Manufacturing method of FMM and FMM manufactured by manufacturing method

Abstract

A method for manufacturing an FMM according to the present invention comprises: a step (a) for plating an invar alloy sheet on an object by electroplating; (b) arranging invar alloy sheets on one surface of a carrier film and attaching the invar alloy sheets; (c) forming a divided photoresist on the upper surface of the invar alloy sheet, etching the upper surface portion of the invar alloy sheet with an etching solution, and forming a first etched portion at the divided portion; (d) forming hole plugging ink on the upper surface of the invar alloy sheet to plug the first etching part; (e) turning over the invar alloy sheet in the vertical direction, and forming a photoresist on the upper surface of the invar alloy sheet; and a step (f) in which the upper surface of the invar alloy sheet is etched with an etching solution, a second etched portion is formed at the division portion, the lower portion of the second etched portion is in contact with the first etched portion to form a pattern hole, and steps (c) to (f) are continuously performed in a roll-to-roll manner in a state in which the invar alloy sheet is aligned on the upper portion of the carrier film and attached thereto.

Description

Technical Field

[0001] This invention relates to a method for manufacturing FMMs and FMMs manufactured by the method, and more specifically to a method for manufacturing FMMs by arranging and attaching Invar alloy raw materials manufactured by electroplating onto a carrier film, and then etching the Invar alloy raw materials to produce multiple FMMs in a roll-to-roll manner, thereby achieving uniform thickness, wide manufacturing width, and low coefficient of thermal expansion while simplifying the FMM manufacturing process and improving mass production efficiency. Background Technology

[0002] Organic light-emitting diodes (OLEDs) are thin-film light-emitting diodes (LEDs) formed from a film of organic compounds whose light-emitting layer emits light in response to electric current. Conventional OLED display devices are display devices that use fluorescent or phosphorescent organic compounds electrically connected to emit light, and can drive N×M organic light-emitting units to display images.

[0003] This organic light-emitting unit is formed by an anode (ITO), an organic thin film, and a cathode (metal). The organic thin film is formed by a multilayer structure including an emitting layer (EML), an electron transport layer (ETL), and a hole transport layer (HTL) to improve the balance of electrons and holes and increase luminous efficiency. It may also include an additional electron injecting layer (EIL) and a hole injecting layer (HIL).

[0004] In this type of organic electroluminescent device, in order to achieve full color, the red (R), green (G), and blue (B) light-emitting layers need to be patterned separately. To pattern these light-emitting layers, a high-precision metal mask (FMM) is used.

[0005] High-precision metal mask templates mainly consider thermal expansion and other factors, and use Invar alloy (a steel-nickel alloy).

[0006] The typical production method for Invar alloys (36% Ni-64% Fe) or super Invar alloys (32% Ni-63% Fe-5% Co) used to manufacture high-precision metal photomasks is cold rolling. However, to obtain thin sheets with a thickness of less than 50 μm by cold rolling, multi-stage rolling processes are required, resulting in a long and complex process with high manufacturing costs. Furthermore, the width of rolled Invar alloy sheets with a thickness of 20–25 μm produced by cold rolling is limited to a maximum of 250 mm, making them difficult to use as materials for large-area processes.

[0007] These issues have led to increased manufacturing costs for OLED display devices with a thickness of less than 25μm, and decreased process yields in the manufacture of large-area OLED display devices, resulting in higher costs and making display technology development more difficult.

[0008] Therefore, a method for manufacturing high-precision metal mask templates using Invar alloys by electroplating a base material with a mask pattern formed on one side is currently being developed.

[0009] The conventional high-precision metal mask manufacturing method using this electroplating method is composed of the following: an anode electrode plate and a base material serving as a cathode are arranged in a parallel and opposite manner inside the electroplating tank. After the electroplating solution (electrolyte) is supplied to the inside of the electroplating tank, an anode power supply and a cathode power supply are connected to the anode electrode plate and the base material respectively, and a current is applied to them to form a coating (Invar alloy) on one side of the base material.

