Photosensitive resin composition and application thereof

Abstract

The invention discloses a photosensitive resin composition and application thereof. The photosensitive resin composition includes: 15-60 parts of an epoxy resin; 5-30 parts of a toughening agent; 0.01 to 2 parts of a photoinitiator; 0.01-2 parts of a thermal curing agent; 10 to 70 parts of an inorganic filler; a solvent; wherein the toughening agent is a composition of polyimide resin, organic silicon and polyion liquid. According to the photosensitive resin composition provided by the invention, the composition of the polyimide resin, the organic silicon and the polyion liquid is introduced as the toughening agent, and a dense interpenetrating network structure is formed through high-temperature copolymerization reaction in the presence of the thermal curing agent, so that the glass-transition temperature, the flame retardance, the mechanical property and the like of the photosensitive resin composition are effectively improved.

Description

Technical Field

[0001] This invention relates to the field of electronic packaging technology, and more particularly to a photosensitive resin composition and its application. Background Technology

[0002] Solder resist ink is used to coat the surface of printed circuit boards (PCBs) and protect the circuit patterns. Its function is to protect the PCB from dust, heat, moisture, and chemicals, and to reduce stress during bending. As electronic devices move towards miniaturization, high density, and lightweight designs, the demand for finer, higher-resolution, higher-precision, and higher-performance permanent masking solder resist inks is increasing. Furthermore, PCBs must possess high reliability to avoid quality issues that may arise over decades of use.

[0003] Compared to liquid solder resist inks, photosensitive dry film solder resist inks not only eliminate the need for a drying process after coating but also improve the performance of the solder resist layer. The dry film can be directly laminated to the circuit board, reducing the likelihood of air bubbles being introduced between the substrate and the solder resist film, while also improving the filling ability of recesses on the substrate surface. In subsequent exposure processes with the photosensitive solder resist dry film support film covering, the curing inhibition caused by oxygen is minimized, resulting in a solder resist layer with higher surface smoothness and hardness compared to wet coating.

[0004] In existing technologies, dry-film solder resist inks prepared from photosensitive resin compositions suffer from technical problems such as high brittleness, low resolution, and relatively weak insulation resistance. Currently, there are two main approaches to improving the flexibility of photosensitive dry-film solder resist inks: physical modification and chemical modification. Physical modification is achieved by adding inorganic particles such as BaSO4 and fumed SiO2, as illustrated in patent CN90105419.4, which adds photosensitizers, thermal initiators, fumed SiO2, and styrene to epoxy acrylic resin; or by adding rubber for toughening, as illustrated in patent CN201610554069.8. Chemical modification involves introducing flexible chains into the molecular chain of the main resin, as illustrated in patent CN201811494319.9, which introduces fatty acids into the molecular chain of the main resin to obtain modified epoxy resin, thereby improving flexibility. While the above physical modification methods have improved the flexibility of dry-film solder resist inks to some extent, some problems still remain. For example, while the flexibility of dry film solder resist inks is improved, other properties are compromised. Chemical modification methods may introduce various side reactions during synthesis, reducing the purity of the product. Summary of the Invention

[0005] To address the aforementioned technical problems, the present invention provides a photosensitive resin composition and its application to improve the flexibility and other properties of photosensitive dry film solder resist inks.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0007] In one aspect, the present invention provides a photosensitive resin composition comprising:

[0008] (A) Component: 15-60 parts of epoxy resin;

[0009] (B) Component: 5-30 parts toughening agent;

[0010] (C) Component: 0.01–2 parts of photoinitiator;

[0011] (D) Component: 0.01-2 parts of thermosetting agent;

[0012] (E) Components: 10-70 parts of inorganic filler;

[0013] (F) Component: Solvent.

[0014] The toughening agent is a composition of polyimide resin, organosilicon and polyionic liquid.

