dynamic identification of potential quality defects in the polishing plane, provides key data support for the control system, and the traditional fixed trajectory polishing is difficult to find the problem of local polishing deficiency due to the lack of real-time feedback. This step actively perceives the surface topography change, so that the control system can adjust the parameters or path according to the actual processing state, thereby significantly improving the control accuracy of the multi-surface polishing forming system. This closed-loop control mode based on real-time data not only avoids the risk of rework or scrap caused by under-polishing, but also provides technical support for high-consistency processing of complex curved surfaces and special-shaped workpieces, and finally improves the stability and reliability of product surface quality.

[0179] Step S2: According to the polishing surface real-time collection data, the under-polishing feature points are analyzed for regional aggregation, the target polishing surface is divided into under-polishing regions according to the analysis result, and polishing region division data is obtained;

[0180] The step S2 further includes the following steps:

[0181] The polishing surface real-time collection data is acquired, the under-polishing feature points in the target polishing surface are acquired according to the polishing surface real-time collection data, the target polishing surface is imaged, the target polishing surface image is obtained, the under-polishing feature points are marked in the target polishing surface image, and the target polishing surface marked image is obtained;

[0182] The target polishing surface marked image is analyzed for under-polishing feature point aggregation, the under-polishing region is spatially divided according to the analysis result, and the polishing region division data is obtained according to the division result;

[0183] Specifically as follows:

[0184] Euclidean distance of any two under-polish feature points in the target polishing surface mark image is obtained, and a Euclidean distance connection interval is set, if the Euclidean distance between any two under-polish feature points is in the Euclidean distance connection interval, the two corresponding under-polish feature points are connected as a feature edge, a plurality of under-polish feature edges are obtained, and a plurality of quasi-under-polish regions surrounded by the under-polish feature edges are obtained;

[0185] It should be noted here that:

[0186] In the present application, the Euclidean distance is in the Euclidean distance connection interval, and the two corresponding under-polish feature points are connected as a feature edge. The Euclidean distance involved here is in the Euclidean distance connection interval, including the case of being at the boundary of the interval.

[0187] Any sample quasi-under-polish region is selected from the obtained plurality of quasi-under-polish regions, and feature point aggregation analysis is performed on the sample quasi-under-polish region, and region screening data corresponding to the sample quasi-under-polish region is obtained according to the analysis result;

[0188] The area value of the sample region is obtained, if the sample region area value is less than the under-polish region preset area value, the sample quasi-under-polish region is ignored, if the sample region area value is greater than or equal to the under-polish region preset area value, the feature point analysis is performed on the sample quasi-under-polish region;

[0189] Specifically as follows:

[0190] The minimum concave polygon containing the sample quasi-under-polish region is obtained using a graph algorithm, the number of region feature points covered by the minimum concave polygon is counted to obtain a first feature point number value, the number of under-polish feature points covered by the minimum concave polygon is counted to obtain a second feature point number value, the ratio of the second feature point number value to the first feature point number value is calculated to obtain a region under-polish point proportion corresponding to the sample quasi-under-polish region, a region under-polish point proportion reference interval is set, if the region under-polish point proportion is in the region under-polish point proportion reference interval, the sample quasi-under-polish region is directly divided into an under-polish region, if the region under-polish point proportion is not in the region under-polish point proportion reference interval, the sample quasi-under-polish region is repeatedly divided into a plurality of quasi-under-polish regions, and feature analysis is performed on each quasi-under-polish region until the area value of the quasi-under-polish region is less than the under-polish region preset area value, and the obtained under-polish region is set as the region screening data corresponding to the sample quasi-under-polish region;

[0191] The process of obtaining the region screening data corresponding to the sample quasi-under-polish region is repeated, and the region screening data corresponding to each quasi-under-polish region is obtained respectively to obtain polishing region division data;

[0192] It should be noted here that:

[0193] The step S2 synchronously detects the under-polishing points of the non-covered area of the polishing head during the polishing operation, and quickly locates the under-polishing area through the cluster analysis, so as to realize the dynamic monitoring and compensation of the processing blind area. In the traditional polishing process, the non-covered area often becomes a quality hidden trouble due to the lack of real-time detection, which leads to additional polishing or manual intervention in the subsequent process, thereby affecting the efficiency and cost.

