LED touch packaging structure, touch screen and control system

Abstract

The invention provides an LED touch control packaging structure, a touch control screen and a control system. The LED touch control packaging structure comprises a substrate, a pixel module, a sensing assembly and a signal processor. The pixel module is fixedly installed on the front surface of the substrate and comprises at least two pixel units, and a preset distance is kept between every two pixel units to form an optical interval area. The sensing assemblies and the pixel modules are arranged on the same side of the substrate, and the sensing assemblies are arranged in the interval areas between the pixel units, so that a single sensing assembly can serve a plurality of adjacent pixel units at the same time, the use number of the sensing assemblies can be reduced, and the system material cost is effectively reduced while the integrity of the touch function is ensured. The signal processor is integrated on the substrate and establishes a signal transmission channel with the sensing assembly through an electrical circuit. When an external object touches the screen and shields the sensing assembly, the sensing assembly generates a trigger signal, the signal processor responds and outputs corresponding information, and positioning of the touch coordinates is completed.

Description

Technical Field

[0001] This application belongs to the field of LED touch screen technology, and more specifically, relates to an LED touch packaging structure, a touch screen and a control system. Background Technology

[0002] Infrared touchscreens primarily achieve touch functionality by using a cross-shaped optical grid (X / Y axis grating) formed by infrared emitters and receivers arranged around the screen. When a user touches the screen with their finger or another object, some infrared light is blocked. The receivers detect the interruption in the light signal, and the controller calculates the coordinates of the blocked point to achieve touch positioning. However, in multi-touch scenarios, multiple blocking points may create symmetrical interruptions in the light path, easily leading to "ghost points" where the true touch location cannot be determined. This not only requires complex algorithms or additional auxiliary hardware to eliminate false positives but also increases system processing latency, impacting user experience. Secondly, because infrared gratings rely on linear propagation, they cannot adapt to the touch requirements of curved or irregularly shaped screens, severely limiting the application of this technology in flexible display devices or special scenarios. Summary of the Invention

[0003] The purpose of this application is to provide an LED touch packaging structure, a touch screen, and a control system to solve the technical problems of low touch recognition accuracy and poor applicability in the prior art.

[0004] To achieve the above objectives, the technical solution adopted in this application is: An LED touch packaging structure is provided, comprising: substrate; A pixel module is mounted on one side of the substrate, and the pixel module includes at least two pixel units; A sensing component is mounted on the substrate and on the same side as the pixel module, and the sensing component is located at the interval between each pixel unit; the number of sensing components is less than the number of pixel modules; A signal processor is mounted on the substrate and is signal-connected to the sensing component; when the sensing component is blocked, the signal processor is triggered to send a blocking signal.

[0005] As a further improvement to the above technical solution: Optionally, the sensing component includes an infrared emitter and an infrared receiver. When the sensing component is blocked, the infrared signal emitted by the infrared emitter is reflected by the blocking object to the infrared receiver. The infrared receiver sends an electrical signal to the signal processor to trigger the signal processor to send a blocking signal.

[0006] Optionally, the other side of the substrate is provided with pins, including a pixel unit positive pin, a pixel unit negative pin, a sensing component positive pin, a sensing component negative pin, a signal processor transmitting pin, and a signal processor receiving pin. The pixel unit positive pin is connected to the positive terminal of each pixel unit, the pixel unit negative pin is connected to the negative terminal of each pixel unit, the sensing component positive pin is connected to the positive terminal of the sensing component, the sensing component negative pin is connected to the negative terminal of the sensing component, the signal processor transmitting pin is connected to the transmitting end of the signal processor, and the signal processor receiving pin is connected to the receiving end of the signal processor.

[0007] Optionally, the pixel unit includes red LED beads, green LED beads, and blue LED beads. The positive terminal of the pixel unit includes a first positive terminal, a second positive terminal, and a third positive terminal. The first positive terminal is connected to the positive terminal of the red LED bead, the second positive terminal is connected to the positive terminal of the green LED bead, and the third positive terminal is connected to the positive terminal of the blue LED bead. The negative terminals of the red, green, and blue LED beads are all connected to the negative terminal of the pixel unit.