[0015] In a preferred embodiment, the epoxy resin includes epoxy resin I and epoxy resin II; wherein epoxy resin I is an alkali-soluble photosensitive epoxy resin, and epoxy resin II is an alkali-insoluble photosensitive epoxy resin; the mass of epoxy resin I is 50% to 100% of the total mass of the epoxy resin; in the technical solution of the present invention, the alkali-insoluble photosensitive epoxy resin includes alkali-soluble non-photosensitive epoxy resin, photosensitive non-alkali-soluble epoxy resin, and alkali-insoluble non-photosensitive epoxy resin.

[0016] In a preferred embodiment, the acid value of the alkali-soluble photosensitive epoxy resin is 60-200 KOH / g; in the technical solution of the present invention, the acid value represents the number of milligrams of potassium hydroxide (KOH) required to neutralize 1 gram of chemical substance;

[0017] Preferably, the molecular chain of the alkali-soluble photosensitive epoxy resin contains photosensitive groups and alkali-soluble groups; the photosensitive groups are selected from one or more of carbonyl groups, carboxyl groups, peroxy groups, and carbon-carbon double bonds; the alkali-soluble groups are selected from one or more of carboxyl groups, acid anhydrides, and ester groups.

[0018] Preferably, the alkali-soluble photosensitive epoxy resin is an organic acid containing carbon-carbon double bonds or an anhydride-modified phenolic epoxy resin containing carbon-carbon double bonds.

[0019] Preferably, the weight-average molecular weight M of the alkali-soluble photosensitive epoxy resin is... w =5000~50000g / mol.

[0020] Specifically, the alkali-soluble photosensitive epoxy resins include alkali-soluble photosensitive o-cresol epoxy resin, alkali-soluble photosensitive phenol epoxy resin, alkali-soluble photosensitive bisphenol A epoxy resin, alkali-soluble photosensitive BPA epoxy resin, alkali-soluble photosensitive dicyclopentadiene phenol type epoxy resin, alkali-soluble photosensitive phenol biphenyl type epoxy resin, and alkali-soluble photosensitive XYLOK phenol epoxy resin, etc. The above-mentioned resins can be used individually or in any combination.

[0021] Preferably, the general structural formula of the alkali-soluble photosensitive o-cresol epoxy resin is shown in formula (1):

[0022]

[0023] In equation (1), 100 ≤ m ≤ 400;

[0024] Preferably, the general structural formula of the alkali-soluble photosensitive phenolic epoxy resin is shown in formula (2):

[0025]

[0026] In equation (2), 50 ≤ n ≤ 200;

[0027] In the technical solution of the present invention, the type of epoxy resin II is not particularly limited, but can be specifically listed as: bisphenol F phenolic varnish type epoxy resin, bisphenol A epoxy resin and bisphenol F epoxy resin, etc.

[0028] In the technical solution of the present invention, the mass ratio of the polyimide resin, organosilicon and polyionic liquid in the toughening agent is 1:(0.01-2):(0.1-2);

[0029] Preferably, the organosilicon is selected from one or more of organosilicon resins, modified organosilicon resins, organosilicon rubbers, modified organosilicon rubbers, and silazanes;

[0030] Specifically, the modifying groups of the modified organosilicon resin are selected from one or more of trifluoropropyl, vinyl, phenylene and benzeneborane;

[0031] Preferably, the modified silicone resin is a vinyl silicone resin with a vinyl content of 0.2 wt% to 10 wt% and a viscosity of 100 to 500 cp.

[0032] Preferably, the silazane is vinylsilazane, more preferably tetramethyldivinyldisilazane;

[0033] Specifically, the modifying groups of the modified silicone rubber are selected from one or more of trifluoropropyl, vinyl, phenylene, and benzeneborane; the modified silicone rubber has good adhesion and toughening properties.

[0034] Preferably, the modified silicone rubber is a vinyl silicone rubber with a vinyl content of 0.1% to 0.3%.