[0010] However, high-precision metal mask templates manufactured by electroplating are made of Invar alloy using additional Invar alloy sheets, which makes them unsuitable for mass production of FMMs, ultimately leading to reduced batch production rates in FMM manufacturing. Summary of the Invention

[0011] The problem to be solved

[0012] The present invention is proposed to solve the problems mentioned above. Its purpose is to provide an FMM manufacturing method that aligns Invar alloy raw materials manufactured by electroplating onto a carrier film and attaches them, and then uses an etching process on the Invar alloy raw materials to produce multiple FMMs in a roll-to-roll manner, thereby achieving uniform thickness, wide manufacturing width, and low coefficient of thermal expansion while simplifying the FMM manufacturing process and improving mass production efficiency, as well as the FMMs manufactured by the present invention.

[0013] Solution to the problem

[0014] According to the present invention, a method for manufacturing an FMM is provided, characterized by comprising: step (a) electroplating an Invar alloy sheet onto an object by electroplating; step (b) arranging and attaching the Invar alloy sheets to one side of a carrier film; step (c) forming a segmented photoresist on the upper surface of the Invar alloy sheets disposed on the upper part of the carrier film, and etching the upper surface portion of the Invar alloy sheets using an etching solution to form a first etched portion in the form of an arc groove; and step (d) forming a plugging ink on the upper surface of the Invar alloy sheets to plug the first etched portion in the groove shape. Step (e) involves flipping an Invar alloy sheet with a hole-filling ink formed on its upper surface and a carrier film attached to its lower surface in the vertical direction, and forming a segmented photoresist on the upper surface of the Invar alloy sheet; and step (f) involves etching the upper surface of the Invar alloy sheet using an etching solution to form a second etched portion in the segmented portion in the form of an arc groove, wherein the lower part of the second etched portion contacts the first etched portion to form a through-shaped patterned hole, and the above steps (c) to (f) are performed continuously in a roll-to-roll manner while the Invar alloy sheet is arranged on the upper surface of the carrier film and attached.

[0015] Preferably, the present invention is characterized in that, in step (b) above, two or more rows of Invar alloy sheets attached to one side of the carrier film are attached side by side along the length of the carrier film.

[0016] Preferably, the present invention is characterized in that the etching process is controlled such that the horizontal width of the first etched portion constituting the front face of the FMM is narrower than the second etched portion constituting the rear face of the FMM.

[0017] On the other hand, according to another embodiment of the present invention, an FMM is provided, which is manufactured by the manufacturing method of the FMM according to any of the features described above, characterized in that it comprises: an Invar alloy sheet formed by electroplating; and a plurality of patterned holes that are in contact with a first etched portion formed on the front surface of the Invar alloy sheet and a second etched portion formed on the rear surface of the Invar alloy sheet and are in a through shape.

[0018] Preferably, the horizontal width of the first etched portion constituting the front face of the FMM is narrower than that of the second etched portion constituting the rear face of the FMM, and is formed obliquely by the inner side of the patterned hole where they are joined.

[0019] The effects of the invention

[0020] According to the present invention, the following effects can be obtained: after the Invar alloy raw material manufactured by electroplating is arranged on a carrier film and attached, multiple FMMs are produced in a roll-to-roll manner by etching the Invar alloy raw material, which satisfies the requirements of uniform thickness, wide manufacturing range and low coefficient of thermal expansion, while simplifying the manufacturing process of FMM and improving the mass production rate. Attached Figure Description

[0021] Figure 1 This is a diagram illustrating a method for manufacturing an OLED using an FMM according to the prior art.

[0022] Figure 2 This is a structural diagram of an electroplating apparatus according to an embodiment of the present invention.

[0023] Figure 3 This diagram illustrates the carrier film adhesion process of the Invar alloy sheet according to an embodiment of the present invention.

[0024] Figure 4 This is a diagram illustrating the roll-to-roll FMM manufacturing process according to an embodiment of the present invention.

