Modular aluminum alloy heat sink
By using a modular aluminum alloy heat dissipation device with an air intake box and a memory spring to adjust the exhaust vent, the problem of uneven heat exchange in the heat sink fins of existing technologies is solved, achieving a highly efficient heat dissipation effect, especially faster cooling under CPU load.
Patent Information
- Application Number
- CN202511358195.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-23
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2045-09-23
AI Technical Summary
In existing heat sinks, the fins closer to the CPU receive more heat conduction. However, regardless of whether the CPU is at a high or low temperature, the airflow blown by the fan towards the fins is always from top to bottom, resulting in a high heat exchange rate for the top fins and a low heat exchange efficiency for the bottom fins, which affects the cooling effect.
The modular aluminum alloy heat dissipation device introduces the cool air from the exhaust end of the cooling fan into the exhaust box through the air inlet box. It also uses a memory spring to sense the ambient temperature around the central processing unit and coordinates with the air regulating plate to automatically control the number of exhaust vents to open. The horizontal cool air and the vertical airflow converge to neutralize the temperature, shorten the distance between the cool air and the central processing unit, and improve the heat dissipation efficiency.
It achieves dynamic adjustment of airflow volume and airflow direction based on the central processing unit temperature, improves the heat removal efficiency of the heat sink fins, enhances the heat dissipation effect, and especially cools down faster under central processing unit load.
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Figure CN120848709B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of heat dissipation devices, in particular to a modular aluminum alloy heat dissipation device. BACKGROUND
[0002] Electronic components such as central processing units will generate a large amount of heat during normal operation, and if the heat generated is not removed in time, the heat will accumulate to cause temperature rise, which will seriously affect the normal operation of the electronic components; in the existing heat sinks, the heat sink is usually divided into a heat source contact module (such as a heat-conducting base plate), a heat dissipation main body module (such as a fin group), and an air flow control module (such as a fan).
[0003] At present, a heat dissipation device is disclosed in Chinese Patent Publication No. CNCN101662921A, which comprises a heat sink, a fan, and a wind guide cover. The heat sink comprises a plurality of spaced-apart heat dissipation fins, and an air flow channel is formed between each heat dissipation fin. The wind guide cover is connected between the fan and the heat sink, and comprises a hollow frame and an opening part connected to the frame. The opening part is connected to the heat sink, the frame is connected to the fan, and the opening part comprises a first side wall and a second side wall. A space is formed between the two side walls, and the first side wall and the second side wall cover two adjacent sides of the heat sink, respectively. The space is connected to the air flow channel between the heat dissipation fins. In addition, a computer device using the heat dissipation device is also disclosed. The fan draws in air from both sides of the heat sink through the wind guide cover, thereby increasing the air intake area and improving the heat dissipation effect in the entire computer device system.
[0004] In the prior art, the fan adjusts the air speed according to the temperature change of the central processing unit to ensure the normal operation of the device. However, for a down-pressing heat sink, the closer the fin is to the central processing unit, the more heat it receives. Regardless of whether the central processing unit is in a high-temperature state or a low-temperature state, the air flow blown by the fan to the fin is from top to bottom. This causes the topmost fin to exchange heat with the cold air first, and the heat exchange rate of this part of the fin is high. The bottom fin exchanges heat with the cold air with a rising temperature, and the heat exchange efficiency of this part of the fin is low, thereby affecting the cooling effect. SUMMARY
[0005] The present application provides a modular aluminum alloy heat dissipation device. The exhaust end cold air of the heat dissipation fan is introduced into the exhaust box through the air guide box. The ambient temperature around the central processing unit is sensed by the memory spring, and the number of exhaust openings is automatically controlled by the air regulating plate to enhance cooling. The horizontal cold air and the vertical air flow intersect and neutralize the temperature of the vertical air flow. The heat on the heat dissipation fin is removed, and the distance between the cold air and the central processing unit is shortened to improve the heat dissipation efficiency, thereby solving the problems raised in the background art, i.e.:
[0006] To achieve the above object, the modular aluminum alloy heat dissipation device comprises a cover, a heat dissipation fan, a support, heat dissipation fins, a heat pipe and a heat dissipation base, a wind supply mechanism is arranged on the cover near the air exhaust end of the heat dissipation fan, the wind supply mechanism comprises a wind guiding part and a wind adjusting part, the wind guiding part is communicated with the air exhaust end of the heat dissipation fan, and the wind adjusting part is arranged on the heat dissipation base and is attached to the wind guiding part, in the heat dissipation stage, the wind adjusting part is responsible for adjusting the air exhaust amount of the wind guiding part according to the temperature of the central processing unit, and the wind guiding part is used for horizontally conveying the cold air from the outside of the heat dissipation fins to the inside of the heat dissipation fins to form interaction with the longitudinal air flow blown to the heat dissipation fins by the heat dissipation fan.
