Laser water cooler

Abstract

The invention discloses a laser water chiller which comprises a compressor, a cooling fan, a rectifying device, a laser cooling water supply pipeline, a refrigerant condensation pipeline, a coil evaporator heat exchange pipeline, a front evaporator heat exchange pipeline, a plate heat exchanger heat exchange pipeline, a cooling container and a cooling medium supply device. A condenser is arranged on the refrigerant condensation pipeline; the coil evaporator heat exchange pipeline, the front evaporator heat exchange pipeline and the plate heat exchanger heat exchange pipeline are all communicated with an inlet of the compressor, and an outlet of the compressor is communicated with the refrigerant condensation pipeline. And the coil evaporator heat exchange pipeline, the front evaporator heat exchange pipeline and the plate heat exchanger heat exchange pipeline are respectively communicated with the refrigerant condensation pipeline. The heat dissipation efficiency can be improved, the use requirements of more different working environment temperatures can be met, and the applicable working environment temperature range can be expanded.

Description

Technical Field

[0001] This invention relates to the field of laser chillers, and more specifically to a laser chiller. Background Technology

[0002] Lasers generate a significant amount of waste heat during operation (especially high-power lasers). If this heat cannot be dissipated in time, the internal temperature of the laser will rise, directly affecting its output power, wavelength stability, and beam quality. Laser chillers, as crucial auxiliary equipment providing stable cooling for laser devices, are commonly used to supply cooling water (e.g., at 25°C) to the laser. This cooling water facilitates heat exchange within the laser, thus achieving a cooling effect.

[0003] Existing laser chillers require an operating environment temperature below 45℃. However, in the Middle East and Southeast Asia, summer temperatures are high, reaching over 50℃, and even briefly exceeding 55℃. Under these high temperatures, existing laser chillers operate at full load, causing the compressor's discharge pressure and temperature to rise continuously. This results in increased compressor heat generation, reduced condenser cooling capacity, and high condensing pressure. As the compressor's discharge temperature and current increase, it triggers thermal protection and shuts down, potentially leading to compressor failure. Consequently, the laser chiller cannot operate stably at these high temperatures (45-55℃), limiting its operational range to below 45℃. Furthermore, its low heat dissipation efficiency fails to meet the industry's stringent requirements. Summary of the Invention

[0004] In order to overcome the shortcomings of the prior art, the purpose of this invention is to provide a laser chiller that can improve heat dissipation efficiency and meet the usage requirements of more different working environment temperatures, thereby expanding its applicable working environment temperature range.

[0005] The objective of this invention is achieved through the following technical solution:

[0006] A laser chiller includes a compressor, a cooling fan, a rectifier, a laser cooling water supply pipeline, a refrigerant condensation pipeline, a coil evaporator heat exchange pipeline, a pre-evaporator heat exchange pipeline, a plate heat exchanger heat exchange pipeline, a cooling container, and a cooling medium supply device. A condenser is installed on the refrigerant condensation pipeline. The coil evaporator heat exchange pipeline, the pre-evaporator heat exchange pipeline, and the plate heat exchanger heat exchange pipeline are all connected to the compressor inlet, and the compressor outlet is connected to the refrigerant condensation pipeline. The coil evaporator heat exchange pipeline, the pre-evaporator heat exchange pipeline, and the plate heat exchanger heat exchange pipeline are each connected to the refrigerant condensation pipeline. The plate heat exchanger includes a plate heat exchanger, and the plate heat exchanger is provided with a cooling medium channel. One end of the cooling medium channel is connected to a cooling medium inlet pipe, and the other end of the cooling medium channel is connected to a cooling medium return pipe. The compressor is located inside the cooling container. The cooling medium supply device supplies liquid cooling medium to the cooling container. The cooling medium inlet pipe is connected to the cooling container, and the cooling medium inlet channel is for the flow of gaseous cooling medium that has absorbed heat from the compressor and formed into a gaseous state. The cooling medium return pipe is connected to the cooling container. The cooling fan, when working, forms an airflow that flows sequentially through the pre-evaporator, the rectifier, and the condenser. The pre-evaporator heat exchange pipeline includes a pre-evaporator located in the pre-evaporator zone. The condenser forms multiple condensing ventilation channels for airflow. The rectifier promotes the airflow to enter the condensing ventilation channels in a manner parallel to the extension direction of the condensing ventilation channels. The coil evaporator heat exchange pipeline includes a coil evaporator. The coil evaporator is provided with a cooling water chamber, and the laser cooling water supply pipeline is connected to the cooling water chamber.

[0007] The laser cooling water supply pipeline includes a water supply pipe and a water pump; the water supply pipe is used to connect to the water inlet of the laser; the water supply pipe is connected to the cooling water chamber through the water pump.

[0008] The laser cooling water supply pipeline also includes a return water pipe, which is used to connect to the water outlet of the laser and is connected to the cooling water cavity.

[0009] The rectifier includes a first rectifier cavity and a second rectifier cavity arranged sequentially along the airflow direction; the first rectifier cavity is used to reduce the vortex flow caused by the rotation of the cooling fan; the second rectifier cavity is used to promote the airflow to enter the condensing ventilation channel in a manner parallel to the extension direction of the condensing ventilation channel.

[0010] The condenser is a microchannel condenser.

[0011] The compressor inlet is connected to a refrigerant return main pipe, and the coil evaporator heat exchange pipe, the pre-evaporator heat exchange pipe, and the plate heat exchanger heat exchange pipe are respectively connected to the compressor inlet through the refrigerant return main pipe.

