Microphone device

Abstract

A microphone apparatus includes a microphone element, a wiring, a first member, a second member, a holder, and a housing. The microphone element, the wiring, the first member, the second member, and the holder are arranged inside the housing. The holder holds at least one of the first member and the second member. The wiring electrically connects the microphone element to at least one of the first member and the second member. At least a portion of the wiring is accommodated in a space formed by the holder, the first member, and the second member.

Description

Technical Field

[0001] This disclosure relates to a microphone device. Background Art

[0002] A conventional camera method uses a wireless microphone (microphone device) to transmit and receive audio signals via wireless communication. Japanese Patent Application Publication No. 2011-120170 discloses a microphone device in which a MEMS capacitor and a detection circuit are arranged on a non-adjacent side inside a housing, and a flexible printed circuit (FPC) is bent to electrically connect the MEMS capacitor and the detection circuit.

[0003] In the configuration disclosed in Japanese Patent Application Publication No. 2011-120170, noise such as vibrations caused by user movement or squeaking generated when force is applied to the housing of the microphone device is transmitted through the wiring and can therefore be recorded. Summary of the Invention

[0004] A microphone device according to one aspect of this disclosure includes a microphone element, wiring, a first component, a second component, a retainer, and a housing. The microphone element, wiring, first component, second component, and retainer are arranged inside the housing. The retainer holds at least one of the first component and the second component. The wiring electrically connects the microphone element to at least one of the first component and the second component. At least a portion of the wiring is accommodated in the space formed by the retainer, the first component, and the second component.

[0005] A microphone device according to another aspect of this disclosure includes a microphone element, wiring, and a housing. The housing includes a first housing and a second housing disposed within the first housing. The wiring electrically connects the microphone element and the second housing. At least a portion of the wiring is housed within the space formed by the second housing.

[0006] Other features of various embodiments of this disclosure will become apparent from the following description of the embodiments with reference to the accompanying drawings. Attached Figure Description

[0007] Figure 1 These are schematic diagrams of microphone devices based on various examples.

[0008] Figure 2 It is a cross-sectional view of the microphone device based on Example 1.

[0009] Figure 3A and Figure 3B It is based on the structural diagram of the microphone device in Example 2.

[0010] Figure 4A and Figure 4B It is based on the structural diagram of the microphone device in Example 3.

[0011] Figure 5It is a cross-sectional view of the microphone device based on Example 4.

[0012] Figure 6A , Figure 6B , Figure 6C and Figure 6D It is based on the structural diagram of the microphone device in Example 5.

[0013] Figure 7 It is a cross-sectional view of the microphone device based on Example 6.

[0014] Figure 8 It is a cross-sectional view of the microphone device based on Example 7.

[0015] Figure 9A , Figure 9B and Figure 9C It is based on the structural diagram of the microphone device in Example 8. Detailed Implementation

[0016] A detailed description of embodiments of the present disclosure will now be given with reference to the accompanying drawings. Corresponding elements in the various figures will be designated by the same reference numerals, and repeated descriptions thereof will be omitted.

[0017] Now refer to Figure 1 A summary description of microphone device 1 based on each example will be given. Figure 1 This is a schematic diagram of microphone device 1 (2 to 7). Microphone device 1 is wirelessly connected to communication unit 200 installed on camera device 100, and transmits audio data such as the voice of user 400 and ambient sounds to communication unit 200 via wireless communication. Communication unit 200 is electrically connected to camera device 100 and transmits audio data received from microphone device 1 to camera device 100. Camera device 100 stores the audio data received from communication unit 200 in a storage medium provided in camera device 100. Thus, audio data acquired from microphone device 1 can be stored in camera device 100.

[0018] The microphone device 1 is intended for use by a user 400 by holding the microphone device 1 in his hand or wearing the microphone device 1 on his clothing using a holder such as a clip, and the microphone element 10 and the substrate, which will be described below, are housed inside the housing 50 of the microphone device 1.

[0019] The examples will be described in detail below.

