Two-phase flow heat transfer device and electronic device

Abstract

The invention provides two-phase flow heat transfer equipment which comprises a heat transfer cavity, a heat exchanger and a heat exchanger. A capillary structure is arranged in the heat transfer cavity, and the capillary structure is provided with a condensation area and an evaporation area; the active transmission component is arranged in the heat transfer cavity and is provided with a liquid inlet and a liquid outlet, the liquid inlet is communicated with the condensation area of the capillary structure, and the liquid outlet is communicated with the evaporation area of the capillary structure; the active transmission part is used for extracting the liquid working medium in the condensation area of the capillary structure and transmitting the liquid working medium to the evaporation area of the capillary structure. The invention further provides an electronic device.

Description

Technical Field

[0001] This disclosure relates to the field of heat dissipation technology, and in particular to a two-phase heat transfer device and electronic device. Background Technology

[0002] Two-phase flow heat exchange equipment, such as vapor chambers, heat pipes, or blown plates, generally employs a passive capillary reflux structure. This involves arranging capillary structures such as sintered copper powder cores, microgrooves, copper mesh, or composite fibers within a vacuum chamber. Surface tension is used to re-transport the condensed liquid working fluid to the evaporation zone, completing an "evaporation-condensation-re-evaporation" cycle. However, when the capillary structure suffers from insufficient porosity or permeability due to structural design and manufacturing defects, the working fluid reflux rate cannot match the evaporation demand, leading to interruption of the working fluid cycle. Alternatively, excessive heat load can cause the evaporation rate to exceed the capillary structure's liquid transport capacity, resulting in the evaporation zone drying out. These issues can cause equipment cycle failure or even damage to the equipment. Summary of the Invention

[0003] This disclosure provides a two-phase heat transfer device and electronic device, which can at least solve the problem of dry evaporation zone caused by the inability of the liquid working fluid reflux capacity to meet the evaporation demand in the prior art.

[0004] In a first aspect, embodiments of this disclosure provide a two-phase heat transfer device, comprising:

[0005] A heat transfer cavity, wherein a capillary structure is provided in the heat transfer cavity, and the capillary structure has a condensation zone and an evaporation zone;

[0006] An active transfer component is disposed in the heat transfer cavity and has a liquid inlet and a liquid outlet. The liquid inlet is connected to the condensation zone of the capillary structure, and the liquid outlet is connected to the evaporation zone of the capillary structure. The active transfer component is used to extract the liquid working fluid from the condensation zone of the capillary structure and transfer it to the evaporation zone of the capillary structure.

[0007] Secondly, embodiments of this disclosure provide an electronic device, including the two-phase heat transfer device described above in embodiments of this disclosure. Attached Figure Description

[0008] In the accompanying drawings of the embodiments disclosed herein:

[0009] Figure 1 A partial cross-sectional view of the two-phase heat transfer device provided in the embodiments of this disclosure, parallel to the extension direction of the connecting pipe;

[0010] Figure 2 This is a schematic diagram of the structure of a two-phase heat transfer device provided in an embodiment of this disclosure;

[0011] Figure 3A partial cross-sectional view of a two-phase heat transfer device perpendicular to the extension direction of the connecting pipe is provided for embodiments of this disclosure;

[0012] Figure 4 A partial cross-sectional perspective view of a two-phase heat transfer device is provided for embodiments of this disclosure;

[0013] Figure 5 This is a schematic diagram illustrating the working principle of the piezoelectric micropump used in the embodiments of this disclosure;

[0014] Figure 6 This is a control flowchart of the control unit used in the embodiments of this disclosure. Detailed Implementation

[0015] To enable those skilled in the art to better understand the technical solutions of this disclosure, the embodiments of this disclosure will be described in detail below with reference to the accompanying drawings.

[0016] The present disclosure will be described more fully below with reference to the accompanying drawings; however, the embodiments shown may be embodied in different forms, and the present disclosure should not be construed as limited to the embodiments set forth below. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will enable those skilled in the art to fully understand the scope of the disclosure.

[0017] The accompanying drawings of the embodiments disclosed herein are provided to further illustrate the embodiments of this disclosure and form part of the specification. They are used together with the detailed embodiments to explain this disclosure and do not constitute a limitation thereof. The above and other features and advantages will become more apparent to those skilled in the art from the description of the detailed embodiments with reference to the accompanying drawings.