[0025] Figure 5 This is a diagram illustrating the etching process according to an embodiment of the present invention.

[0026] Description of Reference Signs

[0027] 30: FMM 61: First Roll

[0028] 62: Second roller; 63: Vacuum suction cup Detailed Implementation

[0029] This invention can be modified in various ways and may have multiple embodiments. Specific embodiments are illustrated in the figures and described in detail in the specific description. However, it should be understood that this invention is not limited to the specific implementation, but includes all modifications, equivalent technical solutions, and even alternative technical solutions contained within the concept and technical scope of this invention. In the description of the various figures, similar reference numerals are used for similar structural elements.

[0030] The terms "first," "second," "A," and "B," etc., can be used to describe various structural elements, but the aforementioned structural elements are not limited to these terms. These terms are used only for the purpose of distinguishing one structural element from another. For example, without departing from the scope of the invention, a first structural element may be named a second structural element, and similarly, a second structural element may be named a first structural element. And / or this term includes a combination of multiple related descriptions or any one of multiple related descriptions.

[0031] When it is mentioned that a structural element is "connected" or "linked" to another structural element, it should be understood that it can be directly connected or linked to that other structural element, but there may also be other structural elements in between. Conversely, when it is mentioned that a structural element is "directly connected" or "directly linked" to another structural element, it should be understood that there are no other structural elements in between.

[0032] The terminology used in this application is for illustrative purposes only and does not limit the invention. Singular expressions include plural expressions unless the context clearly distinguishes them. In this application, it should be understood that terms such as "comprising" or "having" are used to specify the presence of features, numbers, steps, actions, structural elements, components, or combinations thereof described in the specification, without precluding the presence or additional possibilities of one or more other features or numbers, steps, actions, structural elements, components, or combinations thereof.

[0033] Unless otherwise defined, all terms used herein, including technical or scientific terms, shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Terms as defined in commonly used dictionaries shall be interpreted as having a meaning consistent with the context of the relevant art, and shall not be construed as having an ideal or overly formal meaning unless expressly defined herein.

[0034] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0035] Figure 1 This is a diagram illustrating a method for manufacturing an OLED using an FMM according to the prior art.

[0036] In the following figures relating to embodiments of the prior art and the present invention, for ease of understanding, the size or thickness of structural elements is indicated as excessively large (or thick) or excessively small (or thin), or is simplified, but should not be construed as limiting the scope of protection of the present invention thereto.

[0037] Reference Figure 1 An OLED manufacturing apparatus that realizes an OLED manufacturing method using an FMM according to the prior art includes: a magnet plate 10, housing a magnet 11 and equipped with a cooling water line 12; and a deposition source supply unit 40 that supplies an organic source 41 from the lower part of the magnet plate 10.

[0038] The object substrate 20, such as glass, on which the organic source 41 is deposited, can be positioned between the magnet plate 10 and the deposition source supply section 40. The FMM 30, on which the organic source 41 is deposited at different pixel levels, can be disposed on the object substrate 20 in a close or very close manner. The magnet 11 generates a magnetic field, and the attraction caused by the magnetic field allows the FMM 30 to be tightly adhered to the object substrate 20.

[0039] The aforementioned FMM30 needs to be aligned before being attached to the target substrate 20. One or more masks may be combined with the frame 35. The frame 35 is fixedly disposed within the OLED manufacturing apparatus, and the masks may be combined with the frame 35 through additional attachment and soldering processes.

[0040] The deposition source supply unit 40 can reciprocate left and right paths to supply organic material source 41. The organic material source 41 supplied in the deposition source supply unit 40 can be deposited on one side of the target substrate 20 through the patterned holes 32 formed in the FMM 30. The organic material source 41 deposited through the pattern of the FMM 30 can serve as a pixel 21 of the OLED.