[0020] Example 1

[0021] Now refer to Figure 2 A description of microphone device 1 based on Example 1 will be given. Figure 2 This is a cross-sectional view based on microphone device 1 in this example. (See diagram below.) Figure 2As shown, the microphone device 1 includes a microphone element 10, a wiring 20, a first component 30, a second component 40, and a housing 50. The microphone element 10, wiring 20, first component 30, and second component 40 are housed inside the housing 50.

[0022] The microphone element 10 is covered by a first damper 70, which will be described later, and held within the housing 50 via the first damper 70. The first damper 70 is an elastic member such as natural rubber, silicone rubber, or sponge. The housing 50 has a generally cuboid shape. It has a central direction ( Figure 2 A retainer (retaining member) 50c, with a rib-shaped internal shape extending substantially vertically in the X-axis direction, is disposed on the inner surface 50a of the housing 50. That is, the retainer 50c is a rib extending substantially vertically from the inner surface 50a of the housing 50. The retainer 50c is provided with a connector 50d protruding in the Z-axis direction. The first member 30 and the second member 40 are fixed to the connector 50d by screw members (not shown), which define their positions relative to the housing 50.

[0023] The first component 30 and the second component 40 each include an electronic substrate having a generally plate-shaped form. At least one of the first component 30 and the second component 40 is electrically connected to the wiring 20 described below. The main surfaces of the first component 30 and the second component 40 are held by a retainer 50c in a manner substantially perpendicular to the thickness direction (Z-axis direction) of the housing 50. Thus, due to the difference in the height direction of the connector 50d, the first component 30 and the second component 40 are arranged to be substantially parallel to each other at positions separated from each other in the Z-axis direction. This difference in the height direction forms a space 60 between the first component 30 and the second component 40. The microphone element 10 and the wiring 20 are electrically connected.

[0024] One end of the wiring 20 is connected to the microphone element 10 via a portion of a first damper 70 that covers the microphone element 10. The other end of the wiring 20 (opposite to the end connected to the microphone element 10) is electrically connected to either the first member 30 or the second member 40. A portion of the wiring 20 is accommodated in a bent state within the space 60 formed between the first member 30 and the second member 40. Due to the repulsive force generated when the wiring 20 is bent, the wiring 20 contacts each of the first member 30 and the second member 40. Therefore, the microphone device 1 is configured such that the wiring 20 does not directly contact the housing 50.

[0025] Next, the propagation of noise will be described in conjunction with the use of microphone device 1, in the case where the wiring 20 is in contact with the housing 50 and in the case where the wiring 20 is not in contact with the housing 50.

[0026] The microphone element 10 converts the collected sound into electrical signals and transmits the signals via wiring 20 to an electronic substrate, which serves as either the first component 30 or the second component 40. The electronic substrate converts the electrical signals transmitted from the microphone element 10 into audio data and stores the data in a storage medium within the electronic substrate or transmits the audio data to the communication unit 200.

[0027] When user 400 attempts to operate microphone device 1 during audio data recording, user 400 touches an operating unit (not shown) located on the outermost surface of microphone device 1. At this time, user 400 touches or holds the housing 50 of microphone device 1, causing forces such as impact propagation or deformation to be applied to microphone device 1. Actions such as walking, running, and jumping by user 400 during audio data recording can be transmitted to microphone device 1 as vibrations.

[0028] If the wiring 20 contacts the inner surface 50a of the housing 50, the touch noise or vibration generated by the user 400 touching the housing 50 will be directly transmitted to the wiring 20. If the shape of the housing 50 is deformed due to the user 400 gripping the housing 50, the contact state of the wiring 20 in contact with the inner surface 50a of the housing 50 may change, and the noise may be recorded as friction noise. Therefore, if the wiring 20 directly contacts the inner surface 50a of the housing 50, the interference caused by the user 400's operation may be recorded as noise such as mechanical noise.

[0029] On the other hand, in the microphone device 1 according to this example, the wiring 20 does not directly contact the inner surface 50a of the housing 50. This increases the propagation path from the housing 50 to the wiring 20 and reduces noise. Furthermore, the wiring 20 and the portions in contact with it (the first member 30 and the second member 40) are located away from the inner surface 50a of the housing 50 (not in contact with the inner surface 50a), which can suppress the propagation of force.

