Laser and electronic equipment

Abstract

The invention belongs to the technical field of laser, and particularly relates to a laser and electronic equipment, and the laser comprises a substrate, an optical assembly which covers the substrate and forms an accommodation cavity with the substrate, and a pedestal and a laser chip which are located in the accommodation cavity. The base comprises a horizontal base body and an inclined base body, the laser chip is arranged on the top face of the horizontal base body, the bottom face of the base body is arranged on the substrate, and the top face of the inclined base body is an inclined face inclining towards the horizontal base body. And beam quality is improved. The electronic equipment comprises an equipment body and the laser, wherein the laser is connected to the equipment body. According to the laser provided by the invention, the field angle of the laser can be effectively improved, and the energy distribution of light spots of the laser can be more uniform.

Description

Technical Field

[0001] This application pertains to the field of lasers, and more specifically, relates to a laser and an electronic device. Background Technology

[0002] Vertical-cavity surface-emitting lasers (VCSELs) are widely used in optoelectronics due to their advantages such as high beam quality and low power consumption. However, existing VCSEL packaging technology has significant drawbacks, including a limited field of view (FOV), and conventional devices are limited to 1 / e 2 The standard horizontal field of view is only 120° and the vertical field of view is 90°, which is much smaller than the 120° to 140° coverage range of LEDs. In addition, the light spot shows an uneven distribution of "weak in the center and strong in the central ring", resulting in insufficient light coverage area in close-range scenarios (such as medical aesthetic laser treatment and short-range sensing). Summary of the Invention

[0003] The purpose of this application is to provide a laser to solve the technical problems of insufficient field of view coverage and uneven spot distribution in the prior art.

[0004] To achieve the above objectives, the technical solutions adopted in the embodiments of the present application are:

[0005] On one hand, a laser is provided, including a substrate, an optical component covered on the substrate and forming a cavity between the substrate and the substrate, and a base and a laser chip located in the cavity. The base includes a horizontal base on which the laser chip is disposed on its top surface and an inclined base. The bottom surface of the base is disposed on the substrate, and the top surface of the inclined base is an inclined surface that is inclined toward the horizontal base.

[0006] Optionally, the tilt angle θ of the top surface of the tilted base is proportional to the maximum field of view α of the laser chip.

[0007] Optionally, the optical component includes a bracket and an optical cover plate, the bracket being disposed along the edge of the substrate, and the optical cover plate being mounted on the bracket and forming a receiving cavity between the bracket and the substrate.

[0008] Optionally, the highest point H of the bracket is connected to the center point M of the laser chip located on the inclined base, and the line connecting the bracket and the substrate forms an angle β, where θ+(180°-α) / 2≥β.

[0009] Optionally, the inclined base is closer to the edge of the substrate than the horizontal base.

[0010] Optionally, the horizontal base is disposed at the center of the substrate, and the inclined base is disposed in both the horizontal and vertical directions of the horizontal base.

[0011] Optionally, the laser further includes a cooling inlet tube and a cooling outlet tube, which are respectively connected to opposite sides of the optical component.

[0012] Optionally, the base is provided with a cooling channel that divides the base into two parts, one end of the cooling channel facing the cooling inlet pipe and the other end of the cooling channel facing the cooling outlet pipe.

[0013] Optionally, the laser further includes a circuit board connected to the optical component, the circuit board being located between the laser chip and the base, and a sealed space being formed between the circuit board and the substrate, with the cooling inlet pipe and the cooling outlet pipe located within the sealed space.

[0014] The laser provided in this application embodiment has at least the following beneficial effects: Compared with the prior art, the laser provided in this application embodiment utilizes a substrate and an optical component that irradiates the substrate to form a receiving cavity for accommodating a base and a laser chip. The base is disposed on the substrate and is used to support the laser chip. By using a horizontal base and an inclined base, the laser chip can be presented in different mounting states. The horizontal top surface of the horizontal base makes the laser chip set horizontally, and the inclined top surface of the inclined base makes the laser chip tilted at a specific angle. Through this design of horizontal and inclined laser chips, the field of view of the laser can be effectively improved, and the energy distribution of the laser spot can be made more uniform, thereby improving the beam quality.