[0018] This disclosure may be described with reference to plan and / or cross-sectional views using the ideal schematic diagrams of this disclosure. Therefore, the example illustrations may be modified according to manufacturing techniques and / or tolerances.

[0019] Where there is no conflict, the various embodiments of this disclosure and the features thereof in the embodiments may be combined with each other.

[0020] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to limit the disclosure. The term "and / or" as used in this disclosure includes any and all combinations of one or more of the associated enumerated entries. The singular forms "a" and "the" as used in this disclosure are also intended to include the plural forms, unless the context clearly indicates otherwise. The terms "comprising," "made of," etc., as used in this disclosure specify the presence of the stated feature, integral, step, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof.

[0021] Unless otherwise specified, all terms used in this disclosure (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art. It will also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and this disclosure, and will not be interpreted as having an idealized or overly formal meaning, unless expressly so defined in this disclosure.

[0022] This disclosure is not limited to the embodiments shown in the accompanying drawings, but includes modifications to the configuration based on the manufacturing process. Therefore, the areas illustrated in the drawings are schematic, and the shapes of the areas shown illustrate specific shapes of the areas of an element, but are not intended to be limiting.

[0023] Please refer to the following: Figures 1 to 4 This disclosure provides a two-phase flow heat transfer device 100, which is used, for example, for chip heat dissipation inside communication products. The two-phase flow heat transfer device 100 can be a heat spreader, heat pipe, or blown plate, etc. Specifically, the two-phase flow heat transfer device 100 includes a heat transfer cavity 1 and a capillary structure 2 disposed within the heat transfer cavity 1. The heat transfer cavity 1 is a sealed cavity, and a liquid working fluid is sealed inside the cavity. This liquid working fluid undergoes a phase change at a certain temperature, thereby efficiently transferring heat. Figure 1 Only the upper cover plate 11 and the lower cover plate 12 of the heat transfer cavity 1 are shown. They are arranged opposite to each other, and multiple support columns (not shown in the figure) are provided between the upper cover plate 11 and the lower cover plate 12 to improve the strength and structural stability of the heat transfer cavity 1. The multiple support columns can be evenly distributed inside the heat transfer cavity 1. The heat transfer cavity 1 also has a circumferential sidewall (not shown in the figure) connecting the upper cover plate 11 and the lower cover plate 12, which together with the upper cover plate 11 and the lower cover plate 12 form a closed space.

[0024] The capillary structure 2 is, for example, attached to the upper cover plate 11 and has a condensation zone A and an evaporation zone B, with the evaporation zone B corresponding to the location of heat-generating components such as chips. Based on this, the working principle of the two-phase flow heat transfer device 100 is as follows: the liquid working fluid is heated and evaporates in the evaporation zone B, absorbing a large amount of heat and transforming into a vaporous working fluid, which then rapidly fills the entire heat transfer cavity 1. When the vaporous working fluid reaches the condensation zone A, it condenses into a liquid state, releasing the previously absorbed heat, which is conducted to the external environment through the wall of the heat transfer cavity 1. The capillary structure 2 is also used to guide the condensed liquid working fluid in the condensation zone A to the evaporation zone B, restarting the evaporation process. Through the continuous evaporation and condensation cycle of the liquid working fluid, the two-phase flow heat transfer device 100 can rapidly diffuse the heat generated in the evaporation zone B and dissipate it into the external environment in the condensation zone A, thereby achieving heat dissipation for heat-generating components such as chips. The aforementioned capillary structure 2 includes, for example, a copper powder sintered core, microgrooves, copper mesh, or composite fibers. The capillary structure 2 can rely on surface tension to transport the condensed liquid working fluid back to the evaporation zone B.

[0025] However, capillary structure 2 has a certain capillary limit. Without considering structural design and process defects, when the heat load on the equipment is too high, the reflux of the liquid working fluid is interfered with by non-condensable gases, and by extremely high heat flux densities (e.g., ≥200 W / cm²). 2 In this case, the drying time of the copper-based sintered core is very short (e.g., 30 seconds), and the evaporation zone urgently needs to be replenished with liquid working fluid. Although the reflux capacity can be improved by optimizing the porosity or using multilayer composite capillary cores, this sacrifices the channel area in the capillary structure, leading to an increase in thermal resistance.