[0007] Secondly, the other end of the wind guiding box is communicated with a wind guiding pipe, the wind guiding pipe is fixed with the support, and the wind guiding pipe is downwardly bent and communicated with an air exhaust box close to the side edge of the heat dissipation fin, the air exhaust box is provided with a plurality of air exhaust ports arranged horizontally, and the air exhaust ports are used for guiding the cold air in the wind guiding box to the adjacent heat dissipation fins to realize mixing with the longitudinal hot air flow.
[0008] Further, the wind adjusting part comprises a memory spring arranged on the heat dissipation base, in the idle stage of the central processing unit, the memory spring is in a soft phase and is in an elongated state, and in the load stage, the memory spring is in a hard phase and is in a contracted state.
[0009] In the above technical scheme, when the ambient temperature around the central processing unit is stable, the memory spring is in the elongated state, only a few air exhaust ports are not shielded by the wind adjusting plate, and most of the air exhaust ports are in the shielded state, at this time, the cold air is exhausted from the open air exhaust ports and mixed with the longitudinal air flow, in this way, the heat dissipation fins blown by the upper open air exhaust ports are located at a higher position, and the path of the cold air flowing through the channels between the heat dissipation fins is longer, so that more heat on the heat dissipation fins is taken away, and the cooling effect is improved.
[0010] Then, the top of the memory spring is fixedly connected with a wind adjusting plate, the wind adjusting plate is attached to the air exhaust port and is used for adjusting the number of air exhaust ports according to the change of the ambient temperature to realize dynamic adjustment of the air exhaust amount. That is, in the implementation process, the number of open air exhaust ports increases from top to bottom, the horizontal air amount conveyed to the channels between the adjacent heat dissipation fins is increased, and the cold air blown out of the air exhaust ports close to the central processing unit contacts the central processing unit most quickly, so that the cooling effect on the central processing unit is improved.
[0011] Compared with the prior art, the beneficial effects of the present application are:
[0012] The heat dissipation fan exhaust end cold air is introduced into the exhaust box by the air guide box, the memory spring senses the ambient temperature around the central processing unit, and the air guide plate is cooperated to automatically control the opening number of the exhaust port, so as to strengthen the cooling, the transverse cold air and the longitudinal air flow meet and neutralize the temperature of the longitudinal air flow, the heat on the heat dissipation fin is taken away, the distance between the cold air and the central processing unit is shortened, and the heat dissipation efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS
[0013] Figure 1 It is the overall structure schematic diagram of the present application;
[0014] Figure 2 It is the explosion structure schematic diagram of the present application cover, support;
[0015] Figure 3 It is the air flow direction structure schematic diagram in the present application support;
[0016] Figure 4 It is the opening and closing principle structure schematic diagram of the present application exhaust port;
[0017] Figure 5 It is the air flow direction structure schematic diagram in the present application air collecting cover;
[0018] Figure 6 It is the auxiliary heat dissipation structure schematic diagram of the present application heat dissipation fin.
[0019] The meaning of each mark in the figure is:
[0020] 100, cover;101, heat dissipation fan;102, support;102a, auxiliary air channel;103, heat dissipation fin;103a, heat dissipation channel;104, heat pipe;105, heat dissipation base;
[0021] 110, air supply mechanism;111, air guide box;112, air guide pipe;113, exhaust box;113a, exhaust port;113b, limiting plate;114, memory spring;114a, heat conducting plate;115, air guide plate;
[0022] 120, air collecting cover;121, wide mouth;122, elbow. DETAILED DESCRIPTION
[0023] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.
[0024] In the prior art, the fan adjusts the wind speed according to the temperature change of the central processor to ensure the normal operation of the equipment, but for the down-pressing radiator, the closer to the central processor, the more heat conduction the fin receives, and no matter the central processor is in a high temperature state or a low temperature state, the air flow blown by the fan to the fin is from top to bottom, which makes the top fin first exchange heat with the cold air, the heat exchange rate of this part of the fin is high, while the bottom fin exchanges heat with the cold air with rising temperature, the heat exchange efficiency of this part of the fin is low, thereby affecting the cooling effect. Therefore, the application provides a modular aluminum alloy heat dissipation device, as shown in Figures 1-3 The heat dissipation fan 101 controls the rotating speed according to the temperature of the central processor to ensure the normal operation of the equipment through heat dissipation.