[0015] On the other hand, this application also provides an electronic device, which includes a device body and a laser as described above, the laser being connected to the device body.

[0016] The laser provided in this application embodiment has at least the following beneficial effects: Compared with the prior art, the device body provided in this application embodiment uses the above-mentioned laser to generate a laser beam with uniform energy distribution, thereby improving the performance of the electronic device. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1Schematic cross-section of a laser provided in an embodiment of this application Figure 1 ;

[0019] Figure 2 Schematic cross-section of a laser provided in an embodiment of this application Figure 2 ;

[0020] Figure 3 A schematic diagram of the laser structure provided in the embodiments of this application. Figure 1 ;

[0021] Figure 4 Schematic cross-section of a laser provided in an embodiment of this application Figure 3 ;

[0022] Figure 5 Schematic cross-section of a laser provided in an embodiment of this application Figure 4 ;

[0023] Figure 6 A schematic diagram of the laser structure provided in the embodiments of this application. Figure 2 .

[0024] Among them, the reference numerals in the figures are:

[0025] 1. Laser; 11. Substrate; 12. Optical component; 121. Optical cover plate; 122. Support; 123. Stepped surface; 13. Laser chip; 14. Base; 141. Inclined base; 142. Horizontal base; 143. Cooling channel; 15. Receiving cavity; 16. Sealed space; 17. Cooling inlet pipe; 18. Cooling outlet pipe; 19. Circuit board;

[0026] H, the highest point of the support; M, the center point of the laser chip; L, the connecting line; α, the maximum field of view of the laser chip; β, the angle between the connecting line L and the substrate; θ, the angle between the top surface of the tilted base and the substrate. Detailed Implementation

[0027] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0028] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0029] It should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0030] The various specific technical features and embodiments described in the detailed implementation can be combined in any suitable manner without contradiction. For example, different implementation methods can be formed by combining different specific technical features / implementations / implementation methods. In order to avoid unnecessary repetition, the various possible combinations of the various specific technical features / implementations / implementation methods in this application will not be described separately.

[0031] Please refer to this as well. Figures 1 to 3 This application provides a laser 1, including a substrate 11, an optical component 12, a base 14, and a laser chip 13. The optical component 12 is mounted on the substrate 11, forming a receiving cavity 15 between them. The base 14 and the laser chip 13 are both disposed in the receiving cavity 15. Specifically, the bottom surface of the base 14 is mounted on the substrate 11, and the top surface of the base 14 is used to mount the laser chip 13. The base 14 includes an inclined base 141 and a horizontal base 142. The top surface of the inclined base 141 is an inclined surface, and this inclined surface is inclined towards the direction of the horizontal base 142. The top surface of the horizontal base 142 is a horizontal surface. After the laser chip 13 is mounted on the top surface of the base 14, it is mounted according to the inclined base 141. Unlike the horizontal base 142, the laser chip 13 is mounted horizontally on the horizontal base 142 and on the inclined top surface of the inclined base 141, making the laser chip 13 tilted. This tilt causes the light spot of the laser chip 13 to change accordingly, and its field of view is different from that of the horizontally mounted laser chip 13. By combining the inclined laser chip 13 with the horizontal laser chip 13, the problem of "weak center, weak periphery, and strong center ring" of the laser spot in the prior art is effectively improved, making the energy distribution of the laser beam emitted by the laser 1 more uniform, reducing local light that is too strong or too weak, and effectively improving the quality of the laser beam.