[0026] To ensure that the evaporation zone B always has a sufficient supply of working fluid for cyclic phase change under high heat load scenarios, the two-phase flow heat transfer device 100 provided in this embodiment of the present disclosure, in addition to using the capillary structure 2 to re-transport the condensed liquid working fluid to the evaporation zone B, also includes an active transfer component 3. The active transfer component 3 is disposed in the heat transfer cavity 1 and has an inlet 311 and an outlet 321. The inlet 311 is connected to the condensation zone A of the capillary structure 2, and the outlet 321 is connected to the evaporation zone B of the capillary structure 2. The active transfer component 3 is used to extract the liquid working fluid from the condensation zone A of the capillary structure 2 and transfer it to the evaporation zone B of the capillary structure 2, thereby further improving the liquid working fluid reflux capacity (the liquid working fluid in the condensation zone A returns to the evaporation zone B) to meet the evaporation demand and avoid the problem of the working fluid circulation being interrupted due to the liquid working fluid reflux capacity not being able to meet the evaporation demand, or the evaporation rate exceeding the liquid transport capacity of the capillary structure due to excessive heat load, causing the evaporation zone to dry out.

[0027] The capillary structure 2 described above employs a passive method of transporting the liquid working fluid based on surface tension, without the input of external energy. The active transport component 3 describes an active transport method that uses an active element to drive the reflux of the liquid working fluid. The capillary structure 2 and the active transport component 3 operate in parallel, causing the liquid working fluid in the condensation zone A of the capillary structure 2 to split into two paths: one path refluxes through the capillary structure 2, and the other path refluxes through the active transport component 3. The fluid velocity and transport capacity of the active transport component 3 are much greater than those of the capillary structure 2, thus allowing for timely replenishment of liquid working fluid to the evaporation zone B when the capillary structure 2 reaches its capillary limit. This prevents the evaporation zone B from drying out, ensuring continuous circulation of the two-phase flow and effectively maintaining stable system operation.

[0028] This embodiment of the invention adds an active transfer component 3 inside the heat transfer cavity 1. Based on the "evaporation-condensation-re-evaporation" cycle completed by the capillary structure 2, an active reflux path is added. In this way, when the liquid working fluid reflux rate of the capillary structure 2 cannot meet the evaporation demand, the active transfer component 3 can continuously replenish the liquid working fluid to the evaporation zone B to meet the evaporation demand. This avoids the problem of the working fluid cycle being interrupted due to the liquid working fluid reflux capacity not being able to meet the evaporation demand, or the problem of the evaporation zone drying out due to excessive heat load and the evaporation rate exceeding the liquid transport capacity of the capillary structure. This significantly expands the maximum heat transfer capacity of the equipment. Meanwhile, compared to improvements such as optimizing porosity or using multi-layer composite capillary cores to enhance reflux capacity, this embodiment connects the inlet 311 of the active transmission component 3 to the condensation zone A of the capillary structure 2 and the outlet 321 to the evaporation zone B of the capillary structure 2. This allows for the extraction of liquid working fluid from the condensation zone A of the capillary structure 2 and its transfer to the evaporation zone B of the capillary structure 2. This avoids reducing the channel area in the capillary structure 2, thus eliminating the problem of increased thermal resistance due to channel area deformation.

[0029] Furthermore, the distance between the evaporation zone B and the condensation zone A is no longer limited by the backflow resistance of the capillary structure 2, making it suitable for larger devices. Based on this, the active transfer component 3 is located inside the heat transfer cavity 1, without occupying external space or altering the original thickness and shape of the heat transfer cavity 1, thus meeting the requirements for a thinner and lighter design.