[0008] Optionally, the positive and negative pins of the pixel unit are arranged in a ring along the circumference of the substrate, and the positive pin of the sensing component, the negative pin of the sensing component, the transmitting pin of the signal processor, and the receiving pin of the signal processor are located in the inner area of ​​the ring.

[0009] Optionally, each of the pixel units is arranged in a rectangular array.

[0010] This application also provides an LED touch screen, including the above-described LED touch packaging structure.

[0011] This application also provides an LED touch screen control system, including a controller and the aforementioned LED touch screen; when an external object touches the LED touch screen, the sensing component of the contact area is blocked, thereby triggering the signal processor to send the position information of the corresponding contact area to the controller. After the controller calculates and modifies the display information of the corresponding contact area, it sends it to the driving circuit of the LED touch screen to drive the pixel unit of the corresponding contact area to change the display content and display state.

[0012] The beneficial effects of the LED touch packaging structure, touch screen, and control system provided in this application are as follows: The LED touch packaging structure provided in this application includes a substrate, a pixel module, a sensing component, and a signal processor. The pixel module is fixedly mounted on the front surface of the substrate and includes at least two pixel units, with a preset spacing between each pixel unit to form an optical separation area. The sensing component is disposed on the same side of the substrate as the pixel module, and is arranged in the spacing area between the pixel units, so that a single sensing component can simultaneously serve multiple adjacent pixel units, achieving an asymmetrical configuration relationship between the sensing component and the pixel units. This reduces the number of sensing components used, ensuring that the total number of sensing components is less than the number of pixel units, effectively reducing system material costs while ensuring the integrity of the touch function. The signal processor is integrated on the substrate and establishes a signal transmission channel with the sensing component through electrical circuitry. When an external object touches the screen and blocks the sensing component, the sensing component generates a trigger signal, and the signal processor responds and outputs the corresponding blocking position information, thereby completing the precise positioning of the touch coordinates. The LED touch packaging structure of this application, by optimizing the component spatial layout and signal processing logic, achieves high-precision touch performance while also reducing manufacturing costs.

[0013] The LED touch screen provided in this application includes the above-mentioned LED touch packaging structure, and therefore also has the advantages of the above-mentioned LED touch packaging structure.

[0014] The LED touchscreen control system provided in this application includes a controller and the aforementioned LED touchscreen. When an external object comes into contact with the LED touchscreen, the sensing component in the contact area is blocked, thereby triggering the signal processor to send the position information of the corresponding contact area to the controller. The controller processes and analyzes the received position information, calculates the display content that needs to be modified according to a preset algorithm, and sends the updated display command to the driving circuit of the LED touchscreen. The driving circuit drives and controls the pixel units corresponding to the contact area according to the control command, realizing real-time adjustment of the display state of that area. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 A schematic diagram of the main structure of the LED touch packaging structure provided in this application; Figure 2 A rear view schematic diagram of the LED touch packaging structure provided in this application; Figure 3A schematic diagram of the wiring structure of the pixel unit of the LED touch packaging structure provided in this application; Figure 4 A schematic diagram of the wiring structure of the sensing component in the LED touch packaging structure provided in this application; Figure 5 A schematic diagram of the wiring structure of the signal processor for the LED touch package structure provided in this application.

[0017] The following are the labeling elements in the figure: 1. Substrate; 2. Pixel unit; 21. Red LED bead; 22. Green LED bead; 23. Blue LED bead; 3. Infrared emitter; 4. Infrared receiver; 5. Pins; 51. Pixel unit positive pin; 511. First positive pin; 512. Second positive pin; 513. Third positive pin; 52. Pixel unit negative pin; 53. Sensing component positive pin; 54. Sensing component negative pin; 55. Signal processor transmit pin; 56. Signal processor receive pin; 6. Signal processor. Detailed Implementation

[0018] The following describes embodiments of the present invention in detail, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and are not to be construed as limiting the present invention.

[0019] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0020] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0021] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0022] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0023] Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of the present invention.

[0024] In the following description, suffixes such as "module," "part," "component," or "unit" are used only for the purpose of illustrative purposes and have no specific meaning in themselves. Therefore, they can be used interchangeably.

[0025] The present invention will now be described in further detail with reference to specific embodiments and accompanying drawings.

