Telescopic heat conduction device

Abstract

The invention relates to a telescopic heat conduction device, which belongs to the field of radiators, and comprises a main board PCBA (Printed Circuit Board Assembly), a chip, a radiator, an elastic piece, a fixing piece, a positioning piece, a heat conduction column, a heat conduction column fixing plate and a heat conduction medium, the chip is arranged on the main board PCBA, the radiator is provided with a positioning piece used for installing the main board PCBA and the heat conduction column fixing plate, the heat conduction column is arranged in a groove of the radiator and connected with the heat conduction column fixing plate in an embedded mode, the elastic piece is arranged on the radiator, and the elastic piece presses the heat conduction column below the main board PCBA. An assembly gap is arranged among the heat conduction column fixing plate, the heat conduction column and the radiator, and the heat conduction medium is filled in the assembly gap. According to the design scheme, the complexity and diversity of heat conduction and heat dissipation structure suites are reduced, and the machining cost and the assembly cost are optimized.

Description

Technical Field

[0001] This invention relates to the field of radiators, and in particular to a telescopic heat conduction device. Background Technology

[0002] Currently, existing fanless industrial computers primarily use a hard-contact method—a heatsink + thermal pad + heat dissipation plate—to cool the chips on the industrial motherboard. However, the variety of chip types and their varying heights and dimensions leads to diverse heat dissipation structures. Furthermore, the thermal conductivity of the heat dissipation plate is limited, significantly restricting the overall heat dissipation performance of the product. This design primarily addresses this structural diversity by replacing the thermal medium between the chip and the thermal pad with thermal grease, thereby improving heat dissipation performance. Summary of the Invention

[0003] To address the aforementioned problems, the present invention aims to provide a telescopic heat conduction device whose structural design can effectively solve the problems of the complexity and variety of existing heat sinks.

[0004] To achieve the above objectives, the technical solution of the present invention is as follows:

[0005] A telescopic heat-conducting device, characterized in that it comprises a motherboard PCBA, a chip, a heat sink, an elastic element, a fixing element, a positioning element, a heat-conducting pillar, a heat-conducting pillar fixing plate, and a heat-conducting medium, and its structural assembly is as follows:

[0006] The chip is mounted on the motherboard PCBA. The heat sink is provided with a positioning component for mounting the motherboard PCBA and the heat conduction pillar fixing plate. The heat conduction pillar is set in the heat sink groove and is fitted and connected with the heat conduction pillar fixing plate. The elastic component is set on the heat sink and presses the heat conduction pillar under the motherboard PCBA. An assembly gap is provided between the heat conduction pillar fixing plate, the heat conduction pillar, and the heat sink. The heat conduction medium is filled in the assembly gap.

[0007] Furthermore, a positioning post is provided in the groove, and the elastic element is fitted onto the positioning post; the groove is located at the center of the heat sink, the opening always faces the motherboard PCBA, and is on the same axis as the heat conduction post, the heat conduction post fixing plate, and the chip.

[0008] Furthermore, the positioning element is a cold-pressed support PCBA stud.

[0009] Furthermore, the fixing element is a fixing screw.

[0010] Furthermore, the upper end of the heat-conducting column has a protruding portion, which is fitted and connected to the heat-conducting column fixing plate.

[0011] Furthermore, the elastic element includes a metal spring and a rubber spring.

[0012] Furthermore, the maximum elastic force applied by the metal spring and the rubber spring should be less than the maximum bearing capacity of the chip. The maximum elastic force is calculated as follows: Where k is the spring stiffness, G is the shear modulus of the material, d is the diameter of the spring wire, n is the effective number of coils of the spring, and D is the average diameter of the spring; the maximum elastic force is equal to the spring stiffness multiplied by the maximum compression of the spring.

[0013] Maximum bearing capacity calculation method: F max =σ y ×A, where F max The maximum withstand force of the chip, where σ y Let A be the yield strength of the chip material and A be the chip contact area.

[0014] Furthermore, the heat-conducting pillar and the chip are interference-fitted.

[0015] Furthermore, the thermally conductive medium is thermally conductive silicone grease.

[0016] Furthermore, the thickness of the thermal grease is 0.025-0.05 mm.