[0012] The cooling medium is a fluorinated liquid.

[0013] The compressor is located inside a cooling container and is immersed in a liquid cooling medium.

[0014] The upper end of the cooling container is connected to the upper end of the cooling medium supply device via a liquid level balance pipe.

[0015] A solenoid valve is provided between the lower end of the cooling container and the lower end of the cooling medium supply device. The laser chiller also includes an exhaust temperature sensor, which is used to detect the temperature of the refrigerant discharged from the compressor. When the exhaust temperature sensor detects that the temperature of the refrigerant discharged from the compressor is greater than 110°C, the solenoid valve opens.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0017] This invention provides a laser chiller that combines a compressor, a cooling fan, a rectifier, a laser cooling water supply pipeline, a refrigerant condensation pipeline, a coil evaporator heat exchange pipeline, a pre-evaporator heat exchange pipeline, a plate heat exchanger heat exchange pipeline, a cooling container, and a cooling medium supply device. The compressor is placed inside the cooling container, and the cooling medium supply device supplies liquid cooling medium to the container. The plate heat exchanger pipeline utilizes a plate heat exchanger, and the cooling medium enters a channel where it absorbs heat from the compressor and transforms into a gaseous state. During compressor operation, the cooling medium rapidly absorbs heat from the compressor, vaporizing and undergoing a phase change. This causes boiling heat transfer between the cooling medium and the compressor casing surface, enabling the compressor to cool rapidly. However, this improves the compressor's heat dissipation, allowing the laser chiller to meet the temperature requirements of more diverse operating environments and expanding its applicable operating temperature range. Furthermore, by rectifying the airflow through a rectifier, laminar flow is achieved, reducing flow resistance and improving heat dissipation efficiency. Additionally, the combination of solenoid valves and exhaust temperature sensors ensures sufficient cooling medium for the compressor, reducing its exhaust temperature, pressure, and operating current, guaranteeing continuous compressor operation and further expanding the applicable operating temperature range of the laser chiller. Moreover, it achieves better heat exchange efficiency for the compressor, significantly improving its heat dissipation. Finally, a well-designed laser cooling water supply pipeline ensures effective laser cooling. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the laser chiller of the present invention;

[0019] Figure 2 This is a perspective view of the laser chiller of the present invention;

[0020] Figure 3 This is a three-dimensional schematic diagram of the laser chiller of the present invention from another perspective;

[0021] Figure 4 This is a cross-sectional view of the laser chiller of the present invention;

[0022] Figure 5 This is a schematic diagram showing the connection between the cooling container and the cooling medium supply device;

[0023] Figure 6 This is a schematic diagram showing the connection between the compressor and the refrigerant condensation piping.

[0024] Figure 7 This is a schematic diagram showing the connection between the plate heat exchanger and the cooling medium inlet pipe and the cooling medium return pipe.

[0025] Figure 8 A 3D view of the pre-evaporator;

[0026] Figure 9 This is a schematic diagram of the installation of the pre-evaporator;

[0027] Figure 10 This is a schematic diagram of the air guide shroud.

[0028] Figure 11 This is a schematic diagram of the condenser structure;

[0029] Figure 12 This is a schematic diagram of the regulator's structure;

[0030] Figure 13 This is a schematic diagram showing the fit between the guide vanes and the air duct.

[0031] Figure 14 This is a schematic diagram of the guide vane structure;

[0032] Figure 15 This is a schematic diagram of the flow guiding unit.

[0033] Figure 16 This is a schematic diagram of the organism's structure;

[0034] The components include: 1. Cooling fan; 2. Condenser; 5. Pre-evaporator; 6. Plate heat exchanger; 7. Temperature sensor; 8. Compressor; 9. Cooling container; 10. Solenoid valve; 11. Cooling medium supply device; 12. Coil evaporator; 13. Water pump; 14. First capillary tube; 15. Second capillary tube; 16. Third capillary tube; 17. Refrigerant condensation pipeline; 18. Refrigerant return main pipe; 22. Liquid level balance pipe; 27. Return water pipe; 28. Supply water pipe; 30. Coil evaporator heat exchange pipeline; 31. Coil evaporator inlet connecting pipe; 32. Coil evaporator outlet connecting pipe; 33. First refrigerant channel; 34. Cooling water chamber; 35. Coil; 40. Pre-evaporator heat exchange pipeline; 41. Pre-evaporator inlet connecting pipe; 42. Pre-evaporator outlet connecting pipe; 43. Third refrigerant channel; 44. Pre-evaporator... 45. Ventilation duct; 46. Bend pipe; 50. Guide plate; 51. Plate heat exchanger heat exchange pipeline; 52. Cooling medium passage; 53. Cooling medium inlet pipe; 54. Cooling medium return pipe; 55. Plate heat exchanger inlet connecting pipe; 56. Plate heat exchanger outlet connecting pipe; 60. Second refrigerant passage; 61. Regulator; 62. Outer shell; 63. Regulating passage; 71. Fan blade; 72. Condenser inlet connecting pipe; 73. Condenser outlet connecting pipe; 74. Refrigerant condensation passage; 75. Condenser ventilation passage; 80. Blade; 81. Pre-processing zone; 82. Rectifier; 83. First rectifier cavity; 84. Second rectifier cavity; 85. Guide vane; 86. Rear balancing zone; 90. Pre-processing balancing zone; 91. Guide plate; 92. Guide channel; 93. Air guide shroud; 94. Body. Detailed Implementation