[0026] like Figure 1 and Figure 2 As shown, this application provides an LED touch packaging structure, including a substrate 1, a pixel module, a sensing component, and a signal processor 6.

[0027] The substrate 1 serves as the main supporting component, providing mechanical support and electrical connection for other functional components. A pixel module is fixedly mounted on the front or front surface of the substrate 1, comprising at least two pixel units 2, with a preset spacing between each pixel unit 2 to form an optical interval area. A sensing component is located on the same side of the substrate 1 as the pixel module, arranged in the interval area between each pixel unit 2. This allows a single sensing component to simultaneously serve multiple adjacent pixel units 2, achieving an asymmetrical configuration between the sensing component and the pixel units 2. This reduces the number of sensing components required, ensuring the total number of sensing components is less than the number of pixel units 2, effectively reducing system material costs while maintaining the integrity of the touch function. A signal processor 6 is integrated on the substrate 1, establishing a signal transmission channel with the sensing component through electrical circuitry. When an external object touches the screen and obstructs the sensing component, the sensing component generates a trigger signal, and the signal processor 6 responds and outputs the corresponding obstruction position information, thereby achieving precise touch coordinate positioning.

[0028] The LED touch packaging structure of this application reduces manufacturing costs while achieving high-precision touch performance by optimizing the component spatial layout and signal processing logic.

[0029] like Figure 1 and Figure 4 As shown in one specific embodiment of this application, the sensing component includes an infrared emitter 3 and an infrared receiver 4. When an external object touches the screen surface, the infrared signal continuously emitted by the infrared emitter 3 is reflected by the obstruction, and the reflected infrared signal is captured by the adjacent infrared receiver 4. The infrared receiver 4 converts the received optical signal into a corresponding electrical signal and transmits it to the signal processor 6 through a preset signal transmission path. The signal processor 6 processes the received electrical signal, thereby triggering the system to generate a corresponding obstruction signal.

[0030] like Figures 1 to 5 As shown, in one specific embodiment of this application, pins 5 are integrated on the other side of the substrate 1. Pins 5 include a positive pin 51 and a negative pin 52 of the pixel unit, which form a parallel circuit with the positive and negative terminals of each pixel unit 2, respectively; the positive pin 53 and the negative pin 54 of the sensing component establish a stable power supply circuit with the sensing component; the signal processor transmitting pin 55 and the signal processor receiving pin 56 are respectively connected to the transmitting end and the receiving end of the signal processor 6, forming a signal transmission channel.

[0031] like Figures 1 to 3As shown, in a specific embodiment of this application, the pixel unit 2 adopts a three-primary-color LED combination structure, including a red LED bead 21, a green LED bead 22, and a blue LED bead 23, which work together to achieve full-color display function. The positive pin 51 of the pixel unit adopts a branched design, specifically including a first positive pin 511, a second positive pin 512, and a third positive pin 513, which are respectively connected to the positive input terminals of the red LED bead 21, the green LED bead 22, and the blue LED bead 23. The negative pin 52 of the pixel unit serves as a common negative terminal and is connected to the negative output terminals of the three LED beads, forming a complete current loop. This circuit configuration enables independent driving control of each color LED bead. By adjusting the input signals of different positive pins, the luminous intensity ratio of the three primary colors can be precisely controlled, thereby mixing to produce the desired display color.

[0032] like Figure 2 As shown, in one specific embodiment of this application, the positive pin 51 and negative pin 52 of the pixel unit are arranged in a ring array along the circumferential edge of the substrate 1. The positive pin 53 of the sensing component, the negative pin 54 of the sensing component, the signal processor transmitting pin 55, and the signal processor receiving pin 56 are concentrated in the inner area surrounded by the ring pin array, forming a compact core signal processing pin group. This layout scheme achieves logical isolation of pin types through functional partitioning. The physical separation of the outer ring power pins and the inner ring signal pins effectively reduces the risk of electromagnetic interference during signal transmission, while reserving sufficient space in the central area of ​​the substrate 1 for integrating other functional modules.