[0030] The following description of other operations of the microphone device 1 according to this example will now be given. In the microphone device 1, the respective positions of the first component 30 and the second component 40 in the height direction are determined by the height (length in the Z-axis direction) of the connector 50d disposed on the retainer 50c. Thus, even if the user 400 applies force in the Z-axis direction by gripping the housing 50, the force will not propagate beyond the retainer 50c, and therefore the relative positions of the first component 30 and the second component 40 in the height direction will not change. While maintaining the relative positional relationship between the first component 30 and the second component 40 and the wiring 20, the respective contact states do not change, thus noise such as friction noise or squeaking noise can be reduced.

[0031] In microphone device 1, space 60 is the portion of the internal space of housing 50 that includes the approximate center of housing 50 in the thickness direction (Z-axis direction). The approximate center of housing 50 in the thickness direction is the location physically separated from the outermost part of housing 50, and wiring 20 and the insertion points for retaining wiring 20 are arranged with this location as the base point. These insertion points increase the force transmission path from the outermost part of housing 50 to wiring 20, thereby reducing the stress applied to wiring 20. The length L1 of space 60 in the thickness direction of housing 50 is 75% or less, or 50% or less, of the length L2 of the internal space of housing 50.

[0032] In the microphone device 1, the microphone element 10 is covered by a first damper 70 and held by the housing 50 via the first damper 70. Since the microphone element 10 is covered by the first damper 70, vibrations or shocks transmitted from the outside of the housing 50 to the microphone element 10 and the wiring 20 can be suppressed.

[0033] In the microphone device 1, at least one of the first component 30 and the second component 40 is made of a material with a rigidity higher than that of the housing 50. Using a material in the first component 30 and the second component 40 with a rigidity higher than that of the housing 50 increases the rigidity toward the interior of the microphone device 1. Thus, even if the user 400 applies a strong force to the microphone device 1, the force caused by the deformation of the housing 50 can be received by the first component 30 or the second component 40, thereby suppressing the force applied to the wiring 20. Therefore, by increasing the strength of the first component 30 or the second component 40, deformation of the housing 50 can be suppressed, and abnormal sounds (noise) such as friction or squeaking of the wiring 20 can be reduced.

[0034] Example 2

[0035] Now refer to Figure 3A and Figure 3B A description of microphone device 2 based on Example 2 will be given. Figure 3A and Figure 3B This is a structural diagram of microphone device 2 according to this example. Figure 3A This is a view taken from the direction where the first component 30 and the second component 40 are flat (Z-axis direction), and Figure 3B yes Figure 3A The cross-sectional view of section AA in the image, viewed from the +Y axis direction. Figure 3A and Figure 3BDetails of the retainer 50c, which allows the damping force to propagate to the first member 30 and the second member 40, are shown. The retainer 50c is configured such that the distance from the inner surface 50a of the housing 50 to the connector 50d is long. That is, the connector (first connector) 50d is located in the region of the retainer 50c furthest from the connector (second connector) 50f on the inner surface 50a of the housing 50. For simplicity, in Figure 3A and Figure 3B The microphone element 10 and wiring 20 are omitted.

[0036] Two retainers 50c extend relative to the housing 50 along the Y-axis. The two retainers 50c are generally parallel to each other, and each retainer 50c has a bridge shape extending to connect its two ends to the inner surface 50a of the housing 50. Figure 3B As shown, connector 50d is disposed on retainer 50c to hold a first member 30 and a second member 40 disposed relative to retainer 50c in the ±Z-axis direction. The first member 30 and the second member 40 are fixed to connector 50d by fixing members such as screws, and the positions of the first member 30 and the second member 40 in the thickness direction (Z-axis direction) are relatively defined.

[0037] A description of the action when force is applied to microphone device 2 will now be given. Figure 3A The diagram illustrates the state where forces F1 and F2 are applied in the Y-axis direction when the user 400 holds the microphone device 2. When the user 400 holds the housing 50, forces F1 and F2 are generated and are in equilibrium. Forces F1 and F2 are distributed and propagated as forces f1 and f2 to the two retainers 50c, respectively. Forces f1 and f2 are in equilibrium on the retainers 50c, and the retainers 50c are in a state of stress due to the equilibrium of forces f1 and f2.