[0041] To prevent uneven deposition of pixel 21 caused by the shadow effect, the pattern aperture 32 of the FMM 30 can be formed obliquely (S) [or tapered (S)]. The organic source 41 passing through the pattern aperture 32 along the oblique direction can also form pixel 21, so that the overall thickness of pixel 21 can be deposited uniformly.

[0042] Figure 1 The FMM30 can perform pixel deposition processes on large-area object substrates 20.

[0043] The manufacturing method of this FMM30 is described below.

[0044] Figure 2 This is a structural diagram of an electroplating apparatus according to an embodiment of the present invention.

[0045] Reference Figure 2 According to an embodiment of the present invention, the electroplating apparatus may include an electroplating solution supply unit 52, an electrolyte supply unit 53, and a gas supply unit 54, so that the electroplating unit 51 is movably disposed in a water tank unit 56 having a predetermined receiving space and an object I is disposed therein, and the object I is electroplated by supplying current from the power supply unit 55, and the electroplating solution, electrolyte, and inert gas for electroplating are supplied to the water tank unit 56 and the electroplating unit 51.

[0046] First, the aforementioned water tank portion 56 is formed with a defined internal receiving space, which contains the electroplating solution. The upper surface of this water tank portion 56 is open, allowing the object I to be inserted and pulled out horizontally, and has a height that allows the object I to be inserted as a whole.

[0047] The electroplating solution is an electrolyte and can be used as the material for the Invar alloy sheet 31 used as a mask. As one embodiment, when manufacturing an electroplated layer from an Invar alloy sheet that is an iron-nickel alloy, a mixture of solutions including Ni ions and Fe ions can be used as the electroplating solution. As another embodiment, when manufacturing an electroplated layer from a Super Invar alloy sheet that is an iron-nickel-cobalt alloy, a mixture of solutions including Ni ions, Fe ions, and Co ions can also be used as the electroplating solution. Invar alloy sheets and Super Invar alloy sheets can be used as fine metal masks (FMMs) and shadow masks in OLED manufacturing, accurately guiding the electron beam to the phosphor. Furthermore, because Invar alloy sheets or Super Invar alloy sheets have a very low coefficient of thermal expansion (CTE), there are few concerns about heat causing deformation of the mask pattern shape, making them primarily used in the manufacture of high-resolution OLEDs. Furthermore, the electroplating solution can be used without restriction to achieve the desired electroplating layer. In this specification, the manufacture of Invar alloy sheet 31 as an example will be used as the main example for illustration.

[0048] The electroplating solution supply unit 52 can supply electroplating solution to the electroplating unit 51.

[0049] The electroplating solution supply unit 52 has a storage space for storing electroplating solution inside. This electroplating solution supply unit 52 can supply and store electroplating solution from an external electroplating solution supply mechanism, and the electroplating solution stored in the storage space is supplied to the supply nozzle (not shown) of the electroplating unit 51 by a supply pump. Furthermore, the electroplating solution supply unit 52 is connected to the water tank unit 56, allowing the electroplating solution stored in the water tank unit 56 to flow back in and be stored again.

[0050] Finally, the electroplating solution supplied by the electroplating solution supply unit 52 to the supply nozzle of the electroplating unit 51 is sprayed onto the object I, and the electroplating solution that flows downwards through the object I by gravity is stored in the water tank unit 56 and then recycled back to the connected electroplating solution supply unit 52, thus circulating the electroplating solution as a whole. In this way, the electroplating solution supply unit 52 can recycle the electroplating solution because when the electroplating solution is supplied by the gas supply unit 54 (described later), an inert gas is introduced simultaneously to maintain a constant concentration of iron ions in the electroplating solution and suppress the formation of iron oxide in the electroplating solution.

[0051] At this time, the electroplating solution supply unit 52 may also include a filter or the like for removing impurities from the electroplating solution.

[0052] The electrolyte supply unit 53 can supply electrolyte solution to the electroplating unit 51.