[0032] As one of the optional implementation methods in this embodiment, please continue to refer to... Figure 1 The optical component 12 includes a support 122 and an optical cover plate 121. The support 122 can be disposed along the edge of the substrate 11. The optical cover plate 121 is mounted on the support 122 and forms a receiving cavity 15 between the support 122 and the substrate 11. That is, the support 122 is disposed between the optical cover plate 121 and the substrate 11. The three components together form the receiving cavity 15, which is used to accommodate components such as the base 14 and the laser chip 13.

[0033] For details, please refer to Figure 3 The laser chip 13 can be a VCSEL chip, the substrate 11 can be a square ceramic substrate 11, the bracket 122 can be a square metal frame, and the optical cover 121 is a transparent or light-transmitting square cover. The laser beam of the laser chip 13 can be emitted through the optical cover 121.

[0034] Of course, in other embodiments, the substrate 11, the support 122 and the optical cover 121 may also be in other shapes, such as circular, elongated, etc., and this embodiment does not limit them.

[0035] As one of the optional implementation methods in this embodiment, please refer to Figure 1 and Figure 2 , Figure 2 The laser chip 13 in the figure is located on the tilted base 141. The angle between the top surface of the tilted base 141 and the substrate 11 (i.e., the tilt angle of the top surface of the tilted base 141) θ is proportional to the maximum field of view α of the laser chip 13. Specifically, taking the VCSEL chip in actual use as an example, the field of view of the VCSEL is 120°*90°, where 120° is the horizontal angle and 90° is the vertical angle. In this case, the tilt angle of the top surface of the tilted base 141 can be relatively larger to avoid the light from the laser chip 13 being interfered with by the bracket 122. For example, when the field of view of the VCSEL is 60°*45°, the tilt angle of the top surface of the tilted base 141 can be relatively smaller.

[0036] Specifically, as one of the optional implementation methods of this embodiment, please refer to Figure 1 and Figure 2 A line L is drawn connecting the highest point H of the support 122 (the highest point H closest to the receiving cavity 15) and the center point M of the laser chip 13. Line L forms an angle β with the substrate 11, where θ + (180° - α) / 2 ≥ β. Thus, the height of the laser chip 13 and the support 122 is limited based on the maximum field of view of the laser chip 13, ensuring that the support 122 does not affect the light emission from the laser chip 13 on the inclined base 141, thus maximizing light utilization.

[0037] In practical applications, the height of the bracket 122 and the distance between the tilted base 141 and the bracket 122 can be adjusted adaptively according to the actual situation. The only requirement is that the height of the bracket 122 must be higher than the highest point of the laser chip 13, and the included angle β ≤ (180° - α) / 2 + θ. With a fixed height of the bracket 122, the larger the field of view α of the laser chip 13, the greater the corresponding tilt angle θ of the top surface of the tilted base 141 needs to be, ensuring that the bracket 122 does not interfere with the light from the laser chip 13. Similarly, when the tilt angle θ of the tilted base 141 is fixed, the height of the bracket 122 and the position of its highest point H need to be adjusted to ensure that the bracket 122 does not interfere with the light from the laser chip 13.

[0038] As one of the optional embodiments of this example, the tilted base 141 is closer to the edge of the substrate 11 than the horizontal base 142. That is, on the substrate 11, the horizontal base 142 is closer to the center of the substrate 11, and the tilted base 141 is closer to the edge of the substrate 11. The tilted base 141 can eliminate the interference of the bracket 122 on the laser chip 13 by adjusting the tilt angle θ of the top surface of the tilted base 141, and can also make the laser beam of the laser 1 more uniform.

[0039] For details, please refer to Figure 1 and Figure 3 The horizontal base 142 can be disposed at the center of the substrate 11. Inclined bases 141 are provided in both the horizontal and vertical directions of the horizontal base 142, so as to... Figure 3 For example, the horizontal base 142 can be set at the center of the square substrate 11. Taking the horizontal base 142 as the central origin, two inclined bases 141 are respectively set in the horizontal and vertical directions of the central origin. Each inclined base 141 and the horizontal base 142 is provided with a laser chip 13. This design allows the inclined laser chips 13 in the horizontal and vertical directions to cooperate with the central horizontal laser chip 13, optimize the field of view of the laser 1, expand the field of view to 180°, and use fewer laser chips 13. While ensuring the quality of the laser beam, the cost of the laser 1 is effectively reduced.