[0030] In some embodiments, the active transfer component 3 includes a liquid pump 31 and at least one connecting pipe 32. The inlet of the liquid pump 31 is used as a liquid inlet 311, the outlet 312 of the liquid pump 31 is connected to one end of each connecting pipe 32, the other end of each connecting pipe 32 is used as a liquid outlet 321, and each connecting pipe 32 is provided with a first check valve 33. The first check valve 33 is used to allow the liquid working fluid to flow only in the direction from the liquid inlet 311 to the liquid outlet 321. Figure 1 and Figure 2The location of the first check valve 33 is only schematically shown and does not represent its specific structure. The inlet (i.e., liquid inlet 311) of the pump 31 can be located at the position corresponding to the condensation zone A of the capillary structure 2, preferably at the position where the temperature of the condensation zone A is lowest. The working fluid at this position is always in a liquid state and will not mix in vapor bubbles, thereby avoiding problems such as pump dry running and flow rate reduction caused by the pump 31 sucking in air bubbles. Moreover, the liquid working fluid at this position is sufficient, making it easy to ensure that the liquid inlet 311 is always submerged in liquid working fluid, avoiding the pump 31 from running dry.

[0031] Furthermore, the aforementioned pump 31 can be, for example, a piezoelectric micropump. It is not only small in size and thin (e.g., a 7mm*7mm*1mm cube), meeting the requirements for lightweight design, but also has a long lifespan and high reliability. It should be noted that, for the piezoelectric micropump, before installing the pump 31, the inlet 311 of the pump 31 can be immersed in the liquid working medium to draw liquid, ensuring that the receiving cavity 313 of the pump 31, used to hold the liquid working medium, is filled with the liquid working medium. Then, the pump 31, filled with liquid working medium, is installed inside the heat transfer cavity 1. This pre-filling method of the pump 31 avoids residual air in the receiving cavity 313 and also creates an effective negative pressure in the receiving cavity 313, ensuring effective pumping.

[0032] The aforementioned pump 31 can be a piezoelectric micropump with various structures, for example, Figure 5 A schematic diagram illustrating the working principle of a piezoelectric micropump is shown. The pump 31 includes a accommodating cavity 313, which is provided with the aforementioned inlet (i.e., inlet 311) and outlet 312. It should be noted that... Figure 5 The positions and orientations of the inlet 311 and outlet 312 in the present invention are illustrative and do not represent the actual positions and orientations of the inlet 311 and outlet 312 in the embodiments of this disclosure.

[0033] A second check valve 315 and a third check valve 316 are respectively provided at the inlet (i.e., liquid inlet 311) and outlet 312. The material of the accommodating cavity 313 is at least partially piezoelectric ceramic. For example, the accommodating cavity 313 includes a cavity wall body and a piezoelectric ceramic oscillator 314 disposed outside the cavity wall body. The second check valve 315 is used to allow only the liquid working medium outside the accommodating cavity 313 to enter the accommodating cavity 313, and the third check valve 316 is used to allow only the liquid working medium inside the accommodating cavity 313 to exit the accommodating cavity 313. The piezoelectric ceramic is used to deform when a voltage (alternating or unidirectional voltage) is applied, causing the volume of the accommodating cavity 313 to change (increase or decrease), so that continuous circulation of liquid intake and discharge can be achieved by working in conjunction with the second check valve 315 and the third check valve 316.

[0034] Specifically, in one example, if the voltage applied to the piezoelectric ceramic is an alternating voltage, the relationship between the volume change of the accommodating cavity 313 and the polarity and magnitude of the voltage is as follows: By applying a voltage of the first polarity to the piezoelectric ceramic, the volume of the accommodating cavity 313 can be increased, that is, by... Figure 5 The processes (a) to (c) in the text describe the volume increment of the accommodating cavity 313, which is positively correlated with the level of the first polarity voltage. Specifically, the higher the first polarity voltage, the greater the volume increment of the accommodating cavity 313; conversely, the lower the first polarity voltage, the smaller the volume increment. By applying a second polarity voltage to the piezoelectric ceramic, which has the opposite polarity to the first polarity voltage, the volume of the accommodating cavity 313 can be reduced. Figure 5 The process from (d) to (f) is described, and the volume reduction of the accommodating cavity 313 is positively correlated with the level of the second polarity voltage; that is, the higher the second polarity voltage, the greater the volume reduction of the accommodating cavity 313; the lower the second polarity voltage, the smaller the volume reduction of the accommodating cavity 313. One of the aforementioned first polarity voltage and second polarity voltage can be positive, and the other can be negative. In this example, the volume of the accommodating cavity 313 can be switched between increasing and decreasing by switching the voltage applied to the piezoelectric ceramic between the first polarity voltage and the second polarity voltage, and the magnitude of the volume increase and decrease of the accommodating cavity 313 can be adjusted by controlling the magnitudes of the first polarity voltage and the second polarity voltage. Since the voltage applied to the piezoelectric ceramic is an alternating voltage, the accommodating cavity 313 can switch between a volume increasing state and a volume decreasing state.