[0053] The electrolyte supply unit 53 has a storage space for storing electrolyte solution inside. This electrolyte supply unit 53 can supply and store electrolyte solution from an external electrolyte solution supply mechanism, and the electrolyte solution stored in the storage space is supplied to the electroplating unit 51 by a supply pump. Furthermore, the electrolyte supply unit 53 is connected to the electroplating unit 51, allowing the electrolyte solution in the electroplating unit 51 to flow back in and be stored.

[0054] Ultimately, the electrolyte solution supplied to the electroplating unit 51 via the electrolyte supply unit 53 is recycled back to the connected electrolyte supply unit 53, thus circulating the electrolyte solution as a whole.

[0055] The gas supply unit 54 can supply inert gas to the electroplating unit 51.

[0056] The gas supply unit 54 has a storage space for storing inert gas inside. This gas supply unit 54 can supply and store inert gas from an external inert gas supply mechanism, and the inert gas stored in the storage space is supplied to the supply nozzle of the electroplating unit 51 by a supply pump.

[0057] Finally, the inert gas supplied to the supply nozzle of the electroplating section 51 through the gas supply section 54 is sprayed together with the supplied electroplating solution into the electroplating solution of the water tank section 56. During this process, the inert gas can maintain the supersaturated state of the gas in the electroplating solution, suppress the inflow of oxygen into the electroplating solution, maintain a constant concentration of iron ions in the electroplating solution, and ultimately suppress the formation of iron oxide in the electroplating solution.

[0058] In this case, N2 gas is preferred as the inert gas, but other inert gases with low reactivity and chemical stability can also be used. In particular, when N2 gas is used as the inert gas, compressed nitrogen at 120 kg / cm³ can be used. 2 It is filled with N2 gas at a pressure of over 99.99%.

[0059] This inert gas is sprayed onto the electroplating solution to help degas the hydrogen gas generated and attached to the cathode surface, maintain the nitrogen supersaturation state in the electroplating solution, and ultimately control the inflow of oxygen generated in the insoluble anode and the inflow of oxygen from the atmosphere, thus preventing the formation of iron oxide.

[0060] Dissolved oxygen is oxygen in the molecular state that dissolves in water or a solution, and is usually supplied by oxygen from the air. The amount of dissolved oxygen in water or a solution is affected by temperature and air pressure, and it has the characteristic that the higher the temperature of the solution, the lower the amount of dissolved oxygen.

[0061] The power supply unit 55 can supply current to the electroplating unit 51. The power supply unit 55 can form multiple channels, and the multiple channels can form four or more channels. Furthermore, the current value of each of the multiple channels of the power supply unit 55 can be controlled separately. Therefore, the power supply unit 55 can be designed with different anode sizes or the number of channels can be increased as needed to reduce electroplating deviations in the electroplating unit 51.

[0062] The electroplating section 51 described above can form an electroplated Invar alloy sheet 31 on one side of the high-precision metal mask substrate. The Invar alloy sheet 31 has a Ni eutectoid ratio of 36 to 38%, a low coefficient of thermal expansion, a uniform thickness of less than 25 μm (more precisely, 3 to 20 μm), and a manufacturing width of more than 120 mm (more precisely, 1250 to 3000 mm).

[0063] This electroplating unit 51 can be disposed inside the upper part of the water tank 56 and move horizontally along the water tank 56. Furthermore, the electroplating unit 51 can be electrically connected to the power supply unit 55 to supply current. Additionally, the electroplating unit 51 can be connected to the electroplating solution supply unit 52 and the gas supply unit 54 to supply electroplating solution and inert gas, and connected to the electrolyte supply unit 53 to supply electrolyte solution.

[0064] On the other hand, when the Invar alloy sheet 31, which is an iron-nickel alloy, is manufactured as an electroplating layer, the electroplating solution of the material that becomes the electroplating layer can be determined by the amount of additives added in the amount of a few to tens of ml, the large / small area of ​​the electroplated body, the electroplating thickness deviation between the via or through hole and the ground, and the aspect ratio.

