A quantum chip packaging device

Abstract

The application belongs to the technical field of chip packaging, and discloses a quantum chip packaging device, which has the technical features that the device comprises a substrate, the surface of the substrate is provided with a mounting groove, a chip body is placed in the mounting groove, the surface of the substrate is provided with a packaging cover, the surface of the substrate is provided with a fixing mechanism, the fixing mechanism comprises a clamping assembly and an adjusting assembly, the surface of the substrate is provided with a protection mechanism matched with the chip body, the protection mechanism comprises a blocking assembly and a positioning assembly, the blocking assembly comprises two groups of fixed covers fixedly installed on the surface of the substrate, a plurality of protection covers are arranged in the fixed covers, and an extrusion assembly is arranged on the inner top wall of the protection cover; the positioning assembly and the fixed cover are matched with each other, the relative positions of the plurality of protection covers can be conveniently adjusted, the protection cover and the packaging cover are matched with each other, the chip body can be doubly protected against impact, and the use effect of the chip body is effectively improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip packaging, and in particular to a quantum chip packaging device. BACKGROUND

[0002] The normal operation of a quantum chip requires an extremely stable working environment, so that the quantum chip is free from external interference. The bare chip is easily affected by the surrounding environment, which affects the transmission of signals on the chip and its performance, resulting in poor performance or even failure of the chip. In general, the bare quantum chip needs to be packaged before use to reduce environmental interference.

[0003] In use, the packaging device generally directly fixes and installs the chip on the surface of the substrate, and then installs a packaging cover on the surface of the substrate to seal the chip on the surface of the substrate. The existing packaging method cannot conveniently install and dismount the chip on the surface of the substrate in use, and the protection method of the packaging cover is relatively single. When subjected to external impact, the packaging cover is easily damaged after being deformed by the impact, which easily causes the chip to be damaged by pressure. SUMMARY

[0004] The purpose of the present application is to provide a quantum chip packaging device to solve the problems raised in the background art.

[0005] To achieve the above purpose, the present application provides the following technical scheme:

[0006] A quantum chip packaging device, comprising a substrate, the surface of the substrate is provided with a mounting groove, the mounting groove is placed with a chip body, the surface of the substrate is provided with a packaging cover, the surface of the substrate is provided with a fixing mechanism matched with the packaging cover, the fixing mechanism comprises a clamping assembly and an adjusting assembly, the clamping assembly is located on the surface of the substrate and connected with the packaging cover, the adjusting assembly is located on the surface of the substrate and connected with the clamping assembly, the adjusting assembly is used to adjust the position of the packaging cover on the surface of the substrate by cooperating with the clamping assembly, the surface of the substrate is provided with a protection mechanism matched with the chip body, the protection mechanism comprises a blocking assembly and a positioning assembly, the blocking assembly comprises two groups of fixed covers respectively located on both sides of the mounting groove and fixedly installed on the surface of the substrate, the fixed cover is a inverted U-shaped structure, a plurality of protection covers are arranged in the fixed cover, the protection cover is a inverted U-shaped structure, a plurality of protection covers are sequentially sleeved from inside to outside, the fixed cover and the outermost protection cover are connected in a sliding manner along the horizontal direction, and the adjacent two groups of protection covers are connected in a sliding manner, the positioning assembly is located on the surface of the protection cover, and the positioning assembly is used to adjust the relative position between the fixed cover and the plurality of protection covers, the inner top wall of the protection cover is provided with an extrusion assembly matched with the chip body, and the extrusion assembly is used to fix the position of the chip body in the mounting groove.

[0007] As a further scheme of the present application: the clamping assembly comprises a rectangular ring-shaped bottom groove opened on the surface of the base plate, the bottom end of the packaging cover is inserted into the bottom groove, a plurality of groups of clamping holes are opened at the bottom end of the sidewall of the packaging cover at equal intervals, a receiving hole is opened on the sidewall of the bottom groove, a clamping column matched with the clamping hole is slidably installed in the receiving hole, and an extrusion spring is fixedly installed in the receiving hole, with the telescopic end of the extrusion spring connected with the clamping column.