[0035] In another example, if the voltage applied to the piezoelectric ceramic is a unidirectionally changing voltage, the relationship between the volume change of the accommodating cavity 313 and the polarity and magnitude of the voltage is as follows: by applying a first polarity voltage or a second polarity voltage to the piezoelectric ceramic, the volume of the accommodating cavity 313 can be increased or decreased, and the volume increase or decrease of the accommodating cavity 313 is positively correlated with the level of the first polarity voltage or the second polarity voltage; that is, the higher the first polarity voltage or the second polarity voltage, the greater the volume increase or decrease of the accommodating cavity 313; the lower the first polarity voltage or the second polarity voltage, the smaller the volume increase or decrease of the accommodating cavity 313. One of the aforementioned first polarity voltage and second polarity voltage can be positive, and the other can be negative. In this example, the voltage applied to the piezoelectric ceramic is always either a first polarity voltage or a second polarity voltage. Simultaneously, by controlling the applied first polarity voltage or second polarity voltage to switch between a preset maximum and minimum value, the volume of the accommodating cavity 313 can switch between increasing and decreasing. That is, when switching from the minimum value to the maximum value, the volume of the accommodating cavity 313 increases; when switching from the maximum value to the minimum value, the volume of the accommodating cavity 313 decreases. Furthermore, by controlling the difference between the maximum and minimum values, the magnitude of the volume increase and decrease of the accommodating cavity 313 is adjusted. It is easy to understand that, since the voltage applied to the piezoelectric ceramic is a unidirectional voltage, the accommodating cavity 313 can only switch from the initial state to the volume-increasing state (or volume-decreasing state), or from the volume-increasing state (or volume-decreasing state) back to the initial state.

[0036] Furthermore, when the volume of the aforementioned accommodating cavity 313 increases, a first power can be generated; when the volume of the aforementioned accommodating cavity 313 decreases, a second power can be generated. The aforementioned first power is used to open the second one-way valve 315 and close the third one-way valve 316, and to draw the liquid working fluid into the accommodating cavity 313 through the inlet 311, such as... Figure 5 As shown in (b); the second power is used to close the second check valve 315 and open the third check valve 316, discharging the liquid working fluid in the accommodating cavity 313 through the outlet 321, as shown in (b). Figure 5 As shown in (d) and (e) in the figure.

[0037] In some embodiments, such as Figure 4 As shown, the inlet (i.e., inlet 311) of the pump 31 faces the capillary structure 2 and is fitted to the capillary structure 2. This allows the inlet (i.e., inlet 311) of the pump 31 to be completely immersed in the liquid working medium in the capillary structure 2, thereby preventing the inlet from drawing in steam or air bubbles and ensuring that the accommodating cavity 313 is always filled with pure liquid working medium.

[0038] In some embodiments, the inlet surface of the pump 31 is welded to the capillary structure 2. For example, cryogenic welding is used. This ensures that the inlet of the pump 31 is relatively fixed to the capillary structure 2, preventing the intake of steam or air due to positional shift during pumping, and ensuring no displacement under long-term vibration, thereby improving structural stability and reliability. The cryogenic welding method described above avoids degradation of the capillary structure 2 at high temperatures and avoids degradation of the piezoelectric ceramic's polarization intensity, thus preventing pump performance degradation.

[0039] In some embodiments, such as Figure 1 As shown, the heat transfer chamber 1 is provided with a lead wire channel, which is, for example, formed in the circumferential sidewall of the heat transfer chamber 1. The pump 31 also includes a cable 35, one end of which is electrically connected to the piezoelectric ceramic, and the other end is led out to the outside of the heat transfer chamber 1 through the lead wire channel, so as to be electrically connected to an external power source to realize the electrical connection between the power source and the piezoelectric ceramic. Moreover, a sealing component (not shown in the figure) is provided in the lead wire channel to seal the lead wire channel, thereby ensuring the airtightness of the heat transfer chamber 1. The sealing component includes, for example, sealant.