[0035] Preferably, the polyionic liquid is a polyionic liquid obtained by polymerization of imidazole ionic liquid; the imidazole ionic liquid is selected from one or more of 1-butyl-3-methylimidazolium hexafluorophosphate, 1-ethyl-3-methylimidazolium tetrafluoroborate and 1-butyl-3-methylimidazolium tetrafluoroborate.

[0036] More preferably, the toughening agent is a composition of polyimide resin, vinyl silicone resin, vinyl silicone rubber, and polyionic liquid; or, the toughening agent is a composition of polyimide resin, vinyl silazane, and polyionic liquid.

[0037] In the technical solution of the present invention, the type of photoinitiator is not particularly limited, and can be selected from one or more of aromatic ketone photoinitiators, acylphosphine oxide photoinitiators, thioxanone photoinitiators, titanium hololiths photoinitiators and oxime ester photoinitiators;

[0038] From the perspective of improving the clarity of the photolithographic pattern and obtaining a rectangular photolithographic pattern, one or more of aromatic ketone photoinitiators and thioxanthone photoinitiators are preferred; as the above-mentioned aromatic ketone photoinitiator, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-propanone-1 is preferred; as the above-mentioned thioxanthone compound photoinitiator, 2,4-diethylthioxanthone is preferred.

[0039] From the perspective of improving sensitivity, oxime ester-based photoinitiators are preferred; as the above-mentioned oxime ester-based photoinitiators, one or more of 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-, 1-(0-acetyl oxime), 2-(acetoxyiminomethyl)thioxanthone, (1,2-octanedione, 1-[4-(phenylthio)phenyl, 2-(o-benzoyl oxime))] and ethyl ketone, 1-(o-acetyl oxime) are preferred, with ethyl ketone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-, 1-(0-acetyl oxime) being the most preferred.

[0040] In the technical solution of the present invention, the type of thermosetting agent is not particularly limited, but is preferably one or more of thermosetting agents with phenolic hydroxyl groups and thermosetting agents with hydroxymethyl amino groups. Specific examples include biphenol and its derivatives, melamine, poly(N-hydroxymethyl)melamine, poly(N-hydroxymethylglycolurea), poly(N-hydroxymethylbenzoguanamine), etc.

[0041] In a preferred embodiment, the inorganic filler is selected from silicon dioxide (SiO2), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), zirconium oxide (ZrO2), silicon nitride (Si3N4), barium titanate (BaO·TiO2), lead zirconate titanate (PZT), lanthanum lead zirconate titanate (PLZT), gallium oxide (Ga2O3), spinel (MgO·Al2O3), and mullite (3Al2O3·2SiO2). One or more of the following: cordierite (2MgO·2Al2O3 / 5SiO2), talc (3MgO·4SiO2·H2O), aluminum titanate (TiO2·Al2O3), yttrium-containing zirconium oxide (Y2O3·ZrO2), barium silicate (BaO·8SiO2), boron nitride (BN), calcium carbonate (CaCO3), barium sulfate (BaSO4), calcium sulfate (CaSO4), hydrotalcite, mica, carbon (C), bentonite, and montmorillonite;

[0042] Preferably, the inorganic filler has a particle size of 0.1–20 μm, more preferably 0.1–10 μm, even more preferably 0.1–5 μm, and particularly preferably 0.1–1 μm;

[0043] Specifically, from the viewpoint of improving heat resistance, the inorganic filler is preferably silica;

[0044] Specifically, from the viewpoint of improving heat resistance, crack resistance (thermal shock resistance) and bond strength, the inorganic filler is preferably barium sulfate;

[0045] Specifically, from the viewpoint of improving anti-agglomeration properties, the inorganic filler is preferably alumina that has not been or has been surface-treated with an organosilane coupling agent.

[0046] In the technical solution of the present invention, the amount of solvent used is determined by making the photosensitive resin composition form a uniformly dispersed liquid; in some specific embodiments, viscosity can also be used as a measure of the amount of solvent added according to application requirements.