[0025] For the above-mentioned problems, the air supply mechanism 110 is arranged on the machine cover 100 close to the air exhaust end of the heat dissipation fan 101, the air supply mechanism 110 includes a wind guiding part and an air adjusting part, the wind guiding part is communicated with the air exhaust end of the heat dissipation fan 101, and the air adjusting part is arranged on the heat dissipation base 105 and is attached to the wind guiding part, in the heat dissipation stage, the air adjusting part is responsible for adjusting the air exhaust amount of the wind guiding part according to the temperature of the central processor, and the wind guiding part is used for horizontally conveying the cold air from the outside of the heat dissipation fin 103 to the inside, so as to form interaction with the vertical air flow blown by the heat dissipation fan 101 to the heat dissipation fin 103, thereby realizing high-efficiency heat dissipation.
[0026] It should be noted that, as shown in Figure 3 The air exhaust end is below the heat dissipation fan 101, and the air inlet end is above the heat dissipation fan 101, and the air flow is formed from top to bottom under the action of the blades of the heat dissipation fan 101, and the air flow carries away the heat when flowing through the heat dissipation fin 103.
[0027] Then, the heat dissipation fin 103 close to the bottom of the support 102 has a notch, and the notch and the support 102 form a heat dissipation channel 103a for air flow circulation, therefore, when the heat dissipation fan 101 stops working, the air flow from top to bottom disappears, and the heat emitted by the central processor and the heat dissipation fin 103 is transmitted upward, that is, the hot air moves upward and diffuses, and after being blocked by the heat dissipation fan 101, the diffused part of the hot air can be diffused to the surrounding through the heat dissipation channel 103a, thereby improving the heat dissipation effect.
[0028] In contrast, when the heat dissipation fan 101 works, the heat generated by the central processor is transferred to the heat dissipation fins 103 through the heat pipe 104, and the contact area with the cold air is increased through the heat dissipation fins 103, so as to dissipate the heat of the central processor faster; when the cold air is transported from the air inlet end to the air outlet end, part of the cold air directly blows to the heat dissipation fins 103 to take away the heat, and the other part of the cold air is transported to the outside of the heat dissipation fins 103 by the air guide part.
[0029] At this time, based on Figure 3 and in combination with Figure 4 , the structure of the air guide part is disclosed, which includes an air guide box 111 located at the air outlet end of the inner side of the cover 100, the air guide box 111 is arc-shaped and one end is open, and the opening at the air guide box 111 faces the longitudinal airflow formed at the air outlet end, so as to guide the airflow at the air outlet end into the air guide box 111 and transport it to the side of the heat dissipation fins 103; then, the other end of the air guide box 111 is communicated with an air guide pipe 112, the air guide pipe 112 is fixed with the support 102, and the air guide pipe 112 is downwardly bent and communicated with an air outlet box 113 close to the side of the heat dissipation fins 103, the air outlet box 113 has a plurality of air outlet openings 113a arranged transversely, and the air outlet openings 113a are used to guide the cold air in the air guide box 111 to the adjacent heat dissipation fins 103, so as to mix with the longitudinal hot airflow.
[0030] The specific heat dissipation working principle is as follows:
[0031] When the heat dissipation fan 101 works, the heat dissipation fan 101 blades rotate to transport the external cold air from the air inlet end to the air outlet end, and because there is a channel for airflow to flow between the adjacent heat dissipation fins 103, part of the longitudinal airflow directly blows to the heat dissipation fins 103, so as to exchange the heat between the cold air and the heat dissipation fins 103, thereby taking away the heat on the heat dissipation fins 103, and after heat exchange, the cold air blows to the central processor below and diffuses to the surrounding after being blocked.
[0032] At the same time, the other part of the cold air is guided into the air outlet box 113 through the opening of the air guide box 111 and the air guide pipe 112, and the temperature of this part of the cold air is lower than that of the cold air after heat exchange, so that this part of the cold air flows out to the heat dissipation fins 103 through the air outlet openings 113a, at this time, the transverse airflow flows out from the air outlet openings 113a, the airflow between the heat dissipation fins 103 after heat exchange is longitudinal airflow, and the two form a mixture, the transverse airflow neutralizes the temperature of the longitudinal airflow (refer to arrows h1 and h2 shown in Figure 5 , which represent the flow direction of the transverse airflow), so as to reduce the temperature of the airflow blowing to the central processor.