[0194] This step adjusts the polishing head track in real time, so that the equipment can actively supplement the polishing of the under-polishing area, avoiding the limitation of the fixed path. This integrated design of "detection-compensation" not only shortens the overall processing cycle, but also reduces the overall quality fluctuation caused by local defects, thereby ensuring the uniformity of the workpiece surface topography. At the same time, the real-time track adjustment function enhances the adaptability of the system to complex workpiece geometric characteristics, thereby providing key technical support for high-precision and high-efficiency automatic polishing.

[0195] Step S3: polishing control is performed on the target polishing surface according to the polishing area division data, and the forming quality of the target polishing surface after polishing is monitored and the polishing quality is evaluated;

[0196] In the step S3, the following steps are further included:

[0197] The polishing area division data is obtained, each under-polishing area in the target polishing surface is obtained according to the polishing area division data, and the polishing head is automatically controlled to polish each under-polishing area in the target polishing surface until there is no under-polishing area in the target polishing surface, and the target polishing surface without the under-polishing area is set as a non-under-polishing polishing surface;

[0198] The non-under-polishing polishing surface is monitored for forming quality, and the polishing quality is evaluated according to the monitoring result;

[0199] Specifically as follows:

[0200] The real-time polishing thickness corresponding to each region feature point in the non-under-polishing polishing surface is obtained, the difference between the real-time polishing thickness and the preset polishing thickness corresponding to each region feature point is calculated, and the absolute value of the obtained difference is taken to obtain the polishing thickness deviation corresponding to each region feature point, the ratio of the polishing thickness deviation corresponding to each region feature point to the preset polishing thickness is calculated, and a plurality of polishing actual deviation degrees are obtained, and the average of the plurality of polishing actual deviation degrees is calculated to obtain the overall polishing deviation degree;

[0201] The polishing actual deviation degrees of the two region feature points in the adjacent state are calculated to obtain a polishing deviation degree difference value, the polishing actual deviation degrees corresponding to the two region feature points in the adjacent state are calculated by using an average number to obtain an adjacent average deviation degree, a ratio of the polishing deviation degree difference value and the adjacent average deviation degree is calculated to obtain a plurality of adjacent polishing error ratios, and the plurality of adjacent polishing error ratios are calculated by using an average number to obtain a region polishing deviation;

[0202] The overall polishing deviation degree and the region polishing deviation degree are calculated to obtain a molding quality evaluation coefficient corresponding to the non-throwaway polishing surface;

[0203] The molding quality evaluation coefficient corresponding to the non-throwaway polishing surface is calculated, and the specific formula is as follows:

[0204]

[0205] Wherein, Cpg is the molding quality evaluation coefficient corresponding to the non-throwaway polishing surface, Zpc is the overall polishing deviation degree, and Qpc is the region polishing deviation degree.

[0206] A molding quality evaluation preset interval is obtained, if the molding quality evaluation coefficient is in the molding quality evaluation preset interval, the non-throwaway polishing surface is evaluated as qualified in molding and polishing, and if the molding quality evaluation coefficient is not in the molding quality evaluation preset interval, the non-throwaway polishing surface is evaluated as unqualified in molding and polishing.

[0207] The above disclosed preferred embodiments of the present application are only used to help explain the present application. The preferred embodiments do not describe all the details, nor limit the present application to the specific embodiments. Obviously, according to the content of the present application, many modifications and changes can be made. The present application selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can well understand and utilize the present application. The present application is limited by the claims and their entire scope and equivalents.​