[0047] Preferably, the solvent is selected from one or more of alcohols, glycol ethers, and esters.

[0048] The technical solution of the present invention also includes additives; the additives are selected from one or more of pigments, leveling agents and defoamers;

[0049] Specifically, the pigments mentioned may include phthalocyanine blue, phthalocyanine green, iodine green, malachite green, crystal violet, carbon black, etc.

[0050] In the technical solution of the present invention, the content of the additive can be arbitrarily set within a range that does not affect the performance of the photosensitive resin composition.

[0051] In another aspect, the present invention provides a photosensitive film prepared from the above-described photosensitive resin composition; the photosensitive film is obtained by curing a solution comprising the above-described photosensitive resin composition.

[0052] In some specific embodiments, the thickness of the photosensitive film is 5–200 μm, more preferably 15–60 μm, and most preferably 20–50 μm;

[0053] Preferably, the solvent in the solution comprising the above-described photosensitive resin composition is selected from acetone and / or carbitol acetate;

[0054] Preferably, the curing is thermosetting; the thermosetting conditions are 80-130℃ for 3-10 minutes.

[0055] In another aspect, the present invention provides a photosensitive resin laminate, comprising a support and the aforementioned photosensitive film disposed on the support.

[0056] Preferably, a protective film is also provided on the photosensitive film.

[0057] In some specific embodiments, the support is prepared from a polymer film with heat resistance and solvent resistance, such as polypropylene or polyethylene;

[0058] In some specific embodiments, the protective film is prepared from a polymer film with heat resistance and solvent resistance, such as polypropylene or polyethylene;

[0059] Preferably, the photosensitive resin laminate further includes an intermediate layer; the intermediate layer is selected from one or more of a buffer layer, an adhesive layer, a light-absorbing layer, and a gas-barrier layer.

[0060] In another aspect, the present invention provides the application of the above-described photosensitive resin composition, the above-described photosensitive film, or the above-described photosensitive resin laminate in electronic packaging.

[0061] Preferably, it is used in the preparation of photoresists or solder resist inks.

[0062] The above technical solution has the following advantages or beneficial effects:

[0063] The photosensitive resin composition provided by this invention enhances the optical properties, strength, and toughness of solder resist ink systems. This invention introduces a toughening system composed of polyimide resin, silicone, and polyionic liquid into the photosensitive epoxy resin system. This not only improves the flexibility of the photosensitive resin composition and the elongation at break of the photosensitive dry film, but also, in the presence of a thermosetting agent, the toughening agent undergoes a high-temperature copolymerization reaction to form a dense interpenetrating network structure, thereby effectively improving the glass transition temperature, flame retardancy, and mechanical properties of the photosensitive resin composition. Furthermore, the photosensitive resin composition provided by this invention can also improve the clarity and resolution of photolithographic patterns by controlling the composition, thus meeting the stringent requirements of printed circuit boards. Detailed Implementation

[0064] The following embodiments are merely some, not all, of the embodiments of the present invention. Therefore, the detailed descriptions of the embodiments provided below are not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0065] In this invention, unless otherwise specified, all equipment and raw materials are commercially available or commonly used in the industry. The methods described in the following embodiments are conventional methods in the art, unless otherwise specified.

[0066] Manufacturing Example 1: Alkali-soluble photosensitive epoxy resin A1

[0067] 350 parts by weight of o-cresol formaldehyde epoxy resin (epoxy equivalent: 191.6), 70 parts by weight of acrylic acid, 0.5 parts by weight of methyl hydroquinone, and 120 parts by weight of carbitol acetate were heated and stirred at 100°C until completely dissolved. 2 parts by weight of triphenylphosphine were added, and the reaction was continued at 100°C until the acid value no longer decreased. 98 parts by weight of tetrahydrophthalic anhydride and 85 parts by weight of carbitol acetate were added, and the reaction was carried out at 90°C for 6 hours. After cooling to room temperature and washing, an alkali-soluble photosensitive o-cresol formaldehyde epoxy resin (alkali-soluble photosensitive epoxy resin A1, acid value 78 KOH / g) was obtained.