[0008] As a further scheme of the present application: the adjusting assembly comprises a plurality of groups of wire holes opened downward on the surface of the base plate, the wire holes are communicated with the receiving hole, and a control rope is fixedly installed at one end of the clamping column in the receiving hole, with the end of the control rope away from the clamping column extending through the wire hole to the surface of the base plate and fixedly connected with a control ring.

[0009] As a further scheme of the present application: the positioning assembly comprises guide grooves opened on the opposite two inner sidewalls of the fixing cover and the opposite two inner sidewalls of the protective cover respectively, a guide block is fixedly installed on the surface of the protective cover, the guide block is slidably installed in the outer guide groove, and magnetic adsorption pieces are fixedly installed on the opposite two sidewalls of the two innermost protective covers respectively.

[0010] As a further scheme of the present application: the extrusion assembly comprises a plurality of groups of parallelly distributed receiving grooves opened on the inner top wall of the protective cover, an extrusion rod is rotatably installed at one end of the receiving groove, an extrusion plate is rotatably installed at the end of the extrusion rod away from the receiving groove, a control spring is fixedly installed in the receiving groove, and the telescopic end of the control spring is connected with the extrusion rod.

[0011] As a further scheme of the present application: the guide block is made of magnetic material, and magnetic positioning blocks matched with the guide block are fixedly installed at the two ends of the guide groove respectively.

[0012] As a further scheme of the present application: the bottom end of the protective cover is slidably connected with the surface of the base plate.

[0013] Compared with the prior art, the present application has the following beneficial effects: through the cooperation of the positioning assembly and the fixing cover, the relative positions of the plurality of protective covers can be conveniently adjusted, the protective cover and the packaging cover are matched with each other, the chip body can be doubly protected against impact, and the use effect of the chip body is effectively improved. The problem that the protection mode of the packaging cover is single, the chip is easily damaged under pressure after the packaging cover is deformed by impact, and the like are solved.

[0014] Through the cooperation of the extrusion assembly and the protective cover, the packaging cover can be conveniently installed and removed on the surface of the base plate. Through the cooperation of the clamping assembly and the adjusting assembly, the packaging cover can be conveniently installed and removed on the surface of the base plate, and the problem that the chip cannot be conveniently installed and removed on the surface of the base plate is solved. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a perspective structural schematic view of a quantum chip packaging device provided in an embodiment of the present application.

[0016] Figure 2 It is a front view structural schematic view of a quantum chip packaging device provided in an embodiment of the present application.

[0017] Figure 3 It is a structural schematic view of a protective cover in a quantum chip packaging device provided in an embodiment of the present application.

[0018] Figure 4 It is a schematic view of a chip body and its connecting structure in a quantum chip packaging device provided in an embodiment of the present application.

[0019] Figure 5 It is a schematic view of an extrusion rod and its connecting structure in a quantum chip packaging device provided in an embodiment of the present application.

[0020] Figure 6 It is a structural schematic view of a magnetic positioning block in a quantum chip packaging device provided in an embodiment of the present application. Figure 2 It is an enlarged structural schematic view of A.

[0021] Figure 7 It is an enlarged structural schematic view of B. Figure 2 It is an enlarged structural schematic view of B.

[0022] Figure 8 It is a structural schematic view of a guide groove and a guide block in a quantum chip packaging device provided in an embodiment of the present application.

[0023] Wherein: 1 - base plate, 11 - mounting groove, 2 - packaging cover, 3 - chip body, 4 - fixing mechanism, 41 - clamping assembly, 411 - bottom groove, 412 - clamping hole, 413 - receiving hole, 414 - extrusion spring, 415 - clamping column, 42 - adjusting assembly, 421 - wire hole, 422 - control rope, 423 - control ring, 5 - protection mechanism, 51 - blocking assembly, 511 - fixed cover, 512 - protective cover, 52 - positioning assembly, 521 - guide groove, 522 - guide block, 523 - magnetic adsorption piece, 6 - extrusion assembly, 61 - receiving groove, 62 - extrusion rod, 63 - control spring, 64 - extrusion plate, 7 - magnetic positioning block. DETAILED DESCRIPTION

[0024] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0025] The specific implementation of the present application is described in detail below in combination with specific embodiments.