[0040] Of course, in other embodiments, the number and position of the horizontal base 142 and the inclined base 141 can be adjusted according to the actual situation. For example, the inclined base 141 can be set at the four corners of the substrate 11.

[0041] As one of the optional implementation methods in this embodiment, please refer to Figures 4 to 6 The laser 1 may also include a cooling inlet pipe 17 and a cooling outlet pipe 18, which are respectively connected to opposite sides of the optical component 12 and communicate with the receiving cavity 15.

[0042] Specifically, the cooling inlet pipe 17 can be connected to one side of the bracket 122, and the cooling outlet pipe 18 can be connected to the opposite side of the bracket 122. The coolant can enter the receiving cavity 15 through the cooling inlet pipe 17, flow through the laser chip 13 and carry away the heat of the laser chip 13, and then flow out through the cooling outlet pipe 18 on the other side, effectively reducing the heat of the laser 1 and improving the heat dissipation effect of the laser 1.

[0043] For example, the cooling inlet pipe 17 and the cooling outlet pipe 18 can be metal pipes with a circular cross-section, and the coolant can be an insulating coolant to avoid affecting the normal operation of the laser chip 13.

[0044] As one of the optional implementation methods in this embodiment, please refer to Figure 3 and Figure 6 The base 14 is provided with a cooling channel 143 that divides the base 14 into two relatively independent parts. The laser chip 13 can be mounted on top of the cooling channel 143. One end of the cooling channel 143 faces the cooling inlet pipe 17, and the other end faces the cooling outlet pipe 18. Coolant can flow into the cooling channel 143 from one end, fully cool the laser chip 13, and then flow out from the other end. This design ensures that the coolant can fully cool the laser chip 13, guaranteeing its normal operation. Furthermore, since the two ends of the cooling channel 143 face the cooling inlet pipe 17 and the cooling outlet pipe 18 respectively, and the orientation of the cooling channel 143 is the same as the direction of coolant flow, the flow rate of the coolant can be increased, further improving the cooling effect.

[0045] Specifically, both the inclined base 141 and the horizontal base 142 can be provided with cooling channels 143. Each base 14 can be provided with one, two or more cooling channels 143. The cooling channels 143 can be circular channels, square channels or channels of other shapes. This embodiment does not impose any restrictions.

[0046] For details, please refer to Figure 4 and Figure 5 The laser 1 also includes a circuit board 19, which is connected to the optical component 12 and is located between the laser chip 13 and the base 14. A sealed space 16 is formed between the circuit board 19 and the substrate 11, and a cooling inlet pipe 17 and a cooling outlet pipe 18 are located within the sealed space 16. This design confines the coolant within the sealed space 16 below the circuit board 19, which on the one hand can fully cool the laser chip 13, and on the other hand can prevent the coolant from flowing to the light-emitting surface of the laser chip 13, thus ensuring the optimal performance of the laser chip 13.

[0047] More specifically, the circuit board 19 can be connected to the bracket 122 of the optical component 12. The inner side of the bracket 122 (that is, the side facing the receiving cavity 15) can be provided with a stepped surface 123. The circuit board 19 can be mounted on the stepped surface 123, which facilitates the installation of the circuit board 19 and makes the circuit board 19 more reliable and stable after installation. The height of the stepped surface 123 can be the same as the highest point of the base 14. The thickness of the cooling inlet pipe 17 and the cooling outlet pipe 18 can be equivalent to the height of the stepped surface 123 to ensure that the coolant can be confined in the sealed space 16 below the circuit board 19.

[0048] For example, the circuit board 19 can be a single-layer or double-layer flexible circuit board 19, or it can be an irregularly shaped 3D rigid board.