Claims

1. A multi-faceted polishing forming control system, characterized by, The application relates to a polishing quality monitoring and evaluation method and device. The method comprises the following steps: A data acquisition module: laser reflection analysis is performed on regional feature points in a target polishing surface, real-time polishing thickness corresponding to the regional feature points is obtained according to the analysis result, and under-polishing feature points are screened according to the real-time polishing thickness, so that polishing surface real-time acquisition data are obtained; A regional identification module: regional aggregation analysis is performed on the under-polishing feature points according to the polishing surface real-time acquisition data, under-polishing region division of the target polishing surface is performed according to the analysis result, and polishing region division data are obtained; A polishing control module: polishing control is performed on the target polishing surface according to the polishing region division data, and forming quality monitoring and polishing quality evaluation are performed on the target polishing surface; The polishing surface real-time acquisition data are obtained as follows: A target polishing surface is obtained by acquiring a workpiece polishing surface that is being polished; A polishing thickness real-time monitoring region is obtained by acquiring an un-covered work surface region of a polishing head in the target polishing surface, and a sample regional feature point is randomly selected in the polishing thickness real-time monitoring region; Polishing position analysis is performed on the sample regional feature point, and real-time polishing thickness corresponding to the sample regional feature point is obtained according to the analysis; A first feature time point is obtained by randomly selecting a historical time point in a historical period in which the sample regional feature point is not polished, and a second feature time point corresponding to the current time is set; Laser emission distance analysis is performed on the sample regional feature point at the first feature time point, and a first-time laser emission distance is obtained according to the analysis result; Laser emission distance analysis is performed on the sample regional feature point at the second feature time point, and a second-time laser emission distance is obtained according to the analysis result; Polishing thickness monitoring is performed on the sample regional feature point according to the first-time laser emission distance and the second-time laser emission distance, real-time polishing thickness corresponding to the sample regional feature point is obtained according to the monitoring result, and real-time polishing thickness corresponding to each regional feature point is obtained; Target polishing thickness corresponding to the target polishing surface is obtained, and the regional feature points with real-time polishing thickness smaller than the target polishing thickness are set as under-polishing feature points, so that the polishing surface real-time acquisition data are obtained; The first-time laser emission distance is obtained as follows: A laser emission and entry plane perpendicular to the ground is set at the sample regional feature point, a first laser emission time value is obtained by acquiring the time value of the target laser beam emitted from the laser emission and entry plane to the sample regional feature point, the laser emission and entry plane receives the laser beam reflected from the sample regional feature point, and a first laser receiving time value is obtained by acquiring the receiving time value; The propagation speed of the target laser beam in a polishing environment is obtained, and the actual laser propagation speed is obtained; The first-time laser emission distance is obtained by calculating the first laser emission time value, the first laser receiving time value and the actual laser propagation speed; The real-time polishing thickness is obtained as follows: In the space region where the target polishing surface is located, a plane perpendicular to the laser in-out plane is made to pass the ground, to obtain a polishing thickness projection plane, to obtain a projection point of the target laser beam emission point on the polishing thickness projection plane, to obtain a laser emission projection point, to obtain a projection point of the sample area feature point on the polishing thickness projection plane, to obtain an area feature projection point; In the polishing thickness projection plane, a first laser path connecting line is obtained by connecting the laser emission projection point and the area feature projection point, a polishing extension distance is obtained by calculating the difference between the laser emission distance at the second time and the laser emission distance at the first time, and a laser path extension point is obtained by making an extension line of the first laser path connecting line through the area feature projection point, and the connecting line between the area feature projection point and the laser path extension point is set as a second laser path connecting line; In the polishing thickness projection plane, a first polishing feature line is obtained by making a vertical line through the laser path extension point and the ground, a straight line perpendicular to the first polishing feature line is made through the area feature projection point, an intersection point of the obtained straight line and the first polishing feature line is set as an updated polishing position point, and a polishing thickness marking line is set as the connecting line between the area feature projection point and the updated polishing position point. In the thickness feature triangle, an angle value of the target laser beam incident at the area feature projection point is obtained, to obtain a polishing feature angle value, and the polishing feature angle value and the polishing extension distance are calculated to obtain a real-time polishing thickness corresponding to the sample area feature point.

2. A multi-faceted polishing and forming control system according to claim 1, wherein, The polishing area division data is obtained as follows: The polishing surface real-time collection data is obtained, the target polishing surface is imaged to obtain a target polishing surface image, the under-polishing feature points in the target polishing surface are obtained, and the under-polishing feature points in the target polishing surface image are marked to obtain a target polishing surface marked image; The Euclidean distance between any two under-polishing feature points in the target polishing surface marked image is obtained, and a Euclidean distance connection interval is set, if the Euclidean distance between any two under-polishing feature points is in the Euclidean distance connection interval, the two under-polishing feature points corresponding to the two under-polishing feature points are connected as a feature edge, a plurality of under-polishing feature edges are obtained, and a plurality of quasi-under-polishing regions are obtained by obtaining the closed region surrounded by the under-polishing feature edges. Any one of the plurality of quasi-under-polishing regions is selected as a sample quasi-under-polishing region, and the sample quasi-under-polishing region is analyzed for feature point aggregation, the region screening data corresponding to the sample quasi-under-polishing region is obtained according to the analysis result, the region screening data corresponding to each quasi-under-polishing region is obtained, and the polishing area division data is obtained.