[0026] For example, Figure 1、 Figure 2 、 Figure 3 As shown in FIG. 1, it is a structural diagram of a quantum chip packaging device provided by an embodiment of the present application, comprising a substrate 1, the surface of the substrate 1 is provided with a mounting groove 11, the chip body 3 is placed in the mounting groove 11, the surface of the substrate 1 is provided with a packaging cover 2, the surface of the substrate 1 is provided with a fixing mechanism 4 matched with the packaging cover 2, the fixing mechanism 4 comprises a clamping assembly 41 and an adjusting assembly 42, the clamping assembly 41 is located on the surface of the substrate 1 and connected with the packaging cover 2, the adjusting assembly 42 is located on the surface of the substrate 1 and connected with the clamping assembly 41, the adjusting assembly 42 is used to adjust the position of the packaging cover 2 on the surface of the substrate 1 by matching with the clamping assembly 41, the surface of the substrate 1 is provided with a protection mechanism 5 matched with the chip body 3, the protection mechanism 5 comprises a blocking assembly 51 and a positioning assembly 52, the blocking assembly 51 comprises two groups of fixed covers 511 fixedly installed on the surface of the substrate 1 and located on both sides of the mounting groove 11 respectively, the fixed cover 511 is a reverse U-shaped structure, a plurality of protection covers 512 are arranged in the fixed cover 511, the protection cover 512 is a reverse U-shaped structure, the plurality of protection covers 512 are sequentially sleeved from inside to outside, the fixed cover 511 and the outermost protection cover 512 are connected in a sliding manner along the horizontal direction, and the adjacent two groups of protection covers 512 are connected in a sliding manner, the positioning assembly 52 is located on the surface of the protection cover 512, and the positioning assembly 52 is used to adjust the relative position between the fixed cover 511 and the plurality of protection covers 512, the inner top wall of the protection cover 512 is provided with an extrusion assembly 6 matched with the chip body 3, and the extrusion assembly 6 is used to fix the position of the chip body 3 in the mounting groove 11.

[0027] Initially, the positioning assembly 52 positions the protection cover 512, at this time, the plurality of protection covers 512 are sequentially sleeved in the fixed cover 511 from inside to outside, the fixed cover 511 and the plurality of protection covers 512 are respectively located on both sides of the mounting groove 11, the chip body 3 to be installed is placed in the mounting groove 11 on the surface of the substrate 1, the innermost protection cover 512 is moved outwardly of the fixed cover 511 by the staff, the positioning assembly 52 controls the plurality of protection covers 512 to extend outwardly of the fixed cover 511 and be sleeved outside the chip body 3 in sequence, after the protection cover 512 covers the chip body 3 as a whole, the extrusion assembly 6 continuously applies a pushing force to the chip body 3, and then the chip body 3 is stably installed in the mounting groove 11. The packaging cover 2 is placed on the surface of the substrate 1, the adjusting assembly 42 and the clamping assembly 41 are matched with each other, so that the packaging cover 2 can be conveniently fixed on the surface of the substrate 1, at this time, the packaging cover 2 is sleeved outside the fixed cover 511 and the protection cover 512, and the packaging cover 2 and the protection cover 512 are matched with each other, so that the chip body 3 can be doubly protected.

[0028] When the chip body 3 needs to be disassembled, the adjusting assembly 42 cooperates with the clamping assembly 41, so that the packaging cover 2 can be conveniently removed from the surface of the substrate 1. The protective cover 512 is pushed towards the fixed cover 511, the positioning assembly 52 controls a plurality of protective covers 512 to be sleeved in the fixed cover 511, at this time the pressing assembly 6 releases the restriction on the chip body 3, and the staff can conveniently take the chip body 3 out of the mounting groove 11.