[0065] Additives can be SPS, MPSA, DPS, and thiourea, etc., acting as accelerators (brighteners) of organic compounds; PEG, gelatin, collagen, etc., acting as suppressors (carriers) of polymeric organic compounds; and Janus Green B (JGB), PEI, HEC, etc., acting as levelers of compounds. Among these, sulfur compounds, which act as accelerators, can be readily decomposed by oxygen generated in the anode region during electroplating.

[0066] Among these requirements, a primary qualification for Invar alloy raw materials used in high-precision metal mask (FMM) applications is a low coefficient of thermal expansion (CTE). Furthermore, to obtain an Invar alloy with a low CTE through electroplating, the Ni content in the electroplating solution... 2+ Fe 2+ The coexistence ratio is very important.

[0067] Therefore, a specific ratio needs to be used as the ratio for Ni-Fe alloys, that is, the Ni content needs to be 36% to 38% to precipitate the Invar alloy from the substrate in the plating solution. In this way, to maintain the precipitation ratio at a specified level, it is necessary to constantly maintain and manage the Ni salt (Ni... 2+ ) and Fe salts (Fe 2+ )concentration.

[0068] The method for manufacturing FMM30 using the Invar alloy sheet 31 of object I electroplated in the electroplating apparatus by the above-described electroplating process will be described in detail below.

[0069] Figure 3 This diagram illustrates the carrier film adhesion process of the Invar alloy sheet according to an embodiment of the present invention.

[0070] Reference Figure 3 (a) The carrier film attachment process according to an embodiment of the present invention may include a first roller 61, a second roller 62 and a vacuum suction cup 63.

[0071] The aforementioned first roller 61 is positioned at the front of the process line, supporting a cylindrical roll, and according to the operation process, causing the carrier film 60 wound on the roll to rotate, loosen, and release it.

[0072] The carrier film 60 can be a silicon-based carrier film, and its surface bonding strength is preferably 10–20 gf / cm. 2 The range.

[0073] Furthermore, the second roller 62 rewinds the carrier film 60 released from the first roller 61 in a rolling manner.

[0074] A vacuum chuck 63 is disposed between the first roller 61 and the second roller 62.

[0075] The vacuum chuck 63 causes the Invar alloy sheets 31 produced in the electroplating apparatus to be arranged on one side of the carrier film 60 and attached.

[0076] The aforementioned vacuum chuck 63 adsorbs the object I, which is electroplated with Invar alloy sheet 31, onto the pad and moves it, transferring the Invar alloy sheet 31 formed on the object I onto one side of the carrier film 60 between the first roller 61 and the second roller 62.

[0077] Among them, the bonding strength of the Invar alloy sheet 31 formed on object I by electroplating is 2 to 5 gf / cm. 2 Therefore, the Invar alloy sheet 31 can be easily transferred onto surfaces with a bonding strength of 10–20 gf / cm. 2 60. Silicon-based carrier films within the range.

[0078] At this time, if Figure 3 As shown in (b), two or more rows of Invar alloy sheets 31 transferred to one side of the carrier film 60 can be attached side-by-side along the length of the carrier film 60. In this way, by arranging the Invar alloy sheets 31 attached side-by-side in multiple rows to a carrier film 60 and by performing a roll-to-roll etching process on the carrier film 60, high productivity can be achieved in the manufacture of the FMM 30.

[0079] Figure 4 This is a diagram illustrating the roll-to-roll FMM manufacturing process according to an embodiment of the present invention.

[0080] First, such as Figure 4 As shown in (a), with the Invar alloy sheet 31 and the carrier film 60, which are attached together as a result of the above-mentioned Invar alloy sheet carrier film attachment process, arranged vertically, a segmented photoresist 33 is formed on the upper surface of the upper Invar alloy sheet 31 by a photolithography process.