[0068] Manufacturing Example 2: Alkali-soluble photosensitive epoxy resin A2

[0069] 350 parts by weight of bisphenol A (BPA) phenolic epoxy resin (epoxy equivalent: 173.31), 70 parts by weight of acrylic acid, 0.5 parts by weight of methyl hydroquinone, and 120 parts by weight of carbitol acetate were heated and stirred at 100°C until completely dissolved. 2 parts by weight of triphenylphosphine were added, and the reaction was continued at 100°C until the acid value no longer decreased. 98 parts by weight of tetrahydrophthalic anhydride and 85 parts by weight of carbitol acetate were added, and the reaction was carried out at 90°C for 6 hours. After cooling to room temperature and washing, an alkali-soluble photosensitive bisphenol A phenolic epoxy resin (alkali-soluble photosensitive epoxy resin A2, acid value 85 KOH / g) was obtained.

[0070] Manufacturing Example 3: Polyionic Liquid

[0071] 1-Butyl-3-methylimidazolium hexafluorophosphate / 1-ethyl-3-methylimidazolium tetrafluoroborate / 1-butyl-3-methylimidazolium tetrafluoroborate (molar fraction 99.5%) and initiator azobisisobutyronitrile (molar fraction 0.5%) were evacuated to a bubble-free state, argon gas was introduced, the temperature was raised to 40°C, and the mixture was stirred until the initiator dissolved. The mixture was then degassed under vacuum. The mixture was then heated to 65°C and reacted for 5 hours to obtain a yellow transparent solid mixture. Finally, after purification, a yellowish-white amorphous polymer was obtained, which is the polyionic liquid.

[0072] In the following embodiments and comparative examples:

[0073] Toughening agent C1 comprises: 10 parts by weight of polyimide resin, 5 parts by weight of vinyl silicone resin, 5 parts by weight of vinyl silicone rubber, and 10 parts by weight of polyionic liquid 1-butyl-3-methylimidazolium hexafluorophosphate.

[0074] Toughening agent C2 comprises: 10 parts by weight of polyimide resin, 10 parts by weight of tetramethyldivinyldisilazane, 5 parts by weight of 1-ethyl-3-methylimidazolium tetrafluoroborate polyionic liquid, and 5 parts by weight of 1-butyl-3-methylimidazolium tetrafluoroborate polyionic liquid.

[0075] Toughening agent C3 comprises: 10 parts by weight of polyimide resin, 0.1 parts by weight of vinyl silicone resin, and 1 part by weight of 1-butyl-3-methylimidazolium hexafluorophosphate polyionic liquid;

[0076] Toughening agent C4 comprises: 5 parts by weight of polyimide resin, 10 parts by weight of vinyl silicone resin, 5 parts by weight of 1-ethyl-3-methylimidazolium tetrafluoroborate polyionic liquid, and 5 parts by weight of 1-butyl-3-methylimidazolium tetrafluoroborate polyionic liquid.

[0077] The polyimide resin has a molecular weight of 10,000; the vinyl content in the vinyl silicone resin is 3.0 wt% to 3.4 wt%, and the viscosity is 300 cp; the vinyl content in the vinyl silicone rubber is 0.13% to 0.22%.

[0078] Examples 1-4: Photosensitive Resin Compositions

[0079] The photosensitive resin composition was prepared by mixing using a three-roll press according to the mass proportions shown in Table 1. Carbitol acetate was added until the solid content was 70 wt%, and the photosensitive resin composition was obtained.

[0080] Table 1

[0081]

[0082] In the table above, the particle size of SiO2 is 0.3 μm.