[0038] In this example, a protrusion 50e projecting in the X-axis direction is located at the midpoint of the retainer 50c, and the connector 50d is disposed on the protrusion 50e. The protrusion 50e of the retainer 50c is further away from the inner surface 50a of the housing 50 than other parts of the retainer 50c. Therefore, the stress propagates a longer distance to the connector 50d than to other parts of the retainer 50c. This increased stress propagation distance can disperse the stress on the retainer 50c and suppress the forces applied to the connector 50d and the first member 30 and the second member 40 fixed to the connector 50d.

[0039] On the other hand, when the protrusion 50e is arranged close to the inner side 50a of the housing 50, the distance through which stress propagates is reduced, and the stress cannot be sufficiently dispersed through the retainer 50c. When the stress cannot be sufficiently dispersed, forces f1 and f2 are transmitted more strongly, and stronger forces are applied to the connector 50d and the first member 30 and the second member 40 fixed to the connector 50d.

[0040] Therefore, by increasing the distance from the inner side 50a of the housing 50 to the connector 50d to disperse stress, the force transmitted to the first member 30 and the second member 40 can be suppressed.

[0041] Now, we will give the application of, for example, in the X-axis direction, in the following way. Figure 3A Description of the force states of forces F3 and F4, etc. The directions (X-axis direction) of forces F3 and F4 are perpendicular to the direction of extension of the retainer 50c (Y-axis direction). The region near the inner side 50a of the housing 50 that generates forces F3 and F4 is spaced apart from the protrusion 50e (spaced apart by a distance in the Y-axis direction). Therefore, the stress generated by forces F3 and F4 is transmitted circuitously along the side of the housing 50 through the retainer 50c. Thus, the propagation distance of forces F3 and F4 is longer than that of forces F1 and F2, allowing for further suppression of stress propagation.

[0042] By positioning the connector 50d on the retainer 50c at a position away from the inner surface 50a of the housing 50, this embodiment suppresses the forces applied to the first member 30 and the second member 40 respectively. As a result, abnormal sounds (noise) generated due to the force applied to the wiring 20 can be reduced.

[0043] Example 3

[0044] For reference Figure 4A and Figure 4B The following will provide a description of microphone device 3. Figure 4A and Figure 4B This is a structural diagram of the microphone device 3 according to this example, and details of the retainer 50c through which the damping force is transmitted to the first member 30 and the second member 40 are shown. The retainer 50c extends in a generally L-shape to the corner 50b of the inner side surface 50a of the housing 50, and the connector 50d is disposed in the area near the corner 50b. Figure 4A This is a view taken from the flat direction (Z-axis direction) of each of the components in the first component 30 and the second component 40, and Figure 4B yes Figure 4A The cross-sectional view of section BB along the +Y axis.

[0045] The retainer 50c extends relative to the inner surface 50a of the housing 50. The retainer 50c has a generally L-shape to fit along the corner 50b of the housing 50. Figure 4BAs shown, connector 50d is disposed near corner 50b of housing 50 to hold first member 30 and second member 40 in the Z-axis direction. First member 30 and second member 40 are fixed to connector 50d by fixing members such as screws, and the positions of first member 30 and second member 40 in the thickness direction (Z-axis direction) are determined relative to each other.

[0046] A description of the effect of placing the connector 50d near the corner 50b of the housing 50 will be given. Figure 4A The retainer 50c shown has a rib shape to reinforce the housing 50 and inhibit bending and deformation when the user 400 grips the side of the housing 50. Force F5 indicates the force when the user 400 grips the housing 50 at a position away from the corner 50b of the housing 50. Force F6 indicates the force when the user 400 grips the housing 50 in the area near the corner 50b of the housing 50. When forces F5 and F6 are equal, when force F5 is applied from the outside of the housing 50, the side of the housing 50 bends and deforms with the corner 50b as the fulcrum. Due to the deformation of the side of the housing 50, the connector 50d and the first member 30 and the second member 40 connected to the connector 50d receive force F5. As a result, a strong force is applied to the first member 30 and the second member 40.