3. A multi-faceted polishing and forming control system according to claim 2, wherein, The sample quasi-under-polishing region is analyzed for feature points as follows: The area value of the sample quasi-under-polishing region is obtained, and the sample area area value is obtained. If the sample area area value is less than the under-polishing region preset area value, the sample quasi-under-polishing region is ignored. If the sample area area value is greater than or equal to the under-polishing region preset area value, the sample quasi-under-polishing region is analyzed for feature points.

4. A multi-faceted polishing and forming control system according to claim 3, wherein, The region screening data is obtained as follows: The minimum concave polygon containing the sample quasi-underpolished area is obtained, the number of feature points covered by the minimum concave polygon is counted to obtain a first feature point number value, the number of underpolished feature points covered by the minimum concave polygon is counted to obtain a second feature point number value, the ratio of the second feature point number value to the first feature point number value is calculated to obtain the area underpolished point proportion corresponding to the sample quasi-underpolished area; A region underpolished point proportion benchmark interval is set, if the region underpolished point proportion is in the region underpolished point proportion benchmark interval, the sample quasi-underpolished area is divided into an underpolished area, if the region underpolished point proportion is not in the region underpolished point proportion benchmark interval, the sample quasi-underpolished area is repeatedly divided into a plurality of quasi-underpolished areas, and feature analysis is performed on each quasi-underpolished area until the area value of each quasi-underpolished area is less than the underpolished area preset area value, and the obtained underpolished area is set as the region screening data corresponding to the sample quasi-underpolished area.

5. The multi-faceted polishing and molding control system of claim 1, wherein, The target polishing surface is polished, specifically as follows: The polishing area division data is obtained, each underpolished area in the target polishing surface is obtained according to the polishing area division data, and the polishing head is automatically controlled to polish each underpolished area in the target polishing surface until there is no underpolished area in the target polishing surface, and the target polishing surface without underpolished area is set as a non-underpolished polishing surface; The non-underpolished polishing surface is monitored for forming quality, and the polishing quality is evaluated according to the monitoring result.

6. A multi-faceted polishing and forming control system according to claim 5, wherein, The non-underpolished polishing surface is monitored for forming quality, specifically as follows: The real-time polishing thickness corresponding to each region feature point in the non-underpolished polishing surface is obtained, the preset polishing thickness corresponding to each region feature point is calculated, the difference between the real-time polishing thickness and the preset polishing thickness is obtained, and the absolute value of the difference is taken to obtain the polishing thickness deviation corresponding to each region feature point, the ratio of the polishing thickness deviation corresponding to each region feature point to the preset polishing thickness is calculated to obtain a plurality of polishing actual deviation degrees, and the average of the plurality of polishing actual deviation degrees is calculated to obtain a total polishing deviation degree; The polishing actual deviation degree difference value is calculated by calculating the difference between any two region feature points in an adjacent state to obtain a polishing deviation degree difference value, the average of the polishing actual deviation degrees corresponding to any two region feature points in an adjacent state is calculated to obtain an adjacent average deviation degree, the ratio of the polishing deviation degree difference value to the adjacent average deviation degree is calculated to obtain a plurality of adjacent polishing error ratios, and the average of the plurality of adjacent polishing error ratios is calculated to obtain a region polishing deviation; The total polishing deviation degree and the region polishing deviation degree are calculated to obtain a forming quality evaluation coefficient corresponding to the non-underpolished polishing surface; A forming quality evaluation preset interval is obtained, if the forming quality evaluation coefficient is in the forming quality evaluation preset interval, the non-underpolished polishing surface is evaluated as forming and polishing qualified, and if the forming quality evaluation coefficient is not in the forming quality evaluation preset interval, the non-underpolished polishing surface is evaluated as forming and polishing unqualified.

7. A method for controlling a multi-faceted polishing forming system as claimed in any one of claims 1 to 6, characterized by, The control method comprises the following steps: Step S1: laser reflection analysis is performed on the regional feature points in the target polishing surface, real-time polishing thickness corresponding to each regional feature point is obtained according to the analysis result, and the regional feature points are screened for under-polishing feature points according to the real-time polishing thickness, to obtain polishing surface real-time collection data; Step S2: the under-polishing feature points are analyzed for regional aggregation according to the polishing surface real-time collection data, the target polishing surface is divided into under-polishing regions according to the analysis result, to obtain polishing region division data; Step S3: the target polishing surface is controlled for polishing according to the polishing region division data, and the finished target polishing surface is monitored for forming quality and evaluated for polishing quality.

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