[0083] Iguracure 0XE02: Ethyl ketone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-, 1-(0-acetyl oxime) (BASF)

[0084] Comparative Examples 1-4: Photosensitive Epoxy Resin Compositions

[0085] The photosensitive resin composition was prepared by mixing using a three-roll press according to the mass proportions shown in Table 2. Carbitol acetate was added until the solid content was 70 wt%, resulting in the photosensitive epoxy resin composition.

[0086] Table 2

[0087]

[0088] In the table above, the particle size of SiO2 is 0.3 μm.

[0089] Example 1:

[0090] The photosensitive epoxy resin compositions from Examples 1-4 and Comparative Examples 1-4 were prepared into photosensitive dry films and then laminated onto an FCBGA substrate by thermal lamination. Specifically, acetone was added to the photosensitive epoxy resin composition until the solid content reached 58 wt%. After thorough stirring and mixing, a mixture was obtained. This mixture was then uniformly coated onto a polyethylene terephthalate (PET) film using a coating machine and dried in a dryer at 95°C for 5 minutes. A 5 μm thick photosensitive dry film was formed from the photosensitive epoxy resin composition. The PET film covered with the photosensitive dry film was then laminated onto the FCBGA substrate using a hot roller lamination device at a roller temperature of 105°C. The air pressure was set to 0.35 MPa and the lamination speed to 1.5 m / min. Finally, performance tests were conducted. The test methods and results are shown in Tables 3-1 and 3-2 below.

[0091] In Tables 3-1 and 3-2, the methods for evaluating resolution are as follows:

[0092] The aforementioned polyethylene terephthalate film covering the photosensitive dry film was laminated onto a 6-inch diameter silicon wafer using hot roller lamination to obtain a laminate consisting of a polyethylene terephthalate film support, a photosensitive layer (photosensitive dry film), and a silicon wafer. The lamination was performed using heated rollers at 100°C, a pressing pressure of 0.4 MPa, and a roller speed of 1.0 m / min. Subsequently, the support was peeled off, and the photosensitive layer was subjected to reduced projection exposure using i-rays (365 nm) through a mask using an i-ray lithography machine.

[0093] Table 3-1

[0094]

[0095] Table 3-2

[0096]

[0097]

[0098] As can be seen from Tables 3-1 and 3-2, the photosensitive resin compositions prepared in Examples 1-4 of this invention all exhibit excellent electrical properties, mechanical properties, resolution, corrosion resistance, and weather resistance. Comparative Example 1, using a single-component toughening agent, shows better resolution compared to Examples 1-2, but its other properties are inferior. Comparative Examples 3-4, using a two-component toughening agent, show significantly lower overall performance compared to Examples 1-2. The photosensitive resin composition provided by this invention, with the addition of polyimide, organosilicon, and a polyionic liquid composition as toughening agents, not only improves solder resistance but also enhances electrical properties, adhesion, resolution, and elongation at break.

[0099] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A photosensitive resin composition, characterized in that, include: (A) Component: 15-60 parts of epoxy resin; (B) Component: 5-30 parts toughening agent; (C) Component: 0.01–2 parts of photoinitiator; (D) Component: 0.01-2 parts of thermosetting agent; (E) Components: 10-70 parts of inorganic filler; (F) Component: Solvent; The toughening agent is a composition of polyimide resin, organosilicon and polyionic liquid.

2. The photosensitive resin composition according to claim 1, characterized in that, The epoxy resin includes epoxy resin I and epoxy resin II; wherein epoxy resin I is an alkali-soluble photosensitive epoxy resin, and epoxy resin II is a non-alkali-soluble photosensitive epoxy resin; the mass of epoxy resin I is 50% to 100% of the total mass of the epoxy resin.