[0035] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0036] like Figure 1-16As shown, a laser chiller includes a compressor 8, a cooling fan 1, a rectifier 81, a laser cooling water supply pipeline, a refrigerant condensation pipeline 17, a coil evaporator heat exchange pipeline 30, a pre-evaporator heat exchange pipeline 40, a plate heat exchanger heat exchange pipeline 50, a cooling container 9, and a cooling medium supply device 11; a condenser 2 is installed on the refrigerant condensation pipeline 17; the coil evaporator heat exchange pipeline 30, the pre-evaporator heat exchange pipeline 40, and the plate heat exchanger heat exchange pipeline 50 are all connected to the compressor 8. The inlet is connected, and the outlet of the compressor 8 is connected to the refrigerant condensing pipe 17; the coil evaporator heat exchange pipe 30, the pre-evaporator heat exchange pipe 40, and the plate heat exchanger heat exchange pipe 50 are respectively connected to the refrigerant condensing pipe 17; the plate heat exchanger heat exchange pipe 50 includes a plate heat exchanger 6, and the plate heat exchanger 6 is provided with a cooling medium channel 51; one end of the cooling medium channel 51 is connected to a cooling medium inlet pipe 52, and the other end of the cooling medium channel 51 is connected to a cooling medium return pipe. The cooling medium supply device 11 supplies liquid cooling medium to the cooling container 9 via a flow pipe 53; the cooling medium inlet pipe 52 is connected to the cooling container 9 and is used to supply gaseous cooling medium that has absorbed heat from the compressor 8 and has become gaseous; the cooling medium return pipe 53 is connected to the cooling container 9; the cooling fan 1 is used to generate airflow that flows sequentially through the pre-evaporator 80, the rectifier 81, and the condenser 2; the pre-evaporator heat exchange pipe 40 includes a pre-evaporator 5 located in the pre-evaporator 80; the condenser 2 has multiple condensing ventilation channels 74 for airflow; the rectifier 81 is used to cause airflow to enter the condensing ventilation channels 74 in a manner parallel to the extension direction of the condensing ventilation channels 74; the coil evaporator heat exchange pipe 30 includes a coil evaporator 12; a cooling water chamber 34 is provided on the coil evaporator 12, and the laser cooling water supply pipe is connected to the cooling water chamber 34.

[0037] When in use, the cooling water in the cooling water chamber 34 exchanges heat with the refrigerant flowing through the coil evaporator 12 and then cools down. The cooling water is then supplied to the laser through the laser cooling water supply pipeline so that the laser can be cooled down by the cooling water. After the refrigerant in the coil evaporator 12 exchanges heat and absorbs heat, it flows back to the compressor (8) for isentropic compression along the coil evaporator heat exchange pipeline 30. The refrigerant flowing back from the pre-evaporator heat exchange pipe 40 and the plate heat exchanger heat exchange pipe 50 to the compressor 8 is also isentropically compressed within the compressor 8, forming a high-temperature, high-pressure refrigerant. This high-temperature, high-pressure refrigerant enters the refrigerant condenser pipe 17 from the outlet of the compressor 8 and then enters the condenser 2 along the refrigerant condenser pipe 17. During this process, the cooling fan 1 operates, driving airflow to form airflow (i.e., wind). The airflow generated by the cooling fan 1 first flows through the pre-evaporator 5 in the pre-evaporator zone 80, where it exchanges heat with the refrigerant flowing through the pre-evaporator 5. The airflow is cooled to a low-temperature airflow and enters the rectifier 81. After being rectified by the rectifier 81, the airflow extends parallel to the direction of the condenser ventilation channel 74. The refrigerant flows into the condenser ventilation channel 74 to laminate the flow of low-temperature air, reducing flow resistance, increasing the effective air volume flowing through the condenser 2, and improving heat dissipation. The refrigerant flowing through the condenser 2 exchanges heat with the low-temperature airflow flowing through the condenser ventilation channel 74, so that the heat of the refrigerant can be carried away by the airflow, so that the high-temperature and high-pressure refrigerant is cooled in the condenser 2. After cooling, the refrigerant enters the coil evaporator heat exchange pipeline 30, the pre-evaporator heat exchange pipeline 40, and the plate heat exchanger heat exchange pipeline 50 along the refrigerant condenser pipeline 17 for heat exchange. After heat exchange, it enters the compressor 8 from the coil evaporator heat exchange pipeline 30, the pre-evaporator heat exchange pipeline 40, and the plate heat exchanger heat exchange pipeline 50, and then continues to work in the above manner.During operation, liquid cooling medium can be supplied to the cooling container 9 via the cooling medium supply device 11. When the ambient temperature is high (45-55℃), the liquid cooling medium in the cooling container 9 can quickly absorb the heat generated by the compressor 8 during operation, undergo a phase change, and vaporize. This causes the cooling medium to boil and transfer heat to the surface of the compressor 8 shell, thus providing comprehensive cooling to the surface of the compressor 8 shell. The gaseous cooling medium, after absorbing heat and vaporizing, enters the plate heat exchanger 6 via the cooling medium inlet pipe 52 to exchange heat with the refrigerant. After the cooling medium temperature decreases following the heat exchange, it enters the cooling medium return pipe 53 from the plate heat exchanger 6 and then returns to the cooling container 9 via the cooling medium return pipe 53. This invention provides a laser chiller, which combines a compressor 8, a cooling fan 1, a rectifier 81, a laser cooling water supply pipeline, a refrigerant condensation pipeline 17, a coil evaporator heat exchange pipeline 30, a pre-evaporator heat exchange pipeline 40, a plate heat exchanger heat exchange pipeline 50, a cooling container 9, and a cooling medium supply device 11. The compressor 8 is placed inside the cooling container 9, and the cooling medium supply device 11 supplies liquid cooling medium to the cooling container 9. Simultaneously, the plate heat exchanger pipeline 50 uses a plate heat exchanger 6, and the cooling medium enters through a pipe 52 to allow the gaseous cooling medium, which absorbs heat from the compressor 8 and forms a gaseous state, to flow in, enabling the compressor 8 to operate at a higher ambient temperature. When operating at 45-55℃, the cooling medium in the cooling container 9 can quickly absorb the heat from the compressor 8 and vaporize, causing boiling heat transfer between the cooling medium and the surface of the compressor 8 casing, thus rapidly cooling the compressor 8. Furthermore, the cooling medium can enter the plate heat exchanger 6 to exchange heat with the refrigerant for further cooling. The cooled medium then returns to the cooling container 9 via the cooling medium return pipe 53, allowing the compressor 8 to be continuously cooled within the cooling container 9 during operation. Therefore, this improves the heat dissipation effect of the compressor 8, preventing it from shutting down due to thermal protection at higher operating temperatures (45-55℃) and reducing compressor malfunctions. It can operate stably at 5℃, enabling the laser chiller to meet the usage requirements of more different working environment temperatures and expanding its applicable working environment temperature range. Moreover, the pre-evaporator 5 can be used to cool the airflow, thereby reducing the airflow temperature, lowering the condensing pressure, and reducing the exhaust temperature and operating current of the compressor 8. Furthermore, based on the cooling of the airflow with the help of the pre-evaporator 5, the rectifier device 81 is used to rectify the cooling airflow, thereby laminarizing the airflow, reducing flow resistance, increasing the effective airflow through the condenser 2, and improving the heat dissipation effect. This allows the compressor 8 to operate stably at higher working environment temperatures (45-55℃), further expanding the applicable working environment temperature range of the laser chiller.

