Test fixture and test method for testing device performance under different impedances

Abstract

The application relates to the field of wireless communication technology and provides a test fixture and a test method for testing the performance of a device under different impedances. The test fixture comprises a circuit bottom plate, a signal connector, a first radio frequency connector, a second radio frequency connector, a third radio frequency connector, a device clamp, a first radio frequency switch, a matching circuit and a second radio frequency switch. The device clamp is electrically connected with the first radio frequency connector and the second radio frequency connector. The first radio frequency switch is used for connecting a power supply and a control signal. The control end of the first radio frequency switch is electrically connected with the device clamp. The matching circuit comprises multiple matching circuits. The input end of each matching circuit is connected with one output end of the first radio frequency switch. The second radio frequency switch is used for connecting the power supply and the control signal. The output end of the second radio frequency switch is connected with the output end of the multiple matching circuits. The application has good test effect and high test precision for the performance of the device under different impedances.

Description

Technical Field

[0001] This invention relates to the field of wireless communication technology, and in particular to a test fixture and test method for testing the performance of devices under different impedances. Background Technology

[0002] In the production process of radio frequency (RF) devices, such as power amplifiers (PAs) and RF front-end modules (FEMs), functional and performance testing (FT) after product packaging is a critical step in ensuring product quality. FT testing verifies the functional integrity of RF devices and whether various performance indicators (such as gain, output power, and noise figure) meet design requirements. It is an important means of screening qualified products and eliminating defective ones.

[0003] In existing FT test systems, to ensure signal transmission stability and test accuracy, the impedance of the entire RF link is typically designed to be 50 ohms. Specifically, the device under test (DUT) is fixed in a dedicated socket, whose pins are electrically connected to the test base plate via solder pads. The socket is then connected to test instruments (such as signal generators and spectrum analyzers) via RF coaxial cables, forming a complete test loop. The RF impedance of each component in the loop is matched to 50 ohms. This 50-ohm impedance matching-based testing method effectively reduces signal reflection and ensures the integrity of the test signal, thereby enabling accurate evaluation of the performance of RF devices under standard impedance conditions.

[0004] However, in the actual operating environment of RF devices, the RF impedance at their input and output terminals is often not a stable 50 ohms, but rather fluctuates significantly. For example, in the practical application scenarios of Wi-Fi RF modules, the antenna impedance is significantly affected by the environment (such as obstruction by surrounding objects, changes in distance, etc.), causing the impedance faced by the module's output terminal to exhibit dynamic changes, which may deviate significantly from 50 ohms. The performance of RF devices is closely related to their input and output impedance. When the impedance deviates from 50 ohms, it can lead to problems such as increased signal reflection and decreased power transmission efficiency, resulting in deteriorated device performance (such as a worse EVM index for Wi-Fi modules), and even affecting their operational reliability and lifespan.

[0005] Therefore, relying solely on the existing FT test based on a fixed impedance of 50 ohms cannot fully reflect the performance of RF devices under complex impedance environments in real-world applications. This may lead to some products that have performance problems due to impedance mismatch in actual applications being mistakenly judged as qualified, thus affecting the overall quality of the terminal equipment. Summary of the Invention

[0006] To address the shortcomings of the existing technologies, this invention proposes a test fixture and test method for testing the performance of devices under different impedances, thereby solving the problem of poor test results for the performance characteristics of devices under different impedances using existing test fixtures.

[0007] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0008] In a first aspect, embodiments of the present invention provide a test fixture for testing the performance of a device under different impedances, the test fixture comprising:

[0009] The circuit base plate is provided with a signal connector, a first radio frequency connector, a second radio frequency connector and a third radio frequency connector. The signal connector is used to receive control signals, the first radio frequency connector is used to input radio frequency signals, the second radio frequency connector is used to output radio frequency signals, and the third radio frequency connector is used to connect to the radio frequency circuit.

[0010] The device fixture is electrically connected to the first RF connector and the second RF connector, and is also connected to the signal connector for receiving power and control signals, respectively; the device fixture is used to place the device under test.

[0011] A first radio frequency switch is used to connect to the power supply and the control signal respectively; the control terminal of the first radio frequency switch is electrically connected to the device fixture.