[0033] Further, considering that the ambient temperature of the central processor remains stable when the central processor is in an idle state, the temperature change is small, and the heat transferred to the heat dissipation fins 103 is reduced, therefore, the number of air outlets 113a is controlled by the air adjusting part to adjust the amount of transverse air flow blown to the heat dissipation fins 103; the following returns to Figure 4 As shown, the structure of the air adjusting part is disclosed, which includes a memory spring 114 arranged on the heat dissipation base 105, the memory spring 114 exhibits a soft phase and is in an elongated state when the central processor is in an idle stage, and the memory spring 114 exhibits a hard phase and is in a contracted state when it is in a load stage; on the other hand, the top of the memory spring 114 is fixedly connected with an air adjusting plate 115, the air adjusting plate 115 is arranged in close contact with the air outlet 113a, and is used to adjust the number of air outlets 113a according to the change of ambient temperature, so as to realize dynamic adjustment of air outlet.
[0034] That is, when the ambient temperature of the central processor is stable, the memory spring 114 is in an elongated state (i.e. Figure 4 The state shown in the middle), only a certain number of air outlets 113a are not blocked by the air adjusting plate 115, and most of the air outlets 113a are in a blocked state, at this time, the cold air is discharged from the open air outlets 113a and mixed with the longitudinal air flow, in this way, the heat dissipation fins 103 located above the open air outlets 113a are blown to a higher position, and the cold air can flow through a longer path in the channel between the heat dissipation fins 103, thereby taking away more heat on the heat dissipation fins 103 and improving the cooling effect.
[0035] Secondly, when the central processor is in a load state and the ambient temperature rises above the phase transition temperature, since the heat dissipation base 105 is fixedly connected with a heat conducting plate 114a at the bottom, the heat conducting plate 114a is connected with the bottom of the memory spring 114 and can transfer the temperature of the central processor to the memory spring 114 to cause the memory spring 114 to deform, in this way, the memory spring 114 contracts and pulls the air adjusting plate 115 to move downward, in this process, a limiting plate 113b is fixedly arranged on the side wall of the air outlet box 113, the limiting plate 113b is used to promote the air adjusting plate 115 to move along the preset longitudinal direction, the number of open air outlets 113a increases from top to bottom, the amount of transverse air flow transported to the channel between the adjacent heat dissipation fins 103 increases, so that the cold air blown out by the air outlet 113a close to the central processor contacts the central processor faster, thereby improving the cooling effect of the central processor.
[0036] In other words, the cool air from the exhaust end of the cooling fan 101 is introduced into the exhaust box 113 by the air intake box 111. Then, the ambient temperature around the central processing unit is sensed by the memory spring 114, and the number of exhaust vents 113a opened is automatically controlled by the air regulating plate 115 to enhance cooling. Furthermore, the horizontal cool air and the vertical airflow converge and neutralize the temperature of the vertical airflow. While removing heat from the heat sink 103, the distance between the cool air and the central processing unit is also shortened, thus improving the heat dissipation efficiency.
[0037] Furthermore, based on Figure 5 Based on and combined Figure 6 As shown, an air-gathering shroud 120 is fixedly installed on the outside of the casing 100. The connection between the air-gathering shroud 120 and the casing 100 has a wide opening 121 corresponding to the impeller of the cooling fan 101. The end of the air-gathering shroud 120 is connected to a downwardly bent pipe 122. The bent pipe 122 is used to transport the radial airflow generated by the impeller to the outside of the support 102, so that an air curtain is formed on the outside of the support 102; that is, when the impeller rotates (refer to...), Figure 2 As shown), air enters the impeller axially (that is, longitudinally as shown above). Under centrifugal force, the air is thrown out and turns into radial flow (perpendicular to the axis, that is, transverse), passing through... Figure 5 , Figure 6 The middle arrow indicates that the impeller delivers air through the wide opening 121, into the bend 122, and then through the bend 122 to the outside of the support 102.