[0033] like Figure 1 As shown, in one specific embodiment of this application, the pixel units 2 are arranged in a rectangular array. Each pixel unit 2 maintains equal spacing in both the horizontal and vertical directions, forming a uniformly distributed grid structure. This rectangular array arrangement is beneficial for achieving uniformity in the displayed image and facilitates a correspondence with the spacing areas of the sensing components.

[0034] This application also provides an LED touch screen, including the LED touch packaging structure in the above embodiments, and therefore also has the advantages of the LED touch packaging structure in the above embodiments.

[0035] This application also provides an LED touch screen control system, including a controller and the LED touch screen in the above embodiments. When an external object touches the LED touch screen, the sensing component of the contact area is blocked, thereby triggering the signal processor to send the position information of the corresponding contact area to the controller. The controller processes and analyzes the received position information, calculates the display content that needs to be modified according to a preset algorithm, and sends the updated display command to the driving circuit of the LED touch screen. The driving circuit drives and controls the pixel unit 2 corresponding to the contact area according to the control command, realizing real-time adjustment of the display state of that area.

[0036] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An LED touch packaging structure, characterized in that, include: substrate(1); A pixel module is mounted on one side of the substrate (1), and the pixel module includes at least two pixel units (2). A sensing component is mounted on the substrate (1) and on the same side as the pixel module. The sensing component is located at the interval between each pixel unit (2). The number of sensing components is less than the number of pixel modules. A signal processor is mounted on the substrate (1) and is signal-connected to the sensing component; when the sensing component is blocked, the signal processor is triggered to send a blocking signal.

2. The LED touch packaging structure as described in claim 1, characterized in that, The sensing component includes an infrared transmitter (3) and an infrared receiver (4). When the sensing component is blocked, the infrared signal emitted by the infrared transmitter (3) is reflected by the blocking object to the infrared receiver (4). The infrared receiver (4) sends an electrical signal to the signal processor to trigger the signal processor to send a blocked signal.

3. The LED touch packaging structure as described in claim 1, characterized in that, The other side of the substrate (1) is provided with pins (5), the pins (5) include a pixel unit positive pin (51), a pixel unit negative pin (52), a sensor component positive pin (53), a sensor component negative pin (54), a signal processor transmitting pin (55), and a signal processor receiving pin (56). The pixel unit positive pin (51) is connected to the positive terminal of each pixel unit (2), the pixel unit negative pin (52) is connected to the negative terminal of each pixel unit (2), the sensor component positive pin (53) is connected to the positive terminal of the sensor component, the sensor component negative pin (54) is connected to the negative terminal of the sensor component, the signal processor transmitting pin (55) is connected to the transmitting end of the signal processor, and the signal processor receiving pin (56) is connected to the receiving end of the signal processor.

4. The LED touch packaging structure as described in claim 3, characterized in that, The pixel unit (2) includes a red LED (21), a green LED (22), and a blue LED (23). The positive pin (51) of the pixel unit includes a first positive pin (511), a second positive pin (512), and a third positive pin (513). The first positive pin (511) is connected to the positive terminal of the red LED (21), the second positive pin (512) is connected to the positive terminal of the green LED (22), and the third positive pin (513) is connected to the positive terminal of the blue LED (23). The negative terminals of the red LED (21), green LED (22), and blue LED (23) are all connected to the negative pin (52) of the pixel unit.

5. The LED touch packaging structure as described in claim 3, characterized in that, The positive pin (51) and negative pin (52) of the pixel unit are arranged in a ring along the circumference of the substrate (1), and the positive pin (53), negative pin (54), transmitting pin (55) and receiving pin (56) of the sensing component are located in the inner area of ​​the ring.

6. The LED touch packaging structure according to any one of claims 1 to 5, characterized in that, Each pixel unit (2) is arranged in a rectangular array.

7. An LED touch screen, characterized in that, Includes the LED touch packaging structure as described in any one of claims 1 to 6.

8. An LED touch screen control system, characterized in that, Includes a controller and an LED touchscreen as described in claim 7; When an external object touches the LED touch screen, the sensing component of the contact area is blocked, thereby triggering the signal processor to send the position information of the corresponding contact area to the controller. After the controller calculates and modifies the display information of the corresponding contact area, it sends it to the driving circuit of the LED touch screen to drive the pixel unit (2) of the corresponding contact area to change the display content and display state.

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