[0029] As shown in Figure 2 , Figure 3 , Figure 6 As a preferred embodiment of the present application, the clamping assembly 41 comprises a rectangular annular bottom groove 411 formed on the surface of the substrate 1, the bottom end of the packaging cover 2 is inserted into the bottom groove 411, a plurality of clamping holes 412 are formed at the bottom end of the side wall of the packaging cover 2, a receiving hole 413 is formed in the side wall of the bottom groove 411, a clamping column 415 is slidably installed in the receiving hole 413 and cooperates with the clamping hole 412, and a pressing spring 414 is fixedly installed in the receiving hole 413 and connected to the clamping column 415.

[0030] The adjusting assembly 42 controls the clamping column 415 to move into the receiving hole 413, the packaging cover 2 is placed on the surface of the substrate 1, the bottom end of the packaging cover 2 is inserted into the bottom groove 411, at this time the adjusting assembly 42 releases the restriction on the clamping column 415, the pressing spring 414 pushes the clamping column 415 to move into the bottom groove 411, the clamping column 415 is inserted into the clamping hole 412 on the surface of the packaging cover 2, and the clamping column 415 cooperates with the clamping hole 412 to conveniently fix the packaging cover 2 on the surface of the substrate 1. When the packaging cover 2 needs to be disassembled, the adjusting assembly 42 controls the clamping column 415 to move into the receiving hole 413 again, at this time the clamping column 415 and the clamping hole 412 are separated from each other, and the packaging cover 2 can be conveniently taken out of the bottom groove 411.

[0031] As shown in Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 6 As a preferred embodiment of the present application, the adjusting assembly 42 comprises a plurality of wire holes 421 formed downward on the surface of the substrate 1, the wire holes 421 are in communication with the receiving hole 413, one end of the clamping column 415 located in the receiving hole 413 is fixedly installed with a control rope 422, and the other end of the control rope 422 extends to the surface of the substrate 1 through the wire hole 421 and is fixedly connected with a control ring 423.

[0032] At the beginning, the control ring 423 is on the surface of the substrate 1, when the package cover 2 needs to be installed or disassembled, pull the control ring 423, the control ring 423 cooperates with the control rope 422, and the clamping column 415 can be conveniently pulled into the storage hole 413. Loosen the control ring 423, the control ring 423 and the control rope 422 are disengaged from the clamping column 415, and the clamping column 415 is pushed by the compression spring 414 to move into the bottom groove 411.

[0033] As shown in Figure 2 、 Figure 7 、 Figure 8 As a preferred embodiment of the present application, the positioning assembly 52 includes two inner side walls of the fixed cover 511 and two inner side walls of the protective cover 512, and the guide grooves 521 are respectively arranged on the two inner side walls of the protective cover 512. The guide block 522 is fixedly installed on the surface of the protective cover 512, and the guide block 522 is slidably installed in the outer guide groove 521. The two innermost protective covers 512 are respectively fixedly installed on the two side walls of the two innermost protective covers 512.

[0034] The guide block 522 slides in the guide groove 521 to control the sliding of the plurality of protective covers 512 on the surface of the substrate 1. When the chip body 3 needs to be protected, the two innermost protective covers 512 on both sides of the mounting groove 11 are pushed towards the middle, and after the plurality of protective covers 512 are sequentially moved to the outside of the fixed cover 511, the two innermost protective covers 512 are in close contact with each other, and the two magnetic adsorption pieces 523 are connected into a whole by magnetic force, thereby controlling the plurality of protective covers 512 to be connected into a whole. The plurality of protective covers 512 are sleeved on the outer side of the chip body 3, and the protective cover 512 can efficiently protect the chip body 3. When the chip body 3 needs to be disassembled, the two innermost protective covers 512 are pushed towards the fixed cover 511, and the two magnetic adsorption pieces 523 are separated from each other. The guide block 522 moves in the opposite direction in the guide groove 521, and the plurality of protective covers 512 can be sequentially sleeved in the fixed cover 511.