[0012] A matching circuit, comprising multiple matching circuits, wherein the input terminal of each matching circuit is respectively connected to one of the output terminals of the first radio frequency switch; and,

[0013] The second RF switch is used to connect to the power supply and the control signal respectively; the multiple output terminals of the second RF switch are respectively connected to the output terminals of the multiple matching circuits; the control terminal of the second RF switch is connected to the third RF connector.

[0014] The control signal controls the first RF switch and the second RF switch to switch the multiple matching circuits on and off to achieve the testing of the device under test.

[0015] Preferably, the output terminals of the first RF switch include a first output terminal, a second output terminal, a third output terminal, a fourth output terminal, a fifth output terminal, and a sixth output terminal; the first output terminal, the second output terminal, the third output terminal, and the fourth output terminal of the first RF switch are respectively connected to the input terminals of the plurality of matching circuits; the sixth output terminal of the first RF switch is left floating.

[0016] The output terminals of the second RF switch include a first output terminal, a second output terminal, a third output terminal, a fourth output terminal, a fifth output terminal, and a sixth output terminal; the first output terminal, the second output terminal, the third output terminal, and the fourth output terminal of the second RF switch are respectively connected to the output terminals of the plurality of matching circuits; the fifth output terminal of the first RF switch is connected to the fifth output terminal of the second RF switch, and the sixth output terminal of the second RF switch is left floating;

[0017] The plurality of matching circuits include a first matching unit, a second matching unit, a third matching unit, and a fourth matching unit; the input terminal of the first matching unit is connected to the first output terminal of the first RF switch, and the output terminal of the first matching unit is connected to the first output terminal of the second RF switch; the input terminal of the second matching unit is connected to the second output terminal of the first RF switch, and the output terminal of the second matching unit is connected to the second output terminal of the second RF switch; the input terminal of the fourth matching unit is connected to the fourth output terminal of the first RF switch, and the output terminal of the fourth matching unit is connected to the fourth output terminal of the second RF switch;

[0018] The impedances of the first matching unit, the second matching unit, the third matching unit, and the fourth matching unit change sequentially.

[0019] Preferably, the first matching unit includes a first capacitor and a first inductor; a first terminal of the first capacitor is connected to a first terminal of the first inductor and serves as the input terminal of the first matching unit; a second terminal of the first capacitor is grounded, and a second terminal of the first inductor serves as the output terminal of the first matching unit.

[0020] Preferably, the second matching unit includes a second capacitor and a second inductor; the first end of the second inductor serves as the input terminal of the second matching unit, and the second end of the second inductor is connected to the first end of the two capacitors and serves as the output terminal of the second matching unit; the second end of the second capacitor is grounded.

[0021] Preferably, the third matching unit includes a third capacitor and a third inductor; the first terminal of the third capacitor serves as the input terminal of the third matching unit, and the second terminal of the third capacitor is connected to the first terminal of the third inductor and serves as the output terminal of the third matching unit; the second terminal of the third inductor is grounded.

[0022] Preferably, the fourth matching unit includes a fourth capacitor and a fifth capacitor; the first terminal of the fourth capacitor is connected to the first terminal of the fifth capacitor and serves as the input terminal of the fourth matching unit, the second terminal of the fourth capacitor serves as the output terminal of the fourth matching unit, and the second terminal of the fifth capacitor is grounded.

[0023] Preferably, the first RF connector is electrically connected to the device clamp via a first high-frequency impedance line; the second RF connector is electrically connected to the device clamp via a second high-frequency impedance line.

[0024] Preferably, both the first high-frequency impedance line and the second high-frequency impedance line are one of microstrip lines, striplines, and coaxial lines.

[0025] Secondly, embodiments of the present invention provide a test method for testing the performance of a device under different impedances. The test method is based on the test fixture described above for testing the performance of a device under different impedances, and includes the following steps:

[0026] Place the device under test in the device fixture;

[0027] The first RF switch and the second RF switch are controlled according to the control signal, so that the first RF switch and the second RF switch are connected to different matching circuits; wherein the matching circuits have different matching impedances.

[0028] The control signal sends control commands to control the device under test to perform performance testing, and shuts down the device under test after the test is completed.