[0047] As the applied force approaches the area near the corner 50b, which serves as the fulcrum, i.e., the location of force F6, the deformation of the side of the housing 50 is suppressed. Positioning the connector 50d as a retainer at the location where deformation is minimal when force is applied (which can be the location of minimum deformation) (i.e., the high-rigidity area) further suppresses deformation of the first member 30 and the second member 40. Consequently, the force applied to the wiring 20 can be suppressed.

[0048] Example 4

[0049] Now refer to Figure 5 A description of microphone device 4 based on Example 4 will be given. Figure 5 This is a cross-sectional view based on microphone device 4 in this example. (As shown) Figure 5 As shown, the microphone device 4 has a microphone element 10, a wiring 20, a first component 30, a second component 40, and a housing 50. The microphone element 10, wiring 20, first component 30, and second component 40 are housed inside the housing 50.

[0050] The microphone element 10 is covered by a first damper 70 and held within the housing 50 via the first damper 70. The first damper 70 is an elastic member such as natural rubber, silicone rubber, or sponge. The housing 50 has a generally rectangular parallelepiped shape. The retainer 50c has a shape facing the center of the housing 50. Figure 5The retainer 50c includes a rib-like internal shape extending in the X-axis direction and is disposed substantially vertically on the inner side 50a of the housing 50. The retainer 50c includes a connector 50d protruding in the Z-axis direction.

[0051] The second damper 80 is disposed at the front end of the connector 50d. The second damper 80 is an elastic member such as natural rubber, silicone rubber or sponge. The first member 30 and the second member 40 are fixed to the connector 50d via the second damper 80 by a fixing member such as a screw (not shown), a pull pin or a light press fit with a hole and a shaft, and are positioned relative to the housing 50.

[0052] The first component 30 and the second component 40 each include an electronic substrate having a generally plate-like shape. At least one of the first component 30 and the second component 40 is electrically connected to the wiring 20. The first component 30 and the second component 40 are configured to be substantially parallel at a position where the difference in height in the connector 50d, which separates the ribbed retainer 50c in the Z-axis direction, is significant. In other words, the retainer 50c holds the first component 30 and the second component 40 in a manner perpendicular to the thickness direction (Z-axis direction) of the housing 50, thereby defining the position of the first component 30 and the second component 40 in the Z-axis direction. Due to this difference in height, a space 60 is formed between the first component 30 and the second component 40. The microphone element 10 and the wiring 20 are electrically connected.

[0053] One end of the wiring 20 is connected to the microphone element 10 via a portion of a first damper 70 that passes through and covers the microphone element 10. The other end of the wiring 20 (opposite to the end connected to the microphone element 10) is electrically connected to either the first member 30 or the second member 40. A portion of the wiring 20 is accommodated in a bent state within the space 60 formed between the first member 30 and the second member 40. Due to the repulsive force generated when the wiring 20 is bent, the wiring 20 contacts the respective members of the first member 30 and the second member 40.

[0054] When the area of ​​the wiring 20 adjacent to (near) the inner surface 50a of the housing 50 is designated as the wiring portion 20a, a third damper 90 is disposed between the wiring portion 20a and the inner surface 50a of the housing 50. The third damper 90 is an elastic member such as natural rubber, silicone rubber, or sponge. One side (first side) of the third damper 90 is fixed to the inner surface 50a of the housing 50 by an adhesive member such as tape or adhesive, and the other side (second side opposite to the first side) contacts the wiring portion 20a.

[0055] In this example, components that are in mechanical contact with the housing 50, or components that may come into contact depending on assembly variations, are held or stressed by a damper. By using the damper, vibrations or shocks transmitted from the housing 50 to the first component 30 and the second component 40, or to the wiring 20, can be suppressed. This suppresses abnormal sounds (noise) caused by vibrations or shocks occurring when the user 400 wears and uses the microphone device 4.