[0040] In some embodiments, the surface of the pump 31 and its interface 34 for connecting the cable 35 are covered with an insulating layer (not shown). This insulating layer serves to insulate the accommodating cavity 313 and the interface 34 from the external environment, thereby preventing short circuits and leakage. This insulating layer can be fabricated by vacuum deposition.

[0041] The connecting pipe 32 is used to transport the liquid working fluid flowing from the outlet 312 of the pump 31 to the evaporation zone B. The connecting pipe 32 is made of, for example, copper or other materials with good thermal conductivity. At least one connecting pipe 32 is installed between the condensation zone A and the evaporation zone B to serve as a dedicated channel for the pump 31 to transport the liquid working fluid.

[0042] The fluid flow area (or inner diameter) of the connecting pipe 32 can achieve a balance between structural stability and liquid delivery volume, thereby maximizing the flow capacity of the connecting pipe 32 without affecting the mechanical support effect of the heat transfer chamber 1. This avoids both insufficient fluid flow area leading to limited output and insufficient return of the pump 31, and excessive fluid flow area weakening the rigidity of the heat transfer chamber 1, ensuring stable heat transfer and structural safety. There can be one or more connecting pipes 32. Furthermore, the volume of working fluid can be increased in the heat transfer chamber 1 according to the capacity of the pump 31 and the connecting pipe 32.

[0043] The first check valve 33 allows the liquid working medium to flow only from the inlet 311 to the outlet 321, thus preventing backflow. The first check valve 33 can be, for example, a diaphragm check valve. This type of check valve can be a miniature check valve, allowing it to be embedded in the connecting pipe 32 without requiring a large-diameter connecting pipe 32. Furthermore, diaphragm check valves have no magnets and rely solely on pressure differential for opening and closing, resulting in high long-term reliability.

[0044] In some embodiments, such as Figure 1 and Figure 3 As shown, a gap channel 36 is provided between the wall of the connecting pipe 32 and the capillary structure 2, and the gap channel 36 is connected to the evaporation zone B and the condensation zone A of the capillary structure 2. With the help of the gap channel 36, the liquid working fluid in the condensation zone A can flow to the evaporation zone B through the gap channel 36, thereby further increasing the return path for transporting the liquid working fluid. It should be noted that the aforementioned gap channel 36 is a tiny gap, forming a capillary channel, which allows the liquid working fluid flowing to the inlet of the gap channel 36 under the suction force of the pump 31 to permeate into the evaporation zone B by relying on surface tension.

[0045] In some embodiments, the wall of the connecting pipe 32 is spot-welded to the capillary structure 2. By using spot welding, the wall of the connecting pipe 32 and the capillary structure 2 can be fixed at multiple points within a very small heat-affected zone, which ensures mechanical connection strength and resistance to vibration displacement, while almost avoiding blockage of the capillary channels.

[0046] In some embodiments, a first temperature detection unit and a second temperature detection unit (not shown in the figures) are respectively provided in the condensation zone A and the evaporation zone B. The first and second temperature detection units are used to detect the temperatures of the condensation zone A and the evaporation zone B, respectively. The first and second temperature detection units can detect the temperature at regular intervals, for example, every 3 seconds. The first and second temperature detection units are, for example, thermistors, and are respectively attached to the heat transfer cavity 1 at positions corresponding to the condensation zone A and the evaporation zone B. The two-phase heat transfer device 100 also includes a control unit (not shown in the figures), such as... Figure 6 As shown, the control unit is used to control the active transmission component 3 to start when the temperature difference detected by the first temperature detection unit and the second temperature detection unit (i.e., the temperature difference between the two points) is greater than the preset temperature threshold T1, at which time the liquid pump 31 works; and to control the active transmission component 3 to stop when the temperature difference is less than or equal to the preset temperature threshold T1, at which time the liquid pump 31 does not work.

[0047] The aforementioned preset temperature threshold T1 can be the temperature difference detected by the first temperature detection unit and the second temperature detection unit when the capillary structure 2 is close to the limit of its reflux capacity, that is, when the evaporation zone B is close to dry.