[0029] Compared with related technologies, in the embodiments of the present invention, a signal connector, a first RF connector, a second RF connector, and a third RF connector are provided on the circuit base plate. The signal connector is used to receive control signals, the first RF connector is used to input RF signals, the second RF connector is used to output RF signals, and the third RF connector is used to connect to the RF circuit. The device fixture is electrically connected to the first RF connector and the second RF connector respectively, and the device fixture is connected to the signal connector to receive the operating power supply and control signals respectively. The device fixture is used to place the device under test (DUT). The first RF switch is used to receive the power supply and control signals respectively. The input terminal of each matching circuit is connected to one of the output terminals of the first RF switch respectively. The second RF switch is used to receive the power supply and control signals respectively. The multiple output terminals of the second RF switch are connected one-to-one to the output terminals of multiple matching circuits respectively, and the control terminal of the second RF switch is connected to the third RF connector. The control signal controls the first RF switch and the second RF switch to switch the on and off of multiple matching circuits to achieve the testing of the DUT. The performance testing of the DUT is achieved by using the different impedances of multiple matching circuits. It can be used in production lines to quickly, conveniently, and cost-effectively test the performance under different impedances, with good testing results. Attached Figure Description

[0030] The present invention will now be described in detail with reference to the accompanying drawings. The above and other aspects of the present invention will become clearer and more readily understood through the detailed description following the accompanying drawings. In the drawings:

[0031] Figure 1 This is a circuit structure block diagram of a test fixture for testing device performance under different impedances, provided in an embodiment of the present invention.

[0032] Figure 2 The circuit diagram of the first matching unit of the test fixture for testing device performance under different impedances provided in the embodiments of the present invention;

[0033] Figure 3 A circuit diagram of the second matching unit of a test fixture for testing device performance under different impedances, provided in an embodiment of the present invention;

[0034] Figure 4 The circuit diagram of the third matching unit of the test fixture for testing device performance under different impedances provided in the embodiments of the present invention;

[0035] Figure 5 The circuit diagram of the fourth matching unit of the test fixture for testing device performance under different impedances provided in the embodiments of the present invention;

[0036] Figure 6 Polar coordinate graphs for analyzing and solving impedance matching problems of test fixtures for testing device performance under different impedances provided in embodiments of the present invention;

[0037] Figure 7 This is a flowchart of a test method for a test fixture used to test device performance under different impedances, provided in an embodiment of the present invention.

[0038] Among them, 100 is a test fixture for testing device performance under different impedances, 1 is a circuit base plate, 2 is a signal connector, 3 is a first RF connector, 4 is a second RF connector, 5 is a third RF connector, 6 is a device fixture, 7 is a matching circuit, 71 is a first matching unit, 72 is a second matching unit, 73 is a third matching unit, 74 is a fourth matching unit, 8 is a first high-frequency impedance line, and 9 is a second high-frequency impedance line. Detailed Implementation

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings of this application, are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings of this application are used to distinguish different objects, not to describe a particular order.

[0040] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0041] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0042] Example 1

[0043] Please see Figures 1-6As shown, this embodiment of the invention provides a test fixture 100 for testing device performance under different impedances. The test fixture 100 includes: a circuit base plate 1, a device clamp 6, a first RF switch SW1, multiple matching circuits 7, and a second RF switch SW2. Optionally, the first RF switch SW1 and the second RF switch SW2 are SP6T RF switches.

[0044] The circuit base plate 1 has a connecting circuit, and the circuit base plate 1 facilitates the installation of the device fixture 6, the first RF switch SW1, multiple matching circuits 7, and the second RF switch SW2. The circuit base plate 1 is equipped with a signal connector 2, a first RF connector 3 (CON1), a second RF connector 4 (CON2), and a third RF connector 5 (CON3). The signal connector 2 is used to receive control signals, the first RF connector 3 is used to input RF signals, the second RF connector 4 is used to output RF signals, and the third RF connector 5 is used to connect to the RF I / O circuit.

[0045] The device holder 6 is electrically connected to the first RF connector 3 and the second RF connector 4, respectively. The device holder 6 is also connected to the signal connector 2 for receiving power and control signals, respectively. The device holder 6 is used to place the device under test (DUT). The device holder 6 (Socket) can be pneumatic, electric, or manual, used to secure and clamp the DUT, ensuring a good electrical connection between the DUT and the circuit board 1. The power pin of the device holder 6 is used to input power, and the control pin is used to input control signals. The power supply and control signals are input externally through the signal connector 2 (Connector) on the board.