[0056] Example 5

[0057] Now refer to Figure 6A , Figure 6B , Figure 6C and Figure 6D This section will describe a microphone device according to Example 5. This example is a variation of microphone devices 1 to 4 according to Examples 1 to 4. Figure 6A , Figure 6B , Figure 6C and Figure 6D The extracted internal components of the microphone devices 1 to 4 described in Examples 1 to 4 are shown, as well as the state in which the microphone element 10, wiring 20, first component 30 and second component 40 are held by a housing 50 (not shown). Figure 6A and Figure 6B The tilting of wiring 20 is shown, and Figure 6C and Figure 6D It explains how to prevent tipping.

[0058] exist Figure 6A In this configuration, when a portion of the wiring 20 is bent, the wiring 20 is accommodated within the space 60 formed between the first member 30 and the second member 40. The elastic force generated when the wiring 20 bends causes the wiring 20 to exert a force on the first member 30 and the second member 40. This biasing force causes the wiring 20 to contact the first member 30 and the second member 40. In this state, if there is an assembly change or if the microphone devices 1 to 4 are subjected to vibration or impact, the posture of the wiring 20 may not be stably maintained and may change as follows: Figure 6B As shown, it is tilted. Figure 6B This shows the view in the -X axis direction. Figure 6A And it shows the fold of wiring 20 as viewed from one end.

[0059] exist Figure 6BIn the case where wiring 20 is tilted in the direction of arrow cw, wiring 20 exerts forces on the first component 30 and the second component 40 respectively through its elasticity. Due to the biasing force at this time, the bending diameter of wiring 20 is greater than the diameter of wiring 20 under the biasing force before tilting. Therefore, the biasing force decreases proportionally to the decrease in the elasticity of wiring 20. Wiring 20 may tilt further due to vibration or impact. Due to the tilting of wiring 20, the desired elasticity cannot be applied to the respective components of the first component 30 and the second component 40. As a result, the posture of wiring 20 becomes unstable and it is suspended in space 60. If vibration or impact is applied to wiring 20 while it is suspended in the air, wiring 20 may repeatedly collide with other components and become a source of noise.

[0060] Figure 6C It is shown that it is held in place by a fixing member 130 such as an adhesive or tape to prevent, as in the reference Figure 6A The wiring 20 is tilted. Figure 6D This shows what it looks like when viewed in the -X-axis direction. Figure 6C The state is such that the contact position between the wiring 20 and the first component 30, and the contact position between the wiring 20 and the second component 40 are maintained by the fixing member 130, which can suppress the wiring 20 from tipping over due to vibration or impact. Thus, abnormal sounds (noise) that occur when the wiring 20 collides with other components can be suppressed.

[0061] Example 6

[0062] Now refer to Figure 7 A description of microphone device 5 based on Example 6 will be given. Figure 7 This is a cross-sectional view of the microphone device 5 according to this example. The microphone device 5 according to this example differs from the microphone device 1 according to Example 1 in that the microphone device 5 has a fourth damper 95 and an intermediate member 140 replacing the retainer 50c. The description common to Example 1 will be omitted.

[0063] The intermediate member 140 is a retaining member that holds the first member 30 and the second member without contacting the housing 50. This determines the relative position of the first member 30 and the second member 40. The fourth damper 95 is configured to hold the microphone element 10, the first member 30, the second member 40, and the intermediate member 140 within the housing 50. That is, the microphone element 10, the first member 30, the second member 40, and the intermediate member 140 are arranged inside the housing 50 via the fourth damper 95.

[0064] In this example, microphone element 10, first component 30, second component 40, and intermediate component 140 are arranged inside housing 50 via a fourth damper 95, with each component spaced apart from the inner surface 50a of housing 50 (not in direct contact with the inner surface 50a of housing 50). Therefore, by arranging wiring 20 and the components in contact with wiring 20 inside housing 50 via a single damper (fourth damper 95), vibrations transmitted from housing 50 to wiring 20 are suppressed while allowing the dampers for each component to be integrated into a single assembly. By integrating the internal components into a single damper, the number of components can be reduced and assemblability improved. In this example, the fourth damper 95 is shown as U-shaped, but the fourth damper 95 can be configured such that the components do not contact the inner surface 50a of housing 50, for example, by covering all internal components.