[0038] The laser cooling water supply pipeline includes a supply water pipe 28 and a water pump 13; the supply water pipe 28 is used to connect to the water inlet of the laser; the supply water pipe 28 is connected to the cooling water chamber 34 through the water pump 13. The laser cooling water supply pipeline also includes a return water pipe 27, which is used to connect to the water outlet of the laser and is connected to the cooling water chamber 34. During use, the cooling water in the cooling water chamber 34 of the coil evaporator 12 is supplied to the laser by the water pump 13 through the supply water pipe 28. After heat exchange inside the laser, the water temperature rises to about 28-30°C and returns to the cooling water chamber 34 of the coil evaporator 12 through the return water pipe 27. The heated cooling water exchanges heat with the low-temperature refrigerant in the coil evaporator 12, and the cooling water cools down to 25°C again. It is then supplied to the laser by the water pump 13 through the supply water pipe 28. The low-temperature refrigerant in the coil evaporator 12 absorbs heat and returns to the compressor 8 along the coil evaporator heat exchange pipe 30.

[0039] The rectifier 81 includes a first rectifier cavity 82 and a second rectifier cavity 83 arranged sequentially along the airflow direction; the first rectifier cavity 82 is used to reduce the vortex flow caused by the rotation of the cooling fan 1; the second rectifier cavity 83 is used to promote the airflow to enter the condenser ventilation channel 74 in a manner parallel to the extension direction of the condenser ventilation channel 74. During use, the airflow generated by the cooling fan 1 first flows through the pre-evaporator 5 in the pre-zone 80 and exchanges heat with the low-temperature refrigerant flowing through the pre-evaporator 5. Then, it enters the first rectifier cavity 82. The first rectifier cavity 82 rectifies the incoming low-temperature airflow, reducing the vortex flow caused by the rotation of the cooling fan 1 and the air pressure difference. After passing through the first rectifier cavity 82, the airflow enters the second rectifier cavity 83. After passing through the second rectifier cavity 83, the airflow enters the condenser ventilation channel 74 in a manner parallel to the extension direction of the condenser ventilation channel 74. This laminarizes the flow of the low-temperature airflow, reduces flow resistance, increases the effective airflow through the condenser 2, improves the heat dissipation effect, and ensures the working stability of the laser chiller at higher operating temperatures (45℃-55℃).

[0040] The first rectifier cavity 82 is provided with a number of guide vanes 84 arranged in a circle around the central axis of the cooling fan 1. During the process of airflow passing through the first rectifier cavity 82, the guide vanes 84 can be used to guide the airflow, so as to reduce the vortex flow caused by the rotation of the cooling fan 1 and the air pressure difference, and at the same time facilitate the processing.

[0041] The structure and shape of the guide vane 84 can be set according to actual needs, as long as it can be used to reduce the vortex flow caused by the rotation of the cooling fan 1 and the air pressure difference. As a preferred embodiment of the present invention, the guide vane 84 is twisted and has a streamlined design. Specifically, the extension trajectory of the guide vane 84 is spiral, so that the airflow flows along the surface of the spiral guide vane 84 and the flow state tends to be laminar at the end of the guide vane 84 near the second rectifying cavity 83.

[0042] Preferably, the blade outlet angle of the guide vane 84 is 80-85°. More preferably, the guide vane 84 adopts a large-angle design with an outlet angle of 80°. By optimizing this outlet angle, the airflow does not separate on the surface of the guide vane 84, the flow state is maximized to be laminar, and there is no backflow at the blade outlet. The blade outlet is located at the end of the guide vane 84 near the second rectifying cavity 83.