[0046] The first RF switch SW1 is used to connect to the power supply and the control signal respectively; the control terminal SW1-1 of the first RF switch SW1 is electrically connected to the device clamp 6.

[0047] The matching circuit 7 includes multiple circuits, and the input terminal of each matching circuit 7 is connected to one of the output terminals of the first radio frequency switch SW1.

[0048] The second RF switch SW2 is used to connect to the power supply and the control signal respectively; the multiple output terminals of the second RF switch SW2 are respectively connected to the output terminals of the multiple matching circuits 7, and the control terminal SW2-1 of the second RF switch SW2 is connected to the third RF connector 5; the control signal controls the first RF switch SW1 and the second RF switch SW2 to switch the multiple matching circuits 7 on and off to achieve the testing of the device under test. Utilizing the different impedances of the multiple matching circuits 7 to achieve the performance testing of the device under test can be used on production lines for fast, convenient, and low-cost testing of performance under different impedances, with good testing results.

[0049] Optionally, the control signals that control the device under test, the first RF switch SW1, and the second RF switch SW2 can be the same signal or different signals, such as control signal 1, control signal 2, and control signal 3, etc., which will not be described here.

[0050] In this embodiment, the output terminals of the first RF switch SW1 include a first output terminal SW1-2, a second output terminal SW1-3, a third output terminal SW1-4, a fourth output terminal SW1-5, a fifth output terminal SW1-6, and a sixth output terminal SW1-7; the first output terminal SW1-2, the second output terminal SW1-3, the third output terminal SW1-4, and the fourth output terminal SW1-5 of the first RF switch SW1 are respectively connected to the input terminals of the plurality of matching circuits 7; the sixth output terminal SW1-7 of the first RF switch SW1 is left floating. The output terminals of the second RF switch SW2 include a first output terminal SW2-2, a second output terminal SW2-3, a third output terminal SW2-4, a fourth output terminal SW2-5, a fifth output terminal SW2-6, and a sixth output terminal SW2-7. The first output terminal SW2-2, the second output terminal SW2-3, the third output terminal SW2-4, and the fourth output terminal SW2-5 of the second RF switch SW2 are respectively connected to the output terminals of the multiple matching circuits 7. The fifth output terminal SW2-6 of the first RF switch SW1 is connected to the fifth output terminal SW2-6 of the second RF switch SW2, and the sixth output terminal SW2-7 of the second RF switch SW2 is left floating.

[0051] In this embodiment, the plurality of matching circuits 7 include a first matching unit 71, a second matching unit 72, a third matching unit 73, and a fourth matching unit 74. The input terminal of the first matching unit 71 is connected to the first output terminal SW1-2 of the first RF switch SW1, and the output terminal of the first matching unit 71 is connected to the first output terminal SW2-2 of the second RF switch SW2. The input terminal of the second matching unit 72 is connected to the second output terminal SW1-3 of the first RF switch SW1, and the output terminal of the second matching unit 72 is connected to the second output terminal SW2-3 of the second RF switch SW2. The input terminal of the third matching unit 73 is connected to the third output terminal SW1-4 of the first RF switch SW1, and the output terminal of the fourth matching unit 74 is connected to the fourth output terminal SW1-5 of the first RF switch SW1, and the output terminal of the fourth matching unit 74 is connected to the fourth output terminal SW2-5 of the second RF switch SW2.

[0052] The impedances of the first matching unit 71, the second matching unit 72, the third matching unit 73, and the fourth matching unit 74 change sequentially. Specifically, the impedance of the first matching unit 71 is 100 ohms. The impedance of the second matching unit 72 is 40 + j30 ohms. The impedance of the third matching unit 73 is 25 ohms. The impedance of the fourth matching unit 74 is 40 - j30 ohms; where 40 is the resistance in ohms, reflecting the active power loss of the circuit element; j is the imaginary unit, generally j = 30 represents reactance, measured in ohms, reflecting the energy storage capacity of a circuit element for current. Optionally, the impedances of the first matching unit 71, the second matching unit 72, the third matching unit 73, and the fourth matching unit 74 may decrease or increase sequentially, depending on the specific circumstances, and will not be described further here.

[0053] Specifically, the device under test is a 2.4G RF front-end module, the test frequency is selected as 2450MHz, and the test impedances are set at four evenly distributed impedance positions on the Smith chart with a VSWR of 2:1. The impedance values ​​are 100 ohms ±10 ohms, 40 + j30 ohms, 25 ohms, and 40 - j30 ohms, respectively. The impedance positions on the Smith chart are shown below. Figure 6 Positions a, b, c, and d are shown in the middle.