[0065] Example 7

[0066] Now refer to Figure 8 A description of microphone device 6 based on Example 7 will be given. Figure 8 This is a cross-sectional view of the microphone device 6 according to this example. The microphone device 6 according to this example differs from the microphone device 1 according to Example 1 in that the microphone device 6 has a fifth damper 110. The description common to Example 1 will be omitted.

[0067] The fifth damper 110 is a box-shaped structure 110a having a space for accommodating the wiring 20. At least a portion of the box-shaped structure 110a extends in the +X axis direction to be disposed within the space 60. The box-shaped structure 110a has a through-hole 110b for electrically connecting the wiring 20 to the first member 30 or the second member 40. The wiring 20 is accommodated in a bent state within the space 60 formed between the first member 30 and the second member 40 while being accommodated within the box-shaped structure 110a. At this time, the wiring 20 exerts a force on each of the members in the first member 30 and the second member 40 by the elastic force generated when the wiring 20 is bent. This biasing force causes the wiring 20 to contact each of the members in the first member 30 and the second member 40 via the box-shaped structure 110a of the fifth damper 110.

[0068] In this example, a box shape 110a for accommodating the wiring 20 is provided in a portion of the fifth damper 110, such that the wiring 20 applies force to the respective components of the first member 30 and the second member 40 via the fifth damper 110. The fifth damper 110, which covers the microphone element 10, is extended to form the space of the box shape 110a, and the wiring 20 contacts the respective components of the first member 30 and the second member 40 via the fifth damper 110. Thus, the wiring 20 can be held inside the space 60 while suppressing vibrations transmitted from the first member 30 or the second member 40 to the wiring 20. An opening 110c is formed in the box shape 110a for bending operations of the wiring 20, and the length of the wiring 20 can be adjusted through the opening 110c when the wiring 20 is bent, or the wiring 20 can be pulled out through the through hole 110b.

[0069] Example 8

[0070] Now refer to Figure 9A , Figure 9B and Figure 9C A description of microphone device 7 based on Example 8 will be given. Figure 9A This is a cross-sectional view based on microphone device 7 in this example. Figure 9B and Figure 9C The sixth damper 120 is described. The microphone device 7 according to this example differs from the microphone device 1 according to Example 1 in that the microphone device 7 has the sixth damper 120. The description common to Example 1 will be omitted.

[0071] Figure 9B This is a detailed diagram of the sixth damper 120 covering the microphone element 10, showing the state of the wiring 20 before bending. When viewed in the -X-axis direction, Figure 9C Corresponding to Figure 9B This shows the state in which wiring 20 is housed in the sixth damper 120. A more detailed view shows wiring 20 in a state where two wires are wound in a spiral shape.

[0072] exist Figure 9B and Figure 9C In this embodiment, the sixth damper 120 has a plate-shaped protrusion 120a. The protrusion 120a includes a plurality of retainers 120b. The retainers 120b have through holes 120c for retaining the wiring 20. With the wiring 20 passing through the through holes 120c, the protrusion 120a and the wiring 20 extend in substantially the same direction.

[0073] A portion of the protrusion 120a and the wiring 20 are both housed in a bent state within the space 60 formed between the first member 30 and the second member 40. At this time, the wiring 20 exerts a force on each of the members in the first member 30 and the second member 40 through the elastic force generated when the wiring 20 bends. Due to this biasing force, the wiring 20 contacts each of the members in the first member 30 and the second member 40 via the protrusion 120a of the sixth damper 120. Thus, while the shape of the damper can be simplified and the wiring 20 can be incorporated simultaneously, vibrations transmitted from the first member 30 or the second member 40 to the wiring 20 can be suppressed. Therefore, the ease of assembly can be improved.