[0048] Through the above control process, liquid working fluid can be replenished to evaporation zone B in a timely manner when it is nearly dry, avoiding the problem of dry burning in evaporation zone B and ensuring the continuous circulation of the two-phase flow, thereby effectively maintaining the stable operation of the system. When the above difference is less than or equal to the preset temperature threshold T1, it indicates that the reflux capacity of capillary structure 2 has met the evaporation requirements. At this time, the active transmission component 3 can be stopped to achieve the effects of energy saving and extending the life of the liquid pump 31.

[0049] As another technical solution, this disclosure also provides an electronic device, which includes the two-phase heat transfer device 100 provided in this disclosure.

[0050] This disclosure has disclosed exemplary embodiments, and although specific terminology has been used, it is for general illustrative purposes only and should not be construed as limiting. In some instances, it will be apparent to those skilled in the art that features, characteristics, and / or elements described in conjunction with particular embodiments may be used alone, or in combination with features, characteristics, and / or elements described in conjunction with other embodiments, unless otherwise expressly indicated. Therefore, those skilled in the art will understand that various changes in form and detail may be made without departing from the scope of this disclosure as set forth by the appended claims.

Claims

1. A two-phase heat transfer device, characterized in that, include: A heat transfer cavity, wherein a capillary structure is provided in the heat transfer cavity, and the capillary structure has a condensation zone and an evaporation zone; An active transfer component is disposed in the heat transfer cavity and has a liquid inlet and a liquid outlet. The liquid inlet is connected to the condensation zone of the capillary structure, and the liquid outlet is connected to the evaporation zone of the capillary structure. The active transfer component is used to extract the liquid working fluid from the condensation zone of the capillary structure and transfer it to the evaporation zone of the capillary structure.

2. The two-phase heat transfer device according to claim 1, characterized in that, The active transmission component includes a liquid pump and at least one connecting pipeline. The inlet of the liquid pump serves as the liquid inlet, the outlet of the liquid pump is connected to one end of each connecting pipeline, the other end of each connecting pipeline serves as the liquid outlet, and each connecting pipeline is provided with a first one-way valve. The first one-way valve is used to allow the liquid working fluid to flow only in the direction from the liquid inlet to the liquid outlet.

3. The two-phase heat transfer device according to claim 2, characterized in that, A gap channel is provided between the pipe wall of the connecting pipe and the capillary structure, and the gap channel is connected to the evaporation zone and the condensation zone of the capillary structure.

4. The two-phase heat transfer device according to claim 2, characterized in that, The pipe wall of the connecting pipe is spot-welded to the capillary structure.

5. The two-phase heat transfer device according to claim 2, characterized in that, The pump includes a receiving cavity, which is provided with an inlet and an outlet, and a second check valve and a third check valve are respectively provided at the inlet and the outlet; The material of the accommodating cavity is at least partially piezoelectric ceramic.

6. The two-phase heat transfer device according to claim 5, characterized in that, The inlet faces the capillary structure and is fitted to the capillary structure.

7. The two-phase heat transfer device according to claim 6, characterized in that, The surface of the inlet of the accommodating cavity is welded and fixed to the capillary structure.

8. The two-phase heat transfer device according to claim 5, characterized in that, The heat transfer cavity is provided with a lead wire channel, and the liquid pump also includes a cable. One end of the cable is electrically connected to the piezoelectric ceramic, and the other end is led out to the outside of the heat transfer cavity through the lead wire channel. A sealing component is provided in the lead wire channel for sealing the lead wire channel.

9. The two-phase heat transfer device according to claim 8, characterized in that, The surface of the pump and the interface used to connect the cable are covered with an insulating layer.

10. The two-phase heat transfer device according to any one of claims 1-9, characterized in that, A first temperature detection unit and a second temperature detection unit are respectively provided in the condensation zone and the evaporation zone, and the first temperature detection unit and the second temperature detection unit are used to detect the temperature of the condensation zone and the evaporation zone respectively; The two-phase heat transfer device further includes a control unit, which is used to control the active transfer component to start when the temperature difference detected by the first temperature detection unit and the second temperature detection unit is greater than a preset temperature threshold, and to control the active transfer component to stop when the temperature difference is less than or equal to the preset temperature threshold.

11. An electronic device, characterized in that, Includes the two-phase heat transfer device as described in any one of claims 1-10.

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