[0054] At this point, we have the following VSWR ratios: Position a: VSWR (100 ohms) = 2:1; Position b: VSWR (40 + j30 ohms) = 2:1; Position c: VSWR (25 ohms) = 2:1; Position d: VSWR (40 - j30 ohms) = 2:1. The center position on the Smith chart is 50 ohms impedance. Of course, these impedances can be adjusted according to different testing requirements. For example, if designed with VSWR = 3:1, more impedance positions can be set.

[0055] In this embodiment, as Figure 2 As shown, the first matching unit 71 includes a first capacitor C1 and a first inductor L1; the first terminal of the first capacitor C1 is connected to the first terminal of the first inductor L1 and serves as the input terminal of the first matching unit 71; the second terminal of the first capacitor C1 is grounded, and the second terminal of the first inductor L1 serves as the output terminal of the first matching unit 71. Based on the above impedance values ​​and test conditions, four sets of matching circuits 7 are designed. The circuit of the first matching unit 71 is used to convert to a 100-ohm impedance, with L1 = 3.2nH and C1 = 0.63pF.

[0056] Specifically, during the test, the host sends commands to the device under test, the first RF switch SW1, and the second RF switch SW2 via the control signal bus to set their working status.

[0057] The host sends a command to connect SW1-1 to SW1-6 and SW2-1 to SW2-6, setting the output impedance of the device under test (DUT) to 50 ohms. The host then sends a command to activate the DUT and test its performance at the 50-ohm impedance. After the test is complete, a command is sent to shut down the DUT.

[0058] The host sends a command to connect SW1-1 to SW1-2 and SW2-1 to SW2-2, setting the output impedance of the device under test (DUT) to 100 ohms. The host then sends a command to turn on the DUT and test its performance at 100 ohms impedance. After the test is complete, a command is sent to turn off the DUT.

[0059] In this embodiment, as Figure 3 As shown, the second matching unit 72 includes a second capacitor C2 and a second inductor L2; the first end of the second inductor L2 serves as the input terminal of the second matching unit 72, and the second end of the second inductor L2 is connected to the first end of the two capacitors and serves as the output terminal of the second matching unit 72; the second end of the second capacitor C2 is grounded. Based on the above impedance values ​​and test conditions, the circuit of the second matching unit 72 is used to convert to an impedance of 40 + j30 ohms, L2 = 3.2nH, and C2 = 0.63pF.

[0060] Specifically, during the test, the host sends commands to the device under test, the first RF switch SW1, and the second RF switch SW2 via the control signal bus to set their working status.

[0061] The host sends a command to connect SW1-1 to SW1-3 and SW2-1 to SW2-3, setting the output impedance of the device under test (DUT) to 40 + J30 ohms. The host then sends a command to turn on the DUT and test its performance at the 40 + J30 ohm impedance. After the test is complete, a command is sent to turn off the DUT.

[0062] In this embodiment, as Figure 4 As shown, the third matching unit 73 includes a third capacitor C3 and a third inductor L3; the first terminal of the third capacitor C3 serves as the input terminal of the third matching unit 73, and the second terminal of the third capacitor C3 is connected to the first terminal of the third inductor L3 and serves as the output terminal of the third matching unit 73; the second terminal of the third inductor L3 is grounded. Based on the above impedance values ​​and test conditions, the circuit of the third matching unit 73 is used to convert to a 25-ohm impedance, L3 = 3.2nH, C3 = 2.5pF.

[0063] Specifically, the host sends a command to connect SW1-1 to SW1-4 and SW2-1 to SW2-4, setting the output impedance of the device under test (DUT) to 25 ohms. The host then sends a command to turn on the DUT and test its performance at the 25-ohm impedance. After the test is complete, a command is sent to turn off the DUT.

[0064] In this embodiment, as Figure 5 As shown, the fourth matching unit 74 includes a fourth capacitor C4 and a fifth capacitor C5; the first terminal of the fourth capacitor C4 is connected to the first terminal of the fifth capacitor C5 and serves as the input terminal of the fourth matching unit 74, the second terminal of the fourth capacitor C4 serves as the output terminal of the fourth matching unit 74, and the second terminal of the fifth capacitor C5 is grounded. Based on the above impedance values ​​and test conditions, the circuit of the fourth matching unit 74 is used to convert to a 40-j30 ohm impedance, with C4 = 2.4pF and C5 = 0.25pF.