[0043] The number of guide vanes 84 can be set according to actual needs. In a preferred embodiment of the present invention, three guide vanes 84 are arranged in a circle around the central axis of the cooling fan 1 in the first rectifier cavity 82.

[0044] A central shaft is provided inside the first rectifier cavity 82, and a plurality of guide vanes 84 are disposed on the central shaft and arranged in a circle around the central shaft. A wind tunnel is provided inside the first rectifier cavity 82, and the plurality of guide vanes 84 are disposed inside the wind tunnel.

[0045] A flow guiding unit 90 is provided within the second rectifier cavity 83. Preferably, the flow guiding unit 90 includes a plurality of guide plates 91 arranged at intervals, with a flow guiding channel 92 formed between any two adjacent guide plates 91 for airflow. The guide plates 91 are vertically arranged, and the width C of the flow guiding channel 92 is greater than the width of the condenser ventilation channel 74. By adopting the above structure, after the airflow passes through the flow guiding channel 92 of the second rectifier cavity 83, the airflow direction is vertically upward, the same as the extension direction of the condenser ventilation channel 74. This laminarizes the airflow, reduces flow resistance, increases the effective airflow through the condenser 2, improves heat dissipation, and ensures the stability of the system operating in high-temperature environments.

[0046] In a preferred embodiment of the present invention, the interval C between two adjacent guide plates 91 is 10 mm, that is, the width of the flow channel 92 is 10 mm and the width of the condensing ventilation channel 74 is 3.1 mm, so as to optimize the reduction of flow resistance, increase the effective air volume flowing through the condenser 2, and improve the heat dissipation effect.

[0047] Specifically, the second rectifier cavity 83 has a height of 150mm, the guide plate 91 has a height of 50mm, and there are 42 guide plates 91. The height of the second rectifier cavity 83, the height of the guide plate 91, and the number of guide plates 91 can be set according to actual needs.

[0048] Specifically, the second rectifier cavity 83 includes a rear balancing section 85; the rear balancing section 85 is located between the guide unit 90 and the condenser 2, so that when the airflow passing through the guide unit 90 passes through the rear balancing section 85, the pressure difference after the airflow passes through the guide plate 91 can be balanced by the rear balancing section 85. Specifically, the height of the rear balancing section 85 is 45-55mm, and more preferably, the height of the rear balancing section 85 is 50mm.

[0049] The second rectifier cavity 83 further includes a pre-balancing section 86; the pre-balancing section 86 is located between the flow guiding unit 90 and the first rectifier cavity 82. Specifically, the height of the pre-balancing section 86 is 45-55mm, and more preferably, the height of the pre-balancing section 86 is 50mm.

[0050] The end of the pre-evaporator 80 furthest from the rectifier 81 forms the air inlet, and the condenser 2 is located between the rectifier 81 and the cooling fan 1; the end of the cooling fan 1 furthest from the condenser 2 forms the air outlet. In use, the airflow generated by the cooling fan 1 enters from the air inlet, passes sequentially through the pre-evaporator 80, the rectifier 81, and the condenser 2, and exits from the air outlet, preventing the airflow discharged by the cooling fan 1 from being re-drawn in. There is a temperature difference between the airflow at the air inlet and the airflow after passing through the pre-evaporator 5, resulting in a different air density and a pressure gradient in the vertical direction, creating a thermo-pressure effect that allows the airflow to quickly flow into the system for heat dissipation. The front zone 80 is provided with an air guide shroud 93, and the front evaporator 5 is located inside the air guide shroud 93; the air-cooling system also includes a hollow body 94; the front zone 80 is formed on the body 94, and the front zone 80, rectifier 81, condenser 2, and cooling fan 1 are arranged in sequence along the vertical direction inside the body 94. By adopting the above arrangement, a chimney effect can be formed, which accelerates the airflow from the bottom to flow in quickly, enhances the convective heat dissipation effect, and ensures that the laser chiller operates normally at higher temperatures.

[0051] The distance between the air inlet and outlet and the width of the body 94 can be set according to actual needs. Preferably, the width d of the body 94 is 480mm and the distance h between the air inlet and outlet is 773mm.

[0052] The condenser 2 on the refrigerant condensation pipe 17 can be any commercially available condenser. In a preferred embodiment of the invention, the condenser 2 can be a microchannel condenser to improve heat exchange efficiency and significantly increase the system's energy efficiency ratio. The condenser 2 includes multiple fins 75, and a condensation ventilation channel 74 is formed between adjacent fins 75. Airflow passes through the condensation ventilation channel 74 to exchange heat with the high-temperature, high-pressure refrigerant flowing through the condenser 2.

[0053] Preferably, the refrigerant condensing pipeline 17 further includes a condenser inlet connecting pipe 71 and a condenser outlet connecting pipe 72. The condenser 2 forms a refrigerant condensing channel 73. One end of the condenser inlet connecting pipe 71 is connected to the compressor 8 outlet, and the other end is connected to the refrigerant condensing channel 73. The condenser outlet connecting pipe 72 is connected to the refrigerant condensing channel 73. The coil evaporator heat exchange pipeline 30, the pre-evaporator heat exchange pipeline 40, and the plate heat exchanger heat exchange pipeline 50 are respectively connected to the condenser outlet connecting pipe 72. In use, After being isentropically compressed by compressor 8, the refrigerant, which is now at high temperature and high pressure, enters the condenser inlet connecting pipe 71 from the outlet of compressor 8, and then enters the refrigerant condensing channel 73 of condenser 2 from the condenser inlet connecting pipe 71. The heat of the refrigerant can be carried away by the airflow flowing through the condensing ventilation channel 74 of condenser 2, so that the high temperature and high pressure refrigerant is cooled in condenser 2. After being cooled, the refrigerant enters the coil evaporator heat exchange pipeline 30, the pre-evaporator heat exchange pipeline 40, and the plate heat exchanger heat exchange pipeline 50 along the condenser outlet connecting pipe 72.