[0081] More specifically, a photosensitive photoresist 33 is attached to the upper surface of the Invar alloy sheet 31, and an exposure process is performed using a pattern mask. The photoresist 33 acts as a barrier film for the subsequent etching process, preventing light from contacting specific areas and defining the areas to be etched. Afterwards, a developing solution is sprayed to remove the unexposed photoresist 33 adhering to the areas to be etched. The photoresist 33 on the upper surface of the Invar alloy sheet 31 thus defines the areas to be etched on the Invar alloy sheet 31.

[0082] After that, as Figure 4 As shown in (b), the carrier film 60 is introduced into the etching equipment, and the etching solution is sprayed from the top. During this process, the photoresist 33 is removed, and the upper part of the exposed Invar alloy sheet 31 is etched using the etching solution, forming a first etched part E1 in the shape of an arc groove on the upper part of the Invar alloy sheet 31.

[0083] In the first etching process, the first etched portion E1 is not formed as a hole, but as a recessed arc groove.

[0084] To create the first etched portion E1 of this groove shape, a small amount of etchant is sprayed in this process. Compared to through-hole etching, the etching equipment can reduce the amount of etchant or the etchant spraying time to control the etching process.

[0085] The first etched portion E1 of this groove shape becomes the rear face of the subsequently completed FMM30, and is in contact with the target substrate 20 of the deposited organic source 41.

[0086] After that, as Figure 4As shown in (d), hole-filling ink 34 is formed on the upper surface of the Invar alloy sheet 31 on which the first etched portion E1 is formed.

[0087] The aforementioned plugging ink 34 plugs the first etched portion E1 of the groove shape, which can be formed on the upper surface of the Invar alloy sheet 31 by printing or coating.

[0088] After that, as Figure 4 As shown in (e), an Invar alloy sheet 31 with via-filling ink 34 formed on its upper surface and a carrier film 33 attached to its lower surface is flipped in the vertical direction. After removing the carrier film 33 on the upper surface, a photoresist 33 is formed on the upper surface of the Invar alloy sheet 31 using photolithography. That is, the photoresist 33 on the upper surface of the Invar alloy sheet 31 can define the areas of the Invar alloy sheet 31 that will be etched.

[0089] After that, as Figure 4 As shown in (f), the carrier film 60 is introduced into the etching equipment, and the etching solution is sprayed from the top. During this process, the photoresist 33 is removed, and the upper part of the exposed Invar alloy sheet 31 is etched using the etching solution, forming a second etched part E2 in the shape of an arc groove on the upper part of the Invar alloy sheet 31.

[0090] In this process, through a second etching, the lower part of the second etched portion E2 comes into contact with the first etched portion E1 to form a through-shaped patterned hole 32. The patterned hole 32 thus formed provides a path through which the organic source 41 supplied from the deposition source supply section 40 can pass.

[0091] In order to form a second etched region E2 with a larger groove shape than the first etched region E1, a larger amount of etching solution is sprayed in this process than in the first etched region E1. Compared with the process for forming the first etched region E1, the etching process for forming the second etched region E2 can be controlled by increasing the amount of etching solution or increasing the spraying time of the etching solution.

[0092] The second etched portion E2 of this groove shape becomes the front face of the subsequently completed FMM30, and becomes the portion that preferentially receives organic matter supplied from the deposition source supply section 40.

[0093] Basically, when depositing organic matter, the organic matter supplied from the deposition source supply section 40 passes through the patterned hole 32 in a bottom-up manner, where the organic matter rises from the bottom. Therefore, as mentioned above, the horizontal width of the first etched portion E1 is smaller than that of the second etched portion E2, allowing for smoother and more accurate deposition of the organic matter.

[0094] Subsequently, the photoresist 33 formed on the upper surface of the Invar alloy sheet 31 and the via-filling ink 34 formed on the lower surface are removed to form an FMM 30 with multiple patterned holes 32 (see reference). Figure 4 (g)

[0095] Figure 5 This is a diagram illustrating the etching process according to an embodiment of the present invention.