[0065] Specifically, the host sends a command to connect SW1-1 to SW1-5 and SW2-1 to SW2-5, setting the output impedance of the device under test (DUT) to 40-J30 ohms. The host then sends a command to turn on the DUT and test its performance at the 40-J30 ohm impedance. After the test is completed, a command is sent to turn off the DUT.

[0066] In this embodiment, the first RF connector 3 is electrically connected to the device clamp 6 via a first high-frequency impedance line 8; the second RF connector 4 is electrically connected to the device clamp 6 via a second high-frequency impedance line 9.

[0067] In this embodiment, both the first high-frequency impedance line 8 and the second high-frequency impedance line 9 are microstrip lines, striplines, and coaxial lines. Specifically, pins 61 and 62 of the device fixture 6 are connected to the first RF connector 3 and the second RF connector 4 on the circuit base plate 1 via the first high-frequency impedance line 8 and the second high-frequency impedance line 9, respectively; the control terminal SW1-1 of the first RF switch SW1 is connected to pin 63 of the device fixture 6. The high-frequency impedance line can be a microstrip line, stripline, coaxial line, etc., and the first RF connector 3 and the second RF connector 4 can be SMA connectors, N-type RF connectors, etc., for transmitting RF signals. Figure 1 In the example, CON1 is used to input the transmitted radio frequency signal, CON2 is used to output the received radio frequency signal, and CON3 is used to output the transmitted radio frequency signal.

[0068] Example 2

[0069] like Figure 7 As shown, this embodiment of the invention provides a test method for a test fixture used to test the performance of devices under different impedances. The test method is based on the test fixture 100 for testing the performance of devices under different impedances described in Embodiment 1 above, and the test method includes the following steps:

[0070] S1. Place the device under test in the device fixture 6.

[0071] S2. Control the first RF switch SW1 and the second RF switch SW2 according to the control signal, so that the first RF switch SW1 and the second RF switch SW2 are connected to different matching circuits 7, wherein the matching circuits 7 have different matching impedances.

[0072] The test includes performance tests at different matching impedances: 50 ohms, 100 ohms, 40+j30 ohms, and 25 ohms. The host computer then sends a command to turn on the device under test (DUT) and test its performance at different impedances. After the test is complete, a command is sent to turn off the DUT.

[0073] S3. The control signal sends a control command to control the device under test (DUT) to operate and perform performance testing. After the test is completed, the DUT is turned off. The control signal controls the first RF switch SW1 and the second RF switch SW2 to switch the on / off states of multiple matching circuits 7 to achieve the testing of the DUT. Utilizing the different impedances of the multiple matching circuits 7 to perform performance testing of the DUT allows for fast, convenient, and low-cost testing of performance under different impedances on production lines, with good testing results.

[0074] It should be noted that the various embodiments described above with reference to the accompanying drawings are merely illustrative of the present invention and not intended to limit its scope. Those skilled in the art should understand that any modifications or equivalent substitutions made to the present invention without departing from its spirit and scope should be included within the scope of the present invention. Furthermore, unless the context otherwise requires, words appearing in the singular include those in the plural, and vice versa. Additionally, unless specifically stated otherwise, all or part of any embodiment may be used in conjunction with all or part of any other embodiment.

Claims

1. A test fixture for testing the performance of devices under different impedances, characterized in that, The test fixture includes: The circuit base plate is provided with a signal connector, a first radio frequency connector, a second radio frequency connector and a third radio frequency connector. The signal connector is used to receive control signals, the first radio frequency connector is used to input radio frequency signals, the second radio frequency connector is used to output radio frequency signals, and the third radio frequency connector is used to connect to the radio frequency circuit. The device fixture is electrically connected to the first RF connector and the second RF connector, and is also connected to the signal connector for receiving power and control signals, respectively; the device fixture is used to place the device under test. A first radio frequency switch is used to connect to the power supply and the control signal respectively; the control terminal of the first radio frequency switch is electrically connected to the device fixture. A matching circuit, comprising multiple matching circuits, wherein the input terminal of each matching circuit is respectively connected to one of the output terminals of the first radio frequency switch; and, The second RF switch is used to connect to the power supply and the control signal respectively; the multiple output terminals of the second RF switch are respectively connected to the output terminals of the multiple matching circuits; the control terminal of the second RF switch is connected to the third RF connector. The control signal controls the first RF switch and the second RF switch to switch the multiple matching circuits on and off to achieve the testing of the device under test.