[0038] At this time, since an auxiliary gas channel 102a is formed in the horizontal direction at the top of the support 102 and the exhaust box 113, when the mixed gas is obstructed, it will disperse along the central processing unit to the surrounding areas (see reference). Figure 5 (The middle arrows f1 and f2 point to), and the diffused hot air will flow upward. At this time, due to the downward airflow formed in the channel between the heat dissipation fins 103, the surrounding air will be forced to move closer to the heat dissipation fins 103 under the action of negative pressure. This will draw in the already dissipated hot air and affect the heat dissipation. Thus, the auxiliary air channel 102a is used to supply the bent pipe 122 to transport air to the inside of the exhaust box 113, providing additional cold air for the heat dissipation fins 103 to achieve auxiliary heat dissipation of the heat dissipation fins 103.
[0039] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.
Claims
1. A modular aluminum alloy heat sink device, comprising a cover (100), a cooling fan (101), a support (102), a cooling fin (103), a heat pipe (104) and a heat sink base (105), characterized in that: The air supply mechanism (110) is arranged on the hood (100) near the exhaust end of the heat dissipation fan (101), and includes an air guiding part and an air adjusting part. The air guiding part is communicated with the exhaust end of the heat dissipation fan (101), and the air adjusting part is arranged on the heat dissipation base (105) and is in abutment with the air guiding part. In the heat dissipation stage, the air adjusting part is responsible for adjusting the air volume of the air guiding part according to the temperature of the central processing unit, and the air guiding part is used for transversely conveying the cold air at the exhaust end from the outside of the heat dissipation fin (103) to the inside, so as to form interaction with the longitudinal air flow blown by the heat dissipation fan (101) to the inside of the heat dissipation fin (103). The air guiding part includes an air guiding box (111) arranged at the exhaust end of the inside of the hood (100), and the air guiding box (111) is arc-shaped and has an open end. The opening of the air guiding box (111) is arranged to face the longitudinal air flow formed at the exhaust end, so as to guide the air flow at the exhaust end into the air guiding box (111) and convey the air flow to the side of the heat dissipation fin (103). The other end of the air guiding box (111) is communicated with an air guiding pipe (112), the air guiding pipe (112) is fixed with the support (102), and the air guiding pipe (112) is downwardly bent and communicated with an air exhaust box (113) close to the side of the heat dissipation fin (103). The air exhaust box (113) has a plurality of air exhaust openings (113a) arranged transversely, and the air exhaust openings (113a) are used for guiding the cold air in the air guiding box (111) to the adjacent heat dissipation fins (103) to mix with the longitudinal hot air flow. The air adjusting part includes a memory spring (114) arranged on the heat dissipation base (105). In the idle stage of the central processing unit, the memory spring (114) is in a soft phase and is in a stretched state. In the load stage, the memory spring (114) is in a hard phase and is in a contracted state.
2. The modular aluminum alloy heat sink of claim 1, wherein: The heat dissipation fin (103) near the bottom of the support (102) has a notch, and the notch and the support (102) form a heat dissipation channel (103a) for air flow.
3. The modular aluminum alloy heat sink of claim 1, wherein: The top of the memory spring (114) is fixedly connected with an air adjusting plate (115), the air adjusting plate (115) is arranged in abutment with the air exhaust opening (113a), and is used for adjusting the number of air exhaust openings (113a) according to the change of the ambient temperature, so as to dynamically adjust the air volume.
4. The modular aluminum alloy heat spreader of claim 1, wherein: The bottom of the heat dissipation base (105) is fixedly connected with a heat conducting plate (114a), the heat conducting plate (114a) is connected with the bottom of the memory spring (114), and can transmit the temperature of the central processing unit to the memory spring (114), so as to cause the memory spring (114) to deform.
5. The modular aluminum alloy heat sink of claim 3, wherein: The side wall of the air exhaust box (113) is fixedly provided with a limiting plate (113b), and the limiting plate (113b) is used for causing the air adjusting plate (115) to move longitudinally.
6. The modular aluminum alloy heat sink of claim 5, wherein: A gas collecting cover (120) is fixed outside the cover (100), and the connecting part of the gas collecting cover (120) and the cover (100) has a wide mouth (121) corresponding to the impeller of the heat dissipation fan (101), and the end of the gas collecting cover (120) is communicated with a downward bent elbow pipe (122), which is used for conveying the radial air flow formed by the impeller to the outside of the support (102), so as to form an air curtain outside the support (102).
7. The modular aluminum alloy heat sink of claim 6, wherein: An auxiliary air passage (102a) is formed horizontally on the top of the support (102) and the exhaust box (113), which is used for conveying the air flow of the elbow pipe (122) to the inside of the exhaust box (113) to achieve auxiliary heat dissipation of the heat dissipation fins (103).
Citation Information
Patent Citations
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