[0054] The compressor 8 is connected to the refrigerant return pipe 18 at its inlet. The coil evaporator heat exchange pipe 30, the pre-evaporator heat exchange pipe 40, and the plate heat exchanger heat exchange pipe 50 are respectively connected to the compressor 8 at its inlet through the refrigerant return pipe 18 for easy connection.

[0055] The coil evaporator heat exchange pipeline 30 also includes a coil evaporator inlet connecting pipe 31 and a coil evaporator outlet connecting pipe 32. The coil evaporator 12 forms a first refrigerant channel 33. One end of the coil evaporator inlet connecting pipe 31 is connected to the refrigerant condensation pipeline 17, and the other end is connected to the first refrigerant channel 33. One end of the coil evaporator outlet connecting pipe 32 is connected to the first refrigerant channel 33, and the other end is connected to the refrigerant return main pipe 18. The refrigerant flowing from the refrigerant condensation pipeline 17 to the coil evaporator inlet connecting pipe 31 after cooling can enter the first refrigerant channel 33 of the coil evaporator 12 from the coil evaporator inlet connecting pipe 31, and then enter the refrigerant return main pipe 18 through the coil evaporator outlet connecting pipe 32, and then enter the compressor 8 from the refrigerant return main pipe 18. When the refrigerant passes through the first refrigerant channel 33 of the coil evaporator 12, it can exchange heat with the airflow in the condensation ventilation channel 34. Specifically, the coil evaporator 12 includes a coil 35, and the first refrigerant passage 33 is formed on the coil 35, which is located within the cooling water chamber 34. The coil evaporator inlet connecting pipe 31 is connected to the condenser outlet connecting pipe 72 of the refrigerant condensation pipe 17.

[0056] Preferably, the coil evaporator inlet connecting pipe 31 includes a first capillary tube 14, allowing the refrigerant to be throttled and depressurized through the first capillary tube 14 before flowing into the coil evaporator 12 for heat exchange. The coil evaporator inlet connecting pipe 31 also includes a first pipe body, which connects the first capillary tube 14 and the coil evaporator 12.

[0057] Preferably, the plate heat exchanger heat exchange pipeline 50 further includes a plate heat exchanger inlet connecting pipe 54 and a plate heat exchanger outlet connecting pipe 55. The plate heat exchanger 6 forms a second refrigerant channel 56. One end of the plate heat exchanger inlet connecting pipe 54 is connected to the refrigerant condensation pipeline 17, and the other end is connected to the second refrigerant channel 56. One end of the plate heat exchanger outlet connecting pipe 55 is connected to the second refrigerant channel 56, and the other end is connected to the refrigerant return main pipe 18. The refrigerant flowing from the refrigerant condensation pipeline 17 to the plate heat exchanger inlet connecting pipe 54 after cooling can enter the second refrigerant channel 56 of the plate heat exchanger 6 from the plate heat exchanger inlet connecting pipe 54, and then enter the refrigerant return main pipe 18 through the plate heat exchanger outlet connecting pipe 55, and then enter the compressor 8 from the refrigerant return main pipe 18. When the refrigerant passes through the second refrigerant channel 56 of the plate heat exchanger 6, it can exchange heat with the cooling medium flowing through the cooling medium channel 51 within the plate heat exchanger 6 by means of heat transfer. The inlet connecting pipe 54 of the plate heat exchanger is connected to the condenser outlet connecting pipe 72 of the refrigerant condensation pipe 17.

[0058] Preferably, the plate heat exchanger inlet connecting pipe 54 includes a second capillary tube 15, allowing the refrigerant to be throttled and depressurized through the second capillary tube 15 into a low-temperature liquid refrigerant before flowing into the plate heat exchanger 6 for heat exchange. The plate heat exchanger inlet connecting pipe 54 also includes a second pipe body, which connects the second capillary tube 15 and the plate heat exchanger 6.

[0059] The second refrigerant channel 56 is connected to the plate heat exchanger inlet connecting pipe 54 at one end, forming the refrigerant inlet end, and connected to the plate heat exchanger outlet connecting pipe 55 at the other end, forming the refrigerant outlet end. The cooling medium channel 51 is connected to the cooling medium inlet pipe 52 at one end, forming the cooling medium inlet end, and connected to the cooling medium return pipe 53 at the other end, forming the cooling medium outlet end. This allows the refrigerant and high-temperature cooling medium in the process plate heat exchanger 6 to flow in opposite directions, thereby achieving better heat exchange efficiency.