[0035] As shown in Figure 2 、 Figure 4 、 Figure 5 、 Figure 7 As a preferred embodiment of the present application, the extrusion assembly 6 includes a plurality of parallelly arranged storage grooves 61 formed in the inner top wall of the protective cover 512. The extrusion rod 62 is rotatably installed at one end of the inner cavity of the storage groove 61. The extrusion plate 64 is rotatably installed at the end of the extrusion rod 62 away from the storage groove 61. The control spring 63 is fixedly installed in the storage groove 61, and the extension end of the control spring 63 is connected with the extrusion rod 62.

[0036] After the multiple sets of protective covers 512 are unfolded in turn and cover the chip body 3, the control spring 63 exerts a pushing force on the pressing rod 62, the pressing rod 62 rotates to the outside of the storage groove 61, at this time, the pressing plate 64 at the bottom end of the pressing rod 62 is attached to the surface of the chip body 3, the pressing rod 62 and the pressing plate 64 cooperate with each other to exert a pushing force on the chip body 3, so that the chip body 3 can be conveniently fixed in the mounting groove 11. When the chip body 3 needs to be disassembled, the multiple sets of protective covers 512 are pushed to move towards the fixed cover 511, the inner protective cover 512 exerts a pushing force on the pressing rod 62 when moving, thereby pushing the whole pressing rod 62 to move into the storage groove 61.

[0037] As shown in Figure 8 As a preferred embodiment of the present application, the guide block 522 is made of a magnetic material, and the two ends of the guide groove 521 are respectively fixedly installed with magnetic positioning blocks 7 which cooperate with the guide block 522.

[0038] After the guide block 522 moves to the end of the guide groove 521, the magnetic positioning block 7 is connected to the guide block 522 as a whole through magnetic attraction, effectively improving the stability of the protective cover 512.

[0039] As a preferred embodiment of the present application, the bottom end of the protective cover 512 is slidably connected to the surface of the substrate 1. The sliding connection of the bottom end of the protective cover 512 to the surface of the substrate 1 can effectively improve the stability of the protective cover 512.

[0040] The working principle of the present application is as follows: initially, the multiple sets of protective covers 512 are sequentially sleeved in the fixed cover 511 from inside to outside, the fixed cover 511 and the multiple sets of protective covers 512 are respectively located on both sides of the mounting groove 11, the chip body 3 to be installed is placed in the mounting groove 11 on the surface of the substrate 1, the innermost protective cover 512 is pulled by the worker to move towards the outside of the fixed cover 511, the guide block 522 slides in the guide groove 521 to control the multiple sets of protective covers 512 to extend to the outside of the fixed cover 511 in turn and be sleeved outside the chip body 3, after the protective cover 512 covers the whole chip body 3, the two innermost protective covers 512 are attached to each other at this time, the two magnetic adsorption pieces 523 are connected as a whole through magnetic attraction, thereby controlling the multiple sets of protective covers 512 to be connected as a whole, the multiple sets of protective covers 512 are sleeved outside the chip body 3, and the protective cover 512 can efficiently protect the chip body 3. The control spring 63 exerts a pushing force on the pressing rod 62, the pressing rod 62 rotates to the outside of the storage groove 61, at this time, the pressing plate 64 at the bottom end of the pressing rod 62 is attached to the surface of the chip body 3, the pressing rod 62 and the pressing plate 64 cooperate with each other to exert a pushing force on the chip body 3, so that the chip body 3 can be conveniently fixed in the mounting groove 11.

[0041] Pull the control ring 423, the control ring 423 cooperates with the control rope 422, can conveniently pull the clamping column 415 to the storage hole 413. The packaging cover 2 is placed on the surface of the substrate 1, the bottom end of the packaging cover 2 is inserted into the bottom groove 411, at this time the clamping column 415 is released, the compression spring 414 pushes the clamping column 415 to move towards the bottom groove 411, the clamping column 415 is inserted into the clamping hole 412 on the surface of the packaging cover 2, the clamping column 415 cooperates with the clamping hole 412, can conveniently fix the packaging cover 2 on the surface of the substrate 1.