[0017] Compared with the prior art, the beneficial effects of this invention are:

[0018] Given the power consumption of the chip components, the required heat dissipation area can be simulated and calculated. Once the heatsink size is designed, the same thermal conductivity and heat dissipation structure kit can be directly applied to chipsets with the same power consumption, reducing the variety of thermal conductivity and heat dissipation structure kits. Even if different chips have different heights, installation requirements can be met by modifying the height of the motherboard support studs or thermal pillars. This minimizes modifications and manufacturing processes. The manufacturing and assembly costs of the entire product series are optimized. At the same time, the optimization of the thermal medium reduces the variety of thermal pads; replacing thermal pads with thermal grease also optimizes their thermal conductivity. Attached Figure Description

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 This is an assembly cross-sectional view of the telescopic heat conduction device of the present invention.

[0021] Figure 2 Explosive decomposition of the telescopic heat conduction device of the present invention Figure 1 .

[0022] Figure 3 Explosive decomposition of the telescopic heat conduction device of the present invention Figure 2 .

[0023] In the diagram: 1-Screws securing the motherboard, 2-PCBA motherboard, 3-Screws, 4-Heat conduction pillar mounting plate, 5-Heat conduction pillar, 6-Heat sink, 7-Spring, 8-Chip, 9-Cold-pressed PCBA support studs Detailed Implementation

[0024] The present invention will now be described in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0025] As shown in the figure, the technical solution of the present invention is:

[0026] A telescopic heat-conducting device, characterized in that it comprises a motherboard PCBA, a chip, a heat sink, an elastic element, a fixing element, a positioning element, a heat-conducting pillar, a heat-conducting pillar fixing plate, and a heat-conducting medium, and its structural assembly is as follows:

[0027] like Figure 2 As shown, the chip 8 is mounted on the motherboard PCBA2. The heat sink 6 is provided with a positioning component for mounting the motherboard PCBA2 and the heat conduction pillar fixing plate 4. The heat conduction pillar 5 is disposed in the groove of the heat sink 6 and is fitted and connected to the heat conduction pillar fixing plate 4. The elastic component is disposed on the heat sink 6 and presses the heat conduction pillar 5 under the motherboard PCBA2. An assembly gap is provided between the heat conduction pillar fixing plate 4, the heat conduction pillar 5, and the heat sink 6, and the heat conduction medium is filled in the assembly gap.

[0028] like Figure 1 As shown, a positioning post is provided in the groove, and the elastic element is fitted onto the positioning post. The groove is located at the center of the heat sink 6, and its opening always faces the motherboard PCBA2. It is also on the same axis as the heat conduction post 5, the heat conduction post fixing plate 4, and the chip 8. At this time, the components on the same axis fit more tightly, resulting in better heat conduction. The positioning post is cylindrical in shape, matching the inner hole shape of the elastic element, which can effectively support the elastic element and keep it stable in the axial direction.

[0029] like Figure 3 As shown, the positioning component is a cold-pressed support PCBA stud 9.

[0030] The corresponding mounting holes are pre-machined on the heat sink 6 to ensure that the size and position accuracy of the holes meet the installation requirements of the studs. After the finished product is produced, the PCBA studs 9 are cold-pressed to support them, thus producing the finished product.

[0031] like Figure 2 , Figure 3As shown, the fixing components are the motherboard fixing screw 1 and the fixing screw 3. The fixing components are distributed on the heat conduction pillar fixing plate 4 and the motherboard PCBA2 and cooperate with the cold-pressed support PCBA stud 9.

[0032] like Figure 1 As shown, the upper end of the heat-conducting column 4 has a protruding part, which is fitted and connected to the heat-conducting column fixing plate 4. The protruding part is a cylindrical protrusion.

[0033] Furthermore, the elastic element includes metal springs and rubber springs, such as carbon steel springs and stainless steel springs.

[0034] Furthermore, the maximum elastic force applied by the spring 7 should be less than the maximum bearing capacity of the chip. The maximum elastic force is calculated as follows: Where k is the spring stiffness, G is the shear modulus of the material, d is the diameter of the spring wire, n is the effective number of coils of the spring, and D is the average diameter of the spring; the maximum elastic force is equal to the spring stiffness multiplied by the maximum compression of the spring.

[0035] Assume the contact area of ​​the chip is A = 10 mm. 2 Spring 7 is made of carbon spring steel wire with a wire diameter of 0.5 mm, an average spring diameter of 5 mm, and 10 effective coils. The maximum spring force of spring 7 is: If the maximum compression is 1, then the maximum elastic force is 0.0122N.