2. The test fixture for testing device performance under different impedances according to claim 1, characterized in that, The first RF switch has a first output terminal, a second output terminal, a third output terminal, a fourth output terminal, a fifth output terminal, and a sixth output terminal; the first output terminal, the second output terminal, the third output terminal, and the fourth output terminal of the first RF switch are respectively connected to the input terminals of the plurality of matching circuits; the sixth output terminal of the first RF switch is left floating. The output terminals of the second RF switch include a first output terminal, a second output terminal, a third output terminal, a fourth output terminal, a fifth output terminal, and a sixth output terminal; the first output terminal, the second output terminal, the third output terminal, and the fourth output terminal of the second RF switch are respectively connected to the output terminals of the plurality of matching circuits; the fifth output terminal of the first RF switch is connected to the fifth output terminal of the second RF switch, and the sixth output terminal of the second RF switch is left floating; The plurality of matching circuits include a first matching unit, a second matching unit, a third matching unit, and a fourth matching unit; the input terminal of the first matching unit is connected to the first output terminal of the first RF switch, and the output terminal of the first matching unit is connected to the first output terminal of the second RF switch; the input terminal of the second matching unit is connected to the second output terminal of the first RF switch, and the output terminal of the second matching unit is connected to the second output terminal of the second RF switch; the input terminal of the fourth matching unit is connected to the fourth output terminal of the first RF switch, and the output terminal of the fourth matching unit is connected to the fourth output terminal of the second RF switch; The impedances of the first matching unit, the second matching unit, the third matching unit, and the fourth matching unit change sequentially.

3. The test fixture for testing device performance under different impedances according to claim 2, characterized in that, The first matching unit includes a first capacitor and a first inductor; a first terminal of the first capacitor is connected to a first terminal of the first inductor and serves as the input terminal of the first matching unit; a second terminal of the first capacitor is grounded, and a second terminal of the first inductor serves as the output terminal of the first matching unit.

4. The test fixture for testing device performance under different impedances according to claim 2, characterized in that, The second matching unit includes a second capacitor and a second inductor; the first end of the second inductor serves as the input terminal of the second matching unit, and the second end of the second inductor is connected to the first end of the two capacitors and serves as the output terminal of the second matching unit; the second end of the second capacitor is grounded.

5. The test fixture for testing device performance under different impedances according to claim 2, characterized in that, The third matching unit includes a third capacitor and a third inductor; the first terminal of the third capacitor serves as the input terminal of the third matching unit, and the second terminal of the third capacitor is connected to the first terminal of the third inductor and serves as the output terminal of the third matching unit; the second terminal of the third inductor is grounded.

6. The test fixture for testing device performance under different impedances according to claim 2, characterized in that, The fourth matching unit includes a fourth capacitor and a fifth capacitor; the first terminal of the fourth capacitor is connected to the first terminal of the fifth capacitor and serves as the input terminal of the fourth matching unit, the second terminal of the fourth capacitor serves as the output terminal of the fourth matching unit, and the second terminal of the fifth capacitor is grounded.

7. The test fixture for testing device performance under different impedances according to claim 1, characterized in that, The first RF connector is electrically connected to the device clamp via a first high-frequency impedance line; the second RF connector is electrically connected to the device clamp via a second high-frequency impedance line.

8. The test fixture for testing device performance under different impedances according to claim 7, characterized in that, Both the first high-frequency impedance line and the second high-frequency impedance line are one of the following: microstrip line, stripline, and coaxial line.

9. A test method for testing device performance under different impedances, characterized in that, The test method is based on the test fixture for testing device performance under different impedances as described in any one of claims 1-8, and the test method includes the following steps: Place the device under test in the device fixture; The first RF switch and the second RF switch are controlled according to the control signal, so that the first RF switch and the second RF switch are connected to different matching circuits; wherein the matching circuits have different matching impedances. The control signal sends control commands to control the device under test to perform performance testing, and shuts down the device under test after the test is completed.

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