[0042] When the chip body 3 needs to be disassembled, the two groups of innermost protective covers 512 are pushed to move towards the fixed cover 511, at this time the two groups of magnetic adsorption pieces 523 are separated from each other, the guide block 522 moves reversely in the guide groove 521, and a plurality of protective covers 512 can be sequentially sleeved in the fixed cover 511.

[0043] The preferred embodiments of the present application are described in detail above, but the present application is not limited to the above-mentioned embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the purpose of the present application.

Claims

1. A quantum chip packaging device, comprising a substrate, a mounting groove is formed on the surface of the substrate, a chip body is placed in the mounting groove, and a packaging cover is arranged on the surface of the substrate, characterized in that, The substrate surface is provided with a fixing mechanism matched with the package cover; The fixing mechanism comprises a clamping assembly and an adjusting assembly, the clamping assembly is located on the substrate surface and connected with the package cover, and the adjusting assembly is located on the substrate surface and connected with the clamping assembly, and the adjusting assembly is used to adjust the position of the package cover on the substrate surface by matching with the clamping assembly; The substrate surface is provided with a protection mechanism matched with the chip body, and the protection mechanism comprises a blocking assembly and a positioning assembly; The blocking assembly comprises two groups of fixed covers respectively located on both sides of the mounting groove and fixedly installed on the substrate surface, the fixed cover is a reverse U-shaped structure, a plurality of protection covers are arranged in the fixed cover, the protection cover is a reverse U-shaped structure, the plurality of protection covers are sequentially sleeved from inside to outside, the fixed cover and the outermost protection cover are connected in a sliding manner along the horizontal direction, and the adjacent two groups of protection covers are connected in a sliding manner; The positioning assembly is located on the surface of the protection cover, and the positioning assembly is used to adjust the relative position between the fixed cover and the plurality of protection covers; The inner top wall of the protection cover is provided with an extrusion assembly matched with the chip body, and the extrusion assembly is used to fix the position of the chip body in the mounting groove.

2. The quantum chip packaging apparatus of claim 1, wherein, The clamping assembly comprises a rectangular ring-shaped bottom groove formed in the substrate surface, the bottom end of the package cover is inserted into the bottom groove, a plurality of clamping holes are formed in the bottom end of the sidewall of the package cover at equal intervals, a receiving hole is formed in the sidewall of the bottom groove, a clamping column matched with the clamping hole is slidably installed in the receiving hole, an extrusion spring is fixedly installed in the receiving hole, and the extension end of the extrusion spring is connected with the clamping column.

3. The quantum chip packaging apparatus of claim 2, wherein, The adjusting assembly comprises a plurality of wire holes formed downward in the substrate surface, the wire holes are communicated with the receiving hole, one end of the clamping column located in the receiving hole is fixedly installed with a control rope, and the end of the control rope away from the clamping column extends through the wire hole to the substrate surface and is fixedly connected with a control ring.

4. The quantum chip packaging apparatus of claim 1, wherein, The positioning assembly comprises guide grooves formed in the opposite two inner sidewalls of the fixed cover and the opposite two inner sidewalls of the protection cover, respectively, guide blocks are fixedly installed on the surface of the protection cover, the guide blocks are slidably installed in the outer guide grooves, and magnetic adsorption pieces are fixedly installed on the opposite two sidewalls of the two innermost protection covers.

5. The quantum chip packaging apparatus of claim 1, wherein, The extrusion assembly comprises a plurality of parallelly distributed receiving grooves formed in the inner top wall of the protection cover, an extrusion rod is rotatably installed at one end of the receiving groove, an extrusion plate is rotatably installed at the end of the extrusion rod away from the receiving groove, a control spring is fixedly installed in the receiving groove, and the extension end of the control spring is connected with the extrusion rod.

6. The quantum chip packaging apparatus of claim 4, wherein, The guide blocks are made of magnetic material, and magnetic positioning blocks matched with the guide blocks are fixedly installed at both ends of the guide grooves.

7. The quantum chip packaging apparatus of claim 1, wherein, The bottom end of the protection cover is connected with the substrate surface in a sliding manner.

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