[0049] The laser 1 provided in this embodiment utilizes a substrate 11 and an optical component 12 that irradiates the substrate 11 to form a receiving cavity 15 for accommodating a base 14 and a laser chip 13. The base 14 is disposed on the substrate 11 and serves to support the laser chip 13. The laser chip 13 is positioned in different states by using a horizontal base 142 and an inclined base 141. The horizontal top surface of the horizontal base 142 causes the laser chip 13 to be horizontally positioned, while the inclined top surface of the inclined base 141 causes the laser chip 13 to be tilted at a specific angle. This design of the horizontal and inclined laser chips 13 effectively improves the field of view of the laser 1 and makes the energy distribution of the laser spot more uniform, thus improving beam quality. Simultaneously, coolant flows through the sealed space 16 below the circuit board 19 and through the cooling channel 143, ensuring sufficient cooling of the laser chip 13 and guaranteeing its long-term stable operation.

[0050] This application also provides an electronic device, which includes a device body and a laser 1 as described above, the laser 1 being connected to the device body. The laser 1 is used to generate a laser beam with uniform energy distribution, improving the usability of the electronic device.

[0051] In specific applications, the electronic device can be any device that uses laser 1, including but not limited to medical aesthetic laser devices, laser sensing devices, lidar devices, etc. The size, shape, and number of laser 1 can be adaptively adjusted according to the actual situation, and this embodiment does not impose any restrictions.

[0052] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A laser (1), characterized in that, The device includes a substrate (11), an optical component (12) that covers the substrate (11) and forms a receiving cavity (15) between the substrate (11) and the optical component (12), and a base (14) and a laser chip (13) located in the receiving cavity (15). The base (14) includes a horizontal base (142) on which the laser chip (13) is disposed on its top surface and an inclined base (141). The bottom surface of the base (14) is disposed on the substrate (11), and the top surface of the inclined base (141) is an inclined surface that is inclined toward the horizontal base (142).

2. The laser as described in claim 1, characterized in that, The tilt angle θ of the top surface of the tilted base (141) is proportional to the maximum field of view α of the laser chip (13).

3. The laser as described in claim 2, characterized in that, The optical component (12) includes a bracket (122) and an optical cover plate (121). The bracket (122) is disposed along the edge of the substrate (11), and the optical cover plate (121) is mounted on the bracket (122) and forms a receiving cavity (15) between the bracket (122) and the substrate (11).

4. The laser as described in claim 3, characterized in that, The highest point H of the bracket (122) is connected to the center point M of the laser chip (13) located on the inclined base (141), and the line forms an angle β with the substrate (11), θ+(180°-α) / 2≥β.

5. The laser as described in claim 1, characterized in that, The inclined base (141) is closer to the edge of the substrate (11) than the horizontal base (142).

6. The laser as claimed in claim 1, characterized in that, The horizontal base (142) is located at the center of the substrate (11), and the inclined base (141) is provided in both the horizontal and vertical directions of the horizontal base (142).

7. The laser as claimed in any one of claims 1 to 6, characterized in that, The laser also includes a cooling inlet pipe (17) and a cooling outlet pipe (18), which are respectively connected to opposite sides of the optical component (12).

8. The laser as claimed in claim 7, characterized in that, The base (14) is provided with a cooling channel (143) that divides the base (14) into two parts. One end of the cooling channel (143) faces the cooling inlet pipe (17), and the other end of the cooling channel (143) faces the cooling outlet pipe (18).

9. The laser as claimed in claim 8, characterized in that, The laser also includes a circuit board (19) connected to the optical component (12). The circuit board (19) is located between the laser chip (13) and the base (14), and a sealed space (16) is formed between the circuit board (19) and the substrate (11). The cooling inlet pipe (17) and the cooling outlet pipe (18) are located in the sealed space (16).

10. An electronic device, characterized in that, It includes a device body and a laser as described in any one of claims 1 to 9, the laser being connected to the device body.

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