[0036] Maximum bearing capacity calculation method: F max =σ y ×A, where F max σ is the maximum force that the chip can withstand. y Let A be the yield strength of the chip material and A be the chip contact area.

[0037] For silicon chips, the yield strength is approximately σ = 70 MPa, then F max =70×10=700N.

[0038] The maximum elastic force applied by spring 7, 0.0122N, is less than the maximum bearing capacity of chip 8, 700N, and therefore will not damage chip 8. Furthermore, the stiffness and compression of spring 7 can be adjusted according to actual needs to achieve a tight fit between chip 8 and spring 7.

[0039] Furthermore, by applying pressure to the motherboard screw 1, the heat-conducting pillar 5 is pressurized to fit the chip 8, resulting in a larger heat-conducting contact area and better heat dissipation.

[0040] Furthermore, the thermally conductive medium is thermally conductive silicone grease. The high thermal conductivity and stability of thermally conductive silicone grease can be better adapted to electronic components and play a certain protective role.

[0041] Furthermore, the thickness of the thermal grease is 0.025-0.05 mm.

[0042] The main function of thermal grease is to fill microscopic gaps, eliminate air layers, and establish efficient heat conduction channels. Its thermal conductivity is a key indicator for measuring heat dissipation performance; the higher the thermal conductivity, the better the thermal conductivity and the more significant the heat dissipation effect.

[0043] The thinner the thermal grease, the lower the thermal resistance. However, a thermal grease that is too thin may not be able to effectively fill surface defects. Therefore, a minimum thickness of 0.025mm is required to ensure the filling effect. If the gap is too large, exceeding 0.05mm, the thickness of the thermal grease will increase. Although it can fill the gap, it will significantly increase the thermal resistance.

[0044] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A telescopic heat conduction device, characterized in that: The system includes the motherboard PCBA, chips, heat sink, elastic components, fixing components, positioning components, heat conduction pillars, heat conduction pillar fixing plates, and heat conduction medium. Its structural assembly is as follows: The chip is mounted on the motherboard PCBA. The heat sink is provided with a positioning component for mounting the motherboard PCBA and the heat conduction pillar fixing plate. The heat conduction pillar is set in the heat sink groove and is fitted and connected with the heat conduction pillar fixing plate. The elastic component is set on the heat sink and presses the heat conduction pillar under the motherboard PCBA. An assembly gap is provided between the heat conduction pillar fixing plate, the heat conduction pillar, and the heat sink. The heat conduction medium is filled in the assembly gap.

2. The telescopic heat conduction device according to claim 1, characterized in that: The groove is provided with a positioning post, and the elastic element is fitted onto the positioning post; the groove is located at the center of the heat sink, and the opening always faces the motherboard PCBA, and is on the same axis as the heat conduction post, the heat conduction post fixing plate, and the chip.

3. The telescopic heat conduction device according to claim 1, characterized in that: The positioning component is a cold-pressed support PCBA stud.

4. The telescopic heat conduction device according to claim 1, characterized in that: The fastener is a fixing screw.

5. A telescopic heat-conducting device according to claim 1, characterized in that: The upper end of the heat-conducting column has a protruding section, which is fitted and connected to the heat-conducting column fixing plate.

6. A telescopic heat-conducting device according to claim 1, characterized in that: The elastic element includes metal springs and rubber springs.

7. A telescopic heat-conducting device according to claim 6, characterized in that: The maximum elastic force exerted by the metal spring and rubber spring should be less than the maximum bearing capacity of the chip. The maximum elastic force is calculated as follows: Where k is the spring stiffness, G is the shear modulus of the material, d is the diameter of the spring wire, n is the effective number of coils of the spring, and D is the average diameter of the spring; the maximum elastic force is equal to the spring stiffness multiplied by the maximum compression of the spring. Maximum bearing capacity calculation method: F max =σ y ×A, where F max The maximum withstand force of the chip, where σ y Let A be the yield strength of the chip material and A be the chip contact area.

8. A telescopic heat-conducting device according to claim 1, characterized in that: The heat-conducting pillars are interference-fitted with the chip.

9. A telescopic heat-conducting device according to claim 1, characterized in that: The thermally conductive medium is thermally conductive silicone grease.

10. A telescopic heat-conducting device according to claim 9, characterized in that: The thickness of the thermal grease is 0.025-0.05 mm.

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