[0074] As described above in the various examples, the wiring 20 is housed in a space 60 formed by the first member 30 and the second member 40 disposed inside the housing 50. However, the various examples are not limited to this implementation, and the housing 50 may be integrated with the first member 30 and the second member 40. In this case, the housing 50 has a dual structure consisting of an outer housing (the first housing) and an inner housing disposed inside the outer housing (the second housing corresponding to the first member 30 and the second member 40). The inner housing has a space for storing the wiring 20 (corresponding to space 60), and the wiring 20 is stored in the internal space of the inner housing when it is electrically connected to the microphone element 10 and the inner housing. In this way, the wiring 20 does not come into contact with the inner surface 50a of the outer housing, which receives force or vibration, and therefore the housing 50 can have a dual structure.

[0075] Various examples may provide a microphone device that can suppress the generation of noise transmitted to the wiring due to the force or impact when the user holds the housing.

[0076] While this disclosure describes exemplary embodiments, it should be understood that this disclosure is not limited to exemplary embodiments. The scope of the appended claims is to be interpreted in the broadest possible sense so as to include all such modifications and equivalent structures and functions.

[0077] Each example can provide a microphone device capable of suppressing noise generation.

Claims

1. A microphone device, comprising: Microphone components; Wiring; First component; Second component; Holder; as well as case, The microphone element, the wiring, the first component, the second component, and the retainer are arranged inside the housing. The retainer holds at least one of the first member and the second member. The wiring electrically connects the microphone element to at least one of the first component and the second component, and At least a portion of the wiring is housed in the space formed by the retainer, the first member, and the second member.

2. The microphone device according to claim 1, characterized in that, The wiring, the first component, and the second component are separated from the inner surface of the housing.

3. The microphone device according to claim 1, characterized in that, The retainer is a rib extending vertically from the inner side of the housing, and is connected to each of the first and second components via a first connector disposed to the rib. The first connector is located in the region of the retainer furthest from the second connector on the inner side of the housing.

4. The microphone device according to claim 1, characterized in that, The retainer is a rib extending vertically from the inner side of the housing, and is connected to each of the first and second components via a first connector disposed on the rib. The first connector is located in the area near the corner of the housing.

5. The microphone device of claim 1, further comprising a first damper covering the microphone element. Its features are, The microphone element is held within the housing via the first damper.

6. The microphone device according to claim 1, further comprising a second damper, Its features are, The retainer holds at least one of the first member and the second member via the second damper.

7. The microphone device according to claim 1, characterized in that, The retainer holds the first component and the second component such that the main surfaces of the first component and the second component are perpendicular to the thickness direction of the housing, thereby determining the position of the first component and the second component in the thickness direction.

8. The microphone device according to claim 1, characterized in that, The retainer holds the first component and the second component such that the principal surfaces of the first component and the second component are perpendicular to the thickness direction of the housing. The space is the portion of the internal space of the housing that includes the center of the housing in the thickness direction.

9. The microphone device according to claim 8, characterized in that, The length of the space in the thickness direction is 75% or less of the length of the interior space.

10. The microphone device of claim 1, further comprising a third damper disposed on the inner side of the housing. Its features are, The wiring contacts the third damper.

11. The microphone device according to claim 1, characterized in that, At least a portion of the wiring is accommodated in the space in a bent state.

12. The microphone device according to claim 1, characterized in that, At least one of the first component and the second component has a higher rigidity than the rigidity of the housing.

13. The microphone device of claim 1, further comprising a fifth damper having a box shape and covering the microphone element. Its features are, A portion of the wiring is housed in the fifth damper, and At least a portion of the fifth damper is arranged in the space.

14. The microphone device of claim 1, further comprising a sixth damper covering the microphone element. Its features are, The sixth damper has plate-shaped protrusions. At least a portion of the protrusion and the wiring are arranged in a curved state within the space.

15. The microphone device according to any one of claims 1 to 14, further comprising a fixing member configured to secure the wiring to at least one of the first member and the second member.

16. A microphone device, comprising: Microphone components; Wiring; as well as case, The characteristic feature is that the housing comprises a first housing and a second housing disposed inside the first housing. The wiring electrically connects the microphone element and the second housing, and At least a portion of the wiring is housed within the space formed by the second housing.

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