[0060] Preferably, the pre-evaporator heat exchange pipeline 40 further includes a pre-evaporator inlet connecting pipe 41 and a pre-evaporator outlet connecting pipe 42. The pre-evaporator 5 forms a third refrigerant channel 43. One end of the pre-evaporator inlet connecting pipe 41 is connected to the refrigerant condensation pipeline 17, and the other end is connected to the third refrigerant channel 43. One end of the pre-evaporator outlet connecting pipe 42 is connected to the third refrigerant channel 43, and the other end is connected to the refrigerant return main pipe 18. The pre-evaporator 5 also forms a pre-ventilation channel 44. The refrigerant flowing from the refrigerant condensation pipeline 17 to the pre-evaporator inlet connecting pipe 41 after cooling can enter the third refrigerant channel 43 of the pre-evaporator 5 through the pre-evaporator inlet connecting pipe 41, and then enter the refrigerant return main pipe 18 through the pre-evaporator outlet connecting pipe 42, and then enter the compressor 8 from the refrigerant return main pipe 18. The refrigerant can exchange heat with the airflow flowing through the pre-ventilation channel 44 in the third refrigerant channel 43 of the pre-evaporator 5 to cool the airflow. The cooled airflow then flows through the rectifier 81 and condenser 2, carrying away the heat of the refrigerant flowing through the condenser 2, which can reduce the condensing pressure, reduce the current of the compressor 8, and also reduce the exhaust temperature of the compressor 8.

[0061] Preferably, the pre-evaporator inlet connecting pipe 41 includes a third capillary tube 16, allowing the refrigerant to be depressurized and throttled through the third capillary tube 16 before flowing into the pre-evaporator 5 for heat exchange. The pre-evaporator inlet connecting pipe 41 also includes a third pipe body, which connects the third capillary tube 16 and the pre-evaporator 5.

[0062] The pre-evaporator 5 includes a bent pipe 45, and the third refrigerant channel 43 is formed on the bent pipe 45. The pre-evaporator 5 also includes a plurality of guide plates 46 connected to the bent pipe 45. The pre-ventilation channel 44 is formed between any two adjacent guide plates 46, so that the airflow flowing through the pre-ventilation channel 44 can exchange heat with the refrigerant in the third refrigerant channel 43 through the pipe wall of the bent pipe 45.

[0063] The effective air intake space of all the pre-ventilation channels 44 of the pre-evaporator 5 is larger than the effective air intake space of all the condenser ventilation channels 74 of the condenser 2.

[0064] Preferably, a regulator 60 may be provided between the rectifier 81 and the condenser 2. The regulator 60 includes a housing 61; a plurality of regulating channels 62 are sequentially arranged inside the housing 61, and a fan blade 63 is pivotally connected to each regulating channel 62. The regulator 60 also includes a drive device. The rotation axis of each fan blade 63 constitutes a first axis, and a surface passing through the first axis and parallel to the front wall of each regulating channel 62 constitutes an regulating reference surface. The drive device is used to drive each fan blade 63 to rotate between a first position and a second position of the corresponding regulating channel 62. The fan blade 63 is located at the opposite... When the first position of the adjustment channel 62 is adjusted, the angle between the fan blade 63 and the adjustment reference plane is 30-45°. When the fan blade 63 is in the second position of the corresponding adjustment channel 62, the fan blade 63 is parallel to the front wall of the corresponding adjustment channel 62. In use, when the fan blade 63 is driven to rotate synchronously to the first position by the drive device, the ventilation volume can be reduced to decrease the airflow through the condenser 2. When the fan blade 63 is driven to rotate synchronously to the second position by the drive device, the ventilation volume can be increased to increase the airflow through the condenser 2. Thus, the cooling effect of the refrigerant can be adjusted according to the refrigerant flow rate and other conditions in the condenser 2.

[0065] The drive device can be any existing drive device on the market, as long as it can drive the fan blades 63 in the multiple adjustment channels 62 to rotate. For example, it can include multiple driven wheels, driving wheels, transmission belts and motors that correspond one-to-one with the multiple fan blades 63; the motor is used to drive the driving wheel to rotate; the driven wheel is fixed on the corresponding fan blade 63, and the transmission belt is wound around the multiple driven wheels and driving wheel.

[0066] The compressor 8 is located inside the cooling container 9 and immersed in a liquid cooling medium. The cooling medium is a fluorinated liquid. The boiling point of the fluorinated liquid is 76°C, and its thermal conductivity is 0.069 W / (mK). By using a fluorinated liquid as the cooling medium, when the compressor 8 is running, after the surface temperature of the compressor 8 casing rises to 76°C, the fluorinated liquid absorbs heat and vaporizes, undergoing a phase change. The fluorinated liquid then boils and transfers heat to the surface of the compressor 8 casing, thereby cooling the compressor 8 and improving the cooling effect.

[0067] Of course, the cooling medium can be any commercially available fluorinated liquid. More preferably, the cooling medium is an electronic fluorinated liquid, which has low viscosity and excellent electrical insulation and thermal conductivity. In some embodiments, the electronic fluorinated liquid can be 3M's Novec 7200 model electronic fluorinated liquid.