3. The photosensitive resin composition according to claim 2, characterized in that, The acid value of the alkali-soluble photosensitive epoxy resin is 60-200 KOH / g; Preferably, the molecular chain of the alkali-soluble photosensitive epoxy resin contains photosensitive groups and alkali-soluble groups; the photosensitive groups are selected from one or more of carbonyl groups, carboxyl groups, peroxy groups, and carbon-carbon double bonds; the alkali-soluble groups are selected from one or more of carboxyl groups, acid anhydrides, and ester groups. Preferably, the alkali-soluble photosensitive epoxy resin is an organic acid containing carbon-carbon double bonds or an anhydride-modified phenolic epoxy resin containing carbon-carbon double bonds. Preferably, the weight-average molecular weight M of the alkali-soluble photosensitive epoxy resin is... w =5000~50000g / mol.

4. The photosensitive resin composition according to claim 1, characterized in that, In the toughening agent, the mass ratio of the polyimide resin, organosilicon, and polyionic liquid is 1:(0.01-2):(0.1-2); Preferably, the organosilicon is selected from one or more of organosilicon resins, modified organosilicon resins, organosilicon rubbers, modified organosilicon rubbers, and silazanes; Preferably, the modifying group of the modified organosilicon resin is selected from one or more of trifluoropropyl, vinyl, phenylene and benzyl borane; Preferably, the modified silicone resin is a vinyl silicone resin with a vinyl content of 0.2 wt% to 10 wt% and a viscosity of 100 to 500 cp. Preferably, the silazane is vinylsilazane, more preferably tetramethyldivinyldisilazane; Preferably, the modifying groups of the modified silicone rubber are selected from one or more of trifluoropropyl, vinyl, phenylene, and benzeneborane; the modified silicone rubber has good adhesion and toughening properties. Preferably, the modified silicone rubber is a vinyl silicone rubber with a vinyl content of 0.1% to 0.3%. Preferably, the polyionic liquid is a polyionic liquid obtained by polymerization of imidazole ionic liquid; the imidazole ionic liquid is selected from one or more of 1-butyl-3-methylimidazolium hexafluorophosphate, 1-ethyl-3-methylimidazolium tetrafluoroborate and 1-butyl-3-methylimidazolium tetrafluoroborate. More preferably, the toughening agent is a composition of polyimide resin, vinyl silicone resin, vinyl silicone rubber, and polyionic liquid; or, the toughening agent is a composition of polyimide resin, vinyl silazane, and polyionic liquid.

5. The photosensitive resin composition according to claim 1, characterized in that, The inorganic filler is selected from one or more of the following: silicon dioxide, aluminum oxide, titanium oxide, tantalum oxide, zirconium oxide, silicon nitride, barium titanate, lead zirconium titanate, lanthanum lead zirconium titanate, gallium oxide, spinel, mullite, cordierite, talc, aluminum titanate, yttrium-containing zirconium oxide, barium silicate, boron nitride, calcium carbonate, barium sulfate, calcium sulfate, hydrotalcite, mica, carbon, bentonite, and montmorillonite. Preferably, the inorganic filler has a particle size of 0.1–20 μm, more preferably 0.1–10 μm, even more preferably 0.1–5 μm, and particularly preferably 0.1–1 μm.

6. The photosensitive resin composition according to claim 1, characterized in that, The solvent is selected from one or more of alcohols, glycol ethers, and esters.

7. The photosensitive resin composition according to claim 1, characterized in that, It also includes additives; the additives are selected from one or more of pigments, leveling agents and defoamers.

8. A photosensitive film, characterized in that, The photosensitive film is obtained by curing a solution comprising the photosensitive resin composition according to any one of claims 1-7; Preferably, the solvent in the solution comprising the photosensitive resin composition of any one of claims 1-7 is selected from acetone and / or carbitol acetate; Preferably, the curing is thermosetting; the thermosetting conditions are 80-130℃ for 3-10 minutes.

9. A photosensitive resin laminate, characterized in that, It includes a support and a photosensitive film disposed on the support, wherein the photosensitive film is the photosensitive film as described in claim 8.

10. The use of the photosensitive resin composition according to any one of claims 1-7, the photosensitive film according to claim 8, or the photosensitive resin laminate according to claim 9 in electronic packaging; Preferably, it is used in the preparation of photoresists or solder resist inks.

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