[0096] In the above description, the etching is divided into a first etching that forms the first etched portion E1 and a second etching that forms the second etched portion E2.

[0097] In contrast, the housing with a patterned hole 32 formed by a single etching process is shown in... Figure 5 In (a).

[0098] Due to the isotropic etching characteristics of wet etching, when a deeper pattern hole 32 is formed by etching once, the horizontal width of the etched area becomes wider, and the overall density of the pattern hole 32 becomes lower, which is ultimately not conducive to achieving high-resolution OLED.

[0099] Furthermore, after two isotropic etching operations on the upper and lower surfaces of the Invar alloy sheet 31, the etchant sprayed during the second etching accumulates in or flows from the first etched area E1, resulting in over-etching of the first etched area E1. This leads to an uneven shape of the patterned holes 32, reducing the quality of the FMM 30.

[0100] In this invention, after the first etching, the second etching is performed with the first etched area E1 filled with plugging ink 34, thus fundamentally blocking the deformation of the first etched area E1 during the second etching process.

[0101] Furthermore, the second etched portion E2, which has a wider horizontal width, becomes the front face of the FMM30 and is the portion that preferentially receives organic matter supplied from the deposition source supply portion 40. The first etched portion E1, which has a narrower horizontal width, becomes the rear face of the FMM30 and is in contact with the target substrate 20 of the organic matter deposition source 41. The inner side of the pattern hole 32 formed by the combination of them can be naturally tilted (S) ([or formed in a conical (S) shape]).

[0102] As described above, preferred embodiments are disclosed in the accompanying drawings and description. Specific terminology is used herein, but it is for illustrative purposes only and not intended to limit the meaning or scope of the invention as set forth in the claims. Therefore, those skilled in the art will understand that various modifications and equivalent embodiments can be achieved therein. Consequently, the true scope of protection of this invention depends on the technical concept of the appended claims.

Claims

1. A method for manufacturing an FMM, characterized in that, include: Step (a): Electroplating an Invar alloy sheet onto the object. Step (b) involves arranging and attaching the Invar alloy sheets to one side of the carrier film; Step (c): A segmented photoresist is formed on the upper surface of the Invar alloy sheet disposed on the upper part of the carrier film, and the upper surface of the Invar alloy sheet is etched using an etching solution to form a first etched area in the form of an arc groove. Step (d) involves forming a plugging ink on the upper surface of the Invar alloy sheet to plug the first etched portion of the groove shape. Step (e) involves flipping an Invar alloy sheet with via-filling ink on its upper surface and a carrier film attached to its lower surface in the vertical direction, and forming a segmented photoresist on the upper surface of the Invar alloy sheet; and In step (f), the upper surface of the Invar alloy sheet is etched using an etching solution to form a second etched area in the shape of an arc groove at the dividing part. The lower part of the second etched area contacts the first etched area to form a through-shaped patterned hole. With the Invar alloy sheets arranged on top of the carrier film and attached, steps (c) to (f) are performed continuously in a roll-to-roll manner.

2. The manufacturing method of FMM according to claim 1, characterized in that, In step (b), two or more rows of Invar alloy sheets are attached side by side along the length of the carrier film on one side of the carrier film.

3. The manufacturing method of FMM according to claim 1, characterized in that, The etching process is controlled such that the horizontal width of the first etched portion of the front face of the FMM is narrower than that of the second etched portion of the rear face of the FMM.

4. An FMM manufactured by the manufacturing method of an FMM according to any one of claims 1 to 3, characterized in that, include: Invar alloy sheets are formed by electroplating. as well as Multiple patterned holes are formed by a first etched portion formed on the front surface of the Invar alloy sheet and a second etched portion formed on the rear surface of the Invar alloy sheet, which are in contact and in a through shape.

5. The FMM according to claim 4, characterized in that, The horizontal width of the first etched portion constituting the front face of the FMM is narrower than that of the second etched portion constituting the rear face of the FMM, and is formed obliquely by the inner side of the patterned hole where they are joined.

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