[0068] The upper end of the cooling container 9 is connected to the upper end of the cooling medium supply device 11 via a liquid level balance pipe 22, and a solenoid valve 10 is installed between the lower end of the cooling container 9 and the lower end of the cooling medium supply device 11. The laser chiller also includes an exhaust temperature sensor 7, which is installed on the condenser inlet connecting pipe 71 and is used to detect the temperature of the gaseous refrigerant discharged from the compressor 8. When the exhaust temperature sensor 7 detects that the temperature of the gaseous refrigerant discharged from the compressor 8 is greater than 110°C, the solenoid valve 10 opens. In this embodiment, the distance between the liquid level balance pipe 22 and the top of the cooling container 9 is 100mm. After adding liquid cooling medium, the highest liquid level of the cooling medium supply device 11 and the cooling container 9 is flush with the liquid level balance pipe 22. The section of the cooling container 9 above the liquid level balance pipe 22 forms an upper section, which facilitates the evaporation of the fluorinated liquid and reduces the gas pressure of the fluorinated liquid. When the ambient temperature is high and the laser chiller is operating under high load, the fluorinated liquid in the cooling container 9 evaporates rapidly, causing the liquid level to drop. This reduces the heat dissipation capacity of the compressor 8 casing and raises the exhaust temperature. When the exhaust temperature sensor 7 detects that the temperature of the gaseous refrigerant discharged from the compressor 8 is greater than 110°C, the solenoid valve 10 automatically opens, allowing liquid fluorinated liquid to flow from the cooling medium supply device 11 to the cooling container 9. This replenishes the cooling container 9 with sufficient fluorinated liquid to cool the compressor 8, improving the heat dissipation capacity of the compressor 8 surface, reducing the exhaust temperature, exhaust pressure, and operating current of the compressor 8, and ensuring the continuous operation of the compressor 8. When the exhaust temperature sensor 7 detects that the temperature of the gaseous refrigerant discharged from the compressor 8 is less than 110°C, the solenoid valve 10 automatically closes. When the ambient temperature is low and the system is under low load, the fluorinated liquid in the cooling container 9 evaporates slowly and can flow back to the cooling medium supply device 11 through the liquid level balance pipe 22. In this embodiment, the cooling medium supply device 11 includes a storage tank for storing the fluorinated liquid.

[0069] The above embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of protection of the present invention. Any non-substantial changes and substitutions made by those skilled in the art based on the present invention shall fall within the scope of protection claimed by the present invention.

Claims

1. A laser chiller, characterized in that: The system includes a compressor, a cooling fan, a rectifier, a laser cooling water supply pipeline, a refrigerant condensation pipeline, a coil evaporator heat exchange pipeline, a pre-evaporator heat exchange pipeline, a plate heat exchanger heat exchange pipeline, a cooling container, and a cooling medium supply device. A condenser is installed on the refrigerant condensation pipeline. The coil evaporator heat exchange pipeline, the pre-evaporator heat exchange pipeline, and the plate heat exchanger heat exchange pipeline are all connected to the compressor inlet, and the compressor outlet is connected to the refrigerant condensation pipeline. The coil evaporator heat exchange pipeline, the pre-evaporator heat exchange pipeline, and the plate heat exchanger heat exchange pipeline are each connected to the refrigerant condensation pipeline. The plate heat exchanger pipeline includes a plate heat exchanger, which is provided with a cooling medium channel. One end of the cooling medium channel is connected to a cooling medium inlet pipe, and the other end is connected to a cooling medium return pipe. The compressor is located... Inside the cooling container, the cooling medium supply device supplies liquid cooling medium to the cooling container; the cooling medium inlet pipe is connected to the cooling container, and the cooling medium inlet channel is for the flow of gaseous cooling medium that has absorbed heat from the compressor and formed into a gaseous state; the cooling medium return pipe is connected to the cooling container; the cooling fan, when working, is used to form an airflow that flows sequentially through the pre-evaporator zone, the rectifier, and the condenser; the pre-evaporator heat exchange pipeline includes a pre-evaporator located in the pre-evaporator zone; the condenser forms multiple condensing ventilation channels for airflow; the rectifier is used to cause the airflow to enter the condensing ventilation channels in a manner parallel to the extension direction of the condensing ventilation channels; the coil evaporator heat exchange pipeline includes a coil evaporator; the coil evaporator is provided with a cooling water chamber, and the laser cooling water supply pipeline is connected to the cooling water chamber.

2. The laser chiller as described in claim 1, characterized in that: The laser cooling water supply pipeline includes a water supply pipe and a water pump; the water supply pipe is used to connect to the water inlet of the laser; the water supply pipe is connected to the cooling water chamber through the water pump.

3. The laser chiller as described in claim 2, characterized in that: The laser cooling water supply pipeline also includes a return water pipe, which is used to connect to the water outlet of the laser and is connected to the cooling water cavity.

4. The laser chiller as described in claim 1, characterized in that: The rectifier includes a first rectifier cavity and a second rectifier cavity arranged sequentially along the airflow direction; the first rectifier cavity is used to reduce the vortex flow caused by the rotation of the cooling fan; the second rectifier cavity is used to promote the airflow to enter the condensing ventilation channel in a manner parallel to the extension direction of the condensing ventilation channel.

5. The laser chiller as described in claim 1, characterized in that: The condenser is a microchannel condenser.

6. The laser chiller as described in any one of claims 1-5, characterized in that: The compressor inlet is connected to a refrigerant return main pipe, and the coil evaporator heat exchange pipe, the pre-evaporator heat exchange pipe, and the plate heat exchanger heat exchange pipe are respectively connected to the compressor inlet through the refrigerant return main pipe.

7. The laser chiller as described in any one of claims 1-5, characterized in that: The cooling medium is a fluorinated liquid.

8. The laser chiller as described in any one of claims 1-5, characterized in that: The compressor is located inside a cooling container and is immersed in a liquid cooling medium.

9. The laser chiller as described in claim 1, characterized in that: The upper end of the cooling container is connected to the upper end of the cooling medium supply device via a liquid level balance pipe.

10. The laser chiller as described in claim 1 or 9, characterized in that: A solenoid valve is provided between the lower end of the cooling container and the lower end of the cooling medium supply device. The laser chiller also includes an exhaust temperature sensor, which is used to detect the temperature of the refrigerant discharged from the compressor. When the exhaust temperature sensor detects that the temperature of the refrigerant discharged from the compressor is greater than 110°C, the solenoid valve opens.

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